Laser processing method, controller, laser processing equipment and circuit board

Abstract

The invention is suitable for the technical field of laser processing, and provides a laser processing method, a controller, laser processing equipment and a circuit board. The laser processing method comprises the following steps: acquiring a target laser movement track of a to-be-processed workpiece; decomposing the target laser motion track into a first motion component of a first light beam deflection mechanism and a second motion component of a second light beam deflection mechanism; the first target speed of the first light beam deflection mechanism and the initial speed of the second light beam deflection mechanism when the second light beam deflection mechanism enters the second motion component are determined according to the processing point location distribution of the first motion component, and the initial speed is larger than 0; and controlling the first light beam deflection mechanism to execute the first motion component at the first target speed, and controlling the second light beam deflection mechanism to start speed change from the initial speed to a second target speed so as to execute the second motion component. According to the embodiment of the invention, the laser processing efficiency can be improved.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and particularly relates to a laser processing method, controller, laser processing equipment and circuit board. Background Technology

[0002] In the electronics manufacturing industry, various laser processing techniques, such as laser windowing, laser cleaning, and laser drilling, are widely used. For example, in the manufacturing of flexible printed circuit boards (FPCs), before the FPC cover film is bonded to the circuit layer, windows need to be cut at corresponding positions in the cover film according to the circuit design requirements, exposing the circuits or pads for subsequent surface treatment to achieve the functions of connection and component placement. In the manufacturing of printed circuit boards (PCBs), laser processing can be used to remove the solder mask layer. In related technologies, laser processing can be achieved through the linkage control of a galvanometer and a modulated deflector. However, in practical applications, because the galvanometer needs to undergo acceleration and / or deceleration processes when changing between different deflection speeds, when laser processing large batches of patterns, the galvanometer needs to constantly adjust the deflection speed between the laser processing path segment and the non-processing path segment. The acceleration and deceleration time between different deflection speeds results in low laser processing efficiency. Summary of the Invention

[0003] This application provides a laser processing method, controller, laser processing equipment, and circuit board, which can reduce the acceleration and deceleration time between different deflection speeds, thereby improving the efficiency of laser processing.

[0004] A first aspect of this application provides a laser processing method, comprising: acquiring a target laser motion trajectory of a workpiece to be processed; decomposing the target laser motion trajectory into a first motion component and a second motion component of a second beam deflection mechanism, wherein the speed at which the first beam deflection mechanism controls the laser beam deflection is greater than the speed at which the second beam deflection mechanism controls the laser beam deflection; determining a first target speed of the first beam deflection mechanism and an initial speed of the second beam deflection mechanism when entering the second motion component based on the processing point distribution of the first motion component, wherein the initial speed is greater than 0; controlling the first beam deflection mechanism to execute the first motion component at the first target speed, and controlling the second beam deflection mechanism to start changing speed from the initial speed to the second target speed to execute the second motion component.

[0005] In some embodiments of the first aspect, determining the initial velocity of the second beam deflection mechanism when entering the second motion component based on the processing point distribution of the first motion component includes: determining the total processing time required for the first beam deflection mechanism to complete the first motion component based on the processing point distribution of the first motion component; and determining the initial velocity based on the total processing time and the motion trajectory of the second beam deflection mechanism on the first motion component.

[0006] In some embodiments of the first aspect, determining the total processing time required for the first beam deflection mechanism to complete the first motion component based on the processing point distribution of the first motion component includes: obtaining the single-point processing time and the jump time between processing points of the first beam deflection mechanism at each processing point; and determining the total processing time based on the number of processing points, the single-point processing time, and the jump time.

[0007] In some embodiments of the first aspect, the laser processing method further includes: controlling the second beam deflection mechanism to deflect during the process of controlling the first beam deflection mechanism to execute the first motion component at the first target speed, so that the second beam deflection mechanism reaches the end of the first motion component at the initial speed; and controlling the first beam deflection mechanism to remain stationary during the process of controlling the second beam deflection mechanism to start changing speed from the initial speed to the second target speed to execute the second motion component.

[0008] In some embodiments of the first aspect, the process of controlling the first beam deflection mechanism to execute the first motion component at the first target speed further includes: dynamically adjusting the frequency of the control signal of the first beam deflection mechanism.

[0009] In some embodiments of the first aspect, the dynamic adjustment of the control signal frequency of the first beam deflection mechanism includes: determining the target size of the filling spot based on the structure to be processed to which the current processing position belongs; and adjusting the control signal frequency of the acoustic control signal used to drive the first beam deflection mechanism based on the target size.

[0010] In some embodiments of the first aspect, obtaining the target laser motion trajectory of the workpiece to be processed includes: obtaining a processing partition of a second beam deflection mechanism on the workpiece to be processed, the processing partition of the second beam deflection mechanism comprising one or more structures to be processed; generating a target laser motion trajectory for processing the processing partition of the second beam deflection mechanism, the target laser motion trajectory being configured to cover the entire processing partition, or being configured to cover each of the one or more structures to be processed respectively.

[0011] A second aspect of this application provides a controller, including a memory, a processor, and a computer program stored in the memory and executable on the processor; the processor executes the computer program to implement the steps of the laser processing method described above.

[0012] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the laser processing method described above.

[0013] The fourth aspect of this application provides a computer program product that, when run, causes the above-described laser processing method to be executed.

[0014] The fifth aspect of this application provides a laser processing apparatus, comprising: a laser for emitting a laser beam; a beam control system including a first beam deflection mechanism and a second beam deflection mechanism, the beam control system being used to transmit, control, and deflect the laser beam; a processing platform for carrying a workpiece to be processed; and a controller for controlling the laser, the beam control system, and the processing platform to work together to achieve the laser processing method as described in any one of the first aspects.

[0015] The sixth aspect of this application provides a circuit board that is processed according to the method described in any one of the first aspects or based on the laser processing equipment described in any one of the fifth aspects.

[0016] In the embodiments of this application, the target laser motion trajectory of the workpiece to be processed is decomposed into a first motion component of the first beam deflection mechanism and a second motion component of the second beam deflection mechanism. Based on the processing point distribution of the first motion component, a first target speed of the first beam deflection mechanism and an initial speed greater than 0 of the second beam deflection mechanism when entering the second motion component are determined. Subsequently, the first beam deflection mechanism is controlled to execute the first motion component at the first target speed, and the second beam deflection mechanism is controlled to start changing speed from the initial speed to the second target speed to execute the second motion component. In this way, the second beam deflection mechanism does not need to start accelerating from 0 again, but can start accelerating from the initial speed reserved for it, reducing the acceleration and deceleration time between different deflection speeds and improving laser processing efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram illustrating the implementation process of a laser processing method provided in an embodiment of this application; Figure 2 This is a first schematic diagram of the processing partition of the second beam deflection mechanism provided in the embodiments of this application; Figure 3 This is a second schematic diagram of the processing zone of the second beam deflection mechanism provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of a controller provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are protected by this application.

[0020] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0021] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0022] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0023] In related technologies, laser processing can be achieved through the coordinated control of a galvanometer and a modulation deflector. However, in practical applications, because the galvanometer needs to undergo acceleration and / or deceleration when changing between different deflection speeds, when processing large batches of patterns, the galvanometer needs to constantly adjust its deflection speed between the processing and non-processing segments of the laser beam. The acceleration and deceleration time between different deflection speeds results in low laser processing efficiency. Specifically, the galvanometer deflects to the processing start point of a modulation deflector's scanning range and then stops. The modulation deflector continues to deflect to complete the scanning within that range, and then the galvanometer deflects again to the next modulation deflector's scanning range and then stops. During this process, the galvanometer stops in the processing segment, rapidly accelerates to a high moving speed v in the non-processing segment, and then precisely decelerates to 0 when reaching the next scanning segment; that is, the speed constantly changes between 0, v, and 0. When performing laser processing of large batches of patterns, the galvanometer needs to continuously change its deflection speed between the processing path segment and the non-processing path segment of the laser. The acceleration and deceleration time between different deflection speeds results in low laser processing efficiency.

[0024] In view of this, this application proposes a laser processing method that enables the galvanometer to accelerate from an initial velocity reserved for it, without having to start from zero again, thereby reducing the acceleration and deceleration time between different deflection velocities and improving laser processing efficiency.

[0025] To illustrate the technical solution of this application, specific embodiments are described below.

[0026] Figure 1 A schematic diagram illustrating the implementation flow of a laser processing method provided in an embodiment of this application is shown. This method can be applied to a controller. The controller can be installed on a laser processing device.

[0027] Specifically, the laser processing method described above may include the following steps S101 to S104.

[0028] Step S101: Obtain the target laser motion trajectory of the workpiece to be processed.

[0029] In the embodiments of this application, the workpiece to be processed is a workpiece that requires laser processing, including but not limited to circuit boards, sheet metal, and mechanical parts. The circuit board refers to a packaging substrate used to carry and realize the interconnection of different chips and / or electronic components, including various PCB boards such as ordinary boards, multilayer boards, high-density interconnect (HDI) boards, and FPCs, as well as integrated circuit package substrates (IC package substrates) composed of organic substrates, ceramic substrates, glass substrates, or other novel substrates. The target laser motion trajectory is a pre-planned, continuous laser focus movement path to achieve the processing task of the workpiece to be processed. The target laser motion trajectory can be obtained according to actual processing requirements.

[0030] In embodiments of this application, the target laser motion trajectory may include a processing path segment and a non-processing path segment. The processing path segment is the portion of the target laser motion trajectory that covers the structure to be processed, also known as the laser scanning path. The non-processing path segment is the portion of the target laser motion trajectory other than the processing path segment.

[0031] Step S102: Decompose the target laser motion trajectory into the first motion component of the first beam deflection mechanism and the second motion component of the second beam deflection mechanism.

[0032] In this design, the first beam deflection mechanism controls the laser beam to deflect at a speed greater than that controlled by the second beam deflection mechanism. The first beam deflection mechanism can be used for small-range, rapid point-to-point deflection or complex trajectory movements, and can specifically refer to a modulation deflector. A modulation deflector is an optical device with beam manipulation capabilities; common types include electro-optic deflectors, acousto-optic deflectors, and liquid crystal phased arrays. These devices can dynamically change the refractive index distribution of a transparent medium using physical effects such as electro-optic, acousto-optic, or liquid crystal birefringence, thereby deflecting the transmitted light beam. They can also precisely control the phase of the beam using optical phased array technology, ultimately achieving beam deflection and scanning functions. For example, in a specific embodiment, the first beam deflection mechanism is specifically an acousto-optic deflector (AOD). The second beam deflection mechanism can be used to perform large-scale or continuous scanning motion. Specifically, it refers to a mechanical deflection mechanism. The mechanical deflection mechanism can use a motor to drive the optical lens to deflect in order to control the direction of beam propagation. It includes a galvanometer, a rotating mirror, a galvanometer scanner, etc. For example, in a specific embodiment, the second beam deflection mechanism specifically refers to a galvanometer.

[0033] Specifically, the target laser trajectory consists of processing points of a continuous laser beam and / or a set of pulsed laser beams. Each processing point corresponds to the center position of the laser spot formed by the laser beam on the surface of the workpiece, which can be represented in coordinate form. By decomposing the target laser trajectory, a first motion component and a second motion component can be obtained. The first motion component corresponds to the aforementioned processing path segment and is suitable for switching via a first beam deflection mechanism, while the second motion component corresponds to the aforementioned non-processing path segment and is suitable for switching via a second beam deflection mechanism.

[0034] Step S103: Based on the processing point distribution of the first motion component, determine the first target velocity of the first beam deflection mechanism and the initial velocity of the second beam deflection mechanism when entering the second motion component.

[0035] The first target velocity is the velocity at which the first beam deflection mechanism deflects on the first motion component. The distribution of processing points on the first motion component determines the processing time required by the first beam deflection mechanism on the first motion component, and therefore can be used to determine the first target velocity of the first beam deflection mechanism, so that when the first beam deflection mechanism deflects at the first target velocity, the laser beam can perform processing at each processing point according to the processing requirements.

[0036] Meanwhile, to ensure that the second beam deflection mechanism has an initial velocity greater than 0 when entering the second motion component, based on the processing time required by the first beam deflection mechanism in the first motion component, determined by the processing point distribution, the velocity that the second beam deflection mechanism can maintain when both mechanisms reach the end of the first motion component synchronously can be determined. This maintained velocity is also the initial velocity of the second beam deflection mechanism when entering the second motion component.

[0037] Step S104: Control the first beam deflection mechanism to execute the first motion component at the first target speed, and control the second beam deflection mechanism to start changing speed from the initial speed to the second target speed to execute the second motion component.

[0038] The second target speed is the speed at which the second beam deflection mechanism deflects on the second motion component. It can be a preset value or a value determined according to processing requirements or the structural parameters of the second beam deflection mechanism.

[0039] In the embodiments of this application, the first beam deflection mechanism and the second beam deflection mechanism can be controlled to work synchronously. During the execution of the first motion component, the first beam deflection mechanism deflects the beam at a first target speed to achieve laser processing of the structure to be processed. Simultaneously, during the execution of the second motion component, the second beam deflection mechanism starts from the initial speed retained in the first motion component, accelerates to the second target speed, and deflects the beam at the second target speed to achieve a jump in the second motion component. Thus, when the second beam deflection mechanism is not on the processing path segment, it no longer needs to accelerate from 0, but can accelerate from the first target speed.

[0040] In the embodiments of this application, the target laser motion trajectory of the workpiece to be processed is decomposed into a first motion component of the first beam deflection mechanism and a second motion component of the second beam deflection mechanism. Based on the processing point distribution of the first motion component, a first target speed of the first beam deflection mechanism and an initial speed greater than 0 of the second beam deflection mechanism when entering the second motion component are determined. Subsequently, the first beam deflection mechanism is controlled to execute the first motion component at the first target speed, and the second beam deflection mechanism is controlled to start changing speed from the initial speed to the second target speed to execute the second motion component. In this way, the second beam deflection mechanism does not need to start accelerating from 0 again, but can start accelerating from the initial speed reserved for it, reducing the acceleration and deceleration time between different deflection speeds and improving laser processing efficiency.

[0041] In some embodiments of this application, obtaining the target laser motion trajectory of the workpiece to be processed may include: obtaining the processing partition of the second beam deflection mechanism on the workpiece to be processed; and generating the target laser motion trajectory for processing the processing partition of the second beam deflection mechanism.

[0042] The processing zone of the second beam deflection mechanism refers to the maximum laser scanning range set for the second beam deflection mechanism. This processing zone can contain one or more structures to be processed. These structures are those to be formed through laser processing. The shape and distribution of each structure within the processing zone can be designed based on the laser processing requirements. For the processing zone of the second beam deflection mechanism, a path planning algorithm can be used to fill the path within the zone, obtaining the target laser trajectory. This target laser trajectory can be configured to cover the entire processing zone, or to cover each of the one or more structures to be processed. For details, please refer to [link to relevant documentation]. Figure 2 , Figure 2A schematic diagram is shown showing the target laser trajectory covering the entire processing area. The dashed box 21 represents the processing area of ​​the second beam deflection mechanism, the gray background graphic represents the structure to be processed 22, and the solid line 23 represents the target laser trajectory. It can be understood that the arrangement of the target laser trajectory is not limited to... Figure 2 In some implementations, the laser scanning paths within each structure to be processed can be arranged in a non-lateral manner (e.g., diagonal, vertical). In other implementations, such as... Figure 3 As shown, Figure 3 The diagram shows a target laser trajectory covering each of one or more structures to be processed, where the laser trajectory is continuously processed within each structure.

[0043] It should be noted that the path planning algorithms here include, but are not limited to, path filling and contour offset filling, which can be selected according to the processing requirements.

[0044] After obtaining the target laser processing path, vector decomposition can be performed to obtain the first motion component and the second motion component.

[0045] Specifically, decomposing the target laser trajectory into a first motion component of the first beam deflection mechanism and a second motion component of the second beam deflection mechanism may include: obtaining the coordinate transformation matrix between the first beam deflection mechanism and the second beam deflection mechanism; and decomposing the target laser trajectory into the first motion component and the second motion component based on the coordinate transformation matrix.

[0046] Specifically, the coordinates of the processing point can be represented as a vector superposition of the coordinates of the first beam deflection mechanism and the coordinates of the second beam deflection mechanism: (1); These are the coordinates of the processing point. These are the coordinates in the coordinate system of the second beam deflection mechanism. These are the coordinates within the coordinate system of the first beam deflection mechanism. It is a coordinate transformation matrix used to map the coordinates of the first beam deflection mechanism to the coordinate system of the second beam deflection mechanism.

[0047] As shown in formula (1), the coordinates of each processing point can be decomposed into the motion component executed by the second beam deflection mechanism and the motion component executed by the first beam deflection mechanism. By performing low-pass filtering on the coordinates of the processing point, the second motion component can be obtained, eliminating high-frequency jitter. The second motion component can be expressed as: (2); LPF() indicates that a low-pass filter (LPF) is used for low-pass filtering. That is, the coordinates of a certain processing point. This is the second motion component at the processing point.

[0048] At this point, subtracting the second motion component from the coordinates of the processing point, that is, subtracting the non-processing path segment from the target laser motion trajectory, yields the first motion component: (3); in, This represents the first motion component of the processing point.

[0049] Therefore, the deflection movement of the first beam deflection mechanism in the processing path segment can be controlled according to the first motion component, and the exit position of the beam and the deflection movement in the non-processing path segment can be controlled according to the second motion component, so that the first beam deflection mechanism and the second beam deflection mechanism can jump together between different processing areas, thereby improving the efficiency of laser processing.

[0050] In some embodiments of this application, processing control parameters of the laser processing equipment can be obtained before determining the first target velocity and the initial velocity. The processing control parameters of the laser processing equipment may include the processing point distribution of the first motion component. This processing point distribution can be represented by the number and location of processing points. The processing points are automatically generated by the geometry of the structure to be processed and a path planning algorithm. Furthermore, the processing control parameters of the laser processing equipment may also include, but are not limited to: the single-point processing time of the first beam deflection mechanism at each processing point and the jump time between processing points.

[0051] In some embodiments of this application, determining the initial velocity of the second beam deflection mechanism when entering the second motion component based on the processing point distribution of the first motion component may include: determining the total processing time required for the first beam deflection mechanism to complete the first motion component based on the processing point distribution of the first motion component; and determining the initial velocity based on the total processing time and the motion trajectory of the second beam deflection mechanism on the first motion component.

[0052] Specifically, determining the total processing time required for the first beam deflection mechanism to complete the first motion component based on the processing point distribution of the first motion component may include: obtaining the single-point processing time and the jump time between processing points of the first beam deflection mechanism at each processing point; and determining the total processing time based on the number of processing points, the single-point processing time, and the jump time.

[0053] The single-point processing time can be obtained based on the material of the workpiece and the processing depth. The transition time between processing points can be determined by the physical performance indicators of the first beam deflection mechanism and the deflection distance between the two processing points. Using the number of processing points, the single-point processing time, and the transition time between processing points, the total processing time t required for the first beam deflection mechanism to complete the first motion component can be determined to meet the dwell and transition requirements of all processing points. Simultaneously, based on the number of processing points, the single-point processing time, and the transition time between processing points, a first target speed can be determined so that when the first beam deflection mechanism deflects at the first target speed, it can complete the processing according to the processing requirements of each laser point.

[0054] To ensure that the first and second beam deflection mechanisms deflect synchronously to the end of the processing path segment, the deflection speed v = L / t of the second beam deflection mechanism within the first motion component can be calculated based on the length L of the motion trajectory of the second beam deflection mechanism in the first motion component. This deflection speed can then be used as the initial speed. It should be noted that if the second beam deflection mechanism needs to jump between adjacent sub-paths during deflection within the first motion component, the length L of the motion trajectory can include the length of the motion trajectory during the jump.

[0055] Thus, after a total processing time t, the first beam deflection mechanism and the second beam deflection mechanism will synchronously deflect to the end of the first motion component. When the second beam deflection mechanism reaches the end of the first motion component, it maintains its initial speed. Therefore, when entering the second motion component, the second beam deflection mechanism can accelerate and decelerate from its initial speed, reducing the time required for acceleration and deceleration, thereby improving processing efficiency.

[0056] In embodiments of this application, the laser processing method may further include: controlling a second beam deflection mechanism to deflect during the process of controlling a first beam deflection mechanism to execute a first motion component at a first target speed, so that the second beam deflection mechanism reaches the end of the first motion component at an initial speed; and controlling the first beam deflection mechanism to remain stationary during the process of controlling the second beam deflection mechanism to begin changing speed from the initial speed to a second target speed to execute a second motion component.

[0057] In other words, for the first motion component, the first beam deflection mechanism deflects the laser beam at a first target speed to achieve laser processing, while the second beam deflection mechanism moves synchronously to maintain its initial speed when reaching the end of the first motion component. Subsequently, when entering the second motion component, the second beam deflection mechanism can accelerate from its initial speed to a preset second target speed, deflect the laser beam at the second target speed, and set the first beam deflection mechanism to enter a stationary or standby state to accelerate the movement speed of the laser beam along the target laser trajectory.

[0058] In some embodiments of this application, the process of controlling the first beam deflection mechanism to execute the first motion component at a first target speed may further include: dynamically adjusting the frequency of the control signal of the first beam deflection mechanism.

[0059] The frequency of the control signal can be used to adjust the size of the light spot.

[0060] Specifically, dynamically adjusting the control signal frequency of the first beam deflection mechanism may include: determining the target size of the filling spot based on the structure to be processed at the current processing position, and adjusting the control signal frequency of the acoustic control signal used to drive the first beam deflection mechanism based on the target size.

[0061] Specifically, when encountering a structure to be filled, the target size can be selected based on the required processing accuracy and efficiency. A larger spot size requires fewer pulses per unit area, resulting in less processing time. A smaller spot size leads to higher processing accuracy. By generating a high-frequency acoustic control signal, the signal frequency can be continuously and rapidly varied within the frequency range corresponding to the target size, thereby enlarging the spot size to the target size for laser processing.

[0062] In some embodiments of this application, the frequency change period of the acoustic control signal may be less than the single pulse duration of the laser.

[0063] To illustrate the principle of beam enlargement, consider this example: The control signal frequency of the first beam deflection mechanism is set to operate within a range of 170 MHz to 200 MHz, corresponding to a deflection range of 300 μm. If the theoretical processing point is located at 100 μm in the AOD coordinate system, its corresponding center signal frequency is 180 MHz. When a large beam filling process is required at this processing point, the required frequency modulation bandwidth can be calculated based on the target beam size. For instance, to achieve the desired beam enlargement effect, the acoustic wave frequency can be controlled to continuously and rapidly change back and forth within the range of 178 MHz to 182 MHz at a speed much higher than the laser's single pulse period. This frequency modulation causes the beam to perform a micro-amplitude high-speed scan near the target position during actual deflection, thus creating a magnified beam size in both visual and processing effects.

[0064] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because based on this application, some steps can be performed in other orders.

[0065] like Figure 4The diagram shown is a schematic of a controller provided in an embodiment of this application. Specifically, the controller 40 may include: a processor 400, a memory 401, and a computer program 402 stored in the memory 401 and executable on the processor 400, such as a laser processing program. When the processor 400 executes the computer program 402, it implements the steps in the various laser processing method embodiments described above, for example... Figure 1 Steps S101 to S104 are shown.

[0066] The computer program can be divided into one or more modules / units, which are stored in the memory 401 and executed by the processor 400 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0067] The controller may include, but is not limited to, a processor 400 and a memory 401. Those skilled in the art will understand that... Figure 4 This is merely an example of a controller and does not constitute a limitation on the controller. It may include more or fewer components than illustrated, or combine certain components, or different components. For example, the controller may also include input / output devices, network access devices, buses, etc.

[0068] The processor 400 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0069] The memory 401 can be an internal storage unit of the controller, such as the controller's hard drive or memory. The memory 401 can also be an external storage device of the controller, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or FlashCard. Furthermore, the memory 401 can include both internal and external storage units of the controller. The memory 401 is used to store the computer program and other programs and data required by the controller. The memory 401 can also be used to temporarily store data that has been output or will be output.

[0070] It should be noted that, for the sake of convenience and brevity, the structure of the controller described above can also be referred to the specific description of the structure in the method embodiment, which will not be repeated here.

[0071] Specifically, Figure 5 This application illustrates a laser processing apparatus, comprising: Laser 10 is used to emit a laser beam; The beam control system 20 includes a first beam deflection mechanism 201 and a second beam deflection mechanism 202. The beam control system 20 is used to transmit, control, and deflect a laser beam. The processing platform 30 is used to support the workpiece to be processed; Controller 40 is used to control the coordinated operation of the laser 10, beam control system 20, and processing platform 30 to achieve the following: Figures 1 to 3 The laser processing method described above.

[0072] In some embodiments of this application, the laser 10 may be a solid-state laser (e.g., nanosecond laser, picosecond laser, femtosecond laser, etc.), a gas laser (e.g., a CO2 laser), or other types of lasers, and this application does not impose any limitations on this. A laser 10 capable of providing suitable laser pulse wavelength and pulse frequency parameters can be selected according to processing requirements. The power, spot size, and number of pulses of the laser beam emitted by the laser 10 can all be set according to processing requirements.

[0073] In some embodiments of this application, the deflection speed of the second beam deflection mechanism 202 is less than that of the first beam deflection mechanism 201. The first beam deflection mechanism 201 can be used for small-range, rapid point deflection or complex trajectory motion, and can specifically refer to a modulation deflector. A modulation deflector is an optical device with beam control function, and its common types mainly include electro-optic deflectors, acousto-optic deflectors, and liquid crystal phased arrays. On the one hand, these devices can dynamically change the refractive index distribution of a transparent medium by means of physical effects such as electro-optic effect, acousto-optic effect, or liquid crystal birefringence, thereby deflecting the beam transmitted through the medium; on the other hand, they can also precisely control the phase of the beam through optical phased array technology, ultimately realizing the deflection and scanning functions of the beam. For example, in a specific embodiment, the first beam deflection mechanism 201 is specifically an acousto-optic deflector (AOD). The second beam deflection mechanism 202 can be used to perform large-scale or continuous scanning motion. Specifically, it refers to a mechanical deflection mechanism. The mechanical deflection mechanism can use a motor to drive the optical lens to deflect in order to control the direction of beam propagation. It includes a galvanometer, a rotating mirror, a galvanometer scanner, etc. For example, in a specific embodiment, the second beam deflection mechanism 202 specifically refers to a galvanometer.

[0074] In some embodiments of this application, the beam control system 20, in addition to the first beam deflection mechanism 201 and the second beam deflection mechanism 202, may also include, but is not limited to, a beam shaper (e.g., an aperture, a beam expander or beam shrinker, a shaping component that converts the intensity distribution of the laser beam from a Gaussian distribution to the desired shape), and a focusing lens. The beam shaper can be used to shape the laser beam to control the spot size and energy density distribution. The focusing lens can be used to control the focal length, thereby affecting the energy density distribution of the laser spot formed at the processing position of the workpiece. The various devices within the beam control system 20 cooperate to transmit, control, and deflect the laser beam, forming a spot with specific laser parameters to process the signal transmission substrate. The first beam deflection mechanism 201 can be disposed between the laser 10 and the second beam deflection mechanism 202, and the second beam deflection mechanism 202 can be disposed between the first beam deflection mechanism 201 and the focusing lens to achieve continuous deflection of the beam.

[0075] This application embodiment also provides a circuit board, which is based on... Figures 1 to 3 The described laser processing method or such Figure 5 The product obtained from the laser processing equipment.

[0076] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0077] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0078] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for various specific applications, but such implementations should not be considered beyond the scope of this application.

[0079] In the embodiments provided in this application, it should be understood that the disclosed devices / controllers / systems and methods can be implemented in other ways. For example, the device / controller / system embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0080] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected based on actual needs to achieve the purpose of this embodiment.

[0081] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0082] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed based on the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, based on legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0083] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A laser processing method, characterized in that, include: Obtain the target laser motion trajectory of the workpiece to be processed; The target laser trajectory is decomposed into a first motion component of the first beam deflection mechanism and a second motion component of the second beam deflection mechanism, wherein the speed at which the first beam deflection mechanism controls the laser beam deflection is greater than the speed at which the second beam deflection mechanism controls the laser beam deflection. Based on the processing point distribution of the first motion component, the first target velocity of the first beam deflection mechanism and the initial velocity of the second beam deflection mechanism when entering the second motion component are determined, wherein the initial velocity is greater than 0. The first beam deflection mechanism is controlled to execute the first motion component at the first target speed, and the second beam deflection mechanism is controlled to start changing speed from the initial speed to the second target speed to execute the second motion component.

2. The laser processing method as described in claim 1, characterized in that, Based on the processing point distribution of the first motion component, the initial velocity of the second beam deflection mechanism when entering the second motion component is determined, including: Based on the processing point distribution of the first motion component, determine the total processing time required for the first beam deflection mechanism to complete the first motion component; The initial velocity is determined based on the total processing time and the motion trajectory of the second beam deflection mechanism on the first motion component.

3. The laser processing method as described in claim 2, characterized in that, Based on the processing point distribution of the first motion component, the total processing time required for the first beam deflection mechanism to complete the first motion component is determined, including: The processing time of the first beam deflection mechanism at each processing point and the jump time between processing points are obtained. The total processing time is determined based on the number of processing points, the processing time of each single point, and the jump time.

4. The laser processing method as described in claim 1, characterized in that, The laser processing method further includes: During the process of controlling the first beam deflection mechanism to execute the first motion component at the first target speed, the second beam deflection mechanism is controlled to deflect so that the second beam deflection mechanism reaches the end of the first motion component at the initial speed. And, while controlling the second beam deflection mechanism to begin changing speed from the initial speed to the second target speed to execute the second motion component, the first beam deflection mechanism is controlled to remain stationary.

5. The laser processing method according to any one of claims 1-4, characterized in that, The process of controlling the first beam deflection mechanism to execute the first motion component at the first target speed further includes: The frequency of the control signal for the first beam deflection mechanism is dynamically adjusted.

6. The laser processing method as described in claim 5, characterized in that, The dynamic adjustment of the control signal frequency of the first beam deflection mechanism includes: Determine the target size of the filling spot based on the structure to be processed at the current processing position; The frequency of the control signal used to drive the acoustic control signal for the first beam deflection mechanism is adjusted according to the target size.

7. The laser processing method according to any one of claims 1-4, characterized in that, The acquisition of the target laser motion trajectory of the workpiece to be processed includes: Obtain the processing zone of the second beam deflection mechanism on the workpiece to be processed, wherein the processing zone of the second beam deflection mechanism includes one or more structures to be processed; Generate a target laser motion trajectory for processing a processing partition of the second beam deflection mechanism, the target laser motion trajectory being configured to cover the entire processing partition, or to cover each of the one or more structures to be processed.

8. A controller comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the laser processing method as described in any one of claims 1 to 7.

9. A laser processing device, characterized in that, include: A laser, used to emit a laser beam; A beam control system, comprising a first beam deflection mechanism and a second beam deflection mechanism, wherein the beam control system is used to transmit, control, and deflect the laser beam; The machining platform is used to support the workpiece to be processed; A controller is used to control the laser, the beam control system and the processing platform to work together to achieve the laser processing method as described in any one of claims 1 to 7.

10. A circuit board, characterized in that, The circuit board is obtained by the laser processing method according to any one of claims 1 to 7 or by processing the laser processing equipment according to claim 9.

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