Optical module

Abstract

In the optical module provided by the invention, a first optical receiving part receives a fourth wavelength optical signal, a fifth wavelength optical signal and a sixth wavelength optical signal reflected by a first reflector, and outputs a first voltage signal, a second voltage signal or a third voltage signal; a golden finger, an MCU, a first limiting amplifier, a second limiting amplifier and a filter circuit are arranged on the circuit board; the input end of the first limiting amplifier and the input end of the second limiting amplifier are connected with a first light receiving part through a filter circuit; the filter circuit transmits a second voltage signal to the first limiting amplifier, so that the first limiting amplifier processes the second voltage signal and transmits the second voltage signal to the golden finger; and the MCU is in control connection with the second limiting amplifier, so that the second limiting amplifier processes the first voltage signal or the third voltage signal through the control signal and then transmits the first voltage signal or the third voltage signal to the golden finger through the corresponding output end.

Description

optical modules

[0001] This application claims the priority of application number 202411064913.X filed with the China Patent Office on August 5, 2024; the priority of application number 202411163298.8 filed with the China Patent Office on August 22, 2024; and the priority of application number 202420062434.3 filed with the China Patent Office on January 10, 2024; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Currently, to increase the transmission rate of optical modules, multiple transmission channels are set up in optical modules. In other words, the transmission capacity is increased through multi-channel design. However, as the number of transmission channels in optical modules increases, the number of components involved will also increase, which places higher requirements on the packaging of optical modules.

[0005] Summary of the Invention

[0006] The present disclosure provides an optical module, comprising:

[0007] an optical fiber adapter, one end of which is configured to be connected to an external optical fiber to transmit a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal input through the external optical fiber;

[0008] The optical housing comprises a first housing; one end of the first housing is connected to the other end of the optical fiber adapter; a first reflector and a second reflector are disposed in the first housing, and the first reflector and the second reflector are configured to reflect a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal;

[0009] a first light receiving component connected to the first housing, wherein a light input end of the first light receiving component is located in the first housing; the first light receiving component is located in a reflected light path of the first reflector, the first light receiving component receives at least one of the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal reflected by the first reflector, and outputs at least one of the first voltage signal, the second voltage signal, or the third voltage signal;

[0010] A circuit board is provided with a gold finger, an MCU, a first limiting amplifier, a second limiting amplifier, and a filtering circuit; the input end of the first limiting amplifier and the input end of the second limiting amplifier are connected to the first light receiving component through the filtering circuit, and the output end of the first limiting amplifier and the output end of the second limiting amplifier are respectively connected to the gold finger; the filtering circuit bypasses the second voltage signal to the first limiting amplifier, causing the first limiting amplifier to amplify or limit and shape the second voltage signal and transmit it to the gold finger; the first voltage signal and the third voltage signal are transmitted to the second limiting amplifier through the filtering circuit; the MCU controls the connection to the second limiting amplifier, so that the second limiting amplifier amplifies or limits and shapes the first voltage signal or the third voltage signal through a control signal and transmits it to the gold finger through the corresponding output end;

[0011] And / or, the optical module further includes:

[0012] Light emitting components, including:

[0013] a laser assembly configured to emit a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal;

[0014] A polarization component configured to adjust the polarization direction of an optical signal; the polarization component includes a first polarization component, a second polarization component, and a third polarization component, each of which includes a first polarizer, a Faraday plate, a second polarizer, and a wave plate. The first polarizer, the Faraday plate, the second polarizer, and the wave plate are sequentially positioned away from the laser component. A first wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer, and the wave plate of the first polarization component to emit horizontally polarized light. A third wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer, and the wave plate of the third polarization component to emit first vertically polarized light. A second wavelength optical signal sequentially passes through the first polarizer, the Faraday plate, the second polarizer, and the wave plate of the second polarization component to emit second vertically polarized light.

[0015] The wavelength combining component is configured to combine the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal into one beam. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0017] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0018] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0019] FIG3 is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0020] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0021] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0022] FIG6 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0023] FIG7 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0024] FIG8 is a diagram of an Ethernet passive optical network according to some embodiments of the present disclosure;

[0025] FIG9 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0026] FIG10 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0027] FIG11 is a circuit diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0028] FIG12 is a schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure;

[0029] FIG13 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0030] FIG14 is a circuit diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0031] FIG15 is a schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure;

[0032] FIG16 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0033] FIG17 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0034] FIG18 is a diagram illustrating a first housing in use according to some embodiments of the present disclosure;

[0035] FIG19 is an assembly diagram of an optical transceiver component and an optical fiber adapter according to some embodiments of the present disclosure;

[0036] FIG20 is an exploded view of an optical transceiver component and an optical fiber adapter according to some embodiments of the present disclosure;

[0037] FIG21 is a structural diagram of a first cavity provided according to some embodiments of the present disclosure;

[0038] FIG22 is an exploded view of a first cavity according to some embodiments of the present disclosure;

[0039] FIG23 is an exploded view of a first housing and a first optical assembly according to some embodiments of the present disclosure;

[0040] FIG24 is a cross-sectional view of a first housing according to some embodiments of the present disclosure;

[0041] FIG25 is a light path diagram of a first optical component according to some embodiments of the present disclosure;

[0042] FIG26 is a light path diagram of another first optical assembly according to some embodiments of the present disclosure;

[0043] FIG27 is a structural diagram of a wave splitting component provided according to some embodiments of the present disclosure;

[0044] FIG28 is a cross-sectional view of an optical transceiver component according to some embodiments of the present disclosure;

[0045] FIG29 is an exploded view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure;

[0046] FIG30 is an exploded view of an optical transceiver component according to some embodiments of the present disclosure;

[0047] FIG31 is a structural diagram of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure;

[0048] FIG32 is an exploded view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure;

[0049] FIG33 is a cross-sectional view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure;

[0050] FIG34 is an exploded view of a transceiver cavity according to some embodiments of the present disclosure;

[0051] FIG35 is a structural diagram of a transceiver housing according to some embodiments of the present disclosure;

[0052] FIG36 is a light path diagram of a second optical assembly according to some embodiments of the present disclosure;

[0053] FIG37 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0054] FIG38 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0055] FIG39 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0056] FIG40 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0057] FIG41 is a second schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

[0058] FIG42 is a third schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0059] FIG43 is a first cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0060] FIG44 is a second cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0061] FIG45 is a third cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0062] FIG46 is a transmission optical path diagram of an optical transmission signal according to some embodiments of the present disclosure;

[0063] FIG47 is an assembly diagram of an optical transceiver component and an optical fiber adapter from another perspective according to some embodiments of the present disclosure;

[0064] FIG48 is a structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0065] FIG49 is an exploded view of a second housing and an electrical connector according to some embodiments of the present disclosure;

[0066] FIG50 is a light path diagram of a second optical assembly according to some embodiments of the present disclosure;

[0067] FIG51 is a light path diagram of another second optical assembly according to some embodiments of the present disclosure;

[0068] FIG52 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0069] FIG53 is an exploded view of a first optical assembly and a transmitting housing according to some embodiments of the present disclosure;

[0070] FIG54 is a structural diagram of a launch housing according to some embodiments of the present disclosure;

[0071] FIG55 is a light path diagram of a first optical assembly according to some embodiments of the present disclosure;

[0072] FIG56 is another optical path diagram of the first optical assembly according to some embodiments of the present disclosure;

[0073] FIG57 is a combined optical path diagram of a first optical component and a second optical component according to some embodiments of the present disclosure;

[0074] FIG58 is a schematic diagram illustrating the optical axis of a wave plate, the polarization direction of an incident light signal, and the polarization direction of an outgoing light signal according to some embodiments of the present disclosure;

[0075] FIG59 is an exploded view of a supporting member, a second polarization combining member, and a third polarization combining member according to some embodiments of the present disclosure;

[0076] FIG60 is a structural diagram of a supporting member according to some embodiments of the present disclosure;

[0077] FIG61 is a structural diagram of a supporting member provided in accordance with some embodiments of the present disclosure from another perspective;

[0078] Figure 62 is a cross-sectional view of a support member provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0079] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0080] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0081] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0082] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0083] FIG1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in FIG1 , the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0084] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0085] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0086] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0087] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote server device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0088] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0089] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0090] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0091] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light-emitting component 400, and an optical receiving component 500. The optical receiving component 500 is provided with at least one light-receiving component. However, the present disclosure is not limited to this. In some embodiments, the optical module 200 includes either the light-emitting component 400 or the optical receiving component 500.

[0092] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0093] In some embodiments of the present disclosure, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0094] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0095] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end in FIG3 ), and the opening 204 is also located at the end of the optical module 200 (the left end in FIG3 ). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located on the side of the optical module 200. The opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to receive the optical fiber 101 so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0096] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, the light-emitting component 400, and the optical receiving component 500 into the housing, with the upper and lower housings 201 and 202 providing encapsulation and protection for these components. Furthermore, during the assembly of the circuit board 300, the light-emitting component 400, and the optical receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0097] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0098] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0099] Exemplarily, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0100] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0101] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0102] In some embodiments, three light receiving components may be provided on the optical receiving component 500 , and each light receiving component receives a light signal of a corresponding wavelength.

[0103] In some embodiments, two light receiving components may be provided on the optical receiving component 500 , one light receiving component for receiving an optical signal of one wavelength, and the other light receiving component for receiving optical signals of two wavelengths in a time-division manner.

[0104] In some embodiments, a light receiving component may be provided on the optical receiving component 500 , and the light receiving component is used for time-division reception of optical signals of three wavelengths.

[0105] In some embodiments, the light receiving component includes a light detector and a TIA. The light signal is transmitted to the light receiving component. The light detector receives the light signal and converts it into a current signal. The TIA converts the current signal output by the detector into a voltage signal.

[0106] The circuit board 300 also includes a gold finger 310 formed on its end surface, and the gold finger 310 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 310 is electrically connected to the electrical connector in the cage 106. The gold finger 310 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to adapt to occasions where a large number of pins are required. The gold finger 310 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0107] In some embodiments, the light emitting component 400 and the light receiving component on the optical receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0108] Figure 5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure, Figure 6 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure, and Figure 7 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure. Figures 5 to 7 show the usage status of the optical accommodation components in the embodiments of the present disclosure.

[0109] In some embodiments, one end of the optical receiving component 500 is connected to the optical fiber adapter 530, and the other end of the optical receiving component 500 is connected to the optical emitting component 400. The optical signal generated by the optical emitting component 400 is first transmitted into the optical receiving component 500, then transmitted to the optical fiber adapter 530 through the optical receiving component 500, and finally output through the optical fiber adapter 530. Externally input optical signals are input into the optical receiving component 500 through the optical fiber adapter 530, allowing the optical receiving component 500 and the optical emitting component 400 to share the optical fiber adapter 530, thereby allowing the uplink and downlink optical signals of the optical module to share the optical fiber 101.

[0110] In some embodiments, the optical housing 500 includes a first housing 510 and a first upper cover 520, which together form a first cavity. The interior of the first cavity forms a housing chamber, which is used to accommodate components and enable connections or communication between components. Exemplarily, a displacement prism, a reflector, etc., is disposed within the housing chamber. A fiber optic adapter 530 is connected to one end of the first housing 510, which communicates with the interior of the first housing 510.

[0111] In some embodiments, the other end of the first housing 510 is connected to the optical transmission component 400. The optical transmission component 400 can generate optical transmission signals of multiple wavelengths and can combine the optical transmission signals of multiple wavelengths into a single optical transmission signal. For example, the optical transmission component 400 can generate optical transmission signals of three wavelengths, each of which has different rates. For example, the optical transmission component 400 can generate an optical signal of a first wavelength, an optical signal of a second wavelength, and an optical signal of a third wavelength, each of which has different rates.

[0112] In some embodiments, the optical transmission component 400 may include a second housing 410, with a plurality of pins 430 disposed on the sidewalls of the second housing 410. Devices for generating and transmitting optical transmission signals are disposed within the second housing 410. The pins 430 are connected to a flexible printed circuit board (FPC) to electrically connect to the circuit board 300 via the FPC. For example, one end of the second housing 410 is connected to the other end of the first housing 510.

[0113] In some embodiments, multiple rows of pins are respectively disposed on two connected side walls of the second housing 410 , and the pins in the bottom row of the two connected side walls include high-frequency pins.

[0114] In some embodiments, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1575-1580 nm, such as the wavelength of the second wavelength optical signal is 1577 nm; the wavelength range of the third wavelength optical signal is 1480-1500 nm, such as the wavelength of the third wavelength optical signal is 1490 nm.

[0115] In some embodiments, optical receiving signals of different wavelengths can be input into the inner cavity of the first housing 510 through the optical fiber adapter 530. For example, a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal can be input into the inner cavity of the first housing 510 through the optical fiber adapter 530. For example, the wavelength range of the fourth wavelength optical signal is 1260-1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal is 1284-1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; the wavelength range of the sixth wavelength optical signal is 1290-1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm. The fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal can have different rates; of course, in the embodiment of the present disclosure, the fourth wavelength optical signal and the sixth wavelength optical signal can have the same rate, etc.

[0116] In some embodiments, the optical housing 500 is provided with a first light receiving component 710 (also referred to as a first light receiving assembly in some examples). The first light receiving component 710 can be connected to a side wall of the first housing 510, with the light input end of the first light receiving component 710 located within the housing cavity. The first light receiving component 710 can receive optical signals at a fourth wavelength, an optical signal at a fifth wavelength, and an optical signal at a sixth wavelength. The first light receiving component 710 can be connected to the circuit board 300 via a flexible circuit board.

[0117] In some embodiments, the optical housing 500 is provided with a second light receiving component 720 (also referred to as a second light receiving assembly in some examples) and a first light receiving component 710. The second light receiving component 720 and the first light receiving component 710 can be connected to the side wall of the first housing 510, and the light input ends of the second light receiving component 720 and the first light receiving component 710 are respectively located within the housing cavity. The second light receiving component 720 can receive optical signals of the fourth wavelength and the sixth wavelength, and the first light receiving component 710 can receive optical signals of the fifth wavelength. The second light receiving component 720 and the first light receiving component 710 can each be connected to the circuit board 300 via a flexible circuit board.

[0118] In some embodiments, the optical receiving component 500 is provided with a second light receiving component 720, a first light receiving component 710, and a third light receiving component 730 (in some examples, it can also be referred to as a third light receiving assembly). The second light receiving component 720, the first light receiving component 710, and the third light receiving component 730 can be connected to the side wall of the first housing 510, and the light input ends of the second light receiving component 720, the first light receiving component 710, and the third light receiving component 730 are respectively located in the receiving cavity. The second light receiving component 720 can receive a fourth wavelength optical signal, the first light receiving component 710 can receive a fifth wavelength optical signal, and the third light receiving component 730 can receive a sixth wavelength optical signal. The second light receiving component 720, the first light receiving component 710, and the third light receiving component 720 can be connected to the circuit board 300 via a flexible circuit board.

[0119] FIG8 is a diagram of an Ethernet Passive Optical Network (EPON) according to some embodiments of the present disclosure, and FIG8 illustrates a usage scenario of an optical module 200. In some embodiments, the OLT in the EPON can connect to ONUs such as ONU1, ONU2, and ONU3 via an optical distribution network (ODN); wherein the ONU is a 50G EPON ONU, a 10G EPON ONU, a 1G EPON ONU, or a 10G EPON asymmetric ONU, so that the OLT can receive a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal, etc., through the optical module 200. The downstream wavelength of the 50G EPON ONU can be the fifth wavelength, the downstream wavelength of the 10G EPON ONU can be the fourth wavelength, and the downstream wavelength of the 1G EPON ONU and the 10G EPON asymmetric ONU can be the sixth wavelength.

[0120] Figure 9 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. Figure 9 shows the setting status of the components in the first shell 510 and the transmission optical path of the optical signal in the first shell 510; wherein, the solid arrow is the optical transmission signal, and the dotted arrow is the optical reception signal.

[0121] In some embodiments, a first reflector 540 and a second reflector 550 may be disposed within the first housing 510. The first reflector 540 is located on the input optical path of the first light receiving component 710, and the second reflector 550 is located on the incident optical path of the first reflector 540. A received optical signal input into the first housing via the optical fiber adapter 530 is transmitted to the second reflector 550, reflected by the second reflector 550 and transmitted to the first reflector 540, and then directly reflected by the first reflector 540 to the first light receiving component 710. The received optical signal may be an optical signal of the fourth wavelength, an optical signal of the fifth wavelength, or an optical signal of the sixth wavelength.

[0122] In some embodiments, the optical transmission signal is transmitted to the first housing 510 and passes through the second reflector 550 .

[0123] In some embodiments, the fourth wavelength optical signal, the fifth wavelength optical signal or the sixth wavelength optical signal is transmitted to the first housing 510 in a time division multiplexed manner, so that the first light receiving component 710 can receive optical signals of different wavelengths in different time periods.

[0124] In some embodiments, a first displacement prism 560 may be disposed within the first housing 510. A first reflective surface 561 of the first displacement prism 560 is located on an extension of the optical axis of the fiber optic adapter 530, and a second reflective surface 562 of the first displacement prism 560 is located on the incident optical axis of the second reflector 550. A received optical signal input into the first housing 510 via the fiber optic adapter 530 is transmitted to the first reflective surface 561, reflected from the first reflective surface 561 to the second reflective surface 562, and then reflected from the second reflective surface 562 to the second reflector 550. The first displacement prism 560 can be used to adjust the transmission optical path of the received optical signal in the width direction of the first housing 510.

[0125] In some embodiments, a first lens 570 may be disposed within the first housing 510. The first lens 570 is disposed on the optical transmission path from the fiber optic adapter 530 to the first displacement prism 560. For example, the first lens 570 is located on the optical transmission path from the fiber optic adapter 530 to the first reflective surface 561. The first lens 570 collimates the received optical signal input into the first housing 510 via the fiber optic adapter 530.

[0126] In some embodiments, the optical transmission signal is transmitted through the second reflector 550 to the second reflective surface 562, reflected by the second reflective surface 562 and transmitted to the first reflective surface 561, then reflected by the first reflective surface 561 and transmitted to the first lens 570, and finally converged by the first lens 570 and transmitted to the optical fiber adapter 530.

[0127] FIG10 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure, and FIG10 shows a circuit diagram using the first light receiving component 710. In some embodiments, the circuit board 300 may be provided with an MCU 320.

[0128] In some embodiments, a first limiting amplifier 330 is provided on the circuit board 300. The input end of the first limiting amplifier 330 is connected to the output end of the first light receiving component 710. The first limiting amplifier 330 amplifies or limits the voltage signal output by the first light receiving component 710 and outputs it to the gold finger 310. Exemplarily, the first limiting amplifier 330 is connected to the output end of the TIA in the first light receiving component 710. The first limiting amplifier 330 amplifies or limits the voltage signal output by the TIA.

[0129] In some embodiments, at a first target time, the first light receiving component 710 outputs a first voltage signal; at a second target time, the first light receiving component 710 outputs a second voltage signal; and at a third target time, the first light receiving component 710 outputs a third voltage signal. The first target time, the second target time, and the third target time can be updated cyclically.

[0130] In some embodiments, the first limiting amplifier 330 includes a first output channel 331, a second output channel 332, and a third transmission channel 333. The first output channel 331, the second output channel 332, and the third transmission channel 333 are respectively connected to the gold finger 310. The first output channel 331 is used to output the first voltage signal processed by the first limiting amplifier 330, the second output channel 332 is used to output the second voltage signal processed by the first limiting amplifier 330, and the third transmission channel 333 is used to output the third voltage signal processed by the first limiting amplifier 330.

[0131] In some embodiments, a rate of the third voltage signal is greater than a rate of the first voltage signal, and a rate of the third voltage signal is greater than a rate of the second voltage signal.

[0132] In some embodiments, the MCU 320 controls the connection to the first limiting amplifier 330, causing the first limiting amplifier 330 to process different voltage signals in different time periods and output the processed voltage signals to the gold finger through corresponding transmission channels. For example, the MCU 320 outputs a first control signal to the first limiting amplifier 330 at a first target time, causing the first limiting amplifier 330 to amplify or limit the first voltage signal and output the processed first voltage signal to the gold finger 310 through a first output channel 331; the MCU 320 outputs a second control signal to the first limiting amplifier 330 at a second target time, causing the first limiting amplifier 330 to amplify or limit the second voltage signal and output the processed second voltage signal to the gold finger 310 through a second output channel 3321; and the MCU 320 outputs a third control signal to the first limiting amplifier 330 at a third target time, causing the first limiting amplifier 330 to amplify or limit the third voltage signal and output the processed third voltage signal to the gold finger 310 through a third transmission channel 333.

[0133] In some embodiments, the first control signal is a high level signal, the second control signal is a medium level signal, and the third control signal is a low level signal. Of course, in the embodiments of the present disclosure, the first control signal is not limited to this and can be a combination of other forms.

[0134] FIG11 is a circuit diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure, and FIG11 shows another circuit diagram using the first light receiving component 710. In some embodiments, a second limiting amplifier 340, a first limiting amplifier 330, and a filter circuit 350 are provided on the circuit board 300. The input end of the filter circuit 350 is connected to the output end of the first light receiving component 710, and the output end of the filter circuit 350 is connected to the input end of the second limiting amplifier 340 and the input end of the first limiting amplifier 330, respectively, so that the output voltage signal of the first light receiving component 710 is output to the input end of the second limiting amplifier 340 or the first limiting amplifier 330 through the filter circuit 350.

[0135] In some embodiments, the first and third voltage signals output by the first light receiving component 710 are transmitted to the second limiting amplifier 340 via the filter circuit 350. The second limiting amplifier 340 amplifies or limits the first and third voltage signals. The second voltage signal output by the first light receiving component 710 is transmitted to the first limiting amplifier 330 via the filter circuit 350. The first limiting amplifier 330 amplifies or limits the second voltage signal. For example, the second voltage signal output by the first light receiving component 710 is bypassed by the filter circuit 350 to the first limiting amplifier 330.

[0136] In some embodiments, the second limiting amplifier 340 includes a fourth output channel 341 and a fifth output channel 342, each of which is connected to the gold finger 310. The fourth output channel 341 is used to output the first voltage signal processed by the second limiting amplifier 340, and the fifth output channel 342 is used to output the third voltage signal processed by the second limiting amplifier 340. The first limiting amplifier 330 includes a second output channel 332, which is connected to the gold finger 310. The second output channel 332 is used to output the second voltage signal processed by the first limiting amplifier 330.

[0137] In some embodiments, the MCU 320 controls the connection to the second limiting amplifier 340, causing the second limiting amplifier 340 to process different voltage signals in different time periods and output the processed voltage signals to the gold finger through corresponding transmission channels. For example, the MCU 320 outputs a fourth control signal to the second limiting amplifier 340 at a first target time, causing the second limiting amplifier 340 to amplify or limit the first voltage signal and output the processed first voltage signal to the gold finger 310 through a fourth output channel 341. At a third target time, the MCU 320 outputs a fifth control signal to the second limiting amplifier 340, causing the second limiting amplifier 340 to amplify or limit the third voltage signal and output the processed third voltage signal to the gold finger 310 through a fifth output channel 342.

[0138] In some embodiments, the fourth control signal may be at a high level, and the fifth control signal may be at a low level.

[0139] In some embodiments, the filter circuit 350 includes a first capacitor 351, a second capacitor 352, a third capacitor 353, a fourth capacitor 354, a first inductor 355, and a second inductor 356. The first capacitor 351, the second capacitor 352, the first inductor 355, and the second inductor 356 are disposed between the first light receiving component 710 and the second limiting amplifier 340. The first capacitor 351 is connected in series with the first inductor 355, and the second capacitor 352 is connected in series with the second inductor 356. The third capacitor 353 and the fourth capacitor 354 are disposed between the first light receiving component 710 and the first limiting amplifier 330.

[0140] In some embodiments, the output end of the first light receiving component 710 can be connected to three limiting amplifiers, so that the three limiting amplifiers process the electrical signal output by the first light receiving component 710 in a one-to-one manner. For example, the first limiting amplifier processes the first voltage signal, the second limiting amplifier processes the second voltage signal, and the third limiting amplifier processes the third voltage signal.

[0141] In some embodiments, the first light receiving component 710 may include a first detector 711 and a first TIA 712. The signal output of the first detector 711 is connected to the signal input of the first TIA 712, which converts the current signal into a voltage signal. The MCU 320 controls the connection to the first TIA 712 and sends control signals to the first TIA 712 according to the timing settings, causing the first TIA 712 to convert the current signal into a voltage signal according to the corresponding configuration.

[0142] In some embodiments, the MCU 320 outputs a first configuration signal to the first TIA 712 at a first target time, causing the first TIA 712 to convert the first current signal output by the first detector 711 into a first voltage signal according to the first configuration. The MCU 320 outputs a second configuration signal to the first TIA 712 at a second target time, causing the first TIA 712 to convert the second current signal output by the first detector 711 into a second voltage signal according to the second configuration. The MCU 320 outputs a third configuration signal to the first TIA 712 at a third target time, causing the first TIA 712 to convert the third current signal output by the first detector 711 into a third voltage signal according to the third configuration. The first, second, and third configuration signals can be signals of different voltage levels.

[0143] Figure 12 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure. Figure 12 shows the setting status of another device in the first shell 510 and the transmission optical path of the optical signal in the first shell 510; wherein, the solid arrow is the optical transmission signal, and the dotted arrow is the optical reception signal.

[0144] In some embodiments, the second light receiving component 720 is disposed beside the first light receiving component 710. Exemplarily, the second light receiving component 720 and the first light receiving component 710 are disposed side by side, and the input light path of the second light receiving component 720 is parallel to the input light path of the first light receiving component 710.

[0145] In some embodiments, a wavelength division multiplexer 580 and a displacement prism assembly 590 may be disposed within the first housing 510. The wavelength division multiplexer 580 is located on the reflected light path of the first reflector 540 and on one side of the displacement prism assembly 590. The displacement prism assembly 590 is located on the output light path of the wavelength division multiplexer 580. The second light receiving component 720 and the first light receiving component 710 are located on the other side of the displacement prism assembly 590.

[0146] The optical receive signal reflected by the first reflector 540 is transmitted to the wavelength division multiplexer 580. The wavelength division multiplexer 580 changes the transmission path of the optical receive signal according to the wavelength of the optical receive signal, so that the received optical signals of different wavelengths are transmitted along different optical paths after being output by the wavelength division multiplexer 580. Exemplarily, the wavelength division multiplexer 580 includes a first optical output port 581, a second optical output port 582, and a third optical output port 583. The first optical output port 581 is used to output an optical signal of a fourth wavelength, the second optical output port 582 is used to output an optical signal of a fifth wavelength, and the third optical output port 583 is used to output an optical signal of a sixth wavelength.

[0147] In some embodiments, the displacement prism assembly 590 includes a second displacement prism 591 and a third displacement prism 592. The third displacement prism 592 is located to the side of the second displacement prism 591. The second displacement prism 591 includes a third reflective surface 5191 and a fourth reflective surface 5192. The third reflective surface 5191 is located in the light-emitting direction of the first light outlet 581 and is configured to reflect the fourth wavelength optical signal output from the first light outlet 581 to the fourth reflective surface 5192. The fourth reflective surface 5192 is located in the input optical path of the second light receiving component 720, allowing the second light receiving component 720 to receive the fourth wavelength optical signal. The third displacement prism 592 includes a fifth reflective surface 5921 and a first refractive surface 5922. The first refractive surface 5922 is adjacent to the third reflective surface 5191. The fifth reflective surface 5921 is located in the light-emitting direction of the third light outlet 583 and is configured to reflect the sixth wavelength optical signal output from the third light outlet 583 to the first refractive surface 5922. The sixth wavelength optical signal is sequentially transmitted through the first refractive surface 5922 and the third reflective surface 5191 to be transmitted to the fourth reflective surface 5192 , and is reflected by the fourth reflective surface 5192 to be transmitted to the second light receiving component 720 .

[0148] In some embodiments, the first light receiving element 710 is located on the side of the third displacement prism 592. The fifth wavelength optical signal output by the second light outlet 582 passes through the third displacement prism 592 and is then transmitted to the first light receiving element 710. Of course, in some embodiments of the present disclosure, there is a gap between the second displacement prism 591 and the third displacement prism 592, and the fifth wavelength optical signal passes through this gap.

[0149] In some embodiments, the optical receiving signal transmitted to the first shell 510 is a composite light after wavelength division multiplexing of the fourth wavelength optical signal and the fifth wavelength optical signal; or, the optical receiving signal transmitted to the first shell 510 is a composite light after wavelength division multiplexing of the fifth wavelength optical signal and the sixth wavelength optical signal.

[0150] FIG13 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure. FIG13 shows a circuit diagram using a first light receiving component 710 and a second light receiving component 720 .

[0151] In some embodiments, a first limiting amplifier 330 and a second limiting amplifier 340 are provided on the circuit board 300. The input end of the first limiting amplifier 330 is connected to the output end of the first light receiving component 710, and the first limiting amplifier 330 amplifies or limits the voltage signal output by the first light receiving component 710. The input end of the second limiting amplifier 340 is connected to the output end of the second light receiving component 720, and the second limiting amplifier 340 amplifies or limits the voltage signal output by the second light receiving component 720.

[0152] In some embodiments, the first limiting amplifier 330 includes a second output channel 332 . The first limiting amplifier 330 amplifies or limits the second voltage signal output by the first light receiving component 710 and outputs it to the gold finger 310 through the second output channel 332 .

[0153] In some embodiments, the second limiting amplifier 340 may include a fourth output channel 341 and a fifth output channel 342 , wherein the fourth output channel 341 is used to output the first voltage signal processed by the second limiting amplifier 340 , and the fifth output channel 342 is used to output the third voltage signal processed by the second limiting amplifier 340 .

[0154] In some embodiments, the MCU 320 controls the connection to the second limiting amplifier 340. For example, at a fourth target time, the MCU 320 outputs a fourth control signal to the second limiting amplifier 340, causing the second limiting amplifier 340 to amplify or limit the first voltage signal and output the processed first voltage signal to the gold finger 310 via a fourth output channel 341. At a fifth target time, the MCU 320 outputs a fifth control signal to the second limiting amplifier 340, causing the second limiting amplifier 340 to amplify or limit the third voltage signal and output the processed third voltage signal to the gold finger 310 via a fifth output channel 342. The fifth and sixth target times can be cyclically updated.

[0155] In some embodiments, the second light receiving component 720 may include a second detector 721 and a second TIA 722. The signal output of the second detector 721 is connected to the signal input of the second TIA 722, which converts the current signal into a voltage signal. The MCU 320 controls the connection to the second TIA 722 and sends control signals to the second TIA 722 based on the timing settings, causing the second TIA 722 to convert the current signal into a voltage signal according to the corresponding configuration.

[0156] In some embodiments, the MCU 320 outputs a fourth configuration signal to the second TIA 722 at a fourth target time, causing the second TIA 722 to convert the first current signal output by the second detector 721 into a first voltage signal according to the fourth configuration. At a fifth target time, the MCU 320 outputs a fifth configuration signal to the second TIA 722, causing the second TIA 722 to convert the third current signal output by the second detector 721 into a third voltage signal according to the fifth configuration. The fourth and fifth configuration signals can be signals of different levels.

[0157] FIG14 is a circuit diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure, and FIG14 shows another circuit diagram using a first light receiving component 710 and a second light receiving component 720. In some embodiments, a first limiting amplifier 330, a second limiting amplifier 340, a third limiting amplifier 360, and a filter circuit 350 are provided on a circuit board 300.

[0158] The input end of the second limiting amplifier 340 is connected to the output end of the second light receiving component 720 via the filter circuit board 350. The input end of the third limiting amplifier 360 is connected to the output end of the second light receiving component 720 via the filter circuit board 350. For example, the third voltage signal output by the second light receiving component 720 is bypassed by the filter circuit 350 to the second limiting amplifier 340. The first voltage signal output by the second light receiving component 720 is transmitted to the third limiting amplifier 360 via the filter circuit 350. The third limiting amplifier 360 amplifies or limits the first voltage signal. The third voltage signal output by the second light receiving component 720 is transmitted to the second limiting amplifier 340 via the filter circuit 350. The second limiting amplifier 340 amplifies or limits the third voltage signal.

[0159] In some embodiments, the third limiting amplifier 360 includes a sixth output channel 361 connected to the gold finger 310. The second limiting amplifier 340 includes a fifth output channel 342 connected to the gold finger 310. The sixth output channel 361 is used to output the first voltage signal processed by the third limiting amplifier 360 to the gold finger 310, and the fifth output channel 342 is used to output the third voltage signal processed by the second limiting amplifier 340 to the gold finger 310.

[0160] In some embodiments, the filter circuit 350 includes a fifth capacitor 3561, a sixth capacitor 3562, a third inductor 3571, a fourth inductor 3572, a seventh capacitor 3581, and an eighth capacitor 3582. The fifth capacitor 3561, the sixth capacitor 3562, the third inductor 3571, and the fourth inductor 3572 are disposed between the second light receiving component 720 and the third limiting amplifier 360. The fifth capacitor 3561 is connected in series with the third inductor 3571, and the sixth capacitor 3562 is connected in series with the fourth inductor 3572. The seventh capacitor 3581 and the eighth capacitor 3582 are disposed between the second light receiving component 720 and the second limiting amplifier 340.

[0161] Figure 15 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure. Figure 15 shows the setting status of another device in the first shell 510 and the transmission optical path of the optical signal in the first shell 510; wherein, the solid arrow is the optical transmission signal, and the dotted arrow is the optical reception signal.

[0162] In some embodiments, the second light receiving component 720 is disposed on one side of the first light receiving component 710, and the third light receiving component 730 is disposed on the other side of the first light receiving component 710. Exemplarily, the first light receiving component 710, the second light receiving component 720, and the third light receiving component 730 are disposed side by side, and the input light path of the third light receiving component 730 and the input light path of the second light receiving component 720 are parallel to the input light path of the first light receiving component 710.

[0163] In some embodiments, the third displacement prism 592 includes a fifth reflective surface 5921 and a sixth reflective surface 5923. The fifth reflective surface 5921 is located in the light-emitting direction of the third light outlet 583 and is configured to reflect the sixth wavelength optical signal output from the third light outlet 583 toward the sixth reflective surface 5923. The sixth reflective surface 5923 is located in the input optical path of the third light receiving component 730 and reflects the sixth wavelength optical signal toward the third light receiving component 730.

[0164] In some embodiments, a gap is formed between the second displacement prism 591 and the third displacement prism 592 , and the input light path of the first light receiving component 710 passes through the gap. The fifth wavelength optical signal output by the second light output port 582 passes through the gap and is transmitted to the first light receiving component 710 .

[0165] In some embodiments, the optical receiving signal transmitted to the first housing 510 is a wavelength division multiplexed light signal of a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal.

[0166] FIG16 is a circuit diagram of the internal structure of an optical module according to some embodiments of the present disclosure. FIG16 shows a circuit diagram using a first light receiving component 710 , a second light receiving component 720 , and a third light receiving component 730 .

[0167] In some embodiments, a first limiting amplifier 330, a second limiting amplifier 340, and a third limiting amplifier 360 are provided on the circuit board 300. The input end of the first limiting amplifier 330 is connected to the output end of the first light receiving component 710, and the first limiting amplifier 330 amplifies or limits the voltage signal output by the first light receiving component 710. The input end of the second limiting amplifier 340 is connected to the output end of the second light receiving component 720, and the second limiting amplifier 340 amplifies or limits the voltage signal output by the second light receiving component 720. The input end of the third limiting amplifier 360 is connected to the output end of the third light receiving component 730, and the third limiting amplifier 360 amplifies or limits the voltage signal output by the third light receiving component 730.

[0168] In some embodiments, the first limiting amplifier 330 amplifies or limits the second voltage signal and outputs it to the gold finger 310, the second limiting amplifier 340 amplifies or limits the third voltage signal and outputs it to the gold finger 310, and the third limiting amplifier 360 amplifies or limits the first voltage signal and outputs it to the gold finger 310.

[0169] In some embodiments, the third light receiving component 730 may include a third detector 731 and a third TIA 732. The signal output terminal of the third detector 731 is connected to the signal input terminal of the third TIA 732, and the current signal of the third TIA 732 is converted into a voltage signal.

[0170] Figure 17 is a circuit diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. Figure 17 shows another circuit diagram using a first optical receiving component 710, a second optical receiving component 720, and a third optical receiving component 730. The second optical receiving component 730 receives a fourth wavelength optical signal, which may have a rate of 1G or 10G. When the rate of the fourth wavelength optical signal is 1G, the second optical receiving component 730 outputs a first voltage signal; when the rate of the fourth wavelength optical signal is 10G, the second optical receiving component 730 outputs a third voltage signal. The third optical receiving component 730 receives a sixth wavelength optical signal and outputs a first voltage signal.

[0171] In some embodiments, a switch 370 is provided on the circuit board 300. A first input of the switch 370 is connected to the second limiting amplifier 340, a second input of the switch 370 is connected to the third limiting amplifier 360, and an output of the switch 370 is connected to the gold finger 310. The switch 370 is used to connect the second limiting amplifier 340 to the gold finger 310, or to connect the third limiting amplifier 360 to the gold finger 310. The switch 370 can be a high-speed signal switch.

[0172] In some embodiments, MCU 320 controls the connection switch 370 and sends a switching signal to the switch 370. The switch 370 then switches in the corresponding direction based on the received switching signal. For example, MCU 320 may send a first switching signal and a second switching signal to the switch 370. When the switch 370 receives the first switching signal, the switch 370 switches on the second limiting amplifier 340 and the gold finger 310. When the switch 370 receives the second switching signal, the switch 370 switches on the third limiting amplifier 360 and the gold finger 310. MCU 320 may periodically send the first switching signal or the second switching signal to the switch 370 according to internal timing definitions. The first switching signal and the second switching signal may be high or low level signals.

[0173] In some embodiments, the second limiting amplifier 340 includes a fourth output channel 341 and a fifth output channel 342. The fourth output channel 341 is connected to the first input of the switch 370, and the fifth output channel 342 is connected to the gold finger 310. When the second limiting amplifier 340 outputs the processed first voltage signal, it is sequentially output to the gold finger 310 through the fourth output channel 341 and the switch 370. When the second limiting amplifier 340 outputs the processed third voltage signal, it is directly transmitted to the gold finger 310 through the fifth output channel 342.

[0174] In some embodiments, the signal feedback terminal of the second limiting amplifier 340 is connected to the MCU 320. When the second limiting amplifier 340 receives the first voltage signal, the second limiting amplifier 340 sends a first feedback signal to the MCU 320 through the signal feedback terminal. When the MCU 320 receives the first feedback signal, the MCU 320 sends a first switching signal to the switch 370.

[0175] In some embodiments, a signal feedback terminal of the third limiting amplifier 360 is connected to the MCU 320. When the third limiting amplifier 360 receives the first voltage signal, the signal feedback terminal of the third limiting amplifier 360 sends a second feedback signal to the MCU 320. When the MCU 320 receives the second feedback signal, the MCU 320 sends a second switching signal to the switch 370.

[0176] Figure 18 is a usage status diagram of a first shell provided according to some embodiments of the present disclosure. Figure 18 shows the device setting status of the third first shell 510 and the transmission optical path of the optical signal in the first shell 510; wherein, the solid arrow is the light transmission signal, and the dotted arrow is the light receiving signal.

[0177] In some embodiments, a fourth displacement prism 501 is disposed within the first housing 510 and is located in the input optical path of the optical transmission signal. The fourth displacement prism 501 is disposed along the width of the first housing 510 to adjust the optical transmission path of the optical transmission signal in this direction, thereby causing a translational shift in the optical transmission path. The fourth displacement prism 501 includes a seventh reflective surface and an eighth reflective surface. The optical transmission signal transmitted into the first housing 510 is incident on the seventh reflective surface, reflected from the seventh reflective surface, transmitted to the eighth emitting surface, and then reflected from the eighth emitting surface to the second reflector 550, ultimately passing through the second reflector 550.

[0178] In some embodiments, an isolator 502 may be provided on the first housing 510. The isolator 502 is embedded in a sidewall of the first housing 510 and is located on a side of the fourth displacement prism 501 away from the second reflector 550. The isolator 502 is used to isolate the optical signal reflected by the seventh reflective surface to prevent the optical signal from being transmitted to the optical emitting component 400.

[0179] In some embodiments, the isolator 502 may be disposed on or within the second housing 410 .

[0180] Figure 19 is an assembly diagram of an optical transceiver component and an optical fiber adapter provided according to some embodiments of the present disclosure. Figure 20 is an exploded view of an optical transceiver component and an optical fiber adapter provided according to some embodiments of the present disclosure. Figure 21 is a structural diagram of a first cavity provided according to some embodiments of the present disclosure. As shown in Figures 19, 20, and 21, in some embodiments, the optical receiving component 500 may include a first cavity. One end of the first cavity may be connected to the optical transmitting component 400. The other end of the first cavity may be connected to the optical fiber adapter 700 so that the first cavity can receive the received optical signal emitted by the optical fiber adapter 700. One end of the first cavity may be connected to the optical transmitting component 400, and the other end of the first cavity may be connected to one end of the optical fiber adapter 700 so that the transmitted optical signal emitted by the optical transmitting component 400 is first transmitted to the first cavity, then transmitted to the optical fiber adapter 700 through the first cavity, and finally output through the optical fiber adapter 700.

[0181] As shown in Figures 5, 6, and 7, in some embodiments, the optical receiving component 500 may include at least one receiving assembly. The at least one optical receiving assembly may be connected to the first cavity so that an externally input received optical signal (including optical signals of multiple wavelengths) is input into the first cavity through the optical fiber adapter 700 and then transmitted through the first cavity to the at least one optical receiving assembly. In some examples, the at least one optical receiving assembly may be the first optical receiving assembly described in detail in the aforementioned embodiments of the present disclosure.

[0182] In some embodiments, the at least one optical receiving component may include a first optical receiving component 520. The first optical receiving component 520 may receive a fourth wavelength optical signal, where the fourth wavelength optical signal has a wavelength range of 1284-1288 nm.

[0183] In some embodiments, the at least one optical receiving component may include a second optical receiving component 530. The second optical receiving component 530 may receive a fifth wavelength optical signal, where the fifth wavelength optical signal has a wavelength range of 1260-1280 nm.

[0184] In some embodiments, the at least one optical receiving component may include a third optical receiving component 540. The third optical receiving component 540 may receive a sixth wavelength optical signal, where the sixth wavelength optical signal has a wavelength range of 1290-1330 nm.

[0185] It should be noted here that the numerical values ​​and numerical ranges involved in some embodiments of the present disclosure are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors. Those skilled in the art may consider this part of the error to be negligible.

[0186] The at least one optical receiving component includes a first optical receiving component 520 , a second optical receiving component 530 , and a third optical receiving component 540 , so that the optical receiving unit 500 can receive optical signals of three wavelengths having different rates.

[0187] In some embodiments, the first optical receiving component 520, the second optical receiving component 530 and the third optical receiving component 540 all include a receiving tube cap and a receiving tube seat. The receiving tube cap is covered on the receiving tube seat to form a receiving cavity. A light receiving chip is arranged in the receiving cavity. The light receiving chip receives the optical signal and converts the optical signal into an electrical signal.

[0188] The receiver socket is also provided with a receiver pin, one end of which is connected to the circuit board 300 via a flexible circuit board, thereby electrically connecting the receiver pin and the circuit board 300. The receiver pin extends upward from the bottom of the receiver socket until it extends beyond the top of the receiver socket, where it is wired to the pad where the optical receiver chip is located, thereby electrically connecting the receiver pin and the optical receiver chip, thereby transmitting the electrical signal through the receiver pin to the circuit board 300.

[0189] In some embodiments, the receiving tube cap of the optical receiving assembly is provided with a second lens. The second lens is a converging lens that can converge the optical signal incident on the second lens and couple it to the optical receiving chip in the receiving cavity.

[0190] In some embodiments, the receiving rates of the optical receiving chip of the first optical receiving assembly 520, the receiving rates of the optical receiving chip of the second optical receiving assembly 530, and the receiving rates of the optical receiving chip of the third optical receiving assembly 540 may all be different. For example, the receiving rate of the optical receiving chip of the first optical receiving assembly 520 is greater than the receiving rate of the optical receiving chip of the second optical receiving assembly 530, and greater than the receiving rate of the optical receiving chip of the third optical receiving assembly 540. For example, the receiving rate of the optical receiving chip of the first optical receiving assembly 520 is 25G, the receiving rate of the optical receiving chip of the second optical receiving assembly 530 is 10G, and the receiving rate of the optical receiving chip of the third optical receiving assembly 540 is 2.5G.

[0191] In some embodiments, the first light receiving assembly 520 , the second light receiving assembly 530 , and the third light receiving assembly 540 are all located on the same sidewall of the first cavity.

[0192] In some embodiments, the first light receiving assembly 520 and the second light receiving assembly 530 may be located on one sidewall of the first cavity, and the third light receiving assembly 540 may be located on the other sidewall of the first cavity to reduce the length of the light receiving component 500 .

[0193] In some embodiments, the first cavity may include a first connection hole 5111. The first connection hole 5111 may be located at a first end of the first cavity. The first connection hole 5111 may be connected to the fiber optic adapter 700 to connect the fiber optic adapter 700 to the first cavity. For example, one end of a connecting sleeve 710 is inserted into the first connection hole 5111, and the other end of the connecting sleeve 710 is connected to the fiber optic adapter 700 to connect the fiber optic adapter 700 to the first cavity via the connecting sleeve 710.

[0194] In some embodiments, the first cavity may include a second connection hole 5131. The second connection hole 5131 may be located at the second end of the first cavity. The second connection hole 5131 may be connected to the light emitting component 400 to connect the light emitting component 400 to the first cavity.

[0195] In some embodiments, the first connection hole 5111 and the second connection hole 5131 may be arranged opposite to each other.

[0196] In some embodiments, the first cavity may include a third connection hole 5122. The third connection hole 5122 may be used for inserting the first light receiving assembly 520 so as to connect the first light receiving assembly 520 to the first cavity.

[0197] In some embodiments, the first cavity may include a fourth connection hole 5121. The fourth connection hole 5121 may be used for inserting the second light receiving assembly 530 so as to connect the second light receiving assembly 530 to the first cavity.

[0198] In some embodiments, the first cavity may include a fifth connection hole 5141. The fifth connection hole 5141 may be used for inserting the third light receiving assembly 540 so as to connect the third light receiving assembly 540 to the first cavity.

[0199] In some embodiments, the third connection hole 5122 and the fourth connection hole 5121 can be located on one side wall of the first cavity, and the fifth connection hole 5141 can be located on the other side wall of the first cavity, so that the first light receiving component 520 and the second light receiving component 530 are located on one side wall of the first cavity, and the third light receiving component 540 is located on the other side wall of the first cavity, thereby reducing the length of the first cavity.

[0200] Figure 22 is an exploded view of a first cavity according to some embodiments of the present disclosure. Figure 23 is an exploded view of a first housing and a first optical assembly according to some embodiments of the present disclosure. As shown in Figures 22 and 23, in some embodiments, the first cavity may include a first housing 510.

[0201] In some embodiments, the first cavity may include a first cover plate 515. The first cover plate 515 may be attached to the first housing 510 to form the first cavity. A first optical assembly 517 may be disposed within the first cavity. The first optical assembly 517 may transmit a transmitted optical signal to the fiber optic adapter 700, or may split a received optical signal transmitted by the fiber optic adapter 700 to the first cavity and direct the split optical signal to a corresponding optical receiving assembly.

[0202] During the assembly process, the first optical component 517 is first fixed in the first housing 510 , and then the first cover 515 is covered on the first housing 510 to assemble the first optical component 517 into the first cavity.

[0203] Figure 24 is a cross-sectional view of a first housing according to some embodiments of the present disclosure. As shown in Figures 22, 23, and 24, in some embodiments, the first housing 510 is recessed inward to form a housing cavity 516, i.e., the inner cavity of the first cavity. The housing cavity 516 is connected to the first connection hole 5111, the second connection hole 5131, the third connection hole 5122, the fourth connection hole 5121, and the fifth connection hole 5141. The housing cavity 516 can accommodate other components of the first optical assembly 517, except for the first lens 5171.

[0204] In some embodiments, the first housing 510 may include a first sidewall 511. The first sidewall 511 may have a first connection hole 5111. The first connection hole 5111 may traverse the first sidewall 511 so that the first connection hole 5111 can communicate with the inner cavity of the first cavity, thereby allowing optical signals to be transmitted along the first connection hole 5111 inside and outside the first cavity.

[0205] In some embodiments, the first housing 510 may include a second sidewall 512. One end of the second sidewall 512 may be connected to one end of the first sidewall 511.

[0206] In some embodiments, the second sidewall 512 may have a third connection hole 5122. The third connection hole 5122 may traverse the second sidewall 512 so that the third connection hole 5122 can communicate with the inner cavity of the first cavity, thereby allowing the optical signal of the inner cavity of the first cavity to be incident on the optical receiving component connected to the third connection hole 5122.

[0207] In some embodiments, the second sidewall 512 may have a fourth connection hole 5121. The fourth connection hole 5121 may traverse the second sidewall 512 so that the fourth connection hole 5121 can communicate with the inner cavity of the first cavity, thereby allowing the optical signal of the inner cavity of the first cavity to be incident on the optical receiving component connected to the fourth connection hole 5121.

[0208] In some embodiments, the first housing 510 may include a third sidewall 513. One end of the third sidewall 513 may be connected to the other end of the second sidewall 512. The third sidewall 513 may be disposed opposite the first sidewall 511. The third sidewall 513 may have a second connection hole 5131. The second connection hole 5131 may extend through the third sidewall 513 so as to communicate with the inner cavity of the first cavity, thereby allowing the transmitted optical signal emitted by the optical emitting component 400 to enter the first cavity through the second connection hole 5131.

[0209] In some embodiments, the first housing 510 may include a fourth sidewall 514. One end of the fourth sidewall 514 may be connected to one end of the third sidewall 513. The other end of the fourth sidewall 514 may be connected to the other end of the first sidewall 511. The fourth sidewall 514 may be disposed opposite the second sidewall 512.

[0210] In some embodiments, the fourth sidewall 514 may have a fifth connection hole 5141. The fifth connection hole 5141 may traverse the fourth sidewall 514 so that the fifth connection hole 5141 can communicate with the inner cavity of the first cavity, thereby allowing the optical signal of the inner cavity of the first cavity to be incident on the optical receiving component connected to the fifth connection hole 5141.

[0211] In some embodiments, the first housing 510 may include a bottom plate 5161. The bottom plate 5161 may be used to support the first optical assembly 517. The bottom plate 5161 may be connected to the bottoms of the first side wall 511, the second side wall 512, the third side wall 513, and the fourth side wall 514, respectively. The first side wall 511, the second side wall 512, the third side wall 513, and the fourth side wall 514 are connected in sequence and are respectively connected to the bottom plate 5161 to form the first housing 510 with an opening at the top.

[0212] In some embodiments, the third sidewall 513 may include a first connecting wall 5132 . One end of the first connecting wall 5132 may be connected to the second sidewall 512 .

[0213] In some embodiments, the third sidewall 513 may include a first supporting wall 5133. The first supporting wall 5133 is closer to the first sidewall 511 than the first connecting wall 5132. The first supporting wall 5133 may be connected to the first connecting wall 5132. The first supporting wall 5133 is more recessed than the first connecting wall 5132 so that the first supporting wall 5133 supports the first cover plate 515.

[0214] In some embodiments, the fourth sidewall 514 may include a second connecting wall 5143. One end of the second connecting wall 5143 may be connected to the first connecting wall 5132. The other end of the second connecting wall 5143 may be connected to the first sidewall 511.

[0215] In some embodiments, the fourth sidewall 514 may include a second support wall 5144. One end of the second support wall 5144 may be connected to the first support wall 5133. The other end of the second support wall 5144 may be connected to the first sidewall 511. The second support wall 5144 may be connected to the second connecting wall 5143. The second support wall 5144 is more recessed than the second connecting wall 5143 so that the second support wall 5144 supports the first cover plate 515.

[0216] The first support wall 5133 and the second support wall 5144 can jointly support the first cover plate 515 to increase the contact area between the first cover plate 515 and the first shell 510 and improve the connection stability between the first cover plate 515 and the first shell 510 .

[0217] In some embodiments, the second supporting wall 5144 may include a first supporting portion 51441 . One end of the first supporting portion 51441 may be connected to the first supporting wall 5133 .

[0218] The diameter of the fifth connection hole 5141 is equal to the thickness of the second connection wall 5143. The second support wall 5144 protrudes relative to the second connection wall 5143, resulting in the diameter of the fifth connection hole 5141 being greater than the thickness of the second support wall 5144. Therefore, the first support portion 51441 may have an avoidance hole 5147. The avoidance hole 5147 may communicate with the fifth connection hole 5141 to avoid the fifth connection hole 5141.

[0219] In some embodiments, the second support wall 5144 may include a second support portion 51444. One end of the second support portion 51444 may be connected to the other end of the first support portion 51441. The width of the second support portion 51444 is smaller than the width of the first support portion 51441. That is, the vertical distance between the second support portion 51444 and the second sidewall 512 is greater than the vertical distance between the first support portion 51441 and the second sidewall 512, thereby providing space for accommodating the first optical assembly 517.

[0220] In some embodiments, the second supporting wall 5144 may include a third supporting portion 51445. One end of the third supporting portion 51445 may be connected to the other end of the second supporting portion 51444. The other end of the third supporting portion 51445 may be connected to the first sidewall 511.

[0221] In some embodiments, the second support wall 5144 may include a support member 51442. One end of the support member 51442 may be connected to a side surface of the first support portion 51441. The other end of the support member 51442 is not connected to the second sidewall 512 to avoid the first optical assembly 517. One side of the support member 51442 may not be connected to the third sidewall 513. The other side of the support member 51442 may not be connected to the first sidewall 511.

[0222] In some embodiments, the support member 51442 may have a first light hole 51443. The first light hole 51443 may penetrate the support member 51442, so that the optical signal can pass through the first light hole 514443.

[0223] The support member 51442 and the second support wall 5144 can be an integrally formed structure or two independent structural members.

[0224] In some embodiments, the first light-through hole 51443 may be arranged corresponding to the first connection hole 5111 , so that the optical signal passes through the first light-through hole 51443 and is incident on the first connection hole 5111 .

[0225] In some embodiments, the central axis of the first connection hole 5111 (as shown in FIG. 23 e ) is closer to the fourth side wall 514 than the central axis of the first side wall 511 (as shown in FIG. 23 f ).

[0226] In some embodiments, the fourth sidewall 514 may have a step 5142. The step 5142 may provide sufficient space for the connecting sleeve 710 to increase the contact area between the connecting sleeve 710 and the first sidewall 511, thereby improving the connection stability between the connecting sleeve 710 and the first sidewall 511.

[0227] One side of the step 5142 (the left side as shown in FIG. 23 ) is more recessed than the other side of the step 5142 (the right side as shown in FIG. 23 ). One side of the step 5142 has a fifth connection hole 5141, and a light receiving assembly can be disposed in the fifth connection hole 5141. The step 5142 can provide space for accommodating the light receiving assembly in the fifth connection hole 5141, thereby reducing the width of the light receiving component 500.

[0228] Figure 25 is an optical path diagram of a first optical assembly according to some embodiments of the present disclosure. Figure 26 is an optical path diagram of another first optical assembly according to some embodiments of the present disclosure. As shown in Figures 25 and 26, in some embodiments, the first optical assembly 517 may include a first lens 5171. The first lens 5171 is used to collimate / focus optical signals. For example, the received optical signals transmitted from the first cavity to the fiber optic adapter 700 are focused by the first lens 5171, and the optical signals transmitted from the fiber optic adapter 700 to the first cavity are collimated by the first lens 5171.

[0229] In some embodiments, the first optical assembly 517 may include a first filter 5173. The first filter 5173 may be located on one side of the first lens 5171, so that the first filter 5173 can reflect the received optical signal collimated by the first lens 5171.

[0230] The first filter 5173 can receive the emission light signal and transmit the emission light signal to the first lens 5171 .

[0231] In some embodiments, the first filter 5173 is tilted so that the received light signal can be reflected. For example, the tilt angle of the first filter 5173 is a first preset angle. The first preset angle can be 8° to 13°.

[0232] In some examples, the first preset angle may be 8° to 11°.

[0233] In some examples, the first preset angle may be 10° to 13°.

[0234] In some examples, the first preset angle may be 10° to 11°.

[0235] In some embodiments, the first optical assembly 517 may include a first reflector 5174. The first reflector 5174 may reflect the received optical signal. The first reflector 5174 may be located in the reflective optical path of the first optical filter 5173, thereby reflecting the received optical signal reflected by the first optical filter 5173 to the first reflector 5174.

[0236] In some embodiments, the first reflective sheet 5174 is tilted. For example, the tilt angle of the first reflective sheet 5174 is a second preset angle, which may be 32° to 37°.

[0237] In some examples, the second preset angle may be 32° to 35°.

[0238] In some examples, the second preset angle may be 34° to 37°.

[0239] In some examples, the second preset angle may be 34° to 35°.

[0240] As shown in Figures 25 and 26, in some embodiments, the first optical assembly 517 may include a second reflector 5175. The second reflector 5175 may reflect an optical signal incident on the second reflector 5175. The second reflector 5175 may be located on a reflective optical path of the first reflector 5174 to reflect the received optical signal reflected by the first reflector 5174 to the second reflector 5175.

[0241] In some embodiments, the second reflective sheet 5175 is tilted. For example, the tilt angle of the second reflective sheet 5175 is a third preset angle, which may be 45°.

[0242] The first preset angle, the second preset angle, and the third preset angle cooperate with each other so that the received light signal reflected by the second reflective plate 5175 can be emitted in parallel along the length direction of the light receiving component 500 .

[0243] As shown in Figures 25 and 26, in some embodiments, the first optical component 517 may include a wavelength splitting component 5172. The wavelength splitting component 5172 may be located in the reflected light path of the second reflector 5175, so that the wavelength splitting component 5172 can receive the received optical signal reflected by the second reflector 5175. The wavelength splitting component 5172 can split the received optical signal according to wavelength. For example, the wavelength splitting component 5172 splits a received optical signal including a fourth wavelength, a fifth wavelength, and a sixth wavelength into a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal according to wavelength.

[0244] In some embodiments, the first end of the wave splitter assembly 5172 has a light input, and the received optical signal including the fourth wavelength, the fifth wavelength and the sixth wavelength transmitted by the optical fiber adapter 700 is incident on the light input of the first end of the wave splitter assembly 5172 and is reflected by the second end of the wave splitter assembly 5172.

[0245] In some embodiments, the first end of the wave splitter component 5172 has a first light output, and the second end of the wave splitter component 5172 has a second light output and a third light output. The received optical signal is divided into a fourth wavelength optical signal, a fifth wavelength optical signal and a sixth wavelength optical signal by the wave splitter component 5172. The fourth wavelength optical signal is emitted through the first light output of the first end of the wave splitter component 5172, the fifth wavelength optical signal is emitted through the second light output of the second end of the wave splitter component 5172, and the sixth wavelength optical signal is emitted through the third light output of the second end of the wave splitter component 5172, so that the output direction of the optical signal transmitted through the first light output is opposite to the output direction of the optical signal transmitted through the second light output or the optical signal transmitted through the third light output, thereby improving the isolation.

[0246] As shown in Figures 22, 25 and 26, the first end of the wave splitting component 5172 can be set corresponding to the first end of the first shell 510, and the second end of the wave splitting component 5172 can be set corresponding to the second end of the first shell 510, so that the wave splitting component 5172 can be set along the length direction of the first shell 510.

[0247] The wave splitter assembly 5172 can be positioned along the length of the optical receiving component 500, that is, along the length of the first housing 510, thereby reducing the width of the first housing 510 and, in turn, the width of the optical receiving component 500. When the wave splitter assembly 5172 is positioned along the length of the first housing 510, the width of the first housing 510 required to accommodate the wave splitter assembly 5172 can be reduced to meet the requirement. Because the optical receiving component's receiving pins are relatively short, reducing the width of the first housing 510 also reduces the width of the optical receiving component 500.

[0248] In some embodiments, the first end of the wave splitter assembly 5172 and the second end of the wave splitter assembly 5172 are arranged in parallel so that the transmitted optical signal incident to the second end of the wave splitter assembly 5172 and the transmitted optical signal emitted through the first end of the wave splitter assembly 5172 are parallel to each other.

[0249] In some embodiments, the tilt angle of the first end of the wave splitting assembly 5172 is within a first preset range, such that a received optical signal including the fourth wavelength, the fifth wavelength, and the sixth wavelength incident on the wave splitting assembly 5172 can be split into a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal by the wave splitting assembly 5172. For example, the first preset range is 8°±1°.

[0250] FIG27 is a structural diagram of a wave splitter assembly provided according to some embodiments of the present disclosure. As shown in FIG22 , FIG25 , and FIG27 , in some embodiments, the wave splitter assembly 5172 may include a substrate 51721 . The substrate 51721 is a block substrate. The first end surface of the substrate 51721 is disposed corresponding to the first end of the light receiving component 500 , and the second end surface of the substrate 51721 is disposed corresponding to the second end of the light receiving component 500 , such that the substrate 51721 is disposed along the length of the light receiving component 500 . The first end surface of the substrate 51721 may face the first connection hole 5111 . The second end surface of the substrate 51721 may face the second connection hole 5131 .

[0251] The first end surface of the substrate 51721 and the second end surface of the substrate 51721 are arranged in parallel, so that the optical signal incident on the substrate 51721 and the optical signal emitted through the substrate 51721 are parallel to each other.

[0252] The first end surface of the substrate 51721 may face the first connection hole 5111 , and the second end surface of the substrate 51721 may face the second connection hole 5131 , so that the substrate 51721 may be disposed along the length direction of the first shell 510 .

[0253] As shown in Figures 22, 25, and 27, in some embodiments, the wave splitting assembly 5172 may include a light entrance a. The light entrance a may be located at the first end surface of the substrate 51721. The light entrance a may be located on the reflected light path of the second reflector 5175, so that the light entrance a can receive the received optical signal reflected by the second reflector 5175.

[0254] In some embodiments, the light entrance point a may be a wave plate provided on the area of ​​the first end surface of the substrate 51721 corresponding to the second reflector 5175. The wave plate allows the received light signal to pass through.

[0255] In some embodiments, the light entrance point a may be an anti-reflection film coated on an area of ​​the first end surface of the substrate 51721 corresponding to the second reflector 5175. The anti-reflection film has a function of allowing the received light signal to pass through.

[0256] A side wall of the substrate 51721 close to the light entrance a rests on the second side wall 512 , and a gap exists between a side wall of the substrate 51721 away from the light entrance a and the fourth side wall 514 , so that the emitted light signal is transmitted through the gap between the substrate 51721 and the fourth side wall 514 .

[0257] The vertical distance between the side wall of the substrate 51721 away from the light incident point a and the second side wall 512 is smaller than the vertical distance between the first light hole 51443 and the second side wall 512 to prevent the emitted light signal from passing through the substrate 51721 .

[0258] As shown in Figures 22, 25, and 27, in some embodiments, the wave splitting assembly 5172 may include a first reflection portion b. The first reflection portion b may be located at the second end surface of the substrate 51721. The first reflection portion b may be disposed opposite the light incident portion a so that the first reflection portion b can reflect the received optical signal incident through the light incident portion a.

[0259] In some embodiments, the first reflection point b may be a wave plate provided on a region of the second end surface of the substrate 51721 that is opposite to the light incident point a. The wave plate does not allow the received light signal to pass through but allows the received light signal to be reflected.

[0260] In some embodiments, the first reflection point b may be a high-reflection film coated on an area of ​​the second end surface of the substrate 51721 opposite to the light incident point a. The high-reflection film does not allow the received light signal to pass through, but allows the received light signal to be reflected.

[0261] As shown in Figures 22, 25, and 27, in some embodiments, the wave splitting assembly 5172 may include a first wave plate 51722. The first wave plate 51722 may be disposed on the first end surface of the substrate 51721. The first wave plate 51722 may be disposed adjacent to the light entrance a. The first wave plate 51722 may be connected to the light entrance a to reduce the size of the first end of the wave splitting assembly 5172. The first wave plate 51722 may be located in the reflected light path of the first reflection point b, so that the received light signal reflected by the first reflection point b can be incident on the first wave plate 51722.

[0262] In some embodiments, the first wave plate 51722 may be a bandpass filter that allows signals within a certain frequency range to pass through while blocking signals of other frequencies. For example, the first wave plate 51722 may allow a fourth wavelength optical signal to pass through while allowing other wavelength optical signals to reflect.

[0263] The first wave plate 51722 serves as the first light output point of the wave splitting assembly 5172 , so that the fourth wavelength optical signal in the wave splitting assembly 5172 is transmitted out through the first wave plate 51722 .

[0264] As shown in Figures 22, 25, and 27, in some embodiments, the wave splitting assembly 5172 may include a second wave plate 51723. The second wave plate 51723 may be disposed on the second end surface of the substrate 51721. The second wave plate 51723 may be disposed adjacent to the first reflection point b. The second wave plate 51723 may be located on the reflected light path of the first wave plate 51722 so that the received light signal reflected by the first wave plate 51722 can be incident on the second wave plate 51723.

[0265] In some embodiments, the second wave plate 51723 can be a bandpass filter that allows signals within a certain frequency range to pass through and blocks signals of other frequencies from passing through. For example, the second wave plate 51723 can allow a fifth wavelength optical signal to pass through and can also allow other wavelength optical signals to reflect.

[0266] The second wave plate 51723 serves as the second light output port of the wave splitting assembly 5172 , so that the fifth wavelength optical signal in the wave splitting assembly 5172 is transmitted out through the second wave plate 51723 .

[0267] In some embodiments, the wave splitting assembly 5172 may include a second reflection point c. The second reflection point c may be disposed adjacent to the first wave plate 51722, such that the first wave plate 51722 is located between the light incident point a and the second reflection point c. The second reflection point c may be located on the reflected light path of the second wave plate 51723, such that the second reflection point c can reflect the received light signal reflected by the second wave plate 51723.

[0268] In some embodiments, the second reflection location c may be a region of the first end surface of the substrate 51721 adjacent to the first wave plate 51722 where a wave plate is provided, which does not allow the received light signal to pass through but allows the received light signal to be reflected.

[0269] In some embodiments, the second reflection point c may be a high-reflection film coated on an area of ​​the first end surface of the substrate 51721 adjacent to the first wave plate 51722. The high-reflection film does not allow the received light signal to pass through but allows the received light signal to be reflected.

[0270] In some embodiments, the wave splitting assembly 5172 may include a third wave plate 51724. The third wave plate 51724 is disposed on the second end surface of the substrate 51721. The third wave plate 51724 may be disposed adjacent to the second wave plate 51723. The third wave plate 51724 may be located on the reflected light path of the second reflection point c, so that the received light signal reflected by the second reflection point c can be incident on the third wave plate 51724.

[0271] In some embodiments, the third wave plate 51724 can be a bandpass filter that allows signals within a certain frequency range to pass through and blocks signals of other frequencies from passing through. For example, the third wave plate 51724 can allow a sixth wavelength optical signal to pass through and can also allow other wavelength optical signals to reflect.

[0272] The third wave plate 51724 serves as the third light output point of the wave splitting assembly 5172 , so that the sixth wavelength optical signal in the wave splitting assembly 5172 is transmitted out through the third wave plate 51724 .

[0273] In some embodiments, the second wave plate 51723 and the third wave plate 51724 can be connected to reduce the size of the second end surface of the substrate 51721.

[0274] FIG28 is a cross-sectional view of an optical transceiver component according to some embodiments of the present disclosure. As shown in FIG24 and FIG28 , in some embodiments, a first lens 5171 may be disposed in the first connection hole 5111 to reduce the length of the first housing 510 .

[0275] In some embodiments, the first lens 5171 can be disposed in the accommodating cavity 516 .

[0276] In some embodiments, an isolator 518 may be disposed in the second connection hole 5131. The isolator 518 may allow the optical transmission signal emitted by the optical transmission component 400 to enter the optical reception component 500, while preventing the optical transmission signal entering the optical reception component 500 from returning to the optical transmission component 400.

[0277] In some embodiments, a first light receiving assembly 520 may be disposed in the third connection hole 5122 .

[0278] In some embodiments, a second light receiving assembly 530 may be disposed in the fourth connection hole 5121 .

[0279] In some embodiments, a third light receiving assembly 540 may be disposed in the fifth connection hole 5141 .

[0280] In some embodiments, the first optical assembly 517 may include a third reflector 5176. The third reflector 5176 may be located in the transmission light path of the first wave plate 51722, so that the third reflector 5176 can receive the fourth wavelength optical signal transmitted by the first wave plate 51722. The third reflector 5176 can reflect the received fourth wavelength optical signal. The third connection hole 5122 may be located in the reflection light path of the third reflector 5176, so that the first light receiving assembly 520 in the third connection hole 5122 can be located in the reflection light path of the third reflector 5176, thereby allowing the third reflector 5176 to reflect the fourth wavelength optical signal to the first light receiving assembly 520.

[0281] In some embodiments, the third reflector 5176 may include a reflective surface. The reflective surface may be located in the transmission light path of the first wave plate 51722, and the first light receiving assembly 520 may be located in the reflection light path of the reflective surface, so that the fourth wavelength optical signal transmitted through the first wave plate 51722 is reflected by the reflective surface to the first light receiving assembly 520.

[0282] In some embodiments, the inclination angle of the reflective surface of the third reflector 5176 is not 45°, so that the fourth wavelength optical signal is reflected by the reflective surface of the third reflector 5176 and then obliquely incident to the first optical receiving component 520, thereby reducing the fourth wavelength optical signal returning along the original path when it reaches the first optical receiving component 520.

[0283] In some embodiments, the third reflective plate 5176 may include an incident surface. The incident surface may be located between the first wave plate 51722 and the reflective surface. One end of the incident surface may be connected to one end of the reflective surface.

[0284] In some embodiments, the third reflective sheet 5176 may include an exit surface. The exit surface may be located between the reflective surface and the first light receiving assembly 520. One end of the exit surface may be connected to the other end of the reflective surface. The other end of the exit surface may be connected to the other end of the incident surface.

[0285] In some embodiments, a filter film is coated on the incident surface or the exit surface of the third reflector 5176 to filter out received optical signals of wavelengths other than the first wavelength, so that the fourth wavelength optical signal can be incident on the first optical receiving component 520 and prevent the fifth wavelength optical signal and the sixth wavelength optical signal from being incident on the first optical receiving component 520.

[0286] Alternatively, in some embodiments, a filter may be provided between the third reflector 5176 and the first wave plate 51722 or between the third reflector 5176 and the first optical receiving component 520 to filter out received optical signals of wavelengths other than the first wavelength.

[0287] The incident surface or the exit surface of the third reflector 5176 is coated with a filter film. Compared with the provision of a filter, the space occupied by the first optical component can be effectively reduced, thereby reducing the space of the first housing.

[0288] The first filter 5173 and the first reflector 5174 are both located in the opposite direction of the reflected light path of the third reflector 5176 , and the first light receiving assembly 520 is located on the reflected light path of the third reflector 5176 to reduce the size of the light receiving component 500 .

[0289] In some embodiments, the first optical assembly 517 may include a beam splitter prism 5177. The beam splitter prism 5177 may include a first reflective surface 51771. The first reflective surface 51771 may be located in the transmission light path of the second wave plate 51723, so that the first reflective surface 51771 can receive the fifth wavelength optical signal transmitted by the second wave plate 51723. The fourth connection hole 5121 may be located in the reflection light path of the first reflective surface 51771, so that the second optical receiving assembly 530 in the fourth connection hole 5121 can be located in the reflection light path of the first reflective surface 51771, thereby allowing the first reflective surface 51771 to reflect the fifth wavelength optical signal to the second optical receiving assembly 530.

[0290] In some embodiments, the beam splitter 5177 may include a second reflective surface 51772. The second reflective surface 51772 may be located on the transmission light path of the third wave plate 51724, so that the second reflective surface 51772 can receive the sixth wavelength optical signal transmitted by the third wave plate 51724. The fifth connection hole 5141 may be located on the reflection light path of the second reflective surface 51772, so that the third optical receiving assembly 540 in the fifth connection hole 5141 can be located on the reflection light path of the second reflective surface 51772, thereby allowing the second reflective surface 51772 to reflect the sixth wavelength optical signal to the third optical receiving assembly 540.

[0291] The first reflecting surface 51771 of the beam splitter prism 5177 and the second reflecting surface 51772 of the beam splitter prism 5177 may be connected or not connected.

[0292] In some embodiments, the beam splitter prism 5177 may include a first incident surface. The first incident surface may be located between the first reflective surface 51771 and the second wave plate 51723. One end of the first incident surface may be connected to one end of the first reflective surface 51771.

[0293] In some embodiments, the beam splitter 5177 may include a first exit surface. The first exit surface may be located between the first reflective surface and the second light receiving assembly 530. One end of the first exit surface may be connected to the other end of the first reflective surface 51771. The other end of the first exit surface may be connected to the other end of the first incident surface.

[0294] In some embodiments, a filter film is coated on the first incident surface or the first exit surface to filter out received optical signals of wavelengths other than the second wavelength, so that the fifth wavelength optical signal can be incident on the second optical receiving component 530 and prevent the fourth wavelength optical signal and the sixth wavelength optical signal from being incident on the second optical receiving component 530.

[0295] Alternatively, in some embodiments, a filter may be provided between the beam splitter prism 5177 and the second wave plate 51723 or between the beam splitter prism 5177 and the second light receiving assembly 530 to filter out received light signals of wavelengths other than the second wavelength. As shown in FIG12 , a second filter 5179 is provided between the beam splitter prism 5177 and the second wave plate 51723. The second filter 5179 may filter out received light signals of wavelengths other than the second wavelength.

[0296] In some embodiments, the beam splitter prism 5177 may include a second incident surface. The second incident surface may be located between the second reflective surface 51772 and the second wave plate 51723. One end of the second incident surface may be connected to one end of the second reflective surface 51772.

[0297] In some embodiments, the beam splitter prism 5177 may include a second exit surface. The second exit surface may be located between the second reflective surface 51772 and the third light receiving assembly 540. One end of the second exit surface may be connected to the other end of the second reflective surface 51772. The other end of the second exit surface may be connected to the other end of the second incident surface.

[0298] In some embodiments, a filter film is coated on the second incident surface or the second exit surface to filter out received optical signals of wavelengths other than the third wavelength, so that the sixth wavelength optical signal can be incident on the third optical receiving component 540, and the fifth wavelength optical signal and the sixth wavelength optical signal are prevented from being incident on the third optical receiving component 540.

[0299] Alternatively, in some embodiments, a filter may be provided between the beam splitter 5177 and the third wave plate 51724, or between the beam splitter 5177 and the third light receiving assembly 540, to filter out received light signals having wavelengths other than the third wavelength. As shown in FIG11 , a third filter 5178 is provided between the beam splitter 5177 and the third wave plate 51724. The third filter 5178 may filter out received light signals having wavelengths other than the third wavelength.

[0300] As shown in Figures 24 and 28, a first filter 5173 may be provided on a surface of the support member 51442 facing the first sidewall 511. The transmitted light signal is transmitted through the first light hole 51443 of the support member 51442 to the first filter 5173, and then transmitted through the first filter 5173 to the first lens 5171. The received light signal is collimated by the first lens 5171, then incident on the first filter 5173, and then reflected by the first filter 5173.

[0301] Since the first filter 5173 is set at an angle, the transmitted light signal is incident on the first filter 5173 at an angle, and the transmitted light signal is refracted at both the light incident surface and the light exit surface of the first filter 5173, causing the central axis of the transmitted light signal at the light incident surface and the light exit surface of the first filter 5173 to be offset. Therefore, the central axis of the first connecting hole 5111 is offset relative to the central axis of the first light-transmitting hole 51443.

[0302] Because the first optical filter 5173 is disposed at an angle, in order to increase the stability of the connection between the first optical filter 5173 and the support member 51442, in some embodiments, the surface of the support member 51442 facing the first sidewall 511 can be disposed parallel to the first optical filter 5173. That is, the angle of inclination of the surface of the support member 51442 facing the first sidewall 511 is equal to the angle of inclination of the first optical filter 5173. For example, the angle of inclination of the surface of the support member 51442 facing the first sidewall 511 is a first predetermined angle.

[0303] As shown in Figures 24 and 28, in some embodiments, a first reflector 5174 may be provided on a side of the third support portion 51445 facing the support member 51442. The side surface of the third support portion 51445 may be tilted so that the first reflector 5174 is located in the reflected light path of the first filter 5173.

[0304] Because the first reflective sheet 5174 is tilted, in order to increase the connection stability between the first reflective sheet 5174 and the third support portion 51445, in some embodiments, the side of the third support portion 51445 facing the support member 51442 can be arranged parallel to the first reflective sheet 5174. That is, the tilt angle of the side of the third support portion 51445 facing the support member 51442 is equal to the tilt angle of the first reflective sheet 5174. For example, the tilt angle of the side of the third support portion 51445 facing the support member 51442 is a second predetermined angle.

[0305] In some embodiments, the receiving rate of the first optical receiving component 520 is greater than the receiving rates of the second optical receiving component 530 and the third optical receiving component 540, resulting in the receiving photosensitive surface of the first optical receiving component 520 being smaller than the receiving photosensitive surfaces of the second optical receiving component 530 and the third optical receiving component 540, so that the transmission path of the fourth wavelength optical signal received by the first optical receiving component 520 is the shortest, and the optical receiving chip of the first optical receiving component 520 can receive the fourth wavelength optical signal with high coupling efficiency.

[0306] As shown in Figures 25, 26, and 28, the optical paths are as follows:

[0307] The transmitted optical signal is transmitted through the first filter 5173 and then focused by the first lens 5171 and coupled to the optical fiber adapter 700 .

[0308] The received optical signal is first collimated by the first lens 5171, then sequentially reflected by the first filter 5173, the first reflector 5174, and the second reflector 5175 before entering the light entrance point a of the wave splitter 5172. It is then reflected again by the first reflector b. The fourth wavelength signal in the received optical signal is transmitted through the first wave plate 51722 and finally reflected by the third reflector 5176.

[0309] The fifth wavelength optical signal in the received optical signal is reflected by the first wave plate 51722 , transmitted through the second wave plate 51723 , and then reflected by the first reflection surface 51771 of the beam splitter prism 5177 .

[0310] The fifth wavelength optical signal in the received optical signal is reflected by the first wave plate 51722 , the second wave plate 51723 and the second reflection point c in sequence, then transmitted through the third wave plate 51724 and then reflected by the second reflection surface 51772 of the beam splitter 5177 .

[0311] Figure 29 is an exploded view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure. As shown in Figure 29, in some embodiments, the circuit board 300 includes a first circuit board 301 and a second circuit board 302. The first circuit board 301 is a rigid circuit board, and the second circuit board 302 is a flexible circuit board. The optical emitting component 400 and the optical receiving component 500 are both electrically connected to the first circuit board 301 via the second circuit board 302.

[0312] One end of the optical receiving component 500 is connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 is connected to the optical transmitting component 400. The optical signal generated by the optical transmitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700. The external input optical signal is input to the optical receiving component 500 through the optical fiber adapter 700, so that the optical receiving component 500 and the optical transmitting component 400 share the optical fiber adapter 700. In addition, the uplink optical signal and the downlink optical signal of the optical module share the optical fiber 101.

[0313] In some embodiments, the optical transmitting component 400 can generate optical signals of multiple wavelengths, and the optical signals of multiple wavelengths can be combined into a single optical signal. The optical receiving component 500 can receive optical signals including multiple wavelengths. For example, the optical transmitting component 400 generates optical signals of three wavelengths, and the optical receiving component 500 receives optical signals of three wavelengths.

[0314] FIG30 is an exploded view of an optical transceiver assembly according to some embodiments of the present disclosure. As shown in FIG30 , the optical receiving assembly 500 includes a transceiver cavity 510 and multiple optical receiving assemblies, each of which is connected to the transceiver cavity 510. For example, the multiple optical receiving assemblies include a first optical receiving assembly 520, a second optical receiving assembly 530, and a third optical receiving assembly 540.

[0315] In some embodiments, the optical emitting component 400 utilizes a micro-optical package, and the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 utilize a coaxial package. Exemplarily, the receiving optical axes of the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 are parallel to each other. That is, the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 each include a receiving tube cap and a receiving tube socket. The receiving tube cap is mounted on the receiving tube socket to form a receiving cavity. A light receiving chip is disposed within the receiving cavity. The light receiving chip receives optical signals and converts them into electrical signals.

[0316] The receiver socket is also provided with a receiver pin, one end of which is connected to the first circuit board 301 via the second circuit board 302, thereby electrically connecting the receiver pin and the first circuit board 301. The receiver pin extends upward from the bottom of the receiver socket until it extends beyond the top of the receiver socket, where it is wired to the pad where the optical receiver chip is located, thereby electrically connecting the receiver pin and the optical receiver chip, thereby transmitting the electrical signal to the first circuit board 301 through the receiver pin.

[0317] In some embodiments, the optical module 200 is configured to receive a beam of optical signals including three wavelength ranges and to transmit a beam of optical signals including three wavelength ranges. For example, the optical transmitting component 400 is configured to output a beam of optical signals including a first wavelength, a second wavelength, and a third wavelength, the first optical receiving component 520 is configured to receive an optical signal at a fourth wavelength, the second optical receiving component 530 is configured to receive an optical signal at a fifth wavelength, and the third optical receiving component 540 is configured to receive an optical signal at a sixth wavelength.

[0318] In some embodiments, the first side of the transceiver cavity 510 is connected to the fiber optic adapter 700, the second side of the transceiver cavity 510 is provided with the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540, and the third side of the transceiver cavity 510 is provided with the light emitting component 400. For example, the first side of the transceiver cavity 510 is adjacent to the optical port of the optical module, the second side of the transceiver cavity 510 is adjacent to the lower side plate 2022 of the lower housing 202, and the third side of the transceiver cavity 510 is adjacent to the electrical port of the optical module.

[0319] In some embodiments, a first connection hole is provided on the first side of the transceiver cavity 510, a second connection hole is provided on the second side of the transceiver cavity 510, a third connection hole is provided on the fourth side of the transceiver cavity 510, and a fifth connection hole is provided on the third side of the transceiver cavity 510. The first connection hole, the second connection hole, the third connection hole, the fourth connection hole, and the fifth connection hole are respectively connected to the inner cavity of the transceiver cavity 510. The other end of the fiber optic adapter 700 is connected to the first connection hole; the first light receiving assembly 520 is connected to the second connection hole, the second light receiving assembly 530 is connected to the third connection hole, the third light receiving assembly 540 is connected to the fourth connection hole, and the light emitting component 400 is connected to the fifth connection hole. For example, the second connection hole, the third connection hole, and the fourth connection hole are arranged in sequence on the second side of the transceiver cavity 510.

[0320] Figure 31 is a structural diagram of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure. Figure 32 is an exploded view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure. Figure 33 is a cross-sectional view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure. As shown in Figures 31, 32, and 33, in some embodiments, a fiber optic adapter 700 is disposed on a first side of a transceiver cavity 510. One end of the fiber optic adapter 700 is used to connect to an optical fiber, and the other end of the fiber optic adapter 700 communicates with the transceiver cavity 510, enabling optical connection of the transceiver cavity 510 to the optical fiber through the fiber optic adapter 700. For example, a first connection hole 5111 is disposed on one side of the transceiver cavity 510, and a connecting sleeve 710 is disposed on the other end of the fiber optic adapter 700. One end of the connecting sleeve 710 is embedded with the fiber optic adapter 700, and the other end of the connecting sleeve 710 connects to the transceiver cavity 510, connecting the fiber optic adapter 700 to the first connection hole 5111. The connecting sleeve 710 facilitates connection of the fiber optic adapter 700 to the transceiver cavity 510. Exemplarily, the other end of the optical fiber adapter 700 is embedded in the connecting sleeve 710 , and the end of the optical fiber ferrule in the optical fiber adapter 700 is located in the connecting sleeve 710 .

[0321] In some embodiments, the first connection hole 5111 extends from the inside of the transceiver cavity 510 to the outside of the transceiver cavity 510, that is, the first connection hole 5111 is a through hole that passes through the first side panel of the transceiver cavity 510, so as to facilitate the transmission of optical signals back and forth between the transceiver cavity 510 and the optical fiber adapter 700 outside the transceiver cavity 510.

[0322] In some embodiments, a fourth lens 5174 is disposed within the first connection hole 5111. The fourth lens 5174 is used to collimate / converge optical signals. For example, optical signals transmitted from the transceiver cavity 510 to the fiber optic adapter 700 are converged by the fourth lens 5174, while optical signals transmitted from the fiber optic adapter 700 to the transceiver cavity 510 are collimated by the fourth lens 5174. The fourth lens 5174 disposed within the first connection hole 5111 saves space within the transceiver cavity 510 that would otherwise be occupied by the fourth lens 5174, helping to reduce the size of the optical receiving component 500 and facilitating assembly of the optical receiving component 500 within the optical module.

[0323] In some embodiments, a second connection hole 5121, a third connection hole 5122, and a fourth connection hole 5123 are provided on the second side of the transceiver cavity 510. The top of the first light receiving assembly 520 is embedded in the second connection hole 5121, the top of the second light receiving assembly 530 is embedded in the third connection hole 5122, and the top of the third light receiving assembly 540 is embedded in the fourth connection hole 5123. The separation of the second connection hole 5121, the third connection hole 5122, and the fourth connection hole 5123 allows the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540 to be isolated from each other, effectively reducing high-frequency crosstalk, thermal crosstalk, etc. between the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540. For example, corresponding connection holes are embedded in the receiving tube caps of the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540.

[0324] In some embodiments, a fifth connection hole 5131 is provided on the third side of the transceiver cavity 510, one end of the fifth connection hole 5131 is connected to the inner cavity of the transceiver cavity 510, the other end of the fifth connection hole 5131 is connected to one end of the connecting portion 5132, the other end of the connecting portion 5132 is connected to the light emitting component 400, and a fourth through hole 51321 is provided inside the connecting portion 5132, the fourth through hole 51321 is connected to the fifth connection hole 5131, so that the optical signal emitted by the light emitting component 400 can be incident on the interior of the transceiver cavity 510.

[0325] Figure 34 is an exploded view of a transceiver cavity according to some embodiments of the present disclosure. Figure 35 is a structural diagram of a transceiver housing according to some embodiments of the present disclosure. As shown in Figures 34 and 35, in some embodiments, transceiver cavity 510 includes a transceiver cover 515 and a transceiver housing. The transceiver cover 515 covers the transceiver housing to form transceiver cavity 510. A second optical assembly 517 is disposed within transceiver cavity 510 to transmit optical signals to fiber optic adapter 700 and receive optical signals transmitted by fiber optic adapter 700.

[0326] In some embodiments, the transceiver housing is recessed inward to form an accommodating cavity 516 , and the second optical component 517 is disposed in the accommodating cavity 516 to accommodate the second optical component 517 .

[0327] In some embodiments, the transceiver housing has an opening. For example, the transceiver housing includes a first transceiver side panel 511, a second transceiver side panel 512, a third transceiver side panel 513, and a fourth transceiver side panel 514. The first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are connected end to end in sequence. The first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are located at the edge of the accommodating cavity 516. The first transceiver side panel 511 is located on a first side of the transceiver housing, the second transceiver side panel 512 is located on a second side of the transceiver housing, the third transceiver side panel 513 is located on a third side of the transceiver housing, and the fourth transceiver side panel 514 is located on a fourth side of the transceiver housing. The fourth side of the transceiver housing is adjacent to the lower side panel 2022 of the lower housing 202 and is located on a different side of the transceiver housing than the second side of the transceiver housing. The first transceiver side panel 511 is provided with a first connection hole 5111, the second transceiver side panel 512 is provided with a second connection hole 5121, a third connection hole 5122, and a fourth connection hole 5123, and the third transceiver side panel 513 is provided with a fifth connection hole 5131. Exemplarily, the first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are integrally formed.

[0328] In some embodiments, the third transceiver side panel 513 includes a first sub-transceiver side panel 5133 and a second sub-transceiver side panel 5134, one end of the first sub-transceiver side panel 5133 is connected to the second transceiver side panel 512, the other end of the first sub-transceiver side panel 5133 is connected to one end of the second sub-transceiver side panel 5134, and the other end of the second sub-transceiver side panel 5134 is connected to the fourth transceiver side panel 514, so that the third transceiver side panel 513 has an avoidance notch to avoid the light emitting component 400.

[0329] In some embodiments, the second sub-transceiver side panel 5134 is provided with an avoidance gap 5135, which is formed by the inner wall of the second sub-transceiver side panel 5134 being recessed toward the outer wall of the second sub-transceiver side panel 5134, and the side wall of the avoidance gap 5135 includes one end of the fifth connection hole 5131.

[0330] In some embodiments, the accommodating cavity 516 includes a first accommodating cavity, a second accommodating cavity 5165 and a third accommodating cavity 5166, and the first accommodating cavity, the second accommodating cavity 5165 and the third accommodating cavity 5166 are interconnected so that the optical signal can be transmitted from the first accommodating cavity to the second accommodating cavity 5165 and from the first accommodating cavity to the third accommodating cavity 5166.

[0331] In some embodiments, the first transceiver side panel 511 and the second transceiver side panel 512 form a second accommodating cavity 5165 , and the first sub-transceiver side panel 5133 and the second transceiver side panel 512 form a third accommodating cavity 5166 .

[0332] In some embodiments, the first accommodating cavity includes an accommodating cavity body 5163, a storage piece 5169, a second storage groove 5162 and a third storage groove 5164, the first connecting hole 5111 is located on the first side of the accommodating cavity body 5163, the third storage groove 5164 is located on the second side of the accommodating cavity body 5163, the storage piece 5169 is located on the third side of the accommodating cavity body 5163, the second storage groove 5162 is located on the fourth side of the accommodating cavity body 5163, the second storage groove 5162 and the third storage groove 5164 are more recessed relative to the accommodating cavity body 5163, and the storage piece 5169 is more protruding relative to the accommodating cavity body 5163.

[0333] The third storage groove 5164 is communicated with the accommodating cavity body 5163, the second accommodating cavity 5165 and the third accommodating cavity 5166 respectively, so that the first accommodating cavity, the second accommodating cavity 5165 and the third accommodating cavity 5166 are communicated with each other.

[0334] In some embodiments, the first end of the placement piece 5169 is connected to the accommodating cavity body 5163, and the second end of the placement piece 5169 is connected to the inner side wall of the second sub-transceiver side panel 5134 of the third transceiver side panel 513. The placement piece 5169 is more recessed relative to the second sub-transceiver side panel 5134 to facilitate the mounting of optical components.

[0335] In some embodiments, a first storage groove 5161 is provided on the storage member 5169. The first storage groove 5161 is located between the accommodating cavity body 5163 and the avoidance gap 5135. The first storage groove 5161 is recessed relative to the storage member 5169 to facilitate the placement of optical components.

[0336] In some embodiments, the first storage slot 5161 is located between the accommodating cavity body 5163 and the second sub-transceiver side plate 5134 of the third transceiver side plate 513, the first port of the first storage slot 5161 is connected to the fifth connecting hole 5131, and the second port of the first storage slot 5161 is located at the notch of the first support surface 5167, so that the second port of the first storage slot 5161 is connected to the accommodating cavity body 5163, so that the optical signal incident through the fifth connecting hole 5131 can be transmitted along the first storage slot 5161 to the accommodating cavity body 5163.

[0337] In some embodiments, the central axes of the first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not coincide with each other, that is, the first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not coincide with each other on the Y axis.

[0338] In some embodiments, the accommodating cavity body 5163 includes a first sidewall and a second sidewall. The first sidewall of the accommodating cavity body 5163 is disposed opposite the second sidewall of the accommodating cavity body 5163. The second sidewall of the accommodating cavity body 5163 is connected to the first end of the storage member 5169. The second sidewall of the accommodating cavity body 5163 includes a first support surface 5167. The first support surface 5167 is the connection surface between the first storage slot 5161 and the accommodating cavity body 5163. The first support surface 5167 is used to support a portion of the second optical assembly. For example, the first support surface 5167 is an inclined surface, sloping from one end to the other end along the inner sidewall of the third transceiver side plate 513. That is, the central axis of the fifth connection hole 5131 is not perpendicular to the first support surface 5167.

[0339] In some embodiments, the second side wall of the accommodating cavity body 5163 also includes a second supporting surface 5168, which is used to support part of the second optical component. The first supporting surface 5167 and the second supporting surface 5168 are connected, and the first supporting surface 5167 and the second supporting surface 5168 are arranged non-parallel to each other, so that the second supporting surface 5168 is arranged parallel to the inner wall of the second sub-transceiver side panel 5134.

[0340] FIG36 is an optical path diagram of a second optical assembly according to some embodiments of the present disclosure. As shown in FIG36 , in some embodiments, the second optical assembly 517 includes a first displacement prism 5171, a first optical filter 5172, a second displacement prism 5173, a fourth lens 5174, a first reflector 5175, a wave splitter 5176, a second optical filter 5177, a third displacement prism 5178, and a fourth displacement prism 5179. The fourth lens 5174 is located in the first connecting hole 5111, and the first displacement prism 5171, the first optical filter 5172, the second displacement prism 5173, the first reflector 5175, the wave splitter 5176, the second optical filter 5177, the third displacement prism 5178, and the fourth displacement prism 5179 are located in the accommodating cavity 516.

[0341] The first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not overlap on the Y-axis. To adjust the position of the optical signal on the Y-axis so that the optical signal propagates from the first port of the first storage slot 5161 to the second port of the first storage slot 5161, in some embodiments, a first displacement prism 5171 is disposed within the first storage slot 5161. The optical signal enters the first displacement prism 5171 through the incident surface of the first displacement prism 5171. The optical signal is reflected from the first reflection surface of the first displacement prism 5171 to the second reflection surface of the first displacement prism 5171. The optical signal is then reflected from the second reflection surface of the first displacement prism 5171 to the exit surface of the first displacement prism 5171, and then exits through the exit surface of the first displacement prism 5171.

[0342] In some embodiments, a first optical filter 5172 is disposed on the first supporting surface 5167, covering the second port of the first storage slot 5161. The signal light output by the light emitting component 400 is transmitted to the first optical filter 5172. The first optical filter 5172 is configured to transmit the optical signal output by the light emitting component 400 and transmit it to the second displacement prism 5173. The first optical filter 5172 is also configured to reflect the optical signal output from the second displacement prism 5173 to the first reflector 5175. Exemplarily, the first surface of the first optical filter 5172 faces the second displacement prism 5173, and the second surface of the first filter 5172 rests on the first supporting surface 5167.

[0343] In some embodiments, the second displacement prism 5173 is used to adjust the position of the optical signal in the Y direction of the transceiver housing to accommodate the optical module's requirements for the assembly position of the fiber optic adapter 700 and to provide sufficient space for the installation of the first reflector 5175 and the first filter 5172. The optical signal enters the second displacement prism 5173 through its incident surface. The optical signal is reflected from its first reflective surface to its second reflective surface. The optical signal is then reflected from its second reflective surface to its exit surface, where it is emitted.

[0344] For transmitted optical signals, the incident surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the first optical filter 5172, and the exit surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the fourth lens 5174. For received optical signals, the incident surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the fourth lens 5174, and the exit surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the first optical filter 5172.

[0345] In some embodiments, the second displacement prism 5173 is located at the edge of the first connection hole 5111, so that the optical signal passing through the first connection hole 5111 is transmitted to the second displacement prism 5173, and the optical signal output by the second displacement prism 5173 is transmitted to the first connection hole 5111. Exemplarily, the first side surface of the second displacement prism 5173 abuts against the first side wall of the accommodating cavity body 5163 (i.e., the inner side wall of the first transceiver side plate 511), or the first side surface of the second displacement prism 5173 is sealedly connected to the first connection hole 5111.

[0346] In some embodiments, the first side surface of the second displacement prism 5173 is perpendicular or approximately perpendicular to the central axis of the first connecting hole 5111, so that the optical signal incident on the first side surface of the second displacement prism 5173 through the first connecting hole 5111 is transmitted perpendicularly or approximately perpendicularly to the first side surface of the second displacement prism 5173, and the optical signal output from the first side surface of the second displacement prism 5173 can be transmitted to the first connecting hole 5111 along the central axis of the first connecting hole 5111.

[0347] In some embodiments, a first reflector 5175 is disposed within the second storage slot 5162 and is configured to reflect the optical signal reflected by the first filter 5172 to the wave splitter 5176. To facilitate the first reflector 5175 reflecting the optical signal to the wave splitter 5176, the first reflector 5175 is disposed at an angle within the first accommodating cavity, that is, the reflective surface of the first reflector 5175 is non-parallel to the second side surface of the second displacement prism 5173 and the angle between the two is less than 90°.

[0348] In some embodiments, a side wall of the second storage slot 5162 is the inner side wall of the fourth transceiver side panel 514. A first support member 5141 is attached to the inner side wall of the fourth transceiver side panel 514. The first side wall of the first support member 5141 is attached parallel to the inner side wall of the fourth transceiver side panel 514. The second side wall of the first support member 5141 is perpendicular to the first side wall of the first support member 5141. The third side wall of the first support member 5141 is connected to the first side wall and the second side wall of the first support member 5141 at both ends, respectively. The third side wall of the first support member 5141 is an inclined surface, i.e., one end of the third side wall of the first support member 5141 is closer to the first side wall of the first support member 5141 than the other end of the third side wall of the first support member 5141. For example, a first reflector 5175 is attached to the third side wall of the first support member 5141.

[0349] In some embodiments, the side of the splitter 5176 rests on the second support surface 5168 , and the side of the splitter 5176 contacts the positioning notch 51681 , and the positioning notch 51681 facilitates the positioning and assembly of the splitter 5176 .

[0350] In some embodiments, a wave splitter 5176 is disposed at the bottom of the housing cavity body 5163, with the light incident side of the wave splitter 5176 facing the first reflector 5175 and the light splitting output side of the wave splitter 5176 facing the second transceiver side panel 512. The wave splitter 5176 is configured to split the optical signal reflected by the first reflector 5175 according to wavelength. Exemplarily, the wave splitter 5176 splits a beam of optical signals including a fourth wavelength, a fifth wavelength, and a sixth wavelength into three beams according to wavelength.

[0351] In some embodiments, a third displacement prism 5178 is disposed in the second accommodating cavity 5165, and the fourth wavelength optical signal output by the wave splitter 5176 is transmitted to the third displacement prism 5178. A fourth displacement prism 5179 is disposed in the third accommodating cavity 5166, and the sixth wavelength optical signal output by the wave splitter 5176 is transmitted to the fourth displacement prism 5179. The third displacement prism 5178 and the fourth displacement prism 5179 are used to adjust the position of the optical signal in the X direction of the transceiver housing, so that the optical signal split by the wave splitter 5176 can be transmitted to the corresponding first optical receiving assembly 520, second optical receiving assembly 530, and third optical receiving assembly 540.

[0352] In some embodiments, multiple second filters are disposed within the second and third accommodating cavities 5165 and 5166, such as a second filter disposed at the output end of the third displacement prism 5178 and a second filter disposed at the output end of the fourth displacement prism 5179. The second filters are used to filter the optical signal before it enters the corresponding optical receiving component, reducing noise in the corresponding wavelength optical signal and ensuring the quality of optical signal reception. For example, a second filter 5177 is disposed within the third storage slot 5164 and is located at the end of the third connecting hole 5122. The second filter 5177 is located at the light input front end of the second optical receiving assembly 530. The second filter 5177 is used to filter out noise in the optical signal about to enter the second optical receiving assembly 530, thereby improving the quality of the light entering the second optical receiving assembly 530.

[0353] As shown in Figure 12, the emission light signal output by the light emitting component 400 is first adjusted in position in the Y direction by the first displacement prism 5171 and then incident on the first filter 5172, then incident on the second displacement prism 5173 through the first filter 5172, and then adjusted in position in the Y direction by the second displacement prism 5173 and incident on the fourth lens 5174, and finally converged by the fourth lens 5174.

[0354] A beam of received optical signals including the fourth wavelength, the fifth wavelength and the sixth wavelength is first collimated by the fourth lens 5174 and then transmitted to the second displacement prism 5173. Then, the position in the Y direction is adjusted by the second displacement prism 5173 and then incident on the first filter 5172. Then, the received optical signals are reflected by the first filter 5172 again and transmitted to the first reflector 5175. Then, the received optical signals are reflected by the first reflector 5175 and transmitted to the wavelength splitter 5176. Finally, the received optical signals are split into the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal according to the wavelength of the optical signals by the wavelength splitter 5176.

[0355] The light signal is reflected by the first reflection surface of the second displacement prism 5173 to the second reflection surface of the second displacement prism 5173 , and then reflected by the second reflection surface of the second displacement prism 5173 to the exit surface of the second displacement prism 5173 , and then emitted through the exit surface of the second displacement prism 5173 .

[0356] The fourth wavelength optical signal is transmitted to the incident surface of the third displacement prism 5178. The optical signal passes through the incident surface of the third displacement prism 5178 and is incident on the first reflection surface of the third displacement prism 5178. The optical signal is reflected from the first reflection surface of the third displacement prism 5178 to the second reflection surface of the third displacement prism 5178. The optical signal is reflected from the second reflection surface of the third displacement prism 5178 to the exit surface of the third displacement prism 5178. The optical signal is emitted from the exit surface of the third displacement prism 5178 to the first light receiving component 520. The fifth wavelength optical signal passes through the second filter 5177 and is transmitted to the second light receiving component 530. The sixth wavelength optical signal is transmitted to the incident surface of the fourth displacement prism 5179. The optical signal passes through the incident surface of the fourth displacement prism 5179 and is incident on the first reflection surface of the fourth displacement prism 5179. The optical signal is reflected by the first reflection surface of the fourth displacement prism 5179 to the second reflection surface of the fourth displacement prism 5179. The optical signal is reflected by the second reflection surface of the fourth displacement prism 5179 to the exit surface of the fourth displacement prism 5179. The optical signal is emitted through the exit surface of the fourth displacement prism 5179 to the third light receiving component 540.

[0357] The fourth wavelength optical signal is transmitted to the first optical receiving component 520, the fifth wavelength optical signal is transmitted to the second optical receiving component 530, and the sixth wavelength optical signal is transmitted to the third optical receiving component 540. Of course, in some embodiments, the optical signal transmitted to the first optical receiving component 520 is not limited to the fourth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the fourth wavelength optical signal; the optical signal transmitted to the second optical receiving component 530 is not limited to the fifth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the fifth wavelength optical signal; the optical signal transmitted to the third optical receiving component 540 is not limited to the sixth wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the sixth wavelength optical signal.

[0358] In some embodiments, the wavelength of the fourth wavelength optical signal is smaller than the wavelength of the fifth wavelength optical signal, and the wavelength of the fifth wavelength optical signal is smaller than the wavelength of the sixth wavelength optical signal. For example, the wavelength range of the fourth wavelength optical signal received by the first optical receiving component 520 is 1260-1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal received by the second optical receiving component 530 is 1284-1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; and the wavelength range of the sixth wavelength optical signal received by the third optical receiving component 540 is 1290-1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm.

[0359] The first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 each include a photodetector, which is used to receive optical signals and convert them into electrical signals. In some embodiments, the receiving rate of the photodetector in the second optical receiving assembly 530 is greater than the receiving rate of the photodetector in the first optical receiving assembly 520, and the receiving rate of the photodetector in the second optical receiving assembly 530 is greater than the receiving rate of the photodetector in the third optical receiving assembly 540. This ensures that the optical path of the fifth wavelength optical signal with the highest transmission rate from the output of the demultiplexer 5176 to the photodetector is relatively short and simple, allowing the photodetector in the second optical receiving assembly 530 to receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first optical receiving assembly 520 is 10G, the receiving rate of the photodetector in the second optical receiving assembly 530 is 50G, and the receiving rate of the photodetector in the third optical receiving assembly 540 is 2.5G.

[0360] In some embodiments, one end of the light emitting component 400 is connected to the second sub-transceiver side panel 5134, and one side of the light emitting component 400 is close to the first sub-transceiver side panel 5133, so that the light emitting component 400 is located at the avoidance corner of the transceiver shell, thereby making the assembly of the light emitting component 400 and the light receiving component 500 more compact, effectively reducing the overall size of the light emitting component 400 and the light receiving component 500.

[0361] Figure 37 is a schematic diagram of the structure of an optical transmission component provided according to some embodiments of the present disclosure. Figure 37 illustrates the arrangement of components within a second housing 410 and the optical transmission path of an optical signal within the second housing 410. In some embodiments, a first laser assembly 440, a second laser assembly 450, and a third laser assembly 460 are disposed within the first housing 410. The first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 are disposed side by side within the second housing 410, with the first laser assembly 440 located on one side of the third laser assembly 460 and the second laser assembly 450 located on the other side of the third laser assembly 460. The first laser assembly 440 generates an optical signal of a first wavelength, the second laser assembly 450 generates an optical signal of a second wavelength, and the third laser assembly 460 generates an optical signal of a third wavelength.

[0362] In some embodiments, the second housing 410 may be provided with a wavelength division multiplexer 401, which is located on the optical outgoing path of the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460, and is used to wavelength division multiplex the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal, so that the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal are output from the second housing 410 along the same optical path.

[0363] In some embodiments, a second lens 4181 is disposed between the first laser assembly 440 and the wavelength division multiplexer 401 , and the second lens 4181 collimates the first wavelength optical signal.

[0364] In some embodiments, a third lens 4182 is disposed between the second laser assembly 450 and the wavelength division multiplexer 401 , and the third lens 418 collimates the second wavelength optical signal.

[0365] In some embodiments, a fourth lens 4183 is disposed between the third laser assembly 460 and the wavelength division multiplexer 401 , and the fourth lens 4183 collimates the third wavelength optical signal.

[0366] Figure 38 is a schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure, and Figure 39 is an exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. In some embodiments, as shown in Figures 38 and 39, the light emitting component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 covers and connects to the second housing 410 to form a second cavity. The second housing 410 includes a bottom plate 411, a first side wall 412, a second side wall 413, a third side wall 414, and a fourth side wall 415. The first, second, third, and fourth side walls 412, 413, 414, and 415 are sequentially connected, with their bottoms connected to the bottom plate 411 to form a second inner cavity. The tops of the first, second, third, and fourth side walls 412, 413, 414, and 415 are supported and connected to the second upper cover 420; the bottom plate 411 is used to support the device. The second housing 410 can be a one-piece metal housing.

[0367] In some embodiments, the first sidewall 412 is located at one end of the second housing 410. A first connection hole 4121 is provided on the first sidewall 412. The first connection hole 4121 communicates with the second inner cavity and serves as a light outlet for the second cavity. The first connection hole 4121 connects to the first housing 510, allowing the second housing 410 to communicate with the inner cavity of the first housing 510 through the first connection hole 4121. For example, a boss 4122 is provided on the outer side of the first sidewall 412. One end of the first connection hole 4121 extends through the boss 4122, and the end of the connector 5101 is embedded with the connection boss 4122.

[0368] In some embodiments, two rows of pins are provided on each of the third sidewall 414 and the fourth sidewall 415, each row including a plurality of pins 430. For ease of description, the row of pins on the third and fourth sidewalls 414, 415 closest to the bottom plate 411 is referred to as the bottom row of pins on the third and fourth sidewalls 414, 415. The pins 430 on the third and fourth sidewalls 414, 415 are electrically connected to the circuit board 300 via corresponding flexible printed circuit boards.

[0369] In some embodiments, first laser assembly 440 is located on the sides of second sidewall 413 and third sidewall 414; second laser assembly 450 and third laser assembly 460 are located on the side of fourth sidewall 415, with third laser assembly 460 located on the side of second laser assembly 450 away from third sidewall 414, and third laser assembly 460 located on the side of first sidewall 412. This allows first laser assembly 440, second laser assembly 450, and third laser assembly 460 to be distributed on the sides of two adjacent sidewalls of second housing 410. This arrangement results in a triangular distribution of first laser assembly 440, second laser assembly 450, and third laser assembly 460, rather than being arranged in a row, to reduce the packaging volume of optical emitting component 400. For example, first laser assembly 440 generates an optical signal of a first wavelength, second laser assembly 450 generates an optical signal of a second wavelength, and third laser assembly 460 generates an optical signal of a third wavelength.

[0370] In some embodiments, the third sidewall 414 is disposed along the width direction of the second housing 410, and the fourth sidewall is disposed along the length direction of the second housing 410. This allows the first laser assembly 440 to be disposed within the width direction of the second housing 410, thereby reducing the width dimension of the second housing 410. The second laser assembly 450 and the third laser assembly 460 are disposed within the length direction of the second housing 410, in conjunction with the first laser assembly 440 disposed within the width direction of the second housing 410. This allows sufficient laser assemblies to be disposed within the second housing 410, while reducing the overall dimension of the second housing 410 and, consequently, the dimension of the light-emitting component 400.

[0371] In some embodiments, the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 have different transmission rates. For example, the transmission rate of the first laser assembly 440 is greater than the transmission rate of the second laser assembly 450, and the transmission rate of the second laser assembly 450 is greater than the transmission rate of the third laser assembly 460. For example, the transmission rate of the first laser assembly 440 is 50G, the transmission rate of the second laser assembly 450 is 10G, and the transmission rate of the third laser assembly 460 is 2.5G, etc.

[0372] A first filter 416 and a second filter 417 are also disposed on the side of the light outlet in the second housing 410. The first filter 416 and the second filter 417 are disposed on the side of the first connection hole 4121 and are located on the output optical paths of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The first filter 416 and the second filter 417 are disposed side by side. The first filter 416 and the second filter 417 are used to change the transmission optical paths of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal, allowing the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to pass through the first connection hole 4121. Exemplarily, the second filter 417 and the first filter 416 transmit the first wavelength optical signal, the second filter 417 reflects the second wavelength optical signal, the first filter 416 transmits the second wavelength optical signal, and the first filter 416 reflects the third wavelength optical signal.

[0373] In some embodiments, the first filter 416 and the second filter 417 are arranged on the side where the first side wall 412 and the second side wall 413 are connected, so that the first filter 416, the second filter 417 and the first laser assembly 440 are arranged compactly, which facilitates controlling the length direction of the second shell 410.

[0374] In some embodiments, a first optical filter 416 is disposed at the intersection of the output optical paths of the first laser assembly 440 and the third laser assembly 460, and a second optical filter 417 is disposed at the intersection of the output optical paths of the first laser assembly 440 and the second laser assembly 450. The first laser assembly 440 is located on the transmissive side of the second optical filter 417, the second laser assembly 450 is located on the reflective side of the second optical filter 417, and the third laser assembly 460 is located on the reflective side of the first optical filter 416. Exemplarily, the first optical filter 416 includes a first optical surface and a second optical surface, which are primary optical surfaces of the first optical filter 416. The second optical surface includes a third optical surface and a fourth optical surface, which are primary optical surfaces of the second optical filter 417. The first optical surface faces the third laser assembly 460, the second optical surface faces the second filter 417, the third optical surface faces the second laser assembly 450, and the fourth optical surface faces the first laser assembly 440.

[0375] In some embodiments, a mounting bracket 470 is further disposed within the second housing 410. The mounting bracket 470 is disposed on the side of the first connection hole 4121 and is fixed within the second housing 410. The mounting bracket 470 supports and connects the first optical filter 416 and the second optical filter 417. The first optical filter 416 and the second optical filter 417 are fixed within the second housing 410 via the mounting bracket 470, facilitating the fixing of the first optical filter 416 and the second optical filter 417 within the second housing 410.

[0376] In some embodiments, a lens 418 is further disposed within the second housing 410. The lens 418 is disposed on the optical path from the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to the first filter 416 or the second filter 417. For example, a second lens 4181 is disposed on the optical path from the first laser assembly 440 to the second filter 417 to collimate the first wavelength optical signal; a third lens 4182 is disposed on the optical path from the second laser assembly 450 to the second filter 417 to collimate the second wavelength optical signal; and a fourth lens 4183 is disposed on the optical path from the third laser assembly 460 to the first filter 416 to collimate the third wavelength optical signal.

[0377] Figure 40 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 41 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 42 is a partial structural schematic diagram of a light emitting component provided according to some embodiments of the present disclosure, Figure 43 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure, Figure 44 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure, and Figure 45 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. Figures 40 to 45 show the internal structure of the light emitting component in the embodiments of the present disclosure.

[0378] In some embodiments, the first laser assembly 440 includes a first substrate 441 and a first laser chip 442. The first laser chip 442 is mounted on the first substrate 441 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4410, a first high-frequency pad 4411, a first LD pad 4412, and a first SOA pad 4413 are provided on the first substrate 441. The first laser chip 442 is mounted on the ground layer 4410, with the first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 located on the sides of the first laser chip 442. The first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are each wire-bonded to the first laser chip 442. A first high-frequency pin 4301, a first SOA pin 4302, and a first LD pin 4303 are disposed on the third sidewall 414. These pins are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410. These pins are insulated from the third sidewall 414 by insulating layers. The first high-frequency pin 4301 is located in the bottom row of pins on the third sidewall 414. The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412. In some embodiments, one end of the first high frequency pin 4301 is wired to the first high frequency pad 4411 , one end of the first SOA pin 4302 is wired to the first SOA pad 4413 , and one end of the first LD pin 4303 is wired to the first LD pad 4412 .

[0379] In some embodiments, the height of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 is also provided on the third sidewall 414. The first ground pin 4304 is located to the side of the first high-frequency pin 4301 and is electrically connected to the third sidewall 414.

[0380] In some embodiments, a first adapter board 481 is further provided in the second shell 410, and a circuit pattern is provided on the first adapter board 481 to realize electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 through the first adapter board 481. The first adapter board 481 can also be used for impedance matching of the first laser chip 442 to ensure the impedance continuity of the high-frequency transmission link.

[0381] In some embodiments, a first high-frequency transmission line 4811 is disposed on the front of the first adapter plate 481. A first ground layer 4812 is disposed on one side of the first high-frequency transmission line 4811, and a second ground layer 4813 is disposed on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0382] In some embodiments, a ground layer is set on the back of the first adapter board 481, and via holes are respectively set on the first ground layer 4812 and the second ground layer 4813. The first ground layer 4812 and the second ground layer 4813 are respectively connected to the ground layer on the back of the first adapter board 481 through the via holes.

[0383] In some embodiments, the second laser assembly 450 includes a second substrate 451 and a second laser chip 452. The second laser chip 452 is mounted on the second substrate 451 and integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4510, a second high-frequency pad 4511, a second LD pad 4512, and a second SOA pad 4513 are provided on the second substrate 451. The second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are located on the sides of the second laser chip 452. The second laser chip 452 is mounted on the ground layer 4510, and the second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are respectively wire-bonded to the second laser chip 452.

[0384] Pins 430 further include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. Second high-frequency pin 4305 is located in the bottom row of pins on third sidewall 414. Second high-frequency pin 4305 is electrically connected to second high-frequency pad 4511, second SOA pin 4306 is electrically connected to second SOA pad 4513, and second LD pin 4307 is electrically connected to second LD pad 4512.

[0385] In some embodiments, a second adapter plate 482 is further disposed within the second housing 410, with a circuit board pattern disposed thereon. The second adapter plate 482 is used to electrically connect the second high-frequency pin 4305 to the second laser assembly 450. The second adapter plate 482 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link.

[0386] In some embodiments, a second high-frequency pin 4305 is embedded in and connected to the third sidewall 414, insulated from the third sidewall 414 by an insulating layer. A second adapter plate 482 is disposed on a side of the third sidewall 414. A second SOA pin 4306 and a second LD pin 4307 are embedded in and connected to the fourth sidewall 415 and insulated from the fourth sidewall 415 by an insulating layer. The second SOA pin 4306 is wired to the second SOA pad 4513, and the second LD pin 4307 is wired to the second LD pad 4512. A second ground pin 4308 is also disposed on the third sidewall 414, located on a side of the second high-frequency pin 4305 and electrically connected to the third sidewall 414. Exemplarily, the second ground pin 4308 is located on a side of the second high-frequency pin 4305 that is proximal to the first high-frequency pin 4301. The second adapter plate 482 is located on the same sidewall of the second housing 410 as the first adapter plate 481. This facilitates assembly of the second adapter plate 482 and increases the density of components within the second housing 410, thereby helping to reduce the size of the second housing 410. In some embodiments, a second high-frequency transmission line 4821 is disposed on the front surface of the second adapter plate 482. A third ground plane 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground plane 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305. The ground plane 4510 electrically connects the third ground plane 4822 and the fourth ground plane 4823.

[0387] In some embodiments, a ground layer is provided on the back of the second adapter plate 482, and vias are provided in the third and fourth ground layers 4822 and 4823, respectively. The third and fourth ground layers 4822 and 4823 are connected to the ground layer on the back of the second adapter plate 482 through the vias. In some embodiments, a third adapter plate 483 is further provided within the second housing 410, with a circuit pattern provided thereon. The third adapter plate 483 is positioned between the second laser assembly 450 and the second adapter plate 482, with the side edges of the third adapter plate 483 adjacent to the first laser assembly 440. The third adapter plate 483 is used to achieve an electrical connection between the second laser assembly 450 and the second adapter plate 482. The third adapter plate 483 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link. The third adapter plate 483 helps reduce the length of the wires between the second laser assembly 450 and the second adapter plate 482, thereby reducing parasitic inductance and ensuring high-frequency signal transmission quality. In some embodiments, a third high-frequency transmission line 4831 is disposed on the front surface of the third adapter plate 483, a fifth ground layer 4832 is disposed on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is disposed on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wired to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wired to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wired to the third ground layer 4822, the sixth ground layer 4833 is wired to the fourth ground layer 4823, and the fifth and sixth ground layers 4832 and 4833 are each wired to the ground layer 4510.

[0388] In some embodiments, a third LD pad 4834 and a third SOA pad 4835 are further provided on the front surface of the third adapter board 483. The third LD pad 4834 and the third SOA pad 4835 are located near the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834, respectively. The first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835, respectively. This allows the first laser assembly 440, the first LD pin 4303, and the first SOA pin 4302 to be electrically connected via the third adapter board 483, thereby facilitating control of the bonding arc height and thus facilitating bonding. In some embodiments, capacitors are mounted on third LD pad 4834 and third SOA pad 4835, respectively. First LD pad 4412 and first LD pin 4303 are connected to the capacitors mounted on third LD pad 4834, respectively. First SOA pad 4413 and first SOA pin 4302 are wired to connect the capacitors mounted on third SOA pad 4835. A third adapter plate 483 is disposed at the junction of third sidewall 414 and fourth sidewall 415, enabling third adapter plate 483 to serve both first laser assembly 440 and second laser assembly 450, thereby facilitating coordinated use of space within second housing 410.

[0389] In some embodiments, the third laser assembly 460 includes a third substrate 461 and a third laser chip 462. A negative electrode pad 4611 and a positive electrode pad 4612 are provided on the third substrate. The third laser chip 462 is mounted on the negative electrode pad 4611 and is wire-bonded to the positive electrode pad 4612. The pins 430 also include a third LD pin 4309 and a fourth LD pin 4310. The third LD pin 4309 is wire-bonded to the positive electrode pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative electrode pad 4611. Exemplarily, the third LD pin 4309 and the fourth LD pin 4310 are embedded in the fourth sidewall 415, with their ends respectively extending into the inner cavity of the second housing 410 and insulated from the fourth sidewall 415 by an insulating layer.

[0390] In some embodiments, the third laser assembly 460 further includes a backlight detector 463, which is disposed on the third substrate 461 and located on the backlight side of the third laser chip 462. The backlight detector 463 is configured to receive backlight from the third laser chip 462 to monitor optical signals at a third wavelength. Pins 430 further include an MPD pin 4311, which is wired to the backlight detector 463. Exemplarily, the MPD pin 4311 is embedded in the fourth sidewall 415, with the end of the MPD pin 4311 extending into the inner cavity of the second housing 410. The MPD pin 4311 is insulated from the fourth sidewall 415 by an insulating layer.

[0391] In some embodiments, a thermoelectric cooler (TEC) 490 is further disposed within the second housing 410. The bottom of the TEC 490 is connected to the base plate 411, and the top of the TEC 490 supports the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The sides of the TEC 490 include a first TEC pad 491 and a second TEC pad 492, which are located on the sides of the second sidewall 413. The pins 430 also include a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410 and insulated from the third sidewall 414 by an insulating layer.

[0392] In some embodiments, a support plate 419 is further disposed within second housing 410 and is positioned atop TEC 490. The bottom of support plate 419 is connected to the top of TEC 490, while the top of support plate 419 supports and connects first laser assembly 440, second laser assembly 450, and third laser assembly 460. In some embodiments, support plate 419 is electrically connected to the ground layer on the front surface of third adapter plate 483.

[0393] In some embodiments, a fourth adapter plate 484 is further disposed within the second housing 410. The fourth adapter plate 484 is disposed on the support plate 419 and has a circuit pattern disposed thereon. The fourth adapter plate 484 is used to connect the TEC pads and TEC pins. Exemplarily, the fourth adapter plate 484 includes a fourth substrate 4841 on which a first metal layer 4842 and a second metal layer 4843 are disposed. The first metal layer 4842 and the second metal layer 4843 extend along the length of the fourth substrate 4841. The fourth adapter plate 484 is disposed adjacent to the second sidewall 413 and adjacent to the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0394] In some embodiments, a temperature sensor 4836 is further provided on the third adapter board 483; illustratively, the temperature sensor 4836 is a thermistor. Pins 430 also include an RTH pin 4314, which is embedded in the third sidewall 414. One end of the RTH pin 4314 extends into the inner cavity of the second housing 410 and is insulated from the third sidewall 414 by an insulating layer. One end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0395] In some embodiments, a transfer pad 4837 is further provided on the third adapter board 483. The transfer pad 4837 is disposed on the side of the temperature sensor 4836 and is connected to the temperature sensor 4836 and the RTH pin 4314 by wire bonding. The transfer pad 4837 facilitates the connection between the temperature sensor 4836 and the RTH pin 4314, thereby reducing the risk of heat being transferred to the RTH pin 4314 through the wire bonding when the temperature sensor 4836 is directly connected to the RTH pin 4314, which could cause the temperature sensor 4836 to detect inaccurate temperature in the second cavity.

[0396] In some embodiments, the inner side of the third sidewall 414 includes a first side surface 4141, a second side surface 4142, a first stepped surface 4143, and a second stepped surface 4144. The first side surface 4141 is connected to the first stepped surface 4143, one end of the second stepped surface 4144 is connected to the first side surface 4141, and the other end of the second stepped surface 4144 is connected to the second side surface 4142. The first stepped surface 4143 is closer to the bottom plate 411 than the second stepped surface 4144. That is, the height of the first stepped surface 4143 in the second housing 410 is lower than the height of the second stepped surface 4144 in the second housing 410.

[0397] The first stepped surface 4143 supports and connects the first adapter plate 481 and the second adapter plate 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 each pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter plate 481, while one end of the second high-frequency pin 4305 extends to the second adapter plate 482. One end of the RTH pin 4314 passes through the first side surface 4141, while one end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 each pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0398] In some embodiments, the pins extending through the first side surface 4141 form a first row of pins 430a, while the pins extending through the second side surface 4142 form a second row of pins 430b. Specifically, the pins disposed on the third side wall 414 are arranged in two rows. The pins in the first row 430a and the pins in the second row 430b are staggered to facilitate pin bonding and adaptability to flexible printed circuit boards, while also reducing the risk of air leakage caused by deformation of the insulating layer securing the pins.

[0399] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in a row, and the second LD pin 4307 , the third LD pin 4309 , and the fourth LD pin 4310 are located in a row.

[0400] In some embodiments, the first connection hole 4121 is a stepped through hole that gradually becomes smaller from one side of the boss 4122 to the inside of the second housing 410. A sealing window 4123 is provided in the first connection hole 4121 at the boss 4122 to seal the first connection hole 4121.

[0401] FIG46 is a transmission optical path diagram of an optical transmission signal provided according to some embodiments of the present disclosure, and FIG46 shows the transmission optical path of the optical transmission signal. As shown in FIG28 , the first wavelength optical signal generated by the first laser assembly 440 is transmitted to the second lens 4181 , collimated by the second lens 4181 , and then transmitted to the second filter 417 , transmitted through the second filter 417 to the first filter 416 , and then transmitted through the first filter 416 to the first connection hole 4121 ; the second wavelength optical signal generated by the second laser assembly 450 is transmitted to the third lens 4182 , collimated by the third lens 4182 , and then transmitted to the second filter 417 , reflected by the second filter 417 and transmitted to the first filter 416 , and then transmitted through the first filter 416 to the first connection hole 4121 ; the third wavelength optical signal generated by the third laser assembly 460 is transmitted to the fourth lens 4183 , collimated by the fourth lens 4183 , and then transmitted to the first filter 416 , and then reflected by the first filter 416 and transmitted to the first connection hole 4121 . The first optical filter 416 and the second optical filter 417 allow the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal to share a common optical path when outputting from the second housing 410 .

[0402] Figure 47 illustrates an assembly diagram of an optical transceiver component and a fiber optic adapter from another perspective, according to some embodiments of the present disclosure. Figure 48 illustrates a structural diagram of an optical transmitting component, according to some embodiments of the present disclosure. As shown in Figure 47 , in some embodiments, the optical transmitting component 400 may include a second cavity. The second cavity may be connected to the optical receiving component 500 so that the transmitted optical signal emitted by the optical transmitting component 400 can be incident on the optical receiving component 500.

[0403] As shown in FIG. 47 and FIG. 48 , in some embodiments, the second cavity may include a second shell 410 .

[0404] As shown in Figures 47 and 48, in some embodiments, the second cavity may include a second cover plate 415. The second cover plate 415 may be attached to the second housing 410 to form the second cavity. A second optical assembly 430 may be disposed within the second cavity. The second optical assembly 430 may transmit at least one optical signal. For example, the second optical assembly 430 may transmit an optical signal having a first wavelength, an optical signal having a second wavelength, and an optical signal having a third wavelength.

[0405] During the assembly process, the second optical assembly 430 is first fixed in the second housing 410 , and then the second cover 415 is covered on the second housing 410 to form a second cavity.

[0406] As shown in FIG47 , the openings of the first housing 510 and the second housing 410 face opposite directions. For example, the opening of the first housing 510 faces the upper housing 201 , and the opening of the second housing 410 faces the lower housing 202 .

[0407] In some embodiments, the openings of the first housing 510 and the second housing 410 face the same direction. For example, the openings of the first housing 510 and the second housing 410 both face the upper housing 201 .

[0408] Figure 49 is an exploded view of a second housing and electrical connector according to some embodiments of the present disclosure. As shown in Figures 48 and 49, in some embodiments, the second housing 410 has a notch 417. An electrical connector 420 can be positioned in the notch 417, allowing one end of the electrical connector 420 to connect to the second optical assembly 430, thereby enabling electrical signal transmission between the electrical connector 420 and the second optical assembly 430. The other end of the electrical connector 420 can be connected to the circuit board 300, thereby enabling electrical signal transmission between the circuit board 300 and the electrical connector 420.

[0409] A notch 417 is formed in the middle portion of the side wall of the second housing 410 . The notch 417 does not extend beyond the top and bottom surfaces of the side wall of the second housing 410 , so that the notch 417 is not connected to the opening of the second housing 410 .

[0410] In some embodiments, the notch 417 does not extend beyond the bottom surface of the sidewall of the second shell 410 , but extends beyond the top surface of the sidewall of the second shell 410 , so that the notch 417 communicates with the opening of the second shell 410 .

[0411] In some embodiments, the second housing 410 may include a bottom plate 416 , which may be used to support the second optical assembly 430 .

[0412] In some embodiments, the second housing 410 may include a first sidewall 411. The bottom of the first sidewall 411 may be connected to the bottom plate 416. The first sidewall 411 may be connected to the light receiving component 500. The first sidewall 411 may have a sixth connection hole 4111. The sixth connection hole 4111 may pass through the first sidewall 411. The sixth connection hole 4111 may communicate with the inner cavity of the second cavity, thereby allowing the transmission light signal emitted by the light emitting component 400 to be transmitted to the light receiving component 500 through the sixth connection hole 4111.

[0413] In some embodiments, the second housing 410 may include a second sidewall 412. A bottom of the second sidewall 412 may be connected to the bottom plate 416. One end of the second sidewall 412 may be connected to one end of the first sidewall 411.

[0414] In some embodiments, the second housing 410 may include a third sidewall 413. The bottom of the third sidewall 413 may be connected to the bottom plate. One end of the third sidewall 413 may be connected to the other end of the second sidewall 412. The third sidewall 413 is disposed opposite to the first sidewall 411.

[0415] In some embodiments, the second housing 410 may include a fourth sidewall 414. The bottom of the fourth sidewall 414 may be connected to the bottom plate. One end of the fourth sidewall 414 may be connected to the other end of the third sidewall 413. The other end of the fourth sidewall 414 may be connected to the other end of the first sidewall 411. The fourth sidewall 414 may be disposed opposite the second sidewall 412.

[0416] The first side wall 411 , the second side wall 412 , the third side wall 413 and the fourth side wall 414 are sequentially connected and respectively connected to the bottom plate 416 to form a second housing 410 having an opening.

[0417] Figure 50 is an optical path diagram of a second optical assembly according to some embodiments of the present disclosure. Figure 51 is an optical path diagram of another second optical assembly according to some embodiments of the present disclosure. As shown in Figures 50 and 51, in some embodiments, second optical assembly 430 may include a laser chipset 431. Laser chipset 431 may be connected to electrical connector 420 so that laser chipset 431 emits an optical signal based on an electrical signal provided by electrical connector 420.

[0418] In some embodiments, the laser chip group 431 may include a first laser chip 4311 . The first laser chip 4311 is connected to the electrical connector 420 , so that the first laser chip 4311 emits a first wavelength optical signal according to an electrical signal provided by the electrical connector 420 .

[0419] Because the output optical power of the first wavelength optical signal is greater than that of the second wavelength optical signal and the third wavelength optical signal, the first laser chip 4311 may include a distributed feedback laser (DFB), an electro-absorption modulator (EAM), and a semiconductor amplifier (SOA). The DFB emits light of the first wavelength, the EAM modulates the first wavelength light to obtain a first wavelength optical signal, and the SOA amplifies the first wavelength optical signal so that the output optical power of the first wavelength optical signal meets the requirement.

[0420] The presence of the SOA causes the first laser chip 4311 to be tilted. While tilted, the direction of the first wavelength optical signal output by the first laser chip 4311 is parallel to the length of the second housing 410. This reduces reflections of the optical signal at the end face of the output port of the first laser chip 4311, effectively preventing reflected optical signals from entering the first laser chip 4311 and interfering with its light emission.

[0421] In some embodiments, the laser chip set 431 may include a second laser chip 4312 . The second laser chip 4312 is connected to the electrical connector 420 , so that the second laser chip 4312 emits a second wavelength optical signal according to an electrical signal provided by the electrical connector 420 .

[0422] The second wavelength optical signal has a wavelength of 1480-1500 nm. This wavelength is within the low-dispersion region of the optical fiber, so the dispersion caused by chirp has minimal impact on the signal. The chirp effect of the DFB does not significantly affect signal quality. Therefore, the second laser chip 4312 is a directly modulated laser (DML), also known as a DFB. The circuit board 300 provides a drive signal via the electrical connector 420, causing the DFB to emit the second wavelength optical signal.

[0423] In some embodiments, the laser chip set 431 may include a third laser chip 4313 . The third laser chip 4313 is connected to the electrical connector 420 , so that the third laser chip 4313 emits a third wavelength optical signal according to an electrical signal provided by the electrical connector 420 .

[0424] The third wavelength optical signal has a wavelength of 1575-1580 nm. This wavelength falls within the high-dispersion region of the optical fiber, where chirp-induced dispersion significantly impacts the signal. Using an externally modulated laser (EML) can mitigate the chirp effect, thereby reducing the impact of dispersion on the signal and ensuring high-quality signal transmission. Therefore, the third laser chip 4313 is an EML. The EML includes a DFB and an EAM. The circuit board 300 provides a first drive signal and a second drive signal via the electrical connector 420. The first drive signal causes the DFB to emit light at the third wavelength, while the second drive signal modulates the EAM to output the third wavelength optical signal.

[0425] In some embodiments, the second optical assembly 430 may include a lens assembly 432. The lens assembly 432 may include a second lens 4321. The second lens 4321 may be located on the output optical path of the first laser chip 4311 so as to collimate the first wavelength optical signal emitted by the first laser chip 4311.

[0426] In some embodiments, the lens assembly 432 may include a third lens 4322 . The third lens 4322 may be located on an outgoing optical path of the second laser chip 4312 , such that the third lens 4322 collimates the second wavelength optical signal emitted by the second laser chip 4312 .

[0427] In some embodiments, the lens assembly 432 may include a fourth lens 4323 . The fourth lens 4323 may be located on an outgoing optical path of the third laser chip 4313 , so that the fourth lens 4323 collimates the third wavelength optical signal emitted by the third laser chip 4313 .

[0428] In some embodiments, the second optical component 430 may include a wavelength combining component 433. The wavelength combining component 433 may include a wavelength division multiplexer. The input side of the wavelength division multiplexer faces the laser chipset 431, and the output side of the wavelength division multiplexer faces the sixth connection hole 4111. The wavelength division multiplexer combines the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal emitted by the laser chipset 431 into a single optical signal for emission.

[0429] In some embodiments, the combining assembly 433 may include a polarization assembly and a polarization combining assembly. The polarization assembly is used to adjust the polarization direction of the optical signal, and the polarization combining assembly combines multiple polarized light beams into a single beam. The polarization assembly adjusts the polarization direction of the optical signal, and then combines the multiple polarized light beams into a single beam using the polarization combining assembly, thereby achieving wave combining in the optical emitting component.

[0430] In some embodiments, the wavelength combining component 433 may include multiple filters that cooperate with each other to combine the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal into a beam of transmitted optical signal.

[0431] As shown in Figures 50 and 51, the multiplexing assembly 433 may include a fourth filter 4331. The fourth filter 4331 may include an incident surface and an exit surface. Both the incident surface and the exit surface are located on the collimated optical path of the second lens 4321, that is, between the second lens 4321 and the sixth connecting hole 4111, so that the first wavelength optical signal can be incident on the fourth filter 4331 through the incident surface and be transmitted through the exit surface of the fourth filter 4331.

[0432] The wavelength combining assembly 433 may include a fifth optical filter 4332. The fifth optical filter 4332 may include an incident surface, a filtering surface, and an exit surface. The incident surface and the filtering surface are both located in the collimated optical path of the third lens 4322, and the exit surface is located in the reflected optical path of the filtering surface. This allows the second wavelength optical signal to enter the fifth optical filter 4332 through the incident surface, be reflected by the filtering surface of the fifth filter 4332, and finally be emitted through the exit surface.

[0433] The output surface of the fifth filter 4332 is connected to the output surface of the fourth filter 4331 , so that the second wavelength optical signal is emitted through the output surface of the fifth filter 4332 and then reflected through the output surface of the fourth filter 4331 .

[0434] The multiplexing assembly 433 may include a sixth optical filter 4333. The sixth optical filter 4333 may include an incident surface, a filtering surface, and an exit surface. The incident surface and the filtering surface are both located in the collimated optical path of the fourth lens 4323, and the exit surface is located in the reflected optical path of the filtering surface. This allows the third wavelength optical signal to enter the sixth optical filter 4333 through the incident surface, be reflected by the filtering surface of the sixth filter 4333, and finally be emitted through the exit surface.

[0435] The exit surface of the sixth filter 4333 is connected to the filtering surface of the fifth filter 4332, so that the third wavelength optical signal is emitted through the exit surface of the sixth filter 4333, transmitted through the filtering surface of the fifth filter 4332, and then emitted from the exit surface of the fifth filter 4332, and finally reflected through the exit surface of the fourth filter 4331.

[0436] The output surface of the sixth filter 4333 is connected to the output surface of the fifth filter 4332 , and the output surface of the fifth filter 4332 is connected to the output surface of the fourth filter 4331 , so as to increase the stability of the multiplexing component 433 .

[0437] In order to prevent the transmission light signal incident on the light receiving component 500 from returning to the laser chipset 431, in some embodiments, no isolator is provided in the light emitting component 400, as shown in FIG18. For example, an isolator 518 is provided in the light receiving component 500, and the isolator 518 can prevent a beam of transmission light signal incident on the light receiving component 500 from returning to the light emitting component 400, as shown in FIG14.

[0438] As shown in FIG51 , in some embodiments, the second optical assembly 430 may include an isolator group 434. The isolator group 434 may include a first isolator 4341. The first isolator 4341 may be located between the second lens 4321 and the fourth filter 4331 to prevent the first wavelength optical signal from returning to the first laser chip 4311 via the first isolator 4341.

[0439] In some embodiments, the isolator group 434 may include a second isolator 4342 . The second isolator 4342 may be located between the third lens 4322 and the fifth filter 4332 to prevent the second wavelength optical signal from returning to the second laser chip 4312 via the second isolator 4342 .

[0440] In some embodiments, the isolator group 434 may include a third isolator 4343 . The third isolator 4343 may be located between the fourth lens 4323 and the sixth filter 4333 to prevent the third wavelength optical signal from returning to the third laser chip 4313 via the third isolator 4343 .

[0441] The isolator includes a first polarizer, a Faraday plate and a second polarizer. The Faraday plates rotate in the same direction. Polarized light passing through the first polarizer cannot return to the first polarizer after Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate and the second polarizer has a reverse isolation effect.

[0442] Figure 52 is an exploded view of an optical transmission component provided according to some embodiments of the present disclosure. Figure 53 is an exploded view of a second optical component and a transmission housing provided according to some embodiments of the present disclosure. Figure 54 is a structural diagram of a transmission housing provided according to some embodiments of the present disclosure. As shown in Figures 52, 53, and 54, the optical transmission component 400 includes a transmission cover 401 and a transmission housing 402. The transmission cover 401 covers the transmission housing 402 to form a transmission cavity. A first optical component 403 is disposed in the transmission cavity, and the first optical component 403 is used to transmit an optical signal.

[0443] In some embodiments, the first end of the transmitting housing 402 is provided with a third through hole 4211. A light window is positioned within the third through hole 4211, configured to transmit the transmitted light signal and seal the light hole. The light window is embedded within the third through hole 4211 to seal the third through hole 4211; the light window can be made of transparent glass. The light window seals the third through hole 4211, allowing the transmitted light signal to pass through while also sealing the third through hole 4211 to ensure the sealing performance of the transmitting housing 402. In some embodiments, the light window may also be embedded in a connection with the fourth through hole 51321.

[0444] In some embodiments, a notch is provided at the second end of the launch housing 402, and the notch passes through the second end of the launch housing 402. One end of the first circuit board 301 is embedded in the notch, that is, one end of the first circuit board 301 passes through the notch and extends into the inner cavity of the launch housing 402.

[0445] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. The laser assembly 431 is positioned near one end of the first circuit board 301 to facilitate electrical connection of the laser assembly 431 to the first circuit board 301. The laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, the laser assembly 431 is connected to the first circuit board 301 by wire bonding.

[0446] In some embodiments, a socket 4234 is provided at the second end of the launch shell 402, and the socket 4234 passes through the second end of the launch shell 402. The first end of the launch pin 405 is connected to the second circuit board 302, and the second end of the launch pin 405 passes through the socket 4234 and extends into the inner cavity of the launch shell 402.

[0447] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. Laser assembly 431 is positioned near one end of the transmitting pin 405 to facilitate electrical connection of laser assembly 431 to the transmitting pin 405. Laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, laser assembly 431 is connected to transmitting pin 405 via wire bonding.

[0448] In some embodiments, the first optical component 403 further includes a lens component 432 , which is disposed on the optical path from the laser component 431 to the combiner component for collimating the optical signal generated by the laser component 431 and transmitting it to the combiner component.

[0449] In some embodiments, the first optical component 403 further includes a combining component, which is used to combine multiple optical signals of different wavelengths emitted by the laser component 431 into one transmitted optical signal.

[0450] As shown in Figures 52, 53, and 54, in some embodiments, the second end of the transmitting housing 402 is provided with multiple jacks 4234. The multiple jacks 4234 include a first jack and a second jack. The first jack is closer to the bottom of the transceiver housing 402. The first jack is used to insert a first transmitting pin, and the second jack is used to insert a second transmitting pin, thereby reducing signal crosstalk between the first transmitting pin and the second transmitting pin. The first transmitting pin is a rate-related transmitting pin 405, and the second transmitting pin is a rate-independent transmitting pin 405.

[0451] As shown in Figures 52 and 53, in some embodiments, a first soldering pad 406 is further provided at the second end of the launch shell 402, one end of the first soldering pad 406 is welded to the first launch pin located on the first socket, and the other end of the first soldering pad 406 is wired to the soldering pad where the laser component 431 is located.

[0452] In some embodiments, the first optical component 403 is fixed in the emission cavity through the substrate 404, and the soldering pad where the laser component 431 is located is connected to the first soldering pad 406 by wire bonding, so that the soldering pad where the laser component 431 is located is flush with the height of the first soldering pad 406, thereby shortening the wire bonding length between the soldering pad where the laser component 431 is located and the first soldering pad 406.

[0453] In some embodiments, the launch housing 402 has an opening. For example, the launch housing 402 includes a first launch side panel 421, a second launch side panel 422, a third launch side panel 423, a fourth launch side panel 424, and a launch bottom panel 425. The first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are connected end to end, and the first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are all connected to the launch bottom panel 425 to form a launch cavity having an opening.

[0454] The first emitting side plate 421 has a third through hole 4211 .

[0455] The third launching side panel 423 includes a first sub-launching side panel 4231, a second sub-launching side panel 4232 and a third sub-launching side panel 4233. The first sub-launching side panel 4231 is connected to the launching base panel 425. The distances between the first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 and the launching base panel 425 increase successively. The first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 are connected successively so that the third launching side panel 423 is stepped.

[0456] A first solder pad 406 is provided on the surface of the first sub-emitting side panel 4231 facing the opening of the emission housing 402. A first socket is provided on the surface of the second sub-emitting side panel 4232 facing the laser assembly 431. The first socket passes through the second sub-emitting side panel 4232 to facilitate insertion of the first emission pin from the emission housing 402 into the emission housing 402. A second socket is provided on the surface of the third sub-emitting side panel 4233 facing the laser assembly 431. The second socket passes through the third sub-emitting side panel 4233 to facilitate insertion of the second emission pin from the emission housing 402 into the emission housing 402.

[0457] The first jack passes through the second sub-transmitting side panel 4232, and the second jack passes through the third sub-transmitting side panel 4233. The second sub-transmitting side panel 4232 and the third sub-transmitting side panel 4233 are stepped, so as to extend the distance between the first jack and the second jack in the length direction of the transmitting shell 402, reduce the distance between the first jack and the second jack in the height direction of the transmitting shell 402, and thereby reduce the signal crosstalk between the first transmitting pin inserted into the first jack and the second transmitting pin inserted into the second jack.

[0458] The fourth emitting side panel 424 includes a fourth sub-emitting side panel 4241 and a fifth sub-emitting side panel 4242. One side surface of the fourth sub-emitting side panel 4241 is connected to the emitting bottom panel 425, and the other side surface of the fourth sub-emitting side panel 4241 is connected to the fifth sub-emitting side panel 4242, so that the fourth emitting side panel 424 is stepped; one end of the fourth sub-emitting side panel 4241 is connected to the first emitting side panel 421, and the other end of the fourth sub-emitting side panel 4241 is connected to the first sub-emitting side panel 4231; one end of the fifth sub-emitting side panel 4242 is connected to the first emitting side panel 421, and the other end of the fifth sub-emitting side panel 4242 is connected to the second sub-emitting side panel 4232 and the third sub-emitting side panel 4233.

[0459] One end of the fourth sub-emitting side plate 4241 is connected to the first emitting side plate 421 , and the fourth sub-emitting side plate 4241 is connected to the first sub-emitting side plate 4231 to reduce the storage space of the emitting cavity and further limit the substrate 404 .

[0460] Figure 55 is an optical path diagram of a first optical assembly according to some embodiments of the present disclosure. Figure 56 is another optical path diagram of a first optical assembly according to some embodiments of the present disclosure. Figure 57 is a combined optical path diagram of the first and second optical assemblies according to some embodiments of the present disclosure. As shown in Figures 55, 56, and 57, laser assembly 431 includes a first laser assembly 4311, a second laser assembly 4312, and a third laser assembly 4313. Second laser assembly 4312 is located between first laser assembly 4311 and third laser assembly 4313. The light output directions of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are directed toward the multiplexing assembly. In some embodiments, first laser assembly 4311 emits an optical signal of a first wavelength, second laser assembly 4312 emits an optical signal of a second wavelength, and third laser assembly 4313 emits an optical signal of a third wavelength. The optical axes of the first, second, and third wavelength optical signals are parallel to the longitudinal extension of the transmitting housing. Exemplarily, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1480-1500 nm, such as the wavelength of the second wavelength optical signal is 1490 nm; the wavelength range of the third wavelength optical signal is 1575-1580 nm, such as the wavelength of the third wavelength optical signal is 1577 nm.

[0461] In some embodiments, the transmission rate of the first laser assembly 4311 is greater than the transmission rate of the third laser assembly 4313, and the transmission rate of the third laser assembly 4313 is greater than the transmission rate of the second laser assembly 4312. For example, the transmission rate of the first laser assembly 4311 is 50G, the transmission rate of the second laser assembly 4312 is 2.5G, and the transmission rate of the third laser assembly 4313 is 10G.

[0462] In some embodiments, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are not flush, that is, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are located on different length surfaces of the emitting shell.

[0463] In some embodiments, first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 utilize a chip-on-carrier (COC) package, which can also be referred to as chip-on-ceramic substrate (CPC). Therefore, the side profiles of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are relatively regular, such as rectangular.

[0464] In some embodiments, lens assembly 432 includes a first lens 4321, a second lens 4322, and a third lens 4323. First lens 4321 is disposed on the optical transmission path from first laser assembly 4311 to the combiner assembly, second lens 4322 is disposed on the optical transmission path from second laser assembly 4312 to the combiner assembly, and third lens 4323 is disposed on the optical transmission path from third laser assembly 4313 to the combiner assembly. In some embodiments, first lens 4321, second lens 4322, and third lens 4323 are disposed on substrate 404. However, embodiments of the present disclosure are not limited to first lens 4321, second lens 4322, and third lens 4323 being disposed on substrate 404.

[0465] In some embodiments, the combining component includes a wavelength division multiplexer, the input side of the wavelength division multiplexer faces the laser component, and the output side of the wavelength division multiplexer faces the third through hole 4211. The wavelength division multiplexer combines the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength emitted by the laser component 431 into one optical signal.

[0466] In some embodiments, the wavelength combining component includes a plurality of optical filters, which cooperate with each other to combine the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength into one optical signal.

[0467] In some embodiments, the combining assembly includes a polarization assembly 433 and a polarization combining assembly 434. Polarization assembly 433 is used to adjust the polarization direction of the optical signal, and polarization combining assembly 434 combines multiple polarized beams into a single beam. The polarization assembly adjusts the polarization direction of the optical signal, and then combines the multiple polarized beams into a single beam by the polarization combining assembly, thereby achieving wave combining in the optical emitting component.

[0468] As shown in FIG55 , in some embodiments, the polarization component 433 includes a first polarization component 4331, a second polarization component 4332, and a third polarization component 4333. The first polarization component 4331 is located in the light-emitting direction of the first laser assembly 4311 and is used to adjust the deflection direction of the first wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the first wavelength optical signal is horizontal, i.e., horizontally polarized light. The second polarization component 4332 is located in the light-emitting direction of the second laser assembly 4312 and is used to adjust the deflection direction of the second wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the second wavelength optical signal is vertical, i.e., second vertically polarized light. The third polarization component 4333 is located in the light-emitting direction of the third laser assembly 4313 and is used to adjust the deflection direction of the third wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the third wavelength optical signal is vertical, i.e., first vertically polarized light.

[0469] As shown in Figure 55, in some embodiments, the polarization combining component 434 includes a first polarization combining component 4341, a second polarization combining component 4342 and a third polarization combining component 4343. The first polarization combining component 4341 is located on the left side of the first polarization component 4331, and the first polarization combining component 4341 is located between the third through hole 4211 and the first polarization component 4331. The first polarization combining component 4341 is used to transmit the horizontal polarized light (horizontally polarized light) of the first wavelength optical signal, and is also used to reflect the vertical polarized light (second vertical polarized light) of the second wavelength optical signal and the vertical polarized light (first vertical polarized light) of the third wavelength optical signal, and then combine the three into one optical signal. The second polarization combiner 4342 is located to the left of the second polarization component 4332. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertically polarized light) of the second wavelength optical signal to the first polarization combiner 4341, and to transmit the vertically polarized light (first vertically polarized light) of the third wavelength optical signal to the first polarization combiner 4341. The third polarization combiner 4343 is located to the left of the third polarization component 4333. The third polarization combiner 4343 is configured to reflect the vertically polarized light (first vertically polarized light) of the third wavelength optical signal to the second polarization combiner 4342.

[0470] In some embodiments, the first polarization combining element 4341 is a polarization beam splitter, which can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0471] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the second wavelength optical signal and transmit the third wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is arranged at an angle relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0472] In some embodiments, the third polarization combiner 4343 is a reflector that reflects the third wavelength optical signal. The third polarization combiner 4343 is tilted relative to the central axis of the third polarization component 4333. For example, the angle between the third polarization combiner 4343 and the central axis of the third polarization component 4333 is 45°.

[0473] The polarization component 433 and the polarization combining component 434 shown in Figure 16 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening of the transmitting shell 402 is facing downward in the opposite direction to the opening of the transceiver shell.

[0474] As shown in FIG56 , in some embodiments, a first polarization component 4331 is used to adjust the deflection direction of a first wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the first wavelength optical signal is vertical, i.e., first vertically polarized light. A second polarization component 4332 is used to adjust the deflection direction of a second wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the second wavelength optical signal is vertical, i.e., second vertically polarized light. A third polarization component 4333 is used to adjust the deflection direction of a third wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the third wavelength optical signal is horizontal, i.e., horizontally polarized light.

[0475] As shown in FIG56 , in some embodiments, a third polarization combiner 4343 is located between the third through-hole 4211 and the third polarization component 4333. The first polarization combiner 4341 is configured to reflect the vertically polarized light (first polarized light) of the first wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertical polarized light) of the second wavelength optical signal to the third polarization combiner 4343, and further configured to transmit the vertically polarized light (first polarized light) of the first wavelength optical signal to the third polarization combiner 4343. The third polarization combiner 4343 is configured to transmit the horizontally polarized light (horizontally polarized light) of the third wavelength optical signal and reflect the vertically polarized light (first polarized light) of the first wavelength optical signal and the vertically polarized light (second vertical polarized light) of the second wavelength optical signal to achieve beam combining.

[0476] In some embodiments, the first polarization combiner 4341 is a reflector that reflects the first wavelength optical signal. The first polarization combiner 4341 is tilted relative to the central axis of the first polarization component 4331. For example, the angle between the first polarization combiner 4341 and the central axis of the first polarization component 4331 is 45°.

[0477] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the second wavelength optical signal and transmit the first wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is arranged at an angle relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0478] In some embodiments, the third polarization combiner 4343 is a polarization beam splitter that can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0479] The polarization component 433 and the polarization combining component 434 shown in Figure 56 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening direction of the transmitting shell 402 is the same as the downward direction of the opening of the transceiver shell.

[0480] As shown in FIG55 , the first wavelength optical signal emitted by the first laser assembly 4311 is transmitted to the first lens 4321, collimated by the first lens 4321, and transmitted to the first polarization component 4331. The polarization direction of the first wavelength optical signal is adjusted by the first polarization component 4331 before being transmitted to the first polarization combiner 4341. The second wavelength optical signal emitted by the second laser assembly 4312 is transmitted to the second lens 4322, collimated by the second lens 4322, and transmitted to the second polarization component 4332. The polarization direction of the second wavelength optical signal is adjusted by the second polarization component 4332 before being transmitted to the second polarization combiner 4342. The third wavelength optical signal emitted by the third laser assembly 4313 is transmitted to the third lens 4323, collimated by the third lens 4323, and transmitted to the third polarization component 4333. The polarization direction of the third wavelength optical signal is adjusted by the third polarization component 4333 before being transmitted to the third polarization combiner 4343. The third polarization combiner 4343 reflects the vertically polarized light of the third wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 reflects the vertically polarized light of the second wavelength optical signal to the first polarization combiner 4341 and transmits the vertically polarized light of the third wavelength optical signal to the first polarization combiner 4341. The first polarization combiner 4341 transmits the horizontally polarized light of the first wavelength optical signal and reflects the vertically polarized light of the second wavelength optical signal and the third wavelength optical signal, so that the horizontally polarized light of the first wavelength optical signal, the vertically polarized light of the second wavelength optical signal, and the vertically polarized light of the third wavelength optical signal are combined into one optical signal.

[0481] As shown in FIG57 , after the horizontally polarized light of the first wavelength optical signal, the vertically polarized light of the second wavelength optical signal, and the third wavelength optical signal are combined into a beam of optical signals, the optical signal is first adjusted in the Y direction by the first displacement prism 5171 and then incident on the first filter 5172. Then, the optical signal is incident on the second displacement prism 5173 through the first filter 5172. Then, the optical signal is adjusted in the Y direction by the second displacement prism 5173 and incident on the fourth lens 5174. Finally, the optical signal is converged by the fourth lens 5174.

[0482] Figure 58 is a schematic diagram of the optical axis of the wave plate, the polarization direction of the incident light signal, and the polarization direction of the outgoing light signal provided according to some embodiments of the present disclosure. As shown in Figure 58, a is the polarization direction of the incident light signal, b is the optical axis of the first wave plate, and c is the polarization direction of the outgoing light signal. Figure A is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 45° passes through the wave plate, and Figure B is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 135° passes through the wave plate. Figure C is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 45° passes through the wave plate, and Figure C is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 135° passes through the wave plate. As shown in Figure 58, in some embodiments, the wave plate is a half-wave plate, and the incident linearly polarized light emits linearly polarized light after passing through the half-wave plate. The characteristic of a half-wave plate is that the polarization direction of the incident light and the polarization direction of the outgoing light are symmetrical with respect to the optical axis of the half-wave plate.

[0483] The following only uses the polarization component 433 and the polarization combining component 434 shown in Figure 55 as an example to introduce the beam combining principle of the optical emitting component. Since the optical signal after the polarization combining component combines includes a vertical polarization state and a horizontal polarization state, if a structural component for reverse isolation is provided after the polarization combining component, then at least two isolators need to be provided after the polarization combining component to achieve reverse isolation. Therefore, an isolator can be provided before the polarization combining component. Since the isolator includes a first polarizer, a Faraday plate, and a second polarizer, an isolator is provided before the polarization combining component, and the optical signal emits non-horizontally polarized light and non-vertically polarized light after passing through the isolator. In order to make the optical signal emit horizontally polarized light or vertically polarized light after passing through the polarization component, it is necessary to add a wave plate after the second polarizer. Non-horizontally polarized light emits horizontally polarized light after passing through the wave plate, and non-vertically polarized light emits horizontally polarized light or vertically polarized light after passing through the wave plate. The reverse isolation principle of the isolator is as follows: the Faraday plate rotates in the same direction, and the polarized light passing through the first polarizer cannot return to the first polarizer after the Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate and the second polarizer has a reverse isolation effect.

[0484] In some embodiments, the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 all include a first polarizer, a Faraday plate, a second polarizer and a wave plate. The first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially away from the first laser component. The first wavelength light signal emitted by the first laser component passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate in sequence and is emitted. The angle between the optical axis of the wave plate and the horizontal plane is a preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light or vertical polarized light after passing through the wave plate. For example, the angle between the optical axis of the wave plate of the first polarization component 4331 and the horizontal plane is a first preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the second polarization component 4332 and the horizontal plane is a second preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the third polarization component 4333 and the horizontal plane is a third preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate.

[0485] The first preset angle is different from the second preset angle.

[0486] The polarization direction of the second polarizer of the second polarization assembly is the same as the polarization direction of the second polarizer of the third polarization assembly, so that the second preset angle is the same as the third preset angle.

[0487] In some embodiments, the first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer. For example, the first polarization component 4331 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, the second polarization component 4332 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, and the third polarization component 4333 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer.

[0488] In some embodiments, the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer. For example, the first polarization component 4331 includes a vertical polarizer, a Faraday plate, and a 135° polarizer, the second polarization component 4332 includes a vertical polarizer, a Faraday plate, and a 135° polarizer, and the third polarization component 4333 includes a vertical polarizer, a Faraday plate, and a 135° polarizer.

[0489] In some embodiments, a first polarizer, a Faraday plate, and a second polarizer are sequentially connected to form an isolator. A wave plate is located outside the isolator and is mounted on substrate 404. For example, a horizontal polarizer, a Faraday plate, and a 45° polarizer are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, and a 135° polarizer are sequentially connected to form an isolator. In some embodiments, the first polarizer, the Faraday plate, and the second polarizer are sequentially bonded using glue.

[0490] In some embodiments, a first polarizer, a Faraday plate, a second polarizer, and a wave plate are sequentially connected to form an isolator. This not only facilitates the mounting of the wave plate but also reduces the space required for the transmitter housing. For example, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a wave plate are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, a 135° polarizer, and a wave plate are sequentially connected to form an isolator. In some embodiments, the first polarizer, Faraday plate, second polarizer, and wave plate are sequentially bonded using glue.

[0491] Since the structures of the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 are the same, only the optical axis angles of the wave plates are slightly different. Instead of introducing each polarization component in detail, only the first polarization component 4331 and the second polarization component 4332 are used as examples to introduce the polarization components.

[0492] Taking the first polarization assembly 4331 as an example, the first polarization assembly 4331 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in A of FIG58 , 45° polarized light (i.e., an incident light signal with a 45° polarization direction) is polarized by the first wave plate to produce horizontal polarized light (i.e., an outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane forms a first preset angle, which is 22.5°.

[0493] In some embodiments, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0494] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0495] In some embodiments, the first polarization assembly 4331 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in FIG19B , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the first wave plate to obtain horizontally polarized light (i.e., the outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first predetermined angle, which is 157.5°.

[0496] In some embodiments, the vertical polarizer, the Faraday plate, and the 135° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0497] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0498] The above configuration does not consider adjusting the magnetic poles of the first or fourth isolators. If the magnetic poles of the fourth isolator are adjusted, the fourth isolator includes a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the first isolator are adjusted, the first isolator includes a vertical polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The first wave plate's optical axis forms an angle of 22.5° with the horizontal plane.

[0499] Taking the second polarization assembly 4332 as an example, the second polarization assembly 4332 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and second wave plate are sequentially spaced away from the second laser assembly 4312. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in C of FIG19 , the 45° polarized light (i.e., the incident light signal with a 45° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second preset angle of 67.5°.

[0500] In some embodiments, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0501] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0502] In some embodiments, the second polarization assembly 4332 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and second wave plate are sequentially positioned away from the second laser assembly 4312. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in D of FIG58 , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second predetermined angle, which is 112.5°.

[0503] In some embodiments, the vertical polarizer, the Faraday plate, and the 135° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0504] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0505] The above configuration does not consider adjusting the magnetic poles of the second or fifth isolators. If the magnetic poles of the fifth isolator are adjusted, the fifth isolator will include a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the second isolator are adjusted, the second isolator will include a vertical polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The angle between the optical axis of the second wave plate and the horizontal plane is 67.5°.

[0506] The third polarization component 4333 may include a sixth isolator and a third wave plate, or may include a third isolator, wherein the third isolator includes a third wave plate, and the third wave plate is positioned at a third predetermined angle with the horizontal plane. Both the third polarization component 4333 and the second polarization component 4332 function to adjust the deflection direction of the optical signal so that the polarization direction of the optical signal is vertical. Therefore, the sixth isolator is identical to the fifth isolator, and the third isolator is identical to the second isolator, and their details are not further described here.

[0507] The sixth isolator is the same as the fifth isolator, which means that the sixth isolator can be any embodiment of the fifth isolator; the third isolator is the same as the second isolator, which means that the third isolator can be any embodiment of the second isolator.

[0508] Figure 59 is a decomposition diagram of the supporting member, the second polarization combining member and the third polarization combining member provided according to some embodiments. As shown in Figure 59, a supporting member 407 is also provided on the substrate 404. One side of the supporting member 407 supports the third polarization combiner 4343, and the other side of the supporting member 407 supports the second polarization combiner 4342. The third polarization combiner 4343 is arranged parallel to the second polarization combiner 4342. The supporting member 407 is provided with a first through hole, one end of which is connected to the third polarization combiner 4343, and the other end of the first through hole is directed toward the third polarization component 4333, so that the vertically polarized light of the third wavelength optical signal emitted by the third polarization component 4333 is incident on the third polarization combiner 4343 through the first through hole; the supporting member 407 is also provided with a second through hole, one end of which is connected to the second polarization combiner 4342, and the other end of the second through hole is connected to the third polarization combiner 4343, so that the third wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 through the second through hole.

[0509] Figure 60 is a structural diagram of a supporting member provided according to some embodiments. Figure 61 is a structural diagram of a supporting member provided according to some embodiments from another perspective. Figure 62 is a cross-sectional view of a supporting member provided according to some embodiments. As shown in Figures 60, 61 and 62, in some embodiments, the side surface of the supporting member 407 includes a first limiting surface 471, a first supporting surface 472, a second limiting surface 473, a first connecting surface 474, a second connecting surface 475, a third limiting surface 476, a second supporting surface 477, a third connecting surface and a fourth connecting surface, and the first limiting surface 471, the first supporting surface 472, the second limiting surface 473, the first connecting surface 474, the second connecting surface 475, the third limiting surface 476, the second supporting surface 477, the third connecting surface and the fourth connecting surface are connected in sequence. The first supporting surface 472 supports the third polarization combining component 4343, and the first limiting surface 471, the first supporting surface 472 and the second limiting surface 473 are connected in sequence to form a recessed limiting groove to limit the third polarization combining component 4343; the first connecting surface 474 is in contact and connected with the fourth sub-emitting side plate 4241 of the fourth emitting side plate 424, and the second connecting surface 475 faces the third polarization component 4333; the second supporting surface 477 supports the second polarization combining component 4342, and the third limiting surface 476 is connected to the second supporting surface 477 to form a recessed limiting groove to limit the second polarization combining component 4342.

[0510] In some embodiments, the first supporting surface 472 and the second supporting surface 477 are arranged in parallel to ensure that the vertically polarized light of the third wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 as much as possible.

[0511] As shown in Figures 60, 61 and 62, one end of the first through hole 478 is located at the second connecting surface 475, the other end of the first through hole 478 is located at the first supporting surface 472, one end of the second through hole 479 is located at the first supporting surface 472, and the other end of the second through hole 479 is located at the second supporting surface 477. The first through hole 478 is connected to the second through hole 479, so that the third polarization combiner 4343 receives the vertical polarized light of the third wavelength optical signal through the first through hole 478, and reflects the vertical polarized light of the third wavelength optical signal to the second polarization combiner 4342 through the second through hole 479.

[0512] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: An optical fiber adapter, one end of which is configured to connect to an external optical fiber to transmit a fourth-wavelength optical signal, a fifth-wavelength optical signal, and a sixth-wavelength optical signal input through the external optical fiber; An optical accommodating component, including a first housing; one end of the first housing is connected to the other end of the optical fiber adapter, and a first mirror and a second mirror are arranged in the first housing, and the first mirror and the second mirror are configured to reflect the fourth-wavelength optical signal, the fifth-wavelength optical signal, and the sixth-wavelength optical signal; A first optical receiving component, connected to the first housing, and the light incident end of the first optical receiving component is located in the first housing; the first optical receiving component is located on the reflection optical path of the first mirror, and the first optical receiving component receives at least one of the fourth-wavelength optical signal, the fifth-wavelength optical signal, and the sixth-wavelength optical signal reflected by the first mirror, and outputs at least one of a first voltage signal, a second voltage signal, or a third voltage signal; A circuit board, provided with a gold finger, an MCU, a first limiting amplifier, a second limiting amplifier, and a filtering circuit; the input ends of the first limiting amplifier and the second limiting amplifier are connected to the first optical receiving component through the filtering circuit, and the output ends of the first limiting amplifier and the second limiting amplifier are respectively connected to the gold finger; the filtering circuit diverts the second voltage signal to the first limiting amplifier, so that the first limiting amplifier amplifies or limits and shapes the second voltage signal and transmits it to the gold finger; the first voltage signal and the third voltage signal are transmitted to the second limiting amplifier through the filtering circuit; The MCU is controllably connected to the second limiting amplifier to enable the second limiting amplifier to amplify or limit and shape the first voltage signal or the third voltage signal through a control signal and transmit it to the gold finger through a corresponding output end; The optical module further includes: An optical transmitting component, including: A laser component, configured to emit a first-wavelength optical signal, a second-wavelength optical signal, and a third-wavelength optical signal; A polarization component, configured to adjust the polarization direction of the optical signal; the polarization component includes a first polarization component, a second polarization component, and a third polarization component, and the first polarization component, the second polarization component, and the third polarization component each include a first polarizer, a Faraday plate, a second polarizer, and a wave plate. The first polarizer, the Faraday plate, the second polarizer, and the wave plate are arranged in sequence away from the laser component. After the first-wavelength optical signal passes through the first polarizer, the Faraday plate, the second polarizer, and the wave plate of the first polarization component in sequence, horizontally polarized light is emitted. After the third-wavelength optical signal passes through the first polarizer, the Faraday plate, the second polarizer, and the wave plate of the third polarization component in sequence, first vertically polarized light is emitted. After the second-wavelength optical signal passes through the first polarizer, the Faraday plate, the second polarizer, and the wave plate of the second polarization component in sequence, second vertically polarized light is emitted; The multiplexing component is configured to combine the optical signals of the first wavelength, the second wavelength, and the third wavelength into one beam.

2. The optical module according to claim 1, wherein The fiber optic adapter is configured to transmit the time-division multiplexed optical signal input by the external optical fiber, and the time-division multiplexed optical signal includes the optical signals of the fourth wavelength, the fifth wavelength, and the sixth wavelength; The first mirror is located on the reflection optical path of the second mirror; the optical signals of the fourth wavelength, the fifth wavelength, and the sixth wavelength are transmitted to the second mirror and reflected by the second mirror and then transmitted to the first mirror; The first optical receiving component receives the optical signals of the fourth wavelength, the fifth wavelength, and the sixth wavelength reflected by the first mirror, and outputs the first voltage signal, the second voltage signal, or the third voltage signal.

3. The optical module according to claim 2, wherein, The second limiting amplifier includes a fourth output channel and a fifth output channel, and the fourth output channel and the fifth output channel are respectively connected to the gold fingers; The MCU outputs a fourth control signal to the second limiting amplifier at a first target time, so that the second limiting amplifier amplifies or limits and shapes the first voltage signal, and outputs the processed first voltage signal to the gold fingers through the fourth output channel; The MCU outputs a fifth control signal to the second limiting amplifier at a third target time, so that the second limiting amplifier amplifies or limits and shapes the third voltage signal, and outputs the processed third voltage signal to the gold fingers through the fifth output channel.

4. The optical module according to claim 2, wherein, A first displacement prism and a first lens are further arranged in the first housing. The first displacement prism includes a first reflection surface and a second reflection surface. The first reflection surface is located on the extension line of the optical axis of the fiber optic adapter, and the second reflection surface is located on the incident optical axis of the second mirror; the first lens is located between the fiber optic adapter and the first reflection surface.

5. The optical module according to claim 2, wherein, The first optical receiving component includes a first detector and a first TIA. The output end of the first detector is connected to the input end of the first TIA, and the output end of the first TIA is connected to the filter circuit; The MCU is controllably connected to the first TIA. The MCU sends a first configuration signal to the first TIA at a first target time, so that the first TIA converts the first current signal output by the first detector into a first voltage signal according to the first configuration; the MCU sends a second configuration signal to the first TIA at a second target time, so that the first TIA converts the second current signal output by the first detector into a second voltage signal according to the second configuration; the MCU sends a third configuration signal to the first TIA at the second target time, so that the first TIA converts the third current signal output by the first detector into a third voltage signal according to the third configuration.

6. The optical module according to claim 2, wherein, The optical transmitting component further includes: A second housing, and the laser component is arranged in the second housing; the laser component includes: a first laser component, a second laser component, and a third laser component; the multiplexing component includes a second filter and a third filter; The second housing includes two connected side walls, and the first laser component, the second laser component, and the third laser component are distributed on the sides of the two connected side walls. The first laser component generates a first-wavelength optical signal, the second laser component generates a second-wavelength optical signal, and the third laser component generates a third-wavelength optical signal; Multiple rows of pins are respectively arranged on the two connected side walls. The bottom row of pins on the two connected side walls includes high-frequency pins, and the ends of the high-frequency pins extend into the second housing; An optical output port is arranged at one end of the second housing, and the optical output port is optically connected to the first housing; The second filter and the third filter are arranged side by side on the side of the optical output port. The first optical surface of the second filter faces the third laser component, the second optical surface of the second filter faces the third optical surface of the third filter, the third optical surface faces the second laser component, and the fourth optical surface of the third filter faces the first laser component; The first laser component, the second laser component, and the third laser component are respectively electrically connected to corresponding high-frequency pins.

7. The optical module according to claim 1, further comprising: A second optical receiving component, located on a side wall of the first housing with the first optical receiving component; A third optical receiving component, located on the other side wall of the first housing; An optical component, comprising: A first filter, located between the optical transmitting component and the fiber optic adapter to achieve transmission of the transmitted optical signal and reflection of the received optical signal; A first reflector, located on the reflection optical path of the first filter; A second reflector, located on the reflection optical path of the first reflector; A wavelength division component, the first end is correspondingly arranged with the first end of the first housing, and the second end is correspondingly arranged with the second end of the first housing; The first end of the wavelength division component includes an incident light place and a first output light place, the incident light place is located on the reflection optical path of the second reflector, the incident light place and the first output light place are adjacent to each other, the second end of the wavelength division component includes a second output light place and a third output light place, the received optical signal is split after entering the wavelength division component through the incident light place, the fourth-wavelength optical signal is transmitted through the first output light place, the fifth-wavelength optical signal is transmitted through the second output light place, and the sixth-wavelength optical signal is transmitted through the third output light place; A third reflector, located on the output optical path of the first output light place; The first optical receiving component is located on the reflection optical path of the third reflector, and the first filter and the first reflector are both located in the opposite direction of the reflection optical path of the third reflector; A beam splitting prism, including a first reflection surface and a second reflection surface. The first reflection surface is located on the output optical path of the second output light place, the second optical receiving component is located on the reflection optical path of the first reflection surface, the second reflection surface is located on the output optical path of the third output light place, and the third optical receiving component is located on the reflection optical path of the second reflection surface.

8. The optical module according to claim 7, wherein, The first housing includes: A first side wall, connected to the fiber optic adapter; The second sidewall, one end of which is connected to one end of the first sidewall; the first light receiving component and the second light receiving component are provided on the second sidewall; The third sidewall, one end of which is connected to the other end of the second sidewall and is connected to the light emitting component; The fourth sidewall, one end of which is connected to the other end of the third sidewall and the other end of which is connected to the other end of the first sidewall; the third light receiving component, the first filter and the first reflector are provided on the fourth sidewall, so that the fourth wavelength optical signal is reflected by the third reflector and then directed to the first light receiving component provided on the second sidewall.

9. The optical module according to claim 7, wherein, The inclination angle of the first filter is a first preset angle, the inclination angle of the first reflector is a second preset angle, and the inclination angle of the second reflector is a third preset angle. The first preset angle, the second preset angle and the third preset angle cooperate with each other so that the received optical signal is emitted parallel to the length direction of the light receiving component.

10. The optical module according to claim 8, wherein, The fourth sidewall includes: The first support portion having a connection hole; the third light receiving component is disposed in the connection hole; The support member, one end of which is connected to the side surface of the first support portion, the other end of which is not connected to the second sidewall, one side of which is not connected to the first sidewall, and the other side of which is not connected to the third sidewall; the first filter is provided on the surface of the support member close to the second sidewall, the support member has a first light passing hole, the first light passing hole is correspondingly arranged with the first connection hole of the first sidewall, and the first light passing hole is correspondingly arranged with the second connection hole of the third sidewall, so that the emitted optical signal is incident on the fiber optic adapter through the second connection hole, the first light passing hole, the first filter and the first connection hole in sequence; The second support portion, one end of which is connected to the other end of the support member; the vertical distance between the second support portion and the second sidewall is greater than the vertical distance between the first support portion and the second sidewall; The third support portion, one end of which is connected to the other end of the second support portion and the other end of which is connected to the first sidewall; the first reflector is provided on the surface of the third support portion facing the second sidewall.

11. The optical module according to claim 10, wherein, The wavelength division component includes a substrate, one sidewall of the substrate close to the light incident place abuts against the second sidewall, and the vertical distance between the other sidewall of the substrate far from the light incident place and the second sidewall is less than the vertical distance between the first light passing hole and the second sidewall, so as to prevent the emitted optical signal from passing through the substrate.

12. The optical module according to claim 7, wherein, The wavelength division component includes: The substrate, the first end of which is correspondingly arranged with the first end of the light receiving component, and the second end of which is correspondingly arranged with the second end of the light receiving component; the second end of the substrate has a first reflection place where the received optical signal is allowed to be reflected; the first end of the substrate has the light incident place and a second reflection place where the received optical signal is allowed to be transmitted and the sixth wavelength optical signal is allowed to be reflected; The first wave plate is disposed between the light incident place and the second reflection place to allow the fourth wavelength optical signal to be transmitted; A second wave plate, which is disposed adjacent to the first reflection location to allow a fifth-wavelength optical signal to transmit therethrough; A third wave plate, which is disposed adjacent to the second wave plate to allow a sixth-wavelength optical signal to transmit therethrough.

13. The optical module according to claim 7, wherein, A first filter is disposed between the reflection surface of the third reflector and the first light output location, or between the reflection surface of the third reflector and the first optical receiving component, and the first filter is configured to filter out the fifth-wavelength optical signal and the sixth-wavelength optical signal; A second filter is disposed between the first reflection surface and the second light output location, or between the first reflection surface and the second optical receiving component, and the second filter is configured to filter out the fourth-wavelength optical signal and the sixth-wavelength optical signal; A third filter is disposed between the second reflection surface and the third light output location, or between the second reflection surface and the third optical receiving component, and the third filter is configured to filter out the fifth-wavelength optical signal and the sixth-wavelength optical signal.

14. The optical module according to claim 7, wherein, An isolator is disposed between the optical transmitting component and the first optical component, and the isolator is configured to block the transmitted optical signal from returning along the original path, and the transmitted optical signal includes a first-wavelength optical signal, a second-wavelength optical signal, and a third-wavelength optical signal; Alternatively, an isolator array is disposed inside the optical transmitting component, the isolator array includes a first isolator, a second isolator, and a third isolator, the first isolator is configured to block the first-wavelength optical signal from returning along the original path, the second isolator is configured to block the second-wavelength optical signal from returning along the original path, and the third isolator is configured to block the third-wavelength optical signal from returning along the original path.

15. The optical module according to claim 1, wherein, The multiplexing component includes a first polarization multiplexing component, a second polarization multiplexing component, and a third polarization multiplexing component. The third polarization multiplexing component is configured to reflect a first vertically polarized light to the second polarization multiplexing component. The second polarization multiplexing component is configured to transmit the first vertically polarized light to the first polarization multiplexing component, and further reflect a second vertically polarized light to the first polarization multiplexing component. The first polarization multiplexing component is configured to reflect the second vertically polarized light and the first vertically polarized light, and further transmit a horizontally polarized light to achieve beam combination.

16. The optical module according to claim 15, wherein, The first polarizer, the Faraday plate, the second polarizer, and the wave plate are sequentially connected to form an isolator; The optical axis of the wave plate of the first polarization component forms a fourth preset angle with the horizontal plane so that the first polarization component emits a horizontally polarized light; the optical axis of the wave plate of the second polarization component forms a fifth preset angle with the horizontal plane so that the second polarization component emits a vertically polarized light; the optical axis of the wave plate of the third polarization component forms a sixth preset angle with the horizontal plane so that the third polarization component emits a vertically polarized light; The fourth preset angle is different from the fifth preset angle; The polarization directions of the second polarizers of the second polarization component and the third polarization component are the same so that the fifth preset angle is the same as the sixth preset angle.

17. The optical module according to claim 15, wherein The first polarizer, the Faraday plate, and the second polarizer are sequentially connected to form an isolator, and the wave plate is located outside the isolator; The angle between the optical axis of the wave plate of the first polarization component and the horizontal plane is a fourth preset angle, so that the first polarization component emits horizontally polarized light; the angle between the optical axis of the wave plate of the second polarization component and the horizontal plane is a fifth preset angle, so that the second polarization component emits vertically polarized light; the angle between the optical axis of the wave plate of the third polarization component and the horizontal plane is a sixth preset angle, so that the third polarization component emits vertically polarized light; the fourth preset angle is different from the fifth preset angle; the polarization direction of the second polarizer of the second polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the fifth preset angle is the same as the sixth preset angle.

18. The optical module according to claim 15, wherein, The first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer; the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer.

19. The optical module according to claim 15, wherein, The optical emission component further includes a supporting member, the supporting member includes a first supporting surface and a second supporting surface, the first supporting surface is used to support the third polarization combining component, the second supporting surface is used to support the second polarization combining component, and the first supporting surface and the second supporting surface are arranged in parallel; The supporting member has a first through hole and a second through hole. One end of the first through hole and one end of the second through hole are both located on the first supporting surface. The other end of the first through hole is located on the surface of the supporting member facing the third polarization combining component. The other end of the second through hole is located on the second supporting surface, and the first through hole and the second through hole are communicated with each other.

20. The optical module according to claim 19, wherein, The optical emission component further includes an emission housing. A third through hole is provided at the first end of the emission. The central axis of the third through hole coincides with the central axis of the first polarization combining component, so that the optical signal combined by the first polarization combining component is emitted through the first through hole; An emission pin is provided at the second end of the emission housing. One end of the emission pin is connected to the circuit board, and the other end of the emission pin extends into the emission housing and is wire-bonded to the laser component in the emission housing.

21. The optical module according to claim 20, wherein, The emission housing includes a first emission side plate, a second emission side plate, a third emission side plate and a fourth emission side plate. The first emission side plate, the second emission side plate, the third emission side plate and the fourth emission side plate are connected end to end. The first emission side plate is provided with a third through hole. The third emission side plate includes a first sub-emission side plate, a second sub-emission side plate and a third sub-reflection plate. The first sub-emission side plate, the second sub-emission side plate and the third sub-reflection plate are in a stepped shape. The fourth emission side plate includes a fourth sub-emission side plate and a fifth sub-emission side plate. The fourth sub-emission side plate and the fifth sub-emission side plate are in a stepped shape. The first sub-emission side plate is connected to the fourth sub-emission side plate to limit the substrate, wherein the substrate supports the laser component.

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