Semiconductor electronic component packaging equipment and packaging process thereof

Abstract

The invention relates to semiconductor electronic component packaging equipment and a packaging process thereof, and relates to the technical field of semiconductor electronic component packaging. The device comprises a support frame, a dispensing assembly and a cooling assembly which are used for dispensing and cooling a circuit board, a video sensor for detecting a dispensing position on the circuit board, and a clamping piece for clamping the circuit board, the dispensing assembly comprises four glue storage tanks and wedge-shaped cams which are rotationally arranged on the supporting frame, dispensing pipes communicating with the four glue storage tanks correspondingly, movable blocks movably arranged in the four dispensing pipes correspondingly, and adjusting pieces used for conducting translation adjustment on the four dispensing pipes. The glue type can be automatically switched according to different components installed at the corresponding positions of the circuit board, the glue amount when the corresponding glue is dispensed can be automatically adjusted, glue dispensing can be conducted on the circuit board at a time, and meanwhile the glue curing speed can be controlled according to the glue dispensing amount of the corresponding positions on the circuit board and the different glue types.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor electronic component packaging, and in particular to a semiconductor electronic component packaging equipment and packaging process. Background Technology

[0002] As the core of electronic products, semiconductor electronic components are directly determined by their packaging technology and assembly quality, which in turn determine the performance, lifespan, and reliability of the final product. During the production and processing of semiconductor electronic components, various electronic components need to be installed in specific positions on the circuit board. A typical electronic module usually requires the assembly of electronic components such as chips, discrete devices, electronic circuits, and optoelectronic devices on the circuit board to ensure the functionality of the semiconductor electronic components.

[0003] Before semiconductor electronic components such as chips, discrete devices, electronic circuits, and optoelectronic devices are mounted on a circuit board, they need to be glued to the circuit board using packaging equipment to ensure the stability of the subsequent installation of chips, discrete devices, electronic circuits, and optoelectronic devices on the circuit board.

[0004] Regarding the aforementioned technologies, the inventors believe that the following defects exist: To ensure the stability of the combination of chips, discrete devices, electronic circuits, and optoelectronic devices on the circuit board, it is necessary to control the amount of adhesive and switch between different types of adhesives when installing different components at different locations on the circuit board. However, currently, the switching of adhesives and the adjustment of adhesive amount in packaging equipment mainly rely on manual operation. Workers need to switch the corresponding adhesive and the corresponding amount of adhesive according to the different components installed at different locations on the circuit board. This not only affects the efficiency of semiconductor electronic component packaging but also increases the labor intensity of workers. Furthermore, the error tolerance is high. If the worker adjusts the wrong type and amount of adhesive, it will not only cause insufficient bonding strength of the components, leading to displacement, but also affect the stability of the components and fail to guarantee the packaging effect of semiconductor electronic components. Therefore, improvements are made to address this issue. Summary of the Invention

[0005] To address the aforementioned problems, this application provides a semiconductor electronic component packaging device and its packaging process.

[0006] This application provides a semiconductor electronic component packaging equipment and packaging process, which adopts the following technical solution: A semiconductor electronic component packaging device includes a support frame, a dispensing assembly and a cooling assembly for dispensing and cooling a circuit board, a video sensor for detecting the dispensing position on the circuit board, and a clamping member for holding the circuit board. The dispensing assembly includes four glue tanks rotatably mounted on a support frame and a wedge-shaped cam, dispensing tubes respectively connected to the four glue tanks, movable blocks respectively movably mounted in the four dispensing tubes, an adjusting component for translating the four dispensing tubes, a switching component for switching the four dispensing tubes, a translating component for driving the movable blocks to translate, and a lifting component for driving the wedge-shaped cam to lift. The lifting component is automatically driven by the switching component. The four glue tanks are epoxy glue tank, polyurethane glue tank, silicone rubber tank, and UV-curable glue tank, respectively. The cooling assembly includes multiple air outlet pipes mounted on a support frame, a blower for storing cold air in the air outlet pipes, a control device for adjusting the amount of cold air in each air outlet pipe, and an air outlet device for opening the multiple air outlet pipes one by one.

[0007] By adopting the above technical solution, when packaging semiconductor electronic components, chips, discrete devices, electronic circuits and optoelectronic devices need to be installed on the circuit board. During installation, glue needs to be applied to the circuit board to facilitate the positioning of chips, discrete devices and electronic circuits during packaging. In the prior art, chips, discrete devices, electronic circuits and optoelectronic devices are usually assembled manually one by one. The installation positions of chips, discrete devices, electronic circuits and optoelectronic devices on the circuit board are also manually applied one by one. This packaging process affects the packaging efficiency of semiconductor electronic components. Currently, when packaging equipment applies adhesive to circuit boards in a single application, it's difficult to control the curing speed based on the amount of adhesive applied to specific locations on the board and the type of adhesive. If the adhesive cures too quickly, subsequent component mounting may fail to properly attach to the board. This is because component mounting requires a brief window for precise positioning. If the adhesive cures too quickly, this window disappears instantly, and the component is fixed in place. Any slight misalignment at this point cannot be corrected, leading to misalignment or tilted mounting. This can lead to poor electrical connections, excessively fast curing, and the glue hardening before the components are pressed. This prevents the glue from filling gaps due to its own fluidity, resulting in one end of the component being suspended or loosely connected. This affects heat dissipation and connection strength. If the glue cures too slowly when applying it to the circuit board, it will reduce the efficiency of component assembly, significantly reducing production capacity and cycle time. Moreover, during handling, transmission, or subsequent component insertion, the uncured glue does not have enough initial tack to fix the components. Even slight vibration or force can cause the components to shift or fall off, thus affecting the packaging effect of semiconductor electronic components. The circuit board can be inspected using video sensors to detect which components are installed at each location. Clamping components hold and secure the circuit board, while the dispensing assembly applies adhesive to every part of the board in a single application. It can switch between different types of adhesive and adjust the amount of adhesive applied to each location based on the components being installed, ensuring optimal dispensing results. The cooling assembly cools the circuit board during dispensing, controlling the adhesive's curing speed. It also controls the airflow from each exhaust duct based on the type and amount of adhesive applied at each location, ensuring a successful single-application dispensing.

[0008] Optionally, the adjusting component includes a movable frame movably mounted on a support frame, two first racks fixed on the support frame, two first motors fixed on the movable frame, first gears respectively fixed on the output shafts of the two first motors, a second rack fixed on the movable frame, a second motor fixed on the movable frame, and a second gear fixed on the output shaft of the second motor. The two first racks mesh with the two first gears respectively, and the second rack meshes with the second gear.

[0009] By adopting the above technical solution, the positions of the video sensor and four dispensing tubes can be adjusted using the adjusting mechanism to detect and dispense adhesive at each point on the circuit board. The two first motors can drive the two first gears to rotate, and the meshing of the two first racks can sequentially drive the moving frame, the two first motors, the two first gears, the movable frame, the second motor, the second gear, the second rack, the four dispensing tubes, and the video sensor to move back and forth. The second motor can drive the second gear to rotate, and the meshing of the second rack can sequentially drive the movable frame, the second motor, the second gear, the four dispensing tubes, and the video sensor to move left and right. By moving the video sensor and the four dispensing tubes back and forth and left and right above the circuit board, detection and dispensing can be performed at each point on the circuit board.

[0010] Optionally, the switching component includes a transmission gear and a power gear rotatably mounted on a movable frame, and an electric motor fixed on the movable frame. The power gear is fixedly connected to the output end of the electric motor, the transmission gear meshes with the power gear, and all four rubber storage tanks are fixedly connected to the transmission gear.

[0011] By adopting the above technical solution, the positions of the four glue storage tanks and four dispensing tubes can be switched using a switching component. This allows for the selection of different dispensing tubes for dispensing based on the different components to be installed on the circuit board. The motor sequentially drives the power gear, transmission gear, four glue storage tanks, four dispensing tubes, four annular springs, four movable blocks, four movable rods, and four double-sided wedges to rotate. This allows for the switching and adjustment of the positions of the four movable rods, four double-sided wedges, four glue storage tanks, and four dispensing tubes, enabling the four movable rods to sequentially engage with the wedge-shaped cams, ensuring that the designated movable rod engages with the wedge-shaped cams.

[0012] Optionally, the translation component includes annular springs fixed to four dispensing tubes, movable rods fixed to four movable blocks, a fixed square rod fixed to a wedge cam, a drive rod rotatably mounted on a movable frame, and a servo motor fixed to the movable frame. The drive rod is fixedly connected to the output end of the servo motor. All four movable rods are in movable contact with the wedge cam. The four annular springs are fixedly connected to the four movable rods. A glue passage gap is provided between the movable block and the dispensing tube.

[0013] By adopting the above technical solution, the dispensing tube at a specified position can be opened and dispensing glue through the translation component. The servo motor can sequentially drive the drive rod, the fixed square rod, and the double-sided wedge to rotate. When the double-sided wedge rotates, it will frequently drive the currently attached movable rod to move. When the movable rod moves, it will compress the ring spring, which will then drive the movable block to translate inside the dispensing tube. The frequent opening and closing of the dispensing tube can be controlled, so that the glue in the glue tank can drip onto the circuit board through the dispensing tube, thus achieving the purpose of dispensing glue onto the circuit board.

[0014] Optionally, the lifting component includes four double-sided wedges fixed to the transmission gear, and a telescopic spring and a fixing ring fixed to the wedge-shaped cam. The telescopic spring is fixedly connected to the drive rod, and a fixing square groove is provided inside the drive rod. The fixing square rod is slidably connected to the fixing square groove. The four double-sided wedges are all movably fitted with the fixing ring. The four double-sided wedges are respectively located below the four glue storage tanks, and the heights of the four double-sided wedges are different.

[0015] By adopting the above technical solution, the amount of glue in the corresponding dispensing tube can be controlled by the lifting component, so as to control the amount of glue in the dispensing tube according to the different components to be installed on the circuit board. When the switching component drives the four double-sided wedges to rotate, they will successively fit into the fixed ring. When the double-sided wedges fit into the fixed ring, the inclined surface feature of the double-sided wedges will squeeze the fixed ring and the wedge cam. With the elasticity of the telescopic spring, the fixed square rod, the fixed ring and the wedge cam can be moved up and down in sequence, thereby adjusting the height of the wedge cam so that the movable rod fits into different positions of the wedge cam. The inclined surface feature of the wedge cam controls the translation component to control the opening size of the dispensing tube.

[0016] Optionally, the blower includes a shaped tube fixed on a support frame and a cooler. Multiple air outlet tubes are connected to the shaped tube, and the shaped tube is connected to the air outlet of the cooler. The air outlets of the multiple air outlet tubes are located below the circuit board, and the multiple air outlet tubes are evenly distributed on the shaped tube.

[0017] By adopting the above technical solution, the circuit board can be cooled by the blower to control the curing speed of the adhesive. The air cooler can put cold air into multiple air outlets through the special-shaped tube. The multiple air outlets will blow air onto the circuit board, which can cool the circuit board and prevent the adhesive from curing on the circuit board due to the adhesive being on the circuit board for too long when applying adhesive in one go.

[0018] Optionally, the air outlet component includes a lifting frame movably mounted on a support frame, a first screw rotatably mounted on the lifting frame, a third motor fixed on the lifting frame, a connecting frame movably mounted on the lifting frame, a threaded block movably mounted on the connecting frame, a second screw rotatably mounted on the connecting frame, and a fourth motor fixed on the connecting frame. The first screw is fixedly connected to the output shaft of the third motor, the first screw is threadedly connected to the connecting frame, the second screw is fixedly connected to the output shaft of the fourth motor, and the second screw is threadedly connected to the threaded block.

[0019] By adopting the above technical solution, the opening of each air outlet pipe under the circuit board can be controlled by the air outlet component to facilitate cooling of each part of the circuit board. The third motor can drive the first screw to rotate, which in turn drives the connecting frame, the second screw, the fourth motor, the threaded block and the fixed rack to move back and forth in sequence. The fourth motor can drive the second screw to rotate, which in turn drives the threaded block and the fixed rack to move left and right in sequence. The back-and-forth and left-and-right movement of the fixed rack can open each air outlet pipe, so that multiple air outlet pipes can cool each part of the circuit board respectively.

[0020] Optionally, the air control component includes a fixed rack fixed to the threaded block, four electric telescopic rods fixed to the support frame, control valves respectively fixed to multiple air outlet pipes, and movable gears respectively fixed to multiple control valves. The multiple movable gears are all movably meshed with the fixed rack, and the output ends of the four electric telescopic rods are all fixedly connected to the lifting frame.

[0021] By adopting the above technical solution, the opening size of each air outlet duct can be controlled by the air control component. This allows for the control of the cold air volume of the air outlet duct at the specified location for cooling, based on the type and amount of adhesive applied to the designated location on the circuit board. Four electric telescopic rods can sequentially drive the lifting frame, the first screw, the third motor, the connecting frame, the second screw, the fourth motor, the threaded block, and the fixed rack to move up and down. This allows for the adjustment of the height of the fixed rack. In conjunction with the air outlet component, the opening size of the control valve can be controlled by controlling the range of meshing transmission between the fixed rack and each movable gear through the up-down, left-right, and forward-backward movement of the fixed rack. This, in turn, controls the amount of cold air flowing from each air outlet duct.

[0022] Optionally, the video sensor is fixedly connected to the movable frame, and the four dispensing tubes are epoxy tube, polyurethane tube, silicone rubber tube, and UV-curable tube, respectively. The dispensing end of the epoxy tube is conical, the dispensing end of the polyurethane tube is obliquely cut, the dispensing end of the silicone rubber tube is flat fan-shaped, and the dispensing end of the UV-curable tube is needle-shaped. The lengths of the four dispensing tubes are different.

[0023] By adopting the above technical solutions, the distance between the epoxy adhesive tube head and the circuit board can prevent the epoxy adhesive from deforming or breaking during dispensing. The conical shape of the epoxy adhesive tube head ensures stable extrusion of the epoxy adhesive. The distance between the polyurethane adhesive tube head and the circuit board ensures stable diffusion of the polyurethane adhesive during dispensing. The beveled cut of the polyurethane adhesive tube head ensures effective diffusion of the polyurethane adhesive. The distance between the silicone rubber tube head and the circuit board ensures uniform spreading of the silicone rubber during dispensing. The flat fan shape of the silicone rubber tube head increases the coverage area of ​​the silicone rubber. The distance between the UV-curable adhesive tube head and the circuit board ensures the positioning of the UV-curable adhesive during dispensing. The needle-shaped UV-curable adhesive tube head minimizes the diffusion of the UV-curable adhesive.

[0024] A semiconductor electronic component packaging process includes the following steps: S1. Place the circuit board on the support frame. The clamping component can hold and fix the circuit board. The adjusting component can move the video sensor and the dispensing tube horizontally, so that detection and dispensing can be performed at each position above the circuit board. S2. The switching component can switch and adjust the position of the four dispensing tubes. The motor drives the four dispensing tubes, four movable rods and four double-sided wedges to rotate and switch in sequence, so that the four movable rods fit into the wedge cam in sequence and the four double-sided wedges fit into the fixing ring in sequence. When fitting, under the action of the elastic force of the telescopic spring, the fixed square rod and the others move up and down to adjust the height of the wedge cam, so that the movable rod fits into the wedge cam at different positions, thereby controlling the dispensing type and dispensing amount of different dispensing tubes. S3. The servo motor drives the double-sided wedge to rotate, frequently moving the movable rod to compress the ring spring, which in turn moves the movable block inside the dispensing tube, controlling the dispensing tube to open and close frequently, so that the glue drips onto the circuit board to complete the dispensing in one go. S4. The air blower cools the circuit board. The air control component works with the air outlet component to regulate the amount of cold air in each air outlet. The video sensor detects the position of the circuit board. When the dispensing tube dispenses glue at the designated position, the corresponding air outlet is opened to cool the dispensing point and control the glue curing speed. S5. When a component is detected to be installed at a designated location on the circuit board, epoxy tubing is used for chip installation with a moderate to slightly less amount of adhesive, resulting in the largest amount of cold air from the exhaust duct. Polyurethane tubing is used for discrete components with a moderate to slightly more amount of adhesive, resulting in a relatively large amount of cold air from the exhaust duct. Silicone rubber tubing is used for electronic circuits with the largest amount of adhesive, resulting in a relatively small amount of cold air from the exhaust duct. Photocurable tubing is used for optoelectronic devices with the smallest amount of adhesive, resulting in the smallest amount of cold air from the exhaust duct.

[0025] By adopting the above technical solution, the type of adhesive can be automatically switched and the amount of adhesive applied can be automatically adjusted according to the different components installed at the corresponding positions on the circuit board. The circuit board can be applied in one go, and the curing speed of the adhesive can be controlled according to the amount of adhesive applied at the corresponding positions on the circuit board and the different types of adhesive. This allows for one-time assembly when chips, discrete devices, electronic circuits and optoelectronic devices are installed on the circuit board in subsequent steps.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. Place the circuit board to be glued on the support frame. The clamping device can hold and fix the circuit board, preventing it from shaking or shifting during glue dispensing and component installation. The adjusting device, together with the video sensor, can accurately detect each position on the circuit board, and can detect what type of component should be installed at different positions on the circuit board. The switching device can switch and adjust the position of the four dispensing tubes. The switching device, together with the lifting and translation devices, can make the glue drip onto the circuit board, achieving the purpose of dispensing the circuit board. It can automatically switch the corresponding glue type and automatically adjust the corresponding glue amount according to the different components installed at the corresponding positions on the circuit board. By adjusting the device to drive the video sensor and the translation of the four dispensing tubes above the circuit board, and by switching the position of the four dispensing tubes, the entire dispensing on the circuit board can be completed in one go, thereby improving the efficiency of circuit board dispensing and the efficiency of semiconductor electronic component packaging. 2. The blower can cool the circuit board, allowing control over the curing speed of the adhesive during dispensing. This prevents the adhesive from curing due to excessive time on the circuit board during a single dispensing operation, ensuring effective dispensing. The air control unit, in conjunction with the air outlet unit, can control the amount of cold air from each air outlet. By detecting each position on the circuit board using a video sensor, the corresponding air outlet can be opened while the dispensing tube is dispensing adhesive to a designated location on the circuit board. This cools the dispensing area and controls the curing speed of the adhesive, ensuring effective dispensing in a single operation. 3. When it is detected that a chip needs to be installed at the current location of the circuit board, epoxy adhesive can be applied to the circuit board. The amount of epoxy adhesive applied should be controlled to be moderately small, and the airflow from the exhaust duct below the current adhesive application location can be adjusted to maximum to cool the epoxy adhesive. When it is detected that discrete components need to be installed at the current location of the circuit board, polyurethane adhesive can be applied to the circuit board. The amount of polyurethane adhesive applied should be controlled to be moderately large, and the airflow from the exhaust duct below the current adhesive application location can be adjusted to a larger amount to cool the polyurethane adhesive. When it is detected that electronic circuitry needs to be installed at the current location of the circuit board, silicone rubber tubing can be used to apply the circuitry... The board dispensing system maximizes the amount of silicone rubber dispensed and controls the airflow from the exhaust duct below the dispensing location to cool the silicone rubber. When it detects that optoelectronic devices need to be installed at the current location on the board, it dispenses UV-curing adhesive, minimizing the amount of UV-curing adhesive dispensed and controlling the airflow from the exhaust duct below the dispensing location to cool the UV-curing adhesive. This controls the curing time of epoxy, polyurethane, and silicone rubber on the board, ensuring the effective installation and fixation of chips, discrete components, electronic circuits, and optoelectronic devices on subsequent boards. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application; Figure 2 This is an external view of the movable clamp connection structure in the embodiments of this application; Figure 3 This is an external view of the electric telescopic pole connection structure in the embodiments of this application; Figure 4 This is an external view of the irregular tube connection structure in the embodiments of this application; Figure 5 This is an external view of the mobile frame connection structure in the embodiments of this application; Figure 6 This is an external view of the movable frame connection structure in the embodiments of this application; Figure 7 This is an external view of the wedge-shaped cam connection structure in the embodiments of this application; Figure 8 This is a cross-sectional view of the movable frame connection structure in an embodiment of this application.

[0028] Reference numerals: 1. Support frame; 2. Circuit board; 3. Movable frame; 4. Adjustable frame; 5. Glue storage tank; 6. Dispensing tube; 7. Movable block; 8. Movable rod; 9. Circular spring; 10. Video sensor; 11. Power gear; 12. Transmission gear; 13. Servo motor; 14. Drive rod; 15. Fixed square rod; 16. Telescopic spring; 17. Wedge cam; 18. Electric motor; 19. Air outlet duct; 20. Irregularly shaped tube; 21. Control valve; 22. Movable gear ; 23. Fixed rack; 24. Lifting frame; 25. Connecting frame; 26. Third motor; 27. First screw; 28. Fourth motor; 29. ​​Second screw; 30. Threaded block; 31. Electric telescopic rod; 32. Fixed ring; 33. First motor; 34. First gear; 35. First rack; 36. Second motor; 37. Second gear; 38. Second rack; 39. Electric push rod; 40. Movable clamp; 41. Double-sided wedge; 42. Intelligent controller. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0030] This application discloses a semiconductor electronic component packaging device, referring to... Figure 1 and Figure 2The system includes a support frame 1, a dispensing assembly and a cooling assembly for dispensing and cooling the circuit board 2, a video sensor 10 for detecting the dispensing position on the circuit board 2, and a clamping component for holding the circuit board 2. The dispensing assembly includes four glue tanks 5 rotatably mounted on the support frame 1 and a wedge-shaped cam 17, dispensing tubes 6 respectively connected to the four glue tanks 5, movable blocks 7 respectively movably mounted in the four dispensing tubes 6, an adjusting component for translating the four dispensing tubes 6, and a component for switching the four dispensing tubes 6. The system includes an adjustment switching component, a translation component for driving the movable block 7 to move horizontally, and a lifting component for driving the wedge cam 17 to rise and fall. The lifting component is automatically driven by the switching component. The four adhesive storage tanks 5 are epoxy adhesive tank, polyurethane adhesive tank, silicone rubber tank, and UV-curable adhesive tank, respectively. The cooling assembly includes multiple air outlet pipes 19 mounted on the support frame 1, a blower for storing cold air in the air outlet pipes 19, a control component for adjusting the amount of cold air in each air outlet pipe 19, and an air outlet component for opening the multiple air outlet pipes 19 one by one.

[0031] The adjusting components include a movable frame 3 movably mounted on the support frame 1, a movable frame 4 movably mounted on the movable frame 3, two first racks 35 fixed on the support frame 1, two first motors 33 fixed on the movable frame 3, first gears 34 respectively fixed on the output shafts of the two first motors 33, a second rack 38 fixed on the movable frame 3, a second motor 36 fixed on the movable frame 4, and a second gear 37 fixed on the output shaft of the second motor 36. The two first racks 35 mesh with the two first gears 34 respectively, and the second rack 38 meshes with the second gear 37. Two first guide rails are fixedly connected to the support frame 1, and both first guide rails are slidably connected to the movable frame 3. The stability of the translation of the movable frame 3 can be ensured by the two first guide rails. Two second guide rails are fixedly connected to the movable frame 3, and both second guide rails are slidably connected to the movable frame 4. The stability of the translation of the movable frame 4 can be ensured by the two second guide rails.

[0032] The switching component includes a transmission gear 12 and a power gear 11 rotatably mounted on the movable frame 4, and a motor 18 fixed on the movable frame 4. The output end of the power gear 11 is fixedly connected to the motor 18, and the transmission gear 12 meshes with the power gear 11. All four glue storage tanks 5 are fixedly connected to the transmission gear 12. The movable frame 4 is provided with a fixing slot, and the transmission gear 12 is located inside the fixing slot. The fixing slot can support and limit the transmission gear 12 to ensure the stability of the transmission gear 12 driving the four glue storage tanks 5 to rotate. Each of the four glue storage tanks 5 is movably connected with a sealing cap. By opening the four sealing caps, the corresponding glue can be added to the inside of the four glue storage tanks 5 respectively.

[0033] The translation component includes annular springs 9 fixed to four dispensing tubes 6, movable rods 8 fixed to four movable blocks 7, fixed square rods 15 fixed to wedge cams 17, drive rods 14 rotatably mounted on movable frame 4, and servo motors 13 fixed to movable frame 4. The output end of drive rods 14 and servo motors 13 are fixedly connected. All four movable rods 8 are in movable contact with wedge cams 17. All four annular springs 9 are fixedly connected to the four movable rods 8. Each of the four dispensing tubes 6 has a sliding hole with the same diameter as the four movable rods 8. The four movable rods 8 are slidably connected to the four sliding holes. Each of the four dispensing tubes 6 has a storage groove. The four movable blocks 7 are slidably connected to the four storage grooves. There is a glue passage gap between the movable blocks 7 and the dispensing tubes 6. The wedge cam 17 is a frustum-shaped cone with one side being straight and the other side being inclined.

[0034] The lifting component includes four double-sided wedges 41 fixed to the transmission gear 12, and a telescopic spring 16 and a fixing ring 32 fixed to the wedge-shaped cam 17. The telescopic spring 16 is fixedly connected to the drive rod 14. A fixing square groove is provided inside the drive rod 14, and the fixing square rod 15 is slidably connected to the fixing square groove. The four double-sided wedges 41 are all movably fitted with the fixing ring 32. The four double-sided wedges 41 are respectively located below the four glue storage tanks 5, and the heights of the four double-sided wedges 41 are different. A guide groove is provided on the movable frame 4, and the wedge-shaped cam 17 and the... The guide groove is slidably connected. By setting the guide groove, the wedge cam 17 can be guided and limited to ensure the stability of the translation of the wedge cam 17. The heights of the four double-sided wedges 41 are different. The height of the double-sided wedge 41 located below the polyurethane glue can is greater than that of the double-sided wedge 41 located below the silicone rubber can, the height of the double-sided wedge 41 located below the epoxy glue can is greater than that of the double-sided wedge 41 located below the polyurethane glue can, and the height of the double-sided wedge 41 located below the UV-curable glue can is greater than that of the double-sided wedge 41 located below the epoxy glue can.

[0035] The blower includes a shaped tube 20 fixed on the support frame 1 and a cooler (not shown in the figure). Multiple air outlets 19 are connected to the shaped tube 20. The shaped tube 20 is connected to the air outlet of the cooler. The air outlets of the multiple air outlets 19 are located below the circuit board 2. The multiple air outlets 19 are evenly distributed on the shaped tube 20 and are evenly distributed below the circuit board 2.

[0036] The air outlet component includes a lifting frame 24 movably mounted on a support frame 1, a first screw 27 rotatably mounted on the lifting frame 24, a third motor 26 fixed on the lifting frame 24, a connecting frame 25 movably mounted on the lifting frame 24, a threaded block 30 movably mounted on the connecting frame 25, a second screw 29 rotatably mounted on the connecting frame 25, and a fourth motor 28 fixed on the connecting frame 25. The first screw 27 is fixedly connected to the output shaft of the third motor 26, and the first screw 27 is threadedly connected to the connecting frame 25. The second screw 29 is fixedly connected to the output shaft of the fourth motor 28. The second screw 29 is threadedly connected to the threaded block 30. Two limiting guide rails are fixedly connected to the lifting frame 24. Both limiting guide rails are slidably connected to the connecting frame 25. The two limiting guide rails can restrict the circumferential rotation of the connecting frame 25 and ensure the stability of the translation of the connecting frame 25. A limiting rod is fixedly connected to the connecting frame 25. A limiting hole with the same diameter as the limiting rod is opened on the inner side of the threaded block 30. The limiting rod is slidably connected to the limiting hole. The limiting rod and the limiting hole can restrict the circumferential rotation of the threaded block 30 and ensure the stability of the translation of the threaded block 30.

[0037] The air control components include a fixed rack 23 fixed to the threaded block 30, four electric telescopic rods 31 fixed to the support frame 1, control valves 21 respectively fixed to multiple air outlet pipes 19, and movable gears 22 respectively fixed to multiple control valves 21. The multiple movable gears 22 are all movably meshed with the fixed rack 23. The output ends of the four electric telescopic rods 31 are all fixedly connected to the lifting frame 24. The stability of the lifting frame 24 moving up and down can be ensured by the four electric telescopic rods 31. It is not necessary to set a solenoid valve on each air outlet pipe 19 to control the opening size, which can save costs.

[0038] The clamping components include two movable clamping plates 40 movably mounted on the support frame 1 and two electric push rods 39 fixed on the support frame 1. The two movable clamping plates 40 are respectively fixedly connected to the output ends of the two electric push rods 39. Both movable clamping plates 40 are movably attached to the circuit board 2. The circuit board 2 is movably connected to the support frame 1. Guide rods are fixedly connected to both movable clamping plates 40. The guide rods are slidably connected to the support frame 1. The stability of the translation of the movable clamping plates 40 can be ensured by the guide rods.

[0039] The video sensor 10 is fixedly connected to the movable frame 4. The video sensor 10 is located above the circuit board 2. The four dispensing tubes 6 are epoxy tube, polyurethane tube, silicone rubber tube, and UV-curing tube, respectively. The dispensing end of the epoxy tube is conical, the dispensing end of the polyurethane tube is obliquely cut, the dispensing end of the silicone rubber tube is flat and fan-shaped, and the dispensing end of the UV-curing tube is needle-shaped. The lengths of the four dispensing tubes 6 are different. The length of the epoxy tube is greater than that of the UV-curing tube, the length of the polyurethane tube is greater than that of the epoxy tube, and the length of the silicone rubber tube is greater than that of the polyurethane tube.

[0040] A smart controller 42 is fixedly connected to the support frame 1. The video sensor 10, servo motor 13, electric motor 18, third motor 26, fourth motor 28, first motor 33, second motor 36, two electric push rods 39 and four electric telescopic rods 31 are all electrically connected to the smart controller 42. The smart controller 42 can control the timed drive of the video sensor 10, servo motor 13, electric motor 18, third motor 26, fourth motor 28, first motor 33, second motor 36, two electric push rods 39 and four electric telescopic rods 31.

[0041] When the packaging equipment applies adhesive to the positions of chips, discrete devices, electronic circuits, and optoelectronic devices on circuit board 2, epoxy adhesive must be used for the chip positions on circuit board 2. This is because the chip, as a core component, requires high reliability, heat resistance, and mechanical stability. After curing, the epoxy adhesive forms a rigid structure that effectively fixes the chip and prevents solder joints from falling off due to vibration or thermal expansion. The epoxy underfill can fill the tiny gaps between the chip and the substrate, reducing solder joint stress and improving impact resistance. After curing, the epoxy adhesive forms a high-strength rigid structure, and a small amount of adhesive is sufficient to bond the chip to circuit board 2. For a strong bond, excessive dispensing of epoxy adhesive can cause glue overflow, contaminating the area around the chip, affecting electrical performance, and wasting adhesive. Epoxy adhesive releases a large amount of heat during curing; if heat dissipation is insufficient, a thermal gradient will form inside the adhesive layer, leading to stress concentration. Therefore, a sufficiently large airflow is needed to shorten the curing time. Epoxy adhesive has a high viscosity; controlling the tube length can reduce the adhesive's exposure time in the air, preventing the adhesive droplets from deforming or breaking due to gravity. Epoxy adhesive has poor flowability; using a conical dispensing head through a narrow outlet generates high shear force, temporarily reducing the adhesive viscosity and facilitating the stable extrusion of small amounts of adhesive.

[0042] Polyurethane adhesive is required for dispensing discrete components on circuit board 2 because these components need flexible bonding, shear resistance, and environmental resistance. Polyurethane adhesive, with its rubber-like properties, can adapt to the bonding of substrates with different coefficients of thermal expansion, forming a soft-hard transition layer and reducing thermal stress damage. The polyurethane adhesive needs to form a sufficiently thick flexible layer to absorb the thermal expansion differences between the discrete components and circuit board 2. Since discrete components are easily subjected to mechanical vibration or impact, a larger amount of adhesive can enhance shear resistance and prevent components from falling off. The curing speed of polyurethane adhesive is temperature-sensitive, requiring the use of cooling air to regulate the curing environment temperature. The initial viscosity of polyurethane adhesive is low; if the cooling air volume is insufficient, the adhesive viscosity will increase sharply due to excessive temperature, leading to uneven filling. With moderate viscosity, controlling the tube length allows gravity to assist the adhesive in spreading along the pin gaps, ensuring complete filling. A beveled dispensing head is used to utilize the combined effect of gravity and shear force to allow the adhesive to spread laterally along the pin gaps.

[0043] Silicone rubber needs to be used for dispensing the electronic circuits on circuit board 2. This is because the electronic circuits require insulation, waterproofing, and high-temperature resistance. Silicone rubber's strong hydrophobicity forms a waterproof barrier, protecting the circuits from moisture corrosion, effectively isolating them, preventing short circuits, and effectively protecting fragile circuits from thermal and mechanical stress. The silicone rubber needs to form a complete protective layer, covering the circuit surface and solder joints to prevent moisture and dust intrusion that could cause short circuits. A larger amount of adhesive enhances thermal stability, preventing cracking after long-term use. The circuit board surface may have minor unevenness; a larger amount of adhesive can fill the gaps. Silicone rubber has low heat release during curing; excessive cold air will inhibit the curing reaction, resulting in surface hardening while the interior remains uncured. Silicone rubber has a high curing shrinkage rate; gentle cold air is needed to control the shrinkage rate and prevent the formation of pinholes. Silicone rubber has low viscosity; controlling the tube length allows gravity to spread the adhesive evenly, forming a continuous adhesive layer. Using a flat, fan-shaped dispensing head creates a fan-shaped adhesive flow, expanding the coverage area. A single dispensing can cover multiple circuits, improving efficiency.

[0044] The positions of the optoelectronic devices on circuit board 2 require dispensing with photocurable adhesive. This is because optoelectronic devices demand high positional accuracy and have a fast production cycle. They require rapid curing, high precision, and optical transparency. Photocurable adhesive can cure within seconds, significantly improving production efficiency. It also avoids stress concentration caused by over-curing. The adhesive must maintain high light transmittance; excessive adhesive will form an uneven adhesive layer, leading to optical path deviation or increased insertion loss. Micro-dispensing shortens curing time and avoids positioning deviations caused by adhesive flow. Excess adhesive can contaminate the optical interface, causing signal attenuation. Since the curing speed of the adhesive does not require active control and the dispensing amount is extremely small, the thermal mass is very small. The cold airflow to the optoelectronic devices must be kept to a minimum to avoid positioning deviations caused by adhesive flow. The optoelectronic devices require sub-millimeter precision; controlling the tube length can reduce positioning deviations caused by adhesive flow. Using a needle-type dispensing head allows for the extrusion of micro-adhesive, preventing adhesive diffusion from affecting optical performance.

[0045] Therefore, to ensure the stability of the assembly of various components on circuit board 2, epoxy adhesive should be used at the chip mounting positions on circuit board 2, with a small amount of adhesive applied, the curing time of the epoxy adhesive controlled, the cold air volume maximized, the distance between the dispensing head and circuit board 2 high, and the dispensing head set to a conical shape. Polyurethane adhesive should be used at the discrete component mounting positions, with a larger amount of adhesive applied, the curing time of the polyurethane adhesive controlled, the cold air volume maximized, the distance between the dispensing head and circuit board 2 low, and the dispensing head set to a beveled shape. Silicone rubber should be used at the electronic circuit mounting positions, with a maximum amount of adhesive applied, the curing time of the silicone rubber controlled, the cold air volume minimized, the distance between the dispensing head and circuit board 2 maximized, and the dispensing head set to a flat fan shape. Photocurable adhesive should be used at the optoelectronic component mounting positions, with a minimum amount of adhesive applied, the curing time of the photocurable adhesive controlled, the cold air volume minimized, the distance between the dispensing head and circuit board 2 minimumed, and the dispensing head set to a needle-like shape.

[0046] The implementation principle of a semiconductor electronic component packaging device according to an embodiment of this application is as follows: (1) Place the circuit board 2 that needs to be glued on the support frame 1. The two electric push rods 39 can drive the two movable clamps 40 to move relative to each other and fit with the circuit board 2, thereby clamping and fixing the circuit board 2 to prevent the circuit board 2 from shaking or shifting when glued and installing components. (2) The two first motors 33 can drive the two first gears 34 to rotate, and the meshing of the two first racks 35 can drive the moving frame 3, the movable frame 4, the four dispensing tubes 6 and the video sensor 10 to move back and forth in sequence. The second motor 36 can drive the second gear 37 to rotate, and the meshing of the second rack 38 can drive the movable frame 4, the four dispensing tubes 6 and the video sensor 10 to move left and right in sequence. The video sensor 10 can accurately detect each position on the circuit board 2 by moving back and forth and left and right above the circuit board 2. It can detect what type of components should be installed at different positions on the circuit board 2. The video sensor 10 will then transmit the signal to the intelligent controller 42. (3) The motor 18 can drive the power gear 11, transmission gear 12, four glue storage tanks 5, four glue dispensing tubes 6, four ring springs 9, four movable blocks 7, four movable rods 8 and four double-sided wedges 41 to rotate in sequence. The positions of the four movable rods 8, four double-sided wedges 41, four glue storage tanks 5 and four glue dispensing tubes 6 can be switched and adjusted. The four movable rods 8 can be put into contact with the wedge cam 17 in sequence. When the four double-sided wedges 41 rotate, they will put into contact with the fixed ring 32 in sequence. When the double-sided wedges 41 and the fixed ring 32 are in contact, the inclined surface of the double-sided wedges 41 will squeeze the fixed ring 32 and the wedge cam 17. With the elasticity of the telescopic spring 16, the fixed square rod 15, the fixed ring 32 and the wedge cam 17 can be moved up and down in sequence. The height of the wedge cam 17 can be adjusted so that the movable rods 8 and the wedge cam 17 can be put into contact at different positions. (4) When the positions of the four movable rods 8, the four double-sided wedges 41, the four glue storage tanks 5 and the four dispensing tubes 6 are adjusted, the servo motor 13 can drive the drive rod 14, the telescopic spring 16, the fixed square rod 15 and the double-sided wedges 41 to rotate in sequence. When the double-sided wedges 41 rotate, they will frequently drive the currently attached movable rods 8 to move. When the movable rods 8 move, the ring spring 9 will be in a compressed state, which will drive the movable block 7 to move inside the dispensing tube 6. The movable block 7 can be frequently moved to the storage slot inside the dispensing tube 6. The frequent opening and closing of the dispensing tube 6 can be controlled, so that the glue in the glue storage tank 5 can drip onto the circuit board 2 through the dispensing tube 6, thus achieving the purpose of dispensing glue onto the circuit board 2. Furthermore, by the video sensor 10, the four glue storage tanks 5 and the four dispensing tubes 6 moving above the circuit board 2, and the position switching of the four glue storage tanks 5 and the four dispensing tubes 6, all glue can be dispensed onto the circuit board 2 at once, thereby improving the efficiency of dispensing glue onto the circuit board 2. (5) The air cooler can put cold air into multiple air outlet pipes 19 through the shaped pipe 20, and then the multiple air outlet pipes 19 will blow the air onto the circuit board 2, thereby cooling the circuit board 2 so that the curing speed of the glue can be controlled when the glue is applied to the circuit board 2, and the glue will not cure due to the glue being on the circuit board 2 for too long when applying glue once, so as to ensure the effect of glue application on the circuit board 2. (6) The four electric telescopic rods 31 can sequentially drive the lifting frame 24, the first screw 27, the third motor 26, the connecting frame 25, the second screw 29, the fourth motor 28, the threaded block 30 and the fixed rack 23 to move up and down, thereby adjusting the height of the fixed rack 23. The third motor 26 can drive the first screw 27 to rotate, thereby sequentially driving the connecting frame 25, the second screw 29, the fourth motor 28, the threaded block 30 and the fixed rack 23 to move back and forth. The fourth motor 28 can drive the second screw 29 to rotate, thereby sequentially driving the threaded block 30 and the fixed rack 23 to move left and right. By moving the fixed rack 23 up and down, left and right and back and forth, the fixed rack 23 can mesh with each movable gear 22 on the air outlet pipe 19, thereby sequentially controlling the opening and closing of each control valve 21. At the same time, by controlling the range of meshing transmission between the fixed rack 23 and the corresponding movable gear 22, the opening size of the control valve 21 can be controlled, thereby controlling the amount of cold air in each air outlet pipe 19. (7) Furthermore, based on the above principle, while the corresponding dispensing tube 6 dispenses glue to the designated position on the circuit board 2, the fixing rack 23 can be moved to the corresponding air outlet 19, and the corresponding air outlet 19 can be opened, thereby cooling the current glued position on the circuit board 2 and controlling the curing speed of the glue on the circuit board 2. The glue is dispensed to the position on the circuit board 2 that needs to be glued through the dispensing tube 6 in sequence, and the fixing rack 23 will also open the corresponding air outlet 19 in sequence to cool the glued position on the circuit board 2, so as to ensure the glued effect of the circuit board 2 in one go. Each air outlet 19 can be opened in sequence. At the same time, when the components on the circuit board 2 are assembled, all the air outlet 19 can be closed by controlling the up and down, left and right and forward and backward movement of the fixing rack 23, so as to facilitate the glued and cooled position on the next circuit board 2. (8) When the video sensor 10 detects that a chip needs to be installed at the current position of the circuit board 2, the movable rod 8 on the epoxy tube can be put into contact with the wedge cam 17, and the double-sided wedge 41 located below the epoxy glue can be put into contact with the fixing ring 32. In this way, the movable rod 8 can be put into contact with the wedge cam 17 at a smaller diameter position, so that when the epoxy tube is dispensing glue to the circuit board 2, the glue gap can be controlled to be smaller, so that when the epoxy glue is dispensing glue, the glue amount can be controlled to be moderately small, and the fixing rack 23 can be controlled to open the air pipe 19 below the current glue dispensing position of the circuit board 2, and the air pipe 19 can be opened to the maximum, and the cold air volume can be adjusted to the maximum to cool the epoxy glue at the chip installation position of the circuit board 2, so as to control the curing time of the epoxy glue, so as to ensure the effect of epoxy glue dispensing at the specified position on the circuit board 2, and to ensure the effect of chip installation and fixing on the subsequent circuit board 2. (9) When the video sensor 10 detects that discrete components need to be installed at the current position of the circuit board 2, the movable rod 8 on the polyurethane tube can be put into contact with the wedge cam 17, and the double-sided wedge 41 located below the polyurethane glue can be put into contact with the fixing ring 32. In this way, the movable rod 8 can be put into contact with the wedge cam 17 at a larger diameter position, so that when the polyurethane tube is dispensing glue to the circuit board 2, the glue gap can be controlled to be larger, so that when the polyurethane glue is dispensing glue, the glue amount can be controlled to be moderately large, and the fixing rack 23 can be controlled to open the air pipe 19 below the current glue dispensing position of the circuit board 2, and the air pipe 19 can be opened to a larger size, and the cold air volume can be adjusted to a larger size to cool the polyurethane glue at the position where the discrete components are installed on the circuit board 2, so as to control the curing time of the polyurethane glue, so as to ensure the effect of polyurethane glue dispensing at the designated position on the circuit board 2, and to ensure the effect of subsequent discrete component installation and fixing on the circuit board 2. (10) When the video sensor 10 detects that electronic circuits need to be installed at the current position of the circuit board 2, the movable rod 8 on the silicone rubber tube can be put into contact with the wedge cam 17, and the double-sided wedge 41 located below the silicone rubber can be put into contact with the fixing ring 32. In this way, the movable rod 8 can be put into contact with the position with the smallest diameter of the wedge cam 17, so that when the silicone rubber tube is dispensing glue to the circuit board 2, the glue gap can be controlled to the maximum, so that when the silicone rubber is dispensing glue, the glue amount can be controlled to the maximum, and the fixing rack 23 can be controlled to open the air pipe 19 below the current glue dispensing position of the circuit board 2, and the air pipe 19 can be opened to a smaller size, and the cold air volume can be adjusted to a smaller size to cool the silicone rubber at the position where the electronic circuits are installed on the circuit board 2, so as to control the curing time of the silicone rubber, so as to ensure the effect of silicone rubber dispensing at the specified position on the circuit board 2, and to ensure the effect of subsequent electronic circuit installation and fixing on the circuit board 2. (11) When the video sensor 10 detects that the current position of the circuit board 2 needs to be installed with an optoelectronic device, the movable rod 8 on the light-curing adhesive tube can be put into contact with the wedge cam 17, and the double-sided wedge 41 located below the light-curing adhesive can be put into contact with the fixing ring 32. In this way, the movable rod 8 can be put into contact with the position with the largest diameter of the wedge cam 17, so that when the light-curing adhesive tube is applied to the circuit board 2, the glue gap can be controlled to the minimum, so that the amount of glue applied can be controlled to the minimum, and the fixing rack 23 can be controlled to open the air duct 19 below the current glue application position of the circuit board 2, and the air duct 19 can be opened to the minimum, and the cold air volume can be adjusted to the minimum to cool the light-curing adhesive at the position where the optoelectronic device is installed on the circuit board 2, so as to control the curing time of the light-curing adhesive, so as to ensure the effect of the light-curing adhesive application at the specified position on the circuit board 2, and to ensure the effect of the subsequent installation and fixing of the optoelectronic device on the circuit board 2.

[0047] Compared with existing technologies, the overall structure is simple. It can automatically switch the type of adhesive and adjust the amount of different adhesives according to the different components installed at different positions on the circuit board 2. This improves the efficiency of semiconductor electronic component packaging, reduces the labor intensity of workers, has a low fault tolerance rate, and ensures the stability of electronic components. It can dispense adhesive onto the circuit board 2 in one go. At the same time, it can control the adhesive curing speed according to the amount of adhesive dispensed at the corresponding position on the circuit board 2 and the type of adhesive, ensuring the packaging effect of semiconductor electronic components. This allows for one-time assembly when installing chips, discrete devices, electronic circuits and optoelectronic devices on the circuit board 2 in subsequent steps. It also ensures the synchronous adjustment of adhesive type, amount of adhesive and cooling air force, reduces the complexity of operation, and synchronously adjusts various parameters when dispensing adhesive onto the circuit board 2.

[0048] This application also discloses a semiconductor electronic component packaging process, based on a semiconductor electronic component packaging device, including the following steps: S1. Place the circuit board 2 on the support frame 1. The clamping component can clamp and fix the circuit board 2. The adjusting component can drive the video sensor 10 and the dispensing tube 6 to move horizontally, so that each position above the circuit board 2 can be detected and dispensed. S2. The switching component can switch and adjust the position of the four dispensing tubes 6. The motor 18 sequentially drives the four dispensing tubes 6, the four movable rods 8 and the four double-sided wedges 41 to rotate and switch, so that the four movable rods 8 sequentially fit into the wedge cam 17 and the four double-sided wedges 41 sequentially fit into the fixing ring 32. When fitting, under the elastic force of the telescopic spring 16, the fixed square rod 15 and the others move up and down, adjusting the height of the wedge cam 17 so that the movable rods 8 fit into different positions with the wedge cam 17, thereby controlling the dispensing type and dispensing amount of different dispensing tubes 6. S3. Servo motor 13 drives double-sided wedge block 41 to rotate, frequently driving movable rod 8 to move, compressing ring spring 9, driving movable block 7 to move inside dispensing tube 6, controlling dispensing tube 6 to frequently open and close, so that glue drips onto circuit board 2 to complete one-time dispensing. S4. The air blowing component cools the circuit board 2. The air control component and the air outlet component work together to regulate the cold air volume of each air outlet 19. The video sensor 10 detects the position of the circuit board 2. When the dispensing tube 6 dispenses glue at the designated position, the corresponding air outlet 19 is opened to cool the dispensing point and control the glue curing speed. S5. When the components to be installed at the specified positions on the circuit board 2 are detected, epoxy tubing is used for chip installation with a moderate to slightly less amount of adhesive, corresponding to the largest amount of cold air in the exhaust duct 19; polyurethane tubing is used for discrete components with a moderate to slightly more amount of adhesive, corresponding to a relatively large amount of cold air in the exhaust duct 19; silicone rubber tubing is used for electronic circuits with the most amount of adhesive, corresponding to a relatively small amount of cold air in the exhaust duct 19; and photocurable tubing is used for optoelectronic devices with the least amount of adhesive, corresponding to the smallest amount of cold air in the exhaust duct 19.

[0049] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor electronic component packaging device, characterized in that: It includes a support frame (1), a dispensing assembly and a cooling assembly for dispensing and cooling the circuit board (2), a video sensor (10) for detecting the dispensing position on the circuit board (2), and a clamping component for clamping the circuit board (2); The dispensing assembly includes four glue tanks (5) rotatably mounted on a support frame (1) and a wedge cam (17), dispensing tubes (6) respectively connected to the four glue tanks (5), movable blocks (7) respectively movably mounted in the four dispensing tubes (6), an adjusting component for translating the four dispensing tubes (6), a switching component for switching the four dispensing tubes (6), a translating component for translating the movable blocks (7), and a lifting component for lifting the wedge cam (17). The lifting component is automatically driven by the switching component. The four glue tanks (5) are epoxy glue tank, polyurethane glue tank, silicone rubber tank and UV-curable glue tank, respectively. The cooling assembly includes multiple air outlet pipes (19) mounted on a support frame (1), a blower for storing cold air in the air outlet pipes (19), a control device for adjusting the amount of cold air in each air outlet pipe (19), and an air outlet device for opening the multiple air outlet pipes (19) one by one.

2. The semiconductor electronic component packaging equipment according to claim 1, characterized in that: The adjusting component includes a movable frame (3) movably mounted on the support frame (1), a movable frame (4) movably mounted on the movable frame (3), two first racks (35) fixed on the support frame (1), two first motors (33) fixed on the movable frame (3), a first gear (34) respectively fixed on the output shaft of the two first motors (33), a second rack (38) fixed on the movable frame (3), a second motor (36) fixed on the movable frame (4), and a second gear (37) fixed on the output shaft of the second motor (36). The two first racks (35) mesh with the two first gears (34) respectively, and the second rack (38) meshes with the second gear (37).

3. The semiconductor electronic component packaging equipment according to claim 2, characterized in that: The switching component includes a transmission gear (12) and a power gear (11) rotatably mounted on the movable frame (4) and an electric motor (18) fixed on the movable frame (4). The power gear (11) is fixedly connected to the output end of the electric motor (18), the transmission gear (12) meshes with the power gear (11), and the four glue storage tanks (5) are all fixedly connected to the transmission gear (12).

4. The semiconductor electronic component packaging equipment according to claim 3, characterized in that: The translation component includes annular springs (9) fixed on four dispensing tubes (6), movable rods (8) fixed on four movable blocks (7), fixed square rods (15) fixed on wedge cams (17), drive rods (14) rotatably mounted on movable frames (4), and servo motors (13) fixed on movable frames (4). The drive rods (14) are fixedly connected to the output end of the servo motors (13). The four movable rods (8) are all in movable contact with the wedge cams (17). The four annular springs (9) are fixedly connected to the four movable rods (8). A glue-over-gluing gap is provided between the movable blocks (7) and the dispensing tubes (6).

5. The semiconductor electronic component packaging equipment according to claim 4, characterized in that: The lifting component includes four double-sided wedges (41) fixed on the transmission gear (12) and a telescopic spring (16) and a fixing ring (32) fixed on the wedge cam (17). The telescopic spring (16) is fixedly connected to the drive rod (14). A fixing square groove is provided in the drive rod (14). The fixing square rod (15) is slidably connected to the fixing square groove. The four double-sided wedges (41) are all in contact with the fixing ring (32). The four double-sided wedges (41) are located below the four glue storage tanks (5). The heights of the four double-sided wedges (41) are different.

6. The semiconductor electronic component packaging equipment according to claim 1, characterized in that: The blower includes a shaped tube (20) fixed on the support frame (1) and a cooler. Multiple air outlets (19) are connected to the shaped tube (20). The shaped tube (20) is connected to the air outlet of the cooler. The air outlets of the multiple air outlets (19) are located below the circuit board (2). The multiple air outlets (19) are evenly distributed on the shaped tube (20).

7. The semiconductor electronic component packaging equipment according to claim 1, characterized in that: The air outlet component includes a lifting frame (24) movably mounted on the support frame (1), a first screw (27) rotatably mounted on the lifting frame (24), a third motor (26) fixed on the lifting frame (24), a connecting frame (25) movably mounted on the lifting frame (24), a threaded block (30) movably mounted on the connecting frame (25), a second screw (29) rotatably mounted on the connecting frame (25), and a fourth motor (28) fixed on the connecting frame (25). The first screw (27) is fixedly connected to the output shaft of the third motor (26), the first screw (27) is threadedly connected to the connecting frame (25), the second screw (29) is fixedly connected to the output shaft of the fourth motor (28), and the second screw (29) is threadedly connected to the threaded block (30).

8. A semiconductor electronic component packaging device according to claim 7, characterized in that: The air control component includes a fixed rack (23) fixed on a threaded block (30), four electric telescopic rods (31) fixed on a support frame (1), control valves (21) fixed on multiple air outlet pipes (19) respectively, and movable gears (22) fixed on multiple control valves (21) respectively. The multiple movable gears (22) are all in active engagement with the fixed rack (23), and the output ends of the four electric telescopic rods (31) are all fixedly connected to the lifting frame (24).

9. A semiconductor electronic component packaging device according to claim 1, characterized in that: The video sensor (10) is fixedly connected to the movable frame (4). The four dispensing tubes (6) are epoxy tube, polyurethane tube, silicone rubber tube and light-curing tube, respectively. The dispensing end of the epoxy tube is conical, the dispensing end of the polyurethane tube is obliquely cut, the dispensing end of the silicone rubber tube is flat fan-shaped, and the dispensing end of the light-curing tube is needle-shaped. The lengths of the four dispensing tubes (6) are different.

10. A semiconductor electronic component packaging process, based on a semiconductor electronic component packaging apparatus as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. Place the circuit board (2) on the support frame (1). The clamping component can clamp and fix the circuit board (2). The adjusting component can drive the video sensor (10) and the dispensing tube (6) to move horizontally, so as to detect and dispense adhesive at each position above the circuit board (2). S2. The switching component can switch and adjust the position of the four dispensing tubes (6). The motor (18) drives the four dispensing tubes (6), four movable rods (8) and four double-sided wedges (41) to rotate and switch in sequence, so that the four movable rods (8) fit into the wedge cam (17) in sequence, and the four double-sided wedges (41) fit into the fixing ring (32) in sequence. When fitting, under the elastic force of the telescopic spring (16), the fixed square rod (15) and the others move up and down, adjusting the height of the wedge cam (17) so that the movable rods (8) fit into different positions with the wedge cam (17) to control the dispensing type and dispensing amount of different dispensing tubes (6); S3. The servo motor (13) drives the double-sided wedge (41) to rotate, frequently driving the movable rod (8) to move, compressing the ring spring (9), driving the movable block (7) to move inside the dispensing tube (6), controlling the dispensing tube (6) to frequently open and close, so that the glue drips onto the circuit board (2) to complete the one-time dispensing. S4. The air blower cools the circuit board (2), the air control component and the air outlet component work together to regulate the cold air volume of each air outlet pipe (19), the video sensor (10) detects the position of the circuit board (2), and when the dispensing tube (6) dispenses glue at the specified position, the corresponding air outlet pipe (19) is opened to cool the dispensing point and control the glue curing speed. S5. When the components to be installed at the specified position on the circuit board (2) are detected, the epoxy tube used for chip installation has a moderate to small amount of glue, and the corresponding air outlet (19) has the largest amount of cold air. The polyurethane tube used for discrete components has a moderate to large amount of glue, and the corresponding air outlet (19) has a relatively large amount of cold air. The silicone rubber tube used for electronic circuits has the largest amount of glue, and the corresponding air outlet (19) has a relatively small amount of cold air. The photocurable tube used for optoelectronic devices has the smallest amount of glue, and the corresponding air outlet (19) has the smallest amount of cold air.

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