IO interface automatic installation system and method for electronic equipment assembly

Abstract

The invention discloses an IO interface automatic installation system and method for electronic equipment assembly. The system comprises a bottom plate conveying and overturning positioning mechanism, an IO interface feeding and preprocessing mechanism and an IO interface assembling mechanism. During working, a bottom plate is conveyed to an assembling station and is overturned and positioned to a first inclination angle; meanwhile, the IO interface is overturned to a second inclination angle after being subjected to feeding and liner stripping; and finally, accurate assembly is completed through an assembly mechanism when the IO interface plane and the bottom plate installation opening are both in the inclined posture, the first inclined angle is matched with the second inclined angle, and the IO interface plane and the bottom plate installation opening are in the optimal butt joint posture. Through an inclined alignment assembly strategy, the problems that in a traditional mode, alignment precision is poor, efficiency is low and components are prone to being damaged are solved, and high-precision and full-automatic installation of the IO interface is achieved.

Description

Technical Field

[0001] This invention relates to the field of automated assembly technology for electronic devices, and more particularly to an automated installation system and method for I / O interfaces in electronic device assembly. Background Technology

[0002] In the assembly of electronic devices (such as servers, computers, and communication equipment), the installation of I / O interfaces is a crucial step. Traditional I / O interface installation is mostly performed manually or semi-automatically, which presents the following problems:

[0003] I / O interfaces typically require precise alignment with openings on the equipment baseplate. Manual assembly makes it difficult to ensure consistency each time, easily leading to misalignment, tilting, or poor contact, affecting the electrical connection and structural stability of the interface. Furthermore, manual installation is slow, failing to meet the efficiency requirements of modern production lines.

[0004] When the I / O interface and the baseboard are assembled horizontally, the field of vision is limited, and it is difficult to ensure alignment during the interface insertion process. Especially when the interface has pads or requires pre-positioning, the horizontal posture increases the difficulty of assembly and can easily lead to component damage or improper installation. Summary of the Invention

[0005] The purpose of this invention is to provide a system and method that enables automatic and precise assembly of the I / O interface and the base plate under an adaptive tilt posture, so as to improve installation quality and production efficiency.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] An automated I / O interface installation system for electronic device assembly includes:

[0008] A base plate conveying and flipping positioning mechanism is used to convey the base plate of an electronic device and flip the base plate to a first tilt angle;

[0009] An IO interface feeding and pre-processing mechanism is located on one side of the base plate conveying and flipping positioning mechanism. It is used to convey and pre-process the IO interfaces and flip them to a second tilt angle.

[0010] An IO interface assembly mechanism is disposed between the base plate conveying and flipping positioning mechanism and the IO interface feeding and pre-processing mechanism, and is used to assemble the IO interface to the corresponding position on the base plate when both the base plate and the IO interface are in an inclined position.

[0011] The first tilt angle is adapted to the second tilt angle to facilitate the assembly operation of the IO interface assembly mechanism.

[0012] Furthermore, the base plate conveying and flipping positioning mechanism includes: a base plate conveyor belt for conveying the base plate; and a base plate flipping positioning device disposed on the conveying path of the base plate conveyor belt for adsorbing and flipping the base plate upward by 60° after it reaches the designated position.

[0013] Furthermore, the base plate flipping and positioning device includes:

[0014] A flipping assembly is used to attract and support the base plate for flipping.

[0015] A first positioning component is disposed on the flipping component and is used to longitudinally position the base plate within the flipping plane;

[0016] A second positioning component, disposed on the flipping component, is used to laterally position the base plate within the flipping plane; and

[0017] Side clamping components are disposed on both sides of the flipping component and are used to press the base plate onto the flipping component after flipping.

[0018] Furthermore, the flipping component includes: a flipping drive motor;

[0019] The rotating shaft is driven by the aforementioned tilting drive motor;

[0020] A flip plate, fixedly mounted on the rotating shaft, has a surface provided with a vacuum suction cup for adsorbing the base plate; and

[0021] A locking assembly is used to lock the flip plate when it is flipped to a 60° position.

[0022] Furthermore, the first positioning component includes a first pressing component and a first clamping component. The first pressing component is disposed on the upper side of the base plate and is used to press the base plate downward. The first clamping component is disposed on the lower side of the base plate and is used to clamp the bottom of the base plate.

[0023] The first clamping assembly includes a first clamping cylinder, a first clamping block, and a first clamping spring. The first clamping cylinder can drive the first clamping block to clamp the upper side of the base plate, and the first clamping spring is used to reset the first clamping block.

[0024] The first clamping assembly includes a second clamping block and a second clamping cylinder, wherein the second clamping cylinder drives the second clamping block to clamp the base plate.

[0025] Furthermore, the second positioning component includes a second positioning block and a second positioning cylinder, wherein the second positioning cylinder drives the second positioning block to position the base plate upward.

[0026] Furthermore, the side clamping assembly includes a second clamping block, a second clamping cylinder, and a second clamping lifting module. The second clamping block is mounted on the second clamping cylinder, and the second clamping cylinder is mounted on the second clamping lifting module. The second clamping lifting module drives the second clamping cylinder and the second clamping block to descend closer to the bottom plate, and the second clamping cylinder drives the second clamping block to clamp the bottom plate.

[0027] Furthermore, the IO interface feeding and pre-processing mechanism includes an IO interface tray feeding belt, an IO interface picking device, an IO interface gasket peeling device, and an IO interface rotating device. The IO interface tray feeding belt is used to transport the IO interface to the picking position of the IO interface picking device. The IO interface gasket peeling device is located on one side of the IO interface tray feeding belt. The IO interface picking device transfers the IO interface to the IO interface gasket peeling device. The IO interface gasket peeling device is used to peel off the gasket on the IO interface. After peeling, the IO interface picking device transfers the IO interface to the IO interface rotating device, and the IO interface rotating device tilts and rotates the IO interface.

[0028] Furthermore, the IO interface picking device includes a first linear module, an IO interface picking robot, and an IO interface picking CCD module. The IO interface picking robot is mounted on the first linear module, and the first linear module can drive the IO interface picking robot to perform lifting and lowering movements. The IO interface picking robot can be used to pick up IO interfaces. The IO interface picking CCD module is located on one side of the IO interface picking robot and is used to obtain the position of the IO interface.

[0029] An automated installation method for I / O interfaces in electronic device assembly includes the following steps:

[0030] S1: Provide and transport the base plate of the electronic device to an assembly station, and flip the base plate from a horizontal position upward and fix it at a first tilt angle;

[0031] S2: Provide and deliver the IO interface, perform at least one preprocessing step of feeding and stripping the IO interface, and flip the IO interface from a horizontal position to a second tilt angle;

[0032] S3: With the base plate fixed at the first tilt angle and the IO interface held at the second tilt angle, grab the IO interface and move it to the corresponding mounting position on the base plate; wherein, the first tilt angle and the second tilt angle are adapted to each other so that the interface plane of the IO interface is in the best docking posture with the mounting opening on the base plate when the IO interface is assembled.

[0033] The beneficial effects of this application are as follows:

[0034] (1) This application uses a base plate conveying and flipping positioning mechanism to flip and fix the base plate to the first tilt angle, while the IO interface feeding and pre-processing mechanism flips the IO interface to the second tilt angle and makes the two angles adapt to each other, ensuring that the interface plane of the IO interface and the mounting opening of the base plate are in the best docking posture during assembly. This tilting alignment method effectively avoids the misalignment, tilting or poor insertion problems commonly found in traditional horizontal assembly, and improves the electrical connection stability and structural fit of the interface.

[0035] (2) The system of this application achieves continuous and efficient processing of the base plate and IO interface through a fully automated conveying, flipping, pre-processing and assembly process. For example, the IO interface feeding and pre-processing mechanism integrates a liner peeling function, which can complete the pre-processing of the IO interface without manual intervention; the IO interface assembly mechanism directly grasps and assembles in an inclined state, reducing the posture adjustment time. The entire process is seamlessly connected, overcoming the bottlenecks of low efficiency and slow pace of traditional manual or semi-automatic methods. It is particularly suitable for large-scale production lines, which can significantly shorten the production cycle and reduce labor costs.

[0036] (3) The tilted assembly posture of this application not only optimizes the operating field of vision and movement path of the robot, but also reduces the risk of interference and collision during the assembly process. The pad peeling of the IO interface is automatically completed by a special device, avoiding the interface scratches or deformation that may be caused by manual peeling; at the same time, the pressing and positioning mechanism after the base plate is flipped prevents the base plate from shifting or shaking during assembly, further protecting the integrity of the components. Attached Figure Description

[0037] Figure 1 A top view of an automated I / O interface assembly system for electronic device assembly provided in an embodiment of this application;

[0038] Figure 2 This is a schematic diagram of the structure of a bottom plate conveyor belt provided in one embodiment of this application;

[0039] Figure 3 This is a schematic diagram of the structure of a base plate flipping and positioning device provided in an embodiment of this application;

[0040] Figure 4 This is a schematic diagram of the structure of a flipping component provided in an embodiment of this application;

[0041] Figure 5 This is a schematic diagram of the structure of the second positioning component provided in an embodiment of this application;

[0042] Figure 6 This is a schematic diagram of the structure of an IO interface material handling device provided in an embodiment of this application;

[0043] Figure 7This is a schematic diagram of the structure of an IO interface rotation device provided in an embodiment of this application;

[0044] Figure 8 This is a schematic diagram of the structure of an IO interface material handling machine provided in an embodiment of this application;

[0045] Figure 9 This is a schematic diagram of the structure of an IO interface pad peeling device provided in an embodiment of this application;

[0046] Figure 10 This is a schematic diagram of the structure of an IO interface assembly mechanism provided in one embodiment of this application;

[0047] Figure 11 This is a schematic diagram of the structure of the clamping assembly and the suction assembly provided in an embodiment of this application;

[0048] Figure 12 This is a schematic diagram of the screw-locking device provided in one embodiment of this application;

[0049] Explanation of reference numerals in the attached figures:

[0050] 1. Base plate conveying and flipping positioning mechanism; 2. IO interface feeding and pre-processing mechanism; 3. IO interface assembly mechanism;

[0051] 11. Base plate conveyor belt; 12. Base plate tilting and positioning device;

[0052] 121. Flipping assembly; 122. First positioning assembly; 123. Second positioning assembly; 124. Side clamping assembly;

[0053] 1211. Tilting drive motor; 1212. Rotating shaft; 1213. Tilting plate; 1214. Vacuum suction cup; 1215. Locking assembly;

[0054] 1221. First clamping assembly; 1222. First clamping assembly;

[0055] 1221a, First clamping cylinder; 1221b, First clamping block; 1221c, First clamping spring;

[0056] 1222a, Second clamping block; 1222b, Second clamping cylinder;

[0057] 1231, Second positioning block; 1232, Second positioning cylinder;

[0058] 1241. Second clamping block; 1242. Second clamping cylinder; 1243. Second clamping lifting module;

[0059] 21. IO interface tray feeding belt; 22. IO interface material handling device; 23. IO interface gasket peeling device; 24. IO interface rotating device;

[0060] 221. First linear module; 222. I / O interface picking robot; 223. I / O interface picking CCD module;

[0061] 241. Y-axis horizontal translation module; 242. Rotating CCD module; 243. Flip module;

[0062] 2431. Mounting base; 2432. Rotating shaft; 2433. Rotating plate; 2434. Rotation drive motor;

[0063] 31. Second linear module; 32. Rotary module; 33. Clamping assembly; 34. Picking assembly; 35. Screw locking device;

[0064] 331. Gripper; 332. Drive cylinder;

[0065] 341. First vacuum suction unit; 342. Second vacuum suction unit;

[0066] 351. Third linear module; 352. First screw fastener; 353. Second screw fastener; Detailed Implementation

[0067] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0068] In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," etc., are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In particular, the understanding of the term "upper" following a noun in the claims should be understood as meaning that the entire inner and outer surfaces of the structure referred to by the noun conform to the definition of "upper."

[0069] The following detailed description, in conjunction with the accompanying drawings and preferred embodiments, describes the specific implementation methods, structures, features, and effects provided in this application.

[0070] like Figure 1As shown, an automated I / O interface installation system for assembling electronic devices includes: a base plate conveying and flipping positioning mechanism 1, an I / O interface loading and pre-processing mechanism 2, and an I / O interface assembly mechanism 3. The base plate conveying and flipping positioning mechanism 1 is used to convey the base plate of the electronic device and flip the base plate to a first tilt angle; the I / O interface loading and pre-processing mechanism 2 is disposed on one side of the base plate conveying and flipping positioning mechanism 1, and is used to convey the I / O interface, pre-process the I / O interface, and flip the I / O interface to a second tilt angle; and the I / O interface assembly mechanism 3 is disposed between the base plate conveying and flipping positioning mechanism 1 and the I / O interface loading and pre-processing mechanism 2, and is used to assemble the I / O interface to the corresponding position on the base plate when both the base plate and the I / O interface are in a tilted state; wherein the first tilt angle and the second tilt angle are adapted to facilitate the assembly operation of the I / O interface assembly mechanism 3.

[0071] Specifically, the base plate conveying and flipping positioning mechanism 1 is provided in two sets, arranged symmetrically; the IO interface feeding and pre-processing mechanism 2 is provided in two sets, arranged symmetrically; the IO interface assembly mechanism 3 is also provided in two sets corresponding to the above mechanisms.

[0072] like Figure 2 and Figure 3 As shown, in one embodiment, the base plate conveying and flipping positioning mechanism 1 includes: a base plate conveyor belt 11 and a base plate flipping positioning device 12. The base plate conveyor belt 11 is used to convey the base plate; the base plate flipping positioning device 12 is arranged on the conveying path of the base plate conveyor belt 11 and is used to attract the base plate and flip it upward 60° after the base plate reaches the designated position.

[0073] like Figure 3 and 4 As shown, in one embodiment, the base plate flipping and positioning device 12 includes: a flipping component 121, a first positioning component 122, a second positioning component 123, and a side pressing component 124. The flipping component 121 is used to adsorb and carry the base plate for flipping; the first positioning component 122 is disposed on the flipping component 121 and is used to longitudinally position the base plate in the flipping plane; the second positioning component 123 is disposed on the flipping component 121 and is used to laterally position the base plate in the flipping plane; and the side pressing component 124 is disposed on both sides of the flipping component 121 and is used to press the base plate onto the flipping component 121 after flipping.

[0074] like Figure 4As shown, in one embodiment, the flipping assembly 121 includes: a flipping drive motor 1211, a rotating shaft 1212, a flipping plate 1213, a vacuum suction cup 1214, and a locking assembly 1215; the rotating shaft is driven by the flipping drive motor 1211; the flipping plate 1213 is fixedly mounted on the rotating shaft 1212, and its surface is provided with a vacuum suction cup 1214 for adsorbing the base plate; the locking assembly 1215 is used to lock the flipping plate 1213 when it is flipped to a 60° position. The locking assembly 1215 includes a locking cylinder and a locking pin driven by the locking cylinder. The flipping plate 1213 is provided with a corresponding locking hole. When flipped to the correct position, the locking cylinder drives the locking pin to insert into the locking hole.

[0075] like Figure 4 As shown, in one embodiment, the first positioning component 122 includes a first pressing component 1221 and a first clamping component 1222. The first pressing component 1221 is disposed on the upper side of the base plate and is used to press the base plate downward. The first clamping component 1222 is disposed on the lower side of the base plate and is used to clamp the bottom of the base plate.

[0076] like Figure 4 As shown, the first pressing assembly 1221 includes a first pressing cylinder, a first pressing block 1221b and a first pressing spring 1221c. The first pressing cylinder can drive the first pressing block 1221b to press the upper side of the base plate, and the first pressing spring 1221c is used to reset the first pressing block 1221b.

[0077] The first clamping assembly 1222 includes a second clamping block 1222a and a second clamping cylinder 1222b, wherein the second clamping cylinder 1222b drives the second clamping block 1222a to clamp the base plate.

[0078] like Figure 5 As shown, in one embodiment, the second positioning component 123 includes a second positioning block 1231 and a second positioning cylinder 1232, the second positioning cylinder 1232 driving the second positioning block 1231 to position the base plate upward.

[0079] like Figure 3 As shown, in one embodiment, the side clamping assembly 124 includes a second clamping block 1241, a second clamping cylinder 1242, and a second clamping lifting module 1243. The second clamping block 1241 is mounted on the second clamping cylinder 1242, and the second clamping cylinder 1242 is mounted on the second clamping lifting module 1243. The second clamping lifting module 1243 drives the second clamping cylinder 1242 and the second clamping block 1241 to descend closer to the bottom plate, and the second clamping cylinder 1242 drives the second clamping block 1241 to clamp the bottom plate.

[0080] like Figure 1 , Figure 6 and Figure 9 As shown, in one embodiment, the IO interface feeding and pre-processing mechanism 2 includes an IO interface tray feeding belt 21, an IO interface picking device 22, an IO interface pad peeling device 23, and an IO interface rotating device 24. The IO interface tray feeding belt 21 is used to transport the IO interface to the picking position of the IO interface picking device 22. The IO interface pad peeling device 23 is located on one side of the IO interface tray feeding belt 21. The IO interface picking device 22 transfers the IO interface to the IO interface pad peeling device 23. The IO interface pad peeling device 23 is used to peel off the pad on the IO interface. After peeling, the IO interface picking device 22 transfers the IO interface to the IO interface rotating device 24. The IO interface rotating device 24 tilts and rotates the IO interface.

[0081] like Figure 9 As shown, the IO interface gasket peeling device is located on one side of the IO interface tray feeding belt, and is used to automatically peel off the protective gasket (such as release paper or plastic film) on the IO interface before assembly.

[0082] In a preferred embodiment of the present invention, the IO interface gasket peeling device can adopt a mature structure disclosed in the prior art. Specifically, it can refer to, for example, patent publication number CN111805194B (“A peeling device and peeling method”). Figure 5 The structure and principle of the adhesive-tearing device disclosed in the corresponding explanatory text.

[0083] like Figure 8 As shown, in one embodiment, the IO interface picking device 22 includes a first linear module 221, an IO interface picking robot 222, and an IO interface picking CCD module 223. The IO interface picking robot 222 is mounted on the first linear module 221, and the first linear module 221 can drive the IO interface picking robot 222 to perform lifting and lowering movements. The IO interface picking robot 222 can be used to pick up IO interfaces. The IO interface picking CCD module 223 is disposed on one side of the IO interface picking robot 222 and is used to obtain the position of the IO interface.

[0084] In one specific embodiment of the present invention, the first linear module 221 included in the IO interface picking device 22 is part of a common multi-axis motion platform in the prior art. Specifically, the first linear module is responsible for driving the IO interface picking robot to move precisely along the X, Y, and Z axes, together forming a complete XYZ three-axis Cartesian coordinate robot. Through the coordinated operation of these three-axis movements, the IO interface picking robot can move to any specified coordinate position in three-dimensional space, thereby accurately picking up the IO interface from the tray and transferring it to the subsequent pad peeling station and rotary station. Since such multi-axis linear modules are mature prior art, their specific structures (such as using servo motor drive, ball screw drive, or synchronous belt drive, and equipped with linear guide rails, etc.) will not be described in detail here. Those skilled in the art will understand that using this prior art module is the fundamental guarantee for realizing the automated picking and transfer function of the present invention.

[0085] like Figure 7 As shown, in one embodiment, the IO interface rotation device 24 includes a Y-axis horizontal movement module 241, a rotating CCD module 242, and a flipping module 243. The flipping module 243 is mounted on the Y-axis horizontal movement module 241, and the Y-axis horizontal movement module 241 can drive the flipping module 243 to move laterally along the Y-axis. The flipping module 243 is used to clamp the IO interface and flip it. The rotating CCD module 242 is disposed on one side of the flipping module 243 and is used to detect the flipping angle of the IO interface.

[0086] like Figure 7 As shown, in one embodiment, the flipping module 243 includes a mounting base 2431, a rotating shaft 2432, a rotating plate 2433, and a rotating drive motor 2434. The rotating plate 2433 is mounted on the rotating shaft 2432, the rotating shaft 2432 is mounted on the rotating drive motor 2434, and the rotating drive motor 2434 is mounted on the mounting base 2431. The rotating drive motor 2434 can drive the rotating shaft 2432 to rotate the rotating plate 2433.

[0087] In a specific implementation, the IO interface rotating device includes a Y-axis lateral movement module. Its core function is to drive the flipping module and the IO interface held therein to move linearly along a horizontal axis (i.e., the Y-axis) parallel to the conveying direction of the base plate. This module moves the IO interface, which has completed the flipping preparation, from a receiving and waiting station to a dedicated flipping and visual inspection station, thereby achieving spatial separation of workstations, avoiding mechanical interference, and optimizing system layout and work cycle.

[0088] In one embodiment, a limit block and a buffer (not shown in the figure) are provided on the mounting base 2431. Specifically, the limit block is fixedly installed at the end of the expected rotation path of the rotating plate. Its core function is to provide a mechanical hard limit to accurately define and limit the maximum rotation angle of the rotating plate, preventing it from over-rotating due to program errors or drive failures, thereby ensuring that the IO interface can be stably flipped and stopped at a preset second tilt angle, creating conditions for subsequent precise assembly.

[0089] In conjunction with the limiting block, the buffer (such as a hydraulic buffer) is installed at the impact point where the rotating plate or shaft will contact the limiting block on its rotation path. When the rotating plate rotates at high speed and approaches its maximum angle, the buffer can work before or in conjunction with the limiting block, effectively absorbing and dissipating the remaining kinetic energy of the rotating mechanism, achieving smooth and gentle deceleration and stopping. This design significantly reduces the impact, vibration, and noise when rotating to the desired position, protecting the I / O interface from damage and improving the overall smoothness of the rotating device and its long-term operational reliability.

[0090] Through the coordinated operation of the limiting block and the buffer, precise angle control and reliable end-effector buffering are provided for the flipping motion of the IO interface rotating device.

[0091] like Figure 10 As shown, in one embodiment, the IO interface assembly mechanism 3 includes a second linear module 31, a rotating module 32, a clamping component 33, a suction component 34, and a screw-locking device 35. The clamping component 33 is disposed on both sides of the suction component 34. After the suction component 34 picks up the IO interface, it is clamped by the clamping component 33. The suction component 34 is mounted on the rotating module 32, and the rotating module 32 is mounted on the second linear module 31. The second linear module 31 can drive the clamping component 33 and the suction component 34 to fix the IO interface in the XYZ axis direction and assemble the IO interface on the base plate. The rotating module 32 can drive the IO interface to rotate. The screw-locking device 35 is used to lock the IO interface to the base plate with screws.

[0092] The second linear module 31 has the same function as the first linear module 221.

[0093] like Figure 11 As shown, in one embodiment, the clamping assembly 33 includes a gripper 331 and a drive cylinder 332, which can drive the gripper 331 to clamp the side of the IO interface.

[0094] like Figure 11As shown, in one embodiment, the suction component 34 includes a first vacuum suction part 341 and a second vacuum suction part 342. The first vacuum suction part 341 is provided with a first vacuum adsorption hole, and the second vacuum suction part 342 is provided with a second vacuum adsorption hole.

[0095] like Figure 12 As shown, in one embodiment, the screw fastening device 35 includes a third linear module 351, a first screw fastener 352, and a second screw fastener 353, both of which are mounted on the third linear module 351; the first screw fastener 352 includes a first Z-axis drive module and a first screw head; the second screw fastener 353 includes a second Z-axis drive module and a second screw head.

[0096] An automated installation method for I / O interfaces in electronic device assembly includes the following steps:

[0097] S1: Base plate conveying and tilting positioning steps

[0098] Provide and transport the base plate of the electronic device to an assembly station, and flip the base plate from a horizontal position upward and fix it at a first tilt angle;

[0099] S2: IO Interface Loading and Preprocessing Steps

[0100] Provide and deliver the IO interface, perform at least one pre-processing on the IO interface, including feeding and pad removal, and flip the IO interface from a horizontal position to a second tilt angle;

[0101] S3: Tilt Assembly Step

[0102] With the base plate fixed at the first tilt angle and the IO interface held at the second tilt angle, grab the IO interface and move and assemble it to the corresponding mounting position on the base plate;

[0103] The first tilt angle is adapted to the second tilt angle so that the interface plane of the IO interface is in the optimal mating posture with the mounting opening on the base plate during assembly.

[0104] This method optimizes both assembly alignment and screw tightening—two key processes—simultaneously by tilting the base plate to 60 degrees, changing the screw-locking surface of the I / O interface from vertical to horizontal. Firstly, this allows for stable and efficient screw tightening on a horizontal plane, fundamentally avoiding quality issues such as stripped or misaligned screws, and simplifying the screw-locking device's structure. Secondly, this tilted posture provides the robotic arm with optimal operating visibility and docking path during assembly, ensuring precise insertion of the I / O interface into the base plate mounting opening. Ultimately, this method, through systematic posture planning, achieves high precision, high reliability, and high efficiency throughout the entire process from alignment assembly to final tightening.

[0105] The working principle of this application is as follows:

[0106] The automatic installation system for IO interfaces described in this invention works by coordinating and controlling the base plate conveying and flipping positioning mechanism 1, the IO interface feeding and pre-processing mechanism 2, and the IO interface assembly mechanism 3, so that the base plate and the IO interface can complete high-precision and automated docking and assembly at an appropriate tilt angle.

[0107] The entire workflow begins with the base plate conveying and flipping positioning mechanism 1. The base plate is horizontally conveyed to the assembly station by the base plate conveyor belt 11. When the base plate reaches the designated position, the base plate flipping positioning device 12 starts working. The vacuum suction cup 1214 in its flipping component 121 is activated, firmly adsorbing the base plate onto the flipping plate 1213. Subsequently, the flipping drive motor 1211 drives the flipping plate 1213 through the rotating shaft, precisely flipping the base plate from a horizontal position upwards to 60° (i.e., the first tilt angle). When the flipping is in place, the locking component 1215 is activated, and the locking cylinder drives the locking pin to insert into the locking hole of the flipping plate 1213, locking the flipping plate 1213 and preventing it from shaking during subsequent operations. To ensure that the base plate is in an absolutely accurate and stable position when tilted, the positioning components work together: the first positioning component 122 (including the first pressing component 1221 and the first clamping component 1222) presses and clamps the base plate longitudinally (up and down), the second positioning component 123 positions the base plate laterally, and the side pressing component 124 applies pressure from both sides to form a multi-dimensional and stable clamping.

[0108] Meanwhile, the IO interface loading and pre-processing mechanism 2 operates in parallel. The IO interface tray loading conveyor 21 transports the tray carrying the IO interfaces to the picking position. The first linear module 221 of the IO interface picking device 22 drives the IO interface picking robot 222 to descend, accurately picking up the IO interfaces under the visual guidance of the IO interface picking CCD module 223. Subsequently, the robot transfers the IO interfaces to the IO interface pad peeling device 23, where the protective pads are automatically peeled off. After pre-processing, the robot transfers the IO interfaces to the IO interface rotating device 24. Under the monitoring of the rotating CCD module 242, the flipping module 243 of the IO interface rotating device 24 clamps the IO interfaces and flips them from a horizontal position to a preset tilt angle (e.g., a second tilt angle adapted to 60° of the base plate), preparing for the final tilt assembly.

[0109] Finally, the crucial assembly operation is performed by the IO interface assembly mechanism 3. The second linear module 31 of the assembly mechanism drives the entire end effector (including the rotary module 32, clamping assembly 33, and suction assembly 34) to move above the flipped IO interface. The suction assembly 34 uses its first and second vacuum suction sections 342 to hold the IO interface in place, while the drive cylinders 332 of the clamping assemblies 33 on both sides drive the grippers 331 to clamp the sides of the IO interface, achieving double fixation. Then, the second linear module 31 carries the IO interface and moves it in the XYZ axis direction, while the rotary module 32 can fine-tune the circumferential angle of the IO interface to achieve optimal alignment between its interface plane and the mounting opening fixed to the base plate at a 60° tilt angle. With the assistance of the vision system, the IO interface is precisely inserted into the mounting opening of the base plate.

[0110] After assembly, the screw-locking device 35 begins operation. Its third linear module 351 moves the first screw-locker 352 and the second screw-locker 353 to the screw-locking position. The first screw-locker 352 and the second screw-locker 353 descend under the drive of their respective Z-axis drive modules. The first screw-locker 352 initially tightens the screw, and the second screw-locker 353 further tightens the screw to prevent the IO interface from rotating during tightening. The screw is then screwed in through the screw-locking head, firmly locking the IO interface to the base plate, completing the entire installation process.

[0111] In summary, by pre-flipping the base plate and I / O interface to mutually compatible tilt angles before assembly, this invention greatly optimizes the robot's operating space and assembly alignment field of view, effectively avoiding interference, thereby achieving high-precision and high-efficiency fully automated assembly and solving the problems of difficult alignment, low efficiency, and easy damage to components in traditional methods.

[0112] The embodiments described above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make several improvements and substitutions without departing from the technical principles of this application, and these improvements and substitutions should also be considered within the scope of protection of this application.

Claims

1. An automated I / O interface installation system for assembling electronic devices, characterized in that, include: A base plate conveying and flipping positioning mechanism is used to convey the base plate of an electronic device and flip the base plate to a first tilt angle; An IO interface feeding and pre-processing mechanism is located on one side of the base plate conveying and flipping positioning mechanism. It is used to convey the IO interface, pre-process the IO interface, and flip the IO interface to the second tilt angle. as well as An IO interface assembly mechanism is disposed between the base plate conveying and flipping positioning mechanism and the IO interface feeding and pre-processing mechanism, and is used to assemble the IO interface to the corresponding position on the base plate when both the base plate and the IO interface are in an inclined position. The first tilt angle is adapted to the second tilt angle to facilitate the assembly operation of the IO interface assembly mechanism.

2. The automatic installation system for I / O interfaces in electronic device assembly according to claim 1, characterized in that: The base plate conveying and flipping positioning mechanism includes: a base plate conveyor belt for conveying the base plate; and a base plate flipping positioning device disposed on the conveying path of the base plate conveyor belt for adsorbing and flipping the base plate upward by 60° after it reaches the designated position.

3. The automatic installation system for I / O interfaces in electronic device assembly according to claim 2, characterized in that: The base plate flipping and positioning device includes: A flipping assembly is used to attract and support the base plate for flipping. A first positioning component is disposed on the flipping component and is used to longitudinally position the base plate within the flipping plane; A second positioning component, disposed on the flipping component, is used to laterally position the base plate within the flipping plane; and Side clamping components are disposed on both sides of the flipping component and are used to press the base plate onto the flipping component after flipping.

4. The automatic installation system for I / O interfaces in electronic device assembly according to claim 3, characterized in that: The flipping component includes: a flipping drive motor; The rotating shaft is driven by the aforementioned tilting drive motor; A flip plate, fixedly mounted on the rotating shaft, has a surface provided with a vacuum suction cup for adsorbing the base plate; and A locking assembly is used to lock the flip plate when it is flipped to a 60° position.

5. The automatic installation system for I / O interfaces in electronic device assembly according to claim 3, characterized in that: The first positioning component includes a first pressing component and a first clamping component. The first pressing component is disposed on the upper side of the base plate and is used to press the base plate downward. The first clamping component is disposed on the lower side of the base plate and is used to clamp the bottom of the base plate. The first clamping assembly includes a first clamping cylinder, a first clamping block, and a first clamping spring. The first clamping cylinder can drive the first clamping block to clamp the upper side of the base plate, and the first clamping spring is used to reset the first clamping block. The first clamping assembly includes a second clamping block and a second clamping cylinder, wherein the second clamping cylinder drives the second clamping block to clamp the base plate.

6. The automatic installation system for I / O interfaces in electronic device assembly according to claim 3, characterized in that: The second positioning component includes a second positioning block and a second positioning cylinder, wherein the second positioning cylinder drives the second positioning block to position the base plate upward.

7. The automatic installation system for I / O interfaces in electronic device assembly according to claim 3, characterized in that: The side clamping assembly includes a second clamping block, a second clamping cylinder, and a second clamping lifting module. The second clamping block is mounted on the second clamping cylinder, and the second clamping cylinder is mounted on the second clamping lifting module. The second clamping lifting module drives the second clamping cylinder and the second clamping block to descend and approach the bottom plate. The second clamping cylinder drives the second clamping block to clamp the bottom plate.

8. The automatic installation system for I / O interfaces in electronic device assembly according to claim 1, characterized in that: The IO interface feeding and pre-processing mechanism includes an IO interface tray feeding belt, an IO interface picking device, an IO interface gasket peeling device, and an IO interface rotating device. The IO interface tray feeding belt is used to transport the IO interface to the picking position of the IO interface picking device. The IO interface gasket peeling device is located on one side of the IO interface tray feeding belt. The IO interface picking device transfers the IO interface to the IO interface gasket peeling device. The IO interface gasket peeling device is used to peel off the gasket on the IO interface. After peeling, the IO interface picking device transfers the IO interface to the IO interface rotating device, which tilts and rotates the IO interface.

9. An automatic installation system for I / O interfaces in electronic device assembly according to claim 8, characterized in that: The IO interface picking device includes a first linear module, an IO interface picking robot, and an IO interface picking CCD module. The IO interface picking robot is mounted on the first linear module, and the first linear module can drive the IO interface picking robot to perform lifting and lowering movements. The IO interface picking robot can be used to pick up IO interfaces. The IO interface picking CCD module is located on one side of the IO interface picking robot and is used to obtain the position of the IO interface.

10. An automatic installation method for I / O interfaces in electronic device assembly, characterized in that, Includes the following steps: S1: Provide and transport the base plate of the electronic device to an assembly station, and flip the base plate from a horizontal position upward and fix it at a first tilt angle; S2: Provide and deliver the IO interface, perform at least one preprocessing step of feeding and stripping the IO interface, and flip the IO interface from a horizontal position to a second tilt angle; S3: With the base plate fixed at the first tilt angle and the IO interface held at the second tilt angle, grab the IO interface and move it to the corresponding mounting position on the base plate; The first tilt angle is adapted to the second tilt angle so that the interface plane of the IO interface is in the optimal docking posture with the mounting opening on the base plate during assembly.

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