Display method, display device and computer readable storage medium

Abstract

The invention provides a display method, a display device and a computer readable storage medium. After the condition of lightening the display screen is detected, the DDIC in the screen module can obtain an initialization instruction, color correction data and brightness curve data for lightening the display screen through the SOC. Through the method, the screen module does not need to integrate a storage unit used for storing the initialization instruction, the color correction data and the brightness curve data, the integrated structure of the screen module is reduced, and the cost of the screen module is also reduced. And secondly, the initialization instruction, the color correction data and the brightness curve data are transmitted to the DDIC through the SOC, so that the speed of acquiring the initialization instruction, the color correction data and the brightness curve data by the SOC can be accelerated, and the speed of lightening the display screen by the DDIC is accelerated.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a display method, display device, and computer-readable storage medium. Background Technology

[0002] With the development of terminal technology, more and more applications are installed on electronic devices, allowing users to experience different functions.

[0003] To reduce power consumption and accidental touches in electronic devices, they can enter a screen-off state after prolonged periods of inactivity. Once in screen-off mode, the device can re-enter screen-on mode after meeting certain conditions. Currently, before activating the screen, the device must perform, but is not limited to, the following steps: powering on the digital logic circuitry, loading the first configuration file, and powering on the display. These steps take a considerable amount of time. For example, if a user actively triggers the screen to illuminate, the device must wait a period of time after receiving the user's activation command before the screen illuminates, resulting in a poor user experience. Summary of the Invention

[0004] This application provides a display method, display device, and computer-readable storage medium. After detecting a condition for activating the display screen, the DDIC in the screen module can obtain initialization commands, color correction data, and brightness curve data for activating the display screen via the SOC. This method eliminates the need for an integrated storage unit for storing the initialization commands, color correction data, and brightness curve data in the screen module, reducing the integrated structure and cost. Furthermore, transmitting the initialization commands, color correction data, and brightness curve data from the SOC to the DDIC speeds up the acquisition of these data by the SOC, thus accelerating the DDIC's ability to activate the display screen.

[0005] In a first aspect, this application provides a display method applied to a display device, the display device including a system-on-a-chip (SOC), a display driver chip (DDIC), a display screen, and a first memory, the first memory storing a first configuration file; the method includes: the SOC retrieving the first configuration file from the first memory; the SOC sending image content and the first configuration file to the DDIC; the DDIC illuminating the display screen based on the first configuration file and displaying a first image on the display screen based on the image content.

[0006] In some embodiments, the display device may also be referred to as an electronic device.

[0007] This method eliminates the need for integrated storage devices for the first configuration file in the screen module, reducing its integrated structure and cost. Secondly, by transmitting initialization commands, color correction data, and brightness curve data from the SOC to the DDIC, the speed at which the SOC acquires these data is accelerated, thus speeding up the DDIC's screen-lighting process.

[0008] Optionally, when the screen is turned on again after being turned off, the SOC needs to send the image content and the first configuration file to the DDIC again.

[0009] Optionally, the first memory can be any type of RAM, DRAM, etc. This application does not limit the types of the second memory and the first memory.

[0010] In conjunction with the first aspect, in one possible implementation, the SOC retrieves the first configuration file from the first memory, specifically including: when a first condition of turning on the display screen is detected, the SOC retrieves the first configuration file from the first memory; the first condition includes any one or more of the following: detecting a first operation by the user, or the SOC obtaining a first instruction.

[0011] The first condition can be either the electronic device detecting the first operation of turning on the display screen, or the SOC obtaining the first instruction to turn on the display screen.

[0012] The first operation to turn on the display screen can be a user's active operation on the power button / display screen, or it can be the electronic device recognizing the user's facial image, voiceprint, or fingerprint.

[0013] The command to turn on the display screen can also be that the electronic device receives a first message. To prompt the user to view the first message, the electronic device can send a first command to the SOC, enabling the SOC to control the display screen to turn on. For example, the first message can be any of the following: an incoming call message, a text message, an application message, etc. The first message can also be other messages, which are not limited in this application.

[0014] In conjunction with the first aspect, in one possible implementation, the display device further includes a second memory storing a first configuration file; before the SOC retrieves the first configuration file from the first memory, the method further includes: after the display device is powered on, the SOC retrieves the first configuration file from the second memory and stores the first configuration file in the first memory.

[0015] Using this method, the display device can store the first configuration file in the second memory, eliminating the need to add a storage device for storing the first configuration file in the screen module, thus reducing the composition and size of the screen module.

[0016] Optionally, the first configuration file stored in the second memory may be pre-installed in the second memory before the electronic device leaves the factory. Optionally, the second memory may be any one of a hard disk or universal flash storage (UFS).

[0017] Optionally, after the electronic device is powered off, the first configuration file stored in the second memory will not be cleared, but the first configuration file stored in the first memory will be cleared.

[0018] In conjunction with the first aspect, in one possible implementation, the display device further includes a third memory and a fourth memory; after the SOC sends the image content and the first configuration file to the DDIC, the method further includes: the DDIC storing the image content in the third memory; and the DDIC storing the first configuration file in the fourth memory.

[0019] In this way, DDIC can light up the display screen based on the first configuration file stored in the fourth memory, and display the first image on the display screen based on the image content stored in the third memory.

[0020] Optionally, the DDIC may include only one memory, for example, the third and fourth memories may be a single memory, and the image content and the first profile may also be stored in the same memory.

[0021] In conjunction with the first aspect, in one possible implementation, the SOC includes a central processing unit (CPU) and a data processing unit (DPU), with the CPU and DPU connected together and the DPU and DDIC connected together; the SOC retrieves a first configuration file from a first memory, specifically including: the CPU retrieving the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the CPU sending the first configuration file to the DPU; and the DPU sending the first configuration file to the DDIC.

[0022] In this way, the SOC can obtain the first configuration file through the CPU and send the first configuration file to the DDIC based on the DPU.

[0023] In conjunction with the first aspect, in one possible implementation, the SOC includes a Direct Memory Access Controller (DMA), the DMA and a Data Processing Unit (DPU) are connected, and the DPU and a Data Memory Controller (DDIC) are connected; the SOC retrieves a first configuration file from a first memory, specifically including: the DMA retrieving the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the DMA sending the first configuration file to the DPU; and the DPU sending the first configuration file to the DDIC.

[0024] Optionally, before the DMA retrieves the first configuration file from the first memory, the CPU may send a first instruction to the DMA, and in response to the first instruction, the DMA retrieves the first configuration file from the first memory.

[0025] Optionally, the first configuration file can also be obtained by the CPU from the first memory, and then the CPU sends the first configuration file to the DDIC.

[0026] In this way, the CPU can be freed up to perform other tasks, and the DMA can retrieve the first configuration file from the first memory and send it to the DPU.

[0027] In conjunction with the first aspect, in one possible implementation, the SOC also includes a first physical layer interface, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together.

[0028] The DPU sends the first configuration file to the DDIC, specifically by sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0029] Optionally, the first physical interface and the second physical layer interface can be high-speed data transmission interfaces to enable fast transmission of image content and the first configuration file between the SOC and DDIC.

[0030] In conjunction with the first aspect, in one possible implementation, the SOC further includes a first physical layer interface, the DPU includes a display serial interface (DSI) module and a fifth memory, and the DDIC further includes a second physical layer interface. The first physical layer interface and the second physical layer interface are connected. The CPU sends a first configuration file to the DPU, specifically including: the CPU sending the first configuration file to the fifth memory; the DPU sending the first configuration file to the DDIC, specifically including: the DSI module retrieving the first configuration file from the fifth memory; and the DSI module sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0031] In this way, the DSI module within the DPU is connected to or bound to the first physical layer interface. The DSI module can retrieve image content from the fifth memory and send it to the DDIC through the first physical layer interface. Based on the DPU's ability to send image content to the DDIC, the CPU can be connected to or bound to the fifth memory, allowing the CPU to write a first configuration file into the fifth memory. The DSI module can then retrieve the first configuration file from the fifth memory and quickly send it to the DDIC through the first physical layer interface. This method enables the CPU to quickly send the first configuration file to the DDIC via the DPU.

[0032] In conjunction with the first aspect, in one possible implementation, the SOC also includes a first physical layer interface, the DPU includes a DSI module and a fifth memory, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together.

[0033] The DMA sends the first configuration file to the DPU, specifically including: the DMA sending the first configuration file to the fifth memory; the DPU sending the first configuration file to the DDIC, specifically including: the DSI module retrieving the first configuration file from the fifth memory; and the DSI module sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0034] The DSI module within the DPU is connected to or bound to the first physical layer interface. The DSI module can retrieve image content from the fifth memory and send it to the DDIC via the first physical layer interface. Based on the DPU's ability to send image content to the DDIC, the CPU can be connected to or bound to the fifth memory, allowing the DMA to write a first configuration file into the fifth memory. The DSI module can then retrieve the first configuration file from the fifth memory and quickly send it to the DDIC via the first physical layer interface. This method enables the DMA to quickly send the first configuration file to the DDIC via the DPU.

[0035] In this way, the CPU can be freed up to perform other tasks, and the DMA can retrieve the first configuration file from the first memory and send it to the DPU.

[0036] In conjunction with the first aspect, in one possible implementation, the SOC further includes a first physical layer interface and a CPU, and the DDIC further includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC retrieves a first configuration file from the first memory, specifically including: the CPU retrieving the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the CPU sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0037] In this way, the DPU and the first physical layer interface are connected or bound together, allowing the DPU to send image content to the DDIC through the first physical layer interface. Based on the communication capability between the first physical layer interface and the DDIC, the CPU can be connected or bound to the first physical layer interface, enabling the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface. This method enables the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface.

[0038] In conjunction with the first aspect, in one possible implementation, the SOC further includes a first physical layer interface and a DMA, and the DDIC further includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC retrieves a first configuration file from the first memory, specifically including: the DMA retrieving the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the DMA sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0039] In this way, the DPU and the first physical layer interface are connected or bound together, allowing the DPU to send image content to the DDIC through the first physical layer interface. Based on the communication capability between the first physical layer interface and the DDIC, the DMA can be connected or bound to the first physical layer interface, enabling the DMA to quickly send the first configuration file to the DDIC through the first physical layer interface. This method enables the DMA to quickly send the first configuration file to the DDIC through the first physical layer interface.

[0040] In this way, the CPU can be freed up to perform other tasks, and the DMA can retrieve the first configuration file from the first memory and send it to the DPU.

[0041] In conjunction with the first aspect, in one possible implementation, the SOC further includes a DPU and a first physical layer interface, the DDIC further includes a second physical layer interface, the DPU further includes a fifth memory and a DSI module, the DSI module is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface; the SOC sends image content to the DDIC, specifically including: the DSI module obtaining image content from the fifth memory; the DSI module sending image content to the second physical layer interface of the DDIC through the first physical layer interface.

[0042] In this way, the DPU can quickly send image content to the DDIC through the first physical layer interface.

[0043] In conjunction with the first aspect, in one possible implementation, the display device further includes an independent driver chip, and the SOC is connected to the DDIC through the independent driver chip; the SOC sends the image content and the first configuration file to the DDIC, specifically including: the SOC sends the image content and the first configuration file to the DDIC through the independent driver chip.

[0044] In conjunction with the first aspect, in one possible implementation, the CPU or DMA sends the first configuration file to the first physical layer interface based on the MIPI-DSI specification for mobile industry processor interfaces, or the DSI module sends image content to the first physical layer interface based on the MIPI-DSI specification.

[0045] In conjunction with the first aspect, in one possible implementation, the CPU or DMA sends the first configuration file to the first physical layer interface based on the MIPI specification.

[0046] Optional, not limited to MIPI-DSI and MIPI specifications, can also be other high-speed data transmission protocols, such as EDP and LVDS protocols.

[0047] In conjunction with the first aspect, in one possible implementation, the initialization instruction is used to configure the screen brightness display parameters, the color correction data is used to adjust the brightness and / or color offset of each pixel in the screen, and the brightness curve data is used to configure the driving voltage of each pixel in the screen based on the current display brightness of the screen.

[0048] In conjunction with the first aspect, in one possible implementation, the first memory includes any of the following: random access memory (RAM), dynamic random access memory (DRAM), or flash memory.

[0049] Secondly, this application provides a display device, which includes a system-on-a-chip (SOC), a display driver chip (DDIC), a display screen, and a first memory. The SOC is connected to the DDIC and the first memory, and the DDIC is connected to the display screen. The first memory stores initialization instructions, color correction data, and brightness curve data. The SOC is used to retrieve a first configuration file from the first memory. The SOC is also used to send image content and the first configuration file to the DDIC. The DDIC is used to turn on the display screen based on the first configuration file and display a first image on the display screen based on the image content.

[0050] In conjunction with the second aspect, in one possible implementation, the SOC is specifically used to retrieve a first configuration file from a first memory when a first condition for lighting up the display screen is detected; the first condition includes any one or more of the following: detecting a first operation by the user, or the SOC retrieving a first instruction.

[0051] In conjunction with the second aspect, in one possible implementation, the display device further includes a second memory storing a first configuration file; the SOC is also configured to retrieve the first configuration file from the second memory and store the first configuration file in the first memory after the display device is powered on.

[0052] In conjunction with the second aspect, in one possible implementation, the display device further includes a third memory and a fourth memory; the DDIC is also used to store image content in the third memory and to store the first profile in the fourth memory.

[0053] In conjunction with the second aspect, in one possible implementation, the SOC includes a central processing unit (CPU) and a data processing unit (DPU), with the CPU and DPU connected together, and the DPU and DDIC connected together; the SOC is specifically used for: retrieving a first configuration file from a first memory via the CPU; sending the first configuration file to the DPU via the CPU; and sending the first configuration file to the DDIC via the DPU.

[0054] In conjunction with the second aspect, in one possible implementation, the SOC includes a Direct Memory Access Controller (DMA), the DMA and the DPU are connected, and the DPU and the DDIC are connected; the SOC is specifically used for: obtaining a first configuration file from a first memory via the DMA; sending the first configuration file to the DPU via the DMA; and sending the first configuration file to the DDIC via the DPU.

[0055] In conjunction with the second aspect, in one possible implementation, the SOC further includes a first physical layer interface, the DPU includes a display serial interface (DSI) module and a fifth memory, and the DDIC further includes a second physical layer interface. The first physical layer interface and the second physical layer interface are connected. Specifically, the SOC is used to: send a first configuration file to the fifth memory via the CPU; retrieve the first configuration file from the fifth memory via the DSI module; and send the first configuration file to the second physical layer interface of the DDIC via the first physical layer interface through the DSI module.

[0056] In conjunction with the second aspect, in one possible implementation, the SOC further includes a first physical layer interface, the DPU includes a display serial interface (DSI) module and a fifth memory, and the DDIC further includes a second physical layer interface. The first physical layer interface and the second physical layer interface are connected. Specifically, the SOC is used to: send a first configuration file to the fifth memory via DMA; retrieve the first configuration file from the fifth memory via the DSI module; and send the first configuration file to the second physical layer interface of the DDIC via the first physical layer interface through the DSI module.

[0057] In conjunction with the second aspect, in one possible implementation, the SOC further includes a first physical layer interface and a CPU, and the DDIC further includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. Specifically, the SOC is used to: obtain a first configuration file from a first memory through the CPU; and send the first configuration file to the second physical layer interface of the DDIC through the CPU based on the first physical layer interface.

[0058] In conjunction with the second aspect, in one possible implementation, the SOC further includes a first physical layer interface and DMA, and the DDIC further includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. Specifically, the SOC is used to: obtain a first configuration file from a first memory via DMA; and send the first configuration file to the second physical layer interface of the DDIC via DMA based on the first physical layer interface.

[0059] In conjunction with the second aspect, in one possible implementation, the SOC further includes a DPU and a first physical layer interface, the DDIC further includes a second physical layer interface, the DPU further includes a fifth memory and a DSI module, the DSI module is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface; the SOC is specifically used for: obtaining image content from the fifth memory through the DSI module; and sending the image content to the second physical layer interface of the DDIC through the DSI module based on the first physical layer interface.

[0060] In conjunction with the second aspect, in one possible implementation, the display device further includes an independent driver chip, and the SOC is connected to the DDIC through the independent driver chip; the SOC is specifically used to send the image content and the first configuration file to the DDIC through the independent driver chip.

[0061] In conjunction with the second aspect, in one possible implementation, the CPU or DMA sends the first configuration file to the first physical layer interface based on the MIPI-DSI specification of the mobile industry processor interface, or the DSI module sends image content to the first physical layer interface based on the MIPI-DSI specification.

[0062] In conjunction with the second aspect, in one possible implementation, the CPU or DMA sends the first configuration file to the first physical layer interface based on the MIPI specification.

[0063] In conjunction with the second aspect, in one possible implementation, the initialization instruction is used to configure the screen brightness display parameters, the color correction data is used to adjust the brightness and / or color offset of each pixel in the screen, and the brightness curve data is used to configure the driving voltage of each pixel in the screen based on the current display brightness of the screen.

[0064] In conjunction with the second aspect, in one possible implementation, the first memory includes any of the following: Random Access Memory (RAM), Dynamic Random Access Memory (DRAM), Flash Memory, etc. The second memory includes any of the following: Universal Flash Storage (UFS), Hard Disk Drive, SD Card, etc.

[0065] Thirdly, this application provides a computer-readable storage medium including instructions that, when executed on a display device, cause the display device to perform any of the possible implementations of any of the above aspects.

[0066] Fourthly, this application provides a computer program product that may include computer instructions that, when executed on a display device, cause the display device to perform any of the possible implementation methods described above.

[0067] Fifthly, this application provides a chip applied to a display device, the chip including one or more processors, the processors being configured to invoke computer instructions to cause the display device to execute any of the possible implementation methods described in any of the above aspects.

[0068] For the beneficial effects of aspects two through five, please refer to the description of the beneficial effects in aspect one, which will not be repeated here. Attached Figure Description

[0069] Figure 1 A schematic diagram of a process for loading a first configuration file into an electronic device is shown.

[0070] Figure 2 A schematic diagram of the composition structure of an electronic device is shown;

[0071] Figure 3 A schematic diagram of the composition structure of another electronic device is shown;

[0072] Figure 4 A schematic diagram of DDIC obtaining the first configuration file is shown;

[0073] Figure 5 This illustrates another method by which DDIC obtains the first configuration file;

[0074] Figure 6 A schematic diagram of the electronic device involved in the first method is shown;

[0075] Figure 7 A schematic diagram of the electronic device involved in the second method is shown;

[0076] Figure 8 A schematic diagram of the electronic device involved in the third method is shown;

[0077] Figure 9 A schematic diagram of the electronic device involved in the fourth method is shown;

[0078] Figure 10 A schematic diagram of the electronic device involved in the fifth method is shown;

[0079] Figure 11 A schematic diagram of the electronic device involved in the sixth method is shown;

[0080] Figure 12 A schematic diagram of the electronic device involved in the first method two is shown;

[0081] Figure 13 A schematic diagram of the electronic device involved in the second method is shown;

[0082] Figure 14 A schematic diagram of the electronic device involved in the third method (2) is shown;

[0083] Figure 15 A schematic diagram of the electronic device involved in the second method is shown;

[0084] Figure 16 A flowchart illustrating a display method provided in this application is shown. Detailed Implementation

[0085] The technical solutions of the embodiments of this application are described below with reference to the accompanying drawings. In the description of the embodiments of this application, the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, "at least one" and "one or more" refer to one or more (including two). The term "and / or" is used to describe the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0086] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. The term "connection" includes direct connections and indirect connections, unless otherwise stated. "First" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0087] In the embodiments of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0088] To reduce power consumption and accidental touches in electronic devices, they can enter a screen-off state after prolonged periods of inactivity. Once in screen-off mode, the device can re-enter screen-on mode after meeting the conditions for display activation. Currently, before activating the display, the electronic device must perform, but is not limited to, the following steps: powering on the digital logic circuitry, loading the first configuration file, and powering on the display.

[0089] The first configuration file may include initialization instructions, color correction data, and brightness curve data.

[0090] In some embodiments, color correction data may also be referred to as color calibration files or gamma data, and brightness curve data may also be referred to as demura files.

[0091] The initialization command is used to configure the display parameters of the screen, such as parameters that allow the screen to display images normally after it is turned on. For example, the display parameters may include, but are not limited to, any one or more of the following: screen height, screen width, screen resolution, etc.

[0092] Color calibration data is used to adjust the brightness and / or color offset of each pixel in the display screen. Since the display brightness of each pixel in the display screen varies, in order to ensure that the display brightness of each pixel is not significantly different after the screen is turned on, the electronic device can calibrate the display brightness of each pixel in the display screen based on color calibration data, thereby improving the display effect.

[0093] The brightness curve data is used to configure the driving voltage of each pixel in the display screen based on the current display brightness of the display screen.

[0094] The aforementioned digital logic circuit takes approximately 10ms to power on, approximately 120ms to load the first configuration file, and approximately 25ms to power on the display screen. The electronic device requires a considerable amount of time to execute these steps, primarily due to the significant time spent loading the first configuration file.

[0095] In some embodiments, if a user actively triggers the electronic device to enter the screen-on state, after the electronic device receives the user's operation to turn on the display, the user has to wait for a period of time before the electronic device will enter the screen-on state, resulting in a poor user experience.

[0096] The process of loading the first configuration file on an electronic device can be as follows: Figure 1 As shown.

[0097] Figure 1 A schematic diagram of the process of loading a first configuration file by an electronic device is shown.

[0098] like Figure 1 As shown, the electronic device includes a screen module and a system-on-a-chip (SOC) or relay chip. The screen module may include, but is not limited to, a display driver integrated chip (DDIC), flash memory, etc., and the DDIC may include, but is not limited to, random access memory (RAM), one-time programmable memory (OTP), etc. Optionally, the DDIC may include one or more RAMs.

[0099] The OTP stores initialization instructions, while the flash stores color correction data and brightness curve data.

[0100] After detecting that the screen-on trigger condition is met, the DDIC can retrieve the initialization command from the OTP and store it in the DDIC's RAM. The process of the DDIC retrieving the initialization command from the OTP takes approximately 35ms.

[0101] DDIC is also used to retrieve color correction data and luminance profile data from flash memory and store them in DDIC's RAM. The process of DDIC retrieving color correction data and luminance profile data from flash memory takes approximately 85ms.

[0102] The SOC is also used to send image content to the DDIC, which can store the image content in its RAM. Optionally, not limited to image content, the SOC can also be used to send other instructions to the DDIC.

[0103] Then, DDIC can display the first image on the screen based on the image content.

[0104] The above-described screen-on process has, but is not limited to, the following problems:

[0105] Question 1: The screen module requires an additional flash storage chip to store color correction data and brightness curve data, which increases the cost of the screen module.

[0106] Question 2: The screen module requires an additional pre-configured OTP for storing initialization commands, which increases the cost of the screen module.

[0107] Question 3: Color correction data and luminance curve data are large in volume, typically exceeding 10 Mbit. If DDIC stores and transmits these data via flash memory, the limited data transfer speed of flash memory will result in a significant delay. OTP data transfer speed is also limited, and DDIC will also need considerable time to retrieve initialization instructions from OTP.

[0108] Based on the above analysis, this application provides a display method. The electronic device may include a screen module, a System-on-a-Chip (SOC), a first memory, and a second memory. The screen module may include a DDIC and a display screen, and the SOC is connected to the screen module. Optionally, it is not limited to a DDIC, but may also be a TDDI / TCON, etc. The following embodiments of this application use a screen module including a DDIC as an example for illustration. It is not limited to a SOC, but may also be a relay chip, etc. The following embodiments of this application use an electronic device including a SOC as an example for illustration.

[0109] The electronic device stores a first configuration file on its hard drive. After the electronic device is powered on, the System-on-Chip (SoC) can retrieve the first configuration file from a second memory and store it in the first memory. Optionally, after the electronic device is powered off, the first configuration file stored in the second memory will not be cleared, but the first configuration file stored in the first memory will be cleared.

[0110] Upon detecting the first condition for turning on the display, the SOC can retrieve the first profile from the first memory and send the first profile to the DDIC.

[0111] The SOC can also acquire image content and send it to the DDIC.

[0112] Optionally, the image content and the first configuration file can be sent to DDIC simultaneously or in a time-division multiplexing manner. This application does not impose any restrictions on the timing of the transmission of the image content and the first configuration file.

[0113] After receiving the first configuration file sent by the SOC, the DDIC can light up the display screen based on the initialization command, color correction data, and brightness curve data, and display the first image on the display screen based on the image content.

[0114] Optionally, the SOC and DDIC can transmit data via a high-speed data transmission interface, which can accelerate the transmission of the first configuration file from the SOC to the DDIC. The high-speed data transmission interface can be specified based on, but is not limited to, the Mobile Industry Processor Interface (MIPI) protocol. It can also be specified based on other protocols, such as EDP and LVDS. This application does not limit this; the following embodiments use an example where the high-speed data transmission interface is specified based on the MIPI protocol.

[0115] The high-speed data transmission interface is specified based on the MIPI protocol. It can refer to the data that the SOC can transmit to the DDIC via the high-speed data transmission interface based on the MIPI protocol, or it can refer to the data that the DDIC can receive from the DDIC via the high-speed data transmission interface based on the MIPI protocol.

[0116] This method eliminates the need for a flash memory chip to store color correction and brightness curve data in the screen module, and also eliminates the need to integrate an OTP for storing initialization commands on the DDIC of the screen module. This reduces the integrated structure and cost of the screen module. Secondly, the high-speed data transmission interface between the SOC and DDIC for initialization commands, color correction, and brightness curve data speeds up the process of the SOC acquiring these data, thus accelerating the speed at which the DDIC lights up the display.

[0117] Figure 2 A schematic diagram of the composition structure of an electronic device is shown.

[0118] like Figure 2As shown, the electronic device includes a System-on-a-Chip (SOC), a screen module, a second memory, and a first memory, with the SOC and screen module connected together. The second memory stores a first configuration file. After the electronic device is powered on, the SOC can retrieve the first configuration file from the second memory and store it in the first memory. Optionally, after the electronic device is powered off, the first configuration file stored in the second memory will not be cleared, but the first configuration file stored in the first memory will be cleared.

[0119] Optionally, the first configuration file stored in the second memory may be pre-installed in the second memory before the electronic device leaves the factory. Optionally, the second memory may be any one of a hard disk or universal flash storage (UFS).

[0120] The first memory can be any type of RAM, DRAM, etc., and the second memory can be universal flash storage (UFS), hard disk, expandable storage SD card, etc. This application does not limit the types of the second memory and the first memory.

[0121] SoCs include, but are not limited to, central processing units (CPUs), direct memory access (DMA) processors, and data processing units (DPUs).

[0122] The screen module includes, but is not limited to, DDIC, power management IC (PMIC), and display screen. DDIC may include third memory and fourth memory.

[0123] The PMIC is used to power the various components in the screen module, such as the DDIC and the display screen, so that the display screen can light up and display.

[0124] The third and fourth memories are used to store the image content and the first configuration file, respectively. In other words, the image content and the first configuration file are stored in different memories.

[0125] The third and fourth memories can be any type of RAM, DRAM, etc., and this application does not limit the type of the third and fourth memories.

[0126] Optionally, the DDIC may include only one memory, for example, the third and fourth memories may be a single memory, and the image content and the first profile may also be stored in the same memory.

[0127] Figure 3 A schematic diagram of the composition of another electronic device is shown.

[0128] Figure 3 The structure of the electronic device shown is similar to... Figure 2 The electronic devices shown have similar structural compositions. The difference lies in... Figure 3 The electronic device shown in the diagram also includes an independent driver chip, and the SOC can be connected to the screen module through this independent driver chip. For Figure 3 For introductions to the various components, please refer to [link / reference]. Figure 2 The descriptions in the document are not repeated here.

[0129] Optionally, data can be transferred between the SOC and the independent driver chip via a high-speed data transfer interface.

[0130] Optionally, data can also be transmitted between the independent driver chip and the DDIC via a high-speed data transmission interface.

[0131] High-speed data transmission interfaces can be specified based on, but are not limited to, the Mobile Industry Processor Interface (MIPI) protocol. High-speed data transmission interfaces can also be specified based on other protocols, and this application does not limit this.

[0132] Next, combine Figure 2 and Figure 3 The diagram shows the structure of the electronic device and details how DDIC obtains the first configuration file.

[0133] Figure 4 A schematic diagram of DDIC obtaining the first configuration file is shown.

[0134] 1. The SOC retrieves the first configuration file from the second memory and stores the first configuration file in the first memory.

[0135] Optionally, the first configuration file stored in the second memory may be pre-installed in the second memory before the electronic device leaves the factory. Optionally, the second memory may be any one of a hard disk or universal flash storage (UFS).

[0136] The first memory can be any type of RAM, DRAM, etc. This application does not limit the types of the second memory and the first memory.

[0137] After the electronic device is powered on, the SOC can retrieve the first configuration file from the second memory and store it in the first memory. Optionally, after the electronic device is powered off, the first configuration file stored in the second memory will not be cleared, but the first configuration file stored in the first memory will be cleared.

[0138] 2. The SOC retrieves the first configuration file from the first memory.

[0139] When the first condition for turning on the display is detected, the SOC can retrieve the first configuration file from the first memory and send it to the DDIC, so that the DDIC can control the display to turn on.

[0140] The first condition can be either the electronic device detecting the first operation of turning on the display screen, or the SOC obtaining the first instruction to turn on the display screen.

[0141] The first operation to turn on the display screen can be a user's active operation on the power button / display screen, or it can be the electronic device recognizing the user's facial image, voiceprint, or fingerprint.

[0142] The command to turn on the display screen can also be that the electronic device receives a first message. To prompt the user to view the first message, the electronic device can send a first command to the SOC, enabling the SOC to control the display screen to turn on. For example, the first message can be any of the following: an incoming call message, a text message, an application message, etc. The first message can also be other messages, which are not limited in this application.

[0143] 3. The SOC sends the image content and the first configuration file to the DDIC.

[0144] Upon detecting the first condition for turning on the display, the SOC can retrieve the first profile from the first memory and send the first profile to the DDIC.

[0145] Optionally, the image content and the first configuration file can be sent to DDIC simultaneously or in a time-division multiplexing manner. This application does not impose any restrictions on the timing of the transmission of the image content and the first configuration file.

[0146] Optionally, the SOC and DDIC can transmit data via a high-speed data transmission interface, which can accelerate the transmission of image content and the first configuration file from the SOC to the DDIC. The high-speed data transmission interface can be specified based on, but is not limited to, the Mobile Processor Interface (MIPI) protocol. Other protocols can also be specified, and this application does not limit this to any particular protocol.

[0147] 4. DDIC stores the image content in the third memory.

[0148] 5. DDIC stores the first configuration file in the fourth memory.

[0149] After receiving the image content and the first configuration file sent by the SOC, the DDIC can store the image content in the third memory and the first configuration file in the fourth memory.

[0150] The third and fourth memories can be any type of RAM, DRAM, etc., and this application does not limit the type of the third and fourth memories.

[0151] Optionally, the DDIC may include only one memory, for example, the third and fourth memories may be a single memory, and the image content and the first profile may also be stored in the same memory.

[0152] 6. DDIC lights up the display screen based on the first configuration file and displays the first image on the display screen based on the image content.

[0153] DDIC can light up the display screen based on initialization commands, color correction data, and brightness curve data, and display the first image on the display screen based on the image content.

[0154] This method eliminates the need for integrating a flash memory chip for storing color correction data and brightness curve data into the screen module, and also eliminates the need to integrate an OTP for storing initialization instructions into the DDIC of the screen module. This reduces the integrated structure of the screen module and also reduces its cost.

[0155] It should be noted that, Figure 4 The steps described herein are for illustrative purposes only and are not intended to explain this application. Figure 4 The execution order of each step is not a limitation.

[0156] Optional, Figure 4 In the method steps described in this embodiment, after the display screen is turned off, the image content stored in the third memory and the initialization instructions, color correction data, and brightness curve data stored in the fourth memory are cleared, while the initialization instructions, color correction data, and brightness curve data stored in the second memory and the first memory are not cleared. After the display screen is turned on again after being turned off, steps 2-6 above need to be repeated.

[0157] Figure 5 This diagram illustrates another method by which DDIC obtains the first configuration file.

[0158] Figure 5 Examples and Figure 4The implementation examples are similar, except that... Figure 5 In this embodiment, the SOC is connected to the DDIC via a separate driver chip. The SOC can send image content and a first configuration file to the DDIC via the separate driver chip.

[0159] Optionally, the SOC and the independent driver chip can transmit data through a high-speed data transmission interface, which can speed up the transmission of image content and the first configuration file from the SOC to the independent driver chip.

[0160] Optionally, the independent driver chip and DDIC can also transmit data through a high-speed data transmission interface, which can speed up the transmission of image content and first configuration file from the independent driver chip to the DDIC.

[0161] The high-speed data transmission interface can be specified based on, but is not limited to, the Mobile Industry Processor Interface (MIPI) protocol. It can also be specified based on other protocols, which this application does not limit.

[0162] Optionally, the protocol specification for the high-speed data transmission interface between the SOC and the independent driver chip can be the same as or different from the protocol specification for the high-speed data transmission interface between the independent driver chip and the DDIC.

[0163] for Figure 5 For more information, please refer to the following: Figure 4 The embodiments are described herein. Further details are omitted here.

[0164] Optional, via Figure 5 and Figure 4 The structure shown indicates that it takes approximately 2ms for DDIC to obtain initialization instructions and approximately 2ms for DDIC to obtain color correction data and brightness curve data. This reduces the time for DDIC to obtain the first configuration file and speeds up the DDIC's ability to turn on the display screen.

[0165] Next, we will explain how the SOC sends image content and the first configuration file to the DDIC.

[0166] In some embodiments, the DPU in the SCO can send image content to the DDIC via a high-speed data transmission interface (e.g., the first physical layer interface).

[0167] The first physical layer interface can be specified based on, but is not limited to, the Mobile Industry Processor Interface (MIPI) protocol. The first physical layer interface can also be specified based on other protocols, which this application does not limit.

[0168] However, currently, the SOC can only send image content to the DDIC via the DPU based on the first physical layer interface. For example, the DPU may include a display serial interface (DSI) module. The first physical layer interface and the DSI module are connected or bound together. The DSI module includes a fifth memory. The CPU can store image content in the fifth memory, and the DSI module can retrieve image content from the fifth memory and send it to the DDIC via the first physical layer interface.

[0169] To enable the SOC to send the first configuration file to the DDIC via the first physical layer interface, this application proposes two improvements.

[0170] Improvement Method 1:

[0171] In some embodiments, the CPU is connected to a fifth memory, enabling the CPU to write data into the fifth memory, such as writing a first configuration file. The DSI module can retrieve the first configuration file from the fifth memory and quickly send the first configuration file to the DDIC through the first physical layer interface.

[0172] In other embodiments, the DMA is connected to a fifth memory, allowing the CPU to control the DMA to write data into the fifth memory, such as writing a first configuration file into the fifth memory. The DSI module can then retrieve the first configuration file from the fifth memory and quickly send it to the DDIC via the first physical layer interface.

[0173] Improvement Method Two:

[0174] In some embodiments, the CPU is connected to the first physical layer interface, so that the CPU can directly operate the first physical layer interface, that is, reuse the first physical layer interface on the SOC for sending image content by the DPU, so that the CPU can quickly send the first configuration file to the DDIC through the first physical layer interface.

[0175] In other embodiments, the DMA is connected to the first physical layer interface, so that the CPU can control the DMA to directly operate the first physical layer interface, that is, reuse the first physical layer interface on the SOC for sending image content by the DPU, so that the CPU can control the DMA to quickly send the first configuration file to the DDIC based on the first physical layer interface.

[0176] The following sections will provide a detailed explanation of Improvement Method 1 and Improvement Method 4.

[0177] Improvement Method 1

[0178] Figures 6-11 The diagram shows the structural schematics of several electronic devices involved in the first improvement method.

[0179] Figure 6 A schematic diagram of the electronic device involved in the first method is shown.

[0180] like Figure 6 As shown, the electronic device includes a screen module, a SOC, and a first memory. The SOC includes a CPU and a DPU, which are connected to each other.

[0181] 1. The CPU retrieves the first configuration file from the first memory.

[0182] 2. The CPU sends the first configuration file to the DPU.

[0183] 3. The DPU sends the image content and the first configuration file to the DDIC.

[0184] The image content can be acquired by the DPU.

[0185] pass Figure 6 As shown in the structure, the SOC can send image content to the DDIC by means of the DPU. The DPU sends the first configuration file to the DDIC, which realizes that when the first condition of turning on the display is detected, the SOC sends the first configuration file to the DDIC.

[0186] Figure 7 A schematic diagram of the electronic device involved in the second method is shown.

[0187] Figure 7 The structure of the electronic device shown is similar to Figure 6 The electronic devices shown have similar structures. The difference lies in that... Figure 7 The electronic device shown in the diagram also includes an independent driver chip. The DPU can send image content and the first configuration file to the DDIC via the independent driver chip.

[0188] for Figure 7 For more information, please refer to the following: Figure 6 The embodiments are described herein. Further details are omitted here.

[0189] Figure 8 A schematic diagram of the electronic device involved in the third method is shown.

[0190] like Figure 8 As shown, the electronic device includes a screen module, a SOC, and a first memory. The SOC includes a CPU, a DPU, and a first physical layer interface. The DDIC includes a second physical layer interface. The CPU and DPU are connected, the DPU is connected to the first physical layer interface, and the first physical layer interface and the second physical layer interface are connected.

[0191] 1. The CPU retrieves the first configuration file from the first memory.

[0192] 2. The CPU sends the first configuration file to the DPU.

[0193] 3 and 4: The DPU sends the image content and the first configuration file to the second physical interface of the DDIC through the first physical interface.

[0194] The image content can be acquired by the DPU.

[0195] The first physical interface and the second physical layer interface can be high-speed data transmission interfaces. For example, the first physical layer interface and the second physical layer interface can be specified based on, but are not limited to, the Mobile Industry Processor Interface (MIPI) protocol. The first physical layer interface and the second physical layer interface can also be specified based on other protocols, which this application does not limit. This is to achieve fast data transmission between the SOC and DDIC.

[0196] pass Figure 8 As shown in the structure, the SOC can quickly send image content to the DDIC via the DPU's ability to use the first physical layer interface. By sending the first configuration file to the DDIC via the DPU's first physical layer interface, the SOC can not only send the first configuration file to the DDIC when the first condition of turning on the display is detected, but also speed up the DDIC's acquisition of the first configuration file and reduce the latency of the electronic device in responding to the user's operation of turning on the display.

[0197] Figure 9 A schematic diagram of the electronic device involved in the fourth method is shown.

[0198] Figure 9 The structure of the electronic device shown is similar to Figure 8 The electronic devices shown have similar structures. The difference lies in that... Figure 9 The electronic device shown in the diagram also includes an independent driver chip. This independent driver chip includes a third physical layer interface and a fourth physical layer interface, which are connected together. The first physical layer interface is also connected to the fourth physical layer interface, and the fourth physical layer interface is connected to the second physical layer interface.

[0199] The DPU can send the image content and the first configuration file to the third physical layer interface of the independent driver chip through the first physical layer interface. The independent driver chip then sends the image content and the first configuration file to the second physical interface of the DDIC through the fourth physical layer interface.

[0200] Optionally, the first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can be high-speed data transmission interfaces. For example, the first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can be specified based on, but not limited to, the Mobile Industry Processor Interface (MIPI) protocol. The third physical layer interface and fourth physical layer interface can also be specified based on other protocols, which are not limited in this application. This enables fast data transmission between the independent driver chip and the SOC, and between the independent driver chip and the DDIC.

[0201] Optional, in Figure 9 In this embodiment, the fourth physical layer interface and the second physical layer interface can be ordinary data transmission interfaces. That is, the independent driver chip and the DDIC can transmit data using a common data connection interface protocol. The data transmission speed of an ordinary data transmission interface is lower than that of a high-speed data transmission interface.

[0202] for Figure 9 For more information, please refer to the following: Figure 8 The embodiments are described herein. Further details are omitted here.

[0203] Figure 10 A schematic diagram of the electronic device involved in the fifth method is shown.

[0204] like Figure 10 As shown, the electronic device includes a screen module, a SOC, and a first memory. The SOC includes a CPU, a DPU, and a first physical layer interface. The DDIC includes a second physical layer interface. The DPU includes a fifth memory and a DSI module. The CPU and the fifth memory are connected. The fifth memory and the DSI module are connected. The DSI module is connected to the first physical layer interface. The first physical layer interface and the second physical layer interface are connected.

[0205] In some embodiments, the fifth memory may be referred to as a data buffer.

[0206] 1. The CPU retrieves the first configuration file from the first memory.

[0207] 2. The CPU sends the first configuration file to the fifth memory.

[0208] 3. The DSI module retrieves the image content and the first configuration file from the fifth memory.

[0209] 4. The DSI module sends the image content and the first configuration file to the first physical layer interface.

[0210] 5. The DSI module sends the image content and the first configuration file to the second physical layer interface of DDIC based on the first physical layer interface.

[0211] Optionally, a DSI module also exists in DDIC. After obtaining the image content and the first configuration file based on the second physical layer interface, DDIC can then send the image content and the first configuration file to the DSI module in DDIC.

[0212] Optionally, when the DSI module is connected to the first physical layer interface and the second physical layer interface is connected to the DSI module, the first and second physical layer interfaces can be specified based on the MIPI-SDI protocol. The first and second physical layer interfaces can also be specified based on other protocols, which this application does not limit. This enables fast data transmission between the SOC and DDIC.

[0213] pass Figure 10 The structure shown depicts a DPU where the DSI module is connected to or bound to the first physical layer interface. The DSI module can retrieve image content from the fifth memory and send it to the DDIC via the first physical layer interface. Based on the DPU's ability to send image content to the DDIC, the CPU can be connected to or bound to the fifth memory, allowing the CPU to write a first configuration file into the fifth memory. The DSI module can then retrieve the first configuration file from the fifth memory and quickly send it to the DDIC via the first physical layer interface. Figure 10 The structure shown enables the CPU to quickly send the first configuration file to the DDIC via the DPU.

[0214] Figure 11 A schematic diagram of the electronic device involved in the sixth method is shown.

[0215] Figure 11 The structure of the electronic device shown is similar to Figure 10 The electronic devices shown have similar structures. The difference lies in that... Figure 11 The electronic device shown in the diagram also includes an independent driver chip. This independent driver chip includes a third physical layer interface and a fourth physical layer interface, which are connected together. The first physical layer interface is also connected to the fourth physical layer interface, and the fourth physical layer interface is connected to the second physical layer interface.

[0216] The DSI module can send the image content and the first configuration file to the third physical layer interface of the independent driver chip through the first physical layer interface. The independent driver chip then sends the image content and the first configuration file to the second physical interface of the DDIC through the fourth physical layer interface.

[0217] Optionally, the first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can be high-speed data transmission interfaces. For example, the first physical interface and third physical layer interface can be specified based on, but not limited to, the MIPI-SDI protocol. The second physical layer interface and fourth physical layer interface can be specified based on the MIPI-SDI protocol or the MIPI protocol. The first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can also be specified based on other protocols, which is not limited in this application. This enables fast data transmission between the independent driver chip and the SOC, and between the independent driver chip and the DDIC.

[0218] Optional, in Figure 11 In this embodiment, the fourth physical layer interface and the second physical layer interface can be ordinary data transmission interfaces. That is, the independent driver chip and the DDIC can transmit data using a common data connection interface protocol. The data transmission speed of an ordinary data transmission interface is lower than that of a high-speed data transmission interface.

[0219] for Figure 11 For more information, please refer to the following: Figure 10 The embodiments are described herein. Further details are omitted here.

[0220] Optionally, in some embodiments, Figures 6-11 The CPU shown can be replaced by a DMA. Upon detecting the first condition of turning on the display, the CPU can control the DMA to retrieve the first configuration file from the first memory and send it to the DPU via the DMA. The DPU then sends the first configuration file to the DDIC, or the first configuration file can be sent to the DDIC via a separate driver chip. In this way, the CPU can be freed up to perform other tasks, while the DMA retrieves the first configuration file from the first memory and sends it to the DPU.

[0221] Improvement Method Two

[0222] Figures 12-15 The diagram shows the structural schematics of several electronic devices involved in Improvement Method 2.

[0223] Figure 12 A schematic diagram of the electronic device involved in the first method two is shown.

[0224] like Figure 12 As shown, the electronic device includes a screen module, a SOC, and a first memory. The screen module includes a DDIC, the SOC includes a CPU, a DPU, and a first physical layer interface, the DDIC includes a second physical layer interface, the CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface.

[0225] 1. The CPU retrieves the first configuration file from the first memory.

[0226] 2 and 4. The CPU sends the first configuration file to the second physical layer interface of DDIC through the first physical layer interface.

[0227] 3 and 4: The DPU sends the image content to the DDIC's second physical layer interface through the first physical layer interface.

[0228] Optionally, the first physical interface and the second physical layer interface can be high-speed data transmission interfaces. For example, the first physical layer interface and the second physical layer interface can be specified based on the MIPI-SDI protocol. The first physical interface and the second physical layer interface can also be specified based on other protocols, which this application does not limit. This enables fast data transmission between the SOC and DDIC.

[0229] Figure 12 In the illustrated structure, the DPU and the first physical layer interface are connected or bound together. The DPU can send image content to the DDIC through the first physical layer interface. Based on the communication capability between the first physical layer interface and the DDIC, the CPU can be connected or bound to the first physical layer interface, allowing the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface. Figure 12 The structure shown enables the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface.

[0230] Figure 13 A schematic diagram of the electronic device involved in the second method is shown.

[0231] Figure 13 The structure of the electronic device shown is similar to Figure 12 The electronic devices shown have similar structures. The difference lies in that... Figure 13 The illustrated electronic device also includes an independent driver chip. This independent driver chip includes a third physical layer interface and a fourth physical layer interface, which are connected. The third physical layer interface is also connected to the first physical layer interface, and the fourth physical layer interface is connected to the second physical layer interface. The CPU can send a first configuration file to the third physical layer interface of the independent driver chip via the first physical layer interface, and the DPU can send image content to the third physical layer interface of the independent driver chip via the first physical layer interface. The independent driver chip then sends the image content and the first configuration file (DDIC) to the second physical layer interface via the fourth physical layer interface.

[0232] Optionally, the first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can be high-speed data transmission interfaces. For example, the first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can be specified based on, but not limited to, the MIPI-SDI protocol. The first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can also be specified based on other protocols, which this application does not limit. This enables fast data transmission between the SOC and DDIC.

[0233] Optional, in Figure 13 In this embodiment, the fourth physical layer interface and the second physical layer interface can be ordinary data transmission interfaces. That is, the independent driver chip and the DDIC can transmit data using a common data connection interface protocol. The data transmission speed of an ordinary data transmission interface is lower than that of a high-speed data transmission interface.

[0234] for Figure 13 For more information, please refer to the following: Figure 12 The embodiments are described herein. Further details are omitted here.

[0235] Figure 14 A schematic diagram of the electronic device involved in the third method 2 is shown.

[0236] like Figure 14 As shown, the electronic device includes a screen module, a SOC, and a first memory. The screen module includes a DDIC, the SOC includes a CPU, a DPU, and a first physical layer interface, the DDIC includes a second physical layer interface, the DPU includes a fifth memory and a DSI module, the CPU is connected to the first physical layer interface, the fifth memory is connected to the DSI module, the DSI module is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface.

[0237] 1. The CPU retrieves the first configuration file from the first memory.

[0238] 2 and 5, the CPU sends the first configuration file to the second physical layer interface of DDIC through the first physical layer interface.

[0239] 3. The DSI module retrieves the image content from the fifth memory.

[0240] 4 and 5, the DSI module sends the image content to the second physical layer interface of DDIC through the first physical layer interface.

[0241] Optionally, a DSI module also exists in DDIC. After obtaining the image content and the first configuration file based on the second physical layer interface, DDIC can then send the image content and the first configuration file to the DSI module in DDIC.

[0242] Optionally, the first physical layer interface and the second physical layer interface can be specified based on the MIPI-SDI protocol. The first physical interface and the second physical layer interface can also be specified based on other protocols; this application does not limit this. This is to achieve fast data transmission between the SOC and DDIC.

[0243] Figure 14 In the structure shown, the DSI module in the DPU is connected to or bound to the first physical layer interface. The DSI module can send image content to the DDIC through the first physical layer interface. Based on the communication capability between the first physical layer interface and the DDIC, the CPU can be connected to or bound to the first physical layer interface, allowing the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface. Figure 14 The structure shown enables the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface.

[0244] Figure 15 A schematic diagram of the electronic device involved in the second method is shown.

[0245] Figure 15 The structure of the electronic device shown is similar to Figure 14 The electronic devices shown have similar structures. The difference lies in that... Figure 15 The illustrated electronic device also includes an independent driver chip. This independent driver chip includes a third physical layer interface and a fourth physical layer interface, which are connected. The third physical layer interface is also connected to the first physical layer interface, and the fourth physical layer interface is connected to the second physical layer interface. The CPU can send a first configuration file to the third physical layer interface of the independent driver chip via the first physical layer interface, and the DSI module can send image content to the third physical layer interface of the independent driver chip via the first physical layer interface. The independent driver chip then sends the image content and the first configuration file (DDIC) to the second physical layer interface via the fourth physical layer interface.

[0246] Optionally, the first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can be high-speed data transmission interfaces. For example, the first physical interface and third physical layer interface can be specified based on, but not limited to, the MIPI-SDI protocol. The second physical layer interface and fourth physical layer interface can be specified based on the MIPI-SDI protocol or the MIPI protocol. The first physical interface, second physical layer interface, third physical layer interface, and fourth physical layer interface can also be specified based on other protocols, which is not limited in this application. This enables fast data transmission between the independent driver chip and the SOC, and between the independent driver chip and the DDIC.

[0247] Optional, in Figure 15 In this embodiment, the fourth physical layer interface and the second physical layer interface can be ordinary data transmission interfaces. That is, the independent driver chip and the DDIC can transmit data using a common data connection interface protocol. The data transmission speed of an ordinary data transmission interface is lower than that of a high-speed data transmission interface.

[0248] for Figure 15 For more information, please refer to the following: Figure 14 The embodiments are described herein. Further details are omitted here.

[0249] Optionally, in some embodiments, Figures 12-15 The CPU shown can be replaced by a DMA. Upon detecting the first condition of turning on the display, the CPU can control the DMA to retrieve the first configuration file from the first memory and send it to the DPU via the DMA. The DPU then sends the first configuration file to the DDIC, or the first configuration file can be sent to the DDIC via a separate driver chip. In this way, the CPU can be freed up to perform other tasks, while the DMA retrieves the first configuration file from the first memory and sends it to the DPU.

[0250] Figure 16 A schematic diagram of the method flow of a display method provided in this application is shown.

[0251] S1601, SOC retrieves the first configuration file from the first memory.

[0252] S1602, SOC sends the image content and the first configuration file to DDIC.

[0253] S1603 and DDIC illuminate the display screen based on the first configuration file and display the first image on the display screen based on the image content.

[0254] The display device includes a system-on-a-chip (SOC), a display driver chip (DDIC), a display screen, and a first memory, which stores a first configuration file.

[0255] This method eliminates the need for integrated storage devices for the first configuration file in the screen module, reducing its integrated structure and cost. Secondly, by transmitting initialization commands, color correction data, and brightness curve data from the SOC to the DDIC, the speed at which the SOC acquires these data is accelerated, thus speeding up the DDIC's screen-lighting process.

[0256] Optionally, when the screen is turned on again after being turned off, the SOC needs to send the image content and the first configuration file to the DDIC again.

[0257] Optionally, the first memory can be any type of RAM, DRAM, etc. This application does not limit the types of the second memory and the first memory.

[0258] In one possible implementation, the SOC retrieves the first configuration file from the first memory, specifically including: when a first condition of turning on the display screen is detected, the SOC retrieves the first configuration file from the first memory; the first condition includes any one or more of the following: detecting a first operation by the user, or the SOC obtaining a first instruction.

[0259] The first condition can be either the electronic device detecting the first operation of turning on the display screen, or the SOC obtaining the first instruction to turn on the display screen.

[0260] The first operation to turn on the display screen can be a user's active operation on the power button / display screen, or it can be the electronic device recognizing the user's facial image, voiceprint, or fingerprint.

[0261] The command to turn on the display screen can also be that the electronic device receives a first message. To prompt the user to view the first message, the electronic device can send a first command to the SOC, enabling the SOC to control the display screen to turn on. For example, the first message can be any of the following: an incoming call message, a text message, an application message, etc. The first message can also be other messages, which are not limited in this application.

[0262] In one possible implementation, the display device further includes a second memory storing a first configuration file; before the SOC retrieves the first configuration file from the first memory, the method further includes: after the display device is powered on, the SOC retrieves the first configuration file from the second memory and stores the first configuration file in the first memory.

[0263] Using this method, the display device can store the first configuration file in the second memory, eliminating the need to add a storage device for storing the first configuration file in the screen module, thus reducing the composition and size of the screen module.

[0264] Optionally, the first configuration file stored in the second memory may be pre-installed in the second memory before the electronic device leaves the factory. Optionally, the second memory may be any one of a hard disk or universal flash storage (UFS).

[0265] Optionally, after the electronic device is powered off, the first configuration file stored in the second memory will not be cleared, but the first configuration file stored in the first memory will be cleared.

[0266] In one possible implementation, the display device further includes a third memory and a fourth memory; after the SOC sends the image content and the first configuration file to the DDIC, the method further includes: the DDIC storing the image content in the third memory; and the DDIC storing the first configuration file in the fourth memory.

[0267] In this way, DDIC can light up the display screen based on the first configuration file stored in the fourth memory, and display the first image on the display screen based on the image content stored in the third memory.

[0268] Optionally, the DDIC may include only one memory, for example, the third and fourth memories may be a single memory, and the image content and the first profile may also be stored in the same memory.

[0269] In one possible implementation, the SOC includes a central processing unit (CPU) and a data processing unit (DPU), with the CPU and DPU connected together and the DPU and DDIC connected together. The SOC retrieves a first configuration file from a first memory, specifically including: the CPU retrieving the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the CPU sending the first configuration file to the DPU; and the DPU sending the first configuration file to the DDIC.

[0270] In this way, the SOC can obtain the first configuration file through the CPU and send the first configuration file to the DDIC based on the DPU.

[0271] In one possible implementation, the SOC includes a Direct Memory Access Controller (DMA), the DMA and the DPU are connected, and the DPU and the DDIC are connected. The SOC retrieves a first configuration file from a first memory, specifically including: the DMA retrieving the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the DMA sending the first configuration file to the DPU; and the DPU sending the first configuration file to the DDIC. Optionally, before the DMA retrieves the first configuration file from the first memory, the CPU can send a first instruction to the DMA, and in response to the first instruction, the DMA then retrieves the first configuration file from the first memory.

[0272] Optionally, the first configuration file can also be obtained by the CPU from the first memory, and then the CPU sends the first configuration file to the DDIC.

[0273] In this way, the CPU can be freed up to perform other tasks, and the DMA can retrieve the first configuration file from the first memory and send it to the DPU.

[0274] In one possible implementation, the SOC also includes a first physical layer interface, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together.

[0275] The DPU sends the first configuration file to the DDIC, specifically by sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0276] Optionally, the first physical interface and the second physical layer interface can be high-speed data transmission interfaces to enable fast transmission of image content and the first configuration file between the SOC and DDIC.

[0277] In one possible implementation, the SOC further includes a first physical layer interface, the DPU includes a display serial interface (DSI) module and a fifth memory, and the DDIC further includes a second physical layer interface. The first physical layer interface and the second physical layer interface are connected. The CPU sends a first configuration file to the DPU, specifically including: the CPU sending the first configuration file to the fifth memory; the DPU sending the first configuration file to the DDIC, specifically including: the DSI module retrieving the first configuration file from the fifth memory; and the DSI module sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0278] In this way, the DSI module within the DPU is connected to or bound to the first physical layer interface. The DSI module can retrieve image content from the fifth memory and send it to the DDIC through the first physical layer interface. Based on the DPU's ability to send image content to the DDIC, the CPU can be connected to or bound to the fifth memory, allowing the CPU to write a first configuration file into the fifth memory. The DSI module can then retrieve the first configuration file from the fifth memory and quickly send it to the DDIC through the first physical layer interface. This method enables the CPU to quickly send the first configuration file to the DDIC via the DPU.

[0279] In one possible implementation, the SOC also includes a first physical layer interface, the DPU includes a DSI module and a fifth memory, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together.

[0280] The DMA sends the first configuration file to the DPU, specifically including: the DMA sending the first configuration file to the fifth memory; the DPU sending the first configuration file to the DDIC, specifically including: the DSI module obtaining the first configuration file from the fifth memory; the DSI module sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0281] The DSI module within the DPU is connected to or bound to the first physical layer interface. The DSI module can retrieve image content from the fifth memory and send it to the DDIC via the first physical layer interface. Based on the DPU's ability to send image content to the DDIC, the CPU can be connected to or bound to the fifth memory, allowing the DMA to write a first configuration file into the fifth memory. The DSI module can then retrieve the first configuration file from the fifth memory and quickly send it to the DDIC via the first physical layer interface. This method enables the DMA to quickly send the first configuration file to the DDIC via the DPU.

[0282] In this way, the CPU can be freed up to perform other tasks, and the DMA can retrieve the first configuration file from the first memory and send it to the DPU.

[0283] In one possible implementation, the SOC further includes a first physical layer interface and a CPU, and the DDIC further includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC obtains a first configuration file from the first memory, specifically including: the CPU obtaining the first configuration file from the first memory; the SOC sends the first configuration file to the DDIC, specifically including: the CPU sending the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0284] In this way, the DPU and the first physical layer interface are connected or bound together, allowing the DPU to send image content to the DDIC through the first physical layer interface. Based on the communication capability between the first physical layer interface and the DDIC, the CPU can be connected or bound to the first physical layer interface, enabling the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface. This method enables the CPU to quickly send the first configuration file to the DDIC through the first physical layer interface.

[0285] In one possible implementation, the SOC further includes a first physical layer interface and a DMA, and the DDIC further includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC obtains a first configuration file from the first memory, specifically including: the DMA obtains the first configuration file from the first memory. The SOC sends the first configuration file to the DDIC, specifically including: the DMA sends the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

[0286] In this way, the DPU and the first physical layer interface are connected or bound together, allowing the DPU to send image content to the DDIC through the first physical layer interface. Based on the communication capability between the first physical layer interface and the DDIC, the DMA can be connected or bound to the first physical layer interface, enabling the DMA to quickly send the first configuration file to the DDIC through the first physical layer interface. This method enables the DMA to quickly send the first configuration file to the DDIC through the first physical layer interface.

[0287] In this way, the CPU can be freed up to perform other tasks, and the DMA can retrieve the first configuration file from the first memory and send it to the DPU.

[0288] In one possible implementation, the SOC further includes a DPU and a first physical layer interface, the DDIC further includes a second physical layer interface, the DPU further includes a fifth memory and a DSI module, the DSI module is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface; the SOC sends image content to the DDIC, specifically including: the DSI module obtaining image content from the fifth memory; the DSI module sending image content to the second physical layer interface of the DDIC through the first physical layer interface.

[0289] In this way, the DPU can quickly send image content to the DDIC through the first physical layer interface.

[0290] In one possible implementation, the display device further includes an independent driver chip, and the SOC is connected to the DDIC through the independent driver chip; the SOC sends the image content and the first configuration file to the DDIC, specifically including: the SOC sends the image content and the first configuration file to the DDIC through the independent driver chip.

[0291] In one possible implementation, the CPU or DMA sends the first configuration file to the first physical layer interface based on the MIPI-DSI specification for mobile industry processor interfaces, or the DSI module sends image content to the first physical layer interface based on the MIPI-DSI specification.

[0292] In one possible implementation, the CPU or DMA sends the first configuration file to the first physical layer interface based on the MIPI specification.

[0293] Optional, not limited to MIPI-DSI and MIPI specifications, can also be other high-speed data transmission protocols, such as EDP and LVDS protocols.

[0294] In one possible implementation, initialization instructions are used to configure the screen's brightness display parameters, color correction data is used to adjust the brightness and / or color offset of each pixel in the screen, and brightness curve data is used to configure the driving voltage of each pixel in the screen based on the current display brightness.

[0295] In one possible implementation, the first memory includes any of the following: random access memory (RAM), dynamic random access memory (DRAM), or flash memory.

[0296] It is understood that the user interfaces described in the embodiments of this application are merely example interfaces and do not constitute a limitation on the solution of this application. In other embodiments, the user interface may adopt different interface layouts, may include more or fewer controls, and may add or remove other functional options, as long as they are based on the same inventive concept provided in this application, they are all within the protection scope of this application.

[0297] It should be noted that, without causing contradictions or conflicts, any feature in any embodiment of this application, or any part of any feature, can be combined, and the combined technical solution is also within the scope of the embodiments of this application.

[0298] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display method, characterized in that, The method is applied to a display device, the display device including a system-on-a-chip (SOC), a display driver chip (DDIC), a display screen, and a first memory, the first memory storing a first configuration file; the method includes: The SOC retrieves the first configuration file from the first memory; The SOC sends the image content and the first configuration file to the DDIC; The DDIC illuminates the display screen based on the initialization command, color correction data, and brightness curve data, and displays a first image on the display screen based on the image content.

2. The method according to claim 1, characterized in that, The SOC retrieves the first configuration file from the first memory, specifically including: When the first condition for turning on the display screen is detected, the SOC retrieves the first configuration file from the first memory; The first condition includes any one or more of the following: detecting the user's first operation, or the SOC acquiring the first instruction.

3. The method according to claim 1 or 2, characterized in that, The display device further includes a second memory, in which the first configuration file is stored; Before the SOC retrieves the first configuration file from the first memory, the method further includes: After the display device is powered on, the SOC retrieves the first configuration file from the second memory and stores the first configuration file in the first memory.

4. The method according to any one of claims 1-3, characterized in that, The display device further includes a third memory and a fourth memory; After the SOC sends the image content and the first configuration file to the DDIC, the method further includes: The DDIC stores the image content in the third memory; The DDIC stores the first configuration file in the fourth memory.

5. The method according to any one of claims 1-4, characterized in that, The SOC includes a central processing unit (CPU) and a data processing unit (DPU), the CPU and the DPU are connected, and the DPU is connected to the DDIC; the SOC retrieves the first configuration file from the first memory, specifically including: The CPU retrieves the first configuration file from the first memory; The SOC sends the first configuration file to the DDIC, specifically including: The CPU sends the first configuration file to the DPU; The DPU sends the first configuration file to the DDIC.

6. The method according to any one of claims 1-4, characterized in that, The SOC includes a Direct Memory Access Controller (DMA), the DMA and the DPU are connected, and the DPU and the DDIC are connected; the SOC obtains the first configuration file from the first memory, specifically including: The DMA retrieves the first configuration file from the first memory; The SOC sends the first configuration file to the DDIC, specifically including: The DMA sends the first configuration file to the DPU; The DPU sends the first configuration file to the DDIC.

7. The method according to claim 5, characterized in that, The SOC also includes a first physical layer interface, the DPU includes a display serial interface (DSI) module and a fifth memory, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together. The CPU sends the first configuration file to the DPU, specifically including: The CPU sends the first configuration file to the fifth memory; The DPU sends the first configuration file to the DDIC, specifically including: The DSI module retrieves the first configuration file from the fifth memory; The DSI module sends the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

8. The method according to claim 6, characterized in that, The SOC also includes a first physical layer interface, the DPU includes a DSI module and a fifth memory, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together. The DMA sends the first configuration file to the DPU, specifically including: The DMA sends the first configuration file to the fifth memory; The DPU sends the first configuration file to the DDIC, specifically including: The DSI module retrieves the first configuration file from the fifth memory; The DSI module sends the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

9. The method according to any one of claims 1-4, characterized in that, The SOC also includes a first physical layer interface and a CPU, and the DDIC also includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC retrieves the first configuration file from the first memory, specifically including: The CPU retrieves the first configuration file from the first memory; The SOC sends the first configuration file to the DDIC, specifically including: The CPU sends the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

10. The method according to any one of claims 1-4, characterized in that, The SOC also includes a first physical layer interface and DMA, and the DDIC also includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC retrieves the first configuration file from the first memory, specifically including: The DMA retrieves the first configuration file from the first memory; The SOC sends the first configuration file to the DDIC, specifically including: The DMA sends the first configuration file to the second physical layer interface of the DDIC through the first physical layer interface.

11. The method according to any one of claims 1-10, characterized in that, The SOC also includes a DPU and a first physical layer interface, the DDIC also includes a second physical layer interface, the DPU also includes a fifth memory and a DSI module, the DSI module is connected to the first physical layer interface, and the first physical layer interface and the second physical layer interface are connected. The SOC sends the image content to the DDIC, specifically including: The DSI module retrieves the image content from the fifth memory; The DSI module sends the image content to the second physical layer interface of the DDIC through the first physical layer interface.

12. The method according to any one of claims 1-11, characterized in that, The display device further includes an independent driver chip, and the SOC is connected to the DDIC through the independent driver chip; The SOC sends the image content and the first configuration file to the DDIC, specifically including: The SOC sends the image content and the first configuration file to the DDIC through the independent driver chip.

13. The method according to any one of claims 7, 8, or 11, characterized in that, The CPU or the DMA sends the first configuration file to the first physical layer interface based on the Mobile Industry Processor Interface (MIPI-DSI) specification, or the DSI module sends the image content to the first physical layer interface based on the MIPI-DSI specification.

14. The method according to claim 9 or 10, characterized in that, The CPU or the DMA sends the first configuration file to the first physical layer interface based on the MIPI specification.

15. The method according to any one of claims 1-14, characterized in that, The first configuration file includes initialization instructions, color correction data, and brightness curve data. The initialization instructions are used to configure the screen display parameters. The color correction data are used to adjust the brightness and / or color offset of each pixel in the display. The brightness curve data are used to configure the driving voltage of each pixel in the display based on the current display brightness of the display.

16. The method according to any one of claims 1-14, characterized in that, The first memory includes any one of the following: random access memory (RAM), dynamic random access memory (DRAM), and flash memory.

17. A display device, characterized in that, The display device includes a system-on-a-chip (SOC), a display driver chip (DDIC), a display screen, and a first memory. The SOC is connected to the DDIC and the first memory, and the DDIC is connected to the display screen. The first memory stores a first configuration file. The SOC is used to retrieve the first configuration file from the first memory; The SOC is also used to send the image content and the first configuration file to the DDIC; The DDIC is used to light up the display screen based on the first configuration file and to display a first image on the display screen based on the image content.

18. The apparatus according to claim 17, characterized in that, Specifically, the SOC is used to retrieve the first configuration file from the first memory when a first condition for turning on the display screen is detected; The first condition includes any one or more of the following: detecting the user's first operation, or the SOC acquiring the first instruction.

19. The apparatus according to claim 17 or 18, characterized in that, The display device further includes a second memory, in which the first configuration file is stored; The SOC is also configured to retrieve the first configuration file from the second memory and store the first configuration file in the first memory after the display device is powered on.

20. The apparatus according to any one of claims 17-19, characterized in that, The display device further includes a third memory and a fourth memory; The DDIC is also used to store the image content in the third memory and the first configuration file in the fourth memory.

21. The apparatus according to any one of claims 17-20, characterized in that, The SOC includes a central processing unit (CPU) and a data processing unit (DPU), wherein the CPU and the DPU are connected, and the DPU is connected to the DDIC. The SOC is specifically used for: The CPU retrieves the first configuration file from the first memory; The CPU sends the first configuration file to the DPU. The first configuration file is sent to the DDIC via the DPU.

22. The apparatus according to any one of claims 17-20, characterized in that, The SOC includes a Direct Memory Access Controller (DMA), the DMA is connected to the DPU, and the DPU is connected to the DDIC. The SOC is specifically used for: The first configuration file is retrieved from the first memory via the DMA; The first configuration file is sent to the DPU via the DMA; The first configuration file is sent to the DDIC via the DPU.

23. The apparatus according to claim 21, characterized in that, The SOC also includes a first physical layer interface, the DPU includes a display serial interface (DSI) module and a fifth memory, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together. The SOC is specifically used for: The CPU sends the first configuration file to the fifth memory. The first configuration file is obtained from the fifth memory through the DSI module; The first configuration file is sent to the second physical layer interface of the DDIC via the first physical layer interface through the DSI module.

24. The apparatus according to claim 22, characterized in that, The SOC also includes a first physical layer interface, the DPU includes a DSI module and a fifth memory, and the DDIC also includes a second physical layer interface, with the first physical layer interface and the second physical layer interface connected together. The SOC is specifically used for: The first configuration file is sent to the fifth memory via the DMA; The first configuration file is obtained from the fifth memory through the DSI module; The first configuration file is sent to the second physical layer interface of the DDIC via the first physical layer interface through the DSI module.

25. The apparatus according to any one of claims 17-20, characterized in that, The SOC also includes a first physical layer interface and a CPU, and the DDIC also includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC is specifically used for: The CPU retrieves the first configuration file from the first memory; The CPU sends the first configuration file to the second physical layer interface of the DDIC via the first physical layer interface.

26. The apparatus according to any one of claims 17-20, characterized in that, The SOC also includes a first physical layer interface and DMA, and the DDIC also includes a second physical layer interface. The CPU is connected to the first physical layer interface, and the first physical layer interface is connected to the second physical layer interface. The SOC is specifically used for: The first configuration file is retrieved from the first memory via the DMA; The first configuration file is sent to the second physical layer interface of the DDIC via the DMA based on the first physical layer interface.

27. The apparatus according to any one of claims 17-26, characterized in that, The SOC also includes a DPU and a first physical layer interface, the DDIC also includes a second physical layer interface, the DPU also includes a fifth memory and a DSI module, the DSI module is connected to the first physical layer interface, and the first physical layer interface and the second physical layer interface are connected. The SOC is specifically used for: The image content is obtained from the fifth memory through the DSI module; The image content is sent from the DSI module to the second physical layer interface of the DDIC via the first physical layer interface.

28. The apparatus according to any one of claims 17-27, characterized in that, The display device further includes an independent driver chip, and the SOC is connected to the DDIC through the independent driver chip; The SOC is specifically used for: The image content and the first configuration file are sent to the DDIC via the independent driver chip.

29. A computationally readable storage medium, comprising instructions, characterized in that, When the instructions are executed on the display device, the display device performs the method according to any one of claims 1-16.

30. A computer program product, characterized in that, The computer program product includes computer instructions that, when executed on a display device, cause the display device to perform the method according to any one of claims 1-16.

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