Coating composition for strengthening PCB (Printed Circuit Board) substrate glass and PCB substrate glass manufactured by using same

Abstract

The purpose of the present invention is to provide: a coating composition for strengthening strength for preventing damage caused by stress imbalance and impact generated in a process for manufacturing a PCB substrate for packaging; and a PCB substrate glass manufactured using the same. The present invention relates to a coating composition for strengthening PCB substrate glass and a PCB substrate glass manufactured by using the same, and more particularly, to a coating composition for strengthening PCB substrate glass comprising a compound represented by Chemical Formula 1, silica, a water-soluble organic solvent, and water, and a PCB substrate glass manufactured by using the same.

Description

TECHNICAL FIELD

[0001] The present application relates to a coating agent composition for forming a coating film for enhancing the strength of glass used in a semiconductor package printed circuit board (PCB: Printed Circuit Board) and a method of manufacturing a coating film using the same. BACKGROUND

[0002] A process of implementing a circuit on a semiconductor wafer is called a front-end process (FE: Front-End), and a process of assembling a wafer into a state that can be used in an actual product is called a back-end process (BE: Back-End). Also, the back-end process includes a packaging process.

[0003] Recently, as four core technologies of the semiconductor industry that make it possible for electronic products to rapidly develop, there are semiconductor technology, semiconductor packaging technology, manufacturing process technology, and software technology. The semiconductor technology is developing in various forms such as a line width of a nanometer unit below micrometers, more than ten million cells, high-speed operation, high heat dissipation, etc., but the technology capable of perfectly packaging these is relatively not supported. Therefore, the electrical performance of a semiconductor can not be determined by the performance of the semiconductor technology itself, but by the packaging technology and electrical connection.

[0004] As a material of a packaging substrate, ceramic or resin is used. In the case of using a ceramic material, it is difficult to mount a high-performance high-frequency semiconductor device because of a high resistance value or a high dielectric constant; in the case of using a resin material, although a high-performance high-frequency semiconductor device can be relatively mounted, there is a limitation in reducing a wiring pitch.

[0005] Recently, research is being conducted to use silicon or glass as a packaging PCB substrate material. In particular, glass has electrical insulation properties, strong resistance to heat, and a chemically stable property, and thus is stable in various environments.

[0006] Due to these properties, the manufactured substrate glass has excellent heat conduction, which helps to effectively disperse heat generated in a high-temperature operating environment to stabilize the temperature of components on a printed circuit board (PCB: Printed Circuit Board), and as an insulator, prevents interference between different electrical signal paths, thereby enabling more accurate and stable signal transmission. There are various types of substrate glass, and silicate glass (Silicate Glass) and borosilicate glass (Borosilicate Glass) are mainly used. Each type is selected according to the purpose and has specific physical, electrical, and chemical properties.

[0007] By forming a through-hole in the substrate glass and applying a conductive material to the through-hole, the wiring length between the device and the mother board can be shortened, and excellent electrical characteristics can be obtained. The substrate glass used for packaging is manufactured by cutting a thin and uniform glass original plate into a desired shape using a laser after the original plate is manufactured.

[0008] In the above cutting process, stress or heat variation occurs along the cutting surface of the substrate glass, thereby causing the quality of the surface or edge of the substrate glass to decrease, which is a cause of the decrease in the durability of the substrate glass. During the packaging process using the cut substrate glass, stress is accumulated due to vibration or impact generated, and cracks are generated in the edge whose quality decreased during the cutting process, thereby decreasing the manufacturing yield of the packaging process.

[0009] (Prior Art Document) (Patent Document) (Patent Document 1) 1. Korean Registered Patent Gazette 10-1133695 B1 (Patent Document 2) 2. Korean Registered Patent Gazette 10-1441563 B1 (Patent Document 3) 3. Korean Registered Patent Gazette 10-1749174 B1 (Patent Document 4) 4. Korean Registered Patent Gazette 10-21882111 B1 SUMMARY

[0010] PROBLEMS TO BE SOLVED BY THE INVENTION The present invention aims to provide a strength-reinforcing coating composition and a coating method for preventing damage caused by stress imbalance and impact generated in a packaging PCB substrate manufacturing process using a substrate glass, in order to solve the above-described problems.

[0011] SOLUTION TO THE PROBLEM To achieve the above-described object, the present invention provides a coating agent composition characterized by including: a compound represented by Chemical Formula 1 below, silicon dioxide, a water-soluble organic solvent, and water.

[0012] [Chemical Formula 1]

[0013] In the above formula, n is an integer selected from 15 to 100; R is C 1~6 an aldehyde group; C 1~6 alkyl substituted with an OR' group (wherein R' is C 1~6 alkyl (wherein R' is C 2~6aldehyde group, or C 1~6 alkyl) ; R1 is hydroxyl, alkoxy, or R group.

[0014] In a preferred embodiment of the present application, the PCB substrate glass strengthening coating composition further includes an acid catalyst and a nonionic surfactant.

[0015] In a preferred embodiment of the present application, the silica, although not particularly limited, is a fumed silica (Fumed Silica) having hydroxyl groups on the surface and exhibiting hydrophilicity.

[0016]

[0017] In a preferred embodiment of the present application, the water-soluble organic solvent is one or more selected from the group consisting of methanol, ethanol, benzyl alcohol, isopropyl alcohol, isopentyl alcohol, isopropyl alcohol, pentanol, isobutyl alcohol, butanol, cetyl alcohol, lauryl alcohol, nonanol, undecyl alcohol, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate.

[0018] In a preferred embodiment of the present application, the acid catalyst is one or more selected from the group consisting of sulfuric acid, hydrochloric acid, sodium nitrate, potassium nitrate, nitric acid, potassium chromate, nitrous acid, perchloric acid, phosphoric acid, and acetic acid.

[0019] In a preferred embodiment of the present application, the nonionic surfactant is one or more selected from the group consisting of polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene glycol fatty acid ester, oxypropylene- oxyethylene block copolymer, polyoxyethylene glycol, polyoxyethylene alkyl amine ether, polyoxyalkylene glycol monoalkyl ether, polyoxyalkylene, and polyoxyalkylene alkyl ether.

[0020] In a preferred embodiment of the present application, the PCB substrate glass strengthening coating composition includes 20 to 30 wt% of the compound represented by Chemical Formula 1, 1 to 10 wt% of silica, 50 to 70 wt% of a water-soluble organic solvent, and the balance of water, with respect to the total weight of the composition.

[0021] In a preferred embodiment of the present application, the PCB substrate glass strengthening coating composition further includes 0.5 to 1 wt% of an acid catalyst and 1 to 4 wt% of a nonionic surfactant, with respect to the total weight of the composition.

[0022] In a preferred embodiment of the present application, the PCB substrate glass strengthening coating composition is for a package substrate glass.

[0023] In another embodiment of the present application, a coating film for glass strengthening of a PCB substrate is formed by applying the coating composition for glass strengthening of a PCB substrate of the present application to the edge of a substrate glass and then curing.

[0024] The present application provides a method for manufacturing a substrate glass for packaging, which comprises wet coating a substrate glass using the coating composition for glass strengthening of a PCB substrate of the present application.

[0025] The method for the wet coating is not particularly limited, and for example, after dip coating, spin coating, brush coating, roll coating, spray coating, or the like is performed, the coated coating film is cured by heating. The heating is performed by any method, but is generally performed by, for example, an electric furnace or an air heating furnace. The coating agent of the present application is heated to a temperature of 100 to 300°C, preferably 110 to 150°C, depending on the characteristics of the substrate glass, so that a sufficiently cured coating film is formed in 1 hour or less.

[0026] The substrate glass on which the cured coating film is formed is generally completed with the coating process by slow cooling. The temperature pattern of heating or cooling is not particularly limited, but is generally performed within a range in which thermal shock does not occur in the substrate glass and the coating film due to a sharp temperature change.

[0027] Effects of the Invention The present application can provide a compound for a strength-enhancing coating agent for a strength-enhancing coating agent, which has a function of preventing cracks in a substrate glass due to stress imbalance and impact by being coated as a thin film of several micrometers in thickness.

[0028] Therefore, when the coating composition of the present application is applied to a PCB substrate glass for semiconductor packaging, cracks in the substrate glass generated during the packaging process can be prevented, so that the production yield and the quality level are improved. DETAILED DESCRIPTION

[0029] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art. Generally, the nomenclature used in the present application is well-known and commonly used in the art.

[0030] Throughout the present application specification, when a certain part "comprises" a certain component, unless otherwise specifically stated, it means that other components are not excluded, but other components can be further included.

[0031] An implementation example of the present application provides a PCB substrate glass strengthening coating composition and a coating method, the PCB substrate glass strengthening coating composition comprising: a compound represented by the following Chemical Formula 1, silica, a water-soluble organic solvent, and water.

[0032] [Chemical Formula 1]

[0033] In the above formula, n is an integer selected from 15 to 100; R is C 1~6 aldehyde; C 1~6 alkyl; or C 1~6 alkyl substituted with OR' group (wherein R' is C 2~6 aldehyde, or C 1~6 alkyl substituted with hydroxyl, alkoxy, alkyl carboxyl, or oxirane); R1 is hydroxyl, alkoxy, or R group.

[0034] When the compound represented by the Chemical Formula 1 is dispersed in the water-soluble organic solvent, a sol state is formed, thereby being able to increase the impact resistance to prevent cracks due to stress imbalance and impact applied to the substrate glass in the packaging process.

[0035] The compound represented by the Chemical Formula 1 forms silica particles having a diameter of tens to hundreds of nanometers in the coating film formed after thermal curing. According to the degree of polymerization, the compound represented by the Chemical Formula 1 can have a difference in impact resistance. When the compound represented by Chemical Formula 1 above a certain degree of polymerization is used, the impact resistance can be increased, but when the compound represented by Chemical Formula 1 below a certain degree of polymerization is used, voids are formed in the center of the particles, thereby failing to increase the impact resistance.

[0036] At this time, preferably, in the compound represented by the Chemical Formula 1, n is an integer selected from 25 to 75. When n in the compound represented by the Chemical Formula 1 is less than 25, the impact resistance of the PCB substrate glass strengthening coating film can be significantly reduced, and when n exceeds 75, the viscosity increases, the flowability decreases, thereby the coating property is degraded, and the intermolecular interaction is enhanced, which can cause the adhesion between the substrate glass and the coating film to be reduced, and thus is not preferable as a coating for PCB substrate glass strengthening.

[0037] As described above, when the impact resistance of the PCB substrate glass strengthening coating film is reduced, the durability is deteriorated, the effect of the PCB substrate glass strengthening coating cannot be maintained for a long time, and when the viscosity is increased, the coatability is deteriorated, and a uniform coating film cannot be obtained. Therefore, in order to improve the impact resistance, it is important to continuously maintain the durability in a low viscosity state.

[0038] According to a preferred embodiment of the present application, the PCB substrate glass strengthening coating composition can further include an acid catalyst and a nonionic surfactant.

[0039] The PCB substrate glass strengthening coating composition can include 20 to 30 wt% of the compound represented by Chemical Formula 1, 1 to 10 wt% of silica, 50 to 70 wt% of a water-soluble organic solvent, and the balance of water, based on the total weight of the composition.

[0040] Preferably, 20 to 30 wt% of the compound represented by Chemical Formula 1 is included, based on the total weight of the composition. If the compound represented by Chemical Formula 1 is less than 20 wt%, it is difficult to secure an appropriate thickness of the PCB substrate glass strengthening coating film, and thus is not preferred, and if it exceeds 50 wt%, the thickness of the coating film is thickened, it is difficult to obtain an appropriate coating uniformity, and further dilution is required, and thus is not preferred.

[0041] The thickness of the PCB substrate glass strengthening coating film can be adjusted according to the molecular weight and content of the compound represented by Chemical Formula 1, and in the case of the glass strengthening coating film according to the present application, a thickness of 1 to 10 micrometers is appropriate. If the glass strengthening coating film is less than 1 micrometer, the impact resistance can be significantly reduced, and if the glass strengthening coating film exceeds 10 micrometers, the coating film uniformity can be deteriorated, and thus is not preferred.

[0042] Preferably, the coating composition includes 1 to 10 wt% of the silica, based on the total weight of the composition. If the content of the silica is less than 1 wt%, the impact resistance of the coating film can be reduced, and if it is used in an amount exceeding 10 wt%, the viscosity of the coating agent composition is increased, and the flowability can be deteriorated.

[0043] Preferably, the coating composition includes 50 to 70 wt% of the water-soluble organic solvent, based on the total weight of the composition. If the water-soluble organic solvent is used in an amount less than 50 wt%, the solid content based on the entire composition is high, and it is difficult to obtain an appropriate coating film uniformity, and if it is used in an amount exceeding 70 wt%, the solid content based on the entire composition is low, and the impact resistance can be reduced, and thus is not preferred.

[0044] The water-soluble organic solvent can be a compound selected from the group consisting of methanol, ethanol, benzyl alcohol, isopropyl alcohol, isoamyl alcohol, isopropyl alcohol, amyl alcohol, isobutyl alcohol, butyl alcohol, cetyl alcohol, lauryl alcohol, nonyl alcohol, undecyl alcohol, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate, or a mixture of two or more thereof.

[0045] The PCB substrate glass strengthening coating composition can further include 0 to 1% by weight of an acid catalyst and 1 to 4% by weight of a nonionic surfactant, with respect to the total weight of the composition.

[0046] Preferably, the coating composition includes 0.5 to 1% by weight of the acid catalyst, with respect to the total weight of the composition. If the acid catalyst is used in excess of 1% by weight, the combination between the compounds represented by Chemical Formula 1 increases, thereby causing a decrease in the uniformity of the coating film due to an increase in viscosity, and thus is not preferred.

[0047] The acid catalyst can be a compound selected from the group consisting of sulfuric acid, hydrochloric acid, sodium nitrate, potassium nitrate, nitric acid, potassium chromate, nitrous acid, perchloric acid, phosphoric acid, and oxalic acid, or a mixture of two or more thereof.

[0048] Preferably, the coating composition includes 1 to 4% by weight of the nonionic surfactant, with respect to the total weight of the composition. If the nonionic surfactant is used in excess of 4% by weight, the impact resistance of the coating film deteriorates, and thus is not preferred.

[0049] The nonionic surfactant can be a compound selected from the group consisting of polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene glycol fatty acid ester, oxypropylene-oxyethylene block copolymer, polyoxyethylene glycol, polyoxyethylene alkyl amine ether, polyoxyalkylene glycol monoalkyl ether, polyoxyalkylene styrenated phenyl ether, and polyoxyalkylene alkyl ether, or a mixture of two or more thereof.

[0050] The PCB substrate glass strengthening coating composition can be advantageously applied to a package substrate.

[0051] As described above, by forming a coating film with the PCB substrate glass strengthening coating composition provided by the present application, a coating film having excellent impact resistance can be provided.

[0052] Hereinafter, the present application will be described in more detail by way of Examples. These Examples are merely for exemplification of the present application, and it will be apparent to those skilled in the art that the scope of the present application should not be construed as being limited by these Examples.

[0053] [Examples 1 to 33 and Comparative Example 1] Example 1 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by the following Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0054] (Chemical Formula 1)

[0055] Example 2 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by the following Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0056] The coating composition for glass strengthening of a PCB substrate as described above was stored in a room maintained at 23℃±2℃ for 6 hours, and after the temperature of the composition was maintained at 23℃±2℃, a packaging PCB substrate glass (Corning Company EAGLE nG; width: 50㎜, height: 50㎜, thickness: 0.4㎜) that was pretreated clean without contaminants on the surface was slowly put into a water tank containing the coating composition by a dip coating method, and after 1 minute, the substrate glass was slowly taken out, and then was heated and cured in an oven heated to 110℃ for 60 minutes, and then was cooled at room temperature for 10 minutes, thereby preparing 10 glass test pieces each and analyzing the properties. The coating film thickness was 5 .

[0057] Example 3 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by the following Chemical Formula 1 (n=50, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0058] A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by the following Chemical Formula 1 (n=50, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water. .

[0059] Example 4 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by the following Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0060] A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water. .

[0061] Example 5 A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0062] A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water. .

[0063] Example 6 A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0064] A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water. .

[0065] Example 7 A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water.

[0066] A PCB substrate glass strengthening coating composition was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 19.5 g of water. .

[0067] Example 8 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 18.5 g of water.

[0068] Using the coating composition for glass strengthening of a PCB substrate manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0069] Example 9 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 16.5 g of water.

[0070] Using the coating composition for glass strengthening of a PCB substrate manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0071] Example 10 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, 1.0 g of oxypropylene-oxyethylene block copolymer, and 17.5 g of water.

[0072] Using the coating composition for glass strengthening of a PCB substrate manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0073] Example 11 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 20.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 13.5 g of water.

[0074] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water. .

[0075] Example 12 A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water.

[0076] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water. .

[0077] Example 13 A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water.

[0078] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water. .

[0079] Example 14 A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water.

[0080] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water. .

[0081] Example 15 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water.

[0082] Using the coating composition for glass strengthening of a PCB substrate manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness was measured to be 5 .

[0083] Example 16 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=100, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 14.5 g of water.

[0084] Using the coating composition for glass strengthening of a PCB substrate manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness was measured to be 5 .

[0085] Example 17 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, 1.0 g of oxypropylene-oxyethylene block copolymer, and 13.5 g of water.

[0086] Using the coating composition for glass strengthening of a PCB substrate manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness was measured to be 5 .

[0087] Example 18 A coating composition for glass strengthening of a PCB substrate was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 11.5 g of water.

[0088] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water. .

[0089] Example 19 A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water.

[0090] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water. .

[0091] Example 20 A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water.

[0092] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water. .

[0093] Example 21 A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water.

[0094] A PCB substrate glass strengthening coating composition was prepared by mixing 25.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 1 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, and 13.5 g of water. .

[0095] Example 22 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0096] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0097] Example 23 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0098] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0099] Example 24 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0100] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, and 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0101] Example 25 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=15, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0102] A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water. .

[0103] Example 26 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0104] A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water. .

[0105] Example 27 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0106] A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water. .

[0107] Example 28 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water.

[0108] A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=75, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, and 9.5 g of water. .

[0109] Example 29 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 6.5 g of water.

[0110] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, 10 glass test pieces were each prepared and properties were analyzed. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0111] Example 30 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 6.5 g of water.

[0112] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, 10 glass test pieces were each prepared and properties were analyzed. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0113] Example 31 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 6.5 g of water.

[0114] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, 10 glass test pieces were each prepared and properties were analyzed. The coating film thickness measured using an ellipsometer (HORIBA, UVISEL) was 5 .

[0115] Example 32 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 6.5 g of water.

[0116] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness was measured using an ellipsometer (HORIBA, UVISEL) to be 5 .

[0117] Example 33 A PCB substrate glass strengthening coating composition was prepared by mixing 30.0 g of a compound represented by Chemical Formula 1 (n=25, R=OCH3, R1=OH), 3 g of silica, 60.0 g of ethanol, 0.5 g of nitric acid, 3.0 g of oxypropylene-oxyethylene block copolymer, and 3.5 g of water.

[0118] Using the PCB substrate glass strengthening coating composition manufactured as described above, coating was performed by the same method as in Example 1, 10 glass test pieces were each prepared and analyzed for properties. The coating film thickness was measured using an ellipsometer (HORIBA, UVISEL) to be 5 .

[0119] Comparative Example 1 As the bare glass, "EAGLE nG" of Corning Inc. was used.

[0120] [Glass Impact Test (GIT) Measurement] In order to prevent the broken substrate glass from flying due to the falling hammer, the prepared glass test pieces were put in a polyethylene bag (thickness of 0.1 mm or less), and mounted on the lower jig (outer diameter of 50.8 mm, inner diameter of 25.4 mm) of a glass impact tester (CKSI, E602SS), a steel ball (diameter of 12.0 mm) was mounted on the upper part of the substrate glass in a manner to align with the lower end of the rail portion, and then an aluminum hammer of 60 g weight was lifted upward by 5 cm units of height, and the height (cm) before breakage was recorded.

[0121] The impact resistance height of the glass test pieces of Examples 1 to 33 and Comparative Example 1 was measured, and the results are shown in Table 1. Five were evaluated for each glass test piece, and the average of the five values was recorded.

[0122]

Table 1

[0123] Compared to the bare glass of Comparative Example 1, the breakage height of Examples 1 to 33 prepared by the present application was significantly higher, thereby confirming that the resistance to external impact was excellent.

[0124] [Pen Drop Measurement] To prevent the scattering of broken glass, the glass test pieces of Examples 1 to 33 and Comparative Example 1 were mounted on a metal (SUS) plate, and a cap of a ballpoint pen (BIC Orange Ball Pen 0.7㎜, including the weight of the cap: 5.7g) of "BIC Corporation" was inserted into the back of the ballpoint pen in a state in which the tip of the ballpoint pen was directed toward the upper surface of the mounted glass test piece, and the glass test piece was lifted vertically upward at a height of 1 cm and then dropped until the glass test piece was broken, and the height at the moment before the breakage was recorded to confirm the breakage prevention property. The height at the moment before the breakage of the glass test pieces of Examples 1 to 33 and Comparative Example 1 was measured, and the results thereof are shown in Table 2. Each of the glass test pieces was evaluated 5 times, and the average of the 5 values was recorded.

[0125]

Table 2

[0126] The breakage height of Examples 1 to 33 prepared by the present application was significantly higher compared to the bare glass of Comparative Example 1, thereby confirming that the resistance to external impact was excellent.

[0127] As described above, it was known that the semiconductor packaging PCB substrate glass coated with the PCB substrate glass strengthening coating composition of the present application was significantly reduced in the breakage phenomenon due to external impact during the process compared to the semiconductor packaging PCB substrate glass which was not coated. Therefore, the PCB substrate glass strengthening coating composition of the present application was evaluated as greatly contributing to the stabilization of the semiconductor packaging process using the substrate glass.

Claims

1. A coating composition for glass strengthening of a PCB substrate, wherein, Comprises: a compound represented by the following Chemical Formula 1; silica; a water-soluble organic solvent; and water, [Chemical Formula 1] In the above formula, n is an integer selected from 25 to 50; R is C 1~6 aldehyde; C 1~6 alkyl; or C 1~6 alkyl (wherein R' is C 2~6 aldehyde, or C 1~6 alkyl); R1 is a hydroxyl group, an alkoxy group, or an R group.

2. The PCB substrate glass strengthening coating composition according to claim 1, characterized by, Comprises: 20 to 30% by weight of the compound represented by the Chemical Formula 1; 1 to 10% by weight of the silica; 50 to 70% by weight of the water-soluble organic solvent; and the balance of water.

3. The coating composition for PCB substrate glass strengthening according to claim 2, wherein the silica is fumed silica that exhibits hydrophilicity by having a hydroxyl group bonded thereto.

4. The coating composition for PCB substrate glass strengthening according to claim 2, wherein the water-soluble organic solvent is a compound selected from the group consisting of methanol, ethanol, benzyl alcohol, isopropyl alcohol, isoamyl alcohol, isopropyl alcohol, amyl alcohol, isobutyl alcohol, butyl alcohol, cetyl alcohol, lauryl alcohol, nonyl alcohol, undecyl alcohol, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate, or a mixture of two or more thereof.

5. The coating composition for PCB substrate glass strengthening according to claim 2, wherein the coating composition for PCB substrate glass strengthening further comprises an acid catalyst.

6. The coating composition for PCB substrate glass strengthening according to claim 5, wherein the coating composition comprises 0.5 to 1% by weight of the acid catalyst, relative to the total weight of the composition.

7. The coating composition for PCB substrate glass strengthening according to claim 6, wherein the acid catalyst is a compound selected from the group consisting of sulfuric acid, hydrochloric acid, sodium nitrate, potassium nitrate, nitric acid, acetic acid, potassium chromate, nitrous acid, perchloric acid, phosphoric acid, and acetic acid, or a mixture thereof.

8. The coating composition for PCB substrate glass strengthening according to claim 2, wherein the coating composition for PCB substrate glass strengthening further comprises a nonionic surfactant.

9. The coating composition for PCB substrate glass strengthening according to claim 8, wherein the coating composition comprises 1 to 4% by weight of the nonionic surfactant, relative to the total weight of the composition.

10. The coating composition for PCB substrate glass strengthening according to claim 9, wherein the nonionic surfactant is a compound selected from the group consisting of polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene glycol fatty acid ester, oxypropylene- oxyethylene block copolymer, polyoxyethylene glycol, polyoxyethylene alkyl amine ether, polyoxyalkylene glycol monoalkyl ether, polyoxyalkylene, and polyoxyalkylene alkyl ether, or a mixture of two or more thereof.

11. A PCB substrate glass manufactured by coating the coating composition for PCB substrate glass strengthening according to any one of claims 1 to 10 to at least one side of a PCB substrate glass for semiconductor packaging and then curing.

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