Temperature and humidity pressure sensor

Abstract

The invention relates to the technical field of sensors, in particular to a temperature and humidity pressure sensor which comprises a port seat, a PCB mainboard supporting seat, a PCB mainboard, a terminal seat assembly and a shell, the port seat is provided with a pressure detection special channel and a temperature and humidity detection special channel which are separated, and a pressure sensing module is mounted through a sensing position at the top of a boss. A traditional complex inner plane machining structure is abandoned, and the special channel meets the requirements of two types of detection on the fluid state through differential design. The PCB mainboard supporting seat is provided with a positioning structure and a through groove, accurate positioning and stable electric connection of the PCB mainboard and the sensing module are guaranteed, the terminal seat assembly adopts a buckle and guiding design to improve the assembling efficiency, reliable protection is achieved in cooperation with a double-sealing structure, synchronous and accurate detection of temperature, humidity and pressure parameters is achieved on the whole, assembling is convenient, the production cost is low, and the product quality is improved. The method is suitable for various working condition scenes; the problems that the detection precision of the same flow channel of an existing integrated sensor is mutually disturbed, and the machining technology is complex can be effectively solved.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more particularly to a temperature, humidity and pressure sensor. Background Technology

[0002] Temperature, humidity, and pressure sensors, as multi-parameter detection devices, are widely used in industrial measurement and control, automotive electronics (such as air suspension systems), and other fields. Their core requirement is to achieve accurate and synchronous detection of temperature, humidity, and pressure signals. Existing integrated temperature, humidity, and pressure sensors, such as the built-in pressure and temperature / humidity integrated sensor disclosed in patent CN119437340A, have the following significant drawbacks: The bottleneck in the machining of the inner plane results in high production costs and low yield. Existing sensors use a D-shaped elastic substrate, with one side being the outer plane (sensing surface) for strain gauge attachment, and the inner side correspondingly forming the inner plane. A thin-walled design exists between the outer and inner planes to ensure strain gauge sensitivity. This structure demands extremely high machining precision, requiring strict control over the parallelism and flatness of the inner and outer planes, as well as the wall thickness tolerance of the thin wall. Problems such as inner plane tilting and uneven wall thickness are easily encountered during machining, not only raising the bar for machining equipment but also causing distortion of the strain gauge's sensing signal, significantly increasing product scrap rate and production costs.

[0003] In addition, the existing structure also has problems such as imperfect flow channel sealing design, unstable positioning connection between temperature and humidity sensing module and PCB motherboard, and low assembly efficiency of terminal block assembly, which further affect the service life and production efficiency of the sensor.

[0004] Therefore, there is an urgent need for a temperature, humidity and pressure sensor with optimized structural design to solve the above-mentioned technical pain points. Summary of the Invention

[0005] The purpose of this invention is to overcome the problems of the prior art and provide a temperature, humidity and pressure sensor to solve the technical problems of high difficulty in the machining process of the inner plane of the fluid channel, unstable connection between the sensing module and the PCB motherboard, inconvenient overall assembly of the sensor and insufficient sealing protection.

[0006] The above objectives are achieved through the following technical solutions: A temperature, humidity, and pressure sensor includes a port socket, a PCB motherboard support, a PCB motherboard, a terminal block assembly, and a housing. The port socket has a main detection channel, a first detection branch channel, and a second detection branch channel. A sensing position and a first sensing module are disposed on the outer side of the first detection branch channel, and a second sensing module is disposed within the second detection branch channel. The PCB motherboard support is sleeved on the upper surface of the port socket, and the PCB motherboard support has a first sensing module through slot and a second sensing module through slot. The PCB motherboard is disposed on the surface of the PCB motherboard support, and the PCB motherboard has a first PCB motherboard through slot and a second PCB motherboard through slot. The first sensing module is electrically connected to the PCB motherboard via the first sensing module through slot and the first PCB motherboard through slot, and the second sensing module is electrically connected to the PCB motherboard via the second sensing module through slot and the second PCB motherboard through slot. The terminal block assembly is disposed above the PCB motherboard, and the terminal block assembly is sleeved with the port socket through the housing.

[0007] Furthermore, the port seat includes a connector disposed on the lower end face and extending outward, and the connector is provided with the main detection channel. One end of the main detection channel is the main channel opening end, and the other end is the main channel closing end. The main channel closing end is provided with the first detection branch channel and the transition channel that are parallel to each other along the axial direction.

[0008] Furthermore, the end of the first detection branch channel away from the main detection channel is a closed section, the closed section forms a boss, and the top surface of the boss is the sensing position; the upper end face of the port seat is provided with a second sensing module mounting cavity, the second sensing module mounting cavity is intersected and connected with the transition channel to form the second detection branch channel.

[0009] Furthermore, the upper surface of the PCB motherboard support is provided with a PCB motherboard positioning post and a PCB motherboard limiting block. The PCB motherboard is provided with a PCB motherboard positioning hole and a PCB motherboard limiting groove. The PCB motherboard positioning hole is adapted to the PCB motherboard positioning post, and the PCB motherboard limiting groove is adapted to the PCB motherboard limiting block.

[0010] Furthermore, the second sensing module includes an adapter board bracket, which is provided with a stepped groove. The stepped groove includes a first groove, a second groove, and a third groove that are interconnected. The first groove is used to accommodate the sensing chip, and a sensing hole is formed on the bottom wall of the first groove, which corresponds to the sensing chip.

[0011] Furthermore, the bottom wall of the second groove is provided with a first adapter plate positioning post, the side of the adapter plate bracket extends outward to form a reversing support plate, and the surface of the reversing support plate is provided with a second adapter plate positioning post; the second sensing module also includes an adapter plate, the adapter plate is provided with a first adapter plate positioning hole and a second adapter plate positioning hole, the first adapter plate positioning hole is adapted to the first adapter plate positioning post, and the second adapter plate positioning hole is adapted to the second adapter plate positioning post.

[0012] Furthermore, chip sealant is filled between the sensing chip and the inner wall of the first groove, potting compound is provided between the first groove and the second groove corresponding to the outer side of the adapter plate, and potting compound is filled at the top of the second detection branch channel.

[0013] Furthermore, the terminal block assembly includes a terminal support and a terminal bracket. The terminal support and the terminal bracket are connected by a snap-fit ​​structure. The terminal bracket has a lower limit hole for a spring terminal and symmetrically arranged locking feet. The terminal support has a terminal bracket sleeve hole, a spring terminal sleeve, and a locking groove. The spring terminal sleeve corresponds to the lower limit hole for the spring terminal, and the locking groove is adapted to the locking feet.

[0014] Furthermore, the bottom surface of the terminal support is provided with a support guide post, the PCB motherboard support is provided with a support guide groove, the support guide groove is adapted to the support guide post, the terminal support is provided with a housing limiting part, and the outer side of the port seat is provided with a housing ring groove, the housing ring groove is adapted to the housing.

[0015] Furthermore, the first sensing module is a pressure strain gauge, the second sensing module is any one of a temperature sensing module, a humidity sensing module, or an integrated temperature and humidity sensing module, the adapter plate is an FPC flexible circuit board, and the outer side wall of the connector is provided with several riveting protrusions or sealing ring grooves.

[0016] The temperature, humidity, and pressure sensor provided by this invention achieves simultaneous detection of pressure, temperature, and humidity through a separate dual-detection channel design; stable electrical connection of the module is achieved through corresponding through-slots and sleeve structures; and the layered assembly design achieves overall sealing protection and convenient assembly of the sensor. Compared with the prior art, it has the following advantages: 1. The structure of mounting pressure strain gauges on the flat sensing position of the boss is adopted, which eliminates the need for inner plane processing of D-shaped elastic substrate, reduces process difficulty and equipment threshold, reduces processing defects such as uneven wall thickness and parallelism deviation, improves product yield and reduces production costs. 2. The dual sealing structure of chip sealant and potting compound effectively blocks the fluid penetration path, preventing corrosion and damage to the PCB motherboard and adapter board, and extending the service life of the sensor; 3. The stepped groove of the adapter board bracket and the dual positioning structure of the first adapter board positioning post and the second adapter board positioning post, together with the dual positioning design of the PCB motherboard, realize the precise positioning and stable reversing connection between the second sensing module and the PCB motherboard. The snap-fit ​​connection and guide positioning structure of the terminal block assembly improves assembly efficiency, and the spring terminal enhances the reliability of electrical connection. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a temperature, humidity and pressure sensor according to the present invention; Figure 2 This is a cross-sectional view of a temperature, humidity and pressure sensor according to the present invention. Figure 3 This is a cross-sectional view of the port mount of a temperature, humidity and pressure sensor according to the present invention; Figure 4 This is an exploded view of a temperature, humidity and pressure sensor according to the present invention; Figure 5 This is a connection diagram of the PCB motherboard, PCB motherboard support base, and port base in a temperature, humidity, and pressure sensor according to the present invention. Figure 6 This is a schematic diagram of the terminal block assembly in a temperature, humidity and pressure sensor according to the present invention; Figure 7 This is a schematic diagram of the structure of the second sensing module in the temperature, humidity and pressure sensor of the present invention; Figure 8 This is a schematic diagram of the assembly of the second sensing module in a temperature, humidity and pressure sensor according to the present invention. Figure 9 This is a cross-sectional view of the second sensing module in a temperature, humidity and pressure sensor according to the present invention.

[0018] Illustration markings: 1-Port socket, 101-Main detection channel, 102-First detection branch channel, 103-Second detection branch channel, 104-Sensing position, 105-Connector, 106-Main channel opening end, 107-Main channel closing end, 108-Closed section, 109-Boss, 110-Transition channel, 111-Second sensing module mounting cavity, 112-Sealing ring groove, 113-Support base housing ring groove, 114-Outer shell ring groove; 2-PCB motherboard support base, 201-first sensing module through slot, 202-second sensing module through slot, 203-PCB motherboard limiting block, 204-support base body, 205-support base housing, 206-PCB motherboard positioning post, 207-support guide groove; 3-PCB motherboard, 301-first PCB motherboard through slot, 302-second PCB motherboard through slot, 303-PCB motherboard positioning hole, 304-PCB motherboard limiting slot, 305-first inductive electrical connection position, 306-second inductive electrical connection position, 307-terminal electrical connection part; 4-Terminal base assembly, 401-Terminal support, 402-Terminal bracket, 403-Spring terminal, 404-Spring terminal lower limit hole, 405-Clamping foot, 406-Spring terminal sleeve, 407-Terminal bracket sleeve hole, 408-Clamping groove, 409-Support guide post, 410-Outer shell limiting part; 5-First sensing module; 6-Second sensing module, 601-Stepped groove, 602-Adapter board bracket, 603-Adapter board, 604-First groove, 605-Second groove, 606-Third groove, 607-Sensing chip, 608-Sensing hole, 609-First adapter board positioning post, 610-First adapter board positioning hole, 611-Reversing support plate, 612-Second adapter board positioning post, 613-Second adapter board positioning hole, 614-Bending part, 615-Adapter board connecting part, 616-Chip sealant; 7-Outer casing; 8-Potting compound. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figures 1-4 As shown, this solution provides a temperature, humidity, and pressure sensor. Through a split flow channel, a pressure sensing structure without an inner plane, multiple positioning, and a double-sealing design, it fundamentally solves the accuracy interference and process bottleneck problems of existing sensors, making it suitable for various high-precision multi-parameter detection scenarios. This sensor includes a port socket 1, a PCB motherboard support 2, a PCB motherboard 3, a terminal block assembly 4, a first sensing module 5, a second sensing module 6, a housing 7, and potting compound 8. The structure and connection relationships of each component are as follows: like Figures 2-5As shown, in this embodiment, the port seat 1 is an integral injection-molded structure, with its lower end extending outward to form a cylindrical connector 105. A main detection flow channel 101 is axially formed inside the connector 105. One end of the main detection flow channel 101 is the main flow channel opening end 106, used to connect the fluid to be detected. The other end of the main detection flow channel 101 is the main flow channel closing end 107, forming a fluid diversion cavity. In this embodiment, the connection method between the connector 105 and the device to be detected is not limited to riveting and sealing ring connection; specifically: The outer side wall of the connector 105 is provided with several riveting protrusions, which achieve a stable connection by deformation after being inserted into the external pipeline. The outer side wall of the connector 105 is provided with several sealing ring grooves 112 for fitting sealing rings and improving the sealing performance of the connection between the sensor and the external pipeline.

[0021] On the main flow channel closure end 107, a first detection branch channel 102 and a transition channel 110 are provided parallel to each other along the axial direction of the main detection flow channel 101. The end of the first detection branch channel 102 away from the main detection flow channel 101 is a closed section 108. The closed section 108 extends upward to form a cylindrical boss 109 protruding from the upper end face of the port seat 1. The closed end surface of the top of the boss 109 is a flat sensing position 104 for mounting the first sensing module 5. The first detection branch channel 102 serves as a dedicated channel for pressure detection. The first sensing module 5 is a pressure strain gauge. The pressure strain gauge is welded and fixed to the first sensing electrical connection position 305 on the surface of the PCB motherboard 3 through a wire harness to realize pressure signal transmission. This design abandons the thin-walled inner plane structure of the D-shaped elastic substrate. By mounting the pressure strain gauge through the flat sensing position 104 on the top of the boss 109, there is no need to process the corresponding inner plane, which completely solves the process problem of parallelism and wall thickness tolerance control.

[0022] A second sensing module mounting cavity 111 is vertically formed downwards from the upper end of the port seat 1. The second sensing module mounting cavity 111 is parallel to the transition channel 110 and intersects at the bottom, together forming a second detection branch channel 103. The second detection branch channel 103 is connected to the main detection channel 101 via the transition channel 110, serving as a dedicated channel for temperature and humidity detection. As an optimization of this embodiment, the inner diameter of the second sensing module mounting cavity 111 is not less than the inner diameter of the first detection branch channel 102, and the inner diameter of the first detection branch channel 102 is greater than the inner diameter of the transition channel 110, so as to facilitate better processing. A second sensing module 6 is embedded in the second sensing module mounting cavity 111. The second sensing module 6 is a temperature sensing module, a humidity sensing module, or an integrated temperature and humidity sensing module. The second sensing module 6 is electrically connected to the second sensing electrical connection position 306 on the surface of the PCB motherboard 3 by soldering.

[0023] like Figure 2 and Figure 4 As shown, in this embodiment, the upper surface shape of the PCB motherboard support 2 and the port seat 1 are adapted to each other, including an integrally formed support body 204 and a support housing 205. The outer side of the port seat 1 is provided with a support housing annular groove 113 that is adapted to the support housing 205. The PCB motherboard support 2 and the port seat 1 are quickly assembled and positioned by the snap-fit ​​between the support housing 205 and the support housing annular groove 113.

[0024] The surface of the support body 204 is provided with a first sensing module through slot 201 and a second sensing module through slot 202 that are vertically connected. The first sensing module through slot 201 corresponds to the wiring path of the first sensing module 5, and the second sensing module through slot 202 corresponds to the installation position of the second sensing module 6. The upper surface of the support body 204 is also integrally formed with at least one PCB motherboard positioning post 206 and at least one PCB motherboard limiting block 203. The PCB motherboard 3 is provided with a PCB motherboard positioning hole 303 that can be fitted with the PCB motherboard positioning post 206, and a PCB motherboard limiting groove 304 that can be engaged and adapted with the PCB motherboard limiting block 203. Through the dual cooperation of the PCB motherboard positioning post 206 and the PCB motherboard positioning hole 303, and the PCB motherboard limiting block 203 and the PCB motherboard limiting groove 304, the PCB motherboard 3 is accurately positioned on the PCB motherboard support 2, preventing horizontal displacement and rotation.

[0025] The PCB motherboard 3 is also provided with a first PCB motherboard through slot 301 coaxial with the first sensing module through slot 201 and a second PCB motherboard through slot 302 coaxial with the second sensing module through slot 202. The wire harness of the first sensing module 5 extends to the upper surface of the PCB motherboard 3 through the first sensing module through slot 201 and the first PCB motherboard through slot 301. The adapter board connection part 615 of the second sensing module 6 extends to the upper surface of the PCB motherboard 3 through the second sensing module through slot 202 and the second PCB motherboard through slot 302, ensuring a smooth electrical connection path.

[0026] like Figures 7-9 As shown, in this embodiment, the second sensing module 6 includes an adapter board bracket 602, an adapter board 603, a sensing chip 607, and chip sealant 616. The adapter board bracket 602 is a columnar structure adapted to the mounting cavity 111 of the second sensing module. Its surface is recessed inward to form a stepped groove 601. The stepped groove 601 includes a first groove 604, a second groove 605, and a third groove 606 that are interconnected. The depth of the first groove 604 is greater than the depth of the second groove 605, and the depth of the second groove 605 is greater than the depth of the third groove 606, adapting to the bending shape of the adapter board 603.

[0027] The first groove 604 is used to accommodate the sensing chip 607, which is welded and fixed to the adapter plate 603. The bottom wall of the first groove 604 is provided with a sensing hole 608 corresponding to the detection end of the sensing chip 607, so as to ensure that the fluid in the second detection branch channel 103 can fully contact the sensing chip 607 through the sensing hole 608 and accurately collect temperature and humidity signals. The space between the sensing chip 607 and the inner wall of the first groove 604 is filled with chip sealant 616 to prevent the fluid from contacting the adapter plate 603.

[0028] The bottom wall of the second groove 605 protrudes to form a first adapter plate positioning post 609. The adapter plate 603 has a first adapter plate positioning hole 610 that matches the first adapter plate positioning post 609. By engaging the first adapter plate positioning post 609 through the first adapter plate positioning hole 610, the adapter plate 603 is initially positioned within the stepped groove 601. The side of the adapter plate bracket 602 extends outward to form a reversing support plate 611. A protrusion on the surface of the reversing support plate 611 forms a second adapter plate positioning post 612. The adapter plate 603 has a second adapter plate positioning hole 613 corresponding to the second adapter plate positioning post 612. The second adapter plate positioning post 612 is sleeved through the second adapter plate positioning hole 613 to maintain the position of the adapter plate 603 and ensure that the bending part 614 of the adapter plate 603 can drive the adapter plate connecting part 615 to change direction stably; the shape of the second sensing module through groove 202 matches the adapter plate bracket 602, and the adapter plate bracket 602 is stably fixed in the second sensing module through groove 202 by the contact between the second adapter plate positioning post 612 and the inner wall of the second sensing module through groove 202; the adapter plate 603 is an FPC flexible circuit board, which is adapted to the structure of the stepped groove 601 and the reversing support plate 611 to improve the reversing flexibility and connection stability.

[0029] The first groove 604 and the second groove 605 on the outer side of the adapter plate 603 are filled with potting compound 8, and the top of the second detection branch channel 103 is also filled with potting compound 8, forming a double seal and completely blocking the fluid penetration path.

[0030] like Figure 4 and Figure 6As shown, the terminal bracket assembly 4 in this embodiment includes a terminal support 401 and a terminal bracket 402 that can be snapped together. The terminal bracket 402 has multiple spring terminal lower limiting holes 404 for limiting and fitting the bottom end of the spring terminal 403. The bottom end of the spring terminal 403 can extend out of the spring terminal lower limiting holes 404 and be welded and fixed to the terminal electrical connection part 307 on the upper surface of the PCB motherboard 3. The terminal bracket 402 has elastic locking feet 405 symmetrically arranged on both sides. The terminal support 401 has terminal bracket sleeve holes 407 for fitting the terminal bracket 402. The inner wall of the terminal bracket sleeve hole 407 has a slot 408 that matches the locking feet 405. The terminal support 401 and the terminal bracket 402 can be quickly assembled by the snapping cooperation between the locking feet 405 and the slot 408.

[0031] The terminal support 401 is also integrally formed with a spring terminal sleeve 406 that corresponds one-to-one with the lower limiting hole 404 of the spring terminal. The inner diameter of the top port of the spring terminal sleeve 406 is smaller than the inner diameter of the sleeve body, which can limit the top end of the spring terminal 403. The top end of the spring terminal 403 extends out of the spring terminal sleeve 406 for electrical connection with external equipment. The bottom surface of the terminal support 401 is also provided with at least two support guide posts 409. The PCB motherboard support 2 is provided with a support guide groove 207 that is clearance-fitted with the support guide posts 409, so as to realize the quick orientation assembly of the terminal support assembly 4 and the PCB motherboard support 2.

[0032] The terminal support 401 has a T-shaped cross-section, with an outwardly protruding outer shell limiting part 410 at the top to limit the assembly depth of the outer shell 7; the outer side of the port seat 1 is provided with an outer shell annular groove 114 that is adapted to the inner wall of the outer shell 7, the lower end of the outer shell 7 is engaged with the outer shell annular groove 114, and the upper end of the outer shell 7 abuts against the outer shell limiting part 410, thereby achieving sealed protection for the PCB motherboard support 2, the PCB motherboard 3 and the terminal seat assembly 4.

[0033] Working principle: The fluid to be tested smoothly enters the main detection channel 101 from the main channel opening end 106 of the connector 105, and is divided into two orderly flows under the guidance of the main channel closing end 107.

[0034] One of the fluids flows into the first detection branch channel 102. With the help of the structural design of the channel adapted to pressure detection, the fluid acts on the surface of the boss 109 at a uniform and stable flow rate, applying continuous and stable pressure to the first sensing module 5, i.e., the pressure strain gauge, which is attached to the sensing position 104. This causes the strain gauge to produce elastic deformation that precisely corresponds to the pressure value. The deformation signal is transmitted stably to the first sensing electrical connection position 305 of the PCB motherboard 3 through the first sensing module through slot 201 and the first PCB motherboard through slot 301 in sequence via a dedicated wire harness.

[0035] Another fluid is introduced into the second detection branch channel 103 through the transition channel 110. The size design of this channel provides sufficient residence time for the fluid, allowing the fluid to fully contact the sensing chip 607 of the second sensing module 6. The chip efficiently collects temperature and humidity information through the sensing hole 608 and converts it into an electrical signal. The signal is conducted through the bending part 614 and the connecting part 615 of the adapter plate 603, and then transmitted to the second sensing electrical connection position 306 of the PCB motherboard 3 through the second sensing module through slot 202 and the second PCB motherboard through slot 302.

[0036] After receiving two signals, the PCB motherboard 3 performs signal filtering, amplification and data processing through built-in circuitry. Finally, it transmits accurate temperature, humidity and pressure parameters to external devices through spring terminal 403, realizing multi-parameter synchronous and high-precision real-time detection to meet the detection needs under various working conditions.

[0037] The above description is merely illustrative of the embodiments of the present invention and is not intended to limit the present invention. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A temperature, humidity, and pressure sensor, characterized in that, The system includes a port socket (1), a PCB motherboard support (2), a PCB motherboard (3), a terminal block assembly (4), and a housing (7). The port socket (1) is provided with a main detection channel (101), a first detection branch channel (102), and a second detection branch channel (103). A sensing position (104) and a first sensing module (5) are provided on the outside of the first detection branch channel (102), and a second sensing module (6) is provided inside the second detection branch channel (103). The PCB motherboard support (2) is sleeved with the upper surface of the port socket (1), and the PCB motherboard support (2) has a first sensing module through slot (201) and a second sensing module through slot (202). The PCB motherboard (3) The PCB motherboard support (2) is disposed on the surface of the PCB motherboard support (2). The PCB motherboard (3) has a first PCB motherboard through slot (301) and a second PCB motherboard through slot (302). The first sensing module (5) is electrically connected to the PCB motherboard (3) through the first sensing module through slot (201) and the first PCB motherboard through slot (301). The second sensing module (6) is electrically connected to the PCB motherboard (3) through the second sensing module through slot (202) and the second PCB motherboard through slot (302). The terminal block assembly (4) is disposed above the PCB motherboard (3). The terminal block assembly (4) is connected to the port socket (1) through the outer shell (7).

2. The temperature, humidity, and pressure sensor according to claim 1, characterized in that, The port seat (1) includes a connector (105) disposed on the lower end face and extending outward. The connector (105) is provided with the main detection channel (101). One end of the main detection channel (101) is the main channel opening end (106), and the other end is the main channel closing end (107). The main channel closing end (107) is provided with the first detection branch channel (102) and the transition channel (110) parallel to each other along the axial direction.

3. A temperature, humidity, and pressure sensor according to claim 2, characterized in that, The end of the first detection branch channel (102) away from the main detection channel (101) is a closed section (108), the closed section (108) forms a boss (109), and the top surface of the boss (109) is the sensing position (104); the upper surface of the port seat (1) is provided with a second sensing module mounting cavity (111), the second sensing module mounting cavity (111) and the transition channel (110) are cross-connected to form the second detection branch channel (103).

4. A temperature, humidity, and pressure sensor according to claim 1, characterized in that, The upper surface of the PCB motherboard support base (2) is provided with a PCB motherboard positioning post (206) and a PCB motherboard limiting block (203). The PCB motherboard (3) is provided with a PCB motherboard positioning hole (303) and a PCB motherboard limiting groove (304). The PCB motherboard positioning hole (303) is adapted to the PCB motherboard positioning post (206), and the PCB motherboard limiting groove (304) is adapted to the PCB motherboard limiting block (203).

5. A temperature, humidity, and pressure sensor according to claim 1, characterized in that, The second sensing module (6) includes an adapter board bracket (602), which is provided with a stepped groove (601). The stepped groove (601) includes a first groove (604), a second groove (605), and a third groove (606) that are interconnected. The first groove (604) is used to accommodate a sensing chip (607). The bottom wall of the first groove (604) is provided with a sensing hole (608), which corresponds to the sensing chip (607).

6. A temperature, humidity, and pressure sensor according to claim 5, characterized in that, The bottom wall of the second groove (605) is provided with a first adapter plate positioning post (609), the side of the adapter plate bracket (602) extends outward to form a reversing support plate (611), and the surface of the reversing support plate (611) is provided with a second adapter plate positioning post (612); the second sensing module (6) also includes an adapter plate (603), the adapter plate (603) is provided with a first adapter plate positioning hole (610) and a second adapter plate positioning hole (613), the first adapter plate positioning hole (610) is adapted to the first adapter plate positioning post (609), and the second adapter plate positioning hole (613) is adapted to the second adapter plate positioning post (612).

7. A temperature, humidity, and pressure sensor according to claim 5, characterized in that, The sensing chip (607) is filled with chip sealant (616) between the inner wall of the first groove (604), and potting compound (8) is provided between the first groove (604) and the second groove (605) corresponding to the outer side of the adapter plate (603). The top of the second detection branch channel (103) is filled with potting compound (8).

8. A temperature, humidity, and pressure sensor according to claim 1, characterized in that, The terminal block assembly (4) includes a terminal support (401) and a terminal bracket (402). The terminal support (401) and the terminal bracket (402) are connected by a snap-fit ​​structure. The terminal bracket (402) has a spring terminal lower limit hole (404) and symmetrically arranged locking feet (405). The terminal support (401) has a terminal bracket sleeve hole (407), a spring terminal sleeve (406) and a locking groove (408). The spring terminal sleeve (406) corresponds to the spring terminal lower limit hole (404), and the locking groove (408) is adapted to the locking feet (405).

9. A temperature, humidity, and pressure sensor according to claim 8, characterized in that, The bottom surface of the terminal support (401) is provided with a support guide post (409), and the PCB motherboard support (2) is provided with a support guide groove (207). The support guide groove (207) is adapted to the support guide post (409). The terminal support (401) is provided with a housing limiting part (410). The outer side of the port seat (1) is provided with a housing ring groove (114), and the housing ring groove (114) is adapted to the housing (7).

10. A temperature, humidity, and pressure sensor according to claim 1, characterized in that, The first sensing module (5) is a pressure strain gauge, the second sensing module (6) is any one of a temperature sensing module, a humidity sensing module or an integrated temperature and humidity sensing module, and the adapter plate (603) is an FPC flexible circuit board.

Images