Electronic device

Abstract

The embodiment of the invention provides electronic equipment which is used for improving the phenomenon that the communication performance of a communication component is poor. The electronic equipment comprises a shell, a first feed radiator, a second feed radiator, a third feed radiator and a communication assembly. The first feed radiator, the second feed radiator and the third feed radiator are all arranged on the shell. The communication assembly comprises a first communication chip, a switching circuit, a second communication chip and a first radio frequency front end. The first communication chip is coupled with the first feed radiator, and the switching circuit is respectively coupled with the first communication chip and the second feed radiator; the second communication chip is coupled with the first radio frequency front end, and the first radio frequency front end is respectively coupled with the switching circuit and the third feed radiator. The first communication chip is selectively coupled with the second feed radiator or the third feed radiator through the switching circuit, so that the radiation coverage range of the feed radiator coupled with the first communication chip is increased, and the communication performance is improved.

Description

Technical Field

[0001] This application relates to the field of communication technology, specifically to an electronic device. Background Technology

[0002] Terminal electronic devices integrate multiple wireless communication functions. These wireless communication functions can include short-range wireless communication functions based on Bluetooth and Wi-Fi. In certain scenarios, short-range wireless communication antennas in related electronic devices (such as mobile phones) exhibit poor communication performance. Summary of the Invention

[0003] This application provides an electronic device for improving the poor communication performance of short-range wireless communication antennas.

[0004] To achieve the above objectives, the embodiments of this application provide the following solutions:

[0005] On one hand, an electronic device is provided, including a housing, a first feed radiator, a second feed radiator, a third feed radiator, and a communication component. The housing encloses a predetermined area; the first feed radiator, the second feed radiator, and the third feed radiator are all disposed on the housing; the communication component is located within the predetermined area.

[0006] The communication component includes a first communication chip, a switching circuit, a second communication chip, and a first radio frequency (RF) front-end. The first communication chip is coupled to a first feed radiator, which is used to transmit and receive RF signals in a first frequency band and a second frequency band, which are communication frequency bands of different communication standards. The switching circuit is coupled to both the first communication chip and the second feed radiator. The second communication chip is coupled to the first RF front-end, which is coupled to both the switching circuit and a third feed radiator.

[0007] When the switching circuit is in the first state, the first communication chip is coupled to the second feed radiator through the switching circuit. The second feed radiator is used to transmit and receive radio frequency signals in the first frequency band and the second frequency band. The second communication chip is coupled to the third feed radiator through the first radio frequency front end. When the switching circuit is in the second state, the first communication chip is coupled to the third feed radiator through the switching circuit and the first radio frequency front end. The third feed radiator is used to transmit and receive radio frequency signals in the first frequency band and the second frequency band.

[0008] Compared to related technologies where the first communication chip uses a first or second feed radiator for communication, the embodiments of this application can change the switching state of the switching circuit, so that while the first communication chip is coupled with the first feed radiator, it can selectively couple with the second or third feed radiator through the switching circuit, thereby increasing the radiation coverage of the feed radiator coupled with the first communication chip and improving communication performance.

[0009] The first frequency band's radio frequency signal is a Bluetooth signal, and the second frequency band's radio frequency signal is a Wi-Fi signal. For example, when the switching circuit is in the first state, the first communication chip can communicate through the first and second feed radiators, thereby transmitting and receiving Bluetooth and Wi-Fi signals. When the switching circuit is in the second state, the first communication chip can communicate through the first and third feed radiators, thereby transmitting and receiving Bluetooth and Wi-Fi signals; that is, the first communication chip communicates through the first feed radiator while also multiplexing the cellular antenna for communication.

[0010] In some embodiments, the communication component further includes a first switch, which is multiplexed as at least a portion of the switches of the first radio frequency front end. The first switch is coupled to the second communication chip, the third feed radiator, and the switching circuit. When the switching circuit is in a second state and the first switch is in a third state, the first communication chip is coupled to the third feed radiator through the switching circuit and the first switch.

[0011] By adopting the above settings, the current cellular communication channel design remains unchanged, requiring no additional components and thus avoiding insertion losses, which in turn prevents interference with other hardware. Simultaneously, it also helps to improve the integration of communication components and reduce their footprint.

[0012] In some embodiments, the electronic device further includes a fourth feed radiator disposed on the housing, and the first switch is coupled to the fourth feed radiator. When the switching circuit is in the second state and the first switch is in the fourth state, the first communication chip is coupled to the fourth feed radiator through the switching circuit and the first switch. The fourth feed radiator is used to transmit and receive radio frequency signals in the first frequency band and the second frequency band. By providing a fourth feed radiator, it is beneficial to further increase the radiation coverage range of the feed radiator and improve communication performance.

[0013] In some embodiments, when the switching circuit is in the second state and the first switch is in the third state, the second communication chip is coupled to the fourth feed radiator through the first switch, and the fourth feed radiator is used to transmit and receive radio frequency signals in the third frequency band. When the switching circuit is in the third state and the first switch is in the fourth state, and the second communication chip is coupled to the third feed radiator through the first switch, the third feed radiator is used to transmit and receive radio frequency signals in the third frequency band.

[0014] In some embodiments, the communication component further includes a second radio frequency (RF) front end, which is coupled to both the second communication chip and the first switch. When the switching circuit is in the first state, the second communication chip is coupled to a fourth feed radiator via the first RF front end. The fourth feed radiator is used to transmit and receive RF signals in the third frequency band. The second communication chip is coupled to a third feed radiator via the second RF front end and the first switch. The third feed radiator is used to receive RF signals in the third frequency band. Alternatively, when the switching circuit is in the first state, the second communication chip is coupled to the third feed radiator via the first RF front end. The third feed radiator is used to transmit and receive RF signals in the third frequency band. The second communication chip is coupled to the fourth feed radiator via the second RF front end and the first switch. The fourth feed radiator is used to receive RF signals in the third frequency band.

[0015] With the above settings, when the switching circuit is in the first state, the third feed radiator can be used as a main antenna and the fourth feed radiator can be used as a diversity antenna, or the third feed radiator can be used as a diversity antenna and the fourth feed radiator can be used as a main antenna.

[0016] In some embodiments, the electronic device further includes an arbitration module, which is coupled to a first communication chip, a first switch, and a switching circuit. The first communication chip is used to acquire first signal information of the second feed radiator, second signal information of the third feed radiator, and third signal information of the fourth feed radiator. The arbitration module is used to control the switching circuit to switch to a first state or a second state, and to control the first switch to switch to a third state or a fourth state, based on the first signal information, the second signal information, and the third signal information.

[0017] With the above settings, the arbitration module can control the first communication chip to selectively couple with the one of the three feed radiators with the best communication performance.

[0018] In some embodiments, the first signal information, the second signal information, and the third signal information each include one or more combinations of signal strength, throughput, and signal-to-noise ratio. With the above configuration, the first communication chip can obtain the feed radiator with optimal communication performance by comparing the signal strength, throughput, and signal-to-noise ratio of the first signal information, the second signal information, and the third signal information.

[0019] In some embodiments, the communication component further includes a third radio frequency (RF) front-end and a fourth RF front-end. A switching circuit is coupled to a first port of the first communication chip, the third RF front-end, and the fourth RF front-end, respectively. The third RF front-end is coupled to a second feed radiator, and the fourth RF front-end is coupled to the first RF front-end. The first port of the first communication chip is used to alternately transmit and receive RF signals in a first frequency band and RF signals in a second frequency band. When the switching circuit is in the first state, the first port of the first communication chip is coupled to the second feed radiator through the switching circuit and the third RF front-end. When the switching circuit is in the second state, the first port of the first communication chip is coupled to the third feed radiator through the switching circuit, the fourth RF front-end, and the first RF front-end.

[0020] Based on the above configuration, the second, third, and fourth feed radiators can achieve time-division multiplexing of Wi-Fi and Bluetooth communication.

[0021] In some embodiments, the first port of the first communication chip may include a first Bluetooth receiving port and a first Bluetooth transmitting port, and the switching circuit includes a second switch. The first port of the second switch is coupled to the first Bluetooth transmitting port, the second port of the second switch is coupled to a third RF front-end, the third port of the second opening is coupled to a fourth RF front-end, and the third RF front-end is coupled to the first Bluetooth receiving port. The first Bluetooth receiving port and the first Bluetooth transmitting port operate alternately. The first Bluetooth transmitting port is used to transmit RF signals of the first frequency band, and the first Bluetooth receiving port is used to receive RF signals of the first frequency band. When the switching circuit is in the second state, the first Bluetooth receiving port is coupled to the second feed radiator through the third RF front-end when it is operating; when the switching circuit is in the third state, the first Bluetooth transmitting port is coupled to the third feed radiator through the fourth RF front-end when it is operating. Through the above configuration, the feed radiator can achieve the effect of time-division multiplexing Bluetooth communication.

[0022] In some embodiments, the first port of the first communication chip may include a first Wi-Fi receiving port and a first Wi-Fi transmitting port, and the switching circuit includes a third switch. The first port of the third switch is coupled to the first Wi-Fi transmitting port, the second port of the third switch is coupled to the first Wi-Fi receiving port, the third and fourth ports of the third switch are both coupled to a third radio frequency front-end, and the fifth and sixth ports of the third switch are both coupled to a fourth radio frequency front-end; the first Wi-Fi receiving port is coupled to a first Bluetooth receiving port. The first Wi-Fi receiving port and the first Wi-Fi transmitting port operate alternately. The first Wi-Fi transmitting port is used to transmit radio frequency signals in the second frequency band, and the first Wi-Fi receiving port is used to receive radio frequency signals in the second frequency band. When the switching circuit is in the second state, the first Wi-Fi receiving port is coupled to the second feed radiator through the third radio frequency front-end; when the switching circuit is in the third state, the first Wi-Fi transmitting port is coupled to the third feed radiator through the fourth radio frequency front-end. Through the above configuration, the feed radiator can achieve the effect of time-division multiplexing Wi-Fi communication.

[0023] In some embodiments, the communication component further includes a fifth radio frequency (RF) front-end, which is coupled to a second port of the first communication chip and a first feed radiator. The second port of the first communication chip is used to alternately transmit and receive RF signals of a first frequency band and RF signals of a second frequency band. During operation, the second port of the first communication chip is coupled to the first feed radiator via the fifth RF front-end. With this configuration, the first feed radiator can achieve time-division multiplexing of Wi-Fi and Bluetooth communication.

[0024] In some embodiments, the housing includes a frame, and the first feed radiator, the second feed radiator, the third feed radiator, and the fourth feed radiator are all disposed on the frame. This arrangement improves the structural compactness of the electronic device and also prevents the frame from affecting the outward radiation of signals from the feed radiators.

[0025] In some embodiments, the first frequency band can be the Bluetooth band, and the second frequency band can be the Wi-Fi band. That is, the radio frequency signal of the first frequency band is a Bluetooth signal, and the radio frequency signal of the second frequency band is a Wi-Fi signal. With the above configuration, the first feed radiator can be used as an antenna to transmit and receive Bluetooth signals and Wi-Fi signals.

[0026] In some embodiments, the third frequency band can be a cellular frequency band. That is, the radio frequency signal of the third frequency band is a cellular signal. With the above configuration, when the third and fourth feed radiators are coupled to the second communication chip, they can be used as cellular antennas.

[0027] In some embodiments, the frame includes a first side and a second side, and a third side and a fourth side connecting the first side and the second side respectively, the first side, the second side, the third side, and the fourth side together enclosing a preset area. The first feed radiator, the second feed radiator, the third feed radiator, and the fourth feed radiator are respectively disposed on different sides of the frame. Through the above arrangement, the first feed radiator, the second feed radiator, the third feed radiator, and the fourth feed radiator can be relatively dispersed on the frame, ensuring the isolation between adjacent feed radiators.

[0028] In some embodiments, the electronic device further includes a rotating mechanism. The frame includes a first portion and a second portion, which are foldably connected via the rotating mechanism. The first portion includes a first side, a first sub-side, and a second sub-side. The second portion includes a second side, a third sub-side, and a fourth sub-side. The third side includes the first sub-side and the third sub-side, and the fourth side includes the second sub-side and the fourth sub-side. A first communication chip and a switching circuit are located within the space enclosed by the first portion and the rotating mechanism. A first radio frequency front-end and a second communication chip are located within the space enclosed by the second portion and the rotating mechanism. A first feed radiator and a second feed radiator are disposed in the first portion, and a third feed radiator and a fourth feed radiator are disposed in the second portion. This arrangement allows the first, second, third, and fourth feed radiators to be relatively dispersed on the frame, ensuring isolation between adjacent feed radiators.

[0029] In some embodiments, the electronic device further includes a rotating mechanism. The frame includes a first portion and a second portion, which are foldably connected via the rotating mechanism. The electronic device also includes a fourth feed radiator. The communication component is located within the space enclosed by the first portion and the rotating mechanism. Three of the first, second, third, and fourth feed radiators are located on different sides of the first portion. This arrangement allows the first, second, third, and fourth feed radiators to be relatively dispersed on the frame, ensuring isolation between adjacent feed radiators.

[0030] In some embodiments, the distance between two adjacent feed radiators on the same side of the frame is greater than 10 mm. This configuration ensures sufficient isolation between adjacent feed radiators. Attached Figure Description

[0031] Figure 1 An exploded view of the structure of an electronic device provided in an embodiment of this application;

[0032] Figure 2 A structural diagram of an electronic device provided for embodiments of related technologies;

[0033] Figure 3 A structural diagram of an electronic device provided in an embodiment of this application;

[0034] Figure 4 This is a structural diagram of a switching circuit of an electronic device in a first state, provided in an embodiment of this application.

[0035] Figure 5 A structural diagram of a switching circuit of an electronic device in a second state, provided in an embodiment of this application;

[0036] Figure 6 A structural diagram of another electronic device provided in an embodiment of this application;

[0037] Figure 7 This is a structural diagram of an electronic device provided in an embodiment of the present application, showing the switching circuit in a first state and the first switch in a third state.

[0038] Figure 8 This is a structural diagram of an electronic device provided in an embodiment of the present application, showing the switching circuit in a second state and the first switch in a fourth state.

[0039] Figure 9 This is a structural diagram of a switching circuit of an electronic device in a first state, provided in an embodiment of this application.

[0040] Figure 10 A structural diagram of the switching circuit of another electronic device provided in an embodiment of this application in a first state;

[0041] Figure 11 A structural diagram of another electronic device provided in an embodiment of this application;

[0042] Figure 12 A structural diagram of another electronic device provided in an embodiment of this application;

[0043] Figure 13 A location distribution diagram of a feed radiator for an electronic device provided in an embodiment of this application;

[0044] Figure 14 This application provides a radiation pattern of a feed radiator in an electronic device.

[0045] Figure 15 A structural diagram illustrating the transition of an electronic device between a folded state and a flat state, provided in an embodiment of this application;

[0046] Figure 16 This is a structural diagram of an electronic device in a flat state, provided as an embodiment of this application;

[0047] Figure 17 A location distribution diagram of a feed radiator for an electronic device provided in an embodiment of this application;

[0048] Figure 18 A location distribution diagram of the feed radiator of another electronic device provided in an embodiment of this application;

[0049] Figure 19 A location distribution diagram of the feed radiator of another electronic device provided in an embodiment of this application;

[0050] Figure 20 A location distribution diagram of the feed radiator of another electronic device provided in an embodiment of this application;

[0051] Figure 21 A location distribution diagram of the feed radiator of another electronic device provided in an embodiment of this application. Detailed Implementation

[0052] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0053] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0054] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0055] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection / linking" should be interpreted broadly, and may refer to a mechanical connection or a physical connection. That is, A and B being connected or linked may mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0056] Communication connection: This can refer to the transmission of electrical signals, such as wireless communication connections and / or wired communication connections. Wireless communication connections do not require a physical medium and are not considered connections that limit the structure of a product.

[0057] Coupling can be understood as direct coupling and / or indirect coupling. "Coupled connection" can be understood as a direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection," which can be understood as physical contact and electrical conduction between components; it can also be understood as the form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Indirect coupling" can be understood as electrical conduction between two conductors through a gap / non-contact method. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gaps between two conductive parts.

[0058] Connection: The process of making two or more components conduct or connect through the above-mentioned "electrical connection" or "indirect coupling" to transmit signals / energy can be called connection.

[0059] A radiator, or antenna stub, is a device in an antenna used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The receiving radiator converts electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0060] Radiators (or antenna stubs) may include conductors with specific shapes and sizes, such as wires or sheets, and this application does not limit the specific shape. In one embodiment, a wire radiator may be simply referred to as a wire antenna. In one embodiment, a wire radiator may be implemented by a conductive frame, and may also be referred to as a frame antenna. In one embodiment, a wire radiator may be implemented by a support conductor, and may also be referred to as a support antenna. In one embodiment, the wire diameter (e.g., including thickness and width) of the wire radiator, or the radiator of the wire antenna, is much smaller than the wavelength (e.g., the wavelength of the medium) (e.g., less than 1 / 16 of the wavelength), and the length may be comparable to the wavelength (e.g., the wavelength of the medium) (e.g., a length of approximately 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of wire antennas include dipole antennas, half-wave dipole antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFAs). For example, in a dipole antenna, each dipole antenna typically includes two radiating stubs, each fed from the feed end of the radiating stub by a feed section. For example, an inverted-F antenna (IFA) can be considered as a monopole antenna with an added ground path. An IFA antenna has one feed point and one ground point, and is called an inverted-F antenna because its side view is inverted-F shaped. In one embodiment, the sheet radiator may include a microstrip antenna or a patch antenna, such as a planar inverted-F antenna (also known as a PIFA). In one embodiment, the sheet radiator may be implemented using a planar conductor (e.g., a conductive sheet or conductive coating). In one embodiment, the sheet radiator may include a conductive sheet, such as a copper sheet. In one embodiment, the sheet radiator may include a conductive coating, such as silver paste. The shape of the sheet radiator includes circular, rectangular, and annular shapes, and this application does not limit the specific shape. The structure of a microstrip antenna generally consists of a dielectric substrate, a radiator, and a ground plane, wherein the dielectric substrate is disposed between the radiator and the ground plane.

[0061] Radiators (or antenna stubs) may also include slots or gaps formed on a conductor, for example, closed or semi-closed slots or gaps formed on a grounded conductor surface. In one embodiment, a slotted or slit radiator may be simply referred to as a slot antenna or a gap antenna. In one embodiment, the radial dimension (e.g., including width) of the slot or gap of the slot antenna / gap antenna is much smaller than the wavelength (e.g., the dielectric wavelength) (e.g., less than 1 / 16 of the wavelength), while the length dimension may be comparable to the wavelength (e.g., the dielectric wavelength) (e.g., a length of approximately 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). In one embodiment, a radiator with a closed slot or gap may be simply referred to as a closed slot antenna. In one embodiment, a radiator with a semi-closed slot or gap (e.g., an opening added to a closed slot or gap) may be simply referred to as an open slot antenna. In some embodiments, the gap shape is elongated. In some embodiments, the length of the gap is approximately half a wavelength (e.g., the dielectric wavelength). In some embodiments, the length of the gap is approximately an integer multiple of a wavelength (e.g., one dielectric wavelength). In some embodiments, the slot can be fed by transmission lines connected across one or both sides, thereby exciting a radio frequency electromagnetic field on the slot and radiating electromagnetic waves into space. In one embodiment, the radiator of the slot antenna or gap antenna can be implemented by a conductive frame grounded at both ends, also known as a frame antenna; in this embodiment, the slot antenna or gap antenna can be viewed as including a linear radiator, the linear radiator being spaced apart from the ground and grounded at both ends, thereby forming a closed or semi-closed slot or gap. In one embodiment, the radiator of the slot antenna or gap antenna can be implemented by a support conductor grounded at both ends, also known as a support antenna.

[0062] Communication / Operating Frequency Band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna supporting the B40 band operates within the frequency range of 2300MHz to 2400MHz, or in other words, its operating frequency band includes the B40 band. The frequency range that meets the specifications can be considered the antenna's operating frequency band. The width of the operating frequency band is called the operating bandwidth. The operating bandwidth of an omnidirectional antenna may reach 3-5% of the center frequency. The operating bandwidth of a directional antenna may reach 5-10% of the center frequency. Bandwidth can be considered as a frequency range on both sides of the center frequency (e.g., the resonant frequency of a dipole), where the antenna characteristics are within the acceptable range of the center frequency.

[0063] The resonant frequency band and the operating frequency band can be the same or can partially overlap. In one embodiment, one or more resonant frequency bands of the antenna can cover one or more operating frequency bands of the antenna.

[0064] End / Point: The term "end / point" in the context of the antenna radiator's first end / second end / feed end / ground end / feed point / ground point / connection point should not be narrowly interpreted as necessarily an endpoint or end physically disconnected from other radiators. It can also be considered a point or segment on a continuous radiator. In one embodiment, "end / point" can include a connection / coupling region on the antenna radiator that couples to other conductive structures. For example, a feed end / feed point can be a coupling region on the antenna radiator that couples to a feed structure or feed circuit (e.g., a region facing a part of the feed circuit). Similarly, a ground end / ground point can be a connection / coupling region on the antenna radiator that couples to a ground structure or ground circuit.

[0065] The terms collinearity, coaxiality, coplanarity, symmetry (e.g., axial symmetry, or central symmetry), parallelism, perpendicularity, and similarity (e.g., same length, same width, etc.) mentioned in the embodiments of this application are all relative to the current technological level, and not absolute and strict mathematical definitions. There may be a deviation of less than a predetermined threshold (e.g., 1 mm, 0.5 mm, or 0.1 mm) between the edges of two collinear radiating stubs or two antenna elements in the line width direction. There may be a deviation of less than a predetermined threshold between the edges of two coplanar radiating stubs or two antenna elements in the direction perpendicular to their coplanar plane. There may be a deviation of a predetermined angle between two parallel or perpendicular antenna elements. In one embodiment, the predetermined threshold may be less than or equal to a threshold of 1 mm, for example, the predetermined threshold may be 0.5 mm or 0.1 mm. In one embodiment, the predetermined angle may be an angle within the range of ±10°, for example, the predetermined angle deviation is ±5°.

[0066] The same operating frequency band mentioned in the embodiments of this application (also known as, same frequency) can be understood as either of the following two situations:

[0067] 1) The operating frequency bands of the first antenna and the second antenna include the same communication frequency band. In one embodiment, both the first antenna and the second antenna serve as sub-units in a MIMO antenna system. For example, the operating frequency bands of both the first antenna and the second antenna include sub-future communication network frequency bands in 5G.

[0068] 2) The operating frequency bands of the first antenna and the second antenna partially overlap. For example, the operating frequency band of the first antenna includes B35 (1.85-1.91GHz) in LTE, while the operating frequency band of the second antenna includes B39 (1.88-1.92GHz) in LTE.

[0069] Antenna radiation pattern: also known as radiation pattern. It refers to the graph showing how the relative field strength (normalized modulus) of the antenna's radiated field changes with direction at a certain distance from the antenna. It is usually represented by two mutually perpendicular planar radiation patterns passing through the direction of maximum radiation of the antenna.

[0070] Antenna radiation patterns typically have multiple radiating beams. The beam with the highest radiating intensity is called the main lobe, and the remaining beams are called side lobes. Among the side lobes, the side lobe in the opposite direction to the main lobe is also called the back lobe.

[0071] Antenna gain: Characterizes the degree to which an antenna concentrates the radiated input power. Generally, the narrower the main lobe and the smaller the side lobes of the antenna pattern, the higher the antenna gain.

[0072] Isolation: Isolation refers to the ratio of the signal received by one antenna through another to the signal received by the transmitting antenna. It's a physical quantity used to measure the degree of mutual coupling between antennas. Assuming two antennas form a two-port network, the isolation between them is represented by their S21 and S12 parameters. Antenna isolation can be expressed using S21 and S12 parameters, which are also types of S-parameters. S21 and S12 parameters are usually negative. Smaller S21 and S12 parameters indicate greater isolation and less mutual coupling between antennas; larger S21 and S12 parameters indicate less isolation and greater mutual coupling. Antenna isolation depends on factors such as the antenna radiation pattern, the spatial distance between antennas, and antenna gain.

[0073] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings.

[0074] This application provides an electronic device, which may include mobile phones, tablet computers, laptops, remote information processors, and other devices. The electronic device includes a feed radiator, which, when used as an antenna, enables wireless communication between the electronic device and communication base stations, other electronic devices, satellites, and other devices.

[0075] Please refer to Figure 1 In some embodiments, the electronic device 10 may include a non-foldable electronic device. The following description uses an example of an electronic device 10 including a mobile phone (non-foldable mobile phone). For example, the mobile phone includes a housing that surrounds a predetermined area 119. For instance, the housing may include a frame 110 and a back cover 150. The mobile phone also includes a display panel 130 and a motherboard 120. The display panel 130 covers the frame 110, and the back cover 150 covers the side of the frame 110 opposite to the display panel 130. The display panel 130 is electrically connected to the motherboard 120 to control the display panel 130 to display images.

[0076] In some implementations, the electronic device 10 also includes a cover plate 140 and a battery (not shown). The cover plate 140 covers the side of the display panel 130 away from the bezel 110, and can protect the display panel 130 from damage caused by external objects. The battery is disposed in a preset area 119 and is electrically connected to the motherboard 120 to supply power to the motherboard 120.

[0077] In some embodiments, refer to Figure 2 The power radiator may include a first power radiator 31 and a second power radiator 32, both of which are mounted on the housing. The electronic device 10 also includes a communication component 20, located within a preset area 119. The communication component 20 can be coupled to the first power radiator 31 and the second power radiator 32 via a switch 90. For example, the first port of the switch 90 can be coupled to the first power radiator 31, the second port of the switch 90 can be coupled to the second power radiator 32, and the common port of the switch 90 can be coupled to the communication component 20.

[0078] Understandably, when a feed radiator is used as an antenna, its radiation is directional due to physical limitations, resulting in poor coverage at certain angles. This leads to poor communication performance when the feed radiator is used as an antenna in certain scenarios. With the above configuration, when the communication component 20 is coupled to the first feed radiator 31, and the communication performance is poor at certain angles, the communication component 20 can be switched to couple to the second feed radiator 32 to improve communication performance.

[0079] However, the radiation range formed by the first feed radiator 31 and the second feed radiator 32 still has directionality and cannot cover certain angles. In view of this, refer to... Figure 3 The feed radiator in this embodiment also includes a third feed radiator 33, which is also disposed on the housing.

[0080] In this embodiment of the application, the communication component 20 includes a first communication chip 21, a switching circuit 23, a second communication chip 22, and a first radio frequency front end 24.

[0081] The first communication chip 21 is coupled to the first feed radiator 31. The first feed radiator 31 is used to transmit and receive radio frequency signals in the first frequency band and the second frequency band. The first frequency band and the second frequency band are communication frequency bands of different communication standards.

[0082] In some examples, the first communication chip 21 can be a short-range chip. A "short-range chip" can be understood as a chip capable of data communication over a relatively short distance. Wireless short-range communication can include technologies such as Wi-Fi, Bluetooth, ultra-wideband, and NFC. Correspondingly, the first frequency band and the second frequency band are short-range communication frequency bands of different communication standards.

[0083] In this embodiment, the first frequency band can be the Bluetooth band, and the second frequency band can be the Wi-Fi band. That is, the radio frequency signal of the first frequency band is a Bluetooth signal, and the radio frequency signal of the second frequency band is a Wi-Fi signal. With the above configuration, the first feed radiator 31 can be used as an antenna to transmit and receive Bluetooth signals and Wi-Fi signals. Of course, in some other examples, the radio frequency signal of the first frequency band can be a Wi-Fi signal, and the radio frequency signal of the second frequency band can be a Bluetooth signal.

[0084] The second communication chip 22 is coupled to the first radio frequency front-end 24, the switching circuit 23 is coupled to the first communication chip 21, the second feed radiator 32 and the first radio frequency front-end 24 respectively, and the first radio frequency front-end 24 is coupled to the third feed radiator 33.

[0085] In some examples, the switching circuit 23 may include at least one mechanical switching switch, for example, the switching terminals of the mechanical switching switch being used to connect at least the first communication chip 21, the first feed radiator 31, and the first radio frequency front-end 24, respectively. Alternatively, in some examples, the switching module may also include at least one electronic switching switch, for example, it may be a plurality of switching paths composed of switching transistors, and the plurality of switching paths being used to connect at least the first communication chip 21, the first feed radiator 31, and the first radio frequency front-end 24, respectively.

[0086] Combination Figure 4 and Figure 5 As shown, the switching circuit 23 can have a first state and a second state.

[0087] Reference Figure 4 When the switching circuit 23 is in the first state, the first communication chip 21 is coupled to the second feed radiator 32 through the switching circuit 23. The second feed radiator 32 is used to transmit and receive radio frequency signals in the first frequency band and the second frequency band. The second communication chip 22 is coupled to the third feed radiator 33 through the first radio frequency front end 24. With the above settings, when the switching circuit 23 is in the first state, the first communication chip 21 is coupled to the second feed radiator 32, and the second feed radiator 32 can be used as a short-range antenna to transmit and receive Bluetooth signals and Wi-Fi signals.

[0088] Reference Figure 5When the switching circuit 23 is in the second state, the first communication chip 21 is coupled to the third feed radiator 33 through the switching circuit 23 and the first RF front-end 24. The third feed radiator 33 is used to transmit and receive RF signals in the first frequency band and the second frequency band. With the above settings, when the switching circuit 23 is in the second state, the first communication chip 21 is coupled to the third feed radiator 33, and the third feed radiator 33 can be used as a short-range antenna to transmit and receive Bluetooth signals and Wi-Fi signals.

[0089] In some examples, the second communication chip 22 may include a cellular chip, and the first radio frequency front-end 24 may be used to process the cellular communication signals in the radio frequency domain. For example, the first radio frequency front-end 24 may be an L-PAMiD module (LNA-PowerAmplifier Module integrated Duplexer), which integrates a radio frequency power amplifier, a radio frequency switch, an IPD (Integrated Passive Device) filter, and a low-noise amplifier.

[0090] When the switching circuit 23 is in the first state, the second communication chip 22 is coupled to the third feed radiator 33 through the first radio frequency front end 24. Accordingly, when the second communication chip 22 is coupled to the third feed radiator 33, the third feed radiator 33 can be used to receive and / or transmit radio frequency signals in a third frequency band. The third frequency band can be a cellular frequency band. That is, the radio frequency signal in the third frequency band can be a cellular signal. With the above configuration, the third feed radiator 33 can be used as a cellular antenna.

[0091] In summary, compared to related technologies where the first communication chip 21 uses either the first feed radiator 31 or the second feed radiator 32 for communication, this embodiment can change the switching state of the switching circuit 23. This allows the first communication chip 21 to be coupled to the first feed radiator 31 while simultaneously coupling to the second feed radiator 32 or the third feed radiator 33 via the switching circuit 23. This increases the radiation coverage of the feed radiators coupled to the first communication chip 21, improving communication performance. For example, when the switching circuit 23 is in the first state, the first communication chip 21 can communicate through the first feed radiator 31 and the second feed radiator 32, thereby transmitting and receiving Bluetooth and Wi-Fi signals. When the switching circuit 23 is in the second state, the first communication chip 21 can communicate through both the first feed radiator 31 and the third feed radiator 33, also transmitting and receiving Bluetooth and Wi-Fi signals. In other words, the first communication chip 21 communicates through the first feed radiator 31 while simultaneously using a cellular antenna for communication.

[0092] In some embodiments, refer to Figure 6The communication component 20 may further include a first switch 243, which may be multiplexed as at least a portion of the switches of the first radio frequency front-end 24. The first switch 243 is coupled to the second communication chip 22, the third feed radiator 33, and the switching circuit 23, respectively. When the switching circuit 23 is in the second state and the first switch 243 is in the third state, the first communication chip 21 is coupled to the third feed radiator 33 through the switching circuit 23 and the first switch 243.

[0093] For example, the first port a1 of the first switch can be coupled to the switching circuit 23, the second port a2 of the first switch can be coupled to the second communication chip 22, and the third port a3 of the first switch can be coupled to the third feed radiator 33. (Refer to...) Figure 7 When the first switch 243 is in the third state, the first port a1 and the third port a3 of the first switch are coupled to couple the switching circuit 23 and the third feed radiator 33.

[0094] With the above settings, when the switching circuit 23 is in the second state and the first switch 243 is in the third state, the first communication chip 21 can be coupled to the third feed radiator 33 through the switching circuit 23 and the first switch 243, so that the first communication chip 21 can reuse the cellular antenna for communication.

[0095] Furthermore, since the first switch 243 can be reused as at least part of the switch of the first RF front-end 24, the current cellular communication channel design is not changed, no additional components are needed, thus avoiding insertion loss and impacting other hardware. At the same time, it also helps to improve the integration of the communication component 20 and reduce its footprint.

[0096] Based on the above settings, continue to refer to Figure 6 The communication component 20 may further include a fourth feed radiator 34, which may be disposed within the housing. The first switch 243 is coupled to the fourth feed radiator 34. (See reference...) Figure 8 When the switching circuit 23 is in the second state and the first switch 243 is in the fourth state, the first communication chip 21 is coupled to the fourth feed radiator 34 through the switching circuit 23 and the first switch 243. The fourth feed radiator 34 is used to transmit and receive radio frequency signals of the first frequency band and radio frequency signals of the second frequency band.

[0097] For example, the fourth feed radiator 34 can be coupled to the fourth port a4 of the first switch. When the first switch 243 is in the fourth state, the first port a1 of the first switch and the fourth port a4 of the first switch are coupled to couple the switching circuit 23 and the fourth feed radiator 34.

[0098] With the above configuration, when the switching circuit 23 is in the second state and the first switch 243 is in the fourth state, the first communication chip 21 can communicate through the first feed radiator 31 and the fourth feed radiator 34, thereby transmitting and receiving Bluetooth signals and Wi-Fi signals; that is, while communicating through the first feed radiator 31, the first communication chip 21 also reuses the cellular antenna for communication. By setting the fourth feed radiator 34, it is beneficial to further increase the radiation coverage of the feed radiator and improve communication performance.

[0099] Furthermore, referring to Figure 7 When the switching circuit 23 is in the second state and the first switch 243 is in the third state, the second communication chip 22 is coupled to the fourth feed radiator 34 through the first switch 243. The fourth feed radiator 34 is used to transmit and receive radio frequency signals in the third frequency band.

[0100] For example, when the switching circuit 23 is in the second state and the first switch 243 is in the third state, the second port a2 of the first switch can be coupled to the fourth port a4 of the first switch, so that the second communication chip 22 is coupled to the fourth feed radiator 34 through the first radio frequency front end 24.

[0101] With the above settings, when the first communication chip 21 reuses the third feed radiator 33 to transmit and receive Bluetooth signals and Wi-Fi signals, the second communication chip 22 can be coupled with the fourth feed radiator 34. The fourth feed radiator 34 can be used as the main antenna of the cellular antenna to transmit and receive cellular signals, thereby ensuring the communication performance of the cellular band.

[0102] Furthermore, referring to Figure 8 When the switching circuit 23 is in the second state and the first switch 243 is in the fourth state, when the second communication chip 22 is coupled to the third feed radiator 33 through the first switch 243, the third feed radiator 33 is used to transmit and receive radio frequency signals in the third frequency band.

[0103] For example, when the switching circuit 23 is in the second state and the first switch 243 is in the fourth state, the second port a2 of the first switch can be coupled to the third port a3 of the first switch, so that the second communication chip 22 is coupled to the third feed radiator 33 through the first radio frequency front end 24. The third feed radiator 33 can be used as the main antenna of the cellular antenna to transmit and receive cellular signals.

[0104] With the above settings, when the first communication chip 21 reuses the fourth feed radiator 34 to transmit and receive Bluetooth signals and Wi-Fi signals, the second communication chip 22 can be coupled with the third feed radiator 33. The third feed radiator 33 can be used as the main antenna of the cellular antenna to transmit and receive cellular signals, thereby ensuring the communication performance of the cellular band.

[0105] In some embodiments, continue to refer to Figure 6 The communication component 20 may further include a second radio frequency (RF) front-end 26, which can be coupled to the second communication chip 22 and the first switch 243, respectively. The second RF front-end 26 can be used to process cellular communication signals in the radio frequency domain. For example, the first RF front-end 243 can be a DiFEM module (LNA - Power Amplifier Module integrated Duplexer), integrating an RF switch and a SAW (surface acoustic wave) filter. Exemplarily, the fifth port a5 of the first switch can be coupled to the second RF front-end 26.

[0106] In some examples, refer to Figure 9 When the switching circuit 23 is in the first state, the second communication chip 22 is coupled to the fourth feed radiator 34 through the first radio frequency front end 24. The fourth feed radiator 34 is used to transmit and receive radio frequency signals in the third frequency band. The second communication chip 22 is coupled to the third feed radiator 33 through the second radio frequency front end 26 and the first switch 243. The third feed radiator 33 is used to receive radio frequency signals in the third frequency band.

[0107] For example, when the switching circuit 23 is in the first state, the second port a2 of the first switch can be coupled to the fourth port a4 of the first switch, so that the second communication chip 22 is coupled to the fourth feed radiator 34 through the first radio frequency front end 24, and the fourth feed radiator 34 can be used as the main antenna of the cellular antenna; the third port a3 of the first switch can be coupled to the fifth port a5 of the first switch, so that the second communication chip 22 is coupled to the third feed radiator 33 through the second radio frequency front end 26 and the first switch 243, and the third feed radiator 33 can be used as the diversity antenna of the cellular antenna.

[0108] In some examples, refer to Figure 10 When the switching circuit 23 is in the first state, the second communication chip 22 is coupled to the third feed radiator 33 through the first radio frequency front end 24. The third feed radiator 33 is used to transmit and receive radio frequency signals in the third frequency band. The second communication chip 22 is coupled to the fourth feed radiator 34 through the second radio frequency front end 26 and the first switch 243. The fourth feed radiator 34 is used to receive radio frequency signals in the third frequency band.

[0109] For example, when the switching circuit 23 is in the first state, the second port a2 of the first switch can be coupled to the third port a3 of the first switch, so that the second communication chip 22 is coupled to the third feed radiator 33 through the first radio frequency front end 24, and the third feed radiator 33 can be used as the main antenna of the cellular antenna; the fourth port a4 of the first switch can be coupled to the fifth port a5 of the first switch, so that the second communication chip 22 is coupled to the fourth feed radiator 34 through the second radio frequency front end 26 and the first switch 243, and the fourth feed radiator 34 can be used as the diversity antenna of the cellular antenna.

[0110] In some embodiments, continue to refer to Figure 6 The communication component 20 may further include an arbitration module 25, which may be coupled to the first communication chip 21, the switching circuit 23, and the first switch 243, respectively. For example, the arbitration module 25 may be coupled to the first switch 243 via the second communication chip 22.

[0111] In some embodiments, the arbitration module 25 may also control the switching circuit 23 to switch to the first state or the second state, and control the first switch 243 to switch to the third state or the fourth state, according to the communication scenario of the electronic device 10, so that the first communication chip 21 can selectively couple with one of the first feed radiator 31, the second feed radiator 32 and the third feed radiator 33.

[0112] It is understandable that when the first communication chip 21 is coupled to the third feed radiator 33 or the fourth feed radiator 34, the first communication chip 21 reuses part of the cellular antenna for communication, resulting in a partial degradation of cellular communication performance. For example, in a scenario where cellular communication is prioritized, to avoid partial degradation of cellular communication performance, the arbitration module 25 can control the switching circuit 23 to switch to the first state, so that the first communication chip 21 is coupled to the second feed radiator 32.

[0113] Scenarios prioritizing cellular communication may include, for example, when the electronic device 10 is using cellular communication and webpage loading or video playback is experiencing stuttering, cellular communication should be prioritized to improve communication performance. Alternatively, if the electronic device 10 does not have high requirements for the communication quality of Bluetooth or Wi-Fi communication, cellular communication should also be prioritized. Of course, scenarios prioritizing cellular communication are not limited to the two mentioned above, and this application embodiment does not impose any limitations on them.

[0114] For example, in a scenario where Bluetooth or Wi-Fi communication is prioritized, or where Bluetooth, Wi-Fi, and cellular communication coexist, as described in the above embodiments, since the performance requirements for cellular communication are not high, the arbitration module 25 can control the first communication chip 21 to selectively couple with the one among the three feed radiators with the best communication performance.

[0115] Scenarios where Bluetooth or Wi-Fi communication is prioritized may include, for example, when electronic device 10 is using a Bluetooth headset for a call and the call quality is poor, prioritizing Bluetooth communication is necessary to improve call quality. Alternatively, when electronic device 10 is using Wi-Fi communication and webpage loading or video playback is choppy, prioritizing Wi-Fi communication is necessary to improve communication performance. Of course, scenarios where Bluetooth or Wi-Fi communication is prioritized are not limited to these two, and this application embodiment does not impose such limitations.

[0116] The following is a brief description of the process by which the arbitration module 25 controls the first communication chip 21 to selectively couple with the one of the three feed radiators that has the best communication performance.

[0117] Furthermore, the first communication chip 21 is used to acquire the first signal information of the second feed radiator 32, the second signal information of the third feed radiator 33, and the third signal information of the fourth feed radiator 34. The arbitration module 25 is used to control the switching circuit 23 to switch to the first state or the second state, and to control the first switch 243 to switch to the third state or the fourth state, based on the first signal information, the second signal information, and the third signal information.

[0118] For example, the first communication chip 21 can be coupled to the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 respectively, so that the first communication chip 21 can acquire first signal information, second signal information, and third signal information. The first communication chip 21 is also used to obtain preset information based on the first signal information, second signal information, and third signal information. For example, the first communication chip 21 can compare the first signal information, second signal information, and third signal information, and can compare the signal information of the feed radiators to obtain the feed radiator with optimal communication performance.

[0119] When the communication performance of the second feed radiator 32 is optimal, the arbitration module 25 can control the switching circuit 23 to switch to the first state, so that the first communication chip 21 is coupled with the second feed radiator 32. When the communication performance of the third feed radiator 33 is optimal, the arbitration module 25 can control the switching circuit 23 to switch to the second state, and the arbitration module 25 can also control the first switch 243 to switch to the third state, so that the first communication chip 21 is coupled with the third feed radiator 33. When the communication performance of the fourth feed radiator 34 is optimal, the arbitration module 25 can control the switching circuit 23 to switch to the second state, and the arbitration module 25 can also control the first switch 243 to switch to the fourth state, so that the first communication chip 21 is coupled with the fourth feed radiator 34.

[0120] The above configuration allows the first communication chip 21 to couple with the feed radiator with optimal communication performance, thereby improving the communication performance of Bluetooth and Wi-Fi communication.

[0121] In some examples, the first signal information, the second signal information, and the third signal information may each include one or more combinations of signal strength, throughput, and signal-to-noise ratio. The first communication chip 21 can obtain the feed radiator with optimal communication performance by comparing the signal strength, throughput, and signal-to-noise ratio of the first, second, and third signal information. Specifically, the feed radiator with the strongest signal strength has the best communication performance; similarly, the feed radiator with the highest throughput has the best communication performance, and the feed radiator with the highest signal-to-noise ratio has the best communication performance.

[0122] In some embodiments, continue to refer to Figure 6 The communication component 20 may further include a third radio frequency (RF) front-end 28 and a fourth RF front-end 29. The switching circuit 23 is coupled to the first port 211 of the first communication chip 21, the third RF front-end 28, and the fourth RF front-end 29, respectively. The third RF front-end 28 is coupled to the second feed radiator 32, and the fourth RF front-end 29 is coupled to the first RF front-end 24. The third RF front-end 28 and the fourth RF front-end 29 can be used to process Bluetooth and Wi-Fi communication signals in the radio frequency domain.

[0123] When the switching circuit 23 is in the first state, the first port 211 of the first communication chip 21 is coupled to the second feed radiator 32 through the switching circuit 23 and the second radio frequency front end 26. By setting a separate radio frequency front end for the second feed radiator 32, complete radio frequency domain processing of Bluetooth and Wi-Fi signals is achieved, thereby improving communication quality.

[0124] When the switching circuit 23 is in the second state and the first switch 243 is in the third state, the first port 211 of the first communication chip 21 is coupled to the third feed radiator 33 through the switching circuit 23, the fourth RF front-end 29, and the first RF front-end 24. When the switching circuit 23 is in the second state and the first switch 243 is in the fourth state, the first port 211 of the first communication chip 21 is coupled to the fourth feed radiator 34 through the switching circuit 23, the fourth RF front-end 29, and the first RF front-end 24. By setting a separate RF front-end for the third feed radiator 33 or the fourth feed radiator 34, complete RF domain processing of Bluetooth and Wi-Fi signals can be achieved, thereby improving communication quality.

[0125] Based on the above settings, the first port 211 of the first communication chip 21 can be used to alternately transmit and receive radio frequency signals of the first frequency band and the second frequency band, so that the second feed radiator 32, the third feed radiator 33 and the fourth feed radiator 34 can achieve the effect of time-division multiplexing of Wi-Fi communication and Bluetooth communication.

[0126] Reference Figure 11 The first port 211 of the first communication chip 21 may include a first Bluetooth receiving port RX11, a first Bluetooth transmitting port TX11, a first Wi-Fi receiving port RX12, and a first Wi-Fi transmitting port TX12. For example, the first Bluetooth receiving port RX11 may be multiplexed as the first Bluetooth transmitting port TX11, and the first Bluetooth receiving port RX11 may also be coupled with the first Wi-Fi receiving port RX12.

[0127] The first Bluetooth receiving port RX11 and the first Bluetooth transmitting port TX11 work alternately. The first Bluetooth transmitting port TX11 is used to transmit Bluetooth signals, and the first Bluetooth receiving port RX11 is used to receive Bluetooth signals. The first Wi-Fi receiving port RX12 and the first Wi-Fi transmitting port TX12 work alternately. The first Wi-Fi transmitting port TX12 is used to transmit Wi-Fi signals, and the first Wi-Fi receiving port RX12 is used to receive Wi-Fi signals.

[0128] In some embodiments, the switching circuit 23 may include a second switch 231 and a third switch 232.

[0129] The first port b1 of the second switch is coupled to the first Bluetooth transmitting port TX11, the second port b2 of the second switch is coupled to the third RF front-end 28, and the third port b3 of the second switch is coupled to the fourth RF front-end 29. The third RF front-end 28 and the fourth RF front-end 29 are also coupled to the first Wi-Fi receiving port RX12.

[0130] The first port c1 of the third switch is coupled to the first Wi-Fi transmitting port TX12, the second port c2 of the third switch is coupled to the first Wi-Fi receiving port RX12, the third port c3 and the fourth port c4 of the third switch are both coupled to the third RF front-end 28, and the fifth port c5 and the sixth port c6 of the third switch are both coupled to the fourth RF front-end 29.

[0131] When the switching circuit 23 is in the first state, and the first Bluetooth transmitting port TX11 is working, the first port b1 of the second switch and the second port b2 of the second switch are coupled. The first Bluetooth transmitting port TX11 is coupled to the second feed radiator 32 through the third RF front-end 28, so that the second feed radiator 32 can transmit Bluetooth signals. When the first Bluetooth receiving port RX11 is working, the second port c2 and the fourth port c4 of the third switch are coupled. The first Bluetooth receiving port RX11 receives the Bluetooth signal received by the second feed radiator 32 through the Wi-Fi receiving port and the third RF front-end 28. Through the above settings, the second feed radiator 32 can achieve the effect of time-division multiplexing Bluetooth communication.

[0132] Similarly, when the first Wi-Fi transmitting port TX12 is working, the first port c1 and the third port c3 of the third switch are coupled. The first Wi-Fi transmitting port TX12 is coupled to the second feed radiator 32 through the third RF front-end 28, so that the second feed radiator 32 can transmit Wi-Fi signals. When the first Wi-Fi receiving port RX12 is working, the second port c2 and the fourth port c4 of the third switch are coupled. The first Wi-Fi receiving port RX12 receives the Wi-Fi signal received by the second feed radiator 32 through the third RF front-end 28. Through the above settings, the second feed radiator 32 can achieve the effect of time-division multiplexing Wi-Fi communication.

[0133] When the switching circuit 23 is in the second state and the first switch 243 is in the third state, and the first Bluetooth transmitting port TX11 is working, the first port b1 of the second switch and the third port b3 of the second switch are coupled. The first Bluetooth transmitting port TX11 is coupled to the third feed radiator 33 through the fourth RF front-end 29, so that the third feed radiator 33 can transmit Bluetooth signals. When the first Bluetooth receiving port RX11 is working, the second port c2 and the sixth port c6 of the third switch are coupled. The first Bluetooth receiving port RX11 is coupled to the third feed radiator 33 through the Wi-Fi receiving port and the fourth RF front-end 29, so that the third feed radiator 33 can receive Bluetooth signals. Through the above settings, the third feed radiator 33 can achieve the effect of time-division multiplexing Bluetooth communication.

[0134] Similarly, when the first Wi-Fi transmitting port TX12 is working, the first port c1 and the fifth port c5 of the third switch are coupled. The first Wi-Fi transmitting port TX12 is coupled to the third feed radiator 33 through the fourth RF front-end 29, so that the third feed radiator 33 can transmit Wi-Fi signals. When the first Wi-Fi receiving port RX12 is working, the second port c2 and the sixth port c6 of the third switch are coupled. The first Wi-Fi receiving port RX12 is coupled to the third feed radiator 33 through the fourth RF front-end 29, so that the third feed radiator 33 can receive Wi-Fi signals. Through the above settings, the third feed radiator 33 can achieve the effect of time-division multiplexing Wi-Fi communication.

[0135] When switching circuit 23 is in the second state and first switch 243 is in the fourth state, and the first Bluetooth transmitting port TX11 is working, the first port b1 of the second switch and the third port b3 of the second switch are coupled. The first Bluetooth transmitting port TX11 is coupled to the fourth feed radiator 34 through the fourth RF front-end 29, so that the fourth feed radiator 34 can transmit Bluetooth signals. When the first Bluetooth receiving port RX11 is working, the second port c2 and the sixth port c6 of the third switch are coupled. The first Bluetooth receiving port RX11 is coupled to the fourth feed radiator 34 through the Wi-Fi receiving port and the fourth RF front-end 29, so that the fourth feed radiator 34 can receive Bluetooth signals. Through the above settings, the fourth feed radiator 34 can achieve the effect of time-division multiplexing Bluetooth communication.

[0136] Similarly, when the first Wi-Fi transmitting port TX12 is working, the first port c1 and the fifth port c5 of the third switch are coupled. The first Wi-Fi transmitting port TX12 is coupled to the fourth feed radiator 34 through the fourth RF front-end 29, so that the fourth feed radiator 34 can transmit Wi-Fi signals. When the first Wi-Fi receiving port RX12 is working, the second port c2 and the sixth port c6 of the third switch are coupled. The first Wi-Fi receiving port RX12 is coupled to the fourth feed radiator 34 through the fourth RF front-end 29, so that the fourth feed radiator 34 can receive Wi-Fi signals. Through the above settings, the fourth feed radiator 34 can achieve the effect of time-division multiplexing Wi-Fi communication.

[0137] In some embodiments, the communication component 20 further includes a fifth radio frequency (RF) front-end 27, which is coupled to the second port 212 of the first communication chip 21 and the first feed radiator 31, respectively. The fifth RF front-end 27 can be used to process Bluetooth and Wi-Fi communication signals in the radio frequency domain.

[0138] The second port 212 of the first communication chip 21 is used to alternately transmit and receive radio frequency signals of the first frequency band and the second frequency band. By setting a separate radio frequency front-end for the first feed radiator 31, complete radio frequency domain processing of Bluetooth and Wi-Fi signals is achieved, thereby improving communication quality. When the second port 212 of the first communication chip 21 is working, it is coupled to the first feed radiator 31 through the fifth radio frequency front-end 27, so that the first feed radiator 31 can achieve time-division multiplexing of Wi-Fi and Bluetooth communication.

[0139] In some embodiments, the second port 212 of the first communication chip 21 may include a second Bluetooth receiving port RX21, a second Bluetooth transmitting port TX21, a second Wi-Fi receiving port RX22, and a second Wi-Fi transmitting port TX22. For example, the second Bluetooth receiving port RX21 may be multiplexed as the second Bluetooth transmitting port TX21, and the second Bluetooth receiving port RX21 may also be coupled to the second Wi-Fi receiving port RX22.

[0140] The second Bluetooth receiving port RX21 and the second Bluetooth transmitting port TX21 work alternately. The second Bluetooth transmitting port TX21 is used to transmit Bluetooth signals, and the second Bluetooth receiving port RX21 is used to receive Bluetooth signals. The second Wi-Fi receiving port RX22 and the second Wi-Fi transmitting port TX22 work alternately. The second Wi-Fi transmitting port TX22 is used to transmit Wi-Fi signals, and the second Wi-Fi receiving port RX22 is used to receive Wi-Fi signals.

[0141] When the second Bluetooth transmitting port TX21 is operational, it is coupled to the first feed radiator 31 via the fifth RF front-end 27, enabling the first feed radiator 31 to transmit Bluetooth signals. When the second Bluetooth receiving port RX21 is operational, it is coupled to the first feed radiator 31 via the second Wi-Fi receiving port RX22 and the fifth RF front-end 27, enabling the first feed radiator 31 to receive Bluetooth signals. Through this configuration, the first feed radiator 31 can achieve time-division multiplexing for Bluetooth communication.

[0142] Similarly, when the second Wi-Fi transmitting port TX22 is operational, it is coupled to the first feed radiator 31 via the fifth RF front-end 27, enabling the first feed radiator 31 to transmit Wi-Fi signals. Similarly, when the second Wi-Fi receiving port RX22 is operational, it is coupled to the first feed radiator 31 via the fifth RF front-end 27, enabling the first feed radiator 31 to receive Wi-Fi signals. This configuration allows the first feed radiator 31 to achieve time-division multiplexing of Wi-Fi communication.

[0143] In some embodiments, refer to Figure 12The switching circuit 23 may include a 3P6T switch 233. A portion of the 3P6T switch 233 can be reused as a second switch 231, and another portion can be reused as a third switch 232. For example, the first port b1, the second port b2, the third port b3, the first port c1, the second port c2, the fourth port c4, the fifth port c5, and the sixth port c6 of the third switch are integrated within the same 3P6T switch 233. This configuration improves the integration of the switching circuit 23, and consequently, the integration of the communication component 20.

[0144] In the above implementation, the feed radiator can be set on the frame 110. That is, at least part of the feed radiator is set on the frame 110. The antenna structure is formed by using the frame 110, which can improve the structural compactness of the electronic device 10 and at the same time avoid the frame 110 from affecting the outward radiation signal of the feed radiator.

[0145] For example, the feed radiator can be mounted on the frame 110 by means of attachment, snap-fit, etc. Alternatively, the feed radiator and the frame 110 can be an integral structure, that is, part of the frame 110 serves as the feed radiator; wherein, a gap can be formed between the part of the frame 110 that serves as the feed radiator and the rest of the frame 110 to prevent the rest of the frame 110 from affecting the feed radiator.

[0146] Reference Figure 13 The electronic device 10 can be a non-foldable electronic device 10. For example, the frame 110 may include a first side 111 and a second side 112, as well as a third side 113 and a fourth side 114 connected to the first side 111 and the second side 112 respectively; wherein the first side 111 and the second side 112 can be arranged parallel and spaced apart, the third side 113 and the fourth side 114 are located between the first side 111 and the second side 112, one end of the third side 113 is connected to the first side 111, the other end of the third side 113 is connected to the second side 112, one end of the fourth side 114 is connected to the first side 111, and the other end of the fourth side 114 is connected to the second side 112.

[0147] For example, the third side 113 may be located at the top of the electronic device 10, which is the direction in which the electronic device 10 faces the sky when in use (such as making or receiving phone calls, sending or receiving video calls, etc.). The fourth side 114 may be located at the bottom of the electronic device 10, which is the direction in which the electronic device 10 faces the ground when in use.

[0148] In an embodiment where the feed radiator includes a first feed radiator 31, a second feed radiator 32, a third feed radiator 33, and a fourth feed radiator 34, at least a portion of the first feed radiator 31, at least a portion of the second feed radiator 32, at least a portion of the third feed radiator 33, and at least a portion of the fourth feed radiator 34 may be disposed on different sides of the frame.

[0149] For example, at least a portion of the first feed radiator 31 may be disposed on the third side 113 of the frame, at least a portion of the second feed radiator 32 may be disposed on the first side 111 of the frame, at least a portion of the third feed radiator 33 may be disposed on the second side 112 of the frame, and at least a portion of the fourth feed radiator 34 may be disposed on the fourth side 114 of the frame.

[0150] Understandably, when the electronic device 10 is held by hand, the user may grip the feed radiator used as an antenna, leading to a deterioration in antenna performance. For example, when the user holds the second feed radiator 32 and the third feed radiator 33, the communication component 20 can be coupled to the fourth feed radiator 34, thereby transmitting and receiving radio frequency signals in the first and second frequency bands, avoiding impact on communication performance. Alternatively, when the user holds the third feed radiator 33 and the fourth feed radiator 34, the communication component 20 can be coupled to the second feed radiator 32. Or, when the user holds the second feed radiator 32 and the fourth feed radiator 34, the communication component 20 can be coupled to the third feed radiator 33.

[0151] Furthermore, referring to Figure 14 The radiation intensity of the feed radiators located on different sides of the frame varies in the radiation pattern. Among them, Figure 14 Figure (1) shows the radiation pattern of the first feed radiator. Figure 14 Figure (2) shows the radiation pattern of the second feed radiator. Figure 14 Figure (3) shows the radiation pattern of the third feed radiator. Figure 14 Figure (4) shows the radiation pattern of the fourth feed radiator.

[0152] When the position of the communication device (e.g., a Bluetooth headset) relative to the electronic device 10 changes, and the radiation intensity of the second feed radiator 32 and the third feed radiator 33 relative to the communication device in the radiation pattern is poor, the communication component 20 can be coupled to the fourth feed radiator 34 to transmit and receive radio frequency signals in the first and second frequency bands, thus avoiding affecting communication performance. Alternatively, when the radiation intensity of the fourth feed radiator 34 and the third feed radiator 33 relative to the communication device in the radiation pattern is poor, the communication component 20 can be coupled to the second feed radiator 32. Or, when the radiation intensity of the fourth feed radiator 34 and the second feed radiator 32 relative to the communication device in the radiation pattern is poor, the communication component 20 can be coupled to the third feed radiator 33.

[0153] In summary, through the above arrangement, the first feed radiator 31, the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 can be relatively dispersed on the frame. When one of the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 has poor communication performance when used as an antenna, the communication component 20 is coupled with another of the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34, which is beneficial to improving the communication performance of the electronic device 10.

[0154] Furthermore, since at least a portion of the first feed radiator 31, at least a portion of the second feed radiator 32, at least a portion of the third feed radiator 33, and at least a portion of the fourth feed radiator 34 can be disposed on different sides of the frame, it is also beneficial to ensure the isolation between the feed radiators.

[0155] Of course, the positions of the first feed radiator 31, the second feed radiator 32, the third feed radiator 33 and the fourth feed radiator 34 on the frame are merely exemplary. The specific positions of the feed radiators are not limited in this application embodiment, as long as at least part of the four feed radiators are located on different sides of the frame.

[0156] Please refer to Figure 15 and Figure 16In some embodiments, the electronic device 10 can be a foldable electronic device 10, such as a foldable mobile phone, a foldable tablet computer, etc. For example, the foldable electronic device 10 can include a frame 110 and a rotating mechanism 115. The frame 110 includes a first portion 116 and a second portion 117, which are foldably connected by the rotating mechanism 115. That is, the rotating mechanism 115 allows the first portion 116 and the second portion 117 to be folded together or unfolded. When the first portion 116 and the second portion 117 are folded together, they are approximately parallel and close to each other; when the first portion 116 and the second portion 117 are unfolded, they are far apart from each other, and the included angle between the first portion 116 and the second portion 117 is approximately 180°.

[0157] In the above implementation, the foldable electronic device 10 further includes a flexible display panel and a motherboard. The flexible display panel can cover the first portion 116 and the second portion 117, and the flexible display panel bends accordingly during the folding or unfolding of the first portion 116 relative to the second portion 117. The first portion 116 and the rotating mechanism 115 form a first preset region 1191, and the second portion 117 and the rotating mechanism 115 form a second preset region 1192; the first preset region 1191 and the second preset region 1192 together constitute a preset region 119. The motherboard can be located in either the first preset region 1191 or the second preset region 1192, and this application embodiment does not limit this. In this application embodiment, the foldable electronic device 10 also includes a battery, which can be located in either the first preset region 1191 or the second preset region 1192.

[0158] In the above implementation, the first part 116 includes a first edge 111, a first sub-edge 1131, and a second sub-edge 1141; the second part 117 includes a second edge 112, a third sub-edge 1132, and a fourth sub-edge 1142. Specifically, the third edge 113 includes the first sub-edge 1131 and the third sub-edge 1132, and the fourth edge 114 includes the second sub-edge 1141 and the fourth sub-edge 1142.

[0159] Specifically, the first sub-side 1131 is located between the first side 111 and the rotating mechanism 115; the second sub-side 1141 is located between the first side 111 and the rotating mechanism 115; the third sub-side 1132 is located between the second side 112 and the rotating mechanism 115; and the fourth sub-side 1142 is located between the second side 112 and the rotating mechanism 115. During the folding of the first part 116 relative to the second part 117, the first sub-side 1131 rotates relative to the third sub-side 1132, and the second sub-side 1141 rotates relative to the fourth sub-side 1142. The third side 113 includes the first sub-side 1131 and the third sub-side 1132, and the fourth side 114 includes the second sub-side 1141 and the fourth sub-side 1142.

[0160] The first part 116 and the rotating mechanism 115 together form a first preset area 1191, and the second side 112 and the rotating mechanism 115 together form a second preset area 1192; the preset area 119 includes the first preset area 1191 and the second preset area 1192.

[0161] In some embodiments, refer to Figure 6 , Figure 16 and Figure 17 The first communication chip 21 and the switching circuit 23 can be located in the first preset area 1191, and the second communication chip 22 and the first radio frequency front end 24 can be located in the second preset area 1192. The first feed radiator 31 and the second feed radiator 32 can be disposed in the first part 116, and the third feed radiator 33 and the fourth feed radiator 34 can be disposed in the second part 117.

[0162] Furthermore, at least a portion of the first feed radiator 31 and at least a portion of the second feed radiator 32 may be disposed on different sides of the first portion 116, and at least a portion of the third feed radiator 33 and at least a portion of the fourth feed radiator 34 may be disposed on different sides of the second portion 117. For example, at least a portion of the first feed radiator 31 may be disposed on the first sub-side 1131, at least a portion of the second feed radiator 32 may be disposed on the first side 111, at least a portion of the third feed radiator 33 may be disposed on the second side 112, and at least a portion of the fourth feed radiator 34 may be disposed on the fourth sub-side 1142.

[0163] With the above configuration, the first feed radiator 31, the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 can be relatively dispersed on the frame. When one of the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 has poor communication performance when used as an antenna, the communication component 20 is coupled with another of the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34, which helps to improve the communication performance of the electronic device 10.

[0164] Of course, the positions of the first feed radiator 31 and the second feed radiator 32 on the frame of the first part 116 are merely exemplary, as are the positions of the third feed radiator 33 and the fourth feed radiator 34 on the frame. This application embodiment does not limit the specific positions of the feed radiators, as long as the four feed radiators are located on different sides of the frame.

[0165] In some embodiments, refer to Figure 6 , Figure 16 and Figure 18 The first communication chip 21, the switching circuit 23 and the second communication chip 22 can all be located in the first preset area. At least a portion of the first feed radiator 31, at least a portion of the second feed radiator 32, at least a portion of the third feed radiator 33 and at least a portion of the fourth feed radiator 34 are located on different sides of the first part 116.

[0166] For example, at least a portion of the first feed radiator 31 may be disposed on the first sub-side 1131, at least a portion of the second feed radiator 32 may be disposed on the first side 111, at least a portion of the third feed radiator 33 may be disposed on the first side 111, and at least a portion of the fourth feed radiator 34 may be disposed on the second sub-side 1141.

[0167] With the above configuration, the first feed radiator 31, the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 can be relatively dispersed on the frame. When one of the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34 has poor communication performance when used as an antenna, the communication component 20 is coupled with another of the second feed radiator 32, the third feed radiator 33, and the fourth feed radiator 34, which helps to improve the communication performance of the electronic device 10.

[0168] In some embodiments, the distance between two adjacent feed radiators on the same side of the frame is greater than 10 mm. The distance between two adjacent feed radiators can be 15 mm, 20 mm, or 25 mm. For example, at least a portion of the second feed radiator 32 and at least a portion of the third feed radiator 33 can both be disposed on the first side 111. The second feed radiator 32 can be closer to the second sub-side than the third feed radiator 33. This arrangement ensures sufficient isolation between adjacent feed radiators, guaranteeing their normal operation.

[0169] In some embodiments, refer to Figures 19 to 21The feed radiator may further include a fifth feed radiator 35 and a sixth feed radiator 36. The fifth feed radiator 35 can be coupled to the second communication chip 22 through a corresponding RF front end, and the sixth feed radiator 36 can also be coupled to the second communication chip 22 through a corresponding RF front end. Both the fifth feed radiator 35 and the sixth feed radiator 36 are used to receive RF signals in the third frequency band.

[0170] In one embodiment of the non-foldable electronic device 10, reference is made to... Figure 19 The third feed radiator 33, the fourth feed radiator 34, the fifth feed radiator 35, and the sixth feed radiator 36 are respectively disposed on different sides of the frame. For example, the second feed radiator 32 and the sixth feed radiator 36 are disposed on the first side 111, the first feed radiator 31 and the fifth feed radiator 35 are disposed on the third side 113, the third feed radiator 33 is disposed on the second side 112, and the fourth feed radiator 34 is disposed on the fourth side 114. Further, the distance between the second feed radiator 32 and the sixth feed radiator 36, and the distance between the first feed radiator 31 and the fifth feed radiator 35, can both be greater than 10 mm to ensure sufficient isolation between adjacent feed radiators.

[0171] In one embodiment of the foldable electronic device 10, reference is made to... Figure 20 Three of the feed radiators—the third feed radiator 33, the fourth feed radiator 34, the fifth feed radiator 35, and the sixth feed radiator 36—are located on different sides of the first portion 116. For example, the third feed radiator 33 and the second feed radiator 32 are located on the first side 111, the first feed radiator 31 and the fifth feed radiator 35 are located on the first sub-side 1131, the fourth feed radiator 34 is located on the second sub-side 1141, and the sixth feed radiator 36 can be located within a first preset area. Further, the distance between the second feed radiator 32 and the third feed radiator 33, and the distance between the first feed radiator 31 and the fifth feed radiator 35, can both be greater than 10 mm to ensure sufficient isolation between adjacent feed radiators.

[0172] Or, refer to Figure 21Three of the feed radiators—the third feed radiator 33, the fourth feed radiator 34, the fifth feed radiator 35, and the sixth feed radiator 36—are located on different sides of the second portion 117. For example, the second feed radiator 32 is located on the first side 111, the first feed radiator 31 is located on the first sub-side 1131, the third feed radiator 33 and the sixth feed radiator 36 are located on the second side 112, the fourth feed radiator 34 is located on the fourth sub-side 1142, and the fifth feed radiator 35 can be located within the third sub-side 1132. Furthermore, the distance between the third feed radiator 33 and the fifth feed radiator 35 can both be greater than 10 mm to ensure sufficient isolation between adjacent feed radiators.

[0173] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: A housing that encloses a predetermined area; The first feed radiator, the second feed radiator, and the third feed radiator are all disposed on the housing; A communication component, located within the preset area, includes: A first communication chip is coupled to a first feed radiator. The first feed radiator is used to transmit and receive radio frequency signals in a first frequency band and a second frequency band. The first frequency band and the second frequency band are communication frequency bands of different communication standards. A switching circuit, wherein the switching circuit is coupled to the first communication chip and the second feed radiator respectively; The second communication chip and the first radio frequency front-end are coupled together, and the first radio frequency front-end is coupled to the switching circuit and the third feed radiator respectively. When the switching circuit is in the first state, the first communication chip is coupled to the second feed radiator through the switching circuit. The second feed radiator is used to transmit and receive radio frequency signals of the first frequency band and radio frequency signals of the second frequency band. The second communication chip is coupled to the third feed radiator through the first radio frequency front end. When the switching circuit is in the second state, the first communication chip is coupled to the third feed radiator through the switching circuit and the first radio frequency front end. The third feed radiator is used to transmit and receive radio frequency signals of the first frequency band and radio frequency signals of the second frequency band.

2. The electronic device according to claim 1, characterized in that, The communication component further includes a first switch, which is multiplexed as at least part of the switches of the first radio frequency front end, and the first switch is coupled to the second communication chip, the third feed radiator and the switching circuit respectively; When the switching circuit is in the second state and the first switch is in the third state, the first communication chip is coupled to the third feed radiator through the switching circuit and the first switch.

3. The electronic device according to claim 2, characterized in that, The electronic device further includes a fourth feed radiator, which is disposed on the housing, and the first switch is coupled to the fourth feed radiator; When the switching circuit is in the second state and the first switch is in the fourth state, the first communication chip is coupled to the fourth feed radiator through the switching circuit and the first switch. The fourth feed radiator is used to transmit and receive radio frequency signals of the first frequency band and radio frequency signals of the second frequency band.

4. The electronic device according to claim 3, characterized in that, When the switching circuit is in the second state and the first switch is in the third state, the second communication chip is coupled to the fourth feed radiator through the first switch, and the fourth feed radiator is used to transmit and receive radio frequency signals in the third frequency band. When the switching circuit is in the second state and the first switch is in the fourth state, and the second communication chip is coupled to the third feed radiator through the first switch, the third feed radiator is used to transmit and receive radio frequency signals in the third frequency band.

5. The electronic device according to claim 4, characterized in that, The communication component further includes a second radio frequency front end, which is coupled to the second communication chip and the first switch respectively. When the switching circuit is in the first state, the second communication chip is coupled to the fourth feed radiator through the first radio frequency front end. The fourth feed radiator is used to transmit and receive radio frequency signals of the third frequency band. The second communication chip is coupled to the third feed radiator through the second radio frequency front end and the first switch. The third feed radiator is used to receive radio frequency signals of the third frequency band. or, When the switching circuit is in the first state, the second communication chip is coupled to the third feed radiator through the first radio frequency front end. The third feed radiator is used to transmit and receive radio frequency signals in the third frequency band. The second communication chip is coupled to the fourth feed radiator through the second radio frequency front end and the first switch. The fourth feed radiator is used to receive radio frequency signals in the third frequency band.

6. The electronic device according to any one of claims 3-5, characterized in that, The electronic device further includes an arbitration module, which is coupled to the first communication chip, the first switch and the switching circuit respectively. The first communication chip is used to acquire the first signal information of the second feed radiator, the second signal information of the third feed radiator, and the third signal information of the fourth feed radiator. The arbitration module is used to control the switching circuit to switch to the first state or the second state according to the first signal information, the second signal information and the third signal information, and to control the first switch to switch to the third state or the fourth state.

7. The electronic device according to claim 6, characterized in that, The first signal information, the second signal information, and the third signal information each include one or more combinations of signal strength, throughput, and signal-to-noise ratio.

8. The electronic device according to any one of claims 3-7, characterized in that, The communication component further includes a third radio frequency front-end and a fourth radio frequency front-end. The switching circuit is coupled to the first port of the first communication chip, the third radio frequency front-end, and the fourth radio frequency front-end, respectively. The third radio frequency front-end is coupled to the second feed radiator, and the fourth radio frequency front-end is coupled to the first radio frequency front-end. The first port of the first communication chip is used to alternately transmit and receive radio frequency signals of the first frequency band and radio frequency signals of the second frequency band. When the switching circuit is in the first state, the first port of the first communication chip is coupled to the second feed radiator through the switching circuit and the third radio frequency front end when it is working. When the switching circuit is in the second state, the first port of the first communication chip is coupled to the third feed radiator through the switching circuit, the fourth radio frequency front end, and the first radio frequency front end.

9. The electronic device according to any one of claims 3-8, characterized in that, The communication component further includes a fifth radio frequency front end, which is coupled to the second port of the first communication chip and the first feed radiator respectively; the second port of the first communication chip is used to alternately transmit and receive radio frequency signals of the first frequency band and radio frequency signals of the second frequency band. When the first communication chip is in operation, its second port is coupled to the first feed radiator through the fifth radio frequency front end.

10. The electronic device according to any one of claims 1-9, characterized in that, The first frequency band is the Bluetooth band, and the second frequency band is the Wi-Fi band.

11. The electronic device according to claim 4 or 5, characterized in that, The third frequency band is a cellular frequency band.

12. The electronic device according to any one of claims 3-9, characterized in that, The housing includes a frame, and the first feed radiator, the second feed radiator, the third feed radiator and the fourth feed radiator are all disposed on the frame.

13. The electronic device according to claim 12, characterized in that, The border includes a first side and a second side, as well as a third side and a fourth side that connect the first side and the second side respectively. The first side, the second side, the third side, and the fourth side together enclose the preset area. The first feed radiator, the second feed radiator, the third feed radiator, and the fourth feed radiator are respectively disposed on different sides of the frame.

14. The electronic device according to claim 13, characterized in that, The electronic device further includes a rotating mechanism. The frame includes a first part and a second part, which are foldably connected by the rotating mechanism. The first part includes a first side, a first sub-side, and a second sub-side. The second part includes a second side, a third sub-side, and a fourth sub-side. The third side includes the first sub-side and the third sub-side. The fourth side includes the second sub-side and the fourth sub-side. The first communication chip and the switching circuit are located in the space enclosed by the first part and the rotating mechanism. The first radio frequency front end and the second communication chip are located in the space enclosed by the second part and the rotating mechanism. The first feed radiator and the second feed radiator are disposed in the first part. The third feed radiator and the fourth feed radiator are disposed in the second part.

15. The electronic device according to claim 13, characterized in that, The electronic device further includes a rotating mechanism, the frame includes a first part and a second part, the first part and the second part are foldably connected by the rotating mechanism, and the electronic device further includes a fourth feed radiator; The communication component is located within the space enclosed by the first part and the rotating mechanism, and three of the first, second, third, and fourth feed radiators are located on different sides of the first part.

16. The electronic device according to claim 15, characterized in that, Within the same side of the frame, the distance between two adjacent feed radiators is greater than 10 mm.

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