Display panel and display device

Abstract

The invention provides a display panel and a display device, belongs to the technical field of display, and aims to eliminate frame type mura on the periphery of the display panel. The second substrate is arranged opposite to the first substrate, the second substrate comprises a display area and a frame area surrounding the display area, and the frame area comprises a first area and a plurality of second areas except the first area; wherein in the first area, one side, close to the first substrate, of the second substrate comprises a fan-out structure; the thickness adjusting structure is located in the frame area and located between the first substrate and the second substrate; the thickness adjusting structure enables the distance between the first substrate and the second substrate in the second area to be consistent with the distance between the first substrate and the second substrate in the first area.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel and a display device. BACKGROUND

[0002] At present, the VR (Virtual Reality) LCD (Liquid Crystal Display) product has small size and small peripheral spacing, and the peripheral metal wires are arranged in a very narrow area. The wiring pattern is often complex and changeable. However, the current VR LCD always has the problem of peripheral frame mura defect, that is, the peripheral brightness is not uniform. SUMMARY

[0003] Based on the background technology, the present disclosure provides a display panel and a display device.

[0004] In a first aspect, the present disclosure provides a display panel, comprising:

[0005] a first substrate;

[0006] a second substrate arranged opposite to the first substrate, the second substrate comprising a display area and a frame area surrounding the display area, the frame area comprising a first area and a plurality of second areas other than the first area; wherein, in the first area, a side of the second substrate close to the first substrate comprises a fan-out structure;

[0007] a thickness adjusting structure located in the frame area and between the first substrate and the second substrate;

[0008] wherein the thickness adjusting structure makes the distance between the first substrate and the second substrate in the second area consistent with the distance in the first area.

[0009] Optionally, further comprising:

[0010] an encapsulation glue located between the first substrate and the second substrate, a normal projection of the encapsulation glue on the second substrate being located in the frame area;

[0011] wherein the normal projection of the encapsulation glue on the second substrate overlaps with the normal projection of the thickness adjusting structure on the second substrate.

[0012] Optionally, the thickness adjusting structure comprises a spacer, and a normal projection of the spacer on the second substrate is located in the plurality of second areas.

[0013] wherein a size of the spacer in a target direction is equal to a size of the fan-out structure in the target direction, and the target direction is perpendicular to the second substrate.

[0014] Optionally, the material of the spacers is the same as the material of the fan-out structure.

[0015] Optionally, a plurality of the spacers are included in the same second region, and the density of the plurality of the spacers in the second region is the same as the density of the fan-out structure in the first region.

[0016] Optionally, the volume ratio of each of the spacers in the corresponding second region is equal to the volume ratio of the fan-out structure in the first region.

[0017] Optionally, the display panel further comprises:

[0018] The encapsulation glue is located between the first substrate and the second substrate and in the frame region.

[0019] The side surface of the spacer that is close to the encapsulation glue is in direct contact with the encapsulation glue.

[0020] Optionally, the thickness adjustment structure comprises elastic microspheres, and the maximum deformation amount of the elastic microspheres is greater than or equal to the difference between the interval of the first substrate and the second substrate in the first region and the interval in the second region.

[0021] Optionally, the elastic microspheres are filled in the encapsulation glue.

[0022] Optionally, the orthographic projection of the elastic microspheres on the second substrate is located in the first region and the plurality of second regions.

[0023] Optionally, in the case where the thickness adjustment structure comprises the spacers, the sum of the deformation amount of the elastic microspheres and the size of the spacers in the target direction is equal to the size of the fan-out structure in the target direction.

[0024] Optionally, the elastic microspheres are high polymer microspheres.

[0025] The display panel provided by the embodiments of the present disclosure includes: a first substrate; a second substrate arranged opposite to the first substrate, the second substrate including a display area and a frame area enclosing the display area, the frame area including a first area and a plurality of second areas other than the first area; wherein, in the first area, the second substrate includes a fan-out structure on a side close to the first substrate; and a thickness adjusting structure located between the first substrate and the second substrate in the frame area; wherein, the thickness adjusting structure makes the distance between the first substrate and the second substrate in the second area consistent with the distance in the first area; thereby, the distance between the first substrate and the second substrate in the second area is adjusted by the thickness adjusting structure, so that the distance between the first substrate and the second substrate in the first area is consistent, which can avoid the first area having the fan-out structure and the plurality of second areas not having the fan-out structure, so that the distance between the first substrate and the second substrate in the first area is different from the distance between the first substrate and the second substrate in the second area, thereby causing the problem of uneven thickness of the display area liquid crystal cell.

[0026] The above description is only a summary of the technical solutions of the present disclosure, in order to more clearly understand the technical means of the present disclosure, the content of the specification can be implemented, and in order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the following specific embodiments of the present disclosure are described. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the related art, the following will briefly introduce the drawings needed to be used in the embodiments or related art description. Obviously, the drawings in the following description are some embodiments of the present disclosure, and those skilled in the art can also obtain other drawings according to these drawings without creative labor. It should be noted that the proportions in the drawings are only for illustration and do not represent the actual proportions.

[0028] Figure 1 The top view of the display panel in the related art is shown, and the SEM diagram of the position of each frame area of the display panel is shown;

[0029] Figure 2 The cross-sectional view of the display panel close to the GOA side and the DO side is shown when 3.2 μm silicon balls are used as supports;

[0030] Figure 3 The cross-sectional view of the display panel close to the DP side is shown when 3.7 μm silicon balls are used as supports;

[0031] Figure 4 The top view of the display panel provided by the embodiments of the present disclosure is shown;

[0032] Figure 5 a cross-sectional view of a display panel is shown; Figure 4 a cross-sectional view of a display panel is shown;

[0033] Figure 6 a cross-sectional view of a display panel is shown;

[0034] Figure 7 a cross-sectional view of a display panel is shown;

[0035] Figure 8 a pattern diagram of SD and SD PAD on different sides of a second substrate is shown;

[0036] Figure 9 a diagram showing the stacking of SD pattern and SD PAD pattern on different sides of a second substrate is shown;

[0037] Figure 10 a pattern diagram of SD and GATE2 on different sides of a second substrate is shown;

[0038] Reference signs: 1, first substrate; 2, second substrate; 21, display area; 22, frame area; 221, first region; 2211, fan-out structure; 222, second region; 3, thickness adjusting structure; 31, spacer; 32, elastic microsphere; 4, encapsulation glue. DETAILED DESCRIPTION

[0039] In order to make the above objectives, features and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present disclosure.

[0040] Virtual reality liquid crystal display (VR LCD) products are usually small in size, narrow in frame, and the peripheral metal wiring is limited in a relatively narrow area, which leads to the need for the product design to be accurate in the peripheral height and the display area height. However, the VR LCD product has the problem of mura appearing around the display area, and adjusting the total amount of liquid crystal in the liquid crystal cell or the size of the silicon ball in the encapsulation glue cannot solve this mura defect, which is specifically a defect caused by uneven brightness and uneven chroma.

[0041] Through defect analysis, it is found that the mura defect problem is caused by the step difference of the array substrate at each peripheral position: referring to Figure 1 ,Figure 1 The electron microscope scanning images of each peripheral position of the array substrate are shown as follows, Figure 1 The left image is a structural schematic diagram of the array substrate, and the AA (Active Area) area represents the display area. The right image is an electron microscope scanning image of a position where the array substrate contacts the encapsulation adhesive. As shown in Figure 1 It can be seen that the thickness of the DP (Data Pad) side of the array substrate is 3.38 μm, the thickness of the GOA (Gate Driver on Array) side is 2.86 μm, and the thickness of the DO (Data Out) side is 2.76 μm. Thus, the fan-out structure of the DP side of the array substrate makes the height of the peripheral position 0.5-0.6 μm higher than the GOA side and the DO side.

[0042] In this case, 3.2 μm silicon balls are used to support the position of the encapsulation adhesive, as shown in Figure 2 Figure 2 The cross-sectional schematic diagram of the display panel near the GOA side or the DO side when the 3.2 μm diameter silicon balls are filled in the encapsulation adhesive is shown as follows, Figure 2 Because the size of the silicon balls is small, the edge box thickness of the DO side and the GOA side is low, which makes the glass substrates near the display area edge and the display area center warp due to stress, resulting in that the box thickness of the display area edge near the GOA side and the DO side is lower than the box thickness of the display area edge near the DP side and the box thickness of the display area center. Thus, the display area near the DP side is normal in brightness in the VR LCD product, but the DO side and the GOA side have frame mura.

[0043] When 3.7 μm silicon balls are used to support the position of the encapsulation adhesive, as shown in Figure 3 Figure 3 The cross-sectional schematic diagram of the display panel near the DP side when the 3.2 μm diameter silicon balls are filled in the encapsulation adhesive is shown as follows, Figure 3 Because the size of the silicon balls is large, the edge box thickness of the DP side is high, which makes the brightness of the display area edge higher than the center position. Thus, the brightness of the DP side is high in the VR LCD product, but the brightness of the GOA side and the DO side is normal.

[0044] Therefore, the display panel and the display device are provided. The thickness adjusting structure is arranged in the frame area between the array substrate and the color film substrate. The thickness adjusting structure is used to adjust the distance between the array substrate and the color film substrate in the position area corresponding to the GOA side and the DO side to be consistent with the distance between the array substrate and the color film substrate in the position area corresponding to the DP side, so that the height of the display area periphery is consistent, and the frame mura of the display area periphery is eliminated. ​​

[0045] Referring to Figure 4 and Figure 5 , Figure 4 A structural schematic diagram of a display panel provided by an embodiment of the present disclosure is shown, Figure 5 A structural schematic diagram of a display panel provided by an embodiment of the present disclosure is shown, Figure 4 A cross-sectional view of the display panel in the embodiment is shown as Figure 4 and Figure 5 The display panel specifically comprises:

[0046] a first substrate 1;

[0047] a second substrate 2 disposed opposite to the first substrate, the second substrate 2 comprising a display area 21 and a frame area 22 enclosing the display area 21, the frame area 22 comprising a first area 221 and a plurality of second areas 222 other than the first area 221; wherein in the first area 221, the second substrate 2 comprises a fan-out structure 2211 close to the first substrate 1;

[0048] and a thickness adjusting structure 3 located between the first substrate 1 and the second substrate 2 in the frame area 22.

[0049] The thickness adjusting structure 3 makes the distance between the first substrate 1 and the second substrate 2 in the second areas 222 consistent with the distance in the first area 221.

[0050] In the embodiment, the first substrate 1 is a color filter substrate, the second substrate 2 is an array substrate, the first area 221 represents an area where a DP (Data Pad) side of the array substrate is located, the second areas 222 are areas where a GOA (Gate Driver on Array) side and a DO (Data Out) side of the array substrate are located, the fan-out structure 2211 is a metal wiring structure of the array substrate 2, which can be a metal wiring such as an SD (scource drain) and an SD PAD (source drain pad), and can also be a metal wiring of an SD and a gate 2 (gate electrode). The thickness adjusting structure 3 is used to reduce the gap between the second substrate 2 and the first substrate 1 in the second areas 222.

[0051] The GOA side generates a gate driving signal of the array substrate in the display panel, the fan-out structure represents a fan-out area, the fan-out area is used for wiring connection of an IC (Integrated Circuit) and a data line in the display area 22, and the fan-out area can comprise a plurality of metal wirings, such as a data lead connected with the IC, a data lead connected with the data line of the display area, etc., wherein the gate line does not exit the fan-out area.

[0052] The thickness adjusting structure 3 can be a spacer with a thickening effect, or a support capable of supporting the gap between the first substrate 1 and the second substrate 2, and can be located in the plurality of second regions 222 or in the first region 221 and the plurality of second regions 222.

[0053] Specifically, when the thickness adjusting structure 3 is located in the plurality of second regions 222, the thickness adjusting structure 3 can be used to increase the thickness of the second substrate 2 in the second region 222, such as a spacer, by arranging the spacer on the second substrate 2 in the second region 222 to shorten the distance between the first substrate 1 and the second substrate 2 in the second region 2, so that it is consistent with the distance between the first substrate 1 and the second substrate 2 in the first region 221. It can be understood that in this case, the thickness of the thickness adjusting structure 3 is consistent with the thickness of the fan-out structure 2211, so that after the second region 222 increases the thickness adjusting structure 3, the distance between the first substrate 1 and the second substrate 2 in the second region 222 is consistent with the distance between the first substrate 1 and the second substrate 2 in the first region 221, to prevent the problem that the step difference cannot be completely eliminated due to the inconsistent thickness of the two.

[0054] In the embodiment, when the difference between the distance between the first substrate 1 and the second substrate 2 in the first region 221 and the distance between the first substrate 1 and the second substrate 2 in the second region 222 is greater than or equal to 0.3 μm, it is easy to cause the frame mura to exist around the display area 21, therefore, when the thickness adjusting structure 3 is used to make the distance between the first substrate 1 and the second substrate 2 in the second region 222 consistent with the distance in the first region 221, the difference between the two can be less than or equal to 0.3 μm.

[0055] When the thickness adjusting structure 3 is located in the first region 221 and the plurality of second regions 222, the thickness adjusting structure 3 can be a support located between the first substrate 1 and the second substrate 2, and the support can be an elastomer, which can adjust the distance between the first substrate 1 and the second substrate 2 in the second region 222 by elastic deformation, so that it is consistent with the distance between the first substrate 1 and the second substrate 2 in the first region 221. At this time, the thickness adjusting structure 3 can also have the function of supporting the gap between the first substrate 1 and the second substrate 2.

[0056] Of course, the thickness adjustment structure 3 may also include spacers located in multiple second regions 222, and supports located in the first region 221 and multiple second regions 222. In this case, the thickness adjustment structure 3 can adjust the spacing between the first substrate 1 and the second substrate 2 in the second region 222 through the spacers and supports. The thickness of the spacers used for thickening can be different from the thickness of the fan-out structure 2211 in the first region 221. The supports are used to compensate for the step difference that is not completely eliminated. The spacing between the first substrate 1 and the second substrate 2 in the second region 222 is roughly adjusted by the spacers first, and then the spacing between the first substrate 1 and the second substrate 2 in the second region 222 is precisely adjusted by the supports, thereby improving the accuracy of thickness adjustment.

[0057] Using the display panel provided in this embodiment, by adding a thickness adjustment structure 3 between the frame area 22 of the first substrate 1 and the second substrate 2, the spacing between the first substrate 1 and the second substrate 2 in the second region 222 is consistent with the spacing between the first substrate 1 and the second substrate 2 in the first region 221, thereby eliminating the step difference around the display area 21 and eliminating frame mura defects caused by the step difference around the perimeter.

[0058] Among them, reference Figure 6 , Figure 6 A cross-sectional view of a display panel provided in yet another embodiment of this disclosure is shown, as follows: Figure 6 As shown, the display panel also includes encapsulant 4, located between the first substrate 1 and the second substrate 2, and the orthographic projection of the encapsulant 4 on the second substrate is located in the border area 22.

[0059] In this case, the encapsulating adhesive 4 overlaps with the orthographic projection of the thickness adjustment structure 3 on the second substrate 2.

[0060] In this embodiment, the border area between the first substrate 1 and the second substrate 2 is sealed with encapsulating adhesive 4. After the first substrate 1 and the second substrate 2 are encapsulated with encapsulating adhesive 4, the spacing between the first substrate 1 and the second substrate 2 at different positions is different. This is actually caused by the different spacing between the first substrate 1 and the second substrate 2 at the sealing position of encapsulating adhesive 4. Therefore, the thickness of the second substrate 2 can be adjusted at the position corresponding to encapsulating adhesive 4 so that the spacing between the first substrate 1 and the second substrate 2 is the same at the position of encapsulating adhesive 4, thereby eliminating the frame-like mura around the display area.

[0061] Specifically, with Figure 5For example, the frame area 22 generally includes a packaging area and a virtual area, the packaging area is used to fill the encapsulation adhesive 4 to seal the first substrate 1 and the second substrate 2 into a box, and the virtual area is a transition between the packaging area and the display area. It can be understood that the frame mura defect is caused by the inconsistency of the gap between the first substrate 1 and the second substrate 2, which causes the first substrate 1 and the second substrate 2 to deform when the encapsulation adhesive 4 encapsulates the gap between the first substrate 1 and the second substrate 2 in the frame area 22, thereby causing the inconsistency of the thickness of the liquid crystal box after encapsulation. Therefore, by making the orthographic projection of the thickness adjusting structure 3 on the second substrate 2 overlap the encapsulation adhesive 4 on the second substrate 2, the gap between the first substrate 1 and the second substrate 2 in the position area of the encapsulation adhesive 4 can be adjusted, so that the encapsulation adhesive 4 encapsulates the first substrate 1 and the second substrate 2, and the gap at different positions is consistent, thereby eliminating the phenomenon that the first substrate 1 and the second substrate 2 deform after encapsulation, thereby eliminating the frame mura defect.

[0062] Of course, the orthographic projection of the encapsulation adhesive 4 on the second substrate 2 can coincide with the orthographic projection of the thickness adjusting structure 3 on the second substrate 2. In this case, the thickness adjusting structure 3 can be a support filled in the encapsulation adhesive 4. The support is changed from a rigid body to an elastic body. In this way, the elastic body can elastically deform to adjust the gap between the first substrate 1 and the second substrate 2 in the second area 222 to be consistent with the gap between the first substrate 1 and the second substrate 2 in the first area 221. In this way, the display area peripheral frame mura can be eliminated while unnecessary structures are reduced, and the problem of the encapsulation adhesive 4 exceeding the packaging area caused by the increase in space occupation can be avoided.

[0063] In the present disclosure, the thickness adjusting structure 3 can be located in the plurality of second areas 222, or can be located in the first area 221 and the plurality of second areas 222. Both of the two modes can achieve the adjustment of the gap between the first substrate 1 and the second substrate 2 in the second area 222.

[0064] In an implementation mode, the thickness adjusting structure 3 is located in the plurality of second areas 222. At this time, continuing to refer to Figure 5 The thickness adjusting structure 3 includes a spacer 31, and the orthographic projection of the spacer 31 on the second substrate 2 is located in the plurality of second areas 222.

[0065] The size of the spacer 31 in the target direction is equal to the size of the fan-out structure 2211 in the target direction, and the target direction is perpendicular to the second substrate 2.

[0066] In the embodiment, the spacers can be dummy metal blocks. By disposing the dummy metal blocks on the surface of the second substrate 2 in the second region 222, the thickness of the second substrate 2 in the second region 222 is increased, so that the distance between the first substrate 1 and the second substrate 2 in the second region 222 is consistent with the distance between the first substrate 1 and the second substrate 2 in the first region 221. It can be understood that, in order to make the distance between the first substrate 1 and the second substrate 2 in the second region 222 consistent with the distance between the first substrate 1 and the second substrate 2 in the first region 221, the thickness of the second substrate 2 that is increased needs to be consistent with the difference between the two distances, and since this difference is caused by the fan-out structure 2211 in the second region 222 compared with the first region 221, the thickness of the spacers 31 can be determined according to the thickness of the fan-out structure 2211. For example, the thickness of the spacers 31 is consistent with the thickness of the fan-out structure 2211. Figure 5 For example, the target direction is the direction of the y-axis.

[0067] It can be understood that the package area in the frame area 22 includes the filling encapsulation glue 4, and the encapsulation glue 4 is in a liquid state when filled. In order to prevent the filled encapsulation glue 4 from flowing out of the package area, the material of the spacers 31 can be the same as the material of the fan-out structure 2211, so as to reduce the influence of the spacers 31 on the process of injecting the encapsulation glue 4 into the package area. For example, the fan-out structure 2211 is made of copper metal, and the spacers can be dummy metal blocks made of copper; the fan-out structure 2211 is made of silver metal, and the spacers can be dummy metal blocks made of silver, and the like.

[0068] The number and arrangement density of the spacers 31 can be determined according to the fan-out structure 2211. Specifically, a plurality of spacers 31 can be included in the same second region 222, and the arrangement density of the plurality of spacers 31 in the second region 222 is the same as the arrangement density of the fan-out structure 2211 in the first region 221.

[0069] In the embodiment, the arrangement density of the spacers 31 is consistent with the fan-out structure 2211, which can improve the consistency of the second substrate 221 in the frame area 22, so as to completely eliminate the step difference of the frame area.

[0070] The density of the plurality of spacers 31 in the same second region 222 represents the density of the arrangement of the spacers 31 in the region, which can be determined according to the area ratio of the plurality of spacers 31 in the second region 222 to the surface area of the second substrate 2 in the second region 222. The greater the area ratio, the greater the density of the spacers 31. It can be understood that the encapsulation adhesive 4 is in a liquid state when injected into the frame area of the first substrate 1 and the second substrate 2. When the density of the plurality of spacers 31 in the second region 222 is greatly different from the density of the fan-out structure 2211 in the first region 221, it is easy to cause a large difference in the packaging width of the encapsulation adhesive 4, thereby affecting the subsequent cutting process. Therefore, the difference between the density of the plurality of spacers 31 in the second region 222 and the density of the fan-out structure 2211 in the first region 221 is less than 1%.

[0071] The arrangement pattern of the spacers 31 can be the same as or different from the arrangement pattern of the fan-out structure 2211. When the arrangement pattern of the spacers 31 is the same as the fan-out structure 2211, the arrangement of the plurality of spacers 31 can be designed according to the arrangement pattern of the fan-out structure 2211. For example, when the fan-out structure 2211 is composed of two kinds of metal patterns of SD and SD pad, dummy metal blocks of SD and SD pad can be arranged in the second region 222. When the fan-out structure 2211 includes SD and gate2 metal lines, dummy metal blocks of the same pattern of SD and gate2 can also be arranged in the second region 222.

[0072] When the arrangement pattern of the spacers 31 is different from the arrangement pattern of the fan-out structure 2211, in addition to ensuring that the thickness of the spacers 31 is the same as the thickness of the fan-out structure 2211, the volume ratio of each spacer 31 in the corresponding second region 222 is also required to be equal to the volume ratio of the fan-out structure 2211 in the first region 221.

[0073] The volume ratio of the spacers 31 in the second region 222 represents the ratio of the total volume of the spacers 31 to the volume of the gap between the first substrate 1 and the second substrate 2 in the second region 222. Similarly, the volume ratio of the fan-out structure 2211 in the first region 221 represents the ratio of the total volume of the fan-out structure 2211 to the volume of the gap between the first substrate 1 and the second substrate 2 in the first region 221.

[0074] It can be understood that the encapsulation glue 4 is first injected into the frame area 22 of the first substrate 1 and the second substrate 2 and then solidified to realize the sealing of the package, and if the volume ratio of the spacer 31 in the second area 222 is different from the volume ratio of the fan-out structure 2211 in the first area 221, it is difficult to accurately measure the injection amount of the encapsulation glue 4, which can easily cause the injected encapsulation glue 4 to exceed the frame area, thereby affecting the subsequent cutting process. Therefore, the volume ratio of the spacer 31 in the corresponding second area 222 should not be much different from the volume ratio of the fan-out structure 2211 in the first area 221, and specifically, the difference between the two can be within 3% to avoid the injected encapsulation glue 4 exceeding the frame area 22.

[0075] In an embodiment, referring to Figure 7 , Figure 7 A cross-sectional view of a display panel provided by another embodiment of the present disclosure is shown, as Figure 7 The display panel further comprises:

[0076] The encapsulation glue 4 is located between the first substrate 1 and the second substrate 2 and in the frame area 22; wherein the spacer 31 is in direct contact with the encapsulation glue 4 on one side surface thereof.

[0077] It can be understood that the support in the encapsulation glue 4 actually determines the gap between the first substrate 1 and the second substrate 2, and the spacer 31 reduces the gap between the first substrate 1 and the second substrate 2 in the second area 222, so that the size of the support in the encapsulation glue 4 can adapt to different peripheral positions, thereby making the gap between the first substrate 1 and the second substrate 2 at each position in the frame area 22 the same. In this case, the spacer 31 can be in direct contact with the encapsulation glue 4, so that the support filled in the encapsulation glue 4 supports the gap according to the distance between the spacer 31 and the first substrate 1, thereby making the distance between the first substrate 1 and the second substrate 2 in the second area 222 equal to the distance between the first substrate 1 and the second substrate 2 in the first area 221.

[0078] The side surface of the spacer 31 close to the encapsulation adhesive 4 can be in full contact with the encapsulation adhesive 4 or in partial contact with the encapsulation adhesive 4. In the case that the side surface of the spacer 31 close to the encapsulation adhesive 4 is in full contact with the encapsulation adhesive 4, the thickness, material and arrangement of the spacer 31 are completely same as the thickness, material and arrangement of the fan-out structure 2211, so as to reduce the influence of the spacer 31 on the injection of the encapsulation adhesive 4. In the case that the side surface of the spacer 31 close to the encapsulation adhesive 4 is in partial contact with the encapsulation adhesive 4, the spacer 31 can be partially located in a virtual area between the display area and the frame area, and the virtual area does not have actual function. Therefore, the spacer 31 has little influence on the virtual area when the spacer 31 is partially located in the virtual area, and the spacer 31 is partially located in the virtual area to reduce the influence of the spacer 31 on the injection of the encapsulation adhesive 4.

[0079] In another implementation, the thickness adjusting structure 3 is located in the first area 221 and the plurality of second areas 222. At this time, the thickness adjusting structure 3 is an elastic body, which can adjust the distance between the first substrate 1 and the second substrate 2 in the second area 222 through elastic deformation of the elastic body, so that the distance between the first substrate 1 and the second substrate 2 in the second area 222 is consistent with the distance between the first substrate 1 and the second substrate 2 in the first area 221. The thickness adjusting structure 3 can also be a structure including an elastic body and a spacer, which adjusts the distance between the first substrate 1 and the second substrate 2 in the second area 222 through elastic deformation and thickening of the spacer, so that the distance between the first substrate 1 and the second substrate 2 in the second area 222 is consistent with the distance between the first substrate 1 and the second substrate 2 in the first area 221.

[0080] Specifically, when the thickness adjusting structure 3 is an elastic body, continuing to refer to Figure 6 The thickness adjusting structure 3 includes elastic microspheres 32, and the maximum deformation amount of the elastic microspheres 32 is greater than or equal to the difference between the distance between the first substrate 1 and the second substrate 2 in the first area 221 and the distance between the first substrate 1 and the second substrate 2 in the second area 222.

[0081] In this embodiment, the maximum deformation amount of the elastic microspheres 32 is greater than or equal to the difference between the first substrate 1 and the second substrate 2 at different positions, so that the elastic microspheres 32 can directly eliminate the step difference at the peripheral position through elastic deformation, so as to Figure 1For example, the DP side of the second substrate 2 is 0.6 μm different from the DO side, and the DP side of the second substrate 2 is 0.5 μm different from the GOA side, so the maximum step difference at the peripheral position is 0.6 μm, and the elastic microspheres 32 with a maximum deformation greater than or equal to 0.6 μm can be used to adjust the gap size, thereby eliminating the step difference. In this way, not only can the spacing between the first substrate 1 and the second substrate 2 in the second area 222 be consistent with the spacing between the first substrate 1 and the second substrate 2 in the first area 221, but the spacing between the first substrate 1 and the second substrate 2 in multiple second areas 222 can also be accurately adjusted, thereby completely eliminating the step difference between the first substrate 1 and the second substrate 2 in the frame area 22.

[0082] In this case, the elastic microspheres 32 are filled in the encapsulation glue 4, so that the elastic microspheres 32 can adjust the gap size between the first substrate 1 and the second substrate 2 while supporting the gap between the first substrate 1 and the second substrate 2, and at this time, the diameter of the elastic microspheres 32 can be determined according to the thickness of the liquid crystal cell.

[0083] In this case, the elastic microspheres 32 are filled in the encapsulation glue 4, so that the elastic microspheres 32 can adjust the gap size between the first substrate 1 and the second substrate 2 while supporting the gap between the first substrate 1 and the second substrate 2, and at this time, the diameter of the elastic microspheres 32 can be determined according to the thickness of the liquid crystal cell.

[0084] In this case, the elastic microspheres 32 are filled in the encapsulation glue 4, so that the elastic microspheres 32 can adjust the gap size between the first substrate 1 and the second substrate 2 while supporting the gap between the first substrate 1 and the second substrate 2, and at this time, the diameter of the elastic microspheres 32 can be determined according to the thickness of the liquid crystal cell. Figure 7 The sum of the deformation of the elastic microspheres 32 and the size of the spacers 31 in the target direction is equal to the size of the fan-out structure 2211 in the target direction.

[0085] In this case, the elastic microspheres 32 are filled in the encapsulation glue 4, so that the elastic microspheres 32 can adjust the gap size between the first substrate 1 and the second substrate 2 while supporting the gap between the first substrate 1 and the second substrate 2, and at this time, the diameter of the elastic microspheres 32 can be determined according to the thickness of the liquid crystal cell.

[0086] Specifically, the difference between the distance between the first substrate 1 and the second substrate 2 in the first area 221 and the second area 222 can be reduced by the spacers 31, and the distance between the first substrate 1 and the second substrate 2 in the second area 222 can be accurately adjusted by the elastic microspheres 32 to be the same as the distance between the first substrate 1 and the second substrate 2 in the first area 221, so that the complexity of the wiring of the frame area 22 and the fluctuation caused by the process can be avoided, the problem that the step difference of the periphery of the display panel is difficult to completely eliminate can be solved, and the thickness adjustment structure 3 can be more flexible to cope with the changes in design and the fluctuations in process because the elastic microspheres 32 can be elastically deformed.

[0087] The elastic microspheres 32 can be high polymer microspheres, and the specific material of the elastic microspheres 32 is not limited in the embodiment, and the maximum deformation amount is greater than the distance between the first substrate 1 and the second substrate 2 in the first area 221, and the difference between the distance between the first substrate 1 and the second substrate 2 in the second area 222.

[0088] The display panel provided by the embodiment of the present disclosure is adopted, the spacers 31 are added at the positions of the second substrate 2 in the plurality of second areas 222, and the elastic microspheres 32 are filled in the first area 221 and the plurality of second areas 222, the distance between the first substrate 1 and the second substrate 2 in the second area 222 is adjusted by the spacers 31 and the elastic microspheres 32 to be the same as the distance between the first substrate 1 and the second substrate 2 in the first area 221, at this time, the first substrate 1 and the second substrate 2 after sealing will not be deformed, and the case that the thicknesses of the liquid crystal after sealing are different at different positions is avoided, thereby eliminating the peripheral frame mura defect of the display panel.

[0089] The display panel provided by the embodiment of the present disclosure is introduced below in combination with a specific example:

[0090] Example one: refer to Figure 5 The display panel includes a first substrate 1 and a second substrate 2, the second substrate 2 includes a display area 21 and a frame area 22 surrounding the display area 21, the frame area 22 includes a first area 221 and a plurality of second areas 222, wherein the first area 221 is an area where a data pad of the second substrate 2 is located, the plurality of second areas 222 include an area where a gate drive circuit is located, and an area where a data output line is located. The first area 221 includes a fan-out structure 2211, and the fan-out structure 2211 includes an SD and an SD PAD pattern.

[0091] The thickness adjusting structure 3 is a dummy metal block in the plurality of second areas 222, which has the same material and thickness as the fan-out structure 2211 in the first area 221, and has the same arrangement pattern as the fan-out structure 2211, which is the SD and SD PAD pattern. For example, referring to Figure 8 and Figure 9 , Figure 8 The pattern diagram of the SD and SD PAD on the second substrate 2 is shown, Figure 9 The SD pattern and the SD PAD pattern on the DP side and the GOA side (or the DO side) are stacked, as shown in Figure 8 and Figure 9 The left diagram shows the stacking mode of the SD and the SD PAD on the GOA side or the DO side, and the right diagram shows the stacking mode of the SD and the SD PAD on the DP side, which are completely consistent.

[0092] Similarly, when the fan-out structure includes the pattern of the SD and the GATE2, as shown in Figure 10 , Figure 10 The pattern diagram of the SD and the SD PAD on the second substrate 2 is shown, and the arrangement of the dummy metal block is also the pattern of the SD and the GATE2.

[0093] Comparing Figure 1 , Figure 2 and Figure 5 , when the thickness adjusting structure 3 is not added, the spacing between the first substrate 1 and the second substrate 2 in the second area 222 is different from the spacing between the first substrate 1 and the second substrate 2 in the first area 221, which makes the cell gap different at different positions of the liquid crystal cell, and makes the frame mura exist in the display area 22 of the display panel.

[0094] In the display panel with the thickness adjusting structure 3, the thickness adjusting structure 3 makes the spacing between the first substrate 1 and the second substrate 2 in the second area 222 the same, and further makes the cell gap uniform at different positions of the liquid crystal cell, which eliminates the mura defect in the display area 22 of the display panel.

[0095] Example II: continuing to refer to Figure 6 , the display panel includes the first substrate 1 and the second substrate 2, the second substrate 2 includes the display area 21 and the frame area 22, the frame area 22 includes the first area 221 and the plurality of second areas 222, the first area 221 includes the fan-out structure 2211, and the second area 222 includes the thickness adjusting structure 3, which is the elastic microsphere 32 filled in the encapsulation adhesive 4. The elastic microsphere 32 is elastically deformed to make the spacing between the first substrate 1 and the second substrate 2 in the second area 222 consistent with the spacing between the first substrate 1 and the second substrate 2 in the first area 221.

[0096] Comparing Figure 1 , Figure 2 and Figure 6 , Figure 1 and Figure 2 , the spacing between the first substrate 1 and the second substrate 2 in the second area 222 is different from the spacing between the first substrate 1 and the second substrate 2 in the first area 221, which makes the cell gap of the liquid crystal cell different at different positions, and makes the frame-type mura exist in the periphery of the display area 22 of the display panel.

[0097] When the silicon balls filled in the encapsulation glue 4 are replaced by the elastic microspheres 32, the spacing between the first substrate 1 and the second substrate 2 in the second area 222 is the same, and the cell gap of the liquid crystal cell is uniform at different positions, and the mura defect in the periphery of the display area 22 of the display panel is eliminated.

[0098] Example Three: continuing to refer to Figure 7 , the display panel includes the first substrate 1 and the second substrate 2, the second substrate 2 includes the display area 21 and the frame area 22, the frame area 22 includes the first area 221 and a plurality of second areas 222, the first area 221 includes the fan-out structure 2211, the second area 222 includes the thickness adjustment structure 3, the thickness adjustment structure 3 is the spacer 31, the size of the spacer 31 in the direction perpendicular to the second substrate 2 is the same as the size of the fan-out structure 2211 in the direction perpendicular to the second substrate 2, and the arrangement pattern of the spacer 31 is the same as the arrangement pattern of the fan-out structure 2211, and the elastic microspheres 32 are filled in the encapsulation glue 4.

[0099] Comparing Figure 1 , Figure 2 and Figure 7 , Figure 1 and Figure 2 , the spacing between the first substrate 1 and the second substrate 2 in the second area 222 is different from the spacing between the first substrate 1 and the second substrate 2 in the first area 221, which makes the cell gap of the liquid crystal cell different at different positions, and makes the frame-type mura exist in the periphery of the display area 22 of the display panel.

[0100] When the dummy metal blocks are added and the silicon balls filled in the encapsulation glue 4 are replaced by the elastic microspheres 32, the spacing between the first substrate 1 and the second substrate 2 in the second area 222 is the same, and the cell gap of the liquid crystal cell is uniform at different positions, and the mura defect in the periphery of the display area 22 of the display panel is eliminated.

[0101] Based on the same inventive concept, the display device also includes the display panel according to any one of the above embodiments.

[0102] Various embodiments are described herein with reference to the following items, which are presented by way of example and are not intended to be limiting of the disclosure. 1. A display panel comprising: a plurality of pixels; a plurality of pixel circuits, each pixel circuit being associated with a respective pixel of the plurality of pixels; and a plurality of pixel circuit drivers, each pixel circuit driver being configured to drive a respective pixel circuit of the plurality of pixel circuits.

[0103] Finally, it should be noted that the terms "first" and "second", and the like, are used merely to distinguish one element from another, and do not necessarily indicate a physical, chronological or spatial sequence or relationship of such elements. Also, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0104] The above describes in detail a display panel and a display device provided by the present disclosure. The principles and implementation manners of the present disclosure are described by applying specific examples. The above description of the embodiments is only to help understand the method of the present disclosure and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present disclosure, the specific implementation manners and application ranges can be changed. In summary, the content of the present description should not be understood as a limitation of the present disclosure.

[0105] Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure following, in general, the principles of the present disclosure and including such features that are evident to those skilled in the art. The specification and examples are to be regarded as exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0106] It should be understood that the present disclosure is not limited to the precise construction that has been described above and illustrated in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the present disclosure. The scope of the present disclosure is limited only by the claims that follow.

[0107] As used herein, the terms "one embodiment", "an embodiment” or "one or more embodiments” mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. The appearances of the phrase "in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.

[0108] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the disclosure can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

[0109] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word 'comprising' does not exclude the presence of elements or steps other than those listed in a claim. The word 'a' or 'an' preceding an element does not exclude the presence of a plurality of such elements. The disclosure can be implemented by means of both hardware and software, and any combination thereof. In a unitary claim, several devices, apparatuses or means can be listed, comprising means for carrying out a certain task. The use of the term'means' in a claim is intended to refer to a combination of means for performing a task, even if such means are not explicitly recited in the claim. The word 'first','second', 'third', etc. do not imply any order. The terms 'first','second', 'third', etc. are to be interpreted according to the context in which they are used.

[0110] It has to be noted that, while the above describes example embodiments of the disclosure, the disclosure is not limited to the above examples, but rather covers any modifications falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: First substrate; A second substrate is disposed opposite to the first substrate. The second substrate includes a display area and a border area surrounding the display area. The border area includes a first region and a plurality of second regions other than the first region. In the first region, the side of the second substrate closer to the first substrate includes a fan-out structure. And a thickness adjustment structure, located in the frame area and between the first substrate and the second substrate; The thickness adjustment structure ensures that the spacing between the first substrate and the second substrate in the second region is the same as the spacing in the first region.

2. The display panel according to claim 1, characterized in that, Also includes: An encapsulating adhesive is located between the first substrate and the second substrate, and the orthographic projection of the encapsulating adhesive on the second substrate is located in the border area; The projection of the encapsulating adhesive onto the second substrate overlaps with the projection of the thickness adjustment structure onto the second substrate.

3. The display panel according to claim 1, characterized in that, The thickness adjustment structure includes spacers, the orthographic projection of which onto the second substrate is located in a plurality of second regions; Wherein, the dimension of the spacer in the target direction is equal to the dimension of the fan-out structure in the target direction, and the target direction is the direction perpendicular to the second substrate.

4. The display panel according to claim 3, characterized in that, The material of the spacer is the same as the material of the fan-out structure.

5. The display panel according to claim 3, characterized in that, The second region includes a plurality of the spacers, and the density of the spacers in the second region is the same as the density of the fan-out structure in the first region.

6. The display panel according to claim 3, characterized in that, The volume percentage of each of the spacers in the corresponding second region is equal to the volume percentage of the fan-out structure in the first region.

7. The display panel according to claim 3, characterized in that, Also includes: The encapsulating adhesive is located between the first substrate and the second substrate, and is located in the border area; In this embodiment, all or part of the surface of the spacer closest to the encapsulating adhesive is in direct contact with the encapsulating adhesive.

8. The display panel according to any one of claims 1-3, characterized in that, The thickness adjustment structure includes elastic microspheres, the maximum deformation of which is greater than or equal to the difference between the distance between the first substrate and the second substrate in the first region and the distance between them in the second region.

9. The display panel according to claim 8, characterized in that, The elastic microspheres are filled within the encapsulating adhesive.

10. The display panel according to claim 8, characterized in that, The orthographic projection of the elastic microspheres onto the second substrate is located in the first region and multiple second regions.

11. The display panel according to claim 8, characterized in that, When the thickness adjustment structure includes the spacer, the sum of the deformation of the elastic microsphere and the dimension of the spacer in the target direction is equal to the dimension of the fan-out structure in the target direction.

12. The display panel according to claim 8, characterized in that, The elastic microspheres are high molecular polymer microspheres.

13. A display device, characterized in that, Includes the display panel as described in any one of claims 1-12.

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