Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a substrate, an electrostatic protection layer and a plurality of conductive structures, the substrate is provided with a first face, a second face and a side face located between the first face and the second face, the conductive structures are arranged at intervals in the first direction, in the same conductive structure, the conductive structure comprises a connecting pad and a side face wire, the connecting pad is arranged on the first face, and the side face wire is arranged on the second face. One end of the side wire is located on the first face and electrically connected with the connecting pad, part of the side wire is located on the side face and the second face, the electrostatic protection layer is located on the side, away from the substrate, of the conductive structure and makes contact with the conductive structure, the electrostatic protection layer at least covers one conductive structure, and the first direction intersects with the thickness direction of the substrate. Therefore, according to the display panel and the display device provided by the invention, the anti-static capability of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) displays integrate LED chips with a size of less than 100 micrometers as display pixels on a substrate. Micro LEDs have advantages such as high stability, long lifespan, low power consumption, and fast response speed.

[0003] In related technologies, the display panel may include an array substrate and multiple Micro LEDs located on the array substrate, all of which are electrically connected to the array substrate. The borderless splicing display panel's characteristic of having no border reduces the proportion of non-display areas, eliminating the visual discontinuity of traditional bezels. However, the anti-static capabilities of the aforementioned display panels need improvement. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and display device that aim to improve the anti-static capability of the display panel.

[0005] In a first aspect, embodiments of this application provide a display panel, which includes a substrate, an electrostatic discharge (ESD) shielding layer, and a plurality of conductive structures. The substrate has a first surface, a second surface, and a side surface located between the first surface and the second surface. The plurality of conductive structures are arranged at intervals along a first direction. In the same conductive structure, the conductive structure includes a connecting pad and a side trace. The connecting pad is disposed on the first surface, one end of the side trace is located on the first surface and is electrically connected to the connecting pad, and some of the side traces are located on the side surface and the second surface. The ESD shielding layer is located on the side of the conductive structure away from the substrate and is in contact with the conductive structure. The ESD shielding layer covers at least one conductive structure, wherein the first direction intersects with the thickness direction of the substrate.

[0006] Secondly, embodiments of this application also provide a display device, including the display panel of the first aspect.

[0007] The display panel provided in this application embodiment has an electrostatic discharge (ESD) protection layer on the side of the conductive structure away from the substrate. The ESD protection layer is in contact with the conductive structure and covers at least one conductive structure. When static charge accumulates on the conductive structure, the ESD protection layer can release the static electricity on the conductive structure, thereby reducing the adverse effects of static electricity on the display panel and reducing damage to the display panel, thus improving the anti-static capability of the display panel. Attached Figure Description

[0008] Figure 1This is a top view of the display panel provided in an embodiment of this application.

[0009] Figure 2 for Figure 1 Enlarged diagram of point A in the middle.

[0010] Figure 3 for Figure 2 Sectional view along the BB direction.

[0011] Figure 4 for Figure 2 Sectional view along the CC direction.

[0012] Figure 5 This is a partial cross-sectional view of the display panel provided in an embodiment of this application.

[0013] Figure 6 Another partial cross-sectional view of the display panel provided in an embodiment of this application.

[0014] Figure 7 This is a schematic diagram of the electrostatic discharge protection layer and the third encapsulation layer on the side of the substrate provided in an embodiment of this application.

[0015] Figure 8 This is a schematic diagram of the structure of the display device provided in the embodiments of this application.

[0016] Figure 9 This is another schematic diagram of the display device provided in an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures:

[0018] 10. Display device; 100. Display panel; 111. First planarization layer; 112. Second planarization layer; 130. Conductive structure; 131. Connecting pad; 1311. First connecting portion; 1312. Second connecting portion; 132. Side trace; 140. Substrate; 141. First surface; 142. Second surface; 143. Side surface; 151. First passivation layer; 152. Second passivation layer; 153. Insulating layer; 154. Shielding layer Light structure; 155, side-shielding structure; 156, filling layer; 161, first encapsulation layer; 162, second encapsulation layer; 163, third encapsulation layer; 164, adhesive layer; 170, light-emitting unit; 181, semiconductor layer; 190, electrostatic discharge protection layer; 191, first electrostatic discharge protection part; 192, second electrostatic discharge protection part; 193, third electrostatic discharge protection part; E, overlapping part; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0019] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more intermediate elements present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intermediate elements present.

[0022] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0023] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0024] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0025] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0026] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0027] As described in the background section, in related technologies, frameless splicing display panels have the technical characteristic of having no frame, thus lacking the frame and corresponding peripheral anti-static structure of traditional display panels. A connecting pad can be provided on the light-emitting side of the display panel, and a driver chip can be provided on the backlight side. Side traces are provided on the sidewalls of the display panel, and the connecting pad and driver chip are electrically connected through the side traces.

[0028] However, during the manufacturing process and subsequent installation and use, edge contact and possible scratches may introduce charge into the side traces, leading to static electricity accumulation, which can damage the circuitry of the display panel, such as the driver chip.

[0029] Based on the above-mentioned technical problems, the inventors discovered that by setting an electrostatic protection layer on the side of the conductive structure away from the substrate, the electrostatic protection layer is in contact with the conductive structure and covers at least one conductive structure. When static charge accumulates on the conductive structure, the static electricity on the conductive structure can be released through the electrostatic protection layer, reducing the adverse effects of static electricity on the display panel and reducing damage to the display panel, thereby improving the anti-static capability of the display panel.

[0030] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] The following combination Figures 1-9 The display panel and display device provided in the embodiments of this application will be described.

[0032] See Figure 3 This application provides a display panel 100, which includes a substrate 140 that can provide support for a subsequently formed film layer. The substrate 140 has a first surface 141 and a second surface 142 that are opposite each other along the thickness direction (direction Z) of the substrate 140, and a side surface 143 of the substrate 140 is connected between the first surface 141 and the second surface 142.

[0033] See Figure 2 and Figure 3In some embodiments, the display panel 100 includes a plurality of conductive structures 130, which are arranged at intervals along a first direction X. The conductive structures 130 are used to connect to electronic components on the second surface 142 of the substrate 140. By placing the electronic components on the second surface 142, the electronic components will not occupy the area of ​​the first surface 141, so that more light-emitting units 170 can be placed on the first surface 141, which is beneficial to improving the arrangement density of the light-emitting units 170 on the first surface 141.

[0034] See Figure 2 and Figure 3 In the same conductive structure 130, the conductive structure 130 includes a connecting pad 131 and a side trace 132. The connecting pad 131 is disposed on the first surface 141 and is located on the edge of the first surface 141 along the second direction Y. One end of the side trace 132 is located on the first surface 141 and is electrically connected to the connecting pad 131. Part of the side trace 132 is located on the side surface 143 and the second surface 142. The side trace 132 extends along the side surface 143 of the substrate 140 from the first surface 141 to the second surface 142 of the substrate 140 so that the side trace 132 can be connected to electronic components disposed on the second surface 142 of the substrate 140 to transmit signals.

[0035] See Figure 2 and Figure 3 The display panel 100 includes an electrostatic discharge (ESD) shielding layer 190. The ESD shielding layer 190 is located on the side of the conductive structure 130 away from the substrate 140 and is in contact with the conductive structure 130. The ESD shielding layer 190 covers at least one conductive structure 130. In this way, when static charge accumulates on the conductive structure 130, the static electricity on the conductive structure 130 can be released through the ESD shielding layer 190, reducing the adverse effects of static electricity on the display panel 100 and reducing damage to the display panel 100, thereby improving the anti-static capability of the display panel.

[0036] For example, the electrostatic discharge (ESD) shielding layer 190 covers at least two adjacent conductive structures 130, allowing the ESD shielding layer 190 to release more static electricity from the conductive structures 130, which helps to improve the ESD shielding effect of the ESD shielding layer 190. For example, the ESD shielding layer 190 covers two adjacent conductive structures 130.

[0037] In some embodiments, the material of the electrostatic discharge (ESD) shielding layer 190 includes a semi-insulating material. Semi-insulating materials are functional materials with resistivity between that of conductors and insulators. The resistance of a semi-insulating material is much lower than that of an insulator, which almost completely blocks charge movement (charge cannot be discharged and accumulates), while the weak conductivity of a semi-insulating material is sufficient to allow static charge to slowly leak to ground (or a grounded structure) within seconds to minutes, achieving electrostatic discharge (ESD). Simultaneously, the resistivity of the semi-insulating material is much higher than that of conductors such as the conductive structure 130, creating a significant impedance difference. This difference results in signal current only propagating in the low-impedance conductive structure 130 and not interfering with the high-impedance semi-insulating material; adjacent conductive structures 130 will not leak current because they are both in contact with the ESD shielding layer 190. Therefore, the weak conductivity of the semi-insulating material is only effective against static electricity and has almost no effect on the signal current of the conductive structure 130. "Among them, two adjacent conductive structures 130 can be connected by an electrostatic protection layer 190, which is equivalent to forming a semi-insulated short circuit between two adjacent conductive structures 130, and adding a very large short circuit resistance between two adjacent conductive structures 130."

[0038] For example, the resistivity of the semi-insulating material is in the range of 10. 7 Ω·m-10 13 The resistivity of the semi-insulating material can be Ω·m, thus preventing interference with the signal current on the conductive structure 130 while releasing static electricity. For example, the resistivity of the semi-insulating material can be 10 Ω·m. 7 Ω·m, 10 8 Ω·m, 10 9 Ω·m, 10 10 Ω·m, 10 11 Ω·m, 10 12 Ω·m or between 10 7 Ω·m-10 13 Any value between Ω and m.

[0039] For example, the resistivity of the side trace 132 is less than or equal to 100 mΩ·m, which makes the resistivity of the side trace 132 low, which is beneficial to the transmission of signal current. For example, the resistivity of the side trace 132 can be any value of 50 mΩ·m, 60 mΩ·m, 70 mΩ·m, 80 mΩ·m, 90 mΩ·m, 100 mΩ·m or less than 100 mΩ·m.

[0040] For example, the resistivity of the connecting pad 131 is less than or equal to 1 Ω·m, which makes the resistivity of the connecting pad 131 low, which is beneficial to the transmission of signal current. For example, the resistivity of the connecting pad 131 can be 0.1 Ω·m, 0.3 Ω·m, 0.5 Ω·m, 0.7 Ω·m, 0.9 Ω·m, 1 Ω·m or any value less than 1 Ω·m.

[0041] In some embodiments, the electrostatic discharge shield 190 is grounded, so that static electricity can be slowly released to ground through the electrostatic discharge shield 190.

[0042] See Figure 2 and Figure 3 In some embodiments, the electrostatic discharge (ESD) protection layer 190 includes a first ESD protection portion 191, which is located on the first surface 141. The first ESD protection portion 191 is in contact with the connecting pad 131 of the conductive structure 130. In this way, the static electricity on the conductive structure 130 in contact with the first ESD protection portion 191 can be released through the first ESD protection portion 191, thereby reducing the adverse effects of static electricity on the display panel 100 and reducing damage to the display panel 100 caused by static electricity.

[0043] For example, the first electrostatic protection part 191 can contact the connection pads 131 of each conductive structure 130.

[0044] See Figure 2 and Figure 3 In some embodiments, the first electrostatic protection part 191 is strip-shaped and extends along the first direction X. This makes the shape of the first electrostatic protection part 191 simpler and allows the size of the first electrostatic protection part 191 along the first direction X to be larger. The first electrostatic protection part 191 can contact more connecting pads 131 of the conductive structure 130, which is beneficial to improving the electrostatic protection effect of the first electrostatic protection part 191.

[0045] See Figure 2 and Figure 3In some embodiments, within the same conductive structure 130, the connecting pad 131 includes a first connecting portion 1311 and a second connecting portion 1312 connected together. The first connecting portion 1311 and the second connecting portion 1312 are arranged along a first direction X. One end of the side trace 132 is connected to the side of the first connecting portion 1311 facing away from the substrate 140. The orthographic projection of the side trace 132 on the first surface 141 does not overlap with the orthographic projection of the second connecting portion 1312 on the first surface 141. The second connecting portion 1312 is not covered by the side trace 132, and the second connecting portion 1312 and the side trace 132 do not overlap. The first electrostatic protection portion 191 is connected to the conductive pad 1311. The second connecting portion 1312 of structure 130 is in contact, and the first electrostatic protection portion 191 covers at least one connecting pad 131. In this way, the size of the connecting pad 131 along the first direction X is set to be relatively large, which helps to reduce the difficulty of connecting the side trace 132 and the corresponding connecting pad 131, and makes the contact area between the side trace 132 and the corresponding connecting pad 131 larger, which is beneficial to the signal transmission between the side trace 132 and the corresponding connecting pad 131. In addition, the first electrostatic protection portion 191 is in contact with the second connecting portion 1312 of conductive structure 130, so that the static electricity on conductive structure 130 can be released through the first electrostatic protection portion 191.

[0046] For example, the first electrostatic discharge protection portion 191 covers at least two adjacent connecting pads 131. For instance, the first electrostatic discharge protection portion 191 covers every two adjacent connecting pads 131.

[0047] For example, the first electrostatic discharge protection unit 191 may be grounded.

[0048] See Figure 4 and Figure 5 In some embodiments, the display panel 100 includes an encapsulation layer (i.e., a third encapsulation layer 163). The third encapsulation layer 163 is disposed on the side of a portion of the conductive structure 130 away from the substrate 140. The third encapsulation layer 163 can protect the covered portion of the conductive structure 130, prevent water and oxygen from entering the portion of the conductive structure 130, and improve the reliability of the display panel 100.

[0049] In some embodiments, the third encapsulation layer 163 is disposed on the side of the conductive structure 130 facing away from the substrate 140, and the third encapsulation layer 163 exposes another part of the conductive structure 130. The electrostatic discharge protection layer 190 is in contact with the other part of the conductive structure 130. In this way, the electrostatic discharge protection layer 190 can protect the covered conductive structure 130. The conductive structure 130 can be completely covered by the electrostatic discharge protection layer 190 and the encapsulation layer, which can form a good protection for the conductive structure 130.

[0050] See Figure 3In some embodiments, a third encapsulation layer 163 is provided between the side trace 132 on the first connection portion 1311 and the first electrostatic protection portion 191. In this way, the third encapsulation layer 163 covers the first connection portion 1311 and the side trace 132 on the first connection portion 1311, which helps to improve the encapsulation effect of the third encapsulation layer 163 and prevent water and oxygen from entering the first connection portion 1311 and the side trace 132 on the first connection portion 1311.

[0051] See Figure 4 In some embodiments, the orthographic projection of the third encapsulation layer 163 on the first surface 141 does not overlap with the orthographic projection of at least a portion of the second connection portion 1312 on the first surface 141, and at least a portion of the second connection portion 1312 is exposed outside the third encapsulation layer 163 to prevent the third encapsulation layer 163 from affecting the contact between the first electrostatic protection portion 191 and the second connection portion 1312.

[0052] See Figure 5 In some embodiments, the electrostatic discharge (ESD) shielding layer 190 includes a second ESD shielding portion 192 located on the side 143. The second ESD shielding portion 192 contacts the side trace 132 of the conductive structure 130. The second ESD shielding portion 192 covers at least one side trace 132. In this way, static electricity on the conductive structure 130 in contact with the second ESD shielding portion 192 can be released through the second ESD shielding portion 192, reducing the adverse effects of static electricity on the display panel 100 and reducing damage to the display panel 100 caused by static electricity.

[0053] For example, the second electrostatic discharge protection portion 192 covers at least two adjacent side traces 132. For instance, the second electrostatic discharge protection portion 192 covers every two adjacent side traces 132. That is, the second electrostatic discharge protection portion 192 can be in contact with all side traces 132 of each conductive structure 130.

[0054] See Figure 7 In some embodiments, the second electrostatic protection part 192 is strip-shaped and extends along the first direction X. This makes the shape of the second electrostatic protection part 192 simpler and allows the size of the second electrostatic protection part 192 along the first direction X to be larger. The second electrostatic protection part 192 can contact more of the side traces 132 of the conductive structure 130, which is beneficial to improving the electrostatic protection effect of the second electrostatic protection part 192.

[0055] For example, the second electrostatic discharge protection section 192 can disconnect the third encapsulation layer 163 into two sub-encapsulation sections.

[0056] For example, the second electrostatic discharge protection unit 192 may be grounded.

[0057] See Figure 6In some embodiments, the electrostatic discharge (ESD) shielding layer 190 includes a third ESD shielding portion 193 located on the second surface 142. The third ESD shielding portion 193 contacts the side traces 132 of the conductive structure 130, and the third ESD shielding portion 193 covers at least one side trace 132. In this way, the static electricity on the conductive structure 130 in contact with the third ESD shielding portion 193 can be released through the third ESD shielding portion 193, thereby reducing the adverse effects of static electricity on the display panel 100 and reducing damage to the display panel 100 caused by static electricity.

[0058] The electrostatic discharge (ESD) protection layer 190 may include at least one of a first ESD protection section 191, a second ESD protection section 192, and a third ESD protection section 193. For example, the ESD protection layer 190 may be provided with at least two of the first ESD protection section 191, the second ESD protection section 192, and the third ESD protection section 193, and adjacent ESD protection sections may be spaced apart.

[0059] For example, the third electrostatic discharge protection section 193 covers at least two adjacent side traces 132. That is, the third electrostatic discharge protection section 193 can contact the side traces 132 of each conductive structure 130.

[0060] In some embodiments, the third electrostatic protection part 193 is strip-shaped and extends along the first direction X. This makes the shape of the third electrostatic protection part 193 simpler and allows the size of the third electrostatic protection part 193 along the first direction X to be larger. The third electrostatic protection part 193 can contact more of the side traces 132 of the conductive structure 130, which is beneficial to improving the electrostatic protection effect of the third electrostatic protection part 193.

[0061] For example, the third electrostatic discharge protection unit 193 may be grounded.

[0062] See Figure 4 and Figure 5 In some embodiments, the third encapsulation layer 163 includes an overlapping portion E, and the overlapping portion E and a portion of the electrostatic discharge (ESD) shielding layer 190 overlap in a direction from the side of the third encapsulation layer 163 near the substrate 140 to the side away from the substrate 140. For example, the portion of the ESD shielding layer 190 is stacked on the side of the overlapping portion E away from the substrate. This ensures that there are no gaps between the overlapping portion E and the adjacent portion of the ESD shielding layer 190, which helps to prevent water and oxygen intrusion caused by the presence of gaps.

[0063] See Figure 3In some embodiments, side surface 143 includes a first sub-surface and a second sub-surface, the first sub-surface being connected between the second sub-surface and the first surface 141, and the first sub-surface intersecting obliquely with the thickness direction of the substrate 140. In this case, there is a chamfer between the first surface 141 and the second sub-surface.

[0064] In the embodiment where the first electrostatic protection part 191 is provided, the first electrostatic protection part 191 is provided at a distance from the first sub-surface, and the orthographic projection of the first electrostatic protection part 191 on the plane where the first surface 141 is located is provided at a distance from the orthographic projection of the first sub-surface on the plane where the first surface 141 is located.

[0065] In the embodiment where a second electrostatic discharge protection part 192 is provided, the second electrostatic discharge protection part 192 is provided on the second sub-surface.

[0066] In some embodiments, side surface 143 includes a third sub-surface that connects between the second sub-surface and the second surface 142, and the third sub-surface intersects obliquely with the thickness direction of the substrate 140. In this case, there is a chamfer between the second surface 142 and the second sub-surface.

[0067] In the embodiment where a third electrostatic discharge protection part 193 is provided, the third electrostatic discharge protection part 193 is provided at a distance from the third sub-surface, and the orthographic projection of the third electrostatic discharge protection part 193 on the plane where the first surface 141 is located is provided at a distance from the orthographic projection of the third sub-surface on the plane where the first surface 141 is located.

[0068] See Figure 3 In some embodiments, the display panel 100 includes a first planarization layer 111 and a second planarization layer 112. The first planarization layer 111 is located on the first surface 141, and the second planarization layer 112 is located on the side of the first planarization layer 111 facing away from the substrate 140. By providing the first planarization layer 111 and the second planarization layer 112, a relatively flat surface support can be provided for the light-emitting unit 170.

[0069] See Figure 3 The display panel 100 may include multiple light-emitting units 170, which are spaced apart on one side of the substrate 140. The multiple light-emitting units 170 being spaced apart can mean that there is a gap between adjacent light-emitting units 170. The surface of the light-emitting unit 170 facing away from the substrate 140 can be the light-emitting surface of the light-emitting unit 170.

[0070] See Figure 3Multiple light-emitting units 170 can be located on the side of the second planarization layer 112 away from the substrate 140 and arranged at intervals. The orthographic projection of each light-emitting unit 170 on the plane where the first surface 141 is located is within the outer contour of the orthographic projection of either the first planarization layer 111 or the second planarization layer 112 on the plane where the first surface 141 is located. In this way, the first planarization layer 111 and the second planarization layer 112 can provide a relatively flat surface support for each light-emitting unit 170.

[0071] For example, the light-emitting unit 170 may include a micro light-emitting diode.

[0072] See Figure 3 In some embodiments, the display panel 100 may include a light-shielding structure 154, which is located on the same side of the substrate 140 as the light-emitting unit 170. For example, the light-shielding structure 154 is located on the side of the second planarization layer 112 facing away from the substrate 140, and the light-shielding structure 154 at least partially surrounds the light-emitting unit 170. The light-shielding structure 154 can help achieve a seamless black effect and also helps prevent color crossing between adjacent light-emitting units 170.

[0073] See Figure 3 In some embodiments, the light-shielding structure 154 covers the side of the first electrostatic protection portion 191 facing away from the substrate 140.

[0074] For example, the light-shielding structure 154 can be formed by printing or coating.

[0075] For example, the material of the light-shielding structure 154 may include ink.

[0076] For example, the color of the light-shielding structure 154 can be gray, black, or other dark colors.

[0077] In some embodiments, see Figure 3 The surface B1 of the light-shielding structure 154 facing away from the substrate 140 and the surface B2 of the light-shielding structure 154 facing away from the center of the display panel are connected by a first arc surface B3, which protrudes in the direction away from the substrate 140. The thickness of the light-shielding structure 154 at the first arc surface B3 gradually decreases in the direction away from the center of the display panel.

[0078] See Figure 1The display panel 100 may have a first direction X, a second direction Y, and a third direction Z, all of which are different. The first direction X and the second direction Y can be any two different directions parallel to the display panel 100, and the third direction Z can be any direction intersecting a plane parallel to the display panel 100. For example, the first direction X, the second direction Y, and the third direction Z can be perpendicular to each other. For example, the first direction X can be the width direction of the display panel 100, the second direction Y can be the length direction of the display panel 100, and the third direction Z can be the thickness direction of the display panel 100. The length, width, and thickness in the embodiments of this application are merely for descriptive convenience and do not imply any limitation on the dimensions. For example, the width can be greater than, equal to, or less than the length. The orientation of the display panel 100 can be consistent with the orientation of the film layers such as the substrate 140.

[0079] In some embodiments, see Figure 1 The light-emitting unit 170 includes a light-emitting functional part, a first electrode, and a second electrode. The first electrode and the second electrode are disposed on the side of the light-emitting functional part facing the substrate 140, and are spaced apart, i.e., there is a gap between the first electrode and the second electrode. One of the first electrode and the second electrode can be an anode, and the other can be a cathode. In this embodiment, the first electrode is used as an anode and the second electrode is used as a cathode for illustration.

[0080] In some embodiments, a partial light-shielding structure 154 is also located in the gap. This partial light-shielding structure 154 is situated between the first electrode and the second electrode. Through this partial light-shielding structure 154 and the partial light-shielding structure 154 located between two adjacent light-emitting units 170, the first and second electrodes of the light-emitting unit 170, as well as the first and second conductive elements, can be effectively covered, avoiding reflection caused by exposure of the first and second electrodes and the first and second conductive elements. The first and second conductive elements can be located in the fourth conductive layer M4, with the first conductive element electrically connected to the first electrode and the second conductive element electrically connected to the second electrode.

[0081] See Figure 3In some embodiments, the display panel 100 further includes an array layer located between the substrate 140 and the light-emitting unit 170. A pixel circuit is disposed in the array layer and connected to the light-emitting unit 170. The pixel circuit includes a transistor T, which may include an active layer, a gate, a first electrode, and a second electrode. The active layer may be located on the semiconductor layer 181, the gate may be located on the first conductive layer M1, the first electrode and the second electrode may be located on the second conductive layer M2, and the first conductive element and the second conductive element may be located on the fourth conductive layer M4. The fourth conductive layer M4 can be connected to the second conductive layer M2 through a third conductive layer M3. A fifth conductive layer Mc is disposed between the first conductive layer M1 and the second conductive layer M2. A portion of the fifth conductive layer Mc and a portion of the second conductive layer M2 can form a capacitor structure for the pixel circuit. A sixth conductive layer M0 is disposed on the side of the semiconductor layer 181 facing away from the first conductive layer M1, and the sixth conductive layer M0 overlaps with the active layer along the thickness direction of the substrate 140.

[0082] See Figure 3 The sixth conductive layer M0, semiconductor layer 181, first conductive layer M1, fifth conductive layer Mc, second conductive layer M2, third conductive layer M3, and fourth conductive layer M4 can be sequentially stacked along the direction away from the substrate 140. An insulating layer 153 can be disposed between each two adjacent layers of the sixth conductive layer M0, semiconductor layer 181, first conductive layer M1, fifth conductive layer Mc, second conductive layer M2, third conductive layer M3, and fourth conductive layer M4. The insulating layer 153 located between the second conductive layer M2 and the third conductive layer M3 includes a first passivation layer 151 and a first planarization layer 111 sequentially disposed in the direction away from the substrate 140. The insulating layer 153 located between the third conductive layer M3 and the fourth conductive layer M4 can be a second planarization layer 112.

[0083] For example, one of the first and second terminals of transistor T can be the source, and the other can be the drain.

[0084] See Figure 3 In some embodiments, the display panel 100 includes a second passivation layer 152, which is located on the side of the second planarization layer 112 facing away from the substrate 140. The second passivation layer 152 can cover the edges of the first conductive element and the second conductive element, and can protect the array layer from the influence of the external environment, thereby improving the stability and reliability of the display panel 100.

[0085] In some embodiments, at least a portion of the insulating layer 153 between the substrate 140 and the active layer may be a barrier layer to prevent substances such as water and oxygen from entering the transistor T and thus avoid affecting the performance of the transistor T.

[0086] For example, the materials of the first electrode, the second electrode, any conductive layer (e.g., M0-M4, Mc), the side trace 132, and the connecting pad 131 can be metals such as titanium, silver, copper, aluminum, and molybdenum, or alloys, or conductive oxides (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), zinc gallium oxide, titanium tantalum oxide, tin oxide, cadmium oxide, and indium oxide, any one or more of these.

[0087] For example, the material of the insulating layer 153 can be silicon nitride, silicon oxynitride, silicon oxide, or various organic insulating materials, or metal oxides with high dielectric constants such as aluminum oxide, tantalum oxide, etc.

[0088] For example, the material of the third encapsulation layer 163 may include an insulating material. The insulating material is in a high-resistivity state and cannot perform electrostatic discharge. For example, the material of the third encapsulation layer 163 may include a high-resistivity ink.

[0089] For example, the resistivity of the third encapsulation layer 163 is greater than 10. 13 The resistivity of the third encapsulation layer 163 is relatively high due to the Ω·m.

[0090] See Figure 3 In some embodiments, the display panel 100 includes a first encapsulation layer 161 located on the side of the light-shielding structure 154 and the light-emitting unit 170 facing away from the substrate 140. For example, the first encapsulation layer 161 may be a transparent ink.

[0091] See Figure 3 In some embodiments, the surface of the first encapsulation layer 161 facing away from the substrate 140 and the surface of the first encapsulation layer 161 facing away from the center of the display panel are connected by a second arc surface, which protrudes in the direction away from the substrate 140. The thickness of the first encapsulation layer 161 at the second arc surface gradually decreases in the direction away from the center of the display panel.

[0092] In some embodiments, the orthographic projection of the first encapsulation layer 161 on the substrate 140 lies within the outer contour of the orthographic projection of the light-shielding structure 154 on the substrate 140.

[0093] See Figure 3 In some embodiments, the display panel 100 includes a second encapsulation layer 162, which is located on the side of the first encapsulation layer 161 facing away from the substrate 140. For example, the second encapsulation layer 162 may be a 3A composite film.

[0094] For example, the surface of the second encapsulation layer 162 has a certain electrostatic dissipation effect, which can improve the electrostatic protection capability of the display panel 100.

[0095] See Figure 3 In some embodiments, the display panel 100 includes an adhesive layer 164 located between a first encapsulation layer 161 and a second encapsulation layer 162.

[0096] See Figure 3 In some embodiments, the display panel 100 includes a filler layer 156 located on the side of the third encapsulation layer 163 away from the side trace 132, and on the side of a portion of the adhesive layer 164 facing the substrate 140.

[0097] See Figure 3 In some embodiments, the display panel 100 includes a side light-shielding structure 155 located on the side of the filler layer 156 facing away from the side 143 of the substrate 140. The side light-shielding structure 155 may also be located at the edge of the second encapsulation layer 162 facing away from the adhesive layer 164. The side light-shielding structure 155 helps reduce the visibility of the seam when two adjacent display panels 100 are joined.

[0098] In some embodiments, the display panel 100 may include a mini light-emitting diode display (Mini LED) or a micro light-emitting diode display (Micro LED). This application describes the embodiment where the display panel 100 is a micro light-emitting diode display.

[0099] For example, the display panel 100 can be a frameless splicing display panel.

[0100] The display device 10 provided in the embodiments of this application will be described below.

[0101] See Figure 8 This application provides a display device 10, which includes the display panel 100 in any of the above embodiments. Therefore, the display device 10 also has the beneficial effects of the display panel 100 in the above embodiments. The similarities can be understood with reference to the explanation of the display panel 100 above, and will not be repeated here.

[0102] For example, the display device 10 can be a mobile phone or any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, industrial control equipment, medical display screen, touch interactive terminal, etc. This application embodiment does not make any special limitation in this regard.

[0103] See Figure 9 The display device 10 may include multiple display panels 100. The multiple display panels 100 may be connected together. The number of display panels 100 in the display device 10 may be any number of two, three, four or more.

[0104] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes: A substrate has a first surface, a second surface, and a side surface. The first surface and the second surface are disposed opposite to each other along the thickness direction of the substrate, and the side surface is connected to the first surface and the second surface. Multiple conductive structures are arranged at intervals along a first direction. In the same conductive structure, the conductive structure includes a connecting pad and a side trace. The connecting pad is disposed on the first surface. One end of the side trace is located on the first surface and is electrically connected to the connecting pad. Part of the side trace is located on the side surface and the second surface. The first direction intersects the thickness direction of the substrate. An electrostatic protective layer is located on the side of the conductive structure opposite to the substrate and is in contact with the conductive structure, and the electrostatic protective layer covers at least one of the conductive structures.

2. The display panel according to claim 1, characterized in that, The electrostatic protection layer includes a first electrostatic protection part located on the first surface, and the first electrostatic protection part is in contact with the connecting pad of the conductive structure.

3. The display panel according to claim 2, characterized in that, In the same conductive structure, the connecting pad includes a first connecting portion and a second connecting portion connected together. The first connecting portion and the second connecting portion are arranged along the first direction. One end of the side trace is connected to the side of the first connecting portion away from the substrate. The first electrostatic protection portion is in contact with the second connecting portion of the conductive structure. The first electrostatic protection portion covers at least one of the connecting pads.

4. The display panel according to claim 3, characterized in that, The display panel includes an encapsulation layer, which is disposed between the side trace on the first connecting portion and the first electrostatic protection portion.

5. The display panel according to any one of claims 1-4, characterized in that, The electrostatic discharge (ESD) shielding layer includes a second ESD shielding portion located on the side surface. The second ESD shielding portion is in contact with the side trace of the conductive structure, and the second ESD shielding portion covers at least one side trace.

6. The display panel according to any one of claims 1-4, characterized in that, The electrostatic discharge protection layer includes a third electrostatic discharge protection part located on the second surface. The third electrostatic discharge protection part is in contact with the side trace of the conductive structure and covers at least one side trace.

7. The display panel according to any one of claims 1-3, characterized in that, The display panel includes an encapsulation layer disposed on a portion of the conductive structure facing away from the substrate, the encapsulation layer exposing another portion of the conductive structure, and the electrostatic discharge protection layer contacting the other portion of the conductive structure.

8. The display panel according to claim 7, characterized in that, The encapsulation layer includes an overlapping portion, and the overlapping portion and a portion of the electrostatic discharge protection layer overlap in a direction from the side of the encapsulation layer close to the substrate to the side away from the substrate.

9. The display panel according to any one of claims 1-4, characterized in that, The electrostatic protection layer is grounded.

10. The display panel according to any one of claims 2-4, characterized in that, The first electrostatic protection part is strip-shaped and extends along the first direction.

11. The display panel according to any one of claims 1-4, characterized in that, The material of the electrostatic protective layer includes a semi-insulating material.

12. A display device, characterized in that, The display panel includes any one of claims 1-11.

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