Automatic welding and positioning device for electronic components of circuit board

Abstract

The invention relates to the technical field of welding equipment, and particularly discloses a circuit board electronic element automatic welding positioning device which comprises a base and a circuit board, a sliding rail is fixedly connected to the inner surface of the base, a movable frame used for containing the circuit board is slidably connected to the outer surface of the sliding rail, and an adsorption assembly is arranged on the inner side of the movable frame. And the adsorption assembly comprises a piston cavity formed in the inner side of the movable frame in an embedded mode, a piston plate is slidably connected to the inner surface of the piston cavity, and a magnetic rod is fixedly connected to the outer surface of the left end of the piston plate. By arranging the adsorption assembly, the circuit board can be adsorbed to the upper side of the movable frame under the action of negative pressure of gas in the gas guide hole, so that the positions of the circuit board and the movable frame are kept stable, the probability of accidental sliding of the circuit board in the welding process is reduced, the welding error can be effectively reduced, and the welding quality is improved. The welding precision of the circuit board can be improved, and meanwhile, the interference of an external clamping structure on the welding position can be reduced.

Description

Technical Field

[0001] This invention relates to the field of welding equipment technology, and in particular to an automatic welding and positioning device for electronic components on circuit boards. Background Technology

[0002] Circuit boards are the core components that support electronic components and realize electrical connections. They are usually made of a composite of a substrate and a conductive layer. Soldering electronic components on circuit boards is a core skill in electronic manufacturing and repair. During the soldering process, the positioning accuracy of the circuit board directly affects the soldering quality. Therefore, existing technologies often use soldering positioning devices to improve soldering accuracy.

[0003] For example, Chinese patent CN221363446U discloses a circuit board welding positioning device. This device uses a positioning bar and a clamping mechanism for initial clamping. Then, by pulling the handle upward, the positioning bar is raised inside the clamping plate, the slot disengages from the outer surface of the block, and the spring is squeezed to retract the pressing bar into the clamping plate. The position of the positioning bar inside the clamping plate can then be adjusted to facilitate the positioning of the circuit board. While existing circuit board welding positioning devices can clamp and fix circuit boards during operation, the clamping mechanism can obstruct the upper part of the circuit board. During the welding process, the clamping mechanism can interfere with the operation position of the welding machine, affecting the convenience of welding operation. At the same time, when the clamping mechanism obstructs the welding position, the clamping position needs to be changed, which will reduce the welding efficiency to a certain extent. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic soldering and positioning device for electronic components on a circuit board. Under the negative pressure of the gas inside the vent hole, the circuit board is adsorbed onto the upper side of the movable frame, thereby stabilizing the position of the circuit board and the movable frame, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic soldering and positioning device for electronic components on a circuit board, comprising a base and a circuit board, wherein a slide rail is fixedly connected to the inner surface of the base, and a movable frame for placing the circuit board is slidably connected to the outer surface of the slide rail, and an adsorption assembly is provided inside the movable frame, the adsorption assembly comprising a piston chamber embedded in the inner side of the movable frame, a piston plate being slidably connected to the inner surface of the piston chamber, a magnetic rod being fixedly connected to the outer surface of the left end of the piston plate, a connecting groove being embedded in the outer surface of the magnetic rod, a top rod being magnetically connected inside the connecting groove, and a vent hole being embedded in the outer surface of the upper end of the movable frame, and a one-way valve being provided inside the vent hole.

[0006] Preferably, the number of air guide holes is several groups and they are distributed in a parallel array. The outer surface of the upper end of the movable frame is in contact with the circuit board. The inner surface of the base is embedded with a slot. The side of the top rod away from the piston plate is fixedly connected to the slot. The outer surface of the movable frame is in contact with the slot. The upper side of the air guide hole is conical.

[0007] Preferably, a drive assembly is provided on the lower side of the movable frame. The drive assembly includes a slide fixedly connected to the lower outer surface of the movable frame. An installation groove is embedded in the upper outer surface of the base. An electric push rod is fixedly connected to the inner surface of the installation groove. The output end of the electric push rod is fixedly connected to the slide. The slide is located inside the installation groove and slides in contact with the installation groove. The number of slide rails is two sets and they are symmetrically distributed.

[0008] Preferably, a positioning component is provided on the upper side of the movable frame. The positioning component includes a limiting plate fixedly connected to the outer surface of the upper end of the movable frame. The limiting plate is right-angled, and there are four sets of limiting plates located at the four corners of the movable frame. The outer surface of the movable frame is in contact with the side of the circuit board.

[0009] Preferably, an air guide groove is embedded in the inner side of the movable frame, and the air guide groove is connected to the inside of the piston chamber. An air storage chamber is embedded in the inner side of the right-side limiting plate, and a compression sleeve is fixedly connected to the outer surface of the air storage chamber. An air guide groove is embedded in the inner side of the movable frame, and one end of the air guide groove extends into the inside of the air storage chamber while the other end is connected to the air guide groove.

[0010] Preferably, the extrusion sleeve is made of elastic material, the piston cavity is filled with thermally expanding gas, the outer surface of the extrusion sleeve is arc-shaped, a guide rail is fixedly connected to the upper outer surface of the base, and a frame is slidably connected to the outer surface of the guide rail.

[0011] Preferably, the frame has a U-shaped structure, and a welding machine for soldering circuit boards is provided on the outer surface of the frame. A heating plate is fixedly connected to the inner surface of the movable frame. The heating plate is located on the lower side of the circuit board, and there are two sets of heating plates symmetrically distributed on both sides of the piston chamber.

[0012] Preferably, a pressing assembly is provided on the outer side of the right-side limiting plate. The pressing assembly includes a sliding groove that extends through the outer surface of the limiting plate. A movable rod is slidably connected to the inner side of the sliding groove. An extrusion block is rotatably connected to the outer surface of the movable rod. The extrusion block is cam-shaped. There are two sets of extrusion blocks that are symmetrically distributed. The outer surface of the extrusion block is in contact with the upper surface of the circuit board.

[0013] Preferably, the base has a material release assembly inside, the material release assembly includes a storage groove embedded in the upper outer surface of the base, a movable shaft is fixedly connected to the inner surface of the storage groove, and a bracket is rotatably connected to the outer surface of the movable shaft.

[0014] Preferably, the bracket has an L-shaped structure, a reset plate is fixedly connected to the outer surface of the bracket, the side of the reset plate away from the bracket is fixedly connected to the inner surface of the storage groove, the reset plate is arc-shaped and made of elastic material, the outer surface of the bracket slides in contact with the outer side of the movable frame, and the bracket and the heating plate are staggered in position.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This solution uses an adsorption component to adsorb the circuit board onto the upper side of the movable frame under the negative pressure of the gas inside the air vent. This keeps the position of the circuit board and the movable frame stable, which helps to reduce the chance of the circuit board accidentally sliding during the soldering process. This effectively reduces soldering errors and improves the soldering accuracy of the circuit board. It also reduces the interference of external clamping structures on the soldering position. 2. This solution, by setting up a positioning component, allows the expanded extrusion sleeve to contact the right side of the circuit board. This not only increases the clamping force on the circuit board to a certain extent, thus improving the clamping stability of the circuit board, but also allows the elastic deformation of the extrusion sleeve to keep the extrusion force on the circuit board within an appropriate range, thereby reducing the risk of damage to the circuit board. The thermal expansion gas inside the gas storage chamber will gradually expand, thereby increasing the deformation range of the extrusion sleeve to a certain extent, thus further improving the clamping effect on the circuit board. 3. This solution, by setting up a stripping component, uses the movement of the bracket to lift the circuit board upwards, thereby separating a portion of the circuit board from the upper surface of the movable frame. This effectively reduces the difficulty of removing the circuit board, improves the ease of operation of the electronic component welding device, and thus improves welding efficiency to a certain extent. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2; Figure 3 This is a top view of the overall structure of the present invention; Figure 4 For the present invention Figure 3 Sectional view along line AA; Figure 5 For the present invention Figure 3 Sectional view along the BB direction; Figure 6 For the present invention Figure 6 C-axis sectional view; Figure 7 For the present invention Figure 2 Enlarged view of point D; Figure 8 For the present invention Figure 4 Enlarged view of point E in the middle; Figure 9 For the present invention Figure 5 Enlarged diagram of point F in the middle.

[0018] Explanation of reference numerals in the attached figures: 11. Base; 12. Guide rail; 13. Frame; 14. Welding machine; 15. Circuit board; 16. Limiting plate; 17. Slide rail; 18. Movable frame; 19. Top rod; 20. Piston chamber; 21. Extrusion sleeve; 22. Connecting groove; 23. Air guide hole; 24. Magnetic rod; 25. Piston plate; 27. Slide groove; 28. Movable rod; 29. ​​Extrusion block; 30. Storage groove; 31. Movable shaft; 32. Bracket; 33. Reset plate; 34. Slot; 35. Heating plate; 36. Air guide groove one; 37. Air guide groove two; 38. Air storage chamber; 39. Mounting groove; 40. Electric push rod; 41. Slide seat. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1 to 9 The present invention provides a technical solution: An automatic soldering and positioning device for electronic components on a circuit board includes a base 11 and a circuit board 15. A slide rail 17 is fixedly connected to the inner surface of the base 11, and a movable frame 18 for placing the circuit board 15 is slidably connected to the outer surface of the slide rail 17. An adsorption assembly is provided inside the movable frame 18. The adsorption assembly includes a piston chamber 20 embedded inside the movable frame 18. A piston plate 25 is slidably connected to the inner surface of the piston chamber 20. A magnetic rod 24 is fixedly connected to the outer surface of the left end of the piston plate 25. A connecting groove 22 is embedded in the outer surface of the magnetic rod 24. A top rod 19 is magnetically connected inside the connecting groove 22. An air guide hole 23 is embedded in the outer surface of the upper end of the movable frame 18. A one-way valve is provided inside the air guide hole 23.

[0021] The number of air guide holes 23 is several groups and they are arranged in a parallel array. The upper outer surface of the movable frame 18 is in contact with the circuit board 15. The inner surface of the base 11 is embedded with a slot 34. The side of the top rod 19 away from the piston plate 25 is fixedly connected to the slot 34. The outer surface of the movable frame 18 is in contact with the slot 34. The upper side of the air guide hole 23 is conical.

[0022] By adopting the above technical solution, when soldering electronic components on the circuit board 15, an adsorption component is set up to keep the position of the circuit board 15 stable during the soldering process. During operation, the circuit board 15 is first placed outside the movable frame 18. The base 11 slides and supports the movable frame 18 via the slide rail 17. The base 11 is used to fix and support the top rod 19 via the slot 34. The piston plate 25 is fixed and limited by the magnetic attraction between the top rod 19 and the magnetic rod 24. When the movable frame 18 moves the circuit board 15 to the left, the piston plate 25 slides inside the piston cavity 20. As the piston plate 25 gradually moves, a certain negative pressure is generated inside the piston cavity 20 located to the left of the piston plate 25. At this time, the gas inside the vent 23 enters the piston under the action of the negative gas pressure. Inside cavity 20, the lower surface of circuit board 15 is in contact with the upper side of movable frame 18. Under the negative pressure of gas inside air vent 23, circuit board 15 is adsorbed onto the upper side of movable frame 18, thus stabilizing the position of circuit board 15 and movable frame 18. This helps reduce the probability of circuit board 15 accidentally sliding during the soldering process, thereby effectively reducing soldering errors and improving the soldering accuracy of circuit board 15. It also reduces interference with the soldering position. When movable frame 18 moves into the slot 34 on the surface of base 11, part of movable frame 18 will engage in the slot 34. The slot 34 can limit the position of movable frame 18, thereby accurately positioning the position of movable frame 18 and further improving the soldering accuracy.

[0023] Specifically, such as Figure 3 , Figure 4 and Figure 6 As shown, a positioning component is provided on the upper side of the movable frame 18. The positioning component includes a limiting plate 16 fixedly connected to the upper outer surface of the movable frame 18. The limiting plate 16 is right-angled, and there are four sets of limiting plates 16 located at the four corners of the movable frame 18. The outer surface of the movable frame 18 is in contact with the side of the circuit board 15.

[0024] The movable frame 18 has an embedded air guide groove 36, which is connected to the piston chamber 20. The right side limit plate 16 has an embedded air storage chamber 38, and a compression sleeve 21 is fixedly connected to the outer surface of the air storage chamber 38. The movable frame 18 has an embedded air guide groove 37, one end of which extends into the air storage chamber 38 and the other end is connected to the air guide groove 36.

[0025] By adopting the above technical solution, a positioning component is set up to improve the convenience of placing the circuit board 15. When the operator places the circuit board 15 on the upper side of the movable frame 18, the left edge of the circuit board 15 contacts the outer surface of the limiting plate 16. The two sets of limiting plates 16 on the left side can limit the circuit board 15, thereby making the placement of the circuit board 15 more accurate. After the circuit board 15 is placed, when the movable frame 18 moves the circuit board 15 to the left, as the piston plate 25 moves inside the piston chamber 20, the piston plate 25 will squeeze the gas on its right side. At this time, the gas will enter the gas guide groove 36 under pressure, and then the gas will enter the gas storage chamber 38 through the gas guide groove 36 and the gas guide groove 37 in sequence. As the gas pressure inside the gas storage chamber 38 gradually increases... The compression sleeve 21 on the surface of the right limit plate 16 expands outward. The expanded compression sleeve 21 contacts the right side of the circuit board 15, which not only increases the clamping force on the circuit board 15 to a certain extent and helps to improve the clamping stability of the circuit board 15, but also the elastic deformation of the compression sleeve 21 can keep the pressure on the circuit board 15 within an appropriate range, thereby reducing the risk of damage to the circuit board 15. After the electronic components on the surface of the circuit board 15 are soldered, the movable frame 18 drives the circuit board 15 to move in the opposite direction. At this time, the piston plate 25 will move in the opposite direction inside the piston chamber 20, thereby sucking the gas inside the gas storage chamber 38 outward. At this time, the compression sleeve 21 moves in the opposite direction and resets under its own elastic force, thereby making the surface of the compression sleeve 21 disengage from the circuit board 15.

[0026] Specifically, such as Figure 3 and Figure 4As shown, a drive assembly is provided on the lower side of the movable frame 18. The drive assembly includes a slide 41 fixedly connected to the lower outer surface of the movable frame 18. An installation groove 39 is embedded in the upper outer surface of the base 11. An electric push rod 40 is fixedly connected to the inner surface of the installation groove 39. The output end of the electric push rod 40 is fixedly connected to the slide 41. The slide 41 is located inside the installation groove 39 and slides in contact with the installation groove 39. There are two sets of slide rails 17, which are symmetrically distributed.

[0027] The extrusion sleeve 21 is made of elastic material, the piston chamber 20 is filled with thermal expansion gas, the outer surface of the extrusion sleeve 21 is arc-shaped, the upper outer surface of the base 11 is fixedly connected to the guide rail 12, and the outer surface of the guide rail 12 is slidably connected to the frame 13.

[0028] The frame 13 has a U-shaped structure. A welding machine 14 for welding circuit boards 15 is provided on the outer surface of the frame 13. A heating plate 35 is fixedly connected to the inner surface of the movable frame 18. The heating plate 35 is located on the lower side of the circuit board 15. There are two sets of heating plates 35, which are symmetrically distributed on both sides of the piston chamber 20.

[0029] By adopting the above technical solution, in order to improve the welding efficiency of the circuit board 15, a drive assembly is set up. The base 11 is fixedly installed on the electric push rod 40 through the mounting groove 39. When the electric push rod 40 is working, it pushes the slide 41 to slide inside the mounting groove 39. During the movement of the slide 41, it drives the movable frame 18 to move synchronously. The base 11 slides and supports the frame 13 through the guide rail 12. The frame 13 is used for welding sliding support. By setting up a drive module, the frame 13 can be driven to slide on the upper side of the guide rail 12 and drive the welding machine 14 to move along the outer side of the frame 13. In this application, the drive module adopts the disclosed prior art such as the drag chain, so its specific structure and working principle will not be described in detail here. When the circuit board 15 moves to the lower side of the frame 13, This allows the welding machine 14 to perform welding processing on electronic components at different positions on the surface of the circuit board 15. The lower surface of the circuit board 15 is in contact with the heating plate 35. The heating plate 35 heats the circuit board 15, causing the solder paste on the surface of the circuit board 15 to melt. The solder paste forms a liquid metal flow and fills the gap between the pad and the component pin, thereby reducing the risk of gaps between the electronic component pin and the pad and helping to improve the welding processing accuracy. During the processing, the heat generated by the heating plate 35 is transferred to the interior of the limiting plate 16 through the movable frame 18. The thermal expansion gas inside the gas storage cavity 38 will gradually expand, thereby increasing the deformation range of the extrusion sleeve 21 to a certain extent, thereby further improving the clamping effect on the circuit board 15.

[0030] Specifically, such as Figure 2 and Figure 7As shown, a pressing assembly is provided on the outer side of the right-side limiting plate 16. The pressing assembly includes a sliding groove 27 that runs through the outer surface of the limiting plate 16. A movable rod 28 is slidably connected to the inner side of the sliding groove 27. A pressing block 29 is rotatably connected to the outer surface of the movable rod 28. The pressing block 29 is cam-shaped. There are two sets of pressing blocks 29 that are symmetrically distributed. The outer surface of the pressing block 29 is in contact with the upper surface of the circuit board 15.

[0031] By adopting the above technical solution, in order to further improve the placement stability of the circuit board 15, a pressing component is set up. The left limiting plate 16 slides to support the movable rod 28 through the slide groove 27. The movable rod 28 and the slide groove 27 are connected by damping. Under the action of friction, the position of the movable rod 28 will remain stable. Before the circuit board 15 is placed, the operator rotates the pressing block 29 at a certain angle. The pressing block 29 and the movable rod 28 are connected by damping rotation. Under the action of no external force, the pressing block 29 and the movable rod 28 will remain stationary. After the circuit board 15 is placed on the surface of the movable frame 18, the operator rotates the pressing block 29 in the opposite direction so that the pressing block 29 contacts the edge of the upper surface of the circuit board 15, thereby pressing and fixing the circuit board 15. The pressing block 29 is cam-shaped and can use circuit boards 15 of different thicknesses, thereby effectively improving the ease of operation of the pressing component.

[0032] Specifically, such as Figure 5 and Figure 9 As shown, a material removal assembly is provided on the inner side of the base 11. The material removal assembly includes a storage groove 30 embedded in the outer surface of the upper end of the base 11. A movable shaft 31 is fixedly connected to the inner surface of the storage groove 30, and a bracket 32 ​​is rotatably connected to the outer surface of the movable shaft 31.

[0033] The bracket 32 ​​has an L-shaped structure. A reset plate 33 is fixedly connected to the outer surface of the bracket 32. The side of the reset plate 33 away from the bracket 32 ​​is fixedly connected to the inner surface of the storage groove 30. The reset plate 33 is arc-shaped and made of elastic material. The outer surface of the bracket 32 ​​slides in contact with the outer side of the movable frame 18. The bracket 32 ​​and the heating plate 35 are staggered in position.

[0034] By adopting the above technical solution, after the circuit board 15 is soldered, a stripping component is set up to reduce the difficulty of removing the circuit board 15. After soldering, the pressing block 29 is first separated from the outer surface of the circuit board 15. Then, the drive component drives the movable frame 18 to slide away from the guide rail 12. When the movable frame 18 moves to the bracket 32, the movable frame 18 will contact the outer surface of the bracket. As the movable frame 18 continues to move, it will push the bracket 32. The base 11 supports the movable shaft 31 through the storage groove 30. Under the push of the movable frame 18, the bracket 32 ​​will flip around the movable shaft 31 as the fulcrum. The movable shaft 31 has an L-shaped structure. During the flipping process, the bracket... The other end of the bracket 32 ​​will flip up from inside the storage slot 30, and then the left end of the bracket 32 ​​will contact the lower surface of the circuit board 15. The movement of the bracket 32 ​​will push the circuit board 15 upward, thereby causing part of the circuit board 15 to disengage from the upper surface of the movable bracket 18, which can effectively reduce the difficulty of removing the circuit board 15 and help improve the ease of operation of the electronic component soldering device. During the rotation, the bracket 32 ​​will squeeze the reset plate, causing the bending arc of the reset plate 33 to gradually increase. When the movable bracket 18 moves in the opposite direction and disengages from the outer surface of the bracket 32, the bracket 32 ​​will rotate in the opposite direction under the elastic force of the reset plate 33, so that the bracket 32 ​​can be stored inside the storage slot 30.

[0035] Working principle: When the circuit board 15 welding positioning device is working, the circuit board 15 is first placed on the upper side of the movable frame 18, and the left edge of the circuit board 15 is made to contact the outer surface of the limiting plate 16. Then, the pressing block 29 is rotated to contact the upper edge of the circuit board 15, thereby pressing and fixing the circuit board 15. When the movable frame 18 moves the circuit board 15 to the left, the piston plate 25 slides inside the piston chamber 20. The gas inside the air guide hole 23 enters the piston chamber 20 under the action of negative gas pressure. The circuit board 15 is adsorbed on the upper side of the movable frame 18 under the action of negative gas pressure inside the air guide hole 23, thereby keeping the position of the circuit board 15 and the movable frame 18 stable. The piston plate 25 will squeeze the gas on its right side. The gas enters the gas storage chamber 38 through the air guide groove and the second air guide groove 37 in sequence, and contacts the right side of the circuit board 15 through the expanded pressing sleeve 21. Not only can it increase the clamping force on the circuit board 15 to a certain extent, which helps to improve the clamping stability of the circuit board 15, when the circuit board 15 moves to the lower side of the frame 13, the welding machine 14 can be operated to weld electronic components at different positions on the surface of the circuit board 15. The thermal expansion gas inside the gas storage chamber 38 will gradually expand, which can increase the deformation range of the extrusion sleeve 21 to a certain extent, thereby further improving the clamping effect on the circuit board 15. After the circuit board 15 is welded, the movable frame 18 will drive the circuit board 15 to move in the opposite direction. The bracket 32 ​​will be pushed by the movable frame 18 and flipped around the movable shaft 31 as the fulcrum. The left end of the bracket 32 ​​will contact the lower surface of the circuit board 15. The movement of the bracket 32 ​​will push the circuit board 15 upward, thereby causing part of the circuit board 15 to disengage from the upper surface of the movable frame 18, thus effectively reducing the difficulty of removing the circuit board 15.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic soldering positioning device for electronic components of a circuit board, comprising a base (11) and a circuit board (15), characterized in that: The inner surface of the base (11) is fixedly connected with a slide rail (17), the outer surface of the slide rail (17) is slidably connected with a movable frame (18) for placing a circuit board (15), the inner side of the movable frame (18) is provided with a suction assembly, the suction assembly comprises a piston cavity (20) embeddedly opened in the inner side of the movable frame (18), the inner surface of the piston cavity (20) is slidably connected with a piston plate (25), the outer surface of the left end of the piston plate (25) is fixedly connected with a magnetic rod (24), the outer surface of the magnetic rod (24) is embeddedly provided with a connecting groove (22), the inner side of the connecting groove (22) is magnetically connected with a top rod (19), the outer surface of the upper end of the movable frame (18) is embeddedly provided with a gas guide hole (23), and the inner side of the gas guide hole (23) is provided with a one-way valve.

2. An apparatus for automatic positioning of electronic components for soldering on a circuit board as defined in claim 1, wherein: The number of the gas guide holes (23) is several groups and is distributed in parallel array, the outer surface of the upper end of the movable frame (18) is in contact with the circuit board (15), the inner surface of the base (11) is embeddedly provided with a clamping groove (34), one side of the top rod (19) away from the piston plate (25) is fixedly connected with the clamping groove (34), the outer surface of the movable frame (18) is in clamping contact with the clamping groove (34), and the upper side of the gas guide hole (23) is conical.

3. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 2, wherein: The lower side of the movable frame (18) is provided with a driving assembly, the driving assembly comprises a sliding seat (41) fixedly connected with the outer surface of the lower end of the movable frame (18), the outer surface of the upper end of the base (11) is embeddedly provided with a mounting groove (39), the inner surface of the mounting groove (39) is fixedly connected with an electric push rod (40), the output end of the electric push rod (40) is fixedly connected with the sliding seat (41), the sliding seat (41) is located in the mounting groove (39) and is in sliding contact with the mounting groove (39), and the number of the slide rails (17) is two groups and is symmetrically distributed.

4. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 3, wherein: The upper side of the movable frame (18) is provided with a positioning assembly, the positioning assembly comprises a limiting plate (16) fixedly connected with the outer surface of the upper end of the movable frame (18), the limiting plate (16) is in right angle shape, the number of the limiting plate (16) is four groups and is located at the four corners of the movable frame (18), and the outer surface of the movable frame (18) is in contact with the side edge of the circuit board (15).

5. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 4, wherein: The inner side of the movable frame (18) is embeddedly provided with a gas guide groove one (36), the gas guide groove one (36) is communicated with the inside of the piston cavity (20), the inner side of the right limiting plate (16) is embeddedly provided with a gas storage cavity (38), the outer surface of the gas storage cavity (38) is fixedly connected with a squeezing sleeve (21), the inner side of the movable frame (18) is embeddedly provided with a gas guide groove two (37), one end of the gas guide groove two (37) penetrates into the inside of the gas storage cavity (38) and the other end is communicated with the gas guide groove one (36).

6. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 5, wherein: The squeezing sleeve (21) is made of elastic material, the inner side of the piston cavity (20) is filled with thermal expansion gas, the outer surface of the squeezing sleeve (21) is in arc shape, the outer surface of the guide rail (12) is slidably connected with a rack (13).

7. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 6, wherein: The rack (13) is of U-shaped structure, the outer surface of the rack (13) is provided with a welding machine (14) for welding the circuit board (15), the inner surface of the movable frame (18) is fixedly connected with a heating plate (35), the heating plate (35) is located below the circuit board (15), the number of the heating plate (35) is two groups and is symmetrically distributed on both sides of the piston cavity (20).

8. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 7, wherein: The outer side of the right limiting plate (16) is provided with a pressing assembly, the pressing assembly comprises a sliding groove (27) penetratingly arranged on the outer surface of the limiting plate (16), the inner side of the sliding groove (27) is dampedly and slidably connected with a movable rod (28), the outer surface of the movable rod (28) is dampedly and rotatably connected with a pressing block (29), the pressing block (29) is in cam shape, the number of the pressing block (29) is two groups and is symmetrically distributed, and the outer surface of the pressing block (29) is in contact with the upper surface of the circuit board (15).

9. An apparatus for automatically positioning electronic components on a circuit board as recited in claim 8, wherein: The inner side of the base (11) is provided with a material stripping assembly, the material stripping assembly comprises a receiving groove (30) embeddedly arranged on the outer surface of the upper end of the base (11), the inner surface of the receiving groove (30) is fixedly connected with a movable shaft (31), and the outer surface of the movable shaft (31) is rotatably connected with a bracket (32).

10. The apparatus of claim 9 wherein: the circuit board is a printed circuit board; the electronic component is a surface mount electronic component; the circuit board electronic component automatic soldering and positioning apparatus further comprises a soldering station; and the circuit board electronic component automatic soldering and positioning apparatus further comprises a soldering station. The bracket (32) is of L-shaped structure, the outer surface of the bracket (32) is fixedly connected with a reset plate (33), one side, away from the bracket (32), of the reset plate (33) is fixedly connected with the inner surface of the receiving groove (30), the reset plate (33) is in circular arc shape and is made of elastic material, the outer surface of the bracket (32) is in sliding contact with the outer side of the movable frame (18), and the bracket (32) and the heating plate (35) are staggered in position.

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