An automatic positioning and imaging platform for wafer edge defect detection

Abstract

The present application relates to the technical field of semiconductor equipment, in particular to an automatic positioning and imaging platform for wafer edge defect detection, comprising a rotating table for positioning the wafer, the rotating table comprising a rotating disc, a dial ring sleeved outside the rotating disc, a rotating base arranged at the bottom surface of the rotating disc near the center, and a plurality of positioners arranged at the edge of the rotating disc. The automatic positioning and imaging platform for wafer edge defect detection drives all positioning sliders to move radially inward synchronously by rotating the dial ring, so as to ensure that the center of the wafer and the center of the rotating base automatically coincide. At the same time, the movement of the positioning sliders triggers the falling of counterweights, and through the cooperation of the convex rods and the inclined grooves, the square frame and the elastic assembly are moved above the edge of the wafer, and the balls in the elastic assembly are gently pressed down. By using mechanical linkage and gravitational potential energy, high precision, non-destructive centering and stable fixing in the detection of small-batch wafer edge collapse are achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more specifically, to an automatic positioning and imaging platform for detecting wafer edge defects. Background Technology

[0002] As the semiconductor industry develops, wafer sizes continue to increase, along with their weight and brittleness. During transport and processing, wafers are more prone to edge chipping due to stress concentration. Wafer edge chipping refers to defects, cracks, or material loss in the edge area, which is a form of physical damage. If the chipping extends to the internal circuitry of the chip, it will cause the chip to fail. Even small chipping can expand into large cracks during subsequent heat treatment or manufacturing processes, causing the entire wafer to break. In addition, edge chipping can also affect the uniformity of photoresist coating and film adhesion, resulting in particulate contamination. Therefore, wafer edge chipping detection is essential in semiconductor manufacturing.

[0003] Patent application number CN202421946843.6 discloses a wafer edge defect detection device, including a support platform, a first camera unit, a rotating shaft, and an image processing unit. The wafer is placed on the upper surface of the support platform. The first camera unit is located above the support platform and aligned with the wafer edge to obtain an image of the wafer edge from the front side of the wafer. The rotating shaft is connected to the lower surface of the support platform and can drive the support platform to rotate. The image processing unit is connected to the first camera unit and processes the received wafer edge image to generate a wafer outline map. The obtained wafer outline map is compared with a wafer template map.

[0004] However, existing wafer edge chipping detection methods have two main shortcomings. First, they rely on manual visual inspection or optical microscopes, which are cumbersome, inefficient, and susceptible to subjective factors, making it difficult to achieve precise positioning and stable observation. Second, while fully automated optical inspection equipment has high precision, it is complex, expensive, and usually designed for mass production. It is not adaptable to flexible inspection scenarios for small and medium batches or multi-size wafers, and has low cost-effectiveness. It cannot guarantee both inspection accuracy and integrity while also being economical and easy to operate.

[0005] In view of this, we propose an automatic positioning and imaging platform for wafer edge defect detection. Summary of the Invention

[0006] The purpose of this invention is to provide an automatic positioning and imaging platform for detecting wafer edge defects. By rotating the toggle ring, all positioning sliders are driven to synchronously retract radially, ensuring that the wafer center automatically coincides with the center of the rotating base. By utilizing mechanical linkage and gravitational potential energy, high-precision, non-destructive alignment and stable fixation are achieved in the detection of chipped wafers in small batches, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] An automatic positioning and imaging platform for detecting wafer edge defects includes a rotating stage for positioning the wafer. The rotating stage includes a turntable, a toggle ring sleeved outside the turntable, a rotating base disposed near the center of the bottom surface of the turntable, and a plurality of locators disposed at the edge of the turntable. The top surface of the toggle ring is provided with a plurality of arc-shaped grooves.

[0009] The rotating base includes a rotating shaft, an arc-shaped protrusion welded to the inner wall of the rotating shaft, a lifting rod sliding inside the rotating shaft, an outer protrusion integrally formed on the outer wall of the top disc of the lifting rod, and a top rod.

[0010] This setting describes how the turntable rotates, causing the rotating shaft to rotate synchronously. When the arc-shaped protrusion contacts the outer protrusion, the lifting rod drives the top rod to move upward, lifting the wafer and misaligning it with several positioning devices.

[0011] The positioner includes a positioning slider, a square frame that slides in the groove on the top surface of the positioning slider, an elastic component set in the square frame, a pair of counterweights set inside the positioning slider, a protruding rod set on the inner wall of the counterweights, and a locking screw set on the bottom surface of the positioning slider. The outer walls on both sides of the square frame are provided with inclined grooves.

[0012] When the toggle ring rotates, the locking screw moves along the arc groove, the positioning slider retracts and the counterweight moves down, and the protruding rod moves along the inclined groove, driving the square frame and the elastic component to move above the edge of the wafer.

[0013] In the technical solution of the present invention, a detection platform is provided at the bottom of the rotating platform, and a pair of vertically distributed moving modules are provided on the top surface of the detection platform on the outside of the rotating platform.

[0014] This configuration includes a high-definition camera mounted on the outside of the mobile module, with a monocular microscope attached to the lens of the high-definition camera.

[0015] In the technical solution of the present invention, a number of regularly distributed polyurethane bases are snapped onto the top surface of the turntable near the center position, and the actuating ring is rotatably connected to the outer wall of the turntable.

[0016] This setting clarifies the core functional division between the turntable and the actuating ring, establishes the basic operating mode of rotation detection and linkage adjustment, and lays the structural foundation for the subsequent coordinated actions of the positioner.

[0017] In the technical solution of the present invention, the rotating base further includes a support base fixedly connected to the top surface of the testing table by bolts, a bearing rotatably connected to the inner wall of the support base, and a fixing rod fixedly connected to the top surface of the testing table by bolts and sleeved inside the rotating shaft.

[0018] In the technical solution of the present invention, the rotating shaft is snapped and fixed to the inner wall of the bearing, the top end of the rotating shaft is fixedly connected to the bottom surface of the turntable by bolts, the lifting rod is slidably connected to the outside of the fixed rod, the bottom surface of the lifting rod is provided with a slot that matches the fixed rod, and the top rod is snapped and fixed at the center position of the top disc of the lifting rod.

[0019] The aforementioned design of rotating base synchronously lifting during testing: when the arc-shaped protrusion contacts the outer protrusion, the wafer is lifted by the lifting rod, temporarily removing it from the positioner, thus completely eliminating the blind spot in observation.

[0020] In the technical solution of the present invention, the positioner further includes a connecting plate fixedly connected to the top surface of the turntable near the edge by bolts and a limiting part disposed at the end of the top surface of the connecting plate. The limiting part includes a limiting block fixedly connected to the top surface of the connecting plate by bolts and a sliding rod and a plug welded to the outer wall of the limiting block.

[0021] In the technical solution of the present invention, the positioning slider is slidably connected to the top surface of the connecting plate and the outside of the slide rod. The outer wall of the positioning slider is provided with an inner slide groove with a longitudinal cross section in the shape of a U. The inner wall of the groove on the top surface of the positioning slider is provided with an outer slide groove that communicates with the inner slide groove. The square frame is slidably connected to the inside of the groove on the top surface of the positioning slider. The counterweight is slidably connected to the inside of the inner slide groove and has an inclined chamfer at its bottom edge. The protruding rod is welded to the inner wall of the counterweight and its end passes through the outer slide groove and extends into the inside of the inclined groove. The locking screw is threadedly connected to the bottom surface of the positioning slider and has a top ring sleeved on it.

[0022] The above setup, through the cooperation of the counterweight and the inclined groove, converts the horizontal displacement into the lowering motion of the frame and the elastic component, thereby achieving automatic centering and positioning.

[0023] In the technical solution of the present invention, the elastic component includes a pair of levers rotating on the inner wall of the groove on the top surface of the positioning slider, a block fixed to one end of the pair of levers, a ball sliding on the bottom surface of the block, a round rod fixed to the inner wall of the groove of the positioning slider and the other end of the levers, and a spiral spring fixed to the outside of the round rod.

[0024] This design uses the elastic force of a spiral spring to gently press the ball at the end of the lever onto the wafer, achieving stable and damage-free flexible clamping.

[0025] In the technical solution of the present invention, the movable module includes a slide rail, a rack fixedly connected to the outer wall of the slide rail by screws, a movable seat slidably connected to the outside of the slide rail, a knob rotatably connected to the outer wall of the movable seat, an end tooth sleeved on the end of the knob and meshing with the rack, a locking wrench rotatably connected to the outer wall of the movable seat, and a clamping block threadedly connected to the central shaft of the locking wrench.

[0026] In the technical solution of the present invention, the moving module further includes an angle adjustment part, which includes a connecting seat fixedly connected to the outer wall of the vertically arranged moving seat by bolts, a torsion disk rotatably connected to the outer wall of the connecting seat, a fixing frame for fixing the monocular microscope fixedly connected to the outer wall of the torsion disk by bolts, and a positioning screw threadedly connected to the outer wall of the connecting seat.

[0027] The above setup achieves precise focusing by driving the end teeth to mesh with the rack via a knob, and uses the angle adjustment unit to adjust the pitch of the monocular microscope, meeting the needs of multi-angle observation.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] 1. This automatic positioning and imaging platform for wafer edge defect detection drives all positioning sliders to synchronously retract radially by rotating the toggle ring, ensuring that the wafer center automatically coincides with the center of the rotating base. At the same time, the movement of the positioning sliders triggers the counterweight to fall, and through the cooperation of the protrusion and the inclined groove, pushes the square frame and elastic component to move above the wafer edge, allowing the ball bearings in the elastic component to gently press down. By utilizing mechanical linkage and gravitational potential energy, high-precision, non-destructive alignment and stable fixation are achieved in the detection of chipped wafers in small batches, effectively avoiding the risk of scratching the wafer surface by traditional fixtures, and ensuring the benchmark accuracy of the detection and operational safety.

[0030] 2. This automatic positioning and imaging platform for wafer edge defect detection uses a rotary table to perform circumferential inspection. When the table is rotated for inspection, the fixed arc-shaped bump periodically contacts the outer bump on the lifting rod. The push rod causes the wafer to be slightly lifted and misaligned with the clamping point of the locator, thus eliminating the obstruction of the observation line of sight by the clamping parts. In conjunction with the moving module, the monocular microscope and high-definition camera can continuously and unobstructedly scan and acquire images of the entire circumference of the wafer edge, thereby ensuring the comprehensiveness and accuracy of defect detection. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the rotating platform in this invention;

[0033] Figure 3 This is a cross-sectional schematic diagram of the rotating base in this invention;

[0034] Figure 4 This is one of the cross-sectional schematic diagrams of a portion of the rotating base in this invention;

[0035] Figure 5 This is the second sectional view of a portion of the rotating base structure in this invention;

[0036] Figure 6 This is a schematic diagram of the locator in this invention;

[0037] Figure 7 This is a schematic diagram of the limiting part in the present invention;

[0038] Figure 8 This is a cross-sectional schematic diagram of a portion of the locator structure in this invention;

[0039] Figure 9 This is a schematic diagram of the structure of the square frame in this invention;

[0040] Figure 10 This is a schematic diagram of the structure of the elastic component in this invention;

[0041] Figure 11 This is a schematic diagram of the structure of the mobile module in this invention;

[0042] Figure 12 This is a partial structural diagram of the mobile module in this invention;

[0043] Figure 13 This is a schematic diagram of the angle adjustment part in this invention;

[0044] Explanation of reference numerals in the attached figures:

[0045] 100. Testing station;

[0046] 200. Rotating table; 210. Turntable; 220. Actuating ring; 221. Arc groove; 230. Polyurethane base; 240. Rotating base; 241. Support base; 242. Bearing; 243. Rotating shaft; 244. Arc protrusion; 245. Fixing rod; 246. Lifting rod; 2460. Slot; 247. Outer protrusion; 248. Top rod; 250. Positioner; 251. Connecting plate; 252. Limiting part; 2520. Limiting 2521, Positioning block; 2522, Slide bar; 253, Positioning slider; 2530, Inner slide groove; 2531, Outer slide groove; 254, Square frame; 2540, Inclined groove; 255, Elastic component; 2550, Toggle lever; 2551, Square block; 2552, Ball bearing; 2553, Round rod; 2554, Worm coil spring; 256, Counterweight; 257, Protruding rod; 258, Locking screw; 259, Top ring; 260, Locking wrench;

[0047] 300. Moving module; 310. Slide rail; 320. Rack; 330. Moving base; 340. Knob; 350. End tooth; 370. Clamping block; 380. Angle adjustment part; 381. Connecting base; 382. Torsion plate; 383. Fixing bracket; 384. Positioning screw;

[0048] 400. High-definition camera;

[0049] 500. Monocular microscope. Detailed Implementation

[0050] The technical solutions of this invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0051] Please see Figures 1-2 As shown, this embodiment provides the following technical solution:

[0052] An automatic positioning and imaging platform for wafer edge defect detection includes a rotating stage 200 for positioning the wafer, a detection stage 100 at the bottom of the rotating stage 200, and a pair of vertically distributed moving modules 300 on the top surface of the detection stage 100 outside the rotating stage 200. A high-definition camera 400 is located outside the moving modules 300, and a monocular microscope 500 is attached to the lens of the high-definition camera 400.

[0053] Specifically, the rotating table 200 includes a turntable 210, a toggle ring 220 sleeved on the turntable 210, a rotating base 240 located on the bottom surface of the turntable 210 near the center, and several positioners 250 located on the edge of the turntable 210. The top surface of the toggle ring 220 is provided with several arc-shaped grooves 221.

[0054] Furthermore, several regularly distributed polyurethane bases 230 are snapped onto the top surface of the turntable 210 near the center position, and the actuating ring 220 is rotatably connected to the outer wall of the turntable 210.

[0055] Furthermore, the turntable 210 is used to drive the wafer placed on its top surface to rotate synchronously, and the rotating ring 220 is used to adjust the position of the internal structure of several positioners 250. This setting clarifies the core functional division between the turntable 210 and the rotating ring 220, establishes the basic operation mode of rotation detection and linkage adjustment, and lays the structural foundation for the subsequent coordinated action of the positioners 250.

[0056] Please see Figures 3-5 As shown, in this embodiment, the rotating base 240 includes a rotating shaft 243, an arc-shaped protrusion 244 welded to the inner wall of the rotating shaft 243, a lifting rod 246 sliding within the rotating shaft 243, an outer protrusion 247 integrally formed on the outer wall of the top disc of the lifting rod 246, and a top rod 248. After the turntable 210 rotates, it drives the rotating shaft 243 to rotate synchronously. When the arc-shaped protrusion 244 abuts against the outer protrusion 247, the lifting rod 246 drives the top rod 248 to move upward, lifting the wafer and misaligning it with several positioners 250.

[0057] Specifically, the rotating base 240 also includes a support base 241 that is fixedly connected to the top surface of the testing table 100 by bolts, a bearing 242 that is rotatably connected to the inner wall of the support base 241, and a fixing rod 245 that is fixedly connected to the top surface of the testing table 100 by bolts and sleeved inside the rotating shaft 243.

[0058] Furthermore, the rotating shaft 243 is snapped and fixed to the inner wall of the bearing 242, and the top end of the rotating shaft 243 is fixedly connected to the bottom surface of the turntable 210 by bolts. The lifting rod 246 is slidably connected to the outside of the fixed rod 245. The bottom surface of the lifting rod 246 is provided with a slot 2460 that matches the fixed rod 245. The top rod 248 is snapped and fixed at the center position of the top disc of the lifting rod 246.

[0059] Furthermore, the support base 241 ensures that the rotating base 240 can be stably placed on the top surface of the inspection table 100, and the bearing 242 ensures the stability of the rotating shaft 243 during rotation. The inspector moves the turntable 210, and the edge of the wafer is inspected using a monocular microscope 500. Simultaneously, the rotating shaft 243 in the rotating base 240 rotates synchronously. When the arc-shaped protrusion 244 abuts against the outer protrusion 247, the lifting rod 246 drives the top rod 248 to move upwards outside the fixed rod 245, thus... After the wafer is lifted, it is misaligned with several locators 250, allowing the monocular microscope 500 to fully inspect the edge of the wafer. During the inspection, the torsion disk 382 can be rotated to tilt the monocular microscope 500 up or down to observe the defects of the wafer edge chamfer. This setting is designed so that the rotating base 240 performs a lifting operation simultaneously during the inspection. When the arc-shaped protrusion 244 abuts against the outer protrusion 247, the wafer is lifted by the lifting rod 246, temporarily removing it from the locator 250, thus completely eliminating the blind spot of observation.

[0060] Please see Figures 6-9 As shown, in this embodiment, the locator 250 includes a positioning slider 253, a frame 254 sliding in the groove on the top surface of the positioning slider 253, an elastic component 255 disposed in the frame 254, a pair of counterweights 256 disposed inside the positioning slider 253, a protruding rod 257 disposed on the inner wall of the counterweight 256, and a locking screw 258 disposed on the bottom surface of the positioning slider 253. The outer walls on both sides of the frame 254 are provided with inclined grooves 2540. When the actuating ring 220 rotates, the locking screw 258 moves along the arc groove 221. After the positioning slider 253 retracts, the counterweight 256 moves down. After the protruding rod 257 moves along the inclined groove 2540, it drives the frame 254 together with the elastic component 255 to move above the edge of the wafer.

[0061] Specifically, the positioner 250 also includes a connecting plate 251 that is fixedly connected to the top surface of the turntable 210 near the edge by bolts, and a limiting part 252 provided at the end of the top surface of the connecting plate 251. The limiting part 252 includes a limiting block 2520 that is fixedly connected to the top surface of the connecting plate 251 by bolts, and a sliding rod 2521 and an insert block 2522 welded to the outer wall of the limiting block 2520.

[0062] Furthermore, the positioning slider 253 is slidably connected to the top surface of the connecting plate 251 and the outside of the slide rod 2521. The outer wall of the positioning slider 253 is provided with an inner groove 2530 with a longitudinal cross section in the shape of a U. The inner wall of the groove on the top surface of the positioning slider 253 is provided with an outer groove 2531 that communicates with the inner groove 2530. The square frame 254 is slidably connected to the inside of the groove on the top surface of the positioning slider 253. The counterweight 256 is slidably connected to the inside of the inner groove 2530 and has an inclined chamfer at its bottom edge. The protruding rod 257 is welded to the inner wall of the counterweight 256 and its end passes through the outer groove 2531 and extends into the inside of the inclined groove 2540. The locking screw 258 is threadedly connected to the bottom surface of the positioning slider 253 and is fitted with a top ring 259.

[0063] Furthermore, by twisting the actuating ring 220, the locking screw 258 inside the positioning slider 253 in the positioner 250 moves along the arc groove 221, causing the positioning slider 253 to retract inward, ensuring that the wafer and the rotation center of the rotating base 240 are coaxial. During this process, after the positioning slider 253 moves away from the limiting part 252, the insert 2522 moves out from the inner slide groove 2530, causing the counterweight 256 and the protruding rod 257 to move downward, causing the protruding rod 257 to move along the inclined groove 2540, causing the square frame 254 and the elastic component 255 to move above the edge of the wafer. This setting, through the cooperation of the counterweight 256 and the inclined groove 2540, converts the horizontal displacement into the downward movement of the square frame 254 and the elastic component 255, realizing automatic centering and positioning.

[0064] Please see Figure 10 As shown, in this embodiment, the elastic component 255 includes a pair of levers 2550 that rotate on the inner wall of the groove on the top surface of the positioning slider 253, a block 2551 that is snapped and fixed to one end of the pair of levers 2550, a ball 2552 that slides on the bottom surface of the block 2551, a round rod 2553 that is snapped and fixed to the inner wall of the groove of the positioning slider 253 and the other end of the levers 2550, and a spiral spring 2554 that is snapped to the outside of the round rod 2553.

[0065] Furthermore, after the spring force of the spiral spring 2554 in the elastic component 255 is released, it drives the lever 2550 to flip downward, causing the ball 2552 to abut against the top surface of the wafer. After the wafer is automatically positioned, the locking screw 258 is turned, and the position of the lever 220 is restricted by the top ring 259. This setting allows the spring force of the spiral spring 2554 to drive the ball 2552 at the end of the lever 2550 to gently press the wafer, achieving stable and damage-free flexible clamping.

[0066] Please see Figures 11-13 As shown, in this embodiment, the movable module 300 includes a slide rail 310, a rack 320 fixedly connected to the outer wall of the slide rail 310 by screws, a movable seat 330 slidably connected to the outside of the slide rail 310, a knob 340 rotatably connected to the outer wall of the movable seat 330, an end tooth 350 sleeved on the end of the knob 340 and meshing with the rack 320, a locking wrench 260 rotatably connected to the outer wall of the movable seat 330, and a clamping block 370 threadedly connected to the central shaft of the locking wrench 260.

[0067] Furthermore, the movable module 300 also includes an angle adjustment unit 380, which includes a connecting seat 381 fixedly connected to the outer wall of the vertically arranged movable seat 330 by bolts, a torsion plate 382 rotatably connected to the outer wall of the connecting seat 381, a fixing frame 383 fixedly connected to the outer wall of the torsion plate 382 by bolts for fixing the monocular microscope 500, and a positioning screw 384 threadedly connected to the outer wall of the connecting seat 381.

[0068] Furthermore, by turning the knob 340 in a pair of movable modules 300, the end teeth 350 are driven to engage the rack 320, which in turn moves the movable seat 330 on the slide rail 310, so that the monocular microscope 500 and the wafer are on the same plane. The distance between the monocular microscope 500 and the wafer is adjusted according to the image displayed on the external display of the high-definition camera 400, so that the object being observed is at the focal length of the monocular microscope 500 to obtain the clearest image. The light source at the end of the monocular microscope 500 is also adjusted. During the inspection process, the torsion disk 382 can also be rotated to tilt the monocular microscope 500 up or down to observe the defects of the wafer edge chamfer. This setting achieves precise focusing by driving the end teeth 350 to engage with the rack 320 through the knob 340, and the pitch adjustment of the monocular microscope 500 is achieved by the angle adjustment unit 380 to meet the needs of multi-angle observation.

[0069] When using the automatic positioning and imaging platform for wafer edge defect detection of the present invention, the wafer is placed on the top surface of several polyurethane bases 230 of the rotating stage 200, and the actuating ring 220 is turned to drive the locking screw 258 in the positioning slider 253 of the locator 250 to move along the arc groove 221, thereby causing the positioning slider 253 to retract inward and ensuring that the wafer and the rotation center of the rotating base 240 are coaxial.

[0070] During this process, after the positioning slider 253 moves away from the limiting part 252, the insert block 2522 moves out from the inner slide groove 2530, driving the counterweight block 256 and the protruding rod 257 to move down, driving the protruding rod 257 to move along the inclined groove 2540, driving the square frame 254 and the elastic component 255 to move above the edge of the wafer. Then, after the elastic force of the spiral spring 2554 in the elastic component 255 is released, it drives the lever 2550 to reverse downward, causing the ball 2552 to abut against the top surface of the wafer. After the automatic positioning of the wafer is completed, the locking screw 258 is turned to restrict the position of the actuating ring 220 through the top ring 259.

[0071] Subsequently, by turning the knob 340 in a pair of movable modules 300, the end teeth 350 are driven to mesh with the rack 320, which in turn drives the movable seat 330 to move on the slide rail 310, so that the monocular microscope 500 and the wafer are on the same plane. The distance between the monocular microscope 500 and the wafer is adjusted according to the image displayed on the external display of the high-definition camera 400, so that the object being observed is at the focal length of the monocular microscope 500 to obtain the clearest image. The light source at the end of the monocular microscope 500 is also adjusted.

[0072] Afterwards, the inspector moves the turntable 210 and inspects the edge of the wafer through the monocular microscope 500. At the same time, the rotating shaft 243 in the rotating base 240 rotates synchronously. When the arc-shaped protrusion 244 abuts against the outer protrusion 247, the lifting rod 246 drives the top rod 248 to move upward outside the fixed rod 245, lifting the wafer and misaligning it with several positioning devices 250. This allows the monocular microscope 500 to fully inspect the edge of the wafer. During the inspection process, the torsion disk 382 can also be rotated to tilt the monocular microscope 500 up or down to observe the defects of the wafer edge chamfer.

[0073] After the subsequent testing is completed, the locking screw 258 is turned to move the top ring 259 down, releasing the restriction on the toggle ring 220. After rotating the toggle ring 220 to restore the position of the locator 250, the wafer that has completed the testing can be taken out from the rotating stage 200.

[0074] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the specification and its equivalents.

Claims

1. An automated positioning and imaging platform for wafer edge defect detection, comprising: The device includes a rotating stage for positioning wafers. The rotating stage includes a turntable, a toggle ring sleeved on the turntable, a rotating base disposed on the bottom surface of the turntable near the center, and several positioners disposed on the edge of the turntable. The top surface of the toggle ring is provided with several arc-shaped grooves. The rotating base includes a rotating shaft, an arc-shaped protrusion welded to the inner wall of the rotating shaft, a lifting rod sliding inside the rotating shaft, an outer protrusion integrally formed on the outer wall of the top disc of the lifting rod, and a top rod. After the turntable rotates, it drives the rotating shaft to rotate synchronously. When the arc-shaped protrusion abuts against the outer protrusion, the lifting rod drives the top rod to move upward, lifting the wafer and misaligning it with several positioning devices. The positioner includes a positioning slider, a square frame that slides in the groove on the top surface of the positioning slider, an elastic component set in the square frame, a pair of counterweights set inside the positioning slider, a protruding rod set on the inner wall of the counterweights, and a locking screw set on the bottom surface of the positioning slider. The outer walls on both sides of the square frame are provided with inclined grooves. When the actuating ring rotates, the locking screw moves along the arc groove. After the positioning slider retracts, the counterweights move down. After the protruding rod moves along the inclined groove, it drives the square frame together with the elastic component to move above the edge of the wafer.

2. The automatic positioning and imaging platform for wafer edge defect detection of claim 1, wherein: The bottom of the rotating stage is equipped with a detection platform, and a pair of vertically distributed moving modules are provided on the top surface of the detection platform outside the rotating stage. A high-definition camera is provided on the outside of the moving modules, and a monocular microscope is attached to the lens of the high-definition camera.

3. The automatic positioning and imaging platform for wafer edge defect detection of claim 2, wherein: Several regularly distributed polyurethane bases are snapped onto the top surface of the turntable near the center, and the actuating ring is rotatably connected to the outer wall of the turntable.

4. The automatic positioning and imaging platform for wafer edge defect detection of claim 2, wherein: The rotating base also includes a support base that is fixedly connected to the top surface of the testing table by bolts, a bearing that is rotatably connected to the inner wall of the support base, and a fixing rod that is fixedly connected to the top surface of the testing table by bolts and sleeved inside the rotating shaft.

5. The automatic positioning and imaging platform for wafer edge defect detection of claim 4, wherein: The rotating shaft is snapped and fixed to the inner wall of the bearing. The top end of the rotating shaft is fixed to the bottom surface of the turntable by bolts. The lifting rod is slidably connected to the outside of the fixed rod. The bottom surface of the lifting rod has a slot that matches the fixed rod. The top rod is snapped and fixed at the center of the top disc of the lifting rod.

6. The automatic positioning and imaging platform for wafer edge defect detection according to claim 1, characterized in that: The positioner also includes a connecting plate that is bolted to the top surface of the turntable near the edge, and a limiting part that is provided at the end of the top surface of the connecting plate. The limiting part includes a limiting block that is bolted to the top surface of the connecting plate, and a sliding rod and a plug that are welded to the outer wall of the limiting block.

7. The automatic positioning and imaging platform for wafer edge defect detection of claim 6, wherein: The positioning slider is slidably connected to the top surface of the connecting plate and the outside of the sliding rod. The outer wall of the positioning slider has an inner groove with a longitudinal cross-section in the shape of a U. The inner wall of the groove on the top surface of the positioning slider has an outer groove that communicates with the inner groove. The square frame is slidably connected to the inside of the groove on the top surface of the positioning slider. The counterweight is slidably connected to the inside of the inner groove and has an inclined chamfer at its bottom edge. The protruding rod is welded to the inner wall of the counterweight and its end passes through the outer groove and extends into the inside of the inclined groove. The locking screw is threadedly connected to the bottom surface of the positioning slider and has a top ring.

8. The automatic positioning and imaging platform for wafer edge defect detection of claim 7, wherein: The elastic component includes a pair of levers that rotate on the inner wall of the groove on the top surface of the positioning slider, a block that is locked and fixed to one end of the pair of levers, a ball that slides on the bottom surface of the block, a round rod that is locked and fixed to the inner wall of the groove of the positioning slider and the other end of the levers, and a spiral spring that is locked to the outside of the round rod.

9. The automatic positioning and imaging platform for wafer edge defect detection of claim 2, wherein: The movable module includes a slide rail, a rack fixed to the outer wall of the slide rail by screws, a movable seat slidably connected to the outside of the slide rail, a knob rotatably connected to the outer wall of the movable seat, an end tooth sleeved on the end of the knob and meshing with the rack, a locking wrench rotatably connected to the outer wall of the movable seat, and a clamping block threaded to the central shaft of the locking wrench.

10. The automatic positioning and imaging platform for wafer edge defect detection according to claim 9, characterized in that: The moving module also includes an angle adjustment unit, which includes a connecting seat fixedly connected to the outer wall of the vertically arranged moving seat by bolts, a torsion disk rotatably connected to the outer wall of the connecting seat, a fixing frame for fixing the monocular microscope fixedly connected to the outer wall of the torsion disk by bolts, and a positioning screw threaded to the outer wall of the connecting seat.

Images