Solid state disk assembly equipment and solid state disk assembly method

Abstract

The invention belongs to the technical field of solid state disks, and discloses solid state disk assembly equipment and a solid state disk assembly method. The feeding conveying module of the solid state disk assembly equipment comprises a conveying line body and a plurality of material trays, the conveying line body is arranged on an installation platform and provided with a first assembly station and a second assembly station, the material trays are arranged on the conveying line body and can move in the conveying direction, and lower shells, PCBs and upper shells are placed in the material trays; the PCB assembling module is arranged on the mounting platform and located on the outer side of the first assembling station, and the PCB assembling module is used for grabbing a PCB and placing the PCB in the lower shell; the overturning module is arranged on the mounting platform and located on the outer side of the second assembling station, and the overturning module is used for grabbing the upper shell and overturning the upper shell by a set angle; the cover closing module is arranged on the mounting platform and located on the outer side of the second assembling station. The cover closing module is used for grabbing the upper shell on the overturning module and buckling the upper shell to the lower shell. According to the invention, the assembly efficiency is improved, and batch production is facilitated.

Description

Technical Field

[0001] This invention relates to the field of solid-state drive (SSD) technology, and more particularly to an SSD assembly device and a SSD assembly method. Background Technology

[0002] With the rapid development of information technology and the increasing prevalence of digital life, people's demand for data storage has exploded. Whether it's individual users storing personal data such as photos and videos, or enterprise users backing up and managing large amounts of business data, both place higher demands on the capacity and performance of storage devices. Against this backdrop, solid-state drives (SSDs) have seen a continuous rise in market demand due to their superior performance.

[0003] However, in the current SSD assembly process, most of the assembly work is done manually. During assembly, workers first need to place the PCB circuit board in the designated position on the lower casing, ensuring accurate connection between the circuit board and the lower casing. This step seems simple, but it actually requires workers to have a high level of skill and focus, because even a slight deviation in placement can lead to poor connection between the circuit board and the lower casing, affecting the normal operation of the SSD. After placing the PCB board, workers also need to attach the upper casing to the lower casing to complete the entire SSD encapsulation. This manual assembly method is not only time-consuming and labor-intensive, but also inefficient. Due to the limited speed and precision of manual operation, it is difficult to meet the mass production needs of SSDs in large-scale production, leading to extended production cycles and increased costs. Summary of the Invention

[0004] The purpose of this invention is to provide a solid-state drive (SSD) assembly device and a SSD assembly method, which can improve SSD assembly efficiency and facilitate the mass production of SSDs.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] Solid-state drive assembly equipment, including:

[0007] Installation platform;

[0008] The feeding and conveying module includes a conveyor line and several material trays. The conveyor line is set on the installation platform and has a first assembly station and a second assembly station. The several material trays are set on the conveyor line and can move along the conveying direction. A lower shell, a PCB board and an upper shell are placed in the material trays.

[0009] A PCB assembly module is disposed on the mounting platform and located outside the first assembly station. The PCB assembly module is used to grip the PCB board and place it inside the lower shell.

[0010] A flipping module is disposed on the mounting platform and located outside the second assembly station. The flipping module is used to grab the upper shell and flip it at a set angle.

[0011] A lid-closing module is disposed on the mounting platform and located outside the second assembly station. The lid-closing module is used to grab the upper shell on the flipping module and fasten it to the lower shell.

[0012] As an optional solution for solid-state drive assembly equipment, the conveyor line has a third assembly station at its end, and the solid-state drive assembly equipment further includes:

[0013] A pressure-holding module is disposed on the mounting platform and located at the third assembly station. The pressure-holding module is used to keep the upper shell and the lower shell in a pressed state for a set time.

[0014] As an optional solution for solid-state drive assembly equipment, the pressure-holding module includes:

[0015] Gantry crane, which is mounted on the mounting platform;

[0016] A pressing module is disposed on the gantry and located above the conveyor line;

[0017] A pressure head is installed at the lower end of the pressing module, and the pressing module can drive the pressure head to move up and down in a first direction.

[0018] As an optional solution for solid-state drive assembly equipment, the feeding and conveying module further includes:

[0019] The lifting mechanism is provided at the first assembly station, the second assembly station and the third assembly station of the conveyor line. The lifting mechanism is used to lift the material tray from the conveyor line.

[0020] Clamping mechanisms are provided on both sides of the first assembly station, the second assembly station and the third assembly station of the conveyor line. The two clamping mechanisms arranged opposite each other are used to fix the material tray that is lifted up.

[0021] As an optional solution for solid-state drive assembly equipment, the feeding and conveying module further includes:

[0022] The first assembly station, the second assembly station, and the third assembly station of the conveyor line are all equipped with blocking mechanisms, which can extend and block the material tray from moving forward.

[0023] As an optional solution for solid-state drive assembly equipment, the PCB assembly module includes a first robotic arm, a first visual guidance module, and a suction nozzle. The first visual guidance module and the suction nozzle are both mounted on the first robotic arm, and the suction nozzle can adsorb the PCB board.

[0024] As an optional solution for solid-state drive assembly equipment, the flip module includes a translation module, a rotation module, a lifting module, and a gripper cylinder. The translation module is disposed on the mounting platform, the rotation module is disposed on the translation module, and the translation module is used to drive the rotation module to move along a second direction. The lifting module is disposed on the rotation module, and the rotation module is used to drive the lifting module to rotate. The gripper cylinder is disposed on the lifting module, and the lifting module is used to drive the gripper cylinder to move along a first direction.

[0025] As an optional solution for solid-state drive assembly equipment, the cover-closing module includes a second robotic arm, a second visual guidance module, and an electric gripper. The second visual guidance module and the electric gripper are both mounted on the second robotic arm, and the electric gripper is used to grasp the flipped upper shell.

[0026] A solid-state drive (SSD) assembly method, applied to the SSD assembly equipment described in any of the preceding claims, includes the following steps:

[0027] S1. Each tray contains a lower shell, a PCB board, and an upper shell. The feeding conveyor module drives the tray to move along the conveying direction.

[0028] S2. When the material tray arrives at the first assembly station, the PCB assembly module picks up the PCB board from the material tray and places it into the lower shell.

[0029] S3. When the material tray arrives at the second assembly station, the flipping module first grabs the upper shell on the material tray and flips it at a set angle. Then the closing module grabs the upper shell on the flipping module and fastens it to the lower shell on the material tray.

[0030] S4. The material tray arrives at the third assembly station, and the pressure holding module presses against the upper shell and continues for the set time.

[0031] S5, the feeding conveyor module transports the product to the unloading station.

[0032] As an optional method for assembling solid-state drives, the set angle is 180 degrees.

[0033] The beneficial effects of this invention are:

[0034] The solid-state drive (SSD) assembly equipment provided by this invention sets up an infeed conveying module, a PCB assembly module, a flipping module, and a cover-closing module on an installation platform. The infeed conveying module's conveyor line moves a tray along the conveying direction, with a lower shell, a PCB board, and an upper shell simultaneously placed on the tray. When the tray moves to the first assembly station, the PCB assembly module picks up the PCB board from the tray and places it into the lower shell on the tray. The tray continues to move to the second assembly station, where the flipping module picks up the upper shell and flips it at a set angle so that the opening of the upper shell faces downwards. The cover-closing module, located near the second assembly station, takes the upper shell from the flipping module and fastens it onto the lower shell. The upper and lower shells combine to form a structure protecting the PCB board, improving SSD assembly efficiency and facilitating mass production of SSDs.

[0035] The solid-state drive (SSD) assembly method provided by this invention requires no manual intervention, improves the assembly efficiency of SSDs, and facilitates the mass production of SSDs. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0037] Figure 1 This is an assembly diagram of the solid-state drive assembly equipment in an embodiment of the present invention;

[0038] Figure 2 This is an assembly diagram of the feeding and conveying module in an embodiment of the present invention;

[0039] Figure 3 This is an assembly diagram of the PCB assembly module in an embodiment of the present invention;

[0040] Figure 4 This is an assembly diagram of the flip module in an embodiment of the present invention;

[0041] Figure 5 This is a schematic diagram of the assembly of the cover module in an embodiment of the present invention;

[0042] Figure 6 This is an assembly diagram of the pressure holding module in an embodiment of the present invention;

[0043] Figure 7 This is a flowchart of a solid-state drive assembly method in an embodiment of the present invention.

[0044] Figure label:

[0045] 0001, Lower shell; 0002, PCB board; 0003, Upper shell;

[0046] 100. Installation platform; 200. Feeding and conveying module; 300. PCB assembly module; 400. Flipping module; 500. Cover closing module; 600. Pressure holding module;

[0047] 201. Conveyor line; 202. Material tray; 203. Lifting mechanism; 204. Clamping mechanism; 205. Blocking mechanism;

[0048] 301. First robotic arm; 3011. Telescopic rod; 302. First vision guidance module; 303. Suction nozzle;

[0049] 401. Translation module; 402. Rotation module; 403. Lifting module; 404. Gripper cylinder;

[0050] 501. Second robotic arm; 502. Second vision guidance module; 503. Electric gripper; 504. Second pressure sensor;

[0051] 601. Gantry frame; 602. Pressing module; 603. Press head; 604. First pressure sensor. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0053] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0054] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0055] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0056] Solid-state drives (SSDs) are crucial components in modern computer storage. Despite their higher price compared to traditional hard disk drives (HDDs), their superior performance has led to their increasing importance in the market. The physical structure of an SSD primarily consists of an upper casing, a lower casing, and a PCB (Printed Circuit Board) containing the storage functionality. The PCB, as the core component, integrates numerous storage modules and undertakes the critical tasks of data storage and retrieval. The upper and lower casings act like robust armor, providing comprehensive protection for the internal PCB and ensuring stable operation in various complex environments.

[0057] Compared to traditional hard disk drives (HDDs), solid-state drives (SSDs) have a wider range of applications. This is mainly due to their significant advantages in several key performance indicators. In terms of data transfer rate, SSDs utilize advanced flash memory technology, enabling high-speed data read and write operations. Whether it's system startup, software loading, or large file transfers, everything can be completed instantly, greatly enhancing the user experience. Regarding noise control, since SSDs lack the high-speed rotating disks and mechanical arms of HDDs, they generate almost no noise during operation, creating a quiet and comfortable working and entertainment environment for users. Heat dissipation is also a crucial indicator of hard drive performance. SSDs generate relatively less heat during operation, which not only helps extend the lifespan of the drive itself but also reduces the impact on other internal computer hardware, ensuring the stable operation of the entire system. Furthermore, in terms of failure rate, SSDs, lacking moving mechanical parts, reduce the risk of failure due to mechanical wear, resulting in higher reliability and stability.

[0058] With the rapid development of information technology and the increasing prevalence of digital life, people's demand for data storage has exploded. Whether it's individual users storing personal data such as photos and videos, or enterprise users backing up and managing large amounts of business data, both place higher demands on the capacity and performance of storage devices. Against this backdrop, solid-state drives (SSDs) have seen a continuous rise in market demand due to their superior performance. To meet this growing demand, efficient and precise manufacturing processes and methods have become crucial for SSD production. Only by continuously optimizing production processes and improving production efficiency can a stable supply of SSDs be ensured to meet the market's demand for mass production.

[0059] However, several problems remain to be solved in the current assembly process of solid-state drives (SSDs). Currently, most SSD assembly is done manually. During assembly, workers must carefully place the PCB circuit board in its designated position on the lower casing, ensuring accurate connection. This step, while seemingly simple, requires high skill and focus, as even a slight misalignment can lead to poor connection between the circuit board and the lower casing, affecting the SSD's functionality. After placing the PCB, workers must then attach the upper casing to the lower casing to complete the SSD's encapsulation. This manual assembly method is not only time-consuming and labor-intensive but also inefficient. Due to the limited speed and precision of manual operation, it is difficult to meet the mass production demands of SSDs in large-scale manufacturing, leading to extended production cycles and increased costs.

[0060] Even more challenging is the inverted snap-fit ​​design of some SSDs, where the upper and lower casings are connected. This design was intended to strengthen the connection between the upper and lower casings, improving the overall stability of the SSD. However, in actual assembly, it presents significant difficulties for workers. Due to the snap-fit, workers cannot directly snap the upper casing vertically onto the lower casing. Instead, they must first tilt the upper casing at an angle so that its edge can smoothly pass over the snap-fit ​​on the lower casing, and then slowly adjust the upper casing to the correct position for a perfect fit. This process requires extensive experience and skillful operation; even slight mistakes can lead to improper connection or damage to either casing, causing unnecessary losses. Therefore, this snap-fit ​​design further increases the assembly difficulty of SSDs, impacting both production efficiency and product quality.

[0061] To improve solid-state drive (SSD) assembly efficiency and enable mass production of SSDs, this embodiment provides an SSD assembly device and an SSD assembly method, which are described below. Figures 1 to 7The specific content of this embodiment will be described in detail. It should be noted that the first direction mentioned in this embodiment is... Figure 1 The Z direction in this embodiment, and the second direction mentioned in this embodiment are Figure 1 In the Y direction, the third direction mentioned in this embodiment is Figure 1 The X direction in the equation.

[0062] like Figures 1 to 6 As shown, the solid-state drive (SSD) assembly equipment in this embodiment includes an installation platform 100, a feeding conveyor module 200, a PCB assembly module 300, a flipping module 400, and a cover-closing module 500. These modules work together to efficiently assemble the SSD. The installation platform 100 serves as the basic support structure for the entire assembly equipment, providing stable and precise installation positions for the other modules. It possesses sufficient strength and rigidity to withstand various forces generated during operation, ensuring the equipment remains stable even under prolonged, high-intensity operation, preventing shaking or displacement, thus providing a reliable guarantee for the precise assembly of the SSD. The feeding conveyor module 200 includes a conveyor line 201 and several trays 202. The conveyor line 201 is mounted on the installation platform 100 and has a first assembly station and a second assembly station. For example, the conveyor line 201 can be a belt conveyor mechanism, capable of stable operation along a specific conveying direction according to a preset program and speed. Several trays 202 are mounted on the conveyor line 201 and can move along the conveying direction. Each tray 202 contains three key components required for solid-state drive assembly: a lower shell 0001, a PCB board 0002, and an upper shell 0003. Because the trays 202 have grooves for placing components, it ensures that the components will not shake or shift during conveying, laying a good foundation for subsequent assembly processes. A PCB assembly module 300 is mounted on the mounting platform 100 and located outside the first assembly station. The PCB assembly module 300 is used to grip the PCB board 0002 and place it inside the lower shell 0001. A flipping module 400 is mounted on the mounting platform 100 and located outside the second assembly station. The flipping module 400 is used to grip the upper shell 0003 and flip it at a set angle. A closing module 500 is mounted on the mounting platform 100 and located outside the second assembly station. The closing module 500 is used to grip the upper shell 0003 on the flipping module 400 and fasten it to the lower shell 0001.

[0063] In summary, the solid-state drive assembly equipment provided in this embodiment sets up the feeding conveyor module 200, PCB assembly module 300, flipping module 400, and capping module 500 on the mounting platform 100, forming a highly efficient and orderly automated production system. Utilizing the conveyor line 201 of the feeding conveyor module 200, the material tray 202 can move stably along the conveying direction, achieving continuous component supply. The material tray 202 simultaneously holds the lower shell 0001, the PCB board 0002, and the upper shell 0003. When the material tray 202 moves to the first assembly station, the PCB assembly module 300 can quickly and accurately grab the PCB board 0002 from the material tray 202 and place it inside the lower shell 0001, completing the initial assembly of the solid-state drive. The material tray 202 continues to move to the second assembly station, where the flipping module 400 can grab the upper shell 0003 and flip it at a set angle, so that the opening of the upper shell 0003 faces downwards, fully preparing for the capping process. The cover-closing module 500, located near the second assembly station, receives the upper shell 0003 from the flipping module 400 and precisely snaps it onto the lower shell 0001, thus completing the assembly of the solid-state drive (SSD). This improves SSD assembly efficiency and facilitates mass production. Traditional SSD assembly methods rely heavily on manual operation, which is not only slow but also prone to human error. The assembly equipment in this embodiment achieves automated production, allowing each module to quickly and accurately complete its assembly task, significantly shortening the assembly cycle, improving production efficiency, and avoiding assembly deviations and quality problems caused by human factors. This, in turn, enhances the overall performance and reliability of the SSD.

[0064] Furthermore, the end of the conveyor line 201 has a third assembly station. The solid-state drive assembly equipment also includes a pressure holding module 600, which is mounted on the mounting platform 100 and located at the third assembly station. The pressure holding module 600 is used to keep the upper shell 0003 and the lower shell 0001 in a pressed state for a set time. When the tray 202, driven by the conveyor line 201, completes the following operations in sequence: at the first assembly station, the PCB assembly module 300 precisely places the PCB board 0002 into the lower shell 0001; at the second assembly station, the flipping module 400 flips the upper shell 0003 to a set angle, and the closing module 500 fastens the upper shell 0003 onto the lower shell 0001; it will then smoothly reach the third assembly station at the end of the conveyor line 201. At this time, another important module in the solid-state drive assembly equipment—the pressure holding module 600—begins to function. The pressing device of the pressure-holding module 600 will quickly activate, applying appropriate pressure to press the already joined upper shell 0003 and lower shell 0001 into a pressed state. This "appropriate pressure" is determined through extensive experimentation and precise calculation, ensuring a tight and secure connection between the upper shell 0003 and lower shell 0001 without damaging them or the internally assembled PCB board 0002 due to excessive pressure. Within the set pressing time, the connection between the upper shell 0003 and lower shell 0001 will be further tightened under pressure. If adhesives are used for auxiliary connection, the combined effect of pressure and time will allow the adhesive to fully fill the tiny gaps between the upper shell 0003 and lower shell 0001, achieving an even stronger bond.

[0065] Furthermore, the pressure holding module 600 includes a gantry 601, a pressing module 602, and a pressing head 603. The gantry 601, serving as the basic support structure for the entire pressure holding module 600, is securely mounted on the mounting platform 100. It is made of high-strength metal materials, possessing sufficient rigidity and stability to withstand various forces generated by the pressing module 602 and the pressing head 603 during operation, ensuring that no deformation or shaking occurs during long-term operation, thus providing a stable and reliable support platform for pressure holding operations. The gantry 601 is typically designed in a U-shape, a structure that is not only simple and easy to manufacture but also provides ample installation space and a flexible range of motion for the pressing module 602. The pressure module 602 is mounted on the gantry 601 and located above the conveyor line 201. The pressure module 602 can be, but is not limited to, a screw-slide module. The drive motor inside the pressure module 602 outputs corresponding power according to a preset program, converting rotary motion into linear motion through the cooperation of the screw and nut. Guided by the guide rails, the pressure module 602 moves smoothly and accurately in the vertical direction. This precise motion control is one of the key factors in ensuring the quality of the pressure holding operation. It ensures that the pressure head 603 accurately reaches the designated position during descent, applying uniform and stable pressure to the upper shell 0003 and lower shell 0001. The pressure head 603 is installed at the lower end of the pressure module 602 and is the component that directly contacts and applies pressure to the upper shell 0003 of the solid-state drive. The shape and size design of the pressure head 603 are carefully customized according to the shape and size of the upper shell 0003 of the solid-state drive to ensure full contact with the surface of the upper shell 0003 during the pressure holding process, achieving uniform pressure distribution. The pressing module 602 can drive the pressing head 603 to move up and down in the first direction.

[0066] To further optimize the performance of the pressure holding module 600, a first pressure sensor 604 is specifically installed between the pressure-lowering module 602 and the pressure head 603. The first pressure sensor 604 can detect the pressure applied to the pressure head 603 by the pressure-lowering module 602 in real time and accurately, converting the detected pressure signal into an electrical signal and transmitting it to the control system. The control system precisely controls the movement of the pressure-lowering module 602 according to a preset pressure value. When the pressure value detected by the pressure sensor is less than the preset value, the control system instructs the pressure-lowering module 602 to continue moving downwards, increasing the pressure; when the pressure value reaches the preset value, the control system stops the movement of the pressure-lowering module 602, maintaining the current pressure state; if the pressure value exceeds the preset value, the control system instructs the pressure-lowering module 602 to move upwards, decreasing the pressure. This closed-loop control effectively controls the downward pressure of the pressure head 603, ensuring the stability and accuracy of the pressure during the pressure holding process. In addition, the first pressure sensor 604 can record and analyze pressure data in real time during the pressure holding process, providing strong data support for production process monitoring and quality control, facilitating the timely detection and resolution of potential problems, and further improving the stability and consistency of production.

[0067] Furthermore, the feeding and conveying module 200 also includes a lifting mechanism 203 and a clamping mechanism 204. Lifting mechanisms 203 are installed at the first, second, and third assembly stations of the conveyor line 201. These lifting mechanisms 203 are used to lift the material tray 202 from the conveyor line 201. These lifting mechanisms 203 are typically pneumatically or electrically driven, possessing strong lifting capacity and precise control performance. Pneumatically driven lifting mechanisms 203 utilize compressed air as a power source, achieving the lifting action of the material tray 202 through the extension and retraction of cylinders, featuring fast response and smooth operation. Electrically driven lifting mechanisms 203 rely on motors to drive lead screws or gear racks and other transmission devices, enabling more precise position control. As the material tray 202 arrives at each assembly station sequentially along the conveyor line 201, the lifting mechanism 203 quickly activates, using a uniform and stable force to precisely lift the material tray 202 off the surface of the conveyor line 201, providing a stable working platform for subsequent assembly operations. This lifting operation not only prevents the material tray 202 from shifting position due to shaking or friction during conveying, but also ensures that the material tray 202 maintains a fixed height during assembly, facilitating accurate operation of the workpieces on the material tray 202 by each assembly module.

[0068] Meanwhile, to further enhance the stability of the material tray 202 during the assembly process, clamping mechanisms 204 are installed on both sides of the first, second, and third assembly stations of the conveyor line 201 along the third direction. Two opposing clamping mechanisms 204 are used to fix the lifted material tray 202. The design of these clamping mechanisms 204 fully considers the shape and size characteristics of the material tray 202 and is typically arranged symmetrically. When the lifting mechanism 203 lifts the material tray 202, the clamping mechanisms 204 on both sides act simultaneously, quickly converging towards the center to firmly fix the material tray 202 with appropriate force. This clamping method effectively prevents the material tray 202 from moving or wobbling horizontally due to external forces during assembly, ensuring the accuracy and stability of the assembly operation. For example, when assembling PCB board 0002 at the first assembly station, clamping mechanism 204 can fix tray 202 in a precise position, so that PCB assembly module 300 can accurately place PCB board 0002 into lower shell 0001, avoiding assembly deviation caused by movement of tray 202; when flipping and closing upper shell 0003 at the second assembly station, clamping mechanism 204 can also ensure the stability of tray 202, so that flipping module 400 and closing module 500 can smoothly complete their respective actions, achieving precise engagement between upper shell 0003 and lower shell 0001.

[0069] Furthermore, the feeding and conveying module 200 also includes a blocking mechanism 205. The first, second, and third assembly stations of the conveyor line 201 are all equipped with blocking mechanisms 205, which can extend and prevent the tray 202 from moving forward. When the conveyor line 201 is operating normally and the tray 202 carrying the components of the solid-state drive moves forward, once the tray 202 approaches the first assembly station, the blocking mechanism 205 at that station will quickly activate. Under the command of the control system, the blocking components in the blocking mechanism 205, such as blocking rods or blocking blocks, will extend from a preset position and accurately lie across the path of the conveyor line 201, forming a reliable barrier to prevent the tray 202 from continuing to move forward. At this time, the tray 202 will stably stop in front of the first assembly station under the action of the blocking mechanism 205, preparing for the subsequent PCB board 0002 assembly operation. After the assembly of PCB board 0002 and lower shell 0001 is completed at the first assembly station, the blocking mechanism 205 retracts its blocking component, allowing the tray 202 to continue moving forward along the conveyor line 201. When the tray 202 reaches the second assembly station, the blocking mechanism 205 at that station will also extend in time to prevent the tray 202 from moving forward, ensuring that the tray 202 is precisely positioned at the second assembly station for operations such as flipping and closing the upper shell 0003. Similarly, when the tray 202 reaches the third assembly station, the blocking mechanism 205 at the third assembly station will also play its role, fixing the tray 202 at that station and providing stable working conditions for the pressure holding module 600 to perform pressure holding processing on the upper shell 0003 and lower shell 0001.

[0070] Furthermore, the PCB assembly module 300 includes a first robotic arm 301, a first vision guidance module 302, and a suction nozzle 303. Both the first vision guidance module 302 and the suction nozzle 303 are mounted on the telescopic rod 3011 of the first robotic arm 301. This integrated design makes the entire module structure compact, reduces space occupation, and also facilitates collaborative work between components. For example, the first robotic arm 301 is a four-axis robotic arm, also known as a swing-arm robot. The first vision guidance module 302 typically consists of a high-precision industrial camera, a light source, and an image processing system. The industrial camera can quickly and accurately capture information such as the PCB board 0002 and its position and orientation on the tray 202. The light source provides stable and uniform illumination for the camera, ensuring clear and high-quality images can be obtained under different environmental conditions. The image processing system performs real-time analysis and processing of the acquired images, identifying feature points, edges, and other information of the PCB board 0002 through advanced algorithms, and calculating its precise position and orientation parameters. These parameters are transmitted to the control system of the first robotic arm 301, guiding the robotic arm to perform precise operations. The suction nozzle 303 is the component that directly contacts the PCB board 0002 and performs the adsorption function. It is typically made of special materials, such as silicone or rubber, possessing good flexibility and sealing properties. Simultaneously, the suction nozzle 303 usually has a vacuum channel inside. By connecting to a vacuum generator, a negative pressure can be quickly generated when the suction nozzle 303 contacts the PCB board 0002, firmly adsorbing the PCB board 0002. After assembly, by controlling the vacuum generator to release the negative pressure, the suction nozzle 303 can easily place the PCB board 0002 into the designated position.

[0071] Furthermore, the flipping module 400 includes a translation module 401, a rotation module 402, a lifting module 403, and a gripper cylinder 404. The translation module 401 is mounted on the mounting platform 100. The translation module 401 is equipped with a high-precision linear guide and a ball screw pair. The linear guide provides precise guidance for the movement, ensuring smooth and seamless motion. The ball screw pair converts rotational motion into linear motion, featuring high transmission efficiency and high precision. Driven by a drive device (such as a servo motor), the translation module 401 can drive the rotation module 402 mounted on it to move precisely in a second direction. The rotation module 402 is mounted on the translation module 401, and the translation module 401 drives the rotation module 402 to move in the second direction. The lifting module 403 is mounted on the rotation module 402, and the rotation module 402 drives the lifting module 403 to rotate. The rotating module 402 is also driven by a dedicated drive unit (such as a stepper motor or servo motor), which drives the lifting module 403 mounted on it to rotate via gear transmission or direct drive. The rotation angle range can be precisely set according to production requirements, enabling 360-degree stepless rotation or positioning rotation at a specific angle. The lifting module 403 is mounted on the rotating module 402, and its main responsibility is to drive the gripper cylinder 404 to move vertically up and down along a first direction. The first direction is usually vertical, to meet the needs of grasping and placing objects at different heights.

[0072] Furthermore, the lid-closing module 500 includes a second robotic arm 501, a second vision guidance module 502, and an electric gripper 503. Both the second vision guidance module 502 and the electric gripper 503 are mounted on the second robotic arm 501. The electric gripper 503 is used to grasp the flipped upper shell 0003. For example, the second robotic arm 501 is a six-axis robot. A six-axis robot has six degrees of freedom, enabling extremely flexible and precise motion control in three-dimensional space. Its six axes control different directions of movement for the robotic arm. Through the coordinated rotation of each axis, the robotic arm can perform various complex movements such as rotation, extension, pitch, and yaw. This multi-degree-of-freedom design allows the second robotic arm 501 to adapt to upper shells 0003 of different sizes and shapes, as well as various complex assembly environments. For example, when facing an upper shell 0003 with an irregular shape or special structural design, the six-axis robot can precisely adjust the angles and positions of each axis to accurately move the electric gripper 503 above the upper shell 0003, preparing for subsequent grasping operations. The second vision guidance module 502 also consists of a high-resolution industrial camera, a professional light source system, and advanced image processing software. The electric gripper 503 is installed at the end of the second robotic arm 501 and is the component that directly contacts the upper shell 0003 to perform the gripping function.

[0073] Preferably, a second pressure sensor 504 is provided at the connection between the electric gripper 503 and the second robotic arm 501. The second pressure sensor 504 can monitor the pressure of the electric gripper 503 during the downward pressing process in real time and feed the pressure signal back to the control system of the second robotic arm 501. The control system precisely controls the downward pressure of the electric gripper 503 driven by the second robotic arm 501 according to the preset pressure value, ensuring that the upper shell 0003 and the lower shell 0001 can fit together with appropriate pressure during the closing process. This prevents the lid from closing loosely due to insufficient pressure, resulting in gaps that affect the product's sealing performance and appearance quality; and also prevents the upper shell 0003 or the lower shell 0001 from being damaged due to excessive pressure, causing the product to be scrapped.

[0074] like Figure 7As shown, this embodiment also provides a solid-state drive (SSD) assembly method. This SSD assembly method is applied to the SSD assembly equipment mentioned above for assembling SSDs, and includes the following steps: S1, Material tray 202 preparation and feeding: Each material tray 202 is equipped with a lower shell 0001, a PCB board 0002, and an upper shell 0003. The feeding and feeding module 200 drives the material tray 202 to move along the conveying direction; S2, PCB board assembly: When the material tray 202 reaches the first assembly station, the PCB assembly module 300 picks up the PCB board 0002 from the material tray 202 and places it into the lower shell 0001; S3, Upper shell 0003 flipping and closing: When the material tray 202 reaches the second assembly station, the flipping module 400 first grabs the upper shell 0003 from the material tray 202 and flips it by a set angle. For example, the set angle is 180 degrees. Then, the closing module 500 grabs the upper shell 0003 from the flipping module 400 and fastens it to the lower shell 0001 on the material tray 202; S4, Pressure holding: The material tray 202 reaches the third assembly station, and the pressure holding module 600 presses the upper shell 0003 and continues for a set time; S5, Product conveying: The feeding conveying module 200 conveys the product to the unloading station. The entire assembly method achieves a high degree of precision in the solid-state drive assembly process through the precise operation and coordinated cooperation of each module. The PCB assembly module 300 can accurately place the PCB board inside the lower shell 0001. The precise flipping and fastening operations of the flipping module 400 and the closing module 500 enable the upper shell 0003 to match the lower shell 0001, improving the sealing performance and structural stability of the shell; the appropriate pressure and set time of the pressure holding module 600 further eliminate minor defects that may exist in the assembly process, greatly improving the overall assembly quality of the solid-state drive and reducing product failures and defect rates caused by inaccurate assembly.

[0075] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A solid state drive assembly apparatus, characterized by, The application relates to a solid state disk assembling device. The device comprises: a mounting platform (100); a feeding and conveying module (200) comprising a conveying line body (201) and a plurality of material trays (202), the conveying line body (201) is arranged on the mounting platform (100) and has a first assembly station and a second assembly station, the plurality of material trays (202) are arranged on the conveying line body (201) and can move along a conveying direction, the material trays (202) are used for placing a lower shell (0001), a PCB (0002) and an upper shell (0003) therein; a PCB assembling module (300) arranged on the mounting platform (100) and located outside the first assembly station, the PCB assembling module (300) is used for grabbing the PCB (0002) and placing the PCB (0002) in the lower shell (0001); a turnover module (400) arranged on the mounting platform (100) and located outside the second assembly station, the turnover module (400) is used for grabbing the upper shell (0003) and turning the upper shell (0003) by a certain angle; 2. The solid state hard disk assembly apparatus of claim 1, wherein, a cover combining module (500) arranged on the mounting platform (100) and located outside the second assembly station, the cover combining module (500) is used for grabbing the upper shell (0003) on the turnover module (400) and combining the upper shell (0003) to the lower shell (0001). The conveying line body (201) has a third assembly station at the end, and the solid state disk assembling device further comprises:

3. The solid state hard disk assembly apparatus of claim 2, wherein, a pressure maintaining module (600) arranged on the mounting platform (100) and located at the third assembly station, the pressure maintaining module (600) is used for maintaining the upper shell (0003) and the lower shell (0001) in a pressed state for a certain time. The pressure maintaining module (600) comprises: a gantry (601) mounted on the mounting platform (100); a pressing module (602) arranged on the gantry (601) and located above the conveying line body (201); 4. The solid state hard disk assembly apparatus of claim 2, wherein, a pressing head (603) mounted at the lower end of the pressing module (602), and the pressing module (602) can drive the pressing head (603) to ascend and descend along a first direction. The feeding and conveying module (200) further comprises: a jacking mechanism (203), the first assembly station, the second assembly station and the third assembly station of the conveying line body (201) are all provided with the jacking mechanism (203), and the jacking mechanism (203) is used for jacking up the material tray (202) from the conveying line body (201); a clamping mechanism (204), both sides of the first assembly station, the second assembly station and the third assembly station of the conveying line body (201) are provided with the clamping mechanism (204), and the two clamping mechanisms (204) arranged oppositely are used for fixing the jacked-up material tray (202).

5. The solid state hard disk assembly apparatus of claim 4, wherein, The feeding and conveying module (200) further comprises: A blocking mechanism (205) is arranged on the first assembly station, the second assembly station and the third assembly station of the conveying line body (201), and the blocking mechanism (205) can extend and block the forward movement of the tray (202).

6. The solid state hard disk assembly apparatus of claim 2, wherein, The PCB assembly module (300) comprises a first manipulator (301), a first visual guiding module (302) and a suction nozzle (303), the first visual guiding module (302) and the suction nozzle (303) are both mounted on the first manipulator (301), and the suction nozzle (303) can adsorb the PCB board (0002).

7. The solid state hard disk assembly apparatus of claim 2, wherein, The overturning module (400) comprises a translation module (401), a rotation module (402), a lifting module (403) and a clamping jaw cylinder (404), the translation module (401) is arranged on the mounting platform (100), the rotation module (402) is arranged on the translation module (401), the translation module (401) is used to drive the rotation module (402) to move in a second direction, the lifting module (403) is arranged on the rotation module (402), the rotation module (402) is used to drive the lifting module (403) to rotate, and the clamping jaw cylinder (404) is arranged on the lifting module (403), and the lifting module (403) is used to drive the clamping jaw cylinder (404) to move in a first direction.

8. The solid state hard drive assembly apparatus of claim 2, wherein, The cover closing module (500) comprises a second manipulator (501), a second visual guiding module (502) and an electric clamping jaw (503), the second visual guiding module (502) and the electric clamping jaw (503) are both mounted on the second manipulator (501), and the electric clamping jaw (503) is used to grab the overturned upper shell (0003).

9. A method of assembling a solid state drive, characterized by, The application is applied to the solid state hard disk assembly device of any one of claims 2-8 for solid state hard disk assembly, comprising the following steps: S1, the lower shell (0001), the PCB board (0002) and the upper shell (0003) are placed on each tray (202), and the feeding and conveying module (200) drives the tray (202) to move in a conveying direction; S2, the tray (202) reaches the first assembly station, the PCB assembly module (300) sucks and places the PCB board (0002) on the tray (202) in the lower shell (0001); S3, the tray (202) reaches the second assembly station, the overturning module (400) first grabs the upper shell (0003) on the tray (202) and overturns by a set angle, then the cover closing module (500) grabs the upper shell (0003) on the overturning module (400) and buckles to the lower shell (0001) on the tray (202); S4, the tray (202) reaches the third assembly station, the pressure maintaining module (600) presses the upper shell (0003) and lasts for a set time; S5, the feeding and conveying module (200) conveys the product to a discharging station.

10. The solid state hard disk assembly method of claim 9, wherein, The set angle is 180 degrees.

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