Semiconductor refrigeration fan capable of isolating cold air from hot air

Abstract

The invention discloses a cold and hot air isolated semiconductor refrigeration fan, and aims to provide a semiconductor refrigeration fan which can effectively isolate cold and hot air of the semiconductor refrigeration fan, avoid mutual interference and influence between the cold and hot air and facilitate reduction of power consumption of a semiconductor refrigerator. A partition plate is arranged in the shell and divides an inner cavity of the shell into a main chamber and a control chamber, the main chamber comprises a power chamber and a refrigerator chamber, a partition plate is arranged in the refrigerator chamber and divides the refrigerator chamber into a heat exchange chamber and a refrigerating chamber, an air inlet, a cold air outlet and a hot air outlet are formed in the shell, the air inlet is communicated with the power chamber, and the cold air outlet is communicated with the refrigerating chamber. The hot air outlet is communicated with the heat exchange chamber; the fan is arranged in the power chamber; the semiconductor refrigerator is arranged in the refrigerator chamber and comprises a cold surface and a hot surface, radiators are arranged on the cold surface and the hot surface, the radiators on the cold surface and the cold surface are located in the refrigerating chamber, and the radiators on the hot surface and the hot surface are located in the heat exchange chamber.

Description

Technical Field

[0001] This invention relates to the field of semiconductor refrigeration technology, and more specifically to a semiconductor refrigeration fan that isolates hot and cold air. Background Technology

[0002] Currently, handheld cooling fans on the market fall into two categories: those using semiconductor cooling and those using superconducting magnetic cooling. Semiconductor cooling fans can only cool the aluminum block on the fan surface or the aluminum block at the air outlet; consumers need to place the aluminum block against their skin to feel a cooling sensation. Furthermore, due to the heat dissipation from the semiconductor cooler, the fan blows out hot air above ambient temperature, affecting user comfort. For example, Chinese Patent Publication No. CN112212540A describes an invention entitled "Neck Hanger Fan with Semiconductor Cooling Function," which includes a bracket and a fan connected to both ends of the bracket. A semiconductor cooling component is located in the middle of the bracket, and this component includes a heat-conducting plate exposed inside the bracket for contact with the user's neck. The cooling effect is achieved by the heat-conducting plate of the central semiconductor cooling component being in contact with the user's neck.

[0003] Superconducting magnetic cooling is actually a way to accelerate the heat dissipation of a semiconductor refrigeration chip. Its principle is to use a liquid with a high thermal conductivity and graphite powder (called a superconducting agent) as a heat transfer medium to transfer the heat from the TEC hot surface to the heat sink fins. The heat is then dissipated into the air by a high-speed rotating fan motor. It still uses semiconductor refrigeration in essence, so the air passing over the heat sink surface is still hot air. The hot air is compressed by high-speed rotation and passes through the cooling block to achieve the effect of cold air. However, the effect of the cold air is also affected by the heat dissipation of the semiconductor refrigeration chip. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor cooling fan that isolates hot and cold air, which can effectively isolate the hot and cold air of the semiconductor cooling fan, avoid mutual interference between the hot and cold air, improve the user experience, and help reduce the power consumption of the semiconductor cooler.

[0005] The technical solution of this invention is: A semiconductor cooling fan with hot and cold air isolation, comprising: The shell has an internal partition plate that divides the shell cavity into a main chamber and a control chamber. The main chamber includes a power chamber and a refrigerator chamber. The refrigerator chamber has a partition plate that divides the refrigerator chamber into a heat exchange chamber and a refrigeration chamber. Both the heat exchange chamber and the refrigeration chamber are connected to the power chamber. The shell has an air inlet, a cold air outlet and a hot air outlet. The air inlet is connected to the power chamber, the cold air outlet is connected to the refrigeration chamber, and the hot air outlet is connected to the heat exchange chamber. The fan located in the power room blows air into the heat exchange room and the refrigeration room; The semiconductor refrigerator in the refrigerator chamber comprises a cold surface and a hot surface, and the cold surface and the hot surface are provided with radiators, the radiator on the cold surface is located in the refrigeration chamber, and the radiator on the hot surface is located in the heat exchange chamber. The specific working process of the cold and hot air isolation semiconductor refrigeration fan is as follows: when the cold and hot air isolation semiconductor refrigeration fan works, the semiconductor refrigerator and the fan work simultaneously. During the normal working process of the semiconductor refrigerator, the temperature difference between the cold surface and the hot surface can reach 70℃, wherein the cold surface absorbs the heat in the refrigeration chamber through the corresponding radiator, and the heat of the hot surface is dissipated to the heat exchange chamber through the corresponding radiator; and the fan blows air into the heat exchange chamber and the refrigeration chamber, discharges the cold air in the refrigeration chamber through the cold air outlet, realizes cold air blowing and cooling, and discharges the hot air in the heat exchange chamber through the hot air outlet, effectively accelerating the heat dissipation of the radiator on the hot surface. In this way, the hot surface and the cold surface of the semiconductor refrigerator can be effectively isolated, the cold and hot air is prevented from interfering with each other, so that cooling and cold air blowing are realized, and the cold and hot air of the semiconductor refrigeration fan can be effectively isolated, the cold and hot air in the shell is prevented from interfering with each other, and the user experience is improved. At the same time, during the working process of the fan, air can be blown into the refrigeration chamber to form cold air at the cold air outlet, and air can also be blown into the heat exchange chamber to discharge the hot air in the heat exchange chamber through the hot air outlet, effectively improving the heat exchange efficiency of the radiator on the hot surface, thereby reducing the power consumption of the semiconductor module.

[0006] As a preferred, the shell is surrounded by two end plates and a side wall, the partition plate comprises two guide plates in a splayed distribution, the semiconductor refrigerator is located between the two guide plates, one side of the guide plate is close to or abuts against the semiconductor refrigerator, the other side of the guide plate is inclined to the heat exchange chamber and connected with the side wall or one end plate, and the side wall is provided with a cold air outlet corresponding to the guide plate. In this way, the guide plate and the cold air outlet are arranged, and during the blowing process of the fan into the refrigeration chamber, the cold air flow in the refrigeration chamber can flow along the guide plate to both sides of the shell and be discharged through the corresponding cold air outlet, thereby reducing the wind resistance of the cold air flow in the refrigeration chamber, improving the cold air effect, and reducing the noise.

[0007] As a preferred, one end of the two guide plates is connected with the partition plate, and the other end of the two guide plates extends into the power chamber. In this way, the guide area of the guide plate can be increased, the cold air flow in the refrigeration chamber can be better guided, and the cold air effect can be improved.

[0008] As preferred, the controller is arranged in the control chamber, the refrigeration chamber is located between the control chamber and the power chamber, a plurality of communication holes are arranged on the partition plate and communicate the refrigeration chamber and the control chamber, and a heat dissipation opening is further arranged on the shell and communicates with the control chamber. Since the controller generates heat during operation, the controller is prone to failure and affects the service life of the controller when working in a high-temperature environment for a long time. To solve this problem, the refrigeration chamber is arranged between the control chamber and the power chamber, a small part of the cold air flow in the refrigeration chamber can enter the control chamber through the communication hole during the blowing process of the fan to the refrigeration chamber, and then is discharged through the heat dissipation opening, so as to cool the control chamber and the controller, effectively solving the problem that the controller is prone to failure and affects the service life of the controller when working in a high-temperature environment for a long time.

[0009] As preferred, the controller is arranged in the control chamber, the shell is surrounded by two end plates and a side wall plate, the power chamber is located between the refrigeration chamber and the control chamber, and the side wall plate comprises a semicircular surface, and the cold air outlet is arranged on the semicircular surface and comprises a plurality of strip-shaped air outlets which are distributed along the semicircular surface in sequence. The strip-shaped air outlets of the cold air outlet of the present application are distributed along the semicircular surface in sequence, so that super-wide-angle cold air blowing can be realized, and user experience is further improved.

[0010] As preferred, the partition plate comprises a U-shaped side partition plate arranged on one of the end plates, the semiconductor refrigeration chamber is located in the U-shaped side partition plate, and the hot air outlet and the side partition plate are arranged on the same end plate. In this way, the arrangement of the partition plate is facilitated, the heat exchange chamber is formed, and the interference between the cold air and the hot air in the shell is avoided.

[0011] As preferred, the shell is surrounded by two end plates and a side wall plate, the air inlet is arranged on one of the end plates, the hot air outlet is arranged on the other end plate, and the cold air outlet is arranged on the side wall plate. In the present application, the air inlet, the hot air outlet and the cold air outlet are arranged reasonably, so that during the operation of the semiconductor refrigeration fan, the space outside the shell enters the power chamber in the shell from one end of the shell, the hot air discharged from the hot air outlet is discharged from the other end of the shell, and the cold air blown out of the cold air outlet is blown out through the side surface of the shell. In this way, the hot air discharged from the hot air outlet can be effectively prevented from entering the shell again through the air inlet, thereby affecting the refrigeration effect of the semiconductor refrigeration chamber, and the cold air blown out of the cold air outlet and the hot air discharged from the hot air outlet can be effectively prevented from interfering with each other, so that the user can fully enjoy the effect of cold air refrigeration and avoid being affected by the hot air, thereby further improving the user experience.

[0012] As preferred, the aluminum ice compress is arranged on the outer surface of the shell corresponding to the refrigeration device, the aluminum ice compress penetrates through the shell and extends into the refrigeration chamber, and one end surface of the aluminum ice compress is close to or abuts against the heat radiator on the cold surface. In this way, the user can attach the aluminum ice compress to the human skin to enjoy the ice compress effect, and the ice compress can also meet the scene of ice compress for part of joint sprain. In addition, in addition to the ice compress for the human body and the cold air blowing, the matched sleeve structure can cool the mobile phone, realizing one machine with multiple functions.

[0013] As preferred, the refrigeration working mode and the heating working mode are further included, when the semiconductor refrigeration fan is in the refrigeration working mode, the temperature of the cold surface of the semiconductor refrigeration device is lower than the temperature of the hot surface, and the cold air outlet blows cold air. When the semiconductor refrigeration fan is in the heating working mode, the temperature of the cold surface of the semiconductor refrigeration device is higher than the temperature of the hot surface, and the cold air outlet blows hot air. In this way, the semiconductor refrigeration fan can realize the integration of refrigeration and heating, and replace the hot air blower to blow hot air. Specifically, the user can select the refrigeration working mode for cooling or the heating working mode for heating according to the needs, for example, when the cold air is needed in summer, the refrigeration working mode is selected, at this time, the temperature of the cold surface of the semiconductor refrigeration device is lower than the temperature of the hot surface, the cold air outlet blows cold air, and cooling is performed; when the air temperature is low, the heating working mode is selected, at this time, the temperature of the cold surface of the semiconductor refrigeration device is higher than the temperature of the hot surface, the cold air outlet blows hot air, and heating is performed.

[0014] As preferred, the hanging rope member is arranged on the outer side of the shell, and the hanging rope hole is arranged on the hanging rope member. In this way, the hanging rope can be connected on the hanging rope member, and the user can hang the semiconductor refrigeration fan on the neck or use it on the arm and other parts.

[0015] The beneficial effects of the present application are: Firstly, the fan blows air into the heat exchange chamber and the refrigeration chamber, the cold air in the refrigeration chamber is discharged through the cold air outlet, refrigeration is realized, and the hot air in the heat exchange chamber is discharged through the hot air outlet, the heat dissipation of the hot surface and the heat radiator on the hot surface is effectively accelerated, so that the hot surface and the cold surface of the semiconductor refrigeration device are effectively isolated, the interference between the cold air and the hot air in the shell is avoided, the cold air blowing and refrigeration are realized, and the user experience is improved.

[0016] Secondly, during the operation of the fan, the fan can also blow air into the heat exchange chamber, the hot air in the heat exchange chamber is discharged through the hot air outlet, the heat exchange efficiency of the hot surface and the heat radiator on the hot surface is effectively improved, and the power consumption of the semiconductor module is reduced.

[0017] Thirdly, the user can enjoy the effect of ice compress by attaching the aluminum ice compress patch on the human skin, and also can meet the scene of ice compress for part of joint sprain; in addition, besides ice compress and cold air blowing for human body, the matched card sleeve structure can cool the mobile phone, and realizes one machine with multiple uses.

[0018] Fourthly, the semiconductor refrigeration fan can realize the integration of refrigeration and heating, and replace the hot air blower to blow hot air. The user can select the refrigeration working mode for cooling or the heating working mode for heating according to the needs. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a three-dimensional structure schematic diagram of a first embodiment of a cold and hot air isolated semiconductor refrigeration fan of the application.

[0020] Figure 2 is a sectional structure schematic diagram of the first embodiment of the cold and hot air isolated semiconductor refrigeration fan of the application.

[0021] Figure 3 is Figure 2 is a sectional structure schematic diagram of the first embodiment of the cold and hot air isolated semiconductor refrigeration fan of the application.

[0022] Figure 4 is a three-dimensional structure schematic diagram of a second embodiment of a cold and hot air isolated semiconductor refrigeration fan of the application.

[0023] Figure 5 is a sectional structure schematic diagram of the second embodiment of the cold and hot air isolated semiconductor refrigeration fan of the application.

[0024] Figure 6 is Figure 5 is a sectional structure schematic diagram of the second embodiment of the cold and hot air isolated semiconductor refrigeration fan of the application.

[0025] In the figure: The shell 1, the end plate 1.1, the side wall 1.2, the isolation plate 1.3, the control chamber 1.4, the refrigeration device chamber 1.5, the heat exchange chamber 1.52, the refrigeration chamber 1.51, the power chamber 1.6, the communication hole 1.7; The air inlet 2; The cold air outlet 3; The heat dissipation port 4; The aluminum ice compress patch 5; The hanging rope 6; The fan 7; The semiconductor refrigeration device 8, the heat sink 8.1; The controller 9; The partition plate 10, the flow guide plate 10.1, the side partition plate 10.2; The hot air outlet 11. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Specific Implementation Example 1, such as Figure 1 , Figure 2 , Figure 3 As shown, a semiconductor cooling fan with hot and cold air isolation includes a housing 1, a fan 7, a controller 9, and a semiconductor cooler 8.

[0027] The housing 1 has an internal partition plate 1.3, which divides the interior of the housing 1 into a main chamber and a control chamber 1.4. The controller 9 is located in the control chamber 1.4. The fan 7 and the semiconductor cooler 8 are connected to the controller 9 via signal lines. The main chamber includes an interconnected power chamber 1.6 and a cooler chamber 1.5. The cooler chamber 1.5 has a partition plate 10, which divides the cooler chamber 1.5 into a heat exchange chamber 1.52 and a cooling chamber 1.51. Both the heat exchange chamber 1.52 and the cooling chamber 1.51 are connected to the power chamber 1.6. The housing 1 has an air inlet 2, a cold air outlet 3, and a hot air outlet 11. The air inlet 2 is connected to the power chamber 1.6, the cold air outlet 3 is connected to the cooling chamber 1.51, and the hot air outlet 11 is connected to the heat exchange chamber 1.52.

[0028] Fan 7 is located inside the power compartment 1.6. It blows air into the heat exchange compartment 1.52 and the cooling compartment 1.51.

[0029] A semiconductor cooler 8 is located within a cooler chamber 1.5. The semiconductor cooler 8 includes a cold side and a hot side. Both the cold side and the hot side are equipped with heat sinks 8.1. The heat sinks 8.1 on the cold side are located within the cooler chamber 1.51, and the heat sinks 8.1 on the hot side are located within the heat exchange chamber 1.52.

[0030] The specific work of the cold and hot air isolated semiconductor refrigeration fan of the embodiment is as follows: when the cold and hot air isolated semiconductor refrigeration fan works, the semiconductor refrigeration device 8 and the fan 7 work simultaneously. In the normal working process of the semiconductor refrigeration device 8, the temperature difference between the cold face and the hot face can reach 70℃, wherein the cold face absorbs the heat in the refrigeration chamber 1.51 through the corresponding heat sink 8.1, and the heat of the hot face is dissipated to the heat exchange chamber 1.52 through the corresponding heat sink 8.1; and the fan 7 blows air into the heat exchange chamber 1.52 and the refrigeration chamber 1.51, and the cold air in the refrigeration chamber 1.51 is discharged through the cold air outlet 3 to realize the blowing of cold air for cooling; at the same time, the hot air in the heat exchange chamber 1.52 is discharged through the hot air outlet 11, effectively accelerating the heat dissipation of the heat sink 8.1 on the hot face and the cold face. In this way, the hot face and the cold face of the semiconductor refrigeration device 8 can be effectively isolated, and the mutual interference between the cold air and the hot air is avoided, so that the blowing of cold air for cooling is realized, and the cold air and the hot air of the semiconductor refrigeration fan can be effectively isolated, the mutual interference between the cold air and the hot air in the shell 1 is avoided, and the user experience is improved. At the same time, in the working process of the fan 7, air can not only be blown into the refrigeration chamber 1.51 to form cold air at the cold air outlet 3, but also be blown into the heat exchange chamber 1.52 to discharge the hot air in the heat exchange chamber 1.52 through the hot air outlet 11, effectively improving the heat exchange efficiency of the heat sink 8.1 on the hot face and the cold face, thereby reducing the power consumption of the semiconductor module.

[0031] Specific embodiment two, as Figure 1 、 Figure 2 、 Figure 3 indicated, a cold and hot air isolated semiconductor refrigeration fan, comprising a shell 1, a fan 7, a controller 9 and a semiconductor refrigeration device 8.

[0032] The shell 1 is provided with a partition plate 1.3, and the partition plate 1.3 divides the inner cavity of the shell 1 into a main chamber and a control chamber 1.4. The controller 9 is arranged in the control chamber 1.4. The fan 7 and the semiconductor refrigeration device 8 are connected to the controller 9 through signal lines respectively. The main chamber comprises a power chamber 1.6 and a refrigeration device chamber 1.5 which are in communication with each other. The refrigeration device chamber 1.5 is provided with a partition plate 10, and the partition plate 10 divides the refrigeration device chamber 1.5 into a heat exchange chamber 1.52 and a refrigeration chamber 1.51. The heat exchange chamber 1.52 and the refrigeration chamber 1.51 are in communication with the power chamber 1.6. The shell 1 is provided with an air inlet 2, a cold air outlet 3 and a hot air outlet 11. The air inlet 2 is in communication with the power chamber 1.6, the cold air outlet 3 is in communication with the refrigeration chamber 1.51, and the hot air outlet 11 is in communication with the heat exchange chamber 1.52.

[0033] The fan 7 is arranged in the power chamber 1.6. Air is blown into the heat exchange chamber 1.52 and the refrigeration chamber 1.51.

[0034] The semiconductor refrigerator 8 is arranged in the refrigerator chamber 1.5. The semiconductor refrigerator 8 comprises a cold face and a hot face. Specifically, the semiconductor refrigerator 8 comprises two substrates and a semiconductor material arranged between the two substrates, wherein the outer surface of one substrate constitutes the cold face and the outer surface of the other substrate constitutes the hot face. The cold face and the hot face are both provided with a radiator 8.1. The cold face and the radiator 8.1 on the cold face are located in the refrigerator chamber 1.51, and the hot face and the radiator 8.1 on the hot face are located in the heat exchange chamber 1.52.

[0035] In one example, the radiator 8.1 comprises a plurality of heat dissipation rods.

[0036] In another example, the radiator 8.1 comprises a plurality of heat dissipation fins, and heat dissipation channels are formed between the heat dissipation fins of the radiator 8.1. One end of the heat dissipation channels faces the power chamber 1.6.

[0037] In the embodiment, the shell 1 is surrounded by two end plates 1.1 and side plates 1.2. The isolation plate 1.3 connects the two end plates 1.1. The partition plate 10 comprises two left and right flow guide plates 10.1 arranged in an eight-shaped manner. The semiconductor refrigerator 8 is located between the two flow guide plates 10.1. One side of the flow guide plate 10.1 is close to or abuts against the semiconductor refrigerator 8. The other side of the flow guide plate 10.1 is inclined towards the heat exchange chamber 1.52 and connected with the side plate 1.2 or one of the end plates 1.1. In the embodiment, the other side of the flow guide plate 10.1 is inclined towards the heat exchange chamber 1.52 and connected with the edge of the side plate 1.2. The side plate 1.2 is provided with a cold air outlet 3 corresponding to the flow guide plate 10.1. With the arrangement of the flow guide plate 10.1 and the cold air outlet 3, during the blowing process of the fan 7 towards the refrigerator chamber 1.51, the cold air flow in the refrigerator chamber 1.51 can flow along the flow guide plate 10.1 to both sides of the shell 1 and be discharged through the corresponding cold air outlet 3, thereby reducing the wind resistance of the cold air flow in the refrigerator chamber 1.51, which is conducive to improving the cold air effect and reducing the noise.

[0038] The specific work of the cold and hot air isolated semiconductor refrigeration fan of the embodiment is as follows: when the cold and hot air isolated semiconductor refrigeration fan works, the semiconductor refrigeration device 8 and the fan 7 work simultaneously. During the normal working process of the semiconductor refrigeration device 8, the temperature difference between the cold face and the hot face can reach 70 DEG C, wherein the cold face absorbs the heat in the refrigeration chamber 1.51 through the corresponding radiator 8.1, and the heat of the hot face is dissipated to the heat exchange chamber 1.52 through the corresponding radiator 8.1; and the fan 7 blows air into the heat exchange chamber 1.52 and the refrigeration chamber 1.51, and the cold air in the refrigeration chamber 1.51 is discharged through the cold air outlet 3, so as to realize the blowing of cold air for cooling; at the same time, the hot air in the heat exchange chamber 1.52 is discharged through the hot air outlet 11, so as to effectively accelerate the heat dissipation of the radiator 8.1 on the hot face and the hot face. In this way, the hot face and the cold face of the semiconductor refrigeration device 8 can be effectively isolated, the mutual interference between the cold air and the hot air is avoided, so as to realize the blowing of cold air for cooling, and thus the cold air and the hot air of the semiconductor refrigeration fan can be effectively isolated, the mutual interference between the cold air and the hot air in the shell 1 is avoided, and the user experience is improved. At the same time, during the working process of the fan 7, the fan 7 not only can blow air into the refrigeration chamber 1.51 to form cold air at the cold air outlet 3, but also can blow air into the heat exchange chamber 1.52 to discharge the hot air in the heat exchange chamber 1.52 through the hot air outlet 11, so as to effectively improve the heat exchange efficiency of the radiator 8.1 on the hot face and the hot face, thereby reducing the power consumption of the semiconductor module.

[0039] Specifically, the cold and hot air isolated semiconductor refrigeration fan further comprises a battery. The battery is arranged in the control chamber 1.4. The battery supplies power for the controller 9, the fan 7 and the semiconductor refrigeration device 8. In the embodiment, the fan 7 is a direct current fan 7.

[0040] In the embodiment, as shown in Figure 2 The refrigeration chamber 1.5 is located between the control chamber 1.4 and the power chamber 1.6. The isolation plate 1.3 is provided with a plurality of communication holes 1.7 which communicate the refrigeration chamber 1.51 and the control chamber 1.4. The shell 1 is further provided with a heat dissipation opening 4 which communicates with the control chamber 1.4. In the embodiment, the heat dissipation opening 4 is arranged on the side wall plate 1.2 of the shell 1. Of course, the heat dissipation opening is also arranged on the end plate 1.1 of the shell 1. Since the controller 9 generates heat during the working process, the controller 9 works in a high temperature state for a long time, which is prone to failure and affects the service life of the controller 9. In order to solve this problem, the refrigeration chamber 1.5 is arranged between the control chamber 1.4 and the power chamber 1.6, and a small part of the cold air flow in the refrigeration chamber 1.51 can enter the control chamber 1.4 through the communication hole 1.7 during the blowing of air into the refrigeration chamber 1.51 by the fan 7, and then is discharged through the heat dissipation opening, so as to cool the control chamber 1.4 and the controller 9, thereby effectively solving the problem that the controller 9 works in a high temperature state for a long time, which is prone to failure and affects the service life of the controller 9.

[0041] Further, asFigure 3 As shown, one end of the two flow guide plates 10.1 is connected with the isolation plate 1.3, and the other end of the two flow guide plates 10.1 extends into the power chamber 1.6. In this way, the flow area of the flow guide plate 10.1 can be increased, and the flow guide effect on the cold air in the refrigeration chamber 1.51 is better, which is beneficial to improve the cold air effect.

[0042] Further, as shown in Figure 1 , Figure 3 , the air inlet 2 is arranged on one end plate 1.1. The hot air outlet 11 is arranged on the other end plate 1.1. The cold air outlet 3 is arranged on the side wall 1.2. The present scheme reasonably arranges the air inlet 2, the hot air outlet 11 and the cold air outlet 3, so that during the operation of the semiconductor refrigeration fan, the space outside the shell 1 enters the power chamber 1.6 in the shell 1 from one end of the shell 1, the hot air discharged from the hot air outlet 11 is discharged from the other end of the shell 1, and the cold air blown out of the cold air outlet 3 is blown out through the side of the shell 1. In this way, it can effectively avoid the hot air discharged from the hot air outlet 11 re-entering the shell 1 through the air inlet 2, which affects the refrigeration effect of the semiconductor refrigerator 8; and it can effectively avoid the circulation interference between the cold air blown out of the cold air outlet 3 and the hot air discharged from the hot air outlet 11 (the cold air blown out of the cold air outlet 3 is perpendicular to the hot air discharged from the hot air outlet 11), so that the user can fully enjoy the effect of cold air refrigeration and avoid being affected by the hot air, thereby further improving the user experience.

[0043] Specifically, as shown in Figure 4 , Figure 5 , Figure 6 , a cold and hot air isolated semiconductor refrigeration fan includes a shell 1, a fan 7, a controller 9 and a semiconductor refrigerator 8.

[0044] The shell 1 is provided with an isolation plate 1.3, which divides the inner cavity of the shell 1 into a main chamber and a control chamber 1.4. The controller 9 is arranged in the control chamber 1.4. The fan 7 and the semiconductor refrigerator 8 are respectively connected with the controller 9 through signal lines. The main chamber includes a power chamber 1.6 and a refrigerator chamber 1.5 which are in communication with each other. The refrigerator chamber 1.5 is provided with a partition plate 10, which divides the refrigerator chamber 1.5 into a heat exchange chamber 1.52 and a refrigeration chamber 1.51. The heat exchange chamber 1.52 and the refrigeration chamber 1.51 are in communication with the power chamber 1.6. The shell 1 is provided with an air inlet 2, a cold air outlet 3 and a hot air outlet 11. The air inlet 2 is in communication with the power chamber 1.6, the cold air outlet 3 is in communication with the refrigeration chamber 1.51, and the hot air outlet 11 is in communication with the heat exchange chamber 1.52.

[0045] The fan 7 is arranged in the power chamber 1.6. It blows air into the heat exchange chamber 1.52 and the refrigeration chamber 1.51.

[0046] The semiconductor refrigerator 8 is arranged in the refrigerator chamber 1.5. The semiconductor refrigerator 8 comprises a cold face and a hot face. Specifically, the semiconductor refrigerator 8 comprises two substrates and a semiconductor material arranged between the two substrates, wherein the outer surface of one substrate constitutes the cold face and the outer surface of the other substrate constitutes the hot face. The cold face and the hot face are both provided with a heat sink 8.1. The cold face and the heat sink 8.1 on the cold face are located in the refrigerator chamber 1.51, and the hot face and the heat sink 8.1 on the hot face are located in the heat exchange chamber 1.52.

[0047] In one example, the heat sink 8.1 comprises a plurality of heat dissipation rods.

[0048] In another example, the heat sink 8.1 comprises a plurality of heat dissipation fins, and heat dissipation channels are formed between the heat dissipation fins of the heat sink 8.1. One end of the heat dissipation channels faces the power chamber 1.6.

[0049] In this embodiment, the shell 1 is surrounded by two end plates 1.1 and side plates 1.2. The partition plate 10 comprises a U-shaped side partition plate 10.2. The side partition plate 10.2 is arranged on one of the end plates 1.1. The side partition plate 10.2 and the other end plate 1.1 have a gap therebetween. The opening of the U-shaped side partition plate 10.2 faces the power chamber 1.6. The semiconductor refrigerator 8 is located in the U-shaped side partition plate 10.2. The edge of the U-shaped side partition plate 10.2 is close to or abuts against the semiconductor refrigerator 8. The hot air outlet 11 and the side partition plate 10.2 are arranged on the same end plate 1.1. In this way, the arrangement of the partition plate 10 can be facilitated, the heat exchange chamber 1.52 is formed, and the cold and hot air in the shell 1 are prevented from interfering with each other.

[0050] The specific work of the cold and hot air isolated semiconductor refrigeration fan of the embodiment is as follows: when the cold and hot air isolated semiconductor refrigeration fan works, the semiconductor refrigeration device 8 and the fan 7 work simultaneously. During the normal working process of the semiconductor refrigeration device 8, the temperature difference between the cold face and the hot face can reach 70℃, wherein the cold face absorbs the heat in the refrigeration chamber 1.51 through the corresponding heat sink 8.1, and the heat of the hot face is dissipated to the heat exchange chamber 1.52 through the corresponding heat sink 8.1; and the cold air in the refrigeration chamber 1.51 is blown out through the cold air outlet 3, realizing the blowing of cold air for cooling; at the same time, the hot air in the heat exchange chamber 1.52 is discharged through the hot air outlet 11, effectively accelerating the heat dissipation of the heat sink 8.1 on the hot face and the cold face. In this way, the hot face and the cold face of the semiconductor refrigeration device 8 can be effectively isolated, and the mutual interference between the cold air and the hot air is avoided, so that the blowing of cold air for cooling is realized, and thus the cold air and the hot air of the semiconductor refrigeration fan can be effectively isolated, the mutual interference between the cold air and the hot air in the shell 1 is avoided, and the user experience is improved. At the same time, during the working process of the fan 7, not only can the fan 7 blow air into the refrigeration chamber 1.51 to form cold air at the cold air outlet 3, but also can blow air into the heat exchange chamber 1.52 to discharge the hot air in the heat exchange chamber 1.52 through the hot air outlet 11, effectively improving the heat exchange efficiency of the heat sink 8.1 on the hot face and the cold face, thereby reducing the power consumption of the semiconductor module.

[0051] Specifically, the cold and hot air isolated semiconductor refrigeration fan further comprises a battery. The battery is arranged in the control chamber 1.4. The battery supplies power to the controller 9, the fan 7 and the semiconductor refrigeration device 8. In the embodiment, the fan 7 is a direct current fan 7.

[0052] In the embodiment, as shown in Figure 5 , the power chamber 1.6 is located between the refrigeration device and the control chamber 1.4. The side wall 1.2 comprises a semicircular surface. The cold air outlet 3 is arranged on the semicircular surface, and the cold air outlet 3 comprises a plurality of strip-shaped air outlets which are distributed along the circumference of the semicircular surface in sequence. The plurality of strip-shaped air outlets of the cold air outlet 3 which are distributed along the circumference of the semicircular surface in sequence can realize the blowing of cold air with an ultra-wide angle, further improving the user experience.

[0053] In the embodiment, the side wall 1.2 comprises two semicircular surfaces which are symmetrically distributed, the cold air outlet 3 is arranged on one of the semicircular surfaces, and the other semicircular surface constitutes a side wall of the control chamber 1.4.

[0054] Further, as shown in Figure 4 , Figure 6As shown, the air inlet 2 is arranged on one end plate 1.1. The hot air outlet 11 is arranged on the other end plate 1.1. The cold air outlet 3 is arranged on the side wall 1.2. The present scheme reasonably arranges the air inlet 2, the hot air outlet 11 and the cold air outlet 3, so that during the operation of the semiconductor cooling fan, the space outside the casing 1 enters the power chamber 1.6 in the casing 1 from one end of the casing 1, the hot air discharged from the hot air outlet 11 is discharged from the other end of the casing 1, and the cold air blown out by the cold air outlet 3 is blown out through the side of the casing 1. In this way, it can effectively avoid the hot air discharged from the hot air outlet 11 from entering the casing 1 again through the air inlet 2, which affects the cooling effect of the semiconductor refrigerator 8. It can also effectively avoid the circulation interference between the cold air blown out by the cold air outlet 3 and the hot air discharged from the hot air outlet 11 (the cold air blown out by the cold air outlet 3 is perpendicular to the hot air discharged from the hot air outlet 11), so that the user can fully enjoy the cooling effect of the cold air, avoid the influence of the hot air, and further improve the user experience.

[0055] In a fourth embodiment, the remaining structures of the present embodiment refer to the first embodiment, the second embodiment or the third embodiment, and the difference is that, As shown in Figure 1 , Figure 4 A semiconductor cooling fan with cold and hot air isolation also includes an aluminum ice compress 5. The aluminum ice compress 5 is arranged on the outer surface of the casing 1 corresponding to the refrigerator. The aluminum ice compress 5 penetrates the outer shell and extends into the cooling chamber 1.51, and one end surface of the aluminum ice compress 5 is close to or abuts against the heat sink 8.1 on the cold surface.

[0056] A hanging rope member 6 is arranged on the outer side of the casing 1, and a hanging rope hole is arranged on the hanging rope member 6. In actual use, a hanging rope is connected to the hanging rope member. The hanging rope member is one or more.

[0057] The user usage modes include, Neck hanging usage, the semiconductor cooling fan is hung in front of the chest through the hanging rope, the cold air outlet 3 can blow the face and lower limbs of the human body, realizing the cooling of the upper and lower body; at the same time, the ice compress is attached to the clothes of the human body, playing an ice compress cooling role.

[0058] Binding usage, the user fixes the semiconductor cooling fan on the arm or ankle through the hanging rope or the clamping sleeve kit, realizing the ice compress cooling purpose, for example, meeting the scene of ice compress cooling for part of joint sprain; in addition, in addition to ice compressing and blowing cold air to the human body, the clamping sleeve structure matched with the semiconductor cooling fan can cool the mobile phone, realizing one machine with multiple uses.

[0059] Further, the casing 1 is also provided with a fan 7 gear, for example, a three-gear fan 7 gear, for adjusting the air volume of the fan 7. The user can select different fan 7 gears according to needs, further improving the user experience.

[0060] Further, a semiconductor cooling fan with cold and hot air isolation also includes a cooling working mode and a heating working mode.

[0061] When the semiconductor refrigeration fan is in the refrigeration mode, the temperature of the cold face of the semiconductor refrigerator 8 is lower than that of the hot face, and the cold air outlet 3 blows cold air. Specifically, when the semiconductor refrigeration fan is in the refrigeration mode, the controller 9 controls the direction of the current flowing into the semiconductor refrigerator 8, so that the temperature of the cold face of the semiconductor refrigerator 8 is lower than that of the hot face, and the cold air outlet 3 blows cold air.

[0062] When the semiconductor refrigeration fan is in the heating mode, the temperature of the cold face of the semiconductor refrigerator 8 is higher than that of the hot face, and the cold air outlet 3 blows hot air. Specifically, when the semiconductor refrigeration fan is in the heating mode, the controller 9 controls the direction of the current flowing into the semiconductor refrigerator 8, so that the direction of the current in the semiconductor refrigerator 8 in the heating mode is opposite to that in the refrigeration mode, so that the temperature of the cold face of the semiconductor refrigerator 8 is higher than that of the hot face, and the cold air outlet 3 blows hot air.

[0063] Thus, the semiconductor refrigeration fan of the present application can realize the integration of refrigeration and heating, and replace the hot air blower to blow hot air. Specifically, the user can select the refrigeration mode for cooling or the heating mode for heating according to the needs, for example, when the cold air is needed in summer, the refrigeration mode is selected, at this time, the temperature of the cold face of the semiconductor refrigerator 8 is lower than that of the hot face, and the cold air outlet 3 blows cold air for cooling; when the temperature is low, the heating mode is selected, at this time, the temperature of the cold face of the semiconductor refrigerator 8 is higher than that of the hot face, and the cold air outlet 3 blows hot air for heating.

[0064] In actual production, a mode selection switch or button can be arranged on the shell 1, so that the user can conveniently select the refrigeration mode or the heating mode.

[0065] The above is only the preferred embodiment of the present application, and does not limit the present application, any simple modification, change and equivalent transformation of the above embodiment according to the technical essence of the present application are still within the protection scope of the technical solution of the present application.

Claims

1. A semiconductor cooling fan that isolates hot and cold air, characterized in that, include: The shell has an internal partition plate that divides the shell cavity into a main chamber and a control chamber. The main chamber includes a power chamber and a refrigerator chamber. The refrigerator chamber has a partition plate that divides the refrigerator chamber into a heat exchange chamber and a refrigeration chamber. Both the heat exchange chamber and the refrigeration chamber are connected to the power chamber. The shell has an air inlet, a cold air outlet and a hot air outlet. The air inlet is connected to the power chamber, the cold air outlet is connected to the refrigeration chamber, and the hot air outlet is connected to the heat exchange chamber. The fan located in the power room blows air into the heat exchange room and the refrigeration room; A semiconductor refrigerator located in a refrigerator chamber includes a cold side and a hot side. Both the cold side and the hot side are equipped with heat sinks. The heat sinks on the cold side and the hot side are located in the refrigerator chamber, while the heat sinks on the hot side and the hot side are located in the heat exchange chamber.

2. A semiconductor cooling fan with hot and cold air isolation according to claim 1, characterized in that, The housing is formed by two end plates and a side plate. The partition plate includes two guide plates arranged in a figure-eight shape. The semiconductor cooler is located between the two guide plates. One side of the guide plate is close to or abuts against the semiconductor cooler. The other side of the guide plate is inclined towards the heat exchange chamber and connected to the side plate or one end plate. Cold air outlets are provided on the side plate at the corresponding parts of the guide plates.

3. A semiconductor cooling fan with hot and cold air isolation according to claim 2, characterized in that, One end of each of the two deflectors is connected to the isolation plate, and the other end of each deflector extends into the power chamber.

4. A semiconductor cooling fan with hot and cold air isolation according to claim 1, 2, or 3, characterized in that, It also includes a controller, which is located in the control room. The refrigeration chamber is located between the control room and the power room. The isolation plate is provided with several connecting holes that connect the refrigeration chamber and the control room. The housing is also provided with heat dissipation vents that are connected to the control room.

5. A semiconductor cooling fan with hot and cold air isolation according to claim 1, characterized in that, It also includes a controller, which is located in the control room. The housing is formed by two end plates and side panels. The power room is located between the refrigerator and the control room. The side panels include a semi-circular arc surface. The cold air outlet is located on the semi-circular arc surface. Several strip-shaped air outlets are distributed sequentially along the circumference of the semi-circular arc surface.

6. A semiconductor cooling fan with hot and cold air isolation according to claim 5, characterized in that, The partition plate includes side partitions arranged in a U-shape, with the side partitions disposed on one of the end plates. The semiconductor cooler is located inside the U-shaped side partitions, and the hot air outlet is disposed on the same end plate as the side partitions.

7. A semiconductor cooling fan with hot and cold air isolation according to claim 1, characterized in that, The housing is formed by two end plates and a side plate. The air inlet is located on one end plate, the hot air outlet is located on the other end plate, and the cold air outlet is located on the side plate.

8. A semiconductor cooling fan with hot and cold air isolation according to claim 1, 2, 3, 5, 6, or 7, characterized in that, It also includes aluminum ice packs, which are placed on the outer surface of the housing corresponding to the cooler. The aluminum ice packs pass through the housing and extend into the cooling chamber, with one end of the aluminum ice packs approaching or abutting against the radiator on the cold surface.

9. A semiconductor cooling fan with hot and cold air isolation according to claim 1, 2, 3, 5, 6, or 7, characterized in that, It also includes a cooling mode and a heating mode. When the semiconductor cooling fan is in the cooling mode, the temperature of the cold side of the semiconductor cooler is lower than the temperature of the hot side, and the cold air outlet blows cold air. When the semiconductor cooling fan is in heating mode, the temperature of the cold side of the semiconductor cooler is higher than the temperature of the hot side, and hot air is blown out of the cold air outlet.

10. A semiconductor cooling fan with hot and cold air isolation according to claim 1, 2, 3, 5, 6, or 7, characterized in that, The outer surface of the housing is provided with a hanging rope component, and the hanging rope component is provided with a hanging rope hole.

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