Package structure and method of manufacturing the same

Abstract

The embodiments of the present disclosure disclose a packaging structure and a manufacturing method thereof, wherein the packaging structure comprises a substrate, at least one first interlayer on the substrate, the first interlayer having a first optical element therein; a plurality of light processing unit groups on the first interlayer, each light processing unit group comprising one or more spaced-apart light processing units; a second interlayer, and a light emitter on one side of the second interlayer in the thickness direction, the second interlayer being above the substrate, the second interlayer having a second optical element therein; wherein the light emitter is configured to emit a first light beam towards the second interlayer; the second optical element is configured to divide the first light beam into a plurality of second light beams that are spatially separated and to cause the second light beams to be incident into the first interlayer; and the first optical element is configured to guide the plurality of second light beams incident into the first interlayer to the plurality of light processing unit groups, respectively.

Description

Technical Field

[0001] This disclosure relates to the semiconductor field, and more particularly to a packaging structure and a method for manufacturing the same. Background Technology

[0002] In recent years, optical signal transmission and processing have been used in an increasing number of applications, particularly due to the application of fiber optics for signal transmission. Optical signal transmission and processing are often combined with electrical signal transmission and processing to provide comprehensive applications. For example, optical fibers can be used for long-range signal transmission, while electrical signals can be used for short-range signal transmission, processing, and control. Therefore, optoelectronic packaging devices integrating long-range optical components and short-range electronic components have been developed for the conversion between optical and electrical signals, as well as the processing of both.

[0003] However, existing optoelectronic packaging devices still have many problems that need to be improved. Summary of the Invention

[0004] This disclosure provides a packaging structure, including:

[0005] A substrate, and at least one first interposer layer located on the substrate, wherein a first optical element is present in the first interposer layer;

[0006] Multiple optical processing unit groups are located on the first intermediate layer, and each optical processing unit group includes one or more optical processing units arranged at intervals.

[0007] A second interposer and a light emitter located on one side of the second interposer in its thickness direction are situated above the substrate, and a second optical element is present within the second interposer; wherein...

[0008] The light emitter is configured to emit a first light beam toward a second interposer; the second optical element is configured to split the first light beam into a plurality of spatially separated second light beams and incident the second light beams into the first interposer; the first optical element is configured to guide the plurality of second light beams incident into the first interposer to a plurality of light processing unit groups respectively.

[0009] In some embodiments, the second interposer is located above the first interposer, a plurality of light processing unit groups are distributed around the second interposer in a direction parallel to the substrate plane, and each of the first interposer and the second interposer has an overlapping area in a direction perpendicular to the substrate plane, and the incident interface of the second light beam incident on the first interposer is located in the overlapping area.

[0010] In some embodiments, the second optical element includes a beam splitter configured to split the first beam into a plurality of outgoing beams propagating in different directions.

[0011] In some embodiments,

[0012] The beam splitter includes a reflecting structure having multiple non-coplanar and non-parallel reflecting portions, which reflect the first beam into multiple outgoing beams with different propagation directions and spatially separated; or,

[0013] The beam splitter includes a grating structure configured to convert a first beam into multiple outgoing beams with different propagation directions and spatially separated by a diffraction effect.

[0014] In some embodiments,

[0015] When the beam-splitting element includes a reflective structure, the reflective structure includes multiple reflective surfaces, the angle between any reflective surface and the propagation direction of the first beam is greater than 0° and less than 90°, and the angle between any two reflective surfaces is greater than 0° and less than 180°, the reflective surfaces constitute a reflective portion; or,

[0016] The reflective structure includes an arc-shaped reflective surface that protrudes toward the light emitter, and different areas of the arc-shaped reflective surface constitute the reflective part.

[0017] In some embodiments, the second optical element further includes:

[0018] Multiple first reflectors are disposed around the beam-splitting element. The first reflectors are used to adjust the propagation direction of the emitted beam so that the emitted beam enters the first intermediate layer; and / or,

[0019] Multiple first optical waveguides are arranged around the beam splitter and located on the propagation path of the outgoing beam.

[0020] In some embodiments, the encapsulation structure further includes an antireflection layer located on the side surface of the second interposer facing the light emitter and at least covering the incident surface of the first light beam incident on the second interposer.

[0021] In some embodiments, the light emitter is disposed on the side of the second interposer facing the substrate and bonded to the substrate; the packaging structure further includes a heat dissipation structure located inside the substrate and disposed below the light emitter.

[0022] In some embodiments, the first optical element includes:

[0023] Multiple second reflectors are provided, which are used to adjust the propagation direction of a second light beam incident on the first intermediate layer, so as to guide the second light beam to one or more light processing units of the light processing unit group; and / or,

[0024] Multiple second optical waveguides are positioned along the propagation path of the second beam.

[0025] This disclosure also provides a method for manufacturing a packaging structure, including:

[0026] Provide substrate;

[0027] At least one first interposer layer is formed, and a first optical element is formed within the first interposer layer, and the first interposer layer is fixed on the substrate;

[0028] Multiple optical processing unit groups are formed, each optical processing unit group includes one or more optical processing units, and the multiple optical processing unit groups are fixed on the first intermediary layer.

[0029] A second intermediate layer is formed, and a second optical element is formed within the second intermediate layer;

[0030] A light emitter is formed, and a second interposer and the light emitter are fixed above the substrate, with the light emitter located on one side of the second interposer in its thickness direction; wherein,

[0031] The light emitter is configured to emit a first light beam toward a second interposer; the second optical element is configured to split the first light beam into a plurality of spatially separated second light beams and incident the second light beams into the first interposer; the first optical element is configured to guide the plurality of second light beams incident into the first interposer to a plurality of light processing unit groups respectively.

[0032] In some embodiments, forming a second optical element within a second interposer layer includes: forming a beam splitter within the second interposer layer, the beam splitter being configured to split a first beam into a plurality of outgoing beams propagating in different directions.

[0033] In some embodiments, a second interposer layer is formed, and a second optical element is formed within the second interposer layer, including:

[0034] A first substrate is provided, and a first groove is formed within the first substrate;

[0035] A reflective material is formed on the sidewall of the first groove to form a reflective structure, which constitutes a beam splitting element; wherein the reflective structure includes multiple non-coplanar and non-parallel reflective parts, which are used to reflect the first beam into multiple outgoing beams with different propagation directions and spatially separated.

[0036] In some embodiments, a second interposer layer is formed, and a second optical element is formed within the second interposer layer, including:

[0037] A second substrate is provided, and a plurality of periodically arranged second grooves are formed in the second substrate to form a grating structure in the second substrate. The grating structure is configured to convert a first beam into a plurality of outgoing beams with different propagation directions and spatially separated by a diffraction effect. The grating structure constitutes a beam splitting element.

[0038] In some embodiments, forming a second optical element within a second interposer layer further includes:

[0039] A plurality of first reflective elements are formed within the second intermediate layer, and the plurality of first reflective elements are disposed around the beam-splitting element to adjust the propagation direction of the emitted beam so that the emitted beam is incident into the first intermediate layer; and / or,

[0040] Multiple first optical waveguides are formed within the second intermediate layer. These first optical waveguides are disposed around the beam splitter and located on the propagation path of the emitted beam.

[0041] In some embodiments, after forming the second intermediary layer, the method further includes:

[0042] An antireflection layer is formed on one side surface of the second interposer. The antireflection layer is located on the side surface of the second interposer facing the light emitter and at least covers the incident surface of the first light beam when it is incident on the second interposer.

[0043] In some embodiments, after providing the substrate, the method further includes:

[0044] A heat dissipation structure is formed inside the substrate, the light emitter is disposed on the surface of the substrate, and the heat dissipation structure is disposed below the light emitter.

[0045] In some embodiments, a first optical element is formed within a first interposer layer, including:

[0046] Multiple second reflectors are formed within the first intermediate layer. These second reflectors are used to adjust the propagation direction of a second light beam incident upon the first intermediate layer, guiding the second light beam to one or more light processing units within the light processing unit group; and / or,

[0047] Multiple second optical waveguides are formed within the first intermediate layer, and the second optical waveguides are positioned on the propagation path of the second beam.

[0048] In this embodiment, the second optical element located within the second interposer can divide the first beam emitted by the light emitter into multiple spatially separated second beams, and the first optical element located within the first interposer can guide the multiple second beams to multiple optical processing unit groups respectively. Thus, through the cooperation of the first and second optical elements, the first beam emitted by one light emitter can be distributed to multiple optical processing units, effectively improving the light source utilization of the light emitter and the integration of the packaging structure; at the same time, compared with the solution of externally mounted multiple lasers, the optical path transmission distance can be reduced and optical loss can be reduced.

[0049] Details of one or more embodiments of this disclosure are set forth in the following drawings and description. Other features and advantages of this disclosure will become apparent from the specification and the drawings. Attached Figure Description

[0050] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of the packaging structure provided in some embodiments of this disclosure;

[0052] Figure 2 for Figure 1 A top-down view;

[0053] Figure 3 for Figure 1 A schematic diagram of the structure of the second interposer layer and the second optical element;

[0054] Figure 4 This is a schematic diagram of the packaging structure provided in some other embodiments of this disclosure;

[0055] Figure 5 for Figure 4 A top-down view;

[0056] Figure 6 for Figure 4 A schematic diagram of the structure of the second interposer layer and the second optical element;

[0057] Figure 7 This is a schematic diagram of the packaging structure provided in some embodiments of the present disclosure;

[0058] Figure 8 for Figure 7 A schematic diagram of the structure of the second interposer layer and the second optical element;

[0059] Figure 9 This is a top view schematic diagram of a grating structure provided in some embodiments of the present disclosure;

[0060] Figure 10 A top view schematic diagram of a grating structure provided for other embodiments of this disclosure;

[0061] Figure 11 Schematic diagram of the packaging structure provided in some embodiments of this disclosure;

[0062] Figure 12 This is a schematic diagram of the packaging structure provided in some other embodiments of this disclosure;

[0063] Figure 13 for Figure 12 A top-down view;

[0064] Figure 14This is a flowchart illustrating a method for manufacturing a packaging structure provided in some embodiments of this disclosure;

[0065] Figure 15 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 1 ;

[0066] Figure 16 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 2 ;

[0067] Figure 17 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 3 ;

[0068] Figure 18 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 4 ;

[0069] Figure 19 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 5 ;

[0070] Figure 20 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 6 ;

[0071] Figure 21 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 7 ;

[0072] Figure 22 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 8 ;

[0073] Figure 23 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 9 ;

[0074] Figure 24 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 10 ;

[0075] Figure 25 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 10 one;

[0076] Figure 26 Schematic diagram of the packaging structure provided in other embodiments of this disclosure during the manufacturing process Figure 10 two;

[0077] Figure 27 Schematic diagram of the packaging structure provided in other embodiments of this disclosure during the manufacturing process Figure 10 three;

[0078] Figure 28 Schematic diagram of the packaging structure provided in other embodiments of this disclosure during the manufacturing process Figure 10 Four;

[0079] Figure 29 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 10 five;

[0080] Figure 30 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 10 six;

[0081] Figure 31 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 10 seven;

[0082] Figure 32 Schematic diagram of the packaging structure provided in some embodiments of this disclosure during the manufacturing process Figure 10 eight. Detailed Implementation

[0083] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0084] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In other instances, to avoid confusion with this disclosure, certain technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0085] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0086] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this disclosure.

[0087] Spatial relation terms such as “below,” “under,” “below,” “below,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0088] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprise” and / or “comprising,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0089] Optoelectronic packaging devices typically include a substrate and a laser and a photonic integrated circuit (PIC) located on the substrate. A laser usually provides a light source for only one photonic integrated circuit adjacent to it, resulting in low light source utilization.

[0090] Based on this, the technical solution of the present disclosure is proposed. In the present disclosure, the second optical element located in the second intermediate layer can divide the first beam emitted by the light emitter into multiple spatially separated second beams, and the first optical element located in the first intermediate layer can guide the multiple second beams to multiple optical processing unit groups respectively. In this way, through the cooperation of the first optical element and the second optical element, the first beam emitted by one light emitter can be distributed to multiple optical processing units, effectively improving the light source utilization of the light emitter and the integration of the packaging structure; at the same time, compared with the solution of externally mounted multiple lasers, the optical path transmission distance can be reduced and the optical loss can be reduced.

[0091] To make the above-mentioned objects, features, and advantages of this disclosure more apparent and understandable, the specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this disclosure in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to general proportions, and the schematic diagrams are merely examples and should not limit the scope of protection of this disclosure.

[0092] like Figures 1 to 13 As shown, this disclosure provides a packaging structure including: a substrate 10, and at least one first interposer 11 located on the substrate 10, the first interposer 11 having a first optical element 12 therein; a plurality of light processing unit groups 13 located on the first interposer 11, each light processing unit group 13 including one or more light processing units 131 arranged at intervals; a second interposer 16, and a light emitter 22 located on one side of the second interposer 16 in its thickness direction, located above the substrate 10, the second interposer 16 having a second optical element 17 therein; wherein, the light emitter 22 is configured to emit a first light beam L1 toward the second interposer 16; the second optical element 17 is configured to divide the first light beam L1 into a plurality of spatially separated second light beams L2, and incident the second light beams L2 into the first interposer 11; the first optical element 12 is configured to guide the plurality of second light beams L2 incident into the first interposer 11 to the plurality of light processing unit groups 13 respectively.

[0093] In some embodiments, the substrate 10 may include, but is not limited to, a printed circuit board (PCB). In some embodiments, a plurality of conductive contacts 101 may be provided on the side of the substrate 10 facing the first interposer 11, and the first interposer 11 may be electrically connected to the substrate 10 through the plurality of conductive contacts 101.

[0094] In some embodiments, the first interposer 11 may be a multilayer structure formed in multiple process steps. For example, the first interposer 11 may include a substrate (e.g., a silicon substrate) and a dielectric material layer located on the substrate, and the first optical element 12 may be formed within the dielectric material layer.

[0095] The number of the first intermediary layer 11 can be one or more. For example... Figure 2 As shown, when there are multiple first intermediary layers 11, one optical processing unit group 13 can be provided on one first intermediary layer 11. However, it is not limited to this, and multiple optical processing unit groups 13 can also be provided on one first intermediary layer 11.

[0096] In some embodiments, a plurality of optical processing unit groups 13 may be arranged around the second intermediary layer 16 to shorten the optical path of the second beam L2 emitted from the second intermediary layer 16 to the optical processing unit group 13.

[0097] like Figure 2 As shown, in some embodiments, the number of light processing unit groups 13 can be four. The four light processing unit groups 13 can be disposed on one side of the second interposer layer 16 along the first direction, the second direction, the third direction and the fourth direction, respectively. The first direction, the second direction, the third direction and the fourth direction can all be parallel to the plane of the substrate 10, and the first direction and the second direction can be perpendicular or oblique. The first direction and the third direction can be opposite, and the second direction and the fourth direction can be opposite.

[0098] It should be noted that the number and arrangement of the light processing unit groups 13 are not limited to... Figure 2 As shown, the light processing unit group 13 can also be disposed on different sides of the second interposer layer 16 in other directions.

[0099] like Figure 2 As shown, a group of optical processing units 13 may include one optical processing unit 131. However, it is not limited to this, as shown in... Figure 12 and Figure 13 As shown, a light processing unit group 13 may also include multiple light processing units 131.

[0100] In some embodiments, the optical processing unit 131 includes optical devices capable of processing and controlling optical signals, such as a PLC, modulator, optical amplifier, optical switch, etc. In some embodiments, the optical processing unit 131 may also include a photonic integrated circuit (PIC) that integrates multiple optical devices on a single microchip.

[0101] like Figure 1 As shown, in some embodiments, the packaging structure may further include multiple electronic integrated circuits (EICs) 14; wherein, the multiple electronic integrated circuits 14 may be respectively disposed on multiple optical processing units 131 and bonded to the optical processing units 131; the electronic integrated circuits 14 integrate electronic components such as transistors, resistors, and capacitors on a single chip and can be used to provide drive current for the optical processing units 131.

[0102] In some embodiments, the package structure may further include at least one application-specific integrated circuit (ASIC) 15, which may be electrically connected to the optical processing unit 131. An ASIC 15 may serve as a driver chip or a control chip to provide power drive and control signals to one or more optical processing units 131.

[0103] like Figure 1 and Figure 2 As shown, in some embodiments, the application-specific integrated circuit 15 may be disposed on the first interposer layer 11 and bonded to the first interposer layer 11; an interconnect structure 111 may also be disposed in the first interposer layer 11, and the application-specific integrated circuit 15 may be electrically connected to the optical processing unit 131 through the interconnect structure 111.

[0104] In practice, the optical processing unit 131 and the first interposer 11, the application-specific integrated circuit 15 and the first interposer 11, and the optical processing unit 131 and the electronic integrated circuit 14 can be bonded together by hybrid bonding or flip-chip bonding.

[0105] But not limited to this, such as Figure 13 As shown, in some embodiments, the application-specific integrated circuit 15 (ASIC 15) can also be disposed on the surface of the substrate 10. The ASIC 15 can be electrically connected to the substrate 10 through conductive contacts 101, and electrically connected to the light processing unit 131 through conductive structures (not shown) within the substrate 10 and the first interposer layer 11. In some embodiments, the ASIC 15 can be disposed in a corner region of the substrate 10. However, it is not limited to this; the ASIC 15 can also be disposed in other unused areas of the substrate 10, depending on the actual situation.

[0106] like Figure 1 As shown, in some embodiments, the second interposer 16 may be located above the first interposer 11. Multiple optical processing unit groups 13 may be distributed around the second interposer 16 in a direction parallel to the plane of the substrate 10. Each first interposer 11 and the second interposer 16 has an overlapping area in a direction perpendicular to the plane of the substrate 10. The incident interface of the second beam L2 into the first interposer 11 is located in the overlapping area. The second interposer 16 and the substrate 10 are spaced apart, allowing the second beam L2 to enter the first interposer 11 from the lower surface of the second interposer 16. Thus, by providing an overlapping area between the second interposer 16 and the first interposer 11 in a direction perpendicular to the plane of the substrate 10, the integration of the first interposer 11 and the second interposer 16 can be increased, improving the space utilization of the substrate 10. Simultaneously, it facilitates the second beam L2 entering the first interposer 11 from the second interposer 16, reducing optical path length and optical loss.

[0107] But not limited to this, such as Figure 11As shown, in some other embodiments, the second interposer 16 may also be disposed adjacent to the first interposer 11 in a direction parallel to the plane of the substrate 10, and one or more first interposers 11 may be disposed around the second interposer 16 so that the second beam L2 may be incident from the sidewall of the second interposer 16 into one or more first interposers 11. The second interposer 16 may be directly fixed to the surface of the substrate 10 to increase the applicability of different scenarios.

[0108] In some embodiments, the light emitter 22 can be a laser chip that emits a first light beam L1 based on the electroluminescence effect of a semiconductor PN junction. However, it is not limited to this; the light emitter 22 can also be a thermal radiation source, a gas discharge source, etc.

[0109] In this embodiment, the light emitter 22 is disposed on one side of the second interposer 16 along the thickness direction of the second interposer 16, and the light emitter 22 is far away from the heat-sensitive light processing unit 131. In this way, the heat generated by the light emitter 22 during operation can be avoided or reduced from causing damage to the light processing unit 131.

[0110] like Figure 1 As shown, in some embodiments, the light emitter 22 can be disposed along the thickness direction of the second interposer 16 on the side of the second interposer 16 near the substrate 10 and bonded to the substrate 10. The packaging structure may further include a heat dissipation structure 23 located within the substrate 10 and disposed below the light emitter 22. The light emitter 22 can be electrically connected to the substrate 10, and the heat dissipation structure 23 can be a thermally conductive via, a metal layer, or a microfluidic channel, etc. Thus, the heat dissipation structure 23 can improve the heat dissipation efficiency of the light emitter 22, thereby improving the reliability of the packaging structure.

[0111] But not limited to this, such as Figure 11 As shown, in some other embodiments of this application, the light emitter 22 may also be disposed along the thickness direction of the second interposer 16 on the side of the second interposer 16 away from the substrate 10, so as to increase the applicability of different scenarios.

[0112] In some embodiments, the second optical element 17 may include a beam splitter 171 configured to split the first beam L1 into a plurality of outgoing beams L3 propagating in different directions, thereby guiding the outgoing beams L3 propagating in different directions to the light processing unit group 13 located in different regions.

[0113] like Figures 1 to 3 as well as Figures 4 to 6As shown, in some embodiments, the beam splitter 171 may include a reflective structure 18 having multiple non-coplanar and non-parallel reflective portions 181. These multiple reflective portions 181 are used to reflect the first beam L1 into multiple outgoing beams L3 with different propagation directions and spatially separated. Thus, the first beam L1 can be split into multiple outgoing beams L3 propagating in different directions using the principle of reflection.

[0114] like Figures 1 to 3 As shown, in some embodiments, the reflective structure 18 may include multiple reflective surfaces S1, the angle between any reflective surface S1 and the propagation direction of the first beam L1 is greater than 0° and less than 90°, and the angle between any two reflective surfaces S1 is greater than 0° and less than 180°. The reflective surfaces S1 constitute a reflective part 181. In this way, by reflecting the first beam L1 through multiple reflective surfaces S1, the first beam L1 can be divided into multiple outgoing beams L3.

[0115] like Figure 2 As shown, in some embodiments, the reflective structure 18 may include four reflective surfaces S1, and the reflective surfaces S1 of the reflective structure 18 may be planar reflective surfaces. The four reflective surfaces S1 may form a tetrahedral structure, and the four reflective surfaces S1 may divide the first beam L1 into four outgoing beams L3 that propagate in four directions, such as the first direction, the second direction, the third direction, and the fourth direction, respectively. In this way, when the light processing unit group 13 is disposed on one side of the second interposer layer 16 along the first direction, the second direction, the third direction, and the fourth direction, the optical path length of the outgoing beam L3 incident on the light processing unit group 13 can be reduced.

[0116] However, this is not the only one. In some embodiments, the reflective surface S1 can also be arc-shaped, and the reflective structure 18 can also include more or fewer reflective surfaces S1, such as 2, 3, 5, 10, etc., to divide the first beam L1 into more or fewer outgoing beams L3. The propagation direction of the outgoing beam L3 can be adjusted by adjusting the angle between the reflective surface S1 and the propagation direction of the first beam L1, as well as the angle between any two reflective surfaces S1.

[0117] Thus, in actual operation, the number and angle of the reflective surfaces S1 can be adjusted according to the distribution position and number of the light processing unit group 13, thereby adjusting the number and propagation direction of the emitted beams L3, so as to guide multiple emitted beams L3 to the light processing unit group 13 and improve scene applicability.

[0118] In some embodiments, the propagation direction of the emitted light beam L3 may be parallel to the plane of the substrate 10. However, it is not limited to this; the propagation direction of the emitted light beam L3 may also have a first preset angle with the direction parallel to the plane of the substrate 10 to increase the applicability of different scenarios.

[0119] like Figure 1 As shown, in some embodiments, the second optical element 17 may further include: a plurality of first reflectors 172 disposed around the beam splitter 171. The first reflectors 172 are used to adjust the propagation direction of the emitted beam L3 so that the emitted beam L3 enters the first interposer layer 11. For example, when the second interposer layer 16 is disposed above the first interposer layer 11, and the emitted beam L3 cannot directly enter the first interposer layer 11, the first reflectors 172 can be used to adjust the propagation direction of the emitted beam L3. In some embodiments, the emitted beam L3 forms a second beam L2 after its propagation direction is adjusted by the first reflectors 172. The propagation direction of the second beam L2 may be perpendicular to the plane of the substrate 10. However, it is not limited to this; the propagation direction of the second beam L2 may also have a second preset angle with the direction perpendicular to the plane of the substrate 10 to increase the applicability of different scenarios.

[0120] In some embodiments, the second optical element 17 may further include a plurality of first optical waveguides 173 disposed around the beam splitter 171 and located on the propagation path of the outgoing beam L3, wherein the first optical waveguides 173 may be used to constrain the propagation direction of the outgoing beam L3.

[0121] In some embodiments, the incident end of the first optical waveguide 173 may be disposed toward the beam splitter 171, and the first reflector 172 may be disposed at the emitting end of the first optical waveguide 173. Multiple first optical waveguides 173 may be disposed between the first reflector 172 and the beam splitter 171, and the first optical waveguides 173 may extend along the propagation direction of the emitted beam L3. However, this is not a limitation; the first optical waveguide 173 may not be disposed between the beam splitter 171 and the first reflector 172.

[0122] like Figure 11 As shown, in some other embodiments of this disclosure, when the second interposer 16 is disposed adjacent to the first interposer 11 in a direction parallel to the plane of the substrate 10, the first reflector 172 may not be provided. The emitted beam L3 is coupled through the first optical waveguide 173 to form the second beam L2. The second beam L2 can be directly incident into the first interposer 11 to increase the applicability of the scene.

[0123] like Figures 4 to 6 As shown, in some other embodiments of this disclosure, the reflective structure 18 may include an arc-shaped reflective surface S2 protruding toward the light emitter 22, and different regions of the arc-shaped reflective surface S2 constitute a reflective portion 181. The arc-shaped reflective surface S2 may be a sphere, an ellipsoid, or a freeform surface, etc.

[0124] Understandably, the light rays in the emitted beam L3 reflected by the arc-shaped reflective surface S2 propagate in different directions. Through the coupling effect of the first optical waveguide 173, the light rays propagating in a preset direction (e.g., a direction parallel to the plane of the substrate 10) and a portion of the light rays propagating in a direction having a third preset angle with the preset direction can be coupled into an independently propagated beam. This beam can be deflected by the first reflector 172 and then incident on the first intermediate layer 11 as the second beam L2, or it can be directly incident on the first intermediate layer 11 as the second beam L2.

[0125] Figure 4 The second beam L2 shown propagates along the first direction, the second direction, the third direction, and the fourth direction, respectively. However, it is not limited to this; more or fewer second beams L2 propagating in different directions can be formed by adjusting the number and position of the first optical waveguide 173.

[0126] In actual operation, the materials of the reflective structure 18 and the first reflective element 172 can be the same or different. The materials of the reflective structure 18 and the first reflective element 172 can include, but are not limited to, metallic reflective materials, such as one or more of copper, aluminum, tantalum, aluminum-copper alloy, and aluminum-copper-silicon alloy. The material of the first optical waveguide 173 can include, but is not limited to, silicon nitride.

[0127] In practice, the second intermediary layer 16 may include a multi-layer structure formed in multiple process steps, and the structure of the second intermediary layer 16 will be described in detail in the subsequent manufacturing method.

[0128] like Figures 7 to 8 As shown, in some embodiments, the beam splitter 171 may further include a grating structure 19, which is configured to convert the first beam L1 into multiple outgoing beams L3 with different propagation directions and spatially separated by a diffraction effect. Thus, the first beam L1 can be divided into multiple outgoing beams L3 propagating in different directions using a diffraction effect.

[0129] The grating structure 19 may include a plurality of second grooves T2 arranged periodically. For example... Figure 9 As shown, in some embodiments, the grating structure 19 may include a plurality of second grooves T2 extending along a first direction and arranged along a second direction. The grating structure 19 can divide the first beam L1 into two outgoing beams L3 propagating along the second direction and in a direction opposite to the second direction (e.g., a fourth direction). Figure 10 As shown, in some other embodiments, the grating structure 19 may include a plurality of second grooves T2 arranged in an array along the first direction and the second direction. The grating structure 19 can divide the first beam L1 into four outgoing beams L3 that propagate along the first direction, the second direction and the direction opposite to the first direction and the second direction (e.g., the third direction and the fourth direction).

[0130] However, it is not limited to this. The second groove T2 of the grating structure 19 can also have other shapes and arrangements to divide the first beam L1 into more or fewer outgoing beams L3 that propagate in different directions.

[0131] In some embodiments, the second optical element 17 may further include a cone 174, through which the first optical waveguide 173 is connected to the grating structure 19.

[0132] In practice, the second interposer 16 may include a second substrate 163. The grating structure 19, the cone 174 connected to the grating structure 19, and the first optical waveguide 173 connected to the cone 174 can be formed by etching the second substrate 163. The specific structure of the second interposer 16 will be described in detail in the subsequent manufacturing method.

[0133] In some other embodiments of this disclosure, the beam splitting element 171 may also include other optical elements capable of beam splitting, such as prisms; the second optical element 17 may also include other optical elements capable of adjusting the propagation path of the emitted light L3, such as focusing lenses, collimating lenses, etc., which can be set according to actual conditions.

[0134] In some embodiments, the encapsulation structure may further include an antireflection layer 21, which is located on the side surface of the second interposer 16 facing the light emitter 22 and at least covers the incident surface of the first light beam L1 onto the second interposer 16, thereby increasing the transmittance of the first light beam L1 and reducing light loss. In some embodiments, the antireflection layer 21 may also cover the exit surface of the second light beam L2 emitted from the second interposer 16, further reducing light loss.

[0135] In some embodiments, the first optical element 12 may include: a plurality of second reflectors 121, the second reflectors 121 being used to adjust the propagation direction of the second beam L2 incident on the first intermediary layer 11, so as to guide the second beam L2 to one or more optical processing units 131 of the optical processing unit group 13; and / or, a plurality of second optical waveguides 122, disposed on the propagation path of the second beam L2.

[0136] In actual operation, the material of the second reflector 121 can be the same as that of the first reflector 172, and the material of the second optical waveguide 122 can be the same as that of the first optical waveguide 173.

[0137] like Figure 12 and Figure 13As shown, in some embodiments, when the light processing unit group 13 includes a plurality of light processing units 131, the second optical element 17 can guide a second light beam L2 to the plurality of light processing units 131 of the light processing unit group 13 respectively.

[0138] In some embodiments, the plurality of light processing units 131 of a light processing unit group 13 can be arranged at intervals along the propagation direction of the second beam L2. A plurality of second reflectors 121 can be respectively disposed below the plurality of light processing units 131 to guide the second beam L2 to the plurality of light processing units 131 of the light processing unit group 13. However, this is not a limitation. When the light processing unit group 13 includes a plurality of light processing units 131, the plurality of light processing units 131 can also have other arrangement methods, and the placement position of the second optical element 17 can be adjusted according to the arrangement method of the light processing units 131.

[0139] In some embodiments, the second optical element 17 may also include optical elements such as a focusing lens, a collimating lens, and a prism that can adjust the propagation path of the second beam L2, which can be configured according to actual conditions.

[0140] As can be seen from the present embodiment, the second optical element 17 located within the second intermediary layer 16 can divide the first beam L1 emitted by the light emitter 22 into multiple spatially separated second beams L2, and the first optical element 12 located within the first intermediary layer 11 can guide the multiple second beams L2 to multiple light processing unit groups 13 respectively. Thus, through the cooperation of the first optical element 12 and the second optical element 17, the first beam L1 emitted by one light emitter 22 can be distributed to multiple light processing units 131, effectively improving the light source utilization rate of the light emitter 22 and the integration of the packaging structure; at the same time, compared with the solution of externally mounted multiple lasers, the optical path transmission distance can be reduced and the optical loss can be reduced.

[0141] This disclosure also provides a method for manufacturing a packaging structure. For example... Figure 14 As shown, the manufacturing method includes:

[0142] Step S101: Provide a substrate;

[0143] Step S102: Form at least one first interposer layer, and form a first optical element within the first interposer layer, and fix the first interposer layer onto the substrate;

[0144] Step S103: Form multiple light processing unit groups, each light processing unit group including one or more light processing units, and fix the multiple light processing unit groups on the first interposer layer;

[0145] Step S104: Form a second interposer layer and form a second optical element within the second interposer layer; form a light emitter, fix the second interposer layer and the light emitter above the substrate, with the light emitter located on one side of the second interposer layer in its thickness direction; wherein,

[0146] The light emitter is configured to emit a first light beam toward a second interposer; the second optical element is configured to split the first light beam into a plurality of spatially separated second light beams and incident the second light beams into the first interposer; the first optical element is configured to guide the plurality of second light beams incident into the first interposer to a plurality of light processing unit groups respectively.

[0147] The manufacturing method provided by the embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0148] First, execute step S101, as follows: Figure 15 As shown, a substrate 10 is provided.

[0149] In some embodiments, substrate 10 may include, but is not limited to, a printed circuit board (PCB).

[0150] Next, proceed to step S102, as follows: Figures 16 to 17 As shown, at least one first interposer layer 11 is formed, and a first optical element 12 is formed within the first interposer layer 11, and the first interposer layer 11 is fixed to the substrate 10.

[0151] In some embodiments, after providing the substrate 10, the method further includes: providing a plurality of conductive contacts 101 on the substrate 10, wherein the first intermediary layer 11 can be fixedly connected to the substrate 10 through the plurality of conductive contacts 101.

[0152] The number of the first intermediary layer 11 can be one or more. For example... Figure 17 As shown, when there are multiple first interposer layers 11, the multiple first interposer layers 11 can be arranged along a ring direction. For example, the number of first interposer layers 11 can be four, where two first interposer layers 11 can be arranged opposite each other along a first direction, and the other two first interposer layers 11 can be arranged opposite each other along a second direction. Both the first direction and the second direction are parallel to the plane of the substrate 10, and the first direction and the second direction can intersect or be perpendicular. However, this is not the only possibility; the multiple first interposer layers 11 can also have other arrangements.

[0153] In some embodiments, the first interposer 11 may be a multilayer structure formed in multiple process steps. For example, the first interposer 11 may include a substrate (e.g., a silicon substrate) and a dielectric material layer located on the substrate, and the first optical element 12 may be formed within the dielectric material layer.

[0154] In some embodiments, forming a first optical element 12 within a first interposer layer 11 may include: forming a plurality of second reflectors 121 within the first interposer layer 11; and / or forming a plurality of second optical waveguides 122 within the first interposer layer.

[0155] Next, proceed to step S103, as follows: Figures 18 to 19 As shown, multiple light processing unit groups 13 are formed, each light processing unit group 13 including one or more light processing units 131, and the multiple light processing unit groups 13 are fixed on the first intermediary layer 11.

[0156] When there are multiple first intermediary layers 11, one optical processing unit group 13 can be set on one first intermediary layer 11. However, it is not limited to this, and multiple optical processing unit groups 13 can also be set on one first intermediary layer 11.

[0157] In some embodiments, the optical processing unit 131 includes optical devices capable of processing and controlling optical signals, such as a PLC, modulator, optical amplifier, optical switch, etc. In some embodiments, the optical processing unit 131 may also include a photonic integrated circuit (PIC) that integrates multiple optical devices on a single microchip.

[0158] like Figures 18 to 19 As shown, in some embodiments, the method may further include: forming a plurality of electronic integrated circuits (EICs) 14, and disposing the plurality of electronic integrated circuits 14 on a plurality of optical processing units 131 respectively, and bonding them to the optical processing units 131; the electronic integrated circuits 14 integrate electronic components such as transistors, resistors, and capacitors on a single chip, and can be used to provide drive current to the optical processing units 131.

[0159] In some embodiments, the method may further include: forming at least one application-specific integrated circuit (ASIC) 15, which may be electrically connected to the optical processing unit 131. An ASIC 15 may serve as a driver chip or a control chip to provide power drive and control signals to one or more optical processing units 131.

[0160] like Figures 18 to 19 As shown, in some embodiments, the application-specific integrated circuit 15 may be disposed on the first interposer layer 11 and bonded to the first interposer layer 11; an interconnect structure 111 may also be disposed in the first interposer layer 11, and the application-specific integrated circuit 15 may be electrically connected to the optical processing unit 131 through the interconnect structure 111.

[0161] In practice, the optical processing unit 131 and the first interposer 11, the application-specific integrated circuit 15 and the first interposer 11, and the optical processing unit 131 and the electronic integrated circuit 14 can be bonded together by hybrid bonding or flip-chip bonding.

[0162] But not limited to this, such as Figure 13 As shown, in some embodiments, the application-specific integrated circuit 15 (ASIC 15) can also be disposed on the surface of the substrate 10. The ASIC 15 can be electrically connected to the substrate 10 through conductive contacts 101, and electrically connected to the light processing unit 131 through conductive structures (not shown) within the substrate 10 and the first interposer layer 11. In some embodiments, the ASIC 15 can be disposed in a corner region of the substrate 10. However, it is not limited to this; the ASIC 15 can also be disposed in other unused areas of the substrate 10, depending on the actual situation.

[0163] Next, proceed to step S104, as follows: Figures 20 to 25 ,as well as Figures 1 to 3 As shown, a second interposer 16 is formed, and a second optical element 17 is formed within the second interposer 16; a light emitter 22 is formed, and the second interposer 16 and the light emitter 22 are fixed above the substrate 10, with the light emitter 22 located on one side of the second interposer 16 in its thickness direction; wherein,

[0164] The light emitter 22 is configured to emit a first beam L1 toward the second interposer layer 16; the second optical element 17 is configured to divide the first beam L1 into a plurality of spatially separated second beams L2 and incident the second beams L2 into the first interposer layer 11; the first optical element 12 is configured to guide the plurality of second beams L2 incident into the first interposer layer 11 to a plurality of light processing unit groups 13 respectively.

[0165] like Figure 1 As shown, in some embodiments, the second interposer 16 may be located above the first interposer 11. Multiple optical processing unit groups 13 may be distributed around the second interposer 16 in a direction parallel to the plane of the substrate 10. Each first interposer 11 and the second interposer 16 has an overlapping area in a direction perpendicular to the plane of the substrate 10. The incident interface of the second beam L2 into the first interposer 11 is located in the overlapping area. The second interposer 16 and the substrate 10 are spaced apart, allowing the second beam L2 to enter the first interposer 11 from the lower surface of the second interposer 16. Thus, by providing an overlapping area between the second interposer 16 and the first interposer 11 in a direction perpendicular to the plane of the substrate 10, the integration of the first interposer 11 and the second interposer 16 can be increased, improving the space utilization of the substrate 10. Simultaneously, it facilitates the second beam L2 entering the first interposer 11 from the second interposer 16, reducing optical path length and optical loss.

[0166] But not limited to this, such as Figure 11As shown, in some other embodiments, the second interposer 16 may also be disposed adjacent to the first interposer 11 in a direction parallel to the plane of the substrate 10, and one or more first interposers 11 may be disposed around the second interposer 16 so that the second beam L2 may be incident from the sidewall of the second interposer 16 into one or more first interposers 11. The second interposer 16 may be directly fixed to the surface of the substrate 10 to increase the applicability of different scenarios.

[0167] In some embodiments, the light emitter 22 can be a laser chip that emits a first light beam L1 based on the electroluminescence effect of a semiconductor PN junction. However, it is not limited to this; the light emitter 22 can also be a thermal radiation source, a gas discharge source, etc.

[0168] In this embodiment, the light emitter 22 is disposed on one side of the second interposer 16 along the thickness direction of the second interposer 16, and the light emitter 22 is far away from the heat-sensitive light processing unit 131. In this way, the heat generated by the light emitter 22 during operation can be avoided or reduced from causing damage to the light processing unit 131.

[0169] See you again Figure 16 In some embodiments, after providing the substrate 10, the method further includes: forming a heat dissipation structure 23 within the substrate 10; as shown in the figure. Figure 1 As shown, the light emitter 22 can be disposed on the surface of the substrate 10, and the heat dissipation structure 23 is disposed below the light emitter 22. The light emitter 22 can be electrically connected to the substrate 10, and the heat dissipation structure 23 can be a thermally conductive via, a metal layer, or a microfluidic channel, etc. Thus, the heat dissipation structure 23 can improve the heat dissipation efficiency of the light emitter 22, thereby improving the reliability of the packaging structure.

[0170] But not limited to this, such as Figure 11 As shown, in some other embodiments of this application, the light emitter 22 may also be disposed along the thickness direction of the second interposer 16 on the side of the second interposer 16 away from the substrate 10, so as to increase the applicability of different scenarios.

[0171] In some embodiments, a plurality of optical processing unit groups 13 may be arranged around the second intermediary layer 16 to shorten the optical path of the second beam L2 emitted from the second intermediary layer 16 to the optical processing unit group 13.

[0172] like Figure 2As shown, in some embodiments, the number of light processing unit groups 13 can be four. The four light processing unit groups 13 can be disposed on one side of the second interposer layer 16 along the first direction, the second direction, the third direction and the fourth direction, respectively. The first direction, the second direction, the third direction and the fourth direction can all be parallel to the plane of the substrate 10, and the first direction and the second direction can be perpendicular or oblique. The first direction and the third direction can be opposite, and the second direction and the fourth direction can be opposite.

[0173] It should be noted that the number and arrangement of the light processing unit groups 13 are not limited to... Figure 2 As shown, the light processing unit group 13 can also be disposed on different sides of the second interposer layer 16 in other directions.

[0174] Thus, in this embodiment of the present disclosure, by providing a second interposer 16 and a second optical element 17, as well as a first interposer 11 and a first optical element 12, the first beam L1 can be divided into multiple second beams L2, and the second beams L2 can be guided to multiple light processing unit groups 13. The manufacturing method of the second interposer 16 and the second optical element 17 provided in this embodiment of the present disclosure will be further described below with reference to the accompanying drawings.

[0175] See you again Figures 20 to 23 In some embodiments, a second optical element 17 is formed within the second intermediary layer 16, including: forming a beam splitter 171 within the second intermediary layer 16, the beam splitter 171 being configured to split the first beam L1 into a plurality of outgoing beams L3 propagating in different directions, thereby guiding the outgoing beams L3 propagating in different directions to the light processing unit group 13 located in different regions.

[0176] See also Figures 20 to 23 In some embodiments, a second interposer layer 16 is formed, and a second optical element 17 is formed within the second interposer layer 16, including:

[0177] A first substrate 161 is provided, and a first recess T1 is formed within the first substrate 161 (e.g. Figures 20 to 22 );

[0178] A reflective material is formed on the sidewall of the first groove T1 to form a reflective structure 18, which constitutes a beam splitter 171. The reflective structure 18 includes multiple non-coplanar and non-parallel reflective portions 181, which reflect the first beam L1 into multiple outgoing beams L3 with different propagation directions and spatially separated. Thus, the first beam L1 can be divided into multiple outgoing beams L3 propagating in different directions using the principle of reflection.

[0179] See you again Figures 20 to 22In some embodiments, a first substrate 161 is provided, and a first recess T1 is formed within the first substrate 161, including: firstly, as... Figure 20 As shown, a first sublayer 1611 is provided, the material of which includes, but is not limited to, silicon; a second sublayer 1612 is formed on the first sublayer 1611, the material of which includes a light-transmitting material, such as silicon oxide; the first sublayer 1611 and the second sublayer 1612 constitute a first substrate 161; then, as... Figure 21 As shown, a photoresist layer M is formed on the first substrate 161, and an opening K is formed in the photoresist layer M by processes such as imprinting or grayscale etching. The pattern of the opening K has the same morphology as the first groove T1 to be formed; then, as... Figure 22 As shown, the second sub-layer 1612 is etched using the mask layer M as a mask to form a first groove T1 in the second sub-layer 1612.

[0180] like Figure 22 and Figure 23 As shown, in some embodiments, the first groove T1 includes a plurality of inclined sidewalls W1, the angle between any sidewall W1 and the propagation direction of the first beam L1 is greater than 0° and less than 90°, and the angle between any two sidewalls W1 is greater than 0° and less than 180°. The reflective structure 18 may include a plurality of reflective surfaces S1 located on the plurality of sidewalls W1, the angle between any reflective surface S1 and the propagation direction of the first beam L1 is greater than 0° and less than 90°, and the angle between any two reflective surfaces S1 is greater than 0° and less than 180°. The reflective surfaces S1 constitute a reflective part 181. In this way, by reflecting the first beam L1 through the plurality of reflective surfaces S1, the first beam L1 can be divided into a plurality of outgoing beams L3.

[0181] like Figure 2 As shown, in some embodiments, the reflective structure 18 may include four reflective surfaces S1, and the reflective surfaces S1 of the reflective structure 18 may be planar reflective surfaces. The four reflective surfaces S1 may form a tetrahedral structure, and the four reflective surfaces S1 may divide the first beam L1 into four outgoing beams L3 that propagate in four directions, such as the first direction, the second direction, the third direction, and the fourth direction, respectively. In this way, when the light processing unit group 13 is disposed on one side of the second interposer layer 16 along the first direction, the second direction, the third direction, and the fourth direction, the optical path length of the outgoing beam L3 incident on the light processing unit group 13 can be reduced.

[0182] However, this is not the only one. In some embodiments, the reflective surface S1 can also be arc-shaped, and the reflective structure 18 can also include more or fewer reflective surfaces S1, such as 2, 3, 5, 10, etc., to divide the first beam L1 into more or fewer outgoing beams L3. The propagation direction of the outgoing beam L3 can be adjusted by adjusting the angle between the reflective surface S1 and the propagation direction of the first beam L1, as well as the angle between any two reflective surfaces S1.

[0183] Thus, in actual operation, the number and angle of the reflective surfaces S1 can be adjusted according to the distribution position and number of the light processing unit group 13, thereby adjusting the number and propagation direction of the emitted beams L3, so as to guide multiple emitted beams L3 to the light processing unit group 13 and improve scene applicability.

[0184] In some embodiments, the propagation direction of the emitted light beam L3 may be parallel to the plane of the substrate 10. However, it is not limited to this; the propagation direction of the emitted light beam L3 may also have a first preset angle with the direction parallel to the plane of the substrate 10 to increase the applicability of different scenarios.

[0185] See you again Figure 20 In some embodiments, forming a second optical element 17 within the second interposer layer 16 further includes forming a plurality of first optical waveguides 173 within the second interposer layer 16. The plurality of first optical waveguides 173 are disposed around the beam splitter 171 and located along the propagation path of the emitted beam L3. The first optical waveguides 173 may be formed before forming the beam splitter 171. The first optical waveguides 173 can be used to constrain the propagation direction of the emitted beam L3.

[0186] In practice, multiple first optical waveguides 173 can be formed in the second sub-layers 1612 by forming multiple layers of second sub-layers 1612, patterning each second sub-layer 1612, and depositing optical waveguide material in the patterned second sub-layers 1612.

[0187] See you again Figure 24In some embodiments, forming a second optical element 17 within the second interposer layer 16 may further include: forming a plurality of first reflectors 172 within the second interposer layer 16, the plurality of first reflectors 172 being disposed around the beam splitter 171, for adjusting the propagation direction of the emitted beam L3 so that the emitted beam L3 enters the first interposer layer 11. For example, when the second interposer layer 16 is disposed above the first interposer layer 11, and the emitted beam L3 cannot directly enter the first interposer layer 11, the first reflectors 172 can be used to adjust the propagation direction of the emitted beam L3. In some embodiments, after the emitted beam L3 has its propagation direction adjusted by the first reflectors 172, it forms a second beam L2, the propagation direction of the second beam L2 being perpendicular to the plane of the substrate 10. However, this is not limited to this; the propagation direction of the second beam L2 may also have a second preset angle with the direction perpendicular to the plane of the substrate 10 to increase scene applicability.

[0188] In practice, a method similar to that used to form the first groove T1 can be used to form the third groove T3 within the second sub-layer 1612. Then, reflective material is deposited on one sidewall of the third groove T3 to form the first reflector 172. The first reflector 172 can be formed after the formation of the first optical waveguide 173 and the second sub-layer 1612, and before or after the formation of the beam splitter 171.

[0189] In some embodiments, the incident end of the first optical waveguide 173 may be disposed toward the beam splitter 171, and the first reflector 172 may be disposed at the emitting end of the first optical waveguide 173. Multiple first optical waveguides 173 may be disposed between the first reflector 172 and the beam splitter 171, and the first optical waveguides 173 may extend along the propagation direction of the emitted beam L3. However, this is not a limitation; the first optical waveguide 173 may not be disposed between the beam splitter 171 and the first reflector 172.

[0190] like Figure 11 As shown, in some other embodiments of this disclosure, when the second interposer 16 is disposed adjacent to the first interposer 11 in a direction parallel to the plane of the substrate 10, the first reflector 172 may not be provided. The emitted beam L3 is coupled through the first optical waveguide 173 to form the second beam L2. The second beam L2 can be directly incident into the first interposer 11 to increase the applicability of the scene.

[0191] See you again Figure 25 In some embodiments, forming the second interposer 16 may further include forming a first dielectric layer 162, the first dielectric layer 162 filling the first recess T1 and the third recess T3 and covering the first substrate 161, the first substrate 161 and the first dielectric layer 162 constituting the second interposer 16. The material of the first dielectric layer 162 includes, but is not limited to, oxides, such as silicon oxide.

[0192] like Figures 26 to 27 As shown, in some other embodiments of this disclosure, the morphology of the opening K can be changed to form a first groove T1 with a different morphology in the first substrate 161, and to form a reflective structure 18 with a different morphology.

[0193] Specifically, such as Figures 26 to 28 As shown, in some embodiments, a first groove T1 with an arc-shaped inner wall W2 can be formed in a first substrate 161, and a reflective material can be deposited on the arc-shaped inner wall W2 of the first groove T1 to form a reflective structure 18 with an arc-shaped reflective surface S2. Different regions of the arc-shaped reflective surface S2 constitute a reflective portion 181, and the arc-shaped reflective surface S2 can be a sphere, an ellipsoid, or a freeform surface, etc.

[0194] Understandably, the light rays in the emitted beam L3 reflected by the arc-shaped reflective surface S2 propagate in different directions. Through the coupling effect of the first optical waveguide 173, the light rays propagating in a preset direction (e.g., a direction parallel to the plane of the substrate 10) and a portion of the light rays propagating in a direction having a third preset angle with the preset direction can be coupled into an independently propagated beam. This beam can be deflected by the first reflector 172 and then incident on the first intermediate layer 11 as the second beam L2, or it can be directly incident on the first intermediate layer 11 as the second beam L2.

[0195] Next, regarding Figure 27 The structure shown is executed as follows Figure 25 The steps shown are for forming Figure 28 The structure shown is executed as follows. Figures 1 to 3 The steps shown form as follows Figures 4 to 6 The structure shown.

[0196] Figure 4 The second beam L2 shown propagates along the first direction, the second direction, the third direction, and the fourth direction, respectively. However, it is not limited to this; more or fewer second beams L2 propagating in different directions can be formed by adjusting the number and position of the first optical waveguide 173.

[0197] In actual operation, the materials of the reflective structure 18 and the first reflective element 172 can be the same or different. The materials of the reflective structure 18 and the first reflective element 172 can include, but are not limited to, metallic reflective materials, such as one or more of copper, aluminum, tantalum, aluminum-copper alloy, and aluminum-copper-silicon alloy. The material of the first optical waveguide 173 can include, but is not limited to, silicon nitride.

[0198] like Figures 29 to 30 As shown, in some embodiments, a second interposer 16 is formed, and a second optical element 17 is formed within the second interposer 16, including: providing a second substrate 163 (such as...). Figure 29Multiple periodically arranged second grooves T2 are formed within the second substrate 163 to form a grating structure 19 within the second substrate 163. The grating structure 19 is configured to convert the first beam L1 into multiple outgoing beams L3 with different propagation directions and spatially separated through diffraction. The grating structure 19 constitutes a beam splitter 171 (e.g., ...). Figure 30 Thus, the first beam L1 can be divided into multiple outgoing beams L3 propagating in different directions by utilizing the diffraction effect.

[0199] In practice, the material of the second substrate 163 may include, but is not limited to, silicon.

[0200] The grating structure 19 may include a plurality of second grooves T2 arranged periodically. For example... Figure 9 As shown, in some embodiments, the grating structure 19 may include a plurality of second grooves T2 extending along a first direction and arranged along a second direction. The grating structure 19 can divide the first beam L1 into two outgoing beams L3 propagating along the second direction and in a direction opposite to the second direction (e.g., a fourth direction). Figure 10 As shown, in some other embodiments, the grating structure 19 may include a plurality of second grooves T2 arranged in an array along the first direction and the second direction. The grating structure 19 can divide the first beam L1 into four outgoing beams L3 that propagate along the first direction, the second direction and the direction opposite to the first direction and the second direction (e.g., the third direction and the fourth direction).

[0201] However, it is not limited to this. The second groove T2 of the grating structure 19 can also have other shapes and arrangements to divide the first beam L1 into more or fewer outgoing beams L3 that propagate in different directions.

[0202] See you again Figure 30 , Figure 9 as well as Figure 10 In some embodiments, while forming the grating structure 19, a second substrate 163 may also be etched to form a cone 174 and a first optical waveguide 173, the first optical waveguide 173 being connected to the grating structure 19 through the cone 174.

[0203] Next, as Figure 31 As shown, a second dielectric layer 164 can be formed, and a third groove T3 can be formed within the second dielectric layer 164, and a beam splitter 171 can be formed within the third groove T3; then, as... Figure 32 As shown, a third dielectric layer 165 can be formed, which covers the second substrate 163 and fills the second groove T2 and the third groove T3. The materials of the second dielectric layer 164 and the third dielectric layer 165 can include, but are not limited to, oxides, such as silicon oxide. The second substrate 163, the second dielectric layer 164, and the third dielectric layer 165 can constitute a second interposer 16.

[0204] Next, execute as follows Figures 1 to 3 The steps shown form as follows Figures 7 to 8 The structure shown.

[0205] In some other embodiments of this disclosure, the beam splitting element 171 may also include other optical elements capable of beam splitting, such as prisms; the second optical element 17 may also include other optical elements capable of adjusting the propagation path of the emitted light L3, such as focusing lenses, collimating lenses, etc., which can be set according to actual conditions.

[0206] See you again Figure 25 , Figure 28 as well as Figure 32 In some embodiments, after forming the second interposer layer 16, the method further includes forming an antireflection layer 21 on one side surface of the second interposer layer 16. The antireflection layer 21 is located on the side surface of the second interposer layer 16 facing the light emitter 22 and at least covers the incident surface of the first light beam L1 onto the second interposer layer 16. This increases the transmittance of the first light beam L1 and reduces light loss. In some embodiments, the antireflection layer 21 may also cover the exit surface of the second light beam L2 exiting from the second interposer layer 16, further reducing light loss.

[0207] See you again Figures 1 to 3 In some embodiments, the second reflector 121 is used to adjust the propagation direction of the second light beam L2 incident on the first interposer layer 11, so as to guide the second light beam L2 to one or more optical processing units 131 of the optical processing unit group 13. In actual operation, the material of the second reflector 121 can be the same as the material of the first reflector 172, and the material of the second optical waveguide 122 can be the same as the material of the first optical waveguide 173.

[0208] like Figure 12 and Figure 13 As shown, in some embodiments, when the light processing unit group 13 includes a plurality of light processing units 131, the second optical element 17 can guide a second light beam L2 to the plurality of light processing units 131 of the light processing unit group 13 respectively.

[0209] In some embodiments, the plurality of light processing units 131 of a light processing unit group 13 can be arranged at intervals along the propagation direction of the second beam L2. A plurality of second reflectors 121 can be respectively disposed below the plurality of light processing units 131 to guide the second beam L2 to the plurality of light processing units 131 of the light processing unit group 13. However, this is not a limitation. When the light processing unit group 13 includes a plurality of light processing units 131, the plurality of light processing units 131 can also have other arrangement methods, and the placement position of the second optical element 17 can be adjusted according to the arrangement method of the light processing units 131.

[0210] In some embodiments, the second optical element 17 may also include optical elements such as a focusing lens, a collimating lens, and a prism that can adjust the propagation path of the second beam L2, which can be configured according to actual conditions.

[0211] As can be seen from the present embodiment, the second optical element 17 located within the second intermediary layer 16 can divide the first beam L1 emitted by the light emitter 22 into multiple spatially separated second beams L2, and the first optical element 12 located within the first intermediary layer 11 can guide the multiple second beams L2 to multiple light processing unit groups 13 respectively. Thus, through the cooperation of the first optical element 12 and the second optical element 17, the first beam L1 emitted by one light emitter 22 can be distributed to multiple light processing units 131, effectively improving the light source utilization rate of the light emitter 22 and the integration of the packaging structure; at the same time, compared with the solution of externally mounted multiple lasers, the optical path transmission distance can be reduced and the optical loss can be reduced.

[0212] It should be noted that those skilled in the art can change the order of the above steps without departing from the protection scope of this disclosure. The above description is only an optional embodiment of this disclosure and is not intended to limit the protection scope of this disclosure. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A packaging structure, characterized in that, include: A substrate, and at least one first interposer layer located on the substrate, wherein the first interposer layer has a first optical element; Multiple optical processing unit groups are located on the first intermediary layer, and each optical processing unit group includes one or more optical processing units arranged at intervals. A second interposer layer and a light emitter located on one side of the second interposer layer in its thickness direction are situated above the substrate, and a second optical element is provided within the second interposer layer; wherein... The light emitter is configured to emit a first light beam toward the second interposer layer; The second optical element is configured to split the first beam into a plurality of spatially separated second beams and incident the second beams into the first interposer layer; the first optical element is configured to guide the plurality of second beams incident into the first interposer layer to the plurality of light processing unit groups respectively; The second interposer is located above the first interposer. A plurality of light processing unit groups are distributed around the second interposer in a direction parallel to the plane of the substrate. Each of the first interposer and the second interposer has an overlapping area in a direction perpendicular to the plane of the substrate. The incident interface of the second light beam into the first interposer is located in the overlapping area. The light emitter is disposed on the side of the second interposer facing the substrate and is bonded to the substrate.

2. The packaging structure according to claim 1, characterized in that, The second optical element includes a beam splitter configured to split the first beam into multiple outgoing beams that propagate in different directions.

3. The packaging structure according to claim 2, characterized in that, The beam splitter includes a reflective structure having multiple non-coplanar and non-parallel reflective portions, which are used to reflect the first beam into multiple outgoing beams with different propagation directions and spatially separated. or, The beam splitter includes a grating structure configured to convert the first beam into multiple outgoing beams with different propagation directions and spatially separated by a diffraction effect.

4. The packaging structure according to claim 3, characterized in that, When the beam-splitting element includes a reflective structure, the reflective structure includes multiple reflective surfaces, wherein the angle between any one of the reflective surfaces and the propagation direction of the first beam is greater than 0° and less than 90°, and the angle between any two of the reflective surfaces is greater than 0° and less than 180°, and the reflective surfaces constitute the reflective portion; or, The reflective structure includes an arc-shaped reflective surface protruding toward the light emitter, and different regions of the arc-shaped reflective surface constitute the reflective part.

5. The packaging structure according to claim 3, characterized in that, The second optical element also includes: A plurality of first reflective elements are disposed around the beam-splitting element. These first reflective elements are used to adjust the propagation direction of the emitted light beam so that the emitted light beam enters the first intermediate layer; and / or, Multiple first optical waveguides are disposed around the beam splitter and located on the propagation path of the emitted beam.

6. The packaging structure according to claim 1, characterized in that, The encapsulation structure further includes an anti-reflection layer located on the side surface of the second interposer facing the light emitter, and at least covering the incident surface of the first light beam incident on the second interposer.

7. The packaging structure according to claim 1, characterized in that, The packaging structure further includes a heat dissipation structure located within the substrate and positioned below the light emitter.

8. The packaging structure according to claim 1, characterized in that, The first optical element includes: Multiple second reflectors, the second reflectors being used to adjust the propagation direction of the second light beam incident upon the first intermediate layer, so as to guide the second light beam to one or more of the light processing units of the light processing unit group; and / or, Multiple second optical waveguides are disposed on the propagation path of the second beam.

9. A method for manufacturing a packaging structure, characterized in that, include: Provide substrate; At least one first interposer layer is formed, and a first optical element is formed within the first interposer layer, and the first interposer layer is fixed on the substrate; Multiple light processing unit groups are formed, each light processing unit group including one or more light processing units, and the multiple light processing unit groups are fixed on the first intermediary layer. A second interposer layer is formed, and a second optical element is formed within the second interposer layer; A light emitter is formed, and a second interposer layer and the light emitter are fixed above the substrate. The second interposer layer is located above the first interposer layer. A plurality of light processing unit groups are distributed around the second interposer layer in a direction parallel to the plane of the substrate, and each of the first and second interposer layers has an overlap area in a direction perpendicular to the plane of the substrate. The light emitter is disposed on the side of the second interposer layer facing the substrate and bonded to the substrate. The light emitter is configured to emit a first light beam toward the second interposer layer; the second optical element is configured to divide the first light beam into a plurality of spatially separated second light beams and incident the second light beams into the first interposer layer, wherein the incident interface of the second light beams into the first interposer layer is located in the overlapping region; the first optical element is configured to guide the plurality of second light beams incident into the first interposer layer to the plurality of light processing unit groups respectively.

10. The manufacturing method according to claim 9, characterized in that, Forming a second optical element within the second interposer layer includes: forming a beam splitter within the second interposer layer, the beam splitter being configured to split the first beam into a plurality of outgoing beams propagating in different directions.

11. The manufacturing method according to claim 10, characterized in that, Forming the second interposer layer and forming the second optical element within the second interposer layer includes: A first substrate is provided, and a first groove is formed within the first substrate; A reflective material is formed on the sidewall of the first groove to form a reflective structure, which constitutes the beam splitting element; wherein the reflective structure includes a plurality of non-coplanar and non-parallel reflective portions, which are used to reflect the first beam into a plurality of outgoing beams with different propagation directions and spatially separated.

12. The manufacturing method according to claim 10, characterized in that, Forming the second interposer layer and forming the second optical element within the second interposer layer includes: A second substrate is provided, and a plurality of periodically arranged second grooves are formed in the second substrate to form a grating structure in the second substrate. The grating structure is configured to convert the first beam into a plurality of outgoing beams with different propagation directions and spatially separated by a diffraction effect. The grating structure constitutes the beam splitting element.

13. The manufacturing method according to claim 10, characterized in that, Forming a second optical element within the second interposer layer further includes: A plurality of first reflective elements are formed within the second intermediate layer, and the plurality of first reflective elements are disposed around the beam-splitting element to adjust the propagation direction of the emitted beam so that the emitted beam is incident within the first intermediate layer; and / or, A plurality of first optical waveguides are formed within the second interposer layer, and the plurality of first optical waveguides are disposed around the beam splitter and located on the propagation path of the emitted beam.

14. The manufacturing method according to claim 9, characterized in that, After forming the second intermediary layer, the method further includes: An antireflection layer is formed on one side surface of the second interposer layer, the antireflection layer being located on the side surface of the second interposer layer facing the light emitter, and at least covering the incident surface of the first light beam onto the second interposer layer.

15. The manufacturing method according to claim 9, characterized in that, After providing the substrate, the method further includes: A heat dissipation structure is formed within the substrate, the light emitter is disposed on the surface of the substrate, and the heat dissipation structure is disposed below the light emitter.

16. The manufacturing method according to claim 9, characterized in that, The first optical element is formed within the first interposer layer, comprising: A plurality of second reflective elements are formed within the first interposer layer. These second reflective elements are used to adjust the propagation direction of the second light beam incident upon the first interposer layer, guiding the second light beam to one or more of the light processing units in the light processing unit group; and / or, Multiple second optical waveguides are formed within the first interposer layer, and the second optical waveguides are disposed on the propagation path of the second beam.

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