Display screen module and manufacturing method thereof

Abstract

The invention provides a display screen module and a manufacturing method thereof, a light energy conversion device is arranged in the display screen module, the light energy conversion device can comprise a plurality of pn junctions arranged in a stacked mode, and the light energy conversion device and a screen cover plate as well as the light energy conversion device and a display panel can be bonded through optical transparent adhesive tape. The display screen module can convert energy of light rays in different wavelength ranges into electric energy, and the energy conversion efficiency is high. The light energy conversion device can not comprise a substrate, the thickness of the light energy conversion device is small, and the occupied volume of the light energy conversion device in the display screen module is small. The display screen module provided by the invention can be widely applied to wearable equipment such as bracelets and watches, and the service life of the wearable equipment can be prolonged.

Description

Technical Field

[0001] This application relates to the field of terminal device hardware, and more specifically, to a display module and its manufacturing method. Background Technology

[0002] Photovoltaic devices on electronic equipment can convert solar energy and light energy from lighting into electrical energy for the use of electronic devices. However, due to the limited energy conversion efficiency of these devices, the electrical energy they provide is often limited.

[0003] To improve the ability of light-converting devices to supply power to electronic devices, one feasible approach is to increase the area of ​​the light-converting device that receives incident light. However, this approach is often not very suitable for small electronic devices such as mobile phones and watches.

[0004] Improving the power supply capability of photoelectric conversion devices in electronic devices with limited space, and reducing the size occupied by photoelectric conversion devices in these electronic devices, are issues worth considering. Summary of the Invention

[0005] This application provides a display module and its manufacturing method. The display module is provided with a light energy conversion device including multiple pn junctions. The upper and lower surfaces of the light energy conversion device are provided with adhesive layers to fix it relative to the screen cover and the display panel. The light energy conversion device has high energy conversion efficiency and occupies little space in the display module.

[0006] In a first aspect, a display module is provided, comprising: a display panel, a light-power conversion device, a screen cover, a first adhesive layer, and a second adhesive layer. The first adhesive surface of the first adhesive layer is connected to the display panel, and the second adhesive surface of the first adhesive layer is connected to the first surface of the light-power conversion device. The first adhesive surface of the second adhesive layer is connected to the second surface of the light-power conversion device, and the second adhesive surface of the second adhesive layer is connected to the screen cover. The light-power conversion device includes a plurality of pn junctions stacked along a first direction, wherein the first direction is the direction from the first adhesive layer to the second adhesive layer.

[0007] In some scenarios, the first direction can also be understood as the thickness direction of the display module or the thickness direction of the light energy conversion device. The first direction can also be understood as the stacking direction of multiple components within the display module.

[0008] In one possible implementation, different pn junctions within the photoelectric conversion device have different bandgap widths.

[0009] In one possible implementation, the light-powered device may not include a substrate, or the substrate of the light-powered device may have a thickness less than a thickness threshold.

[0010] The light-energy conversion device incorporates multiple pn junctions, which can convert the energy contained in light of different wavelengths in the incident light into electrical energy, resulting in higher energy conversion efficiency. The light-energy conversion device is fixed within the display module using a first and second adhesive layer. This facilitates the processing and installation of the device; furthermore, during the assembly of the display module, the two adhesive layers can be pressed and fitted together, reducing the space occupied by the device in the thickness direction. This display module can be widely used in wearable devices such as wristbands and watches, extending their lifespan.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the projection of the light energy conversion device onto the display panel is located on the outer periphery of the display area of ​​the display panel.

[0012] In some scenarios, the display area can also be called the effective area or the effective display area, etc.

[0013] In one possible implementation, the projection of the light-converting device onto the display panel coincides with the bezel of the display panel.

[0014] In this technical solution, the light energy conversion device is placed in a position that does not obstruct the display area of ​​the display panel, which helps to reduce the adverse effects of the light energy conversion device on the display effect of the display module.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the display module further includes a third adhesive layer for connecting the second adhesive layer and the display panel, wherein the third adhesive layer is at least partially connected to the middle portion of the second adhesive layer.

[0016] Due to temperature changes and / or the action of external forces, the middle area of ​​the second adhesive layer may collapse. By setting a third adhesive layer in the middle part of the second adhesive layer, it is beneficial to make the screen cover plate and the light energy conversion device more firmly connected, which is beneficial to improving the structural reliability of the display module.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the light energy conversion device includes a first device and a second device, wherein the first device and the second device are connected in parallel.

[0018] By connecting the first and second devices in parallel, and then electrically connecting the two devices to the external circuit, the internal circuit connection of the light energy conversion device is simplified, which helps to simplify the manufacturing process of the display module and improve the production efficiency of the display module.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the first end of the first device includes a first electrode and a second electrode, and the first end of the second device includes a third electrode and a fourth electrode. The first electrode, the second electrode, the third electrode and the fourth electrode are all used for electrical connection with the same electrode of an external circuit. The first electrode is electrically connected to the third electrode, and the second electrode is electrically connected to the fourth electrode.

[0020] In one possible implementation, the first, second, third, and fourth electrodes are all used for electrical connection to the positive or negative electrode of an external circuit.

[0021] Multiple connection lines can be set for the same electrodes between two devices. If one line fails, the other line can be used to maintain the normal operation of the light energy conversion device. The implementation of this technical solution is conducive to improving the reliability of the electrical connection of the light energy conversion device and the reliability of the light energy conversion function of the display module.

[0022] In conjunction with the first aspect, in some implementations of the first aspect, the second end of the first device, which is disposed opposite to the first end, is electrically connected to an external circuit, and the second end of the second device, which is disposed opposite to the first end, is electrically connected to an external circuit.

[0023] Both components in the light energy conversion device can be electrically connected to an external circuit independently. If one component fails, the other component can maintain its working state. The implementation of this technical solution helps to improve the reliability of the light energy conversion function of the display module.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the display module further includes a circuit board for electrically connecting the light energy conversion device to an external circuit. The second adhesive layer includes a first adhesive portion and a second adhesive portion. The first adhesive surface of the first adhesive portion is connected to the light energy conversion device, and the second adhesive surface of the first adhesive portion is connected to the screen cover plate. The first adhesive surface of the second adhesive portion is connected to the circuit board, and the second adhesive surface of the second adhesive portion is connected to the screen cover plate. The adhesive strength of the second adhesive portion is greater than that of the first adhesive portion.

[0025] Since the bonding area between the circuit board and the screen cover is relatively small, using a stronger adhesive part to bond the circuit board and the screen cover is beneficial to making the connection between the screen cover and the circuit board more secure and improving the reliability of the display module function.

[0026] In conjunction with the first aspect, in some implementations of the first aspect, the light energy conversion device includes a light energy conversion layer and an electrical connection layer. The light energy conversion layer includes multiple pn junctions, and the electrical connection layer is used to electrically connect the light energy conversion layer to an external circuit.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, the light energy conversion device further includes an upper electrode, and the electrical connection layer includes a first conductive part, which is electrically connected to an external circuit and electrically connected to the upper electrode.

[0028] In one possible implementation, the electrical connection layer may be located on the side of the photoconversion layer away from the upper electrode, and the photoconversion device may further include a conductive via for electrical connection between the upper electrode and the first conductive portion. Exemplarily, the conductive via may be partially located within the photoconversion layer, and one end of the conductive via may contact the upper electrode.

[0029] In one possible implementation, the electrical connection layer can be located on the side of the photoelectric conversion layer near the upper electrode, and the first conductive part can contact and be electrically connected to the upper electrode.

[0030] In conjunction with the first aspect, in some implementations of the first aspect, the light energy conversion device further includes a lower electrode, and the electrical connection layer further includes a second conductive part, which is in contact with the lower electrode and electrically connected to an external circuit.

[0031] In one possible implementation, the lower electrode can also be electrically connected to the second conductive part via a conductive via or a conductive post.

[0032] Using an electrical connection layer instead of a circuit board to achieve electrical connection between the light energy conversion device and the external circuit, the implementation of this technical solution is beneficial to reducing the number of electronic components in the display module, simplifying the circuit connection in the display module, and improving the assembly and manufacturing efficiency of the display module.

[0033] In one possible implementation, the photoelectric conversion device includes a first device and a second device, wherein a first conductive portion of the electrical connection layer of the first device is electrically connected to a first conductive portion of the electrical connection layer of the second device, and / or, a second conductive portion of the electrical connection layer of the first device is electrically connected to a second conductive portion of the electrical connection layer of the second device.

[0034] Using an electrical connection layer to achieve electrical connection between two devices helps to simplify the circuit connection within the light energy conversion device and reduces the adverse effects of the connection lines between devices on light blocking.

[0035] In conjunction with the first aspect, in some implementations of the first aspect, the photoelectric conversion device includes one or more of the following materials: multijunction gallium arsenide, multijunction indium gallium phosphide, multijunction indium gallium arsenide, or perovskite.

[0036] In conjunction with the first aspect, in some implementations of the first aspect, the length of the light-converting device is one-quarter of the perimeter of the display panel.

[0037] In a second aspect, a method for manufacturing a display module is provided, the method comprising: attaching a light-power conversion device to a second adhesive surface of a first adhesive layer; bonding the second adhesive surface of the first adhesive layer to a first adhesive surface of a second adhesive layer, and bonding the second adhesive surface of the second adhesive layer to a screen cover plate; wherein the light-power conversion device comprises a plurality of stacked pn junctions.

[0038] In this technical solution, two adhesive layers are respectively set on the upper and lower surfaces of the light energy conversion device to achieve relative fixation between the light energy conversion device and the screen cover and display panel. On the one hand, this is beneficial for the processing and installation of the light energy conversion device; on the other hand, during the assembly of the display module, the two adhesive layers can be squeezed and cooperated, which helps to reduce the space occupied by the light energy conversion device in the thickness direction.

[0039] In conjunction with the second aspect, in some implementations of the second aspect, the method further includes: bonding the first adhesive surface of the first adhesive layer to the display panel.

[0040] This technical solution first attaches the light energy conversion device to the first adhesive layer. After completing the electrical connection and other operations of the light energy conversion device, the first adhesive layer is then bonded to the display panel. The implementation of this technical solution helps to reduce the probability of damage to the display panel during the processing of the light energy conversion device and helps to improve the yield rate of the display module.

[0041] In conjunction with the second aspect, in some implementations of the second aspect, the method further includes bonding the first adhesive surface of the first adhesive layer to the display panel before attaching the light-energy conversion device to the second adhesive surface of the first adhesive layer.

[0042] The first adhesive layer is first bonded to the display panel, which can then support the adhesive layer. This technical solution is beneficial to improving the processing efficiency of subsequent light energy conversion devices.

[0043] In conjunction with the second aspect, in some implementations of the second aspect, before bonding the second adhesive surface of the first adhesive layer to the first adhesive surface of the second adhesive layer, the method further includes: electrically connecting the circuit board to the light energy conversion device; disposing a first adhesive material between a first portion of the circuit board and a screen cover, the first portion of the circuit board being close to the light energy conversion device; bonding the first portion of the circuit board to the screen cover using the first adhesive material; wherein the adhesive strength of the first adhesive material is greater than the adhesive strength of the materials constituting the first adhesive layer.

[0044] Since the area of ​​the circuit board used for bonding with the screen cover is relatively small, using an adhesive part with greater bonding strength to bond the circuit board and the screen cover is beneficial to make the connection between the screen cover and the circuit board more secure, which is beneficial to improving the functional reliability of the display module.

[0045] In conjunction with the second aspect, in some implementations of the second aspect, the light energy conversion device includes a first device and a second device, and the method further includes: electrically connecting the first device and the second device in parallel before bonding the second adhesive surface of the first adhesive layer to the first adhesive surface of the second adhesive layer.

[0046] By connecting the first and second devices in parallel, and then electrically connecting the two devices to the external circuit, the internal circuit connection of the light energy conversion device is simplified, which helps to simplify the manufacturing process of the display module and improve the production efficiency of the display module.

[0047] In conjunction with the second aspect, in some implementations of the second aspect, the first device and the second device are arranged adjacent to each other and spaced apart. Before electrically connecting the first device and the second device in parallel, the method further includes: filling the gap between the first device and the second device with a filling medium; and providing wires on the filling medium for connecting the first device and the second device in parallel.

[0048] By filling the gap between the first and second devices with a dielectric material and placing conductive lines on the dielectric material, the implementation of this technical solution can improve the reliability of the electrical connection between the two devices.

[0049] In conjunction with the second aspect, in some implementations of the second aspect, the first end of the first device includes a first electrode and a second electrode, and the first end of the second device includes a third electrode and a fourth electrode. Electrically connecting the first device and the second device in parallel includes: electrically connecting the first electrode to the third electrode and electrically connecting the second electrode to the fourth electrode; wherein the first electrode, the second electrode, the third electrode and the fourth electrode are all used for electrical connection with the same electrode of an external circuit.

[0050] Multiple connection lines can be set for the same electrodes between two devices. If one line fails, the other line can be used to maintain the normal operation of the light energy conversion device. The implementation of this technical solution is conducive to improving the reliability of the electrical connection of the light energy conversion device and the reliability of the light energy conversion function of the display module.

[0051] Thirdly, an electronic device is provided, comprising a housing and a display module as described in the first aspect and any possible implementation thereof, the display module being fixed relative to the housing.

[0052] In one possible implementation, the electronic device can be a wearable device such as a wristband or watch, and the housing can be the outer shell of the wearable device.

[0053] In one possible implementation, the electronic device can be a portable device such as a mobile phone or tablet, and the casing can be the mid-frame of the portable device. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of a display module provided in an embodiment of this application.

[0055] Figure 2 yes Figure 1 A schematic diagram of the AA section of the display module.

[0056] Figure 3 yes Figure 1 A schematic diagram of the components of the display module.

[0057] Figure 4 yes Figure 1 A schematic diagram of the BB cross-section of the display module.

[0058] Figure 5 This is a schematic diagram of the bonding method for the circuit board provided in the embodiments of this application.

[0059] Figure 6 This is a schematic diagram of the composition of the light energy conversion device provided in the embodiments of this application.

[0060] Figure 7 This is a schematic diagram of the structure of a light energy conversion device provided in an embodiment of this application.

[0061] Figure 8 This is a schematic diagram of another light energy conversion device provided in the embodiments of this application.

[0062] Figure 9 This is a schematic diagram of another type of light energy conversion device provided in the embodiments of this application.

[0063] Figure 10 This is a schematic diagram of another type of light energy conversion device provided in the embodiments of this application.

[0064] Figure 11 This is a schematic diagram of the electrical connection method of a light energy conversion device provided in an embodiment of this application.

[0065] Figure 12 This is a schematic diagram of another electrical connection method of a light energy conversion device provided in the embodiments of this application.

[0066] Figure 13 This is a schematic diagram of another electrical connection method of a light energy conversion device provided in the embodiments of this application.

[0067] Figure 14 This is a schematic diagram of another display module provided in an embodiment of this application.

[0068] Figure 15 This is a flowchart of a method for manufacturing a display module according to an embodiment of this application.

[0069] Figures 16 to 21 This is a schematic diagram of a method for manufacturing a display module provided in an embodiment of this application.

[0070] Figure 22 This is a flowchart of another method for manufacturing a display module provided in an embodiment of this application.

[0071] Figures 23 to 26 This is a schematic diagram of a method for manufacturing a display module provided in an embodiment of this application.

[0072] Figure 27 This is a schematic diagram of the electronic device provided in the embodiments of this application. Detailed Implementation

[0073] The embodiments of this application are described in detail below, and examples of these embodiments are illustrated in the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0074] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. In the description of this application, it should be understood that the terms “center,” “longitudinal,” “lateral,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0075] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0076] To improve the power supply capability of light energy conversion devices in electronic devices, this application provides a display module that includes a light energy conversion device. The light energy conversion device is fixed to other components in the display module by upper and lower adhesive layers. The light energy conversion device occupies less space in the thickness direction. In addition, the light energy conversion device includes multiple layers of stacked pn junctions, resulting in a higher light energy conversion efficiency.

[0077] Here's a brief explanation of pn junctions: A p (positive) type semiconductor is a semiconductor doped with a trivalent element (such as boron). A p-type semiconductor can contain a large number of freely moving electrons and holes. An n (negative) type semiconductor is a semiconductor doped with a pentavalent element (such as phosphorus or antimony). An n-type semiconductor can also contain a large number of freely moving electrons. The transition layer between the p-type and n-type semiconductors is called a pn junction.

[0078] Figure 1 The diagram shown is a structural schematic of a display module 10 provided in an embodiment of this application. The display module 10 may include a screen cover 20 and a display panel 60, with the screen cover 20 located approximately above the display panel 60.

[0079] For example, the side of the display panel 60 facing the screen cover 20 may include a display area 64 and a non-display area 66. The display area 64 can be used to display information such as text and images. The display area 64 may be located in the middle of the display panel 60, and the non-display area 66 may be located on the outer periphery of the display area 64.

[0080] In some scenarios, the display area 64 can also be called the active area (AA), and the non-display area 66 can also be called the black matrix (BM) or border.

[0081] In some examples, the non-display area 66 may be composed of a material with low light transmittance, such as a metal material, which can reduce the probability of light from the display area 64 leaking from other locations outside the display area 64, such as the non-display area 66.

[0082] One possible scenario is, such as Figure 1 As shown, the display panel 60 can be roughly circular, the display area 64 can be roughly circular, and the non-display area 66 can be roughly annular. Alternatively, the display panel can be roughly rectangular, in which case the display area can be roughly rectangular and the non-display area can be roughly a rectangular ring.

[0083] In some examples, the display panel 60 may also include a flexible circuit board 62, which can be used for electrical connection between the display panel 60 and external circuitry. Exemplarily, the display panel 60 can receive control signals from external circuitry via the flexible circuit board 62, which can be used to control the display mode and / or content displayed by the display panel 60.

[0084] For example, the end of the flexible circuit board 62 away from the display panel 60 can be electrically connected to a control chip, which can be used to send control signals to the display panel 60 to control the display mode and / or display content of the display panel 60.

[0085] In some examples, the display panel 60 can be a self-emissive display panel or a passively emissive display panel. For example, the display panel 60 can be one or more of the following: an organic light-emitting diode (OLED) based display panel, a quantum dot light-emitting diode (QLED) based display panel, a micro light-emitting diode (micro-LED) based display panel, or a liquid crystal based display panel. This application does not limit the scope of the application.

[0086] Continue to refer to Figure 1 The screen cover 20 of the display module 10 can be located above the display panel 60, and the screen cover 20 can protect the display panel 60.

[0087] One possibility is that the screen cover 20 can be larger than the display panel 60. For example, if both the screen cover 20 and the display panel 60 are circular, the diameter of the screen cover 20 can be larger than the diameter of the display panel 60. During the assembly of the multiple components included in the display module 10, the screen cover 20 can be fitted onto the display panel 60, and the edge of the screen cover 20 can be located outside the edge of the display panel 60.

[0088] To enhance the impact and abrasion resistance of the screen cover 20 and better protect other components of the display module 10, the screen cover 20 may, for example, be composed of one or more of the following materials: tempered glass, aluminosilicate glass, chemically strengthened glass, or sapphire crystal.

[0089] To maximize the amount of light from outside the display module 10 that can reach the light conversion device inside the display module 10, thereby improving the efficiency of the display module 10 in utilizing ambient light, one feasible approach is to apply an anti-reflective coating to the side of the screen cover 20 away from the display panel 60. This reduces the reflectivity of ambient light incident on the screen cover 20, allowing more incident light to reach the light conversion device, thus increasing the light energy utilization efficiency of the device. In some scenarios, the aforementioned anti-reflective coating on the screen cover 20 can also be referred to as an anti-reflective coating.

[0090] Continue to refer to Figure 1 The display module 10 may further include a light energy conversion device 40, which converts the light energy of incident light into electrical energy. This light energy conversion device 40 may be located between the aforementioned screen cover 20 and the display panel 60. In other words, the screen cover 20, the light energy conversion device 40, and the display panel 60 may be approximately aligned along the thickness direction of the display module 10. Figure 1 Center direction D1) stacking settings.

[0091] The incident light may include one or more of visible light, ultraviolet light, or infrared light; in other words, the wavelength range of the incident light may cover ultraviolet light, visible light, and infrared light. For example, the incident light may be natural light such as sunlight, or it may be light emitted by lighting appliances such as incandescent lamps.

[0092] To improve the energy conversion efficiency of the light energy conversion device 40, one feasible approach is to increase the area of ​​the light energy conversion device 40 that can receive incident light. By way of example and not limitation, the light energy conversion device 40 can be matched with the shape of the display panel 60. For example, the display panel 60 can be disc-shaped, and the light energy conversion device can also be approximately disc-shaped, with the diameter of the light energy conversion device being approximately equal to the diameter of the display panel 60.

[0093] The light energy conversion device 40 can be located roughly above the display area 64 of the display panel 60. When the shape and size of the light energy conversion device 40 are basically the same as those of the display panel 60, the light energy conversion device 40 will block the light emitted from the display area 64 to a certain extent, which will have an adverse effect on the display effect of the display module 10.

[0094] To minimize the adverse effects of the light-energy conversion device 40 on the display effect, one feasible approach is to maximize the light transmittance of light emitted from the display area 64 as it passes through the light-energy conversion device 40. For example, the light-energy conversion device 40 can be made of a material with high light transmittance. For instance, the light-energy conversion device 40 can be composed of materials such as perovskite or transparent conductive oxides. In this case, the light-energy conversion device 40 can convert the energy contained in infrared and / or ultraviolet light into electrical energy, while having a relatively small impact on the visible light emitted from the display area 64.

[0095] Similarly, to reduce the adverse effects of the light conversion device 40 on the display effect, one feasible approach is to position the light conversion device 40 outside the display area 64 of the display panel 60. Alternatively, the projection of the light conversion device 40 onto the plane of the display panel 60 can be located at the outer periphery of the display area 64. For example, the light conversion device 40 can be positioned above the non-display area 66 of the display panel 60.

[0096] Figure 2 yes Figure 1 A schematic diagram of the cross-section AA of the assembled display module 10 is shown. For example, when the display panel 60 is approximately circular, the light-converting device 40 can be approximately annular. In this case, the inner diameter of the light-converting device 40 can be r41, the outer diameter can be r42 (r42>r41), the radius of the display area 64 of the display panel 60 can be r61, and the radius of the display panel 60 can be r62 (r62>r61). One possible scenario is that r41 and r61 can satisfy the following relationship: r41≥r61, and r42 and r62 can satisfy the following relationship: r42≤r62.

[0097] The width of the annular light energy conversion device can be w1 (w1 = r42 - r41), and the width of the non-display area of ​​the display panel can be w2 (w2 = r62 - r61). In some scenarios, the above scheme can also be understood as: w1 ≤ w2.

[0098] Similarly, if the display panel 60 or the light energy conversion device 40 has other shapes, for example, the display panel 60 can be approximately rectangular, and the light energy conversion device 40 can be approximately rectangular. The size and positional relationship between the light energy conversion device 40 and the display panel 60 can also satisfy the following: the projection of the light energy conversion device 40 on the plane of the display panel 60 is located on the outer periphery of the display area 64.

[0099] When the light energy conversion device 40 is ring-shaped, the ring-shaped light energy conversion device 40 can be an open ring, or the two ends of the ring-shaped light energy conversion device 40 can be spaced apart.

[0100] One possibility is that the light energy conversion device 40 includes only one notch, or that the light energy conversion device 40 is a continuous strip or ring structure.

[0101] One possibility is that the light-energy conversion device 40 may include multiple notches, or in other words, the light-energy conversion device 40 may be composed of multiple sub-devices spaced apart from each other. For example, Figure 1 In this case, the light energy conversion device 40 may include two notches. In this case, the light energy conversion device 40 can be regarded as being composed of two mutually spaced sub-devices 401 and 402.

[0102] In some scenarios, the structure of the light energy conversion device 40 including multiple sub-devices can also be understood as follows: the number of light energy conversion devices can be multiple, and the multiple light energy conversion devices are spaced apart. Alternatively, the light energy conversion device 40 may include multiple sub-devices that are spaced apart from each other.

[0103] In order to transmit the electrical energy generated by the light-power conversion device 40 to an external circuit, at least one end of the light-power conversion device 40 is electrically connected to the external circuit. For example, Figure 1 The light-energy conversion device 40 can be electrically connected to an external circuit via a circuit board 42 (e.g., a flexible circuit board). Alternatively, by way of example, the light-energy conversion device 40 can be provided with an electrical connection layer, which can be used for the light-energy conversion device 40 to be electrically connected to an external circuit.

[0104] When the light energy conversion device 40 is a continuous strip or ring structure, one or both ends of the strip or ring light energy conversion device 40 can be electrically connected to an external circuit.

[0105] In the case where the photoelectric conversion device 40 includes multiple sub-devices, these sub-devices can be connected in parallel or in series. One possibility is that the multiple sub-devices are connected in parallel or in series and then electrically connected to an external circuit through one of the sub-devices. Alternatively, each of the multiple sub-devices can be electrically connected to an external circuit separately.

[0106] In some scenarios, the way the above-mentioned light energy conversion device 40 is electrically connected to the external circuit can also be understood as: the light energy conversion device 40 can be provided with one or more connection interfaces with the external circuit.

[0107] The electrical connection between the light energy conversion device 40 and the external circuit, as well as the electrical connection between the multiple sub-devices included in the light energy conversion device 40, will be explained in detail later and will not be elaborated here.

[0108] Continue to refer to Figure 1In some examples, the display module 10 may further include an adhesive layer 30 and an adhesive layer 50, wherein the adhesive layer 30 is located between the screen cover 20 and the light conversion device 40, and the adhesive layer 50 is located between the display panel 60 and the light conversion device 40. In other words, adhesive layers 30 and 50 are respectively disposed above and below the light conversion device 40. Figure 2 The adhesive layer 30 is connected to the screen cover plate 20 and the light energy conversion device 40 respectively, and the adhesive layer 50 is connected to the display panel 60 and the light energy conversion device 40 respectively.

[0109] For example, continue to refer to Figure 1 The adhesive layer 30 includes an adhesive surface 30-1 and an adhesive surface 30-2. The adhesive surface 30-1 can face the screen cover plate 20, and the adhesive surface 30-2 can face the light energy conversion device 40. In the scenario of assembling multiple components of the display module 10, the adhesive surface 30-1 is bonded to the side of the screen cover plate 20 facing the display panel 60, and the adhesive surface 30-2 is bonded to the side of the light energy conversion device 40 facing the screen cover plate 20. The adhesive layer 30 can achieve mutual bonding and relative fixation between the screen cover plate 20 and the light energy conversion device 40.

[0110] For example, continue to refer to Figure 1 The adhesive layer 50 includes an adhesive surface 50-1 and an adhesive surface 50-2. The adhesive surface 50-1 can face the light energy conversion device 40, and the adhesive surface 50-2 can face the display panel 60. In the scenario of assembling multiple components of the display module 10, the adhesive surface 50-1 is bonded to the light energy conversion device 40, and the adhesive surface 50-2 is bonded to the display panel 60. The adhesive layer 50 can achieve mutual bonding and relative fixation between the light energy conversion device 40 and the display panel 60.

[0111] To ensure a more secure connection between the multiple stacked components in the display module 10 and to make the structure of the display module 10 more stable, one feasible approach is to allow the area of ​​the adhesive surface 30-2 to be larger than the area where the light-energy conversion device 40 is bonded to the adhesive surface 30-2. Alternatively, the projection of the light-energy conversion device 40 onto the plane of the adhesive layer 30 can be located inside the adhesive layer 30. Or, in combination with... Figure 2 and Figure 3 The illustration in Figure 3-1 The adhesive surface 30-2 of the adhesive layer 30 facing the light energy conversion device 40 may include a region that is bonded to the light energy conversion device 40 (e.g., referred to as region A1) and a region that is not bonded to the light energy conversion device 40 (e.g., referred to as region A2). In this way, region A2 on the adhesive surface 30-2 can be bonded to the adhesive surface 50-1 of the adhesive layer 50, making the connection between the adhesive layer 30 and the adhesive layer 50 more secure.

[0112] Similarly, the area of ​​the adhesive surface 50-1 can be larger than the area of ​​the region where the light-energy conversion device 40 is bonded to the adhesive surface 50-1; in other words, the projection of the light-energy conversion device 40 onto the plane of the adhesive layer 50 can be located inside the adhesive layer 50. Or, in combination with... Figure 2 and Figure 3 The illustration in Figure 3-2 The adhesive surface 50-1 of the adhesive layer 50 facing the light energy conversion device 40 may include an area to which the light energy conversion device 40 is bonded (e.g., referred to as area A3) and an area not to which the light energy conversion device 40 is bonded (e.g., referred to as area A4). In this way, area A3 on the adhesive surface 50-1 can be bonded to the adhesive surface 30-2 of the adhesive layer 30, making the connection between the adhesive layers 50 and 30 more secure.

[0113] In other words, in some examples, adhesive layer 30 can also be used for bonding and fixing the screen cover 20 to adhesive layer 50, and adhesive layer 50 can also be used for bonding and fixing the display panel 60 to adhesive layer 30. Based on this, the multiple components in the display module 10 can be connected more firmly and reliably.

[0114] For example, refer to Figure 3 The light energy converter 40 can be ring-shaped, and the adhesive layer 30 and adhesive layer 50 can both be disc-shaped. The radius of the disc-shaped adhesive layer 30 and the radius of the disc-shaped adhesive layer 50 can both be larger than the outer diameter of the ring-shaped light energy converter 40.

[0115] When the light-energy conversion device 40 is bonded to the bonding surface 30-2, the area surrounded by the annular light-energy conversion device 40 can be considered as region A2 on the bonding surface 30-2. When the radius of the bonding layer 30 is larger than the outer radius of the light-energy conversion device 40, the area between the outer edge of the light-energy conversion device 40 and the outer edge of the bonding surface 30-2 can also be considered as region A2 on the bonding surface 30-2. In other words, Figure 3 The illustration in Figure 3-1 In the above, the oblique shaded area located inside the annular light energy conversion device 40 and the oblique shaded area located on the outer periphery of the annular light energy conversion device 40 can both be regarded as the aforementioned area A2.

[0116] Similarly, when the light-energy conversion device 40 is bonded to the bonding surface 50-1, the area surrounded by the annular light-energy conversion device 40 can be considered as region A4 on the bonding surface 50-1. When the radius of the bonding layer 50 is larger than the outer radius of the light-energy conversion device 40, the area between the outer edge of the light-energy conversion device 40 and the outer edge of the bonding surface 50-1 can also be considered as region A4 on the bonding surface 50-1. In other words, Figure 3 The illustration in Figure 3-2The oblique shaded area located within the annular light energy conversion device 40 and the oblique shaded area located on the outer periphery of the annular light energy conversion device 40 can both be regarded as the aforementioned area A4.

[0117] During the assembly and processing of the display module 10, the adhesive layer 30 and the adhesive layer 50 can be squeezed and cooperate with each other, which to a certain extent helps to reduce the space occupied by the light energy conversion device 40 in the thickness direction.

[0118] As explained above, the light-energy conversion device 40 can be electrically connected to an external circuit via the circuit board 42. In scenarios where multiple components of the display module 10 are assembled together, refer to... Figure 1 The circuit board 42 is generally located between the adhesive layer 30 and the adhesive layer 50. To ensure a relatively uniform distribution of the components in the display module 10 in different directions and to reduce the probability of the display module 10 having a large number of stacked components or a large thickness in one direction, one possibility is that the circuit board 42 electrically connected to the light-energy conversion device 40 and the flexible circuit board 62 electrically connected to the display panel 60 can be spatially offset from each other. In other words, the projection of the circuit board 42 onto the plane of the display panel 60 can be non-overlapping with the flexible circuit board 62.

[0119] Compared to the light energy conversion device 40, the area of ​​the circuit board 42 that can be used to bond with the adhesive layer 30 or adhesive layer 50 is relatively small. In order to enhance the bonding strength between the circuit board 42 and the adhesive layer 30 or adhesive layer 50 and improve the stability of the connection between the components of the display module 10 and the reliability of the function, it is possible to increase the area of ​​the circuit board 42, thereby increasing the bonding area between the circuit board 42 and the adhesive layer 30 or adhesive layer 50. However, this solution will reduce the area of ​​the light energy conversion device 40 that can receive incident light to a certain extent, which is not conducive to improving the light energy utilization efficiency of the light energy conversion device 40.

[0120] Taking the above factors into consideration, in order to enhance the bonding strength between the circuit board 42 and the adhesive layer 30 or adhesive layer 50, a stronger adhesive material can be used to connect the circuit board 42 and the screen cover 20, and / or, a stronger adhesive material can be used to connect the circuit board 42 and the display panel 60.

[0121] In other words, the material constituting adhesive layer 30 can be M1, the material constituting adhesive layer 50 can be M2, and the material used to bond the circuit board 42 can be M3. The adhesive strength of material M1 is T1, the adhesive strength of material M2 is T2, and the adhesive strength of material M3 is T3. For example, T1, T2, and T3 can satisfy: T3 > T1, T3 > T2.

[0122] It should be noted that the difference in adhesive strength among the three materials mentioned above is only one manifestation of their performance in the application scenario of this application. More generally, the differences in performance between materials M1, M2, and M3 can be explained using standard performance evaluation methods, such as comparing the peel strength of the three materials using the international standard ISO 11339. When comparing the performance of the three materials using the aforementioned standard method, it can also be concluded that the peel strength of material M3 is greater than that of material M1, and the peel strength of material M3 is greater than that of material M2.

[0123] For example, Figure 4 yes Figure 1 A schematic diagram of the cross-section BB of the assembled display module 10. (Combined with...) Figure 1 and Figure 4 The adhesive layer 30 may have an adhesive portion 32 at the position corresponding to the circuit board 42. The adhesive portion 32 may be composed of a material with greater adhesive strength (such as the aforementioned material M3). In the scenario of assembling multiple components of the display module 10, the side of the adhesive portion 32 facing the circuit board 42 may be bonded to the circuit board 42, and the side of the adhesive portion 32 facing the screen cover 20 may be bonded to the screen cover 20. Thus, the adhesive portion 32 with better adhesive performance can achieve mutual bonding and relative fixation between the circuit board 42 and the screen cover 20.

[0124] To ensure a more secure bond between the circuit board 42 and the display module 10, one feasible approach is to ensure that the bonding area between the adhesive portion 32 and the circuit board 42 is sufficiently large. For example, refer to... Figure 5 The illustration in Figure 5-1 The adhesive portion 32, for bonding to the circuit board 42, may include two regions. One region (e.g., referred to as region A5) may be bonded to the circuit board 42, and the other region (e.g., referred to as region A6) may be bonded to a portion of the adhesive layer 50. In other words, the projection of the portion of the circuit board 42 bonded to the adhesive portion 32 onto the plane of the adhesive layer 30 may fall within the area of ​​the adhesive portion 32, or the area of ​​the projection of the adhesive portion 32 onto the plane of the adhesive layer 30 may be larger than the area of ​​the projection of the portion of the circuit board 42 bonded to the adhesive portion 32 onto the plane of the adhesive layer 30.

[0125] It should be noted that, based on the above requirements, the total area of ​​the adhesive part 32 for bonding with the circuit board 42 can be controlled to be as small as possible, so as to reduce the adverse effects such as shading of the light energy conversion device 40 that may be caused by setting the adhesive part 32.

[0126] To ensure a more secure bond between the circuit board 42 and the display module 10, one feasible approach is to maximize the adhesive properties of the material M3 constituting the adhesive portion 32. For example, if the adhesive strength T3 of material M3 is greater than a threshold α, or in other words, the adhesive strength of material M3 is sufficiently high, then the area bonded between the adhesive portion 32 and the circuit board 42 can be minimized. For instance, refer to... Figure 5 The illustration in Figure 5-2 The projection of the adhesive portion 32 in the plane of the adhesive layer 30 can be approximately located inside the projection of the circuit board 42 in the plane of the adhesive layer 30, or in other words, the area A5 where the adhesive portion 32 is bonded to the circuit board 42 is approximately located inside the circuit board 42.

[0127] When the area where the adhesive portion 32 is bonded to the circuit board 42 is small, gaps may exist between the circuit board 42 and the adhesive layer 30 on both sides of the adhesive portion 32. One possibility is that the circuit board 42 may have electrodes on both sides of the adhesive portion 32 for electrical connection between the circuit board 42 and the light energy conversion device 40, or in other words, the positions where the light energy conversion device 40 and the circuit board 42 are electrically connected may be located on both sides of the adhesive portion 32.

[0128] Similarly, the adhesive layer 50 may have an adhesive portion composed of a material with greater adhesive strength (such as the aforementioned material M3) at the position corresponding to the circuit board 42. In scenarios where multiple components of the display module 10 are assembled, this adhesive portion can be used to more firmly bond the circuit board 42 to the display panel 60. The projection of the portion of the circuit board 42 connected to the adhesive portion in the plane of the adhesive layer 50 may be located within the range of the projection of the adhesive portion in the plane of the adhesive layer 50. Alternatively, if the adhesive strength of the adhesive material constituting the adhesive portion is sufficiently high, the projection of the adhesive portion in the plane of the adhesive layer 50 may also fall within the range of the projection of the circuit board 42 in the plane of the adhesive layer 50.

[0129] Figure 6 The diagram shown illustrates the structure of various light-energy conversion devices 40 provided in the embodiments of this application. These light-energy conversion devices can be broadly classified into two categories, with light-energy conversion device 40a being one category. Figure 1 The light energy conversion device 40 can be regarded as the light energy conversion device 40a here. The light energy conversion device 40a can be electrically connected to the external circuit through the circuit board 42. The light energy conversion devices 40b, 40c and 40d can be regarded as another type. These light energy conversion devices have an electrical connection layer that can be used for electrical connection with the external circuit.

[0130] Figure 7The image shows a cross-section CC of the light energy conversion device 40a. Exemplarily, the light energy conversion device 40a may include a light energy conversion layer 120, a conductive layer 130, a conductive layer 140, a support layer 150, and electrodes 111 and 112. The light energy conversion layer 120, conductive layer 130, conductive layer 140, and support layer 150 may be arranged along the thickness direction of the light energy conversion device 40a. Figure 7 The electrodes 111 and 112 are stacked sequentially in the direction of D1. Electrode 111 can be located on the light conversion layer 120, and electrode 112 can be located on the conductive layer 140. Electrodes 111 and 112 can be located on opposite sides of the light conversion device 40a, for example... Figure 7 In the photoelectric conversion device 40a, electrode 111 is located on the left side and electrode 112 is located on the right side.

[0131] In some scenarios, electrode 111 can be referred to as the upper electrode, and electrode 112 can be referred to as the lower electrode.

[0132] To improve the energy conversion efficiency of the light energy conversion device 40a, multiple pn junctions can be stacked in the light energy conversion layer 120 along the thickness direction of the light energy conversion device 40a. Different pn junctions correspond to different bandgap widths. In this way, the light energy conversion layer 120 can convert light of different wavelengths (such as visible light and infrared light) into electrical energy, thereby improving the energy conversion efficiency.

[0133] Furthermore, since different pn junctions are arranged along the thickness direction of the light energy conversion device 40a, this is beneficial to reducing the size of the light energy conversion device 40a in the length or width direction to a certain extent. In other words, this is beneficial to reducing the area of ​​the light energy conversion device 40a projected onto the plane WL, which is perpendicular to the thickness direction of the light energy conversion device 40a.

[0134] For example, the multiple pn junction structures in the photoelectric conversion layer 120 may include an n-type doped layer, a transition layer, and a p-type doped layer. The n-type doped layer may be composed of a material with a high free electron density, such as gallium arsenide with a pentavalent element (e.g., antimony or phosphorus) as the doping phase; the p-type doped layer may be composed of a material with a high hole density, such as gallium arsenide with a trivalent element (e.g., boron) as the doping phase.

[0135] In some examples, the photoelectric conversion layer 120 may include one or more of the following materials: multijunction gallium arsenide, multijunction indium gallium phosphide, multijunction indium gallium arsenide, or perovskite.

[0136] The thickness direction of the aforementioned light energy conversion device 40a can also be understood as: the thickness direction of the display module 10, or the direction in which the adhesive layer 30 in the display module 10 points to the adhesive layer 50, or the direction in which the components in the display module 10 are stacked.

[0137] In some examples, an antireflection layer may be provided on the side of the light conversion layer 120 away from the conductive layer 130. This antireflection layer can be used to reduce the reflectivity of incident light on the surface of the light conversion layer 120 and improve the absorption rate of the light conversion layer 120 for incident light. For example, the antireflection layer may be composed of a transparent, high-resistivity gallium arsenide material.

[0138] The side of conductive layer 130 closest to the light conversion layer 120 can contact the light conversion layer 120, and the side of conductive layer 130 furthest from the light conversion layer 120 can contact conductive layer 140. In other words, charge carriers (such as holes or electrons) generated in the light conversion layer 120 can be transported within conductive layers 130 and 140. One possibility is that both conductive layers 130 and 140 can be composed of metallic materials.

[0139] Continue to refer to Figure 7 The length of the conductive layer 130 ( Figure 7 The dimensions of the D2 axis in the center direction and the length of the photoconversion layer 120 are ( Figure 7 The dimensions on the center direction D2 are approximately equal, and the length of the conductive layer 140 is approximately equal. Figure 7 The dimension on the center direction D2 can be greater than the length of the conductive layer 130. In one possible case, the conductive layer 140 may include an extension located outside the right edge of the conductive layer 130, and the electrode 112 may be located on the right extension of the conductive layer 140. Furthermore, the electrode 112 may be spaced apart from the light energy conversion layer 120 and the conductive layer 130.

[0140] To facilitate the processing and movement of the thin and fragile light energy conversion layer 120, one feasible approach is to provide a support layer 150 for the light energy conversion device 40a. The aforementioned conductive layer 140, conductive layer 130, and light energy conversion layer 120 can all be located on the support layer 150. In other words, the support layer 150 can be used to support the light energy conversion layer 120, conductive layer 130, and conductive layer 140.

[0141] Considering that the processing and assembly process may cause damage to the light energy conversion device 40a, in some examples, the support layer 150 may be made of a material with good thermal stability. For example, the support layer 150 may include one or more of the following materials: polyimide, polytetrafluoroethylene, polyether ether ketone, or polycarbonate.

[0142] Unlike the aforementioned light-energy conversion device 40a, Figure 6The light energy conversion devices 40b, 40c, and 40d in the above-mentioned light energy conversion devices include a light energy conversion layer and an electrical connection layer. The light energy conversion layer can be used to convert light energy into electrical energy, and the electrical connection layer can be used for electrical connection between the light energy conversion device and the external circuit. In other words, the electrical connection layer of these light energy conversion devices can play the role of the aforementioned circuit board 42.

[0143] For example, the light energy conversion device 40b can be considered as including two interconnected sub-devices: sub-device 411 and sub-device 412. Sub-device 411 is generally ring-shaped and can be used to receive incident light and convert the light energy contained in the incident light into electrical energy; sub-device 412 is generally strip-shaped or strip-shaped and can be used to electrically connect the light energy conversion device 40b to an external circuit.

[0144] One possibility is that sub-devices 411 and 412 can be integrally formed, or that they can be continuous structures. For example, sub-devices 411 and 412 can have the same structure.

[0145] For example, the light energy conversion device 40c can be considered to include three sub-devices: sub-device 421, sub-device 422, and sub-device 423. Sub-devices 421 and 423 are generally semi-annular in shape and are used to receive incident light and convert the light energy contained in the incident light into electrical energy. Sub-device 422 is generally strip-shaped or ribbon-shaped and is used to electrically connect the light energy conversion device 40c to an external circuit. Sub-device 423 is spaced apart from sub-device 421, and also spaced apart from sub-device 422.

[0146] One possibility is that sub-devices 421 and 422 can be integrally formed, or that they can be continuous structures. For example, sub-devices 421 and 422 can have the same structure.

[0147] For sub-device 423, the structure of sub-device 423 can be the same as the structure of sub-device 421 or sub-device 422, or the structure of sub-device 423 can be different from the structure of sub-device 421 or sub-device 422.

[0148] For example, the light energy conversion device 40d can be considered to include five sub-devices: sub-device 431, sub-device 432, sub-device 433, sub-device 434, and sub-device 435. Sub-devices 431, 433, 434, and 435 are approximately in a quarter-ring shape, and these four sub-devices can be used to receive incident light and convert the light energy contained in the incident light into electrical energy. Sub-device 432 is approximately in a strip or band shape, and sub-device 432 can be used to electrically connect the light energy conversion device 40d to an external circuit. Sub-devices 433, 434, and 435 are spaced apart from each other in pairs, and these three pairs of sub-devices are spaced apart from sub-devices 431 and 432, respectively.

[0149] One possibility is that sub-devices 431 and 432 can be integrally formed, or that they can be continuous structures. For example, sub-devices 431 and 432 can have the same structure.

[0150] For sub-devices 433, 434 and 435, their structures may be the same as those of sub-devices 431 or 432, or they may be different from those of sub-devices 431 or 432.

[0151] by Figure 6 Taking the light energy conversion device 40b in the example, Figures 8 to 10 Several possible configurations of the cross section DD of the light energy conversion device 40b are provided as examples, and the cross section DD can roughly reflect the structure of the light energy conversion device 40b. The structures of the light energy conversion devices 40c and 40d can be similar to the structure of the light energy conversion device 40b.

[0152] refer to Figure 8 The light energy conversion device 40b may include a light energy conversion layer 220, an insulating layer 230, an electrical connection layer 240, an electrode 211, and an electrode 212. The light energy conversion layer 220, the insulating layer 230, and the electrical connection layer 240 are generally along the thickness direction of the light energy conversion device 40b. Figure 8 The layers are stacked in the direction of D1. Electrode 211 can be located on the side of the light energy conversion layer 220 away from the insulating layer 230, and electrode 212 can be located on the side of the insulating layer 230 away from the electrical connection layer 240.

[0153] In some scenarios, electrode 211 can be referred to as the upper electrode, and electrode 212 can be referred to as the lower electrode.

[0154] In some examples, the photoelectric conversion layer 220 may include one or more of the following materials: multijunction gallium arsenide, multijunction indium gallium phosphide, multijunction indium gallium arsenide, or perovskite.

[0155] To improve the energy conversion efficiency of the light energy conversion device 40a, the light energy conversion layer 220 can be modified along the thickness direction ( Figure 8 In the direction D1), multiple pn junctions are stacked, and different pn junctions correspond to different bandgap widths. In this way, the light energy conversion layer 220 can convert light of different wavelengths (such as visible light and infrared light) into electrical energy, thereby improving the energy conversion efficiency of the light energy conversion device 40b.

[0156] Furthermore, since different pn junctions are arranged along the thickness direction, this is beneficial to reducing the size of the light energy conversion device 40b in the length or width direction to some extent. In other words, this is beneficial to reducing the area of ​​the light energy conversion device 40b projected onto the plane WL, which is perpendicular to the thickness direction of the light energy conversion device 40b.

[0157] For example, the multiple pn junction structures in the photoelectric conversion layer 220 may include an n-type doped layer, a transition layer, and a p-type doped layer. The n-type doped layer may be composed of a material with a high free electron density, such as gallium arsenide with a pentavalent element (e.g., antimony or phosphorus) as the doping phase; the p-type doped layer may be composed of a material with a high hole density, such as gallium arsenide with a trivalent element (e.g., boron) as the doping phase.

[0158] For example, an antireflection layer may also be provided on the side of the light conversion layer 220 away from the insulating layer 230. This antireflection layer can be used to reduce the reflectivity of incident light on the surface of the light conversion layer 220 and improve the absorption rate of the light conversion layer 220 for incident light. For example, the antireflection layer may be composed of a transparent, high-resistivity gallium arsenide material.

[0159] In some examples, the insulating layer 230 may be made of an insulating material. Exemplarily, the insulating layer 230 may be a polymer material, an inorganic non-metallic composite material, etc.

[0160] For the light energy conversion device 40a mentioned above, the circuit board 42 can be electrically connected to the light energy conversion device 40a through conductive lines that are connected to the electrodes 111 and 112 of the light energy conversion device 40a. Since the electrodes are located above the light energy conversion device, the conductive lines will affect the absorption and conversion of light by the light energy conversion layer to a certain extent.

[0161] To improve the energy conversion efficiency of the 40b photoelectric conversion device, continue to refer to... Figure 8 An electrical connection layer 240 may be provided on the side of the light energy conversion device 40b away from the light energy conversion layer 220. This electrical connection layer 240 can be used for electrical connection between the light energy conversion device 40b and an external circuit.

[0162] For example, the electrical connection layer 240 may include a conductive portion 241, a conductive portion 242, and a support portion 243, wherein the conductive portions 241 and 242 may be composed of conductive materials, and the support portion 243 may be composed of insulating materials. The conductive portion 241 may be electrically connected to the electrode 211, the conductive portion 242 may be electrically connected to the electrode 212, and the support portion 243 may cover the outer periphery of the conductive portions 241 and 242.

[0163] For example, conductive parts 241 and 242 may be composed of one or more of the following materials: copper, silver, aluminum or gold, etc.

[0164] For example, the support portion 243 may be composed of one or more of the following materials: polyimide, polytetrafluoroethylene, polyetheretherketone, or polycarbonate, etc.

[0165] refer to Figure 8 One possibility is that the length of the insulating layer 230 ( Figure 8 The dimension on the central direction D2 can be larger than the length of the light conversion layer 220. Figure 8 (The dimension on the direction D2), or in other words, the insulating layer 230 may include an extension that is generally located outside the right edge of the light conversion layer 220. By way of example and not limitation, the electrode 212 may be located on the extension of the insulating layer 230 and the electrode 212 may be spaced apart from the light conversion layer 220.

[0166] As one possible implementation, electrode 211 and conductive part 241 can be electrically connected via conductive via 251, and electrode 212 and conductive part 242 can be electrically connected via conductive via 252. A portion of conductive via 251 can be located on the light energy conversion layer 220, with the end near electrode 211 in contact with electrode 211; another portion of conductive via 251 can be located on the insulating layer 230, with the end near the electrical connection layer 240 in contact with conductive part 241; the two portions of the aforementioned conductive via 251 can be interconnected and electrically connected. Conductive via 252 can be located on the insulating layer 230, with the end near electrode 212 in contact with electrode 212, and the end near the electrical connection layer 240 in contact with conductive part 242.

[0167] In some examples, conductive portions 241 and 242 can also be used to fix the insulating layer 230 and the electrical connection layer 240 to each other. Exemplarily, both conductive portions 241 and 242 can be made of a metallic material (e.g., copper), and the conductive portions 241 and 242 can achieve relative fixation of the insulating layer 230 and the electrical connection layer 240 by means of bonding techniques such as chemical bonding and physical bonding.

[0168] Figure 9 This is a schematic diagram of a cross-section DD of another light-energy conversion device 40b provided in this application embodiment. The light-energy conversion device 40b may include a light-energy conversion layer 320, a conductive layer 330, an electrical connection layer 340, an electrode 311, and an electrode 312. The light-energy conversion layer 320, the conductive layer 330, and the electrical connection layer 340 are generally along the thickness direction of the light-energy conversion device 40b. Figure 9 The layers are stacked in the direction of D1. Electrode 311 can be located on the side of the light energy conversion layer 320 away from the conductive layer 330, and electrode 312 can be located on the electrical connection layer 340.

[0169] In some scenarios, electrode 311 can be referred to as the upper electrode, and electrode 312 can be referred to as the lower electrode.

[0170] In some examples, the photoelectric conversion layer 320 may include one or more of the following materials: multijunction gallium arsenide, multijunction indium gallium phosphide, multijunction indium gallium arsenide, or perovskite.

[0171] To improve the energy conversion efficiency of the light energy conversion device 40b, multiple pn junctions can be stacked along the thickness direction in the light energy conversion layer 320. Different pn junctions correspond to different bandgap widths. In this way, the light energy conversion layer 320 can convert light of different wavelengths (such as visible light and infrared light) into electrical energy, thereby improving the energy conversion efficiency.

[0172] Furthermore, since different pn junctions are arranged along the thickness direction, this is beneficial to reducing the size of the light energy conversion device 40b in the length or width direction to some extent. In other words, this is beneficial to reducing the area of ​​the light energy conversion device 40b projected onto the plane WL, which is perpendicular to the thickness direction of the light energy conversion device 40b.

[0173] For example, the multiple pn junction structures in the photoelectric conversion layer 320 may include an n-type doped layer, a transition layer, and a p-type doped layer. The n-type doped layer may be composed of a material with a high free electron density, such as gallium arsenide with a pentavalent element (e.g., antimony or phosphorus) as the doping phase; the p-type doped layer may be composed of a material with a high hole density, such as gallium arsenide with a trivalent element (e.g., boron) as the doping phase.

[0174] For example, an antireflection layer may also be provided on the side of the light conversion layer 320 away from the insulating layer 330. This antireflection layer can be used to reduce the reflectivity of incident light on the surface of the light conversion layer 320 and improve the absorption rate of the light conversion layer 320 for incident light. For example, the antireflection layer may be composed of a transparent, high-resistivity gallium arsenide material.

[0175] The side of the conductive layer 330 closest to the light conversion layer 320 can be in contact with the light conversion layer 320. In other words, charge carriers (such as holes or electrons) generated in the light conversion layer 320 can be transported within the conductive layer 330. One possibility is that the conductive layer 330 can be composed of a metallic material.

[0176] Continue to refer to Figure 9 One possibility is that the length of the conductive layer 330 is approximately equal to the length of the light energy conversion layer 320. The length of the electrical connection layer 340 may be greater than the length of the conductive layer 330, or the electrical connection layer 340 may include an extension that is approximately located outside the right edge of the conductive layer 330. Another possibility is that the electrode 312 may be located on the extension of the electrical connection layer 340, and the electrode 312 may be spaced apart from the conductive layer 330 and the light energy conversion layer 320.

[0177] To improve the energy conversion efficiency of the 40b photoelectric conversion device, continue to refer to... Figure 9 The light energy conversion device 40b can be electrically connected to an external circuit through the electrical connection layer 340.

[0178] In some examples, the electrical connection layer 340 may include a conductive portion 341, a conductive portion 342, and a support portion 343, wherein the conductive portion 341 may be electrically connected to the electrode 311, the conductive portion 342 may be electrically connected to the electrode 312, and the support portion 343 may cover the outer periphery of the conductive portions 341 and 342.

[0179] For example, conductive parts 341 and 342 may be composed of one or more of the following materials: copper, silver, aluminum or gold, etc.

[0180] For example, the support portion 343 may be composed of one or more of the following materials: polyimide, polytetrafluoroethylene, polyetheretherketone, or polycarbonate, etc.

[0181] As one possible implementation, electrode 311 and conductive part 341 can be electrically connected through conductive via 351, and electrode 312 can be in direct contact and electrically connected to conductive part 342. (Reference) Figure 9 A portion of the conductive via 351 may be located on the light energy conversion layer 320, and the end of this portion near the electrode 311 may be in contact with the electrode 311; another portion of the conductive via 351 may be located on the conductive layer 330, and the end of this portion near the electrical connection layer 340 may be in contact with the conductive part 341.

[0182] Figure 10This is a schematic diagram of a cross-section DD of another light-energy conversion device 40b provided in this application embodiment. The light-energy conversion device 40b may include a light-energy conversion layer 420, a substrate 430, an electrical connection layer 440, electrodes 411 and 412. The electrical connection layer 440, the light-energy conversion layer 420, and the substrate 430 are generally along the thickness direction of the light-energy conversion device 40b. Figure 10 The layers are stacked in the direction of D1. Electrode 411 can be located on the side of the light energy conversion layer 420 away from the substrate 430, and electrode 412 is located on the substrate 430.

[0183] In some examples, the photoelectric conversion layer 420 may include one or more of the following materials: multijunction gallium arsenide, multijunction indium gallium phosphide, multijunction indium gallium arsenide, or perovskite.

[0184] The material composition, structure and performance of the photoelectric conversion layer 420 are roughly similar to those of the photoelectric conversion layer 220 or the photoelectric conversion layer 320 mentioned above. For a detailed description of this part, please refer to the content mentioned above, and it will not be repeated here.

[0185] In some examples, the light conversion layer 420 can be prepared by epitaxial growth of the substrate 430. In this scenario, the light conversion layer 420 can also be referred to as the epitaxial layer 420.

[0186] In order to reduce the thickness of the light energy conversion device 40b as much as possible, the substrate 430 can be thinned during the fabrication of the light energy conversion device 40b. For example, the substrate 430 can be thinned by chemical etching or physical polishing.

[0187] refer to Figure 10 In some examples, the length of the substrate 430 may be greater than the length of the photoconversion layer 420, or the substrate 430 may include an extension that is generally located outside the right edge of the photoconversion layer 420. One possibility is that the electrode 412 may be located on the extension of the substrate 430, and the electrode 412 may be spaced apart from the photoconversion layer 420.

[0188] Different from Figure 8 or Figure 9 The electrical connection layer is located below the light energy conversion layer. Figure 10 The electrical connection layer 440 can be located above the light conversion layer 420. In other words, Figure 8 The intermediate electrical connection layer 240 is positioned away from the electrode 211. Figure 9 The intermediate electrical connection layer 340 is positioned away from the electrode 311. Figure 10 In this configuration, the electrical connection layer 440 can be positioned close to the electrode 411.

[0189] For example, the electrical connection layer 440 may include a conductive portion 441, a conductive portion 442, and a support portion 443, wherein the conductive portion 441 is electrically connected to the electrode 411, the conductive portion 442 is electrically connected to the electrode 412, and the support portion 443 may cover the outer periphery of the conductive portions 441 and 442.

[0190] For example, conductive parts 441 and 442 may be composed of one or more of the following materials: copper, silver, aluminum or gold, etc.

[0191] For example, the support portion 443 may be composed of one or more of the following materials: polyimide, polytetrafluoroethylene, polyetheretherketone, or polycarbonate, etc.

[0192] One possible scenario is that the conductive part 441 is in direct contact and electrically connected to the electrode 411, while the conductive part 442 is electrically connected to the electrode 412 via a conductive post 452. (Reference) Figure 10 The conductive portion 441 can be located approximately above the electrode 411, with the side of the conductive portion 441 facing the electrode 411 in contact with the electrode 411. The conductive portion 442 is also located approximately above the electrode 412, with one end of the conductive post 452 in contact with the conductive portion 442 and the other end of the conductive post 452 in contact with the electrode 412. Alternatively, the end of the conductive post 452 in contact with the conductive portion 442 can be inserted into the support layer 443, thereby fixing the conductive post 452 relative to the electrical connection layer 440.

[0193] During use, Figures 7 to 9 The light energy conversion layer of the light energy conversion device 40b can be positioned facing the screen cover 20, and incident light can be directly incident on the light energy conversion layer. Figure 10 The substrate 430 of the light energy conversion device 40b can be positioned facing the screen cover plate 20, and incident light can pass through the substrate 430 and then enter the light energy conversion layer 420. In order to reduce the influence of the substrate 430 on the absorption and reflection of incident light, the thickness of the substrate 430 can be made as thin as possible.

[0194] It should be noted here that, for Figure 6 In the case of a solar energy conversion device containing multiple sub-devices, the structures of the sub-devices can be the same or different.

[0195] For example, for the light energy conversion device 40a, its sub-device 401 can be... Figure 7 The structure shown can be such that sub-device 402 can be Figures 7 to 10 Any of the structures in it.

[0196] For example, in the light energy conversion device 40b, the sub-devices 411 and 412 are integrally formed structures. These two sub-devices have the same structure and can be used as... Figures 8 to 10Any of the structures in it.

[0197] For example, in the light energy conversion device 40c, the sub-devices 421 and 422 included can be Figures 8 to 10 Any of the structures in the diagram, whose sub-devices 423 can be... Figures 7 to 10 Any of the structures in it.

[0198] For example, for the light energy conversion device 40d, its sub-devices 431 and 432 can be... Figures 8 to 10 Any of the structures in the diagram, including sub-devices 433, 434, and 435, can be... Figures 7 to 10 Any of the structures in it.

[0199] Figure 6 The shapes and structures of several light-energy conversion devices are provided only as examples; more shapes or structures are possible for light-energy conversion devices, and this application does not limit this. For example, in the case where the display panel of the display module 10 is approximately rectangular, Figure 6 In this light-energy conversion device, the annular portion can be a straight strip or band. Similarly, by way of example, the light-energy conversion device may include six, eight, or more sub-devices.

[0200] Photovoltaic devices can include sub-devices of different shapes and in adjustable quantities. On the one hand, this can improve the utilization rate of materials (such as epitaxial wafers) used to manufacture photovoltaic devices, and on the other hand, it can reduce the processing difficulty of photovoltaic devices. For example, it can reduce the difficulty of cutting epitaxial wafers used to manufacture photovoltaic devices.

[0201] The following combination Figures 11 to 13 The electrical connection methods between different sub-components in the light energy conversion device and the connection methods between the light energy conversion device and the circuit board are explained.

[0202] refer to Figure 11 , indicating Figure 11-1 and indication Figure 11-2 In this case, the light energy conversion device can be a one-piece molded structure, which involves the electrical connection between the light energy conversion device and the external circuit.

[0203] One possibility is that the photoelectric conversion device may not include an electrical connection layer, for example... Figure 7 In the structure shown, the light energy conversion device can be electrically connected to the circuit board 42 through two electrodes, and the circuit board 42 can be electrically connected to the external circuit through the electrical connection interface, so that the light energy conversion device can be electrically connected to the external circuit.

[0204] For example, such as Figure 11 The illustration in Figure 11-1One end of the light energy conversion device can be provided with two electrodes, which can be electrically connected to the circuit board 42.

[0205] To improve the reliability of the electrical connection between the light energy conversion device and the circuit board 42, refer to the schematic diagram. Figure 11-2 Each end of the light energy conversion device can be equipped with two electrodes, both of which can be electrically connected to the circuit board 42. In this way, if the electrical connection between one end of the light energy conversion device and the circuit board 42 is unreliable, the electrical energy generated by the light energy conversion device can be supplied to the external circuit through the other end electrically connected to the circuit board 42.

[0206] One possibility is that the photoelectric conversion device may include an electrical connection layer, such as the one mentioned above. Figures 8 to 10 In the structure shown, the electrical connection layer of the light-power conversion device can be used as an electrical connection between the circuit board and an external circuit. For example, one end of the electrical connection layer connected to the external circuit can be provided with an electrical connection interface (e.g., a male connector of a board-to-board interface). When this electrical connection interface is engaged with the corresponding electrical connection interface of the external circuit, the light-power conversion device is electrically connected to the external circuit.

[0207] It should be noted that when an electrical connection layer is provided in the light energy conversion device, the light energy conversion device can also be electrically connected to the circuit board through electrodes.

[0208] refer to Figure 11 , indicating Figure 11-3 To indicate Figure 11-7 In this context, a light energy conversion device may include multiple sub-devices, which involves electrical connections between adjacent sub-devices and electrical connections between sub-devices and external circuits.

[0209] One possibility is that the photoelectric conversion device may include an electrical connection layer, such as the one mentioned above. Figures 8 to 10 The structure shown allows the electrical connection layer to be used for electrical connections between sub-devices and between sub-devices and external circuitry. (See diagram for reference.) Figure 11-3 Two conductive parts on the electrical connection layer at one end of two adjacent sub-devices can be electrically connected through conductive lines.

[0210] One possibility is that the photoelectric conversion device may not include an electrical connection layer, for example... Figure 7 The structure shown is illustrated in this case, referring to the schematic diagram. Figure 11-4 The electrical connection between two adjacent sub-devices can be achieved by electrically connecting two electrodes located on their respective light energy conversion layers through conductive lines. The electrical connection between the sub-device and the circuit board 42 can be achieved by electrically connecting the two electrodes on the light energy conversion layer of the sub-device to the circuit board.

[0211] One possibility is that the photoelectric conversion device may include an electrical connection layer, such as the one mentioned above. Figures 8 to 10 The structure shown may include two conductive portions in the electrical connection layer. In this case, refer to the schematic diagram. Figure 11-5 One of the two conductive lines between the two sub-devices can electrically connect the two oppositely arranged electrodes of the two sub-devices, and the other can electrically connect the two oppositely arranged conductive parts of the two sub-devices. Similarly, one of the two conductive lines between the sub-device and the circuit board 42 can electrically connect the electrodes of the sub-device, and the other can electrically connect the conductive parts of the sub-device.

[0212] When a photoelectric conversion device comprises multiple sub-devices, these sub-devices can be electrically connected in various ways. Taking a photoelectric conversion device comprising four sub-devices as an example, the diagram illustrates... Figure 11-4 In this circuit, three adjacent sub-devices can be connected in parallel and electrically connected to an external circuit, while the remaining sub-device can be electrically connected to an external circuit independently. (Illustration) Figure 11-6 In this design, two adjacent sub-devices out of the four sub-devices can form a group, and the two sub-devices in each group can be connected in parallel and then electrically connected to an external circuit. (Illustration) Figure 11-7 In this configuration, the four sub-devices can be connected in parallel and then electrically connected to an external circuit. In this case, the diagram illustrates... Figure 11-2 Similarly, after the four sub-devices are connected in parallel, the two sub-devices at both ends can be electrically connected to the external circuit, thereby improving the reliability of the electrical connection between the light energy conversion device and the external circuit.

[0213] refer to Figure 12 In order to improve the reliability of electrical connections between different sub-devices in a light energy conversion device and the reliability of electrical connections between the light energy conversion device and external circuits, multiple parallel conductive lines can be set between two interconnected electrodes or between two interconnected conductive parts. If one conductive line fails, the parallel conductive lines can still provide electrical connection.

[0214] For ease of explanation, the electrical connection between sub-components and the electrical connection between a sub-component and the circuit board will not be distinguished below, and will be referred to as the electrical connection between component A and component B; similarly, the electrical connection between electrodes and the electrical connection between conductive parts will not be distinguished, and will be referred to as the electrical connection between two nodes.

[0215] To illustrate Figure 12-1 For example, device A includes nodes Pc-1 and Pc-2, and device B includes nodes Pc-3 and Pc-4. When device A and device B are electrically connected, nodes Pc-1 and Pc-3 are electrically connected, and nodes Pc-2 and Pc-4 are electrically connected.

[0216] To improve the reliability of the electrical connection between device A and device B, in some examples, node Pc-1 may include child nodes Pc-11 and Pc-12, and node Pc-3 may include child nodes Pc-31 and Pc-32. During the electrical connection of device A and device B, for example, child node Pc-11 may be electrically connected to child node Pc-31, and child node Pc-12 may be electrically connected to child node Pc-32. Thus, even if any one of the child nodes Pc-11, Pc-12, Pc-31, and Pc-32 fails, the electrical connection between node Pc-1 and node Pc-3 can still be maintained.

[0217] Similarly, node Pc-2 may include child nodes Pc-21 and Pc-22, and node Pc-4 may include child nodes Pc-41 and Pc-42. During the electrical connection of device A to device B, for example, child node Pc-21 may be electrically connected to child node Pc-41, and child node Pc-22 may be electrically connected to child node Pc-42. Thus, even if any one of the child nodes Pc-21, Pc-22, Pc-41, or Pc-42 fails, the electrical connection between nodes Pc-2 and Pc-4 can still be maintained.

[0218] refer to Figure 12 The illustration in Figure 12-2 For example, during the process of electrically connecting device A and device B, sub-node Pc-11 can be electrically connected to sub-node Pc-32, sub-node Pc-12 can be electrically connected to sub-node Pc-31; sub-node Pc-21 can be electrically connected to sub-node Pc-42, and sub-node Pc-22 can be electrically connected to sub-node Pc-41.

[0219] refer to Figure 12 The illustration in Figure 12-3 For example, during the electrical connection of device A and device B, child node Pc-11 can be electrically connected to both child nodes Pc-31 and Pc-32 simultaneously, and child node Pc-12 can be electrically connected to both child nodes Pc-31 and Pc-32 simultaneously. Similarly, child node Pc-21 can be electrically connected to both child nodes Pc-41 and Pc-42 simultaneously, and child node Pc-22 can be electrically connected to both child nodes Pc-41 and Pc-42 simultaneously.

[0220] refer to Figure 12 The illustration in Figure 12-4For example, during the electrical connection of device A and device B, the four child nodes Pc-11, Pc-12, Pc-31, and Pc-32 can all be electrically connected to each other. Similarly, the four child nodes Pc-21, Pc-22, Pc-41, and Pc-42 can all be electrically connected to each other.

[0221] As explained above, when a photoelectric conversion device contains multiple sub-devices, adjacent sub-devices can be spaced apart, or in other words, there can be gaps between adjacent sub-devices. To make the electrical connection between adjacent sub-devices more reliable, one feasible approach is to fill the gaps between adjacent sub-devices with a filling medium. The height of the filling medium can be approximately the same as the height of the two corresponding sub-nodes of the adjacent sub-devices.

[0222] Here, the height of the child node can be up to the height of the electrode on the light conversion layer of the light conversion device, or it can be up to the height of the conductive part in the light conversion device that includes the electrical connection layer.

[0223] For example, refer to Figure 13 A filling medium 44 can be provided at the interval between device A and device B. The height of the filling medium 44, the height of the child node Pc-11 on device A, and the height of the child node Pc-31 on device B can be approximately the same. A portion of the upper surface of the filling medium 44 can be provided with a conductive coating (such as conductive silver paste, silver paste, etc.). The conductive coating can be roughly in the shape of a line segment. One end of the conductive coating near the child node Pc-11 can be electrically connected to the child node Pc-11, and the other end of the conductive coating near the child node Pc-31 can be electrically connected to the child node Pc-31. In this way, the line segment-shaped conductive coating on the upper surface of the filling medium 44 can serve as a conductive line for electrically connecting the child nodes Pc-11 and Pc-31.

[0224] Combination Figure 1 and Figure 14 During the processing of the display module 10, the adhesive layer 30 or adhesive layer 50 may deform due to temperature changes and / or external forces. One possibility is that the middle part of the adhesive layer 30 may collapse, or the middle area of ​​the adhesive surface 30-1 connecting the adhesive layer 30 to the screen cover plate 20 may separate from the screen cover plate 20.

[0225] To ensure a stronger bond between the adhesive layer 30 and the screen cover plate 20, one feasible method is to fill the space between the adhesive surface 30-1 of the adhesive layer 30 and the screen cover plate 20 with an adhesive material. This adhesive material, after curing, can form a structure similar to... Figure 14The adhesive layer 70 shown can be bonded to the middle area of ​​the screen cover 20 and the adhesive surface 30-1 respectively, thereby making the adhesive layer 30 and the screen cover 20 more firmly connected.

[0226] like Figure 15 The diagram shown is a schematic diagram of the process flow for manufacturing a display module 10 according to an embodiment of this application. Figures 16 to 21 The process of fabricating the display module 10 using this technology is roughly illustrated.

[0227] S101, cut to obtain one or more light energy conversion devices.

[0228] In some examples, the light-energy conversion device can be Figures 7 to 10 Any one of the following structures.

[0229] In some examples, a light-energy conversion device can be composed of multiple sub-devices, and the shapes and structures of the different sub-devices can be different. For example, a light-energy conversion device can be... Figure 6 Any one of the light energy conversion devices 40a, 40b, 40c or 40d shown.

[0230] In some examples, multiple pn junctions may be stacked along the thickness direction of the photoelectric conversion device, with different pn junctions corresponding to different bandgap widths. Exemplarily, the photoelectric conversion device may include one or more of the following materials: multi-junction gallium arsenide, multi-junction indium gallium phosphide, multi-junction indium gallium arsenide, or perovskite.

[0231] As one possible implementation, the light-energy conversion device can be obtained by processing an epitaxial wafer.

[0232] For example, for Figure 7 The light energy conversion device shown can remove the substrate of the epitaxial wafer by physical polishing and / or chemical etching. Electrodes 111 and conductive layers 130 can be processed on the epitaxial layer of the epitaxial wafer by deposition processes such as vapor deposition. Support layer 150 with conductive layer 140 coated on its surface can be fixed relative to epitaxial wafer 120 by bonding process. Electrodes 112 can be processed onto conductive layer 140 by deposition process.

[0233] After the above processing steps, the epitaxial wafer retains its basic shape and remains roughly circular. To place the light-converting device on the outer periphery of the display area of ​​the display panel, the processed epitaxial wafer needs to be cut into rings, strips, or bands. For ease of explanation, the epitaxial wafer processed in the above manner will be referred to as the processed epitaxial wafer Wf.

[0234] For example, multiple light-energy conversion devices of the same shape and size can be cut from the same processed epitaxial wafer Wf.

[0235] For example, such as Figure 16 The illustration in Figure 16-1 As shown, the processed epitaxial wafer Wf can be cut into multiple light-energy conversion devices Ws0, each approximately a quarter ring in shape.

[0236] To improve the utilization efficiency of epitaxial wafers, for example, multiple light conversion devices of different shapes and / or sizes can be cut from the same processed epitaxial wafer Wf.

[0237] For example, such as Figure 16 The illustration in Figure 16-2 As shown, the processed epitaxial wafer Wf can be cut into annular light-converting devices Ws1, Ws3, and strip-shaped light-converting devices Ws2. The widths of the annular light-converting devices Ws1 and Ws3 can be different.

[0238] for Figure 6 In order to improve the utilization efficiency of the processed epitaxial wafer Wf, the length of sub-devices 412 in the light energy conversion device 40b, 422 in the light energy conversion device 40c, or 432 in the light energy conversion device 40d can be controlled to be as short as possible.

[0239] Light-converting devices of different shapes and / or sizes can be applied to different types of display modules, and this cutting method helps improve the utilization efficiency of epitaxial wafers. In addition, compared to a single light-converting device, combining multiple light-converting devices and applying them to a display module is beneficial for the subsequent processing and assembly of the display module, and simplifies the processing steps of the display module.

[0240] S102, attach the light energy conversion device to the first side of the film adhesive material A.

[0241] Figure 17 The illustration in Figure 17-1 and Figure 18 The illustration in Figure 18-1 A top view roughly showing the S102 operation process is shown. Figure 17 The illustration in Figure 17-2 and Figure 18 The illustration in Figure 18-2 The main view roughly shows the S102 operation process.

[0242] In some examples, Figure 1The adhesive layer 50 in the display module 10 shown can be formed by curing adhesive material A. For example, adhesive material A can include one or more of the following materials: acrylic adhesive, epoxy resin adhesive, polyurethane adhesive or silicone adhesive, etc.

[0243] One possibility is that adhesive material A can be optically clear adhesive (OCA).

[0244] Adhesive material A can be located between the upper release film Fu1 and the lower release film Fd1; in other words, Figure 1 Before being bonded to the light energy conversion device 40, the adhesive surface 50-1 of the adhesive layer 50 is bonded to the upper release film Fu1; before being bonded to the display panel 60, the adhesive surface 50-2 of the adhesive layer 50 is bonded to the lower release film Fd1. After peeling off the upper release film Fd1 of the film-like adhesive material A, as shown... Figure 17 and Figure 18 As shown, the light energy conversion device 40 can be bonded to the adhesive material A, or in other words, the light energy conversion device 40 can be bonded to the adhesive surface 50-2 of the adhesive layer 50.

[0245] Figure 17 In this context, adhesive material A or adhesive layer 50 can be approximately in the shape of a disc. For example... Figure 18 As shown, the adhesive material A or adhesive layer 50 can be approximately annular. Compared to a circular adhesive layer 50, the annular adhesive layer 50 has a hollowed-out central area, resulting in less obstruction of light emitted from the display area 64 of the display panel 60. Compared to the annular adhesive layer 50, the central area of ​​the circular adhesive layer 50 can be bonded to the adhesive layer 30, and the circular adhesive layer 50 has a larger bonding area, which helps to make the connection between the various components of the display module 10 more secure.

[0246] S103 connects the light energy conversion device to the circuit board.

[0247] Figure 19 The illustration in Figure 19-1 A top view roughly showing the S103 operation process is shown. Figure 19 The illustration in Figure 19-2 The main view roughly shows the S103 operation process.

[0248] In cases where the light energy conversion device 40 needs to be connected to an external circuit via the circuit board 42, for example, when the light energy conversion device 40 is... Figure 7 The structure shown allows the light-energy conversion device to function as follows: Figure 11 It can be electrically connected to circuit board 42 in the manner shown in Figure 12.

[0249] In the case where a light energy conversion device comprises multiple spaced-apart sub-devices, the multiple sub-devices can be connected via, for example... Figure 11 They can be electrically connected to each other in the manner shown in Figure 12.

[0250] In some examples, such as Figure 13 As shown, before electrically connecting the two sub-devices, a dielectric 44 can be filled in the gap between the two sub-devices. The height of the dielectric 44 can be approximately the same as the height of the electrodes or the conductive portion of the light energy conversion device 40. Wires or conductive coatings for electrically connecting the two sub-devices can be disposed on the aforementioned dielectric 44.

[0251] For example, the filling medium 44 may be composed of a polymer material.

[0252] For example, the light energy conversion device 40 and the circuit board 42 can be electrically connected by applying conductive materials through an electric dispensing process, or by soldering, or by using a gold wire bonding process.

[0253] Similarly, the multiple sub-devices included in the photoelectric conversion device can also be electrically connected through one or more of the following processes: dispensing, soldering, or gold wire bonding.

[0254] S104, attach the first side of the film adhesive material B to the lower surface of the screen cover; attach the second side of the film adhesive material B to the first side of the film adhesive material A.

[0255] Figure 20 The illustration in Figure 20-1 A top view roughly showing the S104 operation process is shown. Figure 20 The illustration in Figure 20-2 The main view roughly shows the operation process of S104.

[0256] In some examples, Figure 1 The adhesive layer 30 in the display module 10 shown can be formed by curing adhesive material B. For example, adhesive material B can include one or more of the following materials: acrylic adhesive, epoxy resin adhesive, polyurethane adhesive or silicone adhesive, etc.

[0257] Adhesive material B can be located between the upper release film Fu2 and the lower release film Fd2; in other words, Figure 1 Before being bonded to the screen cover plate 20, the adhesive surface 30-1 of the adhesive layer 30 is bonded to the upper release film Fu2; before being bonded to the light energy conversion device 40, the adhesive surface 30-2 of the adhesive layer 30 is bonded to the lower release film Fd2. Figure 20As shown, after peeling off the upper release film Fd2 of the film-like adhesive material B, the screen cover 20 can be bonded to the adhesive material B, or in other words, the screen cover 20 can be bonded to the bonding surface 30-1 of the adhesive layer 30; after peeling off the lower release film Fd2 of the adhesive material B to which the screen cover 20 is bonded, the adhesive material A to which the light energy conversion device 40 is attached can be bonded to the side of the adhesive material B away from the screen cover 20, or in other words, the side of the light energy conversion device 40 close to the screen cover 20 can be bonded to the adhesive layer 30.

[0258] One possibility is that adhesive material B can be an optically transparent adhesive.

[0259] The display module 10 may deform during use due to heat or external force. In order to make the deformation at different locations roughly the same, one feasible approach is that the adhesive material A and adhesive material B can be the same material, or in other words, the adhesive layer 30 and adhesive layer 50 in the display module 10 can be composed of the same material.

[0260] In order to make the circuit board 42 and the screen cover 20 more firmly connected, an adhesive part 32 can be provided between the circuit board 42 and the screen cover 20. The adhesive strength of the materials constituting the adhesive part 32 can be greater than the adhesive cavity of adhesive material A or the adhesive strength of adhesive material B.

[0261] One feasible approach is to, after completing the S103 operation, apply a material (such as material M3 mentioned above) to the area above the circuit board 42 where it will be bonded to the screen cover 20, which will form the bonding part 32.

[0262] One feasible approach is to leave a notch for placing the adhesive portion 32 when bonding the adhesive layer B to the screen cover 20, and to place the adhesive material (such as material M3 mentioned above) that makes up the adhesive portion 32 at the notch location.

[0263] In some examples, to prevent the middle area of ​​adhesive material B from separating from the screen cover 20, adhesive material C can be applied to the middle area of ​​the side of the screen cover 20 facing adhesive material B or the middle area of ​​the side of the adhesive material B facing the screen cover 20 before bonding the screen cover 20 to adhesive material B. This adhesive material C, after curing, can form a structure like... Figure 15 The adhesive layer 70 shown.

[0264] S105, attach the second side of the film adhesive material A to the display panel.

[0265] Figure 21 The illustration in Figure 21-1 A top view roughly showing the S105 operation process is shown. Figure 21 The illustration in Figure 21-2The main view roughly shows the S105 operation process.

[0266] like Figure 21 As shown, after peeling off the lower release film Fd1 of adhesive material A, the display panel 60 can be bonded to adhesive material A, or in other words, the display panel 60 can be bonded to... Figure 1 The adhesive layer 50 is bonded to the adhesive surface 50-2.

[0267] One possibility is that the flexible circuit board 62 of the display panel 60 can be offset from the circuit board 42 corresponding to the light energy converter 40, in order to reduce the probability of the display module 10 having too many electronic components stacked at a certain angle.

[0268] It should be noted that the sequence numbers of steps such as S101 and S102 are used to distinguish different steps and should not be construed as limiting the execution order of different steps. For example, in step S104 above, adhesive material B can be bonded to adhesive material A first and then to screen cover plate 20.

[0269] In the above-mentioned processing method of display module 10, the light energy converter 40 is first pasted onto the adhesive material A. Before pasting the adhesive material A onto the display panel 60, the light energy converter 40 is electrically connected and processed. This helps to reduce the probability of damage to the display panel 60 during processing and helps to improve the yield rate of manufacturing display module 10.

[0270] like Figure 22 The diagram shown is a schematic of another process flow for manufacturing a display module 10 according to an embodiment of this application. Figures 23 to 26 The process of fabricating the display module 10 using this technology is roughly illustrated. Compared to Figure 15 The processing procedure shown is as follows: Figure 22 In the processing shown, adhesive material A is first bonded to the display panel 60, and then the light energy conversion device 40 is bonded to adhesive material A.

[0271] S201, cut to obtain one or more light energy conversion devices.

[0272] In some examples, the light-energy conversion device can be Figures 7 to 10 Any one of the following structures.

[0273] In some examples, a light-powered energy conversion device can be composed of multiple sub-devices, and the shapes and structures of these sub-devices can differ. For example, a light-powered energy conversion device can be... Figure 6 Any one of the light energy conversion devices 40a, 40b, 40c or 40d shown.

[0274] The operation method for cutting the light energy conversion device in S201 is roughly similar to the operation method in S101. For details, please refer to the relevant description in S101.

[0275] S202, the second side of the film adhesive material A is adhered to the display panel.

[0276] Figure 23 The illustration in Figure 23-1 A top view roughly showing the S202 operation process is shown. Figure 23 The illustration in Figure 23-2 The main view roughly shows the S202 operation process.

[0277] In some examples, Figure 1 The adhesive layer 50 in the display module 10 shown can be formed by curing adhesive material A. For example, adhesive material A can include one or more of the following materials: acrylic adhesive, epoxy resin adhesive, polyurethane adhesive or silicone adhesive, etc.

[0278] One possibility is that adhesive material A can be an optically transparent adhesive.

[0279] Adhesive material A can be located between the upper release film Fu1 and the lower release film Fd1; in other words, Figure 1 Before being bonded to the light energy conversion device 40, the adhesive surface 50-1 of the adhesive layer 50 is bonded to the upper release film Fu1, and the adhesive surface 50-2 of the adhesive layer 50 is bonded to the lower release film Fd1 before being bonded to the display panel 60.

[0280] like Figure 23 As shown, after peeling off the lower release film Fd1 of adhesive material A, the display panel 60 can be bonded to adhesive material A, or in other words, the display panel 60 can be bonded to... Figure 1 The adhesive layer 50 is bonded to the adhesive surface 50-2.

[0281] The adhesive material A can be in the form of a disc or a ring, and this application makes no limitation on this. Compared to the disc-shaped adhesive layer 50, the ring-shaped adhesive layer 50 has a hollowed-out central area, resulting in less obstruction of light emitted from the display area 64 of the display panel 60. Compared to the ring-shaped adhesive layer 50, the disc-shaped adhesive layer 50 can be bonded to the adhesive layer 30 in its central area, and the disc-shaped adhesive layer 50 has a larger bonding area, which helps to make the connection between the various components of the display module 10 more secure.

[0282] S203, attach the light energy conversion device to the first side of the film adhesive material A.

[0283] Figure 24 The illustration in Figure 24-1A top view roughly showing the S203 operation process is shown. Figure 24 The illustration in Figure 24-2 The main view roughly shows the S203 operation process.

[0284] like Figure 24 As shown, after peeling off the upper release film Fu1 of the film-like adhesive material A, the light energy conversion device 40 can be bonded to the adhesive material A, or in other words, the light energy conversion device 40 can be bonded to the adhesive surface 50-2 of the adhesive layer 50.

[0285] S204 connects the light energy conversion device to the circuit board.

[0286] Figure 25 The illustration in Figure 25-1 A top view roughly showing the S204 operation process is shown. Figure 25 The illustration in Figure 25-2 The main view of the S204 operation process is roughly shown.

[0287] like Figure 25 As shown, in cases where the photoelectric conversion device needs to be connected to an external circuit via a circuit board, for example, photoelectric conversion device 40 is... Figure 7 The structure shown allows the light-energy conversion device to function as follows: Figure 11 It can be electrically connected to circuit board 42 in the manner shown in Figure 12.

[0288] When the photoelectric conversion device includes an electrical connection layer, the photoelectric conversion device can be electrically connected to an external circuit through the electrical connection layer, and S204 may not need to be executed.

[0289] In the case of multiple light-energy conversion devices comprising multiple spaced-apart sub-devices, the multiple sub-devices can be connected via, for example... Figure 11 They can be electrically connected to each other in the manner shown in Figure 12.

[0290] In some examples, such as Figure 13 As shown, before electrically connecting the two sub-devices, a dielectric 44 can be filled in the gap between the two sub-devices. The height of the dielectric 44 can be approximately the same as the height of the electrodes or the conductive part of the light energy conversion device. Wires or conductive coatings for electrically connecting the two sub-devices can be disposed on the aforementioned dielectric 44.

[0291] One possibility is that, with circuit board 42 in place, the flexible circuit board 62 of the display panel 60 can be offset from the circuit board 42 corresponding to the light energy converter 40, in order to reduce the probability of the display module 10 having too many electronic components stacked at a certain angle.

[0292] For example, the light energy conversion device 40 and the circuit board 42 can be electrically connected by applying conductive materials through an electric dispensing process, or by soldering, or by using a gold wire bonding process.

[0293] Similarly, the multiple sub-devices included in the photoelectric conversion device can also be electrically connected through one or more of the following processes: dispensing, soldering, or gold wire bonding.

[0294] S205, attach the first side of the film adhesive material B to the lower surface of the screen cover; attach the second side of the film adhesive material B to the first side of the film adhesive material A.

[0295] Figure 26 The illustration in Figure 26-1 A top view roughly showing the S205 operation process is shown. Figure 26 The illustration in Figure 26-2 The main view roughly shows the S205 operation process.

[0296] In some examples, Figure 1 The adhesive layer 30 in the display module 10 shown can be formed by curing adhesive material B. For example, adhesive material B can include one or more of the following materials: acrylic adhesive, epoxy resin adhesive, polyurethane adhesive or silicone adhesive, etc.

[0297] The film-like adhesive material B can be located between the upper release film Fu2 and the lower release film Fd2; in other words, Figure 1 Before being bonded to the screen cover plate 20, the adhesive surface 30-1 of the adhesive layer 30 shown is bonded to the upper release film Fu2, and the adhesive surface 30-2 of the adhesive layer 30 is bonded to the lower release film Fd2 before being bonded to the light energy conversion device 40.

[0298] One possibility is that adhesive material B can be an optically transparent adhesive.

[0299] like Figure 26 As shown, after peeling off the upper release film Fu2 of the film-like adhesive material B, the screen cover 20 can be bonded to the adhesive material B, or in other words, the screen cover 20 can be bonded to the bonding surface 30-1 of the adhesive layer 30; after peeling off the lower release film Fd2 of the adhesive material B to which the screen cover 20 is bonded, the adhesive material A to which the light energy conversion device 40 is attached can be bonded to the side of the adhesive material B away from the screen cover 20, or in other words, the side of the light energy conversion device 40 close to the screen cover 20 can be bonded to the adhesive layer 30.

[0300] During use, the screen assembly 10 may deform due to heat or external force. In order to make the deformation at different locations roughly the same, one feasible approach is that the adhesive material A and adhesive material B can be the same material, or in other words, the adhesive layer 30 and adhesive layer 50 in the display module 10 can be composed of the same material.

[0301] In the case of setting up the circuit board 42, in order to make the circuit board 42 and the screen cover 20 more firmly connected, an adhesive part 32 can be provided between the circuit board 42 and the screen cover 20. The adhesive strength of the material constituting the adhesive part 32 can be greater than that of adhesive material A or adhesive material B.

[0302] One feasible approach is to, after completing the S204 operation, apply a material (such as material M3 mentioned above) to the area above the circuit board 42 where it will be bonded to the screen cover 20, which will form the bonding part 32.

[0303] One feasible approach is to leave a notch for placing the adhesive portion 32 when bonding the adhesive layer B to the screen cover 20, and to place the adhesive material (such as material M3 mentioned above) that makes up the adhesive portion 32 at the notch location.

[0304] In some examples, to prevent the middle area of ​​adhesive material B from separating from the screen cover 20, adhesive material C can be applied to the middle area of ​​the side of the screen cover 20 facing adhesive material B or the middle area of ​​the side of the adhesive material B facing the screen cover 20 before bonding the screen cover 20 to adhesive material B. This adhesive material C, after curing, can form a structure like... Figure 15 The adhesive layer 70 shown.

[0305] It should be noted that the sequence numbers of steps such as S201 and S202 are used to distinguish different steps and should not be construed as limiting the execution order of different steps. For example, in step S205 above, adhesive material B can be bonded to adhesive material A first and then to screen cover plate 20.

[0306] In the above processing method, the adhesive layer 50 is first bonded to the display panel 60. The display panel 60 can support the adhesive layer 50. The implementation of this technical solution is conducive to improving the processing efficiency of the light energy conversion device 40 in the subsequent process.

[0307] This application also provides an electronic device 1000, which may include the display module 10 described above.

[0308] In some examples, such as Figure 27As shown, the electronic device 1000 can be a wearable device, such as a bracelet or a watch. In this case, the electronic device 1000 may also include components such as a watch strap 1100, a watch case 1200, and a watch buckle. The watch strap 1100 can be fixed relative to the watch case 1200, and the display module 10 can be mounted on the watch case 1200.

[0309] For example, the casing 1200 may also house a battery, motherboard, etc., and the light energy conversion device 40 of the display module 10 may be electrically connected to the battery, motherboard, etc., and the display panel of the display module 10 may also be electrically connected to the battery, motherboard, etc.

[0310] In some examples, the electronic device 1000 can be a portable device such as a mobile phone or tablet computer, and the aforementioned display module 10 can be fixedly connected to the mid-frame of the electronic device.

[0311] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: Display panel, light-energy conversion device, screen cover, first adhesive layer and second adhesive layer The first adhesive surface of the first adhesive layer is connected to the display panel, and the second adhesive surface of the first adhesive layer is connected to the first surface of the light energy conversion device. The first adhesive surface of the second adhesive layer is connected to the second surface of the light energy conversion device, and the second adhesive surface of the second adhesive layer is connected to the screen cover plate; The light energy conversion device includes a plurality of pn junctions stacked along a first direction, where the first direction is the direction from the first adhesive layer to the second adhesive layer.

2. The display module according to claim 1, characterized in that, The projection of the light energy conversion device onto the display panel is located on the outer periphery of the display area of ​​the display panel.

3. The display module according to claim 1 or 2, characterized in that, The display module further includes a third adhesive layer, which is used to connect the second adhesive layer and the display panel. The third adhesive layer is at least partially connected to the middle portion of the second adhesive layer.

4. The display module according to any one of claims 1 to 3, characterized in that, The light energy conversion device includes a first device and a second device, wherein the first device and the second device are connected in parallel.

5. The display module according to claim 4, characterized in that, The first end of the first device includes a first electrode and a second electrode, and the first end of the second device includes a third electrode and a fourth electrode. The first electrode, the second electrode, the third electrode and the fourth electrode are all used to be electrically connected to the same electrode of an external circuit. The first electrode is electrically connected to the third electrode, and the second electrode is electrically connected to the fourth electrode.

6. The display module according to claim 4 or 5, characterized in that, The second end of the first device, which is disposed opposite to the first end, is electrically connected to an external circuit. The second end of the second device, which is disposed opposite to the first end, is also electrically connected to an external circuit.

7. The display module according to any one of claims 1 to 6, characterized in that, The display module further includes a circuit board for electrically connecting the light-energy conversion device to an external circuit. The second adhesive layer includes a first adhesive portion and a second adhesive portion. The first adhesive surface of the first adhesive portion is connected to the light-energy conversion device, and the second adhesive surface of the first adhesive portion is connected to the screen cover plate. The first adhesive surface of the second adhesive portion is connected to the circuit board, and the second adhesive surface of the second adhesive portion is connected to the screen cover plate. The adhesive strength of the second adhesive part is greater than that of the first adhesive part.

8. The display module according to any one of claims 1 to 6, characterized in that, The light energy conversion device includes a light energy conversion layer and an electrical connection layer. The light energy conversion layer includes the plurality of pn junctions, and the electrical connection layer is used to electrically connect the light energy conversion layer to an external circuit.

9. The display module according to claim 8, characterized in that, The light energy conversion device further includes an upper electrode, and the electrical connection layer includes a first conductive part, which is electrically connected to an external circuit and to the upper electrode.

10. The display module according to claim 9, characterized in that, The light energy conversion device further includes a lower electrode, and the electrical connection layer further includes a second conductive part, which is in contact with the lower electrode and is electrically connected to an external circuit.

11. The display module according to claim 10, characterized in that, The photoelectric conversion device includes one or more of the following materials: multijunction gallium arsenide, multijunction indium gallium phosphide, multijunction indium gallium arsenide, or perovskite.

12. The display module according to any one of claims 1 to 11, characterized in that, The length of the light energy conversion device is one-quarter of the circumference of the display panel.

13. A method for manufacturing a display module, characterized in that, include: The light energy conversion device is attached to the second adhesive surface of the first adhesive layer; The second adhesive surface of the first adhesive layer is bonded to the first adhesive surface of the second adhesive layer, and the second adhesive surface of the second adhesive layer is bonded to the screen cover plate; The light energy conversion device includes multiple stacked pn junctions.

14. The manufacturing method according to claim 13, characterized in that, The method further includes: The first adhesive surface of the first adhesive layer is bonded to the display panel.

15. The manufacturing method according to claim 13, characterized in that, Before attaching the light energy conversion device to the second adhesive surface of the first adhesive layer, the method further includes: The first adhesive surface of the first adhesive layer is bonded to the display panel.

16. The manufacturing method according to any one of claims 13 to 15, characterized in that, Before bonding the second adhesive surface of the first adhesive layer to the first adhesive surface of the second adhesive layer, the method further includes: Electrically connect the circuit board to the light energy conversion device; A first adhesive material is provided between a first portion of the circuit board and the screen cover, the first portion of the circuit board being close to the light energy converter device; The first portion of the circuit board is bonded to the screen cover using the first adhesive material; Wherein, the adhesive strength of the first adhesive material is greater than the adhesive strength of the materials constituting the first adhesive layer.

17. The manufacturing method according to any one of claims 13 to 16, characterized in that, The light energy conversion device includes a first device and a second device. Before bonding the second adhesive surface of the first adhesive layer to the first adhesive surface of the second adhesive layer, the method further includes: The first device and the second device are electrically connected in parallel.

18. The manufacturing method according to claim 17, characterized in that, The first device and the second device are arranged adjacent to each other and spaced apart. Before electrically connecting the first device and the second device in parallel, the method further includes: The gap between the first device and the second device is filled with a filling medium; A wire is provided on the filling medium for connecting the first device and the second device in parallel.

19. The manufacturing method according to claim 17 or 18, characterized in that, The first terminal of the first device includes a first electrode and a second electrode, and the first terminal of the second device includes a third electrode and a fourth electrode. The step of electrically connecting the first device and the second device in parallel includes: The first electrode is electrically connected to the third electrode, and the second electrode is electrically connected to the fourth electrode; The first electrode, the second electrode, the third electrode, and the fourth electrode are all used for electrical connection with the same electrode of the external circuit.

20. An electronic device, characterized in that, It includes a housing and a display module according to any one of claims 1 to 12, wherein the display module is fixed relative to the housing.

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