Heat dissipation cabinet for big data server and heat dissipation method

Abstract

A heat dissipation cabinet for a big data server and a heat dissipation method are characterized in that a cabinet door is arranged on the front side of the cabinet, an observation window is arranged on the cabinet door, a handle is arranged on the outer side face of the cabinet door, an air inlet fan is arranged in the middle of a bottom plate of the cabinet, a pair of exhaust fans is arranged on a top plate of the cabinet, three heat dissipation fans are arranged on a rear side plate of the cabinet, and two pairs of fixing rods are arranged on the bottom plate of the cabinet; sliding rails are evenly distributed between each pair of fixing rods, a heat dissipation tray is arranged between each pair of sliding rails, cooling coils are arranged in the heat dissipation trays, a connecting hose is arranged between a water outlet and a water inlet of every two vertically adjacent cooling coils, and a temperature sensor is arranged in the cabinet. According to the invention, the heat dissipation structure is flexibly adjusted through the temperature sensor according to the change of the temperature gradient in the cabinet, so that the heat dissipation effect is qualitatively improved, and the power consumption is reasonably reduced in the overall operation state; the LED lamp is simple in structure, ingenious in design, good in heat dissipation effect and suitable for general application and popularization.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of big data storage cabinet, and particularly relates to a heat dissipation cabinet for big data server and a heat dissipation method. BACKGROUND

[0002] With the continuous development of computer information technology, the data collection place that cannot be collected, analyzed and processed by conventional application programs in a time range through a computer, so that big data analysis refers to processing and analyzing the obtained massive data, thereby meeting the requirements of visualizing various data collections, from the development trend of big data, the storage of data types needs to develop towards cloudization, distribution and resourceization, the big data storage cabinet provides enterprises with operation with lower energy consumption, higher density and virtualization server integration and various solutions, which meets the trend of cloudization and distribution of data analysis and processing.

[0003] However, the existing big data storage cabinet generates a large amount of heat when multiple big data storage servers in the cabinet run simultaneously, and the heat dissipation mode of the big data storage cabinet itself is relatively single and cannot be flexibly adjusted according to the change of temperature gradient, so that effective heat dissipation in the cabinet cannot be achieved, and thus the existing requirements cannot be met.

[0004] In view of the above reasons, the present application provides a heat dissipation cabinet for big data server and a heat dissipation method. SUMMARY

[0005] The present application aims to overcome the deficiencies in the prior art, and provides a heat dissipation cabinet for big data server and a heat dissipation method, which flexibly adjusts the heat dissipation structure according to the change of temperature gradient in the cabinet through a temperature sensor, not only improves the heat dissipation effect, but also reduces the power consumption under the overall operation state; the present application has simple structure, ingenious design, good heat dissipation effect and is suitable for popularization and application.

[0006] The application discloses a heat dissipation cabinet for a big data server and a heat dissipation method.

[0007] In a conventional state, heat dissipation is performed through the air inlet fan, the air outlet fan and the heat dissipation fan; when the temperature reaches a specified temperature, rapid heat dissipation is performed through the heat dissipation tray.

[0008] The pair of side plates and the back plate of the cabinet are uniformly provided with heat dissipation holes.

[0009] The heat dissipation tray is integrally formed by a pair of baffle plates arranged on the upper surface of the bottom plate, and the left and right sides of the bottom plate are provided with sliding blocks.

[0010] The pair of side plates and the back plate of the cabinet are uniformly provided with heat dissipation holes.

[0011] The cabinet is provided with a UPS power supply, a microprocessor and a circuit distribution system.

[0012] A water tank and a circulating pump are arranged on one side of the cabinet; a connecting pipe is arranged between the water outlet of the water pump and the water inlet of the cooling coil located at the upper end of the cabinet; and a connecting pipe is arranged between the water outlet of the cooling coil located at the lower end of the cabinet and the water inlet of the water tank.

[0013] When the temperature is normal, the three heat dissipation fans on the back side of the cabinet, the air inlet fan at the lower end and the air outlet fan at the upper end are cooperated to form rapid air circulation in the cabinet, so that heat is rapidly discharged; when the temperature sensor detects that the temperature in the cabinet reaches a specified temperature, the microprocessor starts the circulating pump to pump out cooling water in the water tank and pressurize the cooling water into the cooling coil in the heat dissipation tray, so that the cooling water is circulated in the whole water circulation framework; heat generated by the memory is exchanged with the heat dissipation tray, the heat is taken out through the cooling water, and heat dissipation is realized.

[0014] The beneficial effects of this invention are as follows: This invention installs cooling coils inside the heat dissipation trays, with the partitions containing serpentine-shaped cooling coils. The cooling coils in different heat dissipation trays, in conjunction with connecting hoses and sealed interfaces, form an overall water circulation structure. Under normal conditions, the circulation pump remains on, drawing cooling water from the cooling water tank and pressurizing it to the cooling coils and connecting hoses, creating a circulating flow of cooling water throughout the entire water circulation structure. Thermally conductive silicone is applied to the outside of the cooling coils located inside the partitions, adhering to the exterior of the large data storage device. Due to its excellent thermal conductivity, it can dissipate the heat generated by the storage device and exchange heat with the cooling coils. The heat is carried away by the cooling water, thereby reducing the storage device's temperature and achieving effective heat dissipation. Furthermore, the thermally conductive silicone itself has a certain elasticity, ensuring stable positioning of the storage device between the partitions. In this way, the cooling coils distributed inside the partitions dissipate heat from the storage device through heat exchange, effectively improving the overall heat dissipation effect. Additionally, the cooling coils on each heat dissipation tray can be independently disassembled, facilitating daily maintenance.

[0015] This invention uses a temperature sensor to flexibly adjust the heat dissipation structure according to changes in the temperature gradient within the cabinet, which not only significantly improves the heat dissipation effect but also reasonably reduces power consumption during overall operation. This invention has a simple structure, ingenious design, and good heat dissipation effect, making it suitable for widespread application. Areas not detailed in this invention are existing commonly used technologies. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings:

[0017] Figure 1 It is a schematic diagram of a three-dimensional structure;

[0018] Figure 2 This is a frontal view of the structural diagram;

[0019] In the diagram: 1. Cabinet; 2. Cabinet door; 3. Observation window; 4. Fixing rod; 5. Slide rail; 6. Heat dissipation tray; 7. Intake fan; 8. Exhaust fan; 9. Heat dissipation fan. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to embodiments and specific implementation methods:

[0021] Example 1

[0022] The front side of the cabinet 1 is provided with a cabinet door 2, and a pair of rotating shafts are arranged between the cabinet door 2 and the cabinet 1. The cabinet door 2 rotates around the rotating shafts, and the cabinet door 2 is connected with the cabinet 1 through the rotating shafts. An observation window 3 is arranged on the cabinet door 2. A handle is arranged on the outer side of the cabinet door 2 away from the rotating shafts. An air inlet fan 7 is arranged in the middle of the bottom plate of the cabinet 1. A pair of air outlet fans 8 are arranged on the top plate of the cabinet 1. Three heat dissipation fans 9 are arranged on the rear plate of the cabinet 1 from top to bottom. Two pairs of fixing rods 4 are symmetrically arranged on the bottom plate of the cabinet 1 close to the four corners. The fixing rods 4 are uniformly distributed with mounting holes. The slide rails 5 are uniformly distributed between each pair of fixing rods 4. The fixing bolts are arranged between the front and rear ends of the slide rails 5 and the corresponding fixing rods 4. The heat dissipation trays 6 are arranged between each pair of slide rails 5. The slide blocks are arranged on the left and right sides of the heat dissipation trays 6. The slide blocks are located in the slide rails 5. The heat dissipation trays 6 move forward and backward between a pair of slide rails 5 through the slide blocks. The cooling coils are arranged in the heat dissipation trays 6. The connecting hoses are arranged between the water outlets and the water inlets of the upper and lower adjacent cooling coils. The temperature sensor is arranged in the cabinet 1.

[0023] In the conventional state, the heat is dissipated through the air inlet fan 7, the air outlet fan 8 and the heat dissipation fan 9. When the temperature reaches the specified temperature, the heat is rapidly dissipated through the heat dissipation tray 6.

[0024] Embodiment 2

[0025] The heat dissipation holes are uniformly distributed on the pair of side plates and the rear plate of the cabinet 1.

[0026] Embodiment 3

[0027] The heat dissipation tray 6 is integrally formed by the pair of baffles arranged on the upper surface of the bottom plate. The slide blocks are arranged on the left and right sides of the bottom plate.

[0028] Embodiment 4

[0029] The dustproof nets are arranged on the outer sides of the pair of side plates and the rear plate of the cabinet 1.

[0030] Embodiment 5

[0031] The UPS power supply, the microprocessor and the circuit distribution system are arranged in the cabinet 1.

[0032] Embodiment 6

[0033] The water tank and the circulating pump are arranged on one side of the cabinet 1. The connecting pipe is arranged between the water outlet of the water pump and the water inlet of the cooling coil located at the upper end of the cabinet. The connecting pipe is arranged between the water outlet of the cooling coil located at the lower end of the cabinet and the water inlet of the water tank.

[0034] At the conventional temperature, the three heat dissipation fans 9 at the back side of the cabinet 1, in cooperation with the lower end air inlet fan 7 and the upper end air outlet fan 8, form the rapid circulation of the air inside the cabinet 1, and the heat is rapidly discharged; when the temperature sensor detects that the temperature inside the cabinet 1 reaches the specified temperature, the microprocessor starts the circulating pump, and the cooling water inside the water tank is pumped out and pressurized into the cooling coil inside the heat dissipation tray 6, forming the circulation movement of the cooling water in the entire water circulation framework, the heat generated by the memory exchanges heat with the heat dissipation tray 6, and the heat is taken out by the cooling water, achieving heat dissipation.

Claims

1. A heat dissipation cabinet and heat dissipation method for a big data server, wherein the heat dissipation cabinet for a big data server is composed of: a cabinet (1), a cabinet door (2), an observation window (3), a fixing rod (4), a slide rail (5), a heat dissipation tray (6), an intake fan (7), an exhaust fan (8), and a cooling fan (9); characterized in that: A cabinet door (2) is provided on the front side of the cabinet (1). A pair of hinges are provided between the cabinet door (2) and the cabinet (1). The cabinet door (2) rotates around the hinges. The cabinet door (2) is connected to the cabinet (1) as one unit through the hinges. An observation window (3) is provided on the cabinet door (2). A handle is provided on the outer side of the cabinet door (2) away from the hinges. An air intake fan (7) is provided in the middle of the bottom plate of the cabinet (1). A pair of exhaust fans (8) are provided on the top plate of the cabinet (1). Three cooling fans (9) are provided from top to bottom on the rear side plate of the cabinet (1). Two pairs of fixing rods (4) are symmetrically provided near the four corners of the bottom plate of the cabinet (1). Mounting holes are evenly distributed on the fixed rod (4), and slide rails (5) are evenly distributed between each pair of fixed rods (4). Fixing bolts are set between the front and rear ends of the slide rails (5) and the corresponding fixed rods (4). A heat dissipation tray (6) is set between each pair of slide rails (5). Slider blocks are set on the left and right sides of the heat dissipation tray (6). The sliders are located inside the slide rails (5). The heat dissipation tray (6) moves back and forth between a pair of slide rails (5) through the sliders. Cooling coils are set inside the heat dissipation tray (6). Connecting hoses are set between the outlet and inlet of two adjacent cooling coils. A temperature sensor is set inside the cabinet (1). Under normal conditions, heat dissipation is achieved through intake fan (7), exhaust fan (8), and cooling fan (9). When the temperature reaches the specified temperature, heat dissipation is achieved quickly through the heat dissipation tray (6).

2. The heat dissipation cabinet and heat dissipation method for a big data server according to claim 1, characterized in that: The cabinet (1) has heat dissipation holes evenly distributed on a pair of side panels and a rear panel.

3. The heat dissipation cabinet and heat dissipation method for a big data server according to claim 1, characterized in that: The heat dissipation tray (6) is integrally formed by a pair of baffles on both sides of the upper surface of the base plate, and sliders are provided on the left and right sides of the base plate.

4. The heat dissipation cabinet and heat dissipation method for a big data server according to claim 1, characterized in that: Dustproof nets are provided on the outer sides of the pair of side panels and the rear panel of the cabinet (1).

5. The heat dissipation cabinet and heat dissipation method for a big data server according to claim 1, characterized in that: The cabinet (1) is equipped with a UPS power supply, a microprocessor, and a circuit distribution system.

6. The heat dissipation cabinet and heat dissipation method for a big data server according to claim 1, characterized in that: A water tank and a circulating pump are installed on one side of the cabinet (1). A connecting pipe is installed between the outlet of the water pump and the inlet of the cooling coil located at the top of the cabinet. A connecting pipe is installed between the outlet of the cooling coil located at the bottom of the cabinet and the inlet of the water tank. At normal temperature, the three cooling fans (9) on the back of the cabinet (1), together with the lower intake fan (7) and the upper exhaust fan (8), form a rapid air circulation inside the cabinet (1) to quickly expel heat. When the temperature sensor detects that the temperature inside the cabinet (1) has reached the specified temperature, the microprocessor starts the circulation pump to draw out the cooling water inside the water tank and pressurize it into the cooling coil in the heat dissipation tray (6), forming a circulation of cooling water throughout the water circulation structure. The heat generated by the memory exchanges heat with the heat dissipation tray (6), and the heat is carried away by the cooling water to achieve heat dissipation.

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