Novel rotating disc type AOI detection equipment

Abstract

The invention relates to the technical field of chip packaging detection, in particular to novel rotating disc type AOI (automatic optical inspection) equipment, which comprises a feeding adjusting mechanism for placing and adjusting a to-be-detected chip; the end face detection mechanism comprises a front end face detection mechanism and a rear end face detection mechanism and is used for detecting the end faces of the chips; the turntable mechanism comprises a turntable and a plurality of groups of adjusting and positioning tools arranged at the top of the turntable, and the plurality of groups of adjusting and positioning tools are uniformly arranged along the circumferential direction of the turntable and can sequentially enter the detection area of the end face detection mechanism at intervals under the driving of the turntable; the conveying mechanism comprises a suction nozzle carrying mechanism arranged at the top of the feeding adjusting mechanism and an ejector pin mechanism arranged at the bottom of the feeding adjusting mechanism, the ejector pin mechanism is used for jacking the to-be-detected chip subjected to feeding adjustment, and the suction nozzle carrying mechanism is used for carrying the chip jacked by the ejector pin mechanism to the adjusting positioning tool. Through the multi-level high-precision adjustment positioning tool and the conveying mechanism, high-precision and high-efficiency automatic detection of the chip is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging detection, and particularly to a novel rotary disc type AOI detection equipment. BACKGROUND

[0002] With the rapid development of integrated circuit manufacturing technology, chip packaging size is continuously reduced, and pin density is continuously increased, which puts forward higher requirements on the precision and efficiency of chip appearance defect detection. At present, in the field of semiconductor packaging testing, automatic optical detection equipment has been widely used in defect detection of chip end face, pins and other key parts.

[0003] The traditional AOI detection equipment mainly adopts linear or rotary table structure, but generally has the following technical limitations: The existing rotary table structure is difficult to realize synchronous detection of the front end face and the rear end face, and at the same time, it is difficult to maintain accurate flatness during rotation of the rotary table, which puts forward the demand for multi-dimensional high-precision adjustment of the adjustment positioning tool on the table, which is embodied in that the adjustment positioning tool not only needs to meet the linear movement precision of XYZ three axes, but also needs to realize horizontal rotation adjustment around Z axis, and horizontal posture calibration in inclined state. However, the existing positioning tool usually relies on manual installation and debugging before the equipment runs, which seriously restricts the production efficiency.

[0004] In addition, some existing detection equipment adopts fixed detection station combined with linear conveying mechanism, and the chip is easy to produce position deviation during handling and conveying, which affects the consistency of detection precision. At the same time, the front and rear end face detection usually adopts independent station arrangement, which occupies large area and has low space utilization, and the chip is easy to produce secondary pollution or mechanical damage during transmission between detection stations. SUMMARY

[0005] (I) Technical problems to be solved The present application provides a novel rotary disc type AOI detection equipment, which realizes high-precision and high-efficiency automatic detection of chips by designing multi-level high-precision adjustment positioning tool and conveying mechanism.

[0006] (II) Technical scheme In order to achieve the above purpose, the present application provides a novel rotary disc type AOI detection equipment, which comprises: a feeding adjustment mechanism for placing and adjusting the chip to be detected; an end face detection mechanism comprising a front end face detection mechanism and a rear end face detection mechanism for detecting the end face of the chip; a rotary disc mechanism comprising a rotary disc and a plurality of adjustment positioning tools arranged on the top of the rotary disc, the plurality of adjustment positioning tools are evenly arranged along the circumferential direction of the rotary disc and can be sequentially and intermittently introduced into the detection area of the end face detection mechanism under the driving of the rotary disc. The conveying mechanism comprises a suction nozzle conveying mechanism arranged at the top of the feeding adjustment mechanism and a ejector pin mechanism arranged at the bottom of the feeding adjustment mechanism, the ejector pin mechanism is used to lift the chip to be detected after the feeding adjustment, and the suction nozzle conveying mechanism is used to convey the chip lifted by the ejector pin mechanism to the adjustment positioning tool.

[0007] The feeding adjustment mechanism comprises a base, a suction disc and a driving device. The base is fixed on the XY cross slide table, so that the base can be adjusted in the XY plane. The suction disc is rotatably arranged on the base and connected with the driving device through a gear or synchronous belt transmission mechanism to realize forward and reverse rotation, and the suction disc is a vacuum suction disc, and an upper feeding jig for placing the chip is fixed at the top of the suction disc.

[0008] The front end face detection mechanism and the rear end face detection mechanism each comprise a slide table assembly and a detection assembly arranged on the slide table assembly. The slide table assembly comprises an X-axis electric slide table and a YZ-axis manual slide table, which can be combined to adjust the spatial position of the detection assembly. The detection assembly comprises an industrial camera, an objective lens and a tube lens connecting the industrial camera and the objective lens.

[0009] The rotating disc is a hollow rotating platform, and the adjustment positioning tool comprises a first electric adjustment platform, a second manual adjustment platform, an inclined adjustment platform and a suction nozzle fixing table. The first electric adjustment platforms are evenly distributed on the rotating disc, and the top of each first electric adjustment platform is connected with the second manual adjustment platform through a torque motor platform, the top of the second manual adjustment platform is fixed with the inclined adjustment platform, the top of the inclined adjustment platform is fixed with the suction nozzle fixing table, the suction nozzle fixing table is used to fix a vacuum suction nozzle for adsorbing the chip, and the vacuum suction nozzle is connected with a negative pressure source.

[0010] The apparatus further comprises a gantry frame and a suction nozzle conveying mechanism slidingly arranged on the gantry frame. The gantry frame comprises a column and a cross beam supported by the column. The suction nozzle conveying mechanism comprises a lifting mechanism and a suction nozzle rotating mechanism, the lifting mechanism is slidingly connected to the cross beam through a linear guide rail, the bottom of the lifting mechanism is connected with the suction nozzle rotating mechanism, and the lifting mechanism can drive the suction nozzle rotating mechanism to ascend or descend, the suction nozzle rotating mechanism is installed with a vacuum suction nozzle, and the suction nozzle rotating mechanism can drive the vacuum suction nozzle to rotate.

[0011] The lifting mechanism comprises a fixed connecting block and a sliding connecting block slidingly connected to the fixed connecting block. The sliding connecting block has a rectangular slot in the middle, and a bushing is provided inside the rectangular slot. A drive shaft is rotatably provided inside the bushing. The drive shaft has an axially eccentrically set connecting hole inside, and the connecting hole is connected to the power shaft of the first servo motor fixed on the fixed connecting block.

[0012] A further technical solution is that the suction nozzle rotation mechanism includes a motor mounting plate, a second servo motor is fixedly mounted on the top of the motor mounting plate, and a suction nozzle rolling mechanism is fixedly connected to the side. The vacuum suction nozzle is rotatably mounted on the suction nozzle rolling mechanism and is connected to the second drive device through a linkage mechanism. The linkage mechanism includes a drive arm and a swing arm. One end of the drive arm is mounted on the output shaft of the second servo motor, and the other end is connected to a lever. One end of the swing arm is fixedly connected to the vacuum nozzle, and the other end has a U-shaped fork structure. The lever is slidably disposed inside the U-shaped fork structure.

[0013] A further technical solution includes a rotary table loading and unloading positioning mechanism; The turntable loading and unloading positioning mechanism includes a positioning support and a positioning camera assembly. The positioning support is fixed to the crossbeam, and the positioning camera assembly is fixed to the positioning support. The positioning camera assembly is arranged corresponding to the loading and unloading stations of the turntable.

[0014] A further technical solution includes a loading / unloading positioning mechanism and a unloading mechanism; The rear-end face detection mechanism includes a support frame fixed near the turntable; The loading and unloading positioning mechanism includes a loading positioning mechanism slidably disposed on the crossbeam and a unloading positioning mechanism slidably disposed on the support frame, with the unloading mechanism disposed below the unloading positioning mechanism. The unloading mechanism includes a linear mechanism and an unloading fixture mounted on a pallet. The loading and positioning mechanism is used to detect and position the loading fixture, and the unloading and positioning mechanism is used to detect and position the unloading fixture.

[0015] A further technical solution is that the ejector pin mechanism includes an XYZ axis adjusting slide, a slide pad, an eccentric lifting mechanism, and an ejector pin assembly; The XYZ axis adjusting slide is fixed in the mounting hole on the base through the slide pad, and the ejector pin assembly is connected to it through the eccentric lifting mechanism for adjusting the spatial position of the ejector pin assembly. The ejector assembly includes a bearing seat, a guide seat, an ejector pin seat, and a guide cap; the bearing seat and the guide seat are fixed to the support plate at the top of the eccentric lifting mechanism and are coaxially arranged with the lifting rod of the eccentric lifting mechanism; the top of the lifting rod is fixed to the ejector pin seat, and the top of the ejector pin seat is fixed to the guide cap.

[0016] (III) Beneficial Effects The beneficial effects of this invention are as follows: The end-face inspection mechanism of this invention is divided into a front-face inspection mechanism and a rear-face inspection mechanism, both of which are distributed near the turntable and can achieve multi-angle synchronous inspection coverage of the adjustment and positioning fixture on the turntable. It can simultaneously complete the inspection of both the front and rear faces, significantly improving inspection efficiency. The feeding and adjustment mechanism corrects the chip's position, ensuring the positioning accuracy of subsequent handling and avoiding inspection errors caused by chip posture deviations from the source. The adjustment and positioning fixture on the top of the turntable mechanism can achieve firm chip adsorption and micron-level alignment adjustment. Combined with the intermittent rotation of the turntable, it ensures that the chip end face is always at the optimal focal plane of the camera's field of view, improving the clarity and stability of image acquisition. The high-resolution industrial camera and matching lens group integrated into the end-face inspection mechanism can accurately acquire images and identify defects on the front and rear faces of the chip entering the inspection area. The ejector pin mechanism of the conveying mechanism works in conjunction with the nozzle transport mechanism to achieve smooth and accurate transfer of the chip from the adjustment station to the inspection fixture. Furthermore, the nozzle transport mechanism also handles the unloading operation after inspection, simplifying the equipment structure while improving overall flow efficiency. Through the coordinated optimization of various mechanisms, the overall equipment effectively improves the accuracy and automation of chip end-face inspection. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a new rotary AOI inspection device. Figure 2 This is a schematic diagram showing the connection between the end face inspection mechanism and the turntable mechanism; Figure 3 This is a schematic diagram of the turntable mechanism. Figure 4 This is a schematic diagram of the conveying mechanism; Figure 5 This is a schematic diagram of the feeding adjustment mechanism; Figure 6 This is a schematic diagram of the front-end detection mechanism; Figure 7 This is a schematic diagram of the rear-end inspection mechanism; Figure 8 This is a schematic diagram of the nozzle rotation mechanism in the nozzle handling mechanism; Figure 9 This is a schematic diagram of the lifting mechanism in the nozzle handling mechanism; Figure 10 This is a schematic diagram of the ejector mechanism; Figure 11 This is a schematic diagram of the feeding mechanism.

[0018] [Explanation of Labels in the Attached Image] 1: Feeding adjustment mechanism; 11: Base; 12: Suction cup; 13: Drive device; 14: XY axis cross slide; 15: Feeding fixture; 2: End face inspection mechanism; 21: Slide assembly; 211: X-axis electric slide; 212: YZ-axis manual slide; 22: Inspection component; 221: Industrial camera; 222: Objective lens; 223: Tube lens; 3: Turntable mechanism; 31: Turntable; 32: Adjustment and positioning fixture; 321: Primary electric adjustment platform; 322: Secondary manual adjustment platform; 323: Tilting adjustment platform; 324: Nozzle fixing table; 325: Torque motor; 4: Conveying mechanism; 41: Nozzle handling mechanism; 411: Lifting mechanism; 4111: Fixed connecting block; 4112: Sliding connecting block; 41121: Rectangular slot; 4113: Bushing; 4114: Drive shaft; 412: Nozzle rotation mechanism; 4121: Motor mounting plate; 4122: Second servo motor; 4123: Nozzle rolling mechanism; 4124: Linkage mechanism; 41241: Drive arm; 41242: Swing rod; 41243: Lever; 42: Ejector pin mechanism; 421: XYZ axis adjusting slide; 422: Slide pad; 423: Eccentric lifting mechanism; 424: Ejector pin assembly; 4241: Bearing seat; 4242: Guide seat; 4243: Ejector pin seat; 4244: Guide cap; 5: Vacuum nozzle; 6: Gantry frame; 61: Column; 62: Beam; 7: Turntable loading and unloading positioning mechanism; 71: Positioning support; 72: Positioning camera assembly; 8: Loading / unloading positioning mechanism; 81: Loading positioning mechanism; 82: Unloading positioning mechanism; 9: Feeding mechanism; 91: Linear mechanism; 92: Feeding fixture; 10: Supporting framework. Detailed Implementation

[0019] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] AOI inspection, also known as automated optical inspection, is a non-contact visual inspection technology that uses a high-resolution camera combined with a specific light source and image processing software to automatically scan the appearance or specific structure of a chip and quickly compare it with a preset standard image or rule library to identify and locate various visible defects.

[0021] This embodiment provides a novel rotary AOI inspection device, such as... Figures 1 to 4 As shown, the system includes: a feeding and adjusting mechanism 1 for placing and adjusting the chip to be tested; an end-face inspection mechanism 2, including a front-face inspection mechanism and a rear-face inspection mechanism, for inspecting the end faces of the chip; a turntable mechanism 3, including a turntable 31 and multiple sets of adjustment and positioning fixtures 32 disposed on top of the turntable 31, the multiple sets of adjustment and positioning fixtures 32 being evenly arranged along the circumference of the turntable 31 and being able to sequentially and at intervals enter the inspection area of ​​the end-face inspection mechanism 2 under the drive of the turntable 31; and a conveying mechanism 4, including a nozzle conveying mechanism 41 disposed on top of the feeding and adjusting mechanism 1 and a ejector pin mechanism 42 disposed on the bottom, the ejector pin mechanism 42 being used to lift the chip to be tested after feeding and adjusting, and the nozzle conveying mechanism 41 being used to transport the chip lifted by the ejector pin mechanism 42 to the adjustment and positioning fixtures 32.

[0022] The feeding and adjustment mechanism 1 is used to carry the chip to be tested. This mechanism is equipped with a precision linear guide rail and a servo-driven rotary mechanism, which can perform position correction on the initially placed chip to ensure that the chip maintains the preset initial positioning accuracy during subsequent handling and transportation.

[0023] The end-face inspection mechanism 2 integrates a high-resolution industrial camera 221. After the station carrying the chip rotates to the inspection area and is precisely positioned, it can acquire images of the front and rear end faces of the chip to detect defects.

[0024] The turntable mechanism 3 includes a precision turntable 31 driven by a servo motor, and multiple sets of adjustment and positioning fixtures 32 fixed to the top of the turntable 31. In this embodiment, there are two sets. Each set of adjustment and positioning fixtures 32 can precisely fix and install the vacuum nozzle 5 to firmly adsorb the chip during the transfer process and perform micron-level alignment adjustments to ensure that the chip's end face is perfectly presented on the optimal focal plane of the camera's field of view when it enters the inspection station. The intermittent rotation of the turntable 31 allows each set of fixtures to enter the inspection area sequentially and at intervals, thereby simultaneously inspecting the front and rear faces of the chip fixed on it.

[0025] The specific working steps of the conveying mechanism 4 are as follows: After the feeding adjustment mechanism 1 completes the posture adjustment of the chip, the ejector pin mechanism 42 moves to smoothly lift the chip to the preset height; then, the suction nozzle transport mechanism 41 moves above the chip, picks it up by negative pressure adsorption, and accurately transports and places it onto the turntable 31 and the positioning fixture 32. It should be noted that the unloading operation after the inspection is also completed by the conveying mechanism 4.

[0026] In this embodiment, the loading adjustment mechanism 1 includes a base 11, a suction cup 12, and a driving device 13. The base 11 is fixed to the XY-axis cross slide 14 to allow the base 11 to be adjusted in the XY plane. The suction cup 12 is rotatably mounted on the base 11 and is connected to the driving device 13 through a gear or synchronous belt transmission mechanism to achieve forward and reverse rotation. The suction cup 12 is a vacuum suction cup 12, and a loading fixture 15 for placing chips is fixed on its top.

[0027] Specifically, refer to Figure 5 As shown, the loading and adjustment mechanism 1 mainly consists of a base 11, a suction cup 12, and a drive device 13. The base 11 is fixedly installed on the XY-axis cross slide, and the precise positioning of the base 11 in the XY plane is achieved by the slide drive. The suction cup 12 is rotatably mounted on the base 11 via bearings, and its rotational motion is transmitted by the drive device 13 through a gear or synchronous belt transmission mechanism, thereby realizing the forward and reverse rotation of the suction cup 12. The suction cup 12 adopts vacuum adsorption, and a blue film loading fixture 15 for carrying and positioning chips is adsorbed and fixed on its top, ensuring that the chips maintain a stable posture and accurate alignment during the transfer process. The above technical solution significantly improves the position adaptability and angle adjustment capability during the chip loading process by controlling the precise translation in the horizontal plane through the XY-axis cross slide and the controllable rotation of the suction cup 12.

[0028] In this embodiment, refer to Figure 6 and Figure 7 As shown, both the front-end and rear-end inspection mechanisms include a slide assembly 21 and an inspection component 22 mounted on the slide assembly 21. The slide assembly 21 includes an X-axis motorized slide 211 and a YZ-axis manual slide 212, which can be combined to adjust the spatial position of the inspection component 22. The inspection component 22 includes an industrial camera 221, an objective lens 222, and a tube lens 223 connecting the industrial camera 221 and the objective lens 222. This tube lens connection constitutes a stable, coaxial internal focusing optical system. Specifically, the front-end inspection mechanism includes a first inspection component composed of the industrial camera 221, the objective lens 222, and the tube lens 223; the rear-end inspection mechanism includes a second inspection component composed of the industrial camera 221, the objective lens 222, and the tube lens 223. The slide assemblies 21 all employ high-precision multi-axis motion modules, which are rigidly connected to the first and second inspection components 22, respectively. Under the command of the control system, it can independently drive the first detection component 22 or the second detection component 22 connected to it to move linearly along the three directions of the X-axis, Y-axis and Z-axis in the spatial rectangular coordinate system.

[0029] In this embodiment, the high-precision X-axis electric slide 211 is responsible for rapid automatic focusing in the X-axis direction to ensure image clarity, while the manually adjustable YZ-axis manual slide 212 is used for initial calibration and attitude fine-tuning, effectively reducing equipment complexity and control costs.

[0030] In this embodiment, refer to Figure 3 As shown, the turntable 31 is a hollow rotating platform. The adjustment and positioning fixture 32 includes a primary electric adjustment platform 321, a secondary manual adjustment platform 322, a tilt adjustment platform 323, and a suction nozzle fixing table 324. Multiple primary electric adjustment platforms 321 are evenly distributed on the turntable 31, and their tops are connected to the secondary manual adjustment platforms 322 via torque motors 325. The tilt adjustment platform 323 is fixed to the top of the secondary manual adjustment platform 322, and the suction nozzle fixing table 324 is fixed to the top of the tilt adjustment platform. The suction nozzle fixing table 324 is used to fix the vacuum suction nozzle 5 for adsorbing the chip, and the vacuum suction nozzle 5 is connected to a negative pressure source. During operation, the turntable 31 drives the various adjustment and positioning fixtures 32 to rotate to achieve chip transfer. The primary electric adjustment platform 321 can achieve automated position fine-tuning, the secondary manual adjustment platform 322 can perform manual assisted calibration when needed, and the tilt adjustment platform 323 can adjust the tilt angle of the vacuum nozzle 5. With the stable negative pressure adsorption of the negative pressure source, it can effectively prevent the chip from shifting, falling off, or being damaged during the adsorption process. At the same time, multiple adjustment and positioning fixtures 32 are evenly distributed on the turntable 31, which can achieve synchronous transfer and positioning of multiple chips, further improving the overall work efficiency. The hierarchical assembly structure of the adjustment platform also makes the maintenance and debugging of the device more convenient.

[0031] In this embodiment, refer to Figure 4 As shown, the system also includes a gantry frame 6 and a suction nozzle transport mechanism 41 slidably mounted on the gantry frame 6. The gantry frame 6 includes a column 61 and a crossbeam 62 supported by the column 61. The suction nozzle transport mechanism 41 includes a lifting mechanism 411 and a suction nozzle rotation mechanism 412. The lifting mechanism 411 is slidably connected to the crossbeam 62 via a linear guide rail, and its bottom is connected to the suction nozzle rotation mechanism 412. The lifting mechanism 411 can drive the suction nozzle rotation mechanism 412 to rise or fall. A vacuum suction nozzle 5 is mounted on the suction nozzle rotation mechanism 412, and it can drive the vacuum suction nozzle 5 to rotate. In the specific working process, the lifting mechanism 411 slides along the crossbeam 62 to adjust its horizontal position, while simultaneously driving the suction nozzle rotation mechanism 412 and the vacuum suction nozzle 5 to rise and fall. The suction nozzle rotation mechanism 412 adjusts the angle of the vacuum suction nozzle 5 according to the chip transfer requirements. With the adsorption effect of the vacuum suction nozzle 5, the chip can be accurately gripped and transferred between different workstations.

[0032] This structure utilizes a gantry frame 6 and a sliding nozzle transport mechanism 41. The gantry frame 6 is preferably made of marble to provide a stable structural foundation. A linear guide rail enables the horizontal movement of the lifting mechanism 411. The lifting mechanism 411 can drive the nozzle rotation mechanism 412 and the vacuum nozzle 5 to rise and fall, adapting to different workstation heights and enabling precise chip placement and removal. The nozzle rotation mechanism 412 can drive the vacuum nozzle 5 to rotate, facilitating the adjustment of the chip's orientation to match the positioning requirements of subsequent processes and preventing chip orientation deviations from affecting subsequent operations.

[0033] In this embodiment, refer to Figure 9 As shown, the lifting mechanism 411 includes a fixed connecting block 4111 and a sliding connecting block 4112 that is slidably connected to the fixed connecting block 4111.

[0034] The sliding connecting block 4112 has a rectangular slot 41121 in the middle. A bushing 4113 is located inside the rectangular slot 41121. A drive shaft 4114 is rotatably mounted inside the bushing 4113. The drive shaft 4114 has an axially eccentrically positioned connecting hole, which is connected to the power shaft of the first servo motor fixed to the fixed connecting block 4111. The nozzle rotation mechanism 412 includes a motor mounting plate 4121. A second servo motor 4122 is fixedly mounted on the top of the motor mounting plate 4121, and a nozzle rolling mechanism 4123 is fixedly connected to its side. The vacuum nozzle 5 is rotatably mounted on the nozzle rolling mechanism 4123 and is connected to the second drive device 13 via a linkage mechanism 4124. The linkage mechanism 4124 includes a drive arm 41241 and a swing rod 41242. One end of the drive arm 41241 is mounted on the output shaft of the second servo motor 4122, and the other end is connected to a lever 41243. One end of the swing rod 41242 is fixedly connected to the vacuum nozzle 5, and the other end has a U-shaped fork structure. The lever 41243 is slidably disposed inside the U-shaped fork structure.

[0035] In the specific operation, when the first servo motor drives the transmission shaft 4114 to rotate, the transmission shaft 4114 drives the sliding connecting block 4112 to slide up and down along the fixed connecting block 4111 via the eccentrically set connecting hole. This eccentric transmission structure can accurately convert the rotational motion of the motor into the linear lifting motion of the sliding connecting block 4112, improving the accuracy and stability of the lifting action and avoiding jamming or deviation during the lifting process. Furthermore, a secondary shaft can be added to the front end of the transmission shaft 4114. A connecting shaft is provided on the front end face of the secondary shaft. The axis of the connecting shaft coincides with the axis of the transmission shaft 4114. A fan-shaped sensing plate is installed on the connecting shaft. The fan-shaped sensing plate can rotate synchronously with the transmission shaft 4114. A photoelectric sensor is fixedly installed on the fixed block corresponding to the fan-shaped sensing plate. This design converts the real-time angular position information of the transmission shaft 4114 into photoelectric signals that can be accurately identified by the servo control system, thereby forming a closed-loop feedback control for the lifting motion. When the second servo motor 4122 drives the drive arm 41241 to rotate, the lever 41243 slides in the U-shaped fork structure and drives the swing arm 41242 to swing, thereby driving the vacuum nozzle 5 to rotate around the nozzle rolling mechanism 4123. The transmission method of the linkage mechanism 4124 can achieve precise control of the angle of the vacuum nozzle 5. The sliding cooperation between the U-shaped fork and the lever 41243 can buffer the impact force during the transmission process, reduce component wear, and ensure the smoothness of the rotation action.

[0036] Specifically, refer to Figure 3 As shown, it also includes a turntable loading / unloading positioning mechanism 7. The turntable loading / unloading positioning mechanism 7 includes a positioning support 71 and a positioning camera assembly 72. The positioning support 71 is fixed to the crossbeam 62, and the positioning camera assembly 72 is fixed to the positioning support 71. The positioning camera assembly 72 is correspondingly set to the loading / unloading station of the turntable 31. During operation, when the turntable 31 drives the adjusting positioning fixture 32 and the chip to the loading / unloading station, the positioning camera assembly 72 performs visual acquisition and recognition of the chip at the station and feeds the position information back to the control system. This allows the control system to adjust the action parameters of the positioning fixture 32 or the suction nozzle conveying mechanism 41 in real time to achieve precise alignment of the chip loading / unloading. By setting up a positioning camera component 72 corresponding to the loading and unloading station, the position of the chip or nozzle can be detected and fed back in real time using visual positioning technology. This can effectively correct the positional deviation caused by the rotation of the turntable 31 and the adjustment of the tooling, improve the positioning accuracy of the loading and unloading process, and avoid problems such as chip collision and adsorption displacement caused by inaccurate positioning. At the same time, the positioning camera component 72 is integrated on the crossbeam 62 of the gantry frame 6, which is compact and does not interfere with the movement of other mechanisms.

[0037] In this embodiment, refer to Figure 1 As shown, it also includes a loading / unloading positioning mechanism 8 and a unloading mechanism 9. The rear end face detection mechanism includes a support frame 10 fixed near the turntable 31. Specifically, the loading / unloading positioning mechanism 8 includes a loading positioning mechanism 81 slidably mounted on the crossbeam 62 and a unloading positioning mechanism 82 slidably mounted on the support frame 10, with the unloading mechanism 9 located below the unloading positioning mechanism 82. (Refer to...) Figure 11 As shown, the unloading mechanism 9 includes a linear mechanism 91 and an unloading fixture 92 mounted on a pallet. The loading positioning mechanism 81 is used to detect and position the loading fixture 15, and the unloading positioning mechanism 82 is used to detect and position the unloading fixture 92.

[0038] During operation, the loading and positioning mechanism 81 slides along the crossbeam 62 to adjust its position and completes the position detection of the loading fixture 15 delivered to the workstation. It then feeds the positioning information back to the control system to assist the suction nozzle handling mechanism 41 in accurately grasping the chip. The unloading and positioning mechanism 82 slides along the support frame 10 to detect and position the unloading fixture 92. It works in conjunction with the linear mechanism 91 to move the unloading fixture 92, ensuring that the chip is accurately placed into the unloading fixture 92. The support frame 10 of the rear end face detection mechanism provides a stable installation foundation for the subsequent chip rear end face detection components.

[0039] In this embodiment, the ejector mechanism 42 includes an XYZ axis adjusting slide 421, a slide pad 422, an eccentric lifting mechanism 423, and an ejector assembly 424. The XYZ axis adjusting slide 421 is fixed in the mounting hole on the base via the slide pad 422, and the ejector assembly 424 is connected to it via the eccentric lifting mechanism 423 for adjusting the spatial position of the ejector assembly 424. Specifically, the ejector assembly 424 includes a bearing seat 4241, a guide seat 4242, an ejector pin seat 4243, and a guide cap 4244. The bearing seat 4241 and the guide seat 4242 are fixed to the support plate on the top of the eccentric lifting mechanism 423 and are coaxially arranged with the lifting rod of the eccentric lifting mechanism 423. The top of the lifting rod is fixed to the ejector pin seat 4243, and the top of the ejector pin seat 4243 is fixed to the guide cap 4244. The ejector mechanism 42 achieves precise multi-dimensional adjustment of the spatial position of the ejector assembly 424 through the XYZ axis adjustment slide 421, which can flexibly adapt to the lifting requirements of different specifications of chips or different workstations, and improve the versatility of the equipment. The eccentric lifting mechanism 423, together with the coaxially set bearing seat 4241 and guide seat 4242, can ensure the stability and coaxial accuracy of the lifting movement of the ejector assembly 424, and avoid skewness and jamming during the lifting process. The combined structure of the guide cap 4244 and the ejector cap 4243 can protect the chip contact parts and prevent damage to the chip during the lifting process. The slide pad 422 is used to enhance the stability of the XYZ axis adjustment slide 421 installation.

[0040] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicator will also change accordingly.

[0041] Furthermore, in this embodiment, the use of terms such as "first" and "second" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. In the description of this embodiment, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this embodiment, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0043] It should be understood that the above description of specific embodiments of the present invention is only for illustrating the technical approach and features of the present invention, and is intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the present invention is not limited to the specific embodiments described above. All changes or modifications made within the scope of the claims of the present invention should be covered within the protection scope of the present invention.

Claims

1. A novel rotary AOI inspection device, characterized in that, include: The feeding and adjustment mechanism (1) is used to place and adjust the chip to be tested; The end face inspection mechanism (2) includes a front face inspection mechanism and a back face inspection mechanism, which are used to inspect the end face of the chip; The turntable mechanism (3) includes a turntable (31) and multiple sets of adjustment and positioning fixtures (32) located on the top of the turntable (31). The multiple sets of adjustment and positioning fixtures (32) are evenly arranged along the circumferential direction of the turntable (31) and can enter the detection area of ​​the end face detection mechanism (2) in sequence at intervals under the drive of the turntable (31). The conveying mechanism (4) includes a nozzle transport mechanism (41) located at the top of the feeding adjustment mechanism (1) and a pin mechanism (42) located at the bottom. The pin mechanism (42) is used to lift the chip to be tested after feeding adjustment, and the nozzle transport mechanism (41) is used to transport the chip lifted by the pin mechanism (42) to the adjustment positioning fixture (32).

2. The novel rotary AOI inspection equipment as described in claim 1, characterized in that, The feeding adjustment mechanism (1) includes a base (11), a suction cup (12), and a driving device (13). The base (11) is fixed on the XY axis cross slide (14) so ​​that the position of the base (11) can be adjusted in the XY plane; The suction cup (12) is rotatably mounted on the base (11) and connected to the drive device (13) via a gear or synchronous belt transmission mechanism to achieve forward and reverse rotation. The suction cup (12) is a vacuum suction cup (12) with a loading fixture (15) for placing chips fixed on its top.

3. The novel rotary AOI inspection equipment as described in claim 1, characterized in that, Both the front-end detection mechanism and the rear-end detection mechanism include a slide assembly (21) and a detection component (22) disposed on the slide assembly (21). The slide assembly (21) includes an X-axis electric slide (211) and a YZ-axis manual slide (212), which can be combined to adjust the spatial position of the detection assembly (22); The detection component (22) includes an industrial camera (221), an objective lens (222), and a tube lens (223) connecting the industrial camera (221) and the objective lens (222).

4. The novel rotary AOI inspection equipment as described in claim 1, characterized in that, The turntable (31) is a hollow rotating platform, and the adjustment and positioning fixture (32) includes a primary electric adjustment platform (321), a secondary manual adjustment platform (322), a tilt adjustment platform (323), and a suction nozzle fixing table (324). Multiple primary electric adjustment platforms (321) are evenly distributed on the turntable (31), and the top of the platform is connected to the secondary manual adjustment platform (322) via a torque motor (325). The top of the secondary manual adjustment platform (322) is fixed to the tilt adjustment platform (323), and the top of the tilt adjustment platform is fixed to the nozzle fixing platform (324). The nozzle fixing platform (324) is used to fix the vacuum nozzle (5) of the adsorption chip. The vacuum nozzle (5) is connected to a negative pressure source.

5. The novel rotary AOI inspection equipment as described in claim 4, characterized in that, It also includes the gantry frame (6); The gantry frame (6) includes a column (61) and a crossbeam (62) supported by the column (61), and the suction nozzle conveying mechanism (41) is slidably mounted on the crossbeam (62); The suction nozzle transport mechanism (41) includes a lifting mechanism (411) and a suction nozzle rotation mechanism (412). The lifting mechanism (411) is slidably connected to the crossbeam (62) via a linear guide rail, and the bottom is connected to the suction nozzle rotation mechanism (412), which can drive the suction nozzle rotation mechanism (412) to rise or fall. The vacuum nozzle (5) is installed on the suction nozzle rotation mechanism (412).

6. The novel rotary AOI inspection equipment as described in claim 5, characterized in that, The lifting mechanism (411) includes a fixed connecting block (4111) and a sliding connecting block (4112) that is slidably connected to the fixed connecting block (4111). The sliding connecting block (4112) has a rectangular slot (41121) in the middle. The rectangular slot (41121) has a bushing (4113) inside. The bushing (4113) has a drive shaft (4114) rotatably installed inside. The drive shaft (4114) has an axially eccentrically set connecting hole inside. The connecting hole is connected to the power shaft of the first servo motor fixed on the fixed connecting block (4111).

7. The novel rotary AOI inspection equipment as described in claim 5, characterized in that, The suction nozzle rotation mechanism (412) includes a motor mounting plate (4121), on which a second servo motor (4122) is fixedly mounted on the top and a suction nozzle rolling mechanism (4123) is fixedly connected on the side. The vacuum suction nozzle (5) is rotatably mounted on the suction nozzle rolling mechanism (4123) and is connected to the second servo motor (4122) via a linkage mechanism (4124). The linkage mechanism (4124) includes a drive arm (41241) and a swing rod (41242). One end of the drive arm (41241) is mounted on the output shaft of the second servo motor (4122), and the other end is connected to a lever (41243). One end of the swing rod (41242) is fixedly connected to the vacuum nozzle (5), and the other end has a U-shaped fork structure. The lever (41243) is slidably disposed inside the U-shaped fork structure.

8. The novel rotary AOI inspection equipment as described in claim 5, characterized in that, It also includes a turntable loading and unloading positioning mechanism (7); The turntable loading and unloading positioning mechanism (7) includes a positioning support (71) and a positioning camera assembly (72). The positioning support (71) is fixed to the crossbeam (62), and the positioning camera assembly (72) is fixed to the positioning support (71). The positioning camera assembly (72) is set in correspondence with the loading and unloading station of the turntable (31).

9. The novel rotary AOI inspection equipment as described in claim 5, characterized in that, It also includes a loading and unloading positioning mechanism (8) and a unloading mechanism (9); The rear end face detection mechanism includes a support frame (10) fixed near the turntable (31). The loading and unloading positioning mechanism (8) includes a loading positioning mechanism (81) slidably disposed on the crossbeam (62) and a unloading positioning mechanism (82) slidably disposed on the support frame (10), and the unloading mechanism (9) is disposed below the unloading positioning mechanism. The unloading mechanism (9) includes a linear mechanism (91) and an unloading fixture (92) mounted on a pallet. The loading positioning mechanism (81) is used to detect and position the loading fixture (15), and the unloading positioning mechanism (82) is used to detect and position the unloading fixture (92).

10. The novel rotary AOI inspection equipment as described in claim 1, characterized in that, The ejector pin mechanism (42) includes an XYZ axis adjusting slide (421), a slide pad (422), an eccentric lifting mechanism (423), and an ejector pin assembly (424). The XYZ axis adjusting slide (421) is fixed in the mounting hole on the base through the slide pad (422), and the ejector pin assembly (424) is connected to it through the eccentric lifting mechanism (423) for adjusting the spatial position of the ejector pin assembly (424); The ejector assembly (424) includes a bearing seat (4241), a guide seat (4242), an ejector pin seat (4243), and a guide cap (4244). The bearing seat (4241) and the guide seat (4242) are fixed to the support plate on the top of the eccentric lifting mechanism (423) and are coaxially arranged with the lifting rod of the eccentric lifting mechanism (423). The top of the lifting rod is fixed to the ejector pin seat (4243), and the top of the ejector pin seat (4243) is fixed to the guide cap (4244).

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