Display module and display equipment

Abstract

The invention discloses a display module and display equipment, the display module comprises a display panel and a circuit board, and the display panel is provided with a first display area, a second display area and a bendable area located between the first display area and the second display area; the circuit board comprises a first circuit board and a second circuit board, the first circuit board comprises a first main body and a connecting part which are connected with each other, the second circuit board comprises a second main body, and the first main body spans the bendable area through the connecting part so as to be connected with the second main body; wherein the thickness of at least one part of the connecting part located in the bendable area is smaller than that of the connecting part located in at least one of the first display area and the second display area. According to the technical scheme, the tensile or compressive stress borne by the connecting part located in the bendable area during bending each time can be reduced, then the technical problem of stress concentration of the connecting part located in the bendable area is solved, and the bending resistance of the display module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0002] The display device in folded state has become a mainstream trend, for example, the mobile phone and the tablet have multiple display areas and can be folded. Therefore, the bending resistance of the foldable display device has higher requirements.

[0003] In the related art, the circuit board connected between the two display areas is relatively concentrated in stress during the bending process, which affects the bending resistance of the display device. SUMMARY

[0004] The display module and the display device provided by the embodiments of the present application improve the bending resistance of the display module during the bending process, so as to at least partially solve the above technical problems.

[0005] In order to achieve the above purpose, according to a first aspect of the present application, a display module is provided, comprising: a display panel having a first display area, a second display area and a bendable area between the first display area and the second display area; and a circuit board including a first circuit board and a second circuit board, the first circuit board including a first main body and a connecting portion connected to each other, the second circuit board including a second main body, the first main body and the second main body being electrically connected to the display panel in the first display area and the display panel in the second display area respectively, and the first main body being connected to the second main body by crossing the bendable area through the connecting portion; wherein the thickness of at least a part of the connecting portion located in the bendable area is less than the thickness of the connecting portion located in at least one of the first display area and the second display area.

[0006] Optionally, the connecting portion includes a first metal layer and a second metal layer stacked in the thickness direction of the display panel. wherein the connecting portion is provided with an opening penetrating the second metal layer corresponding to the bendable area.

[0007] Optionally, the connecting portion further includes a base layer between the first metal layer and the second metal layer, and an adhesive layer between the base layer and the second metal layer, the opening penetrates the adhesive layer, and the part of the base layer corresponding to the opening is configured to expose the opening.

[0008] Optionally, the metal of the first metal layer is rolled copper.

[0009] Optionally, the connecting portion corresponding to the bendable area is provided with a plurality of through holes in a thickness direction of at least one of the display panel and the circuit board. wherein a center distance between every two adjacent through holes is greater than or equal to 12 mm.

[0010] Optionally, the connecting portion is detachably connected with the second body.

[0011] Optionally, a thickness of the connecting portion located in the bendable area is less than a thickness of the connecting portion located in at least one of the first display area and the second display area, so as to form a bending performance improvement structure. In a perspective view in a thickness direction of at least one of the display panel and the circuit board, a cross-sectional shape of the bending performance improvement structure is trapezoidal. wherein a length of a short side of the two bottom sides of the trapezoid is greater than a width of the bendable area.

[0012] Optionally, a thickness of the connecting portion located in the bendable area is less than a thickness of the connecting portion located in at least one of the first display area and the second display area, so as to form a bending performance improvement structure. In a direction along which the connecting portion extends, the bending performance improvement structure comprises a first sub-bending performance improvement structure and two second sub-bending performance improvement structures located on two sides of the first sub-bending performance improvement structure. wherein in a perspective view in a thickness direction of at least one of the display panel and the circuit board, the first sub-bending performance improvement structure overlaps with the bendable area, and in the direction along which the connecting portion extends, a length of the first sub-bending performance improvement structure is equal to a width of the bendable area.

[0013] Optionally, the two second sub-bending performance improvement structures are symmetrically arranged about the first sub-bending performance improvement structure. and / or In the direction along which the connecting portion extends, a width of the second sub-bending performance improvement structure is greater than 1 mm. and / or In a perspective view in the direction along which the connecting portion extends, the first sub-bending performance improvement structure and the second sub-bending performance improvement structure are partially overlapped.

[0014] According to a second aspect of the present application, a display device is provided, which comprises the display module as described above.

[0015] The present application has the beneficial effect of providing a display module capable of improving bending resistance.

[0016] More specifically, some embodiments of this application may produce the following specific beneficial effects: In the display module of this application embodiment, the display module includes a display panel and a circuit board. The display panel has a first display area, a second display area, and a bendable area located between the first display area and the second display area. The circuit board includes a first circuit board and a second circuit board. The first circuit board includes a first main body and a connecting portion connected to each other. The second circuit board includes a second main body. The first main body and the second main body are electrically connected to the display panel located in the first display area and the display panel located in the second display area, respectively. The first main body crosses the bendable area through the connecting portion to connect with the second main body. At least a portion of the thickness of the connecting portion located in the bendable area is less than the thickness of the connecting portion located in at least one of the first display area and the second display area. Through the above technical solution, when the first display area and the second display area rotate relative to each other to bend the bendable area, the thickness of at least a portion of the connecting portion in the bendable area of ​​the display panel of the display module is less than the thickness of the connecting portion located in at least one of the first display area and the second display area. Reducing the thickness can reduce the tensile or compressive stress borne by the connecting portion located in the bendable area during each bend, thereby improving the technical problem of stress concentration in the connecting portion located in the bendable area and improving the bending resistance of the display module.

[0017] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 This is a schematic diagram of a display module provided in an exemplary embodiment of this application; Figure 2 yes Figure 1 A schematic diagram of the structure of the first circuit board in the diagram; Figure 3 This is a structural cross-sectional view of a display module provided in an exemplary embodiment of this application; Figure 4 yes Figure 3 A schematic diagram of the structure of the first circuit board in the diagram; Figure 5 is a structural schematic view of a display module provided in the exemplary embodiments of the present application; Figure 6 is a structural schematic view of the first circuit board in Figure 5 Figure 7 is a cross-sectional structural schematic view of a connecting portion provided in the exemplary embodiments of the present application; Figure 8 is an enlarged structural schematic view of A in Figure 7 Figure 9 is another cross-sectional structural schematic view of a connecting portion provided in the exemplary embodiments of the present application; Figure 10 is an enlarged structural schematic view of B in Figure 9 Figure 11 is a cross-sectional structural schematic view of a display device provided in the exemplary embodiments of the present application.

[0020] Explanation of Reference Signs: 10, display module; 100, display panel; 100a, first display area; 100b, second display area; 100c, bendable area; 200, circuit board; 210, first circuit board; 211, first main body; 212, connecting portion; 2121, insertion hole; 220, second circuit board; 221, second main body; 230, first shielding layer; 240, first base layer; 250, second metal layer; 260, first adhesive layer; 270, second base layer; 280, first metal layer; 290, second adhesive layer; 310, third base layer; 320, third adhesive layer; 330, third metal layer; 340, fourth base layer; 350, second shielding layer; 400, bend performance improvement structure; 410, first sub-bend performance improvement structure; 420, second sub-bend performance improvement structure; 510, support layer; 520, reinforcing layer; 530, second back plate; 550, insulating adhesive; 570, first back plate; 580, foam layer; a, display section; b2, pressing section; b1, bending section; AA, display plane area; VA, binding and bending area; T, pressing and overlapping area; L1, length of the first sub-bend performance improvement structure; L2, length of the short side of the two bottom sides of the trapezoid; W1, width of the bendable area. DETAILED DESCRIPTION

[0021] ​​​The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort fall within the protection scope of the present application.

[0022] In the following detailed description, certain embodiments of the application are simply shown and described by way of example. As can be appreciated by a person of ordinary skill in the art, the embodiments described herein can be modified in various ways without departing from the spirit or scope of the application.

[0023] In the drawings, the thickness of layers, films, plates, regions, etc. can be exaggerated for clarity and a better understanding and ease of description. It will be understood that when an element as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present.

[0024] In addition, unless explicitly described to the contrary, the word "comprise" and variations such as "comprises" or "comprising" will be understood to imply the inclusion of stated elements but not the exclusion of other elements. Further, in the description of the specification, the word "on" means placed on top of or below the object portion without necessarily being placed on the upper side of the object portion based on the direction of gravity.

[0025] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another.

[0026] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0027] It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0028] It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, it can be directly or indirectly formed on the other layer, region or component. For example, intervening layers, regions or components can be present.

[0029] The various embodiments provided by the present application are similar, and the features in different embodiments can be combined with each other. The description order of the following embodiments is not regarded as a limitation on the preferred order of the embodiments.

[0030] According to a first aspect of the present application, a display module 10 is provided, referring to Figure 1 and Figure 7 The display module 10 comprises a display panel 100 and a circuit board 200 which is connected to the display panel 100.

[0031] The display panel 100 has a first display area 100a, a second display area 100b, and a bendable area 100c between the first display area 100a and the second display area 100b. The circuit board 200 comprises a first circuit board 210 and a second circuit board 220, the first circuit board 210 comprises a first main body 211 and a connecting portion 212 which are connected to each other, and the second circuit board 220 comprises a second main body 221, the first main body 211 and the second main body 221 are respectively electrically connected to the display panel 100 located in the first display area 100a and the display panel 100 located in the second display area 100b, and the first main body 211 crosses the bendable area 100c through the connecting portion 212 to be connected to the second main body 221. At least a part of the connecting portion 212 located in the bendable area 100c has a thickness smaller than that of the connecting portion 212 located in at least one of the first display area 100a and the second display area 100b.

[0032] Through the above technical solution, when the first display area 100a and the second display area 100b are relatively rotated to bend the bendable area 100c, at least a part of the connecting portion 212 located in the bendable area 100c of the display panel 100 of the display module 10 has a thickness smaller than that of the connecting portion 212 located in at least one of the first display area 100a and the second display area 100b. Reducing the thickness can reduce the tensile or compressive stress of the connecting portion 212 located in the bendable area 100c during each bending, thereby improving the technical problem of stress concentration of the connecting portion 212 located in the bendable area 100c and improving the bending resistance of the display module 10.

[0033] It can be understood that by locally thinning the connecting portion 212 corresponding to the bendable area 100c, the reliability of the circuit board 200 under repeated bending is improved. The bendable area 100c of the display panel 100 in the display module 10 is the place where stress is most concentrated and the area where material fatigue fracture is most likely to occur. Therefore, at least partial thinning of the connecting portion 212 corresponding to the bendable area 100c can reduce the stress during bending.

[0034] It should be noted that the first circuit board 210 and the second circuit board 220 in the embodiments of the present application are located at the long edges of the display panel 100, and the long edges of the first circuit board 210 and the long edges of the second circuit board 220 are both arranged parallel to the long edges of the display panel 100.

[0035] The display panel 100 of the display module 10 includes, but is not limited to, one of a liquid crystal display (LCD) panel, an organic light-emitting display (OLED) panel, an inorganic electroluminescent (EL) display panel 100, a quantum dot light-emitting display (QED) panel, a micro-LED display panel 100, a nano-LED display panel 100, a field emission display (FED) panel, and an electrophoretic display (EPD) panel.

[0036] In some embodiments, the connecting portion 212 includes a first metal layer 280 and a second metal layer 250 stacked along a thickness direction of the display panel 100; and the connecting portion 212 is provided with an opening penetrating the second metal layer 250 corresponding to the bendable area 100c.

[0037] With such a scheme, the connecting portion 212 is provided with an opening penetrating the second metal layer 250 corresponding to the bendable area 100c, which can remove part of the second metal layer 250 from the connecting portion 212 corresponding to the bendable area 100c, thereby reducing the thickness of the connecting portion 212 corresponding to the bendable area 100c, and further reducing the bending stiffness of the connecting portion 212 corresponding to the bendable area 100c, so as to reduce the stress generated in the bending process. On the other hand, the first metal layer 280 is kept intact, which can ensure the conduction between the first circuit board 210 and the second circuit board 220.

[0038] Exemplarily, the connecting portion 212 includes two metal layers, and the first metal layer 280 in the embodiment of the present application is located between the second metal layer 250 and the display panel 100. Of course, the first metal layer 280 can also be located on the side of the second metal layer 250 away from the display panel 100. That is, in the case where the connecting portion 212 includes double metal layers, only one of the metal layers is provided with an opening corresponding to the bendable area 100c, and the other metal layer is intact to ensure the conduction between the boards.

[0039] In some other embodiments, referring to Figure 9 and Figure 10The connecting portion 212 can also be configured to include three metal layers, including a first metal layer 280, a second metal layer 250, and a third metal layer 330. The second metal layer 250 is located on the side of the first metal layer 280 away from the display panel 100, and the third metal layer 330 is located between the first metal layer 280 and the display panel 100, i.e., the third metal layer 330, the first metal layer 280, and the second metal layer 250 are sequentially stacked from bottom to top. In the case where the circuit board 200 includes three metal layers, an opening can be formed in the connecting portion 212 corresponding to the bendable area 100c, which penetrates the second metal layer 250 and the third metal layer 330, and the first metal layer 280 is complete. Alternatively, an opening can also be formed in the connecting portion 212 corresponding to the bendable area 100c, which penetrates the third metal layer 330, and the second metal layer 250 is partially removed, so that at least part of the thickness of the connecting portion 212 corresponding to the bendable area 100c is thinned.

[0040] It should be noted that in the embodiments of the present application, the connecting portion 212 located in different areas has different numbers of metal layers. For example, referring to Figure 9 and Figure 10 The connecting portion 212 corresponds to the second display area 100b and is located near the part connected to the second main body 221 and is configured to include two metal layers. The connecting portion 212 corresponds to the first display area 100a and is connected to the first main body 211 and is configured to include three metal layers. The connecting portion 212 corresponds to the bendable area 100c and the edge of the bendable area 100c and includes one metal layer. It can be understood that the connecting portion 212 extending from the first display area 100a to the second display area 100b through the bendable area 100c has a complete metal layer, i.e., the first metal layer 280 in Figure 9 extends from the first display area 100a to the second display area 100b through the bendable area 100c.

[0041] In some embodiments, the connecting portion 212 further includes a base layer between the first metal layer 280 and the second metal layer 250, and an adhesive layer between the base layer and the second metal layer 250. The opening penetrates the adhesive layer, and the part of the base layer corresponding to the opening is configured to expose the opening.

[0042] In the embodiment of the present application, the opening is formed in the adhesive layer between the first metal layer 280 and the second metal layer 250. On the one hand, since the hardness of the adhesive layer is large, the thickness of the connecting portion 212 corresponding to the bendable area 100c can be further reduced when the opening is formed in the adhesive layer, so as to further reduce the stress of the connecting portion 212 corresponding to the bendable area 100c when the connecting portion 212 is bent. On the other hand, by forming the opening in the adhesive layer of the connecting portion 212 corresponding to the bendable area 100c, the effect of removing the adhesive layer is achieved, so as to avoid the interlayer peeling between the adhesive layer and the substrate layer.

[0043] The adhesive layer between the first metal layer 280 and the second metal layer 250 is defined as a second substrate layer 270, and the adhesive layer between the second substrate layer 270 and the second metal layer 250 is defined as a first adhesive layer 260.

[0044] For example, the substrate layer is made of polyimide PI material. The substrate layer made of polyimide PI material is soft, which can be bent together with the complete metal layer, so as to improve the bending resistance of the display module 10.

[0045] It can be understood that the opening of the connecting portion 212 is an opening with equal area in the up-down direction.

[0046] In some embodiments, the metal of the first metal layer 280 is rolled copper.

[0047] In the embodiment of the present application, the metal of the first metal layer 280 is set as rolled copper, which can have a good elongation rate and can withstand a larger plastic deformation, so that the display module 10 has a good bending resistance.

[0048] For example, the second metal layer 250 can also be rolled copper, or the second metal layer 250 can also be electrolytic copper. This is not limited, and the actual use is used as the standard.

[0049] In some embodiments, a plurality of through holes are arranged in the thickness direction of at least one of the display panel 100 and the circuit board 200, and correspond to the connecting portion 212 of the bendable area 100c.

[0050] In the embodiment of the present application, a plurality of through holes are arranged in the thickness direction of at least one of the display panel 100 and the circuit board 200, and correspond to the connecting portion 212 of the bendable area 100c, so as to achieve the effect of local stress release of the connecting portion 212 corresponding to the bendable area 100c when the connecting portion 212 is bent, and avoid the excessive concentration of stress at one point of the connecting portion 212.

[0051] It should be noted that, in this embodiment, the plurality of through holes provided in the connecting portion 212 corresponding to the bendable region 100c are evenly arranged. The shape of the through holes can be circular, rectangular, or other shapes; there is no limitation on this.

[0052] Hereinafter, taking the circuit board 200 of this application embodiment as an example, which includes a double metal layer, through holes can be opened on the adhesive layer between the first metal layer 280 and the second metal layer 250, and through holes can be opened on the first metal layer 280, and the through holes on the adhesive layer and the through holes on the first metal layer 280 are configured in a one-to-one correspondence.

[0053] In some embodiments, the center-to-center distance between any two adjacent through holes is greater than or equal to 12 mm.

[0054] In this embodiment of the application, the center distance between any two adjacent through holes is set to be greater than or equal to 12 mm, which can rationally set the range of center distance values ​​and avoid the situation where the structural strength of the connection part 212 is weakened due to the through holes being too dense.

[0055] In some embodiments, the connecting portion 212 is detachably connected to the second body 221. By detachably connecting the connecting portion 212 to the second body 221, a detachable connection is achieved between the first circuit board 210 and the second circuit board 220, that is, the board-to-board connection is detachable. If one of the circuit boards 200 fails, the faulty circuit board 200 can be replaced.

[0056] For example, the connecting part 212 and the second body 221 are detachably connected by plugging. For instance, a plug-in position is provided on the second body 221 of the second circuit board 220, and the connecting part 212 is provided with a plug hole 2121. The plug hole 2121 is plugged into the plug-in position to realize the detachable connection between the connecting part 212 and the second body 221.

[0057] In related technologies, when the connecting part 212 is detachably connected to the second body 221, the connecting part 212 needs a certain amount of movement to balance the cumulative tolerances of each layer during assembly with the second body 221, thereby improving the fastening yield. Based on this, in some embodiments, the thickness of the connecting part 212 located in the bendable region 100c is less than the thickness of the connecting part 212 located in at least one of the first display region 100a and the second display region 100b, to form a bending performance enhancement structure 400; Reference Figure 5 and Figure 6, the cross-sectional shape of the bending performance improving structure 400 is trapezoidal in the thickness direction of at least one of the display panel 100 and the circuit board 200. With such a scheme, on the basis of thinning the thickness of the connecting portion 212 corresponding to the bendable area 100c to form the bending performance improving structure 400, the cross-sectional shape of the bending performance improving structure 400 is trapezoidal, the overall length of the connecting portion 212 between the first body 211 and the second body 221 can be increased, that is, the length of the connecting portion 212 corresponding to the bendable area 100c can be increased, and when the connecting portion 212 is buckled with the second body 221, there is a certain amount of movement to balance the cumulative tolerances of each layer, thereby improving the buckling yield.

[0058] In some other embodiments, with reference to Figure 1 and Figure 2 , the cross-sectional shape of the bending performance improving structure 400 is rectangular in the thickness direction of at least one of the display panel 100 and the circuit board 200.

[0059] In some embodiments, with reference to Figure 5 and Figure 6 , the length L2 of the short side of the two bottom sides of the trapezoid is greater than the width W1 of the bendable area. In this way, the short side of the trapezoid and the width W1 of the bendable area can be reasonably set to ensure the bending resistance of the connecting portion 212 corresponding to the bendable area 100c.

[0060] In some embodiments, with reference to Figure 5 , Figure 6 and Figure 7 , the thickness of the connecting portion 212 located in the bendable area 100c is less than the thickness of the connecting portion 212 located in at least one of the first display area 100a and the second display area 100b to form the bending performance improving structure 400; the bending performance improving structure 400 includes a first sub-bending performance improving structure 410 and two second sub-bending performance improving structures 420 located on both sides of the first sub-bending performance improving structure 410 in the direction extending along the connecting portion 212; wherein the first sub-bending performance improving structure 410 overlaps the bendable area 100c in the thickness direction of at least one of the display panel 100 and the circuit board 200, and the length L1 of the first sub-bending performance improving structure in the direction extending along the connecting portion 212 is equal to the width of the bendable area 100c.

[0061] The bending performance improving structure 400 in the embodiment of the present application includes a first sub-bending performance improving structure 410 and two second sub-bending performance improving structures 420 located on both sides of the first sub-bending performance improving structure 410. The first sub-bending performance improving structure 410 overlaps the bendable area 100c and extends along the direction of the connecting portion 212. The length L1 of the first sub-bending performance improving structure is equal to the width of the bendable area 100c, which can ensure that the second sub-bending performance improving structure 420 can be used as a buffer area to protect the first sub-bending performance improving structure 410 during repeated bending, and effectively avoid stress concentration between the first sub-bending performance improving structure 410 and the second sub-bending performance improving structure 420.

[0062] It should be noted that the thickness of the first sub-bending performance improving structure 410 and the two second sub-bending performance improving structures 420 on both sides in the embodiment of the present application is equal.

[0063] In some embodiments, the two second sub-bending performance improving structures 420 are symmetrically arranged about the first sub-bending performance improving structure 410. The technical solution of symmetrically arranging two second sub-bending performance improving structures 420 about the first sub-bending performance improving structure 410 can avoid the situation that the deformation sizes of the two second sub-bending performance improving structures 420 of the connecting portion 212 are different during bending, and ensures the stability of the bending process.

[0064] In some embodiments, the width of the second sub-bending performance improving structure 420 along the direction of the connecting portion 212 is greater than 1mm. By reasonably setting the width of the second sub-bending performance improving structure 420, the second sub-bending performance improving structure 420 has sufficient bending space.

[0065] In some embodiments, the first sub-bending performance improving structure 410 and the second sub-bending performance improving structure 420 are partially overlapped in the viewing angle along the direction of the connecting portion 212. By partially overlapping the first sub-bending performance improving structure 410 and the second sub-bending performance improving structure 420, there is a certain amount of activity to balance the cumulative tolerance of each layer when the connecting portion 212 is connected with the second main body 221, thereby improving the yield of the connection.

[0066] Reference Figure 3 and Figure 4It can be understood that the first sub-bending performance improvement structure 410 and the second sub-bending performance improvement structure 420 are partially overlapped, and the cross-sectional shape of the connecting portion 212 corresponding to the bendable area 100c is S-shaped. In the case where the distance between the first main body 211 and the second main body 221 remains unchanged, the overall length of the connecting portion 212 between the first main body 211 and the second main body 221 can be increased, that is, the length of the connecting portion 212 corresponding to the bendable area 100c can be increased. When the connecting portion 212 is connected with the second main body 221, there is a certain amount of movement to balance the cumulative tolerance of each layer, thereby improving the connection yield.

[0067] Hereinafter, with reference to Figure 7 and Figure 8 For example, the connecting portion 212 of the first circuit board 210 includes two metal layers. As described above, the first circuit board 210 includes, from top to bottom, a first shielding layer 230, a first base layer 240, a second metal layer 250, a first adhesive layer 260, a second base layer 270, a first metal layer 280, a second adhesive layer 290, a third base layer 310, and a second shielding layer 350. The connecting portion 212 corresponding to the bendable area 100c is provided with a first opening penetrating through the first shielding layer 230, the first base layer 240, the second metal layer 250, and the first adhesive layer 260, and a second opening penetrating through the third adhesive layer 320. The first opening and the second opening have the same area.

[0068] Hereinafter, with reference to Figure 9 and Figure 10 For example, the connecting portion 212 of the first circuit board 210 includes three metal layers. As described above, the first circuit board 210 includes, from top to bottom, a first shielding layer 230, a first base layer 240, a second metal layer 250, a first adhesive layer 260, a second base layer 270, a first metal layer 280, a second adhesive layer 290, a third base layer 310, a third adhesive layer 320, a third metal layer 330, a fourth base layer 340, and a second shielding layer 350. The connecting portion 212 corresponding to the bendable area 100c is provided with a first opening penetrating through the first shielding layer 230, the first base layer 240, the second metal layer 250, and the first adhesive layer 260, and a second opening penetrating through the third adhesive layer 320, the third metal layer 330, the fourth base layer 340, and the second shielding layer 350. The first opening and the second opening have the same area.

[0069] Compared with the display module 10 in the related art, the display module 10 in the embodiment has better bending resistance.

[0070] In the embodiment, the connection between the first display panel 100 located in the first display area 100a and the first circuit board 210 is taken as an example for description. Referring to Figure 11The display module 10 in the embodiment of the present application includes a display segment a, a pressing segment b2 arranged oppositely, and a bending segment b1 bendingly connecting the display segment a and the pressing segment b2; the display module 10 includes a display plane area AA and a binding bending area VA, the display plane area AA includes a pressing overlapping area T, and the orthographic projection of the pressing segment b2 on the display segment a covers the pressing overlapping area T. The first display panel 100 is electrically connected with the first circuit board 210 at the pressing segment b2.

[0071] Specifically, as shown in the figure, Figure 11 The display module 10 of the display segment a includes a first back plate 570 and a foam layer 580. The display module 10 of the pressing segment b2 includes a supporting layer 510, a reinforcing layer 520, and a second back plate 530. The display panel 100 is a display function layer, a part of the display function layer is laminated on the second back plate 530 as a non-effective display part, and a part is laminated on the first back plate 570 after being bent as an effective display part. In the embodiment of the present application, the first circuit board 210 is connected by the insulating glue 550 between the end of the first display panel 100 and the first circuit board 210 electrically connected at the pressing segment b2 and the supporting layer 510.

[0072] It should be noted that the embodiment takes the area of the pad bending structure part as an example for description. In the pad bending structure of the display module 10, the binding segment of the display module 10 is bent by 180° for pressing, the display function layer includes an effective display part and a non-effective display part, wherein the effective display part corresponds to the display segment a in the display module 10 of the embodiment, the non-effective display part includes a first non-effective display part and a second non-effective display part, the first non-effective display part corresponds to the bending segment b1 of the display module 10 of the embodiment, and the second non-effective display part corresponds to the pressing segment b2 of the display module 10 of the embodiment. Specifically, the display module 10 of the display segment a specifically includes a display function layer (the part of the display panel 100 located in the display plane area AA), a first back plate 570, and a foam layer 580; wherein the display function layer can include an OLED display function layer, the first back plate 570 is attached to the back light surface of the display function layer, the foam layer 580 is attached to the side of the first back plate 570 away from the display function layer, and the foam layer 580 is attached to the side of the supporting layer 510 away from the reinforcing layer 520.

[0073] Specifically, when the display module 10 is a plane display module 10, the projection of the foam layer 580 on the display module 10 covers at least the display segment a, and when the display module 10 is a four-curved surface display module 10, the buffer layer coincides with the display segment a of the display module 10.

[0074] Specifically, the material of the supporting layer 510 can be copper foil or other metal materials with good heat dissipation effect.

[0075] Specifically, as shown in Figure 11 the second non-effective display part is attached to the side of the effective display part thereof after being bent.

[0076] It should be noted that Figure 11 in the present application, the upper side is the light emitting side and the lower side is the light emitting side. However, the upper and lower sides in the present application do not have an absolute spatial relationship, and Figure 11 in the present application are only used for description.

[0077] According to a second aspect of the present application, a display device is provided, which comprises the display module 10 as described above.

[0078] The display device in the present application adopts the display module 10 described above, and thus has all the beneficial effects of the display module 10 described above, which will not be repeated here.

[0079] Exemplarily, the display device in the present application includes but is not limited to a liquid crystal display device.

[0080] In the description of the present application, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0081] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0082] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.

[0083] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification made to the above embodiment according to the technical essence of the present application, without departing from the technical solution content of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that, include: The display panel has a first display area, a second display area, and a bendable area located between the first display area and the second display area; and The circuit board includes a first circuit board and a second circuit board. The first circuit board includes a first body and a connecting portion that are connected to each other. The second circuit board includes a second body. The first body and the second body are electrically connected to a display panel located in the first display area and a display panel located in the second display area, respectively. The first body crosses the bendable area through the connecting portion to connect with the second body. Wherein, at least a portion of the connecting portion located in the bendable area has a thickness less than the thickness of the connecting portion located in at least one of the first display area and the second display area.

2. The display module according to claim 1, characterized in that, The connecting portion includes a first metal layer and a second metal layer stacked along the thickness direction of the display panel; The connecting portion has an opening that penetrates the second metal layer corresponding to the bendable area.

3. The display module according to claim 2, characterized in that, The connection portion further includes a base layer located between the first metal layer and the second metal layer, and an adhesive layer located between the base layer and the second metal layer, the opening penetrating the adhesive layer, and a portion of the base layer corresponding to the opening being configured to expose the opening.

4. The display module according to claim 2, characterized in that, The metal in the first metal layer is rolled copper.

5. The display module according to claim 2, characterized in that, A plurality of through holes are provided at the connection portion corresponding to the bendable area along the thickness direction of at least one of the display panel and the circuit board; The center-to-center distance between any two adjacent through holes is greater than or equal to 12 mm.

6. The display module according to any one of claims 1 to 5, characterized in that, The connecting part is detachably connected to the second main body.

7. The display module according to claim 6, characterized in that, The thickness of the connecting portion located in the bendable area is less than the thickness of the connecting portion located in at least one of the first display area and the second display area, so as to form a structure that improves bending performance; From the perspective of the thickness direction of at least one of the display panel and the circuit board, the cross-sectional shape of the bending performance enhancement structure is trapezoidal; Wherein, the length of the shorter side of the two bases of the trapezoid is greater than the width (W1) of the bendable area.

8. The display module according to claim 6, characterized in that, The thickness of the connecting portion located in the bendable area is less than the thickness of the connecting portion located in at least one of the first display area and the second display area, so as to form a structure that improves bending performance; Along the direction of the connecting portion, the bending performance enhancement structure includes a first sub-bending performance enhancement structure and two second sub-bending performance enhancement structures located on both sides of the first sub-bending performance enhancement structure; From a perspective of the thickness direction of at least one of the display panel and the circuit board, the first sub-bending performance enhancement structure overlaps with the bendable area, and along the direction of extension of the connecting portion, the length of the first sub-bending performance enhancement structure is equal to the width of the bendable area.

9. The display module according to claim 8, characterized in that, The two second sub-bending performance enhancement structures are symmetrically arranged about the first sub-bending performance enhancement structure; and / or Along the direction in which the connecting portion extends, the width of the second sub-bending performance enhancement structure is greater than 1 mm; and / or From a perspective along the extension direction of the connecting portion, the first sub-bending performance enhancement structure and the second sub-bending performance enhancement structure are partially overlapped.

10. A display device, characterized in that, The display device includes the display module according to any one of claims 1 to 9.

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