Thermal simulation method and device based on bus bar, computer equipment and storage medium

Abstract

The invention discloses a thermal simulation method and device based on a bus bar, computer equipment and a storage medium, and the method comprises the steps: obtaining PCB data, bus bar data and configuration data, and the bus bar data comprises geometric feature drivable parameters; based on the PCB data, the bus bar data and the configuration data, constructing an electric-thermal coupling simulation model with the bus bar as a heat source and a heat path; the electric-thermal coupling simulation model is operated for solving, and a solving result of the bus bar system is obtained; generating post-processing data based on the solving result, wherein the post-processing data is used for evaluating thermal performance; and if the thermal performance of the bus bar does not reach the standard, adjusting the drivable parameters of the geometrical characteristics until an optimal bus bar design scheme meeting a preset condition is obtained. According to the method, the PCB simulation result data is analyzed and processed to generate the data cloud picture, so that a customer can be helped to quickly verify and analyze the reasonability of the bus bar design.

Description

Technical Field

[0001] This application relates to a thermal simulation method, apparatus, computer equipment, and storage medium based on a busbar, belonging to the field of power electronics simulation technology. Background Technology

[0002] As power electronic devices such as new energy vehicles, photovoltaic inverters, and industrial frequency converters develop towards higher power density, miniaturization, and higher reliability, their internal thermal management has become a key factor restricting product performance and lifespan. Busbars, as multi-layered laminated power connection components, possess advantages such as low parasitic inductance, high current carrying capacity, compact structure, and high reliability. They are crucial conductive structures for connecting high-power devices such as batteries, capacitors, and IGBTs, and are widely used in aerospace, communications, transportation, and energy fields.

[0003] However, traditional thermal design methods involving busbars have the following significant drawbacks: Isolated and unsystematic analysis: Traditional methods often treat busbars as simple conductors, underestimating their thermal effects. System-level thermal simulations often focus only on the heat generation and dissipation of power devices themselves, neglecting the dual role of busbars as both important heat sources and heat paths. This isolated analysis leads to significant discrepancies between simulation results and actual conditions, making it difficult to accurately predict the system's true temperature rise.

[0004] Reliant on experience, with long design cycles: The design process heavily depends on engineers' experience and trial-and-error methods. Each solution must go through multiple cycles of "design-prototype testing-modification," which not only consumes a lot of time and money, slows down the product launch process, but also often results in a suboptimal solution.

[0005] Ignoring multiphysics coupling effects: The operation of a busbar is essentially a process of electro-thermal-mechanical multiphysics coupling. Uneven current distribution leads to localized overheating, which in turn causes non-uniform thermal expansion and thermal stress. Mechanical stress, in turn, can affect contact resistance, creating complex feedback. Traditional methods struggle to effectively handle this coupling effect, introducing potential risks into the design.

[0006] Therefore, there is an urgent need in this field for a technical solution that can accurately, efficiently, and systematically perform thermal simulation analysis on busbar-based power electronic systems to overcome the limitations of the aforementioned traditional design methods. Summary of the Invention

[0007] In view of this, this application provides a busbar-based thermal simulation method, apparatus, computer equipment, and storage medium. It analyzes and processes PCB simulation results data to generate data cloud maps, enabling customers to quickly verify and analyze the rationality of busbar designs.

[0008] The first aspect of this application discloses a thermal simulation method based on a busbar. The method includes: acquiring PCB data, busbar data, and configuration data, wherein the busbar data includes geometrically drivable parameters; constructing an electro-thermal coupling simulation model of the busbar as a heat source and heat path based on the PCB data, busbar data, and configuration data; running the electro-thermal coupling simulation model to solve the problem and obtain the solution result of the busbar system; generating post-processing data based on the solution result, wherein the post-processing data is used to evaluate thermal performance; and adjusting the geometrically drivable parameters if the thermal performance of the busbar is substandard until an optimal busbar design scheme that meets preset conditions is obtained.

[0009] In one embodiment, the geometric feature drive parameters are at least one of the following: number of layers, width, thickness, bending angle, and connection hole position.

[0010] In one embodiment, constructing an electro-thermal coupling simulation model of the busbar as a heat source and heat path based on the PCB data, busbar data, and configuration data includes: verifying at least one of the following based on the PCB data and the busbar data: power information, material thermal properties, stack-up information, and geometric dimensions of the components; after the verification is passed, constructing a three-dimensional parametric model including power devices, heat sinks, busbar connectors, and busbars; and setting up electro-thermal coupling simulation based on the three-dimensional parametric model to obtain an electro-thermal coupling simulation model.

[0011] In one embodiment, the electro-thermal coupling simulation settings include: assigning predefined electrical and thermal properties to each part of the three-dimensional parametric model; applying operating current excitation to the electrical ports of the busbar; defining the heat dissipation boundary conditions of the system; and performing adaptive mesh refinement on the model region with drastic current changes, wherein the model region with drastic current changes is the busbar connection and the contact area of ​​the power device.

[0012] In one embodiment, the step of running the electro-thermal coupling simulation model to obtain the solution results of the busbar system includes: starting the electro-thermal coupling solver, performing electromagnetic-steady-state current field analysis, calculating the current density distribution of the busbar system according to Ohm's law and calculating the corresponding volumetric heating power density according to Joule's law; and importing the volumetric heating power density as a heat source into the transient or steady-state thermal analysis module to solve the temperature field distribution of the entire system.

[0013] In one embodiment, generating post-processing data based on the solution results includes: generating a three-dimensional temperature cloud map of the entire system and generating a corresponding stress cloud map; generating a current density distribution cloud map on the busbar; generating a temperature change curve of the busbar over time; and generating a thermal resistance network analysis of the system.

[0014] In one embodiment, adjusting the geometrically drivable parameters if the thermal performance of the busbar is substandard includes: if the temperature exceeds the standard, increasing the local size of the busbar to reduce resistance; if the stress exceeds the standard, optimizing the bending shape of the busbar to improve stress distribution; if the current distribution uniformity is substandard, adjusting the connection position of the busbar to balance the current; if the steady-state or transient peak temperature exceeds the standard and thermal resistance network analysis indicates that conductive thermal resistance dominates, increasing the local width of the busbar to reduce contact thermal resistance; if the steady-state or transient peak temperature exceeds the standard and thermal resistance network analysis indicates that convective thermal resistance dominates, optimizing the busbar layout to increase the heat dissipation area or improve airflow.

[0015] A second aspect of this application discloses a busbar-based thermal simulation device, comprising: an acquisition module for acquiring PCB data, busbar data, and configuration data, wherein the busbar data includes geometrically drivable parameters; a construction module for constructing an electro-thermal coupling simulation model of the busbar as a heat source and heat path based on the PCB data, busbar data, and configuration data; a solution module for running the electro-thermal coupling simulation model to obtain the solution results of the busbar system; a generation module for generating post-processing data based on the solution results, wherein the post-processing data is used to evaluate thermal performance; and an adjustment module for adjusting the geometrically drivable parameters if the thermal performance of the busbar is substandard, until an optimal busbar design scheme that meets preset conditions is obtained.

[0016] A third aspect of this application discloses a computer-readable storage medium comprising a stored program, wherein the program, when running, controls the execution of the thermal simulation method of the above embodiments in a processor of the device.

[0017] A fourth aspect of this application discloses a computer device, the computer device including a processor and a memory; wherein the memory stores a computer program adapted to be loaded by the processor and executed by the above-described thermal simulation method.

[0018] Compared with the prior art, the embodiments of this application have the following beneficial effects: 1. High accuracy and high reliability: Through rigorous electro-thermal coupling simulation, the heat generation and heat transfer effects of the busbar are incorporated into the overall thermal model, which completely changes the practice of ignoring or oversimplifying them in traditional methods. This results in a qualitative leap in the accuracy of predicting system hot spots and temperature rise, and greatly reduces the risk of product recall due to thermal design failure.

[0019] 2. Short development cycle and low cost: This method can quickly evaluate and optimize countless design schemes in a virtual environment, transforming the traditional "design-test-modify" physical cycle into an efficient "simulation-optimization" digital cycle. This significantly reduces reliance on physical prototypes, shortens development time by several months, and saves considerable costs associated with prototype manufacturing and testing.

[0020] 3. Enhanced design capabilities and optimized performance: This enables engineers to gain a deeper understanding of multiphysics interaction mechanisms, allowing them to design busbar systems with excellent electrical and thermal performance. This not only solves overheating problems but also increases system current ratings at the same temperature rise or reduces system size at the same power, directly contributing to higher power density and stronger market competitiveness.

[0021] 4. Foresight and guidance: It can accurately locate local overheating bottlenecks that are difficult to find in traditional experience-based design, and provide forward-looking data guidance and decision-making basis for the topology optimization of busbars, material selection (such as the use of composite materials), and the application of advanced manufacturing processes (such as embedded water cooling channels). Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 A flowchart illustrating a busbar-based thermal simulation method provided in this application embodiment.

[0024] Figure 2 This is a schematic diagram of an assembly busbar provided in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of an assembly busbar provided in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of an assembly busbar provided in an embodiment of this application.

[0027] Figure 5 This is a rendering of an assembly busbar provided in an embodiment of this application.

[0028] Figure 6 This is a schematic diagram of a simulation setup provided in an embodiment of this application.

[0029] Figure 7 This is a schematic diagram of a simulation setup provided in an embodiment of this application.

[0030] Figure 8 This is a schematic diagram of a simulation setup provided in an embodiment of this application.

[0031] Figure 9 This is a rendering of a post-processing result provided in an embodiment of this application.

[0032] Figure 10 This is a rendering of a post-processing result provided in an embodiment of this application.

[0033] Figure 11 This is a structural diagram of a busbar-based thermal simulation device provided in an embodiment of this application. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0035] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0036] In this embodiment, a busbar-based thermal simulation method is described. The implementation process includes: pre-simulation settings for the PCB board, importing the busbar data file, and configuring relevant data; performing simulation calculations and generating results after the settings are completed; and finally, analyzing the result data and generating a post-processing cloud map. This invention focuses on illustrating the implementation of a thermal simulation process based on existing busbar layouts.

[0037] The entire process can be broken down into the following steps: importing the busbar file, configuring the busbar data, setting pre-simulation parameters, executing the simulation, generating results, and post-processing display. The simulation process specifically includes data verification, configuration file output, data collection, geometric modeling, mesh generation, and solver computation. The following section will describe the specific implementation flow of some of these steps.

[0038] Example 1: Figure 1 A flowchart illustrating a busbar-based thermal simulation method provided in this application embodiment. Figure 1 As shown, the method includes: S101. Acquire PCB data, busbar data, and configuration data, wherein the busbar data includes geometric feature drive parameters.

[0039] In this step, the configuration data typically includes the initial simulation settings, such as ambient temperature and boundary conditions. In this application scenario, for Joule thermal simulation of a bare plate with added busbars, the configuration file also needs to define additional properties related to the busbars, such as material conductivity and thickness.

[0040] S102. Based on the PCB data, busbar data, and configuration data, construct an electro-thermal coupling simulation model of the busbar as a heat source and heat path.

[0041] Furthermore, the step of constructing an electro-thermal coupling simulation model of the busbar as a heat source and heat path based on the PCB data, busbar data, and configuration data includes: S1021. Based on the PCB data and the busbar data, verify at least one of the following: power information, material thermal properties, stack-up information, and geometric dimensions of the component.

[0042] In this step, before performing thermal simulation with busbars, the design data must first be verified. Verification includes ensuring the accuracy of key parameters such as component power, heat source information, material thermal properties, stack-up information, and geometric dimensions. Furthermore, design team members should promptly communicate any changes to design data related to heat dissipation and ensure the simulation model is updated accordingly.

[0043] S1022. After the verification is passed, a three-dimensional parametric model including power devices, heat sinks, busbar connectors and busbars is constructed.

[0044] In this step, a three-dimensional parametric model is established on an integrated design platform, including power devices (such as IGBT modules and capacitors), heat sinks, busbar connectors, and busbar systems. Key geometric features of the busbar system, such as the number of layers, width, thickness, bending angle, and connection hole positions, are defined as driveable parameters.

[0045] S1023. Based on the three-dimensional parametric model, perform electro-thermal coupling simulation settings to obtain an electro-thermal coupling simulation model.

[0046] Furthermore, the electro-thermal coupling simulation settings are configured, including: S10231. Assign predefined electrical and thermal properties to each part of the three-dimensional parametric model.

[0047] In this step, electrical properties can be electrical conductivity, and thermal properties can include thermal conductivity, specific heat capacity, and surface emissivity.

[0048] S10232. Apply operating current excitation to the electrical port of the busbar.

[0049] In this step, a real operating current waveform (such as a sine wave or PWM wave) is applied to the input or output terminal of the busbar.

[0050] S10233. Define the heat dissipation boundary conditions of the system.

[0051] In this step, the heat dissipation boundary conditions of the system are defined, including the cooling method of the radiator (such as air cooling speed, water cooling flow rate and inlet temperature), ambient temperature and surface thermal radiation.

[0052] S10234. Adaptive mesh refinement is performed on the model region with drastic current changes, wherein the model region with drastic current changes is the busbar connection and the contact area of ​​the power device.

[0053] In this step, adaptive fine meshing is performed on the model, especially at the busbar connections and power device contact areas where current changes drastically, to ensure computational accuracy.

[0054] S103. Run the electro-thermal coupling simulation model to solve the problem and obtain the solution results of the busbar system.

[0055] Furthermore, the solution obtained by running the electro-thermal coupling simulation model to obtain the solution results of the busbar system includes: S1031. Start the electro-thermal coupling solver to perform electromagnetic-steady-state current field analysis. Calculate the current density distribution (J) of the busbar system according to Ohm's law and calculate the corresponding volumetric heating power density (volumetric heating power density generated by Ohmic loss) according to Joule's law.

[0056] S1032. The volumetric heating power density (P) is used as a heat source (the heating power distribution is used as a heat source) and imported into the transient or steady-state thermal analysis module to solve the temperature field distribution of the entire system.

[0057] In S1031~S1032, it is necessary to consider the nonlinear relationship between the material's electrical conductivity and thermal conductivity and temperature to achieve true two-way electro-thermal coupling simulation.

[0058] S104. Generate post-processing data based on the solution results, and the post-processing data is used to evaluate thermal performance.

[0059] Furthermore, the generation of post-processed data (simulation result report) based on the solution results includes: S1041. Generate a three-dimensional temperature cloud map of the entire system and generate a corresponding stress cloud map.

[0060] In this step, the three-dimensional temperature cloud map can intuitively display the location and temperature value of hot spots, and the stress cloud map works similarly.

[0061] S1042. Generate a current density distribution cloud map on the busbar.

[0062] In this step, the current density distribution cloud map can show the current skin effect and crowding effect.

[0063] S1043. Generate the temperature change curve of the busbar over time.

[0064] In this step, a curve showing the change of IGBT junction temperature over time is also generated.

[0065] S1044. Generation system thermal resistance network analysis.

[0066] S105. If the thermal performance of the busbar does not meet the standard, the driving parameters of the geometric features are adjusted until the optimal busbar design scheme that meets the preset conditions is obtained.

[0067] Furthermore, if the thermal performance of the busbar is substandard, the adjustment of the geometrically drivable parameters includes: if the temperature exceeds the standard, increasing the local size of the busbar to reduce resistance; if the stress exceeds the standard, optimizing the bending shape of the busbar to improve stress distribution; if the current distribution uniformity is substandard, adjusting the connection position of the busbar to balance the current; if the steady-state or transient peak temperature exceeds the standard and thermal resistance network analysis indicates that conductive thermal resistance dominates, increasing the local width of the busbar to reduce contact thermal resistance; if the steady-state or transient peak temperature exceeds the standard and thermal resistance network analysis indicates that convective thermal resistance dominates, optimizing the busbar layout to increase the heat dissipation area or improve airflow.

[0068] As an optional implementation, if the performance does not meet the requirements (such as the temperature exceeding the limit), the system can automatically or manually adjust the parametric geometry of the busbar (such as increasing the local width to reduce resistance and temperature rise, optimizing the bending shape to improve stress distribution, and adjusting the connection position to balance the current) and automatically rerun the simulation process until the optimal busbar design that meets all thermal performance and economic indicators is obtained.

[0069] For example, if performance is not met, an optimization iterative loop is executed: a) Adjustment steps: Automatically or according to manual instructions, adjust the parametric geometry of the busbar; the adjustment includes at least one of the following strategies: increasing local width to reduce resistance, optimizing the bend shape to improve stress distribution, and adjusting the connection position to balance current distribution.

[0070] b) Resimulation step: Based on the adjusted geometric features, automatically rerun the entire simulation process from parametric modeling to the generation of post-processed data.

[0071] The optimization and iteration cycle continues until the system indicators meet the preset requirements.

[0072] In some embodiments, a system implementation of the above method is provided, the system comprising: Parametric modeling module: Used to build and modify the three-dimensional geometric model of power electronic systems.

[0073] Multiphysics Coupled Simulation Engine: Used to integrate electromagnetic and thermal field solvers to perform electro-thermal coupled calculations.

[0074] Material Library and Boundary Condition Management Module: Used to store the electrothermal properties of various materials and set boundary conditions, providing corresponding interfaces.

[0075] Post-processing and visualization module: used to present simulation results of physical fields such as temperature field and current density field.

[0076] Optimization driver module: Used to automatically adjust design parameters based on simulation results and drive the system to re-simulate in order to achieve optimization loop.

[0077] In some embodiments, an example of the above method is provided, which includes: I. Assemble the busbar: 1. For example Figure 2 As shown, select the pin to connect to the busbar; 2. For example Figure 3 As shown, the bus bar is imported via Insert Model and the bus bar pin is set; 3. For example Figure 4 As shown, click Assembly to assemble, and select the corresponding pin and connection method; 4. For example Figure 5 As shown, this is the final assembled result.

[0078] II. Start the simulation: 1. For example Figure 6 As shown, select the corresponding Flow to set the heat source data; 2. For example Figure 7 As shown, set the boundary condition data; 3. For example Figure 8 As shown, the simulation is started via Run Thermal.

[0079] III. Simulation completed, post-processing results obtained (such as...) Figure 9 and 10 (As shown).

[0080] Example 2: Figure 11 This is a structural diagram of a busbar-based thermal simulation device provided in an embodiment of this application. Figure 11 As shown, the device includes: The acquisition module 1101 is used to acquire PCB data, busbar data and configuration data, wherein the busbar data includes geometric feature drive parameters.

[0081] The construction module 1102 is used to construct an electro-thermal coupling simulation model of the busbar as a heat source and heat path based on the PCB data, busbar data and configuration data.

[0082] The solver module 1103 is used to run the electro-thermal coupling simulation model to solve the problem and obtain the solution results of the busbar system.

[0083] The generation module 1104 is used to generate post-processing data based on the solution results, and the post-processing data is used to evaluate thermal performance.

[0084] The adjustment module 1105 is used to adjust the geometric feature drive parameters if the thermal performance of the busbar does not meet the standard, until the optimal busbar design scheme that meets the preset conditions is obtained.

[0085] Example 3: Embodiments of this application also provide a computer device, including: a memory storing an executable program; and a processor for running the program, wherein the program executes the methods in various embodiments of the present invention during runtime.

[0086] The aforementioned memory can refer to devices inside a computer used to store data and programs, including RAM, hard disks, etc. RAM can be used to temporarily store running programs and data, while hard disks can be used to store programs and data long-term. Memory enables the computer to read and write data and execute programs. The aforementioned processor is responsible for executing instructions in computer programs and performing data processing. It can also be responsible for controlling and executing various operations, including arithmetic operations, logical operations, and data transmission.

[0087] Example 4: Embodiments of this application also provide a computer-readable storage medium including a stored executable program, wherein, when the executable program is running, it controls the device where the computer-readable storage medium is located to perform the methods of various embodiments of the present invention.

[0088] The aforementioned computer storage media can refer to the media used in computer memory to store certain discontinuous physical quantities. Computer storage media mainly include semiconductors, magnetic cores, magnetic drums, magnetic tapes, laser discs, etc. Computer-readable storage media include stored programs, which can be a set of instructions that a computer can recognize and execute, running on an electronic computer to meet certain information needs.

[0089] Example 5: Embodiments of this application also provide a computer program product, including a computer program that, when executed by a processor, implements the methods of various embodiments of the present invention.

[0090] The aforementioned computer program products can refer to software programs that have been written, tested, and released, and can run on computers or other devices. Computer program products can include application programs, operating systems, utility software, etc., used to achieve specific functions or solve specific problems.

[0091] Example 6: Embodiments of this application also provide a computer program product, including a non-volatile computer-readable storage medium for storing a computer program that, when executed by a processor, implements the methods in various embodiments of the present invention.

[0092] The aforementioned non-volatile computer-readable storage medium can refer to a medium for storing data. Non-volatile computer-readable storage media can retain data without loss when power is off and can be used to store long-term data, such as operating systems, applications, and user files. Non-volatile storage media can include hard disk drives, solid-state drives, optical disks, and flash memory storage devices, etc.

[0093] Example 7: Embodiments of this application also provide a computer program that, when executed by a processor, implements the methods described in the various embodiments of the present invention.

[0094] The aforementioned computer program can refer to a set of instructions used to tell the computer to perform specific tasks or operations. Computer programs can be written by programmers using specific programming languages ​​and can include algorithms, data structures, logic, and control flow. Computer programs can be used for a variety of purposes, including application software, operating systems, etc.

[0095] In the above embodiments of the present invention, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0096] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For instance, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.

[0097] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0098] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0099] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0100] In summary, this method aims to: 1. Achieve high-precision, automated coupled simulation of the electrothermal characteristics of busbars, incorporating the busbars as the core heat source and heat path into the overall system thermal model, significantly improving the accuracy and reliability of simulation results. 2. Provide a rapid evaluation and optimization design method, capable of predicting the impact of different busbar topologies, materials, cross-sectional areas, and layouts on the overall thermal performance of the system before physical prototype manufacturing, thereby guiding optimal design, shortening the development cycle, and reducing development costs. 3. Reveal the detailed heat and current distribution within the system, accurately locating local overheating bottlenecks caused by improper busbar design, providing direct data support for improving system power density and reliability.

[0101] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A thermal simulation method based on busbars, characterized in that, include: Acquire PCB data, busbar data, and configuration data, wherein the busbar data includes geometric feature drive parameters; Based on the PCB data, busbar data, and configuration data, an electro-thermal coupling simulation model of the busbar as a heat source and heat path is constructed. The electro-thermal coupling simulation model was run to solve the problem, and the solution results of the busbar system were obtained. Post-processed data is generated based on the solution results, and the post-processed data is used to evaluate thermal performance. If the thermal performance of the busbar does not meet the standard, the driving parameters of the geometric features are adjusted until the optimal busbar design that meets the preset conditions is obtained.

2. The thermal simulation method according to claim 1, characterized in that, The geometric feature can be driven by at least one of the following parameters: number of layers, width, thickness, bending angle, and connection hole position.

3. The thermal simulation method according to claim 1, characterized in that, The electro-thermal coupling simulation model of the busbar as a heat source and heat path is constructed based on the PCB data, busbar data, and configuration data, including: Based on the PCB data and the busbar data, at least one of the following is verified: power information, material thermal properties, stack-up information, and geometric dimensions of the component. After the verification is passed, a three-dimensional parametric model including power devices, heat sinks, busbar connectors and busbars is constructed. Based on the aforementioned three-dimensional parametric model, an electro-thermal coupling simulation setting is performed to obtain an electro-thermal coupling simulation model.

4. The thermal simulation method according to claim 3, characterized in that, Setting the electro-thermal coupling simulation settings includes: Assign predefined electrical and thermal properties to each part of the three-dimensional parametric model; An operating current excitation is applied to the electrical port of the busbar; Define the system's heat dissipation boundary conditions; Adaptive mesh refinement is performed on the model region with drastic current changes, which includes the busbar connection and the contact area of ​​the power device.

5. The thermal simulation method according to claim 1, characterized in that, The electro-thermal coupling simulation model is run to solve the problem, and the solution results of the busbar system are obtained, including: Start the electro-thermal coupling solver to perform electromagnetic-steady-state current field analysis, calculate the current density distribution of the busbar system according to Ohm's law, and calculate the corresponding volumetric heating power density according to Joule's law; The volumetric heating power density is used as a heat source and imported into the transient or steady-state thermal analysis module to solve the temperature field distribution of the entire system.

6. The thermal simulation method according to claim 1, characterized in that, The generation of post-processed data based on the solution results includes: Generate a three-dimensional temperature cloud map of the entire system and a corresponding stress cloud map; Generate a current density distribution cloud map on the busbar; The temperature change curve of the busbar over time is generated; Thermal resistance network analysis of the generation system.

7. The thermal simulation method according to claim 6, characterized in that, If the thermal performance of the busbar is substandard, the driving parameters of the geometric features are adjusted, including: If the temperature exceeds the limit, a strategy of increasing the local size of the busbar is adopted to reduce the resistance; If the stress value exceeds the standard, a strategy of optimizing the bending shape of the busbar will be adopted to improve the stress distribution; If the current distribution uniformity is not up to standard, the strategy of adjusting the connection position of the busbars is adopted to balance the current. If the steady-state or transient peak temperature exceeds the limit and thermal resistance network analysis indicates that conductive thermal resistance is dominant, the local width of the busbar should be increased to reduce the contact thermal resistance. If the steady-state or transient peak temperature exceeds the limit and thermal resistance network analysis indicates that convective thermal resistance dominates, then optimize the busbar layout to increase the heat dissipation area or improve airflow.

8. A thermal simulation device based on busbars, characterized in that, include: The acquisition module is used to acquire PCB data, busbar data, and configuration data, wherein the busbar data includes geometric feature drive parameters; The construction module is used to construct an electro-thermal coupling simulation model of the busbar as a heat source and heat path based on the PCB data, busbar data, and configuration data. The solver module is used to run the electro-thermal coupling simulation model to obtain the solution results of the busbar system; A generation module is used to generate post-processed data based on the solution results, and the post-processed data is used to evaluate thermal performance. The adjustment module is used to adjust the geometric feature drive parameters if the thermal performance of the busbar does not meet the standard, until the optimal busbar design scheme that meets the preset conditions is obtained.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the thermal simulation method as described in any one of claims 1-7.

10. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the thermal simulation method as described in any one of claims 1-7.

Images