High-speed low-expansion-coefficient resin composition containing unsaturated hydrocarbon resin and application thereof

Abstract

The invention provides a high-speed low-expansion-coefficient resin composition containing unsaturated hydrocarbon resin and application thereof. The high-speed low-expansion-coefficient resin composition comprises a resin compound, unsaturated hydrocarbon resin and an accelerant. In the resin composition provided by the invention, the unsaturated hydrocarbon resin structurally contains two cyclopentadiene, so that the rigidity is relatively strong; a reactive unsaturated olefin group is arranged at the tail end of the resin composition, and the resin composition can be subjected to cross-linking reaction with thermosetting polyphenyl ether and thermosetting hydrocarbon resin to form a uniform network structure, so that the CTE performance of the resin composition is improved. A plate prepared from the resin composition has low thermal expansion coefficients in the X-axis, the Y-axis and the Z-axis, excellent dielectric properties and high peel strength. In addition, the invention also aims to provide a prepreg, a film, a metal foil, a laminated board and a wiring board which contain the resin composition.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of resin composition, in particular to a resin composition with unsaturated hydrocarbon resin, high speed and low expansion coefficient, and its preparation method and application. BACKGROUND

[0002] With the deep penetration of artificial intelligence technology to the edge side, the rapid iteration of supercomputer computing power and the large-scale deployment of edge computing terminals, there are higher requirements for the performance of communication infrastructure, high-end servers, routers, wireless base stations and other electronic products. On the one hand, in order to improve the transmission speed of signals and reduce the loss during signal transmission, the dielectric constant and dielectric loss factor of the substrate material used to constitute the wiring board of various electronic devices are required to be low.

[0003] It is known that the dielectric properties of polyphenyl ether, such as dielectric constant and dielectric loss factor, are excellent, and in the high frequency band (high frequency region) from MHz to GHz, the dielectric properties are also excellent. Therefore, polyphenyl ether is studied to be used as a high-speed molding material. More specifically, polyphenyl ether is studied to be used as a substrate material for constituting a substrate of a printed wiring board, which is provided in electronic devices using high frequency bands.

[0004] On the other hand, in recent years, with the miniaturization and thinning of electronic devices, surface mount type packages are increasingly used as electronic components provided in electronic devices. In the semiconductor packaging process, if the thermal expansion coefficients of the semiconductor components and the substrate differ too much, stress-induced warping of the substrate is likely to occur, causing serious problems such as poor connection between the semiconductor components and the substrate, and between the substrate and the PCB. Therefore, for the substrate material, there are higher requirements in the Z / X / Y axis direction, and the thermal expansion coefficient (Z direction) is expected to be 40 ppm / ℃ or less, and further 35 ppm / ℃ or less. Currently, the XY-CTE of commercial high-speed boards is generally 18-20 ppm / ℃, and to meet higher and more reliable requirements, the XY-CTE is expected to reach 10-13 ppm / ℃, or even 10 ppm / ℃ or less.

[0005] For the purpose of reducing the thermal expansion coefficient, adding fillers to the resin composition is effective, but in order to ensure the resin flowability during circuit filling, the addition of fillers is limited, so it is necessary to maintain a lower CTE performance with less filler addition.

[0006] Therefore, for the base material used for the base material of the wiring board, in actual situations, it is required to obtain a cured product having a high glass transition temperature, excellent heat resistance and adhesion, and having a low water absorption, a low thermal expansion coefficient in the Z / X / Y axes, and a low dielectric property, and it is also required that a prepreg, a resin-coated film, a resin-coated metal foil, and the like containing the resin composition or a semi-cured product thereof have excellent formability and good handleability. SUMMARY

[0007] A first object of the present application is to provide a high-speed low-expansion resin composition containing an unsaturated hydrocarbon resin.

[0008] A second object of the present application is to provide a variety of applications of the resin composition.

[0009] The present application is realized by the following technical solutions: A resin composition, comprising a resin compound and an unsaturated hydrocarbon resin; The resin compound comprises a first resin compound and a second resin compound; The first resin compound comprises, by weight parts, 0-70 parts of a methyl methacrylate group-modified polyphenylene ether resin, 0-70 parts of an ethylene benzyl group-modified polyphenylene ether resin, 0-70 parts of a divinylbenzene oligomer, 0-70 parts of acenaphthylene, and 0-70 parts of a benzocyclobutene resin; The weight parts of the methyl methacrylate group-modified polyphenylene ether resin, the ethylene benzyl group-modified polyphenylene ether resin, the divinylbenzene oligomer, the acenaphthylene, and the benzocyclobutene resin are not all 0 at the same time; The second resin compound comprises, by weight parts, 0-20 parts of a p-divinylbenzene ethane BVPE, 0-10 parts of a triallyl isocyanurate TAIC, 0-10 parts of a divinylbenzene DVB810, 0-10 parts of a polybutadiene resin B-1000, and 0-10 parts of a difunctional maleic amide resin BMI-70; The weight parts of the p-divinylbenzene ethane BVPE, the triallyl isocyanurate TAIC, the divinylbenzene DVB810, the polybutadiene resin B-1000, and the difunctional maleic amide resin BMI-70 are not all 0 at the same time; The molecular structure of the unsaturated hydrocarbon resin is ; Wherein, 1≤a≤5; R is selected from hydrogen, alkyl, alkenyl, alkynyl, or halogenated hydrocarbon.

[0010] The resin composition further comprises a promoter.

[0011] The promoter comprises any one or a mixture of several of a peroxide compound, a derivative of a peroxide compound, an azo compound and a derivative thereof, and a metal organic catalyst. The derivative of the peroxide compound includes dicumyl peroxide.

[0012] The resin composition further includes at least one of a silane coupling agent, a flame retardant, an antifoaming agent, an antioxidant, a heat stabilizer, an antistatic agent, an ultraviolet absorber, a dye or pigment, a lubricant, or an inorganic filler.

[0013] A prepreg obtained by impregnating a glass cloth with the resin composition.

[0014] A copper clad laminate including the prepreg.

[0015] A metal clad laminate including the prepreg.

[0016] A wiring board including the metal clad laminate.

[0017] A metal foil including the resin composition.

[0018] A film including the resin composition.

[0019] Further, the resin composition can further include an epoxy resin, an unsaturated polyester resin, a thermosetting polyimide resin, an unsaturated hydrocarbon resin, or the like.

[0020] The silane coupling agent can be directly included in the resin composition; preferably, can be included in a manner of pre-treating the surface of the filler; more preferably, can be included in a manner of pre-treating the surface of the filler, while being included in the resin composition. Further, in the prepreg, can be included in a manner of pre-treating the surface of the fibrous base material.

[0021] The silane coupling agent is not particularly specified, and is a compound having one of a vinyl group, a styryl group, a methacryl group, an acryl group, and an anilino group as a reactive group, and having a hydrolyzable group such as a methoxy group, an ethoxy group, or the like. In addition to the above, the silane coupling agent can be used alone or two or more kinds can be used in combination.

[0022] As described above, the resin composition according to the present application can include a flame retardant. By including the flame retardant, the flame retardancy of the cured product of the resin composition can be improved. The flame retardant is not particularly limited. Examples include, but are not limited to, halogen-based flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, and the like, such as decabromodiphenyl ether, hexabromobenzene, decabromodiphenyl ethane, ethylene bis-tetrabromophthalimide, and the like, as bromine-based halogen flame retardants, and such as tris(2,6-dimethylphenyl)-phosphine, phenoxyphosphazene, xylylenebis(diphenylphosphine oxide), hypophosphite, and the like, as phosphorus-based flame retardants. In addition to the above, the various flame retardants can be used alone or two or more kinds can be used in combination.

[0023] The resin composition according to the present application can contain a filler material such as an inorganic filler. As the filler material, a filler material added to improve the flame retardancy and heat resistance of the cured product of the resin composition can be cited, and there is no particular limitation. Examples include, but are not limited to, silica such as spherical silica, metal oxides such as alumina, metal hydroxides such as aluminum hydroxide, aluminum borate, and calcium carbonate. As the filler material, silica or the like is preferred, and more preferably, for example, spherical silica or the like. In addition, the aforementioned filler material can be used alone or in combination of two or more. Further, the filler material can be used directly or after surface treatment with a silane coupling agent. In particular, when a filler is contained, the content of the filler is preferably 30 to 70 parts, and more preferably 40 to 60 parts, relative to 100 parts of the total mass of the aforementioned resin composition.

[0024] The method for producing the resin composition is not particularly limited. For example, the resin compound, the unsaturated hydrocarbon resin, and the accelerator can be mixed to obtain the resin composition.

[0025] Further, after obtaining the resin composition according to the present application, a prepreg, a metal-clad laminate, a wiring board, a copper foil-clad metal foil, and a resin-coated film can be obtained as follows.

[0026] Prepreg The prepreg according to the present application contains the aforementioned resin composition or the aforementioned semi-cured product of the resin composition and a fibrous base material.

[0027] The aforementioned semi-cured product refers to a product in which the resin composition is cured partially, and is in a state that can be further cured. Further, the aforementioned resin composition or the aforementioned semi-cured product of the resin composition can be obtained by drying or heat drying the aforementioned resin composition.

[0028] In the production of the aforementioned prepreg, the aforementioned resin composition is mostly formulated as a resin varnish, and is attached to the fibrous base material by impregnation or coating, or the like.

[0029] In the production of the aforementioned resin varnish, the aforementioned resin composition is mostly dissolved in a corresponding solvent, and, if necessary, can be subjected to heating or the like, and insoluble portions can be dispersed to a specified dispersion state with the aid of a device such as a ball mill, a bead mill, a homogenizer, or an emulsifier. In particular, the aforementioned solvent is not particularly limited as long as it can dissolve the aforementioned resin compound, the unsaturated hydrocarbon resin, and the accelerator, and does not react with any of them or hinder the curing reaction of the aforementioned resin composition.

[0030] Specific examples of fiber-based materials include glass cloth, aramid cloth, polyester cloth, glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, and cotton fabric. Preferably, glass cloth can provide the laminate with better mechanical properties, and more preferably, glass cloth that has undergone fiber opening treatment.

[0031] The manufacturing method of the aforementioned prepreg is not particularly required as long as it can produce the aforementioned prepreg.

[0032] Copper-clad laminate (also known as metal foil laminate) The metal foil-coated laminate provided by this invention shall comprise: an insulating layer of the aforementioned cured resin composition or the aforementioned cured prepreg, and a metal foil covering one or both sides of the insulating layer. Furthermore, the type and thickness of the aforementioned metal foil are not particularly limited, depending on actual needs. The metal foil thickness is preferably 0.1-105 μm, and the type of metal foil may include, but is not limited to, copper foil, aluminum foil, etc.

[0033] As for the manufacturing method of the metal-clad laminate, no special requirements are made as long as it is possible to manufacture the aforementioned metal-clad laminate.

[0034] The resin composition described in this invention can be used to manufacture cured products of resin compositions with low dielectric properties and high heat resistance. Therefore, a metal-coated foil laminate having the resin composition described in this invention cured as an insulating layer is also a metal-coated foil laminate with low dielectric properties and high heat resistance. In particular, the aforementioned metal-coated foil laminate having the resin composition described in this invention cured as an insulating layer can also be used to prepare wiring boards with low dielectric properties and high heat resistance.

[0035] Wiring board The wiring board provided by the present invention shall include: an insulating layer of the aforementioned resin composition cured product or the aforementioned prepreg cured product, and a metal foil covering one or both sides of the surface of the insulating layer at etched portions, forming wiring.

[0036] As for the manufacturing method of the wiring board, no special requirements are made as long as it is possible to manufacture the aforementioned wiring board.

[0037] The wiring board described in this invention has low dielectric properties and high heat resistance.

[0038] Resin-coated metal foil The resin-coated metal foil provided by this invention shall comprise: an insulating layer of the aforementioned resin composition or a cured product of the aforementioned resin composition, and a metal foil. Furthermore, the aforementioned insulating layer may or may not comprise a fiber substrate, provided it contains the aforementioned resin composition or a cured product of the aforementioned resin composition. Additionally, the aforementioned resin composition or the semi-cured product of the aforementioned resin composition may be obtained by drying or heat drying the aforementioned resin composition.

[0039] The aforementioned resin-coated metal foil may be covered with a release film as needed to prevent contamination and damage. Furthermore, there are no particular limitations on the release film, as long as it does not react with the aforementioned insulating layer and can detach from the insulating layer without leaving any residue.

[0040] As for the manufacturing method of resin-coated metal foil, no special requirements are made as long as it can manufacture the aforementioned resin-coated metal foil.

[0041] Resin-coated membrane The resin-bearing membrane provided by this invention shall comprise: a resin layer of the aforementioned resin composition or a cured product of the aforementioned resin composition, and a support film. Furthermore, the aforementioned resin layer may or may not contain a fiber substrate, as long as it contains the aforementioned resin composition or a cured product of the aforementioned resin composition. Furthermore, the aforementioned resin composition or the semi-cured product of the aforementioned resin composition may be obtained by drying or heat drying the aforementioned resin composition. Furthermore, the aforementioned support film is not particularly limited as long as it does not react with the aforementioned insulating layer and can detach from the aforementioned insulating layer without leaving residue.

[0042] The aforementioned resin-coated film may be covered with a release film as needed to prevent contamination and damage. Furthermore, there are no particular limitations on the release film as long as it does not react with the aforementioned insulating layer and can detach from the aforementioned insulating layer without leaving any residue.

[0043] As for the method of manufacturing resin-containing membranes, no special requirements are made as long as it is possible to manufacture the aforementioned resin-containing membranes.

[0044] Compared with the prior art, the beneficial effects of the present invention are as follows: In the resin composition provided by the present invention, the unsaturated hydrocarbon resin contains two cyclopentadienes in its structure, which makes it more rigid; and has reactive unsaturated olefin groups at the end, which can crosslink with thermosetting polyphenylene ether and thermosetting hydrocarbon resin to form a uniform network structure, thereby improving the CTE performance of the resin composition.

[0045] The resin composition prepared from the unsaturated hydrocarbon resin B provided by this invention has excellent dielectric properties and good heat resistance.

[0046] The high-speed copper-clad laminate prepared using the resin composition of the present invention has a low coefficient of thermal expansion in the X, Y and Z axes.

[0047] The prepreg prepared using the resin composition of the present invention can meet the performance requirements of high-speed copper foil substrates with higher requirements for the coefficient of thermal expansion. Detailed Implementation

[0048] The present invention will be further illustrated by the following embodiments, but the scope of protection of the present invention is not limited to the following embodiments.

[0049] The raw materials used in the embodiments of the present invention are detailed in Table 1 below.

[0050] Table 1 Material Statistics Table The performance testing methods for the metal foil-coated laminates prepared in the embodiments and comparative examples of this invention are as follows: Glass transition temperature (DMA) (Tg) The Tg of the prepreg was determined using a TA-manufactured dynamic thermomechanical analyzer, DMA850. Dynamic viscoelasticity (DMA) measurements were performed at a frequency of 1 Hz in the flexural modulus, and the temperature at which tanδ reaches its maximum at a heating rate of 5 °C / min from room temperature to 300 °C was defined as Tg.

[0051] Copper foil peel strength In fabricating the aforementioned evaluation substrate, by setting the number of prepreg overlaps to 6, a metal-clad laminate with a thickness of approximately 0.8 mm and copper foil of 18 μm thickness bonded to both sides was obtained. The copper foil on both sides of the formed metal-clad laminate was treated with 3 mm special adhesive tape, the remaining copper foil was removed by etching, and the sample was tested using a peel strength tester.

[0052] Heat resistance (TMA method: T-300) In fabricating the aforementioned evaluation substrate, by setting the number of prepreg overlaps to 6, a metal foil laminate with a thickness of approximately 0.8 mm and 18 μm copper foil bonded to both sides was obtained. The delamination bursting time at 300°C was measured according to IPC-TM-650.

[0053] PCT water absorption rate The water absorption rate was measured after 180 minutes of moisture absorption using a high-pressure accelerated aging tester at 2 MPa and 120°C.

[0054] Dielectric loss factor Df The dielectric loss factor of the evaluation substrate at 15 GHz was determined using the resonant cavity perturbation method. Specifically, the dielectric loss factor of the evaluation substrate at 15 GHz was determined using a network analyzer (Keysight Technologies E5071C).

[0055] Coefficient of thermal expansion (ZCTE) In fabricating the aforementioned evaluation substrate, by setting the number of prepreg overlaps to 6, a metallized foil laminate with a thickness of approximately 0.8 mm and 18 μm copper foil bonded to both sides was obtained. The copper foil on both sides of the formed metallized foil laminate was removed by etching. The coefficient of thermal expansion of the resulting evaluation laminate was evaluated using the TMA method according to IPCTM650 2.4.24. Measurements were performed using a thermomechanical analysis (TMA) apparatus (TA-manufactured TMAQ400) within the range of 50–260 °C.

[0056] Coefficient of thermal expansion (XYCTE) In fabricating the aforementioned evaluation substrate, by setting the number of prepreg overlaps to 6, a metallized foil laminate with a thickness of approximately 0.8 mm and 18 μm copper foil bonded to both sides was obtained. The copper foil on both sides of the formed metallized foil laminate was removed by etching. The resulting evaluation laminate was evaluated for its coefficient of thermal expansion based on the TMA method according to IPCTM650 2.4.41. Measurements were performed using a thermomechanical analysis (TMA) apparatus (TA-manufactured TMAQ400) within the range of 50–125 °C.

[0057] Example 1 70 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound), 10 parts of divinylbenzene (DVB810) (second resin compound), 20 parts of dicumyl peroxide (DCP) (accelerator) and 1 part of cumene peroxide were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140℃ for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The mixture was then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2MPa and a curing temperature of 220℃ to obtain a high-speed copper-clad laminate.

[0058] The DMA Tg of the prepreg prepared in Example 1 was 210℃.

[0059] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 1 is 0.61 N / mm.

[0060] The heat resistance of the high-speed copper-clad laminate prepared in Example 1 is >60 min.

[0061] The water absorption rate of the high-speed copper-clad laminate prepared in Example 1 is 0.10%.

[0062] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 1 was 1.33%.

[0063] The X-CTE of the high-speed copper-clad laminate prepared in Example 1 was 11.8 ppm / ℃.

[0064] The Y-CTE of the high-speed copper-clad laminate prepared in Example 1 was 12.3 ppm / ℃.

[0065] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 1 is 0.0020.

[0066] Example 2 70 parts of ethylene benzyl modified polyphenylene ether resin OPE-2ST(2200) (first resin compound), 10 parts of divinylbenzene (DVB810) (second resin compound), 20 parts were dissolved in toluene, then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140℃ for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2MPa and a curing temperature of 220℃ to obtain a high-speed copper-clad laminate.

[0067] The DMA Tg of the prepreg prepared in Example 2 was 215℃.

[0068] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 2 is 0.62 N / mm.

[0069] The heat resistance of the high-speed copper-clad laminate prepared in Example 2 is >60 min.

[0070] The water absorption rate of the high-speed copper-clad laminate prepared in Example 2 was 0.10%.

[0071] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 2 was 1.31%.

[0072] The X-CTE of the high-speed copper-clad laminate prepared in Example 2 was 11.7 ppm / ℃.

[0073] The Y-CTE of the high-speed copper-clad laminate prepared in Example 2 was 12.5 ppm / ℃.

[0074] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 2 is 0.0019.

[0075] Example 3 35 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound), 35 parts of vinyl benzyl-modified polyphenylene ether resin OPE-2ST(2200) (first resin compound), and 10 parts of divinylbenzene (DVB810) (second resin compound) were prepared. 20 parts of dicumyl peroxide (DCP) (accelerator) and 0.5 parts of spherical silica were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140℃ for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The mixture was then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2MPa and a curing temperature of 220℃ to obtain a high-speed copper-clad laminate.

[0076] The DMA Tg of the prepreg prepared in Example 3 was 209°C.

[0077] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 3 is 0.64 N / mm.

[0078] The high-speed copper-clad laminate prepared in Example 3 has a heat resistance of >60 min.

[0079] The water absorption rate of the high-speed copper-clad laminate prepared in Example 3 was 0.08%.

[0080] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 3 was 1.29%.

[0081] The X-CTE of the high-speed copper-clad laminate prepared in Example 3 was 11.9 ppm / ℃.

[0082] The Y-CTE of the high-speed copper-clad laminate prepared in Example 3 was 12.4 ppm / ℃.

[0083] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 3 is 0.0020.

[0084] Example 4 50 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound), 20 parts of vinyl benzyl-modified polyphenylene ether resin OPE-2ST(2200) (first resin compound), and 10 parts of divinylbenzene (DVB810) (second resin compound) were prepared. 20 parts of dicumyl peroxide (DCP) and 0.7 parts of accelerator were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140℃ for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The mixture was then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2MPa and a curing temperature of 220℃ to obtain a high-speed copper-clad laminate.

[0085] The DMA Tg of the prepreg prepared in Example 4 was 211℃.

[0086] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 4 is 0.66 N / mm.

[0087] The heat resistance of the high-speed copper-clad laminate prepared in Example 4 is >60 min.

[0088] The water absorption rate of the high-speed copper-clad laminate prepared in Example 4 was 0.08%.

[0089] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 4 was 1.32%.

[0090] The X-CTE of the high-speed copper-clad laminate prepared in Example 4 was 11.7 ppm / ℃.

[0091] The Y-CTE of the high-speed copper-clad laminate prepared in Example 4 was 12.2 ppm / ℃.

[0092] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 4 is 0.0020.

[0093] Example 5 70 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were prepared. 20 parts of triallyl isocyanurate (TAIC) (second resin compound), 10 parts of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0094] The DMA Tg of the prepreg prepared in Example 5 was 212℃.

[0095] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 5 is 0.63 N / mm.

[0096] The high-speed copper-clad laminate prepared in Example 5 has a heat resistance of >60 min.

[0097] The water absorption rate of the high-speed copper-clad laminate prepared in Example 5 was 0.09%.

[0098] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 5 was 1.33%.

[0099] The X-CTE of the high-speed copper-clad laminate prepared in Example 5 was 11.8 ppm / ℃.

[0100] The Y-CTE of the high-speed copper-clad laminate prepared in Example 5 was 12.3 ppm / ℃.

[0101] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 5 is 0.0021.

[0102] Example 6 70 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were prepared. 20 parts of polybutadiene resin (B-1000) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0103] The DMA Tg of the prepreg prepared in Example 6 was 213℃.

[0104] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 6 is 0.62 N / mm.

[0105] The high-speed copper-clad laminate prepared in Example 6 has a heat resistance of >60 min. The water absorption rate of the high-speed copper-clad laminate prepared in Example 6 is 0.08%.

[0106] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 6 was 1.32%.

[0107] The X-CTE of the high-speed copper-clad laminate prepared in Example 6 was 11.9 ppm / ℃.

[0108] The Y-CTE of the high-speed copper-clad laminate prepared in Example 6 was 12.4 ppm / ℃.

[0109] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 6 is 0.0020.

[0110] Example 7 70 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were prepared. 20 parts of difunctional maleamide resin (BMI-70) (second resin compound) and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was placed on both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0111] The DMA Tg of the prepreg prepared in Example 7 was 216℃.

[0112] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 7 is 0.60 N / mm.

[0113] The high-speed copper-clad laminate prepared in Example 7 has a heat resistance of >60 min.

[0114] The water absorption rate of the high-speed copper-clad laminate prepared in Example 7 was 0.09%.

[0115] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 7 was 1.25%.

[0116] The X-CTE of the high-speed copper-clad laminate prepared in Example 7 was 11.5 ppm / ℃.

[0117] The Y-CTE of the high-speed copper-clad laminate prepared in Example 7 was 12.0 ppm / ℃.

[0118] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 7 is 0.0021.

[0119] Example 8 70 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were prepared. 20 parts of divinylbenzene (DVB810) (second resin compound), 5 parts of difunctional maleimide resin (BMI-70) (second resin compound), and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was placed on both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate. The DMA Tg of the prepreg prepared in Example 8 was 213°C.

[0120] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 8 is 0.63 N / mm.

[0121] The high-speed copper-clad laminate prepared in Example 8 has a heat resistance of >60 min.

[0122] The water absorption rate of the high-speed copper-clad laminate prepared in Example 8 was 0.09%.

[0123] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 8 was 1.28%.

[0124] The X-CTE of the high-speed copper-clad laminate prepared in Example 8 was 11.6 ppm / ℃.

[0125] The Y-CTE of the high-speed copper-clad laminate prepared in Example 8 was 12.2 ppm / ℃.

[0126] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 8 is 0.0021.

[0127] Example 9 80 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were prepared. 10 parts of divinylbenzene (DVB810) (the second resin compound) and 1 part of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was placed on both sides. The mixture was then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate. The DMA Tg of the prepreg prepared in Example 9 was 215°C.

[0128] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 9 is 0.65 N / mm.

[0129] The high-speed copper-clad laminate prepared in Example 9 has a heat resistance of >60 min.

[0130] The water absorption rate of the high-speed copper-clad laminate prepared in Example 9 was 0.13%.

[0131] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 9 was 1.50%.

[0132] The X-CTE of the high-speed copper-clad laminate prepared in Example 9 was 12.3 ppm / ℃.

[0133] The Y-CTE of the high-speed copper-clad laminate prepared in Example 9 was 12.8 ppm / ℃.

[0134] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 9 is 0.0021.

[0135] Example 10 60 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were added. 30 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was placed on both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate. The DMA Tg of the prepreg prepared in Example 10 was 203°C.

[0136] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 10 is 0.57 N / mm.

[0137] The high-speed copper-clad laminate prepared in Example 10 has a heat resistance of >60 min.

[0138] The water absorption rate of the high-speed copper-clad laminate prepared in Example 10 was 0.09%.

[0139] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 10 was 1.30%.

[0140] The X-CTE of the high-speed copper-clad laminate prepared in Example 10 was 11.1 ppm / ℃.

[0141] The Y-CTE of the high-speed copper-clad laminate prepared in Example 10 was 11.9 ppm / ℃.

[0142] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 10 is 0.0019.

[0143] Example 11 70 parts of divinylbenzene oligomer (ODV-EXT(X04)) (first resin compound), 20 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L2 cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0144] The DMA Tg of the prepreg prepared in Example 11 was 200°C.

[0145] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 11 is 0.55 N / mm.

[0146] The high-speed copper-clad laminate prepared in Example 11 has a heat resistance of >60 min.

[0147] The water absorption rate of the high-speed copper-clad laminate prepared in Example 11 was 0.12%.

[0148] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 11 was 0.7%.

[0149] The X-CTE of the high-speed copper-clad laminate prepared in Example 11 was 9.7 ppm / ℃.

[0150] The Y-CTE of the high-speed copper-clad laminate prepared in Example 11 was 10.3 ppm / ℃.

[0151] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 11 is 0.0015.

[0152] Example 12 10 parts of divinylbenzene oligomer (SA9000) (first resin compound), 40 parts of divinylbenzene oligomer (ODV-EXT(X04)) (first resin compound), and 20 parts of p-divinylbenzene ethane (BVPE) (second resin compound) were added. 20 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L2 cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0153] The DMA Tg of the prepreg prepared in Example 12 was 295°C.

[0154] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 12 is 0.58 N / mm.

[0155] The heat resistance of the high-speed copper-clad laminate prepared in Example 12 is >60 min.

[0156] The water absorption rate of the high-speed copper-clad laminate prepared in Example 12 was 0.11%.

[0157] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 12 was 0.75%.

[0158] The X-CTE of the high-speed copper-clad laminate prepared in Example 12 was 9.4 ppm / ℃.

[0159] The Y-CTE of the high-speed copper-clad laminate prepared in Example 12 was 1.01 ppm / ℃.

[0160] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 12 is 0.0016.

[0161] Example 13 50 parts of divinylbenzene oligomer (ODV-EXT(X04)) (first resin compound), 20 parts of divinylbenzene ethane (BVPE) (second resin compound), 20 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L2 cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0162] The DMA Tg of the prepreg prepared in Example 13 was 198°C.

[0163] The copper foil peel strength HVLP2 of the high-speed copper-clad laminate prepared in Example 13 is 0.56 N / mm.

[0164] The high-speed copper-clad laminate prepared in Example 13 has a heat resistance of >60 min.

[0165] The water absorption rate of the high-speed copper-clad laminate prepared in Example 13 was 0.10%.

[0166] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 13 was 0.65%.

[0167] The X-CTE of the high-speed copper-clad laminate prepared in Example 13 was 9.6 ppm / ℃.

[0168] The Y-CTE of the high-speed copper-clad laminate prepared in Example 13 was 1.02 pm / ℃.

[0169] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 13 is 0.0014.

[0170] Example 14 70 parts of divinylbenzene oligomer (ODV-EXT(X04)) and first resin compound were added. 20 parts of polybutadiene resin (B-1000) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L2 cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140℃ for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The mixture was then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2MPa and a curing temperature of 220℃ to obtain a high-speed copper-clad laminate.

[0171] The DMA Tg of the prepreg prepared in Example 14 was 199°C.

[0172] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 14 is 0.54 N / mm.

[0173] The high-speed copper-clad laminate prepared in Example 14 has a heat resistance of >60 min.

[0174] The water absorption rate of the high-speed copper-clad laminate prepared in Example 14 was 0.09%.

[0175] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 14 was 0.68%.

[0176] The X-CTE of the high-speed copper-clad laminate prepared in Example 14 was 9.8 ppm / ℃.

[0177] The Y-CTE of the high-speed copper-clad laminate prepared in Example 14 was 10.5 ppm / ℃.

[0178] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 14 is 0.0015.

[0179] Example 15 70 parts of DS6205 (first resin compound), 20 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L2 cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0180] The DMA Tg of the prepreg prepared in Example 15 was 210°C.

[0181] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 15 is 0.57 N / mm.

[0182] The high-speed copper-clad laminate prepared in Example 15 has a heat resistance of >60 min.

[0183] The water absorption rate of the high-speed copper-clad laminate prepared in Example 15 was 0.06%.

[0184] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 15 was 0.59%.

[0185] The X-CTE of the high-speed copper-clad laminate prepared in Example 15 was 9.1 ppm / ℃.

[0186] The Y-CTE of the high-speed copper-clad laminate prepared in Example 15 was 9.8 ppm / ℃.

[0187] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 15 is 0.0014.

[0188] Example 16 70 parts of acenaphthene (the first resin compound), 20 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L2 cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0189] The DMA Tg of the prepreg prepared in Example 16 was 195°C.

[0190] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Example 16 is 0.54 N / mm.

[0191] The high-speed copper-clad laminate prepared in Example 16 has a heat resistance of >60 min.

[0192] The water absorption rate of the high-speed copper-clad laminate prepared in Example 16 was 0.09%.

[0193] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Example 16 was 0.81%.

[0194] The X-CTE of the high-speed copper-clad laminate prepared in Example 16 was 8.9 ppm / ℃.

[0195] The high-speed copper-clad laminate prepared in Example 16 has a Y-CTE of 9.6 ppm / ℃.

[0196] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Example 16 is 0.0016.

[0197] Comparative Example 1 90 parts of methacrylate-modified polyphenylene ether resin (SA9000) (the first resin compound), 10 parts of divinylbenzene (DVB810), and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0198] The DMA Tg of the prepreg prepared in Comparative Example 1 was 220℃.

[0199] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 1 was 0.67 N / mm.

[0200] The high-speed copper-clad laminate prepared in Comparative Example 1 has a heat resistance of >60 min.

[0201] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 1 was 0.08%.

[0202] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 1 was 1.60%.

[0203] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 1 was 14.5 ppm / ℃.

[0204] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 1 was 15.2 ppm / ℃.

[0205] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 1 is 0.0022.

[0206] Comparative Example 2 50 parts of methacrylate-modified polyphenylene ether resin (SA9000) (first resin compound) were prepared. 40 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0207] The DMA Tg of the prepreg prepared in Comparative Example 2 was 194℃.

[0208] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 2 was 0.53 N / mm.

[0209] The heat resistance of the high-speed copper-clad laminate prepared in Comparative Example 2 is >60 min.

[0210] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 2 was 0.08%.

[0211] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 2 was 1.31%.

[0212] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 2 was 10.9 ppm / ℃.

[0213] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 2 was 11.5 ppm / ℃.

[0214] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 2 is 0.0018.

[0215] Comparative Example 3 70 parts of divinylphenyl ethane (BVPE) (second resin compound) were added. 20 parts of divinylbenzene (DVB810) (second resin compound) and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added. After thorough stirring, the resin precipitated, so high-speed copper-clad laminate could not be prepared subsequently.

[0216] Comparative Example 4 90 parts of divinylbenzene oligomer (ODV-EXT(X04)) (first resin compound), 10 parts of divinylbenzene (DVB810) (second resin compound), and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0217] The DMA Tg of the prepreg prepared in Comparative Example 4 was 208℃.

[0218] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 4 was 0.57 N / mm.

[0219] The high-speed copper-clad laminate prepared in Comparative Example 4 has a heat resistance of >60 min.

[0220] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 4 was 0.11%.

[0221] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 4 was 0.65%.

[0222] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 4 was 12.3 ppm / ℃.

[0223] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 4 was 13.2 ppm / ℃.

[0224] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 4 is 0.0017.

[0225] Comparative Example 5 50 parts of divinylbenzene oligomer (ODV-EXT(X04)) (first resin compound), 40 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0226] The DMA Tg of the prepreg prepared in Comparative Example 5 was 190℃.

[0227] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 5 was 0.50 N / mm.

[0228] The high-speed copper-clad laminate prepared in Comparative Example 5 has a heat resistance of >60 min.

[0229] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 5 was 0.11%.

[0230] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 5 was 0.68%.

[0231] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 5 was 9.2 ppm / ℃.

[0232] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 5 was 9.9 ppm / ℃.

[0233] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 5 is 0.0015.

[0234] Comparative Example 6 90 parts of DS6205 (first resin compound), 10 parts of divinylbenzene (DVB810) (second resin compound), and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0235] The DMA Tg of the prepreg prepared in Comparative Example 6 was 216℃.

[0236] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 6 was 0.56 N / mm.

[0237] The high-speed copper-clad laminate prepared in Comparative Example 6 has a heat resistance of >60 min.

[0238] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 6 was 0.09%.

[0239] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 6 was 0.59%.

[0240] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 6 was 12.5 ppm / ℃.

[0241] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 6 was 13.4 ppm / ℃.

[0242] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 6 is 0.0015.

[0243] Comparative Example 7 50 parts of DS6205 (first resin compound), 40 parts of divinylbenzene (DVB810) (the second resin compound), 10 parts of dicumyl peroxide (DCP) (an accelerator) were dissolved in toluene, and then 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth) to ensure a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0244] The DMA Tg of the prepreg prepared in Comparative Example 7 was 200℃.

[0245] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 7 was 0.49 N / mm.

[0246] The high-speed copper-clad laminate prepared in Comparative Example 7 has a heat resistance of >60 min.

[0247] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 7 was 0.12%.

[0248] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 7 was 0.69%.

[0249] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 7 was 8.8 ppm / ℃.

[0250] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 7 was 9.5 ppm / ℃.

[0251] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 7 is 0.0016.

[0252] Comparative Example 8 90 parts of acenaphthene (first resin compound), 10 parts of divinylbenzene (DVB810) (second resin compound), and 1 part of dicumyl peroxide (DCP) (accelerator) were dissolved in toluene. Then, 60 parts of spherical silica were added and thoroughly mixed. The resin solution was impregnated with 1078 fiberglass cloth (L-cloth), ensuring a resin content of approximately 65%, and dried in an oven at 140°C for 5 minutes to remove the toluene solvent, thus obtaining 1078 prepreg. Six sheets of 1078 prepreg were overlapped, and copper foil of HoZ thickness was applied to both sides. The sheets were then vacuum laminated and cured in a press for 125 minutes at a curing pressure of 2 MPa and a curing temperature of 220°C to obtain a high-speed copper-clad laminate.

[0253] The DMA Tg of the prepreg prepared in Comparative Example 8 was 199℃.

[0254] The copper foil peel strength (HVLP2) of the high-speed copper-clad laminate prepared in Comparative Example 8 was 0.52 N / mm.

[0255] The high-speed copper-clad laminate prepared in Comparative Example 8 has a heat resistance of >60 min.

[0256] The water absorption rate of the high-speed copper-clad laminate prepared in Comparative Example 8 was 0.13%.

[0257] The Z-CTE (50-260℃) of the high-speed copper-clad laminate prepared in Comparative Example 8 was 0.70%.

[0258] The X-CTE of the high-speed copper-clad laminate prepared in Comparative Example 8 was 12.1 ppm / ℃.

[0259] The Y-CTE of the high-speed copper-clad laminate prepared in Comparative Example 8 was 12.9 ppm / ℃.

[0260] The dielectric loss factor (15GHz) of the high-speed copper-clad laminate prepared in Comparative Example 8 is 0.0017.

[0261] The following table shows the proportions of each component in Examples 1-16 and Comparative Examples 1-8, and the various performance indicators of the high-speed copper-clad laminates prepared in each example and comparative example.

[0262] Table 2 Table 3 As can be seen from Examples 1-16, when the copper-clad laminate contains resin compounds, the unsaturated hydrocarbon resin and the initiator, and the dosage is within a suitable range, the copper-clad laminate provided has a low coefficient of thermal expansion in the X, Y and Z axes, and has excellent heat resistance, dielectric properties and high peel strength.

[0263] As shown in Examples 1, 9-11, 15-16 and Comparative Examples 1-2, 4-8, the lower the amount of unsaturated hydrocarbon resin, the greater its coefficient of thermal expansion on the X and Y axes; however, the HVLP copper foil has a higher peel strength. If the amount of unsaturated hydrocarbon resin B is too high, although the coefficient of thermal expansion on the X and Y axes is lower, the HVLP copper foil has poor peel strength. Comparative Examples 1, 4, 6, and 8 do not contain unsaturated hydrocarbon resin, and their coefficients of thermal expansion on the X and Y axes are too high.

[0264] As shown in Comparative Example 3, excessive BVPE content resulted in precipitated particles, poor appearance of the prepreg, and subsequent testing was not possible.

[0265] To illustrate the invention, the present invention has been appropriately and sufficiently described above through embodiments. However, it should be recognized that those skilled in the art can readily make changes and modifications to the above embodiments. Therefore, any modified or improved embodiments implemented by those skilled in the art, as long as they do not depart from the scope of the claims, can be interpreted as being included within the scope of the claims.

Claims

1. A resin composition, characterized in that, include: Resin compounds and unsaturated hydrocarbon resins; The resin compound includes a first resin compound and a second resin compound; Based on parts by weight, the first resin compound comprises 0-70 parts of methacrylate-modified polyphenylene ether resin, 0-70 parts of vinyl benzyl-modified polyphenylene ether resin, 0-70 parts of divinylbenzene oligomer, 0-70 parts of acenaphthene and 0-70 parts of benzocyclobutene resin. The weight parts of methacrylate-modified polyphenylene ether resin, vinyl benzyl-modified polyphenylene ether resin, divinylbenzene oligomer, acenaphthene and benzocyclobutene resin are not all 0. Based on parts by weight, the second resin compound comprises 0-20 parts of p-divinylbenzene ethane, 0-10 parts of triallyl isocyanurate, 0-10 parts of divinylbenzene, 0-10 parts of polybutadiene resin and 0-10 parts of difunctional maleimide resin. The weight parts of divinylphenyl ethane, triallyl isocyanurate, divinylbenzene, polybutadiene resin and difunctional maleimide resin are not all 0. The molecular structure of the unsaturated hydrocarbon resin is as follows: ; Where 1≤a≤5; R is selected from hydrogen, alkyl, alkenyl, alkynyl or haloalkanes.

2. The resin composition according to claim 1, characterized in that: It also includes accelerators.

3. The resin composition according to claim 2, characterized in that: The promoter includes any one or a mixture of several of the following: peroxides, peroxide derivatives, azo compounds and their derivatives, and organometallic catalysts. The derivatives of the peroxide include dicumyl peroxide.

4. The resin composition according to claim 1, characterized in that: It also includes at least one of the following: silane coupling agents, flame retardants, defoamers, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, dyes or pigments, lubricants, or inorganic fillers.

5. A prepreg obtained by impregnating fiberglass cloth with a resin composition as described in claim 1.

6. A copper-clad laminate comprising the prepreg as described in claim 5.

7. A metal foil laminate comprising the prepreg as described in claim 5.

8. A wiring board comprising the metal foil laminate as described in claim 7.

9. A metal foil comprising the resin composition of claim 1.

10. A film comprising the resin composition of claim 1.

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