Electronic device

Abstract

The invention discloses an electronic device. The electronic equipment comprises a heat source, a soaking piece, a first heat dissipation piece, a second heat dissipation piece, a thermoelectric refrigerating unit and a fan. The soaking part is positioned on one side of the heat source and is thermally connected to the heat source; the first heat dissipation piece comprises a first bearing part, a second bearing part, a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, the first bearing part conducts heat with a heat source, the second bearing part and the second bearing part are oppositely arranged at intervals, the first heat dissipation fins are connected to the first bearing part and arranged at intervals with the second bearing part, and the second heat dissipation fins are connected to the second bearing part and arranged at intervals with the first bearing part. The first heat dissipation fins and the second heat dissipation fins are arranged in a staggered mode. The thermoelectric refrigerating unit is arranged on the side, away from the first bearing part, of the second bearing part and provided with a cold face and a hot face, and the hot face deviates from the second bearing part compared with the cold face. The second heat dissipation piece is positioned on one side of the hot surface; the fan is communicated with the first air channel of the first heat dissipation piece and the second air channel of the second heat dissipation piece. The electronic equipment provided by the invention has a relatively good heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of communication technology, specifically to an electronic device. Background Technology

[0002] With technological advancements, mobile phones and other electronic devices are becoming increasingly ubiquitous and powerful. Consequently, the demands on heat dissipation in these devices are also rising. However, inadequate heat dissipation remains a persistent problem in related technologies. Summary of the Invention

[0003] One embodiment of this application provides an electronic device, the electronic device comprising: Heat source; A heat spreader is located on one side of the heat source and is thermally connected to the heat source; A first heat sink includes a first support portion, a second support portion, a plurality of first heat sink fins, and a plurality of second heat sink fins. The first support portion conducts heat with the heat source. The second support portion is opposite to and spaced apart from the first support portion. The first heat sink fins are connected to the surface of the first support portion facing the second support portion and are spaced apart from the second support portion. The second heat sink fins are connected to the surface of the second support portion facing the first support portion and are spaced apart from the first support portion and offset from the first heat sink fins. The first heat sink has a first air duct. A thermoelectric cooler is disposed on the side of the second support portion away from the first support portion. The thermoelectric cooler has a cold surface and a hot surface, and the hot surface is away from the second support portion relative to the cold surface. A second heat sink is located on one side of the hot surface, and the second heat sink has a second air duct; and A fan is connected to the first air duct, and the fan is also connected to the second air duct.

[0004] In summary, the electronic device provided in this application includes a heat source, a heat spreader, a first heat sink, a thermoelectric cooler, a second heat sink, and a fan. The heat spreader is located on one side of the heat source and is thermally connected to the heat source. The heat emitted by the heat source is transferred to the heat spreader and dissipated through the heat spreader, thereby reducing or even preventing overheating of the heat source from damaging the heat source itself and surrounding devices. Furthermore, the first heat sink fin is connected to the surface of the first support portion facing the second support portion and is spaced apart from the second support portion; the second heat sink fin is connected to the surface of the second support portion facing the first support portion; the second heat sink fin is spaced apart from the first support portion and offset from the first heat sink fin; therefore, the heat from the first heat sink fin is transferred to the second support portion via the air located between and around the first heat sink fin and the second support portion, and the air around the second heat sink fin transfers heat to the second heat sink fin and then to the second support portion via the second heat sink fin; the air transfers heat relatively slowly, thus preventing a large amount of heat from accumulating in the second support portion. When the temperature difference between the cold and hot surfaces of the thermoelectric cooler is constant, the excessively high temperature of the hot surface of the thermoelectric cooler can be reduced or even avoided, thereby reducing or even avoiding adverse effects on other components of the electronic device. Furthermore, the first heat sink has a first air duct, the second heat sink has a second air duct, and the fan is connected to both the first and second air ducts; therefore, if at least one of the first and second air ducts is ventilated, heat dissipation can be further accelerated, further improving the heat dissipation effect. Attached Figure Description

[0005] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 A perspective view of an electronic device provided according to an embodiment of this application; Figure 2 One implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 3 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 4 for Figure 2 An exploded three-dimensional diagram of a portion of the structure of the electronic device shown. Figure 5 for Figure 2 or Figure 3 A detailed schematic diagram of the first heat sink shown in the image; Figure 6 This is a schematic diagram of the structure of a thermoelectric cooler provided in one embodiment of this application; Figure 7 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 8 A schematic diagram of an electronic device provided according to another embodiment of this application; Figure 9 A schematic diagram of an electronic device provided in yet another embodiment of this application; Figure 10 for Figure 9 An exploded view of the components shown; Figure 11 for Figure 9 A schematic diagram of the first heat sink component; Figure 12 A schematic diagram of an electronic device provided in yet another embodiment of this application; Figure 13 A schematic diagram of an electronic device provided in yet another embodiment of this application; Figure 14 for Figure 13 An exploded three-dimensional diagram of the electronic device shown. Figure 15 for Figure 13 A detailed schematic diagram of the first heat sink component; Figure 16 for Figure 13 A detailed schematic diagram of the second heat sink component; Figure 17 A schematic diagram of an electronic device provided in another embodiment of this application; Figure 18 for Figure 17 An exploded three-dimensional diagram of the electronic device shown. Figure 19 for Figure 17 A detailed schematic diagram of the first heat sink component; Figure 20 for Figure 17 A detailed schematic diagram of the second heat sink component; Figures 21 to 24 These are cross-sectional schematic diagrams of electronic devices provided in various different implementation methods; Figure 25 One implementation method Figure 1 A schematic cross-sectional view of the provided electronic device along line II; Figure 26 Another implementation Figure 1A schematic cross-sectional view of the provided electronic device along line II; Figure 27 for Figure 21 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 28 for Figure 22 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 29 for Figure 23 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 30 for Figure 24 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 31 This is a schematic diagram of an electronic device provided in yet another embodiment of this application. Detailed Implementation

[0006] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. In addition, the reference to "embodiment" or "implementation method" in this application means that a specific feature, structure or characteristic described in connection with the embodiment or implementation method can be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art will understand explicitly and implicitly that the embodiments described in this application can be combined with other embodiments. It should be noted that, for ease of explanation, the same reference numerals denote the same parts in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same parts are omitted in different embodiments.

[0007] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0008] This application provides an electronic device 1, which can be, but is not limited to, a mobile phone, watch, tablet computer, laptop computer, etc. This application uses a mobile phone as an example for illustration and description; however, this should not be construed as limiting the scope of this application. Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A perspective view of an electronic device provided according to an embodiment of this application; Figure 2 One implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 3 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 4 for Figure 2 The diagram shows a partial exploded perspective view of the electronic device 1. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader 120 is located on one side of the heat source 110 and is thermally connected to the heat source 110. The first heat sink 130 includes a first support portion 131, a second support portion 132, a plurality of first heat dissipation fins 133, and a plurality of second heat dissipation fins 134. The first support portion 131 is thermally conductive to the heat source 110. The second support portion 132 is opposite to and spaced apart from the first support portion 131. The first heat dissipation fins 133 are connected to the surface of the first support portion 131 facing the second support portion 132 and are spaced apart from the second support portion 132. The second heat dissipation fins 134 are connected to the surface of the second support portion 132 facing the first support portion 131. The second heat dissipation fin 134 is spaced apart from the first support portion 131 and offset from the first heat dissipation fin 133. The first heat sink 130 has a first air duct 130a. The thermoelectric cooler 140 is disposed on the side of the second support portion 132 opposite to the first support portion 131. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b, the hot surface 140b being opposite to the second support portion 132 compared to the cold surface 140a. The second heat sink 150 is located on one side of the hot surface 140b, and the second heat sink 150 has a second air duct 150a. The fan 160 is connected to the first air duct 130a and the second air duct 150a.

[0009] In one embodiment, the heat source 110 is a functional device in the electronic device 1 that generates heat. The heat source 110 can be, but is not limited to, a central processing unit (CPU), a system-on-chip (SOC), a power management chip, or a camera, etc. This application does not limit the heat source 110. When the functional device is working, it generates heat. If the heat is not dissipated in time, the temperature of the functional device will become too high, which may damage the functional device or prevent it from performing its functions properly. Furthermore, when the temperature of the functional device is too high, it may also adversely affect other components around the functional device.

[0010] The heat source 110 has a first heat dissipation surface 110a and a second heat dissipation surface 110b disposed opposite to each other along a first direction D1. In this embodiment, the first direction D1 is the thickness direction of the heat source 110. In the schematic diagram of this embodiment, the first heat dissipation surface 110a is the lower surface of the heat source 110, and the second heat dissipation surface 110b is the lower surface of the heat source 110. It can be understood that the positions of the first heat dissipation surface 110a and the second heat dissipation surface 110b will change depending on the placement posture of the electronic device 1.

[0011] It should be noted that the term "thermally conductive connection" mentioned in the electronic device 1 provided in this application is intended to indicate that one of the two components can transfer heat to the other, or that there is a heat transfer path between the two components. When the two components are "thermally conductive connected," one of the two components is fixed to the other; alternatively, one of the two components may not be fixed to the other. "Thermally conductive connection" should not be interpreted as meaning that one of the two components must necessarily be fixed to the other.

[0012] The heat spreader 120 is located on one side of the heat source 110 and is thermally connected to the heat source 110. Specifically, the heat spreader 120 is located on one side of the first heat dissipation surface 110a, and the heat spreader 120 can conduct heat with the first heat dissipation surface 110a. The heat spreader 120 being located on one side of the first heat dissipation surface 110a includes the heat spreader 120 being in direct contact with the first heat dissipation surface 110a, and also includes the heat spreader 120 being in indirect contact with the first heat dissipation surface 110a. The heat spreader 120 can receive the heat generated by the heat source 110. In other words, the heat generated by the heat source 110 can be transferred to the heat spreader 120. The heat generated by the heat source 110 is transferred to the heat spreader 120 and dissipated through the heat spreader 120. In one embodiment, the heat spreader 120 directly contacts the first heat dissipation surface 110a of the heat source 110 to conduct heat with the heat source 110. In another embodiment, the heat spreader 120 is indirectly in contact with the first heat dissipation surface 110a. For example, the heat spreader 120 conducts heat to the first heat dissipation surface 110a of the heat source 110 through a thermally conductive connector. This application does not limit the manner in which the heat spreader 120 is thermally connected to the heat source 110.

[0013] In one embodiment, the heat spreader 120 includes one or more sub-heat spreaders. The sub-heat spreaders include one or more of the following: a vapor chamber (VC), a graphite sheet, a graphene sheet, a liquid cooling plate, and a thermally conductive metal sheet. See also... Figure 2 The heat spreader 120 includes a sub-heat spreader, and the sub-heat spreader includes a heat spreader plate as an example.

[0014] Please see Figure 3 The heat spreader 120 is illustrated using two sub-heat spreaders stacked in a uniform manner, but this should not be construed as a limitation on the embodiments of this application. In this embodiment, the two sub-heat spreaders are a heat spreader plate and a graphite sheet, respectively. In other words, in this embodiment, the heat spreader 120 includes a heat spreader plate and a graphite sheet stacked in a uniform manner. For ease of description, the two sub-heat spreaders are respectively named a first sub-heat spreader 121 and a second sub-heat spreader 122, which are stacked in a uniform manner. The first sub-heat spreader 121 includes a heat spreader plate (VC), and the second sub-heat spreader 122 includes a graphite sheet. The heat spreader plate can be, but is not limited to, a stainless steel heat spreader plate, a copper heat spreader plate, a stainless steel composite copper heat spreader plate, or an aluminum composite copper heat spreader plate. The thermally conductive metal sheet includes, but is not limited to, a copper sheet or an aluminum sheet. The second sub-heating element 122 of the heat-spreading element 120 is located away from the heat source 110 compared to the first sub-heating element 121.

[0015] In one embodiment, a portion of the heat spreader 120 is disposed corresponding to the heat source 110, and another portion of the heat spreader 120 protrudes from the outer periphery of the heat source 110. In other words, the orthographic projection of the heat source 110 onto the heat spreader 120 is located in a portion of the heat spreader 120. In the electronic device 1 provided in this application embodiment, a portion of the heat spreader 120 is disposed corresponding to the heat source 110, and another portion of the heat spreader 120 protrudes from the outer periphery of the heat source 110. Therefore, the heat spreader 120 is relatively large, and the heat generated by the heat source 110 can be better dispersed when transferred to the heat spreader 120, thereby improving the heat dissipation effect.

[0016] Please refer to the following: Figures 1 to 4 ,as well as Figure 5 , Figure 5 for Figure 2 or Figure 3 The diagram shows a detailed representation of the first heat sink. From the perspective of the schematic diagram in this embodiment, the first support portion 131 is the lower part of the first heat sink 130, and the second support portion 132 is the upper part of the first heat sink 130. The first support portion 131 conducts heat with the heat source 110. The first support portion 131 may be in direct contact with the heat source 110, or it may be in indirect contact with the heat source 110. This application does not limit whether the first support portion 131 is in direct or indirect contact with the heat source 110, as long as the first support portion 131 conducts heat with the heat source 110. The second support portion 132 is opposite to and spaced apart from the first support portion 131, and the second support portion 132 is further away from the heat source 110 than the first support portion 131.

[0017] One end of the first heat dissipation fin 133 is connected to the surface of the first support portion 131 facing the second support portion 132, and the other end of the first heat dissipation fin 133 is spaced apart from the second support portion 132. In other words, there is a gap (marked as 133a) between the other end of the first heat dissipation fin 133 and the second support portion 132, and they are not in direct contact. One end of the second heat dissipation fin 134 is connected to the surface of the second support portion 132 facing the first support portion 131, and the other end of the second heat dissipation fin 134 is spaced apart from the first support portion 131. In other words, there is a gap (marked as 134a) between the other end of the second heat dissipation fin 134 and the first support portion 131, and they are not in direct contact. The second heat dissipation fin 134 is offset from the first heat dissipation fin 133, and there is a gap between the second heat dissipation fin and the first heat dissipation fin 133. The specific embodiments included in the offset arrangement of the second heat dissipation fin 134 and the first heat dissipation fin 133 will be described in detail later.

[0018] In one embodiment, the first support portion 131 and the plurality of first heat dissipation fins 133 are an integral structure or two independent structures; this application does not limit this. Correspondingly, the second support portion 132 and the plurality of second heat dissipation fins 134 are an integral structure or two independent structures; this application does not limit this.

[0019] In this embodiment, the first heat sink 130 further includes a connecting portion 135, which is connected to the periphery of the first support portion 131 and the second support portion 132. In one embodiment, the first support portion 131, the connecting portion, and the second support portion 132 are an integral structure; in other embodiments, at least one of the connecting portion 135 and the first support portion 131 and the second support portion 132 is a separate structure.

[0020] In one embodiment, the first support portion 131, the second support portion 132, the plurality of first heat dissipation fins 133, and the plurality of second heat dissipation fins 134 cooperate to form the first air duct 130a. In other embodiments, the plurality of first heat dissipation fins 133 and the plurality of second heat dissipation fins 134 cooperate to form the first air duct 130a. Airflow in the first air duct 130a can accelerate heat dissipation from the first heat sink 130, thereby accelerating the reduction of the temperature of the heat source 110.

[0021] The first support portion 131 and the second support portion 132 are the substrates in the first heat sink 130, and the first heat sink fin 133 and the second heat sink fin 134 are the heat dissipation portions in the first heat sink 130. The first support portion 131 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The first heat sink fin 133 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the first heat sink fin 133 may be the same as or different from that of the first support portion 131; this is not limited here. The second support portion 132 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The second heat sink fin 134 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the second heat sink fin 134 may be the same as or different from that of the second support portion 132; this is not limited here.

[0022] The second heat sink 150 is located on one side of the hot surface 140b, and the heat from the thermoelectric cooler 140 is conducted to the second heat sink 150 via the hot surface 140b. The second heat sink 150 may be in direct or indirect contact with the hot surface 140b of the thermoelectric cooler 140; this application does not limit this, as long as the heat from the thermoelectric cooler 140 can be transferred to the second heat sink 150 via the hot surface 140b. The second heat sink 150 has a second air duct 150a. Airflow in the second air duct 150a accelerates heat dissipation from the second heat sink 150, thereby accelerating the reduction of the temperature of the heat source 110.

[0023] Fan 160 is a heat dissipation device that accelerates airflow by being driven by electrical energy. Fan 160 can be, but is not limited to, a miniature centrifugal fan, a piezoelectric fan, or an axial fan, as long as it can actively move air from one side to the other. The number of fans can be, but is not limited to, one or more sub-fans. If the electronic device 1 includes multiple sub-fans, these sub-fans can be connected in parallel, in series, or in a combination of series and parallel connections to further improve the heat dissipation effect. This effectively increases airflow or overcomes the system's air resistance.

[0024] The fan 160 is connected to the first air duct 130a. The fan 160 can draw air into the first air duct 130a or exhaust air out of the first air duct 130a to remove heat from the first heat sink 130, thereby accelerating the heat dissipation of the heat source 110.

[0025] Accordingly, the fan 160 is connected to the second air duct 150a. The fan 160 can draw air into the second air duct 150a or exhaust air from the second air duct 150a to remove heat from the second heat sink 150, thereby accelerating the heat dissipation of the heat source 110.

[0026] The electronic device 1 provided in this application embodiment includes a heat spreader 120, a first heat sink 130, and a second heat sink 150, all of which are passive heat dissipation devices. The thermoelectric cooler 140 and the fan 160 are both active heat dissipation devices. Compared to passive heat dissipation devices, active heat dissipation devices have a faster heat dissipation speed, thus achieving rapid heat dissipation. The electronic device 1 provided in this application embodiment includes a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. Appropriate heat dissipation strategies can be selected according to the actual situation of the electronic device 1. The heat dissipation strategies of the electronic device 1 will be described in detail later.

[0027] Please see Figure 6 , Figure 6This is a schematic diagram of the structure of a thermoelectric cooler provided in one embodiment of this application. The thermoelectric cooler 140 (TEC) is also called a semiconductor cooler or a semiconductor refrigeration chip. A semiconductor refrigeration chip is generally composed of many N-type semiconductor particles and many P-type semiconductor particles arranged together. Specifically, the thermoelectric cooler 140 includes an N-type semiconductor 141 and a P-type semiconductor 142. The N-type semiconductor 141 and the P-type semiconductor 142 are connected by a conductor 143 to form a complete circuit. The conductor is typically copper, aluminum, or other metal. When current flows through the thermocouple pair formed by the N-type and P-type semiconductor materials, heat transfer occurs between the two ends, creating a temperature difference that forms a cold end and a hot end. The junction where current flows from the N-type semiconductor to the P-type semiconductor absorbs heat, becoming the cold end; the junction where current flows from the P-type semiconductor to the N-type semiconductor releases heat, becoming the hot end. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b, wherein the cold surface 140a corresponds to the cold end, and the hot surface 140b corresponds to the hot end. In this embodiment, the hot surface 140b of the thermoelectric cooler 140 is disposed opposite to the cold surface 140a. It should be noted that the cold surface 140a refers to the surface corresponding to the cold end when the thermoelectric cooler 140 is in the working state, and the hot surface 140b refers to the surface corresponding to the hot end when the thermoelectric cooler 140 is in operation; it is not a limitation on the working state of the thermoelectric cooler 140. The working state of the thermoelectric cooler 140 can be limited according to the specific situation of the electronic device 1. If the thermoelectric cooler 140 is in the working state, the temperature of the cold surface 140a is lower than the temperature of the hot surface 140b. If the thermoelectric cooler 140 is in the initial state, the temperature of the cold surface 140a is equal to or approximately equal to the temperature of the hot surface 140b.

[0028] The electronic device 1 provided in this application embodiment has a first support portion 131 of a first heat sink 130 that conducts heat to a heat source 110, allowing heat generated by the heat source 110 to be transferred to the first support portion 131. The first heat sink fins 133 of the first heat sink 130 are connected to the surface of the first support portion 131 facing the second support portion 132, and the first heat sink fins 133 and the second support portion 132 are spaced apart. Therefore, the heat from the first heat sink fins 133 is transferred to the second support portion 132 via the air located between and around the first heat sink fins 133 and the second support portion 132. Correspondingly, the second heat sink fins 134 are connected to the surface of the first support portion 131 facing the first support portion 131, and the second heat sink fins 134 are spaced apart from the first support portion 131, while the first heat sink fins 133 are offset from the first heat sink fins 133. Therefore, the second heat sink fins 134 receive heat transferred to them by the air.

[0029] If one end of the first heat dissipation fin 133 is connected to the first support portion 131, and the other end of the first heat dissipation fin 133 is connected to the second support portion 132, then the heat from the first heat dissipation portion can be transferred to the second heat dissipation portion via the first heat dissipation fin 133. Therefore, compared to the case where one end of the first heat dissipation fin 133 is connected to the first support portion 131 and the other end of the first heat dissipation fin 133 is connected to the second support portion 132, in the electronic device 1 provided in this application embodiment, the first heat dissipation fin 133 and the second support portion 132 are spaced apart, and the heat from the first heat dissipation fin 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fin 133 and the second support portion 132. Therefore, the heat transfer speed is relatively slow, thereby avoiding a large amount of heat accumulating in the second support portion 132. Furthermore, the second heat dissipation fin 134 is spaced apart from the first support portion 131, and the second heat dissipation fin 134 is staggered from the first heat dissipation fin 133. This also makes the heat transfer speed from the air around the second heat dissipation fin 134 to the second heat dissipation fin 134 relatively slow, and also avoids a large amount of heat accumulating in the second support portion 132.

[0030] The thermoelectric cooler 140 is disposed on the side of the second support portion 132 opposite to the first support portion 131. Specifically, the thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b. The cold surface 140a faces the second support portion 132 and is thermally connected to the second support portion 132. The hot surface 140b is further away from the second support portion 132 than the cold surface 140a; therefore, the cold surface 140a is closer to the second support portion 132 than the hot surface 140b. The second support portion 132 conducts heat with the cold surface 140a of the thermoelectric cooler 140. If a large amount of heat accumulates in the second support part 132, the temperature of the cold surface 140a of the thermoelectric cooler 140 will also be high; when the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 will also be high, which will lead to adverse effects on other components of the electronic device 1.

[0031] The electronic device 1 provided in this application embodiment has a first heat dissipation fin 133 spaced apart from the second support portion 132, and a second heat dissipation fin 134 spaced apart from the first support portion 131 and offset from the first heat dissipation fin 133. The offset arrangement of the second heat dissipation fin 134 from the first heat dissipation fin 133 is also referred to as an alternating arrangement of the second heat dissipation fin 134 and the first heat dissipation fin 133. The specific manner in which the second heat dissipation fin 134 and the first heat dissipation fin 133 are alternating will be described later. Therefore, the heat from the first heat dissipation fin 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fin 133 and the second support portion 132. The air around the second heat dissipation fin 134 transfers heat to the second heat dissipation fin 134 and then to the second support portion 132 via the second heat dissipation fin 134. The air conducts heat relatively slowly, thus avoiding a large amount of heat accumulating in the second support portion 132. This can reduce or even prevent the temperature of the hot surface 140b of the thermoelectric cooler 140 from becoming too high, thereby reducing or even preventing adverse effects on other components of the electronic device 1.

[0032] In summary, the electronic device 1 provided in this application includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader is located on one side of the heat source 110 and is thermally connected to the heat source 110. The heat emitted by the heat source 110 is transferred to the heat spreader 120 and dissipated through the heat spreader 120, thereby reducing or even preventing overheating of the heat source 110 from causing damage to the heat source 110 itself and the surrounding devices. Furthermore, the first heat dissipation fin 133 is connected to the surface of the first support portion 131 facing the second support portion 132 and is spaced apart from the second support portion 132; the second heat dissipation fin 134 is connected to the surface of the second support portion 132 facing the first support portion 131; the second heat dissipation fin 134 is spaced apart from the first support portion 131 and staggered from the first heat dissipation fin 133; therefore, the heat from the first heat dissipation fin 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fin 133 and the second support portion 132, and the air around the second heat dissipation fin 134 transfers heat to the second heat dissipation fin 134 and then to the second support portion 132 via the second heat dissipation fin 134; the speed of heat transfer by air is relatively slow, thereby avoiding a large amount of heat accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1. Furthermore, the first heat sink 130 has a first air duct 130a, the second heat sink 150 has a second air duct 150a, and the fan 160 is connected to both the first air duct 130a and the second air duct 150a; therefore, if at least one of the first air duct 130a and the second air duct 150a is ventilated, heat dissipation can be further accelerated, further improving the heat dissipation effect.

[0033] Please continue reading. Figures 2 to 5 In this embodiment, the heat source 110 and the first heat sink 130 are both located on the same side of the heat spreader 120, and the heat source 110 and the first heat sink 130 are disposed at different locations on the heat spreader 120. The first heat sink fins 133 of the plurality of first heat sink fins 133 and the second heat sink fins 134 of the plurality of second heat sink fins 134 are arranged sequentially at intervals.

[0034] In this embodiment, the heat source 110 and the first heat sink 130 are both located on the same side of the heat spreader. When the thickness of the heat source 110, the thickness of the heat spreader, and the thickness of the first heat sink 130 are all fixed, compared to the case where the heat spreader, the heat source 110, and the first heat sink 130 are stacked sequentially, the electronic device 1 provided in this application has the heat source 110 and the first heat sink 130 both located on the same side of the heat source 110, and the heat source 110 and the first heat sink 130 are set at different locations corresponding to the heat spreader 120, which makes the thickness of the electronic device 1 smaller. When the thickness of the electronic device 1 is constant, the heat source 110 and the first heat sink 130 of the electronic device 1 provided by the method described in this application are both located on the same side of the heat source 110, and the heat source 110 and the first heat sink 130 are provided at different locations corresponding to the heat spreader 120, which can make at least one of the heat spreader 120 and the first heat sink 130 thicker, thereby improving the heat dissipation effect.

[0035] The first heat dissipation fins 133 and the second heat dissipation fins 134 of the plurality of first heat dissipation fins 133 are arranged sequentially at intervals. Specifically, there is a first gap between two adjacent first heat dissipation fins 133, and the second heat dissipation fins 134 are arranged corresponding to the first gap. Correspondingly, there is a second gap between two adjacent second heat dissipation fins 134, and the first heat dissipation fins 133 are arranged corresponding to the second gap.

[0036] In this embodiment, the first heat dissipation fins 133 and the second heat dissipation fins 134 are arranged alternately in sequence. Therefore, the heat from the first heat dissipation fins 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fins 133 and the second support portion 132. The air around the second heat dissipation fins 134 transfers heat to the second heat dissipation fins 134 and then to the second support portion 132. The heat transfer speed of the air is relatively slow, thus avoiding a large amount of heat accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1.

[0037] Please continue reading. Figures 2 to 5The first support portion 131 has a first sub-support portion 1311 and a second sub-support portion 1312 connected together. A first heat dissipation fin 133 is connected to the first sub-support portion 1311 and avoids the second sub-support portion 1312. The second support portion 132 has a third sub-support portion 1321 and a fourth sub-support portion 1322 connected together. The third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311, and the fourth sub-support portion 1322 is disposed opposite to the second sub-support portion 1312. A second heat dissipation fin 134 is connected to the third sub-support portion 1321 and avoids the fourth sub-support portion 1322. The thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321, and the fan 160 is disposed on the fourth sub-support portion 1322.

[0038] In this embodiment, the first heat dissipation fin 133 is connected to the first sub-support portion 1311, and the first heat dissipation fin 133 avoids the second sub-support portion 1312; the third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311, the fourth sub-support portion 1322 is disposed opposite to the second sub-support portion 1312, and the second heat dissipation fin 134 is connected to the third sub-support portion 1321 and avoids the fourth sub-support portion 1322; on the one hand, this makes the weight of the first heat sink 130 relatively small. On the other hand, compared to the first heat dissipation fin 133 also corresponding to the second sub-support portion 1312, and the second heat dissipation fin 134 also corresponding to the fourth sub-support portion 1322, in the electronic device 1 provided by the embodiments of this application, the number of the first heat dissipation fin 133 and the second heat dissipation fin 134 is relatively small, thereby avoiding a large amount of heat from accumulating in the second support portion 132 via the first heat dissipation fin 133 and the second heat dissipation fin 134. The speed of heat transfer through the air is relatively slow, thus avoiding a large amount of heat from accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1. Furthermore, the electronic device 1 provided by the embodiments of this application also facilitates the installation of the fan 160 in the fourth sub-support portion 1322.

[0039] In this embodiment, the thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321. The cold surface 140a of the thermoelectric cooler 140 conducts heat with the third sub-support portion 1321. Therefore, the heat from the third sub-support portion 1321 can be quickly conducted and transferred to the cold surface 140a of the thermoelectric cooler 140, and then conducted to the hot surface 140b of the thermoelectric cooler 140 via the action of the thermoelectric cooler 140. The fan 160 is disposed on the fourth sub-support portion 1322. The first heat dissipation fin 133 and the second heat dissipation fin 134 both avoid the fourth sub-support portion 1322, which also facilitates the installation of the fan 160 on the fourth sub-support portion 1322.

[0040] Please continue reading. Figures 2 to 5 The fourth sub-support portion 1322 is closer to the heat source 110 than the third sub-support portion 1321.

[0041] In this embodiment, the fourth sub-support portion 1322 is closer to the heat source 110 than the third sub-support portion 1321. The thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321, and the fan 160 is supported on the fourth sub-support portion 1322. Therefore, the fan 160 is closer to the heat source 110 than the thermoelectric cooler 140. In this embodiment, the fan 160 is closer to the heat source 110 than the second heat sink 150.

[0042] If the fan 160 is in operation, the fan 160 blows airflow from the first air duct 130a to the outside of the electronic device 1, and the fan 160 blows airflow from the second air duct 150a to the outside of the electronic device 1.

[0043] In this embodiment, the first air duct 130a has a first opening 131a adjacent to the fan 160 and a second opening 131b away from the fan 160. The second air duct 150a has a third opening 151a adjacent to the fan 160 and a second opening 131b away from the fan 160. In one embodiment, if the fan 160 is in operation: the fan 160 blows airflow into the first air duct 130a from the first opening 131a, and the airflow entering the first air duct 130a is blown out of the electronic device 1 through the second opening 131b; the fan 160 blows airflow into the second air duct 150a from the third opening 151a, and the airflow entering the second air duct 150a is blown out of the electronic device 1 through the fourth opening 151b.

[0044] Therefore, it can be seen that the electronic device 1 provided in this application embodiment has a positional relationship between the third sub-supporting part 1321 and the fourth sub-supporting part 1322 and the heat source 110. When the fan 160 is in working state, it can efficiently blow heat out of the first air duct 130a of the first heat sink 130 to the outside of the electronic device 1, and can also efficiently blow heat out of the second air duct 150a of the second heat sink 150 to the outside of the electronic device 1.

[0045] Please see Figures 2 to 5 ,and Figure 7 , Figure 7 Another implementation Figure 1 A cross-sectional schematic diagram of some components of the electronic device 1. In this embodiment, the electronic device 1 further includes a first circuit board 171, a first electronic device 181 (multiple devices shown), a second circuit board 172, a second electronic device 182 (multiple devices shown), and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and the first circuit board 171 is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is carried on the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182.

[0046] The first circuit board 171 can be, but is not limited to, a printed circuit board (PCB). The heat source 110 and the first electronic device 181 are located on opposite sides of the first circuit board 171. The second circuit board 172 can be, but is not limited to, a printed circuit board (PCB). The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is supported by the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. Thus, the first circuit board 171 and the second circuit board 172 are stacked. In the electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can also be referred to as a stacked board.

[0047] The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182 to reduce or even eliminate electromagnetic interference from the second electronic device 182 to other devices outside the shielding cover 190; correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the second electronic device 182 inside the electromagnetic shielding cover 190.

[0048] In this embodiment, the second circuit board 172 and the first circuit board 171 are stacked along the first direction. The heat source 110 and the first heat sink 130 are arranged in the second direction. In this embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can make full use of the space of the electronic device 1 in the first direction and reduce the space occupied in the second direction.

[0049] Please see Figures 2 to 5 ,and Figure 8 , Figure 8 A schematic diagram of an electronic device provided according to another embodiment of this application. Figure 8 Electronic device 1 corresponding to the implementation method and Figures 2 to 5 The electronic device 1 in the corresponding implementation is basically the same, except that, Figure 8 The corresponding embodiment provides an electronic device 1 that is a stacked board, while the embodiment of this application provides an electronic device 1 that is a single board. The specific description is as follows. The electronic device 1 further includes a first circuit board 171, a first electronic device 181, and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and the first circuit board 171 is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The shielding cover 190 is located on the side of the first circuit board 171 opposite to the heat source 110, and the shielding cover 190 is used to house the first electronic device 181.

[0050] In this embodiment, the first circuit board 171 can be, but is not limited to, a printed circuit board. In this embodiment, the heat source 110 and the first electronic device 181 are respectively disposed on opposite sides of the first circuit board 171 along the thickness direction.

[0051] The electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171 and the first electronic device 181, is also referred to as a single board.

[0052] The shielding cover 190 is located on the side of the first circuit board 171 away from the heat source 110. The shielding cover 190 is used to house the first electronic device 181 to reduce or even eliminate electromagnetic interference from the first electronic device 181 to other devices outside the shielding cover 190. Correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the electronic device 180 inside the electromagnetic shielding cover 190.

[0053] Compared to Figure 7 Regarding the electronic device 1 provided in the embodiments of this application, the layout of the first circuit board 171 and the first electronic device 181 can reduce the occupancy of the first direction by utilizing the dimensions in the second direction.

[0054] Please see Figure 9 , Figure 10 and Figure 11 , Figure 9 A schematic diagram of an electronic device provided in yet another embodiment of this application; Figure 10 for Figure 9 An exploded view of the components shown; Figure 11 for Figure 9A schematic diagram of the first heat sink in the device. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader 120 is located on one side of the heat source 110 and is thermally connected to the heat source 110. The first heat sink 130 includes a first support portion 131, a second support portion 132, a plurality of first heat dissipation fins 133, and a plurality of second heat dissipation fins 134. The first support portion 131 is thermally conductive to the heat source 110. The second support portion 132 is opposite to and spaced apart from the first support portion 131. The first heat dissipation fins 133 are connected to the surface of the first support portion 131 facing the second support portion 132 and are spaced apart from the second support portion 132. The second heat dissipation fins 134 are connected to the surface of the second support portion 132 facing the first support portion 131. The second heat dissipation fin 134 is spaced apart from the first support portion 131 and offset from the first heat dissipation fin 133. The first heat sink 130 has a first air duct 130a. The thermoelectric cooler 140 is disposed on one side of the first heat sink 130. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b, the hot surface 140b being away from the second support portion 132 relative to the cold surface 140a. The second heat sink 150 is located on one side of the hot surface 140b, and the second heat sink 150 has a second air duct 150a. The fan 160 is connected to the first air duct 130a and the second air duct 150a.

[0055] The heat source 110, the heat spreader 120, the first heat sink 130, the thermoelectric cooler 140, the second heat sink 150, and the fan 160 are described above and will not be repeated here.

[0056] Furthermore, in this embodiment, the heat source 110 and the first heat sink 130 are both located on the same side of the heat spreader 120, and the heat source 110 and the first heat sink 130 are disposed at different locations corresponding to the heat spreader 120. The plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134.

[0057] In this embodiment, the heat source 110 and the first heat sink 130 are both located on the same side of the heat spreader. When the thickness of the heat source 110, the thickness of the heat spreader, and the thickness of the first heat sink 130 are all fixed, compared to the case where the heat spreader, the heat source 110, and the first heat sink 130 are stacked sequentially, the electronic device 1 provided in this application has the heat source 110 and the first heat sink 130 both located on the same side of the heat source 110, and the heat source 110 and the first heat sink 130 are set at different locations corresponding to the heat spreader 120, which makes the thickness of the electronic device 1 smaller. When the thickness of the electronic device 1 is constant, the heat source 110 and the first heat sink 130 of the electronic device 1 provided by the method described in this application are both located on the same side of the heat source 110, and the heat source 110 and the first heat sink 130 are provided at different locations corresponding to the heat spreader 120, which can make at least one of the heat spreader 120 and the first heat sink 130 thicker, thereby improving the heat dissipation effect.

[0058] In this embodiment, the plurality of first heat dissipation fins 133 are generally located on one side of the plurality of second heat dissipation fins 134. In the schematic diagram of this embodiment, the plurality of first heat dissipation fins 133 are farther from the heat source 110 than the plurality of second heat dissipation fins 134. It is understood that in other embodiments, the plurality of first heat dissipation fins 133 are closer to the heat source 110 than the plurality of second heat dissipation fins 134. This application does not limit which of the plurality of first heat dissipation fins 133 and the plurality of second heat dissipation fins 134 is closer to the heat source 110, as long as the plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134. Having the plurality of first heat dissipation fins 133 located on one side of the plurality of second heat dissipation fins 134 facilitates the arrangement of the first and second heat dissipation fins 134, reducing the probability of direct contact between the first and second heat dissipation fins 133 and the second heat dissipation fins 134 due to manufacturing tolerances or other reasons.

[0059] In this embodiment, the plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134. Therefore, the heat from the plurality of first heat dissipation fins 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fins 133 and the second support portion 132. The air around the second heat dissipation fins 134 transfers heat to the second heat dissipation fins 134 and then to the second support portion 132 via the second heat dissipation fins 134. The heat transfer speed of the air is relatively slow, thereby avoiding a large amount of heat accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1.

[0060] Please continue reading. Figure 11 The first support portion 131 has a first sub-support portion 1311 and a second sub-support portion 1312 connected together. Figure 11 In the diagram, the boundary between the first sub-support portion 1311 and the second sub-support portion 1312 is indicated by a dashed line. The first heat dissipation fin 133 is connected to the first sub-support portion 1311, and the first heat dissipation fin 133 avoids the second sub-support portion 1312. The second support portion 132 has a connected third sub-support portion 1321 and a fourth sub-support portion 1322. Figure 11 In the diagram, the boundary between the third sub-support portion 1321 and the fourth sub-support portion 1322 is indicated by a dashed line. The third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311, and the fourth sub-support portion 1322 is disposed opposite to the second sub-support portion 1312. The second heat dissipation fin 134 is connected to the third sub-support portion 1321 and avoids the fourth sub-support portion 1322, wherein the fan 160 is disposed on the fourth sub-support portion 1322.

[0061] In this embodiment, the first heat dissipation fin 133 is connected to the first sub-support portion 1311, and the first heat dissipation fin 133 avoids the second sub-support portion 1312; the third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311, the fourth sub-support portion 1322 is disposed opposite to the second sub-support portion 1312, and the second heat dissipation fin 134 is connected to the third sub-support portion 1321 and avoids the fourth sub-support portion 1322; on the one hand, this makes the weight of the first heat sink 130 relatively small. On the other hand, compared to the first heat dissipation fin 133 also corresponding to the second sub-support portion 1312, and the second heat dissipation fin 134 also corresponding to the fourth sub-support portion 1322, in the electronic device 1 provided by the embodiments of this application, the number of the first heat dissipation fin 133 and the second heat dissipation fin 134 is relatively small, thereby avoiding a large amount of heat from accumulating in the second support portion 132 via the first heat dissipation fin 133 and the second heat dissipation fin 134. The speed of heat transfer through the air is relatively slow, thus avoiding a large amount of heat from accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1. Furthermore, the electronic device 1 provided by the embodiments of this application also facilitates the installation of the fan 160 in the fourth sub-support portion 1322.

[0062] In this embodiment, the thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321. The cold surface 140a of the thermoelectric cooler 140 conducts heat with the third sub-support portion 1321. Therefore, the heat from the third sub-support portion 1321 can be quickly conducted and transferred to the cold surface 140a of the thermoelectric cooler 140, and then conducted to the hot surface 140b of the thermoelectric cooler 140 via the action of the thermoelectric cooler 140. The fan 160 is disposed on the fourth sub-support portion 1322. The first heat dissipation fin 133 and the second heat dissipation fin 134 both avoid the fourth sub-support portion 1322, which also facilitates the installation of the fan 160 on the fourth sub-support portion 1322.

[0063] Please continue reading. Figures 9 to 11 The fourth sub-support portion 1322 is closer to the heat source 110 than the third sub-support portion 1321.

[0064] In this embodiment, the fourth sub-support portion 1322 is closer to the heat source 110 than the third sub-support portion 1321. The thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321, and the fan 160 is supported on the fourth sub-support portion 1322. Therefore, the fan 160 is closer to the heat source 110 than the thermoelectric cooler 140. In this embodiment, the fan 160 is closer to the heat source 110 than the second heat sink 150.

[0065] If the fan 160 is in operation, the fan 160 blows airflow from the first air duct 130a to the outside of the electronic device 1, and the fan 160 blows airflow from the second air duct 150a to the outside of the electronic device 1.

[0066] In this embodiment, the first air duct 130a has a first opening 131a adjacent to the fan 160 and a second opening 131b away from the fan 160. The second air duct 150a has a third opening 151a adjacent to the fan 160 and a second opening 131b away from the fan 160. In one embodiment, if the fan 160 is in operation: the fan 160 blows airflow into the first air duct 130a from the first opening 131a, and the airflow entering the first air duct 130a is blown out of the electronic device 1 through the second opening 131b; the fan 160 blows airflow into the second air duct 150a from the third opening 151a, and the airflow entering the second air duct 150a is blown out of the electronic device 1 through the fourth opening 151b.

[0067] Therefore, it can be seen that the electronic device 1 provided in this application embodiment has a positional relationship between the third sub-supporting part 1321 and the fourth sub-supporting part 1322 and the heat source 110. When the fan 160 is in working state, it can efficiently blow heat out of the first air duct 130a of the first heat sink 130 to the outside of the electronic device 1, and can also efficiently blow heat out of the second air duct 150a of the second heat sink 150 to the outside of the electronic device 1.

[0068] Please see Figures 9 to 11The electronic device 1 further includes a first circuit board 171, a first electronic device 181, a second circuit board 172, a second electronic device 182, and a shielding cover 190. The first circuit board 171 carries the heat source 110 and is located on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The second circuit board 172 is located on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is carried on the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182.

[0069] The first circuit board 171 can be, but is not limited to, a printed circuit board (PCB). The heat source 110 and the first electronic device 181 are located on opposite sides of the first circuit board 171. The second circuit board 172 can be, but is not limited to, a printed circuit board (PCB). The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is supported by the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. Thus, the first circuit board 171 and the second circuit board 172 are stacked. In the electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can also be referred to as a stacked board.

[0070] The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182 to reduce or even eliminate electromagnetic interference from the second electronic device 182 to other devices outside the shielding cover 190; correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the second electronic device 182 inside the electromagnetic shielding cover 190.

[0071] In this embodiment, the stacking direction of the second circuit board 172 and the first circuit board 171 is defined as the first direction, and the arrangement direction of the heat source 110 and the first heat sink 130 is defined as the second direction. In this embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can make full use of the space of the electronic device 1 in the first direction and reduce the space occupied in the second direction.

[0072] Please see Figure 12 , Figure 12 This is a schematic diagram of an electronic device provided in yet another embodiment of this application. Figure 12 Electronic device 1 corresponding to the implementation method and Figures 9 to 11 The electronic device 1 in the corresponding implementation is basically the same, except that, Figures 9 to 11 The electronic device 1 provided in the corresponding implementation is a stacked board, while the electronic device 1 provided in the implementation of this application is a single board. The specific description is as follows.

[0073] The electronic device 1 further includes a first circuit board 171, a first electronic device 181, and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The shielding cover 190 is located on the side of the first circuit board 171 opposite to the heat source 110, and is used to house the first electronic device 181.

[0074] In this embodiment, the first circuit board 171 can be, but is not limited to, a printed circuit board. In this embodiment, the heat source 110 and the first electronic device 181 are respectively disposed on opposite sides of the first circuit board 171 along the thickness direction.

[0075] The electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171 and the first electronic device 181, is also referred to as a single board.

[0076] The shielding cover 190 is located on the side of the first circuit board 171 away from the heat source 110. The shielding cover 190 is used to house the electronic device 180 to reduce or even eliminate the electromagnetic interference of the electronic device 180 to other devices outside the shielding cover 190. Correspondingly, the shielding cover 190 can also reduce or even eliminate the electromagnetic interference of other devices outside the shielding cover 190 to the electronic device 180 inside the electromagnetic shielding cover 190.

[0077] Compared to Figures 9 to 11 Regarding the electronic device 1 provided in the embodiments of this application, the layout of the first circuit board 171 and the first electronic device 181 can reduce the occupancy of the first direction by utilizing the dimensions in the second direction.

[0078] Please see Figure 13 , Figure 14 and Figure 15 , Figure 13 A schematic diagram of an electronic device provided in yet another embodiment of this application; Figure 14 for Figure 13 An exploded three-dimensional diagram of the electronic device shown. Figure 15 for Figure 13 A detailed schematic diagram of the first heat sink is shown. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader 120 is located on one side of the heat source 110 and is thermally connected to the heat source 110. The first heat sink 130 includes a first support portion 131, a second support portion 132, a plurality of first heat dissipation fins 133, and a plurality of second heat dissipation fins 134. The first support portion 131 is thermally conductive to the heat source 110. The second support portion 132 is opposite to and spaced apart from the first support portion 131. The first heat dissipation fins 133 are connected to the surface of the first support portion 131 facing the second support portion 132 and are spaced apart from the second support portion 132. The second heat dissipation fins 134 are connected to the surface of the second support portion 132 facing the first support portion 131. The second heat dissipation fin 134 is spaced apart from the first support portion 131 and offset from the first heat dissipation fin 133. The first heat sink 130 has a first air duct 130a. The thermoelectric cooler 140 is disposed on one side of the first heat sink 130. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b, the hot surface 140b being away from the second support portion 132 relative to the cold surface 140a. The second heat sink 150 is located on one side of the hot surface 140b, and the second heat sink 150 has a second air duct 150a. The fan 160 is connected to the first air duct 130a and the second air duct 150a.

[0079] Specifically, in this embodiment, the first heat sink 130 is located on the side of the heat source 110 away from the heat spreader. The thermoelectric cooler 140 is disposed on the side of the first heat sink 130 away from the heat source 110.

[0080] In this embodiment, the heat source 110 has a first heat dissipation surface 110a and a second heat dissipation surface 110b disposed opposite to each other along a first direction D1. The heat spreader 120 is located on one side of the first heat dissipation surface 110a, and the heat spreader 120 can conduct heat with the first heat dissipation surface 110a. The first heat dissipation component 130 is located on the side of the heat source 110 away from the heat spreader. The thermoelectric cooler 140 is disposed on the side of the first heat dissipation component 130 away from the heat source 110; therefore, the heat source 110, the first heat dissipation component 130, and the thermoelectric cooler 140 are stacked along the first direction D1. Therefore, the heat source 110, the first heat dissipation component 130, and the thermoelectric cooler 140 of the electronic device 1 can make full use of the space in the first direction D1 and reduce the space occupied in other directions (such as the second direction D2).

[0081] In summary, the electronic device 1 provided in this application includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader is located on one side of the heat source 110 and is thermally connected to the heat source 110. The heat emitted by the heat source 110 is transferred to the heat spreader 120 and dissipated through the heat spreader 120, thereby reducing or even preventing overheating of the heat source 110 from causing damage to the heat source 110 itself and the surrounding devices. Furthermore, the first heat dissipation fin 133 is connected to the surface of the first support portion 131 facing the second support portion 132 and is spaced apart from the second support portion 132; the second heat dissipation fin 134 is connected to the surface of the second support portion 132 facing the first support portion 131; the second heat dissipation fin 134 is spaced apart from the first support portion 131 and staggered from the first heat dissipation fin 133; therefore, the heat from the first heat dissipation fin 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fin 133 and the second support portion 132, and the air around the second heat dissipation fin 134 transfers heat to the second heat dissipation fin 134 and then to the second support portion 132 via the second heat dissipation fin 134; the speed of heat transfer by air is relatively slow, thereby avoiding a large amount of heat accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1. Furthermore, the first heat sink 130 has a first air duct 130a, the second heat sink 150 has a second air duct 150a, and the fan 160 is connected to both the first air duct 130a and the second air duct 150a; therefore, if at least one of the first air duct 130a and the second air duct 150a is ventilated, heat dissipation can be further accelerated, further improving the heat dissipation effect. Furthermore, the first heat sink 130 is located on the side of the heat source 110 away from the heat spreader, and the thermoelectric cooler 140 is disposed on the side of the first heat sink 130 away from the heat source 110; therefore, the heat source 110, the first heat sink 130 and the thermoelectric cooler 140 of the electronic device 1 can make full use of the space in the first direction and reduce the space occupied in other directions (such as the second direction).

[0082] Please continue reading. Figures 13 to 15 The plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134.

[0083] In this embodiment, the plurality of first heat dissipation fins 133 are generally located on one side of the plurality of second heat dissipation fins 134. In the schematic diagram of this embodiment, the plurality of first heat dissipation fins 133 are farther from the fan 160 than the plurality of second heat dissipation fins 134. It is understood that in other embodiments, the plurality of first heat dissipation fins 133 are closer to the fan 160 than the plurality of second heat dissipation fins 134. This application does not limit which of the plurality of first heat dissipation fins 133 and the plurality of second heat dissipation fins 134 is closer to the fan 160, as long as the plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134. Having the plurality of first heat dissipation fins 133 located on one side of the plurality of second heat dissipation fins 134 facilitates the arrangement of the first and second heat dissipation fins 134, reducing the probability of direct contact between the first and second heat dissipation fins 133 and the second heat dissipation fins 134 due to manufacturing tolerances or other reasons.

[0084] In this embodiment, the plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134. Therefore, the heat from the plurality of first heat dissipation fins 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fins 133 and the second support portion 132. The air around the second heat dissipation fins 134 transfers heat to the second heat dissipation fins 134 and then to the second support portion 132 via the second heat dissipation fins 134. The heat transfer speed of the air is relatively slow, thereby avoiding a large amount of heat accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1.

[0085] Please continue reading. Figures 13 to 15The first support portion 131 has a first sub-support portion 1311 and a second sub-support portion 1312 connected together. In the figure, the boundaries of the first sub-support portion 1311 and the second sub-support portion 1312 are indicated by dashed lines. The first heat dissipation fin 133 is connected to the first sub-support portion 1311, and the first heat dissipation fin 133 avoids the second sub-support portion 1312. The second support portion 132 has a third sub-support portion 1321 and a fourth sub-support portion 1322 connected together. In the figure, the boundaries of the third sub-support portion 1321 and the fourth sub-support portion 1322 are indicated by dashed lines. The third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311, and the third sub-support portion 1321 is disposed opposite to and spaced apart from the first heat dissipation fin 133. The fourth sub-support portion 1322 is disposed opposite to the second sub-support portion 1312, the second heat dissipation fin 134 is connected to the fourth sub-support portion 1322, the second heat dissipation fin 134 avoids the third sub-support portion 1321, and the second heat dissipation fin 134 is disposed at a distance from the second sub-support portion 1312.

[0086] In this embodiment, the first heat dissipation fin 133 is connected to the first sub-support portion 1311, and the first heat dissipation fin 133 avoids the second sub-support portion 1312; the second heat dissipation fin 134 avoids the third sub-support portion 1321; therefore, the plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134. This facilitates the arrangement of the first heat dissipation fins and the second heat dissipation fins 134, reducing the probability of direct contact between the first heat dissipation fins 133 and the second heat dissipation fins 134 due to manufacturing tolerances or other reasons. Further, the first heat dissipation fin 133 is connected to the first sub-support portion 1311, and the third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311, and the third sub-support portion 1321 is disposed opposite to and spaced apart from the first heat dissipation fins 133. The heat from the plurality of first heat dissipation fins 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fins 133 and the second support portion 132. Furthermore, the second heat dissipation fin 134 is connected to the fourth sub-support portion 1322, which is disposed opposite to the second sub-support portion 1312, with the second heat dissipation fin 134 and the second sub-support portion 1312 spaced apart. Therefore, the air surrounding the second heat dissipation fin 134 transfers heat to the second heat dissipation fin 134 and then to the second support portion 132. The heat transfer speed of the air is relatively slow, thus preventing a large amount of heat from accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1.

[0087] Please continue reading. Figures 13 to 15 The thermoelectric cooler 140 is provided corresponding to the fourth sub-support part 1322 and avoids the third sub-support part 1321.

[0088] In this embodiment, the second heat dissipation fin 134 is connected to the fourth sub-support portion 1322, and the second heat dissipation fin 134 avoids the third sub-support portion 1321; the heat from the second heat dissipation fin 134 can be quickly transferred to the fourth sub-support portion 1322. The thermoelectric cooler 140 is provided corresponding to the fourth sub-support portion 1322. Specifically, the cold surface 140a of the thermoelectric cooler 140 and the fourth sub-support portion 1322 transfer heat, which can quickly conduct the heat transferred from the second heat dissipation fin 134 to the fourth sub-support portion 1322 to the hot surface 140b of the thermoelectric cooler 140, and dissipate it through the second heat dissipation fin 134, thereby achieving the technical effect of rapid heat dissipation.

[0089] Furthermore, since the thermoelectric cooler 140 avoids the third sub-support portion 1321, its size is smaller in the direction of arrangement of the third sub-support portion 1321 and the fourth sub-support portion 1322, which helps to reduce the weight of the electronic device 1. In summary, the electronic device 1 provided by the embodiments of this application can balance heat dissipation effect and weight.

[0090] Please see Figure 13 and Figure 16 , Figure 16 for Figure 13 A detailed schematic diagram of the second heat sink 150 is shown. The second heat sink 150 includes a third support portion 151, a fourth support portion 152, and a plurality of third heat dissipation fins 153. The third support portion 151 is located on one side of the hot surface 140b of the thermoelectric cooler 140 and conducts heat with the hot surface 140b. The fourth support portion 152 is opposite to and spaced apart from the third support portion 151, and is further away from the thermoelectric cooler 140 than the third support portion 151. One end of each third heat dissipation fin 153 is connected to the third support portion 151, and the other end is connected to the fourth support portion 152.

[0091] In this embodiment, the third support portion 151 is located on one side of the hot surface 140b of the thermoelectric cooler 140 and conducts heat with the hot surface 140b. Therefore, the heat from the hot surface 140b of the thermoelectric cooler 140 can be transferred to the third support portion 151. In this embodiment, one end of the third heat dissipation fin 153 is connected to the third support portion 151, and the other end of the third heat dissipation fin 153 is connected to the fourth sub-support portion 1322. Therefore, the heat from the third support portion 151 can be transferred to the third heat dissipation fin 153 relatively quickly, and the heat from the third heat dissipation fin 153 can be transferred to the fourth support portion 152 quickly, thereby improving the heat dissipation effect and preventing the temperature of the hot surface 140b of the thermoelectric cooler 140 from becoming too high.

[0092] Furthermore, the second heat sink 150 has a second air duct 150a. If there is airflow in the second air duct 150a, it can accelerate heat dissipation and further improve the heat dissipation effect.

[0093] In this embodiment, the plurality of third heat dissipation fins 153 are disposed corresponding to the portions of the third support portion 151 adjacent to the thermoelectric cooler 140, and the third heat dissipation fins 153 avoid the portions of the third support portion 151 that are away from the thermoelectric cooler 140. Similarly, the plurality of third heat dissipation fins 153 are disposed corresponding to the portions of the fourth support portion 152 adjacent to the thermoelectric cooler 140, and the plurality of third heat dissipation fins 153 avoid the portions of the fourth support portion 152 that are away from the thermoelectric cooler 140.

[0094] In this embodiment, the thermoelectric cooler 140 is not provided for all of the third support portion 151, but rather for a portion of the third support portion 151.

[0095] Specifically, in this embodiment, the plurality of third heat dissipation fins 153 are disposed at the locations of the third support portion 151 adjacent to the thermoelectric cooler 140, and the third heat dissipation fins 153 avoid the locations of the third support portion 151 away from the thermoelectric cooler 140; the plurality of third heat dissipation fins 153 are disposed at the locations of the fourth support portion 152 adjacent to the thermoelectric cooler 140, and the plurality of third heat dissipation fins 153 avoid the locations of the fourth support portion 152 away from the thermoelectric cooler 140; on the one hand, this allows the heat from the hot surface 140b of the thermoelectric cooler 140 to be quickly dissipated through the third support portion 151, the third heat dissipation fins 153 and the fourth support portion 152; on the other hand, it also reduces the weight of the third heat dissipation component.

[0096] Therefore, the arrangement of the third heat dissipation fin 153, the third support portion 151, the fourth support portion 152 and the thermoelectric cooler 140 in the electronic device 1 provided in this application embodiment can achieve both good heat dissipation effect and reduce the weight of the second heat dissipation component 150.

[0097] Please see Figure 17 , Figure 18 and Figure 19 , Figure 17 A schematic diagram of an electronic device provided in another embodiment of this application; Figure 18 for Figure 17 An exploded three-dimensional diagram of the electronic device shown. Figure 19 for Figure 17 A detailed schematic diagram of the first heat sink is shown. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader 120 is located on one side of the heat source 110 and is thermally connected to the heat source 110. The first heat sink 130 includes a first support portion 131, a second support portion 132, a plurality of first heat dissipation fins 133, and a plurality of second heat dissipation fins 134. The first support portion 131 is thermally conductive to the heat source 110. The second support portion 132 is opposite to and spaced apart from the first support portion 131. The first heat dissipation fins 133 are connected to the surface of the first support portion 131 facing the second support portion 132 and are spaced apart from the second support portion 132. The second heat dissipation fins 134 are connected to the surface of the second support portion 132 facing the first support portion 131. The second heat dissipation fin 134 is spaced apart from the first support portion 131 and offset from the first heat dissipation fin 133. The first heat sink 130 has a first air duct 130a. The thermoelectric cooler 140 is disposed on one side of the first heat sink 130. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b, the hot surface 140b being away from the second support portion 132 relative to the cold surface 140a. The second heat sink 150 is located on one side of the hot surface 140b, and the second heat sink 150 has a second air duct 150a. The fan 160 is connected to the first air duct 130a and the second air duct 150a.

[0098] In this embodiment, the first heat sink 130 is located on the side of the heat source 110 away from the heat spreader. The thermoelectric cooler 140 is disposed on the side of the first heat sink 130 away from the heat source 110.

[0099] In this embodiment, the heat source 110 has a first heat dissipation surface 110a and a second heat dissipation surface 110b disposed opposite to each other along a first direction D1. The heat spreader 120 is located on one side of the first heat dissipation surface 110a, and the heat spreader 120 can conduct heat with the first heat dissipation surface 110a. The first heat dissipation component 130 is located on the side of the heat source 110 away from the heat spreader. The thermoelectric cooler 140 is disposed on the side of the first heat dissipation component 130 away from the heat source 110; therefore, the heat source 110, the first heat dissipation component 130, and the thermoelectric cooler 140 are stacked along the first direction. Therefore, the heat source 110, the first heat dissipation component 130, and the thermoelectric cooler 140 of the electronic device 1 can make full use of the space in the first direction and reduce the space occupied in other directions (such as the second direction).

[0100] Furthermore, Figures 17 to 19 The electronic device 1 provided in the implementation method and Figures 13 to 15 The electronic device 1 provided in the implementation method is basically the same as that in the embodiment, except that... Figures 13 to 15 In the electronic device 1 provided in the embodiment, the plurality of first heat dissipation fins 133 are located on one side of the plurality of second heat dissipation fins 134. Furthermore, in this embodiment, the first heat dissipation fins 133 and the second heat dissipation fins 134 are arranged sequentially at intervals.

[0101] In this embodiment, the first heat dissipation fins 133 and the second heat dissipation fins 134 of the plurality of first heat dissipation fins 133 are arranged sequentially at intervals. Specifically, there is a first gap between two adjacent first heat dissipation fins 133, and the second heat dissipation fins 134 are arranged corresponding to the first gap. Correspondingly, there is a second gap between two adjacent second heat dissipation fins 134, and the first heat dissipation fins 133 are arranged corresponding to the second gap.

[0102] In this embodiment, the first heat dissipation fins 133 and the second heat dissipation fins 134 are arranged alternately in sequence. Therefore, the heat from the first heat dissipation fins 133 is transferred to the second support portion 132 via the air located between and around the first heat dissipation fins 133 and the second support portion 132. The air around the second heat dissipation fins 134 transfers heat to the second heat dissipation fins 134 and then to the second support portion 132. The heat transfer speed of the air is relatively slow, thus avoiding a large amount of heat accumulating in the second support portion 132. When the temperature difference between the cold surface 140a and the hot surface 140b of the thermoelectric cooler 140 is constant, the temperature of the hot surface 140b of the thermoelectric cooler 140 can be reduced or even avoided from becoming too high, thereby reducing or even avoiding adverse effects on other components of the electronic device 1.

[0103] Furthermore, in this embodiment, the thermoelectric cooler 140 is provided for all the second heat dissipation fins 134.

[0104] The thermoelectric cooler 140 and the second heat dissipation fins 134 are respectively disposed on opposite sides of the second support portion 132. The cold surface 140a of the thermoelectric cooler 140 is closer to the second support portion 132 than the hot surface 140b. Heat conduction is possible between the cold surface 140a of the thermoelectric cooler 140 and the second support portion 132.

[0105] In this embodiment, the thermoelectric cooler 140 is provided for all the second heat dissipation fins 134. Therefore, the heat transferred from the second heat dissipation fins 134 to the second support portion 132 can be conducted to the hot surface 140b of the thermoelectric cooler 140 via the cold surface 140a of the thermoelectric cooler 140, and dissipated via the second heat dissipation member 150 of the hot surface 140b, thereby improving the heat dissipation effect.

[0106] Please see Figure 17 and Figure 20 , Figure 20 for Figure 17A detailed schematic diagram of the second heat sink 150 is shown. The second heat sink 150 includes a third support portion 151, a fourth support portion 152, and a plurality of third heat dissipation fins 153. The third support portion 151 is located on one side of the hot surface 140b of the thermoelectric cooler 140 and conducts heat with the hot surface 140b. The fourth support portion 152 is opposite to and spaced apart from the third support portion 151, and is further away from the thermoelectric cooler 140 than the third support portion 151. One end of each third heat dissipation fin 153 is connected to the third support portion 151, and the other end is connected to the fourth support portion 152.

[0107] In this embodiment, the third support portion 151 is located on one side of the hot surface 140b of the thermoelectric cooler 140 and conducts heat with the hot surface 140b. Therefore, the heat from the hot surface 140b of the thermoelectric cooler 140 can be transferred to the third support portion 151. In this embodiment, one end of the third heat dissipation fin 153 is connected to the third support portion 151, and the other end of the third heat dissipation fin 153 is connected to the fourth support portion 152. Therefore, the heat from the third support portion 151 can be transferred to the third heat dissipation fin 153 relatively quickly, and the heat from the third heat dissipation fin 153 can be transferred to the fourth support portion 152 quickly, thereby improving the heat dissipation effect and preventing the temperature of the hot surface 140b of the thermoelectric cooler 140 from becoming too high.

[0108] Furthermore, the second heat sink 150 has a second air duct 150a. If there is airflow in the second air duct 150a, it can accelerate heat dissipation and further improve the heat dissipation effect.

[0109] In this embodiment, the plurality of third heat dissipation fins 153 are disposed at the locations of the third support portion 151 adjacent to the fan 160, and are disposed away from the locations of the third support portion 151 opposite to the fan 160.

[0110] Compared to the previous embodiment where the plurality of third heat dissipation fins 153 are arranged corresponding to the portion of the third support portion 151 adjacent to the fan 160 and the portion of the third support portion 151 opposite to the fan 160, in this embodiment, the plurality of third heat dissipation fins 153 are arranged corresponding to the portion of the third support portion 151 adjacent to the fan 160 and avoiding the portion of the third support portion 151 opposite to the fan 160; this reduces the mass of the second heat sink 150.

[0111] Therefore, the arrangement of the third heat dissipation fin 153, the third support portion 151, the fourth support portion 152, the thermoelectric cooler 140, and the fan 160 in the electronic device 1 provided in this application embodiment can achieve both good heat dissipation effect and reduce the weight of the second heat dissipation component 150.

[0112] Please see Figures 13 to 15 Or refer to Figures 17 to 20 The electronic device 1 further includes a first circuit board 171, a first electronic device 181, and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The shielding cover 190 is located on the side of the first circuit board 171 opposite to the heat source 110, and is used to house the first electronic device 181.

[0113] In this embodiment, the first circuit board 171 can be, but is not limited to, a printed circuit board. In this embodiment, the heat source 110 and the first electronic device 181 are respectively disposed on opposite sides of the first circuit board 171 along the thickness direction.

[0114] The electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171 and the first electronic device 181, is also referred to as a single board.

[0115] The shielding cover 190 is located on the side of the first circuit board 171 away from the heat source 110. The shielding cover 190 is used to house the electronic device 180 to reduce or even eliminate the electromagnetic interference of the electronic device 180 to other devices outside the shielding cover 190. Correspondingly, the shielding cover 190 can also reduce or even eliminate the electromagnetic interference of other devices outside the shielding cover 190 to the electronic device 180 inside the electromagnetic shielding cover 190.

[0116] Compared to the stacked board solution, the electronic device 1 provided in this application, in which the first circuit board 171 and the first electronic device 181 are arranged, can utilize the dimensions in the second direction to reduce the occupancy of the dimensions in the first direction.

[0117] Furthermore, in conjunction with the electronic device 1 in any of the preceding embodiments, the electronic device 1 provided in this application includes at least one of the first connector 210 and the second connector 220. Next, let's consider... Figures 21 to 24The electronic device 1 shown is illustrated as an example and should not be construed as limiting the embodiments of this application. Please refer to [link / reference]. Figures 21 to 24 , Figures 21 to 24 These are cross-sectional schematic diagrams of electronic devices provided in various embodiments. In the schematic diagrams of this embodiment, the electronic device 1 including the first connector 210 and the second connector 220 is used as an example for illustration; it should not be understood as a limitation of the embodiments of this application. In this embodiment, the electronic device 1 further includes the first connector 210. The first connector 210 is used for thermally connecting the heat source 110 and the heat spreader 120.

[0118] The first connector 210 may also be referred to as the first thermally conductive connector. The first thermally conductive connector may include, but is not limited to, one or more of a thermal interface connector and thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermal pad, thermal gel, thermal grease, and liquid metal. In another embodiment, the first thermally conductive connector may also be a combination of conventional foam and a thermal interface material; for example, the gaps in the conventional foam may be filled with thermal gel, thermal grease, or liquid metal.

[0119] The electronic device 1 includes the first connector 210, which thermally connects the heat source 110 and the heat spreader 120, thereby enabling the heat generated by the heat source 110 to be quickly transferred to the heat spreader 120 via the first connector 210, thus improving the heat dissipation effect of the electronic device 1.

[0120] Furthermore, in one embodiment, the electronic device 1 further includes a second connector 220, which is used for thermally conductively connecting the shielding cover 190 to the electronic device housed within the shielding cover 190. Figure 21 and Figure 22 In this configuration, the second connector 220 provides a thermally conductive connection between the second electronic device 182 and the shielding cover 190. Figure 23 and Figure 24 In this configuration, the second connector 220 is used for thermally conductive connection between the first electronic device 181 and the shielding cover 190.

[0121] The second connector 220 can also be referred to as the second thermally conductive connector. The second thermally conductive connector may include, but is not limited to, one or more of a thermal interface connector and thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermally conductive pad, thermally conductive gel, thermally conductive silicone grease, and liquid metal. In another embodiment, the second thermally conductive connector may also be a combination of conventional foam and a thermal interface material; for example, the gaps in conventional foam may be filled with thermally conductive gel, thermally conductive silicone grease, or liquid metal. The second connector 220 and the first connector 210 may be of the same type or different, and this embodiment is not limited thereto.

[0122] The electronic device 1 includes the second connector 220, which thermally connects the electronic device housed in the shielding cover 190 to the shielding cover 190. This allows the heat source 110 and the heat generated by the heat source 110 to be quickly transferred to the shielding cover 190 via the second connector 220, and the heat transferred to the shielding cover 190 to be quickly dissipated, thereby improving the heat dissipation effect of the electronic device 1.

[0123] Please see Figure 25 , Figure 25 One implementation method Figure 1 A cross-sectional view of the provided electronic device along line II. The electronic device 1 further includes a frame 230 having a first through hole 230a and a second through hole 230b. The first through hole 230a connects the exterior of the electronic device 1 to the fan 160. The second through hole 230b connects the exterior of the electronic device 1 to the first air duct 130a, and also connects the exterior of the electronic device 1 to the second air duct 150a.

[0124] In this embodiment, the frame 230 is the frame 230 of the middle frame 260 in the electronic device 1. In other embodiments, the frame 230 may also be the frame 230 of the battery cover 250 in the electronic device 1. In the schematic diagram of this application embodiment, the frame 230 is illustrated as the frame 230 of the middle frame 260 of the electronic device 1. Specifically, the middle frame 260 includes a middle plate 261 and a frame 230, and the frame 230 is bent and connected to the middle plate 261. In addition, the electronic device 1 provided in this application embodiment also includes a frame 230 that can be combined with the electronic device 1 provided in any of the preceding embodiments. In the schematic diagram of this application embodiment, the electronic device 1 also includes a frame 230 combined with the electronic device 1 of the preceding embodiment for illustration. It should be understood that this should not be construed as a limitation on the electronic device 1 provided in this application embodiment.

[0125] In one embodiment, the first through hole 230a is an air inlet, and the second through hole 230b is an air outlet. In another embodiment, the first through hole 230a is an air outlet, and the second through hole 230b is an air inlet. Alternatively, in other embodiments, during a first time period, the first through hole 230a is an air inlet, and the second through hole 230b is an air outlet; during a second time period, the first through hole 230a is an air outlet, and the second through hole 230b is an air inlet. This application does not limit which of the first through hole 230a and the second through hole 230b serves as an air inlet and which serves as an air outlet.

[0126] In summary, the electronic device 1 provided in this application embodiment further includes a frame 230, which has a first through hole 230a and a second through hole 230b. The frame 230 can exchange airflow with the outside through the first through hole 230a and the second through hole 230b to dissipate heat from the heat source 110.

[0127] Further, in this embodiment, the electronic device 1 includes a display screen 270 and a battery cover 250 in addition to the mid-frame 260. In this embodiment, the mid-frame 260 includes a mid-plate 261 and a frame 230, with the frame 230 bent and connected to the mid-plate 261. The mid-plate 261 of the mid-frame 260 includes a first bearing surface 260a and a second bearing surface 260b disposed opposite to each other. In one embodiment, the first bearing surface 260a of the mid-frame 260 is the surface of the mid-frame 260 facing the display screen 270, and the second bearing surface 260b of the mid-frame 260 is the surface of the mid-frame 260 facing the battery cover 250. In other embodiments, the first bearing surface 260a of the mid-frame 260 is the surface of the mid-frame 260 facing the battery cover 250, and correspondingly, the second bearing surface 260b of the mid-frame 260 is the surface of the mid-frame 260 facing the display screen 270. In this embodiment of the application, when the middle frame 260 is applied to the electronic device 1, the relative positions of the first bearing surface 260a and the second bearing surface 260b with respect to the display screen 270 and battery cover 250 of the electronic device 1 are not limited, as long as the middle frame 260 has a first bearing surface 260a and a second bearing surface 260b arranged opposite to each other. In one embodiment, the first bearing surface 260a and the second bearing surface 260b are parallel or approximately parallel.

[0128] In this embodiment, the middle frame 260 has a receiving hole 260c. The receiving hole 260c penetrates the first bearing surface 260a and the second bearing surface 260b. The heat source 110 is located in the receiving hole 260c. The heat spreader 120 is closer to the display screen 270 than the heat source 110. In this embodiment, the heat source 110 is housed in the receiving hole 260c, thereby allowing the electronic device 1 to be thinner.

[0129] Please see Figure 26 , Figure 26 Another implementation Figure 1 A cross-sectional view of the provided electronic device along line II. The electronic device 1 further includes a mid-frame 260, a battery cover 250, and a display screen 270. The mid-frame 260 includes a mid-plate 261 and a frame 230, the frame 230 being bent and connected to the mid-plate 261. The battery cover 250 and the display screen 270 are respectively disposed on opposite sides of the mid-plate 261. The battery cover 250 has a first through hole 230a. The frame 230 has a second through hole 230b. The first through hole 230a connects the exterior of the electronic device 1 to the fan 160. The second through hole 230b connects the exterior of the electronic device 1 to the first air duct 130a, and the second through hole 230b also connects the exterior of the electronic device 1 to the second air duct 150a.

[0130] The electronic device 1 provided in this application embodiment also includes a frame 230 that can be incorporated into the electronic device 1 provided in any of the preceding embodiments. The schematic diagram of this application embodiment illustrates that the electronic device 1 also includes a frame 230 incorporated into the electronic device 1 of the preceding embodiment. It should be understood that this should not be construed as a limitation on the electronic device 1 provided in this application embodiment.

[0131] In one embodiment, the first through hole 230a is an air inlet, and the second through hole 230b is an air outlet. In another embodiment, the first through hole 230a is an air outlet, and the second through hole 230b is an air inlet. Alternatively, in other embodiments, during a first time period, the first through hole 230a is an air inlet, and the second through hole 230b is an air outlet; during a second time period, the first through hole 230a is an air outlet, and the second through hole 230b is an air inlet. This application does not limit which of the first through hole 230a and the second through hole 230b serves as an air inlet and which serves as an air outlet.

[0132] In this embodiment, the heat spreader 120, the heat source 110, the thermoelectric cooler 140, the first heat sink 130, the second heat sink 150, and the fan 160 are all located on one side of the second bearing surface 260b of the middle plate 261, and the heat spreader 120 is closer to the second bearing surface 260b than the heat source 110. The heat generated by the heat source 110 is transferred to the heat spreader 120, and then to the middle frame 260. Some of the heat is dissipated through the middle frame 260, and some of the heat is conducted through the middle frame 260 to the display screen 270, and then dissipated by the display screen 270. Therefore, the electronic device 1 provided in this embodiment can also dissipate heat through the middle frame 260 and the display screen 270, improving the heat dissipation effect.

[0133] In another embodiment, the middle plate 261 of the middle frame 260 has a receiving groove located on the second bearing surface 260b, and the receiving groove does not penetrate the first bearing surface 260a. At least one of the heat spreader 120, the heat source 110, the thermoelectric cooler 140, the first heat sink 130, the second heat sink 150, and the fan 160 is housed in the receiving groove, and the second heat sink 150 is closer to the battery cover 250 than the heat spreader 120. Compared to a middle plate 261 without a receiving groove, the electronic device 1 provided in this application embodiment has a receiving groove in the middle plate 261, which allows the electronic device 1 to be thinner.

[0134] Based on the electronic device 1 provided in any of the preceding embodiments, the heat dissipation strategy of the electronic device 1 provided in one embodiment of this application will be described in detail below. In one embodiment, the electronic device 1 has a first heat dissipation mode, a second heat dissipation mode, and a third heat dissipation mode. The first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode are described in detail below. If the electronic device 1 is in the first heat dissipation mode, the fan 160 is in a closed state, and the thermoelectric cooler 140 is in a closed state. If the electronic device 1 is in the second heat dissipation mode, the fan 160 is in a working state, and the thermoelectric cooler 140 is in a closed state. If the electronic device 1 is in the third heat dissipation mode, the fan 160 is in a working state, and the thermoelectric cooler 140 is in a working state.

[0135] In this embodiment, if the electronic device 1 is in the first heat dissipation mode, the fan 160 is off, and the thermoelectric cooler 140 is off. When the electronic device 1 is in the first heat dissipation mode, the heat generated by the heat source 110 in the electronic device 1 is dissipated after being evenly heated by the heat spreader 120, resulting in the lowest heat dissipation power consumption.

[0136] If the electronic device 1 is in the second heat dissipation mode, the fan 160 is in operation, and the thermoelectric cooler 140 is in the off state. In the second heat dissipation mode, the heat generated by the heat source 110 of the electronic device 1 is dissipated after being evenly heated by the heat spreader 120, and the heat generated by the heat source 110 is transferred to the first heat sink 130 and dissipated through the first heat sink 130. With the fan 160 in operation, the air blown out or drawn into the first air duct 130a by the fan 160 can quickly remove heat and transfer it outside the electronic device 1.

[0137] Please see Figure 21 and Figure 27 , Figure 22 and Figure 28 , Figure 23 and Figure 29 , Figure 24 and Figure 30 , Figure 27 for Figure 21 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 28 for Figure 22 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 29 for Figure 23 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 30 for Figure 24The diagram shows the heat dissipation path of the electronic device 1 in the third heat dissipation mode. In the third heat dissipation mode, the fan 160 is operational, and the thermoelectric cooler 140 is off. In this mode, the heat generated by the heat source 110 of the electronic device 1 is dissipated after being homogenized by the heat spreader 120, and the heat generated by the heat source 110 is transferred to the first heat sink 130. The fan 160 is operational, and the cold air blown out by the fan 160 exchanges heat with the staggered first heat sink fins 133 and second heat sink fins 134 in the first heat sink 130, achieving heat transfer and thus cooling the staggered first heat sink fins 133 and second heat sink fins 134. After heat exchange, the cold air becomes hot air, which is then blown out of the electronic device 1, for example, out of the casing of the electronic device 1, thereby achieving overall cooling of the electronic device 1. The first heat sink 130 transfers heat to the cold surface 140a of the thermoelectric cooler 140. When the thermoelectric cooler 140 is in operation, it transfers the heat from the cold surface 140a to the hot surface 140b. The heat transferred to the hot surface 140b is then conducted to the second heat sink 150 and dissipated through it. Furthermore, the fan 160 is in operation, and the air blown out or drawn into the first air duct 130a and the second air duct 150a by the fan 160 can quickly remove heat from the electronic device 1. In other words, in the electronic device 1 provided in this embodiment, the fan 160 can dissipate heat through the air from the first air duct 130a and the second air duct 150a (also called dual air ducts).

[0138] The electronic device 1 can select one of the first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode according to the actual situation of the heat source 110. Therefore, the electronic device 1 provided in this embodiment has three heat dissipation schemes—the first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode—enabling optimal heat dissipation in multiple scenarios and optimal overall power consumption.

[0139] Please see Figure 31 , Figure 31This is a schematic diagram of an electronic device provided in yet another embodiment of this application. In this embodiment, the electronic device 1 further includes a temperature sensor 240. The electronic device 1 provided in this embodiment, which also includes a temperature sensor 240, can be incorporated into any of the electronic devices 1 provided in the preceding embodiments. In the schematic diagram of this embodiment, the example of the electronic device 1 including a temperature sensor 240 incorporated into an electronic device 1 provided in a preceding embodiment is used for illustration. It should be understood that this should not be construed as a limitation on the electronic device 1 provided in the embodiments of this application. The temperature sensor 240 is used to detect the temperature of the heat source 110 to obtain a detected temperature T. If the detected temperature T is greater than or equal to a threshold temperature T0 and less than a first preset temperature T1 (i.e., T0 ≤ T < T1), the electronic device 1 is in a first heat dissipation mode, wherein the first preset temperature is greater than the threshold temperature. If the detected temperature T is greater than or equal to the first preset temperature T1 and less than a second preset temperature T2 (i.e., T1 ≤ T < T2), the electronic device 1 is in a second heat dissipation mode, wherein the second preset temperature is greater than the first preset temperature. If the detected temperature T is greater than or equal to the second preset temperature T2 (i.e., T≥T2), the electronic device 1 is in the third heat dissipation mode.

[0140] The temperature sensor 240 can be, but is not limited to, a negative temperature coefficient (NTC) thermistor or a positive temperature coefficient thermistor. For example, the temperature sensor 240 is disposed adjacent to the heat source 110 to detect the temperature of the heat source 110. In one embodiment, both the temperature sensor 240 and the heat source 110 are located on the first circuit board 171.

[0141] If the detected temperature is greater than or equal to the threshold temperature, it indicates that the heat source 110 of the electronic device 1 has relatively high heat, and heat dissipation is required for the heat source 110. In one embodiment, the selection of the threshold temperature is related to the type of heat source 110; different types of heat sources 110 correspond to different threshold temperatures. In another embodiment, the same threshold temperature can be selected for different types of heat sources 110.

[0142] The first preset temperature and the second preset temperature can be selected according to the actual situation of the electronic device 1, as long as the first preset temperature is greater than the threshold temperature and the second preset temperature is greater than the first preset temperature.

[0143] In one embodiment, the software system (such as a temperature control system) of the electronic device 1 controls the operating state of the fan 160 and the thermoelectric cooler 140. For example, the electronic device 1 further includes a memory and a processor. The memory stores computer program code, which is read and executed by the processor to control the operating state of the fan 160 and the thermoelectric cooler 140.

[0144] Therefore, the electronic device 1 provided in one embodiment of this application, through a temperature sensor 240 and a temperature control system, wherein the temperature sensor 240 identifies the detected temperature of the heat source 110, and the temperature control system, based on the detected temperature and the magnitude between the detected temperature and the threshold temperature, the first preset temperature and the second preset temperature, realizes a multi-level adjustable heat dissipation scheme (i.e., the first heat dissipation mode, the second heat dissipation mode and the third heat dissipation mode), thereby achieving better or optimal heat dissipation in multiple scenarios and overall power consumption.

[0145] In summary, the electronic device 1 provided in this application utilizes the temperature sensor 240 to detect the temperature of the heat source 110 to obtain the detected temperature. The detected temperature is compared with the threshold temperature, the first preset temperature, and the second preset temperature to control the electronic device 1 to be in one of the first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode according to the temperature range in which the detected temperature is located. Therefore, the electronic device 1 provided in this application can adopt a corresponding heat dissipation mode according to the detected temperature of the heat source 110 detected by the temperature sensor 240, thereby achieving optimal or optimal heat dissipation of the heat source 110 and overall power consumption of the electronic device 1 under multiple temperature scenarios.

[0146] In one embodiment, the electronic device 1 has a first load scenario, a second load scenario, and a third load scenario. If the electronic device 1 is in the first load scenario, its power consumption per unit time is a first power consumption. If the electronic device 1 is in the second load scenario, its power consumption per unit time is a second power consumption, wherein the second power consumption is greater than the first power consumption. If the electronic device 1 is in the third load scenario, its power consumption per unit time is a third power consumption, wherein the third power consumption is greater than the second power consumption. If the electronic device 1 is in the first load scenario, it is in a first heat dissipation mode; if the electronic device 1 is in the second load scenario, it is in a second heat dissipation mode; if the electronic device 1 is in the third load scenario, it is in the third heat dissipation mode.

[0147] In this embodiment, the first power consumption is less than the second power consumption, and the third power consumption is greater than the second power consumption. Therefore, the first load scenario can be referred to as a low-to-medium load scenario, the second load scenario can be referred to as a medium-to-high load scenario, and the third load scenario can be referred to as a heavy load scenario.

[0148] For example, the first load scenario includes, but is not limited to, scenarios such as viewing information in instant messaging applications. The second load scenario includes, but is not limited to, scenarios such as taking photos, playing games for a short time, recording videos for a short time, or playing videos for a short time. In this embodiment, a duration less than or equal to the first duration is considered short; a duration greater than or equal to the second duration is considered long, wherein the second duration is longer than the first duration. For example, the first duration can be, but is not limited to, 10 minutes or 15 minutes; the second duration can be, but is not limited to, 30 minutes or 35 minutes; however, it is not limited to this example.

[0149] In one embodiment, the electronic device 1 further includes a processor, which activates a corresponding heat dissipation mode based on the current scene of the electronic device 1 and the duration of the current scene.

[0150] It should be noted that, for the scheme in which the heat source 110 and the first heat sink 130 are both located on the same side of the heat spreader 120, and the heat source 110 and the first heat sink 130 are arranged at different parts of the heat spreader 120, the first heat sink 133 can also be called a heat spreader plate heat sink fin or a VC heat sink fin; the second heat sink 134 can also be called a thermoelectric cooler cold side heat sink fin or a TEC cold side fin.

[0151] In the configuration where the first heat sink 130 is located on the side of the heat source 110 away from the heat spreader plate, and the thermoelectric cooler 140 is located on the side of the first heat sink 130 away from the heat source 110, the first heat sink fin 133 can also be called the motherboard heat sink fin, and the second heat sink fin 134 can also be called the thermoelectric cooler cold side heat sink fin, or TEC cold side fin.

[0152] For a single-board solution, the first circuit board 171 of the electronic device 1 can also be called the motherboard. Correspondingly, since the shielding cover 190 in the single-board solution is located on the side of the first circuit board 171 away from the heat source 110, the shielding component can also be called the motherboard bottom (BOT) shielding cover or the motherboard BOT side shielding cover.

[0153] The electronic device 1 provided in this application includes a heat spreader 120, which is thermally connected to the heat source 110. Therefore, the heat spreader 120 can evenly distribute the heat generated by the heat source 110. When the fan 160 is in operation, the cold air blown out by the fan 160 exchanges heat with the first heat sink 133 and the second heat sink 134 in the first heat sink 130, thereby cooling the first heat sink 133 and the second heat sink 134. After heat exchange, the cold air becomes hot air, which is then blown out of the electronic device 1, such as out of the casing of the electronic device 1, thereby achieving overall cooling of the electronic device 1.

[0154] Furthermore, the electronic device 1 provided in this application embodiment also includes a temperature sensor 240, which can detect the temperature in real time and has a multi-level intelligent heat dissipation adjustment function, enabling it to achieve a better or optimal solution for heat dissipation and overall power consumption in various scenarios. The electronic device 1 provided in this application embodiment can solve the heat dissipation problem of the electronic device 1 under third-load scenarios (also known as high-load scenarios) such as long-term gaming or long-term video recording, thereby solving the problem of the electronic device 1 overheating under these scenarios. The electronic device 1 provides a very good user experience. For example, the electronic device 1 provided in this application embodiment can solve the problem of the electronic device 1 overheating under high-load scenarios such as long-term gaming or long-term video recording in related technologies, resulting in a very good user experience.

[0155] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes: Heat source; A heat spreader is located on one side of the heat source and is thermally connected to the heat source; A first heat sink includes a first support portion, a second support portion, a plurality of first heat sink fins, and a plurality of second heat sink fins. The first support portion conducts heat with the heat source. The second support portion is opposite to and spaced apart from the first support portion. The first heat sink fins are connected to the surface of the first support portion facing the second support portion and are spaced apart from the second support portion. The second heat sink fins are connected to the surface of the second support portion facing the first support portion and are spaced apart from the first support portion and offset from the first heat sink fins. The first heat sink has a first air duct. A thermoelectric cooler is disposed on the side of the second support portion away from the first support portion. The thermoelectric cooler has a cold surface and a hot surface, and the hot surface is away from the second support portion relative to the cold surface. A second heat sink is located on one side of the hot surface, and the second heat sink has a second air duct; and A fan is connected to the first air duct, and the fan is also connected to the second air duct.

2. The electronic device as claimed in claim 1, characterized in that, The heat source and the first heat sink are both located on the same side of the heat spreader, and the heat source and the first heat sink are provided at different locations on the heat spreader. The first heat dissipation fins in the plurality of first heat dissipation fins and the second heat dissipation fins in the plurality of second heat dissipation fins are arranged alternately.

3. The electronic device as claimed in claim 1, characterized in that, The heat source and the first heat sink are both located on the same side of the heat spreader, and the heat source and the first heat sink are set at different parts of the heat spreader. The plurality of first heat dissipation fins are located on one side of the plurality of second heat dissipation fins.

4. The electronic device as described in claim 2 or 3, characterized in that, The first support portion has a first sub-support portion and a second sub-support portion connected together, the first heat dissipation fin is connected to the first sub-support portion, and the first heat dissipation fin avoids the second sub-support portion; The second support portion has a connected third sub-support portion and a fourth sub-support portion. The third sub-support portion is disposed opposite to the first sub-support portion, and the fourth sub-support portion is disposed opposite to the second sub-support portion. The second heat dissipation fin is connected to the third sub-support portion and avoids the fourth sub-support portion. The thermoelectric cooler is disposed corresponding to the third sub-support portion, and the fan is disposed on the fourth sub-support portion.

5. The electronic device as claimed in claim 4, characterized in that, The fourth sub-support unit is closer to the heat source than the third sub-support unit.

6. The electronic device as claimed in claim 2 or 3, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device is mounted on the first circuit board and located on the side of the first circuit board away from the heat source. A second circuit board is disposed on the side of the first electronic device that is away from the first circuit board; A second electronic device, the second electronic device being mounted on the second circuit board and located on the side of the second circuit board opposite to the first circuit board; and A shielding cover is located on the side of the second circuit board opposite to the first circuit board and is used to house the second electronic device.

7. The electronic device as claimed in claim 2 or 3, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device, the first electronic device being mounted on the first circuit board and located on the side of the first circuit board away from the heat source; and A shielding cover is located on the side of the first circuit board away from the heat source, and the shielding cover is used to house the first electronic device.

8. The electronic device as claimed in claim 1, characterized in that, The first heat sink is located on the side of the heat source away from the heat spreader; The thermoelectric cooler is disposed on the side of the first heat sink away from the heat source.

9. The electronic device as claimed in claim 8, characterized in that, The plurality of first heat dissipation fins are located on one side of the plurality of second heat dissipation fins.

10. The electronic device as claimed in claim 9, characterized in that, The first support portion has a first sub-support portion and a second sub-support portion connected together, the first heat dissipation fin is connected to the first sub-support portion, and the first heat dissipation fin avoids the second sub-support portion; The second support portion has a connected third sub-support portion and a fourth sub-support portion. The third sub-support portion is disposed opposite to the first sub-support portion and is disposed opposite to and spaced apart from the first heat dissipation fin. The fourth sub-support portion is disposed opposite to the second sub-support portion. The second heat dissipation fin is connected to the fourth sub-support portion and avoids the third sub-support portion. The second heat dissipation fin is spaced apart from the second sub-support portion.

11. The electronic device as claimed in claim 10, characterized in that, The thermoelectric cooler is disposed corresponding to the fourth sub-support unit and avoids the third sub-support unit.

12. The electronic device as claimed in claim 11, characterized in that, The second heat sink includes: The third support portion is located on one side of the hot surface of the thermoelectric cooler and conducts heat with the hot surface; A fourth support portion, which is opposite to and spaced apart from the third support portion, is further away from the thermoelectric cooler than the third support portion; and Multiple third heat dissipation fins, one end of which is connected to the third support portion and the other end of which is connected to the fourth support portion.

13. The electronic device as claimed in claim 12, characterized in that, The plurality of third heat dissipation fins are provided corresponding to the portions of the third support portion adjacent to the thermoelectric cooler, and the third heat dissipation fins avoid the portions of the third support portion that are away from the thermoelectric cooler; The plurality of third heat dissipation fins are disposed corresponding to the portion of the fourth support portion adjacent to the thermoelectric cooler, and the plurality of third heat dissipation fins avoid the portion of the fourth support portion away from the thermoelectric cooler.

14. The electronic device as claimed in claim 8, characterized in that, The first heat dissipation fins in the plurality of first heat dissipation fins and the second heat dissipation fins in the plurality of second heat dissipation fins are arranged alternately.

15. The electronic device as claimed in claim 14, characterized in that, The thermoelectric cooler is configured for all second heat dissipation fins.

16. The electronic device as claimed in claim 14, characterized in that, The second heat sink includes: The third support portion is located on one side of the hot surface of the thermoelectric cooler and conducts heat with the hot surface; A fourth support portion, which is opposite to and spaced apart from the third support portion, is further away from the thermoelectric cooler than the third support portion; and Multiple third heat dissipation fins, one end of which is connected to the third support portion and the other end of which is connected to the fourth support portion.

17. The electronic device as claimed in claim 16, characterized in that, The plurality of third heat dissipation fins are arranged corresponding to the portion of the third support unit adjacent to the fan, and are arranged away from the portion of the third support unit away from the fan.

18. The electronic device according to any one of claims 8-17, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device, the first electronic device being mounted on the first circuit board and located on the side of the first circuit board away from the heat source; and A shielding cover is located on the side of the first circuit board away from the heat source, and the shielding cover is used to house the first electronic device.

19. The electronic device as claimed in claim 1, characterized in that, The electronic device has: In the first heat dissipation mode, if the electronic device is in the first heat dissipation mode, the fan is off and the thermoelectric cooler is off. In the second heat dissipation mode, if the electronic device is in the second heat dissipation mode, the fan is in the working state and the thermoelectric cooler is in the off state; and In the third heat dissipation mode, the fan is in operation and the thermoelectric cooler is in operation.

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