Dynamic valve for electronic device

By designing the vanes and support components of the electromechanical valve assembly, the leakage of portable devices is dynamically adjusted, solving the balance problem between sealing and permeability of the transducer, and improving acoustic performance and user experience.

CN121531276APending Publication Date: 2026-02-13APPLE INC
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Patent Information

Application Number
CN202511851603.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2021-09-23
Filing Date
2022-09-16
Publication Date
2026-02-13

AI Technical Summary

Technical Problem

Transducers in portable communication devices, due to their thin design, struggle to maintain optimal sound quality, particularly in balancing sealing and transparency, which impacts noise control and sound output.

Method used

The electromechanical valve assembly, including multiple vanes and support components, is used to control the opening and closing of the through-hole by applying voltage, thereby achieving dynamic leakage adjustment to meet the acoustic requirements of different application scenarios.

Benefits of technology

It enables dynamic control of leakage at low power consumption, improving the flexibility of the device between sealing and permeability, and enhancing acoustic performance and user experience.

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Abstract

The invention relates to a dynamic valve for an electronic device. There is provided a portable electronic device including: a housing having a housing wall forming an internal chamber and a sound output port to an ambient environment; a transducer positioned within the interior chamber and dividing the interior chamber into a front volume chamber coupling a first side of the transducer to the sound output port and a rear volume chamber coupling to a second side of the transducer; and an electromechanical valve including a plurality of flaps operable to open and close through-holes leading to the interior chamber, the front volume chamber, or the rear volume chamber.
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Description

[0001] This application is a continuation of the invention patent application entitled “Dynamic Valve for Electronic Device” having application number 202211126448.9, filed on September 16, 2022, and priority to U.S. Provisional Patent Application No. 63 / 245,570, filed on September 17, 2021, which is incorporated by reference herein.

[0002] Cross Reference to Related Applications

[0003] This application is a non-provisional of co-pending U.S. Provisional Patent Application No. 63 / 245,570, filed on September 17, 2021, which is incorporated by reference herein. TECHNICAL FIELD

[0004] One aspect of the present disclosure relates to a dynamic valve assembly for an electronic device. Other aspects are also described and claimed. BACKGROUND

[0005] Portable communication or listening devices (e.g., smart phones, earphones, etc.) have one or more transducers located within them that convert input electrical audio signals into sound pressure wave outputs that can be heard by a user, or convert sound pressure wave inputs into electrical audio signals. Transducers (e.g., speakers) can be used, for example, to output sound pressure waves corresponding to a far-end user’s voice (such as during a phone call), or to output sound pressure waves corresponding to sounds associated with a game the user wants to play or music the user wants to play. Due to the relatively thin profile of portable devices, the transducers also have a relatively thin profile, which in turn can make it difficult to maintain optimal sound quality. SUMMARY

[0006] One aspect of the present disclosure relates to a dynamic valve that can be used to control the amount of leakage between an internal cavity and the environment. Representatively, in the case of earphones, in some cases a perfect seal (high impedance) is desired, while in other cases a very open path (low impedance) is desired. Representatively, in some cases, if the earphone fits relatively tightly within the ear and forms a seal or at least a partial seal with the ear canal, the user can experience an undesirable occlusion effect. For example, during active noise control (ANC) or noise cancellation, the user can want the in-ear device to be isolated with passive isolation and ANC (closed valve), but when outside, transparency (open valve) can be desired so that there is a more natural and lower occlusion effect when speaking. Thus, the valve allows for dynamically controlling the amount of leakage during operation of the system according to the desired level of leakage and with lower power consumption.

[0007] Representatively, in some aspects, the present disclosure relates to a portable electronic device (e.g., a wearable device such as an earphone) including a housing having a housing wall forming an internal chamber, and a sound output port to an ambient environment; a transducer positioned within the internal chamber and dividing the internal chamber into a front volume chamber and a back volume chamber, the front volume chamber coupling a first side of the transducer to the sound output port, the back volume chamber coupled to a second side of the transducer; and an electromechanical valve including a plurality of flaps operable to open and close a through-hole to the internal chamber, the front volume chamber, or the back volume chamber. In some aspects, the plurality of flaps are operable to open or close the through-hole to the ambient environment upon application of a voltage. In further aspects, the through-hole includes a first opening and a second opening, and the plurality of flaps include a first flap operable to open and close the first opening, and a second flap operable to open and close the second opening. In some aspects, at least one flap of the plurality of flaps includes an electrode layer and a structural material layer, and the flap is coupled to a support member having a first portion arranged perpendicular to the flap. In some aspects, upon application of a voltage, the flap transitions from a closed position to an open position in which it is coupled to the first portion by an electrostatic force. In some aspects, the support member further includes a second portion extending perpendicular to the first portion and positioned above the flap, and upon application of a voltage, the flap is coupled to the second portion to close the through-hole. The flap can further include a piezoelectric layer coupled to the electrode layer. In some aspects, the electrode layer is a first electrode layer, and the flap further includes a second electrode layer coupled to an opposite side of the piezoelectric layer from the first electrode layer. In some aspects, the first portion of the support member includes a tapered portion that reduces a distance the flap moves to transition to the open position. In some aspects, the valve is a first valve, and the device further includes a second valve having a flap operable to open in an opposite direction to at least one flap of the plurality of flaps of the first valve to counteract a net air pressure generated by the first valve upon transitioning to the open position.

[0008] In another aspect, the present disclosure is directed to a valve assembly for a portable electronic device, the valve assembly comprising a support member coupled to a housing opening, the support member having an insulating layer; and an electromechanical flap movably coupled to the support member, the electromechanical flap comprising a first material layer comprising a metal, and wherein upon application of a voltage, the electromechanical flap is operable to transition between a closed configuration in which the electromechanical flap covers the housing opening and an open configuration in which the electromechanical flap uncovers the housing opening. The first material layer comprising a metal can be an electrode layer, and the second material layer comprises a structural material coupled to the first material layer, and the second material layer comprises polysilicon, silicon nitride, or single crystal silicon. In some aspects, the second material layer comprises a piezoelectric material. In some aspects, a third material layer comprising a metal is also provided. In some aspects, the insulating layer is coupled to a surface of the support member that extends perpendicular to the housing opening, and the flap rotates about a hinge toward the insulating layer to the open configuration. In some aspects, the insulating layer is coupled to a surface of the support member that extends parallel to the housing opening and is positioned above the flap, and wherein the flap rotates about a hinge toward the insulating layer to the closed configuration. In some aspects, the electromechanical flap comprises a first electromechanical flap and a second electromechanical flap. The first electromechanical flap and the second electromechanical flap can be independently operable to transition between a closed configuration in which the first electromechanical flap and the second electromechanical flap cover the housing opening and an open configuration in which the first electromechanical flap and the second electromechanical flap rotate toward the insulating layer of the support member. In some aspects, the opening comprises a first opening and a second opening, and the first electromechanical flap is operable to transition between a closed configuration in which the first electromechanical flap covers the first housing opening and an open configuration, and the second electromechanical flap is operable to transition between a closed configuration in which the first electromechanical flap covers the second housing opening and an open configuration. In some aspects, the support member comprises a first end and a second end opposite the first end, the first electromechanical flap is coupled to the first end, the second electromechanical flap is coupled to the second end, and wherein the second electromechanical flap opens in an opposite direction to the first electromechanical flap to counteract a net air pressure generated by the first electromechanical flap when transitioning to the open position.

[0009] The foregoing overview is not intended to be an exhaustive list of all aspects of the disclosure. It is contemplated that the application includes all systems and methods that can be practiced from all suitable combinations of the various aspects summarized above, as well as those disclosed in the detailed description below and particularly pointed out in the claims filed with the application. Such combinations have particular advantages not specifically recited in the above summary. BRIEF DESCRIPTION OF DRAWINGS

[0010] Several aspects are illustrated in the accompanying drawings by way of example rather than limitation, and similar reference numerals in the drawings indicate similar elements. It should be noted that references to “a” or “an” aspect in this disclosure do not necessarily refer to the same aspect, and that they mean at least one.

[0011] FIG. 1 A cross-sectional side view of one aspect of a portable electronic device and / or transducer assembly with a valve is shown.

[0012] FIG. 2 It shows FIG. 1 A perspective view of one aspect of the valve of a portable electronic device and / or transducer assembly.

[0013] FIG. 3A It shows a closed configuration. FIG. 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0014] FIG. 3B It shows the open configuration. FIG. 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0015] FIG. 4A It shows a closed configuration. FIG. 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0016] FIG. 4B It shows the open configuration. FIG. 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0017] FIG. 5A It shows a closed configuration. FIG. 2 A side perspective view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0018] FIG. 5B It shows the open configuration. FIG. 2 A side perspective view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0019] FIG. 6A It shows the open configuration. FIG. 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0020] FIG. 6B It shows a closed configuration. FIG. 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0021] FIG. 7A a cross-sectional side view of an aspect of a valve of a portable electronic device and / or transducer assembly in a closed configuration. FIG. 2

[0022] FIG. 7B a cross-sectional side view of an aspect of a valve of a portable electronic device and / or transducer assembly in an open configuration. FIG. 2

[0023] FIG. 8A a cross-sectional side view of an aspect of a valve of a portable electronic device and / or transducer assembly in a closed configuration. FIG. 2

[0024] FIG. 8B a cross-sectional side view of an aspect of a valve of a portable electronic device and / or transducer assembly in an open configuration. FIG. 2

[0025] FIG. 9 a block diagram of an aspect of an electronic device in which a transducer including a valve assembly of FIG. 8 can be implemented. FIG. 1 DETAILED DESCRIPTION

[0026] In this section, we will explain several preferred aspects of the present disclosure with reference to the drawings. Whenever a shape, relative position, and other aspect of a described component is not clearly defined, the scope of the present disclosure is not limited only to the illustrated component, which is used for illustrative purposes only. In addition, although many details are set forth, it is to be understood that some aspects of the present disclosure can be practiced without these details. In other instances, well-known structures and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0027] ​​​​​The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the present disclosure. Spatially relative terms, such as "under", "below", "lower", "on", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device is inverted or rotated by 90 degrees, then an element described as "below" or "under" another element or feature would then be oriented "above" or "on" the other element or feature. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (e.g., at 90 degrees) and the spatially relative descriptors used herein interpreted accordingly.

[0028] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including" when used herein, specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0029] The terms "or" and "and / or" as used herein are to be interpreted as inclusive or meaning any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C." An exception to this definition will occur only when two elements are inherently mutually exclusive from each other.

[0030] FIG. 1A cross-sectional side view of one aspect of a valve assembly of a transducer positioned within a portable electronic device is shown. The electronic device 100 can include a housing, casing, or outer shell 102 that defines or encloses a chamber in which constituent electronic components of the electronic device 100 are housed. In some aspects, the device 100 can be a portable or mobile communication device, an in-ear device, a portable timer, or any other device in which a transducer can be implemented. The shell 102 can include a shell wall 104 that separates the surrounding environment from an enclosed space or internal chamber 106 formed within the shell 102. In some cases, the shell wall 104 completely isolates or seals the entire or partial internal chamber 106 from the surrounding environment. For example, the shell wall 104 can form a waterproof or soundproof portion of the internal chamber 106 that is impervious to water and / or air. The internal chamber 106 can have sufficient volume and / or dimensions to house the constituent components of the electronic device 100. The shell wall 104 can also include one or more of acoustic ports 108. The acoustic ports 108 can be, for example, sound output ports through which sound from a speaker positioned within the internal chamber 106 can be output. In other aspects, where a microphone is positioned proximate to the shell acoustic interface 108, it can be a sound input port to allow sound to be input to the microphone.

[0031] Representatively, in FIG. 1In one aspect shown in FIG. 1, the housing acoustic port 108 is an acoustic port that is acoustically open to a transducer 110 positioned within the internal chamber 106. In some aspects, the transducer 110 can be any type of electroacoustic transducer capable of converting an electrical audio signal into sound or converting sound into an electrical audio signal. Representatively, the transducer 110 can be a loudspeaker or microspeaker, e.g., a miniaturized version of a loudspeaker that uses a moving coil motor to drive a sound output. Thus, in some aspects, the transducer 110 can be referred to herein as a microspeaker. In other aspects, the transducer 110 can also be referred to herein as a microphone if it converts sound into an electrical audio signal. In some aspects, the transducer 110 can be coupled to the inner wall 112 and is considered to divide the internal chamber 106 into a front volume chamber 106A and a back volume chamber 106B that surround the transducer 110. In the case where the transducer 110 is a loudspeaker, the front volume chamber 106A can form a chamber having a first volume (VI) that surrounds a sound output face or surface 110A of the transducer 110. The front volume chamber 106A (and the first volume VI) can be considered to be acoustically coupled to or otherwise open to the acoustic port 108. In this aspect, sound pressure waves output from the surface 110A of the transducer 110 can pass through the front volume chamber 106A and exit through the acoustic port 108 to the ambient environment 112. The back volume chamber 106B can have a second volume (V2) and surround a back side of the transducer 110 (e.g., a side of the transducer 110 opposite the surface 110A).

[0032] It has been recognized that, for example, the size, volume, pressure, or other aspects of the front volume chamber 106A or the back volume chamber 106B can affect the acoustic performance of the transducer 110. Thus, modifying the size, volume, and / or pressure of the front volume chamber 106A and / or the back volume chamber 106B can be used to tune the acoustic performance of the transducer 110. For example, in some cases, it can be desirable for the front volume chamber 106A and / or the back volume chamber 106B to be isolated or sealed (e.g., high impedance) from the ambient environment 112 to achieve a desired acoustic performance. In other cases, it can be desirable for the front volume chamber 106A and / or the back volume chamber 106B to have a very open path (e.g., low impedance) and to have some amount of leakage to the ambient environment 112. In further aspects, it can be desirable for the front volume chamber 106A to have leakage, or otherwise be open to the back volume chamber 106B.

[0033] Accordingly, valve assemblies or valves 114, 116, and / or 118 can also be provided to vent the associated chambers. Valves 114, 116, and / or 118 can open and / or close a through-hole or opening 120 from the front volume chamber 106A and / or the back volume chamber 106B to the ambient environment 112, or between the front volume chamber 106A and the back volume chamber 106B. Typically, valve 114 can open and / or close an opening 120 formed through the wall 104 between the front volume chamber 106A and the ambient environment 112. In other words, when valve 114 is open, the front volume chamber 106A can leak or vent to the ambient environment 112, and when valve 114 is closed, the leak or vent is prevented. Leakage or venting from the front volume chamber 106A can be desirable if, for example, the device 100 is an in-ear earpiece that is sealed within a user's ear, but a more open feel is desired. Valve 116 can open and / or close an opening 120 through the wall 104 between the back volume chamber 106B and the ambient environment 112. In other words, when valve 116 is open, the front volume chamber 106A can leak or vent to the back volume chamber 106B, and when valve 116 is closed, the leak or vent is prevented. Valve 118 can open and / or close an opening 120 through the wall 112 between the front volume chamber 106A and the back volume chamber 106B. In this regard, when valve 118 is open, the back volume chamber 106B can leak or vent to the back volume chamber 106B, and when valve 118 is closed, the leak or vent is prevented. In further aspects, it is contemplated that one or more of the valves 114, 116, 118 can be used to open and / or close an opening (e.g., opening 120) to another type of acoustic chamber, for example, to an acoustic resonator or attenuator coupled to one or more of the previously discussed chambers or ports of the transducer.

[0034] In one aspect, one or more of the valves 114, 116, 118 can be an electromechanical valve that opens and / or closes in response to an applied voltage. In this aspect, the valves 114, 116, 118 can be dynamically actuated to control the amount of leakage. In some aspects, one or more of the valves 114, 116, 118 can be a microelectromechanical system (MEMS) actuator or valve. The valves 114, 116, 118 can be the same or can also be different. In some aspects, one or more valves can provide the following advantages: bistability, low power switching from on / off states, digitization for controlling the percentage or amount of open area for venting, and / or silent operation. Reference will now be made to FIGS. 2-8B Representative configurations for the valves 114, 116, 118 are described.

[0035] Typically, FIG. 2 An enlarged top perspective view of a representative valve from FIG. 1 is shown. In this aspect,FIG. 2 A valve 114 is shown for opening / closing an opening 120 formed in the housing wall 104. However, it should be appreciated that while the valve 114 is specifically discussed, one or more of the valves 116 and / or 118 can be identical to the valve 114 such that the description provided herein also applies to any other valve disclosed in the FIG. 1 From this view, it can be seen that the opening 120 includes a plurality of openings 220 and that the valve 114 includes a plurality of flaps 214 configured to open / close a respective one of the openings 220. Representatively, the openings 220 can be an array of openings 220 that together make up the opening 120. In this regard, the openings 220 can be relatively small, e.g., from about 1 mm to about 3 mm. Similarly, the valve 114 includes an array of flaps 214 positioned over a respective one of the openings 220 to open / close each of the openings 220 as desired. For example, the combination of openings 220 and flaps 214 can make up a 4x4 array of valves as shown, but can include more or fewer valves in the array. For example, the valves can be arranged in a 5x5 array, a 6x6 array, etc. However, it should be appreciated that the valves can be arranged or patterned other than in an array as desired. Additionally, it should be appreciated that while square openings 120 and / or flaps 214 are shown, other polygonal or non-polygonal shapes and sizes of the openings 120 and / or flaps 214 are contemplated (e.g., triangular, rectangular, circular, etc.). The size and shape of the openings 120 and flaps 214 should be complementary such that the flaps 214 have sufficient size and / or shape to cover the openings 220 in a closed configuration and to uncover the openings 220 in an open configuration. It can additionally be appreciated that in some aspects, each of the flaps 214 can be individually controlled by the application of a voltage such that some flaps can be open (e.g., not covering a respective opening 220) while other flaps can be closed (e.g., covering a respective opening 220) depending on the desired level of discharge. The opening and / or closing of the flaps 214 can be controlled in parallel or individually by the application of a voltage to drive to give variable impedance control. For example, in some aspects, the application of a voltage can be used to open the flaps 214, but once opened, they can be considered to be "latched" and can remain latched while reducing power to almost zero. In this regard, the valve 114 consumes a relatively low amount of power when transitioning between open / closed states or configurations.

[0036] Representatively, FIGS. 3A-3B A cross-sectional side view of one aspect of a valve assembly from FIG. 2 is shown. In particular, FIGS. 3A-3B A cross-sectional side view of one aspect of a valve assembly from FIG. 2representative aspects of valve 114. However, it should be appreciated that although valve 114 is specifically discussed, one or more of valves 116 and / or 118 can be identical to valve 114 such that the description provided herein also applies to any other valve disclosed herein. Referring now to valve 114, as can be seen from this view, valve 114 includes at least one flap 214 coupled to a support member 302 by a hinge 306. It should be recognized that although the term "flap" is used herein, flap 214 can be any structure suitable for opening and / or closing opening 220 as discussed herein. Flap 214 and / or support member 302 can include a material that allows flap 214 to be opened and / or closed with respect to opening 220 when a voltage and electrostatic force are applied. Representatively, flap 214 can include a first material layer 214A made of a metallic material and a second material layer 214B made of a structural material. In some aspects, flap 214 can also include an optional material layer 214C that is the same as second material layer 214B and first material layer 214A can be sandwiched between layers 214B and 214C. The materials of layers 214A-214B and optional layer 214C can be any MEMS material. For example, first material layer 214A can be made of a metallic material including, but not limited to, gold, aluminum, etc. In some aspects, first material layer 214A can be referred to herein as an electrode layer, or include an electrode. Second material layer 214B and material layer 214C can be made of a structural material including, but not limited to, polysilicon, silicon nitride, silicon carbide, single crystal silicon, or generally a polymeric MEMS material. First material layer 214A and second material layer 214B can be fixedly attached to one another (e.g., using an adhesive, etc. during processing operations) to form flap 214. In some aspects, material layer 214C can be fixedly attached to a side of first material layer 214A opposite second material layer 214B to provide environmental protection and / or better stress control of flap 214. Flap 214 can include a first end 310 that is considered free to move between an open and / or closed position, and a second end 312 that is coupled to hinge 306 and drives movement of free end 310. In some aspects, hinge 306 can include a spring or biasing mechanism 314 that biases flap 214 toward a closed or horizontal position in which flap 214 covers opening 220, as shown in FIG. 3A FIG. 3A ​The illustrated rest state (e.g., no voltage applied) the flap 214 will remain closed or otherwise in a position such that it is covering the opening 220. However, application of sufficient voltage to the flap 214 will create an attractive force between the flap 214 and the support member 302 that overcomes the biasing force of the hinge 306. This in turn causes the flap 214 to move or rotate (as illustrated by the arrow) toward the support member 302 to an open position (or vertical position) in which it does not cover the opening 220 and latches to the support member 302 due to the electrostatic force, as FIG. 3B illustrated.

[0037] In this regard, the support member 302 can comprise a material that allows the flap 214 to rotate toward and latch to the support member 302 when a force is applied. Representatively, the support member 302 can be a vertical extension of a base or housing wall (or wall) and include an insulating material 308 attached to the side or surface facing the flap 214. For example, the support member 302 can be considered to extend perpendicular to the opening 220, as illustrated. In some aspects, the support member 302 can be made of a single crystal silicon, quartz, or glass material and the insulating material 308 can be, for example, a layer of aluminum oxide or silicon dioxide material. Upon application of a voltage to the flap 214, the voltage will slowly begin to exert a force on the flap 214. The voltage can be continuously increased until an attractive force is created that moves or rotates the flap 214 toward and latches it to the support member 302. It should also be understood that once latched, the flap 214 can remain latched while the electrostatic force reduces the power to nearly zero. However, once the voltage is reduced to a certain threshold, the spring / mechanical force of the hinge 306 will overcome the electrostatic force causing the flap 214 to rotate back to the closed position, as FIG. 3A illustrated. In this regard, it can be appreciated that in order to open / close the flap 214, there is a critical voltage that can be used to keep the flap 214 open and upon reduction of the voltage, there is some hysteresis that occurs allowing the flap 214 to remain latched for a period of time with the electrostatic force generated. However, at some point, this is overcome by the biasing force of the hinge 306 and the flap 214 will return to the closed position. For example, to open the flap 214, a voltage of up to about 50 volts can be applied to the flap 214, which can then be reduced to 40 volts while the flap 214 remains latched. Upon further reduction of the voltage to 30 volts, the flap 214 can remain latched for a period of time due to the hysteresis until the spring force eventually overcomes any remaining force causing the flap 214 to rotate back to the closed position. In some aspects, the device can have an application specific integrated circuit (ASIC) 222 that can be in close proximity to the flap 214 to which it is connected and used to apply the voltage necessary to dynamically control the flap 214.

[0038] Referring now in more detail to the support member 302, in some aspects, the support member 302 can be a wall or structure that extends from the housing wall 104 into the interior chamber 106 defined by the housing wall 104. For example, the support member 302 can be a wall or structure that is coupled to or formed from the housing wall and / or a base or other material in which the valve assembly is implemented. The support member 302 can extend perpendicularly from a portion of the housing wall 104 that defines the opening 220. In some aspects, another support member 304 can also be provided and extend perpendicularly from a portion of the housing wall 104 that defines the opening 220. The support member 302 and the support member 304 can surround the opening 220. In some aspects, the support members 302, 304 can be an integrally formed wall or structure that is formed partially or completely around the opening 220. In this aspect, the support members 302, 304 can form an interior chamber below the opening 220 and the flap 214 can be received therein as it moves toward the support member 302 (e.g., to an open or upright position), as previously discussed and shown in FIG. 3B . As can be further seen in FIG. 3A , when the flap 214 is closed, the housing interior chamber 106 is closed or sealed from the ambient environment 112. On the other hand, when the flap 214 is in an open position, as shown in FIG. 3B , the interior chamber 106 is open or shares volume with the ambient environment 112. As previously discussed, the opening and closing of the flap 214 can be dynamically controlled. In addition, each flap 214 in the array of flaps that make up the valve 114, as described in FIG. 2 , can be individually controlled so that the total open area of the opening can be selected to match a desired leak. For example, if maximum opening or leak is desired, all of the flaps 214 can be opened, and if a smaller leak is desired, some of the flaps 214 can be opened while others can be closed.

[0039] FIGS. 4A-4B A cross-sectional side view of another aspect of the valve assembly from FIG. 2 is shown. In particular, FIGS. 4A-4B a representative aspect of the valve 114 from FIG. 2 is shown. FIGS. 4A-4B The valve 114 shown is substantially similar to the valve 114 described with reference to FIGS. 3A-3BThe described valve, as it includes a flap 214 connected to a support member 302 by a hinge 306. Similar to the previously discussed flap, the flap 214 can include a first layer of material 214A (e.g., a layer of metallic material) and a second layer of material 214B (e.g., a layer of structural material). The support member 302 can include an insulating material 308 attached to the side or surface of the support member 302 facing the flap 214. In this regard, upon application of a voltage as previously discussed, will cause the flap 214 to rotate in the direction of the arrow towards the support member 302. The flap 214 rotates until it contacts and latches to the support member 302 as previously discussed.

[0040] However, in this configuration, the support member 302 (and support member 304) can include an angled, sloped, or tapered configuration such that the distance the flap 214 must move in order to contact and latch to the support member 302 is reduced relative to the case where the support member is not tapered (e.g., as shown in FIGS. 3A-3B In particular, the inner surface 402 of the support member 302 facing the interior chamber can be sloped in an outward direction at the end furthest from the flap 214. For example, the support member 302 can have a first width dimension (W1) at the end closest to the flap 214 and increase to a second width dimension (W2) at the end furthest from the flap 214. The slope or angle of the support member 302 reduces the distance between the support member 302 and the support member 304 from a first distance D1 (at the top of the chamber) to a second distance D2 (at the bottom of the chamber). This in turn reduces the distance the flap 214 must move in order to contact the support member 302 and reach the open / latched position. For example, in the previous configuration, the flap 214 must move across the entire distance D1 to contact the support member, whereas in this configuration, the flap 214 need only move across the distance D2 to contact the support member 302. It should also be understood that since the distance the flap 214 must move in order to reach the open / latched position is reduced, the voltage required to reach the open / latched position can also be reduced.

[0041] Reference is now made to FIGS. 5A-5B , FIGS. 5A-5B shows a side perspective view of another aspect of the valve assembly. In particular, FIGS. 5A-5B shows a side perspective view of another aspect of the valve assembly. In particular, FIG. 2Representative aspects of valve 114. Valve 114 is similar to the valves previously discussed; however, in this configuration, valve 114 includes a plurality of flaps 514A, 514B, 514C, 514D, 514E, and 514F arranged above opening 220. Opening 220 may be formed in housing wall 104 and, in this respect, has a hexagonal shape as shown. Each of the flaps 514A-F may be triangular in shape and is attached at its widest end to housing 104 and / or surrounding support members 502, 504, 506 via hinge 524. In this respect, the point of each of the triangular flaps 514A-F faces the center of opening 220, and when they are arranged together above opening 220 as shown, they form a hexagonal shape similar to opening 220. FIG. 4A Shown are flaps 514A-F in a closed configuration, in which they cover or are otherwise considered to close opening 220, such that the internal chamber 106 is closed from the surrounding environment 112. To open flaps 514A-F, a voltage as previously discussed is applied, causing flaps 514A-F to rotate inward and toward the inner surface of a corresponding one of the support members 502, 504, 506 to which they are attached. Flaps 514A-F, hinge 524, and support members 502, 504, 506 can be substantially similar to the flaps, hinges, and support members previously discussed, thereby generating an electrostatic force when the voltage is applied, which pulls flaps 514A-F inward toward support members 502, 504, 506. In this respect, although not shown, an insulating layer can be formed on the intersecting surfaces of support members 502, 504, 506, similar to those previously referenced. FIGS. 3A-3B Those discussed. Then, the flaps 514A-F can remain latched to one of the corresponding support members 502, 504, 506 until the force is less than the biasing force of hinge 524. At that point, the biasing force of hinge 524 overcomes the electrostatic force and turns the flaps 514A-F back to their original positions. FIG. 4A The closed configuration is shown. As previously discussed, each of the vanes 514A-F can be individually controlled, thus all can be closed, all can be opened, or only some of the vanes 514A-F can be closed / opened, depending on the desired leakage level. It should also be understood that although a single valve assembly 114 and opening 220 are shown in housing 104, as previously referenced... FIG. 2 The array of valve assembly 114 and opening 220 under discussion.

[0042] FIGS. 6A-6B Showing from FIG. 2 A cross-sectional side view of another side of the valve assembly. Specifically, FIGS. 6A-6B Showing from FIG. 2 Representative aspects of valve 114. FIGS. 6A-6BThe illustrated valve 114 is substantially similar to the valve 114 described with reference to FIGS. 3A-4B The illustrated valve 114 is substantially similar to the valve 114 described with reference to

[0043] However, in this configuration, the flap 214 moves in the opposite direction when a voltage is applied to close the opening 220. Representatively, the flap 214 can be coupled to the support member 302 by a reverse hinge 306. The reverse hinge 306 can couple the flap 214 to the support member 302 such that the flap 214 moves in the opposite direction when a voltage is applied. The reverse hinge 306 can couple the flap 214 to the support member 302 such that the flap 214 moves in the opposite direction when a voltage is applied. FIG. 6A The illustrated horizontal position bias, which in this case is the open position. The support member 304 can include a second upper or latching portion 604 that is perpendicular to a first lower portion that extends perpendicular to the opening 220, as illustrated. For example, the portion 604 can be arranged such that it extends above the free end 310 of the flap 214 and parallel to the opening 220, while the lower portion of the support member 304 extends below the opening 220. Representatively, in this regard, the support member 304 can be an "L" shaped structure, where the latching portion 604 extends above the free end 310 of the flap 314, and the remainder extends below the opening 220. The latching portion 604 can include an insulator material 608 and a structural material 608. Upon application of a voltage, the flap 214 rotates from the FIG. 6A The illustrated open (horizontal) position rotates in an upward direction toward the latching portion 604. The flap 214 rotates upward until it contacts the latching portion 604, which in turn closes the opening 220, as illustrated. FIG. 6B The flap 214 can remain in the closed position until the electrostatic force is overcome by the biasing force of the hinge 306, causing the flap 214 to move back to the FIG. 6A The illustrated open (horizontal) position. Due to a configuration similar to FIGS. 4A-4B The flap 214 does not need to move as far to contact the latching portion 604, therefore, the voltage required to transition the flap 214 from the open position to the closed position can be reduced. Additionally, once in the closed or latched position of FIG. 6B The flap 214 will remain in place without an applied voltage for a period of time as previously discussed, therefore the power consumption is nearly zero while remaining in place in the closed / latched position. It can be further appreciated that another advantage of this configuration is that the latching portion 604 acts as a mechanical stop to avoid mechanical failure in large pressure inputs.

[0044] FIGS. 7A-7B Showing from FIG. 2 A cross-sectional side view of another side of the valve assembly. Specifically, FIGS. 7A-7B Showing from FIG. 2 Representative aspects of valve 114. FIGS. 7A-7B The valve 114 shown is basically similar to the reference valve. FIGS. 3A-3B The valve described includes a flap 214 connected to a support member 302 via a hinge 306. Similar to the flaps previously discussed, flap 214 may include a first material layer 214A (e.g., a metallic material layer) and a second material layer 214B (e.g., a structural material layer). In this configuration, flap 214 also includes a third material layer 714B and a fourth material layer 714B. For example, the third material layer 714B may be a piezoelectric layer, and the fourth material layer 714B may be a metallic layer. In some aspects, the first material or metallic layer 214A may be considered a common electrode, and the fourth material or metallic layer 714A may be considered a counter electrode. Similar to the previously discussed configuration, the assembly may also include a support member 302 and a support member 304. Support member 302 may include an insulating material 308 attached to the side facing flap 214. In this aspect, when a voltage is applied as previously discussed, flap 214 will rotate toward support member 302 in the direction of the arrow. The wing 214 rotates until it contacts the support member 302 and latches onto the support member 302, as previously discussed.

[0045] Referring now more specifically to wing 214, the addition of a third material layer 714A comprising piezoelectric material and a fourth material layer 714B comprising electrodes provides a combined actuation mechanism that further helps reduce voltage requirements. For example, a combination of capacitive / piezoelectric or capacitive / thermal dual piezoelectric wafer actuation mechanisms can be used to actuate wing 214 to reduce voltage requirements. Typically, the piezoelectric layer of the third material layer 714A can provide a significant bending force that can be used to induce initial movement of wing 214 at a reduced voltage. For example, in a configuration without a piezoelectric layer, a relatively significant voltage is required to move wing 214 from a rotation angle of 0–30 degrees. Adding the third material layer 714A, which includes a piezoelectric layer, allows for an initial application of a relatively small voltage, which causes wing 214 to bend slightly due to the deflection of the piezoelectric material. This slight bending provides initial rotational initiation to wing 214 at a lower voltage compared to the previously discussed configuration. After this initial rotational initiation at a reduced voltage, the voltage can be increased to fully rotate wing 214 to the latched position. However, compared to valves without a piezoelectric layer, the total voltage required to open / close the vane 214 is considered to be reduced.

[0046] FIGS. 8A-8B Showing from FIG. 2 A cross-sectional side view of another side of the valve assembly. Specifically, FIGS. 8A-8Brepresentative aspects of the valve 114 from FIG. 2 FIG. 1. FIGS. 8A-8B The valve 114 shown is substantially similar to the valve described with reference to FIGS. 3A-3B FIG. 1, in that it includes a flap 214 connected to a support member 302, as well as a second support member 304, by a hinge 306. The support member 302 can include an insulating layer 308A (e.g., an aluminum oxide layer), as previously discussed. Similar to the flap previously discussed, the flap 214 can include a first material layer 214A (e.g., a metallic material layer) and a second material layer 214B (e.g., a structural material layer). As previously described, upon application of a voltage, the flap 214 transitions from a closed (horizontal) configuration shown in FIG. 8A FIG. 1 to an open (vertical) configuration shown in FIG. 8B FIG. 2.

[0047] However, in this configuration, the valve 114 also includes an opposing flap 814 that will counteract the net air pressure generated by the valve during a transition to silence that can occur due to the opening / closing of the flap 214. Representatively, when the flap 214 opens, it can push some air towards the chamber 802 to which it is connected, which can be heard by a user. To avoid this, a second flap 814 can be provided in a reverse and / or counteracting arrangement to open to counteract this air flow from the flap 214. In this aspect, the flap 814 can be connected to a bottom end 816 of the support member 304 by a hinge 806. The flap 814 can be similar to the flap 214 previously discussed in that it includes a first material layer 814A (e.g., a metallic material layer) and a second material layer 814B (e.g., a structural material layer). Additionally, similar to the support member 302 to which the flap 214 is connected, the support member 304 to which the flap 814 is connected can include an insulating layer 308B. The hinge 806 connecting the flap 814 to the support member 304 can be similar to the hinge 306 in that it includes a biasing mechanism or spring 808 for biasing the flap 814 to a closed position. However, in this configuration, the hinge 806 operates in reverse to the hinge 306 and allows the flap 814 to open / close in an opposite direction to the flap 214. Representatively, upon application of a voltage, the hinge 806 allows the flap 814 to open in the direction of arrow 810 (towards the support member 304), which is opposite to the direction of the flap 214 shown by arrow 812 (towards the support member 302). In use, the flap 814 can be used to silence the valve 114 during a transition to FIG. 8BOne representative process in which the net air pressure created by the flap 214 is counteracted during the open configuration of the valve 214, when the flap 214 is open, the flap 814 is also open. The flow created by the opening of both flaps 214, 814 will form a destructive wave. This in turn will reduce the transition sound pressure level (SPL) to a level that is inaudible to the user. One exemplary manufacturing process for forming this dual valve configuration would be to form two MEMS wafers with flaps / hinges at one end, and then bond them together at the opposite end.

[0048] As previously discussed, reference is made herein to FIGS. 1-8B Any one or more of the disclosed valve assemblies can be dynamically controlled by the application of a voltage to control the amount of leakage between the chambers or volumes to which they are connected. For example, any one or more of the valve assemblies can be dynamically opened to connect either the front volume chamber or the back volume chamber of the transducer to the ambient environment surrounding the chamber and / or device housing in which the transducer is implemented. In other aspects, any one or more of the valve assemblies can be dynamically opened to connect the front volume chamber to the back volume chamber of the transducer. It should also be appreciated that while the valve assemblies are described as opening / closing various chambers associated with the transducer, they can be used to open / close or otherwise connect any chamber in which it is desirable to dynamically control the leakage between chambers or different volumes.

[0049] FIG. 9 A block diagram illustrating one aspect of an electronic device within which the previously discussed transducers and / or valve assemblies can be implemented is shown. As FIG. 9 As shown, the device 900 can be any type of portable device in which it can be desirable to implement the transducers and / or valve assemblies disclosed herein, such as an earpiece (e.g., an in-ear earpiece, a hearing aid, etc.), a mobile telephone, a personal digital assistant, a portable timer, or other portable device. The device 900 can include a storage 902. The storage 902 can include one or more different types of storage, such as a hard drive storage, a non-volatile memory (e.g., a flash memory or other electrically programmable read only memory), a volatile memory (e.g., a battery-based static or dynamic random access memory), etc.

[0050] The processing circuit 904 can be used to control the operation of the device 900. The processing circuit 904 can be based on a processor, such as a microprocessor and other suitable integrated circuits. With a suitable arrangement, the processing circuit 904 and the storage device 902 are used to run software on the device 900, such as an Internet browsing application, an Internet voice over protocol (VOIP) telephone call application, an email application, a media playback application, operating system functions, and the like. The processing circuit 904 and the storage device 902 can be used to implement suitable communication protocols. Communication protocols that can be implemented using the processing circuit 904 and the storage device 902 include Internet protocols, wireless local area network protocols (e.g., IEEE 802.11 protocols - sometimes referred to as Wi-Fi ® ), protocols for other short range wireless communication links such as Bluetooth ® protocols, protocols for handling 3G or 4G communication services (e.g., using wideband code division multiple access techniques), 2G cellular telephone communication protocols, and the like.

[0051] To minimize power consumption, the processing circuit 904 can include power management circuitry to implement power management functionality. For example, the processing circuit 904 can be used to adjust gain settings of amplifiers (e.g., radio frequency power amplifier circuitry) on the device 900. The processing circuit 904 can also be used to adjust power supply voltages provided to portions of circuitry on the device 900. For example, higher direct current (DC) power supply voltages can be provided to active circuitry, and lower DC power supply voltages can be provided to circuitry that is less active or in an inactive state. If desired, the processing circuit 904 can be used to implement a control scheme in which power amplifier circuitry is adjusted to accommodate transmission power level requests received from a wireless network.

[0052] The input output devices 906 can be used to allow supply of data to and provision of data from the device 900 to external devices. A display screen, a microphone acoustic port, a speaker acoustic port, and a docking port are examples of input output devices 906. For example, the input output devices 906 can include user input output devices 608 such as buttons, touch screens, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, microphones, cameras, and the like. A user can provide commands to control the operation of the device 900 through the user input devices 908. The display and audio devices 910 can include a liquid crystal display (LCD) screen or other screen, light emitting diodes (LEDs), and other components to present visual information and status data. The display and audio devices 910 can also include audio equipment such as speakers and other devices for creating sound. The display and audio devices 910 can include audio video interface equipment such as jacks and other connectors for external headphones and monitors.

[0053] The wireless communication device 912 can include communication circuitry, such as radio frequency (RF) transceiver circuitry, power amplifier circuitry, passive RF components, antennas, and other circuitry for handling RF wireless signals formed from one or more integrated circuits. Wireless signals can also be sent using light (e.g., using infrared communication). Typically, in the case of a speaker acoustic port, a speaker can be associated with the port and in communication with the RF antenna for transmitting signals from a far-end user to the speaker.

[0054] Returning to FIG. 9, FIG. 9 The device 900 can communicate with external devices such as accessories 914, computing equipment 916, and wireless networks 918, as shown by paths 920 and 922. Path 920 can include wired and wireless paths. Path 922 can be a wireless path. The accessories 914 can include headphones (e.g., wireless cellular headsets or audio headphones) and audio video equipment (e.g., wireless speakers, game controllers, or other equipment that receives and plays audio and video content), peripherals such as wireless printers or cameras, and the like.

[0055] The computing equipment 916 can be any suitable computer. With one suitable arrangement, the computing equipment 916 is a computer with an associated wireless access point (router) or internal or external wireless network card that establishes a wireless connection with the device 900. The computer can be a server (e.g., an Internet server), a local area network computer with or without Internet access, a user's own personal computer, a peer device (e.g., another portable electronic device), or any other suitable computing equipment.

[0056] The wireless networks 918 can include any suitable network equipment, such as cellular telephone base stations, cellular towers, wireless data networks, computers associated with the wireless networks, and the like. For example, the wireless networks 918 can include network management equipment that monitors the wireless signal strength of wireless handheld devices (cellular telephones, handheld computing devices, etc.) that are in communication with the networks 918.

[0057] While certain aspects have been described and shown in the drawings, it is to be understood that these aspects are merely illustrative of and not restrictive to the broad disclosure, and that this disclosure is not limited to the specific constructions and arrangements shown and described Since the description is exemplary only, it is not intended as a limitation on the scope of the disclosure. For example, while a loudspeaker is specifically disclosed herein, the valve disclosed herein can be used with other types of transducers (e.g., microphones). Moreover, in some aspects, the valve can be used to open / close an opening to an acoustic resonator or attenuator coupled to a transducer. Furthermore, while portable electronic devices such as mobile communication devices are described herein, any of the previously described valve and transducer configurations can be implemented within a tablet, personal computer, laptop, notebook, earpiece, etc. Moreover, to the extent that the appended claims recite "a," "an," "the" or "said" one or more of elements, this specification contemplates that one or more such elements are present except where expressly stated otherwise. That is, these determiners are used in the disclosure in the sense only of the presence of one or more of the referenced elements unless stated otherwise. Furthermore, to the extent that the phrase "consisting of" is used in the claims, it is intended to mean "consisting of, but not limited to," such that other elements are optional for the claimed compositions or processes. Also, to the extent that the phrase "consisting essentially of" is used in the claims, it is intended to mean "consisting essentially of, but not limited to," such that other elements are optional for the claimed compositions or processes provided that those other elements do not materially alter the basic and novel characteristics of the claimed compositions or processes. Also, to the extent that the phrase "comprising a" is used in the claims, it is intended to mean "comprising a, or more," such that one or more elements are optional for the claimed compositions or processes.

Claims

1. A portable electronic device, comprising: A housing having a housing wall that forms an internal cavity and a sound output port to the surrounding environment; A transducer is positioned within the internal cavity and divides the internal cavity into a front volume chamber and a rear volume chamber. The front volume chamber connects a first side of the transducer to the sound output port, and the rear volume chamber connects a second side of the transducer. and An electromechanical valve comprising a plurality of blades for opening and closing through-holes leading to the internal chamber, the front volume chamber, or the rear volume chamber, wherein at least one of the plurality of blades comprises a first material layer, a second material layer, and a third material layer.

2. The portable electronic device of claim 1, wherein the plurality of fins are operable to open or close the through-holes to the surrounding environment when the voltage is applied.

3. The portable electronic device of claim 1, wherein the through-hole includes a first opening and a second opening, and the plurality of flaps includes a first flap operable to open and close the first opening and a second flap operable to open and close the second opening.

4. The portable electronic device of claim 1, wherein the first material layer, the second material layer and the third material layer comprise different materials.

5. The portable electronic device according to claim 1, wherein the first material layer is an electrode layer and the second material layer is a structural material layer.

6. The portable electronic device according to claim 1, wherein the third material layer is a piezoelectric layer.

7. The portable electronic device of claim 1, further comprising a fourth material layer, the fourth material layer comprising the same material as the first material layer.

8. The portable electronic device of claim 1, wherein the first material layer comprises a metallic material, the second material layer comprises a structural material, the third material layer comprises a piezoelectric material, and the fourth material layer comprises a metallic material.

9. The portable electronic device of claim 8, wherein the at least one wing is coupled to a support member having a first portion arranged perpendicular to the wing, and when a voltage is applied, the wing changes from a closed position to an open position, wherein in the open position the wing is coupled to the first portion by electrostatic force.

10. The portable electronic device of claim 9, wherein the support member further comprises a second portion extending perpendicularly to the first portion and positioned above the wing, and the wing is coupled to the second portion to close the through-hole when a voltage is applied.

11. The portable electronic device of claim 1, wherein the valve is a first valve, and the device further comprises a second valve having a vane operable to open in a direction opposite to at least one of the plurality of vanes of the first valve when switched to an open position to counteract the net air pressure generated by the first valve.

12. The portable electronic device of claim 1, wherein the through-hole comprises a first polygonal shape, and the at least one wing comprises a second polygonal shape different from the through-hole.

13. A valve assembly for a portable electronic device, the valve assembly comprising: A support member, the support member being connected to a housing opening, the support member having an insulating layer; and An electromechanical flap movably coupled to the support member, the electromechanical flap comprising a first material layer, a second material layer, a third material layer, and a fourth material layer, wherein, when a voltage is applied, the electromechanical flap is operable to switch between a closed configuration and an open configuration, in which the electromechanical flap covers the housing opening, and in which the electromechanical flap unveils the housing opening.

14. The valve assembly of claim 13, wherein the first material layer is an electrode layer and the second material layer is a structural layer comprising polycrystalline silicon, silicon nitride, or monocrystalline silicon.

15. The valve assembly of claim 13, wherein the third material layer comprises a piezoelectric material.

16. The valve assembly of claim 13, wherein the fourth material layer is an electrode layer.

17. The valve assembly of claim 13, wherein the insulating layer is coupled to a tapered surface of the support member extending perpendicular to the housing opening, and the flap rotates about a hinge toward the insulating layer to the open configuration.

18. The valve assembly of claim 13, wherein the insulating layer is coupled to the surface of the support member extending parallel to the housing opening and positioned above the vane, and wherein the vane rotates about a hinge toward the insulating layer to the closed configuration.

19. The valve assembly of claim 13, wherein the electromechanical vane comprises a first electromechanical vane and a second electromechanical vane.

20. The valve assembly of claim 19, wherein the support member includes a first end and a second end opposite to the first end, the first electromechanical flap is coupled to the first end, the second electromechanical flap is coupled to the second end, and wherein the second electromechanical flap opens in the opposite direction to the first electromechanical flap when switched to an open position to counteract the net air pressure generated by the first electromechanical flap.