High-heat-storage cooling device based on self-feedback chemical reaction

Abstract

The invention discloses a high heat storage cooling device based on self-feedback chemical reaction, which comprises a cooling plate fixedly attached to a device to be cooled, the cooling plate is a sealed hollow cavity, a plurality of cooling fins are arranged in the cavity, gaps between adjacent cooling fins in the cavity are filled with heat storage chemical materials, and the heat storage chemical materials are filled with heat storage chemical materials. The heat storage chemical material is a chemical material which can be decomposed at a corresponding temperature to generate a gas product; the temperature sensor and the valve are connected with the control circuit; the temperature sensor is used for monitoring the temperature of the heat conduction cooling plate, and the valve is arranged on the exhaust pipeline of the hollow cavity. The heat dissipation capacity of the device can reach 200 W / cm < 2 > or above, so that the requirement for heat management during operation of high-power equipment can be met, the heat dissipation requirements of aerospace and military electronic equipment in specific application scenes with space limitation and high energy efficiency requirements can be met, and the effect of rapid heat dissipation under the low space size is achieved.

Description

Technical Field

[0001] This invention relates to a high heat storage cooling device based on a self-feedback chemical reaction. Background Technology

[0002] In the electronics industry, electronic devices often need to operate within confined spaces, such as in military, aerospace, and automotive electronic systems. Therefore, the temperature of these devices rises rapidly after a period of operation, and excessively high temperatures can damage electronic components. According to relevant research, most electronic device failures are related to unsuitable thermal environments. For every 10°C increase in temperature causing electronic device failure, its reliability is halved. Therefore, the temperature of electronic devices must be strictly controlled within a certain range to ensure their normal operation.

[0003] Physical methods are the primary means of heat dissipation. Currently, relatively mature technologies include: (1) Natural convection, which utilizes the density difference between air and fluid due to temperature differences to promote flow and thus achieve heat dissipation. This heat dissipation method does not rely on external power. (2) Forced air cooling: Utilizes airflow generated by fans or blowers to force air to flow over heat sinks (e.g., radiators, coolers, or equipment surfaces), accelerating the heat transfer process from the heat sink to the ambient air. Compared to natural convection, forced air cooling is 5 to 10 times more effective. (3) Forced liquid cooling: This system typically includes one or more pumps to drive coolant flow over heat-generating components (such as processors, reactors, etc.), collect their heat, and then transfer the heat to a heat exchanger (commonly a radiator), where the heat is released into the environment, and the coolant is cooled again before returning to the system for circulation. Compared to forced air cooling, forced liquid cooling is 6 to 10 times more effective. (4) Microchannel cooling: It consists of several tiny channels that are engraved on the surface of the radiator or inside the cooling plate, close to the components that need to dissipate heat. Coolant is pumped into these microchannels, absorbing heat as it flows in and carrying heat away as it flows out, and releasing it into the external environment through a heat exchanger. Other technologies include heat pipe cooling and spray cooling.

[0004] However, with the continuous increase in the integration and operating speed of electronic devices, the heat flux density of high-performance processors has exceeded 100 W / cm². 2 The heat dissipation capacity of the aforementioned physical methods, such as air-cooled radiators, is only 74.63 W / cm². 2 Traditional physical heat dissipation technologies have reached their limits and are no longer sufficient to meet the thermal management requirements of high-power devices. Therefore, for specific application scenarios with limited space and high energy efficiency requirements, such as aerospace and military electronic equipment, traditional physical heat dissipation technologies have reached their limits. Due to space constraints, the size of heat dissipation equipment cannot be further increased, making it difficult to further optimize heat dissipation capabilities. Summary of the Invention

[0005] Purpose of the invention: The purpose of this invention is to provide a cooling device that absorbs heat generated by high heat flux density equipment through a chemical reaction, which can effectively solve the problems of low efficiency, large size and high cost of existing heat dissipation technologies such as fan cooling, heat pipe and liquid cooling.

[0006] Technical Solution: The high heat storage cooling device based on self-feedback chemical reaction of the present invention includes a cooling plate fixedly attached to the equipment to be cooled. The cooling plate includes a sealed hollow cavity with multiple heat dissipation fins inside. The gaps between adjacent heat dissipation fins inside the cavity are filled with a heat storage chemical material, which is a chemical material that can decompose at high temperatures to generate gaseous products. The device also includes a control circuit and a temperature sensor and a valve connected to the control circuit. The temperature sensor is used to monitor the temperature of the heat-conducting cooling plate, and the valve is installed on the exhaust pipe of the hollow cavity.

[0007] The chemical materials mentioned include, but are not limited to, one of ammonium carbonate, ammonium bicarbonate, magnesium hydride, or ammonium carbamate. The relevant filling amount is mainly calculated based on the external heat dissipation requirements and combined with the heat storage density below. For example, filling 88 grams of ammonium carbonate can remove 85.69 kJ of heat. Under the initiation of external heat, the following reactions occur respectively: (NH4)2CO3→2NH3+CO2+H2O △H=85.69 KJ / mol NH4HCO3→NH3+CO2+H2O △H=86.19 KJ / mol MgH2(s)→Mg(s)+H2(g) △H=74.98 KJ / mol NH4COONH2(s)→2NH3(g)+CO2(g) △H=2010 KJ / mol The valve is either a solenoid valve or a pneumatic valve; when the valve is a solenoid valve, a pressure sensor is also provided for monitoring the air pressure inside the hollow cavity; when the valve is a pneumatic valve, the air pressure inside the hollow cavity is directly monitored by the pneumatic valve.

[0008] The cooling plate is made of a highly thermally conductive material, including but not limited to graphite, copper, aluminum, titanium, silver, or gold.

[0009] The high thermal energy storage cooling device of this invention achieves adaptive adjustment capability of the device through the pressure-temperature relationship: (1) Temperature feedback and valve linkage mechanism: When the temperature of the heat-conducting cooling plate reaches the set threshold, the temperature sensor transmits the signal to the control circuit, triggering the opening and closing action of the exhaust pipe valve: (a) When the valve is opened, the reaction gas in the hollow cavity is released through the exhaust pipe, causing the system pressure to drop, the original chemical equilibrium is broken (the equilibrium shifts to the direction of gas generation), thereby starting the endothermic reaction to continuously remove heat; (b) When the valve is closed, the pressure in the hollow cavity increases, the reaction proceeds in reverse (the equilibrium shifts to the direction of gas consumption), and the endothermic reaction terminates.

[0010] (2) Pressure threshold control mode: The system presets the pressure threshold according to the pressure-temperature relationship at chemical reaction equilibrium: (a) Overpressure trigger: When the chamber pressure exceeds the threshold, the valve automatically opens to release gas and force the reaction to proceed in the endothermic direction; (b) Low pressure protection: When the pressure is lower than the threshold, the valve closes to maintain the chamber's airtightness and terminate the endothermic reaction.

[0011] This invention relates to a self-feedback thermal energy control system based on endothermic chemical reactions, achieving efficient heat dissipation through a dual dynamic balance of temperature and pressure. When the system temperature rises, a temperature sensor triggers the exhaust pipe valve: if the pressure exceeds a threshold, the valve opens to release gases (such as NH3 and CO2 produced by the decomposition of ammonium carbamate), disrupting the original chemical equilibrium (Le Chatelier's principle), forcing the reaction to accelerate in the endothermic direction, and rapidly absorbing the instantaneous high heat flux; if the pressure falls below the threshold, the valve closes, causing the reaction to terminate in the reverse direction. Without this closed-loop control, the endothermic reaction will accelerate uncontrollably due to the temperature rise, leading to excessively rapid material consumption and the accumulation of gaseous products, which may cause overpressure in the cavity or inhibit the reaction process (reducing endothermic efficiency).

[0012] Beneficial effects: Compared with the prior art, the present invention has the following significant advantages: the heat dissipation capacity of the device of the present invention can reach 200W / cm². 2 And above, for example, ammonium bicarbonate can dissipate heat up to 300W / cm². 2 Therefore, it can meet the thermal management requirements of high-power equipment during operation, thereby solving the heat dissipation needs of aerospace and military electronic equipment in specific application scenarios with space constraints and high energy efficiency requirements, and achieving the effect of rapid heat dissipation in a small space size. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the cooling device of the present invention. Figure 2 This is a schematic diagram of the cooling plate structure. Figure 3 This is a schematic diagram showing the connection between the chip and the cooling plate; Figure 4 This is a schematic diagram showing the connection between the battery pack and the cooling plate; Figure 5This is a schematic diagram showing the connection between the laser and the cooling plate. Detailed Implementation

[0014] like Figures 1-2 As shown, the cooling plate of the cooling device of the present invention is composed of a series of stacked metal sheets (heat sinks) with flaked shapes, and also includes a base plate and a cover plate, thereby forming a cavity structure. An exhaust port for connecting to an external exhaust pipe is provided on the cover plate. Thin rectangular channels are formed between the various metal sheets and filled with reactants. When the back of the cooling plate is in close contact with the equipment to be cooled, the heat generated by the equipment can be effectively removed. An exhaust pipe is connected to the front (on the cover plate) or side of the cooling plate, and a solenoid valve is provided on the exhaust pipe. The solenoid valve is connected to a temperature controller. The temperature control circuit consists of two parts: one is a temperature measurement circuit that uses a thermocouple installed on the back of the cooling plate (the side away from the cover plate) to monitor the temperature of the back of the cooling plate in real time; the other circuit outputs an electrical signal to the solenoid valve. When the measured temperature reaches the set temperature, the solenoid valve on the exhaust pipe is opened, starting the reaction in the cooling plate. Another outlet of the exhaust pipe is connected to an exhaust gas treatment system.

[0015] When the temperature control circuit and solenoid valve are replaced with a pressure valve, a pressure valve is installed on the exhaust pipe. When the pressure valve exceeds the set value, it opens, vents the gas, and the reaction proceeds to the right, absorbing heat.

[0016] The cooling plate's primary function is to evenly conduct heat from the heat source. It features a spatial structure filled with chemical substances and consists of a base plate, heat sinks, and a cover plate. The heat sinks are made of stacked metal sheets, forming thin rectangular channels between them. Before cooling, the channels between adjacent heat sinks are filled with a reactant (one of ammonium carbonate, ammonium bicarbonate, magnesium hydride, or ammonium carbamate; these substances readily decompose at low to medium temperatures to produce gas). Thermally conductive adhesive ensures close contact between the back of the cooling plate and the equipment to be cooled. A thermocouple (temperature sensor) on the back of the cooling plate monitors the surface temperature of the equipment and is connected to the input of a temperature controller. When the measured temperature (the temperature of the equipment) reaches the set temperature, a solenoid valve opens, initiating the reaction within the cooling plate. As the reaction proceeds, the cooling plate rapidly removes the heat generated by the equipment, achieving cooling. During the cooling process, the heat conducted from the heat source is transferred through the decomposition of chemical substances. The reaction control module primarily controls the decomposition reaction, ensuring the entire system only activates when cooling is required. Its control principle is to utilize the decomposition equilibrium of a chemical reaction to establish a self-feedback system, and to autonomously control the reaction process through the self-feedback mode of the chemical reaction. Temperature control: The required start temperature of the reaction is set, and thermocouples on the cooling plate reflect the temperature of the equipment to be cooled in real time. The start and termination of the reaction are controlled by temperature control. Alternatively, pressure control: The required start pressure of the reaction is set, and pressure sensors monitor the pressure inside the cooling plate. The reaction inside the cooling plate is started and terminated by a pressure valve.

[0017] Example 1 Application of the cooling device of this invention in chip heat dissipation: Use thermally conductive adhesive to firmly attach the cooling plate to the chip, such as... Figure 3 As shown, the heat flux density of the chip is 70 W / cm². 2 The ammonium carbonate filling amount in the cooling plate is 160g. When the chip temperature reaches 60℃, the solenoid valve on the exhaust pipe is opened. When it is opened, the reaction gas in the cooling plate is discharged, which causes the reaction equilibrium to be broken. The equilibrium moves to the right, the reaction is started, and an endothermic reaction is carried out. The temperature drops rapidly. Within 2 minutes, the temperature can be immediately reduced to about 20℃. The reaction system temperature is maintained below 50℃ within 56 minutes.

[0018] Example 2 Application of the cooling device of this invention in battery pack heat dissipation: The cooling plate is tightly wrapped around the outside of the battery module, such as Figure 4As shown, the battery pack heats up at a rate of 30W. Under specific conditions, including overheating, overcharging, internal short circuits, and collisions, the internal temperature of the battery pack can rise sharply. When the battery pack temperature reaches 60°C, the solenoid valve on the exhaust pipe is opened, and the reaction gas in the cooling plate is discharged, causing the reaction equilibrium to be broken and proceeding in the forward direction, undergoing an endothermic reaction. This effectively prevents the battery from exploding due to thermal runaway. The cooling plate is filled with 160g of ammonium bicarbonate, and the temperature can be immediately reduced to about 20°C within 0.5 minutes. The reaction system temperature is maintained below 50°C within 100 minutes.

[0019] Example 3 Application of the cooling device of this invention in heat dissipation of high-power lasers: The cooling plate is designed to resemble the shape of the solid-state laser medium, and the solid-state laser medium is entirely embedded within it, such as... Figure 5 As shown, the heat flux density of the laser is 100 W / cm². 2 The cooling plate is filled with 100g of ammonium carbamate. When the laser temperature reaches 60℃, the solenoid valve on the exhaust pipe is opened, and the reaction gas in the cooling plate is discharged, which causes the reaction equilibrium to be broken and proceeds in the forward direction, carrying out an endothermic reaction. The temperature can be immediately reduced to about 20℃ within 5 minutes, and the reaction system temperature is maintained below 50℃ within 35~40 minutes.

[0020] At 1cm 3 Integrating 0.5 mol of reactant (ammonium carbamate) within the volume enables a heat flux density >150 W / cm². 2 Transient heat dissipation enables instantaneous cooling under low filler conditions, mitigating the risk of thermal runaway in electronic devices.

[0021] Comparative Example 1 In the application scenario of Example 3, 140g of phase change material paraffin is filled into the cooling plate for heat dissipation, which is suitable for a heat flux density of 100W / cm². 2 The laser was cooled from 60 degrees to 50 degrees and maintained at 50 degrees for 10 minutes.

[0022] Comparative Example 2 In the application scenario of Example 3, 140g of sodium sulfate decahydrate phase change material is filled into the cooling plate for heat dissipation, which is suitable for a heat flux density of 100W / cm². 2 The laser can be cooled from 60 degrees to 32 degrees in 10 minutes and can be maintained at 50 degrees for 22 minutes.

Claims

1. A high heat storage cooling device based on self-feedback chemical reaction, characterized in that: The cooling plate is fixedly attached to the device to be cooled, and the cooling plate is a sealed hollow cavity, and a plurality of heat dissipation fins are arranged in the cavity, and a heat storage chemical material is filled in the gap between adjacent heat dissipation fins in the cavity, and the heat storage chemical material is a chemical material capable of decomposing to generate a gaseous product at a corresponding temperature; a control circuit, a temperature sensor and a valve connected to the control circuit are further included; the temperature sensor is used to monitor the temperature of the heat-conducting cooling plate, and the valve is arranged on the exhaust pipeline of the hollow cavity.

2. The high heat storage cooling device based on self-feedback chemical reaction according to claim 1, characterized in that: The chemical material includes one of ammonium carbonate, ammonium bicarbonate, magnesium hydride or ammonium carbamate.

3. The high heat storage cooling device based on self-feedback chemical reaction according to claim 2, characterized in that: The filling amount of the chemical material is obtained by conversion according to the external heat dissipation demand and the heat storage density of different substances.

4. The high heat storage cooling device based on self-feedback chemical reaction according to claim 3, characterized in that: When the heat dissipation demand is 100 kJ, the filling amount of ammonium carbonate is not less than 100 g or the filling amount of ammonium carbamate is not less than 50 g; when the heat dissipation demand is 200 kJ, the filling amount of ammonium carbonate is not less than 200 g or the filling amount of ammonium carbamate is not less than 100 g.

5. The high heat storage cooling device based on self-feedback chemical reaction according to claim 1, characterized in that: The valve is an electromagnetic valve or an air pressure valve; when the valve is an electromagnetic valve, a pressure sensor for monitoring the air pressure in the hollow cavity is further arranged; when the valve is an air pressure valve, the air pressure in the hollow cavity is directly monitored by the air pressure valve.

6. The high heat storage cooling device based on self-feedback chemical reaction according to claim 5, characterized in that: In a temperature threshold control mode, when the temperature of the heat-conducting cooling plate reaches a set threshold, the temperature sensor transmits a signal to the control circuit to trigger the opening and closing of the valve of the exhaust pipeline: (a) the valve is opened, the reaction gas in the hollow cavity is released through the exhaust pipeline, the system pressure is reduced, the original chemical equilibrium is broken, and the endothermic reaction is started to continuously remove heat; (b) the valve is closed, the pressure in the hollow cavity is increased, the reaction is reversed, and the endothermic reaction is terminated.

7. The high heat storage cooling device based on self-feedback chemical reaction according to claim 5, characterized in that: In a pressure threshold control mode, a pressure threshold is preset according to the pressure-temperature relationship at the chemical reaction equilibrium: (a) overpressure trigger: when the cavity pressure exceeds the threshold, the valve is automatically opened to release the gas, and the reaction is forced to proceed in the endothermic direction; (b) low pressure protection: when the pressure is lower than the threshold, the valve is closed to maintain the cavity airtight, and the endothermic reaction is terminated.

8. The high heat storage cooling device based on self-feedback chemical reaction according to claim 1, characterized in that: The cooling plate is made of a high-thermal-conductivity material, including at least one of graphite, copper, aluminum, titanium, silver or gold.

9. The high heat storage cooling device based on self-feedback chemical reaction according to claim 1, characterized in that: The device to be cooled is a computer processor, a power amplifier or other high-heat-load electronic components.

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