Auxiliary leveling device, process chamber and leveling method of spraying plate

Abstract

The invention discloses an auxiliary leveling device, a process chamber and a leveling method of a spraying plate. The auxiliary leveling device comprises a corrugated pipe which is movably and axially abutted between a cavity and an upper flat plate, and the lower layer of the upper flat plate is connected with a spraying plate; the distance measuring tool is placed on the leveled heating disc and is used for acquiring a plurality of initial distance values from the surface of the heating disc to the spraying plate above the heating disc; the first adjusting screw is axially screwed into the upper flat plate, and the distance between the upper flat plate and the cavity is locally adjusted by adjusting the number of turns of rotation of the first adjusting screw; and the processor is configured to determine the target number of rotation turns of the first adjusting screw according to the difference of the multiple initial distance values so as to adjust the spraying plate and the heating disc to be relatively parallel based on the target number of rotation turns. The device is simple in structure and convenient to operate, the parallelism between the spraying plate and the heating disc is improved, meanwhile, the vacuum degree in the cavity can be ensured, the uniformity of the process effect is improved, and the product yield can be integrally improved.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor manufacturing, specifically to an auxiliary leveling device, a process chamber, a leveling method for a spray plate, and a computer-readable storage medium. Background Technology

[0002] In semiconductor equipment, discrepancies in the parallelism between the spray plate and the heating plate can lead to a mismatch between heating uniformity and spray coverage. For example, if the local gap between the spray plate and the heating plate is too large, the process gas sprayed in that area may not effectively contact the surface of the heating plate due to the excessive distance. Conversely, if the local gap between the spray plate and the heating plate is too small, the process gas may easily accumulate within that gap.

[0003] As semiconductor process nodes advance, the requirements for thin film deposition thickness are decreasing, leading to increasingly stringent standards for film uniformity. If process gases are scarce or abundant in certain areas, it will affect the uniformity of the deposited film thickness on the wafer surface, resulting in poor uniformity. Furthermore, due to equipment hardware tolerances, there is usually a certain degree of parallelism difference between the spray plate and the heating plate, thus affecting the process results.

[0004] Furthermore, in existing technologies, the adjustment mechanism for leveling the spray plate is not only structurally complex and cumbersome to operate, but also fails to adequately consider the airtightness requirements of the cavity during the leveling process, leading to a disruption of the cavity's vacuum. Once the cavity vacuum is disrupted, impurities in the air can enter, causing chip surface contamination and reduced film purity. Additionally, process gas diffusion is hindered, and pressure distribution becomes uneven, all of which contribute to poor uniformity of the process results. Therefore, disruption of the cavity vacuum during adjustment can trigger a series of problems, including process failure, chip defects, abnormal device performance, and even device scrapping.

[0005] To address the aforementioned problems in the prior art, there is an urgent need in the field for an improved auxiliary leveling device that is not only simple in structure and easy to operate, but also ensures the vacuum level in the cavity while improving the parallelism between the spray plate and the heating plate. This not only enhances the uniformity of the process effect and helps to improve the uniformity of the deposited film, but also improves the overall product yield. Summary of the Invention

[0006] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0007] To overcome the aforementioned deficiencies in the prior art, the present invention provides an auxiliary leveling device, a process chamber, a leveling method for a spray plate, and a computer-readable storage medium. These devices are not only simple in structure and easy to operate, but also improve the parallelism between the spray plate and the heating plate while ensuring the vacuum level within the chamber. This not only enhances the uniformity of the process effect and helps improve the uniformity of the deposited film, but also improves the overall product yield.

[0008] Specifically, the auxiliary leveling device according to the first aspect of the present invention includes: a bellows movably abutting axially between a cavity and an upper plate, wherein a spray plate is connected to the lower layer of the upper plate; a distance measuring fixture placed on a leveled heating plate for acquiring a plurality of initial distance values ​​between the surface of the heating plate and the spray plate above it; a first adjusting screw axially screwed into the upper plate, wherein the distance between the upper plate and the cavity is locally adjusted by adjusting the number of rotations of the first adjusting screw; and a processor configured to: determine a target number of rotations of the first adjusting screw based on the difference between the plurality of initial distance values, so as to adjust the spray plate and the heating plate to be relatively parallel based on the target number of rotations.

[0009] Furthermore, the process chamber provided according to the second aspect of the present invention includes: a spray plate disposed above the process chamber for introducing process gas downwards; a heating plate disposed within the process chamber for supporting a wafer; and the auxiliary leveling device provided in the first aspect of the present invention for adjusting the spray plate and the heating plate to be relatively parallel before performing process processing within the process chamber.

[0010] Furthermore, the leveling method for the spray plate provided in the third aspect of the present invention is implemented via the auxiliary leveling device provided in the first aspect of the present invention. The leveling method includes the following steps: obtaining multiple initial distance values ​​between the leveled heating plate surface and the spray plate above it via a distance measuring fixture; determining a target number of rotations of the first adjusting screw based on the difference between the multiple initial distance values; and rotating the first adjusting screw to the target number of rotations to bring the spray plate and the heating plate into relative parallelism.

[0011] Furthermore, according to a fourth aspect of the present invention, a computer-readable storage medium is provided having computer instructions stored thereon. When the computer instructions are executed by a processor, the leveling method for the spray plate described above, as provided in the third aspect of the present invention, is implemented. Attached Figure Description

[0012] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0013] Figure 1 A schematic diagram of the structure of a process chamber provided according to some embodiments of the present invention is shown.

[0014] Figure 2 A schematic diagram of the structure of a heating plate provided according to some embodiments of the present invention is shown.

[0015] Figure 3 A flowchart of a method for leveling a spray plate according to some embodiments of the present invention is shown.

[0016] Figure label:

[0017] 100 process chambers;

[0018] 101 cavities;

[0019] 110 spray plate;

[0020] 111 on a tablet;

[0021] 120 heating plate;

[0022] 121 Second adjusting screw;

[0023] 130 corrugated pipe;

[0024] 140 ranging fixture;

[0025] 150 First Adjusting Screw;

[0026] 151 Fastening screw;

[0027] 160 sealing ring;

[0028] 170 level inspection fixture;

[0029] Steps S310~S330 Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0033] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0034] As mentioned above, due to the existence of machine hardware tolerances, there is usually a certain degree of parallelism difference between the spray plate and the heating plate, which affects the process effect. Furthermore, in the existing technology, the adjustment mechanism for leveling the spray plate is not only complex in structure and cumbersome in operation, but also lacks consideration for the airtightness requirements of the cavity during the leveling process, resulting in the disruption of the cavity vacuum. Once the cavity vacuum is disrupted, not only will impurities in the air enter the cavity, causing chip surface contamination and reduced film purity, but the diffusion of process gases will also be hindered, and the pressure distribution will be uneven, leading to poor uniformity of the process results. Therefore, disruption of the cavity vacuum during the adjustment process can cause a series of problems such as process failure, chip defects, abnormal device performance, and even scrapping.

[0035] To address the aforementioned problems in the prior art, this invention provides an auxiliary leveling device, a process chamber, a leveling method for a spray plate, and a computer-readable storage medium. These devices are not only simple in structure and easy to operate, but also improve the parallelism between the spray plate and the heating plate while ensuring the vacuum level within the chamber. This not only enhances the uniformity of the process effect and helps improve the uniformity of the deposited film, but also improves the overall product yield.

[0036] In some non-limiting embodiments, the auxiliary leveling device provided in the first aspect of the present invention can be configured in the process chamber provided in the second aspect of the present invention and used to implement the leveling method of the spray plate provided in the third aspect of the present invention.

[0037] Specifically, in some non-limiting embodiments, the computer-readable storage medium described above in the fourth aspect of the present invention stores a computer program product thereon. The computer program product includes computer instructions. The processor may be connected to a memory and configured to execute the computer instructions included in the computer program product to implement the spray plate leveling method as provided in the third aspect of the present invention.

[0038] The working principle of the above-mentioned auxiliary leveling device will be described below with reference to some embodiments of leveling methods for process chambers and spray plates. Those skilled in the art will understand that these embodiments of leveling methods for process chambers and spray plates are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide some specific solutions convenient for public implementation, rather than limiting all operating modes or functions of the auxiliary leveling device. Similarly, the auxiliary leveling device is also only one non-limiting implementation provided by the present invention, and does not limit all operating modes or functions of these process chambers, or the implementing entities and execution order of each step in the leveling method of the spray plate.

[0039] First, please refer to Figure 1 . Figure 1A schematic diagram of the structure of a process chamber provided according to some embodiments of the present invention is shown.

[0040] like Figure 1 As shown, in some embodiments of the present invention, the process chamber 100 may mainly include a spray plate 110, a heating plate 120, and an auxiliary leveling device.

[0041] Specifically, in Figure 1 In the illustrated embodiment, the process chamber 100 can be adapted to the timing requirements of various thin film fabrication processes such as plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), and metal-organic chemical vapor deposition (MOCVD), and is configured with corresponding structures and accessories, which are not limited herein. The spray plate 110 can be positioned above the process chamber 100 via an upper plate 111 to uniformly introduce process gas downwards, facilitating uniform thin film growth on the wafer surface. The heating plate 120 is located within the process chamber 100 to support the wafer during the process and to heat it. An auxiliary leveling device can be used to pre-align the spray plate 110 and the heating plate 120 to relative parallelism before processing within the process chamber 100, thereby ensuring that heating uniformity and spray coverage are synergistically matched within the process space, contributing to improved uniformity of the process effect.

[0042] Furthermore, in some preferred embodiments, a lower electrode may be provided inside the heating plate 120, and an upper electrode may be provided inside the spray plate 110. Through the parallel plate electrodes formed by the heating plate 120 and the spray plate 110, plasma can be generated in the process space between them, thereby performing a plasma-enhanced deposition process. Optionally, the plasma-enhanced deposition process may include, but is not limited to, plasma-enhanced chemical vapor deposition, plasma-enhanced atomic layer deposition, etc.

[0043] In this embodiment, since a plasma field can be formed between the upper and lower electrode plates located within the spray plate 110 and the heating plate 120, the parallelism between the upper and lower electrode plates directly affects this plasma field. Specifically, when there is a parallelism deviation between the upper and lower electrode plates, a wedge-shaped space is formed between the two electrodes. The smaller the spacing, the denser the electric field lines and the higher the electric field strength. Conversely, the larger the spacing, the sparser the electric field lines and the lower the electric field strength. The direct consequence of this electric field distortion is that the gas ionization efficiency varies in different regions. In regions with a strong electric field, the electron acceleration energy is higher, resulting in more complete ionization of the process gas, and therefore, the plasma density in this region is higher. In regions with a weak electric field, the plasma density is lower. Furthermore, in high-density plasma regions, the process rate is faster. For example, for deposition processes, the deposition rate is faster and the deposited film thickness is thicker, while in low-density plasma regions, the deposition rate is slower and the deposited film thickness is thinner.

[0044] In this regard, in the above embodiments provided by the present invention, an auxiliary leveling device can be used to adjust the spray plate 110 and the heating plate 120 to be relatively parallel, thereby forming a uniform vertical electric field with parallel and equally spaced electric field lines between the heating plate 120 and the spray plate 110. This uniform vertical electric field improves the uniformity of plasma distribution in the process space between the upper and lower electrode plates, thereby enhancing the consistency of deposition rates in different regions of the cavity and the uniformity of the deposited film thickness.

[0045] Next, as Figure 1 As shown, in some embodiments of the present invention, the auxiliary leveling device may mainly include a bellows 130, a ranging fixture 140, a first adjusting screw 150, and a processor. Figure 1 (not shown).

[0046] Specifically, in Figure 1 In the illustrated embodiment, the bellows 130 is movably axially abutted between the cavity 101 and the upper plate 111. The lower layer of the upper plate 111 is connected to the spray plate 110. The spray plate 110 is mounted and fixed above the process chamber 100 via the upper plate 111.

[0047] A ranging fixture 140 can be placed on the leveled heating plate 120 to acquire multiple initial distance values ​​between the surface of the heating plate 120 and the spray plate 110 above it. The ranging fixture can have at least three ranging points. The ranging fixture 140, placed on the heating plate 120, can measure at least three initial distance values ​​between the heating plate 120 and the spray plate 110. Since three points define a plane, when the error between the three values ​​is less than or equal to a deviation threshold (e.g., 0.02 mm), it can be determined that the spray plate 110 and the heating plate 120 are relatively level. The ranging fixture can be equipped with multiple ranging sensors. The types of ranging sensors include, but are not limited to, laser ranging sensors, capacitive displacement sensors, fiber optic ranging sensors, and infrared ranging sensors. When it is necessary to detect the distance between the surface of the heating plate 120 and the spray plate 110, the ranging fixture 140 can be placed on the heating plate 120. When it is not necessary to measure the distance, it can be removed to provide space for the wafer to be processed.

[0048] like Figure 1As shown, the first adjusting screw 150 is axially screwed into the upper plate 111. By adjusting the number of rotations of the first adjusting screw 150, the distance between the upper plate 111 and the cavity 101 can be locally adjusted. The processor can be configured to determine the target number of rotations of the first adjusting screw 150 based on the difference between multiple initial distance values, so as to adjust the spray plate 110 and the heating plate 120 to be relatively parallel based on the target number of rotations. In the above embodiment, the retractable bellows 130 is used to axially abut against the upper plate 111 and the cavity 101 during the process of locally adjusting the distance between the upper plate 111 and the cavity 101, thereby forming a dynamic seal between the upper plate 111 and the cavity 101, which can ensure the vacuum degree inside the cavity 101. By ensuring the vacuum degree inside the cavity, not only can external impurities (such as air, water vapor, dust) be eliminated, but process conditions (gas diffusion, energy transfer, reaction efficiency) can also be optimized, thereby ensuring the precise controllability of each process step, and ultimately ensuring the electrical performance, reliability and yield of the product.

[0049] Continue as Figure 1 As shown, there can be one or more first adjusting screws 150. For example, four first adjusting screws 150 can be distributed around the perimeter of the upper plate 111 to divide the gap adjustment area of ​​the spray plate 110 into four local areas.

[0050] In some preferred embodiments, the first adjusting screws 150 can be distributed in multiple areas of the upper plate 111 to correspond to multiple ranging points (such as ranging points A, B, and C) of the ranging fixture 140. Here, the correspondence between the "first adjusting screw 150 and the ranging point" is a large-scale correspondence, rather than a small-scale correspondence where the first adjusting screw 150 is located directly above the ranging point. For example, taking ranging point A as an example, its corresponding first adjusting screw 150 can be located within a circular area with ranging point A as the center and a radius of a specific length.

[0051] In some embodiments of the present invention, a distance standard value can be preset in the processor. Optionally, this distance standard value can be the process gap between the spray plate 110 and the heating plate 120. Then, after receiving the initial distance values ​​of multiple areas of the spray plate 110 fed back by the ranging fixture 140, the processor calculates the difference between each initial distance value and the distance standard value. The adjustment distance change of the first adjusting screw 150 is the product of its pitch and the number of rotations. For example, if the pitch of the first adjusting screw 150 is 0.5 mm and it rotates 1.2 turns, then the change in its adjustment distance is 0.6 mm. Therefore, the target number of rotations of the first adjusting screw 150 corresponding to each ranging point can be obtained based on the difference between each initial distance value and the distance standard value. If the difference between the initial distance value at a certain ranging point and the distance standard value is less than or equal to the deviation threshold (e.g., 0.02 mm), the first adjusting screw 150 in that area can be left unrotated. That is, the first adjusting screw 150 in the area corresponding to that ranging point is not the first adjusting screw 150 in the target area. When the difference between the initial distance value at a certain distance measuring point and the standard distance value is greater than the deviation threshold, the area is determined to be the target area, and the first adjusting screw 150 in this / these target areas needs to be adjusted to the corresponding number of target rotations.

[0052] In some alternative embodiments, to simplify the leveling process, an initial distance value can be used as the distance standard value. This way, only the initial distance values ​​of the remaining areas need to be adjusted to approximate the initial distance value of the area used as the distance standard value. The specific operation process is as described above and will not be repeated here.

[0053] Continue as Figure 1 As shown, in some embodiments, a fastening screw 151 is provided between the first adjusting screw 150 and the upper plate 111. By loosening the fastening screw 151, the first adjusting screw 150 can be released to rotate and adjust its number of rotations. After the first adjusting screw 150 is rotated to the target number of rotations, the fastening screw 151 can be tightened to fix the current screw-in depth of the first adjusting screw 150.

[0054] In addition, Figure 1 In the illustrated embodiment, the auxiliary leveling device may further include a sealing ring 160. The sealing ring 160 may be disposed at both the upper and lower ends of the bellows 130. That is, the sealing ring 160 may be disposed between the contact surfaces of the fastening screw 151 and the upper plate 111, and between the contact surfaces of the bellows 130 and the cavity 101. During the dynamic process of adjusting the distance between the upper plate 111 and the cavity 101 via the first adjusting screw 150, the sealing rings 160 located at both the upper and lower ends of the bellows 130 may cooperate with the bellows 130 to form a dynamic seal between the upper plate 111 and the cavity 101, thereby further ensuring the vacuum level inside the cavity 101.

[0055] Further, please see Figure 2 . Figure 2 A schematic diagram of the structure of a heating plate provided according to some embodiments of the present invention is shown.

[0056] like Figure 2 As shown, in some embodiments of the present invention, the auxiliary leveling device may further include a level detection fixture 170 and a second adjusting screw 121.

[0057] Specifically, in Figure 2 In the illustrated embodiment, the level detection fixture 170 can be placed on the heating plate 120 to detect the levelness between the heating plate 120 and the ground. A level instrument can be configured in the level detection fixture 170. Types of level instruments include, but are not limited to, tilt level sensors, laser level sensors, ultrasonic level sensors, capacitive level sensors, optical level sensors, and liquid pendulum level sensors. When it is necessary to detect the levelness between the surface of the heating plate 120 and the ground, the level detection fixture 170 can be placed on the heating plate 120. At this time, the heating plate 120 and the level detection fixture 170 are relatively horizontal, and the levelness between the heating plate 120 and the ground can be displayed through the level detection fixture 170. When levelness detection is not required, it can be removed to provide space for the wafers to be processed.

[0058] Continue as Figure 2 As shown, the second adjusting screw 121 can be located below the heating plate 120. By adjusting the number of rotations of the second adjusting screw 121, the levelness between the heating plate 120 and the ground can be adjusted to make the heating plate 120 relatively parallel to the ground. By making the heating plate 120 relatively parallel to the ground, it can be ensured that the heating plate is in a horizontal state, thereby effectively preventing the wafers carried on it from slipping in the cavity.

[0059] Furthermore, in some embodiments provided by this invention, the heating plate 120 can first be adjusted to be relatively parallel to the ground using the leveling fixture 170 and the second adjusting screw 121 to ensure that the heating plate 120 is in a horizontal state. Then, using the levelness of the heating plate as a reference, the spray plate 110 and the heating plate 120 are adjusted to be relatively parallel using the ranging fixture 140 and the first adjusting screw 150, thereby ensuring that the spray plate 110 and the heating plate 120 can simultaneously remain horizontal to the ground. The spray plate 110, the heating plate 120, and the ground are all parallel.

[0060] Furthermore, in some preferred embodiments, the auxiliary leveling device may also include a centering tool ( Figure 2(Not shown in the diagram). A centering fixture can be mounted on the heating plate 120 to laterally adjust its position after the aforementioned leveling, aligning it with the center of the cavity 101. Specifically, the centering fixture may optionally include a first fixture, a second fixture, and a third fixture. The first fixture is placed on and fixed to the heating plate 120. The second fixture is placed inside and fixed to the cavity 101. The first and second fixtures are stacked. Both the first and second fixtures have circular holes of the same diameter at their centers. Then, a cylindrical nail-shaped third fixture with the same diameter as the circular hole is used for positioning. When the cylinder of the third fixture naturally falls into the two holes of the first and second fixtures, it is confirmed that the heating plate 120 is centered in the cavity 101. By adjusting the heating plate 120 to the process reference symmetry center of the process chamber 100 using the centering fixture, the imbalance of process conditions on one side caused by spatial positional deviation is eliminated, helping to improve defects such as process eccentricity (e.g., film deposition eccentricity).

[0061] In addition, in some embodiments, the auxiliary leveling device may also include a lifting mechanism connected to the heating plate 120. Figure 2 (Not shown in the diagram). Specifically, after leveling the heating plate 120 and centering it in the cavity 101, the height of the heating plate 120 can be adjusted longitudinally via a lifting mechanism to adjust the gap between it and the spray plate 110 to the target gap. Optionally, the target gap can be determined based on the ranging range of the ranging sensor in the ranging fixture 140. For example, when the ranging range of the ranging sensor in the ranging fixture 140 is 20 mm, the target gap between the heating plate 120 and the spray plate 110 is preferably 15-19 mm. Within this target gap range, the ranging sensor reading is sensitive. However, if the gap between the heating plate 120 and the spray plate 110 exceeds the ranging range of 20 mm, it will cause ranging failure.

[0062] In some alternative embodiments, the target gap can also be determined based on the process gap. In semiconductor manufacturing processes, the requirements for process temperature, reaction medium concentration, and reaction time are extremely stringent (e.g., temperature deviation ±0.5℃, medium flow rate accuracy ±1%), and the process gap serves as the spatial reference for these parameters. If the gap between the spray plate 110 and the heating plate 120 is too large or too small, it will disrupt the preset process window, leading to a decrease in product yield. Therefore, adjusting the target gap between the heating plate 120 and the spray plate 110 to match the process gap can improve process performance and product yield.

[0063] The execution order of the steps described above for quickly adjusting the heating plate 120 to the height position corresponding to the process gap is not limited. Optionally, it can be performed before or after the step of adjusting the heating plate 120 to be relatively parallel with the ground, or before or after the step of adjusting the spray plate 110 to be relatively parallel with the heating plate 120.

[0064] Continue as Figure 1 As shown, after obtaining the target number of rotations corresponding to the first adjusting screw 150 in the target area, the first adjusting screw 150 can be adjusted to the target number of rotations manually or automatically, thereby adjusting the spray plate 110 and the heating plate 120 to be relatively parallel.

[0065] Specifically, in some optional embodiments, the first adjusting screw 150 is a standard screw. In this case, a technician can manually rotate the first adjusting screw 150 to the target number of rotations provided by the processor, adjusting the spray plate 110 and the heating plate 120 to be relatively parallel. Here, "target number of rotations" includes not only the number of rotations but also the direction of rotation.

[0066] In some alternative embodiments, the first adjusting screw 150 can be an electric screw. The auxiliary leveling device may also include a controller. The controller is connected to the processor to receive a target number of rotations provided by the processor and to issue adjustment control commands to the electric first adjusting screw 150. At this time, the electric first adjusting screw 150 can automatically rotate to the target number of rotations according to the adjustment control commands, thereby adjusting the spray plate 110 and the heating plate 120 to be relatively parallel. That is, in the automatic adjustment mode, the first adjusting screw 150 can automatically change the number of screw rotations according to the initial distance value detected by the ranging fixture 140, so as to adjust the difference between the distance values ​​detected by each test point to within the deviation threshold (e.g., 0.02 mm).

[0067] This concludes the basic description of one aspect of the present invention: the process chamber 100 and the main structure of the auxiliary leveling device disposed therein. Next, please refer to... Figure 3 , Figure 3 A flowchart illustrating a method for leveling a spray plate according to some embodiments of the present invention is shown. (In conjunction with...) Figure 3 The leveling method shown above for the spray plate will help us understand the working principle of the auxiliary leveling device.

[0068] like Figure 3 As shown, in some embodiments of the present invention, the leveling method of the spray plate may include the following steps S310 to S330.

[0069] Specifically, it can be combined with Figure 2It is understood that in some embodiments, after completing preventive maintenance (PM) of the equipment and before performing step S310 above, the heating plate 120 can be coarsely leveled using a leveling fixture. Then, the level between the heating plate 120 and the ground can be obtained via a leveling detection fixture 170. Then, by adjusting the number of rotations of the second adjusting screw 121 located at the bottom of the heating plate 120, the level between the heating plate 120 and the ground is adjusted to bring the heating plate 120 and the ground relatively parallel. By bringing the heating plate 120 relatively parallel to the ground, it is ensured that the heating plate is level, thereby effectively preventing the wafers carried on it from slipping within the cavity.

[0070] Furthermore, to maintain the leveling state of the heating plate 120, its position can be adjusted laterally using a centering fixture to bring it to the center of the cavity 101. By adjusting the heating plate 120 to the process reference symmetry center of the process chamber 100 using the centering fixture, the imbalance of process conditions on one side caused by spatial position deviation is eliminated, which helps to improve the defects of process eccentricity (such as film deposition eccentricity).

[0071] Then, step S310 can be performed. For example... Figure 1 As shown, in some optional embodiments, after the ranging fixture 140 is placed on the heating plate 120, the longitudinal height of the heating plate 120 can be adjusted by a lifting mechanism so that the gap between it and the spray plate 110 is within the ranging range of the ranging fixture 140. Then, multiple initial distance values ​​between the leveled surface of the heating plate 120 and the spray plate above it can be obtained via the ranging fixture 140. Afterwards, step S320 can be performed to determine the target number of rotations of the first adjusting screw 150 based on the difference between the multiple initial distance values.

[0072] Finally, step S330 can be performed. First, loosen the fastening screw 151 to release the first adjusting screw 150. Then, rotate the first adjusting screw 150 to change the distance between the upper plate 111 and the cavity 101. After rotating the first adjusting screw 150 to the target number of rotations, the fastening screw 151 can be tightened to fix the current screw-in depth of the first adjusting screw 150. In addition, before tightening the fastening screw 151, the distance values ​​can be detected again via the ranging fixture 140. When the difference between the detected distance values ​​is less than the deviation threshold (e.g., 0.02 mm), the fastening screw is tightened to complete the horizontal calibration of the spray plate 110. Optionally, step S330 can be performed manually or automatically. In this embodiment, the spray plate 110, the heating plate 120, and the ground can be simultaneously leveled.

[0073] In summary, the present invention provides an auxiliary leveling device, a process chamber, a leveling method for a spray plate, and a computer-readable storage medium. It is not only simple in structure and easy to operate, but also improves the parallelism between the spray plate and the heating plate while ensuring the vacuum degree in the chamber. This not only improves the uniformity of the process effect and helps to improve the uniformity of the deposited film, but also improves the overall product yield.

[0074] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0075] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps are described above in a generalized manner in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention.

[0076] The various illustrative logic modules and circuits described in conjunction with the embodiments disclosed herein may be implemented or performed using a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The general-purpose processor may be a microprocessor, but in alternatives, it may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors cooperating with a DSP core, or any other such configuration.

[0077] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0078] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0079] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An auxiliary leveling device, characterized in that, include: A bellows is movably axially abutting between the cavity and the upper plate, wherein the lower layer of the upper plate is connected to a spray plate; A ranging fixture is placed on a leveled heating plate to obtain multiple initial distance values ​​between the surface of the heating plate and the spray plate above it. The first adjusting screw is screwed axially into the upper plate. By adjusting the number of rotations of the first adjusting screw, the distance between the upper plate and the cavity is locally adjusted; and The processor is configured to: determine a target number of rotations of the first adjusting screw based on the difference between the plurality of initial distance values, so as to adjust the spray plate and the heating plate to be relatively parallel based on the target number of rotations.

2. The auxiliary leveling device as described in claim 1, characterized in that, The first adjusting screws are distributed in multiple areas of the upper plate to correspond to multiple ranging points of the ranging fixture. The step of determining the target number of rotations of the first adjusting screw based on the difference between the plurality of initial distance values ​​includes: Obtain the difference between each initial distance value and the standard distance value; and Based on the difference, the first adjusting screw of the target area and its corresponding target number of rotations are determined.

3. The auxiliary leveling device as described in claim 1, characterized in that, Also includes: A leveling fixture is placed on a heating plate to detect the levelness between the heating plate and the ground. The second adjusting screw is located below the heating plate. By adjusting the number of rotations of the second adjusting screw, the levelness between the heating plate and the ground is adjusted so that the heating plate and the ground are relatively parallel.

4. The auxiliary leveling device as described in claim 3, characterized in that, Also includes: A centering fixture is provided on the heating plate and is used to adjust the position of the heating plate laterally after the heating plate is leveled, so as to adjust it to the center of the cavity; as well as A lifting mechanism, connected to the heating plate, is used to adjust the height of the heating plate longitudinally after the heating plate is leveled and located at the center of the cavity, so as to adjust the gap between the heating plate and the spray plate to the target gap.

5. The auxiliary leveling device as described in claim 1, characterized in that, Also includes: A fastening screw is located between the first adjusting screw and the upper plate. The first adjusting screw is released or fixed by loosening or tightening the fastening screw. as well as A sealing ring is provided at the upper and lower ends of the bellows, and is used to form a dynamic seal between the upper plate and the cavity with the bellows during the process of adjusting the number of rotations of the first adjusting screw.

6. A process chamber, characterized in that, include: A spray plate is located above the process chamber and is used to introduce process gas downwards. A heating plate, located within the process chamber, is used to support the wafer; as well as The auxiliary leveling device as described in any one of claims 1 to 5 is used to adjust the spray plate and the heating plate to be relatively parallel before the process is carried out in the process chamber.

7. The process chamber as described in claim 6, characterized in that, The heating plate has a lower electrode inside, and the spray plate has an upper electrode inside, so as to form a uniform vertical electric field with parallel and equally spaced electric field lines between the heating plate and the spray plate.

8. A method for leveling a spray plate, characterized in that, The leveling method, implemented via the auxiliary leveling device as described in any one of claims 1 to 5, includes the following steps: Multiple initial distance values ​​between the leveled heating plate surface and the spray plate above it are obtained using a ranging fixture. Based on the differences between the multiple initial distance values, the target number of rotations of the first adjusting screw is determined; and Rotate the first adjusting screw to the target number of rotations to align the spray plate and the heating plate to be relatively parallel.

9. The leveling method as described in claim 8, characterized in that, Before the step of obtaining multiple initial distance values ​​between the leveled heating plate surface and the spray plate above it via a ranging fixture, the following steps are also included: The horizontality between the heating plate and the ground is obtained using a horizontal testing fixture; and Adjust the number of rotations of the second adjusting screw to adjust the level between the heating plate and the ground, so that the heating plate and the ground are relatively parallel.

10. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the leveling method for the spray plate as described in claim 8 or 9 is implemented.

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