Liquid cooling heat dissipation high-power LED lamp
By using liquid cooling technology, which combines insulating heat dissipation coolant and encapsulating fluorescent adhesive, the problems of poor heat dissipation and blue light hazards in high-power LED lamps are solved, achieving an LED lamp design that is efficient in heat dissipation, long in life and safe.
Patent Information
- Application Number
- CN202511718963.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-21
- Publication Date
- 2026-02-06
AI Technical Summary
Existing high-power LED lights have poor heat dissipation, resulting in short lifespans and safety hazards. At the same time, blue light is harmful to the human eye, making it difficult to meet the requirements of cost, safety and health.
The liquid cooling method is adopted. By setting up the LED lamp frame, metal carrier circuit board and flip-chip LED chip inside the LED lamp, and using insulating heat dissipation coolant and encapsulating fluorescent glue to form a current flow loop, the LED chip lights up when the positive and negative metal plates are connected to the power supply. The lamp is filled with insulating heat dissipation coolant to improve heat dissipation capacity and avoid blue light hazards.
It significantly improves the heat dissipation capacity of high-power LED lamps, extends their service life, ensures safe and healthy use, and provides uniform brightness of LED chips, reducing the harm of blue light to the human eye.
Smart Images
Figure CN121474529A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED lighting technology, and more specifically to a high-power LED lighting fixture with liquid cooling. Background Technology
[0002] LED lighting fixtures are lamps that use a special processing technique to solder LED lights onto copper wires or flexible circuit boards, and then connect them to a power source to emit light. LED lighting fixtures are widely used in buildings, bridges, roads, gardens, courtyards, floors, ceilings, furniture, automobiles, ponds, underwater installations, advertising, signs, and other fields for decoration or illumination. They add immeasurable joy and festive atmosphere to various celebrations. With its tenacious vitality, LED lighting fixtures have entered five major advantageous markets: advertising, decoration, construction, commercial, and gifts, and are exported to many countries and regions. They are widely used in building outlines, bridges, railings, hotels, gardens, dance halls, and advertising decorations.
[0003] LEDs used in LED lighting fixtures include surface-mount LEDs, through-hole LEDs, and flip-chip LEDs. Flip-chip LEDs are also known as COB. Surface-mount LEDs come in sizes such as 0603, 0805, 1206, 1210, 5050, and 5060, and in colors such as red, yellow, blue, green, white, yellow-green, purple, and RGB seven colors. Through-hole LEDs come in sizes such as ∮3, ∮5, and ∮6, and have round or flat heads (commonly known as straw hat lights). They also come in colors such as red, yellow, blue, green, and white. LED lighting fixtures are mainly used for advertising decoration, automotive decoration, and home decoration lighting.
[0004] Existing LED lighting fixtures typically involve etching circuitry onto a PCB board to create a substrate, then flip-chipping blue LEDs onto the substrate and encapsulating them with translucent adhesive and phosphor. This allows them to emit various colors of light, such as warm white, cool white, and warm yellow, while remaining waterproof and dustproof. Many applications require high-brightness LED lighting, necessitating high-power LED fixtures. However, existing high-power LED fixtures generally suffer from inadequate heat dissipation on their PCB boards, leading to prolonged operation in high-temperature environments. This not only easily damages the fixtures under high temperatures but also significantly shortens their lifespan and can even pose safety hazards such as fires. Furthermore, the blue light emitted by blue LED chips, particularly the wavelength around 450 nanometers, is harmful to the eyes, and phosphors cannot completely block all blue light leakage. Therefore, existing high-power LED lighting fixtures using blue LEDs still fall short of meeting users' needs in terms of cost, safety, and health. Summary of the Invention
[0005] To address the problems in existing technologies, this invention provides a high-power LED lamp with liquid cooling. The high-power LED lamp incorporates a cooperating LED lamp frame, an LED lamp cover, a metal carrier circuit board, and LED chips flip-chip mounted on the metal carrier circuit board. The LED chips serve as the light-emitting units, and are sealed with encapsulating fluorescent adhesive to ensure waterproofing and dustproofing while emitting various colors of light. The light-emitting space is then filled with insulating and cooling liquid, significantly improving the heat dissipation capacity of the high-power LED lamp. Simultaneously, it eliminates harmful blue light to the eyes, meeting user needs in terms of cost, safety, and health. This invention solves the problems of poor heat dissipation in existing high-power LED lamps, which lead to short lifespans and safety hazards.
[0006] This invention provides a high-power LED lamp with liquid cooling, comprising an LED lamp frame, an LED lamp cover, a metal carrier circuit board, and LED chips flip-mounted on the metal carrier circuit board. The LED lamp frame and the LED lamp cover are detachably and sealingly connected, with a tight-fitting sealing ring between them. The LED lamp frame contains a light-emitting space filled with an insulating and heat-dissipating coolant. The metal carrier circuit board is fixedly disposed at the bottom of the light-emitting space and integrally formed with the LED lamp frame. The metal carrier circuit board includes a positive electrode... The device comprises a positive electrode metal plate, a negative electrode metal plate, and a chip carrier plate. The chip carrier plate has two conductive pads for fixing the LED chip pins. The power supply pins of the LED chip are fixedly soldered into the conductive pads for fixing the LED chip pins. The positive electrode metal plate, the negative electrode metal plate, and the chip carrier plate form a current flow loop in the circuit through the power supply pins of the LED chip. The positive electrode metal plate can be connected to the positive terminal of the power supply, and the negative electrode metal plate can be connected to the negative terminal of the power supply. The chip carrier plate and the LED chip are covered with encapsulating fluorescent adhesive for sealing and insulation. The LED chip can emit light when the power supply is connected to the positive electrode metal plate and the negative electrode metal plate.
[0007] The present invention is further improved in that the insulating heat dissipation coolant is a unidirectional dielectric coolant of model AP-7.
[0008] In a further improvement, the metal carrier circuit board is an aluminum foil circuit board that is easy to dissipate heat, and the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier sheet are all made of aluminum foil that is easy to dissipate heat.
[0009] The present invention is further improved in that the LED lamp frame includes a base plate and a main frame. The main frame is made of plastic, and the base plate is made of aluminum, which is easy to dissipate heat.
[0010] In a further improvement to this invention, the sealing ring is made of fluororubber.
[0011] The present invention is further improved in that the LED lamp cover includes a light-transmitting cover and a cover frame. The cover frame is made of plastic, and the light-transmitting cover is made of transparent glass or transparent acrylic sheet.
[0012] In a further improvement to the present invention, a buffer protection resistor is provided on the metal carrier circuit board, and the buffer protection resistor is connected in series in the current flow path of the LED chip.
[0013] In a further improvement, the chip carrier array is disposed between the positive electrode metal sheet and the negative electrode metal sheet, and the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier are not in contact with each other. The positive electrode metal sheet is provided with a positive electrode conductive pad, and the negative electrode metal sheet is provided with a negative electrode conductive pad. The two LED pin fixed conductive pads are respectively connected to the LED pin fixed conductive pads of the positive electrode conductive pad and the negative electrode conductive pad. The metal carrier circuit board is cut from a complete aluminum foil into the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier by laser cutting.
[0014] The present invention is further improved in that the width of the positive electrode metal sheet is greater than 0.5 mm, the width of the negative electrode metal sheet is greater than 0.5 mm, and the thickness of the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier sheet are all greater than 0.03 mm and less than 0.1 mm.
[0015] In a further improvement, the conductive pad for fixing the LED bead pins is a copper-plated pad, the power supply pins of the LED chip are fixed to the conductive pad for fixing the LED bead pins by soldering, and the encapsulating fluorescent adhesive is made of epoxy resin containing phosphor or silicone containing phosphor.
[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention provides a high-power LED lamp with liquid cooling heat dissipation. By setting an LED lamp frame, an LED lamp cover, a metal carrier circuit board, and LED chips flip-chips on the metal carrier circuit board in the liquid-cooled high-power LED lamp, the LED chips can emit light when the positive and negative metal plates are connected to the power supply. Using LED chips as light-emitting units, and sealing them with encapsulating fluorescent glue, they can emit light of various colors while being waterproof and dustproof. Then, the light-emitting space is filled with insulating heat dissipation coolant, which greatly improves the heat dissipation capacity of the high-power LED lamp. At the same time, there is no blue light that is harmful to the human eyes. It can meet people's needs in terms of usage cost, safety and health. The structure is simple, and the brightness of the LED chips in the liquid-cooled high-power LED lamp is uniform. It solves the problem of poor heat dissipation in high-power LED lamps in the prior art, which leads to short service life and safety hazards. Attached Figure Description
[0017] To more clearly illustrate the solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0018] Figure 1 This is a structural diagram of the high-power LED lamp with liquid cooling heat dissipation according to the present invention; Figure 2 This is a structural diagram of the high-power LED lamp with liquid cooling heat dissipation according to the present invention.
[0019] In the diagram, 1-LED lamp frame, 2-LED lamp top cover, 3-metal carrier circuit board, 4-LED chip, 5-insulating heat dissipation coolant. Detailed Implementation
[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having” and any variations thereof in the specification, claims and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
[0023] like Figures 1-2As shown, the present invention provides a high-power LED lamp with liquid cooling, comprising an LED lamp frame 1, an LED lamp cover 2, a metal carrier circuit board 3, and LED chips 4 flip-chips mounted on the metal carrier circuit board 3. The LED lamp frame 1 and the LED lamp cover 2 are detachably and sealingly connected, and a tightly fitting sealing ring is provided between the LED lamp frame 1 and the LED lamp cover 2. The LED lamp frame 1 has a light-emitting space filled with insulating and heat-dissipating coolant 5. The metal carrier circuit board 3 is fixedly disposed at the bottom of the light-emitting space and integrally formed with the LED lamp frame 1. The metal carrier circuit board 3 includes a positive electrode metal sheet. The circuit consists of a negative electrode metal sheet and a chip carrier sheet. The chip carrier sheet has two conductive pads for fixing the LED chip pins. The power supply pins of the LED chip are fixedly soldered into the conductive pads for fixing the LED chip pins. The positive electrode metal sheet, negative electrode metal sheet, and chip carrier sheet form a current flow loop in the circuit through the power supply pins of the LED chip. The positive electrode metal sheet can be connected to the positive terminal of the power supply, and the negative electrode metal sheet can be connected to the negative terminal of the power supply. The chip carrier sheet and the LED chip are covered with encapsulating fluorescent adhesive for sealing and insulation. The LED chip can emit light when the positive electrode metal sheet and the negative electrode metal sheet are connected to the power supply. The insulating and heat dissipation coolant 5 is a unidirectional dielectric coolant of model AP-7. In this embodiment, the AP-7 unidirectional dielectric coolant has low viscosity, low dielectric constant, high compatibility, and good light transmittance, which can significantly improve the heat dissipation capacity of high-power LED lamps and make the brightness uniform. When the positive metal plate is connected to the positive terminal of the power supply and the negative metal plate is connected to the negative terminal of the power supply, the LED chip, chip carrier, positive metal plate, negative metal plate, and power supply form a closed circuit. The LED chip can then emit light. Using the LED chip as the light-emitting unit and sealing it with encapsulating fluorescent glue allows it to emit various colors of light while being waterproof and dustproof, without the presence of blue light that is harmful to the human eye, thus meeting people's health needs. All LED chips directly use aluminum foil as the circuit carrier, which allows for a wide conductive line and minimizes the impact of voltage drop, resulting in uniform brightness of the LED chip. Moreover, the heat dissipation performance of the aluminum foil circuit board is much better than that of flexible organic materials. The surface of the aluminum foil will rapidly oxidize to form an insulating aluminum oxide protective film, which can prevent corrosion, improve the service life of liquid-cooled high-power LED lamps, and also improve the safety of liquid-cooled high-power LED lamps.
[0024] like Figures 1-2As shown, the metal carrier circuit board 3 is an aluminum foil circuit board that facilitates heat dissipation. The positive electrode metal sheet, negative electrode metal sheet, and chip carrier sheet are all made of aluminum foil that facilitates heat dissipation. The LED lamp frame 1 includes a base plate and a main frame. The main frame is made of plastic, the base plate is made of aluminum foil that facilitates heat dissipation, and the sealing ring is made of fluoropolymer. The LED lamp cover 2 includes a light-transmitting cover and a cover frame. The cover frame is made of plastic, and the light-transmitting cover is made of transparent glass or transparent acrylic sheet. The metal carrier circuit board 3 is also equipped with a buffer protection resistor, which is connected in series in the current flow circuit of the LED chip. In this embodiment, the sealing ring made of fluoropolymer has the characteristics of high temperature resistance, corrosion resistance, and long service life. It can protect the metal carrier circuit board 3 and the LED chip flip-chip on the metal carrier circuit board 3 in the light-emitting space, greatly improving the service life of the liquid-cooled high-power LED lamp. The aluminum foil base plate can further improve the heat dissipation capacity of the liquid-cooled high-power LED lamp.
[0025] like Figures 1-2As shown, the chip carrier array is positioned between the positive and negative metal sheets. The positive, negative, and chip carrier sheets are not in contact with each other. The positive metal sheet has a positive conductive pad, and the negative metal sheet has a negative conductive pad. Two LED pin fixing conductive pads are connected to the positive and negative conductive pads, respectively. The metal carrier circuit board 3 is made of a complete aluminum foil, laser-cut into positive, negative, and chip carrier sheets. The width of the positive metal sheet is greater than 0.5mm, the width of the negative metal sheet is greater than 0.5mm, and the thickness of the positive, negative, and chip carrier sheets is greater than 0.03mm and less than 0.1mm. The LED pin fixing conductive pads are copper-plated. The power supply pins of the LED chips are fixed to the LED pin fixing conductive pads by soldering. The encapsulating fluorescent adhesive is made of epoxy resin containing phosphor or silicone containing phosphor. In this embodiment, the circuit of the high-power liquid-cooled LED lamp does not require etching. It is directly formed by laser-cutting a metal carrier to create positive and negative electrode metal sheets and a chip carrier, resulting in low production costs and high efficiency. The width of the conductive positive and negative electrode metal sheets is greater than 0.5mm, significantly wider than the circuit etched onto flexible organic materials in FPC light strips. This minimizes current limitation during conduction, reducing the impact on voltage drop in the LED chip, reducing heat generation, and ensuring uniform brightness of the LED chip, thus greatly improving the user experience. The conductive pads are copper-plated, meaning copper is plated onto the metal carrier. The power supply pins are directly soldered to the conductive pads using a die bonder, resulting in a stable and robust structure. The die bonder uses a hot melt die bonder, which is highly efficient, simple to operate, eliminates the need for a tin-plating process, and ensures stable soldering quality. A buffer protection resistor protects electrical components from burnout due to excessive or abnormal current. Epoxy resins are all high molecular weight polymers with the molecular formula (C11H12O3)n. They refer to a class of polymers containing two or more epoxy groups in their molecules. They are condensation products of epichlorohydrin and bisphenol A or polyols. Due to the chemical reactivity of the epoxy groups, they can be ring-opened and cured with various compounds containing active hydrogen to form a network structure. Therefore, it is a thermosetting resin with good light transmittance, dustproof, waterproof, and insulating properties. Silica gel (also known as silica gel) is a highly active adsorbent material, an amorphous substance with the chemical formula mSiO2·nH2O. It does not react with any substance except strong alkalis and hydrofluoric acid, is insoluble in water and any solvent, is non-toxic and odorless, and has stable chemical properties. Different types of silica gel form different microporous structures due to different manufacturing methods. The chemical composition and physical structure of silica gel determine that it has many characteristics that are difficult for other similar materials to replace, such as high adsorption performance, good thermal stability, stable chemical properties, and high mechanical strength.In this embodiment, epoxy resin or silicone containing phosphor is used as the material for encapsulating the light-transmitting adhesive, which can improve the service life and safety of high-power liquid-cooled LED lamps, and at the same time make the brightness of the LED chip more uniform.
[0026] As can be seen from the above, the present invention provides a high-power LED lamp with liquid cooling. This lamp incorporates a matching LED lamp frame, an LED lamp cover, a metal carrier circuit board, and LED chips flip-chip mounted on the metal carrier circuit board. The LED chips emit light when the positive and negative metal plates are connected to a power supply. Using the LED chips as the light-emitting unit, and sealing them with encapsulating fluorescent adhesive, the lamp is waterproof, dustproof, and emits various colors of light. The light-emitting space is then filled with insulating and cooling liquid, significantly improving the heat dissipation capacity of the high-power LED lamp. Simultaneously, it eliminates harmful blue light, meeting the user's needs in terms of cost, safety, and health. The structure is simple, and the LED chips in the liquid-cooled high-power LED lamp exhibit uniform brightness, solving the problems of poor heat dissipation leading to short lifespan and safety hazards in existing high-power LED lamps.
[0027] The specific embodiments described above are preferred embodiments of the present invention and are not intended to limit the specific scope of the present invention. The scope of the present invention includes, but is not limited to, these specific embodiments. All equivalent changes made in accordance with the present invention are within the protection scope of the present invention.
Claims
1. A high-power LED lamp with liquid cooling, characterized in that: The device includes an LED lamp frame, an LED lamp cover, a metal carrier circuit board, and LED chips flip-mounted on the metal carrier circuit board. The LED lamp frame and the LED lamp cover are detachably and sealingly connected, with a tight-fitting sealing ring between them. The LED lamp frame contains a light-emitting space filled with insulating and heat-dissipating coolant. The metal carrier circuit board is fixedly disposed at the bottom of the light-emitting space and integrally formed with the LED lamp frame. The metal carrier circuit board includes a positive electrode metal sheet, a negative electrode metal sheet, and the chip. The chip carrier has two conductive pads for fixing LED chip pins. The power supply pins of the LED chip are fixedly soldered into the conductive pads. The positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier form a current flow loop in the circuit through the power supply pins of the LED chip. The positive electrode metal sheet can be connected to the positive terminal of the power supply, and the negative electrode metal sheet can be connected to the negative terminal of the power supply. The chip carrier and the LED chip are covered with encapsulating fluorescent adhesive for sealing and insulation. The LED chip can emit light when the power supply is connected to the positive electrode metal sheet and the negative electrode metal sheet.
2. The high-power LED lamp with liquid cooling according to claim 1, characterized in that: The insulating and heat-dissipating coolant is a unidirectional dielectric coolant of model AP-7.
3. The high-power LED lamp with liquid cooling according to claim 2, characterized in that: The metal carrier circuit board is an aluminum foil circuit board that is easy to dissipate heat, and the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier sheet are all made of aluminum foil that is easy to dissipate heat.
4. The high-power LED lamp with liquid cooling according to claim 3, characterized in that: The LED lamp frame includes a base plate and a main frame. The main frame is made of plastic, and the base plate is made of aluminum, which is easy to dissipate heat.
5. The high-power LED lamp with liquid cooling according to claim 4, characterized in that: The sealing ring is made of fluororubber.
6. The high-power LED lamp with liquid cooling according to claim 5, characterized in that: The LED lamp cover includes a light-transmitting cover and a cover frame. The cover frame is made of plastic, and the light-transmitting cover is made of transparent glass or transparent acrylic sheet.
7. The high-power LED lamp with liquid cooling according to claim 6, characterized in that: The metal carrier circuit board is also provided with a buffer protection resistor, which is connected in series in the current flow path of the LED chip.
8. The high-power LED lamp with liquid cooling according to claim 7, characterized in that: The chip carrier array is disposed between the positive electrode metal sheet and the negative electrode metal sheet. The positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier array do not contact each other. The positive electrode metal sheet is provided with a positive electrode conductive pad, and the negative electrode metal sheet is provided with a negative electrode conductive pad. The two LED pin fixed conductive pads are respectively connected to the positive electrode conductive pad and the negative electrode conductive pad. The metal carrier circuit board is cut from a complete aluminum foil into the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier array using laser cutting.
9. The high-power LED lamp with liquid cooling according to claim 8, characterized in that: The width of the positive electrode metal sheet is greater than 0.5 mm, the width of the negative electrode metal sheet is greater than 0.5 mm, and the thickness of the positive electrode metal sheet, the negative electrode metal sheet, and the chip carrier sheet is greater than 0.03 mm and less than 0.1 mm.
10. The high-power LED lamp with liquid cooling according to claim 9, characterized in that: The conductive pads for fixing the LED bead pins are copper-plated pads. The power supply pins of the LED chip are fixed to the conductive pads for fixing the LED bead pins by soldering. The encapsulating fluorescent adhesive is made of epoxy resin containing phosphor or silicone containing phosphor.