Method for virtual semiconductor factory wafer carrier supervision

Abstract

The application relates to the technical field of virtual scenes, and discloses a virtual semiconductor factory wafer carrier supervision method, which comprises the following steps: connecting an MCS, an MES and a machine table through middleware of a data interaction center to construct a virtual data interaction center; inserting Carrier ID data at the end of a carrying task based on the MCS; actively inquiring the MES by the data interaction center to obtain corresponding Slot Map data and associating storage; and reporting EAP for verification and instruction issuing after reading data from the data interaction center by the machine table on demand. The application improves the accuracy of data detection and the reliability of virtual application, reduces the risk of wafer waste, enhances the controllability of operation, improves the simulation fidelity, detection accuracy and overall process efficiency.

Description

Technical Field

[0001] This invention relates to the field of virtual scene technology, specifically a method for monitoring virtual semiconductor factory wafer carriers. Background Technology

[0002] Virtual scenes are digital humanistic environments constructed through technologies such as 3D modeling, real-time rendering, and spatial positioning. Their core features include virtual-real interaction, multimodal presentation, and immersive experience.

[0003] Currently, in the process of semiconductor manufacturing virtualization, there is a critical interaction between the Carrier ID data and Slot Map data of material carriers (such as FOUPs). However, the virtual environment lacks the automatic data reading capability of physical card readers in a real factory. When reading Carrier ID data and Slot Map data, it cannot simulate the physical reading capability of hardware scanning equipment in real time. When the data synchronization in the virtual environment is not timely or synchronized, it will cause the processing flow to be interrupted and the command to be issued incorrectly, and the integrity and accuracy of the virtual processing flow cannot be guaranteed.

[0004] Therefore, a method for monitoring virtual semiconductor fab wafer carriers is proposed to address the above-mentioned problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a method for monitoring wafer carriers in a virtual semiconductor fab, which solves the problems mentioned in the background art, such as the inability to simulate the physical reading capabilities of hardware scanning equipment in real time, untimely or asynchronous data synchronization in the virtual environment, and the inability to guarantee the integrity and accuracy of the virtual processing flow.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for monitoring a virtual semiconductor fab wafer carrier, the method comprising the following steps:

[0007] S1. In the virtual semiconductor manufacturing plant scenario, configure the middleware of the data interaction center to connect MCS, MES and machine tools, and build the data interaction center.

[0008] S2. When the handling task ends, the MCS inserts the Carrier ID data into the data interaction center and associates it with the current machine position;

[0009] S3. The data interaction center actively queries the MES for the corresponding SlotMap data based on the Carrier ID data and receives the returned SlotMap data.

[0010] S4. The data interaction center associates and stores the Carrier ID data with the Slot Map to form a complete data record;

[0011] S5. When the machine needs to read data, it sends a request to the data interaction center to obtain Carrier ID data and Slot Map that match the machine's location.

[0012] S6. The machine reports the Carrier ID data and Slot Map to the EAP to achieve operation control;

[0013] S7. The EAP verifies the correctness of the data. If it is correct, a processing operation instruction is issued; otherwise, a return process is triggered.

[0014] Preferably, in step S1, the process of configuring the middleware of the data interaction center in the virtual semiconductor manufacturing plant scenario, connecting the MCS, MES, and machines, and constructing the data interaction center includes:

[0015] S11. In the virtual semiconductor manufacturing plant scenario, initialize the middleware of the data interaction center and adopt a centralized architecture to support concurrent access by multiple machines;

[0016] S12. Establish communication connections between the data interaction center and MCS, MES and machine tools, and use standard network protocols to simulate hardware interfaces.

[0017] S13. Configure the data table structure of the data interaction center, including vehicle identifier, machine location and timestamp fields, to construct the data interaction center.

[0018] Preferably, in step S2, the process of inserting the Carrier ID data into the data interaction center and associating it with the current machine location via the MCS at the end of the handling task includes:

[0019] S21. The MCS monitors the handling tasks in the virtual semiconductor manufacturing plant and obtains the Carrier ID data of the current vehicle when the task ends.

[0020] S22. The MCS inserts the Carrier ID data into a designated data table in the data interaction center through the application programming interface and associates it with the machine location information;

[0021] S23. The data interaction center receives and stores the Carrier ID data without verification; if the data format is incorrect, it is handled directly by the MCS.

[0022] Preferably, the process in S3 where the data interaction center actively queries the MES for the corresponding Slot Map data based on the Carrier ID data and receives the returned Slot Map data includes:

[0023] S31. The data interaction center parses the Carrier ID data received from the MCS and generates a standardized query request;

[0024] S32. The data interaction center sends a query request to the MES through standard interfaces, including HTTP and HSMS, to obtain the corresponding Slot Map data.

[0025] S33. The MES queries the internal database based on the Carrier ID data and returns Slot Map data, including wafer slot status information;

[0026] S34. The data interaction center receives and parses the Slot Map data, and the verification is handled by EAP.

[0027] Preferably, the process in S4 where the data interaction center associates and stores the Carrier ID data with the Slot Map to form a complete data record includes:

[0028] S41. The data interaction center stores Carrier ID data, Slot Map data, and machine location in a database table, using a multi-field structure.

[0029] S42. Update the timestamp and status fields of the data table in the data interaction center to reflect the latest version of the data;

[0030] S43. Implement a data backup mechanism to regularly archive Carrier ID data and Slot Map data to prevent data loss in the virtual environment.

[0031] Preferably, in step S5, when the machine needs to read data, the process of sending a request to the data interaction center to obtain Carrier ID data and Slot Map matching the machine's location includes:

[0032] S51. After detecting the arrival of the vehicle and receiving the EAP instruction, the machine sends a read request to the data interaction center.

[0033] S52. The data interaction center retrieves matching Carrier ID data and Slot Map data based on the machine location parameters in the request;

[0034] S53. The data interaction center returns data to the machine in a format that simulates hardware output to ensure consistency in the virtual environment.

[0035] Preferably, in step S6, the process of the machine reporting the Carrier ID data and Slot Map to the EAP to achieve job control includes:

[0036] S61. The machine parses the Carrier ID data and Slot Map data obtained from the data interaction center and converts them into a message format that EAP can recognize.

[0037] S62. The machine reports data through an event-driven mechanism, and the content is defined by EAP binding parameters;

[0038] S63. The EAP confirms receipt of data and triggers the verification process.

[0039] Preferably, the process of verifying the correctness of the EAP verification data in step S7, and issuing a processing instruction if the data is correct, and triggering a return process otherwise, includes:

[0040] S71. The EAP compares the received Carrier ID data and Slot Map data with the standard process rules of the virtual semiconductor manufacturing plant.

[0041] S72. When the data is correct, the EAP issues process job and control job instructions to start the virtual processing flow;

[0042] S73. When the data is incorrect, the EAP triggers a return process and records an error log; the return process includes interrupting the virtual processing flow and notifying the upstream system to reschedule.

[0043] Preferably, the method further includes the following steps to expand monitoring and optimization capabilities:

[0044] S8. Monitor data flow and periodically sample and check data consistency, rather than conducting a comprehensive audit of dynamic data;

[0045] S9. Simulate abnormal handling scenarios, including data loss, network interruption, and high-concurrency errors, to test the fault tolerance capability of the data interaction center; evaluate the reliability of the method by monitoring data recovery time and error rate, and record the test results for optimization.

[0046] Preferably, step S8 includes the following steps to refine the monitoring and testing operations:

[0047] S81. Dynamically adjust the query frequency and data storage strategy of the data interaction center according to the report to match the load changes of the virtual semiconductor manufacturing plant;

[0048] S82. Introduce stress testing to simulate high-concurrency read scenarios and verify the scalability and stability of the method.

[0049] Compared with the prior art, the present invention provides a method for monitoring virtual semiconductor fabs (FOUPs), which has the following beneficial effects:

[0050] 1. In this invention, by configuring the middleware of the data interaction center to connect MCS, MES and machine tools, a data interaction center is constructed. This center can simulate the reading capability of hardware scanning equipment in real time, ensuring accurate synchronization and consistency of Carrier ID data and Slot Map data. It avoids interruption of the processing flow caused by data asynchrony and errors in the virtual environment, and improves the accuracy of data detection and the reliability of virtualization applications.

[0051] 2. In this invention, the consistency between Carrier ID data and Slot Map data and machine position is verified in real time through EAP, and the return processing of the correction mechanism can be triggered to ensure the correctness of the processing instructions, prevent position deviation or process step disorder in virtual wafer processing, further reduce the risk of scrap and enhance the controllability of operation.

[0052] 3. In this invention, a data interaction center, including its query, storage, and dynamic adaptation functions, enables multi-level and accurate comparison of Carrier ID data and Slot Map, adapting to the complex data interaction needs in a virtual semiconductor manufacturing plant, thereby improving simulation fidelity, detection accuracy, and overall process efficiency. Attached Figure Description

[0053] Figure 1 This is a flowchart illustrating the steps of a method for monitoring a virtual semiconductor fab wafer carrier according to the present invention.

[0054] Figure 2 The locations of the Carrier ID reader and the Slot Map reader in this invention;

[0055] Figure 3 This invention provides a data interaction center for data interaction.

[0056] Figure 4 This invention defines the table fields and data flow. Detailed Implementation

[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] Please see Figure 1-4 The specific implementation of a method for monitoring wafer carriers in a virtual semiconductor fab is as follows: CarrierID data corresponds to the handling identifier of the wafer carrier, which can be a FOUP, etc. A FOUP (Front Opening Unified Pod) is a critical carrier used in semiconductor manufacturing to protect, transport, and store wafers. It is a front-opening standardized container designed specifically for 12-inch (300mm) wafer fabs, serving as a core component of automated transport systems. Its highly sealed structure ensures the safe transport of wafers in a cleanroom environment, preventing yield degradation due to dust contamination or mechanical damage. Carrier ID data is used to uniquely identify carriers (such as FOUPs) and is stored in physical tags, which can be barcodes, QR codes, RFID tags, or other electronic tags. Each FOUP has a unique Carrier ID, ensuring accurate identification and tracking of each FOUP within the wafer fab. Using the Carrier ID data, the location and status of the FOUP can be viewed in real time, including whether the FOUP is in transit, on a specific device, or has completed a certain process step. Carrier ID data records historical information about the FOUP and its internal wafers, including wafer batch number, process flow, dwell time, etc. The Slot Map corresponds to the slot map identifier. A Slot Map is a data structure used to record the usage status and wafer information of each slot in the FOUP. It is typically a table or database that records in detail whether each slot is occupied and the detailed information of the occupied wafer, such as wafer number, batch number, process flow, status, etc. Each FOUP has a unique Slot Map for managing its internal wafer slots. Each slot information in the Slot Map corresponds one-to-one with a physical slot in the FOUP, ensuring accurate wafer management and tracking. The method includes the following steps:

[0059] S1. In the virtual semiconductor manufacturing plant scenario, configure the middleware of the data interaction center to connect MCS, MES and machine tools, and build the data interaction center.

[0060] S2. When the handling task ends, the MCS inserts the Carrier ID data into the data interaction center and associates it with the current machine position;

[0061] S3. The data interaction center actively queries the MES for the corresponding Slot Map data based on the Carrier ID data and receives the returned Slot Map data.

[0062] S4. The data interaction center associates and stores the Carrier ID data with the Slot Map to form a complete data record;

[0063] S5. When the machine needs to read data, it sends a request to the data interaction center to obtain the Carrier ID data and Slot Map that match the machine's location.

[0064] S6. The machine reports the Carrier ID data and Slot Map to the EAP to achieve operation control;

[0065] S7 and EAP verify the correctness of the data. If the data is correct, a processing instruction is issued; otherwise, a return process is triggered.

[0066] In S1, within a virtual semiconductor manufacturing plant scenario, configuring the middleware for the data interaction center connects the MCS, MES, and equipment. The process of building the data interaction center includes:

[0067] S11. In the virtual semiconductor manufacturing plant scenario, initialize the middleware of the data interaction center and adopt a centralized architecture to support concurrent access from multiple machines;

[0068] S12. Establish communication connections between the data interaction center and MCS, MES and machine tools, and use standard network protocols to simulate hardware interfaces.

[0069] S13. Configure the data table structure of the data interaction center, including vehicle identifier, machine location, and timestamp fields, to build the data interaction center and calculate the configuration success rate:

[0070] ;

[0071] in, To improve the success rate of configuration, The number of data tables successfully configured. This represents the total number of configuration attempts.

[0072] Set threshold =0.98, when The configuration is deemed valid if it is valid; otherwise, a reconfiguration mechanism is triggered.

[0073] In S2, the process of inserting Carrier ID data into the data interaction center and associating it with the current machine location at the end of the handling task via MCS includes:

[0074] S21, MCS monitors the handling tasks in the virtual semiconductor manufacturing plant and obtains the Carrier ID data of the current vehicle when the task ends;

[0075] S22, MCS inserts Carrier ID data into a designated data table in the data interaction center through the application programming interface and associates it with machine location information;

[0076] S23. The data interaction center receives and stores the Carrier ID data without verification; if the data format is incorrect, it is handled directly by the MCS.

[0077] In S3, the data interaction center actively queries the MES for the corresponding Slot Map data based on the Carrier ID data, and the process of receiving the returned Slot Map data includes:

[0078] S31. The data interaction center parses the Carrier ID data received from the MCS and generates a standardized query request;

[0079] S32. The data interaction center sends query requests to the MES through standard interfaces, including HTTP and HSMS, to obtain the corresponding Slot Map data.

[0080] S33 and MES query the internal database based on Carrier ID data and return Slot Map data, including wafer slot status information;

[0081] S34. The data interaction center receives and stores the Slot Map data, and calculates the data verification accuracy:

[0082] ;

[0083] in, To verify the accuracy of the original data, To verify the accuracy of the data, The number of correctly parsed SlotMap data. This represents the total number of queries.

[0084] Set threshold =0.95, when The system determines the data to be valid if it is valid; otherwise, it triggers a re-query mechanism.

[0085] In S4, the data exchange center associates and stores Carrier ID data with Slot Maps to form a complete data record. The process includes:

[0086] S41. The data interaction center stores Carrier ID data, Slot Map data, and machine location in a database table, using a multi-field structure.

[0087] S42. Update the timestamp and status fields of the data table in the data interaction center to reflect the latest version of the data;

[0088] S43. Implement a data backup mechanism, regularly archive Carrier ID data and Slot Map data, and calculate backup integrity:

[0089] ;

[0090] in, For backup integrity, The size of the data to be successfully backed up. Total backup data size required;

[0091] Set threshold =0.99, when The backup retry mechanism is triggered when necessary.

[0092] In S5, when a machine needs to read data, the process of sending a request to the data interaction center to obtain Carrier ID data and Slot Map matching the machine's location includes:

[0093] S51. After detecting the arrival of the vehicle and receiving the EAP instruction, the machine sends a read request to the data interaction center.

[0094] S52. The data interaction center retrieves matching Carrier ID data and Slot Map data based on the machine location parameters in the request.

[0095] S53. The data interaction center returns data to the machine, simulating hardware output format, and calculates the reading accuracy:

[0096] ;

[0097] in, To improve reading accuracy, This represents the number of successful reads that match the machine location with the data. Total number of reads;

[0098] Set threshold =0.96, when This triggers a data realignment process.

[0099] In S6, the machine reports Carrier ID data and Slot Map to EAP, and the process of achieving job control includes:

[0100] S61. The machine parses the Carrier ID data and Slot Map data obtained from the data interaction center and converts them into a message format that EAP can recognize.

[0101] S62. The machine reports data through an event-driven mechanism, and the content is defined by the EAP binding parameters.

[0102] S63, EAP confirms receipt of data, triggers the verification process, and calculates the reporting timeliness rate:

[0103] ;

[0104] in, To ensure timely reporting, For ideal reporting time, The actual reporting time;

[0105] Set threshold =0.90, when Optimize the event-driven mechanism in real time.

[0106] In S7, the EAP verifies the correctness of the data. If it is correct, a processing instruction is issued; otherwise, the process of triggering a return is as follows:

[0107] S71, EAP compares the received Carrier ID data and Slot Map data with the standard process rules of the virtual semiconductor manufacturing plant;

[0108] S72. When the data is correct, EAP issues process job and control job instructions to start the virtual processing flow;

[0109] S73. When the data is incorrect, EAP triggers a return process and records the exception log; the return process includes interrupting the virtual processing flow and notifying the upstream system to reschedule.

[0110] The method also includes the following steps to extend monitoring and optimization capabilities:

[0111] S8. Monitor the data flow in the virtual semiconductor manufacturing plant and periodically audit the consistency of Carrier ID data and Slot Map data in the data exchange center;

[0112] S9. Simulate abnormal handling scenarios, including data loss, network interruption, and high-concurrency errors, to test the fault tolerance capability of the data interaction center; evaluate the reliability of the method by monitoring data recovery time and error rate, and record the test results for optimization.

[0113] S8 includes the following steps to refine monitoring and testing operations:

[0114] S81. Dynamically adjust the query frequency and data storage strategy of the data interaction center according to the report to match the load changes of the virtual semiconductor manufacturing plant;

[0115] S82. Introduce stress testing to simulate high-concurrency read scenarios and verify the scalability and stability of the method.

[0116] The operational steps of a method for monitoring wafer carriers in a virtual semiconductor fab are as follows:

[0117] Step 1: Configure the middleware of the data interaction center

[0118] In the virtual semiconductor manufacturing plant scenario, the middleware of the data interaction center is first configured as the data interaction center. This middleware adopts a centralized architecture, connecting MCS, MES and multiple machines, and simulating the reading capability of hardware scanning equipment. The specific principles include: initializing the data table structure of the data interaction center, setting the vehicle identifier, machine location and timestamp fields to support concurrent access by multiple machines, and establishing communication connections through standard network protocols to ensure real-time data synchronization. This step lays the foundation for subsequent data operations and realizes centralized management of data flow in the virtual environment.

[0119] Step 2: Collect and insert Carrier ID data

[0120] MCS monitors the material handling tasks in the virtual semiconductor manufacturing plant. At the end of the task, it automatically collects the Carrier ID data of the current vehicle. MCS inserts the Carrier ID data into a designated data table in the data interaction center through the application programming interface and associates it with the machine position information to ensure that the data is consistent with the physical movement in the virtual scene. The data interaction center verifies the validity of the Carrier ID data in real time, including checking whether the data format conforms to the standard. If it is invalid, it returns an error message to MCS and triggers the data cleaning process. This step ensures the accuracy and integrity of the Carrier ID data through intelligent collection and verification.

[0121] Step 3: Query Slot Map data

[0122] Based on the received Carrier ID data, the Data Interaction Center proactively sends a query request to the MES (Manufacturing Execution System) to obtain the corresponding Slot Map data. The query process uses a standardized request format, including calling the MES's internal database via an HTTP interface. After the MES returns the Slot Map data, the Data Interaction Center parses the data content, including wafer slot status and sequence information, and calculates the data verification accuracy. This step, through a dynamic query mechanism, achieves precise association between Carrier ID data and the Slot Map, avoiding data omissions and misalignments.

[0123] Step 4: Store data association

[0124] The data interaction center stores Carrier ID data and Slot Map data in key-value pairs in memory or a persistent database, and updates the timestamp and status fields of the data tables. At the same time, a data backup mechanism is implemented to archive data regularly to ensure fault tolerance in the virtual environment. During the storage process, the data interaction center calculates backup integrity indicators, including the proportion of data that is successfully backed up, and triggers a retry mechanism when data is abnormal. This step ensures the reliability and traceability of data through an efficient storage strategy.

[0125] Step 5: The machine reads the data.

[0126] When the machine detects the arrival of the carrier or receives the S3F17 proceed command from EAP, it sends a read request to the data interaction center. Based on the machine position parameters in the request, the data interaction center retrieves matching Carrier ID data and SlotMap data, and returns them to the machine in a simulated hardware output format. During the read process, the system calculates the data matching accuracy to ensure consistency between the machine position and the data. This step, through an event-driven mechanism, enables on-demand data reading, improving the real-time performance of virtual machining.

[0127] Step Six: Data Reporting and Verification

[0128] The machine parses the Carrier ID data and Slot Map data obtained from the data interaction center, converts them into a message format that EAP can recognize, and reports them to EAP through an event-driven mechanism. After EAP confirms receipt of the data, it triggers a verification process to compare the data with the standard process rules of the virtual semiconductor manufacturing plant. The system also monitors the reporting timeliness and optimizes the event triggering frequency. This step ensures the correctness of the data in the processing flow through multi-layer verification.

[0129] Step 7: Issuance and Processing of Instructions

[0130] Based on the verification results, EAP issues process job and control job instructions to start the virtual processing flow. When the data is incorrect, EAP triggers return processing, records error logs and stops processing. The system calculates virtual processing efficiency indicators, including the proportion of effective processing time, and issues warnings when efficiency is low. This step achieves autonomous optimization and error correction of the virtual environment through closed-loop control.

[0131] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0132] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for monitoring a virtual semiconductor fab wafer carrier, characterized in that, The method includes the following steps: S1. Configure the middleware of the data interaction center to connect MCS, MES and machine tools, and build the data interaction center; S2. At the end of the handling task, the Carrier ID data corresponding to the wafer carrier being handled is stored in the data interaction center through the MCS and associated with the current machine position; S3. The data interaction center actively queries the MES for the corresponding Slot Map data based on the Carrier ID data, and receives the returned Slot Map data. S4. The data interaction center associates and stores the Carrier ID data with the Slot Map data to form a complete data record; S5. When the machine needs to read data, it sends a request to the data interaction center to obtain Carrier ID data and Slot Map data that match the machine's location. S6. The machine reports the Carrier ID data and Slot Map data to the EAP to achieve operation control; S7. The EAP verifies the correctness of the data. If it is correct, a processing instruction is issued; otherwise, a return process is triggered. In step S1, the process of configuring the middleware of the data interaction center in the virtual semiconductor manufacturing plant scenario, connecting the MCS, MES, and equipment, and constructing the data interaction center includes: S11. In the virtual semiconductor manufacturing plant scenario, initialize the middleware of the data interaction center and adopt a centralized architecture to support concurrent access by multiple machines; S12. Establish communication connections between the data interaction center and MCS, MES and machine tools, and use standard network protocols to simulate hardware interfaces. S13. Configure the data table structure of the data interaction center, including vehicle identifier, machine location and timestamp fields, to construct the data interaction center; The process in S3 where the data interaction center actively queries the MES for the corresponding SlotMap data based on the Carrier ID data and receives the returned SlotMap data includes: S31. The data interaction center parses the Carrier ID data received from the MCS and generates a standardized query request; S32. The data interaction center sends a query request to the MES through standard interfaces, including HTTP and HSMS, to obtain the corresponding Slot Map data. S33. The MES queries the internal database based on the Carrier ID data and returns Slot Map data, including wafer slot status information; S34. The data interaction center receives and stores the Slot Map data, and the verification is handled by EAP. The method also includes the following steps to extend monitoring and optimization capabilities: S8. Monitor data flow and periodically sample and check data consistency, rather than conducting a comprehensive audit of dynamic data; S9. Simulate abnormal handling scenarios, including data loss, network interruption, and high-concurrency errors, to test the fault tolerance capability of the data interaction center; evaluate the reliability of the method by monitoring data recovery time and error rate, and record the test results for optimization.

2. The method for monitoring virtual semiconductor fab wafer carriers according to claim 1, characterized in that, In step S2, the process of inserting the Carrier ID data into the data interaction center via the MCS and associating it with the current machine location at the end of the handling task includes: S21. The MCS monitors the handling tasks in the virtual semiconductor manufacturing plant and obtains the Carrier ID data of the current vehicle when the task ends. S22. The MCS stores the Carrier ID data in a designated data table of the data interaction center through the application programming interface and associates it with the machine location information; S23. The data interaction center receives and stores the Carrier ID data without verification; if the data format is incorrect, it is handled directly by the MCS.

3. The method for monitoring virtual semiconductor fab wafer carriers according to claim 1, characterized in that, The process by which the data interaction center in S4 associates and stores the Carrier ID data with the Slot Map to form a complete data record includes: S41. The data interaction center stores Carrier ID data, Slot Map data, and machine location in a database table, using a multi-field structure. S42. Update the timestamp and status fields of the data table in the data interaction center to reflect the latest version of the data; S43. Implement a data backup mechanism to regularly archive Carrier ID data and Slot Map data to prevent data loss in the virtual environment.

4. The method for monitoring virtual semiconductor fab wafer carriers according to claim 1, characterized in that, In step S5, when the machine needs to read data, the process of sending a request to the data interaction center to obtain Carrier ID data and Slot Map data matching the machine's location includes: S51. After detecting the arrival of the vehicle and receiving the EAP instruction, the machine sends a read request to the data interaction center. S52. The data interaction center retrieves matching Carrier ID data and Slot Map data based on the machine location parameters in the request; S53. The data interaction center returns data to the machine in a format that simulates hardware output to ensure consistency in the virtual environment.

5. The method for monitoring virtual semiconductor fab wafer carriers according to claim 1, characterized in that, The process in S6 where the machine reports the Carrier ID data and Slot Map to the EAP to achieve job control includes: S61. The machine parses the Carrier ID data and Slot Map data obtained from the data interaction center and converts them into a message format that EAP can recognize. S62. The machine reports data through an event-driven mechanism, and the content is defined by EAP binding parameters; S63. The EAP confirms receipt of data and triggers the verification process.

6. The method for monitoring virtual semiconductor fab wafer carriers according to claim 1, characterized in that, The process of verifying the correctness of the EAP data in S7, and issuing a processing instruction if it is correct, otherwise triggering a return process, includes: S71. The EAP compares the received Carrier ID data and Slot Map data with the standard process rules of the virtual semiconductor manufacturing plant. S72. When the data is correct, the EAP issues process job and control job instructions to start the virtual processing flow; S73. When the data is incorrect, the EAP triggers a return process and records an error log; the return process includes interrupting the virtual processing flow and notifying the upstream system to reschedule.

7. The method for monitoring virtual semiconductor fab wafer carriers according to claim 1, characterized in that, The S8 includes the following steps to refine the monitoring and testing operations: S81. Dynamically adjust the query frequency and data storage strategy of the data interaction center according to the report to match the load changes of the virtual semiconductor manufacturing plant; S82. Introduce stress testing to simulate high-concurrency read scenarios and verify the scalability and stability of the method.

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