A method and system for double-helix grinding of semi-cylindrical weld beads based on line laser scanning

Abstract

This invention belongs to the field of intelligent grinding technology for weld seams of rolled metal parts, and particularly relates to a method and system for double-helix grinding of semi-cylindrical weld seams based on line laser scanning. The method includes: scanning the rolled part to be ground using a line laser scanning system to obtain weld seam point cloud information of the part to be ground; obtaining weld seam position information of the part to be ground based on the weld seam point cloud information; obtaining a grinding trajectory based on the weld seam position information; and performing double-layer helix grinding of the part to be ground using a flexible force control and arc-cone grinding wheel grinding module based on the grinding trajectory. This invention achieves intelligent detection and grinding of semi-cylindrical weld seams through a double-helix grinding robot based on line laser scanning. It can better fit the grinding of weld seams and weld seam workpiece connections, improve the grinding quality and aesthetics of weld seams, reduce material waste, increase production efficiency, support the independent and controllable high-quality development of the metal rolling industry, and enhance the industry's competitiveness and influence.

Description

Technical Field

[0001] This invention belongs to the field of intelligent grinding technology for weld seams of rolled metal parts, and particularly relates to a method and system for grinding semi-cylindrical weld seams using a line laser scanning method. Background Technology

[0002] In the field of welding manufacturing, semi-cylindrical weld beads are widely used in the splicing parts of critical structures such as steel structures, pressure vessels, ships, and bridges. Because the welded semi-cylindrical weld beads need to be ground smooth, aesthetically pleasing, and retain their height, uneven heat input and material shrinkage during welding often result in defects such as undercut and spatter on the surface, affecting the fatigue strength, corrosion resistance, and assembly accuracy of the structure. Traditional manual grinding methods rely on operator experience and suffer from low efficiency, high labor intensity, and poor quality consistency, making it difficult to meet the high-precision and high-efficiency processing requirements of modern intelligent manufacturing.

[0003] In recent years, automated weld bead grinding technology has gradually developed, but existing methods still have certain limitations. For example, fixed-path mechanical grinding lacks the ability to adapt to weld bead morphology, easily leading to under-grinding or over-grinding; grinding systems based on contact measurement have slow response speeds, making it difficult to adapt to the efficient processing of complex weld beads, and circular grinding wheels cannot effectively grind the weld bead and workpiece connection. In addition, traditional single-path grinding strategies are prone to vibration and tool wear when grinding weld beads with large excess height, affecting processing quality. Summary of the Invention

[0004] To address the aforementioned technical issues, this invention proposes a method and system for double-helix grinding of semi-cylindrical weld beads based on line laser scanning. By using a double-helix grinding robot based on line laser scanning, intelligent detection and grinding of semi-cylindrical weld beads can be achieved, which can improve weld bead grinding quality, reduce material waste, increase production efficiency, support the independent and controllable high-quality development of the metal rolling industry, and enhance the industry's competitiveness and influence.

[0005] To achieve the above objectives, the present invention provides a method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning, comprising:

[0006] The weld point cloud information of the workpiece to be ground is obtained by scanning the workpiece with a line laser scanning system.

[0007] Based on the weld bead point cloud information, the weld bead position information of the workpiece to be ground is obtained;

[0008] Based on the weld bead position information, the initial grinding position and the initial pitch and helix angle of the grinding workpiece are determined. The pitch and helix angle are corrected according to the actual contact width of the grinding wheel. The first layer of helical grinding path is calculated. Based on the first layer of helical path, the second layer of helical grinding path is calculated to obtain the double helical grinding trajectory.

[0009] The robot polishes the workpiece according to the described double-helix polishing trajectory.

[0010] Optionally, the part to be ground is a cylindrical spliced ​​part.

[0011] Optionally, based on the weld bead point cloud information, obtaining the weld bead position information of the workpiece to be ground includes:

[0012] The noisy weld bead point cloud data acquired by the line laser scanner undergoes multiple steps, including data preprocessing, point cloud segmentation, feature extraction, and post-processing optimization, to output data that the control system can recognize.

[0013] The data preprocessing includes noise reduction and filtering, calculating the average distance between each point and its k nearest neighbors, removing all points whose distance is outside the mean range, and effectively removing discrete outliers.

[0014] The point cloud segmentation method further separates the residual noise and irrelevant structures in the preprocessed point cloud to obtain weld bead point cloud data.

[0015] The feature extraction process involves calculating the centerline from the weld bead point cloud, obtaining the principal direction of the point cloud through principal component analysis (PCA), and slicing the weld bead point cloud into a series of thin slices along a direction perpendicular to the weld bead direction, based on the point cloud density and weld bead width. The centroid of all points within each slice is calculated; this centroid can be used as the center point of the weld bead at that slice. Connecting the calculated center points of all slices in the slice order yields the preliminary weld bead centerline.

[0016] The post-processing optimization includes applying a smoothing algorithm to the centerline sequence using Gaussian filtering to remove spikes and high-frequency noise, resulting in a smooth trajectory.

[0017] Optionally, obtaining the grinding trajectory based on the weld bead position information includes:

[0018] Based on the weld bead position information, the initial grinding position is determined;

[0019] The polishing trajectory is obtained based on the initial polishing position.

[0020] Optionally, obtaining the polishing trajectory based on the initial polishing position includes:

[0021] Based on the initial grinding position, determine the pitch of the workpiece to be ground;

[0022] Based on the pitch, a double-layer spiral grinding method is used to obtain the grinding trajectory.

[0023] Optionally, based on the grinding trajectory, performing double-layer spiral grinding on the workpiece includes:

[0024] Obtain the first layer of the spiral path: ;

[0025] Based on the first layer spiral path, determine the second layer spiral path: ;

[0026] Where D is the diameter of the cylinder. For normalization parameters, Let P be the unit step function and P be the pitch. This represents the x-coordinate value of the first layer of spiral grinding path. Let y be the y-coordinate of the first layer of spiral grinding path. Let z be the z-coordinate of the first layer of spiral grinding path. The spiral angle of the first layer of spiral grinding path. This represents the x-coordinate value of the second layer of spiral grinding path. This represents the y-coordinate of the second layer of spiral grinding path. This is the z-coordinate of the second layer of spiral grinding path. The spiral angle of the second layer of spiral grinding path;

[0027] Based on the first and second spiral paths, double-layer spiral grinding is performed on the workpiece to be ground.

[0028] The present invention also proposes a semi-cylindrical weld bead double helix grinding system based on line laser scanning, including: a grinding part contour scanning module, a weld bead position calculation module, a grinding path planning module, and a weld bead grinding module;

[0029] The grinding part contour scanning module is used to scan the grinding rolled part using a line laser scanning system to obtain the weld point cloud information of the part to be ground.

[0030] The weld bead position calculation module is used to obtain the weld bead position information of the workpiece to be ground based on the weld bead point cloud information.

[0031] The grinding path planning module is used to obtain the grinding trajectory based on the weld position information;

[0032] The weld grinding module employs a combination of flexible force control and a circular arc conical ball-head grinding wheel. The flexible force control precisely controls the axial extension and retraction of the grinding tool. A target contact force is set, and a generated spiral path is used. As the robot executes this path, the grinding head monitors the actual contact force in real time. If excessive pressure is detected, the grinding head automatically retracts to reduce pressure. If insufficient pressure is detected or contact is lost, the grinding head automatically extends forward to increase pressure. The circular arc conical grinding head approaches and grinds concave surfaces, inner corners, and the junction of the weld and the base material, performing a more closely fitted double-layer spiral grinding process on the workpiece.

[0033] Compared with the prior art, the present invention has the following advantages and technical effects:

[0034] (1) The double-layer spiral grinding method designed in this invention has strong adaptability and can ensure the smoothness and aesthetics of the texture of the semi-cylindrical surface. The spiral grinding path and the arc-shaped cone grinding wheel can better fit the semi-cylindrical surface and cover the entire semi-cylindrical surface.

[0035] (2) The double-layer spiral lines in the spiral pitch correction method adopted in this invention compensate each other, avoid the coverage blind area of ​​a single path, and can ensure the grinding of semi-cylindrical welds with different radii, avoiding incomplete grinding due to excessively small radius and excessively large grinding wheel tilt angle.

[0036] (3) The dual-pass grinding method designed in this invention can maintain the continuity of grinding motion, so that the grinding wheel and the grinding workpiece are in continuous contact. Compared with the single spiral path, it can reduce the number of passes by 50%, improve the grinding efficiency of the robot, and reduce the time wasted by the horizontal back and forth switching of the grinding wheel. It is only necessary to change the direction after the first layer of grinding is completed to carry out the second grinding.

[0037] (4) The scanning device used in this invention is a blue line laser scanner. The line laser scanner has higher measurement accuracy, and the blue light is not affected by the reflection of the metal rolled surface, thus preventing point cloud loss. It is used for visual inspection of the surface contour of the semi-cylindrical weld bead. Attached Figure Description

[0038] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0039] Figure 1 This is a flowchart of a method for double-layer spiral grinding of semi-cylindrical weld bead based on line laser scanning according to an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the double-layer spiral grinding process according to an embodiment of the present invention;

[0041] Figure 3 This is a structural diagram of a double-layer spiral grinding machine system for arc welds based on line laser scanning, according to an embodiment of the present invention. Detailed Implementation

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0044] This embodiment proposes a double-helix grinding method for semi-cylindrical weld beads based on line laser scanning, such as... Figure 1 As shown, the specific steps include:

[0045] The weld point cloud information of the workpiece to be ground is obtained by scanning the workpiece with a line laser scanning system.

[0046] Based on weld bead point cloud information, obtain the weld bead position information of the part to be ground;

[0047] Based on the weld bead position information, the initial grinding position and the initial pitch and helix angle of the grinding workpiece are determined. The initial pitch and helix angle are corrected according to the actual contact width of the grinding wheel. The first layer of helical grinding path is calculated. Based on the first layer of helical path, the second layer of helical grinding path is calculated to obtain the double helical grinding trajectory.

[0048] Based on a double-helix grinding trajectory, the robot moves and grinds along this trajectory. This continuous equation is discretized into robot motion command points. While the robot executes this path, the grinding head monitors the actual contact force in real time. The extension and retraction of the grinding head are adjusted based on the feedback of the detected contact force magnitude. A combination module of flexible force control and an arc-conical ball-end grinding wheel is used. The flexible force control can precisely control the extension and retraction of the grinding tool in the axial direction, thereby achieving double-layer helical grinding of the workpiece.

[0049] Furthermore, the part to be ground is a cylindrical splice, and the semi-cylindrical weld can be approximated as a semi-cylindrical model.

[0050] Specifically, a double-layer spiral grinding robot based on line laser scanning is used to detect and grind the semi-cylindrical weld bead on a metal rolling part, including the detection of the semi-cylindrical weld bead, grinding path planning, and grinding.

[0051] The robot system includes a robot control cabinet, a grinding robot, an end flange, a force compensator, an electric spindle, and an arc-shaped conical grinding wheel.

[0052] Because the semi-cylindrical weld has a curved surface, a force-position compensator allows the grinding robot to effectively ensure grinding quality and extend the life of the grinding wheel. The floating mechanism of the force-position compensator is vertically mounted at the robot's end, achieving constant pressure floating by controlling air pressure. The air pressure is adjusted in real-time by controlling the proportional valve in the air pipe to maintain a constant pressure. A cylinder connected to an air pump provides the air supply. The electric spindle is mounted at the end of the force-position compensator, and its rotation direction, speed, and other grinding parameters are controlled by a host computer. The force-position compensator structure meets the requirements for axial floating, maintaining constant force and improving grinding accuracy and stability.

[0053] like Figure 1 As shown, the main steps include:

[0054] Step 1: The line laser scanning device scans the workpiece to be polished and uploads the three-dimensional information of the workpiece to the host computer;

[0055] Step 2: Extract the weld bead position information from the 3D information for grinding trajectory planning and initial grinding position determination, then begin grinding;

[0056] Step 3: After polishing is complete, the robot returns to the standby position and waits for the next instruction.

[0057] In this embodiment, the 3D data scanned by the line laser scanner is directly stored on the host computer controlling the grinding robot, and local files are used to store the scanning results. This method avoids the impact of communication speed on data reading and processing, enabling the grinding robot to quickly obtain weld information.

[0058] Furthermore, based on the weld bead point cloud information, the weld bead position information of the part to be ground is obtained, including:

[0059] Weld bead point cloud information is preprocessed, segmented, feature extracted, and post-processed to obtain weld bead position information of the workpiece to be ground.

[0060] Data preprocessing includes noise reduction and filtering;

[0061] Point cloud segmentation is the process of separating residual noise and irrelevant structures from the point cloud data after data preprocessing to obtain weld bead point cloud data.

[0062] Feature extraction involves calculating the centerline from the weld bead point cloud data, obtaining the main direction of the point cloud through principal component analysis, slicing the weld bead point cloud according to the point cloud density and weld bead width along the direction perpendicular to the weld bead direction, calculating the centroid of all points within the slice, and using the centroid as the center point of the weld bead at the slice location. Connecting the center points calculated from all slices in the slice order yields the preliminary weld bead centerline.

[0063] Post-processing optimization includes: applying a smoothing algorithm to the initial weld centerline using Gaussian filtering to remove burrs and high-frequency noise, resulting in a smooth trajectory; and obtaining the weld position information of the part to be ground based on the trajectory.

[0064] Specifically, the grinding robot obtains the position information of the semi-cylindrical weld bead by reading 3D data from a local file on the host computer. The main process includes:

[0065] 1. A line laser scanner scans the workpiece to be polished, acquiring three-dimensional point cloud data of the surface of the workpiece with weld beads.

[0066] 2. The host computer stores the processed and analyzed point cloud data information in a local file, mainly the coordinates of the weld bead positions and the planned grinding path points.

[0067] 3. The grinding robot obtains the weld information of the workpiece by reading local files and plans the grinding trajectory according to the planned weld point coordinates.

[0068] In this embodiment, the grinding trajectory is planned and a double-layer spiral grinding trajectory is adopted to make the weld bead grinding smooth and beautiful, and to fully cover the arc surface grinding. This ensures that the areas of double-layer spiral grinding have a small overlap, and each spiral path has a corresponding path to prevent over-grinding caused by excessive overlap or under-grinding caused by lack of overlap, which would result in incomplete grinding and ensure the stability and consistency of the grinding effect.

[0069] Furthermore, based on the weld bead position information, the grinding trajectory is obtained including:

[0070] Determine the initial grinding position based on the weld bead position information;

[0071] Determine the initial pitch of the workpiece to be ground based on its initial position during grinding.

[0072] Based on the initial pitch, obtain the initial grinding trajectory;

[0073] Based on the initial polishing trajectory and the actual situation, obtain the polishing trajectory.

[0074] Furthermore, based on the initial polishing position, the initial polishing trajectory is obtained, including:

[0075] Determine the pitch of the workpiece to be ground based on the initial position of the grinding process;

[0076] Based on the pitch, a double-layer spiral grinding method is used to obtain the initial grinding trajectory.

[0077] Furthermore, based on the initial polishing trajectory and the actual situation, the polishing trajectory is obtained, including:

[0078] Based on the initial grinding trajectory and the actual situation, the initial pitch is corrected to obtain the pitch of the grinding part;

[0079] The grinding trajectory is obtained based on the pitch of the workpiece.

[0080] Specifically, such as Figure 2 As shown, efficient polishing, smoothness, and aesthetically pleasing texture are achieved through double-layer spiral polishing.

[0081] Initial parameter settings: The semi-cylindrical weld bead is modeled as half of a cylinder. L is the length of the weld bead to be ground on the workpiece. The path equation is established in a cylindrical coordinate system. First, the pitch needs to be determined. Theoretically, this is to ensure that adjacent grinding paths can be completely covered without gaps or missed grinding.

[0082] Furthermore, based on the grinding trajectory, the double-layer spiral grinding of the workpiece includes:

[0083] Obtain the first layer of the spiral path: ;

[0084] Based on the first spiral path, the second spiral path is determined. Since the second spiral polishing process is complementary to the first spiral process, the spiral angle is offset by 180 degrees, and the angle direction is reversed. Therefore, the parametric equation is: ;

[0085] Where D is the diameter of the cylinder. For normalization parameters, Let P be the unit step function and P be the pitch. This represents the x-coordinate value of the first layer of spiral grinding path. Let y be the y-coordinate of the first layer of spiral grinding path. Let z be the z-coordinate of the first layer of spiral grinding path. The spiral angle of the first layer of spiral grinding path. This represents the x-coordinate value of the second layer of spiral grinding path. This represents the y-coordinate of the second layer of spiral grinding path. This is the z-coordinate of the second layer of spiral grinding path. The spiral angle of the second layer of spiral grinding path;

[0086] After calculating the double-helix trajectory planning path for the grinding robot, the robot moves and grinds according to this path. This continuous equation needs to be discretized into robot motion command points:

[0087] ;

[0088] Where N is the total number of points on the path.

[0089] In this embodiment, the method for starting grinding after identifying the weld bead and planning the grinding trajectory includes: the grinding robot moves to the initial position at the edge of the weld bead based on the detected weld bead information, then determines a double-helix grinding trajectory based on the three-dimensional information of the arc-shaped weld bead, and the grinding robot issues internal motion commands based on the calculated motion command points to complete the single-sided helical grinding. After the single-sided helical grinding is completed, the direction is changed to perform the second layer of helical grinding. This process is repeated until the entire weld bead is ground.

[0090] In this embodiment, a certain width deviation will occur after the grinding wheel is in close contact with the workpiece being ground, requiring deviation compensation. The compensation formula is as follows: .

[0091] in, This refers to the actual grinding width. Polish the width to the ideal. The tilt angle.

[0092] In theory Taking into account the helix angle, the pitch can be corrected as follows:

[0093] ;

[0094] ;

[0095] in, It is the helix angle ( It is the spiral angle of the first layer of polishing path. (This refers to the spiral angle of the second polishing path), where D is the diameter of the cylinder. The corrected pitch is used to calculate the actual helix angle based on the theoretical value.

[0096] like Figure 3 As shown, this embodiment also proposes a semi-cylindrical weld bead double helix grinding system based on line laser scanning, including: a grinding part contour scanning module, a weld bead position calculation module, a grinding path planning module, and a weld bead grinding module;

[0097] The grinding part contour scanning module is used to scan the grinding rolled part using a line laser scanning system to obtain the weld point cloud information of the part to be ground;

[0098] The weld position calculation module is used to obtain the weld position information of the workpiece to be ground based on the weld point cloud information.

[0099] The grinding path planning module determines the initial grinding position and the initial pitch and helix angle of the grinding workpiece based on the weld bead position information. It corrects the initial pitch and helix angle according to the actual contact width of the grinding wheel, calculates the first layer of helical grinding path, and calculates the second layer of helical grinding path based on the first layer of helical path to obtain the double helical grinding trajectory.

[0100] The weld bead grinding module employs a combination of flexible force control and a circular arc conical ball-head grinding wheel. The flexible force control precisely controls the axial extension and retraction of the grinding tool. A target contact force is set, and a generated helical path is used. As the robot executes this path, the grinding head monitors the actual contact force in real time. If excessive pressure is detected, the grinding head automatically retracts to reduce pressure. If insufficient pressure or loss of contact is detected, the grinding head automatically extends forward to increase pressure. The circular arc conical grinding head approaches and grinds concave surfaces, inner corners, and the junction of the weld bead and the base material, performing a more closely fitted double-layer helical grinding process on the workpiece.

[0101] Specifically, in this embodiment, the process of planning the grinding trajectory includes: using a double-layer spiral grinding trajectory.

[0102] In this embodiment, the method for obtaining the grinding depth using the double-layer spiral grinding method includes:

[0103] ;

[0104] in, To refine the theoretical depth, It is the radius of the cone.

[0105] In this embodiment, the actual grinding width of the double-layer spiral is... for:

[0106] .

[0107] The above are merely preferred embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning, characterized in that, include: The weld point cloud information of the workpiece to be ground is obtained by scanning the workpiece with a line laser scanning system. Based on the weld bead point cloud information, the weld bead position information of the workpiece to be ground is obtained; Based on the weld bead position information, the initial grinding position and the initial pitch and helix angle of the grinding part are determined. The initial pitch and helix angle are corrected according to the actual contact width of the grinding wheel. The first layer of helical grinding path is calculated. The second layer of helical grinding path is calculated based on the first layer of helical path to obtain the double helical grinding trajectory. The robot polishes the workpiece according to the described double-helix polishing trajectory; Based on the aforementioned grinding trajectory, the double-layer spiral grinding of the workpiece includes: Obtain the first layer of the spiral path: ; Based on the first layer spiral path, determine the second layer spiral path: ; Where D is the diameter of the cylinder. For normalization parameters, Let P be the unit step function and P be the pitch. This represents the x-coordinate value of the first layer of spiral grinding path. Let y be the y-coordinate of the first layer of spiral grinding path. Let z be the z-coordinate of the first layer of spiral grinding path. The spiral angle of the first layer of spiral grinding path. This represents the x-coordinate value of the second layer of spiral grinding path. This represents the y-coordinate of the second layer of spiral grinding path. This is the z-coordinate of the second layer of spiral grinding path. The spiral angle of the second layer of spiral grinding path; Based on the first and second spiral paths, double-layer spiral grinding is performed on the workpiece to be ground.

2. The method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning according to claim 1, characterized in that, The part to be polished is a cylindrical spliced ​​part.

3. The method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning according to claim 1, characterized in that, Based on the weld bead point cloud information, the weld bead position information of the workpiece to be ground is obtained, including: The weld bead point cloud information is preprocessed, segmented, feature extracted, and post-processed to obtain the weld bead position information of the workpiece to be ground.

4. The method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning according to claim 3, characterized in that, The data preprocessing includes noise reduction and filtering; The point cloud segmentation is to separate the residual noise and irrelevant structures in the preprocessed point cloud from the point cloud data to obtain weld bead point cloud data. The feature extraction involves calculating the centerline from the weld bead point cloud data, obtaining the main direction of the point cloud through principal component analysis, slicing the weld bead point cloud along a direction perpendicular to the weld bead direction based on the point cloud density and weld bead width, calculating the centroid of all points within the slice, and using the centroid as the center point of the weld bead at the slice location. The center points calculated from all slices are then connected in the slice order to obtain the preliminary weld bead centerline. The post-processing optimization includes: applying a smoothing algorithm to the preliminary weld centerline using Gaussian filtering to remove burrs and high-frequency noise, obtaining a smooth trajectory, and obtaining the weld position information of the workpiece to be ground based on the trajectory.

5. The method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning according to claim 1, characterized in that, Based on the weld bead position information, obtaining the grinding trajectory includes: Based on the weld bead position information, the initial grinding position is determined; Based on the initial grinding position, determine the initial pitch of the workpiece to be ground; Based on the initial pitch, obtain the initial grinding trajectory; The polishing trajectory is obtained based on the initial polishing trajectory and the actual situation.

6. The method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning according to claim 5, characterized in that, Based on the initial polishing position, obtaining the initial polishing trajectory includes: Based on the initial grinding position, determine the pitch of the workpiece to be ground; Based on the pitch, a double-layer spiral grinding method is used to obtain the initial grinding trajectory.

7. The method for double-helix grinding of semi-cylindrical weld beads based on line laser scanning according to claim 6, characterized in that, Based on the initial polishing trajectory and the actual situation, the polishing trajectory is obtained as follows: Based on the initial grinding trajectory and the actual situation, the initial pitch is corrected to obtain the pitch of the grinding part; The grinding trajectory is obtained based on the pitch of the grinding part.

8. A semi-cylindrical weld bead double-helix grinding system based on line laser scanning, implemented according to any one of claims 1-7, characterized in that, include: The module includes a grinding part contour scanning module, a weld position calculation module, a grinding path planning module, and a weld grinding module. The grinding part contour scanning module is used to scan the grinding rolled part using a line laser scanning system to obtain the weld point cloud information of the part to be ground. The weld bead position calculation module is used to obtain the weld bead position information of the workpiece to be ground based on the weld bead point cloud information. The grinding path planning module determines the initial grinding position and the initial pitch and helical angle of the grinding workpiece based on the weld bead position information. It corrects the initial pitch and helical angle according to the actual contact width of the grinding wheel, calculates the first layer of helical grinding path, and calculates the second layer of helical grinding path based on the first layer of helical path to obtain a double helical grinding trajectory. The weld bead grinding module is used by a robot to grind the workpiece according to the double helix grinding trajectory.

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