A fast-feedback semiconductor wafer sensor calibration device and calibration method

Abstract

This invention relates to the field of sensor calibration, and provides a fast-feedback semiconductor wafer sensor calibration device and method. The device includes a calibration equipment housing and a base. The housing is connected to the top wall of the base. A storage box is connected to the base, and a second lifting drive mechanism is connected to the inner wall of the storage cavity. Two or more support mechanisms are slidably connected to the inner wall of the storage cavity. Each support mechanism includes a connecting plate, and C-shaped frames three and four are connected to the connecting plate. The second lifting drive mechanism is connected to all the connecting plates. A sensor transport mechanism includes a sliding plate and a horizontal drive mechanism. The horizontal drive mechanism is connected to the base and the sliding plate. A first lifting drive mechanism is connected to the sliding plate, and a lifting plate is connected to the first lifting drive mechanism. A wafer holder and a device base are connected to the lifting plate, and a negative pressure fan is provided on the wafer holder. This invention enables automatic insertion and removal of the sensor body from the calibration equipment housing, improving safety and efficiency.

Description

Technical Field

[0001] This invention relates to the field of sensor calibration technology, and more specifically to a fast-feedback semiconductor wafer sensor calibration device and calibration method. Background Technology

[0002] Chinese utility model patent CN221594134U discloses a temperature calibration device for wafer temperature sensors. The device includes a calibration equipment housing, within which are an insulating container, a heating wire, and a temperature probe. The insulating container is used to achieve a uniform and stable temperature field; the heating wire is used to heat the insulating container; and the temperature probe is used to measure the external and / or internal temperature of the insulating container. Compared to existing temperature ovens, this utility model provides a more stable and uniform temperature field. Utilizing the inherent physical property of material phase transition points, it can obtain very accurate temperature calibration points. Furthermore, this utility model is applicable to the temperature calibration of wafer temperature sensors, is low-cost, and has significant economic value.

[0003] However, the aforementioned patent requires manual placement or removal of the wafer temperature sensor from the calibration equipment housing, which is not only cumbersome and laborious but also prone to causing burns to the hands. Summary of the Invention

[0004] To address the technical problems raised in the background section, this invention aims to provide a fast-feedback semiconductor wafer sensor calibration device and calibration method, which is achieved through the following technical solution:

[0005] A fast feedback semiconductor wafer sensor calibration device includes a calibration device housing and a base. The calibration device housing is connected to the top wall of the base. A storage box is connected to the base. A sensor transport mechanism and a sensor insertion and removal mechanism are connected to the base.

[0006] The storage box has a storage cavity, and the inner wall of the storage cavity is connected to a lifting drive mechanism 2. The inner wall of the storage cavity is slidably connected to two or more support mechanisms, each support mechanism including a connecting plate. The connecting plate is connected to a C-shaped frame 3 and a C-shaped frame 4. The connecting plate is slidably connected to the inner wall of the storage cavity, and the lifting drive mechanism 2 is connected to all the connecting plates.

[0007] The sensor transport mechanism includes a sliding plate and a horizontal drive mechanism. The sliding plate is slidably connected to the base, and the horizontal drive mechanism is connected to the base. The horizontal drive mechanism and the sliding plate are connected. A lifting drive mechanism is connected to the sliding plate. A lifting plate is connected to the lifting drive mechanism. A wafer holder and a device holder are connected to the lifting plate. A negative pressure fan is provided on the wafer holder.

[0008] Preferably, the sensor insertion and removal mechanism includes an electrical box and an electric slide. The electrical box is connected to the base, and the electric slide is slidably connected to the electrical box. An upper heat insulation cover and a C-shaped frame one are connected to the electric slide. A lower heat insulation cover is connected to the C-shaped frame one, and a second C-shaped frame is connected to the lower heat insulation cover. A gap is reserved between the lower heat insulation cover and the upper heat insulation cover.

[0009] Preferably, the bottom wall of the upper heat insulation cover has a groove, and a heat insulation plate and a protrusion are slidably connected to the inner wall of the groove. The heat insulation plate is connected to the inner wall of the groove by a spring. An oblique hole is opened on the heat insulation plate. The protrusion extends to the outside of the upper heat insulation cover. A rotating bar is rotatably connected to the protrusion. The rotating bar is slidably connected to the inner wall of the oblique hole.

[0010] Preferably, the lifting plate is connected to a connecting column, a clamping plate is slidably connected to the connecting column, the clamping plate is connected to the connecting column by a spring four, a fixed frame is connected to the connecting column, a sliding plate is slidably connected to the fixed frame, the sliding plate is connected to the fixed frame by a spring one, a clamping seat is slidably connected to the sliding plate, the clamping seat is connected to the sliding plate by a spring two, a transmission channel is provided on the clamping seat, the transmission channel includes a horizontal section one, an inclined section and a horizontal section two connected in sequence, an inclined seat is connected in the horizontal section two, an extension plate is connected to the upper heat insulation cover, and a protruding strip is connected to the extension plate.

[0011] Preferably, the left wall of the protrusion is connected to a buffer layer one, and the bottom wall of the heat insulation plate is connected to a buffer layer two.

[0012] Preferably, the bottom wall of the clamp is connected to a friction layer one, and the top wall of the clamp is connected to a friction layer two.

[0013] Preferably, a guide rod is connected to the skateboard, and the lifting plate and the guide rod are slidably connected.

[0014] Preferably, both the first friction layer and the second friction layer are made of silicone.

[0015] Preferably, the base contains a control system.

[0016] A fast feedback semiconductor wafer sensor calibration method, based on the aforementioned fast feedback semiconductor wafer sensor calibration device, includes two or more sensor bodies placed in a storage cavity. Each sensor body includes a connector, a wafer temperature sensor, and leads. The connector is connected to the wafer temperature sensor via the leads. An I-shaped frame supports the wafer temperature sensor, and an I-shaped frame supports the connector. A sensor transport mechanism transports each sensor body to a sensor placement and removal mechanism. The sensor placement and removal mechanism places the sensor body into the calibration equipment housing for temperature calibration, and then removes the sensor body from the calibration equipment housing using the same mechanism.

[0017] The present invention has the following beneficial effects:

[0018] It enables the automatic insertion and removal of the sensor body from the calibration equipment housing without the need for manual handling, greatly reducing the risk of burns and improving safety and efficiency;

[0019] The system enables automatic storage and retrieval of sensor bodies, improving calibration efficiency. Through a multi-layer support structure consisting of a base, storage box, storage cavity, lifting drive mechanism II, and connecting plate, multiple sensor bodies can be stored in layers. The lifting drive mechanism II can descend layer by layer, allowing the wafer holder and device holder to automatically remove the bottom sensor body directly from the C-shaped frame III and the four C-shaped frames, eliminating the need for manual handling and significantly improving calibration efficiency. Attached Figure Description

[0020] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0021] Figure 1 This is a front view of a fast feedback semiconductor wafer sensor calibration device according to the present invention (storage box omitted).

[0022] Figure 2 This is the present invention. Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 This is the present invention. Figure 2 Schematic diagram of the central heat insulation plate and protrusions;

[0024] Figure 4 This is the present invention. Figure 2 Left view of the middle clamp;

[0025] Figure 5 This is the present invention. Figure 4 A top-view sectional view of the center clamp;

[0026] Figure 6 This is a top view of a fast feedback semiconductor wafer sensor calibration device according to the present invention (electrical box omitted).

[0027] Figure 7 This is an exploded view of the storage box in this invention;

[0028] Figure 8 This is a schematic diagram of the connecting plate and the second lifting drive mechanism in this invention.

[0029] Reference numerals: 1. Base; 2. Calibration equipment housing; 3. Slide plate; 4. Lifting drive mechanism one; 5. Storage box; 6. Guide rod; 7. Horizontal drive mechanism; 8. Lifting plate; 9. Wafer holder; 10. Socket; 11. Electrical box; 12. Electric slide; 13. Upper heat insulation cover; 14. Lower heat insulation cover; 15. C-shaped frame one; 16. C-shaped frame two; 17. Protruding strip; 18. Extension plate; 19. Connecting column; 20. Clamping piece; 21. Fixing frame; 22. Slide piece; 2 3. Spring 1; 24. Clamp; 25. Spring 2; 26. Groove; 27. Spring 3; 28. Heat insulation plate; 29. ​​Slanted hole; 30. Protrusion; 31. Rotary bar; 32. Spring 4; 33. Lifting drive mechanism 2; 34. Storage cavity; 35. C-shaped frame 3; 36. C-shaped frame 4; 37. Connecting plate; 38. Connector; 39. Wafer temperature sensor; 40. Lead wire; 41. Horizontal section 1; 42. Inclined section; 43. Horizontal section 2; 44. Inclined seat. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In the description of this invention, it should be noted that the terms "vertical," "upper," "lower," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] like Figures 1-8As shown, a fast feedback semiconductor wafer sensor calibration device includes a calibration device housing 2 and a base 1. The calibration device housing 2 is connected to the top wall of the base 1. A storage box 5 is connected to the base 1. A sensor transport mechanism and a sensor insertion and removal mechanism are connected to the base 1.

[0034] Storage box 5 has a storage cavity 34. The inner wall of storage cavity 34 is connected to a second lifting drive mechanism 33. The inner wall of storage cavity 34 is slidably connected to two or more support mechanisms. The support mechanism includes a connecting plate 37. The connecting plate 37 is connected to a third C-shaped frame 35 and a fourth C-shaped frame 36. The connecting plate 37 is slidably connected to the inner wall of storage cavity 34. The second lifting drive mechanism 33 is connected to all the connecting plates 37.

[0035] The sensor transport mechanism includes a slide plate 3 and a horizontal drive mechanism 7. The slide plate 3 is slidably connected to the base 1, and the horizontal drive mechanism 7 is connected to the base 1. The horizontal drive mechanism 7 and the slide plate 3 are connected. A lifting drive mechanism 4 is connected to the slide plate 3. A lifting plate 8 is connected to the lifting drive mechanism 4. A wafer holder 9 and a device holder 10 are connected to the lifting plate 8. A negative pressure fan is provided on the wafer holder 9.

[0036] The internal structure of the calibration equipment housing 2 is based on existing technology and is not limited here.

[0037] During operation, the wafer holder 9 is used to support the wafer temperature sensor 39, the holder 10 is used to support the connector 38, the horizontal drive mechanism 7 is used to drive the slide plate 3 to move horizontally back and forth, and the lifting drive mechanism 4 is used to drive the lifting plate 8 to move up and down.

[0038] In a preferred embodiment of the present invention, the sensor insertion and removal mechanism includes an electrical box 11 and an electric slide 12. The electrical box 11 is connected to the base 1, and the electric slide 12 is slidably connected to the electrical box 11. An upper heat insulation cover 13 and a C-shaped frame 15 are connected to the electric slide 12. A lower heat insulation cover 14 is connected to the C-shaped frame 15, and a second C-shaped frame 16 is connected to the lower heat insulation cover 14. A gap is reserved between the lower heat insulation cover 14 and the upper heat insulation cover 13.

[0039] During operation, the electric slide 12 can be moved horizontally left and right on the electrical box 11 via electronic control to facilitate the insertion and removal of the wafer temperature sensor 39 into and out of the calibration equipment housing 2. The upper heat insulation cover 13 and the lower heat insulation cover 14 are both made of heat insulation material to prevent heat from escaping from the calibration equipment housing 2.

[0040] In a preferred embodiment of the present invention, the bottom wall of the upper heat insulation cover 13 is provided with a groove 26, and a heat insulation plate 28 and a protrusion 30 are slidably connected to the inner wall of the groove 26. The heat insulation plate 28 is connected to the inner wall of the groove 26 by a spring 27. An oblique hole 29 is provided on the heat insulation plate 28. The protrusion 30 extends to the outside of the upper heat insulation cover 13, and a rotating bar 31 is rotatably connected to the protrusion 30. The rotating bar 31 is slidably connected to the inner wall of the oblique hole 29.

[0041] During operation, the protrusion 30 is used to drive the heat insulation plate 28 to move down to eliminate the gap between the upper heat insulation cover 13 and the lower heat insulation cover 14, further reducing the heat loss from the calibration equipment housing 2.

[0042] In a preferred embodiment of the present invention, a connecting column 19 is connected to the lifting plate 8, and a clamping piece 20 is slidably connected to the connecting column 19. The clamping piece 20 is connected to the connecting column 19 via a spring 32. A fixing frame 21 is connected to the connecting column 19, and a sliding piece 22 is slidably connected to the fixing frame 21. The sliding piece 22 is connected to the fixing frame 21 via a spring 23. A clamping seat 24 is slidably connected to the sliding piece 22 via a spring 25. A transmission channel is provided on the clamping seat 24. The transmission channel includes a horizontal section 41, an inclined section 42, and a horizontal section 43 connected in sequence. An inclined seat 44 is connected inside the horizontal section 43. An extension plate 18 is connected to the upper heat insulation cover 13, and a protrusion 17 is connected to the extension plate 18.

[0043] During operation, the clamp 24 and the clamp 20 clamp and drive the lead wire 40, straightening the bent lead wire 40 so that it can enter the gap between the upper heat insulation cover 13 and the lower heat insulation cover 14.

[0044] In a preferred embodiment of the present invention, a first buffer layer is connected to the left wall of the protrusion 30, and a second buffer layer is connected to the bottom wall of the heat insulation plate 28. The first and second buffer layers provide cushioning for the movement of the components.

[0045] In a preferred embodiment of the present invention, a friction layer one is connected to the bottom wall of the clamp 24, and a friction layer two is connected to the top wall of the clamp 20. Friction layer one and friction layer two increase the friction with the lead wire 40, thereby making it easier to pull the lead wire 40.

[0046] In a preferred embodiment of the present invention, a guide rod 6 is connected to the slide plate 3, and the lifting plate 8 is slidably connected to the guide rod 6. The guide rod 6 enables precise guidance of the lifting plate 8's lifting movement, improves structural stability, ensures that the lifting plate 8 maintains a straight guiding line during its up-and-down movement, avoids skewness, and improves the overall reliability and operational stability of the mechanism.

[0047] In a preferred embodiment of the present invention, both the friction layer one and the friction layer two are made of silicone.

[0048] In a preferred embodiment of the present invention, the base 1 is equipped with a control system. This system enables fully automated control of the entire process, improving operational safety. The control system can coordinate and control the horizontal drive mechanism 7, the electric slide 12, the first lifting drive mechanism 4, the second lifting drive mechanism 33, and the negative pressure fan, achieving full automation of the sensor body from storage, transportation, placement, calibration to removal. This avoids manual contact with high-temperature areas and enhances operational safety.

[0049] A fast feedback semiconductor wafer sensor calibration method, based on the aforementioned fast feedback semiconductor wafer sensor calibration device, includes two or more sensor bodies placed in a storage cavity 34. Each sensor body includes a connector 38, a wafer temperature sensor 39, and leads 40. The connector 38 is connected to the wafer temperature sensor 39 via the leads 40. An I-shaped frame 35 supports the wafer temperature sensor 39, and an I-shaped frame 36 supports the connector 38. The sensor bodies are transported one by one to a sensor placement and removal mechanism using a sensor transport mechanism. The sensor bodies are then placed into the calibration equipment housing 2 for temperature calibration using the sensor placement and removal mechanism, and finally removed from the calibration equipment housing 2 using the sensor placement and removal mechanism.

[0050] Implementation process: The horizontal drive mechanism 7 drives the slide plate 3 to move backward, and the wafer holder 9 and the device holder 10 enter the storage cavity 34. The wafer holder 9 moves to below the three-sided frame 35, and the device holder 10 moves to below the four-sided frame 36. The lifting drive mechanism 1 drives the lifting plate 8 to move upward. The wafer holder 9 passes through the three-sided frame 35 to lift the bottom wafer temperature sensor 39, and the device holder 10 passes through the four-sided frame 36 to lift the bottom connector 38. The horizontal drive mechanism 7 drives the slide plate 3 to move forward, thereby transporting a sensor body forward. The negative pressure fan is turned on to adsorb and fix the wafer temperature sensor 39 to prevent displacement during transportation and displacement when the lead wire 40 is straightened.

[0051] Since not all of the lead wires 40 are straight, some may be bent. These bent lead wires will abut against the rear walls of the upper heat insulation cover 13 and the lower heat insulation cover 14, preventing them from smoothly entering the gap between them. Therefore, the bent lead wires 40 need to be straightened. When the slide plate 3 moves forward, it drives the connecting column 19, clamp 20, and fixing frame 21 forward. The clamp 24 moves forward, causing the protrusion 17 to insert into the horizontal section 41 from the rear wall of the clamp 24. The protrusion 17 enters the inclined section 42 along the horizontal section 41. As the protrusion 17 moves within the inclined section 42, it pushes the clamp 24 downward against the elastic force of the spring 25, allowing the clamp 24 to clamp the protrusion 17 in conjunction with the clamp 20. Then, the protrusion 17 enters the horizontal section 43. As the protrusion 17 moves within the horizontal section 43... The clamp 24 maintains its current height, that is, the clamp 24 and the clamping piece 20 hold the protrusion 17. After the protrusion 17 moves to abut against the inclined surface of the inclined seat 44, the protrusion 17 will push the clamp 24 and the slider 22 to move to the right against the elastic force of spring 1 23, and the clamping piece 20 to move to the right against the elastic force of spring 4 32. The clamp 24 and the clamping piece 20 pull the lead wire 40 to the right and straighten it. The wafer temperature sensor 39 is attracted by the negative pressure fan and will not move to the right, so that when all the leads 40 move forward, they can smoothly enter the gap between the upper heat insulation cover 13 and the lower heat insulation cover 14. After the lead wire 40 enters the gap between the upper heat insulation cover 13 and the lower heat insulation cover 14, the protrusion 17 disengages from the front wall of the clamp 24 from the inclined seat 44. The slider 22 moves to the left and resets under the elastic force of spring 1 23. The clamp 24 moves upward and resets under the elastic force of spring 2 25, thereby releasing the clamp on the lead wire 40.

[0052] When wafer pedestal 9 enters the I-shaped frame 16 and device holder 10 enters the I-shaped frame 15, the negative pressure fan is turned off. The lifting drive mechanism 14 controls the lifting plate 8 to move downward. Wafer temperature sensor 39 is supported by I-shaped frame 16, and connector 38 is supported by I-shaped frame 15. The fixing frame 21 stops moving downward after it is lower than the protrusion 17. The horizontal drive mechanism 7 controls the slide plate 3 to move backward behind the upper heat insulation cover 13 to prevent the components on the slide plate 3 from obstructing the movement of the lower heat insulation cover 14. The electric slide 12 is controlled to move to the left. The electric slide 12 drives the upper heat insulation cover 13, I-shaped frame 15, and lower heat insulation cover 14. The heat cover 14 and the C-shaped frame 16 move to the left, and the C-shaped frame 16 sends the wafer temperature sensor 39 into the calibration equipment housing 2 for temperature calibration. The upper heat insulation cover 13 and the lower heat insulation cover 14 both abut against the right wall of the calibration equipment housing 2 to prevent heat from escaping from the calibration equipment housing 2. The right wall of the calibration equipment housing 2 pushes the protrusion 30 to the right, and the rotating bar 31 on the protrusion 30 slides in the oblique hole 29, thereby pushing the heat insulation plate 28 to move down. The heat insulation plate 28 presses down the lead wire 40 and abuts against the top wall of the lower heat insulation cover 14, thereby further preventing heat from escaping from the calibration equipment housing 2.

[0053] After temperature calibration is complete, the electric slide 12 moves to the right to reset, sending the wafer temperature sensor 39 out of the calibration equipment housing 2, so that the user can remove the sensor body.

[0054] The other sensor bodies in the subsequent connecting plate 37 are calibrated using the same method described above. The lifting drive mechanism 2 33 can control all connecting plates 37 to descend, thereby facilitating the transport of the sensor body on another connecting plate 37 by the wafer holder 9 and the device holder 10.

[0055] The beneficial effects of this invention are as follows:

[0056] The sensor body can be automatically placed into and removed from the calibration equipment housing 2 without manual handling, greatly reducing the risk of burns and improving safety and efficiency.

[0057] The automatic removal of the sensor body improves calibration efficiency. Through the multi-layer support structure consisting of base 1, storage box 5, storage cavity 34, lifting drive mechanism 2 33 and connecting plate 37, multiple sensor bodies can be stored in layers. The lifting drive mechanism 2 33 can descend layer by layer, so that the wafer holder 9 and the device holder 10 can directly remove the bottom sensor body from the C-shaped frame 35 and C-shaped frame 4 36. There is no need for manual processing, which greatly improves calibration efficiency.

[0058] To achieve stable transportation of the sensor body and avoid displacement and damage, the sensor transportation mechanism achieves automated transportation through the slide plate 3, horizontal drive mechanism 7, lifting drive mechanism 4, and lifting plate 8. The negative pressure fan on the wafer holder 9 can adsorb and fix the wafer temperature sensor 39 during transportation to prevent it from shifting, falling, or being pulled by the lead wire 40 due to transportation vibration.

[0059] The automatic straightening of the lead wire 40 ensures its smooth entry into the gap between the upper heat insulation cover 13 and the lower heat insulation cover 14. The connecting column 19, clamp 20, fixing frame 21, sliding plate 22, clamp seat 24, and matching springs 1-23, 25-25, and 4-32 constitute the lead wire correction mechanism. The protrusion 17 on the extension plate 18 moves along the horizontal section 1 41, inclined section 42, and horizontal section 2 43 inside the clamp seat 24, so that the clamp seat 24 and clamp 20 automatically straighten the bent lead wire 40, thereby ensuring that the lead wire 40 smoothly enters the gap between the upper heat insulation cover 13 and the lower heat insulation cover 14, thus solving the problem that the traditional technology requires manual insertion of the traditional lead wire through the traditional heat insulation cover.

[0060] The heat insulation mechanism is automatically closed to reduce heat loss. The upper heat insulation cover 13 has a heat insulation plate 28 and a protrusion 30 in the groove 26. When the electric slide 12 pushes the upper heat insulation cover 13 close to the right wall of the calibration equipment housing 2, the protrusion 30 is squeezed and drives the heat insulation plate 28 to move down and seal with the lower heat insulation cover 14. The rotating strip 31 on the protrusion 30 cooperates with the oblique hole 29, thereby effectively reducing heat leakage during the calibration process and improving the stability of the temperature field.

[0061] The storage cavity 34 can accommodate multiple sensor bodies and switch them layer by layer through the lifting drive mechanism 33 to achieve continuous automatic calibration. Combined with the automatic cooperation of the transport mechanism and the heat insulation components, unattended batch calibration can be achieved, which greatly improves the calibration capacity of the wafer temperature sensor 39.

[0062] The components, modules, mechanisms, and devices in this invention that are not described in detail are all general standard parts or components known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A fast-feedback semiconductor wafer sensor calibration device, comprising a calibration device housing (2), characterized in that, It also includes a base (1), a calibration equipment housing (2) connected to the top wall of the base (1), a storage box (5) connected to the base (1), and a sensor transport mechanism and a sensor insertion and removal mechanism connected to the base (1). Storage box (5) has a storage cavity (34) on it. The inner wall of the storage cavity (34) is connected to a second lifting drive mechanism (33). The inner wall of the storage cavity (34) is slidably connected to two or more support mechanisms. The support mechanism includes a connecting plate (37). The connecting plate (37) is connected to a third (35) and a fourth (36) of the C-shaped frame. The connecting plate (37) is slidably connected to the inner wall of the storage cavity (34). The second lifting drive mechanism (33) is connected to all the connecting plates (37). The storage cavity (34) contains two or more sensor bodies. The sensor body includes a connector (38), a wafer temperature sensor (39), and a lead wire (40). The connector (38) is connected to the wafer temperature sensor (39) through the lead wire (40). The sensor transport mechanism includes a slide plate (3) and a horizontal drive mechanism (7). The slide plate (3) is slidably connected to the base (1). The horizontal drive mechanism (7) is connected to the base (1) and the slide plate (3). A lifting drive mechanism (4) is connected to the slide plate (3). A lifting plate (8) is connected to the lifting drive mechanism (4). A wafer holder (9) and a device holder (10) are connected to the lifting plate (8). A negative pressure fan is provided on the wafer holder (9). The sensor insertion and removal mechanism includes an electrical box (11) and an electric slide (12). The electrical box (11) is connected to the base (1), and the electric slide (12) is slidably connected to the electrical box (11). An upper heat insulation cover (13) and a C-shaped frame (15) are connected to the electric slide (12). A lower heat insulation cover (14) is connected to the C-shaped frame (15), and a second C-shaped frame (16) is connected to the lower heat insulation cover (14). A gap is reserved between the lower heat insulation cover (14) and the upper heat insulation cover (13). The lifting plate (8) is connected to a connecting column (19), and a clamping piece (20) is slidably connected to the connecting column (19). The clamping piece (20) is connected to the connecting column (19) via a spring four (32). A fixed frame (21) is connected to the connecting column (19), and a sliding piece (22) is slidably connected to the fixed frame (21). The sliding piece (22) is connected to the fixed frame (21) via a spring one (23). A clamping seat (24) is slidably connected to the sliding piece (22). The clamping seat (24) is connected to the sliding piece (22) via a spring two (25). A transmission channel is provided on the clamping seat (24). The transmission channel includes a horizontal section one (41), an inclined section (42), and a horizontal section two (43) connected in sequence. An inclined seat (44) is connected inside the horizontal section two (43). An extension plate (18) is connected to the upper heat insulation cover (13), and a protruding strip (17) is connected to the extension plate (18). When the slide plate (3) moves forward, it drives the connecting column (19), clamp (20), and fixing frame (21) to move forward. The clamp (24) moves forward, causing the protrusion (17) to be inserted into the horizontal section (41) from the rear wall of the clamp (24). The protrusion (17) enters the inclined section (42) along the horizontal section (41). When the protrusion (17) moves in the inclined section (42), it pushes the clamp (24) to overcome the elastic force of the second spring (25) and move downward, so that the clamp (24) and the clamp (20) clamp the protrusion (17). Then the protrusion (17) enters the water. Within the second horizontal section (43), when the convex strip (17) moves within the second horizontal section (43), the clamp (24) maintains its current height, that is, the clamp (24) and the clamp (20) hold the convex strip (17). After the convex strip (17) moves to abut against the inclined surface of the inclined seat (44), the convex strip (17) will push the clamp (24) and the slider (22) to move to the right against the elastic force of the first spring (23), and the clamp (20) to move to the right against the elastic force of the fourth spring (32). The clamp (24) and the clamp (20) pull the lead wire (40) to the right. During operation, the clamp (24) and the clamp (20) clamp and drive the lead wire (40) to straighten the bent lead wire (40) so that it can enter the gap between the upper heat insulation cover (13) and the lower heat insulation cover (14).

2. The fast feedback semiconductor wafer sensor calibration device according to claim 1, characterized in that, The bottom wall of the upper heat insulation cover (13) is provided with a groove (26). The inner wall of the groove (26) is slidably connected with a heat insulation plate (28) and a protrusion (30). The heat insulation plate (28) is connected to the inner wall of the groove (26) by a spring (27). The heat insulation plate (28) is provided with an oblique hole (29). The protrusion (30) extends to the outside of the upper heat insulation cover (13). A rotating bar (31) is rotatably connected to the protrusion (30). The rotating bar (31) is slidably connected to the inner wall of the oblique hole (29).

3. The fast feedback semiconductor wafer sensor calibration device according to claim 2, characterized in that, The left wall of the protrusion (30) is connected to a buffer layer one, and the bottom wall of the heat insulation plate (28) is connected to a buffer layer two.

4. The fast feedback semiconductor wafer sensor calibration device according to claim 3, characterized in that, The bottom wall of the clamp (24) is connected to a friction layer one, and the top wall of the clamp (20) is connected to a friction layer two.

5. The fast feedback semiconductor wafer sensor calibration device according to claim 4, characterized in that, The slide plate (3) is connected to a guide rod (6), and the lifting plate (8) and the guide rod (6) are slidably connected.

6. The fast feedback semiconductor wafer sensor calibration device according to claim 5, characterized in that, Both friction layer one and friction layer two are made of silicone.

7. The fast feedback semiconductor wafer sensor calibration device according to claim 6, characterized in that, The base (1) is equipped with a control system.

8. A method for calibrating a semiconductor wafer sensor with fast feedback, characterized in that, Based on any one of claims 1-7, a fast feedback semiconductor wafer sensor calibration device is provided, in which two or more sensor bodies are placed in the storage cavity (34). The sensor body includes a connector (38), a wafer temperature sensor (39), and a lead wire (40). The connector (38) is connected to the wafer temperature sensor (39) through the lead wire (40). The C-shaped frame three (35) supports the wafer temperature sensor (39), and the C-shaped frame four (36) supports the connector (38). The sensor bodies are transported one by one to the sensor placement and removal mechanism using the sensor transport mechanism. The sensor bodies are placed into the calibration equipment housing (2) for temperature calibration using the sensor placement and removal mechanism. Then, the sensor bodies are removed from the calibration equipment housing (2) using the sensor placement and removal mechanism.

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