A module automatic taping line

Abstract

The application discloses a kind of module automatic patching lines, it includes patching unit one, patching unit two, patching unit three, patching unit four and welding module, all processing units are installed with main transmission system and reflow conveying system for conveying welding tray, and in the patching unit one and patching unit two of line end part are also installed with reflow lifting system for carrying welding tray between main transmission system and reflow conveying system, including patching unit one, patching unit two, patching unit three and patching unit four are equipped with corresponding feeding machine head and feeding mechanism, to carry out patching in the welding tray conveying process, and after completing patching, welding is carried out by welding module, substrate is identified in the initial stage of processing, and then different feeding processing procedures are selected, suitable for the production of different types of semiconductor devices, improve production convenience and production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging and electronic component mounting technology, and in particular to an automated module mounting line. Background Technology

[0002] The semiconductor packaging industry is currently experiencing a growing demand for high-density, high-reliability chip mounting, especially for the demanding multilayer soldering processes of power devices (such as IGBT modules). Traditional manual chip mounting suffers from low efficiency and poor accuracy, while recent advancements in visual positioning technology and vacuum soldering processes have provided the technological foundation for fully automated chip mounting lines.

[0003] Related technologies can be found in Chinese Patent Publication No. CN110890293B, which discloses a semiconductor device mounting apparatus and mounting method. The apparatus includes a mounting assembly, which includes a mounting head. The mounting head includes: a mounting tool for mounting a semiconductor device; and a mounting head driving mechanism for driving the mounting tool in a horizontal plane to align the semiconductor device relative to the substrate mounting position while holding it above the mounting position. The mounting assembly includes a mounting assembly driver for vertically driving the mounting head to pick up the semiconductor device and mount it at the mounting position. The apparatus also includes a camera assembly, which includes: an alignment camera for capturing a reference view of the semiconductor device and the mounting position; and a camera assembly driving mechanism for driving the alignment camera to position it between the mounting tool and the mounting position. Based on the reference view, the semiconductor device is aligned relative to the mounting position.

[0004] Regarding the aforementioned technologies, during the processing, semiconductor devices move sequentially along the first, second, third, and fourth surface mount components. Some semiconductor devices require single or multiple soldering processes after surface mount. For semiconductor devices requiring two or more soldering processes, manual transfer is required after one surface mount soldering and before the second surface mount soldering, affecting production efficiency. In existing technologies, there are also rotary production lines that use robotic arms to circulate and transport semiconductor devices, enabling the cyclical transport and processing of semiconductor devices. However, the rotary layout is difficult to adapt to mixed-line production of modules of different sizes. When manufacturing different types of semiconductor devices, it is necessary to stop the machine to change the type, which also affects production efficiency. Summary of the Invention

[0005] To enable the continuous production of mixed semiconductor devices, this application provides an automated module placement line.

[0006] This application provides a modular automatic placement line, which adopts the following technical solution:

[0007] An automated placement line includes: a placement unit located at the end of the production line, comprising a main transport system for conveying a soldering tray, the soldering tray supporting a substrate for semiconductor devices; an RFID reading module for identifying the substrate model of the semiconductor devices; a pick-up head for picking up and placing the corresponding placement components into the corresponding positions according to the substrate model; a return conveying system, in the opposite direction to the main transport system, for driving the soldering tray back; and a return lifting system for transferring the soldering tray between the main transport system and the return conveying system.

[0008] The second placement unit, located at the other end of the production line, includes the same reflow lifting system as described above, and also includes a first loading unit for picking up the placement assembly and placing it in a preset position on the soldering tray; and a detection unit for detecting whether the first loading unit repeatedly picks up the placement assembly.

[0009] The third placement unit, located between the first and second placement units, includes a second loading unit for picking up and placing the chip into a preset position on the soldering tray; and a solder cutting unit for cutting the solder and placing it into the corresponding position on the soldering tray.

[0010] Two sets of surface mount units four are located between surface mount unit three and surface mount unit one, including the same feeding unit two, and also include a dispensing system for dispensing adhesive to the surface mount components on the soldering tray;

[0011] The welding module, located between patch unit four and patch unit one, is used for vacuum welding of the substrate and other components on the welding tray.

[0012] The second, third, and fourth placement units and the welding module are all equipped with the same main transport system and return transport system. All the main transport systems are connected in sequence to drive the welding trays to move along the production line, and all the return transport systems are connected in sequence to drive the welding trays to return.

[0013] By adopting the above technical solution, the soldering tray carrying the semiconductor substrate is fed from the first end of the main transport system of the first placement unit. After being identified by the RFID reading module, the pick-up head places the placement component into the corresponding installation position of the soldering tray or semiconductor substrate. The soldering tray is transported to the reflow conveyor system by the reflow lifting system and then transported along the production line to the second placement unit. The reflow lifting system of the second placement unit then lifts the soldering tray to the corresponding main transport system. The first loading unit places another placement component into the preset position on the soldering tray. During this process, the detection unit detects whether the first loading unit repeatedly picks up the placement component. The main transport system moves the soldering tray to the third placement unit. The second loading unit places the chip into the preset position, and the solder sheet is cut by the solder sheet cutting unit and then placed into the area to be soldered. The main transport system continues to operate, causing the soldering tray to pass sequentially through two sets of surface mount units (SMUs). The dispensing system applies adhesive to the semiconductor substrate, and the corresponding loading unit (FMU) places the remaining chip components into their appropriate positions. The main transport system then moves the soldering tray towards the soldering module, where the SMU performs vacuum soldering on the semiconductor substrate and the corresponding surface mount components. After soldering, the soldering tray moves back to a surface mount unit for repeated loading. The reflow lifting system then moves the soldering tray again to the reflow conveyor system for secondary surface mount soldering. During operation, by identifying different types of semiconductor substrates and selecting different surface mount programs, different types of semiconductor devices can be produced on the same production line. The reflow transport of the soldering tray during both soldering processes does not require manual handling, thus improving production efficiency.

[0014] Optionally, the patch unit further includes a marking unit for laser marking the semiconductor device substrate.

[0015] By adopting the above technical solution, the marking unit is used to mark the semiconductor substrate in the early stage of production in order to record and track production information.

[0016] Optionally, each of the three placement units (1, 2, 3, and 4) is equipped with a visual positioning system, which includes a top visual system and a bottom visual system. The top and bottom visual systems identify and position the semiconductor device during the placement process from both sides.

[0017] By adopting the above technical solution, using the top vision system and the bottom vision system for dual-sided identification and positioning, the semiconductor substrate and corresponding pads can be identified and positioned from multiple angles, which helps to improve the accuracy of pad processing.

[0018] Optionally, the pick-up head includes a first suction nozzle, a rangefinder, and a nozzle changer. The first placement unit includes a multi-axis moving mechanism for supporting and driving the first suction nozzle to move. The rangefinder is installed at the connection between the multi-axis moving mechanism and the first suction nozzle to locate the distance between the first suction nozzle and the welding tray. The nozzle changer is located on one side of the multi-axis moving mechanism and holds different types of first suction nozzles. The multi-axis moving mechanism selects different first suction nozzles at the nozzle changer according to different semiconductor device substrate models.

[0019] By adopting the above technical solution, a multi-axis moving mechanism is used to drive the nozzle to move so that the nozzle can pick up the corresponding surface mount components and place them in a preset position. A rangefinder is used to accurately locate the moving position of the nozzle. The nozzle changer can hold various types of nozzles. Different types of nozzles can be selected when producing different types of semiconductor devices.

[0020] Optionally, it also includes: a pallet buffer machine, including a chassis, a pallet magazine and a lifting mechanism. The pallet magazine is located inside the chassis and is used to store welding pallets. The pallet magazine is vertically arranged with multiple transfer tracks corresponding to the main transmission system. The lifting mechanism is located between the chassis and the pallet magazine to drive the pallet magazine to move vertically so that different transfer tracks can be connected to the main transmission system.

[0021] By adopting the above technical solution, the chassis supports and holds the pallet magazine. Under normal working conditions, any transfer track is connected to the return conveyor system, and the welding pallet moves normally along the main transmission system. Welding pallets are placed on the other transfer tracks. The lifting mechanism drives the pallet magazine to move vertically, thereby switching the transfer track connected to the main transmission system in order to collect or increase the number of welding pallets in the production line.

[0022] Optionally, both the third and fourth mounting units include a wafer feeder, a film expansion system, and wafer grippers. The wafer feeder is hollow and used to store wafers in batches. The film expansion system is located on one side of the wafer feeder and is used to stretch the blue film on the wafer and increase the distance between adjacent chips on the blue film. The wafer grippers are used to transport the wafers in the wafer feeder to the film expansion system. The second loading unit is used to assemble the chips in the wafers to preset positions on the semiconductor device substrate.

[0023] By adopting the above technical solution, the wafer grippers take the wafer out of the wafer feed box and assemble it into the film expansion system. The film expansion system stretches and expands the blue film on the wafer, thereby increasing the distance between adjacent chips on the blue film, so that the feeding unit can grab the chip and place the chip in the corresponding position.

[0024] Optionally, the second loading unit includes a placement head, a pin cap, a lifting assembly one, and a lifting assembly two. The lifting assembly one is mounted on the corresponding placement unit three or four and is used to drive the pin cap to move vertically. When the soldering tray moves along the main transport system, it passes over the pin cap. The inner side of the pin cap is provided with a pin that slides vertically. The lifting assembly two is located at the connection between the lifting assembly one and the pin cap and is used to drive the pin to move independently along the pin cap. The pin cap is located below the film expansion system. After the pin extends out from the pin cap, it pushes the chip away from the blue film. The placement head is located on one side of the wafer feed box and is used to pick up the chip and place the chip in a preset position.

[0025] By adopting the above technical solution, after the wafer is expanded, it is located above the pin cap. The pin cap is moved by the first lifting component so that the pin cap comes into contact with the blue film on the wafer. Then, the second lifting component moves the push rod along the pin cap so that the push pin passes through the pin cap and the blue film, thereby pushing the chip to separate from the blue film so that the placement head can pick up the chip.

[0026] Optionally, the lifting assembly includes a clamping part and a moving part. The needle cap is mounted on the clamping part, and the moving part is used to drive the clamping part to move along a three-axis direction. The clamping part is provided with a heater for heating the needle cap.

[0027] By adopting the above technical solution, the clamping part fixes the needle cap, and when the moving part is working, the clamping part drives the needle cap to move. During this process, the needle cap is heated by the heater, and the heat is transferred to the blue film through the needle cap, softening the adhesive between the blue film and the chip, thereby making it easier to separate the chip from the blue film.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. Enables mixed-line production of multiple series of semiconductor devices on the same production line, eliminating the need to stop production to change parts when producing different products, which improves production convenience;

[0030] 2. A closed-loop reflux structure is formed by the main transmission system, the reflux lifting system, and the reflux conveying system to realize the cyclic conveying of the welding pallet, so that the two welding processes are seamlessly connected and the production efficiency is improved;

[0031] 3. The dual visual positioning of detection unit, gravity detection and visual positioning system reduces the missing solder pad placement rate and improves the placement accuracy of surface mount components. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of the embodiment.

[0033] Figure 2 This is a schematic diagram designed to highlight the structure of the tray cache machine.

[0034] Figure 3 This is a top view of patch unit one.

[0035] Figure 4 This is a schematic diagram designed to highlight the structure of the material handling head.

[0036] Figure 5 This is a schematic diagram designed to highlight the installation structure of the marking platform.

[0037] Figure 6 This is a top view of patch unit two.

[0038] Figure 7 This is a top view of patch cell three.

[0039] Figure 8 This is a schematic diagram designed to highlight the structure of the feeder.

[0040] Figure 9 This is a schematic diagram designed to highlight the structure of the wafer feed box.

[0041] Figure 10 This is a schematic diagram designed to highlight the pin cap mounting structure.

[0042] Figure 11 This is a schematic diagram designed to highlight the internal structure of the needle cap.

[0043] Explanation of reference numerals in the attached diagram: 1. Placement Unit 1; 11. Main Conveyor System; 12. Return Conveyor System; 13. Pickup Head; 131. Nozzle 1; 132. Rangefinder; 133. Nozzle Changer; 14. Return Lifting System; 151. Marking Platform; 152. Marking Head; 153. Moving Device; 154. Dust Collection Device; 16. Multi-Axis Moving Mechanism; 161. Linear Rotary Actuator; 2. Placement Unit 2; 21. Feeding Unit 1; 22. Detection Unit; 3. Placement Unit 3; 321. Cutting Flyer 322. Feeder; 323. Pallet gripper; 4. Surface mount unit four; 5. Welding module; 61. Top vision system; 62. Bottom vision system; 7. Pallet buffer; 71. Chassis; 72. Pallet magazine; 721. Transfer track; 73. Lifting mechanism; 81. Wafer feeder; 82. Film expansion system; 83. Wafer gripper; 91. Placement head; 92. Pin cap; 921. Ejector pin; 93. Lifting assembly one; 931. Clamping part; 932. Moving part; 94. Lifting assembly two. Detailed Implementation

[0044] The present application will be further described in detail below with reference to all the accompanying drawings.

[0045] This application discloses an automatic placement line for modules. Example

[0046] Reference Figure 1 and Figure 2 An automated placement line for semiconductor devices includes, in sequence, a second placement unit 2, a third placement unit 3, two sets of fourth placement units 4, a welding module 5, and a first placement unit 1. All of these processing units are equipped with a main transport system 11 and a return transport system 12 along their arrangement direction. All main transport systems 11 are interconnected and used to transport and process semiconductor devices sequentially. The return transport systems 12 are all located below the main transport systems 11, and all return transport systems 12 are interconnected, with no interference between the return transport systems 12 and the main transport systems 11.

[0047] Reference Figure 1 and Figure 2 A tray buffer machine 7 is also provided between the patch unit 1 and the welding module 5, including a chassis 71, a tray magazine 72 and a lifting mechanism 73. The lower end of the chassis 71 is also provided with a return conveying track connected to the return conveying system 12. The tray magazine 72 is located inside the chassis 71 and is slidably connected to the chassis 71 in the vertical direction. The lifting mechanism 73 is installed between the chassis 71 and the tray magazine 72 to drive the tray magazine 72 to move vertically.

[0048] Reference Figure 1 and Figure 2 The tray magazine 72 is vertically arranged with multiple transfer tracks 721 corresponding to the main transfer system 11. The transfer tracks 721 are used to place and fix welding trays, driving the tray magazine 72 to move vertically. Different transfer tracks 721 connect to the main transfer system 11 between the welding module 5 and the patch unit 1. When any transfer track 721 connects to the main transfer system 11, the corresponding welding tray on it can enter the production line and move along the production line under the drive of the main transfer system 11. When a welding tray enters any empty transfer track 721, the lifting mechanism 73 drives the tray magazine 72 to move vertically, allowing another empty transfer track 721 to connect to the main transfer system 11, thus detaching the corresponding welding tray from the production line. The lifting mechanism 73 can be a commonly used mechanism in this technical field, such as an electric actuator, cylinder, gear rack, etc., and is not limited here.

[0049] Reference Figure 3 and Figure 4 The patch unit 1 includes a pick-up head 13 and a multi-axis moving mechanism 16 that drives the pick-up head 13 to move. The pick-up head 13 includes a nozzle 131, a rangefinder 132 and a nozzle changer 133. A linear rotary actuator 161 is installed on the movable end of the multi-axis moving mechanism 16. The nozzle 131 is installed on the output end of the linear rotary actuator 161. When the multi-axis moving mechanism 16 is working, it drives the nozzle 131 to move in any direction through the linear rotary actuator 161.

[0050] Reference Figure 3 and Figure 4The linear rotary actuator 161 is used to individually control the nozzle 131 to perform linear rotational motion, simultaneously completing the "lifting + twisting" motion in one pick-and-place cycle to improve space utilization. The nozzle changer 133 is installed on one side of the multi-axis moving mechanism 16 and stores multiple different types of nozzles 131. When processing different types of substrates, the multi-axis moving mechanism 16 drives the linear rotary actuator 161 to move to the nozzle changer 133 to change to different types of nozzles 131, facilitating the picking of different types of patch assemblies.

[0051] Reference Figure 3 and Figure 4 The placement unit 1 also includes a substrate loading mechanism and an RFID reading module. When the soldering tray enters the substrate loading area of ​​the placement unit 1, the substrate loading mechanism places the semiconductor substrate onto the tray. The substrate loading mechanism includes a material box for storing the substrate and a robotic arm for transporting the substrate; this is existing technology and will not be described in detail here. The RFID reading module is located behind the substrate loading mechanism and is used to identify the semiconductor device substrate model and select the appropriate subsequent processing procedure based on the substrate model. After model identification, the multi-axis moving mechanism 16 drives the pick-up head 13 to grab the required placement components, such as substrate backing plates or solder pads, and places the placement components into the corresponding positions on the substrate.

[0052] Reference Figure 3 and Figure 5 A marking unit is also provided on the patch unit 1. The marking unit includes a marking platform 151, a marking head 152, and a moving device 153. The marking head 152 is mounted on the marking platform 151. The moving device 153 drives the marking platform 151 to move, thereby adjusting the relative position of the marking head 152 and the substrate. The marking head 152 emits laser light to mark the substrate, facilitating subsequent tracking and identification. Furthermore, a dust collection device 154 is also provided on the marking platform 151 to absorb the dust generated during the marking process.

[0053] Reference Figure 3 and Figure 4 Each of the placement units 1, 2, 3, and 4 is equipped with a vision positioning system, which includes a top vision system 61 and a bottom vision system 62. Taking the vision positioning system on placement unit 1 as an example, the top vision system 61 is installed above the linear rotary actuator 161 and is used to identify the welding tray from above. The bottom vision system 62 is installed below the main transmission system 11 and identifies and positions the welding tray from bottom to top during operation. During the placement of the placement components, the dual-side camera recognition helps improve the placement accuracy of the placement components.

[0054] Reference Figure 1The bonding unit 1 also includes a reflow lifting system 14, which is located between the main transport system 11 and the reflow conveyor system 12. The reflow lifting system 14 is used to transport the welding pallet moved to the end of the main transport system 11 onto the reflow conveyor system 12. The reflow lifting system 14 can be a warehouse stacker crane structure from the prior art, which will not be described in detail here. After the substrate and some bonding components on the welding pallet have completed preliminary assembly and marking at bonding unit 1, they are transported by the reflow lifting system 14 to the reflow conveyor system 12, and then conveyed by the reflow conveyor system 12 to bonding unit 2 at the other end of the production line.

[0055] Reference Figure 3 and Figure 6 The second placement unit 2 is also equipped with the same reflow lifting system 14 and picking head 13 as described above, so as to transport the soldering tray from the end of the reflow conveyor system 12 to the beginning of the main conveyor system 11 on the second placement unit 2. The second placement unit 2 also includes a first loading unit 21, which uses the same picking head 13 as described above to pick up other types of placement components, such as backing plates or solder pads, and place them in the installation area. The second placement unit 2 also includes a detection unit 22, which can be equipped with a camera to take pictures to identify the number of backing plates or backing plate solder pads that are picked up, and to issue an alarm when picking up repeatedly, so as to improve the placement accuracy of the placement components.

[0056] Reference Figure 7 and Figure 8 The main transmission system 11 drives the soldering tray to continue moving towards the placement unit 3. The placement unit 3 is used to place chips on the substrate. It includes a solder cutting unit, a wafer feed box 81, a film expansion system 82, a wafer gripper 83, and a loading unit 2. The solder cutting unit includes a cutting feeder 321 and a feeder 322. The feeder 322 stores multiple sets of trays. Each set of trays has a waffle box for storing solder pieces. One end of the feeder 322 is equipped with a tray gripper 323. When the tray gripper 323 is working, it grips the tray and installs the tray onto the loading end of the cutting feeder 321 so that the cutting feeder 321 can center and transport the solder pieces to the corresponding positions on the substrate, and place the corresponding solder pieces into the corresponding soldering positions on the substrate.

[0057] Reference Figure 7 and Figure 9The wafer feed box 81 is hollow and has a cavity for storing wafers. The expansion system 82 is located on one side of the main transport system 11 and includes an expansion ring for placing wafers and a wafer clamping assembly. The wafer clamping assembly is arranged circumferentially along the expansion ring to clamp the wafers and radially stretch the blue film on the wafers along the expansion ring. The wafer grippers 83 are arranged between the wafer feed box 81 and the expansion ring. During operation, they transport the wafers in the wafer feed box 81 and place them on the wafer clamping assembly. The wafers are positioned above the expansion ring. When the wafer clamping assembly has finished clamping the wafers and is stretching them laterally, the expansion ring supports the blue film on the wafers. The chips on the blue film are all inside the expansion ring.

[0058] Reference Figure 10 and Figure 11 The second feeding unit includes a mounting head 91, a pin cap 92, a first lifting assembly 93, and a second lifting assembly 94. The first lifting assembly 93 includes a moving part 932 and a clamping part 931. The pin cap 92 is located below the film expanding ring and is arranged vertically. The moving part 932 is a commonly used multi-axis moving mechanism 16 in the mechanical field. The clamping part 931 is installed on the movable end of the moving part 932 and is used to clamp the pin cap 92 and drive the pin cap 92 to move. The inner side of the pin cap 92 is hollow and a pin 921 is slidably connected to it vertically. The second lifting assembly 94 is a linear motor and is installed on the clamping part 931 to drive the pin 921 to move along the pin cap 92.

[0059] Reference Figure 10 and Figure 11 The clamping part 931 is equipped with a heater. When the heater is working, it heats the pin cap 92. When installing the chip, the moving part 932 moves the pin cap 92 closer to the blue film, so that the heated pin cap 92 softens the adhesive between the chip and the blue film. Then, the lifting assembly 94 drives the ejector pin 921 to extend out of the pin cap 92, pass through the blue film and push the chip to separate from the blue film.

[0060] Reference Figure 7 and Figure 9 The placement head 91 includes a drive mechanism and a second nozzle. The drive mechanism drives the second nozzle to move along a preset trajectory. After the ejector pin 921 separates the chip from the blue film, the chip is picked up by the second nozzle and placed on a preset position on the substrate. The placement unit 3 is also equipped with the same nozzle changer 133 to enable the selection and replacement of different types of second nozzles. The placement unit 4 is equipped with the same wafer feeder 81, film expansion system 82, wafer grippers 83 and loading unit 2, which can be used to install other types of chips. The placement unit 4 is also equipped with a dispensing system. When the soldering tray carries the substrate through the placement unit 4, the dispensing system performs dispensing operations on the substrate. The dispensing system is existing technology and will not be described in detail here.

[0061] Reference Figure 1After dispensing and placing the first set of patch components, the welding tray moves the substrate and the patch components on it to the welding module 5. The welding module 5 uses a vacuum welding machine to complete the vacuum welding of the substrate and the corresponding patch components at the welding module 5. This is existing technology, and common vacuum welding equipment on the market can be used. It will not be elaborated on here.

[0062] Reference Figure 1 After one welding operation is completed, the welding tray continues to be transported to the placement unit 1 along the main transport system 11. The above operation is repeated, and the remaining components to be assembled are installed in the placement unit 1. The welding tray is then transported again to the placement unit 2 via the reflow lifting system 14 and the reflow conveying system 12 for the second round of component installation and welding. Optionally, the suction nozzle 131 can be a magnetic chuck to pick up ferromagnetic components. A laser cleaning module can also be provided in the placement unit 4 near the welding module 5 to remove the oxide layer on the substrate or backing before welding.

[0063] The implementation principle of the modular automated chip mounting line according to this application embodiment is as follows: Each processing unit of the production line is equipped with a bidirectional conveying system to realize the directional conveying and return transfer of the welding tray during the processing. The welding tray is transported by two sets of return lifting systems 14 at the end of the production line, thereby allowing the welding tray to be transported between the main conveying system 11 and the return conveying system 12. During multiple welding processes, the welding tray is automatically circulated, which helps to improve production efficiency. In the initial processing state, the model of the substrate is identified by an RFID reading module, and then the corresponding program is selected to control the subsequent handling, placement and welding operations of the chip mounting components, which facilitates the production of different models of semiconductor devices using the same production line. During the production process, the detection unit 22 and the vision positioning system are used to identify and detect the gripping and placement of the chip mounting components, which helps to improve processing accuracy and product quality.

[0064] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An automatic module placement line, characterized in that, include: The first mounting unit (1) is located at the end of the production line and includes a main transport system (11) for conveying a welding tray, which is used to support the substrate of the semiconductor device; an RFID reading module for identifying the model of the semiconductor device substrate; a picking head (13) for picking up and placing the corresponding mounting components into the corresponding positions according to the substrate model; a return transport system (12) for conveying in the opposite direction to the main transport system (11) and for driving the welding tray back; and a return lifting system (14) for transferring the welding tray between the main transport system (11) and the return transport system (12). The second placement unit (2) is located at the other end of the production line. It includes the same reflow lifting system (14) as described above, and also includes a first loading unit (21) for grabbing the placement assembly and placing the placement assembly at a preset position on the soldering tray; and a detection unit (22) for detecting whether the first loading unit (21) repeatedly grabs the placement assembly. The third mounting unit (3) is located between the first mounting unit (1) and the second mounting unit (2), and includes the second loading unit, which is used to pick up and place the chip on the preset position on the soldering tray; and the solder cutting unit, which is used to cut the solder and place the solder on the corresponding position on the soldering tray. Two sets of patch units four (4) are located between patch unit three (3) and patch unit one (1), including the same feeding unit two, and also including a dispensing system for dispensing adhesive to the patch components on the welding tray; The welding module (5) is located between the four patch units (4) and the one patch unit (1) and is used to perform vacuum welding on the substrate and other components on the welding tray. The second (2), third (3), fourth (4) and welding module (5) are all equipped with the same main transport system (11) and return transport system (12). All the main transport systems (11) are connected in sequence to drive the welding tray to move along the production line. All the return transport systems (12) are connected in sequence to drive the welding tray to return.

2. The automatic placement line for modules according to claim 1, characterized in that: The patch unit (1) further includes a marking unit for laser marking the semiconductor device substrate.

3. The automatic placement line for modules according to claim 1, characterized in that: The first (1), second (2), third (3) and fourth (4) of the chip mounting unit are all equipped with a visual positioning system, which includes a top visual system (61) and a bottom visual system (62). The top visual system (61) and the bottom visual system (62) identify and position the chip mounting process of the semiconductor device from both sides.

4. The automatic placement line for modules according to claim 1, characterized in that: The material handling head (13) includes a suction nozzle (131), a rangefinder (132), and a nozzle changer (133). The bonding unit (1) includes a multi-axis moving mechanism (16) for supporting and driving the suction nozzle (131) to move. The rangefinder (132) is installed at the connection between the multi-axis moving mechanism (16) and the suction nozzle (131) for positioning the distance between the suction nozzle (131) and the welding tray. The nozzle changer (133) is located on one side of the multi-axis moving mechanism (16) and is equipped with different types of suction nozzles (131). The multi-axis moving mechanism (16) selects different suction nozzles (131) at the nozzle changer (133) according to different semiconductor device substrate models.

5. The automatic placement line for modules according to claim 1, characterized in that, Also includes: The pallet buffer machine (7) includes a chassis (71), a pallet magazine (72) and a lifting mechanism (73). The pallet magazine (72) is located inside the chassis (71) and is used to store welding pallets. The pallet magazine (72) is vertically arranged with multiple transfer tracks (721) corresponding to the main transmission system (11). The lifting mechanism (73) is located between the chassis (71) and the pallet magazine (72) to drive the pallet magazine (72) to move vertically so that different transfer tracks (721) can be connected to the main transmission system (11).

6. The automatic placement line for modules according to claim 1, characterized in that: Both the third (3) and the fourth (4) of the chip mounting unit include a wafer feed box (81), a film expansion system (82), and wafer grippers (83). The wafer feed box (81) is hollow and is used to store wafers in batches. The film expansion system (82) is located on one side of the wafer feed box (81) and is used to stretch the blue film on the wafer and increase the distance between adjacent chips on the blue film. The wafer grippers (83) are used to transport the wafers in the wafer feed box (81) to the film expansion system (82). The second loading unit is used to assemble the chips in the wafers to the preset positions on the semiconductor device substrate.

7. The automatic placement line for modules according to claim 6, characterized in that: The second loading unit includes a mounting head (91), a pin cap (92), a lifting assembly one (93), and a lifting assembly two (94). The lifting assembly one (93) is set on the corresponding mounting unit three (3) or mounting unit four (4) and is used to drive the pin cap (92) to move vertically. When the welding tray moves along the main transmission system (11), it passes above the pin cap (92). The inner side of the pin cap (92) is provided with a pin (921) that slides vertically. The lifting assembly two (94) is set at the connection between the lifting assembly one (93) and the pin cap (92) and is used to drive the pin (921) to move independently along the pin cap (92). The pin cap (92) is located below the film expansion system (82). After the pin (921) extends out from the pin cap (92), it pushes the chip to detach from the blue film. The mounting head (91) is set on one side of the wafer feed box (81) and is used to pick up the chip and place the chip in a preset position.

8. The automatic placement line for modules according to claim 7, characterized in that: The lifting assembly (93) includes a clamping part (931) and a moving part (932). The needle cap (92) is mounted on the clamping part (931). The moving part (932) is used to drive the clamping part (931) to move along the three-axis direction. The clamping part (931) is provided with a heater for heating the needle cap (92).

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