Dynamic stress test method and system for folding screen mobile phone mainboard

Abstract

This invention belongs to the field of mobile phone motherboard testing technology, specifically involving a dynamic stress testing method and system for foldable screen mobile phone motherboards. The method involves constructing a test parameter set and stress loading model to simulate real folding conditions; installing the motherboard under test and applying periodic bending stress; monitoring and collecting the electrical, signal integrity, and functional status parameters of the motherboard in real time during stress loading; performing stress-performance coupling analysis on the collected data to establish a dynamic correlation between stress and performance, evaluating performance status, and providing fault warnings; and finally generating a test report. The system includes modules for test control and modeling, stress loading execution, online monitoring, coupling analysis, and report generation. By constructing a stress loading model, this invention can more accurately reproduce the actual bending process, improving the realism and effectiveness of the test. Timing alignment and key parameter extraction establish a real-time correlation between dynamic stress and multi-dimensional performance parameters.

Description

Technical Field

[0001] This invention belongs to the field of mobile phone motherboard testing technology, specifically relating to a dynamic stress testing method and system for foldable screen mobile phone motherboards. Background Technology

[0002] Foldable screen phones have become a hot topic in the industry due to their deformable convenience. As a core component, the motherboard needs to withstand the periodic dynamic stress caused by repeated bending, which can easily lead to problems such as electrical performance degradation, signal distortion, and even functional failure. Therefore, dynamic stress testing is a key link to ensure product reliability.

[0003] Existing testing methods have significant shortcomings: they lack accurate simulation of the dynamic bending stress experienced by foldable phone motherboards in actual use, often employing fixed bending angles and frequencies without considering common real-world conditions such as asymmetric bending and prolonged conformal bending; and due to the asynchrony between test data and stress loading timing, an accurate stress-performance dynamic correlation cannot be established. Analysis relies solely on endpoint failure for crude judgment, lacking the ability to quantitatively track and proactively predict the entire performance degradation process, rendering the test data of low value and unable to provide precise data support for motherboard design optimization. Therefore, a dynamic stress testing method that fits real-world usage scenarios and enables precise coupling analysis of stress and performance is urgently needed. Summary of the Invention

[0004] In view of the above-mentioned shortcomings in the prior art, the present invention provides a dynamic stress testing method and system for foldable screen mobile phone motherboards to solve the problems in the background art.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A dynamic stress testing method for foldable screen phone motherboards includes the following steps:

[0007] Step 1: Construct a test parameter set and stress loading model based on the usage scenario of foldable screen phones. The test parameter set includes parameters such as target bending angle, bending frequency, number of cycles, and temperature environment. The stress loading model is used to generate the dynamic bending trajectory of the stress execution device.

[0008] Step 2: Install the motherboard of the foldable screen phone to be tested onto the test equipment and establish a connection between the foldable screen phone motherboard and the test equipment;

[0009] Step 3: Start the test, input the test parameter set into the stress loading model to generate a dynamic bending trajectory, and control the stress execution device to apply periodic bending stress to the foldable screen phone motherboard through the dynamic bending trajectory;

[0010] Step 4: During the application of cyclic bending stress, the foldable screen phone motherboard is monitored in real time using online testing equipment to collect dynamic test data sets of the phone motherboard; the dynamic test data sets include real-time electrical parameters, signal integrity parameters, and functional status parameters;

[0011] Step 5: Perform stress-performance coupling analysis on the collected dynamic test dataset. Based on the stress corresponding to the dynamic bending trajectory generated in Step 3 and the dynamic test data collected in Step 4, establish the correlation between stress and performance parameters to evaluate the performance status of the foldable screen phone motherboard under periodic bending stress and provide fault warning.

[0012] Step 6: Generate a dynamic stress test report.

[0013] The stress loading model in step 1 is defined using the following formula:

[0014]

[0015] in, This represents the target bending angle at time t. Indicates the magnitude of the bending angle. Indicates the bending frequency. The initial phase and bending angle amplitude A represent key parameters set based on the maximum designed bending angle of the foldable screen phone motherboard under test and the test target. These parameters control the amplitude of dynamic bending, and their value directly affects the magnitude of the applied stress and the severity of the test. The bias function, which varies with time, is used to simulate real-world conditions such as asymmetric bending or maintaining a specific angle for an extended period. Its expression is:

[0016]

[0017] in, The bias amplitude has a range of values. It is used to control the degree of offset of asymmetric bending; The bias frequency needs to be much smaller than the bending frequency. , It is a symbolic function.

[0018] The real-time stress value of the mobile phone motherboard is calculated based on the dynamic bending trajectory generated by the stress loading model. The formula is as follows:

[0019]

[0020] in, Let t be the real-time stress value at time t, E be the elastic modulus of the mobile phone motherboard substrate, d be the thickness of the mobile phone motherboard substrate, and L be the effective bending length.

[0021] In step 4, the motherboard's functionality and performance are monitored in real time using online testing equipment, and a dynamic test dataset with timestamps is collected. The dynamic test dataset is as follows:

[0022]

[0023] in, Dynamic test dataset with timestamps. Real-time electrical parameter sets with timestamps. A set of signal integrity parameters with timestamps. The set of functional status parameters with timestamps, and the set of real-time electrical parameters are as follows:

[0024]

[0025] in, Provides the main power supply voltage for the mobile phone motherboard. This is the operating current of the mobile phone motherboard. The voltage ripple factor is... ;in, This represents the peak-to-peak voltage. This is the average voltage value;

[0026] The signal integrity parameter set is as follows:

[0027]

[0028] in, This refers to the insertion loss of the radio frequency signal. For interface timing jitter, For the interface eye diagram opening;

[0029] The set of functional status parameters is as follows:

[0030]

[0031] in, In terms of communication function status, For data transmission rate, This represents the number of incorrect characters.

[0032] Step 5, the stress-performance coupling analysis, includes step 51: timing alignment processing, based on the synchronous clock timestamp, using the formula:

[0033]

[0034] Correct the timestamps of the dynamic test data, where, This is the initial collection timestamp. This is the synchronization error correction value. Establish stress values ​​for the corrected timestamp. With dynamic test dataset The time correspondence; that is, for any time t, there exists a unique one. ,make and One-to-one correspondence;

[0035] Step 52: Key parameter extraction, within each bending cycle T, Extract key stress phase points, which should include at least the time corresponding to the maximum and minimum bending angle points. Parameter values;

[0036] Step 53: Performance degradation assessment. Based on the performance parameter values ​​of key stress phase points of multiple bending cycles, a linear regression model is used to assess the performance degradation trend.

[0037] Step 54: Fault warning, generate warning signals based on performance degradation trends.

[0038] Performance degradation is assessed using a linear regression model. The formula for the linear regression model is:

[0039]

[0040] in, These are the performance parameter values ​​for the critical stress phase point in the k-th period. This represents the current number of bending cycles. The performance parameter reference value is the stress phase point of the initial period. The slope of performance degradation is calculated using the following formula:

[0041]

[0042] in, The number of bending cycles. , This represents the number of iterations in step 1.

[0043] The fault warning is based on the performance degradation slope. Greater than the preset performance degradation slope threshold At that time, a fault warning signal is generated.

[0044] A dynamic stress testing system for foldable screen phone motherboards is applicable to dynamic stress testing methods for foldable screen phone motherboards. The system includes:

[0045] Test control and modeling module: used to build logically related test parameter sets, generate dynamic bending trajectory models and stress calculation models, and issue synchronous control commands to other modules;

[0046] Stress loading execution module: including standardized test fixtures, servo-driven bending unit and temperature and humidity environment chamber, used to accurately reproduce dynamic bending stress and stress-environment coupling scenarios;

[0047] Online monitoring module: includes a synchronization clock unit, multiple types of test equipment and a data acquisition and storage unit, used to collect synchronized dynamic test data in real time;

[0048] Coupled analysis module: includes a timing alignment unit, a feature extraction unit, a decay modeling unit, and a fault warning unit, used to perform stress-performance coupled analysis, quantitatively evaluate performance decay trends, and generate warning signals;

[0049] Report generation module: Used to automatically generate dynamic stress test reports that include test parameters, attenuation trends, early warning records, and optimization suggestions.

[0050] The stress loading execution module includes a standardized testing fixture, a servo-driven bending unit, and a temperature and humidity environment chamber. The standardized testing fixture is equipped with an adjustable positioning mechanism to adapt to foldable screen mobile phone motherboards of different sizes. The servo-driven bending unit uses a high-precision servo motor to execute dynamic bending trajectories. The temperature and humidity environment chamber is used to regulate the temperature of the testing environment.

[0051] The synchronous clock unit is used to synchronize stress loading and data acquisition; the multi-type test equipment includes an oscilloscope, a network analyzer, and a communication tester, which are used to acquire real-time electrical parameters, signal integrity parameters, and functional status parameters, respectively; the data acquisition and storage unit is used to store dynamic test data.

[0052] Compared with the prior art, the present invention has the following beneficial effects:

[0053] 1. By constructing a stress loading model that includes complex working conditions such as asymmetric bending and angle holding, the actual bending process can be reproduced more accurately, simulating the asymmetric force state caused by holding, as well as the static stress environment when using it partially unfolded for a long time. This can effectively stimulate the potential mechanical fatigue of the motherboard, test the creep characteristics of the material and the reliability of the connection, and improve the authenticity and effectiveness of the test.

[0054] 2. By precisely connecting the mobile phone motherboard and the device, and combining the synchronous clock unit, the timing deviation between stress loading and data acquisition is eliminated; by using multiple types of online testing equipment to synchronously monitor electrical parameters, signal integrity parameters and functional status parameters, dynamic data in all dimensions is collected; after timing alignment processing and key parameter extraction, a one-to-one correspondence between stress values ​​and test data is established, solving the problem of the disconnect between stress and performance in traditional testing.

[0055] 3. By extracting key stress phase points within the cycle and using linear regression modeling, the performance degradation trend can be quantitatively analyzed. Combined with preset thresholds, early warning signals containing parameter types, current number of bends, and predicted failure cycles are generated. At the same time, a complete report containing degradation curves, early warning records, etc. is automatically generated. Attached Figure Description

[0056] Figure 1 This is a flowchart illustrating the steps of the dynamic stress testing method for foldable screen mobile phone motherboards according to the present invention.

[0057] Figure 2 This is a schematic diagram of the module composition of the dynamic stress testing system of the present invention;

[0058] Figure 3 A detailed flowchart of the stress-performance coupling analysis steps; Detailed Implementation

[0059] To enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0060] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this application. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0061] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0062] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0063] Example 1:

[0064] like Figure 1-3 As shown, the present invention provides a dynamic stress testing method for the motherboard of a foldable screen mobile phone, comprising the following steps:

[0065] Step 1: Construct a test parameter set and stress loading model based on the usage scenarios of foldable screen phones. The test parameter set includes the target bending angle. Bending frequency Parameters such as cycle number and temperature environment ;

[0066] The stress loading model is used to generate the dynamic bending trajectory of the stress-actuating device; the stress loading model is defined by the following formula:

[0067]

[0068] in, This represents the target bending angle at time t. Indicates the magnitude of the bending angle. Indicates the bending frequency. Indicates the initial phase; specifically, the initial phase The phase angle of the sine wave at the initial moment (t=0) is determined, thus defining the starting point of the dynamic bending test. Typically, the initial phase is set to begin the test from the equilibrium position (fully unfolded state). = 0; Alternatively, it can be set to other fixed values ​​according to specific test scenario requirements to simulate motion starting from a specific bending posture.

[0069] Bending angle amplitude Its value is not calculated using a single formula, but rather is a systematic engineering decision determined comprehensively based on product design specifications, testing objectives, and industry standards; determined based on product design specifications, The values ​​are primarily derived from the maximum design bending angle of the motherboard of the foldable phone under test. For example, if a phone is designed to fold completely in half, from 0° when fully flat to 180° when folded, then its bending angle range is... It should be set to half of the total travel distance. =90°. At this point, the angle range output by the stress loading model is... To precisely correspond to the bending of the physical equipment scope.

[0070] Based on the testing objectives, A can be specifically adjusted according to different testing purposes, building upon the design specifications. Reliability acceptance testing verifies the reliability of a product within its normal service life and typically uses methods directly determined by the design specifications. Value; Accelerated life testing / reliability baseline testing, in order to elicit potential defects and assess design margins in a shorter time, will employ optimized stress conditions, i.e., setting... >Design specification value. For example, in the 180° design specification, the following is adopted. The test was conducted at 100° to assess the failure modes of the motherboard under excessive bending conditions.

[0071] The bias function, which varies with time, is used to simulate real-world conditions such as asymmetric bending or maintaining a specific angle for an extended period. Its expression is:

[0072]

[0073] in, The bias amplitude has a range of values. It is used to control the degree of offset of asymmetric bending; The bias frequency needs to be much smaller than the bending frequency. , It is a symbolic function.

[0074] The real-time stress value of the mobile phone motherboard is calculated based on the dynamic bending trajectory generated by the stress loading model. The formula is as follows:

[0075]

[0076] in, Let t be the real-time stress value at time t, E be the elastic modulus of the mobile phone motherboard substrate, d be the thickness of the mobile phone motherboard substrate, and L be the effective bending length.

[0077] Step 2: Install the motherboard of the foldable screen phone to be tested onto the testing equipment and establish a connection between the motherboard and the testing equipment. Specifically, fix the motherboard with standardized testing fixtures to ensure that the bending center of the motherboard is aligned with the bending axis of the testing equipment. At the same time, connect the electrical interface of the testing equipment to the test points of the motherboard to establish a stress loading control path and a data transmission path.

[0078] Step 3: Start the test. Input the test parameter set into the stress loading model to generate a dynamic bending trajectory. The dynamic bending trajectory controls the stress execution device to apply periodic bending stress to the foldable screen phone motherboard. Specifically, the servo drive unit in the test device drives the fixture to achieve periodic bending of the motherboard according to the dynamic bending trajectory. At the same time, the temperature and humidity environment chamber maintains the set temperature environment parameters to ensure that the stress loading process is consistent with the actual use environment.

[0079] Step 4: During the application of cyclic bending stress, the foldable screen phone motherboard is monitored in real time using online testing equipment to collect dynamic test data sets of the phone motherboard; the dynamic test data sets include real-time electrical parameters, signal integrity parameters, and functional status parameters;

[0080] The motherboard's functionality and performance are monitored in real time using online testing equipment, and a dynamic test dataset with timestamps is collected. The dynamic test dataset is as follows:

[0081]

[0082] in, Dynamic test dataset with timestamps. Real-time electrical parameter sets with timestamps. A set of signal integrity parameters with timestamps. The set of functional status parameters with timestamps, and the set of real-time electrical parameters are as follows:

[0083]

[0084] in, Provides the main power supply voltage for the mobile phone motherboard. This is the operating current of the mobile phone motherboard. The voltage ripple factor is... ;in, This represents the peak-to-peak voltage. This is the average voltage value;

[0085] The signal integrity parameter set is as follows:

[0086]

[0087] in, This refers to the insertion loss of the radio frequency signal. For interface timing jitter, For the interface eye diagram opening;

[0088] The set of functional status parameters is as follows:

[0089]

[0090] in, In terms of communication function status, For data transmission rate, This represents the number of incorrect characters.

[0091] Step 5: Perform stress-performance coupling analysis on the collected dynamic test dataset. Based on the stress corresponding to the dynamic bending trajectory generated in Step 3 and the dynamic test data collected in Step 4, establish the correlation between stress and performance parameters to evaluate the performance status of the foldable screen phone motherboard under periodic bending stress and provide fault warning.

[0092] Step 51 of the stress-performance coupling analysis involves timing alignment, based on the synchronous clock timestamp, using the formula:

[0093]

[0094] Correct the timestamps of the dynamic test data, where, For dynamic test datasets The initial collection timestamp, This is a synchronization error correction value, obtained through calibration testing equipment, with a range of 0~1ms. Establish stress values ​​for the corrected timestamp. With dynamic test dataset The time correspondence; that is, for any time t, there exists a unique one. ,make and One-to-one correspondence.

[0095] Step 52 Key parameter extraction, within each bending cycle T, i.e. Extract key stress phase points, which must include at least the point of maximum bending angle. corresponding time and minimum bending angle point corresponding time Extraction time , Corresponding dynamic test data Construct a performance parameter set ,

[0096] The moment corresponding to the maximum bending angle Dynamic test data:

[0097]

[0098] The moment corresponding to the minimum bending angle Dynamic test data:

[0099]

[0100] Dynamic test data The set of performance parameters for:

[0101]

[0102] The fully unfolded form is:

[0103]

[0104] Pick up all key parameters for each cycle, generate a complete sequence of key parameters, and perform this for each bending cycle. Solve in sequence Finally, the key parameter sequence is obtained:

[0105]

[0106] Step 53 Performance degradation assessment: Based on the performance parameter values ​​of key stress phase points of multiple bending cycles, a linear regression model is used to assess the performance degradation trend.

[0107] Step 54: Fault warning, generating a warning signal based on the performance degradation trend.

[0108] Performance degradation is assessed using a linear regression model. The formula for the linear regression model is:

[0109]

[0110] in, The performance parameter values ​​are for the critical stress phase point in the k-th cycle. This is the current bending cycle number. The performance parameter reference value is the stress phase point of the initial period, which is the number of the first cycle. = , The slope of performance degradation is calculated using the following formula:

[0111]

[0112] in, This is the current bending cycle number. , This represents the number of iterations in step 1.

[0113] Preset performance degradation slope threshold The threshold values ​​are determined based on the motherboard material and design requirements; different parameters correspond to different thresholds. Fault warnings are based on the performance degradation slope. Greater than the preset performance degradation slope threshold When the time comes, a fault warning signal is generated; the warning signal includes the warning parameter type, the current number of bends, and the predicted failure period.

[0114] Step 6: Generate a dynamic stress test report

[0115] The report includes test parameter sets, stress loading model parameters, statistics of dynamic test datasets, stress-performance coupling analysis results, performance degradation trend curves, fault warning records, and optimization suggestions.

[0116] A dynamic stress testing system for foldable screen mobile phone motherboards, the system comprising:

[0117] Test Control and Modeling Module: Employs an industrial-grade controller to receive user-inputted test scenario parameters, construct a logically interconnected set of test parameters, and base it on formulas. Generate dynamic bending trajectory model based on formula Generate a stress calculation model and send synchronous control commands to other modules;

[0118] The stress loading execution module includes a standardized testing fixture, a servo-driven bending unit, and a temperature and humidity environmental chamber, used to accurately reproduce dynamic bending stress and stress-environment coupling scenarios. Specifically, the standardized testing fixture is equipped with an adjustable positioning mechanism to adapt to motherboards of foldable screen phones of different sizes; the servo-driven bending unit uses a high-precision servo motor with a control accuracy of 0.1° to meet testing requirements and can achieve periodic bending according to the dynamic bending trajectory; the temperature and humidity environmental chamber can be adjusted to the actual operating temperature range of -20℃ to 60℃.

[0119] The online monitoring module includes a synchronization clock unit, multiple types of test equipment, and a data acquisition and storage unit, used for real-time acquisition of synchronized dynamic test data. Specifically, the synchronization clock unit uses GPS high-precision synchronization technology to meet the synchronization requirements of stress loading and data acquisition; the multiple types of test equipment include an oscilloscope, a network analyzer, and a communication tester, used to acquire electrical parameters, signal integrity parameters, and functional status parameters, respectively; the data acquisition and storage unit uses SSD high-speed storage media, with a storage rate that meets the real-time storage requirements of dynamic test data.

[0120] The coupling analysis module includes a timing alignment unit, a feature extraction unit, a decay modeling unit, and a fault warning unit. It is used to perform stress-performance coupling analysis, quantitatively evaluate the performance decay trend, and generate warning signals. Specifically, the timing alignment unit corrects the timestamp based on a synchronous clock; the feature extraction unit extracts key parameters according to the bending period; the decay modeling unit calculates the performance decay slope through a linear regression model; and the fault warning unit compares the decay slope with a preset threshold to generate a warning signal.

[0121] Report generation module: Used to automatically generate dynamic stress test reports that include test parameters, attenuation trends, early warning records, and optimization suggestions.

[0122] The stress loading execution module includes a standardized test fixture, a servo-driven bending unit, and a temperature and humidity environment chamber. The standardized test fixture is equipped with an adjustable positioning mechanism to adapt to motherboards of foldable screen phones of different sizes. The servo-driven bending unit uses a high-precision servo motor to execute dynamic bending trajectories. The temperature and humidity environment chamber is used to regulate the temperature of the test environment.

[0123] The synchronous clock unit is used to synchronize stress loading and data acquisition; multiple types of test equipment, including oscilloscopes, network analyzers and communication testers, are used to acquire real-time electrical parameters, signal integrity parameters and functional status parameters, respectively; the data acquisition and storage unit is used to store dynamic test data.

[0124] The above are merely embodiments of the present invention. The circuits, electronic components, and modules involved are all prior art, fully achievable by those skilled in the art, and require no further explanation. The content protected by this application does not involve improvements to the software and methods. Commonly known structures and characteristics in the solutions are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are able to access all prior art in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of the present invention. These should also be considered within the scope of protection of the present invention, and will not affect the effectiveness of the implementation of the present invention or the practicality of the patent.

Claims

1. A dynamic stress testing method for the motherboard of a foldable screen mobile phone, characterized in that: Includes the following steps: Step 1: Construct a test parameter set and stress loading model based on the usage scenarios of foldable screen phones. The test parameter set includes the target bending angle, bending frequency, number of cycles, and temperature environment. The stress loading model is used to generate the dynamic bending trajectory that controls the stress loading execution module. Step 2: Install the motherboard of the foldable screen phone to be tested onto the test equipment and establish a connection between the foldable screen phone motherboard and the test equipment; Step 3: Start the test, input the test parameter set into the stress loading model to generate a dynamic bending trajectory, and use the dynamic bending trajectory to control the stress loading execution module to apply periodic bending stress to the foldable screen phone motherboard; Step 4: During the application of periodic bending stress, the online monitoring module performs real-time functional and performance monitoring on the foldable screen phone motherboard and collects dynamic test data sets of the phone motherboard; the dynamic test data sets include real-time electrical parameters, signal integrity parameters, and functional status parameters; Step 5: Perform stress-performance coupling analysis on the collected dynamic test dataset. Based on the stress corresponding to the dynamic bending trajectory generated in Step 3 and the dynamic test data collected in Step 4, establish the correlation between the stress dynamic test data to evaluate the performance status of the foldable screen phone motherboard under periodic bending stress and provide fault warning. Step 6: Generate a dynamic stress test report; The stress loading model is defined using the following formula: in, This represents the target bending angle at time t. Indicates the magnitude of the bending angle. Indicates the bending frequency. Indicates the initial phase. The bias function, which varies with time, is used to simulate real-world conditions such as asymmetric bending or maintaining a specific angle for an extended period. Its expression is: in, The bias amplitude has a range of values. It is used to control the degree of offset of asymmetric bending; The bias frequency needs to be much smaller than the bending frequency. , It is a symbolic function.

2. The dynamic stress testing method for foldable screen mobile phone motherboards as described in claim 1, characterized in that, The real-time stress value of the mobile phone motherboard is calculated based on the dynamic bending trajectory generated by the stress loading model. The formula is as follows: in, Let t be the real-time stress value at time t, E be the elastic modulus of the mobile phone motherboard substrate, d be the thickness of the mobile phone motherboard substrate, and L be the effective bending length.

3. The dynamic stress testing method for foldable screen mobile phone motherboards as described in claim 1, characterized in that, In step 4, the motherboard's real-time functionality and performance are monitored using an online monitoring module, and a dynamic test dataset with timestamps is collected. The dynamic test dataset is as follows: in, Dynamic test dataset with timestamps. Real-time electrical parameter sets with timestamps. A set of signal integrity parameters with timestamps. The set of functional status parameters with timestamps, and the set of real-time electrical parameters are as follows: in, Provides the main power supply voltage for the mobile phone motherboard. This is the operating current of the mobile phone motherboard. The voltage ripple factor is... ;in, This represents the peak-to-peak voltage. This is the average voltage value; The signal integrity parameter set is as follows: in, This refers to the insertion loss of the radio frequency signal. For interface timing jitter, For the interface eye diagram opening; The set of functional status parameters is as follows: in, In terms of communication function status, For data transmission rate, This represents the number of incorrect characters.

4. The dynamic stress testing method for foldable screen mobile phone motherboards as described in claim 1, characterized in that, Step 5, the stress-performance coupling analysis, includes step 51: timing alignment processing, based on the synchronous clock timestamp, using the formula: Correct the timestamps of the dynamic test data, where, This is the initial collection timestamp. This is the synchronization error correction value. Establish stress values ​​for the corrected timestamp. With dynamic test dataset Time correspondence; Step 52: Key parameter extraction, within each bending cycle T, Extract key stress phase points, which should include at least the time corresponding to the maximum and minimum bending angle points. Parameter values; Step 53: Performance degradation assessment. Based on the performance parameter values ​​of key stress phase points of multiple bending cycles, a linear regression model is used to assess the performance degradation trend. Step 54: Fault warning, generate warning signals based on performance degradation trends.

5. The dynamic stress testing method for foldable screen mobile phone motherboards as described in claim 4, characterized in that, Performance degradation is assessed using a linear regression model. The formula for the linear regression model is: in, These are the performance parameter values ​​for the critical stress phase point in the k-th period. This represents the current number of bending cycles. The performance parameter reference value is the stress phase point of the initial period. The slope of performance degradation is calculated using the following formula: in, The number of bending cycles. , This represents the number of iterations in step 1.

6. The dynamic stress testing method for foldable screen mobile phone motherboards as described in claim 5, characterized in that, The fault warning is based on the performance degradation slope. Greater than the preset performance degradation slope threshold At that time, a fault warning signal is generated.

7. A dynamic stress testing system for foldable screen mobile phone motherboards, applicable to the dynamic stress testing method for foldable screen mobile phone motherboards as described in any one of claims 1-6, characterized in that: The system includes: Test control and modeling module: Based on the usage scenarios of foldable screen phones, a test parameter set and stress loading model are constructed, and the dynamic bending trajectory of the stress loading execution module is generated according to the stress loading model; Stress loading execution module: including standardized test fixtures, servo-driven bending unit and temperature and humidity environment chamber, used to accurately reproduce dynamic bending stress and stress-environment coupling scenarios; Online monitoring module: includes a synchronization clock unit, multiple types of test equipment and a data acquisition and storage unit, used to collect synchronized dynamic test data in real time; Coupled analysis module: includes a timing alignment unit, a feature extraction unit, a decay modeling unit, and a fault warning unit, used to perform stress-performance coupled analysis, quantitatively evaluate performance decay trends, and generate warning signals; Report generation module: Used to automatically generate dynamic stress test reports that include test parameters, attenuation trends, early warning records, and optimization suggestions.

8. The dynamic stress testing system for foldable screen mobile phone motherboards as described in claim 7, characterized in that: The standardized testing fixture is equipped with an adjustable positioning mechanism to adapt to foldable screen mobile phone motherboards of different sizes; the servo-driven bending unit uses a servo motor to execute dynamic bending trajectories; and the temperature and humidity environment chamber is used to regulate the temperature of the testing environment.

9. A dynamic stress testing system for foldable screen mobile phone motherboards as described in claim 7, characterized in that: The synchronous clock unit is used to synchronize stress loading and data acquisition; the multi-type test equipment includes an oscilloscope, a network analyzer, and a communication tester, which are used to acquire real-time electrical parameters, signal integrity parameters, and functional status parameters, respectively; the data acquisition and storage unit is used to store dynamic test data.

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