A curtain wall photoelectric glass processing technology

Abstract

This invention discloses a processing technology for photoelectric glass used in curtain walls, relating to the field of photoelectric glass processing technology, including the following steps: S1, cleaning and drying tempered glass; S2, cutting PVB film and attaching it to the tempered glass; S3, making FPCB light strips using FPCB material; S4, manufacturing conductive strips; S5, attaching the conductive strips to the PVB film of the tempered glass; S6, attaching the FPCB light strips to the PVB film; S7, placing tempered glass on the FPCB light strips to form a photoelectric glass module; S8, placing the photoelectric glass module into an autoclave for heating to form a complete photoelectric glass. This invention mainly uses FPCB, which has good flexibility and a small difference in thermal expansion coefficient, as the carrier substrate for LEDs, making it suitable for the strain and deformation of large curtain walls. This process cuts a whole FPCB light board into single FPCB light strips, which are then inserted into the conductive strips. This avoids waste of FPCB material and allows for flexible allocation of the distance between the FPCB light strips to adapt to any size. The detachable connection makes the curtain wall photoelectric glass easy to maintain.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic glass processing technology, specifically to a processing technology for optoelectronic glass used in curtain walls. Background Technology

[0002] Photovoltaic glass for curtain walls is a high-tech building material that encapsulates photoelectric components such as light-emitting diodes (LEDs) within multiple layers of glass, achieving the integration of dynamic display, lighting, and architectural aesthetics on the building facade. It must not only meet basic requirements for building lighting, safety, and energy conservation, but also possess reliable display functionality and a long lifespan.

[0003] However, the commonly used processing technology for optoelectronic glass generally uses a rigid, hard-brushed PCB board as the substrate for LEDs. Circuitry is created on the PCB through etching, and LED chips, resistors, capacitors, and other components are soldered onto it using SMT (Surface Mount Technology) to form a complete LED light board. Typically, the conductive strips are soldered to the LED light board as a single unit. Then, the entire LED light board is attached to the glass, and finally, the top and bottom glass panels and the central LED light board are laminated and encapsulated to form the optoelectronic glass. While this integrated LED light board ensures the connection between the LED light board and the conductive strips... While the connection relationship is understood, this traditional processing technology uses rigid PCBs that lack flexibility, making them unsuitable for the tolerances and deformations of large curtain walls. This results in high installation stress and significant differences in thermal expansion coefficients, making it unsuitable for curtain walls. Furthermore, the traditional process uses a single LED light panel, while the spacing between light strips on large curtain walls is relatively large, leading to a waste of PCB material. In addition, the light strips in optoelectronic glass manufactured using traditional processing rely on external welding, which is prone to poor soldering, causing an entire row or area of ​​light strips to fail to light up, resulting in maintenance difficulties. Therefore, it is not suitable for optoelectronic glass in large curtain walls.

[0004] To address the aforementioned issues, there is an urgent need to design a new processing technology applicable to photovoltaic glass used in large curtain walls. Summary of the Invention

[0005] The purpose of this invention is to provide a processing technology for photoelectric glass for curtain walls, aiming to solve the above-mentioned technical problems. The process of this invention mainly uses FPCB as the carrier substrate for LEDs. It has good flexibility and small difference in thermal expansion coefficient, and can be applied to large curtain walls. Moreover, this process first manufactures a whole FPCB light board, and then cuts it into FPCB light strips. This can avoid the waste of FPCB material, and the distance between FPCB light strips can be arranged according to the size requirements of the curtain wall, which can be adapted to the use of large curtain walls of any size. In addition, the FPCB light strips and the conductive crossbars are connected by a detachable wipe, which makes the photoelectric glass of the curtain wall easy to maintain.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0007] A process for processing photovoltaic glass for curtain walls includes the following steps:

[0008] S1. Select tempered glass that meets the requirements in terms of thickness and size, clean and dry it, and set it aside for use;

[0009] S2. Cut the PVB film to the required size and attach the PVB film to the corresponding side of the tempered glass;

[0010] S3. Select an FPCB substrate that meets the required size, print the required number of LED conduction circuit groups on the FPCB substrate, with a spacing of 2-5mm between two adjacent LED conduction circuit groups, and then install LED lights at the corresponding positions on the LED conduction circuit groups to form an FPCB light board. Then cut the entire FPCB light board into single FPCB light strips.

[0011] S4. Select an FPCB substrate or PCB substrate that meets the required size, print the required number of horizontal strip conductive circuit groups on the FPCB substrate or PCB substrate, with a spacing of 2-5mm between two adjacent horizontal strip conductive circuit groups to form a conductive horizontal plate, then cut the entire conductive horizontal plate into individual conductive horizontal strips, and then install connecting wires at the corresponding positions of each conductive horizontal strip.

[0012] S5. Place the cleaned and dried tempered glass on a clean workbench with the side with the PVB film facing up, and attach the conductive strip to the corresponding position on the PVB film so that the connecting wires face outwards.

[0013] S6. Attach the FPCB light strip to the PVB film, so that one end of the FPCB light strip is inserted into the corresponding slot of the conductive strip, and the other end is attached to the PVB film as required.

[0014] S7. After attaching the FPCB light strip, place a tempered glass of the same size as the one below on top of the FPCB light strip, so that the side of the tempered glass with the PVB film attached is in contact with the FPCB light strip, and align the upper tempered glass with the lower tempered glass to form an optoelectronic glass module.

[0015] S8. Place the completed optoelectronic glass module into an autoclave and heat it to melt the PVB film and form a high-viscosity layer, thereby firmly adhering the FPCB light strip and the conductive strip between the upper and lower tempered glass to form a complete optoelectronic glass.

[0016] Preferably, the tempered glass has an AR film or a Low-E low-emissivity film on the side that contacts the PVB film, the surface stress value of the tempered glass is ≥90MPa, the heat resistance temperature of the tempered glass is ≥200℃, the bow curvature of the tempered glass is ≤0.3%, and the wave curvature is ≤0.2%.

[0017] Preferably, step S3 includes the following detailed steps:

[0018] S3.1 Substrate selection and pretreatment: A transparent polyimide substrate with a refractive index range of 1.45-1.55 is used to produce a graphene circuit pattern layer on the substrate using laser induction.

[0019] S3.2, Composite electroplating thickening: Copper is electroplated on the graphene circuit pattern layer to form the main body for current conduction, and then a mirror bright silver plating layer with a thickness ≤0.5μm is plated on the surface of the copper layer.

[0020] S3.3, Cover Film Windowing: Acrylic transparent optical adhesive with a light transmittance of ≥99% and haze of ≤0.5% is used as the cover film, which is attached to the mirror bright silver coating. Excimer laser is used to open the cover film to form the FPCB substrate.

[0021] S3.4 LED Selection and Mounting: Select flip-chip LEDs and print solder paste on the LED pads of the FPCB substrate. Then, pre-apply non-conductive adhesive film to the bottom of the LED chip and accurately mount the flip-chip LEDs onto the solder paste-printed pads. Then, place the FPCB substrate with the flip-chip LEDs onto it into a reflow oven to melt and bond the solder paste and cure the non-conductive adhesive film, thereby encapsulating the flip-chip LEDs on the FPCB substrate to form the FPCB light board.

[0022] S3.5 Testing and Strengthening: First, perform routine electrical tests on the completed FPCB light boards. Then, take sample light boards and place them in an experimental small autoclave for aging tests. After that, perform full-function electrical tests and microscopic morphology checks again to ensure that all components and solder joints are 100% intact after experiencing a real lamination environment.

[0023] Preferably, in step S4, the connecting wire is selected as a flexible connecting wire, and the following detailed steps are included:

[0024] S4.1 Pretreatment of substrate: Select copper foil FPCB or FR-4 material rigid PCB as substrate, and then use a plasma cleaner to clean the surface of the substrate. The processing power of the plasma cleaner is 500-800W and the cleaning time is 30-60s. Then dry it for later use.

[0025] S4.2, Circuit etching: First, conductive lines are etched onto the substrate through exposure, development, etching and film removal processes. Then, CNC drilling machines are used to process and position through holes. Finally, copper plating and electroplating processes are used to metallize the hole walls of the positioning through holes to achieve interlayer interconnection.

[0026] S4.3, LED strip slot processing: Using a high-precision CNC milling machine, the outer shape of the slot and the shape of the spring arm inside the slot are milled according to the design drawings. Then, chemical copper plating and electroplating processes are used to cover the surface and walls of the slot with a copper layer to achieve electrical connection. Then, the contact area of ​​the spring arm is thickened with gold plating to ensure optimal electrical performance. Finally, the slot is flushed with deionized water under high pressure to remove any residual processing debris or chemical solutions.

[0027] S4.4 Integrated Components: Install necessary driver ICs, resistors, capacitors and other components on the conductive strip to make it a complete conductive strip for the intelligent control bus;

[0028] S4.5, Whole Board Testing and Cutting: Use a flying probe tester to perform 100% electrical performance testing on the whole board of conductive horizontal plates to verify the continuity and insulation of all circuits and slots; after the test is completed, use an ultraviolet laser cutter to cut the whole board into individual conductive horizontal strips for the qualified conductive horizontal plates.

[0029] S4.6 Install connecting wires: Solder one end of the connecting wires used to connect external power and signal lines to the designated pad port of the conductive strip as required, forming a conductive strip with connecting wires.

[0030] Preferably, in step S6, using the attached conductive strip as a reference, the positioning fixture is placed on the PVB film, and then one end of the FPCB light strip is snapped into the corresponding slot of the conductive strip, and the other end is attached to the PVB film according to the positioning groove on the positioning fixture. The above attachment method is repeated until the required number of FPCB light strips for tempered glass are attached. Then the positioning fixture is removed, and the installation and attachment of the FPCB light strip is completed.

[0031] Alternatively, using the attached conductive strip as a reference, place the positioning fixture on the workbench, and then place the tempered glass with the conductive strip attached on the positioning fixture, so that the conductive strip corresponds exactly to the positioning position of the strip on the positioning fixture. Then, insert one end of the FPCB light strip into the corresponding slot of the conductive strip, and repeat the above attachment method according to the position of the positioning slot on the PVB film. After attaching the required number of FPCB light strips for the tempered glass, the tempered glass can be placed directly on top of the FPCB light strips.

[0032] Preferably, the positioning fixture is made of metal or plastic material, and has a horizontal positioning groove on one side. Several light strip positioning grooves are evenly arranged below the horizontal positioning groove. The light strip positioning grooves are connected to the horizontal positioning grooves. The width of the horizontal positioning groove is greater than the width of the horizontal bar, and the width of the light strip positioning groove is greater than the width of the FPCB light strip.

[0033] Preferably, a horizontal positioning groove is provided on one side of the PVB film, and a plurality of lamp positioning grooves are provided below the horizontal positioning groove. The horizontal positioning groove and the lamp positioning groove are connected. The width of the horizontal positioning groove is greater than the width of the conductive horizontal bar, and the width of the lamp positioning groove is greater than the width of the FPCB lamp strip. The depth of the horizontal positioning groove on the PVB film is less than the thickness of the conductive horizontal bar by 0.05-0.1 mm, and the depth of the lamp positioning groove is less than the thickness of the FPCB lamp strip by 0.05-0.1 mm.

[0034] Preferably, in step S6, after the conductive strip and FPCB light strip are attached, the conductive strip and FPCB light strip need to be 100% inspected. Using an automatic optical inspection system, the entire glass plate is scanned to check for defects such as light strip displacement, warping, missing components, and foreign objects. Then, by connecting the bus interface through test probes, all light strips are tested point by point to check for problems such as open circuit, short circuit, dim light, and color difference.

[0035] Preferably, in step S8, the heating process inside the autoclave includes the following stages:

[0036] (1) Vacuuming and steady heating stage: Start the vacuum pump to reduce the pressure inside the vessel to below -0.095 MPa and maintain it for 20-25 minutes. The heating rate is 1-2°C / minute.

[0037] (2) Pressurization and rapid heating stage: Close the vacuum valve and fill the vessel with clean, dry compressed air. The pressure rises to the initial pressure of 0.8-1.0 MPa in a short time, and the temperature rises to 100-110°C.

[0038] (3) Constant temperature and pressure stage: The pressure is further increased to 1.2-1.4 MPa, the temperature is maintained at 135-145°C, and the heat and pressure holding time is 40-60 min;

[0039] (4) Controllable cooling and stepped pressure relief stage: turn off the heating and start the cooling system. During the process of the temperature dropping from 80°C to 60°C, the pressure is reduced from 1.3MPa to 0.5MPa; during the process of the temperature dropping from 60°C to 40°C, the pressure is reduced from 0.5MPa to 0MPa. The cooling rate in the high pressure vessel is ≥3°C / min, the pressure relief start temperature is ≤60°C, and the total cooling time is ≥120min.

[0040] Preferably, after completing step S8, it is also necessary to conduct comprehensive performance testing and aging testing on the optoelectronic glass, and to conduct optical performance, electrical performance, mechanical performance and environmental reliability testing on the finished product to ensure the quality of the optoelectronic glass.

[0041] The photoelectric glass processing technology for curtain walls of this invention has the following beneficial effects:

[0042] 1. The photoelectric glass processing technology for curtain walls of the present invention selects FPCB as the carrier substrate for LEDs instead of traditional rigid PCB. The FPCB has good flexibility and small difference in thermal expansion coefficient, which can effectively overcome the problems of large installation stress and thermal expansion mismatch caused by tolerance, deformation and temperature change in large curtain walls. This allows the photoelectric glass to fit tightly into the curtain wall structure and adapt to large curtain wall applications with various complex shapes and sizes.

[0043] 2. The photoelectric glass processing technology for curtain walls of the present invention adopts the process of first making a whole FPCB light board and then cutting it into individual FPCB light strips. This avoids the material waste of traditional whole LED light boards when the light strip spacing is large. By precisely controlling the light strip spacing, it can be flexibly arranged according to the actual size of the curtain wall, thereby maximizing the material utilization rate and significantly reducing the production cost. It is especially suitable for large-area curtain walls.

[0044] 3. The photoelectric glass processing technology for curtain walls of this invention connects the FPCB light strip and the conductive crossbar through a detachable plug-in method, replacing the traditional welding process. This fundamentally eliminates the risks of poor welding and false welding, ensuring the stability of the electrical connection. When a local light strip fails, it can be quickly disassembled and replaced without overall repair, greatly reducing maintenance difficulty and cost, and improving the long-term reliability of the photoelectric glass.

[0045] 4. The photoelectric glass processing technology for curtain walls of this invention introduces high-precision processing steps and combines them with full-process testing to ensure the circuit accuracy, electrical performance and durability of FPCB light strips and conductive crossbars. The optimization of parameters of the autoclave lamination process makes the PVB film melt evenly and the lamination structure tight and bubble-free, thereby improving the overall mechanical strength and optical performance of the photoelectric glass.

[0046] 5. The photoelectric glass processing technology for curtain walls of this invention involves setting an AR film or Low-E low-emissivity film on the surface of tempered glass, combined with high-transmittance PVB film and LED mounting technology, to reduce light loss and reflection, improve display contrast and energy efficiency. The stress value of the tempered glass is ≥90MPa and the heat resistance is ≥200℃, which can ensure that the product remains stable in harsh environments. The control of bow and wave curvature ensures the flatness of the installation.

[0047] 6. The photoelectric glass processing technology for curtain walls of the present invention has passed aging tests and comprehensive performance verification, including optical, electrical, mechanical and environmental reliability tests. The photoelectric glass produced by the present invention has the characteristics of anti-aging and strong weather resistance, and is suitable for long-term outdoor use with a significantly extended lifespan.

[0048] 7. The photoelectric glass processing technology for curtain walls of the present invention provides a precise reference for the attachment of conductive strips and FPCB light strips by using a special positioning fixture or a pre-defined positioning groove on the PVB film, achieving precise alignment and effectively avoiding problems such as uneven display and bright and dark lines caused by light strip offset, thus ensuring the quality of the display image.

[0049] 8. The photoelectric glass processing technology for curtain walls of this invention integrates components such as driver ICs on the conductive crossbars, realizing a "smart bus" structure, reducing messy external wiring, and making the glass curtain wall more tidy overall. Attached Figure Description

[0050] Figure 1 This is a flowchart of the processing technology for the photoelectric glass used in curtain walls according to the present invention;

[0051] Figure 2 This is a structural layer diagram of an embodiment of the photoelectric glass processing technology for curtain walls according to the present invention;

[0052] Figure 3 This is a structural layer diagram of Embodiment 2 of the processing technology for photovoltaic glass for curtain walls of the present invention;

[0053] Figure 4 This is a structural hierarchy diagram of the third embodiment of the photoelectric glass processing technology for curtain walls of the present invention;

[0054] Reference numerals: 1. Tempered glass; 2. PVB film; 3. FPCB light strip; 4. Conductor bar; 5. Positioning fixture. Detailed Implementation

[0055] To enable those skilled in the art to better understand the technical solution of the present invention, the product of the present invention will be further described in detail below with reference to embodiments and accompanying drawings.

[0056] It should be noted that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. Example 1

[0057] A process for processing photovoltaic glass for curtain walls includes the following steps:

[0058] S1. Select tempered glass 1 with the required thickness and size, clean and dry it, and set it aside for use;

[0059] S2. Cut the PVB film 2 to the required size and attach the PVB film 2 to the corresponding side of the tempered glass 1;

[0060] S3. Select an FPCB substrate that meets the required size, print the required number of LED conduction circuit groups on the FPCB substrate, with a spacing of 2-5mm between two adjacent LED conduction circuit groups, and then install LED lights at the corresponding positions on the LED conduction circuit groups to form an FPCB light board. Then cut the entire FPCB light board into single FPCB light strips 3.

[0061] S4. Select an FPCB substrate or PCB substrate that meets the required size, print the required number of horizontal strip conductive circuit groups on the FPCB substrate or PCB substrate, with a spacing of 2-5mm between two adjacent horizontal strip conductive circuit groups to form a conductive horizontal plate, then cut the entire conductive horizontal plate into single conductive horizontal strips 4, and then install connecting wires at the corresponding positions of each conductive horizontal strip 4.

[0062] S5. Place the cleaned and dried tempered glass 1 on a clean workbench with the side with the PVB film 2 facing upwards, and attach the conductive strip 4 to the corresponding position on the PVB film 2 so that the connecting wires face outwards.

[0063] S6. Attach the FPCB light strip 3 to the PVB film 2, so that one end of the FPCB light strip 3 is inserted into the corresponding slot of the conductive strip 4, and the other end is attached to the PVB film 2 as required.

[0064] S7. After attaching the FPCB light strip 3, place a tempered glass 1 of the same size as the one below on top of the FPCB light strip 3, so that the side of the tempered glass 1 with the PVB film 2 attached is in contact with the FPCB light strip 3, and align the upper tempered glass 1 with the lower tempered glass 1 vertically to form a photoelectric glass module.

[0065] S8. The completed optoelectronic glass module is placed in an autoclave and heated to melt the PVB film 2, forming a high-viscosity layer. This causes the FPCB light strip 3 and the conductive strip 4 to adhere firmly between the upper and lower tempered glass 1, forming a complete optoelectronic glass. In this embodiment, step S8 also includes the following steps:

[0066] S8.1 Final Inspection and Assembly Before Lamination: Under standard light, confirm that there are no visible large-area bubbles, foreign objects, or obvious FPCB displacement within the laminated modules. Pay special attention to any abnormalities in the area connecting the conductors of the conductive strip 4. Then, place the modules vertically or at an angle of <10° to the vertical plane on the material rack, using a special spacer block made of high-temperature silicone and ceramic fiber composite. This spacer block has high flatness, high temperature resistance, and a soft texture. It can effectively transmit pressure and avoid creating "marks" on the glass surface, while absorbing the subtle thermal expansion differences between the glass and the metal frame. Then, maintain a uniform spacing of 20-30mm between the modules to ensure unobstructed flow of hot air.

[0067] S8.2 Core Lamination Process: This is an optimized, highly automated lamination cycle. The entire process is precisely executed by the autoclave's PLC system, lasting approximately 4 to 6 hours, and includes the following four stages:

[0068] (1) Vacuuming and steady heating stage: Start the vacuum pump to reduce the pressure inside the vessel to below -0.095 MPa. At the same time, start heating at a controllable rate and maintain it for 20-25 minutes. The heating rate is 1-2°C / minute. During this stage, before the pressure rises, extract as much residual air and moisture adsorbed by PVB as possible from the interlayer. PVB is a thermoplastic material. As the temperature rises above its glass transition temperature by 50-70°C, it changes from a glassy state to a highly elastic state, and the viscosity begins to decrease, preparing for flow.

[0069] (2) Pressurization and rapid heating stage: Close the vacuum valve and fill the vessel with clean and dry compressed air. The pressure rises to the initial pressure of 0.8-1.0 MPa in a short time. At the same time, the temperature rises to 100-110°C. In this stage, under the lower initial pressure and continuous heating, the softened PVB begins to flow and initially fills the gaps. However, the flow is still controlled to prevent the FPCB light strip 3 from shifting due to the excessive flow of PVB.

[0070] (3) Constant temperature and pressure stage: The pressure is further increased to 1.2-1.4 MPa, the temperature is maintained at 135-145°C, and the heat and pressure holding time is 40-60 min; in this stage, PVB is forced to completely fill all the micro gaps between the FPCB light strip 3, the conductive strip 4 and the glass, so that PVB can achieve close contact with the glass surface and the FPCB surface at the molecular level. In this way, the hydroxyl groups on the PVB molecular chain form strong hydrogen bonds with the silanol groups on the glass surface. This is the main chemical source of the adhesion. According to Henry's law, high pressure can greatly increase the solubility of gas in PVB, forcing any residual trace bubbles to dissolve into PVB;

[0071] (4) Controllable cooling and stepped pressure relief stage: The heating is turned off and the cooling system is started. During the process of the temperature dropping from 80°C to 60°C, the pressure is reduced from 1.3MPa to 0.5MPa; during the process of the temperature dropping from 60°C to 40°C, the pressure is reduced from 0.5MPa to 0MPa. The cooling rate in the autoclave is ≤3°C / min, the pressure relief start temperature is ≤60°C, and the total cooling time is ≥120min. This can effectively balance the viscoelastic changes of PVB and avoid the phenomenon of "re-boiling" or interface debonding caused by the sudden drop in pressure. During this stage, as the temperature decreases, PVB changes from a high-elastic state back to a glassy state and solidifies. In this embodiment, slow and uniform cooling is the golden rule for eliminating internal thermal stress of the product and is the key to preventing glass spontaneous breakage and ensuring long-term reliability.

[0072] S8.3. Unloading and Final Comprehensive Inspection: Open the reactor door, pull out the material rack, and allow the product to naturally balance at room temperature for at least 24 hours to release residual stress; Inspect in a dark room using a parallel light source in accordance with the GB 15763.3-2009 laminated glass standard. Undissolved bubbles, delamination, cracks, impurities, and unacceptable color differences or optical distortions with a diameter greater than Φ0.5mm are not permitted. A final power-on test is performed on the finished product, using customized testing fixtures connected to the external wires on the conductive strip 4 to verify that all LED strips function normally, have consistent brightness and color, and are free from short circuits or open circuits. The test current should be 1.1 times the rated operating current, and the duration should be no less than 5 minutes. Samples are extracted for boiling water testing (immersing the sample in boiling water for 4 hours) or wet-freeze testing to verify whether the adhesion between PVB and glass remains reliable after being subjected to harsh environments. Acoustic scanning microscopy is introduced as a sampling non-destructive testing method. Through the reflected signals of ultrasonic waves propagating between layers, very early, invisible micro-delamination or poorly bonded areas can be detected non-destructively, enabling proactive monitoring of the product's intrinsic quality.

[0073] Preferably, the tempered glass 1 has an AR film or a Low-E low-emissivity film on the side that contacts the PVB film 2, the surface stress value of the tempered glass 1 is ≥90MPa, the heat resistance temperature of the tempered glass 1 is ≥200℃, the bow curvature of the tempered glass 1 is ≤0.3%, and the wave curvature is ≤0.2%. The AR film is an anti-reflective coating that improves the light transmittance of the glass, reduces interface reflection, and makes the light strip more concealed when off and the image clearer and the colors more saturated when lit. The Low-E low-emissivity film effectively reflects infrared rays, reducing the building's air conditioning energy consumption. The tempered glass 1 meets the basic standards of "GB 15763.2-2005 Safety Glass for Buildings Part 2: Tempered Glass 1", requiring the surface stress value of tempered glass 1 to be ≥ 90 MPa and to pass the fragmentation test, so that after breakage, tempered glass 1 will not produce sharp, elongated fragments. The heat resistance temperature of tempered glass 1 is ≥ 200℃, and it can withstand a temperature difference of 200℃ without breaking. The arc curvature of tempered glass 1 does not exceed 0.3%, and the wave curvature does not exceed 0.2%, which can effectively avoid optical distortion and affect the building's appearance.

[0074] Preferably, step S3 includes the following detailed steps:

[0075] S3.1 Substrate Selection and Pretreatment: A transparent polyimide substrate with a refractive index range of 1.45-1.55 is used. A graphene circuit pattern layer is produced on the substrate using laser induction. The refractive index range of the transparent polyimide is 1.45-1.55, which is close to the refractive index of glass (n≈1.52) and PVB (n≈1.48-1.50), thereby greatly reducing interface light loss and improving the invisibility of the optoelectronic glass in the non-illuminated state. The transparent polyimide substrate is scanned with an ultraviolet laser, and local carbonization is achieved in the focused area through photothermal effect, generating porous graphene microcircuits with excellent conductivity. This pattern serves as a seed layer for subsequent electroplating, can be integrally formed with the substrate, and has extremely strong adhesion. Moreover, the pattern itself is gray-black, with lower visual contrast than metal mesh, making it more invisible. Furthermore, this process is environmentally friendly and does not require chemical etching.

[0076] S3.2 Composite Electroplating Thickening: Copper is electroplated on the graphene circuit pattern layer to form the main body for current conduction. Then, a mirror-finish bright silver plating layer with a thickness ≤0.5μm is plated on the surface of the copper layer. The silver layer can greatly reduce the surface resistance of the circuit, reduce the voltage drop and heat generation of the line, and the high reflectivity of silver can effectively reflect the side light of the LED out of the glass, improving the brightness and luminous efficiency of the front of the light strip. In this embodiment, a pulse electroplating process is used to ensure that the plating layer is uniform and dense when electroplating on micron-level linewidths, without edge "protrusion" effect, so that the surface roughness Ra<0.1μm.

[0077] S3.3, Cover Film Windowing: An acrylic transparent optical adhesive with a light transmittance ≥99% and haze ≤0.5% is used as a cover film, which is attached to the mirror-finished bright silver plating layer. The cover film is then windowed using an excimer laser to form the FPCB substrate. The acrylic transparent optical adhesive has a light transmittance ≥99% and haze ≤0.5%, which has better compatibility with PVB and can achieve near-seamless visual fusion. Utilizing the "cold" ablation characteristics of the excimer laser, the transparent optical adhesive can be precisely removed to form a solder pad window with a sharp outline and no carbonization residue, while not damaging the underlying silver plating layer. The window accuracy can reach ±5μm.

[0078] S3.4 LED Selection and Mounting: Flip-chip LEDs are selected, and solder paste is printed on the LED pads of the FPCB substrate as a base for electrical connection and primary thermal management. Then, non-conductive thin film adhesive is pre-placed on the bottom of the LED chip to form a "sticky chip" that can be used immediately. The flip-chip LED is then precisely mounted onto the solder paste-printed pads. The FPCB substrate with the flip-chip LED attached is then placed in a reflow oven, where the solder paste melts and the non-conductive thin film adhesive cures, thereby encapsulating the flip-chip LED on the FPCB substrate to form the FPCB lamp board. The flip-chip LED has no gold wires and has excellent pressure resistance and vibration resistance, which can adapt to the harsh environment of autoclaves. In addition, it has lower thermal resistance, and heat is directly conducted to the circuit through the solder joints, resulting in a longer lifespan. The flip-chip LED has a smaller package size and less optical interference. In this embodiment, a nitrogen-filled reflow oven is used, ensuring an internal oxygen concentration of <800ppm to prevent oxidation of transparent circuits and solder joints / chip bumps at high temperatures, thus ensuring soldering quality. During the reflow soldering process, the temperature is raised from room temperature to ~150°C at a rate of 1-2°C / s to activate the solder paste flux and allow the entire component to heat up uniformly. Then, the temperature is slowly increased to above the solder paste melting point and maintained at 150-180°C for 60-90 seconds. The solvent in the solder paste evaporates, homogenizing its composition, and the non-conductive film adhesive begins to soften and flow. The temperature is rapidly increased to a peak of 235-245°C and maintained at this temperature for 45-60 seconds. At this point, the solder melts, forming an intermetallic compound with the chip bumps and pads, achieving electrical interconnection. The non-conductive film adhesive rapidly cures at high temperature, forming a dense three-dimensional network structure that generates extremely strong mechanical anchoring force. Finally, it is cooled at a slope of -2 to -4°C / s, forming bright solder joints and completing the final curing of the non-conductive film adhesive. After completion, a 3D X-ray inspection system is used to inspect the void ratio, bridging, tombstoning, and chip tilt within the solder joints. X-rays can penetrate the chip, visually displaying the solder joint morphology, ensuring that the void ratio within the solder joints is <15%, with no bridging or tombstoning. Then, an automated optical inspection system is used to check for component presence / missing parts, misalignment, and non-conductive film adhesive overflow contamination. Finally, a microprobe is used to perform an electrical connection test on random samples to verify electrical connectivity.

[0079] S3.5. The LED driver IC and temperature sensor are integrated on the FPCB bus using micron-level chip-level packaging. The micro driver IC with micron-level chip-level packaging replaces the traditional "single external driver" with a "distributed driver" scheme. The driver circuit is directly integrated on the horizontal bus of the FPCB. At the same time, a digital temperature sensor is integrated to monitor the working temperature of the light strip in real time and feed it back to the control system through the bus to realize overheat protection and improve the intelligence and safety of the system.

[0080] S3.6 Testing and Strengthening: First, perform routine electrical tests on the completed FPCB light boards. Then, extract sample light boards and place them in an experimental small autoclave for aging tests. Perform a simplified simulation cycle with the highest temperature and pressure parameters, which is completely consistent with the actual lamination process. After that, perform full-function electrical tests and microstructure inspections again to ensure that all components and solder joints are 100% intact after experiencing the actual lamination environment.

[0081] Preferably, in step S4, the connecting wire is selected as a flexible connecting wire, and the following detailed steps are included:

[0082] S4.1 Substrate Pretreatment: Select copper foil FPCB or FR-4 rigid PCB as substrate, and then use a plasma cleaner to clean the surface of the substrate. The plasma cleaner has a processing power of 500-800W and a cleaning time of 30-60s. Then dry it for later use. In this invention, for components that require high mechanical strength to support insertion and removal, FR-4 rigid PCB with a glass transition temperature Tg ≥ 170℃ is selected as substrate to ensure that it maintains dimensional and mechanical strength stability under high lamination temperature. For scenarios with slight bending requirements, FPCB with copper foil of 2oz or more can be selected as substrate.

[0083] S4.2, Circuit Embedding: Conductive lines are first etched onto the substrate using exposure, development, etching, and film removal processes. Then, CNC drilling machines are used to machine and position vias. Finally, copper plating and electroplating processes are used to metallize the walls of these vias, achieving interlayer interconnection. An embedded cavity integrating decoupling capacitors is designed within the power lines of conductive strip 4. Semi-embedded capacitor technology is employed, embedding thin-layer capacitor material into the inner layers of the PCB during lamination, significantly optimizing power integrity, reducing the number of external components, and improving anti-interference capabilities and reliability.

[0084] S4.3, Lamp Strip Slot Processing: Using a high-precision CNC milling machine, the outer shape of the slot and the shape of the spring arm inside the slot are milled according to the design drawings. Then, chemical copper plating and electroplating processes are used to cover the surface and wall of the slot with a copper layer to achieve electrical connection. Then, the contact area of ​​the spring arm is thickened with gold plating to ensure optimal electrical performance. Then, the slot is flushed with deionized water under high pressure to remove any residual processing debris or chemical solutions. In this invention, a double-contact spring arm structure is used instead of a simple open slot, so that the slot inside the conductive strip 4 contacts the gold fingers on both the top and bottom surfaces of the FPCB lamp strip 3, resulting in lower contact resistance and more stable connection. Moreover, the elasticity of the spring arm can compensate for the thickness tolerance of the gold fingers on the FPCB lamp strip 3 and the alignment deviation during insertion, and provide continuous vertical pressure to the FPCB lamp strip 3 to resist vibration and thermal stress. In the chemical copper plating line, a series of chemical treatments clean the milled surface and adsorb a layer of catalytic palladium nuclei. A chemical copper layer approximately 0.3-0.5 μm thick is deposited on this catalytic layer through a chemical oxidation-reduction reaction, initially making the entire slot inner wall, including the spring arm, conductive. The entire board is then placed into the electroplating line, where an electrolytic reaction thickens the copper layer to the designed value, ensuring current carrying capacity and mechanical strength. Next, an ultraviolet laser is used to precisely ablate a pre-coated layer of electroplating-resistant ink in the spring arm contact area of ​​the slot, exposing the area requiring thicker gold plating. A 3-5 μm nickel layer is first electroplated on the exposed area as a barrier layer to prevent copper-gold interdiffusion. Then, a layer ≥ 0.8 μm thick is electroplated on the nickel layer. The hard gold is used, which has excellent wear resistance and can withstand more than 500 repeated insertions and removals. Then, the slot is rinsed with deionized water under high pressure to remove any residual processing debris or chemicals. Then, the spring arm is inspected under a microscope for defects or cracks, and whether the gold layer is uniform and bright. The surface of the spring arm is scanned with a 3D white light interferometer to measure its coplanarity, contour shape, and surface roughness Ra<0.2μm of the gold layer to ensure perfect fit with the FPCB gold fingers.

[0085] S4.4 Integrated Components: Necessary driver ICs, resistors, capacitors, and other components are installed on the conductive strip 4 to make it a complete conductive strip for the intelligent control bus. In this embodiment, solder paste is first applied using a semi-automatic printer and laser stencil, then components are mounted using a medium-to-high-speed pick-and-place machine, and finally soldering is completed in a nitrogen-filled reflow oven. After reflow soldering, all important components such as driver ICs and connectors are reinforced with underfill adhesive. Special dispensing equipment and underfill adhesive based on capillary action are used, and the adhesive is cured at 125°C for 30 minutes to allow it to flow into the bottom of the chip and cure. This effectively resists thermal and mechanical stresses during the lamination process and subsequent use, significantly improving the fatigue life of the solder joints.

[0086] S4.5, Whole Board Testing and Cutting: A flying probe tester is used to perform 100% electrical performance testing on the entire board of conductive horizontal strips. The test current is 1.2-1.5 times the rated operating current to verify the continuity and insulation of all circuits and slots. After the test, the qualified conductive horizontal strips are cut into individual conductive horizontal strips 4 using an ultraviolet laser cutter. The laser cutting parameters are wavelength 355nm, power 15-20W, and cutting speed 500mm / s. In this invention, the testing system can apply the rated operating current to the conductive horizontal strips 4 and monitor their temperature distribution using an infrared thermal imager to ensure that they have sufficient current carrying capacity and heat dissipation performance, and to eliminate defective products with overheating risks. The ultraviolet laser cutting method produces smooth, burr-free cuts, avoiding micro-cracks and stress that may be generated by mechanical cutting, making it particularly suitable for the depaneling of substrates with mounted components.

[0087] S4.6 Install Connecting Wires: Solder one end of the connecting wires used to connect external power and signal lines to the designated pad port of the conductive strip 4 as required, forming the conductive strip 4 with connecting wires. In this embodiment, solder paste is printed on the pad area of ​​the connecting wires using a laser stencil. Subsequently, a ring of high-performance epoxy resin structural adhesive is precisely applied to the contact contour of the connecting wires and the conductive strip 4. Then, the connecting wires are attached to the pad area of ​​the connecting wires of the conductive strip 4, ensuring that the pins or terminals of the connecting wires are completely aligned with the pads and in close contact. The entire conductive strip 4 is then placed in a reflow oven to perform temperature profiling. During this process, the solder paste melts to form an electrical connection; the epoxy resin structural adhesive simultaneously completes preliminary curing at high temperature, providing strong mechanical support when the solder solidifies, effectively preventing solder joint cracking caused by the connector's own weight or insertion / extraction stress. After soldering, comprehensive electrical tests, including contact impedance, insulation impedance, and high voltage withstand voltage, are performed on the conductive strip 4 using a testing device to ensure that its interface performance fully meets the design specifications.

[0088] Preferably, in step S6, using the attached conductive strip 4 as a reference, the positioning fixture 5 is placed on the PVB film 2. Then, one end of the FPCB light strip 3 is inserted into the corresponding slot of the conductive strip 4, and the other end is attached to the PVB film 2 according to the positioning groove on the positioning fixture 5. The above attachment method is repeated until the required number of FPCB light strips 3 for the tempered glass 1 are attached. Then, the positioning fixture 5 is removed, and the installation and attachment of the FPCB light strip 3 is completed. The positioning fixture 5 is made of metal or plastic material, and has a horizontal strip positioning groove on one side. Several light strip positioning grooves are evenly arranged below the horizontal strip positioning groove. The light strip positioning grooves are connected to the horizontal strip positioning grooves. The width of the horizontal strip positioning groove is greater than the width of the conductive strip 4, and the width of the light strip positioning groove is greater than the width of the FPCB light strip 3.

[0089] Preferably, such as Figure 1As shown, in step S6, after the conductive strip 4 and FPCB light strip 3 are attached, the conductive strip 4 and FPCB light strip 3 need to be 100% inspected. Using an automatic optical inspection system, the entire glass plate is scanned to check for defects such as light strip displacement, warping, missing components, and foreign objects. Then, the bus interface is connected through test probes to perform point-by-point lighting tests on all light strips to check for problems such as open circuits, short circuits, dim lights, and color differences.

[0090] Preferably, after completing step S8, there is a further step S9, which requires comprehensive performance testing and aging testing of the optoelectronic glass, and optical performance, electrical performance, mechanical performance and environmental reliability testing of the finished product to ensure the quality of the optoelectronic glass.

[0091] Example 2: The steps in Example 2 are basically the same as those in Example 1, except for step 6:

[0092] like Figure 2 As shown, in step S6, using the attached conductive strip 4 as a reference, the positioning fixture 5 is placed on the worktable. Then, the tempered glass 1 with the conductive strip 4 attached is placed on the positioning fixture 5, so that the conductive strip 4 corresponds exactly to the horizontal strip positioning position on the positioning fixture 5. Then, one end of the FPCB light strip 3 is inserted into the corresponding slot of the conductive strip 4, and the other end is positioned according to the positioning groove of the positioning fixture 5 on the PVB film 2. The above attachment method is repeated until the required number of FPCB light strips 3 for the tempered glass 1 are attached. Then, the tempered glass 1 can be placed directly on top of the FPCB light strips 3. The positioning fixture 5 is made of metal or plastic material, and has a horizontal strip positioning groove on one side. Several light strip positioning grooves are evenly arranged below the horizontal strip positioning groove. The light strip positioning grooves are connected to the horizontal strip positioning grooves. The width of the horizontal strip positioning groove is greater than the width of the conductive strip 4, and the width of the light strip positioning groove is greater than the width of the FPCB light strip 3.

[0093] Example 3: The steps in Example 3 are basically the same as those in Example 1, except for step 6:

[0094] like Figure 3As shown, a horizontal positioning groove is provided on one side of the PVB film 2, and several lamp positioning grooves are provided below the horizontal positioning groove. The horizontal positioning groove and the lamp positioning groove are connected. The width of the horizontal positioning groove is greater than the width of the conductive horizontal bar 4, and the width of the lamp positioning groove is greater than the width of the FPCB lamp strip 3. The depth of the horizontal positioning groove on the PVB film 2 is less than the thickness of the conductive horizontal bar 4 by 0.05-0.1mm, and the depth of the lamp positioning groove is less than the thickness of the FPCB lamp strip 3 by 0.05-0.1mm. In step S6, the conductive horizontal bar 4 is first attached to the horizontal positioning groove on the PVB film 2, and then one end of the FPCB lamp strip 3 is inserted into the corresponding slot of the conductive horizontal bar 4, and the other end is attached to the lamp positioning groove on the PVB film 2. The above attachment method is repeated until the required number of FPCB lamp strips 3 for the tempered glass 1 are attached, thus completing the installation of the FPCB lamp strip 3.

[0095] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Those skilled in the art can readily implement the present invention based on the accompanying drawings and the above description. However, any modifications, alterations, or variations made by those skilled in the art without departing from the scope of the present invention, utilizing the disclosed technical content, are equivalent embodiments of the present invention. Furthermore, any modifications, alterations, or variations made to the above embodiments based on the essential technology of the present invention are still considered part of the present invention's technical solution.

Claims

1. A processing technology for photovoltaic glass used in curtain walls, characterized in that: Includes the following steps: S1. Select tempered glass that meets the requirements in terms of thickness and size, clean and dry it, and set it aside for use; S2. Cut the PVB film to the required size and attach the PVB film to the corresponding side of the tempered glass; S3. Select an FPCB substrate that meets the required size, print the required number of LED conduction circuit groups on the FPCB substrate, with a spacing of 2-5mm between two adjacent LED conduction circuit groups, and then install LED lights at the corresponding positions on the LED conduction circuit groups to form an FPCB light board. Then cut the entire FPCB light board into single FPCB light strips. S4. Select an FPCB substrate or PCB substrate that meets the required size, and print the required number of horizontal strip conductive circuit groups on the FPCB substrate or PCB substrate. The horizontal strip conductive circuit group includes a light strip slot, and the light strip slot is provided with a spring arm for electrical connection. The spacing between two adjacent sets of horizontal conductive circuit groups is 2-5mm to form a conductive horizontal plate. Then, the entire conductive horizontal plate is cut into individual conductive horizontal bars, and connecting wires are installed at the corresponding positions of each conductive horizontal bar. S5. Place the cleaned and dried tempered glass on a clean workbench with the side with the PVB film facing up, and attach the conductive strip to the corresponding position on the PVB film so that the connecting wires face outwards. S6. Using the attached conductive strip as a reference, place the positioning fixture on the PVB film, then insert one end of the FPCB light strip into the corresponding light strip slot of the conductive strip, and attach the other end to the PVB film according to the positioning groove on the positioning fixture. The positioning fixture has a horizontal positioning groove on one side, and several light strip positioning grooves are evenly arranged below the horizontal positioning groove. The light strip positioning grooves are connected to the horizontal positioning groove. S7. After attaching the FPCB light strip, place a tempered glass of the same size as the one below on top of the FPCB light strip, so that the side of the tempered glass with the PVB film attached is in contact with the FPCB light strip, and align the upper tempered glass with the lower tempered glass to form an optoelectronic glass module. S8. Place the completed optoelectronic glass module into an autoclave and heat it to melt the PVB film and form a high-viscosity layer, thereby firmly adhering the FPCB light strip and the conductive strip between the upper and lower tempered glass to form a complete optoelectronic glass.

2. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: The tempered glass has an AR film or a Low-E low-emissivity film on the side that contacts the PVB film. The surface stress value of the tempered glass is ≥90MPa, the heat resistance temperature of the tempered glass is ≥200℃, the bow curvature of the tempered glass is ≤0.3%, and the wave curvature is ≤0.2%.

3. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: Step S3 includes the following detailed steps: S3.1 Substrate selection and pretreatment: A transparent polyimide substrate with a refractive index range of 1.45-1.55 is used to produce a graphene circuit pattern layer on the substrate using laser induction. S3.2, Composite electroplating thickening: Copper is electroplated on the graphene circuit pattern layer to form the main body for current conduction, and then a mirror bright silver plating layer with a thickness ≤0.5μm is plated on the surface of the copper layer. S3.3, Cover Film Windowing: Acrylic transparent optical adhesive with a light transmittance of ≥99% and haze of ≤0.5% is used as the cover film, which is attached to the mirror bright silver coating. Excimer laser is used to open the cover film to form the FPCB substrate. S3.4 LED Selection and Mounting: Select flip-chip LEDs and print solder paste on the LED pads of the FPCB substrate. Then, pre-apply non-conductive adhesive film to the bottom of the LED chip and accurately mount the flip-chip LEDs onto the solder paste-printed pads. Then, place the FPCB substrate with the flip-chip LEDs onto it into a reflow oven to melt and bond the solder paste and cure the non-conductive adhesive film, thereby encapsulating the flip-chip LEDs on the FPCB substrate to form the FPCB light board. S3.5 Testing and Strengthening: First, perform routine electrical tests on the completed FPCB light boards. Then, take sample light boards and place them in an experimental small autoclave for aging tests. After that, perform full-function electrical tests and microscopic morphology checks again to ensure that all components and solder joints are 100% intact after experiencing a real lamination environment.

4. The processing technology for photovoltaic glass for curtain walls according to claim 3, characterized in that: In step S4, the connecting wire is selected as a flexible connecting wire, and the following detailed steps are involved: S4.1 Pretreatment of substrate: Select copper foil FPCB or FR-4 material rigid PCB as substrate, and then use a plasma cleaner to clean the surface of the substrate. The processing power of the plasma cleaner is 500-800W and the cleaning time is 30-60s. Then dry it for later use. S4.2, Circuit etching: First, conductive lines are etched onto the substrate through exposure, development, etching and film removal processes. Then, CNC drilling machines are used to process and position through holes. Finally, copper plating and electroplating processes are used to metallize the hole walls of the positioning through holes to achieve interlayer interconnection. S4.3, LED strip slot processing: Using a high-precision CNC milling machine, the outer shape of the slot and the shape of the spring arm inside the slot are milled according to the design drawings. Then, chemical copper plating and electroplating processes are used to cover the surface and walls of the slot with a copper layer to achieve electrical connection. Then, the contact area of ​​the spring arm is thickened with gold plating to ensure optimal electrical performance. Finally, the slot is flushed with deionized water under high pressure to remove any residual processing debris or chemical solutions. S4.4 Integrated Components: Install driver ICs, resistors, and capacitors on the conductive strips to make it a complete conductive strip for the intelligent control bus; S4.5, Whole Board Testing and Cutting: Use a flying probe tester to perform 100% electrical performance testing on the whole board of conductive horizontal plates to verify the continuity and insulation of all circuits and slots; after the test is completed, use an ultraviolet laser cutter to cut the whole board into individual conductive horizontal strips for the qualified conductive horizontal plates. S4.6 Install connecting wires: Solder one end of the connecting wires used to connect external power and signal lines to the designated pad port of the conductive strip as required, forming a conductive strip with connecting wires.

5. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: In step S6, the attachment method of step S6 is repeated. After the required number of FPCB light strips for tempered glass are attached, the positioning fixture is removed to complete the installation and attachment of the FPCB light strips. Alternatively, using the attached conductive strip as a reference, place the positioning fixture on the workbench, and then place the tempered glass with the conductive strip attached on the positioning fixture, so that the conductive strip corresponds exactly to the positioning position of the strip on the positioning fixture. Then, insert one end of the FPCB light strip into the corresponding slot of the conductive strip, and repeat the above attachment method according to the position of the positioning slot on the PVB film. After attaching the required number of FPCB light strips for the tempered glass, the tempered glass can be placed directly on top of the FPCB light strips.

6. The processing technology for photovoltaic glass for curtain walls according to claim 5, characterized in that: The positioning fixture is made of metal or plastic material. The width of the horizontal positioning groove is greater than the width of the conductive horizontal bar, and the width of the light strip positioning groove is greater than the width of the FPCB light strip.

7. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: A horizontal positioning groove is provided on one side of the PVB film, and several lamp positioning grooves are provided below the horizontal positioning groove. The horizontal positioning groove and the lamp positioning groove are connected. The width of the horizontal positioning groove is greater than the width of the conductive horizontal bar, and the width of the lamp positioning groove is greater than the width of the FPCB lamp strip. The depth of the horizontal positioning groove on the PVB film is less than the thickness of the conductive horizontal bar by 0.05-0.1mm, and the depth of the lamp positioning groove is less than the thickness of the FPCB lamp strip by 0.05-0.1mm.

8. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: In step S6, after the conductive strip and FPCB light strip are attached, 100% inspection of the conductive strip and FPCB light strip is required. Using an automatic optical inspection system, the entire glass plate is scanned to check for light strip displacement, warping, missing components, foreign object defects, etc. Then, the bus interface is connected through test probes to perform point-by-point lighting tests on all light strips to check for open circuit, short circuit, dim light, color difference problems.

9. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: In step S8, the heating process inside the autoclave includes the following stages: (1) Vacuuming and steady heating stage: Start the vacuum pump to reduce the pressure inside the vessel to below -0.095 MPa and maintain it for 20-25 minutes. The heating rate is 1-2°C / minute. (2) Pressurization and rapid heating stage: Close the vacuum valve and fill the vessel with clean, dry compressed air. The pressure rises to the initial pressure of 0.8-1.0 MPa in a short time, and the temperature rises to 100-110°C. (3) Constant temperature and pressure stage: The pressure is further increased to 1.2-1.4 MPa, the temperature is maintained at 135-145°C, and the heat and pressure holding time is 40-60 min; (4) Controllable cooling and stepped pressure relief stage: turn off the heating and start the cooling system. During the process of the temperature dropping from 80°C to 60°C, the pressure is reduced from 1.3MPa to 0.5MPa; during the process of the temperature dropping from 60°C to 40°C, the pressure is reduced from 0.5MPa to 0MPa. The cooling rate in the high pressure vessel is ≥3°C / min, the pressure relief start temperature is ≤60°C, and the total cooling time is ≥120min.

10. The processing technology for photovoltaic glass for curtain walls according to claim 1, characterized in that: After completing step S8, comprehensive performance and aging tests are required for the optoelectronic glass, and optical, electrical, mechanical and environmental reliability tests are conducted on the finished product to ensure the quality of the optoelectronic glass.

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