Conductive foam tape with high cohesion, high shielding performance and low resistance, preparation method of conductive foam tape and electronic product

Abstract

The invention provides a conductive foam tape with high cohesion, high shielding performance and low resistance, a preparation method of the conductive foam tape and an electronic product, and relates to the field of electronic materials. The conductive foam adhesive tape comprises a first conductive adhesive layer, a conductive foam layer, a hot melt adhesive layer, a conductive cloth layer and a second conductive adhesive layer which are sequentially stacked; the raw materials of the first conductive adhesive layer comprise matrix resin and inorganic conductive filler; the raw material of the conductive foam layer comprises porous polyurethane foam subjected to nickel plating treatment; the raw material of the hot melt adhesive layer comprises polyurethane; the raw material of the conductive cloth layer comprises polyethylene glycol terephthalate fibers subjected to copper plating and nickel plating treatment; the second conductive adhesive layer is prepared from the following raw materials: an acrylate compound, tackifying resin, a cross-linking agent and nickel powder. Through the design of a multi-layer composite structure and in combination with a special sprayable conductive adhesive treatment process, excellent electromagnetic shielding effectiveness and mechanical strength are realized.

Description

Technical Field

[0001] This application relates to the field of electronic materials, and in particular to a conductive foam tape with high cohesion, high shielding performance and low resistance, its preparation method and electronic products. Background Technology

[0002] With the development of electronic devices, the demand for high-performance electromagnetic shielding materials is increasing. While traditional metal shielding is effective, it suffers from problems such as heavy weight and difficult processing. Conductive foam, as a novel material, has attracted attention due to its flexibility and adaptability, but faces challenges in practical applications such as insufficient cohesion and susceptibility to debris generation.

[0003] Therefore, it is necessary to develop a conductive foam tape that has both good electromagnetic shielding performance and excellent mechanical strength. Summary of the Invention

[0004] The purpose of this application is to provide a conductive foam tape with high cohesion, high shielding performance, and low resistance, as well as its preparation method and electronic products, to solve the above-mentioned problems.

[0005] To achieve the above objectives, the first aspect of this application provides a conductive foam tape with high cohesion, high shielding performance, and low resistance, comprising a first conductive adhesive layer, a conductive foam layer, a hot melt adhesive layer, a conductive cloth layer, and a second conductive adhesive layer stacked sequentially. The raw materials for the first conductive adhesive layer include a matrix resin and inorganic conductive fillers; The conductive foam layer is made of nickel-plated porous polyurethane foam. The raw material for the hot melt adhesive layer includes polyurethane; The raw material of the conductive fabric layer includes polyethylene terephthalate fibers that have been treated with copper and nickel plating. The raw materials for the second conductive adhesive layer include acrylate compounds, tackifying resins, crosslinking agents, and nickel powder.

[0006] Optionally, the thickness of the conductive foam layer is 0.6-5 mm; And / or, the thickness of the hot melt adhesive layer is 10-60 μm; And / or, the thickness of the conductive cloth layer and the second conductive adhesive layer are each independently 20-100 μm; The thickness of the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape is 0.1-5mm. And / or, the high cohesive, high shielding performance, and low resistance conductive foam tape has a steel plate peel force of 2-8 N / cm at 25°C. And / or, the thickness of the first conductive adhesive layer is 0.001-0.005 mm.

[0007] Optionally, the acrylate compound includes one or more of butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, and hydroxyethyl acrylate; And / or, the crosslinking agent includes one or more of polyfunctional isocyanates, aziridine, and epoxysilanes; And / or, the tackifying resin includes one or more of rosin esters, petroleum resins, and terpene phenolic resins; And / or, the raw materials of the second conductive adhesive layer, by weight, include: Acrylic ester 8-13 parts, tackifying resin 2-6 parts, crosslinking agent 0.2-1.2 parts, nickel powder 0.5-2.5 parts.

[0008] Optionally, the matrix resin includes silane-terminated polyether; Optionally, the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape may contain one or more of the following inorganic conductive fillers: conductive ions, nickel powder, silver-coated copper powder, and nano-carbon materials. It should be noted that carbon nanomaterials are used to construct long-range conductive networks; And / or, the mass of the inorganic conductive filler is 15-30% of the solid content of the matrix resin.

[0009] Optionally, the inorganic conductive filler includes nickel powder surface-treated with a silane coupling agent; And / or, the nickel powder comprises spherical shapes; And / or, the particle size of the nickel powder is 1-10 μm.

[0010] Optionally, the conductive ions include quaternary ammonium salt antistatic agents; And / or, the nanomaterials include carbon nanotubes and / or graphene.

[0011] A second aspect of this application provides a method for preparing the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape, comprising: The raw materials of conductive foam layer, hot melt adhesive layer and conductive cloth layer are stacked in sequence, and the first heating and bonding and heating and pressing treatment are carried out to obtain the first semi-finished product. The conductive foam layer in the first semi-finished product is sprayed with the raw material of the first conductive adhesive layer on the side away from the hot melt adhesive layer, and then cured to obtain the second semi-finished product. The raw material of the second conductive adhesive layer is applied to the surface of the second conductive adhesive layer away from the conductive cloth layer in the second semi-finished product, and then subjected to a second heating and bonding process to obtain the conductive foam tape with high cohesion, high shielding performance and low resistance.

[0012] Optionally, the spraying amount is 10-35 g / m². 2 ; And / or, the relative humidity of the curing process is 40-60%, the temperature is 25-80℃, and the time is 8-15 min; And / or, the temperature of the first heating bonding is 110-135℃, the pressure is 0.4-0.7 MPa, and the linear speed is 3-5 m / min; And / or, the temperature of the heating and pressurizing treatment is 200-250℃, and the pressure is 5-10MPa; And / or, the temperature of the second heating bonding is 110-130℃, and the pressure is 0.4-0.6 MPa.

[0013] A third aspect of this application provides an electronic product comprising the aforementioned high-cohesion, high-shielding-performance, and low-resistance conductive foam tape.

[0014] Compared with the prior art, the beneficial effects of this application include: The high-cohesion, high-shielding-performance, and low-resistance conductive foam tape provided in this application achieves excellent electromagnetic shielding effectiveness and mechanical strength through a multi-layer composite structure design combined with a special sprayable conductive adhesive treatment process. By spraying a moisture-curing organic-inorganic composite conductive adhesive (first conductive adhesive layer) onto the surface of nickel-plated porous polyurethane foam, and utilizing its penetration and in-situ cross-linking in the microporous structure of the conductive foam layer, the material's cohesion, conductivity, and anti-shedding performance are synergistically improved.

[0015] The method for preparing high-cohesion, high-shielding-performance, and low-resistance conductive foam tape provided in this application is simple to operate and the raw materials are readily available. In the spraying process, the raw material of the first conductive adhesive layer is uniformly covered on the surface of the conductive foam in the form of atomized droplets and partially penetrates its three-dimensional porous structure. The curing process does not require an external heat source or metal catalyst, which is energy-saving and environmentally friendly. Moreover, the elastic network formed after curing has excellent cohesive strength and fatigue resistance, and is particularly suitable for the continuous production of flexible electronic materials.

[0016] The electronic products provided in this application improve electromagnetic compatibility, enhance signal integrity, effectively shield interference, and ensure reliable grounding, thereby improving equipment stability and reliability. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope of this application.

[0018] Figure 1 This is a schematic diagram of the conductive foam tape structure with high cohesion, high shielding performance, and low resistance provided in Example 1.

[0019] Explanation of key component symbols: 100 - First conductive adhesive layer; 200 - Conductive foam layer; 300 - Hot melt adhesive layer; 400 - Conductive cloth layer; 500 - Second conductive adhesive layer; 600 - Release layer. Detailed Implementation

[0020] First, the solution provided in this application will be explained in more detail as follows: The first aspect of this application provides a conductive foam tape with high cohesion, high shielding performance and low resistance, comprising a first conductive adhesive layer, a conductive foam layer, a hot melt adhesive layer, a conductive cloth layer and a second conductive adhesive layer stacked in sequence. The raw materials for the first conductive adhesive layer include a matrix resin and inorganic conductive fillers; The conductive foam layer is made of nickel-plated porous polyurethane foam. The raw material for the hot melt adhesive layer includes polyurethane; The raw material of the conductive fabric layer includes polyethylene terephthalate fibers that have been treated with copper and nickel plating. The raw materials for the second conductive adhesive layer include acrylate compounds, tackifying resins, crosslinking agents, and nickel powder.

[0021] It should be noted that the first conductive adhesive layer can enhance the cohesion of the conductive foam layer and reduce the shedding phenomenon. After the conductive foam layer is heated and pressurized, it may break, producing plating or foam debris that is easy to fall off. The first conductive adhesive layer is sprayed on the foam surface and will penetrate into the foam surface. After curing, the plating or foam debris will be fixed between the foam layers, thereby improving foam shedding. It should also be noted that the selection and proportion of materials for each layer can be adjusted according to actual application needs to meet different thickness and performance requirements.

[0022] In some embodiments, the thickness of the conductive foam layer is 0.6-5 mm; Optionally, the thickness of the conductive foam layer can be any value between 0.6 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, or 0.6-5 mm. And / or, the thickness of the hot melt adhesive layer is 10-60 μm; Optionally, the thickness of the hot melt adhesive layer can be any value between 10μm, 20μm, 30μm, 40μm, 50μm, 60μm or 10-60μm; And / or, the thickness of the conductive cloth layer and the second conductive adhesive layer are each independently 20-100 μm; Optionally, the thickness of the conductive cloth layer and the second conductive adhesive layer can be independently 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm or any value between 20-100μm; The thickness of the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape is 0.1-5mm. Optionally, the thickness of the conductive foam tape with high cohesion, high shielding performance, and low resistance can be 0.1mm, 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, or any value between 0.1mm and 5mm. And / or, the high cohesive, high shielding performance, and low resistance conductive foam tape has a steel plate peel force of 2-8 N / cm at 25°C. Optionally, the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape can have a steel plate peel force of 2 N / cm, 3 N / cm, 4 N / cm, 5 N / cm, 6 N / cm, 7 N / cm, 8 N / cm, or any value between 2 and 8 N / cm at 25°C.

[0023] And / or, the thickness of the first conductive adhesive layer is 0.001-0.005 mm.

[0024] Optionally, the thickness of the first conductive adhesive layer can be any value between 0.001 mm, 0.002 mm, 0.003 mm, 0.004 mm, 0.005 mm, or 0.001-0.005 mm.

[0025] In some embodiments, the acrylate compound includes one or more of butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, and hydroxyethyl acrylate; And / or, the crosslinking agent includes one or more of polyfunctional isocyanates, aziridine, and epoxysilanes; And / or, the tackifying resin includes one or more of rosin esters, petroleum resins, and terpene phenolic resins; And / or, the raw materials of the second conductive adhesive layer, by weight, include: Acrylic ester 8-13 parts, tackifying resin 2-6 parts, crosslinking agent 0.2-1.2 parts, nickel powder 0.5-2.5 parts.

[0026] Optionally, the raw materials of the second conductive adhesive layer, by weight, may be: 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts or any value between 8 and 13 parts of acrylate; 2 parts, 3 parts, 4 parts, 5 parts, 6 parts or any value between 2 and 6 parts of tackifying resin; 0.2 parts, 0.4 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts or any value between 0.2 and 1.2 parts of crosslinking agent; and 0.5 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts or any value between 0.5 and 2.5 parts of nickel powder.

[0027] It is important to note that the adhesive of the second conductive layer bonds and secures the tape to the substrate. The conductive particles within the adhesive create vertical and horizontal conductive channels, giving the conductive foam tape an overall structure capable of conducting electricity in all directions. In application scenarios, this satisfies the need for vertical or planar conductivity or cushioning.

[0028] In some embodiments, the matrix resin comprises silane-terminated polyether; It is important to note that the molecular chains of silane-terminated polyethers contain alkoxysilane functional groups (such as -Si(OMe)3 or -Si(OEt)3) at their ends. These functional groups undergo hydrolysis in the presence of trace amounts of moisture in the air to generate silanols (-Si(OH)3). Subsequently, the silanols further condense to form a stable Si-O-Si three-dimensional cross-linked network, achieving rapid curing at room temperature. The general reaction formula is as follows: R–Si(OR')3+ H2O → R–Si(OH)3+ R'OH; 2 R–Si(OH)3→ R–Si(OH)2–O–Si(OH)2–R + H2O; And / or, the number average molecular weight of the matrix resin is 8000-12000.

[0029] And / or, the number average molecular weight of the matrix resin is 8000-12000.

[0030] Optionally, the number average molecular weight of the matrix resin can be 8000, 9000, 10000, 11000, 12000 or any value between 8000 and 12000.

[0031] In some embodiments, the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape contains inorganic conductive fillers including one or more of conductive ions, nickel powder, silver-coated copper powder, and nano-carbon materials. And / or, the mass of the inorganic conductive filler is 60-80% of the solid content of the matrix resin.

[0032] Optionally, the mass of the inorganic conductive filler can be any value between 60%, 70%, 80%, or 60-80% of the solid content of the matrix resin.

[0033] In some embodiments, the inorganic conductive filler comprises nickel powder surface-treated with a silane coupling agent; It should be noted that the surface of the metal conductive powder in the inorganic conductive filler is treated with silane coupling agents such as γ-aminopropyltriethoxysilane to enhance the interfacial bonding force with the resin matrix. And / or, the nickel powder comprises spherical shapes; And / or, the particle size of the nickel powder is 1-10 μm.

[0034] Optionally, the particle size of the nickel powder can be 1μm, 2μm, 4μm, 6μm, 8μm, 10μm or any value between 1 and 10μm.

[0035] In some embodiments, the conductive ions include quaternary ammonium salt antistatic agents; In some embodiments, quaternary ammonium salt antistatic agents include hexadecyltrimethylammonium bromide; conductive ions provide ionic conductivity pathways; And / or, the nanomaterials include carbon nanotubes and / or graphene.

[0036] A second aspect of this application provides a method for preparing the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape, comprising: The raw materials of conductive foam layer, hot melt adhesive layer and conductive cloth layer are stacked in sequence, and the first heating and bonding and heating and pressing treatment are carried out to obtain the first semi-finished product. The conductive foam layer in the first semi-finished product is sprayed with the raw material of the first conductive adhesive layer on the side away from the hot melt adhesive layer, and then cured to obtain the second semi-finished product. The raw material of the second conductive adhesive layer is applied to the surface of the second conductive adhesive layer away from the conductive cloth layer in the second semi-finished product, and then subjected to a second heating and bonding process to obtain the conductive foam tape with high cohesion, high shielding performance and low resistance.

[0037] In some embodiments, the spraying amount is 10-35 g / m². 2 ; Optionally, the spraying amount can be 10 g / m². 2 15 g / m 2 20 g / m 2 25 g / m 2 30 g / m 2 35 g / m 2 Or 10-35 g / m 2 Any value between; And / or, the relative humidity of the curing process is 40-60%, the temperature is 25-80℃, and the time is 8-15 min; Optionally, the relative humidity of the curing process can be any value between 40%, 50%, 60% or 40-60%, the temperature can be any value between 25℃, 30℃, 40℃, 50℃, 60℃, 70℃, 80℃ or 25-80℃, and the time can be any value between 8min, 9min, 10min, 11min, 12min, 13min, 14min, 15min or 8-15min; It is important to note that during the curing process, rapid cross-linking and curing are achieved with the help of moisture in the air. During the curing process, the resin network "anchors" the foam fiber skeleton, forming a mechanically interlocked structure, which significantly improves the overall cohesion of the material. At the same time, the spherical nickel powders form an efficient electron transport path through point contact, which, together with the conductive ion migration mechanism, achieves extremely low contact resistance. And / or, the temperature of the first heating bonding is 110-135℃, the pressure is 0.4-0.7 MPa, and the linear speed is 3-5 m / min; Optionally, the temperature of the first heating bonding can be any value between 110℃, 120℃, 130℃, 135℃ or 110-135℃, and the pressure can be any value between 0.4 MPa, 0.5 MPa, 0.6 MPa, 0.7 MPa or 0.4-0.7 MPa; And / or, the temperature of the heating and pressurizing treatment is 200-250℃, and the pressure is 5-10MPa; Optionally, the temperature for the heating and pressurizing treatment can be any value between 200℃, 210℃, 220℃, 230℃, 240℃, 250℃ or 200-250℃, and the pressure can be any value between 5MPa, 6 MPa, 7 MPa, 8MPa, 9 MPa, 10MPa or 5-10MPa. And / or, the temperature of the second heating bonding is 110-130℃, and the pressure is 0.4-0.6 MPa.

[0038] Optionally, the temperature of the second heating bonding can be any value between 110℃, 120℃, 130℃ or 110-130℃, and the pressure can be any value between 0.4 MPa, 0.5 MPa, 0.6 MPa or 0.4-0.6 MPa.

[0039] It should be noted that this application breaks through the performance bottleneck of traditional conductive foam tapes in terms of "high shielding effectiveness" and "high structural strength" through a three-in-one technical approach of "moisture-triggered crosslinking + microporous infiltration curing + multi-scale conductive network construction".

[0040] A third aspect of this application provides an electronic product comprising the aforementioned high-cohesion, high-shielding-performance, and low-resistance conductive foam tape.

[0041] The implementation schemes of this application will be described in detail below with reference to specific embodiments. However, those skilled in the art will understand that the following embodiments are only for illustrating this application and should not be regarded as limiting the scope of this application. Unless otherwise specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments used without specified manufacturers are all conventional products that can be purchased commercially.

[0042] Example 1 This embodiment provides a conductive foam tape with high cohesion, high shielding performance, and low resistance, comprising a first conductive adhesive layer 100, a conductive foam layer 200, a hot melt adhesive layer 300, a conductive fabric layer 400, a second conductive adhesive layer 500, and a release layer 600, which are sequentially stacked. The structure of this conductive foam tape with high cohesion, high shielding performance, and low resistance is as follows: Figure 1 As shown; Conductive foam layer 200: The substrate is made of nickel-plated porous polyurethane foam (purchased from Shenzhen Daxin Technology Co., Ltd.), with a thickness of 0.613mm. Hot melt adhesive layer 300: Bonded using polyurethane hot melt adhesive (purchased from Shanghai Xingxia Polymer Products Co., Ltd.), with a thickness of 32μm; Conductive fabric layer 400: Made of copper-plated and nickel-plated polyethylene terephthalate fiber (purchased from Guangdong Taikun New Material Technology Co., Ltd.), with a thickness of 50μm; Second conductive adhesive layer 500: Raw materials, by weight, include: The composition includes 11.5 parts of acrylate (butyl acrylate and 2-ethylhexyl acrylate in a 1:1 mass ratio), 2-6 parts of tackifying resin (polymerized rosin and rosin glycerol ester in a 1:1 mass ratio), 0.6 parts of crosslinking agent (isocyanate), and 1.5 parts of nickel powder, with a thickness of 45 μm. Release layer 600: Uses 0.12mm double-plastic double-silicone release paper; The first conductive adhesive layer 100 comprises a matrix resin and an inorganic conductive filler. The matrix resin is a polyether-type MS Polymer (purchased from Hubei Jianghan New Material Co., Ltd.) with methoxysilane-terminated ends and a number average molecular weight of 10,000. The conductive filler is spherical nickel powder (average particle size 5 μm, purchased from Nangong Dinghong Metal Material Co., Ltd.) surface-treated with a silane coupling agent. The amount added is 70 wt% of the solid content of the matrix resin, and 1.5 wt% of a quaternary ammonium salt conductive ion additive is added. The thickness is 5 μm. After the final bonding conductive adhesive process, the thickness of the first conductive adhesive layer is 2 μm.

[0043] The viscosity of this conductive foam tape is 6 N / cm.

[0044] The second aspect of this embodiment provides a method for preparing a conductive foam tape with high cohesion, high shielding performance, and low resistance. The specific steps are as follows: S1: The conductive cloth and hot melt adhesive are initially heated and bonded together to form semi-finished product 1. The temperature is 120℃, the pressure is 0.5MPa, and the linear speed is 4 m / min. S2: The semi-finished product 1 is heated and bonded with conductive foam to form the semi-finished product 2 at a temperature of 120℃ and a pressure of 0.6 MPa. S3: The semi-finished product 2 is heated and pressurized at a temperature of 130℃ and a pressure of 0.8Mpa to obtain the semi-finished product 3; S4: Apply an additional conductive adhesive layer to the surface of the conductive foam in semi-finished product 3 using an air spray gun, with the coating amount controlled at 15 g / m². 2 The semi-finished product is cured at an ambient humidity of 50% using hot air at 80°C for 3 minutes. The semi-finished product 3 and the conductive adhesive are then heated and bonded together at 120°C and 0.5 MPa to form the finished product. After multiple heating and pressurizing processes, the thickness of the finished product ranges from 0.617 to 0.632 mm.

[0045] Example 2 The difference from Example 1 is that no quaternary ammonium salt conductive ion additives are added.

[0046] Example 3 The difference from Example 1 is that the amount of spherical nickel powder added is 40 wt% of the solid content of the matrix resin.

[0047] Comparative Example 1 The difference from Example 1 is that the first conductive adhesive layer is not provided.

[0048] Comparative Example 2 The difference from Example 1 is that no inorganic conductive filler is added to the first conductive adhesive layer.

[0049] Comparative Example 3 The difference from Example 1 is that the relative humidity of the curing process is 20-35%.

[0050] The conductive foam tapes prepared in the above embodiments and comparative examples were tested, and the specific test results are shown in Table 1.

[0051] Test method description: Shielding effectiveness: Tested according to GB / T 30142-2013 "Measurement Method of Shielding Effectiveness of Planar Electromagnetic Shielding Materials", with a frequency range of 30 MHz-3 GHz, and the data is taken as the shielding value at 1 GHz.

[0052] Vertical resistance and bridging resistance: Surface resistance and interlayer conductivity were tested according to GB / T 24342-2009 "Test Method for Resistivity of Conductive and Antistatic Fibers" or IPC-TM-650 2.4.14. The four-probe method was used for measurement, with a voltage of 1 V and a time of 10 s.

[0053] Table 1 Test Results

[0054] analyze: Based on the above tests, it can be seen that when the first conductive adhesive layer is retained and Ni powder is filled with 60-80 wt% and quaternary ammonium salt is added, the vertical resistance is ≤3 mΩ, the shielding is ≥80 dB, and the shedding level is 0. If one layer is missing or the filling is reduced, the resistance jumps by 10 times, the shielding drops by 15 dB, and the cohesion and anti-shedding fail. This confirms that "spraying-penetration-anchoring" is a core essential feature of this application and cannot be omitted.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0056] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, any of the claimed embodiments can be used in any combination. The information disclosed in this background section is intended only to enhance the understanding of the general background of this application and should not be construed as an admission or in any way implying that such information constitutes prior art known to those skilled in the art.

Claims

1. A conductive foam tape with high cohesion, high shielding performance, and low resistance, characterized in that, It includes a first conductive adhesive layer, a conductive foam layer, a hot melt adhesive layer, a conductive cloth layer, and a second conductive adhesive layer, which are stacked in sequence. The raw materials for the first conductive adhesive layer include a matrix resin and inorganic conductive fillers; The conductive foam layer is made of nickel-plated porous polyurethane foam. The raw material for the hot melt adhesive layer includes polyurethane; The raw material of the conductive fabric layer includes polyethylene terephthalate fibers that have been treated with copper and nickel plating. The raw materials for the second conductive adhesive layer include acrylate compounds, tackifying resins, crosslinking agents, and nickel powder.

2. The conductive foam tape with high cohesion, high shielding performance, and low resistance according to claim 1, characterized in that, The thickness of the conductive foam layer is 0.6-5mm; And / or, the thickness of the hot melt adhesive layer is 10-60 μm; And / or, the thickness of the conductive cloth layer and the second conductive adhesive layer are each independently 20-100 μm; The thickness of the high-cohesion, high-shielding-performance, and low-resistance conductive foam tape is 0.1-5mm. And / or, the high cohesive, high shielding performance, and low resistance conductive foam tape has a steel plate peel force of 2-8 N / cm at 25°C. And / or, the thickness of the first conductive adhesive layer is 0.001-0.005 mm.

3. The conductive foam tape with high cohesion, high shielding performance, and low resistance according to claim 1, characterized in that, The acrylate compounds include one or more of butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, and hydroxyethyl acrylate; And / or, the crosslinking agent includes one or more of polyfunctional isocyanates, aziridine, and epoxysilanes; And / or, the tackifying resin includes one or more of rosin esters, petroleum resins, and terpene phenolic resins; And / or, the raw materials of the second conductive adhesive layer, by weight, include: Acrylic ester 8-13 parts, tackifying resin 2-6 parts, crosslinking agent 0.2-1.2 parts, nickel powder 0.5-2.5 parts.

4. The conductive foam tape with high cohesion, high shielding performance, and low resistance according to claim 1, characterized in that, The matrix resin includes silane-terminated polyether; And / or, the number average molecular weight of the matrix resin is 8000-12000.

5. The conductive foam tape with high cohesion, high shielding performance, and low resistance according to any one of claims 1-4, characterized in that, The inorganic conductive filler includes one or more of conductive ions, nickel powder, silver-coated copper powder, and nano-carbon materials. And / or, the mass of the inorganic conductive filler is 60-80% of the solid content of the matrix resin.

6. The conductive foam tape with high cohesion, high shielding performance, and low resistance according to claim 5, characterized in that, The inorganic conductive filler includes nickel powder that has been surface-treated with a silane coupling agent; And / or, the nickel powder comprises spherical shapes; And / or, the particle size of the nickel powder is 1-10 μm.

7. The conductive foam tape with high cohesion, high shielding performance, and low resistance according to claim 5, characterized in that, The conductive ions include quaternary ammonium salt antistatic agents; And / or, the nanomaterials include carbon nanotubes and / or graphene.

8. A method for preparing a conductive foam tape with high cohesion, high shielding performance, and low resistance as described in any one of claims 1-7, characterized in that, include: The raw materials of conductive foam layer, hot melt adhesive layer and conductive cloth layer are stacked in sequence, and the first heating and bonding and heating and pressing treatment are carried out to obtain the first semi-finished product. The conductive foam layer in the first semi-finished product is sprayed with the raw material of the first conductive adhesive layer on the side away from the hot melt adhesive layer, and then cured to obtain the second semi-finished product. The raw material of the second conductive adhesive layer is applied to the surface of the second conductive adhesive layer away from the conductive cloth layer in the second semi-finished product, and then subjected to a second heating and bonding process to obtain the conductive foam tape with high cohesion, high shielding performance and low resistance.

9. The method for preparing the high-cohesion, high-shielding-performance, low-resistance conductive foam tape according to claim 8, characterized in that, The spraying amount is 10-35 g / m². 2 ; And / or, the relative humidity of the curing process is 40-60%, the temperature is 25-80℃, and the time is 8-15 min; And / or, the temperature of the first heating bonding is 110-135℃, the pressure is 0.4-0.7 MPa, and the linear speed is 3-5 m / min; And / or, the temperature of the heating and pressurizing treatment is 200-250℃, and the pressure is 5-10MPa; And / or, the temperature of the second heating bonding is 110-130℃, and the pressure is 0.4-0.7 MPa.

10. An electronic product, characterized in that, The conductive foam tape with high cohesion, high shielding performance and low resistance as described in any one of claims 1-7.

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