Pressure sensor with high pressure seal

Abstract

A pressure sensor includes: a hexagonal bolt assembly including a hexagonal port and an inlet coupled to a base of the hexagonal port; a head configured at a base of the hexagonal port, where the head includes: (i) a groove located within an outer periphery of the head; and (ii) an O-ring in the groove, the O-ring forming a seal joint between the groove and a sidewall of the hexagonal port; and a retaining ring configured in the hexagonal port to retain the head between the retaining ring and the inlet.

Description

TECHNICAL FIELD

[0001] Various embodiments of the present disclosure relate to pressure sensors, and more particularly to designs for high pressure seals for pressure sensors. BACKGROUND

[0002] Pressure sensors can be used in high pressure applications involving the measurement of hazardous media under harsh environmental conditions. Existing pressure sensor designs can include multiple components that are joined to achieve a desired high pressure seal. For example, components of conventional high pressure sensors can include joints that require precision machining and welding. Moreover, any defects in the placement, assembly, and / or welding of the joints can cause sealing issues.

[0003] Applicants have recognized a number of technical challenges and difficulties associated with providing high pressure seals for conventional pressure sensors. SUMMARY

[0004] Various embodiments described herein relate to components and devices for measuring pressure of a medium.

[0005] According to various embodiments of the present disclosure, a pressure sensor is provided. In some embodiments, the pressure sensor includes: a hex bolt assembly including a hex port and an inlet coupled to a base of the hex port; a head configured at the base of the hex port, wherein the head includes: (i) a groove located within an outer periphery of the head; and (ii) an O-ring located in the groove, the O-ring forming a sealed joint between the groove and a sidewall of the hex port; and a retaining ring configured in the hex port to retain the head between the retaining ring and the inlet.

[0006] In some embodiments, the retaining ring is welded in the hex port. In some embodiments, the head further includes a sensor die (i) integrated within a cavity of the head and (ii) interfaced with the inlet. In some embodiments, the pressure sensor further includes: one or more electrical contacts; and a printed circuit board assembly coupled to the sensor die and the one or more electrical contacts. In some embodiments, the one or more electrical contacts are (i) soldered to the printed circuit board assembly and (ii) configured to conduct an electrical output generated by the sensor die. In some embodiments, the inlet is configured to receive a medium and direct the medium from a pressure line to the hex port. In some embodiments, the hex port includes a cylindrical inner cavity defined by an inner cavity sidewall within the hex bolt assembly. In some embodiments, the hex port includes a plain bore inner cavity sidewall. In some embodiments, the retaining ring includes a tubular shape having a uniform or tapered outer periphery that is approximately equal to or less than an outer periphery of the hex port.

[0007] According to another embodiment, the pressure sensor comprises: a hex bolt assembly comprising a hex port and an inlet coupled to a base of the hex port; a head configured at the base of the hex port, wherein the head comprises: (i) a groove located within an outer perimeter of the head; and (ii) an O-ring located in the groove, the O-ring forming a sealed joint between the groove and a sidewall of the hex port; and a spring retainer configured in the hex port to retain the head between the spring retainer and the inlet.

[0008] In some embodiments, the hex port comprises a hex port groove. In some embodiments, the hex port groove is disposed a distance from an end of the hex port opposite the inlet, the distance allowing a gap above the head when the head is seated at the base of the hex port. In some embodiments, the spring retainer is configured in the hex port groove. In some embodiments, the spring retainer is configured to retain the head in the hex port by securing the head below the spring retainer when the spring retainer is configured in the hex port groove. In some embodiments, the head further comprises a sensor die (i) integrated within a cavity of the head and (ii) interfaced with the inlet. In some embodiments, the inlet is configured to receive a medium and direct the medium from a pressure line to the hex port. In some embodiments, the hex port comprises a cylindrical inner cavity defined by an inner cavity sidewall within the hex bolt assembly. In some embodiments, the head further comprises a sensor die (i) integrated within a cavity of the head and (ii) interfaced with the inlet. In some embodiments, the pressure sensor further comprises: one or more electrical contacts; and a printed circuit board assembly coupled to the sensor die and the one or more electrical contacts. In some embodiments, the one or more electrical contacts are (i) soldered to the printed circuit board assembly and (ii) configured to conduct an electrical output generated by the sensor die.

[0009] The foregoing exemplary summary, as well as other exemplary objects and / or advantages of the present disclosure and the manner in which the same are accomplished, are further elucidated in the following detailed description and its attached figures. BRIEF DESCRIPTION OF DRAWINGS

[0010] The description of the exemplary embodiments can be read in conjunction with the accompanying drawings. It will be appreciated that the elements shown in the figures are not necessarily to scale, unless otherwise noted. For example, the dimensions of some of the elements can be exaggerated relative to other elements for the purpose of explanation. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the figures presented herein, in which:

[0011] FIG. 1A is a perspective view of an example pressure sensor;

[0012] FIG. 1B is an exploded cross-sectional view of an example pressure sensor;

[0013] FIG. 1C and FIG. 1D depicts a cross-sectional view of an example pressure sensor;

[0014] FIG. 2A is a perspective view of an example pressure sensor according to some embodiments of the present disclosure;

[0015] FIG. 2B is an exploded cross-sectional view of an example pressure sensor according to some embodiments of the present disclosure;

[0016] FIG. 2C is a cross-sectional view of an example pressure sensor according to some embodiments of the present disclosure;

[0017] FIG. 3A is a perspective view of an example pressure sensor according to some embodiments of the present disclosure;

[0018] FIG. 3B is an exploded cross-sectional view of an example pressure sensor according to some embodiments of the present disclosure; and

[0019] FIG. 3C is a cross-sectional view of an example pressure sensor according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0020] Some embodiments of the present disclosure will be described below in relation to the accompanying drawings, in which some embodiments of the present disclosure are shown, but not all embodiments. Indeed, the present disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like reference numerals refer to like elements throughout.

[0021] As used herein, terms such as “front,” “back,” “top,” and the like are used in the examples provided below for illustrative purposes to describe the relative positions of certain components or portions of components. Moreover, as will be apparent to one of ordinary skill in the art in light of the present disclosure, the terms “substantially” and “approximately” indicate that the referenced element or associated description is accurate, within the range of applicable engineering tolerances.

[0022] As used herein, the term “includes” means includes but not limited to, and should be interpreted in the manner it is typically used in the patent context. The use of broader terms such as “includes,” “including,” and “has” should be understood to provide support for narrower terms such as “consisting of,” “consisting essentially of,” and “consisting only of.”

[0023] The phrases “in one embodiment”, “according to one embodiment”, etc., generally mean that the specific feature, structure or characteristic following the phrase may be included in at least one embodiment of this disclosure, and may be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0024] As used herein, the terms “example” or “exemplary” mean “serving as an example, instance, or illustration.” Any specific implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other specific implementations.

[0025] If this specification states that a component or feature is "may", "can", "may", "should", "will", "preferably", "possibly", "typically", "optionally", "for example", "usually", or "may" (or other such language) included or has a characteristic, then the specific component or feature does not need to be included or have that characteristic. Such a component or feature may be optionally included in some embodiments, or it may be excluded.

[0026] As mentioned above, there are many technical challenges and difficulties associated with providing high-pressure seals for pressure sensors.

[0027] FIG. 1A This is a perspective view of an example pressure sensor 100. FIG. 1A As shown, the pressure sensor 100 includes a hex bolt assembly 120, a retaining ring 106, and a plurality of electrical contacts 124. The plurality of electrical contacts 124 can be coupled to sensor electronics housed within the hex bolt assembly 120. The retaining ring 106 may include a ring attached to the end of an electrical contact (e.g., electrical contact 124) of the hex bolt assembly 120 and is configured to retain sensor electronics and other pressure sensor components within the hex bolt assembly 120. The hex bolt assembly 120 includes a hexagonal member 130 and threads 132. The hexagonal member 130 allows a tool to apply torque to the hex bolt assembly 120, such that the threads 132 can be tightened to or loosened from the system being measured.

[0028] FIG. 1BThis is an exploded cross-sectional view of an example pressure sensor 100. The hex bolt assembly 120 also includes a hexagonal port 102 and an inlet 118. The hexagonal port 102 may include a cylindrical cavity defined by the inner cavity sidewalls within the hex bolt assembly 120. The inlet 118 may be configured to receive a medium (e.g., a fluid) and guide that medium from a pressure line to the hexagonal port 102. The pressure sensor 100 also includes a head 104. The head 104 includes (i) a sensor die 108 integrated within a cavity of the head 104, (ii) a filling fluid within the cavity, and (iii) a diaphragm 136 providing an interface between the sensor die 108, the filling fluid, and the inlet 118. The printed circuit board assembly (PCBA) 134 may include circuitry coupled to electrical contacts 124 and the sensor die 108.

[0029] FIG. 1C and FIG. 1D A cross-sectional view of an example pressure sensor 100 is depicted. A head 104 is constructed within a hexagonal port 102 of a hexagonal bolt assembly 120. Within the hexagonal port 102, a sensor die 108 (i) is positioned together with the head 104 at the base of the hexagonal port 102 and (ii) faces the inlet 118. Thus, the medium received at the inlet 118 can be measured by the sensor die 108.

[0030] The pressure sensor 100 also includes a retaining ring 106, which is partially disposed within the cavity of the hexagonal port 202 and above the head 204. The retaining ring 106 includes a plurality of external notched edges that complement and engage with gaps or grooves formed between a portion of the hexagonal port 102 (or the inner wall of the hexagonal bolt assembly 120) and a portion of the outer surface wall of the head 104. Thus, a plurality of contact points are formed between the retaining ring 106, the head 104, and the hexagonal bolt assembly 120, including a first connector 110 and a second connector 112. The first connector 110 includes the intersection of a collar edge of the hexagonal bolt assembly 120 and a flange edge of the retaining ring 106. The second connector 112 includes (i) the intersection of a notch comprising a portion of the hexagonal port 102, (ii) the collar of the retaining ring 106, and (iii) the intersection of a protrusion of the head 104. The first connector 110 and the second connector 112 may be further welded to provide a leak-proof seal. In some embodiments, the first connector 110 may include a welded portion that engages with the intersection of the collar edge of the hex bolt assembly 120 and the flange edge of the retaining ring 106. In some embodiments, the second connector 112 may include a welded portion that engages with the intersection of (i) a notch including a portion of the hexagonal port 102 and (ii) a protruding portion of the head 104. An O-ring 114 is constructed in an internal groove of the retaining ring 106 to provide an additional sealing connector 116.

[0031] Now for reference FIG. 1D Despite welding, weld leakage paths 140 can form at the first joint 110 and the second joint 112. Furthermore, the head 104 may include unused recesses 122 that are not used for any specific purpose in the pressure sensor 100. Therefore, the pressure sensor 100 includes several disadvantages, including (i) the need for precise welding at the first joint 110 and the second joint 112, (ii) the unutilized machining of the head 104 to form the recesses 122, (iii) the need for precise machining of the hexagonal port 102 or the hexagonal bolt assembly 120 and the retaining ring 106 to form the first joint 110 and the second joint 112, and (iv) high product costs, quality issues, and manufacturing lead times resulting from disadvantages (i) through (iii).

[0032] Various exemplary embodiments of this disclosure overcome the aforementioned technical challenges and difficulties in pressure sensors and provide various technical advancements and improvements. According to various embodiments of this disclosure, pressure sensor components and their constructions in exemplary pressure sensors with improved high-pressure seals are disclosed. In some embodiments, the pressure sensor assembly includes a hexagonal port and a head disposed within the hexagonal port. The hexagonal port may include a conventionally machined port that intersects with the head, the head (i) including a groove disposed with an O-ring; (ii) being secured in the hexagonal port via (a) a retaining ring welded to the hexagonal port or (b) an elastic retaining ring constructed in the groove within the hexagonal port.

[0033] FIG. 2A This is a perspective view of an example pressure sensor 200 according to some embodiments of the present disclosure. The pressure sensor 200 includes a hexagonal bolt assembly 220, a retaining ring 206, and a plurality of electrical contacts 224. The plurality of electrical contacts 224 can be coupled to sensor electronics housed within the hexagonal bolt assembly 220. The retaining ring 206 may include a ring that inserts into an opening at the end of an electrical contact (e.g., electrical contact 224) of the hexagonal bolt assembly 220 and is configured to retain sensor electronics and other pressure sensor components within the hexagonal bolt assembly 220. The hexagonal bolt assembly 220 includes a hexagonal member 230 and threads 232. The hexagonal member 230 allows a tool to apply torque to the hexagonal bolt assembly 220, such that the threads 232 can be tightened to or loosened from the system being measured.

[0034] FIG. 2BThis is an exploded cross-sectional view of an example pressure sensor 200 according to some embodiments of the present disclosure. The hex bolt assembly 220 also includes a hexagonal port 202 and an inlet 218. The hexagonal port 202 may include a cylindrical cavity defined by an inner cavity sidewall within the hexagonal bolt assembly 220. The inlet 218 is coupled to the base of the hexagonal port 202. The inlet 218 may be configured to receive a medium (e.g., a fluid) and guide that medium from a pressure line (e.g., the pressure line may be coupled to the inlet 218) to the hexagonal port 202. The pressure sensor 200 also includes a head 204. The head 204 includes (i) a sensor die 208 integrated within a cavity of the head 204, (ii) a filling fluid (e.g., silicon or transformer oil) within the cavity, and (iii) a diaphragm 236 providing an interface between the sensor die 208, the filling fluid, and the inlet 218. The PCBA 234 may include circuitry coupled to the electrical contacts 224 and the sensor die 208. In some implementations, the electrical contact 224 is soldered to the PCBA 234 and configured to conduct an electrical output generated by the sensor die 208, which represents the pressure sensed by the sensor die 208.

[0035] Sensor die 208 may include one or more elements configured to convert mechanical motion, stress, and / or deflection of sensor die 208 into electrical signals. In some embodiments, sensor die 208 includes a piezoresistive material, which includes any material that exhibits a change in resistance in response to a mechanical force or pressure applied to the material. For example, when a force or pressure is applied to sensor die 208, the resistance between wire bonds connected by the piezoresistive material may change in a time-varying manner based on the applied force. A signal representing the magnitude of the force applied to sensor die 208 may be generated by sensor die 208 and transmitted based on the change in resistance by electrical contact 224.

[0036] The hexagonal port 202 includes a plain bore cavity sidewall without machined grooves or notches. FIG. 1A to FIG. 1D Compared to the pressure sensor 100, the hexagonal port 202 does not include the notch included in the hexagonal port 102 for engaging with the retaining ring 106 or for welding at the second connector 112.

[0037] FIG. 2C This is a cross-sectional view of an example pressure sensor 200 according to some embodiments of the present disclosure. The hexagonal port 202 includes an outer periphery appropriately sized to receive a head 204 and a retaining ring 206. (As shown...) FIG. 2CAs shown, the head 204 is positioned at the base of the hexagonal port 202. The head 204 is constructed within the hexagonal port 202, wherein the sensor die 208 (i) is positioned together with the head 204 at the base of the hexagonal port 202 and (ii) abuts against the inlet 218 of the hexagonal bolt assembly. Thus, the medium received at the inlet 218 can be measured by the sensor die 208.

[0038] The retaining ring 206 can be configured to retain the head 204 in the hexagonal port 202 by positioning the retaining ring 206 in the hexagonal port 202 above the head 204 and by welding the retaining ring 206 to the hexagonal port 202 at the weld joint 210. In some example embodiments, such as FIG. 2C As shown, a retaining ring 206 is configured at the end of an electrical contact (e.g., electrical contact 224) opposite the inlet 218 of the hexagonal port 202, such that the head 204 is held between the retaining ring 206 and the inlet 218. The retaining ring 206 comprises a tubular shape having a uniform or tapered outer perimeter that is approximately equal to and / or smaller than the outer perimeter of the hexagonal port 202. Compared to the retaining ring 106, the retaining ring 206 does not include the flange edge included in the retaining ring 106 for engaging with the collar edge of the hexagonal bolt assembly 120.

[0039] Head 204 can be with FIG. 1A to FIG. 1D The head 104 is identical or substantially similar to the head 104. However, as disclosed above, the head 104 includes a recess 122 not utilized in the pressure sensor 100. According to various embodiments of this disclosure, the head 204 includes a recess 216 within a middle section of the outer periphery of the head 204. An O-ring 212 is disposed in the recess 216 to form a sealing joint 214 between the recess 216 and the sidewall of the hexagonal port 202. In some embodiments, a retaining ring 206 may be welded to the hexagonal port 202 at a weld joint 210 to provide an additional seal with the hexagonal port 202 that prevents leakage from the head 204 through the sealing joint 214.

[0040] Therefore, the pressure sensor 200 offers several advantages, including (i) the unnecessary complexity of the design of the hexagonal port 202 and retaining ring 206, which can reduce machining costs and / or complexity, and (ii) the reduction and / or elimination of weld joints, which can reduce weld leakage paths or failures caused by weld defects.

[0041] FIG. 3AThis is a perspective view of an example pressure sensor 300 according to some embodiments of the present disclosure. The pressure sensor 300 includes a hex bolt assembly 320, a resilient retaining ring 306, and a plurality of electrical contacts 324. The plurality of electrical contacts 324 can be coupled to sensor electronics housed within the hex bolt assembly 320. The resilient retaining ring 306 can be configured to retain the sensor electronics and other sensor components within the hex bolt assembly 320. The hex bolt assembly 320 includes a hexagonal member 330 and threads 332. The hexagonal member 330 allows a tool to apply torque to the hex bolt assembly 320, such that the threads 332 can be tightened to or loosened from the system being measured.

[0042] FIG. 3B This is an exploded cross-sectional view of an example pressure sensor 300 according to some embodiments of the present disclosure. The hex bolt assembly 320 also includes a hexagonal port 302 and an inlet 318. The hexagonal port 302 may include a cylindrical cavity defined by an inner cavity sidewall within the hexagonal bolt assembly 320. The inlet 318 is coupled to the base of the hexagonal port 302. The inlet 318 may be configured to receive a medium (e.g., a fluid) and guide that medium from a pressure line (e.g., the pressure line may be coupled to the inlet 318) to the hexagonal port 302. The pressure sensor 300 also includes a head 304. The head 304 includes (i) a sensor die 308 integrated within a cavity of the head 304, (ii) a filling fluid (e.g., silicon or transformer oil) within the cavity, and (iii) a diaphragm 336 providing an interface between the sensor die 308, the filling fluid, and the inlet 318. The PCBA 334 may include circuitry coupled to the electrical contacts 324 and the sensor die 308. In some implementations, the electrical contact 324 is soldered to the PCBA 334 and configured to conduct an electrical output generated by the sensor die 308, which represents the pressure sensed by the sensor die 308.

[0043] Sensor die 308 may include one or more elements configured to convert mechanical motion, stress, and / or deflection of sensor die 308 into electrical signals. In some embodiments, sensor die 308 includes a piezoresistive material, which includes any material that exhibits a change in resistance in response to a mechanical force or pressure applied to the material. For example, when a force or pressure is applied to sensor die 308, the resistance between wire bonds connected by the piezoresistive material may change in a time-varying manner based on the applied force. A signal representing the magnitude of the force applied to sensor die 308 may be generated by sensor die 308 and transmitted based on the change in resistance by electrical contact 324.

[0044] The hexagonal port 302 does not include ( FIG. 1A to FIG. 1DThe pressure sensor 100's hexagonal port 102 includes a notch for engagement with a retaining ring 106 or for welding at a second connector 112. The hexagonal port 302 also includes a hexagonal port recess 310. The hexagonal port recess 310 is disposed in the hexagonal port 302 at a specific distance from the end of the hexagonal port 302 opposite the inlet 318, a distance that allows for clearance above the head 304 when the head 304 is positioned at the base of the hexagonal port 302. A resilient retaining ring 306 may include a retaining ring inserted into the hexagonal port 302 from an opening at the end of an electrical contact (e.g., electrical contact 324) of the hexagonal bolt assembly 320 and configured (e.g., snap-fit) into the hexagonal port recess 310. The resilient retaining ring 306 may be configured to retain the head 304 in the hexagonal port 302 by securing the head 304 below the resilient retaining ring 306 when positioned in the hexagonal port recess 310. In some example embodiments, a resilient retaining ring 306 is constructed in a hexagonal port recess 310 such that the head 304 is held between the resilient retaining ring 306 and the inlet 318. Therefore, the resilient retaining ring 306 replaces the need for a weld retaining ring and / or weld joint.

[0045] FIG. 3C This is a cross-sectional view of an example pressure sensor 300 according to some embodiments of the present disclosure. The hexagonal port 302 may include an outer periphery appropriately sized to receive a head 304. FIG. 3C As shown, a head 304 is positioned at the base of a hexagonal port 302. A sensor die 308 is integrated within a cavity of the head 304, which may be filled with a filling fluid (e.g., silicon or transformer oil). The head 304 is constructed within the hexagonal port 302, wherein the sensor die 308 (i) is positioned together with the head 304 at the base of the hexagonal port 302 and (ii) abuts against an inlet 318. Thus, the medium received at the inlet 318 can be measured by the sensor die 308.

[0046] The head 304 includes a head recess 316 located in the middle section of the outer periphery of the head 304. An O-ring 312 is disposed in the head recess 316 to form a sealing joint 314 between the head recess 316 and the sidewall of the hexagonal port 302.

[0047] The pressure sensor 300 offers several advantages, including (i) the unnecessary complexity of the design of the hexagonal port 302 and the replacement of the retaining ring with the elastic retaining ring 306, which can reduce machining costs and / or complexity, and (ii) the elimination of weld joints, which eliminates weld leakage paths or failures caused by weld defects.

[0048] It should be understood that this disclosure is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are used herein, they are used in a general and descriptive sense only, and not for purposes of limitation, unless otherwise described.

Claims

1. A pressure sensor, the pressure sensor comprising: A hex bolt assembly, the hex bolt assembly including a hexagonal port and an inlet connected to a base of the hexagonal port; A head, the head being constructed at the base of the hexagonal port, wherein the head includes: (i) a groove located in the outer periphery of the head, (ii) an O-ring located in the groove, the O-ring forming a sealing joint between the groove and the sidewall of the hexagonal port, and (iii) a sensor die, the sensor die (a) being integrated into the cavity of the head and (b) mating with the inlet; and A retaining ring is configured in the hexagonal port to hold the head between the retaining ring and the inlet.

2. The pressure sensor of claim 1, wherein the hexagonal port includes a cylindrical cavity defined by an inner cavity sidewall within the hexagonal bolt assembly.

3. The pressure sensor of claim 1, wherein the retaining ring comprises a tubular shape having a uniform or tapered outer perimeter, the outer perimeter being approximately equal to or smaller than the outer perimeter of the hexagonal port.

4. A pressure sensor, the pressure sensor comprising: A hex bolt assembly, the hex bolt assembly including a hexagonal port and an inlet coupled to a base of the hexagonal port, wherein the hexagonal port includes a hexagonal port recess; A head, the head being constructed at the base of the hexagonal port, wherein the head includes: (i) a groove located within the outer periphery of the head; and (ii) an O-ring located in the groove, the O-ring forming a sealing joint between the groove and the sidewall of the hexagonal port; and An elastic retaining ring is configured in the hexagonal port recess to retain the head between the elastic retaining ring and the inlet.

5. The pressure sensor of claim 4, wherein the hexagonal port recess is configured at a distance from the end of the hexagonal port opposite to the inlet, and the distance allows for a gap above the head when the head is positioned at the base of the hexagonal port.

6. The pressure sensor of claim 5, wherein the resilient retaining ring is configured to retain the head in the hexagonal port by fixing the head below the resilient retaining ring when the resilient retaining ring is configured in the hexagonal port recess.

7. The pressure sensor of claim 4, wherein the head further comprises a sensor die, the sensor die being (i) integrated within a cavity of the head and (ii) mating with the inlet.

8. The pressure sensor of claim 4, wherein the hexagonal port includes a cylindrical cavity defined by an inner cavity sidewall within the hexagonal bolt assembly.

9. The pressure sensor of claim 4, wherein the head further comprises a sensor die, the sensor die being (i) integrated within a cavity of the head and (ii) mating with the inlet.

10. The pressure sensor according to claim 9, further comprising: One or more electrical contacts; and A printed circuit board assembly coupled to the sensor die and the one or more electrical contacts, wherein the one or more electrical contacts are (i) soldered to the printed circuit board assembly and (ii) configured to conduct electrical output generated by the sensor die.

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