Connecting device of heat sink structure in fusion device and connecting method of heat sink structure

Abstract

This invention discloses a connection device and a connection method for a heat sink structure in a fusion device. The invention relates to the field of connection device technology. The heat sink structure includes an intermediate layer located between a first component and a second component. The connection device includes a housing defining a sealed cavity to form a connection environment for the heat sink structure. A pressure application module is movably disposed within the housing and at least partially located within the sealed cavity. The pressure application module is used to clamp the heat sink structure to apply a preset pressure to it. The pressure application module is electrically connected to the heat sink structure and a high-frequency DC power supply, forming an electrical circuit between the high-frequency DC power supply, the pressure application module, and the heat sink structure. When the high-frequency DC power supply supplies power to the pressure application module, the intermediate layer can be sintered to fix the first and second components together. This improves the connection stability, reliability, and efficiency of the first and second components, and the connection device has a simple structure and is easy to operate.

Description

Technical Field

[0001] This invention relates to the field of connection device technology, and in particular to a connection device for a heat sink structure in a fusion device and a connection method for a heat sink structure in a fusion device. Background Technology

[0002] In related technologies, the connection between dissimilar materials in the heat sink structure of fusion devices currently mainly adopts mechanical connection and multi-step brazing technology. However, mechanical connection is only suitable for low-power unsteady-state scenarios and cannot withstand the thermal stress and vibration under high-power steady-state operation, which is prone to loosening and failure. Multi-step brazing technology has high connection temperature and complex process, resulting in long production cycle and high cost. In addition, the material connection interface has high porosity and low shear strength, and it is difficult to adapt to a combination of various dissimilar materials. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a connection device for a heat sink structure in a fusion device, which can improve the connection stability, reliability, and efficiency of the first and second components, and the connection device has a simple structure and is easy to operate.

[0004] The present invention further proposes a method for connecting the heat sink structure in a fusion device, which is applied to the connection device of the heat sink structure in the fusion device.

[0005] According to an embodiment of the present invention, a connecting device for a heat sink structure in a fusion device is provided. The heat sink structure includes: a first body, an intermediate layer, and a second body, wherein the intermediate layer is located between the first body and the second body. The connecting device includes:

[0006] The enclosure defines a sealed cavity for the connection environment to form a heat sink structure;

[0007] A pressure application module is movably disposed in the housing and at least partially located within the sealed cavity. The pressure application module is used to clamp the heat sink structure to apply a preset pressure to the heat sink structure, and the pressure application module is adapted to be electrically connected to the heat sink structure.

[0008] A high-frequency DC power supply is electrically connected to the pressure application module so that the high-frequency DC power supply, the pressure application module and the heat sink structure form an electrical circuit. When the high-frequency DC power supply supplies power to the pressure application module, the intermediate layer can be sintered to fix the first body and the second body together.

[0009] According to an embodiment of the present invention, a connection device for a heat sink structure in a fusion device forms an electrical circuit through a high-frequency DC power supply, a pressure application module, and a heat sink structure. When the high-frequency DC power supply supplies power to the pressure application module, an intermediate layer can be sintered to fix the first component and the second component together. This can improve the connection stability, reliability, and efficiency of the first component and the second component. Moreover, the connection device has a simple structure and is easy to operate.

[0010] According to some embodiments of the present invention, the pressure application module includes: a first module and a second module, the first module and the second module are arranged along a first direction and are disposed opposite to each other, the first module and the second module are adapted to assemble a heat sink structure, the first module and the second module can move closer to each other or further away from each other along the first direction so that the pressure application module clamps or releases the heat sink structure, and the first module and the second module are respectively connected to the positive terminal and the negative terminal of a high-frequency DC power supply.

[0011] According to some embodiments of the present invention, both the first module and the second module are movably disposed in the housing along a first direction, and at least a portion of the first module and at least a portion of the second module are located in a sealed cavity.

[0012] According to some embodiments of the present invention, the connecting device further includes: a clamping mechanism for clamping the heat sink structure, the clamping mechanism being located between the first module and the second module, and the clamping mechanism being detachably disposed in at least one of the first module and the second module.

[0013] According to some embodiments of the present invention, the clamping mechanism includes: a first clamping block and a second clamping block, the first clamping block and the second clamping block are arranged along a first direction, the first clamping block is detachably fixed to a first module, and the second clamping block is detachably fixed to a second module.

[0014] According to some embodiments of the present invention, the second clamping block is formed with a receiving groove that opens toward the first clamping block, the receiving groove being used to receive a heat sink structure.

[0015] According to some embodiments of the present invention, the connecting device further includes a temperature control module, which is used to regulate the sintering temperature of the intermediate layer.

[0016] According to some embodiments of the present invention, the temperature control module includes: a controller and a temperature detection structure, the temperature detection structure being used to detect the temperature of the intermediate layer, the controller being communicatively connected to both the temperature detection structure and the high-frequency DC power supply, and the controller being configured to control the high-frequency DC power supply to operate based on the temperature information detected by the temperature detection structure in order to adjust the temperature of the intermediate layer.

[0017] According to some embodiments of the present invention, the connecting device further includes:

[0018] A vacuuming structure, selectively connected to and located within a sealed cavity, is used to evacuate the sealed cavity; and / or

[0019] The hydrogen-filling structure is selectively connected to a sealed cavity and is used to fill the sealed cavity with hydrogen.

[0020] The connection method for a heat sink structure in a fusion device according to an embodiment of the present invention is applied to the connection device for a heat sink structure in a fusion device described in the above embodiment. The connection method includes:

[0021] The connecting surfaces of the first and second parts are ground and polished to remove impurities and oxide layers.

[0022] The intermediate layer is laid between the first and second parts, and the heat sink structure is assembled into the pressure application module.

[0023] Fill the sealed cavity with hydrogen gas, and / or evacuate the sealed cavity;

[0024] The heat sink structure is clamped by the pressure application module to apply a preset pressure to the heat sink structure. The high-frequency DC power supply supplies power to the pressure application module, so that the temperature of the middle layer rises to the first preset temperature value and is kept at the temperature for a preset time.

[0025] The heat sink structure is removed when it cools down to the second preset temperature value.

[0026] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0027] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0028] Figure 1 This is a schematic diagram of the heat sink structure assembled with the connecting device according to an embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of a connection method for a heat sink structure in a fusion device according to an embodiment of the present invention.

[0030] Figure label:

[0031] Connecting device 100;

[0032] Box 10; Sealed cavity 11;

[0033] Pressure application module 20; First module 21; Second module 22;

[0034] High-frequency DC power supply 30;

[0035] Clamping mechanism 40; First clamping block 41; Second clamping block 42; Receiving groove 43;

[0036] Vacuum pumping structure 50; Hydrogen filling structure 51;

[0037] Heat sink structure 200; first component 201; intermediate layer 202; second component 203. Detailed Implementation

[0038] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0039] The following is for reference. Figures 1-2 The present invention describes a connection device 100 for a heat sink structure 200 in a fusion device and a connection method for a heat sink structure 200 in a fusion device.

[0040] According to an embodiment of the present invention, a connecting device 100 for a heat sink structure 200 in a fusion device is provided. The heat sink structure 200 includes: a first body 201, an intermediate layer 202, and a second body 203, wherein the intermediate layer 202 is located between the first body 201 and the second body 203. The connecting device 100 includes:

[0041] The enclosure 10 defines a sealed cavity 11 for forming a connection environment for the heat sink structure 200.

[0042] The pressure application module 20 is movably disposed in the housing 10 and at least partially located in the sealed cavity 11. The pressure application module 20 is used to clamp the heat sink structure 200 to apply a preset pressure to the heat sink structure 200, and the pressure application module 20 is adapted to be electrically connected to the heat sink structure 200.

[0043] The high-frequency DC power supply 30 is electrically connected to the pressure application module 20 so that the high-frequency DC power supply 30, the pressure application module 20 and the heat sink structure 200 form an electrical circuit. When the high-frequency DC power supply 30 supplies power to the pressure application module 20, the intermediate layer 202 can be sintered to fix the first body 201 and the second body 203 together.

[0044] The heat sink structure 200 includes a first body 201, an intermediate layer 202, and a second body 203. The intermediate layer 202 is located between the first body 201 and the second body 203. As an embodiment of the present invention, the first body 201 is a copper alloy (CuCrZr), the second body 203 is tungsten (W), and the intermediate layer 202 is a W-CuCrZr mixed powder.

[0045] The box 10 can be constructed as an insulated box. The box 10 defines a sealed cavity 11 for forming a connection environment for the heat sink structure 200. It can effectively suppress the loss of volatile components in dissimilar materials (first part 201 and second part 203), significantly reduce the formation of surface oxide layer, maintain material purity, avoid impurity contamination, improve product performance stability, improve microstructure, and enhance performance consistency.

[0046] The pressure application module 20 can be constructed as a hydraulic or pneumatic structure, and can be reasonably selected and set according to actual conditions. The pressure application module 20 is movably disposed in the housing 10 and at least partially located within the sealed cavity 11. In some embodiments of the present invention, the pressure application module 20 and the housing 10 can be connected by piston rings or O-rings, so that the pressure application module 20 can reciprocate relative to the housing 10, ensuring both the normal movement of the pressure application module 20 and the sealing of the housing 10. Since at least part of the pressure application module 20 is located within the sealed cavity 11, the pressure application module 20 can clamp the heat sink structure 200 located within the sealed cavity 11 to apply a preset pressure to the heat sink structure 200. The pressure application module 20 is also suitable for electrical connection with the heat sink structure 200, enabling the heat sink structure 200 to be energized through the pressure application module 20, thereby achieving rapid Joule heating of the intermediate layer 202 and sintering of the intermediate layer 202.

[0047] The high-frequency DC power supply 30 is electrically connected to the pressure application module 20, so that the high-frequency DC power supply 30, the pressure application module 20 and the heat sink structure 200 form an electrical circuit. When the high-frequency DC power supply 30 supplies power to the pressure application module 20, the intermediate layer 202 can be sintered to fix the first body 201 and the second body 203 together. This can achieve an oxidation-free connection between the first body 201 and the second body 203, while relieving the thermal stress of the first body 201 and the second body 203 and improving the thermal load adaptability of the first body 201 and the second body 203. The design of the intermediate layer 202 can effectively reduce the thermal stress caused by the difference in the thermal expansion coefficient between the first body 201 and the second body 203, and avoid cracking and deformation of the first body 201 and the second body 203 under thermal load. This can improve the connection stability, reliability and efficiency of the first body 201 and the second body 203. Moreover, the connection device 100 has a simple structure and is easy to operate. It can also be applied to the connection between various types of dissimilar materials.

[0048] According to an embodiment of the present invention, a connection device 100 for a heat sink structure 200 in a fusion device forms an electrical circuit through a high-frequency DC power supply 30, a pressure application module 20, and a heat sink structure 200. When the high-frequency DC power supply 30 supplies power to the pressure application module 20, an intermediate layer 202 can be sintered to fix the first component 201 and the second component 203 together. This can improve the connection stability, reliability, and efficiency of the first component 201 and the second component 203. Moreover, the connection device 100 has a simple structure and is easy to operate.

[0049] According to some embodiments of the present invention, such as Figure 1 As shown, the pressure application module 20 includes a first module 21 and a second module 22. The first module 21 and the second module 22 are arranged along a first direction and are positioned opposite each other. The first module 21 and the second module 22 are adapted to assemble a heat sink structure 200. The first module 21 and the second module 22 can move closer to each other or further away from each other along the first direction so that the pressure application module 20 can clamp or release the heat sink structure 200. The first module 21 and the second module 22 are respectively connected to the positive and negative terminals of the high-frequency DC power supply 30.

[0050] The first direction is Figure 1 In the X direction, both the first module 21 and the second module 22 can be constructed as hydraulic structures. The first module 21 and the second module 22 are arranged along the first direction and are positioned relative to each other. The first module 21 and the second module 22 are suitable for assembling a heat sink structure 200. Specifically, the first module 21 is adapted to assemble the first part 201 of the heat sink structure 200, and the second module 22 is adapted to assemble the second part 203 of the heat sink structure 200. The first module 21 and the second module 22 can move closer to each other or further away along the first direction so that the pressure application module 20 can clamp or release the heat sink structure 200. During the connection process of the first part 201 and the second part 203, the first module 21 and the second module 22 can move closer to each other along the first direction and the pressure application module 20 clamps the heat sink structure 200 so that the intermediate layer 202 sintersects the first part 201 and the second part 203. After the first part 201 and the second part 203 are fixedly connected, the heat sink structure 200 is released by the pressure application module 20 and the first module 21 moves away from the second module 22, thereby enabling the heat sink structure 200 to be removed.

[0051] Furthermore, the first module 21 and the second module 22 are respectively connected to the positive and negative terminals of the high-frequency DC power supply 30 to energize the heat sink structure 200, thereby enabling the intermediate layer 202 to be sintered when the high-frequency DC power supply 30 supplies power to the pressure application module 20. By heating to an appropriate temperature, through physical and chemical processes such as atomic diffusion and surface energy reduction, metallurgical bonding or atomic-level bonding is formed between the particles to connect the first body 201 and the second body 203.

[0052] According to some embodiments of the present invention, such as Figure 1 As shown, the first module 21 and the second module 22 are both movably disposed in the housing 10 along the first direction, and at least a portion of the first module 21 and at least a portion of the second module 22 are located in the sealed cavity 11.

[0053] Both the first module 21 and the second module 22 can be configured as hydraulic structures. Both modules can be connected to the housing 10 via piston rings or O-rings, allowing them to be movably disposed within the housing 10 along a first direction. This enables the first and second modules 21 and 22 to move closer to or further away from each other along the first direction, ensuring both normal movement of the first and second modules and the airtightness of the housing 10. Furthermore, at least a portion of the first module 21 and at least a portion of the second module 22 are located within the sealed cavity 11, allowing the first and second modules 21 to clamp the heat sink structure 200 located within the sealed cavity 11 and apply a preset pressure to the heat sink structure 200.

[0054] According to some embodiments of the present invention, such as Figure 1 As shown, the connecting device 100 further includes a clamping mechanism 40, which is used to clamp the heat sink structure 200. The clamping mechanism 40 is located between the first module 21 and the second module 22, and is detachably disposed in at least one of the first module 21 and the second module 22.

[0055] The clamping mechanism 40 can be configured as an electromagnetic clamping mechanism, a hydraulic clamping mechanism, a multi-jaw clamping mechanism, or other types of clamping mechanisms, and can be reasonably selected and set according to actual conditions. The clamping mechanism 40 is used to clamp the heat sink structure 200. The clamping mechanism 40 is located between the first module 21 and the second module 22. It can ensure that the position of the heat sink structure 200 is stable when it is pressed by the pressure application module 20, and can ensure that the pressure is applied evenly to the heat sink structure 200, avoiding local stress concentration that could lead to material displacement or deformation.

[0056] The clamping mechanism 40 is detachably disposed in at least one of the first module 21 and the second module 22. In some embodiments of the present invention, the clamping mechanism 40 is detachably connected to the first module 21, or the clamping mechanism 40 is detachably connected to the second module 22, or the clamping mechanism 40 is detachably connected to both the first module 21 and the second module 22. The appropriate selection and configuration can be made according to actual conditions. As a specific embodiment of the present invention, the clamping mechanism 40 is detachably connected to both the first module 21 and the second module 22. This configuration allows for the replacement of different clamping mechanisms 40 according to different shapes and sizes of heat sink structures 200, enabling the connecting device 100 to adapt to different heat sink structures 200. This effectively improves the versatility of the connecting device 100 and facilitates its later maintenance, reducing the connection cost of the heat sink structure 200.

[0057] According to some embodiments of the present invention, such as Figure 1 As shown, the clamping mechanism 40 includes a first clamping block 41 and a second clamping block 42. The first clamping block 41 and the second clamping block 42 are arranged along a first direction. The first clamping block 41 is detachably fixed to the first module 21, and the second clamping block 42 is detachably fixed to the second module 22.

[0058] The first clamping block 41 and the second clamping block 42 are arranged along the first direction. The first clamping block 41 is detachably fixed to the first module 21. In some embodiments of the present invention, the first clamping block 41 and the first module 21 can be detachably connected by bolts or by threads. However, the present invention is not limited to these. The first clamping block 41 and the first module 21 can also be detachably connected by other means, as long as one clamping block is detachably fixed to the first module 21.

[0059] The second clamping block 42 is detachably fixed to the second module 22. In some embodiments of the present invention, the second clamping block 42 and the second module 22 can be detachably connected by bolts or by threads. However, the present invention is not limited to these. The second clamping block 42 and the second module 22 can also be detachably connected by other means, as long as the two clamping blocks are detachably fixed to the second module 22.

[0060] This configuration allows for the replacement of different clamping mechanisms 40 with heat sink structures 200 of different shapes and sizes, enabling the connecting device 100 to be adapted to different heat sink structures 200. This further enhances the versatility of the connecting device 100 and facilitates its later maintenance, thereby reducing the connection cost of the heat sink structure 200.

[0061] According to some embodiments of the present invention, such as Figure 1 As shown, the second clamping block 42 has a receiving groove 43 that opens toward the first clamping block 41, and the receiving groove 43 is used to receive the heat sink structure 200.

[0062] The second clamping block 42 has a receiving groove 43 that opens toward the first clamping block 41. The receiving groove 43 is used to accommodate the heat sink structure 200, which can reduce the risk of the heat sink structure 200 falling off. Even if the first clamping block 41 and the second clamping block 42 fail, the heat sink structure 200 can still be stably assembled in the receiving groove 43. When the first part 201 and the second part 203 of the heat sink structure 200 are fixedly connected, the heat sink structure 200 is still located in the receiving groove 43 when the first clamping block 41 and the second clamping block 42 release the heat sink structure 200. It is only necessary to remove the heat sink structure 200 from the receiving groove 43. There is no need to specially set up a component for fixing the heat sink structure 200, which not only improves the safety and reliability of the connecting device 100, but also helps to reduce the manufacturing cost of the connecting device 100.

[0063] According to some embodiments of the present invention, such as Figure 1 As shown, the connecting device 100 also includes a temperature control module, which is used to regulate the sintering temperature of the intermediate layer 202.

[0064] The temperature control module is used to regulate the sintering temperature of the intermediate layer 202. During the sintering process, temperature is a key parameter affecting the material's performance. The temperature control module can precisely control the temperature near the set value (such as ±1℃ or even higher precision), ensuring that the intermediate layer 202 material is heated evenly and avoiding overheating or underheating in some areas due to temperature fluctuations.

[0065] Different inorganic materials and cemented carbides have varying requirements for sintering temperature precision. The temperature control module can flexibly adjust the temperature according to specific material characteristics and process requirements, providing suitable conditions for the sintering of various materials, thereby improving the versatility of the connecting device 100. Furthermore, the temperature control module can monitor temperature changes in real time. When the temperature exceeds the set safety threshold, it can automatically trigger an alarm and take protective measures (such as cutting off the heating power supply) to prevent equipment failure or safety accidents caused by excessive temperature, thus effectively improving the safety and reliability of the connecting device 100.

[0066] According to some embodiments of the present invention, such as Figure 1 As shown, the temperature control module includes a controller and a temperature detection structure. The temperature detection structure is used to detect the temperature of the intermediate layer 202. The controller is communicatively connected to both the temperature detection structure and the high-frequency DC power supply 30. The controller is configured to control the high-frequency DC power supply 30 to work according to the temperature information detected by the temperature detection structure in order to adjust the temperature of the intermediate layer 202.

[0067] The temperature control module includes a controller and a temperature detection structure. The controller can be a feedback controller (such as a PID controller), a temperature control instrument, or other similar type, and can be selected and configured appropriately according to the actual situation. The temperature detection structure can be a temperature sensor, a thermocouple, or other similar type, and can also be selected and configured appropriately according to the actual situation.

[0068] The temperature detection structure can be fixed to the clamping mechanism 40, and is used to detect the temperature of the intermediate layer 202. The controller is communicatively connected to both the temperature detection structure and the high-frequency DC power supply 30. The controller is configured to control the high-frequency DC power supply 30 to operate based on the temperature information detected by the temperature detection structure to adjust the temperature of the intermediate layer 202. Specifically, when the temperature detection structure detects a temperature lower than the preset sintering temperature of the intermediate layer 202, the controller controls the high-frequency DC power supply 30 to increase its operating power to raise the temperature of the intermediate layer 202 to reach the preset temperature. When the temperature detection structure detects a temperature higher than the preset sintering temperature of the intermediate layer 202, the controller controls the high-frequency DC power supply 30 to decrease its operating power to lower the temperature of the intermediate layer 202 to reach the preset temperature. When the temperature detection structure detects a temperature equal to the preset sintering temperature of the intermediate layer 202, the controller controls the high-frequency DC power supply 30 to maintain its current power to keep the intermediate layer 202 warm.

[0069] This enables precise temperature control of the sintering of the intermediate layer 202 of the heat sink structure 200, improving the connection stability, reliability and efficiency of the first component 201 and the second component 203. The controller can dynamically adjust the heating power of the high-frequency DC power supply 30 according to actual needs, avoiding energy waste.

[0070] According to some embodiments of the present invention, the connecting device 100 further includes:

[0071] A vacuuming structure 50 is selectively connected to and disposed within the sealed cavity 11 of the housing 10. The vacuuming structure 50 is used to evacuate the sealed cavity 11; and / or

[0072] Hydrogen filling structure 51 is selectively connected to the sealed cavity 11 and is used to fill the sealed cavity 11 with hydrogen.

[0073] The connecting device 100 further includes a vacuum structure 50, which is selectively connected to the sealed cavity 11 and disposed in the housing 10. The vacuum structure 50 is used to evacuate the sealed cavity 11.

[0074] Alternatively, the connecting device 100 may further include a hydrogen filling structure 51, which is selectively connected to the sealed cavity 11 and is used to fill the sealed cavity 11 with hydrogen.

[0075] Alternatively, the connecting device 100 may further include a vacuuming structure 50 and a hydrogen filling structure 51. The vacuuming structure 50 is selectively connected to the sealed cavity 11 and disposed within the housing 10. The vacuuming structure 50 is used to evacuate the sealed cavity 11, and the hydrogen filling structure 51 is selectively connected to the sealed cavity 11 and is used to fill the sealed cavity 11 with hydrogen. This embodiment is used as an example to illustrate the present invention. This configuration allows for the rational selection of either the vacuuming structure 50 or the hydrogen filling structure 51 to evacuate or fill the sealed cavity 11 with hydrogen, depending on the type of heat sink material. This enables the connecting device 100 to provide different connection environments to accommodate different heat sink structures 200, thereby further improving the versatility of the connecting device 100.

[0076] like Figure 2 As shown, the connection method for a heat sink structure in a fusion device according to an embodiment of the present invention is applied to the connection device for a heat sink structure in a fusion device described in the above embodiment. The connection method includes:

[0077] S1, grind and polish the connecting surface of the first and second parts to remove impurities and oxide layer.

[0078] In one specific embodiment of the present invention, the first component is a copper alloy (CuCrZr), the second component is tungsten (W), and the intermediate layer is a W-CuCrZr mixed powder. The connecting surface between the first and second components is ground and polished to remove impurities and oxide layers, thus preventing impurities and oxide layers from hindering direct contact and diffusion between atoms of dissimilar materials. The pure surface atoms exposed after polishing have higher activity and are more likely to diffuse during sintering, forming metallurgical bonds or chemical bonds, significantly improving the interface strength.

[0079] S2, the intermediate layer is laid between the first and second parts, and the heat sink structure is assembled into the pressure application module.

[0080] The process involves placing the heat sink between the first and second components and assembling it into the pressure application module. This ensures accurate connection between the first, second, and intermediate layers, laying the foundation for applying pressure to the heat sink and preventing damage and malfunctions due to positioning errors.

[0081] S3, fill the sealed cavity with hydrogen gas, and / or evacuate the sealed cavity.

[0082] The choice between evacuating the sealed cavity or filling it with hydrogen depends on the types of the first and second components. When the first component is a copper alloy (CuCrZr), the second component is tungsten (W), and the intermediate layer is a W-CuCrZr mixed powder (W 20%, CuCrZr 80%), hydrogen is filled into the sealed cavity. Hydrogen has strong reducing properties at high temperatures and can chemically react with metal oxides (such as Fe2O3, WO3, etc.), reducing them to elemental metals. Simultaneously, water vapor is generated and discharged. This process prevents high-temperature oxidation of materials such as tungsten, significantly reducing oxide inclusions in the sintered product and improving material purity and performance. Through the synergistic effect of the hydrogen environment and the intermediate layer, oxidation-free bonding of tungsten-based materials is achieved, while also alleviating thermal stress in the heat sink structure.

[0083] S4, the heat sink structure is clamped by the pressure application module to apply a preset pressure to the heat sink structure, and the high-frequency DC power supply supplies power to the pressure application module to raise the temperature of the intermediate layer to the first preset temperature value and keep it at that temperature for a preset time.

[0084] The pressure application module eliminates microscopic gaps between the intermediate layer and the first and second components, increasing the actual contact area and providing more channels for atomic diffusion. It also counteracts residual stress caused by thermal expansion mismatch during sintering, reducing the risk of cracking. A high-frequency DC power supply powers the pressure application module, raising the temperature of the intermediate layer to a first preset temperature value and holding it at that temperature for a preset time to achieve interfacial bonding between the first and second components, thus completing the fixed connection of the heat sink structure. The first preset temperature value is 900℃±50℃, and the preset holding time is 20-40 minutes.

[0085] S5, the heat sink structure is removed when it cools down to the second preset temperature value.

[0086] The second preset temperature value is set reasonably according to the temperature that the tool for taking out the heat sink structure can withstand. When the heat sink structure cools down to the second preset temperature value, the heat sink structure is taken out, thereby completing the fixed connection of the heat sink structure.

[0087] Furthermore, by employing spark plasma sintering (SPS) technology, tungsten can be bonded to copper alloys, stainless steel, graphite, or molybdenum alloys in a vacuum or hydrogen environment by customizing different intermediate layers. This enables a tight connection of the heat sink structure, meeting the structural strength and sealing requirements of the vacuum chamber wall of the fusion device.

[0088] Furthermore, as an embodiment 1 of the present invention:

[0089] W-CuCrZr connection;

[0090] Materials to be joined: 20mm wide × 150mm long × 5mm thick tungsten sheet, CuCrZr heat sink structure;

[0091] Intermediate layer selection: W-CuCrZr mixed powder (20% / 80%);

[0092] Process parameters: hydrogen environment, suitable pressure and pulse current parameters, temperature 900℃, heat preservation for 30 minutes;

[0093] Subsequent processing: Grind away welding residue in the gaps between tungsten sheets to release welding stress and reduce stress concentration during structural service;

[0094] Performance testing: The heat sink structure was subjected to thermal load testing using an electron beam irradiation device. It successfully withstood high thermal loads of 23MW / m² quasi-steady state (10 minutes) and 15MW / m², 10 seconds, 100 cycles (duty cycle 50%). The highest surface temperature was 1200℃, and there were no welding defects, meeting the requirements for device use.

[0095] As an embodiment 2 of the present invention:

[0096] W-CuCrZr connection;

[0097] Materials to be connected: tungsten armor (various thicknesses), CuCrZr radiator, water channel structure design;

[0098] Intermediate layer selection: W-CuCrZr mixed powder (20% / 80%);

[0099] Process parameters: The process parameters of Example 1 are used, and the pressure distribution is finely adjusted according to the water channel structure;

[0100] Prototype fabrication: Three prototypes with different water channel designs and tungsten thicknesses were manufactured, with a length of 1 / 3 that of the actual components;

[0101] Performance testing: The heat sink structure was subjected to thermal load testing using an electron beam irradiation device. The SATIR infrared non-destructive testing was completed through long-term irradiation of 15MW / m²×100 seconds and cyclic testing of 15MW / m²×10 seconds×100 times. Subsequently, high-power testing was carried out on the HADES device, and the data verified that the performance met the standards.

[0102] As an embodiment 3 of the present invention:

[0103] W-Stainless steel connection;

[0104] Materials to be joined: 1mm sheet tungsten armor, 5mm thick stainless steel heat sink structure;

[0105] Intermediate layer selection: W-Cu mixed powder + Cu sheet + Cu powder multilayer gradient intermediate layer;

[0106] Process parameters: vacuum or hydrogen environment, adaptable pressure and pulse current parameters, temperature control to avoid deterioration of stainless steel performance;

[0107] Performance testing: A tight connection of the heat sink structure was successfully achieved, with only slight warping, meeting the structural strength and sealing requirements of the vacuum chamber wall.

[0108] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0109] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A connection device for a heat sink structure in a fusion device, characterized in that, The heat sink structure includes: a first body, an intermediate layer, and a second body, wherein the intermediate layer is located between the first body and the second body, and the intermediate layer is at least partially a powder structure; the connecting device includes: The enclosure defines a sealed cavity for the connection environment of forming a heat sink structure; A pressure application module is movably disposed in the housing and at least partially located within the sealed cavity. The pressure application module is used to clamp the heat sink structure to apply a preset pressure to the heat sink structure, and the pressure application module is adapted to be electrically connected to the heat sink structure. A high-frequency DC power supply is electrically connected to the pressure application module so that the high-frequency DC power supply, the pressure application module, and the heat sink structure form an electrical circuit. When the high-frequency DC power supply supplies power to the pressure application module, the intermediate layer can be sintered to fix the first body and the second body together.

2. The connecting device for the heat sink structure in a fusion device according to claim 1, characterized in that, The pressure application module includes a first module and a second module, which are arranged along a first direction and opposite to each other. The first module and the second module are adapted to assemble the heat sink structure. The first module and the second module can move closer to or further away from each other along the first direction so that the pressure application module can clamp or release the heat sink structure. The first module and the second module are respectively connected to the positive and negative terminals of the high-frequency DC power supply.

3. The connection device for the heat sink structure in a fusion device according to claim 2, characterized in that, Both the first module and the second module are movably disposed in the housing along the first direction, and at least a portion of the first module and at least a portion of the second module are located within the sealed cavity.

4. The connecting device for the heat sink structure in a fusion device according to claim 2, characterized in that, The connecting device further includes a clamping mechanism for clamping the heat sink structure. The clamping mechanism is located between the first module and the second module, and is detachably disposed in at least one of the first module and the second module.

5. The connecting device for the heat sink structure in a fusion device according to claim 4, characterized in that, The clamping mechanism includes a first clamping block and a second clamping block, the first clamping block and the second clamping block are arranged along the first direction, the first clamping block is detachably fixed to the first module, and the second clamping block is detachably fixed to the second module.

6. The connecting device for the heat sink structure in a fusion device according to claim 5, characterized in that, The second clamping block has a receiving groove that opens toward the first clamping block, the receiving groove being used to receive the heat sink structure.

7. The connecting device for the heat sink structure in a fusion device according to claim 1, characterized in that, The connecting device further includes a temperature control module, which is used to regulate the sintering temperature of the intermediate layer.

8. The connecting device for a heat sink structure in a fusion device according to claim 7, characterized in that, The temperature control module includes a controller and a temperature detection structure. The temperature detection structure is used to detect the temperature of the intermediate layer. The controller is communicatively connected to both the temperature detection structure and the high-frequency DC power supply. The controller is configured to control the high-frequency DC power supply to operate based on the temperature information detected by the temperature detection structure in order to adjust the temperature of the intermediate layer.

9. The connection device for a heat sink structure in a fusion device according to any one of claims 1-8, characterized in that, The connecting device further includes: A vacuuming structure, selectively connected to and disposed within the sealed cavity, is used to evacuate the sealed cavity; and / or A hydrogen-filling structure is selectively connected to the sealed cavity, and the hydrogen-filling structure is used to fill the sealed cavity with hydrogen.

10. A method for connecting a heat sink structure in a fusion device, characterized in that, The connection device applied to the heat sink structure in a fusion device according to any one of claims 1-9, the connection method comprising: The connecting surfaces of the first and second parts are ground and polished to remove impurities and oxide layers. The intermediate layer is laid between the first component and the second component, and the heat sink structure is assembled into the pressure application module; Hydrogen gas is introduced into the sealed cavity, and / or a vacuum is drawn into the sealed cavity; The heat sink structure is clamped by the pressure application module to apply a preset pressure to the heat sink structure. The high-frequency DC power supply supplies power to the pressure application module, so that the temperature of the intermediate layer rises to a first preset temperature value and is kept at that temperature for a preset time. The heat sink structure is removed when it is cooled to the second preset temperature value.

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