Laser processing system, processing platform negative pressure control method thereof and circuit board

Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to a laser processing system, a processing platform negative pressure control method of the laser processing system and a circuit board, and the processing platform negative pressure control method of the laser processing system comprises the steps that a, target negative pressure information is obtained based on a first processing state of a first circuit board to be processed in the laser processing system; b, acquiring real-time negative pressure information of a negative pressure chamber in the processing platform based on a second processing state of a second circuit board to be processed in the laser processing system; c, comparing the real-time negative pressure information with the target negative pressure information to obtain a negative pressure difference value; and d, the negative pressure of the negative pressure cavity in the machining platform is adjusted according to the negative pressure difference value. After the circuit board is replaced or the processing state of the circuit board is changed, the negative pressure of the negative pressure chamber can be adjusted to the target negative pressure based on the negative pressure difference value between the real-time negative pressure information of the negative pressure chamber and the target negative pressure information, and the adsorption stability of the negative pressure chamber to the circuit board to be processed is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit board manufacturing, and particularly relates to a laser processing system, a processing platform negative pressure control method thereof and a circuit board. BACKGROUND

[0002] In laser processing, stable positioning of products is achieved by relying on a processing platform. At present, a vacuum adsorption method is mostly used to fix the products on the processing platform.

[0003] Due to differences in structural parameters of different products and significant differences in structural parameters of the same product in different processes, the demand for adsorption force is also different. However, the vacuum adsorption system of the processing platform in the related art can only provide a fixed and unchanged negative pressure, and the product is difficult to match the most suitable adsorption force, resulting in poor fixing effect on the product, thereby affecting the processing quality. SUMMARY

[0004] The application aims to provide a laser processing system, a processing platform negative pressure control method thereof and a circuit board, and aims to solve the problem of poor adsorption effect of the laser processing system in the prior art.

[0005] The first aspect of the application embodiment provides a processing platform negative pressure control method of a laser processing system, comprising: a. obtaining target negative pressure information based on a first processing state of a first circuit board to be processed in the laser processing system; b. obtaining real-time negative pressure information of a negative pressure chamber in the processing platform based on a second processing state of a second circuit board to be processed in the laser processing system; c. comparing the real-time negative pressure information and the target negative pressure information to obtain a negative pressure difference value; d. adjusting the negative pressure of the negative pressure chamber in the processing platform according to the negative pressure difference value.

[0006] In some embodiments of the application, the negative pressure control method further comprises cyclically executing steps a to d until the negative pressure difference value belongs to a preset range.

[0007] In some embodiments of the application, if the negative pressure difference value does not belong to the preset range, an alarm prompt is triggered.

[0008] In some embodiments of the application, the first circuit board to be processed and the second circuit board to be processed belong to the same basic feature or belong to different basic features.

[0009] In some embodiments of the application, the first processing state and the second processing state belong to the same processing state or belong to different processing states.

[0010] In some embodiments of the present application, the basic characteristics at least include one of material, thickness, rigidity, size, roughness, surface flatness, or weight distribution.

[0011] In some embodiments of the present application, the processing state at least includes one of a processing stage, an effective adsorption area.

[0012] In some embodiments of the present application, wherein, based on the first processing state of the first to-be-processed circuit board in the laser processing system, the target negative pressure information is obtained, including obtaining processing parameters based on the first processing state of the first to-be-processed circuit board in the laser processing system, extracting the target negative pressure information from the processing parameters, or calculating the target negative pressure information in real time according to the processing parameters. According to the processing parameters, a matching preset range is obtained from a preset production processing file.

[0013] The second aspect of the embodiments of the present application also provides a laser processing system, which comprises a laser assembly, a processing platform, a negative pressure detection assembly, a negative pressure adjusting assembly, and a main control assembly. The laser assembly is electrically connected with the main control assembly and is controlled by the main control assembly to perform laser processing on a to-be-processed circuit board. The processing platform is internally structured to form a negative pressure chamber, which is in communication with an adsorption surface of the processing platform, and the adsorption surface is used to fix the to-be-processed circuit board by negative pressure adsorption. The negative pressure detection assembly is connected with the processing platform to detect real-time negative pressure information of the negative pressure chamber. The negative pressure adjusting assembly is connected with the processing platform to adjust the negative pressure of the negative pressure chamber. The main control assembly comprises an input unit, a calculation unit, and a control unit. The input unit is used to obtain target negative pressure information of the to-be-processed circuit board and / or real-time negative pressure information of the negative pressure chamber in the processing platform. The calculation unit is used to calculate a negative pressure difference value of the target negative pressure information and the real-time negative pressure information. The control unit is electrically connected with the negative pressure adjusting assembly and is used to output a negative pressure adjusting signal to the negative pressure adjusting assembly according to the negative pressure difference value, so as to control the negative pressure adjusting assembly to adjust the negative pressure of the negative pressure chamber in the processing platform.

[0014] In some embodiments of the present application, the negative pressure detection assembly comprises a negative pressure sensor. And / or, the negative pressure adjusting assembly comprises one of a pneumatic proportional valve, an electric proportional valve, an electric adjusting valve, and an electric servo valve. And / or, the main control assembly comprises one of a digital controller, a programmable controller, a digital temperature controller, and a digital regulator.

[0015] In some embodiments of the present application, the negative pressure adjusting assembly comprises: a valve body, an air inlet end of the valve body being in communication with the negative pressure chamber, an air outlet end of the valve body being in communication with the external air source, so as to form a negative pressure air path between the negative pressure chamber and the external air source; a valve body regulator, a signal input end of the valve body regulator being electrically connected with the main control assembly, a signal output end of the valve body regulator being electrically connected with a driving end of the valve body, the valve body regulator being configured to adjust an opening degree of the valve body according to the negative pressure adjusting signal, so as to adjust a gas flow of the negative pressure air path, thereby adjusting the negative pressure of the negative pressure chamber.

[0016] In some embodiments of the present application, the laser processing system comprises a plurality of the processing platforms, the plurality of the processing platforms being connected with a plurality of the negative pressure detection assemblies one by one, and the plurality of the processing platforms being connected with a plurality of the negative pressure adjusting assemblies one by one.

[0017] In a third aspect of the embodiments of the present application, a computer readable storage medium is further provided, and the computer readable storage medium stores a computer program, and the computer program is executed by a processor to implement the steps of the above method.

[0018] In a fourth aspect of the embodiments of the present application, a circuit board is further provided, and the circuit board is prepared by using the above method or the laser processing system, wherein the circuit board comprises a core board and at least one electrically conductive layer and at least one electrically insulating layer arranged on a main surface of the core board.

[0019] The laser processing system and the processing platform negative pressure control method thereof, and the circuit board provided in the present application have the following beneficial effects: the processing platform negative pressure control method of the laser processing system comprises: a. obtaining target negative pressure information based on a first processing state of a first circuit board to be processed in the laser processing system; b. obtaining real-time negative pressure information of a negative pressure chamber in a processing platform based on a second processing state of a second circuit board to be processed in the laser processing system; c. comparing the real-time negative pressure information and the target negative pressure information to obtain a negative pressure difference; and d. adjusting the negative pressure of the negative pressure chamber in the processing platform according to the negative pressure difference. After the circuit board is replaced or the processing state thereof is changed, the negative pressure of the negative pressure chamber can be adjusted to the target negative pressure based on the negative pressure difference between the real-time negative pressure information and the target negative pressure information of the negative pressure chamber, which is conducive to improving the adsorption stability of the negative pressure chamber to the circuit board to be processed. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1A step schematic diagram of a processing platform negative pressure control method of a laser processing system provided by an embodiment of the present application is shown in the figure. Figure 2 A frame structure schematic diagram of a laser processing system provided by an embodiment of the present application is shown in the figure. Figure 3 A structure schematic diagram of a laser processing system provided by an embodiment of the present application is shown in the figure. Figure 4 Another structure schematic diagram of a laser processing system provided by an embodiment of the present application is shown in the figure. Figure 5 A structure schematic diagram of a laser processing system provided by another embodiment of the present application is shown in the figure.

[0021] Specific element symbol explanation: 10-laser processing system, 100-laser assembly, 200-processing platform, 210-negative pressure chamber, 300-negative pressure detection assembly, 310-negative pressure sensor, 400-main control assembly, 500-negative pressure adjustment assembly, 20-circuit board to be processed. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0023] It should be noted that when an element is referred to as "provided on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0024] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0025] It should be noted that the term "circuit board" in the context of the present application can specifically include a PCB (Printed Circuit Board), an IC (Integrated Circuit) packaging substrate or other circuit boards for realizing chip connection; it should be noted that the circuit board is used to carry electronic components (chips, resistors, capacitors, inductors, diodes, transistors, amplifiers, etc.) and realize electrical connection between different electronic components. Specifically, the circuit board in the context of the present application includes ordinary boards, multi-layer boards, HDI (High Density Interconnect), FPC (Flexible Printed Circuit) and other PCBs (Printed Circuit Boards) and IC (Integrated Circuit) carriers, wafer carriers, optical module carriers and their semi-finished products made of organic substrates, ceramic substrates or glass, etc. In some feasible embodiments, the circuit board can be formed by stacking the electrically conductive layer and the electrically insulating layer parallel to each other and subjected to mechanical and / or thermal pressing, wherein the electrically insulating layer is used to isolate the electrically conductive layer and provide local interconnection between layers, and the electrically insulating layer can be made of materials such as glass fiber and resin, etc. The electrically conductive layer is used to transmit current and signals, etc., and can be made of materials with good conductivity, such as metal (especially copper), or carbon (especially graphene), etc.

[0026] It should be noted that in the field of laser processing, for the processing of various products such as panels, carriers, wafers, PCBs, glass substrates, optical modules, server IC carriers, etc., stable positioning of the products on the processing platform is required to ensure the precision and quality of subsequent precision processing procedures such as laser cutting and engraving. At present, negative pressure adsorption is mostly used to fix the products carried on the processing platform, wherein the bearing surface of the processing platform is used to place the products that need to be adsorbed and fixed; when a negative pressure environment is formed in the negative pressure chamber in the processing platform, the adsorption structure connected between the negative pressure chamber and the adsorption surface can generate adsorption force through the pressure difference between the external air pressure and the negative pressure chamber, tightly adsorbing the product on the adsorption surface of the processing platform, avoiding displacement and deviation of the product during processing due to external force (such as laser impact, equipment vibration), ensuring that the processing trajectory is consistent with the preset path, and providing a basic guarantee for high-precision laser processing.

[0027] However, the structural parameters of different products are significantly different, and their requirements for adsorption force are also different; for example, multi-layer large-size thick plate products (such as thick PCBs and ceramic substrates) require relatively large adsorption force to overcome their own gravity and processing stress, so as to prevent warping or displacement during processing; while high-value flexible products (such as optical modules and thin IC carrier boards) and high-precision ultra-thin products (such as wafers and silicon wafers) require relatively small adsorption force to avoid product deformation and damage caused by excessive adsorption force; at the same time, even for the same type of product, the required adsorption force will dynamically change with the processing progress during continuous processing (such as laser cutting, which gradually hollows out the product shape to release pressure); a smaller adsorption force is required at the initial stage without porosity, and a larger adsorption force is required after hollowing to maintain stable adsorption.

[0028] The inventors of the present application found that in the related art laser processing system, the negative pressure adsorption system of the processing platform mostly adopts a direct connection type design, which can only provide a fixed and unchanging negative pressure, and cannot adjust the adsorption force in real time according to the structural parameters (such as thickness, size, material flexibility) of the product or the processing progress, resulting in that the product is difficult to match the most suitable adsorption force. Either the product is displaced due to insufficient adsorption force, affecting the processing precision; or the product is deformed and damaged due to excessive adsorption force, reducing the quality and yield of the product, which seriously restricts the adaptability of the circuit board laser processing system to multiple types and specifications of products, and cannot meet the stable production needs of high-value and high-precision products. Based on this, the present application proposes a laser processing system and a processing platform negative pressure control method and a circuit board to improve the above-mentioned problems in the related art.

[0029] Please refer to Figure 1 and Figure 2 , Figure 1 shows the steps of the processing platform negative pressure control method of the laser processing system provided by the embodiments of the present application, Figure 2 shows the structural schematic diagram of the laser processing system 10 provided by the embodiments of the present application; as Figure 2 in the first and second to-be-processed circuit boards are both to-be-processed circuit boards 20; the processing platform negative pressure control method of the laser processing system of the embodiments of the present application comprises: Based on the first processing state of the first to-be-processed circuit board in the laser processing system 10, target negative pressure information is obtained; specifically, the target negative pressure information is a negative pressure chamber 210 pressure parameter preset according to the first processing state of the first to-be-processed circuit board, is a target reference for negative pressure adjustment, can adapt to the adsorption demand of the first to-be-processed circuit board, and avoids deformation of the circuit board caused by excessive pressure or loosening of adsorption caused by insufficient pressure; the first to-be-processed circuit board is a new circuit board to be switched in the laser processing process (or a workpiece after the same circuit board is switched to a processing state), and the adsorption pressure suitable for the first to-be-processed circuit board needs to be determined according to its own processing state, which is the target object of negative pressure adjustment. The first processing state is a specific working condition or attribute state of the first to-be-processed circuit board, such as the processing stage of the circuit board (initially unprocessed / semi-processed hollowing), and different processing states correspond to different adsorption pressure requirements.

[0030] b. Based on the second processing state of the second to-be-processed circuit board in the laser processing system 10, real-time negative pressure information of the negative pressure chamber 210 in the processing platform 200 is obtained; Specifically, the real-time negative pressure information is the actual pressure data of the negative pressure chamber 210 under the processing state of the second to-be-processed circuit board, which is collected in real time by a negative pressure detection component (such as a negative pressure sensor 310), and can dynamically reflect the current pressure status of the negative pressure chamber 210. The second to-be-processed circuit board is a circuit board that has completed processing in the laser processing process, and serves as a reference object for negative pressure adjustment. By collecting real-time negative pressure information under its processing state, current pressure data support is provided for negative pressure adjustment of the first to-be-processed circuit board. The second processing state is a specific working condition or attribute state of the second to-be-processed circuit board.

[0031] c. Comparing the real-time negative pressure information and the target negative pressure information, a negative pressure difference is obtained; Specifically, the negative pressure difference is the pressure difference between the real-time negative pressure information and the target negative pressure information, which can directly reflect the deviation degree of the current negative pressure and the target pressure required by the first to-be-processed circuit board, and can be used to judge the adjustment direction (increase / decrease negative pressure) and the adjustment amplitude of the negative pressure.

[0032] d. Adjusting the negative pressure of the negative pressure chamber 210 in the processing platform 200 according to the negative pressure difference.

[0033] Specifically, the negative pressure adjustment can be performed according to the negative pressure difference in the embodiments of the present application, so that the pressure of the negative pressure chamber 210 quickly approaches the target negative pressure of the first to-be-processed circuit board, dynamically adapts to the requirements after the circuit board is replaced or the state is switched, and avoids the problem of adsorption failure after the working condition changes in the traditional fixed pressure adsorption. Specifically, if the difference shows that the negative pressure needs to be increased (for example, the first to-be-processed circuit board is a thick board), the valve opening can be adjusted to increase the negative pressure of the negative pressure chamber 210; if the difference shows that the negative pressure needs to be reduced (for example, the first to-be-processed circuit board is a thin board), the valve opening can be adjusted to reduce the negative pressure, and the adjustment process does not require manual intervention and responds quickly, which is beneficial to ensure that the first to-be-processed circuit board obtains stable adsorption force immediately after being replaced, and avoids the problem of laser processing path deviation caused by unstable adsorption.

[0034] In some embodiments, the target negative pressure information can be directly extracted from the preset processing parameters, or can be calculated based on the preset processing parameters.

[0035] In some embodiments of the present application, the negative pressure control method further comprises: cyclically performing steps a to d until the negative pressure difference belongs to a preset range.

[0036] It should be explained that the cyclic execution means that the operation mode of steps a to d is repeatedly run in the negative pressure control process of the laser processing system 10, so that the pressure of the negative pressure chamber 210 always approaches the target negative pressure until the preset requirement is met.

[0037] It can be understood that the cyclic execution mode in the embodiments of the present application can form a closed loop control, which can ensure that the pressure of the negative pressure chamber 210 is always stable in the preset range, so that the adsorption stability can be maintained through continuous adjustment even if the processing state dynamically changes or the external working condition fluctuates, and the problem of pressure out of control in the traditional open loop control can be avoided.

[0038] In some embodiments of the present application, if the negative pressure difference does not belong to the preset range, an alarm prompt is triggered.

[0039] It should be explained that the alarm prompt is a warning function in the laser processing system 10 for informing the operator of the negative pressure abnormality, which can be triggered in the form of a pop-up window of an upper computer system interface, an audible and visual signal (such as an indicator light flickering and a buzzer alarm), or a system message push, and is used to timely feedback the problem of the negative pressure difference out of range, guide the operator to intervene in processing, and avoid processing defects or equipment failures caused by negative pressure abnormalities.

[0040] It can be understood that when the negative pressure difference value exceeds the range, the alarm prompt can immediately suspend the laser processing process, avoiding the continuation of processing under the abnormal state of negative pressure, which leads to the scrap of the circuit board. If the first to-be-processed circuit board is a high-value flexible IC carrier board, which requires precise negative pressure for adsorption, if the negative pressure difference value exceeds the range (such as the real-time negative pressure being too low to cause the carrier board to loosen), the alarm prompt will be triggered immediately, the system will stop laser emission, and irreversible damage caused by the displacement of the carrier board will be prevented, which is beneficial to reduce the processing loss of high-value products.

[0041] In some embodiments of the present application, the first to-be-processed circuit board and the second to-be-processed circuit board belong to the same basic feature or belong to different basic features.

[0042] It needs to be explained that the basic feature can be divided based on the material of the circuit board (such as a PCB board, a ceramic substrate, a flexible IC carrier board), a structural type (such as a single-layer board, a multi-layer board, an ultra-thin board), a processing purpose (such as a wafer carrier board, an optical module carrier board), etc. The circuit boards of the same basic feature have commonality in the adsorption negative pressure demand and the processing process adaptability, and the circuit boards of different basic features require differentiated negative pressure control and processing parameters.

[0043] It can be understood that when the first to-be-processed circuit board and the second to-be-processed circuit board belong to the same basic feature, the adsorption negative pressure demand law (such as requiring lower negative pressure when there is no initial pore, and requiring higher negative pressure after processing the hollow) has consistency, which can simplify the acquisition logic of the target negative pressure information, and at the same time ensure the coherence of the negative pressure adjustment strategy. If the first to-be-processed circuit board and the second to-be-processed circuit board are both the same basic feature, the same basic feature process formula can be reused, the parameter configuration time is reduced, and the production efficiency is improved.

[0044] When the first to-be-processed circuit board and the second to-be-processed circuit board belong to different basic features, the difference between the basic features can be determined, the target negative pressure information and the adjustment logic of the negative pressure control method can be adjusted, and the problem that the traditional fixed pressure adsorption cannot adapt to different basic feature circuit boards can be avoided.

[0045] In some embodiments of the present application, the first processing state and the second processing state belong to the same processing state or belong to different processing states.

[0046] It needs to be explained that the processing state is the specific working condition or stage feature of the to-be-processed circuit board 20 in the laser processing process, which is usually divided based on the processing progress of the circuit board (such as initial unprocessed, half-processed, and processing end), structural changes (such as no pore on the surface, local hollowing, and large-area pressure relief), process requirements (such as pre-positioning, fine cutting, and edge trimming), etc. dimensions, which can determine the adsorption pressure demand of the circuit board to the negative pressure chamber 210.

[0047] It can be understood that when the first processing state and the second processing state belong to the same processing state (such as both being initial unprocessed, surface without aperture), the pressure requirement of the negative pressure chamber 210 has consistency, which can simplify the negative pressure control process and improve the negative pressure adjustment efficiency and stability. When the two belong to different processing states (such as the second to-be-processed circuit board being initial unprocessed and the first to-be-processed circuit board being semi-processed hollow), the setting can guide the negative pressure control method to adjust the target negative pressure and the adjustment strategy in a targeted manner by clearly distinguishing the processing state difference, thereby avoiding the problem that the traditional fixed pressure cannot adapt to the change of the processing state.

[0048] In some embodiments, the first to-be-processed circuit board 20 and the second to-be-processed circuit board 20 are the same basic feature, and the first processing state and the second processing state are different processing states. It can be that the same type of circuit board is in different processing states, in particular, the same circuit board is in different processing states (for example, different time sequences). Initially, the circuit board has no aperture, and a small pressure can prevent the product from deforming or deviating. With continuous production, the circuit board gradually becomes hollow and releases pressure according to the increase of the processing pattern (hole, groove, window), and the required pressure continues to increase. The negative pressure control method of the present application can provide matched adsorption negative pressure for different processing states of the same circuit board.

[0049] In some embodiments, the first to-be-processed circuit board and the second to-be-processed circuit board are the same basic feature, and the first processing state and the second processing state are the same processing state. If the negative pressure difference is still greater than the preset value at this time, an alarm signal is output to prompt that the laser processing system 10 has a fault (such as air leakage of the negative pressure passage).

[0050] In some embodiments, the first to-be-processed circuit board and the second to-be-processed circuit board are different basic features, and the first processing state and the second processing state are the same processing state. The negative pressure control method of the present application can provide matched adsorption negative pressure for different circuit boards.

[0051] In some embodiments, the first to-be-processed circuit board and the second to-be-processed circuit board are different basic features, and the first processing state and the second processing state are different processing states. At this time, the second to-be-processed circuit board is removed after completing processing, and the first to-be-processed circuit board is about to enter the processing state.

[0052] In some embodiments of the present application, the basic feature at least includes one of the following: material, thickness, rigidity, size, roughness, surface flatness, or weight distribution.

[0053] It needs to be explained that the material is the basic material property of the circuit board, such as PCB (epoxy resin base material), ceramic substrate (alumina / nitride material), flexible IC carrier board (polyimide material), etc. The structural strength and pressure resistance of different materials are different, for example, the flexible material needs lower negative pressure to avoid deformation, and the rigid ceramic material needs higher negative pressure to ensure stable adsorption. Thickness is the longitudinal size attribute of the circuit board, which can be divided into thick plates (such as multi-layer PCB thick plates) and thin plates (such as ultra-thin wafer carrier plates), etc. The thickness directly affects the anti-deformation ability and adsorption area requirement of the circuit board. Thick plates need higher negative pressure to maintain adsorption due to their large weight and volume, and thin plates need precise control of low pressure due to their easy deformation. Rigidity is the physical property of the circuit board resisting external force deformation, which can be divided into rigid (such as ceramic substrate, rigid PCB) and flexible (such as flexible light module carrier board) two categories. Rigid circuit boards have strong negative pressure fluctuation resistance, and flexible circuit boards need very small negative pressure fluctuation to avoid wrinkles.

[0054] Size is the planar specification attribute of the circuit board (such as length, width, area). Large-size circuit boards need uniform negative pressure distribution and slightly higher pressure to avoid local loosening. Small-size circuit boards have small adsorption area and need lower negative pressure to prevent excessive adsorption leading to deformation. Roughness is the micro-level smoothness attribute of the surface of the circuit board. The gap between the surface of the circuit board with rough surface and the adsorption surface is larger, which is easy to leak pressure. The surface of the circuit board with smooth surface is tightly bonded, and the negative pressure requirement is relatively low. Surface flatness is the macro-level flatness attribute of the surface of the circuit board. Circuit boards with poor flatness (such as local protrusions / recesses) are easy to cause uneven stress on the adsorption surface, and need to adjust the pressure distribution through negative pressure adjustment. Circuit boards with high flatness have uniform adsorption stress.

[0055] In some embodiments of the present application, the processing state at least includes one of: processing stage, effective adsorption area.

[0056] It needs to be explained that the processing stage refers to the specific link of the laser processing flow of the to-be-processed circuit board 20, covering the initial unprocessed, semi-processed, and processing tail stages. The structural features of the circuit board at different stages (such as whether there are hollows or pressure relief levels) are different, for example, the initial unprocessed stage circuit board has no pores on the surface, and the processing tail stage circuit board has a large number of hollows. The effective adsorption area is the area of the negative pressure chamber 210 of the processing platform 200 and the to-be-processed circuit board 20 actually contacting and generating adsorption force. This area changes dynamically during the processing of the circuit board, for example, the effective adsorption area of the circuit board is the complete area of the board at the initial processing, and the effective adsorption area decreases due to the hollow during processing.

[0057] It can be understood that the processing stage can guide the negative pressure control method to dynamically adjust the target negative pressure according to the progress of the circuit board processing, avoiding the problem that the traditional fixed pressure cannot adapt to the changes in the processing stage. For example, step a obtains the high target negative pressure information suitable for the first to-be-processed circuit board based on the processing stage (such as semi-processing), step b obtains the low real-time negative pressure information of the second to-be-processed circuit board (such as initial unprocessed), step c calculates the difference, and step d increases the valve opening degree through the proportional regulating valve to increase the negative pressure, so as to ensure that the pressure relief caused by the hollowing of the semi-processed circuit board is compensated.

[0058] The inclusion of the effective adsorption area can allow the negative pressure control method to adjust the pressure according to the actual change of the effective adsorption area, avoiding the problem that the adsorption force is insufficient due to the decrease of the adsorption area, or the pressure is too large due to the increase of the adsorption area. For example, when step a obtains the target negative pressure information, a higher target negative pressure can be set in combination with the effective adsorption area (such as the reduced area) of the first to-be-processed circuit board, so as to maintain sufficient adsorption force; after step b obtains the real-time negative pressure information, step c calculates the difference, and step d increases the negative pressure through the linkage of the digital regulator and the proportional regulating valve (closed-loop control mentioned in the file), so as to ensure that the adsorption force is adapted to the change of the effective adsorption area, for example, the effective adsorption area is reduced, and the negative pressure is increased to avoid the decrease of the adsorption force.

[0059] In some embodiments of the present application, based on the first processing state of the first to-be-processed circuit board in the laser processing system 10, the target negative pressure information is obtained, including obtaining the processing parameter based on the first processing state of the first to-be-processed circuit board in the laser processing system 10, extracting the target negative pressure information from the processing parameter, or calculating the target negative pressure information in real time according to the processing parameter; and obtaining the matching preset range from the preset production processing file according to the processing parameter.

[0060] It needs to be explained that the processing parameter is a set of various technical parameters related to the processing of the first to-be-processed circuit board in the laser processing system 10, covering the dimensions of negative pressure control, laser power, processing speed, etc., wherein the negative pressure related parameters are directly related to the circuit board adsorption demand, and other parameters (such as processing speed, cutting path) may also indirectly affect the negative pressure adaptability, which is usually pre-configured or generated in real time according to the basic characteristics (such as material, thickness) and processing demand of the circuit board.

[0061] The production processing file is a standardized process document stored in the laser processing system IPC host computer, which contains a set of preset parameters in different circuit board processing scenarios, such as target negative pressure information, negative pressure difference preset range, laser processing parameter corresponding to different processing states, different basic characteristics, etc. It can be flexibly called according to the actual production demand, without the need for repeated manual configuration.

[0062] It can be understood that the application sets the target negative pressure information pre-stored in the processing parameter by directly calling, which can greatly shorten the preparation time of negative pressure adjustment, avoid the delay of real-time calculation, and is especially suitable for batch standardized production scene. If the first to-be-processed circuit board is a batch-produced PCB multilayer board, the target negative pressure information corresponding to the state has been pre-stored in the processing parameter, step a can directly extract from the processing parameter without additional calculation, quickly providing a reference for subsequent negative pressure adjustment, which is beneficial to improve the continuity of batch production.

[0063] The application can also calculate the target negative pressure information in real time according to the processing parameter. This way, the target negative pressure is dynamically derived based on the processing parameter through an algorithm, which can adapt to dynamic changes in processing state or non-standard processing scene, avoiding the limitations of fixed extraction methods that cannot cope with complex working conditions. If the first to-be-processed circuit board is in a semi-processed state (first processing state), the effective adsorption area updated in real time in the processing parameter, the system can calculate the target negative pressure value that needs to be improved in real time according to the "effective adsorption area and negative pressure demand correlation algorithm", to ensure that the negative pressure can dynamically compensate for the decrease in adsorption force caused by the reduction of adsorption area.

[0064] Further, in order to better implement the processing platform negative pressure control method of the laser processing system in any of the above embodiments, on the basis of the above negative pressure control method, please refer to Figures 2 to 4 , Figure 2 A frame structure schematic diagram of the laser processing system 10 provided by the embodiment is shown, Figure 3 A structure schematic diagram of the laser processing system 10 provided by the embodiment is shown, Figure 4 Another structure schematic diagram of the laser processing system 10 provided by the embodiment is shown. The embodiment of the application also provides a laser processing system 10, which comprises a laser assembly 100, a processing platform 200, a negative pressure detection assembly 300, a negative pressure adjustment assembly 500 and a main control assembly 400.

[0065] The laser assembly 100 is electrically connected with the main control assembly 400 and is controlled by the main control assembly 400 to perform laser processing on the to-be-processed circuit board 20, that is, the laser assembly 100 emits a laser beam to the to-be-processed circuit board 20 under the control of the main control assembly 400, and the laser beam incident on the to-be-processed circuit board performs laser processing by ablation.

[0066] The processing platform 200 is internally structured to form a negative pressure chamber 210, which is in communication with the adsorption surface of the processing platform 200, and the adsorption surface is used to fix the to-be-processed circuit board 20 by negative pressure adsorption. Further, in some embodiments, the processing platform 200 is electrically connected with the main control assembly 400, and the processing platform 200 is controlled by the main control assembly 400 to move on the processing plane to drive the to-be-processed circuit board 20 carried on the processing platform 200 to move.

[0067] The negative pressure detection assembly 300 is connected with the processing platform 200 to detect the real-time negative pressure information of the negative pressure chamber 210.

[0068] The negative pressure adjusting assembly 500 is connected with the processing platform 200 to adjust the negative pressure of the negative pressure chamber 210.

[0069] It needs to be explained that the laser processing system 10 is an equipment integrated system for performing precise processing such as laser cutting and engraving on the to-be-processed circuit board 20. The laser assembly 100 is an execution component that generates and outputs laser energy in the laser processing system 10, and is electrically connected with the master control assembly 400, and can implement the preset processing action on the to-be-processed circuit board 20 according to the relevant instructions (such as laser power instruction, processing path instruction, processing speed instruction) issued by the master control assembly 400. The processing platform 200 is a workbench structure in the laser processing system 10 that carries the to-be-processed circuit board 20, and the internal structure forms a negative pressure chamber 210. The platform surface is provided with a suction surface in communication with the negative pressure chamber 210. The suction force of the suction surface can be converted from the negative pressure of the negative pressure chamber 210 to tightly fix the circuit board and avoid displacement of the circuit board due to laser impact force or pressure fluctuation during processing.

[0070] The negative pressure chamber 210 is a cavity structure inside the processing platform 200 for generating and storing negative pressure. Through communication with the suction surface, the negative pressure in the cavity can be transmitted to the suction surface to generate suction force. At the same time, the negative pressure chamber 210 is connected with the negative pressure adjusting assembly 500, so that the internal pressure of the negative pressure chamber 210 can be changed by the adjusting assembly to flexibly adapt to the suction needs of different circuit boards. The suction surface is the area on the surface of the processing platform 200 that directly contacts the to-be-processed circuit board 20. The surface can be provided with suction holes and / or annular grooves interconnected with the negative pressure chamber 210, which can efficiently convert the negative pressure of the negative pressure chamber 210 into uniform suction force on the circuit board, ensuring that the circuit board always adheres to the surface of the processing platform 200 during processing, avoiding processing deviation caused by partial suspension or displacement of the to-be-processed circuit board 20. The negative pressure detection assembly 300 is a pressure detection component connected with the processing platform 200, which can collect the actual pressure value of the negative pressure chamber 210 in real time, convert the actual pressure value into real-time negative pressure information, and transmit the real-time negative pressure information to the master control assembly 400 in the form of signal transmission. The negative pressure adjusting assembly 500 is a pressure regulating component connected with the processing platform 200, which is controlled by the master control assembly 400 and can change the negative pressure of the negative pressure chamber 210 by adjusting the valve opening (increasing or decreasing) to realize precise regulation of the internal pressure of the cavity.

[0071] It can be understood that the negative pressure chamber 210 of the processing platform 200 in the present application provides a stable pressure source for the adsorption force, the negative pressure detection assembly 300 monitors the pressure in the chamber in real time, and the negative pressure adjusting assembly 500 dynamically adjusts the pressure according to the detection data, forming a negative pressure closed-loop control logic of real-time detection, real-time adjustment, and real-time detection again, which can effectively cope with the changes in working conditions (such as line board processing hollow pressure relief, pipeline slight leakage).

[0072] Specifically, if the line board 20 to be processed is a high-value flexible IC carrier board, the pressure in the negative pressure chamber 210 will decrease due to the hollowing of the line board during processing. The negative pressure detection assembly 300 can capture this pressure change in real time and transmit the data, and the negative pressure adjusting assembly 500 immediately adjusts the valve opening to supplement the negative pressure, ensuring that the adsorption surface always maintains a stable adsorption force suitable for flexible carrier boards, avoiding displacement or deformation of the carrier board. And the negative pressure chamber 210 of the processing platform 200 and the negative pressure adjusting assembly 500 can cooperatively adjust the negative pressure to adapt to the adsorption needs of different line boards. If a thick ceramic substrate is being processed, the negative pressure adjusting assembly 500 adjusts the valve opening to increase the negative pressure in the negative pressure chamber 210 to ensure that the thick board is firmly adsorbed. If a thin flexible optical module carrier board is being processed, the adjusting assembly adjusts the valve opening to reduce the negative pressure to avoid deformation of the flexible board.

[0073] In some embodiments, the main control assembly 400 includes an input unit, a calculation unit, and a control unit; the input unit is used to obtain target negative pressure information of the line board 20 to be processed and / or real-time negative pressure information of the negative pressure chamber 210 in the processing platform 200; the calculation unit is used to calculate the negative pressure difference between the target negative pressure information and the real-time negative pressure information; the control unit is electrically connected with the negative pressure adjusting assembly 500, and is used to output a negative pressure adjusting signal to the negative pressure adjusting assembly 500 according to the negative pressure difference, so as to control the negative pressure adjusting assembly 500 to adjust the negative pressure of the negative pressure chamber 210 in the processing platform 200.

[0074] It needs to be explained that the input unit is a unit responsible for data reception and collection in the main control assembly 400, which can on the one hand retrieve the target negative pressure information of the line board 20 to be processed, and on the other hand receive the real-time negative pressure information of the negative pressure chamber 210 transmitted by the negative pressure detection assembly 300. The calculation unit is a module responsible for data processing in the main control assembly 400, which calculates the negative pressure difference between the target negative pressure information and the real-time negative pressure information based on the target negative pressure information and the real-time negative pressure information obtained by the input unit, quantifies the deviation degree of the current pressure in the negative pressure chamber 210 from the target value. The control unit is a module responsible for instruction output and execution control in the main control assembly 400, which is electrically connected with the negative pressure adjusting assembly 500, sends accurate control instructions (such as adjusting the opening of the proportional regulating valve) to the negative pressure adjusting assembly 500 according to the negative pressure difference obtained by the calculation unit, and promotes the pressure in the negative pressure chamber 210 to approach the target negative pressure.

[0075] It can be understood that the input unit, the calculation unit and the control unit in the present application work together to realize the full-automatic process of negative pressure regulation. From data acquisition, deviation calculation to instruction output, no manual intervention is needed, which greatly reduces the operation threshold and the probability of human error. For example, when processing batch circuit boards, the input unit automatically retrieves the target negative pressure information of the circuit board and collects the pressure in real time, the calculation unit continuously calculates the difference, and the control unit dynamically adjusts the negative pressure. The operator only needs to start the processing process and does not need to frequently monitor the pressure or adjust the valve. At the same time, full-automatic regulation and control can ensure that the actual adsorption pressure of each circuit board is equivalent or even consistent with the target adsorption pressure, avoiding fluctuations in processing accuracy caused by manual adjustment differences, and further improving the quality rate of finished products.

[0076] In some embodiments of the present application, please refer to Figure 3 and Figure 4 and refer to Figure 5 , Figure 5 The structure of the laser processing system 10 provided by the present embodiment is shown, and the negative pressure detection assembly 300 of the present embodiment includes a negative pressure sensor 310.

[0077] In some embodiments, the negative pressure sensor 310 is arranged in the negative pressure chamber 210, and in other embodiments, the negative pressure sensor 310 is arranged on the gas path pipeline communicated between the processing platform 200 and the negative pressure regulation assembly 500. By arranging the negative pressure sensor 310 in the negative pressure chamber 210, the real-time negative pressure information detected by the negative pressure sensor 310 is more accurate. By arranging the negative pressure sensor 310 on the gas path pipeline communicated between the processing platform 200 and the negative pressure regulation assembly 500, wired signal transmission of the negative pressure sensor 310 and the main control assembly can be facilitated.

[0078] It can be understood that the probe with the negative pressure sensor 310 extends into the negative pressure chamber 210, and when the pressure of the negative pressure chamber 210 changes, the internal bridge value and capacitance of the negative pressure sensor 310 will change, and then the change is converted into a detection signal through a circuit, so as to detect the negative pressure of the negative pressure chamber 210.

[0079] In some embodiments, the negative pressure sensor 310 can include but is not limited to a piezoresistive sensor or a capacitive sensor. Preferably, the negative pressure sensor 310 is a piezoresistive sensor, which has more advantages than the capacitive sensor in terms of durability, stability, anti-interference ability and cost-effectiveness, and can cope with pressure detection deviations caused by pressure fluctuations, mechanical vibrations, temperature changes and accidental pressure impacts.

[0080] In some embodiments, the negative pressure regulation assembly 500 can include but is not limited to one of a pneumatic proportional valve, an electric proportional valve, an electric regulating valve and an electric servo valve.

[0081] Specifically, in some embodiments of the present application, please continue to refer to Figure 5 The negative pressure adjusting assembly 500 of the present embodiment comprises: a valve body, the air inlet end of the valve body being in communication with the negative pressure chamber 210, and the air outlet end of the valve body being in communication with the external air source to form a negative pressure gas path between the negative pressure chamber 210 and the external air source; a valve body regulator, the signal input end of the valve body regulator being electrically connected with the main control assembly 400, and the signal output end of the valve body regulator being electrically connected with the driving end of the valve body, the valve body regulator being configured to adjust the opening degree of the valve body according to the negative pressure adjusting signal to adjust the gas flow of the negative pressure gas path, so as to adjust the negative pressure of the negative pressure chamber 210.

[0082] It needs to be explained that the valve body is a component for controlling the flow of gas in the negative pressure adjusting assembly 500, which has an air inlet end and an air outlet end, the air inlet end being in communication with the negative pressure chamber 210, and the air outlet end being in communication with the external air source to form a complete negative pressure gas path; the flow of gas in the gas path can be adjusted by changing the opening degree of the valve body (the size of the opening of the valve), so as to change the pressure of the negative pressure chamber 210; for example, when the opening degree is increased, the gas flow is increased, and the negative pressure of the negative pressure chamber 210 is increased; when the opening degree is decreased, the gas flow is decreased, and the negative pressure of the negative pressure chamber 210 is decreased. The external air source is an external pressure source for providing negative pressure power for the negative pressure gas path, which can deliver stable negative pressure gas flow to the negative pressure chamber 210 by being in communication with the air outlet end of the valve body. The negative pressure gas path is a gas flow path formed by the valve body, the negative pressure chamber 210 and the external air source, the gas flows from the external air source into the valve body through the air outlet end of the valve body, and then flows into the negative pressure chamber 210 through the air inlet end of the valve body to form a negative pressure circulation. The valve body regulator is a control component in the negative pressure adjusting assembly 500 for receiving and executing control instructions, the signal input end of which is electrically connected with the main control assembly 400 to receive the negative pressure adjusting information issued by the main control assembly 400; the signal output end of which is electrically connected with the driving end of the valve body to convert the adjusting information into a driving signal to control the valve body to change the opening degree.

[0083] It can be understood that the valve body regulator accurately controls the opening degree of the valve body according to the negative pressure adjusting information, which can change the gas flow of the negative pressure gas path by fine-tuning the opening degree, so that the pressure of the negative pressure chamber 210 gradually approaches the target value; for example, if the circuit board 20 to be processed is a high-precision ultra-thin wafer carrier, the main control assembly 400 calculates that the negative pressure difference is -2kPa, and sends the negative pressure adjusting information to increase the opening degree of the valve body to the valve body regulator, the valve body regulator drives the valve body to slowly increase the opening degree, the gas flow of the negative pressure gas path is increased, and the negative pressure of the negative pressure chamber 210 is gradually increased to the target value, avoiding the displacement of the wafer carrier caused by sudden pressure change.

[0084] In some embodiments, the valve body can be one of a butterfly valve, a gate valve and a ball valve. Specifically, the valve body is a ball valve.

[0085] In some embodiments, the master component 400 can include, but is not limited to, one of a digital controller, a programmable controller, a digital temperature controller, and a digital regulator. The working instructions of the negative pressure regulating component 500 come from the analog signal output by the master component 400, which is built-in with a high-speed DSP controller and a D / A conversion circuit to analyze and process the real-time voltage signal output by the negative pressure detection component 310.

[0086] In some embodiments of the present application, please refer to Figure 5 As shown in Figure 5 The laser processing system of the present embodiment includes a plurality of processing platforms 200, which are connected one-to-one with a plurality of negative pressure detection components 300, and the plurality of processing platforms are connected one-to-one with a plurality of negative pressure regulating components 500.

[0087] It can be understood that the plurality of processing platforms 200 of the present application can simultaneously carry and process a plurality of to-be-processed circuit boards 20, and cooperate with the one-to-one corresponding negative pressure detection and regulating components to ensure that each circuit board can be processed simultaneously in a stable adsorption state. If batch processing of high-value flexible IC carriers is required, the plurality of processing platforms 200 can simultaneously adsorb different carriers, and the negative pressure detection component 300 of each platform can monitor the pressure of the self-negative pressure chamber 210 in real time, and the negative pressure regulating component 500 can independently maintain a low negative pressure suitable for the flexible carrier, and the laser component 100 can perform processing on the carriers on each processing platform 200 according to a preset timing or synchronously, which is beneficial to greatly reducing the total time consumption of batch production.

[0088] In the present application, the processing platform 200, the negative pressure detection component 300, and the negative pressure regulating component 500 are one-to-one corresponding, which can ensure that the negative pressure control of each processing platform 200 is independently operated. When a certain platform needs to adjust the negative pressure due to changes in the processing state (such as the hollowing-out of the circuit board), it will not affect the stability of the negative pressure of other platforms, thereby avoiding the transmission of pressure fluctuations caused by the use of components by multiple platforms. For example, if the left platform of a double-platform device processes an initial unprocessed PCB board (which requires a low negative pressure), and the right platform processes a half-processed hollowed-out PCB board (which requires a high negative pressure), the negative pressure detection component 300 of the left platform only monitors the pressure of the left chamber, and the left negative pressure regulating component 500 maintains a low negative pressure, and the detection and regulating components of the right platform independently maintain a high negative pressure, which do not interfere with each other, thereby ensuring that the circuit boards on the left and right platforms are stably adsorbed.

[0089] In some embodiments, the negative pressure regulating component 500 adjusts the negative pressure based on the received current instruction or voltage instruction.

[0090] In some embodiments, the digital controller negative pressure information can be a current signal or a voltage signal.

[0091] In some embodiments, as shown in Figure 5As shown, in the prior art example that the master control assembly 400 includes a digital controller, the master control assembly 400 of the embodiment further includes a host computer (i.e. Figure 5 The IPC host computer system shown), wherein the negative pressure detection assembly 300 can be in communication with the host computer, so that the host computer can directly obtain the real-time negative pressure information detected by the negative pressure detection assembly 300.

[0092] Specifically, in some embodiments, the digital controller and the host computer can realize bidirectional data transmission of the digital controller and the host computer through at least one of network port communication, USB communication and serial port communication.

[0093] Further, in order to better implement the processing platform negative pressure control method of the laser processing system in any of the above embodiments, on the basis of the processing platform negative pressure control method of the laser processing system, the embodiment of the present application further provides a computer readable storage medium, the computer readable storage medium stores a computer program, and the computer program is executed by a processor to realize the steps of the above method.

[0094] Further, in order to better implement the processing platform negative pressure control method of the laser processing system and the laser processing system 10 in any of the above embodiments, on the basis of the processing platform negative pressure control method of the laser processing system and the laser processing system 10, the embodiment of the present application further provides a circuit board, which is made of the above method or the above laser processing system 10, wherein the circuit board includes a core plate and at least one electrically conductive layer and at least one electrically insulating layer disposed on the main surface of the core plate.

[0095] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0096] The above has described the basic concept, and it is obvious that the above detailed disclosure is only as an example and does not constitute a limitation on the present application for those skilled in the art. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present application. Such modifications, improvements and corrections are suggested in the present application, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present application.

[0097] Also, the use of "a" or "an" to describe an element of the application is merely for convenience and to aid in the understanding of the application, and is not to be construed as limiting the application to a single embodiment and / or to a single kind of implementation. Furthermore, reference to various embodiments of the application throughout this specification and claims does not mean the same embodiment is necessarily referred to in multiple places in the specification and claims.

[0098] Similarly, it is to be noticed that the term "comprising", used in the description, is not to be interpreted as being restricted to the means listed thereafter; it does not exclude other elements or steps. It is thus to be interpreted as specifying the presence of the stated features, integers, steps or components as referred to, but does not preclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. Moreover, it is to be understood that the application can be carried out by both hardware and software, and various embodiments of the application can be implemented by hardware, software, and / or firmware, and that software may

[0099] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit the present application; even though the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A method for controlling negative pressure on a processing platform in a laser processing system, characterized in that, include: a. Based on the first processing state of the first circuit board to be processed in the laser processing system, obtain the target negative pressure information; b. Based on the second processing state of the second circuit board to be processed in the laser processing system, obtain the real-time negative pressure information of the negative pressure chamber in the processing platform; c. Compare the real-time negative pressure information with the target negative pressure information to obtain the negative pressure difference; d. Adjust the negative pressure of the negative pressure chamber in the processing platform according to the negative pressure difference.

2. The negative pressure control method for the processing platform of the laser processing system according to claim 1, characterized in that, The negative pressure control method further includes cyclically executing steps a to d until the negative pressure difference falls within a preset range.

3. The negative pressure control method for the processing platform of the laser processing system according to claim 2, characterized in that, If the negative pressure difference value does not fall within the preset range, an alarm will be triggered.

4. The negative pressure control method for the processing platform of the laser processing system according to claim 1, characterized in that, The first circuit board to be processed and the second circuit board to be processed may have the same basic features or different basic features.

5. The negative pressure control method for the processing platform of the laser processing system according to claim 1, characterized in that, The first processing state and the second processing state may belong to the same processing state or to different processing states.

6. The negative pressure control method for the processing platform of the laser processing system according to claim 4, characterized in that, The basic characteristics include at least one of the following: material, thickness, rigidity, size, roughness, surface flatness, or weight distribution.

7. The negative pressure control method for the processing platform of the laser processing system according to claim 5, characterized in that, The processing state includes at least one of the following: processing stage, effective adsorption area.

8. The method for controlling negative pressure on the processing platform of the laser processing system according to claim 1, characterized in that, in, Based on the first processing state of the first circuit board to be processed in the laser processing system, the target negative pressure information is obtained, including obtaining processing parameters based on the first processing state of the first circuit board to be processed in the laser processing system, extracting the target negative pressure information from the processing parameters, or calculating the target negative pressure information in real time based on the processing parameters. Based on the processing parameters, a matching preset range is obtained from the preset production and processing file.

9. A laser processing system, characterized in that, The laser processing system includes a laser component, a processing platform, a negative pressure detection component, a negative pressure adjustment component, and a main control component; The laser component is electrically connected to the main control component and is controlled by the main control component to perform laser processing on the circuit board to be processed. The processing platform has a negative pressure chamber, which is connected to the adsorption surface of the processing platform. The adsorption surface is used to fix the circuit board to be processed by negative pressure adsorption. The negative pressure detection component is connected to the processing platform to detect the real-time negative pressure information of the negative pressure chamber; The negative pressure regulating component is connected to the processing platform to regulate the negative pressure in the negative pressure chamber; The main control component includes an input unit, a computing unit, and a control unit; The input unit is used to acquire the target negative pressure information of the circuit board to be processed and / or the real-time negative pressure information of the negative pressure chamber; The calculation unit is used to calculate the negative pressure difference between the target negative pressure information and the real-time negative pressure information; The control unit is electrically connected to the negative pressure regulating component and is used to output a negative pressure regulating signal to the negative pressure regulating component according to the negative pressure difference, so as to control the negative pressure regulating component to regulate the negative pressure of the negative pressure chamber.

10. The laser processing system according to claim 9, characterized in that, The negative pressure detection component includes a negative pressure sensor; And / or, the negative pressure regulating assembly includes one of a pneumatic proportional valve, an electric proportional valve, an electric regulating valve, and an electric servo valve. And / or, the main control component includes one of a digital controller, a programmable controller, a digital temperature controller, and a digital regulator.

11. The laser processing system according to claim 10, characterized in that, The negative pressure regulating component includes: The valve body has an air inlet end connected to the negative pressure chamber and an air outlet end connected to the external air source, so as to form a negative pressure air path between the negative pressure chamber and the external air source. A valve body regulator, wherein the signal input terminal of the valve body regulator is electrically connected to the main control component, and the signal output terminal of the valve body regulator is electrically connected to the drive terminal of the valve body, and the valve body regulator is configured to adjust the opening of the valve body according to the negative pressure adjustment signal, so as to adjust the gas flow rate of the negative pressure gas path, thereby adjusting the negative pressure of the negative pressure chamber.

12. The laser processing system according to claim 9, characterized in that, The laser processing system includes multiple processing platforms, each processing platform being connected to a corresponding negative pressure detection component, and each processing platform being connected to a corresponding negative pressure adjustment component.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, characterized in that, when the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1-8.

14. A circuit board, characterized in that, The circuit board is manufactured using the method of any one of claims 1 to 8 or the laser processing system of any one of claims 9 to 11, wherein the circuit board includes a core board and at least one electrically conductive layer and at least one electrically insulating layer disposed on the main surface of the core board.

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