Heat transfer device

Abstract

The embodiment of the invention discloses a heat transfer device which comprises a base body and a cover plate, the base body and the cover plate are correspondingly covered and jointly define a cavity, a liquid inlet end and a liquid outlet end which are communicated with the cavity are arranged on the base body, a plurality of turbulent flow structures are arranged in the cavity, and the turbulent flow structures are connected with the base body or / and the cover plate. The turbulent flow structure is arranged in the cavity, so that the contact surface area and turbulent flow capacity of the heat transfer device and liquid are improved, and the heat dissipation efficiency is improved; the structure is simple, the turbulent flow structure, the base body and the cover plate can be directly manufactured through the die-casting technology, the design freedom degree can be improved, and meanwhile the cost can be reduced.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and more particularly to a heat transfer device. Background Technology

[0002] As electronic components become increasingly integrated, their heat flux density increases, requiring more efficient heat sinks to meet their operating environment requirements.

[0003] Existing heat transfer devices generally consist of an aluminum base and a cover, which are connected by brazing. However, the base or cover structure is relatively complex and requires costly CNC machining or forging, which presents a problem of balancing heat dissipation efficiency and cost.

[0004] Therefore, there is an urgent need to develop a new heat transfer device to solve the problem of balancing heat dissipation efficiency and cost in existing heat transfer devices and to further improve the heat dissipation capacity of the heat transfer device. Summary of the Invention

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a heat transfer device that simplifies the structure and improves heat dissipation efficiency.

[0006] To address the aforementioned technical problems, this invention provides a heat transfer device comprising a base and a cover plate. The base and cover plate are aligned and together define a chamber. The base has an inlet and an outlet end communicating with the chamber. The chamber is provided with a flow disturbance structure, which is connected to the base and / or the cover plate.

[0007] Furthermore, if the interference flow structure is distributed in an array, the interference flow structure is one or more of the following: column, straight tooth, corrugated tooth, and interlaced straight tooth pair.

[0008] Furthermore, the disturbance flow structure is divided into upper and lower groups, which are respectively connected to the cover plate and the substrate. The upper and lower groups of disturbance flow structures are staggered and there are gaps between the disturbance flow structures.

[0009] Furthermore, gaps are provided between the bottom of the upper turbulence structure and the base, and between the top of the lower turbulence structure and the cover plate.

[0010] Furthermore, the turbulence structure and the substrate are integrally formed by die casting, and the turbulence structure and the cover plate are welded together with solder.

[0011] Furthermore, the substrate and the cover plate are welded together using solder.

[0012] Furthermore, the substrate consists of a base plate and a frame.

[0013] Furthermore, the chamber is a three-dimensional structure.

[0014] Furthermore, the cover plate is a U-shaped tube with an inlet chamber and an outlet chamber inside the base. The two ends of the cover plate are connected to the inlet chamber and the outlet chamber respectively to form a three-dimensional structure chamber.

[0015] Furthermore, the turbulence-inducing structure is located inside the cover plate.

[0016] The beneficial effects of this invention are as follows: by setting a turbulence structure in the cavity, this invention increases the contact surface area and turbulence capability between the heat transfer device and the liquid, thereby improving the heat dissipation efficiency; this invention has a simple structure, and the turbulence structure, substrate, and cover plate can be directly manufactured by die casting, which can improve design freedom and reduce costs. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the heat transfer device according to Embodiment 1 of the present invention.

[0018] Figure 2 This is a schematic diagram of the heat transfer device according to Embodiment 2 of the present invention.

[0019] Figure 3 This is a top view schematic diagram of the substrate of Embodiment 3 of the present invention.

[0020] Figure 4 This is a schematic diagram of the turbulence structure in Embodiment 4 of the present invention.

[0021] Figure 5 This is a cross-sectional schematic diagram of the heat transfer device according to Embodiment 5 of the present invention.

[0022] Figure 6 This is a cross-sectional schematic diagram of the heat transfer device according to Embodiment 6 of the present invention.

[0023] Figure 7 This is a three-dimensional structural diagram of the heat transfer device of Embodiment 7 of the present invention.

[0024] Figure 8 This is a cross-sectional schematic diagram of the heat transfer device according to Embodiment 7 of the present invention.

[0025] Figure 9 This is a bottom view of the cover plate of Embodiment 7 of the present invention.

[0026] Explanation of icon numbers 1. Substrate, 2. Cover plate, 3. Chamber, 4. Turbulence structure, 5. Solder, 6. Base plate, 7. Frame, 8. Liquid inlet end, 9. Liquid outlet end, 10. Liquid inlet chamber, 11. Liquid outlet chamber, 12. Mounting hole. Detailed Implementation

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of each component in a specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0029] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0030] Please refer to Figures 1-9 The heat transfer device of this invention includes a base and a cover plate. The base and cover plate are fitted together to define a chamber. The base has an inlet and an outlet end communicating with the chamber. The base has mounting holes for easy installation.

[0031] The chamber is equipped with a turbulent flow structure, which is connected to the substrate and / or cover plate. The turbulent flow structure increases the contact surface area between the heat transfer device and the liquid, as well as the turbulence capability, thereby improving heat dissipation efficiency.

[0032] Example 1, please refer to Figure 1 The substrate consists of a base plate and a frame, which facilitates preparation and reduces costs.

[0033] In one implementation, the disturbance flow structures are arranged in an array, and the disturbance flow structures are one or more of the following: columns, straight teeth, corrugated teeth, and pairs of interlaced straight teeth. A pair of interlaced straight teeth consists of two straight teeth that are interlaced approximately. The gaps between the disturbance flow structures form microchannels that contact the liquid, which can further increase the contact surface area between the heat transfer device and the liquid.

[0034] Example 2, please refer to Figure 2 The turbulence structure is a column.

[0035] Example 3, please refer to Figure 3 The turbulence structure consists of interlaced straight tooth pairs.

[0036] Example 4, please refer to Figure 4 The turbulence structure is a corrugated tooth.

[0037] Example 5, please refer to Figure 5The turbulence-disrupting structure and the substrate are integrally formed by die casting, and the turbulence-disrupting structure and the cover plate are welded together using solder. Preferably, the substrate and the cover plate are welded together using solder. In specific implementations, the substrate can be made of aluminum and prepared by die casting, and then connected to the cover plate by brazing, using solder pads or solder paste during brazing. The cover plate and the turbulence-disrupting structure can also be integrally prepared by die casting, and solder pads or solder paste are used during brazing to the substrate. The die casting process can be high-pressure die casting, or vacuum-assisted high-pressure die casting, or semi-solid high-pressure die casting. The substrate and the cover plate can be made of modified 1-series, 3-series, or 7-series aluminum alloys, modified by adding rare earth elements, nickel, etc., to make them suitable for the die casting process.

[0038] Example 6, please refer to Figure 6 The proposed flow disturbance structure is divided into upper and lower groups, which are connected to the cover plate and the base respectively. The upper and lower groups of flow disturbance structures are staggered and have gaps between them. Preferably, gaps are provided between the bottom of the upper group of flow disturbance structures and the base, and between the top of the lower group of flow disturbance structures and the cover plate. Multiple U-shaped gaps are formed through the upper and lower groups of flow disturbance structures, further increasing the contact surface area between the heat transfer device and the liquid.

[0039] The chamber can be a three-dimensional structure. See Example 7 for details. Figures 7-9 The cover plate is a U-shaped flat tube with an inlet chamber and an outlet chamber inside the base. Both ends of the cover plate are connected to the inlet and outlet chambers respectively, forming a sealed chamber. That is, the chamber is enclosed by the space inside the cover plate and the inlet and outlet chambers within the base. Preferably, the turbulence-inducing structure is located inside the cover plate.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat transfer device, comprising a base and a cover plate, wherein the base and the cover plate, when aligned, jointly define a chamber, characterized in that, The substrate has an inlet end and an outlet end that communicate with the chamber. The chamber has a flow disturbance structure that is connected to the substrate and / or the cover plate.

2. The heat transfer device as described in claim 1, characterized in that, If the interference flow structure is distributed in an array, the interference flow structure is one or more of the following: column, straight tooth, corrugated tooth, or interlaced straight tooth pair.

3. The heat transfer device as described in claim 1, characterized in that, The disturbance flow structure is divided into upper and lower groups. The upper and lower groups of disturbance flow structures are connected to the cover plate and the base respectively. The upper and lower groups of disturbance flow structures are staggered and there are gaps between the disturbance flow structures.

4. The heat transfer device as described in claim 3, characterized in that, There are gaps between the bottom of the upper turbulence structure and the base, and between the top of the lower turbulence structure and the cover plate.

5. The heat transfer device as described in claim 1, characterized in that, The turbulence structure and the substrate are integrally formed by die casting, and the turbulence structure and the cover plate are welded together with solder.

6. The heat transfer device as described in claim 1, characterized in that, The substrate and the cover plate are welded together using solder.

7. The heat transfer device as described in claim 1, characterized in that, The base consists of a base plate and a frame.

8. The heat transfer device as described in claim 1, characterized in that, The chamber is a three-dimensional structure.

9. The heat transfer device as described in claim 8, characterized in that, The cover plate is a U-shaped tube with an inlet chamber and an outlet chamber inside the base. The two ends of the cover plate are connected to the inlet chamber and the outlet chamber respectively to form a three-dimensional structure chamber.

10. The heat transfer device as claimed in claim 9, characterized in that, The turbulence-inducing structure is located inside the cover plate.

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