A small-sized ceramic dielectric filter resistant to high power

Abstract

This application relates to the technical field of electronic filtering, and in particular to a miniaturized ceramic dielectric filter capable of handling high power. The filter includes a ceramic cover plate, a cavity, an insulating kit, an inner conductor sheet, and a connector. The ceramic cover plate is silver-plated and sealed to the top of the cavity. Each side of the cavity has an interface penetrating the side wall. Two insulating kits are located inside the cavity, each corresponding to one of the interfaces. The inner conductor sheet is housed within the insulating kit. The connector passes through the interface, and its end connects to the inner conductor sheet. This application improves transmission efficiency, reduces losses, lowers heat dissipation, and extends product lifespan. The insulating dielectric completely encapsulates the inner conductor, effectively increasing the filter's power output. Compared to conventional ceramic dielectric filters ranging from a few watts to tens of watts, this filter can handle high-current, high-frequency signals, thus broadening its application scope.

Description

Technical Field

[0001] This application relates to the technical field of electronic filtering, and in particular to a miniaturized ceramic dielectric filter capable of handling high power. Background Technology

[0002] A filter is an electronic device that filters signals in a circuit, removing or attenuating signals within certain frequency ranges while retaining or amplifying signals in other frequency ranges. Filters are commonly used in electronic devices to remove noise, interference, and spurious signals, thereby improving signal quality and stability. With rapid modernization, the demand for electronic products is increasing. For ease of installation, modern filter products have been continuously developed towards lightweight, miniaturization, and high performance. Because electromagnetic waves propagate through materials with high dielectric constants, their wavelengths can be significantly shorter than those in air, enabling miniaturized filter designs. Therefore, ceramic materials, with their low loss, high dielectric constant, low frequency temperature coefficient and thermal expansion coefficient, and ability to withstand high power, are widely favored by researchers and are often chosen as the preferred dielectric material for miniaturized filters.

[0003] In traditional filter design, various methods are often employed to achieve miniaturization and meet certain electrical performance requirements. For miniaturization, some designs use traditional materials such as Teflon as the dielectric, and optimize the structural layout to reduce size. For adjusting electrical performance, specialized structural components are used to adjust parameters such as standing wave ratio (SWR) and insertion loss. In terms of material selection, common metals and insulating materials are used for the filter cavity, inner conductor sheets, and insulating dielectric to ensure basic electrical and mechanical properties. Conventional high-temperature welding methods are typically used for assembly and welding. Structurally, there is no special sealing structure to isolate the air inside the cavity from the air inside the conductor sheets at the input port.

[0004] When traditional filters are miniaturized, their power output is typically limited to a low range, failing to meet the current market's demand for high-power electrical performance. This power limitation makes traditional filters perform poorly when handling high-current, high-frequency signals, significantly restricting their application scenarios. Summary of the Invention

[0005] To achieve both miniaturization and increased high-power tolerance of the filter, this application provides a miniaturized ceramic dielectric filter capable of handling high power, employing the following technical solution:

[0006] Includes ceramic cover plate, cavity, insulating kit, inner conductor sheet and connector;

[0007] The ceramic cover plate is provided with a silver plating layer and the ceramic cover plate is sealed to the top of the cavity;

[0008] The cavity has an interface that penetrates the side wall of the cavity on each of its symmetrical sides;

[0009] Two insulating kits are provided inside the cavity, each corresponding to one of the interfaces; the inner conductor sheet is disposed inside the insulating kit.

[0010] The connector passes through the interface, and the end of the connector is connected to the inner conductor plate.

[0011] By adopting the above technical solution, using ceramic as the cover material and setting a silver plating layer, excellent heat dissipation performance and low dielectric loss are achieved, thus enabling it to withstand high power. At the same time, the combined design of the insulating kit, cavity, and inner conductor sheet allows the inner conductor sheet to be effectively fixed and insulated, and reliably connected to the inserted connector. This highly integrated and modular structure eliminates the complex coaxial conversion and welding steps of traditional filters, significantly reducing the overall size and achieving miniaturization.

[0012] Optionally, the insulating kit includes an insulating base and an insulating block. The insulating base has a mounting groove inside, and the lower end of the inner conductor sheet is inserted into the mounting groove. The insulating block has a groove on one side facing the inner conductor sheet, and the upper end of the inner conductor sheet extends into the groove. The bottom surface of the insulating block is in contact with the upper surface of the insulating base.

[0013] By adopting the above technical solution, the inner conductor sheet is firmly clamped inside the cavity by the upper pressure block and the lower base, preventing it from shifting when subjected to vibration or impact, thus ensuring the long-term reliability of the electrical connection. The modular base and pressure block facilitate production assembly and disassembly maintenance, improving production efficiency. Furthermore, the complete insulation barrier formed by the insulating pressure block and the base can more effectively isolate the inner conductor sheet from the metal cavity, reducing the risk of power leakage and breakdown, and enhancing the ability to withstand high voltage and high power.

[0014] Optionally, the inner conductor sheet includes upper and lower parts. The lower part is a horizontally arranged strip, and the upper part is a vertically arranged strip. The horizontal strip and the vertical strip are connected in an L-shape. The horizontal strip is inserted into a mounting groove, and the vertical strip is inserted into a recess.

[0015] By adopting the above technical solution, the L-shaped structure cleverly utilizes the space inside the cavity. The horizontal part is responsible for a stable horizontal connection with the connector, while the vertical part is responsible for vertical electromagnetic coupling with the ceramic cover plate. The structure is compact and helps to further miniaturize. Secondly, this split functional design makes the signal transmission path and coupling path clearer and more controllable, which is conducive to optimizing the electrical performance parameters of the filter (such as bandwidth and insertion loss). It also makes it easy to fine-tune the coupling strength by adjusting the size or position of the vertical part, thus improving the design flexibility and performance adjustability.

[0016] Optionally, the cross plate is provided with a connecting hole, the side wall of the mounting groove is provided with a through hole concentric with the connecting hole, and the end of the connector is provided with a first flange, which passes through the through hole and is engaged in the connecting hole so that the connector is connected to the inner conductor plate.

[0017] By adopting the above technical solution, the mechanical interlocking structure of the flange-connecting hole provides a robust and reliable electrical and mechanical connection, avoiding problems such as incomplete soldering and thermal stress damage that may exist in traditional welding methods, and improving the stability and durability of the connection, which is especially suitable for the high reliability requirements of high-power applications. This connection method is easy to assemble and disassemble, which helps to simplify the production process and subsequent maintenance. Furthermore, the coaxial design of the through hole and the connecting hole ensures the alignment accuracy of the connector and the inner conductor plate, guarantees the integrity of the signal transmission path, and helps to reduce insertion loss.

[0018] Optionally, the top of the vertical plate is provided with a second flange, the bottom of the groove of the insulating block is provided with a through hole for the second flange to pass through, and the bottom of the ceramic cover plate is provided with a coupling groove corresponding to the position of the through hole. The second flange passes through the through hole and extends into the coupling groove.

[0019] By adopting the above technical solution, the second flange of the inner conductor sheet is directly extended into a specific coupling groove at the bottom of the ceramic cover plate, achieving more precise and controllable electromagnetic coupling between the inner conductor and the ceramic dielectric. As a designable physical structure, the size, shape, and position of the coupling groove can be precisely adjusted, allowing for fine-tuning and optimization of key performance parameters such as the filter's center frequency and coupling coefficient. This significantly improves the consistency of filter performance and the degree of design freedom, enabling it to better meet specific filtering response requirements.

[0020] Optionally, the upper end of the insulating pressure block is provided with a sealing groove, and a sealing ring is provided in the sealing groove. When the ceramic cover plate is sealed and connected to the top of the cavity, the sealing ring is compressed between the insulating pressure block and the ceramic cover plate to achieve a seal.

[0021] By adopting the above technical solution, when the ceramic cover plate is sealed to the top of the cavity, the sealing ring is compressed between the pressure block and the cover plate, forming an effective local sealing barrier. This prevents moisture, dust, and other contaminants in the environment from entering the filter through the gaps between the insulating kit and the cavity / cover plate, especially protecting the connection points and coupling areas of the inner conductor sheets. Good sealing performance is crucial for maintaining the long-term stable operation of the filter in harsh environments such as high humidity and dust. It prevents electrical performance degradation (such as reduced Q value and increased insertion loss) or problems such as internal discharge and corrosion caused by contaminants, thereby significantly improving the product's environmental adaptability and long-term reliability.

[0022] Optionally, the silver plating layer on the surface of the ceramic cover plate has a non-uniform thickness distribution.

[0023] By adopting the above technical solution, structural components for adjusting electrical performance indicators such as standing wave ratio (SWR) and insertion loss are integrated onto the silver-plated layer of the ceramic cover plate. This reduces the size of the dielectric filter. The electrical performance is adjusted by polishing the silver-plated layer on the ceramic cover plate to meet customer requirements. This design can specifically improve the filter's power capacity (by reducing the resistance in the high-current region), optimize the frequency response (by adjusting the capacitance in the coupling region), and reduce unnecessary parasitic effects. Ultimately, it achieves better overall electrical performance, including insertion loss and out-of-band rejection, while miniaturizing the filter.

[0024] Optionally, the inner conductor sheet is made of brass and its entire surface is covered with an electroplated silver layer of uniform thickness.

[0025] By adopting the above technical solution and selecting brass as the substrate, good conductivity is ensured while also possessing excellent mechanical strength, machinability, and low cost, making it suitable for manufacturing precision inner conductor sheets. A uniform electroplated silver layer covering the entire surface of the brass significantly reduces the surface resistance of the conductor at high frequencies (due to the skin effect, current mainly travels along the surface), thereby greatly reducing conduction losses and heat generation, which is crucial for high-power applications. The uniform plating ensures consistent performance, and the full coverage also prevents oxidation of the brass substrate, guaranteeing long-term stability.

[0026] Optionally, the connector is provided with a connecting flange, and the interface is provided with an internal thread groove. A screw passes through the connecting flange and is threadedly connected to the internal thread groove, so that the connector and the interface are detachably connected.

[0027] By adopting the above technical solution, the screw connection provides robust and reliable mechanical fixation and good electrical contact (typically the flange fits tightly against the cavity, forming shielding and grounding), ensuring the stability of the connection in vibration environments. This detachable connection method greatly facilitates the installation, commissioning, and maintenance of the filter. It is easy to align and fix during assembly; when it is necessary to change the connector model or repair the internal components, disassembly can be performed without destructive operations, improving the modularity and ease of maintenance of the product, and reducing the total life-cycle cost.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. By using ceramic as the cover material and adding a silver plating layer, excellent heat dissipation performance and low dielectric loss are achieved, thus enabling it to withstand high power. At the same time, the combined design of the insulating kit, cavity, and inner conductor sheet allows the inner conductor sheet to be effectively fixed and insulated, and reliably connected to the inserted connector. This highly integrated and modular structure eliminates the complex coaxial conversion and soldering steps of traditional filters, significantly reducing the overall size and achieving miniaturization.

[0030] 2. The combination of the L-shaped inner conductor sheet and the coupling groove on the ceramic cover plate enables precise and controllable electromagnetic coupling, facilitating fine adjustment of parameters such as the filter's frequency response. Simultaneously, the non-uniform thickness of the silver plating layer on the ceramic cover plate and the full-coverage uniform silver plating layer on the surface of the inner conductor sheet actively optimize current distribution and reduce high-frequency resistance, thereby effectively reducing insertion loss and increasing power capacity, comprehensively optimizing electrical performance.

[0031] 3. The connector is securely connected to the inner conductor sheet and cavity via flange snap-fit ​​and screw flange, ensuring mechanical stability and ease of assembly and disassembly. The sealing ring at the top of the insulating block forms an effective seal after the ceramic cover plate is pressed together, preventing moisture and dust intrusion. These design features collectively enhance the filter's reliability and lifespan in harsh environments such as vibration and humidity. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of the filter;

[0033] Figure 2 This is a schematic diagram of the exploded structure of a filter;

[0034] Figure 3 This is a side-view sectional view of the filter.

[0035] Figure 4 yes Figure 3 An enlarged schematic diagram of part A in the middle;

[0036] Figure 5 This is a schematic diagram of the filter's front cross-sectional structure;

[0037] In the picture,

[0038] 1. Ceramic cover plate; 11. Coupling groove;

[0039] 2. Cavity; 21. Interface; 211. Internal thread groove;

[0040] 3. Insulating kit; 31. Insulating base; 311. Mounting groove; 312. Perforation; 32. Insulating pressure block; 321. Groove; 322. Through hole; 323. Sealing groove.

[0041] 4. Inner conductor sheet; 41. Horizontal sheet; 411. Connecting hole; 42. Vertical sheet; 421. Second flange;

[0042] 5. Connector; 51. First flange; 52. Connecting flange; 53. Screw;

[0043] 6. Sealing ring. Detailed Implementation

[0044] The following is in conjunction with the appendix Figure 1 - Appendix Figure 5 This application will be described in further detail below.

[0045] A miniaturized ceramic dielectric filter capable of handling high power, referenced Figure 1 and Figure 2 The filter comprises a ceramic cover plate 1, a cavity 2, an insulating kit 3, an inner conductor sheet 4, and a connector 5. The ceramic cover plate 1 is sealed to the top of the cavity 2, preventing external dust and moisture from entering and affecting the filter's performance. Each side of the cavity 2 has a symmetrical interface 21 penetrating its sidewall, facilitating the installation of the connector 5 and signal transmission. Two insulating kits 3 are located inside the cavity 2, each corresponding to an interface 21, providing insulation and fixation for the inner conductor sheet 4. The inner conductor sheet 4 is housed within the insulating kit 3 and transmits electrical signals. The connector 5 passes through the interface 21, with its end connecting to the inner conductor sheet 4, enabling signal input and output. This structural combination allows the filter to withstand high power while maintaining miniaturization, meeting market demands for high-power electrical performance.

[0046] Specifically, the ceramic cover plate 1 is equipped with a silver-plated layer, which has good conductivity and helps improve the electrical performance of the filter. The dielectric constant of the ceramic cover plate 1 is 20, which, compared with conventional materials such as Teflon, makes the filter more power-handling and smaller in size. The dielectric loss angle of the ceramic cover plate 1 is three orders of magnitude smaller than that of conventional materials such as Teflon, resulting in a higher Q value and lower insertion loss for the filter. The coefficient of linear expansion of the ceramic cover plate 1 is much smaller than that of conventional materials such as Teflon, resulting in better temperature stability and less temperature drift for the filter. After the metal plating of the ceramic cover plate 1 is welded to the cavity 2, the electric field is concentrated inside the ceramic, improving the power handling performance of the filter and enabling it to withstand power of over 160W in vacuum micro-discharge.

[0047] The inspection conditions and requirements for the micro-discharge test are as follows: QJ 20325.2-2014 Vacuum degree: better than 0.0013Pa; Test temperature: high temperature +65℃; Test duration: ensure sufficient performance testing time for the tested product; Power loading method: pulse power 160W, pulse width 48ms, period 800ms, duty cycle 6%, duration 30min; Applied signal frequency: 960MHz, 1092MHz, 1224MHz; No discharge phenomenon should occur during the test. The test result is: T250529002-1 No discharge phenomenon occurred during the test.

[0048] Furthermore, the silver plating layer on the surface of the ceramic cover plate 1 has a non-uniform thickness distribution. By adjusting the plating layer on the outer side of the metal plating layer of the ceramic cover plate 1, that is, adjusting the thickness of the silver plating layer at different positions, the electrical performance such as insertion loss and standing wave ratio can be made to meet the product requirements. For example, in some areas with high electrical performance requirements, the thickness of the silver plating layer can be appropriately increased. After the product assembly and welding are completed, the product is debugged and connected to a microwave network analyzer. By polishing the metal plating layer on the ceramic cover plate 1 in the area corresponding to the resonant pillar inside the filter, the electrical performance such as in-band insertion loss, out-of-band suppression, and standing wave ratio can be made to meet the product requirements.

[0049] By employing ceramic and metal cavity loading technology, the size and weight of products operating at the same frequency are reduced. Structural components for adjusting electrical performance indicators such as standing wave ratio and insertion loss are integrated onto the silver-plated layer of the ceramic cover plate 1 to reduce the size of the dielectric filter. The electrical performance is adjusted by polishing the silver-plated layer on the ceramic cover plate 1 to meet customer requirements.

[0050] Specifically, cavity 2 uses Kovar alloy 4J29, which has high strength and temperature stability, to reduce the impact of high and low temperatures on product performance. Kovar alloy 4J29 has good thermal conductivity, which can quickly conduct heat to the welding area. Compared with traditional dielectric filters, Kovar alloy has better temperature stability and faster heat dissipation, allowing the filter to withstand higher power.

[0051] The above-mentioned soldering process can employ low-temperature solder paste. The low-temperature solder paste is evenly applied to the soldering area of ​​the product, and then placed on a hot plate for heating. Kovar 4J29 has excellent thermal conductivity, allowing for rapid heat transfer to the soldering area. The low-temperature solder paste melts and solders at 160℃, ensuring the soldering temperature remains within the component's temperature resistance range. This effectively addresses the impact of high temperatures on product structure and performance, and guarantees the safety of assembly production.

[0052] Specifically, refer to Figure 2 and Figure 3The insulating kit 3 includes an insulating base 31 and an insulating block 32. The insulating base 31 has a mounting groove 311 inside, and the lower end of the inner conductor sheet 4 is inserted into the mounting groove 311. The insulating block 32 has a groove 321 on the side facing the inner conductor sheet 4, and the upper end of the inner conductor sheet 4 extends into the groove 321. The bottom surface of the insulating block 32 is in contact with the upper surface of the insulating base 31.

[0053] The insulating material of the insulating kit 3 is polytetrafluoroethylene (PTFE). PTFE has a breakdown field strength more than ten times that of air, and this breakdown field strength does not change with air pressure, resulting in a higher vacuum micro-discharge value for the filter. Furthermore, PTFE has better corrosion resistance and high-temperature resistance, ensuring the product's high-power handling capability. The insulating kit 3 completely encloses the inner conductor sheet 4, confining the electric field within the dielectric, thereby improving the filter's power handling capability.

[0054] Specifically, refer to Figure 3 The inner conductor sheet 4 is made of brass, and its entire surface is covered with a uniformly thick electroplated silver layer. This reduces economic costs while ensuring the electrical performance of the filter. The inner conductor sheet 4 consists of two parts: the lower part is a horizontally arranged strip 41, and the upper part is a vertically arranged strip 42. The horizontal strip 41 and the vertical strip 42 are connected in an L-shape. The horizontal strip 41 is inserted into the mounting groove 311, and the vertical strip 42 is inserted into the recess 321.

[0055] Reference Figure 4 The top of the vertical plate 42 is provided with a second flange 421, and the bottom of the groove 321 of the insulating pressure block 32 is provided with a through hole 322 for the second flange 421 to pass through. The bottom of the ceramic cover plate 1 is provided with a coupling groove 11 corresponding to the position of the through hole 322. The second flange 421 passes through the through hole 322 and extends into the coupling groove 11. This structural design helps to improve the stability and efficiency of signal transmission.

[0056] Furthermore, refer to Figure 5 The horizontal piece 41 is provided with a connecting hole 411, and the side wall of the mounting groove 311 is provided with a through hole 312 concentric with the connecting hole 411. The end of the connector 5 is provided with a first flange 51, which passes through the through hole 312 and is inserted into the connecting hole 411 so that the connector 5 is connected to the inner conductor piece 4.

[0057] Specifically, refer to Figure 2 The connector 5 is provided with a connecting flange 52, and the interface 21 is provided with a corresponding internal thread groove 211. A screw 53 passes through the connecting flange 52 and is threaded into the internal thread groove 211, so that the connector 5 and the interface 21 can be detachably connected. This facilitates the installation, disassembly and maintenance of the filter.

[0058] Furthermore, connector 5 can be an SMA-KFD type connector 5, etc., for easy connection with external devices. Connector 5 can also be other types of connector 5, as long as they can meet the requirements of electrical and mechanical connection.

[0059] Specifically, refer to Figure 4 The insulating pressure block 32 has a sealing groove 323 at its upper end, and a sealing ring 6 is installed inside the sealing groove 323. When the ceramic cover plate 1 is sealed to the top of the cavity 2, the sealing ring 6 is compressed between the insulating pressure block 32 and the ceramic cover plate 1 to achieve a seal. The addition of the sealing ring 6 completely isolates the air in the filter cavity 2 from the air in the inner conductor plate 4 of the filter input port, thereby ensuring the power withstand capability of the filter. By locking the electrons inside the metal, a potential difference cannot be formed, thus ensuring that the ceramic dielectric filter can withstand greater power.

[0060] After integrating electrical properties with ceramic dielectric, the number of required parts is greatly reduced, the structure is simple and reliable, and it can be mass-produced and assembled in an assembly line, thus improving production efficiency.

[0061] The implementation principle of this application embodiment is as follows: This miniaturized ceramic dielectric filter with high power handling capability reduces the size and weight of products at the same frequency by employing ceramic and metal cavity loading technology, combined with adjusting the electrical performance through a silver-plated layer on the ceramic cover plate 1, thus achieving a miniaturized design. Simultaneously, the power handling capability of the filter is improved by utilizing the material characteristics of the ceramic cover plate 1, Kovar alloy cavity 2, PTFE insulation kit 3, and inner conductor sheet 4. Furthermore, the power handling capability is further guaranteed by adding a sealing ring 6 structure. In addition, this filter has a simple and reliable structure, significantly reducing the number of required parts, allowing for mass production and streamlined assembly, thus improving production efficiency. Compared with traditional filters, while miniaturizing, the power handling capability is significantly improved, meeting the market demand for high-power electrical performance, and the use of low-temperature solder paste welding technology ensures the safety of production operations.

[0062] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A miniaturized ceramic dielectric filter capable of handling high power, characterized in that, Includes a ceramic cover plate (1), a cavity (2), an insulating kit (3), an inner conductor sheet (4), and a connector (5); The ceramic cover plate (1) is provided with a silver plating layer and the ceramic cover plate (1) is sealed to the top of the cavity (2); The cavity (2) has an interface (21) on each of its symmetrical sides that penetrates the side wall of the cavity (2). Two insulating kits (3) are provided inside the cavity (2), and each corresponds to one of the interfaces (21); the inner conductor sheet (4) is provided inside the insulating kit (3); the insulating kit (3) includes an insulating base (31) and an insulating block (32). The insulating base (31) has a mounting groove (311) inside, the lower end of the inner conductor sheet (4) is inserted into the mounting groove (311), the insulating block (32) has a groove (321) on the side facing the inner conductor sheet (4), the upper end of the inner conductor sheet (4) extends into the groove (321), and the bottom surface of the insulating block (32) is in contact with the upper surface of the insulating base (31); The connector (5) passes through the interface (21), and the end of the connector (5) is connected to the inner conductor sheet (4); The inner conductor sheet (4) includes two parts, the lower part is a horizontally arranged horizontal sheet (41), and the upper part is a vertically arranged vertical sheet (42). The horizontal sheet (41) and the vertical sheet (42) are connected in an L-shape. The horizontal sheet (41) is inserted into the mounting groove (311), and the vertical sheet (42) is inserted into the groove (321). The transverse piece (41) is provided with a connecting hole (411), and the side wall of the mounting groove (311) is provided with a through hole (312) concentric with the connecting hole (411). The end of the connector (5) is provided with a first flange (51), which passes through the through hole (312) and is inserted into the connecting hole (411) so that the connector (5) is connected to the inner conductor piece (4).

2. A miniaturized ceramic dielectric filter capable of handling high power according to claim 1, characterized in that, The top of the vertical piece (42) is provided with a second flange (421), and the bottom of the groove (321) of the insulating block (32) is provided with a through hole (322) for the second flange (421) to pass through. The bottom of the ceramic cover plate (1) is provided with a coupling groove (11) corresponding to the position of the through hole (322). The second flange (421) passes through the through hole (322) and extends into the coupling groove (11).

3. A miniaturized ceramic dielectric filter capable of handling high power according to claim 1, characterized in that, The upper end of the insulating pressure block (32) is provided with a sealing groove (323), and a sealing ring (6) is provided in the sealing groove (323). When the ceramic cover plate (1) is sealed and connected to the top of the cavity (2), the sealing ring (6) is compressed between the insulating pressure block (32) and the ceramic cover plate (1) to achieve a seal.

4. A miniaturized ceramic dielectric filter capable of handling high power according to claim 1, characterized in that, The silver plating layer on the surface of the ceramic cover plate (1) has a non-uniform thickness distribution.

5. A miniaturized ceramic dielectric filter capable of handling high power according to claim 1, characterized in that, The inner conductor sheet (4) is made of brass and its entire surface is covered with an electroplated silver layer of uniform thickness.

6. A miniaturized ceramic dielectric filter capable of handling high power according to claim 1, characterized in that, The connector (5) is provided with a connecting flange (52), and the interface (21) is provided with an internal thread groove (211). A screw (53) passes through the connecting flange (52) and is threadedly connected to the internal thread groove (211), so that the connector (5) and the interface (21) are detachably connected.

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