Measuring device, bonding method and device and storage medium

Abstract

The invention provides a measuring device and method, a bonding device and a storage medium. The measuring device comprises a two-color light source, an optical system, a first camera and a second camera. The double-color light source is used for providing visible light and infrared light. The optical system is used for transmitting visible light provided by the two-color light source to the surface of a first measurement object, transmitting first reflection light generated by the surface of the first measurement object to a first image acquisition surface of the first camera, and enabling infrared light provided by the two-color light source to penetrate through the first measurement object; and transmitting a second reflected light ray generated by the surface of the second measurement object to a second image acquisition surface of the second camera, and transmitting the second reflected light ray generated by the surface of the second measurement object to the second image acquisition surface of the second camera. The first camera is used for collecting the first reflection light so as to generate a first image of the first measurement object. The second camera is used for collecting the second reflection light so as to generate a second image of the second measurement object.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device fabrication, and more particularly to a measuring device, a bonding device, a bonding method, and a computer-readable storage medium. Background Technology

[0002] Currently, the main method for positioning chips in chip-wafer bonding equipment relies on visible light, using a calibration plate coplanar with the chip markings as an intermediate reference to indirectly establish the alignment relationship between the chip and the wafer. However, because visible light cannot penetrate the silicon substrate of the chip, it is impossible to effectively measure the actual alignment accuracy of the device layers after bonding. This prevents dynamic correction and compensation of subsequent chip bonding process parameters, thus affecting the final bonding yield. Furthermore, the use of infrared light for chip-wafer alignment and measurement mentioned in patent application CN119920742A also has drawbacks. It involves opening holes at the chip's edge for back-side infrared alignment, affecting the chip's flat adhesion and increasing the risk of edge voids and deformation.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved measurement device to measure the alignment accuracy and bonding accuracy based on the same equipment, thereby improving the accuracy of the bonding process. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] To overcome the aforementioned deficiencies in the prior art, the present invention provides a measurement device, a bonding device, a bonding method, and a computer-readable storage medium. These devices can image the alignment of a chip using visible light and the bonding between the chip and the wafer using infrared light, thereby improving the accuracy of the bonding process by measuring the alignment and bonding accuracy using the same equipment.

[0006] Specifically, the measurement apparatus provided according to a first aspect of the present invention includes a dual-color light source, an optical system, a first camera, and a second camera. The dual-color light source provides visible light and infrared light. The optical system transmits the visible light provided by the dual-color light source to the surface of a first measurement object, transmits a first reflected ray generated on the surface of the first measurement object to a first image acquisition surface of the first camera, and transmits the infrared light provided by the dual-color light source through the first measurement object to the surface of a second measurement object, transmitting a second reflected ray generated on the surface of the second measurement object to a second image acquisition surface of the second camera. The first camera acquires the first reflected ray to generate a first image of the first measurement object. The second camera acquires the second reflected ray to generate a second image of the second measurement object.

[0007] Furthermore, in some embodiments of the present invention, the measurement device further includes a light source switching device and a controller. The light source switching device is connected to the dual-color light source and is used to enable the dual-color light source to provide visible light in the first measurement state and to enable the dual-color light source to provide infrared light in the second measurement state. The controller is configured to: in the first measurement state before the first bonding component and the second bonding component are bonded, control the light source switching device to enable the dual-color light source to provide visible light; acquire a first image generated by the first camera; determine a first position of the first measurement object based on the first image; in the second measurement state after the first bonding component and the second bonding component are bonded, control the light source switching device to enable the dual-color light source to provide infrared light; acquire a second image generated by the second camera; and determine the bonding accuracy between the first measurement object and the second measurement object based on the second image.

[0008] Furthermore, in some embodiments of the present invention, the optical system includes a semi-transparent mirror. A first camera is aligned with a first surface of the semi-transparent mirror to capture visible light transmitted through the mirror. A second camera is aligned with a second surface of the semi-transparent mirror to capture infrared light reflected from the second surface. A first image acquisition surface of the first camera is perpendicular to a second image acquisition surface of the second camera.

[0009] Furthermore, in some embodiments of the present invention, the first measurement object includes a chip. The second measurement object includes a wafer.

[0010] Furthermore, in some embodiments of the present invention, the measuring device further includes a calibration plate and a processor. The first distance between the calibration plate and the first measuring object... The optical system is further configured to transmit visible light provided by the dual-color light source to the surface of the calibration plate, and to transmit third reflected light generated on the surface of the calibration plate to the first image acquisition surface of the first camera. The first camera is further configured to acquire the third reflected light to generate a third image of the calibration plate. The processor is configured to: determine a second position of the calibration plate based on the third image of the calibration plate; and determine the second position and the first spacing based on the second position. Determine the first position of the first measurement object.

[0011] Furthermore, in some embodiments of the present invention, the surface of the first measurement object is provided with a plurality of first marks distributed along the X direction, and a plurality of second marks distributed along the Y direction perpendicular to the X direction. The surface of the second measurement object is provided with a third mark and a fourth mark. The vertical projection of the third mark is located between the plurality of first marks. The vertical projection of the fourth mark is located between the plurality of second marks.

[0012] Furthermore, in some embodiments of the present invention, a plurality of first marks and a plurality of second marks on the surface of the first measurement object form a 2×2 array, and each pair of them maintains a uniform second spacing. The controller is further configured to: determine the deviation value between the first measurement object and the second measurement object in the X direction based on the difference in distance between each of the third marks and each of their adjacent first marks; and determine the deviation value between the first measurement object and the second measurement object in the Y direction based on the difference in distance between each of the fourth marks and each of their adjacent second marks.

[0013] Furthermore, the bonding apparatus provided according to a second aspect of the present invention includes a measuring device and a bonding head as provided in the first aspect of the present invention. The measuring device is used to generate a first image of a first measuring object and a second image of a second measuring object. The bonding head is used to pick up and bond the first measuring object and the second measuring object based on the first image and the second image.

[0014] Furthermore, the bonding method provided by the third aspect of the present invention includes the following steps: transmitting visible light provided by the light source of the measuring device as provided by the first aspect of the present invention to the surface of a first measuring object via the optical system of the measuring device, and transmitting a first reflected light generated on the surface of the first measuring object to a first image acquisition surface of a first camera; transmitting infrared light provided by the light source through the first measuring object to the surface of a second measuring object, and transmitting a second reflected light generated on the surface of the second measuring object to a second image acquisition surface of a second camera; acquiring the first reflected light via the first camera to generate a first image of the first measuring object to determine a first position of the first measuring object; acquiring the second reflected light via the second camera to generate a second image of the second measuring object to determine a second position of the second measuring object; and bonding the first measuring object and the second measuring object according to the first position and the second position.

[0015] Furthermore, in some embodiments of the present invention, the bonding method further includes the following steps: after bonding the first measurement object and the second measurement object, the second reflected light is collected again via the second camera to generate a third image; and the bonding accuracy between the first measurement object and the second measurement object is determined based on the third image.

[0016] Furthermore, the computer-readable storage medium provided according to the fourth aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a controller, the bonding method as provided in the third aspect of the present invention is implemented. Attached Figure Description

[0017] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic diagram of the structure of a measuring device provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic diagram of a first measurement state provided according to some embodiments of the present invention is shown.

[0020] Figure 3 A schematic diagram of a second measurement state provided according to some embodiments of the present invention is shown.

[0021] Figure 4 A schematic flowchart of a bonding method provided according to some embodiments of the present invention is shown.

[0022] Figure 5 A schematic diagram of markings on the surface of a first measurement object provided according to some embodiments of the present invention is shown.

[0023] Figure 6 A schematic diagram of markings on the surface of a second measurement object provided according to some embodiments of the present invention is shown.

[0024] Figure 7 A schematic diagram illustrating the deviation between a first measurement object and a second measurement object provided according to some embodiments of the present invention is shown. Detailed Implementation

[0025] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0028] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0029] Because visible light cannot penetrate the silicon substrate of the chip, it is impossible to effectively measure the actual alignment accuracy of the device layers after bonding. This prevents dynamic correction and compensation of subsequent chip bonding process parameters, thus affecting the final bonding yield. Furthermore, the use of infrared light for alignment and measurement between the chip and wafer, as mentioned in patent application CN119920742A, also has drawbacks. It involves opening holes at the chip's edge for back-side infrared alignment, affecting the chip's flatness and increasing the risk of edge voids and deformation.

[0030] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for a measurement device, a bonding device, a measurement method, and a computer-readable storage medium that can image the alignment of the chip using visible light and the bonding between the chip and the wafer using infrared light, so as to complete the measurement of alignment accuracy and bonding accuracy based on the same equipment, thereby improving the accuracy of the bonding process.

[0031] In some non-limiting embodiments, the measurement device provided in the first aspect of the present invention can be configured in the bonding device provided in the second aspect of the present invention. The bonding device provided in the second aspect of the present invention can be implemented based on the bonding method provided in the third aspect of the present invention.

[0032] Specifically, the bonding apparatus provided in the second aspect of the present invention includes a measuring device and a bonding head as provided in the first aspect of the present invention. Here, the measuring device is used to generate a first image of a first measuring object and a second image of a second measuring object. The bonding head is used to pick up and bond the first measuring object and the second measuring object based on the first image and the second image.

[0033] Please refer to the reference for details. Figures 1-3 . Figure 1 A schematic diagram of the structure of a measuring device provided according to some embodiments of the present invention is shown. Figure 2 A schematic diagram of a first measurement state provided according to some embodiments of the present invention is shown. Figure 3 A schematic diagram of a second measurement state provided according to some embodiments of the present invention is shown.

[0034] exist Figures 1-3In the illustrated embodiment, the measurement apparatus provided by the first aspect of the present invention includes a dual-color light source 11, an optical system 12, a first camera 13, and a second camera 14 (Short-Wave Infrared, SWIR). Here, the dual-color light source 11 provides visible light and infrared light. The optical system 12 transmits the visible light provided by the dual-color light source 11 to the surface of a first measurement object 15, transmits the first reflected light generated on the surface of the first measurement object 15 to the first image acquisition surface of the first camera 13, and transmits the infrared light provided by the dual-color light source 11 through the first measurement object 15 to the surface of a second measurement object 16, and transmits the second reflected light generated on the surface of the second measurement object 16 to the second image acquisition surface of the second camera 14. The first camera 13 acquires the first reflected light to generate a first image of the first measurement object 15. The second camera 14 acquires the second reflected light to generate a second image of the second measurement object 16.

[0035] In addition, Figure 1 In the illustrated embodiment, the measurement device provided in the first aspect of the present invention further includes a light source switching device. Here, the light source switching device is connected to a dual-color light source 11, and is used to enable the dual-color light source 11 to provide visible light in a first measurement state, and to enable the dual-color light source 11 to provide infrared light in a second measurement state.

[0036] Thus, the measurement device provided by the first aspect of the present invention can be based on a light source switching device to avoid mutual interference between infrared light and visible light, thereby further improving measurement accuracy.

[0037] Those skilled in the art will understand that the above-described embodiments of switching the light provided by the dual-color light source 11 using a light source switching device before measurement are merely some non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are easy for the public to implement, rather than intended to limit the scope of protection of the present invention.

[0038] Alternatively, in other embodiments, those skilled in the art can also directly use visible light sources and infrared light sources to measure the two measurement states.

[0039] exist Figure 2 and Figure 3 In the illustrated embodiment, the optical system 12 includes a semi-reflective translucent mirror. For example... Figure 2 As shown, the first camera 13 is aimed at the first surface of the semi-transparent mirror to collect visible light transmitted through the mirror. Figure 3 As shown, the second camera 14 is aligned with the second surface of the semi-transparent mirror to capture the infrared light reflected from the second surface. Here, the first image acquisition surface of the first camera 13 is perpendicular to the second image acquisition surface of the second camera 14.

[0040] Furthermore, the first measurement object 15 includes a chip, and the second measurement object 16 includes a wafer.

[0041] In some non-limiting embodiments, the measurement apparatus provided in the first aspect of the present invention includes a memory and a controller. Here, the memory includes, but is not limited to, the computer-readable storage medium provided in the fourth aspect above, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the measurement method as provided in the third aspect of the present invention.

[0042] Please refer to Figure 4 . Figure 4 A schematic flowchart of a measurement method provided according to some embodiments of the present invention is shown.

[0043] like Figure 4 As shown, the measuring device provided in the first aspect of the present invention can first provide visible light and infrared light via a dual-color light source 11.

[0044] Specifically, in the first measurement state before the first component to be bonded and the second component to be bonded are bonded, the measurement device can control the light source switching device via the controller to enable the dual-color light source to provide visible light.

[0045] Subsequently, the measuring device can transmit visible light to the surface of the first measuring object 15 via the optical system 12, and transmit the first reflected light generated on the surface of the first measuring object 15 to the first image acquisition surface of the first camera 13.

[0046] Then, the measuring device can capture the first reflected light through the first camera 13 to generate a first image of the first measuring pair 15.

[0047] Then, the measuring device can acquire the first image generated by the first camera 13 via the controller, and determine the first position of the first measuring object 15 based on the first image, so as to align the first measuring object 15.

[0048] In addition, Figure 2 In the illustrated embodiment, the measuring apparatus provided by the first aspect of the present invention further includes a calibration plate 17 and a processor. Here, the first distance between the calibration plate 17 and the first measurement object 15... .

[0049] Specifically, the measuring device can transmit the visible light provided by the dual-color light source 11 to the surface of the calibration plate 17 via the optical system 12, and transmit the third reflected light generated on the surface of the calibration plate 17 to the first image acquisition surface of the first camera 13.

[0050] Subsequently, the measuring device can acquire the third reflected light through the first camera 13 to generate a third image of the calibration plate 17.

[0051] Then, the measuring device can, via the processor, determine the second position of the calibration plate 17 based on the third image of the calibration plate 17, and, based on the second position and the first spacing... The first position of the first measurement object 15 is determined so as to align the first measurement object 15.

[0052] Subsequently, in the second measurement state after the first component to be bonded and the second component to be bonded are bonded, the measurement device can control the light source switching device via the controller to enable the dual-color light source 11 to provide infrared light.

[0053] Subsequently, the measuring device can transmit infrared light through the optical system 12 to the surface of the first measuring object 15, and transmit the second reflected light generated on the surface of the second measuring object 16 to the second image acquisition surface of the second camera 14.

[0054] Then, the measuring device can collect the second reflected light through the second camera 14 to generate a second image of the second measuring object 16.

[0055] Then, the measuring device can acquire the second image generated by the second camera 14 via the controller, and determine the second position of the second measuring object 16 based on the second image, so as to align the second measuring object 16.

[0056] Then, the bonding head can bond the first measurement object and the second measurement object according to the first position and the second position.

[0057] After bonding the first and second measurement objects, the measurement device can again acquire the second reflected light via the second camera 15 to generate a third image.

[0058] Subsequently, the measuring device can determine the bonding accuracy between the first measuring object 15 and the second measuring object 16 based on the third image.

[0059] Please refer to the reference for details. Figure 5 and Figure 6 . Figure 5 A schematic diagram of markings on the surface of a first measurement object provided according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of markings on the surface of a second measurement object provided according to some embodiments of the present invention is shown.

[0060] exist Figure 5 In the embodiment shown, the surface of the first measurement object 15 is provided with a plurality of first marks distributed along the X direction and a plurality of second marks distributed along the Y direction perpendicular to the X direction.

[0061] Similarly, in Figure 6 In the embodiment shown, the surface of the second measurement object 16 is provided with a third mark and a fourth mark, the vertical projection of the third mark is located between a plurality of first marks, and the vertical projection of the fourth mark is located between a plurality of second marks.

[0062] Furthermore, the multiple first marks and multiple second marks on the surface of the first measurement object 15 form a 2×2 array, and each pair of them maintains a uniform second spacing. .

[0063] Please refer to Figure 7 . Figure 7 A schematic diagram illustrating the deviation between a first measurement object and a second measurement object provided according to some embodiments of the present invention is shown.

[0064] Specifically, in determining the bonding accuracy between the first measurement object 15 and the second measurement object 16, the controller can determine the deviation value between the first measurement object 15 and the second measurement object 16 in the X direction based on the difference in the distance between each third mark and its adjacent first mark, and determine the deviation value between the first measurement object 15 and the second measurement object 16 in the Y direction based on the difference in the distance between each fourth mark and its adjacent second mark.

[0065] For example, the first measurement object 15 has the identifier coordinates (x1, y1), and the second measurement object 16 has the identifier coordinates (x2, y2). The difference between the two position coordinates yields the bonded deviation value (x1-x2, y1-y2).

[0066] In summary, the measurement device, bonding device, measurement method, and computer-readable storage medium provided by the present invention can all image the alignment of the chip using visible light and image the bonding between the chip and the wafer using infrared light, so as to complete the measurement of alignment accuracy and bonding accuracy based on the same equipment, thereby improving the accuracy of the bonding process.

[0067] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0068] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0069] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0070] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A measuring device, characterized in that, include: A dual-color light source is used to provide visible and infrared light; An optical system is used to transmit visible light provided by the dual-color light source to the surface of a first measurement object, and to transmit a first reflected light generated on the surface of the first measurement object to a first image acquisition surface of a first camera, and to transmit infrared light provided by the dual-color light source through the first measurement object to the surface of a second measurement object, and to transmit a second reflected light generated on the surface of the second measurement object to a second image acquisition surface of a second camera. The first camera is used to capture the first reflected light to generate a first image of the first measurement object; as well as The second camera is used to capture the second reflected light to generate a second image of the second measured object.

2. The measuring device as described in claim 1, characterized in that, Also includes: A light source switching device is connected to the dual-color light source and is used to enable the dual-color light source to provide visible light in the first measurement state and to enable the dual-color light source to provide infrared light in the second measurement state. as well as The controller is configured to, in a first measurement state before the first component to be bonded and the second component to be bonded, control the light source switching device to enable the dual-color light source to provide the visible light; Acquire a first image generated by the first camera; determine a first position of the first measurement object based on the first image; in a second measurement state after the first component to be bonded and the second component to be bonded are bonded, control the light source switching device to enable the dual-color light source to provide the infrared light; Acquire a second image generated by the second camera; and determine the bonding accuracy between the first measurement object and the second measurement object based on the second image.

3. The measuring device as described in claim 1, characterized in that, The optical system includes a semi-transparent, semi-reflective mirror, wherein, The first camera is aimed at the first surface of the semi-transparent mirror to capture visible light transmitted through the semi-transparent mirror. The second camera is aligned with the second surface of the semi-transparent mirror to capture the infrared light reflected from the second surface. The first image acquisition surface of the first camera is perpendicular to the second image acquisition surface of the second camera.

4. The measuring device as described in claim 1, characterized in that, The first measurement object includes a chip, and the second measurement object includes a wafer.

5. The measuring device as described in claim 4, characterized in that, It also includes a calibration plate and a processor, wherein the calibration plate is positioned at a first distance from the first measurement object. , The optical system is also used to transmit the visible light provided by the dual-color light source to the surface of the calibration plate, and to transmit the third reflected light generated by the surface of the calibration plate to the first image acquisition surface of the first camera. The first camera is also used to acquire the third reflected light to generate a third image of the calibration plate. The processor is configured to: determine a second position of the calibration piece based on a third image of the calibration piece; and determine the second position and the first spacing based on the second position. Determine the first position of the first measurement object.

6. The measuring device as described in claim 4, characterized in that, The surface of the first measurement object is provided with a plurality of first marks distributed along the X direction and a plurality of second marks distributed along the Y direction perpendicular to the X direction. The surface of the second measurement object is provided with a third mark and a fourth mark. The vertical projection of the third mark is located between the plurality of first marks, and the vertical projection of the fourth mark is located between the plurality of second marks.

7. The measuring device as described in claim 4, characterized in that, The first measurement object's surface has multiple first marks and multiple second marks forming a 2×2 array, with each pair maintaining a uniform second spacing. The controller is further configured to: The deviation value between the first measurement object and the second measurement object in the X direction is determined based on the difference in the distance between each of the third marks and each of the adjacent first marks. as well as The deviation value between the first measurement object and the second measurement object in the Y direction is determined based on the difference in the distance between each of the fourth marks and each of the adjacent second marks.

8. A bonding device, characterized in that, include: The measuring apparatus as described in any one of claims 1 to 7 is used to generate a first image of a first measuring object and a second image of a second measuring object; as well as A bonding head is used to pick up and bond the first measurement object and the second measurement object based on the first image and the second image.

9. A bonding method, characterized in that, Includes the following steps: The optical system of the measuring device as described in any one of claims 1 to 8 transmits visible light provided by its light source to the surface of a first measuring object, transmits a first reflected light generated on the surface of the first measuring object to the first image acquisition surface of a first camera, and transmits infrared light provided by the light source through the first measuring object to the surface of a second measuring object, and transmits a second reflected light generated on the surface of the second measuring object to the second image acquisition surface of a second camera. The first reflected light is captured by the first camera to generate a first image of the first measurement object, thereby determining the first position of the first measurement object. The second reflected light is captured by the second camera to generate a second image of the second measurement object, thereby determining the second position of the second measurement object; as well as Based on the first position and the second position, the first measurement object and the second measurement object are bonded.

10. The bonding method as described in claim 9, characterized in that, It also includes the following steps: After bonding the first measurement object and the second measurement object, the second reflected light is collected again via the second camera to generate a third image; as well as Based on the third image, the bonding accuracy between the first measurement object and the second measurement object is determined.

11. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the controller, the bonding method as described in claim 8 or 9 is implemented.

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