Medical endoscope and multispectral ceramic integrated packaging light supplementing module thereof

Abstract

The invention discloses a medical endoscope and a multispectral ceramic integrated packaging light supplementing module thereof, and belongs to the technical field of medical instruments. The light supplementing module comprises a semi-crescent special-shaped substrate (11) and a light supplementing layer (12), the camera position (16) and the operation position (17) are arranged on the special-shaped substrate; the white light chip (12), the red light chip (13), the orange light chip (14) and the green light chip (15) are arranged on the special-shaped substrate; the number of the white light chips (12) is two, the two white light chips (12) are arranged on the two sides of the camera position (16) respectively, the red light chip (13) and the orange light chip (14) are arranged on the outer sides of the two white light chips respectively, and the green light chip (15) is arranged on the outer side of the orange light chip (14). The chips comprise a 630 nm red light chip, a 600 nm orange light chip and a 540 nm green light chip. According to the method, the focus can be identified more efficiently and clearly, and the clinical diagnosis accuracy is obviously improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of medical devices, and particularly relates to a medical endoscope and a multispectral ceramic integrated light supplement module thereof. BACKGROUND

[0002] As an important tool of modern minimally invasive medicine, medical endoscopes have been widely used in the inspection and treatment of body cavities such as the digestive tract, respiratory tract, and urinary system. With the continuous development of medical diagnosis technology, the performance requirements for endoscope systems are increasingly improved, and the light supplement module, as a key determinant of the imaging quality of the endoscope, directly affects the observation and judgment of the physician on the diseased tissue.

[0003] Traditional endoscope light supplement systems mainly adopt two technical routes: one is to use an external light source to conduct light to the front end of the endoscope through an optical fiber; the other is to directly install an LED light source at the front end. In recent years, with the progress of LED technology, especially the emergence of high-brightness and high-color-rendering-index LEDs, the front-end LED light supplement scheme has gradually become the mainstream due to its simple structure, low cost, and other advantages.

[0004] However, the working environment of medical endoscopes is special, and strict requirements are placed on the light supplement module: it needs to have sufficient brightness to ensure clear imaging; it needs to have good color rendering performance to accurately restore the color of the tissue; it needs to be miniaturized to adapt to different cavity inspection requirements; most importantly, it must be able to withstand high-temperature and high-pressure sterilization (usually 134℃, 0.2MPa) and the erosion of various chemical disinfectants, while ensuring long-term reliability and stability.

[0005] Currently, the endoscope market is pursuing disposable replacement, and the endoscopes suitable for one-time use mainly include biliary pancreas scopes, gastrointestinal scopes, cystoscopes, bronchoscopes, nasopharyngeal laryngoscopes, and hysteroscopes, which are used in departments such as gastroenterology, urology, respiratory medicine, and gynecology. These scopes correspond to nearly 700 million potential diagnoses and treatments in China, which is a vast blue ocean market.

[0006] The existing endoscopes mainly include: Optical fiber transmission type: the light source is located outside the body, and the light is transmitted to the front end through an optical fiber, and the light source is separated from the main body of the endoscope, and its typical structure includes: a high-intensity light source (such as a xenon lamp or a halogen lamp) located outside the endoscope, and a light guide fiber bundle as a light transmission medium; Front LED direct illumination: a miniature LED lamp bead is directly integrated at the front end of the endoscope probe; when the endoscope is working, the LED lamp bead is powered by the built-in circuit to emit light, and the light is directly irradiated on the detection area in front of the probe; Multispectral light supplement technology: in order to meet different medical diagnosis needs, multispectral light supplement technology has emerged in recent years, which uses multiple LED chips of different wavelengths to realize the output of different spectra through a switching circuit.

[0007] The front LED on the market is usually placed in the same plane as the camera to form a probe, which provides illumination for the camera. Compared with the rear optical fiber, it is more flexible and is not affected by the diameter and bending degree of the optical fiber. However, the front LED is usually a single white light source. The addition of multi-spectral technology can provide light sources of different wavelengths. Due to multi-chip integration, the power density per unit area is high, and the heat dissipation performance is insufficient. LED packaging usually uses ordinary welding. The solder used in ordinary welding (such as soldering) has low thermal conductivity, large solder joint thermal resistance, and low heat transfer efficiency, which causes the working temperature of the LED chip to rise, and the thermal stress is concentrated at the solder joint, affecting long-term reliability; the mechanical strength is insufficient, and the high-temperature stability is poor. Moreover, the endoscope LED package is usually square or circular, which has low application degree for use scenarios with special shape requirements, reduces the overall integrated miniaturization degree, and reduces the application volume.

[0008] Therefore, the existing endoscope cannot meet the high requirements of the current and future field. How to provide a new medical endoscope has become a key point. SUMMARY

[0009] The present application aims to at least solve one of the above-mentioned technical problems in the related art to some extent.

[0010] To this end, the purpose of the present application is to provide a medical endoscope and a multi-spectral ceramic integrated packaging light supplement module, which can more efficiently and clearly identify lesions and significantly improve the accuracy of clinical diagnosis.

[0011] In order to solve the above technical problems, the present application is implemented as follows: The present application provides a medical endoscope multi-spectral ceramic integrated packaging light supplement module, which comprises: a semicircular crescent-shaped special-shaped substrate (11); a camera position (16) and a surgery position (17) opened on the special-shaped substrate; a white light chip (12), a red light chip (13), an orange light chip (14), and a green light chip (15) arranged on the special-shaped substrate; The white light chip (12) is two, which are arranged on the two sides of the camera position (16), the red light chip (13) and the orange light chip (14) are arranged on the outer side of the two white light chips, and the green light chip (15) is arranged on the outer side of the orange light chip (14).

[0012] In addition, the medical endoscope multi-spectral ceramic integrated packaging light supplement module according to the present application can also have the following additional technical features: In some embodiments, the red light chip (13), one of the white light chips (12), the camera bit (16), another of the white light chips (12), the orange light chip (14) and the green light chip (15) are arranged in an arc shape as a whole.

[0013] In some embodiments, the white light chip (12), the red light chip (13), the orange light chip (14) and the green light chip (15) are all soldered on the substrate (11) by a gold-tin eutectic process.

[0014] In some embodiments, the substrate (11) is an alumina or aluminum nitride ceramic substrate.

[0015] In some embodiments, the red light chip (13) is a 630nm red light chip.

[0016] In some embodiments, the orange light chip (14) is a 600nm orange light chip.

[0017] In some embodiments, the green light chip (15) is a 540nm green light chip.

[0018] In some embodiments, the red light chip (13) and the orange light chip (14) are special spectrum chips using a blue light high-power flip chip and a fluorescent powder formulation, and the green light chip (15) is a specially made special waveband flip chip.

[0019] In some embodiments, the light supplementing module is a half-moon-shaped special-shaped module with a size of 9.4*5.54*0.56mm.

[0020] The embodiment of the present application also provides a medical endoscope, comprising an endoscope main body, a half-moon-shaped special-shaped columnar front end head is arranged at the front end of the endoscope main body, and the medical endoscope multispectral ceramic integrated packaging light supplementing module according to any one of the above is fixedly arranged on the upper surface of the front end head and is detachably embedded in the endoscope main body integrally with the front end head.

[0021] Compared with the prior art, the present application has at least the following beneficial effects: In the embodiment of the present application, the medical endoscope multispectral ceramic integrated packaging light supplementing module breaks through the limitation of traditional single white light, obtains spectral information far beyond RGB three colors, and adapts to different clinical needs; among them, 540nm green light as the core waveband of NBI clearly presents the superficial microvessels and accurately distinguishes the boundary between tumor and normal tissue; 600nm orange light is extremely sensitive to blood oxygen changes, provides key parameters for blood oxygen saturation imaging, and generates functional "blood oxygen map"; 630nm red light has strong penetration and is the main wavelength for photodynamic therapy and fluorescence diagnosis. In the embodiment of the present application, the medical endoscope multispectral ceramic integrated packaging light supplement module adopts flip chip integration + gold-tin (Au80Sn20) eutectic process. The flip chip structure can shorten the heat dissipation path, avoid bonding wire vibration / breakage failure, improve interconnection density, and realize mini packaging. The thermal conductivity of gold-tin eutectic solder is above 500 W / mK (far more than the ordinary solder of 50-70 W / mK), the solder joint thermal resistance is low, the thermal stress concentration is reduced, the secondary tin melting is avoided, and the long-term reliability is improved. In the embodiment of the present application, the medical endoscope multispectral ceramic integrated packaging light supplement module perfectly fits the front end of the endoscope in a half-moon shape, avoids the camera and the surgical channel, and does not need to occupy additional space. The endoscope is miniaturized and inductive design, which improves the operation comfort of medical staff and maximizes the space utilization. In the embodiment of the present application, the medical endoscope multispectral ceramic integrated packaging light supplement module and the front end form a full polishing disposable scope system, which can completely solve the pain point of "difficult to completely disinfect" of traditional multiplex endoscopes, eliminate the risk of cross infection (more than 70% of traditional endoscopes have the problem of incomplete sterilization), reduce the cost of hospital equipment maintenance and disinfection, and also ensure that each use is in the best state, thereby improving the operation efficiency.

[0022] The medical endoscope of the present application comprises the medical endoscope multispectral ceramic integrated packaging light supplement module, and thus at least has all the characteristics and advantages of the medical endoscope multispectral ceramic integrated packaging light supplement module, which will not be repeated here. Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS Figure 1 The phantom multispectral images taken by the laboratory endoscope disclosed in an embodiment of the present application are shown in the figure; wherein (a)-(c) are images under 450nm, 525nm and 630nm spectra with blood oxygen saturation of 18%, and (d)-(g) are images under 450nm, 525nm and 630nm spectra with blood oxygen saturation of 98%; Figure 2 The lesion area and blood oxygen saturation imaging disclosed in an embodiment of the present application are shown in the figure; wherein (a) is a lesion area image, and (b) is blood oxygen saturation imaging of the lesion area; Figure 3 The narrow-band imaging white light / 540nm light endoscopic image contrast chart disclosed in an embodiment of the present application is shown in the figure; wherein (a) is an endoscopic image under white light, and (b) is an endoscopic image under NBI; Figure 4The structure diagram of the light supplement module disclosed in one embodiment of the present application is shown in the figure, wherein (a) is the front structure diagram of the light supplement module, and (b) is the back structure diagram of the light supplement module. Figure 5 The schematic diagram of the gold-tin eutectic process disclosed in one embodiment of the present application is shown in the figure, wherein (a) is the COB packaging diagram of the LED, and (b) is the use diagram of AuSn20. Figure 6 The combination diagram of the light supplement module and the front end of the endoscope disclosed in one embodiment of the present application is shown in the figure. Figure 7 The combination diagram of the light supplement module and the front end of the endoscope disclosed in one embodiment of the present application is shown in the figure. Figure 8 The comparison diagram of the collected images of the stomach under different light supplement modes disclosed in one embodiment of the present application is shown in the figure, wherein (a) is under the white light mode, and (b) is under the multispectral mode of the present application.

[0023] Explanation of reference signs: 1-light supplement module; 2-camera; 3-surgical channel; 4-front end; 11-substrate; 12-white light chip; 13-red light chip; 14-orange light chip; 15-green light chip; 16-camera position; 17-surgical position. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely in the embodiments of the present application in combination with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0025] The embodiments of the present application will be described in detail in combination with the accompanying drawings and specific embodiments and application scenarios.

[0026] In some embodiments of the present application, a medical endoscope multispectral ceramic integrated package light supplement module is provided. First, the present application uses a multispectral LED. Traditional endoscopes only use white light illumination, and capture is the reflection of tissue in the visible light band (about 400-700 nanometers), forming a true color image composed of RGB three colors, which is closer to the image seen by the human eye. It mainly relies on the experience of doctors to judge lesions (such as inflammation and tumors) according to color, shape and texture. Multispectral imaging has made a great progress. Multispectral imaging acquires spectral information far beyond RGB three colors by imaging tissue at multiple specific and narrow wavelength bands. Switchable narrow-band light source LEDs are used to irradiate the tissue in turn, and the camera collects single-band images at each irradiation. In addition to using basic white light chips, the present application also uses 600nm orange light chips, 630nm red light chips, and 540nm green light chips. These different wavelength chips correspond to different effects in clinical medicine.

[0027] 630nm red light chip: The scattering and absorption of light in biological tissue will change with wavelength. Hemoglobin (the main component of blood) has strong absorption of blue light and green light, but weak absorption of 600-800nm red light and near-infrared light Figure 1 ). This is called the "optical window". 630nm red light is at the beginning of this window, and its tissue penetration depth is deeper than that of blue light and green light, usually reaching several millimeters. This allows it to detect some information below the mucosal surface, not just surface reflection. 630nm light can be used as an excitation light source for photodynamic therapy. After the patient is given a photosensitizer, the 630nm red light is accurately irradiated to the lesion site through the endoscope, producing highly active singlet oxygen. This singlet oxygen can efficiently destroy cell structure, leading to apoptosis and necrosis of diseased cells (such as cancer cells). 630nm strikes a balance between effectively exciting photosensitizers and achieving sufficient tissue penetration depth, sufficient to treat several millimeter-thick tumor tissue.

[0028] 600nm Orange Light Chip: Applicable to blood oxygen saturation imaging, a more advanced multispectral functional imaging technique. It directly calculates and visualizes tissue oxygenation levels by analyzing the absorption characteristics of hemoglobin at multiple wavelengths. While 600nm light remains within the "optical window" of hemoglobin absorption, its position is unique. Hemoglobin (especially oxyhemoglobin) absorbs strongly at 540-580nm, and absorption significantly decreases at 600nm, but not to the minimum as at 630nm or longer wavelengths. Therefore, its tissue penetration ability lies between green light (e.g., 540nm) and deep red light (e.g., 630nm). This is a key characteristic of 600nm light. It represents a transitional region where the absorption curves of chromophores like hemoglobin drop sharply. Therefore, its sensitivity to blood is lower than green light but higher than 630nm red light. This means it can "penetrate" thin layers of blood to some extent or reduce blood interference with the image, while still providing some vascular contrast information. Figure 2 ).

[0029] In multispectral imaging, 600 nm is a highly valuable characteristic wavelength because it is extremely sensitive to changes in blood oxygenation status. The absorption spectra of oxyhemoglobin and deoxyhemoglobin differ significantly around 600 nm, making 600 nm one of the key parameters for calculating blood oxygen saturation.

[0030] 540nm green light chip: Applicable to narrowband imaging; 540nm light energy is absorbed by slightly deeper blood vessels, appearing green. Figure 3 Hemoglobin reflects almost no red light, so red light is not used. In NBI images, 540nm light clearly reveals the vascular tree in the submucosal layer as a dark green or dark brown network structure. This provides physicians with crucial information about the tissue structure. Because tumor tissue proliferates abnormally and disrupts the normal vascular structure, 540nm light allows for a clear view of the boundary between normal vascular areas and avascular or disordered tumor areas, making the extent of the lesion very clear.

[0031] Table 1

[0032] Table 1 compares the application of three wavelengths and colors of light in endoscopy.

[0033] Secondly, the chips are connected using a flip-chip method. The flip-chip structure reduces the risk of failure due to bonding wire vibration or breakage. The active surface of the chip is directly connected to the substrate through bumps, resulting in a shorter heat conduction path and better heat dissipation efficiency than traditional packaging. Furthermore, using alumina or aluminum nitride ceramic substrates, the performance in terms of thermal conductivity, corrosion resistance, and CTE surpasses that of traditional substrates. Additionally, a eutectic process is employed. Figure 5), eutectic solder (such as AuSn) thermal conductivity up to 500W / mK, far better than ordinary solder (50-70W / mK), low solder joint thermal resistance, high heat transfer efficiency, effectively reduce the LED chip operating temperature, uniform heat distribution reduces the thermal stress concentration, improve the long-term reliability, effectively avoid the secondary tin.

[0034] Finally, the present application and the substrate shape are designed to match the actual use scene, and the LED special-shaped module is completely matched with the endoscope assembly. Figure 6 ), without additional position placement, reducing the volume of medical endoscopes, pursuing small volume in actual use, improving the comfort of the user in the medical use scene. And the design and endoscope assembly form a full-throw disposable mirror body system, effectively solving the problem of cross infection, and one-time use does not exist to the loss of endoscope, can ensure that each time the endoscope in the best state after unpacking, to a certain extent, improve the operation efficiency. In addition, disposable endoscopes can effectively control the cost related to endoscopes in hospitals, and promote the promotion of endoscopic surgery in primary hospitals.

[0035] Embodiment 1: The present embodiment provides a multispectral ceramic aluminum nitride integrated packaging medical endoscope light supplement module, which uses ceramic material as the main material of the substrate. The ceramic material (such as aluminum oxide, aluminum nitride) has high thermal conductivity and excellent insulation performance, can quickly conduct the heat generated by the LED chip and ensure the safety of the circuit, is not prone to degradation reaction, and ensures the reliability and safety of the equipment. Adopting flip chip integration technology: flip the high-power LED chip on the ceramic substrate, the thickness of the substrate is controlled within 0.5mm, reducing the occupied space. The flip structure reduces the risk of failure caused by the vibration or fracture of the bonding wire, the active surface of the chip is directly connected with the substrate through the bump, the heat conduction path is shorter, the heat dissipation efficiency is better than the traditional packaging, which is conducive to the stable operation of high-power chips, the interconnection density is significantly improved, the packaging area is saved, the high performance and high integration requirement is met, and the mini packaging LED is realized. Two 5000K color temperature white light chips, one 540nm green light chip, one 600nm orange light chip and one 630nm red light chip are integrated on one module (as shown in Figure 3 ), on the basis of the traditional white light endoscope, multiple spectra are added to obtain more spectral information, and a mixed multispectral design considering white light and colored light is adopted, which can simultaneously meet the special light supplement effect in different environments.

[0036] Secondly, the present application adopts a eutectic process, and uses a gold-tin eutectic alloy (Au80Sn20) Figure 5), which consists of an eutectic alloy of gold and tin in a mass ratio of 80% gold (Au) and 20% tin (Sn). This alloy has a low melting point of about 280°C and is commonly used in soldering of electronic components and optoelectronic packages. The soldering process is mainly through intermetallic diffusion, melting and penetrating into the contact surface to form a firm connection. This material has the characteristics of moderate soldering temperature (300-310°C), high yield strength, no need for flux welding and high thermal conductivity. The characteristics of gold-tin eutectic alloy are that it can complete welding at a relatively low temperature, has good fluidity and wettability, can effectively fill the weld, and avoid the damage caused by high temperature welding. The yield strength of gold-tin alloy is very high. Even at a temperature of 250-260°C, its strength can meet the requirements of airtightness. Gold-tin alloy is close in composition to the gold-plated layer, so the degree of dissolution of the thin plating layer through diffusion is low, and there is no migration phenomenon like silver. In addition, Au-Sn solder also has high corrosion resistance, high creep resistance and good thermal and electrical conductivity, and high stability during medical use, ensuring the necessary safety of medical treatment.

[0037] Finally, the ceramic substrate is cut into a special shape using ceramic laser cutting technology. The cutting is performed using a picosecond laser, which forms a groove on the material surface through precise focusing of the light beam, and the fracture is realized after applying stress. The cut multi-spectrum LED module and endoscope assembly perfectly fit together, and the heterogeneous structure integration design module matches the front end, saving space and fully improving space utilization. The multi-spectrum LED module and endoscope assembly form a disposable mirror system, and the disposable endoscope and portable host are matched, which can be applied to more diverse scenes such as bedside, emergency, and primary care.

[0038] The endoscope multi-spectrum LED module has overall product dimensions of 9.4*5.54*0.56mm, and the ceramic substrate has a thickness of 0.5mm. Two custom white light LED models are MK-THWE-05L18F020, with dimensions of 1.1x1.1x0.3mm. Red light (630nm), orange light (600nm), and green light (540) LEDs are custom-made, with dimensions of 1.1x1.1x3mm. The design takes into account the mixing of white light and colored light, and can simultaneously meet the special lighting effect in different environments.

[0039] The support uses an alumina or aluminum nitride ceramic substrate, with multi-layer circuit etching using ITO technology and electrical separation technology. High-power flip-chip design is used.

[0040] The gold-tin eutectic process, 300℃ vacuum high-temperature gold-tin eutectic process, improves the thermal conductivity and prevents secondary tin dissolution during back welding. Red light (630nm) and orange light (600nm) can be special spectra using blue light high-power flip-chip and fluorescent powder adjustment, and green light (540nm) is a special waveband flip-chip.

[0041] The alumina or aluminum nitride ceramic substrate using thermoelectric separation technology is used as a packaging support, and the gold-tin eutectic process is used for packaging. The laser cutting process is used for the integration design of the special-shaped structure module, and the overall product size is a semicircular crescent-shaped special-shaped module with a size of 9.4*5.54*0.56mm. The semicircular crescent-shaped special-shaped module (supplementary light module 1) includes a semicircular crescent-shaped special-shaped substrate 11, a camera position 16 (for installing a camera 2) and a surgical position 17 (for installing an automatic surgical instrument) opened on the special-shaped substrate, white light chips 12, red light chips 13, orange light chips 14, and green light chips 15 arranged on the special-shaped substrate. Two white light chips 12 are arranged on both sides of the camera position 16, one red light chip 13 and one orange light chip 14 are arranged outside the two white light chips 12, and the green light chip 15 is arranged outside the orange light chip 14 (as shown in Figure 4 ). The semicircular crescent-shaped special-shaped module is fixedly arranged at the upper end of the also semicircular crescent-shaped special-shaped columnar front end head 4, and is embedded in the cylindrical endoscope together with the front end head 4 (as shown in Figure 7 ). The front end head 4 is provided with a through-hole surgical channel 3, which is matched in position and size with the surgical position 17.

[0042] The high-precision laser cutting process is used for the integration design of the special-shaped structure module, which matches the front end head, saves space, fully improves the space utilization rate, and can be applied to the detection and application of medical endoscopes in the digestive system.

[0043] The endoscope in the above embodiment has at least the following beneficial effects: 1. The traditional endoscope LED can only present the natural color of the mucosa, while the multi-spectral LED can penetrate the mucosal tissue through different wavelengths of light, capture the differences between the lesion area and normal tissue in terms of hemoglobin, blood oxygen content, etc., and automatically generate a "highlight mark" - for example, early gastric cancer tissue will present a different color contrast under multi-spectrum (as shown in Figure 8 ), which can be quickly identified even by inexperienced doctors. The present application integrates 630nm, 600nm, 540nm and white light chips together to meet the various core applications required by the endoscope.

[0044] 2. The special-shaped structure module is integrated and designed, which matches the front end head, saves space, and fully improves the utilization rate; in actual use, small size, non-inductive, and improved comfort of the user in the medical use scene are pursued.

[0045] 3. Using aluminum nitride substrate, degradation reaction is not easy to occur, which guarantees the reliability and safety of the equipment. The performance of heat conductivity, corrosion resistance and CTE exceeds that of traditional plates, which guarantees the safety of medical process. The low temperature rise effect of endoscope under high power and high brightness is guaranteed. It is beneficial to the overall endoscope below 41 degrees of human body safety temperature.

[0046] 4. Using eutectic process, 300 DEG C vacuum high temperature gold tin eutectic process, the thermal conductivity is improved, and the back soldering secondary tin solution is prevented, so that the reliability problem of soldering symbiosis process is solved.

[0047] The part not described in detail in the present application can refer to the prior art or the known technology of those skilled in the art, and the present embodiment is not limited thereto, and will not be described in detail here.

[0048] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which all belong to the protection of the present application.

Claims

1. A multispectral ceramic integrated encapsulated supplementary lighting module for medical endoscopes, characterized in that, The supplementary lighting module includes: Semi-circular crescent-shaped irregular substrate (11); Camera position (16) and surgical position (17) are provided on the irregular substrate. White light chip (12), red light chip (13), orange light chip (14) and green light chip (15) are disposed on the irregularly shaped substrate. There are two white light chips (12), which are respectively located on both sides of the camera position (16). The red light chip (13) and the orange light chip (14) are respectively located on the outside of the two white light chips. The green light chip (15) is located on the outside of the orange light chip (14).

2. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to claim 1, characterized in that, The red light chip (13), one of the white light chips (12), the camera position (16), another of the white light chips (12), the orange light chip (14) and the green light chip (15) are arranged in an arc shape.

3. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to claim 1, characterized in that, The white light chip (12), the red light chip (13), the orange light chip (14) and the green light chip (15) are all welded onto the substrate (11) using a gold-tin eutectic process.

4. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to claim 3, characterized in that, The substrate (11) is an alumina or aluminum nitride ceramic substrate.

5. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to any one of claims 1-4, characterized in that, The red light chip (13) is a 630nm red light chip.

6. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to any one of claims 1-4, characterized in that, The orange light chip (14) is a 600nm orange light chip.

7. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to any one of claims 1-4, characterized in that, The green light chip (15) is a 540nm green light chip.

8. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to any one of claims 1-4, characterized in that, The red light chip (13) and the orange light chip (14) are special spectral chips made by using blue high-power flip chips and phosphors, and the green light chip (15) is a specially made special band flip chip.

9. The integrated multispectral ceramic encapsulated supplementary lighting module for medical endoscopes according to claim 1, characterized in that, The fill light module is a crescent-shaped irregular module with dimensions of 9.4*5.54*0.56mm.

10. A medical endoscope, comprising an endoscope body, characterized in that, The endoscope body has a semi-circular crescent-shaped columnar tip at its front end. The medical endoscope multispectral ceramic integrated encapsulation supplementary light module according to any one of claims 1-9 is fixedly disposed on the upper surface of the tip and is detachably embedded in the endoscope body along with the tip.

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