Display screen module, manufacturing method thereof and electronic equipment

Abstract

The invention discloses a display screen module, a manufacturing method thereof and electronic equipment. The display screen module comprises a supporting layer, a functional layer, a cover plate layer and a protective film layer which are stacked in sequence, the functional layer comprises a first light hole; the supporting layer comprises a first supporting layer and a second supporting layer which are stacked in sequence, the first supporting layer is close to the functional layer, and the second supporting layer is located on the side, away from the functional layer, of the first supporting layer; the second supporting layer comprises a second light-transmitting hole, and the first light-transmitting hole is opposite to the second light-transmitting hole. In this way, light is received by the front camera module through the first light hole, the first supporting layer and the second light hole in sequence. On the premise that no light hole is formed in the first supporting layer, light can still penetrate through the first supporting layer easily, the first supporting layer can have high structural strength, and the first supporting layer is prevented from deforming when impacted by external force. The supporting performance of the supporting layer on the back face of the functional layer can be improved through the first supporting layer, and the anti-impact reliability of the display screen module in the hole opening area is improved.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a display module and its manufacturing method, and electronic equipment. Background Technology

[0002] With the development of terminal technology, the screen sizes of electronic devices such as mobile phones are getting larger and larger. In order to meet users' portability needs while increasing screen size, foldable screen devices are gradually entering users' usage scenarios.

[0003] Foldable screen devices include a front-facing camera to meet user needs. Currently, foldable screen devices typically use a hole-punch design in the display screen to enable the front-facing camera's light-sensing capability.

[0004] However, when a hole is cut into the display of a foldable device to accommodate the front-facing camera, the structural strength of the display in the hole area decreases. Under external impact, the display is prone to deformation in the hole area, affecting the usability of the foldable device. Summary of the Invention

[0005] This application provides a display module and its manufacturing method, as well as an electronic device, to solve the problem of low impact resistance and reliability of existing displays.

[0006] In a first aspect, this application provides a display module, including: a support layer, a functional layer, a cover layer and a protective film layer stacked sequentially; the functional layer includes a first light-transmitting hole; the support layer includes a first support layer and a second support layer stacked sequentially, the first support layer being adjacent to the functional layer and the second support layer being located on the side of the first support layer away from the functional layer; the second support layer includes a second light-transmitting hole, and the first light-transmitting hole is opposite to the second light-transmitting hole.

[0007] The display module provided in this application embodiment can have light-transmitting holes (such as a first light-transmitting hole and a second light-transmitting hole) in the second support layer and the functional layer, while the first support layer does not need to have a light-transmitting hole. Light is received by the front-facing camera module sequentially through the first light-transmitting hole, the first support layer, and the second light-transmitting hole. Even without light-transmitting holes, the first support layer can still facilitate light transmission and improve the transparency and gloss of the display module, thereby improving light quality and ultimately enhancing the imaging quality of the front-facing camera module. Simultaneously, it also provides high structural strength, preventing deformation under external impact and improving the impact resistance reliability of the first support layer. Utilizing the first support layer enhances the support of the support layer for the back of the functional layer, improving the impact resistance reliability of the display module in the hole area.

[0008] In some implementations, the method further includes: a first adhesive layer; a first support layer bonded to the functional layer via the first adhesive layer; and a first gap between the first support layer and the second support layer. In this way, the first support layer utilizes a single layer of adhesive to bond with other layers, increasing the thickness of the first support layer while maintaining the overall thickness of the display module, thereby further improving the impact resistance and reliability of the first support layer.

[0009] In some implementations, the method further includes: a second adhesive layer; the first support layer is bonded to the second support layer via the second adhesive layer; and a second gap exists between the first support layer and the functional layer. In this way, the first support layer utilizes a single layer of the second adhesive layer to bond with other layers, increasing the thickness of the first support layer while maintaining the overall thickness of the display module, thereby further improving the impact resistance and reliability of the first support layer.

[0010] In some implementations, the method further includes: a first adhesive layer and a second adhesive layer; the first adhesive layer and the second adhesive layer are located on opposite sides of the first support layer; the first support layer is bonded to the functional layer via the first adhesive layer; the first support layer is bonded to the second support layer via the second adhesive layer. In this way, the first support layer utilizes the double-layered first and second adhesive layers to bond with adjacent layer structures, which can improve the bonding reliability of the first support layer.

[0011] In some implementations, the first support layer is made of one of the following materials: ultra-thin UTG glass, acrylic, epoxy, or transparent ceramic; the second support layer is made of metal. This allows the first support layer to possess material properties such as high transmittance, low haze, and high modulus.

[0012] In some implementations, the transmittance of the first support layer is greater than 90%; the haze of the first support layer is less than 0.5%; and the modulus of the first support layer is greater than 60 GPa. This allows light to pass through without the need for light-transmitting holes in the first support layer, improving the transparency and gloss of the display module. It also gives the first support layer high structural strength, preventing deformation under external impact and thus improving its impact resistance. Furthermore, the first support layer enhances its support for the back of the functional layer, increasing the impact resistance of the display module.

[0013] Some implementations also include: a planar area and a bending area, with the two planar areas located at opposite ends of the bending area; one of the planar areas includes a first region, which is the area opposite to the lens module of the electronic device; a first light-transmitting hole and a second light-transmitting hole are located in the first region. This avoids deformation of the light-transmitting holes during the bending process of the display module, preventing breakage at the light-transmitting holes and ensuring the flatness of the display module, thus meeting the optical performance requirements of the front-facing camera module and the photosensitive chip.

[0014] In some implementations, the support layer further includes a third support layer, located between the second support layer and the functional layer. The third support layer includes a perforation, which is opposite to the first area. The first support layer is embedded within the perforation. The third support layer is made of polyimide (PI), polyethylene terephthalate (PET), or stainless steel (SUS). This allows for bending of the support layer using both the second and third support layers, while also utilizing the first support layer to improve the impact resistance and reliability of the display module in the perforation area, and to meet optical performance requirements.

[0015] In some implementations, the second support layer further includes a third light-transmitting hole; the third light-transmitting hole is located to one side of the second light-transmitting hole and is situated in the first region. Thus, the third light-transmitting hole is opposite to the photosensitive chip, allowing the photosensitive chip to sense ambient light intensity using the third light-transmitting hole.

[0016] Secondly, this application provides a method for manufacturing a display module, used to manufacture a display module as provided in the first aspect. The manufacturing method includes: providing a support layer, a functional layer, a cover layer, and a protective film layer; wherein the support layer includes a first support layer and a second support layer; processing a first light-transmitting hole on the functional layer; processing a second light-transmitting hole on the second support layer; and sequentially stacking the second support layer, the first support layer, the functional layer, the cover layer, and the protective film layer to obtain a display module, wherein the first light-transmitting hole and the second light-transmitting hole are opposite to each other.

[0017] The method for manufacturing a display module provided in this application includes a support layer comprising a first support layer and a second support layer. Light-transmitting holes (such as a first light-transmitting hole and a second light-transmitting hole) are processed in the second support layer and the functional layer, respectively. The first support layer does not require any light-transmitting holes; light is received by the front-facing camera module sequentially through the first light-transmitting hole, the first support layer, and the second light-transmitting hole. Even without light-transmitting holes, the first support layer still facilitates light transmission and improves the transparency and gloss of the display module, thereby improving light quality and ultimately enhancing the imaging quality of the front-facing camera module. Simultaneously, it provides high structural strength, preventing deformation under external impact and improving the impact resistance of the first support layer. The first support layer also enhances the support of the support layer for the back of the functional layer, improving the impact resistance of the display module in the area with the openings.

[0018] In some implementations, the support layer further includes a third support layer, which includes perforations; and the process involves sequentially stacking a second support layer, a first support layer, a functional layer, a cover layer, and a protective film layer, including: sequentially stacking the second and third support layers to obtain a first structural component; sequentially stacking the functional layer, cover layer, and protective film layer; and bonding the first support layer to the functional layer using a first adhesive layer to obtain a second structural component; and stacking the first and second structural components to embed the first support layer into the perforations. This provides a stacking method for the various layers to create display modules with different structures.

[0019] In some implementations, the support layer further includes a third support layer, which includes a perforated hole; and the second support layer, the first support layer, the functional layer, the cover layer, and the protective film layer are stacked sequentially, including: stacking the second and third support layers sequentially; embedding the first support layer into the perforated hole to form a support layer; and stacking the functional layer, the cover layer, and the protective film layer sequentially on the side of the first and third support layers opposite to the second support layer. This provides another stacking method for the layers to create display modules with different structures.

[0020] Thirdly, this application also provides an electronic device, including a front-facing camera module, a body, and a display module as provided in the first aspect; the display module covers the body; the front-facing camera module is located between the display module and the body, and is opposite to a first light-transmitting hole and a second light-transmitting hole on the display module, and light enters the lens of the front-facing camera module through the first light-transmitting hole, the first support layer and the second light-transmitting hole.

[0021] Understandably, the electronic device provided in the third aspect is applied to the display module provided above. Therefore, the beneficial effects it can achieve can be referred to the beneficial effects of the display module provided above, and will not be repeated here. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 2 This is a schematic diagram of a display screen. Figure 3 This is a schematic diagram of the structure of a screen support layer; Figure 4 This is a first structural schematic diagram of the display module provided in the embodiments of this application; Figure 5 This is a schematic diagram of the internal structure of the electronic device provided in the embodiments of this application; Figure 6 This is a schematic diagram of a first type of adhesive structure for the first support layer provided in an embodiment of this application; Figure 7 This is a schematic diagram of a second bonding structure for the first support layer provided in an embodiment of this application; Figure 8 This is a schematic diagram of a third bonding structure for the first support layer provided in an embodiment of this application; Figure 9 This is a top view of the display module provided in the embodiment of this application; Figure 10 This is a second structural schematic diagram of the display module provided in the embodiments of this application; Figure 11 This is a partial cross-sectional structural diagram of the support layer provided in an embodiment of this application; Figure 12 This is a top view of the support layer provided in the embodiments of this application; Figure 13 This is the first process flow diagram of the manufacturing method of the display module provided in the embodiments of this application; Figure 14 This is the second process flow diagram of the manufacturing method of the display module provided in the embodiments of this application; Figure 15 This is the third process flow diagram of the manufacturing method of the display module provided in the embodiments of this application.

[0024] Illustration: Among them, 10-first body, 20-second body, 30-display screen, 31-light transmission hole, 32-ambient light hole, 33-screen protective layer, 34-glass cover layer, 35-display function layer, 36-screen support layer, 361-first screen support layer, 362-second screen support layer, 40-hinge assembly, 50-front camera module, 60-photosensitive chip, 100-display module, 110-planar area, 110a-the... One area, 120-bending area, 101-support layer, 1011-first support layer, 1012-second support layer, 1013-third support layer, 1014-perforated hole, 102-functional layer, 103-cover plate layer, 104-protective film layer, 201-first light-transmitting hole, 202-second light-transmitting hole, 203-third light-transmitting hole, 301-first adhesive layer, 302-second adhesive layer, 303-third adhesive layer, 304-fourth adhesive layer. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the protection scope of this application.

[0026] In the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0027] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0028] The following explanations of the technical terms mentioned in the embodiments of this application are provided to facilitate understanding by those skilled in the art.

[0029] Haze is the percentage of transmitted light intensity that deviates from the incident light angle by more than 2.5° out of the total transmitted light intensity. Haze is an important parameter of the optical transparency of transparent or translucent materials. The greater the haze, the lower the material's gloss, transparency, and especially its image quality.

[0030] Transmittance refers to a lens's ability to transmit incident light, usually expressed as a percentage. Higher transmittance means a lens is better at utilizing light, resulting in better image quality.

[0031] Modulus refers to the ratio of stress to strain in a material under stress. The larger the modulus, the greater the stress the material can withstand, and the better its impact resistance.

[0032] The electronic devices described in this application include, but are not limited to, mobile phones, foldable phones, laptops, tablets, laptop computers, personal digital assistants, or wearable devices. The following description uses a foldable phone as an example.

[0033] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application.

[0034] like Figure 1 As shown, the electronic device may include a first body 10, a second body 20, a display screen 30, and a hinge assembly 40, wherein, Figure 1 The dashed lines schematically indicate the area of ​​the hinge assembly 40. The first body 10 and the second body 20 are respectively located on both sides of the axis of the hinge assembly 40. The first body 10 and the second body 20 are connected to the hinge assembly 40 and can be rotated through the hinge assembly 40 to decrease the angle between the first body 10 and the second body 20 until the electronic device is in a folded state (not shown in the figure); or to increase the angle between the first body 10 and the second body 20 until the electronic device is in an unfolded state (e.g., ...). Figure 1 (as shown in the diagram). The electronic device can also be unfolded or folded to an intermediate state, which can be any state between the unfolded and folded states.

[0035] The display screen 30 covers the first body 10, the second body 20, and the hinge assembly 40, and is connected to the first body 10 and the second body 20 respectively. The rotation of the first body 10 and the second body 20 can cause the display screen 30 to bend or unfold. For example, the display screen 30 can be a flexible screen that can be bent, and the display screen 30 has a bending area, so that the display screen 30 can be bent in the bending area as the hinge assembly 40 rotates.

[0036] It should be noted that circuit boards, speaker modules, batteries, and other electronic components can be housed within the first body 10 and the second body 20; these will not be listed here. Foldable screen phones can be inward-folding, outward-folding, or similar types. Figure 1 The foldable screen phone shown in this application is not limited to the vertically folding type.

[0037] To facilitate the explanation of the positions of various components in the electronic device, this application embodiment exemplarily establishes a three-dimensional coordinate system based on the electronic device, wherein the x-axis direction is the width direction of the electronic device, the y-axis direction is the length direction of the electronic device, and the z-axis direction is the thickness direction of the electronic device.

[0038] To enable the electronic device to take pictures, a camera module is included. The camera module includes a front-facing camera module 50 and a rear-facing camera module (not shown in the figure). The lens of the front-facing camera module 50 faces the display screen 30, and the rear-facing camera module faces the rear cover of the device. The electronic device also includes a photosensitive chip 60 for sensing ambient light intensity.

[0039] Both the front-facing camera module 50 and the image sensor 60 are located within the first body 10, and between the display screen 30 and the first body 10. The lens of the front-facing camera module 50 faces the display screen 30. The front-facing camera module 50 and the image sensor 60 are close to each other, with a gap between them. In this article, the front-facing camera module 50 and the image sensor 60 are collectively referred to as the lens module.

[0040] Figure 2This is a schematic diagram of a display screen. Figure 3 This is a schematic diagram of the structure of a screen support layer. Among them, Figure 2 Show Figure 1 The structure of section AA in the middle, Figure 3 The dashed line in the diagram is opposite to the area of ​​the pivot assembly 40.

[0041] like Figure 2 and Figure 3 As shown, the display screen 30 is mainly composed of a screen protective layer 33, a glass cover layer 34, a display panel layer 35, and a screen support layer 36. The above structural layers are stacked in sequence, and adjacent layers are bonded together by an adhesive layer (not shown in the figure).

[0042] To prevent the display screen 30 from blocking light, the display screen 30 is provided with a light-transmitting hole 31 and an ambient light hole 32 to ensure the light transmittance of the display screen 30. Combined with... Figure 1 The light-transmitting hole 31 is positioned opposite to the front-facing camera module 50 and is specifically located in the display function layer 35 and the screen support layer 36. The ambient light hole 32 is opposite to the photosensitive chip 60 and is also located in the screen support layer 36. This perforated design in the display screen 30 satisfies the optical performance requirements of the front-facing camera module 50 and the photosensitive chip 60. These optical performance requirements include haze and transmittance.

[0043] The screen support layer 36 typically includes a first screen support layer 361 and a second screen support layer 362. The first screen support layer 361 is used to improve reliability, while the second screen support layer 362 is used to provide support. The first screen support layer 361 is located between the display function layer 35 and the second screen support layer 362, and the first screen support layer 361 is bonded to the display function layer 35 and the second screen support layer 362 respectively by corresponding adhesive layers using double-sided adhesive.

[0044] The first screen support layer 361 is made of polyimide (PI), polyethylene terephthalate (PET), or stainless steel (SUS), etc.; the second screen support layer 362 is made of titanium alloy, stainless steel, or carbon fiber, etc. Both the first screen support layer 361 and the second screen support layer 362 have poor transmittance and require openings to allow light to pass through.

[0045] The light-transmitting hole 31 passes through the second screen support layer 362, the first screen support layer 361 and the display function layer 35 in sequence, and the ambient light hole 32 passes through the second screen support layer 362 and the first screen support layer 361 in sequence.

[0046] The light-transmitting hole 31 has a first width W at the second screen support layer 362. 362 The second width W is located at the first screen support layer 361. 361 A third width W is present at the display function layer 35. 35 Based on optical design requirements, the second width W is typically... 361 Greater than the first width W 362 First width W 362 Greater than the third width W 35 .

[0047] Because the width W of the light-transmitting hole 31 at the display functional layer 35 35 Less than the width W at the first screen support layer 361 361 This causes the display functional layer 35 to be suspended at the edge of the light-transmitting hole 31, forming a cantilever (such as...). Figure 2 (Position B in the middle). If the display screen 30 is subjected to an external impact, the display functional layer 35 deforms downwards, and the first screen support layer 361 below it cannot support the cantilever of the display functional layer 35, resulting in excessive deformation of the display functional layer 35. This will cause the display functional layer 35 to fail due to excessive stress, such as power failure or cracking. At the same time, the structural strength of the display screen 30 also decreases at the ambient light hole 32, and the display screen 30 will also deform at the ambient light hole 32 when subjected to an external impact.

[0048] It is evident that when a hole is punched in the display screen 30 to allow the front-facing camera module 50 and the photosensitive chip 60 to sense light, the structural strength of the display screen 30 in the hole area decreases, resulting in lower impact resistance and reliability. Under external impact, the display screen 30 is prone to deformation in the hole area, affecting the use of the electronic device.

[0049] To address the issue of low impact resistance reliability of displays, this application provides a display module 100 that can improve the structural strength of the display module 100 in the opening area, preventing deformation when subjected to external impact, thereby improving impact resistance reliability.

[0050] Figure 4 This is the first structural schematic diagram of the display module provided in the embodiments of this application.

[0051] like Figure 4 As shown, in some embodiments, the display module 100 may include: a support layer 101, a functional layer 102, a cover layer 103, and a protective film layer 104.

[0052] The support layer 101 is used to support the functional layer 102, serving as the back support and protective structure for the functional layer 102. The support layer 101 can improve the structural strength and impact resistance of the display module 100, reduce the probability of deformation of the display module 100 other than normal bending, and ensure the flatness of the display module 100.

[0053] The functional layer 102 can serve as a display panel. The functional layer 102 is used to emit light in order to realize the image display of the display module 100.

[0054] The cover layer 103 is used to protect the functional layer 102 and also reduces the plastic feel of the display module 100.

[0055] The protective film layer 104 is used to protect the cover layer 103 of the electronic device. The material of the protective film layer 104 can be a polymer material or optical glass. Optionally, the optical transmittance of the protective film layer 104 is greater than 90%, which is conducive to the passage of light, increases the amount of light received by the front camera module, and helps to improve image quality and avoid stray light and ghosting.

[0056] The support layer 101 is flexible to allow the display module 100 to be bent; the functional layer 102, the cover layer 103 and the protective film layer 104 can all be made of flexible transparent material, which not only facilitates the passage of light, but also allows the display module 100 to be bent.

[0057] Along the first direction D1, the support layer 101, functional layer 102, cover layer 103, and protective film layer 104 are stacked sequentially. The first direction D1 is the stacking direction and is parallel to the z-axis. For example, adjacent layers of the support layer 101, functional layer 102, cover layer 103, and protective film layer 104 can be bonded together with an adhesive layer. This adhesive layer can be optically transparent adhesive (OCA) or pressure-sensitive adhesive (PSA), etc. Both OCA and PSA adhesives have nearly 100% transmittance and will not obstruct light.

[0058] The functional layer 102 may include a first light-transmitting hole 201, which penetrates the functional layer 102 along a first direction D1.

[0059] The support layer 101 may include a first support layer 1011 and a second support layer 1012 stacked in sequence. The first support layer 1011 is adjacent to the functional layer 102, and the second support layer 1012 is located on the side of the first support layer 1011 that is away from the functional layer 102.

[0060] The first support layer 1011 serves a protective function to improve its impact resistance and reliability. The first support layer 1011 possesses material properties such as high transmittance, low haze, and high modulus, eliminating the need for light-transmitting holes. For example, the first support layer 1011 can be made of ultra-thin glass (UTG).

[0061] The transmittance of the first support layer 1011 is greater than 90%. For example, the transmittance of the first support layer 1011 can be 91%, 93%, 95%, 98%, 99%, etc. In other embodiments, the transmittance of the first support layer 1011 can also be 90%. In this way, without the need to open light-transmitting holes in the first support layer 1011, it is still conducive to the passage of light, so as to increase the amount of light received by the front camera module 50 and improve the light utilization capability of the front camera module 50, which is beneficial to improving image quality and avoiding stray light and ghosting.

[0062] The haze of the first support layer 1011 is less than 0.5%. For example, the haze of the first support layer 1011 can be 0.1%, 0.2%, 0.3%, 0.4%, 0.45%, etc. In other embodiments, the haze of the first support layer 1011 can be 0.5%. In this way, without the need to open light-transmitting holes in the first support layer 1011, the transparency and gloss of the display module 100 can still be improved, thereby improving the quality of light and thus improving the imaging quality of the front camera module 50 and avoiding image blurring.

[0063] The modulus of the first support layer 1011 is greater than 60 GPa. For example, the modulus of the first support layer 1011 can be 61 GPa, 65 GPa, 70 GPa, 75 GPa, 80 GPa, etc. In other embodiments, the modulus of the first support layer 1011 can be 60 GPa. In this way, there is no need to open light-transmitting holes in the first support layer 1011, so that the first support layer 1011 has high structural strength, avoids deformation when subjected to external impact, and thus improves the impact resistance reliability of the first support layer 1011.

[0064] It should be noted that the first support layer 1011 may also be made of other organic polymers or inorganic materials with material properties such as high modulus, high transmittance and low haze, such as acrylic system, epoxy system or transparent ceramic.

[0065] In this embodiment, the first support layer 1011 does not require a light-transmitting hole. The first support layer 1011 can fully cover the first light-transmitting hole 201 of the functional layer 102, thus avoiding the formation of light-transmitting holes in the functional layer 102 at the first light-transmitting hole 201. Figure 2The cantilever structure is shown. When the display module 100 is subjected to an external impact, the functional layer 102, which tends to deform downwards, is supported by the first support layer 1011, resulting in minimal or no deformation of the functional layer 102. Thus, the functional layer 102 is subjected to minimal stress or no applied force and will not fail. It is evident that the first support layer 101 enhances the support of the support layer 101 on the back of the functional layer 102, preventing the functional layer 102 from failing when subjected to external impact in the hole area, thereby improving the impact resistance of the display module 100.

[0066] The second support layer 1012 serves to provide support and flexibility. The second support layer 1012 is made of a metal, such as titanium alloy or stainless steel. In other embodiments, the second support layer 1012 may also be made of carbon fiber.

[0067] The second support layer 1012 may include a second light-transmitting hole 202 and a third light-transmitting hole 203, and the first support layer 1011 covers the second light-transmitting hole 202 and the third light-transmitting hole 203. The third light-transmitting hole 203 is located on one side of the second light-transmitting hole 202, and the second light-transmitting hole 202 and the third light-transmitting hole 203 are spaced apart along the x-axis direction; the first light-transmitting hole 201 is opposite to the second light-transmitting hole 202, and the first light-transmitting hole 201 and the second light-transmitting hole 202 are located on opposite sides of the first support layer 1011.

[0068] Figure 5 This is a schematic diagram of the internal structure of the electronic device provided in an embodiment of this application. Figure 5 Show Figure 1 The cross-sectional structure along the AA direction.

[0069] like Figure 5 As shown, in some embodiments, the first light-transmitting hole 201 and the second light-transmitting hole 202 are both opposite to the front-facing camera module 50. The first light-transmitting hole 201 and the second light-transmitting hole 202 are used for light transmission to enter the lens of the front-facing camera module 50. The third light-transmitting hole 203 is opposite to the photosensitive chip 60, and the photosensitive chip 60 uses the third light-transmitting hole 203 to sense the ambient light intensity.

[0070] Based on optical design requirements, the width W of the first light-transmitting aperture 201 along the x-axis direction is... 201 The width W of the second light-transmitting hole 202 is less than or equal to the width of the second light-transmit 202 The width W of the second light-transmitting hole 202 202 Width W greater than 50mm for the front camera module 50 The width W of the first light-transmitting hole 201 201 Width W of the front camera module 50 50The size can be determined based on the actual situation and is not limited here. This ensures that all the light passing through the first light-transmitting hole 201 can enter the second light-transmitting hole 202 and be received by the lens of the front-facing camera module 50, thereby improving image quality. At the same time, the second light-transmitting hole 202 can be used to avoid obstructing the lens of the front-facing camera module 50. When electronic devices are made thinner and lighter, the lens of the front-facing camera module 50 can be embedded in the second light-transmitting hole 202 to reduce the thickness of the electronic device.

[0071] Based on optical design requirements, the width W of the third light-transmitting aperture 203 along the x-axis direction is... 203 Width W greater than or equal to 60 mm of the photosensitive chip 60 In this way, all the light passing through the third light-transmitting hole 203 can be received by the photosensitive chip 60, thereby improving the accuracy of the photosensitive chip 60 in sensing the ambient light intensity.

[0072] The display module 100 provided in this application embodiment includes a support layer 101 comprising a first support layer 1011 and a second support layer 1012. Light-transmitting holes (such as a first light-transmitting hole 201 and a second light-transmitting hole 202) can be formed in the second support layer 1012 and the functional layer 102, while the first support layer 1011 does not require any light-transmitting holes. Light is received by the front-facing camera module 50 sequentially through the first light-transmitting hole 201, the first support layer 1011, and the second light-transmitting hole 202. The first support layer 1011 has material properties such as high transmittance, low haze, and high modulus. Thus, even without holes in the first support layer 1011, the optical performance requirements of the front-facing camera module 50 and the photosensitive chip 60 can be met. In other words, even without a light-transmitting hole, the first support layer 1011 still allows light to pass through, improving the transparency and gloss of the display module 100, thereby enhancing light quality and ultimately improving the imaging quality of the front-facing camera module 50. Simultaneously, it provides high structural strength, preventing deformation under impact and improving its impact resistance. The first support layer 1011 also enhances its support for the back of the functional layer 102, improving the impact resistance of the display module 100 in the opening area. Furthermore, the third light-transmitting hole 203 is only located within the second support layer 1012 and covered by the first support layer 1011. This reduces the depth of the third light-transmitting hole 203 within the support layer 101, increasing the structural strength of the support layer 101 at the third light-transmitting hole 203, preventing deformation under impact, and improving its impact resistance.

[0073] In some embodiments, the first support layer 1011 may be bonded to adjacent layer structures in the display module 100 using single-sided or double-sided adhesive.

[0074] Figure 6This is a schematic diagram of the first adhesive structure of the first support layer provided in the embodiments of this application.

[0075] like Figure 6 As shown, in the first bonding method, the display module 100 may further include: a first adhesive layer 301.

[0076] The first adhesive layer 301 is located between the first support layer 1011 and the functional layer 102, and the first support layer 1011 is bonded to the functional layer 102 through the first adhesive layer 301.

[0077] The first support layer 1011 and the second support layer 1012 are not bonded together, and there is a first gap between the first support layer 1011 and the second support layer 1012 (not shown in the figure).

[0078] In this way, the first support layer 1011 is bonded to other layers (such as the functional layer 102) using a single layer of first adhesive 301. This allows for an increase in the thickness H of the first support layer 1011 without changing the total thickness of the display module 100. 1011 This further improves the impact resistance reliability of the first support layer 1011.

[0079] Figure 7 This is a schematic diagram of a second adhesive structure for the first support layer provided in an embodiment of this application.

[0080] like Figure 7 As shown, in the second bonding method, the display module 100 may further include a second adhesive layer 302.

[0081] The second adhesive layer 302 is located between the first support layer 1011 and the second support layer 1012, and the first support layer 1011 is bonded to the second support layer 1012 through the second adhesive layer 302.

[0082] The first support layer 1011 and the functional layer 102 are not bonded together, and there is a second gap between the first support layer 1011 and the functional layer 102.

[0083] In this way, the first support layer 1011 is bonded to other layers (such as the second support layer 1012) using a single layer of second adhesive 302. This allows for an increase in the thickness H of the first support layer 1011 without changing the total thickness of the display module 100. 1011 This further improves the impact resistance reliability of the first support layer 1011.

[0084] Figure 8 This is a schematic diagram of a third type of adhesive structure for the first support layer provided in the embodiments of this application.

[0085] like Figure 8As shown, in the third bonding method, the display module 100 may further include: a first adhesive layer 301 and a second adhesive layer 302.

[0086] The first adhesive layer 301 and the second adhesive layer 302 are located on opposite sides of the first support layer 1011; the first adhesive layer 301 is located between the first support layer 1011 and the functional layer 102, and the first support layer 1011 is bonded to the functional layer 102 through the first adhesive layer 301; the second adhesive layer 302 is located between the first support layer 1011 and the second support layer 1012, and the first support layer 1011 is bonded to the second support layer 1012 through the second adhesive layer 302.

[0087] In this way, the first support layer 1011 is bonded to the adjacent layer structure using a double-layered first adhesive layer 301 and a second adhesive layer 302, which can improve the bonding reliability of the first support layer 1011. Although the thickness of this first support layer 1011 is reduced while the total thickness of the display module 100 remains unchanged, the first support layer 1011 still has good impact resistance reliability due to its high modulus.

[0088] In the various bonding methods provided in the embodiments of this application, both the first adhesive layer 301 and the second adhesive layer 302 can be made of PSA adhesive. PSA adhesive has characteristics such as high adhesion, high transmittance, and low haze, allowing the first adhesive layer 301 and the second adhesive layer 302 to meet the optical requirements of the front-facing camera module 50 and the photosensitive chip 60, whether or not holes are cut in them, and ensuring reliable interface bonding. For example, PSA adhesive systems include, but are not limited to, acrylic, polyurethane, and silicone adhesives.

[0089] Figure 9 This is a top view of the display module provided in the embodiments of this application.

[0090] like Figure 9 As shown, in some embodiments, the display module 100 includes a flat area 110 and a bent area 120. The flat area 110 can be understood as a non-bent area, and the two flat areas 110 are located at opposite ends of the bent area 120. (Combined with...) Figure 1 The bending area 120 is opposite to the hinge assembly 40 of the electronic device, and the two planar areas 110 are opposite to the first body 10 and the second body 20 of the electronic device. When the display module 100 is folded or unfolded with the hinge assembly 40, the bending area 120 achieves bending, and the planar areas 110 do not deform.

[0091] One of the planar regions 110 includes a first region 110a, which is the region opposite to the lens module of the electronic device and can cover the lens module. The lens module includes a front-facing camera module 50 and a photosensitive chip 60. For example, the length of the first region 110a along the x-axis can be 10-20 mm, and the width along the y-axis can be 5-10 mm.

[0092] Combination Figure 4 and Figure 9 As shown, the first light-transmitting hole 201, the second light-transmitting hole 202 and the third light-transmitting hole 203 are all located in the first region 110a.

[0093] This design prevents deformation of the light-transmitting holes in the display module 100 during bending, avoiding breakage at these holes and ensuring the flatness of the display module 100, thus meeting the optical performance requirements of the front-facing camera module 50 and the photosensitive chip 60. Furthermore, since both the front-facing camera module 50 and the photosensitive chip 60 are located in the first region 110a, the first light-transmitting hole 201, the second light-transmitting hole 202, and the front-facing camera module 50 will not misalign during bending, and none of them will deform, ensuring the normal operation of the front-facing camera module 50. Similarly, the third light-transmitting hole 203 and the photosensitive chip 60 will not misalign, and neither will deform, ensuring the normal operation of the photosensitive chip 60.

[0094] It should be noted that, from Figure 9 From the top view shown, the visible structure is the protective film layer 104 of the display module 100, while the second support layer 1012 is located below the protective film layer 104. Therefore, the second light-transmitting hole 202 and the third light-transmitting hole 203 on the second support layer 1012 are not visible and are indicated by dashed lines.

[0095] Figure 10 This is a second structural schematic diagram of the display module provided in the embodiments of this application.

[0096] like Figure 10 As shown, in some embodiments, the support layer 101 may further include a third support layer 1013, which is located between the second support layer 1012 and the functional layer 102.

[0097] For example, the material of the third support layer 1013 can be PI, PET or SUS, etc.

[0098] The third support layer 1013 is bonded to the functional layer 102 via the third adhesive layer 303, and the third support layer 1013 is bonded to the second support layer 1012 via the fourth adhesive layer 304. The third adhesive layer 303 and the fourth adhesive layer 304 can be made of the same material as the first adhesive layer 301 and the second adhesive layer 302, which will not be elaborated here.

[0099] Figure 11 This is a partial cross-sectional structural diagram of the support layer provided in an embodiment of this application; Figure 12 This is a top view of the support layer provided in the embodiments of this application.

[0100] like Figure 11 and Figure 12 As shown, in some embodiments, the third support layer 1013 may include a perforated hole 1014, which is opposite to the first region 110a, and the shape and size of the perforated hole 1014 are the same as those of the first region 110a.

[0101] Combination Figure 10 , Figure 11 and Figure 12 The first support layer 1011 is embedded in the perforated hole 1014, and the shape and size of the first support layer 1011 are the same as the shape and size of the perforated hole 1014. In this way, the first support layer 1011 and the third support layer 1013 together form the layer structure of the support layer 101, which serves a protective function.

[0102] by Figure 10 Taking the first support layer 1011 using the third bonding method as an example, the first adhesive layer 301 and the third adhesive layer 303 are located in the same layer and are both adjacent to the functional layer 102, allowing for interfacial bonding between the first adhesive layer 301 and the third adhesive layer 303; the second adhesive layer 302 and the fourth adhesive layer 304 are located in the same layer and are both adjacent to the second support layer 1012, also allowing for interfacial bonding between the second adhesive layer 302 and the fourth adhesive layer 304. This improves the bonding strength between the first support layer 1011 and the third support layer 1013, ensuring their reliability.

[0103] The sum of the thicknesses of the first support layer 1011, the first adhesive layer 301, and / or the second adhesive layer 302 is less than or equal to the sum of the thicknesses of the third support layer 1013, the third adhesive layer 303, and the fourth adhesive layer 304. This avoids adhesion to the molded image.

[0104] Because the material of the third support layer 1013 is different from that of the first support layer 1011, the third support layer 1013 is bendable, while the first support layer 1011 is not bendable. Therefore, the first support layer 1011 can be set only in the first region 110a of the planar region 110, and the shape and size of the first support layer 1011 are the same as the shape and size of the first region 110a.

[0105] It should be noted that, from Figure 12 From the top view shown, the visible structures are the third support layer 1013 and the first support layer 1011 of the support layer 101, while the second support layer 1012 is located below them. Therefore, the second light-transmitting hole 202 and the third light-transmitting hole 203 on the second support layer 1012 are not visible and are represented by dashed lines.

[0106] The display module 100 provided in this application embodiment has a support layer 101 formed by stacking and embedding a first support layer 1011, a second support layer 1012, and a third support layer 1013. In the first region 110a, the third support layer 1013, which does not have high transmittance and low haze, is replaced by the first support layer 1011, which has high transmittance and low haze. The first support layer 1011 does not require holes and covers the first light-transmitting hole 201, the second light-transmitting hole 202, and the third light-transmitting hole 203. In this way, the second support layer 1012 and the third support layer 1013 can be used to achieve bending of the support layer 101, and the first support layer 1011 can be used to improve the back support of the functional layer 102 in the hole area, thereby improving the impact resistance reliability of the display module 100 in the hole area and meeting the optical performance requirements.

[0107] It is understood that the beneficial effects that the display module 100 provided in the embodiments of this application can achieve can be referred to the beneficial effects that the display module 100 provided in the foregoing embodiments can achieve, and will not be repeated here.

[0108] This application embodiment also provides a method for manufacturing a display module, used to manufacture the display module 100 provided in any of the foregoing embodiments. The manufacturing method may include the following steps S100 to S400: Step S100: Provide a support layer 101, a functional layer 102, a cover layer 103, and a protective film layer 104.

[0109] The support layer 101 includes a first support layer 1011 and a second support layer 1012.

[0110] The structural characteristics and functions of the support layer 101, functional layer 102, cover layer 103 and protective film layer 104 can be referred to the content of the foregoing embodiments, and will not be repeated here.

[0111] Step S200: Process the first light-transmitting hole 201 on the functional layer 102.

[0112] Figure 13 This is the first process flow diagram of the manufacturing method of the display module provided in the embodiments of this application.

[0113] like Figure 13As shown in (a), the size of the first light-transmitting hole 201 meets the requirements for light transmission. For details, please refer to the content about the first light-transmitting hole 201 provided in the aforementioned embodiments, which will not be repeated here.

[0114] For example, the processing technology of the first light-transmitting hole 201 includes, but is not limited to, die-cutting or laser cutting.

[0115] Step S300: Process the second light-transmitting hole 202 on the second support layer 1012.

[0116] See you again Figure 13 As shown in (a), the size of the second light-transmitting hole 202 meets the requirements for light transmission. For details, please refer to the content about the second light-transmitting hole 202 provided in the aforementioned embodiments, which will not be repeated here.

[0117] For example, the processing technology of the second light-transmitting hole 202 includes, but is not limited to, die-cutting or laser cutting.

[0118] To facilitate the operation of the photosensitive chip 60, a third light-transmitting hole 203 can also be simultaneously processed on the second support layer 1012. The structural characteristics and functions of the third light-transmitting hole 203 can be found in the description of the third light-transmitting hole 203 provided in the foregoing embodiments, and will not be repeated here.

[0119] It should be noted that the order of steps S200 and S300 is not limited in the embodiments of this application.

[0120] In step S400, the second support layer 1012, the first support layer 1011, the functional layer 102, the cover layer 103 and the protective film layer 104 are stacked in sequence to obtain the display module, with the first light-transmitting hole 201 and the second light-transmitting hole 202 facing each other.

[0121] For details regarding the structural characteristics of the display module 100, please refer to [link / reference]. Figure 4 The contents of the display module 100 shown are not described here.

[0122] In some embodiments, the support layer 101 further includes a third support layer 1013, see [link to documentation]. Figure 13 In section (a), the third support layer 1013 includes a perforated hole 1014. The processing technology of the perforated hole 1014 includes, but is not limited to, die-cutting or laser cutting.

[0123] It should be noted that the structural characteristics and functions of the third support layer 1013 and the hollow hole 1014 can be referred to the relevant content of the aforementioned embodiments, and will not be repeated here.

[0124] In some embodiments, the bonding methods used between the first support layer 1011 and the adjacent layer structures are different, resulting in different stacking methods for each layer structure, and thus different structures for forming the display module 100.

[0125] When the first support layer 1011 adopts the first bonding method, step S400 may further include the following steps S411 to S413: Step S411: Stack the second support layer 1012 and the third support layer 1013 in sequence to obtain the first structural component.

[0126] like Figure 13 As shown in (b), a third adhesive layer 303 and a fourth adhesive layer 304 are respectively attached to the opposite sides of the third support layer 1013. Neither the third adhesive layer 303 nor the fourth adhesive layer 304 covers the perforated hole 1014.

[0127] The second support layer 1012 is bonded to the fourth adhesive layer 304 to achieve the stacking of the second support layer 1012 and the third support layer 1013. The second light-transmitting hole 202 and the third light-transmitting hole 203 on the second support layer 1012 are opposite to and connected to the hollow hole 1014 on the third support layer 1013.

[0128] In step S412, the functional layer 102, the cover layer 103, and the protective film layer 104 are stacked in sequence, and the first support layer 1011 is bonded to the functional layer 102 by the first adhesive layer 301 to obtain the second structural component.

[0129] like Figure 13 As shown in (c), the functional layer 102, the cover layer 103, and the protective film layer 104 can be bonded together with an adhesive layer. The first support layer 1011 covers the first light-transmitting hole 201 on the functional layer 102.

[0130] It should be noted that the order of steps S411 and S412 is not limited in the embodiments of this application.

[0131] Step S413: Stack the first structural component and the second structural component to embed the first support layer 1011 into the hollow hole 1014.

[0132] like Figure 13 As shown in (d), the second structural member is embedded in the first structural member, such that the third support layer 1013 is bonded to the functional layer 102 through the third adhesive layer 303, the first light-transmitting hole 201 is opposite to the second light-transmitting hole 202, and the first support layer 1011 and the second support layer 1012 are not bonded and have a first gap, thus obtaining the first display module 100.

[0133] Combination Figure 6As shown, the first support layer 1011 is bonded to other layers (such as the functional layer 102) using a single-layer first adhesive layer 301. This allows for an increase in the thickness H of the first support layer 1011 while maintaining the overall thickness of the display module 100. 1011 The thickness H of the first support layer 1011 1011 The thickness H is greater than that of the third support layer 1013. 1013 This improves the impact resistance reliability of the first support layer 1011.

[0134] The first adhesive layer 301 and the third adhesive layer 303 achieve interfacial bonding, and the fourth adhesive layer 304 is bonded to the side surface of the first support layer 1011. In this way, the bonding strength between the first support layer 1011 and the third support layer 1013 can be improved, ensuring the bonding reliability of the first support layer 1011 and the third support layer 1013.

[0135] It is understood that the cover layer 103 and the protective film layer 104 can also be stacked after the second structural member is fitted with the first structural member, that is, the cover layer 103 and the protective film layer 104 are not stacked in step S412. In this scenario, the second structural member includes a stacked structure of the first support layer 1011 and the functional layer 102. The embodiments of this application do not limit the stacking order of the cover layer 103 and the protective film layer 104.

[0136] It should be noted that the specific content, structural characteristics, and beneficial effects of each of the above steps can be referred to the corresponding content of the aforementioned display module embodiment, and will not be repeated here.

[0137] Figure 14 This is the second process flow diagram of the manufacturing method of the display module provided in the embodiments of this application.

[0138] like Figure 14 As shown, this application embodiment provides a second method for manufacturing a display module, in which, Figure 14 The content shown in (a) can be referred to in steps S100 to S300, and will not be repeated here.

[0139] When the first support layer 1011 adopts the second bonding method, step S400 may further include the following steps S421 to S423: Step S421: Stack the second support layer 1012 and the third support layer 1013 in sequence.

[0140] like Figure 14 As shown in (b), a third adhesive layer 303 and a fourth adhesive layer 304 are respectively attached to the opposite sides of the third support layer 1013. Neither the third adhesive layer 303 nor the fourth adhesive layer 304 covers the perforated hole 1014.

[0141] The second support layer 1012 is bonded to the fourth adhesive layer 304 to achieve the stacking of the second support layer 1012 and the third support layer 1013. The second light-transmitting hole 202 and the third light-transmitting hole 203 on the second support layer 1012 are opposite to and connected to the hollow hole 1014 on the third support layer 1013.

[0142] In step S422, the first support layer 1011 is embedded into the hollow hole 1014 of the third support layer 1013, and the first support layer 1011 is bonded to the second support layer 1012 through the second adhesive layer 302.

[0143] like Figure 14 As shown in (c), a second adhesive layer 302 is attached to one surface of the first support layer 1011, with the second adhesive layer 302 facing downwards, and the first support layer 1011 is embedded in the hollow hole 1014. The first support layer 1011 covers the second light-transmitting hole 202 and the third light-transmitting hole 203.

[0144] Combination Figure 7 As shown, the first support layer 1011 is bonded to other layers (such as the second support layer 1012) using a single-layer second adhesive layer 302. This allows for an increase in the thickness H of the first support layer 1011 while maintaining the total thickness of the display module 100. 1011 The thickness H of the first support layer 1011 1011 The thickness H is greater than that of the third support layer 1013. 1013 This improves the impact resistance reliability of the first support layer 1011.

[0145] The second adhesive layer 302 and the fourth adhesive layer 304 achieve interfacial bonding, and the third adhesive layer 303 is bonded to the side surface of the first support layer 1011. In this way, the bonding strength between the first support layer 1011 and the third support layer 1013 can be improved, ensuring the bonding reliability of the first support layer 1011 and the third support layer 1013.

[0146] In step S423, a functional layer 102, a cover layer 103, and a protective film layer 104 are sequentially stacked on the side surface of the first support layer 1011 and the third support layer 1013 facing away from the second support layer 1012.

[0147] like Figure 14 As shown in (d), the functional layer 102 is bonded to the third support layer 1013 through the third adhesive layer 303, the functional layer 102 and the first support layer 1011 are not bonded and have a second gap, and the first light-transmitting hole 201 and the second light-transmitting hole 202 are opposite to each other, thus obtaining the second type of display module 100.

[0148] It should be noted that the specific content, structural characteristics, and beneficial effects of each of the above steps can be referred to the corresponding content of the aforementioned display module embodiment, and will not be repeated here.

[0149] Figure 15 This is the third process flow diagram of the manufacturing method of the display module provided in the embodiments of this application.

[0150] like Figure 15 As shown, this application provides a third method for manufacturing a display module, in which... Figure 15 The content shown in (a) can be referred to in steps S100 to S300, and will not be repeated here.

[0151] When the first support layer 1011 adopts a third bonding method, step S400 may further include the following steps S431 to S433: Step S431: Stack the second support layer 1012 and the third support layer 1013 in sequence.

[0152] like Figure 15 As shown in (b), the relevant content of step S431 can be referred to the content of step S421, and will not be repeated here.

[0153] Step S432: The first support layer 1011 is embedded into the hollow hole 1014 to form the support layer 101.

[0154] like Figure 15 As shown in (c), a first adhesive layer 301 and a second adhesive layer 302 are respectively attached to two opposite surfaces of the first support layer 1011, and the first support layer 1011 is embedded in the hollow hole 1014 of the third support layer 1013. The first support layer 1011 is bonded to the second support layer 1012 through the second adhesive layer 302, so that the support layer 101 is formed by the first support layer 1011, the second support layer 1012 and the third support layer 1013.

[0155] The first adhesive layer 301 and the third adhesive layer 303 achieve interfacial bonding, and the second adhesive layer 302 and the fourth adhesive layer 304 achieve interfacial bonding. In this way, the bonding strength between the first support layer 1011 and the third support layer 1013 can be improved, ensuring the bonding reliability of the first support layer 1011 and the third support layer 1013.

[0156] In step S433, a functional layer 102, a cover layer 103, and a protective film layer 104 are sequentially stacked on the side surface of the first support layer 1011 and the third support layer 1013 facing away from the second support layer 1012.

[0157] like Figure 15As shown in (d), the functional layer 102 is bonded to the third support layer 1013 through the third adhesive layer 303, and to the first support layer 1011 through the first adhesive layer 301. The first light-transmitting hole 201 and the second light-transmitting hole 202 are opposite to each other, thus obtaining the third type of display module 100.

[0158] Combination Figure 8 As shown, the first support layer 1011 is bonded to adjacent layer structures (such as the second support layer 1012 and the functional layer 102) using a double-layered first adhesive layer 301 and second adhesive layer 302, which can improve the bonding reliability of the first support layer 1011. In this scenario, the thickness H of the first support layer 1011 1011 The thickness H can be less than or equal to that of the third support layer 1013. 1013 .

[0159] It should be noted that the specific content, structural characteristics, and beneficial effects of each of the above steps can be referred to the corresponding content of the aforementioned display module embodiment, and will not be repeated here.

[0160] The method for manufacturing a display module provided in this application embodiment involves a display module 100 in which a support layer 101 is formed by a first support layer 1011, a second support layer 1012, and a third support layer 1013. Light-transmitting holes (such as a first light-transmitting hole 201 and a second light-transmitting hole 202) are processed in the second support layer 1012 and the functional layer 102. The first support layer 1011 does not require any light-transmitting holes; light is received by the front-facing camera module 50 sequentially through the first light-transmitting hole 201, the first support layer 1011, and the second light-transmitting hole 202. The first support layer 1011 possesses material properties such as high transmittance, low haze, and high modulus. Thus, even without holes in the first support layer 1011, the optical performance requirements of the front-facing camera module 50 and the photosensitive chip 60 can be met. In other words, even without a light-transmitting hole, the first support layer 1011 still allows light to pass through, improving the transparency and gloss of the display module 100, thereby enhancing light quality and ultimately improving the imaging quality of the front-facing camera module 50. Simultaneously, it provides high structural strength, preventing deformation under impact and improving its impact resistance. The first support layer 1011 also enhances its support for the back of the functional layer 102, improving the impact resistance of the display module 100 in the opening area. Furthermore, the third light-transmitting hole 203 is only located within the second support layer 1012 and covered by the first support layer 1011. This reduces the depth of the third light-transmitting hole 203 within the support layer 101, increasing the structural strength of the support layer 101 at the third light-transmitting hole 203, preventing deformation under impact, and improving its impact resistance.

[0161] See you again Figure 1 This application also provides an electronic device, including a lens module, a body, and a display module 100 provided in any of the foregoing embodiments.

[0162] The display module 100 covers the body; when the electronic device is a foldable screen device, the body includes a first body 10 and a second body 20, and the display module 100 covers the first body 10 and the second body 20.

[0163] Combination Figure 5 As shown, the lens module is located between the display module 100 and the first body 10. The lens module includes a front-facing camera module 50 and an image sensor chip 60. The front-facing camera module 50 is opposite to the first light-transmitting hole 201 and the second light-transmitting hole 202 on the display module 100. Light enters the lens of the front-facing camera module 50 through the first light-transmitting hole 201, the first support layer 1011, and the second light-transmitting hole 202. The image sensor chip 60 is opposite to the third light-transmitting hole 203, and the image sensor chip 60 uses the third light-transmitting hole 203 to sense the ambient light intensity.

[0164] It should be noted that the specific structural characteristics of electronic devices can be found by referring to... Figure 1 and Figure 5 The relevant details of the electronic devices shown are not elaborated here.

[0165] The electronic device provided in this application embodiment includes a display module 100 with good optical performance and good shock resistance reliability. Even when subjected to external impact, it can still ensure the normal use of the electronic device and improve the user experience.

[0166] It should be noted that those skilled in the art, upon considering the specification and practicing the application disclosed herein, will readily conceive of other embodiments of this application. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope of this application is indicated by the following claims.

[0167] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A display module, characterized in that, include: The support layer (101), functional layer (102), cover layer (103) and protective film layer (104) are stacked in sequence. The functional layer (102) includes a first light-transmitting hole (201); The support layer (101) includes a first support layer (1011) and a second support layer (1012) stacked in sequence. The first support layer (1011) is adjacent to the functional layer (102), and the second support layer (1012) is located on the side of the first support layer (1011) away from the functional layer (102). The second support layer (1012) includes a second light-transmitting hole (202), and the first light-transmitting hole (201) is opposite to the second light-transmitting hole (202).

2. The display module according to claim 1, characterized in that, It also includes: the first adhesive layer (301); The first support layer (1011) is bonded to the functional layer (102) through the first adhesive layer (301); There is a first gap between the first support layer (1011) and the second support layer (1012).

3. The display module according to claim 1, characterized in that, It also includes: a second adhesive layer (302); The first support layer (1011) is bonded to the second support layer (1012) through the second adhesive layer (302); There is a second gap between the first support layer (1011) and the functional layer (102).

4. The display module according to claim 1, characterized in that, It also includes: a first adhesive layer (301) and a second adhesive layer (302); The first adhesive layer (301) and the second adhesive layer (302) are located on opposite sides of the first support layer (1011); The first support layer (1011) is bonded to the functional layer (102) through the first adhesive layer (301); The first support layer (1011) is bonded to the second support layer (1012) through the second adhesive layer (302).

5. The display module according to claim 1, characterized in that, The first support layer (1011) is made of one of the following materials: ultra-thin glass UTG, acrylic system, epoxy system, or transparent ceramic. The second support layer (1012) is made of metal.

6. The display module according to claim 5, characterized in that, The transmittance of the first support layer (1011) is greater than 90%; The haze of the first support layer (1011) is less than 0.5%; The modulus of the first support layer (1011) is greater than 60 GPa.

7. The display module according to claim 1, characterized in that, It also includes: a planar area (110) and a bending area (120), the two planar areas (110) being located at opposite ends of the bending area (120); One of the planar regions (110) includes a first region (110a), which is a region opposite to the lens module of the electronic device; The first light-transmitting hole (201) and the second light-transmitting hole (202) are located in the first region (110a).

8. The display module according to claim 7, characterized in that, The support layer (101) further includes a third support layer (1013), which is located between the second support layer (1012) and the functional layer (102); The third support layer (1013) includes a perforated hole (1014) which is opposite to the first region (110a); The first support layer (1011) is embedded in the hollow hole (1014).

9. The display module according to claim 8, characterized in that, The third support layer (1013) is made of polyimide (PI), polyethylene terephthalate (PET), or stainless steel (SUS).

10. The display module according to claim 7, characterized in that, The second support layer (1012) also includes a third light-transmitting hole (203); The third light-transmitting hole (203) is located on one side of the second light-transmitting hole (202) and in the first region (110a).

11. A method for manufacturing a display module, used to manufacture a display module as described in any one of claims 1-10, characterized in that, The manufacturing method includes: A support layer (101), a functional layer (102), a cover layer (103), and a protective film layer (104) are provided; wherein the support layer (101) includes a first support layer (1011) and a second support layer (1012). A first light-transmitting hole (201) is processed on the functional layer (102); A second light-transmitting hole (202) is processed on the second support layer (1012); The second support layer (1012), the first support layer (1011), the functional layer (102), the cover layer (103), and the protective film layer (104) are stacked in sequence to obtain the display module, wherein the first light-transmitting hole (201) is opposite to the second light-transmitting hole (202).

12. The manufacturing method according to claim 11, characterized in that, The support layer (101) further includes a third support layer (1013), the third support layer (1013) including perforations (1014); and, The sequential stacking of the second support layer (1012), the first support layer (1011), the functional layer (102), the cover layer (103), and the protective film layer (104) includes: The second support layer (1012) and the third support layer (1013) are stacked sequentially to obtain the first structural component; The functional layer (102), the cover plate layer (103), and the protective film layer (104) are stacked in sequence, and the first support layer (1011) is bonded to the functional layer (102) by the first adhesive layer (301) to obtain the second structural component; The first structural component and the second structural component are stacked to embed the first support layer (1011) into the hollow hole (1014).

13. The manufacturing method according to claim 11, characterized in that, The support layer (101) further includes a third support layer (1013), the third support layer (1013) including perforations (1014); and, The sequential stacking of the second support layer (1012), the first support layer (1011), the functional layer (102), the cover layer (103), and the protective film layer (104) includes: The second support layer (1012) and the third support layer (1013) are stacked sequentially. The first support layer (1011) is embedded into the hollow hole (1014) to form the support layer (101). The functional layer (102), the cover layer (103), and the protective film layer (104) are stacked sequentially on the side of the first support layer (1011) and the third support layer (1013) away from the second support layer (1012).

14. An electronic device, characterized in that, Includes a front-facing camera module, a body, and a display module as described in any one of claims 1-10; The display module covers the body of the device; The front-facing camera module is located between the display module and the body, and is opposite to the first light-transmitting hole (201) and the second light-transmitting hole (202) on the display module. Light enters the lens of the front-facing camera module through the first light-transmitting hole (201), the first support layer (1011) and the second light-transmitting hole (202).

Images