Electrical connector

Abstract

The application discloses an electric connector, and relates to the technical field of high-speed connectors. The electric connector comprises an insulator, two opposite mounting end faces, a signal probe arranged in the insulator, two opposite ends of the signal probe exposed to the two mounting end faces, a plurality of grounding probes arranged in the insulator, two opposite ends of the grounding probes exposed to the two mounting end faces, the plurality of grounding probes arranged around the signal probe, and an electric connection layer arranged in the insulator and spaced apart from the mounting end faces, the electric connection layer connected with the plurality of grounding probes. The technical scheme of the application can improve the minimum resonance frequency of the electric connector structure resonance and reduce the insertion loss of the electric connector.

Description

Technical Field

[0001] This invention relates to the field of high-speed connector technology, and in particular to an electrical connector. Background Technology

[0002] High-speed connectors are electrical connectors suitable for high-frequency signal transmission, typically used in 5G / 6G communications, high-speed interconnects in data centers, etc. A high-speed connector usually consists of an insulator, multiple sets of signal probes mounted on the insulator, and grounding probes surrounding each set of signal probes. Related research indicates that the shorter the probes, the higher the structural resonant frequency of the electrical connector. However, due to the effectiveness of the spring force and the need to provide sufficient travel for the probe head, it is difficult to make the probes short enough. This results in a generally lower structural resonant frequency for electrical connectors. When transmitting high-frequency signals (e.g., 56GHz and above), the frequency of the high-frequency signal is often higher than the structural resonant frequency of the product. Therefore, during operation, the structural resonance of the electrical connector is prone to coupling with the high-frequency signal, leading to a resonance peak near the target operating frequency, resulting in higher insertion loss for the electrical connector. Summary of the Invention

[0003] The main objective of this invention is to provide an electrical connector that aims to increase the minimum resonant frequency of the electrical connector structure and reduce the insertion loss of the electrical connector.

[0004] To achieve the above objectives, the electrical connector proposed in this invention includes: An insulator having two opposing mounting faces; A signal probe is disposed on the insulator, with its opposite ends exposed on the two mounting end faces; Multiple grounding probes are disposed on the insulator, with opposite ends of the grounding probes exposed on the two mounting faces, and the multiple grounding probes are arranged around the signal probe; and An electrical connection layer is disposed within the insulator and spaced apart from the mounting end face; the electrical connection layer is connected to all of the plurality of grounding probes.

[0005] Optionally, at least one of the mounting end faces is provided with a connection groove between any two adjacent grounding probes, and the electrical connection layer is disposed at the bottom of the connection groove.

[0006] Optionally, the connecting groove is a laser-engraved groove.

[0007] Optionally, the electrical connection layer is a conductive plating layer disposed at the bottom of the laser engraving tank.

[0008] Optionally, the width of the connecting groove is smaller than the outer diameter of the grounding probe.

[0009] Optionally, the connecting groove is a straight groove.

[0010] Optionally, the depth of the connecting groove is less than or equal to 1 / 3 of the thickness of the insulator.

[0011] Optionally, both mounting end faces are provided with the connecting groove.

[0012] Optionally, the electrical connection layer includes multiple conductive elements, with one conductive element connected between any two adjacent grounding probes, and the conductive element and the insulator are integrally formed by insert injection molding.

[0013] Optionally, the insulator includes multiple insulating layers stacked separately, and the electrical connection layer is disposed between two adjacent insulating layers.

[0014] Optionally, the insulator is made of plastic, and the electrical connection layer is made of metal.

[0015] Optionally, multiple sets of signal probes are arranged in an array on the insulator, and a ring of grounding probes is provided on the outer periphery of each set of signal probes.

[0016] The technical solution of this invention adds an electrical connection layer connected to the grounding probe within the insulation body to form a ground-like layer within the insulation body for dividing the resonant cavity of the electrical connector structure. By dividing the resonant cavity through the ground-like layer, the height of the resonant cavity is shortened, thereby increasing the minimum resonant frequency of the electrical connector structure. This significantly increases the probability that the minimum resonant frequency is higher than the frequency of the high-frequency signal to be transmitted. In this way, the probability of resonance occurring in the target operating frequency band can be reduced, thereby reducing the insertion loss of the electrical connector and ensuring the stability and reliability of high-frequency signal transmission. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the electrical connector of the present invention; Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the CEC connector; the spring inside the grounding probe is hidden. Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 for Figure 1 A cross-sectional structural diagram of the CEC connector from another perspective; Figure 5 This is a schematic cross-sectional view of another embodiment of the electrical connector of the present invention; Figure 6 for Figure 1 Simulation diagram of insertion loss of CEC connector; Figure 7 This is a simulation diagram of differential calculations for insulators without electrical connection layers.

[0019] Explanation of icon numbers: 10. Insulator; 11. Connecting groove; 20. Signal probe; 21. Differential signal sub-pin; 30. Grounding probe; 31. Needle tube; 32. Probe tip; 33. Spring; 40. Shielding pin; 50. Electrical connection layer; 60. Circuit board The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] This invention proposes an electrical connector.

[0024] Reference Figures 1 to 4 In one embodiment of the present invention, the electrical connector includes: Insulator 10 has two opposing mounting faces; A signal probe 20 is disposed on the insulator 10, with its opposite ends exposed on the two mounting end faces; A plurality of grounding probes 30 are disposed on the insulator 10, with opposite ends of the grounding probes 30 exposed on the two mounting faces, and the plurality of grounding probes 30 are arranged around the signal probe 20; and An electrical connection layer 50 is disposed within the insulator 10 and is spaced apart from the mounting end face. The electrical connection layer 50 is connected to the plurality of grounding probes 30.

[0025] In this embodiment, the electrical connector can be a board-to-board connector, which is installed between two circuit boards 60 to realize the connection between the GPU and the motherboard. It can be understood that one circuit board 60 is the interface panel of the GPU, and the other circuit board 60 is the motherboard.

[0026] Without loss of generality, the probe is scalable, and the shortest contracted length of the probe used in this invention is defined as L. e Taking a double-headed probe as an example, the double-headed probe includes a needle tube 31, two probe heads 32 that extend movably from opposite ends of the needle tube 31, and a spring 33 disposed between the two probe heads 32. The two probe heads 32 can be completely retracted into the needle tube 31 under extreme compression. Thus, the length of the needle tube 31 is the aforementioned L. e .

[0027] In this invention, the electrical connection layer 50 is disposed within the insulator 10, such that the electrical connection layer 50 is connected to the needle tube 31 of the grounding probe 30, and that there is a distance between the electrical connection layer 50 and both ends of the needle tube 31. It can be understood that the electrical connection layer 50, which is connected to multiple grounding probes 30, forms a near-ground layer, but without the same effect as a solid ground layer in a printed circuit board. This is referred to here as a ground-like layer. This ground-like layer can divide the resonant cavities formed at both ends of the probes. For a resonant cavity, its resonant frequency is inversely proportional to its height L; the smaller the height L, the higher the resonant frequency. It can be understood that in this invention, the resonant frequencies of the multiple resonant cavities formed after being divided by the ground-like layer formed by the electrical connection layer 50 will be higher.

[0028] In this invention, the insulator 10 has two opposing mounting end faces, and the distance between these two mounting end faces is the height of the insulator 10. The length of the probe tube 31 is usually equivalent to the height of the insulator 10, that is, the height of the insulator 10 is usually equal to the height of the L. e quite.

[0029] In this invention, the electrical connection layer 50 is disposed within the insulator 10, and the electrical connection layer 50 is parallel or substantially parallel to the two mounting end faces, so as to connect the L... e It is divided into at least two segments. It can be understood that when the electrical connection layer 50 is a single layer, the L... e Divided into two segments; when the electrical connection layer 50 has two layers, the L e Divided into three segments; when the electrical connection layer 50 has three layers, the L e Divide into four segments, and so on.

[0030] It is understandable that among the multiple resonant cavities after separation, the resonant cavity with the highest height has the lowest resonant frequency. If this lowest resonant frequency is also higher than the frequency of the high-frequency signal to be transmitted, then resonance can be avoided in the target operating frequency band, thereby reducing the insertion loss of the electrical connector and ensuring the stability and reliability of high-frequency signal transmission.

[0031] In other words, the technical solution of the present invention adds an electrical connection layer 50 connected to the grounding probe 30 within the insulator 10 to form a ground-like layer within the insulator 10 for dividing the resonant cavity of the electrical connector structure. By dividing the resonant cavity with the ground-like layer, the height of the resonant cavity is shortened, thereby increasing the minimum resonant frequency of the electrical connector structure. This greatly increases the probability that the minimum resonant frequency is higher than the frequency of the high-frequency signal to be transmitted. In this way, the probability of resonance occurring in the target operating frequency band can be reduced, thereby reducing the insertion loss of the electrical connector and ensuring the stability and reliability of high-frequency signal transmission.

[0032] The following explanation uses the example of providing two electrical connection layers 50 (ground-like layers) within the insulator 10: By dividing into two layers of similar strata, L can be... e The resonant cavity is divided into three segments of length L1, L2, and L3. As mentioned earlier, among the divided resonant cavities, the one with the highest height has the lowest resonant frequency. Therefore, the maximum value L among L1, L2, and L3 is... max The equivalent height L of the resonant cavity corresponding to the minimum resonant frequency of the entire electrical connector. e 'Highest correlation. It should be noted that, because what was formed is a stratum-like formation rather than a complete stratum, therefore L...' max Not equal to L e ', understandable, L max <Le ' <L e Let's define a correction coefficient k and let L e '=kL max It can be understood that k>1, the smaller the distance between the grounding probe 30 and the signal probe 20, the smaller the value of k; the more electrical connection layers 50 are set, the larger the value of k.

[0033] With the probe tube 31 having a length of 1.85 mm, i.e., L e =1.85mm (0.0728in) for related experiments. The distance from the upper electrical connection layer 50 to the upper mounting end face is 0.425mm, and the distance from the lower electrical connection layer 50 to the lower mounting end face is also 0.425mm. The distance between the two electrical connection layers 50 is 1mm, that is, L1=L3=0.425mm, L2=1mm (0.394in).

[0034] The formula for the resonant frequency of the resonant cavity is:

[0035] Among them, f n is the resonant frequency, in GHz; n represents the index of the resonant mode; when n=1, the lowest order resonant frequency of the cavity is calculated; D k L is the nodal constant of insulator 10; e 11.8 is the height of the resonant cavity in inches (in); 11.8 is the conversion constant for the speed of light in vacuum (a constant related to in / s).

[0036] According to the above calculation formula, if an electrical connection layer 50 is not added to the insulator 10, the calculation process for the theoretical resonant frequency is as follows:

[0037] The corresponding insertion loss simulation diagram is shown below. Figure 6 As can be seen, a resonance effect occurred in the range of approximately 48 GHz to 50 GHz, with an insertion loss reaching a low value of -7.49 dB, which would severely damage signal integrity. Therefore, without the electrical connection layer 50, if the target high-frequency signal has a frequency of 56 GHz, the probability of resonance occurring within the target operating frequency band is relatively high, easily leading to high insertion loss.

[0038] Based on the above calculation formula, the theoretical minimum resonant frequency of the electrical connector with the two additional electrical connection layers 50 is calculated as follows:

[0039] Theoretically, the minimum resonant frequency is 89.4 GHz, which is much larger than the target operating frequency of 56 GHz. Of course, the actual minimum resonant frequency should not be this high. See the corresponding insertion loss simulation diagram for details. Figure 7 As can be seen, resonance occurs at approximately 66 GHz, which is higher than the target operating frequency of 56 GHz. Therefore, when the target operating frequency is 56 GHz, the probability of resonance occurring in this electrical connector with two internal electrical connection layers 50 within the target operating frequency band is very low, thus improving insertion loss. Since frequency is inversely proportional to height, k = 89.4 / 66 ≈ 1.35 in this case.

[0040] Furthermore, at least one of the mounting end faces has a connecting groove 11 between any two adjacent grounding probes 30, and the electrical connection layer 50 is disposed at the bottom of the connecting groove 11. It can be understood that in this embodiment, the depth of the connecting groove 11 is typically much greater than the thickness of the electrical connection layer 50, so that the electrical connection layer 50 is positioned on the insulating layer away from the corresponding mounting end face, thereby better dividing the resonant cavity. Optionally, the width of the connecting groove 11 is smaller than the outer diameter of the grounding probe 30. Optionally, the connecting groove 11 is a straight groove.

[0041] Optionally, the connecting groove 11 is configured as a laser-engraved groove; however, this design is not limited to this, and in other embodiments, the connecting groove 11 can also be formed by milling. Further optionally, the electrical connection layer 50 is configured as a conductive plating layer; electroplating technology is mature and conducive to mass production of products; however, this design is not limited to this, and in other embodiments, the electrical connection layer 50 can also be configured as a conductive sheet disposed at the bottom of the connecting groove 11.

[0042] Optionally, the depth of the connecting groove 11 is less than or equal to 1 / 3 of the thickness of the insulator 10, so as to avoid the groove setting from excessively affecting the strength of the insulator 10, thereby ensuring the structural strength of the electrical connector.

[0043] Optionally, both mounting end faces are provided with the connecting groove 11 to divide the resonant cavity into three layers, thereby increasing the equivalent height L of the resonant cavity. e Smaller.

[0044] However, this design is not limited to this. In some other embodiments, the electrical connection layer 50 may also include multiple conductive elements, with one conductive element connected between any two adjacent grounding probes 30. The conductive element and the insulator 10 are integrally formed by insert injection molding to facilitate mass production of the product.

[0045] In other embodiments, the insulator 10 may further include multiple insulating layers stacked separately, with the electrical connection layer 50 disposed between two adjacent insulating layers. In this embodiment, the electrical connection layer 50 may be directly electroplated onto the surface of the insulating layer, i.e., it may be integrally formed; the electrical connection layer 50 may also be a conductive sheet sandwiched between two insulating layers. In this case, a positioning groove for embedding and positioning the conductive sheet is typically provided on the surface of at least one insulating layer.

[0046] Optionally, the signal probe 20 includes two differential signal sub-pins 21. In other words, the electrical connector in this embodiment transmits a differential signal. However, this design is not limited to this; in other embodiments, the electrical connector may also transmit a single-ended signal, etc., through its signal probe 20.

[0047] Optionally, the insulator 10 is made of plastic, which has good insulation properties; however, this design is not limited to this, and in other embodiments, the insulator 10 can also be made of other insulating materials. Optionally, the electrical connection layer 50 is made of metal, which has good conductivity.

[0048] Optionally, the signal probes 20 are provided in multiple groups, and each group of signal probes 20 has an independent ring of grounding probes 30 and shielding pins 40 around its outer periphery. However, this design is not limited to this. In other embodiments, the grounding probes 30 and shielding pins 40 are shared between adjacent groups of signal probes 20 to simplify the product structure. Optionally, the multiple groups of signal probes 20 are arranged in an array.

[0049] Optionally, see Figure 5 The electrical connector further includes shielding pins 40 disposed on the insulator 10. For at least some of the grounding probes 30, at least one shielding pin 40 is provided between two adjacent grounding probes 30, and the electrical connection layer 50 is also connected to the shielding pins 40. In this embodiment, some of the grounding probes 30 may not have shielding pins 40 between two adjacent grounding probes 30. For any two adjacent grounding probes 30 with shielding pins 40, only one shielding pin 40 may be provided, or multiple shielding pins 40 may be provided, spaced apart.

[0050] The technical solution of this embodiment adds shielding pins 40 between at least some of the adjacent grounding probes 30, and connects the shielding pins 40 and the grounding probes 30 through an electrical connection layer 50 to form a shielding mesh. In this way, the addition of shielding pins 40 can shorten the distance between grounding nodes, thereby shortening the electromagnetic absorption radius between grounding nodes and avoiding the electromagnetic absorption radius being much larger than the coupling distance. This allows for timely absorption of electromagnetic field interference, reducing crosstalk loss, improving the integrity of high-frequency signal transmission, and reducing crosstalk problems of electrical connectors.

[0051] The above description is only a preferred embodiment of the present invention and does not limit the scope of protection of the present invention. All equivalent structural transformations made under the inventive concept of the present invention using the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. An electrical connector, characterized in that, include: An insulator having two opposing mounting faces; A signal probe is disposed on the insulator, with its opposite ends exposed on the two mounting end faces; Multiple grounding probes are disposed on the insulator, with their opposite ends exposed on the two mounting end faces, and the multiple grounding probes are arranged around the signal probe; as well as An electrical connection layer is disposed within the insulator and spaced apart from the mounting end face. The electrical connection layer is connected to a plurality of grounding probes, and there is a distance between the electrical connection layer and both ends of the needle tube of the grounding probe, so that the resonant cavity formed by the electrical connector at both ends of the needle tube can be divided by the electrical connection layer to improve the resonant frequency of the electrical connector. At least two layers of the electrical connection layer are provided at intervals along the axial direction of the grounding probe.

2. The electrical connector as claimed in claim 1, characterized in that, Both mounting end faces are provided with a connection groove between any two adjacent grounding probes, and the electrical connection layer is provided at the bottom of the connection groove.

3. The electrical connector as described in claim 2, characterized in that, The connecting groove is a laser-engraved groove.

4. The electrical connector as described in claim 3, characterized in that, The electrical connection layer is a conductive plating layer disposed at the bottom of the laser engraving groove.

5. The electrical connector as described in claim 2, characterized in that, The width of the connecting groove is smaller than the outer diameter of the grounding probe; and / or The connecting groove is a straight groove; and / or The depth of the connecting groove is less than or equal to 1 / 3 of the thickness of the insulator.

6. The electrical connector as claimed in claim 1, characterized in that, The electrical connection layer includes multiple conductive elements, and one of the conductive elements is connected between any two adjacent grounding probes. The conductive elements and the insulator are integrally formed by insert injection molding.

7. The electrical connector as claimed in claim 1, characterized in that, The insulator comprises multiple insulating layers stacked separately, and the electrical connection layer is disposed between two adjacent insulating layers.

8. The electrical connector as claimed in claim 1, characterized in that, The insulator is made of plastic, and the electrical connection layer is made of metal.

9. The electrical connector as claimed in claim 1, characterized in that, The electrical connector further includes a shielding pin disposed on the insulator. For at least some of the grounding probes, at least one shielding pin is provided between two adjacent grounding probes. The electrical connection layer is also connected to the shielding pin.

10. The electrical connector according to any one of claims 1 to 9, characterized in that, Multiple sets of signal probes are arranged in an array on the insulator, and a ring of grounding probes is arranged around the outer periphery of each set of signal probes.

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