Transfer mechanism and transfer method for KGD sorting machine from high-temperature turret to normal-temperature turret

Abstract

The invention discloses a transfer mechanism and method for a KGD sorting machine from a high-temperature turret to a normal-temperature turret. The transfer mechanism comprises a chip feeding module, a chip transfer module, a downward-looking camera and a chip discharging module, and the chip feeding module picks up chips from the high-temperature turret in parallel and transfers the chips to the chip transfer module; the downward-looking camera is used for carrying out visual positioning on the chip on the transfer module; and the chip discharging module picks up the chips according to the positioning data and accurately transfers the chips to the normal-temperature turret. The transferring method comprises the steps that the position, angle and patch pressure calibration is conducted on the discharging module through the calibration module; the double feeding modules synchronously pick up the chips from the high-temperature turret and place the chips on the transfer platform; performing image acquisition and positioning by the down-looking camera; and the double-blanking module is used for transferring the chip to the normal-temperature turret according to the positioning and calibration data. Through double-station parallel carrying and vision and force calibration, high-speed, high-precision and lossless transferring of the chips from the high-temperature turret to the normal-temperature turret is achieved.

Description

Technical Field

[0001] This invention relates to the fields of printed circuit chip manufacturing and automated testing technology, and in particular to a transfer mechanism and method for transferring KGD sorting machines from high-temperature turret to room-temperature turret. Background Technology

[0002] In the integrated circuit manufacturing process, Known Good Die (KGD) sorters are crucial equipment for the final testing, classification, and screening of chips. After undergoing high-temperature testing, chips need to be quickly and accurately transferred from a high-temperature turret to a room-temperature turret for further processing. The hourly output of the sorter is one of the key performance indicators.

[0003] With the continuous miniaturization of chips and the ever-increasing demands for testing efficiency, sorting machines need to achieve a UPH of 4000 or higher to meet the high-efficiency requirements of modern production lines. However, existing transfer mechanisms face severe challenges under such high speed requirements:

[0004] First, simple mechanical handling cannot guarantee both high speed and high precision at the same time. It is very easy for chip placement to be inaccurate due to positioning or angular deviations, or even chip damage.

[0005] Secondly, the traditional single-station sequential material handling mode has obvious efficiency bottlenecks and cannot meet the requirements of ultra-high UPH.

[0006] Furthermore, the insufficient precision in controlling the mounting pressure makes it difficult to achieve accurate and flexible mounting within a wide range (e.g., 30g to 1600g) for chips of different sizes and types, posing a risk of chip damage or poor contact.

[0007] Therefore, there is an urgent need in this field for a transport solution that can maintain high precision, high flexibility, and parallel chip processing even under high-speed operating conditions. Summary of the Invention

[0008] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a high-temperature turret to room-temperature turret transfer mechanism for KGD sorting machine, which achieves micron-level transfer positioning accuracy and wide-range adaptive chip placement pressure under the condition of a unit hour output of not less than 4000 chips, thereby ensuring high precision and high yield of chips in the high-speed transfer process.

[0009] To achieve the above objectives, a first aspect of the present invention provides a transfer mechanism from a high-temperature turret to a normal-temperature turret in a KGD sorting machine, the transfer mechanism comprising a chip loading module, a chip transfer module, a downward-viewing camera, and a chip unloading module;

[0010] The chip loading module is used to pick up chips from the high-temperature turret and transfer them to the chip transfer module;

[0011] The chip transfer module is used to carry the chip and transport it to the imaging area of ​​the downward-looking camera;

[0012] The downward-facing camera is used to visually locate the chip on the chip relay module and feed back the location data.

[0013] The chip unloading module picks up the chip from the chip transfer module and transfers it to the ambient temperature turret based on the positioning data.

[0014] In some embodiments of the first aspect of this application, the transfer mechanism further includes a position and pressure calibration module, which is used to calibrate the position, angle and mounting pressure of the chip unloading module.

[0015] In some embodiments of the first aspect of this application, the position and pressure calibration module includes a U-shaped calibration plate, a force calibration sensor, an upward-looking camera, and a calibration algorithm unit;

[0016] The spiral-shaped calibration plate is used in conjunction with the upward-looking camera to calibrate the position and angle of the suction nozzle;

[0017] The force calibration sensor is used to collect the pressing pressure data of the voice coil actuator in the chip feeding module;

[0018] The upward-facing camera is used to capture feature images of the spiral-shaped calibration plate;

[0019] The calibration algorithm unit is used to calculate position, angle, and pressure compensation parameters based on image and pressure data.

[0020] In some embodiments of the first aspect of this application, the upward-facing camera includes a light source, a lens, and a camera module. The camera module is fixedly mounted below the module by a bracket. The lens is vertically upward-facing and aligned with the imaging area. The light source provides illumination for the lens.

[0021] During calibration, the voice coil actuator of the chip feeding module picks up the U-shaped calibration plate and moves it to the imaging range of the upward-viewing camera. After the upward-viewing camera captures the image, the calibration algorithm unit calculates the position deviation and angle deviation of the nozzle and generates position compensation parameters.

[0022] In some embodiments of the first aspect of this application, the chip loading module and the chip unloading module are both independent dual-module structures, and the chip transfer module is a dual-channel structure to realize parallel operation of dual workstations.

[0023] In some embodiments of the first aspect of this application, the downward-facing camera is provided in two sets, which are respectively used to locate the chips in the two channels of the chip relay module;

[0024] The position and pressure calibration module has a dual calibration unit structure, which is used to calibrate the two chip feeding modules respectively.

[0025] In some embodiments of the first aspect of this application, the downward-looking camera includes a camera module, a lens, and a composite lighting system, the composite lighting system consisting of a coaxial light source and a ring light source;

[0026] The downward-facing camera is fixedly installed above the running path of the chip transfer module. It is used to capture chip images and identify the chip's position coordinates and angle through image processing algorithms, and then feed them back to the corresponding chip unloading module in real time.

[0027] In some embodiments of the first aspect of this application, the chip loading module includes a voice coil actuator and a linear motor. The voice coil actuator is mounted on the mover of the linear motor, and the end of the voice coil actuator is provided with a picking nozzle, the picking nozzle having a vacuum channel inside.

[0028] The linear motor is used to drive the voice coil actuator to move horizontally. The voice coil actuator is used to drive the pick-up nozzle to perform chip picking and placement actions in the vertical direction, and to adsorb the chip through the negative pressure generated by the vacuum pipe. At the same time, the chip placement pressure is controlled by the integrated sensor.

[0029] In some embodiments of the first aspect of this application, the chip feeding module includes a voice coil actuator and a linear motor, the end of the voice coil actuator is provided with a feeding nozzle, and the feeding nozzle is provided with a vacuum channel inside;

[0030] The linear motor is used to drive the voice coil actuator to move horizontally, and the voice coil actuator is used to drive the feeding nozzle to perform chip picking and placing actions in the vertical direction, and to adsorb the chip through the negative pressure generated by the vacuum pipe.

[0031] To achieve the above objectives, a second aspect of the present invention provides a method for transferring KGD separators from a high-temperature turret to a normal-temperature turret, the method comprising the following steps:

[0032] S1: The position, angle, and placement pressure of the voice coil actuator in the chip feeding module are calibrated using the position and pressure calibration module;

[0033] S2: The two chip loading modules move to the high-temperature turret and pick up the chips simultaneously;

[0034] S3: Transfer the picked-up chip and place it on the chip placement platform corresponding to the chip transfer module;

[0035] S4: Image acquisition and positioning of the chip on the chip transfer module is performed using a downward-facing camera;

[0036] S5: Two chip unloading modules pick up chips based on positioning and calibration data, transfer them, and place them at the loading position of the ambient temperature turret.

[0037] The advantages of implementing this invention are as follows:

[0038] 1. Adopting a dual-station parallel processing architecture, it can process two chips simultaneously during chip loading and unloading, significantly improving the system throughput and efficiency, easily achieving a transfer efficiency of UPH≥4000.

[0039] 2. By combining visual guidance (downward camera positioning) with actuator calibration (upward camera and pressure calibration module), extremely high transfer accuracy is achieved, ensuring precise chip placement.

[0040] 3. Wide range of placement pressure control (30-1600g) can accommodate a variety of chips from micro to medium size (2X2mm to 15X15mm). The voice coil actuator provides flexible contact, effectively reducing the risk of mechanical damage to the chip during handling.

[0041] 4. The dual-channel independent design of the chip transfer module enables the system to maintain half of the production line in normal operation even when only a single chip is provided in the front-end loading, improving equipment utilization and production flexibility. The independent calibration system ensures the accuracy and stability of the equipment under long-term operation. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a top view of the high-temperature turret to ambient temperature turret transfer mechanism of the KGD sorting machine described in this invention;

[0044] Figure 2 This is a schematic diagram of the chip loading module described in this invention;

[0045] Figure 3 This is a schematic diagram of the chip relay module described in this invention;

[0046] Figure 4 This is a schematic diagram of the chip feeding module described in this invention;

[0047] Figure 5 This is a schematic diagram of the downward-viewing camera shown in this invention;

[0048] Figure 6This is a schematic diagram of the position and pressure calibration module and the upward-viewing camera described in this invention;

[0049] Figure 7 This is a schematic diagram of the process for transferring KGD sorting machine from high-temperature turret to ambient-temperature turret as described in this invention. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example 1:

[0052] Figure 1 This is a top view of a high-temperature turret to ambient-temperature turret transfer mechanism for a KGD sorting machine according to the present invention. Figure 1 As shown, the transfer mechanism includes a chip loading module, a chip transfer module 3, a downward-facing camera 4, and a chip unloading module.

[0053] The chip transfer module 3 is fixedly mounted on the base plates of the chip loading module and the chip unloading module at both ends, forming a stable bridging structure connecting the loading and unloading areas to ensure smooth transition and precise positioning of the chip during the transfer process.

[0054] like Figure 2 As shown, the chip loading module consists of a voice coil actuator and a linear motor. The linear motor serves as the main drive unit of the module, responsible for its wide-range, high-precision horizontal movement. The voice coil actuator, mounted on the mover of the linear motor, is responsible for picking up and placing chips in the vertical direction. Its end has a pick-up nozzle with an internal vacuum channel, allowing for chip adsorption through negative vacuum. Integrated sensors enable precise control of the chip placement pressure.

[0055] During loading, the linear motor of this module drives the voice coil actuator to the high-temperature turret station. First, the voice coil actuator descends vertically under the precise positioning of the linear motor, so that its end-end pick-up nozzle contacts the chip surface on the high-temperature turret test station, and reliably adsorbs the chip by activating vacuum negative pressure. Then, the voice coil actuator immediately rises, carrying the chip away from the high-temperature turret station. At the same time, the linear motor drives the entire module to move along a preset path to the chip transfer module 3. Finally, the module moves to directly above the designated chip placement platform 301 (described below) of the chip transfer module 3. The voice coil actuator descends again, and the vacuum is released at the moment of contact with the platform. The chip is then smoothly released with calibrated precise pressure, completing a single loading cycle.

[0056] In this embodiment of the invention, the voice coil actuator of the chip loading module is a first voice coil actuator 101, and the linear motor of the chip loading module is a first linear motor 102. Simultaneously, the chip loading module includes a first chip loading module 1 and a second chip loading module 2 with identical structures and independent control. These two modules are symmetrically installed on both sides of the loading end of the transfer mechanism support frame, corresponding to two independent unloading stations of the high-temperature turret and two independent chip placement platforms 301 of the chip transfer module 3, respectively.

[0057] When the first chip loading module 1 and the second chip loading module 2 work synchronously and collaboratively, they can correspond to the dual unloading station of the high-temperature turret, and simultaneously complete the picking, transfer and release of two chips to ensure the high efficiency requirement of UPH≥4000. The two modules can also work independently in a time-sharing manner, which can be adapted to the scenario of single chip output of the high-temperature turret or two chips with different sizes. The actions are not conflicting and the other module can continue to run when one module fails, ensuring that part of the production capacity is not interrupted.

[0058] like Figure 3 As shown, the chip transfer module 3 is the core unit of the transfer mechanism connecting the loading and unloading stations. This module is fixed to the middle of the transfer mechanism's support frame via a base, and specifically includes two independently controlled chip placement platforms 301 and linear motors driving each chip placement platform 301, thus forming a dual-channel transfer mechanism. The two platforms can operate independently or synchronously to adapt to the transfer of single or two chips. In this embodiment, the linear motor of the chip transfer module is the second linear motor 302.

[0059] During the transfer, the chip transfer module 3 receives two chips from the chip loading modules (including the first chip loading module 1 and the second chip loading module 2) which are transferred in parallel. The specific process is as follows: the first chip loading module 1 and the second chip loading module 2, driven by linear motors, synchronously transport the chips they have picked up to the top of the chip transfer module 3. Then, the voice coil actuators of the two loading modules descend in sequence, accurately releasing the two chips onto the two independent chip placement platforms 301 in the chip transfer module. After placement, the voice coil actuators of the loading modules rise and return, while the chip transfer module 3 carries the two chips into the next transfer stage.

[0060] like Figure 4 As shown, the chip unloading module is the actuator that moves the chip from the chip transfer module 3 to the ambient temperature turret. Its structure is basically the same as the chip loading module, also including a voice coil actuator and a linear motor. The linear motor drives the entire module to move horizontally over a long stroke, while the voice coil actuator is responsible for the vertical pick-and-place action at the end. A loading nozzle is located at the lower end of the voice coil actuator, and a vacuum channel is installed inside the nozzle, allowing for the suction of chips through negative vacuum.

[0061] During the unloading process, the linear motor of the chip unloading module first drives the voice coil actuator to move to the chip transfer module 3, which has been precisely positioned above the chip by the downward-looking camera 4. Then, the voice coil actuator drives the unloading nozzle to descend vertically, and the negative pressure generated by the vacuum pipe inside reliably picks up the chip. After picking up the chip, the voice coil actuator rises, and the linear motor then transports the chip at high speed and smoothly to the target socket at the room temperature turret test station. Finally, the voice coil actuator descends again, and after reaching the preset height or being triggered by the contact sensor, the vacuum is released and the chip is released into the socket with the pre-calibrated precise placement pressure, completing the high-precision and non-destructive unloading operation.

[0062] In this embodiment of the invention, the voice coil actuator of the chip unloading module is a second voice coil actuator 701, and the linear motor of the chip unloading module is a third linear motor 702. Simultaneously, the chip unloading module includes a first chip unloading module 7 and a second chip unloading module 8, which are structurally identical and independently controlled, and are symmetrically installed on both sides of the unloading end of the transfer mechanism support frame. The first chip unloading module 7 and the second chip unloading module 8 also adopt a parallel working mode, enabling them to operate two chips simultaneously and efficiently collaborate with the preceding process to jointly ensure that the system achieves a throughput of ≥4000 UPH.

[0063] like Figure 5 As shown, the downward-looking camera 4 is a visual inspection unit used for precise positioning of chips on the chip relay module 3. Its structure mainly includes a camera module, a lens, and a composite illumination system composed of an integrated coaxial light source 402 and a ring light source 401. This composite illumination system can select or combine the ring light source and the coaxial light source according to the chip surface material and characteristics to obtain a high-contrast, shadow-free, clear chip image. In this embodiment of the invention, the camera module and lens of the downward-looking camera 4 are a downward-looking camera module 404 and a downward-looking camera lens 403, respectively.

[0064] The downward-view camera 4 is fixedly installed above the running path of the chip transfer module 3. During chip transfer, when the chip placement platform 301 carrying the chip in the chip transfer module 3 moves to the center of its field of view, the camera module (downward-view camera module 404) immediately captures an image of the chip. Through image processing algorithms, the current position coordinates (X, Y) and angle of the chip are accurately identified, and this positioning data is fed back to the chip unloading module (including the first chip unloading module 7 and the second chip unloading module 8) in real time. This guides the voice coil actuator to achieve high-precision chip picking, which is the key guarantee for the entire transfer module to achieve a position accuracy of ±25µm and an angle accuracy of ±0.3°.

[0065] In this embodiment of the invention, there are also two sets of downward-looking cameras 4, which are set independently and correspond one-to-one with the two independent channels of the chip transfer module 3. They can perform parallel and independent visual positioning of the chips on the two chip placement platforms 301, thereby providing the two subsequent chip unloading modules (including the first chip unloading module 7 and the second chip unloading module 8) with their respective corresponding real-time precise chip position data, ensuring the positioning accuracy and efficiency of the dual-channel system under high-speed operation.

[0066] The transfer mechanism of the present invention also includes a position and pressure calibration module 5. For example... Figure 6 As shown, the position and pressure calibration module 5 is a precision calibration unit that integrates vision and force sensing. Its core components include a U-shaped calibration plate 501, a force calibration sensor 502, an upward-looking camera 6, and a calibration algorithm unit.

[0067] The 501 is used to work with the upward-looking camera 6 to calibrate the nozzle angle and position. The force calibration sensor 502 is located next to the chip feeding module (including the first chip feeding module 7 and the second chip feeding module 8) and is used to collect pressure data when the voice coil actuator in the chip feeding module is pressed. The upward-looking camera 6 includes a light source 601, a lens, and a camera module. The camera module is fixedly installed below the module by a bracket. The lens is vertically upward and aligned with the imaging area above. The light source provides stable and uniform illumination for the lens (in this embodiment, the lens and camera module of the upward-looking camera 6 are the upward-looking camera lens 602 and the upward-looking camera module 603, respectively). The calibration algorithm unit is integrated into the control system. It uses a pose calculation method based on image feature extraction for visual calibration and combines multi-point sampling and linear fitting technology to complete the calibration of pressure sensing data.

[0068] In visual calibration, the calibration algorithm unit of this invention employs a PnP algorithm based on feature point matching to achieve high-precision pose calibration. The specific process is as follows: a top-view camera captures an image of the U-shaped calibration plate picked up by the nozzle; image processing extracts preset geometric feature points (such as corner points and center points) on the calibration plate and matches them with a known three-dimensional coordinate model; direct linear transformation (DLT) or iterative optimization methods are used to calculate the nozzle's position (X, Y, Z) and attitude angle relative to the camera coordinate system; finally, coordinate transformation is used to obtain the actual pose of the nozzle in the mechanical coordinate system, and calibration parameters including translational and rotational compensation are generated to achieve closed-loop calibration with a position deviation ≤ ±25µm and an angle deviation ≤ ±0.3°.

[0069] In pressure calibration, the system achieves precise calibration of the chip placement pressure through closed-loop interaction between a force calibration sensor and a voice coil actuator. Specifically, the voice coil actuator is controlled to repeatedly press the sensor with a stepped increasing drive current, simultaneously collecting pressure data. The calibration algorithm unit establishes a current-pressure linear model using the least squares method. A temperature sensor is also introduced for real-time temperature compensation to correct zero drift and sensitivity drift. Finally, pressure calibration parameters, including zero-point offset, sensitivity coefficient, and temperature compensation table, are generated, achieving high repeatability and adaptive control of the chip placement pressure over a wide range of 30g to 1600g, ensuring the smoothness and non-destructive nature of the chip pick-and-place process.

[0070] In this embodiment of the invention, the position and pressure calibration module is a key component for ensuring the positioning accuracy and pressure output accuracy of the transfer module from the high-temperature turret to the room-temperature turret in the KGD sorting machine. Through the collaboration of the return-shaped calibration plate 501, the force calibration sensor 502, the upward-looking camera 6, and the calibration algorithm unit, closed-loop calibration of the feeding nozzle position, angle, and chip placement pressure of the voice coil actuator in the chip feeding module is achieved. The specific process is as follows:

[0071] First, position and angle calibration is performed: the voice coil actuator of the chip feeding module moves to the calibration station, its feeding nozzle picks up the U-shaped calibration board 501 and lifts it into the clear imaging range of the upward-looking camera 6; the upward-looking camera captures the feature image of the U-shaped calibration board, and the calibration algorithm unit calculates the position deviation of the nozzle in the X and Y directions and the angle deviation in the θ direction in real time through image processing, and generates the corresponding position compensation parameters;

[0072] Subsequently, pressure calibration is performed: the voice coil actuator picks up the tooling and contacts the force calibration sensor 502 below multiple times with different drive parameters. The calibration algorithm unit simultaneously collects the feedback data from the force calibration sensor 502, establishes a precise correspondence between the actuator drive signal and the actual output pressure, and finally completes the accurate calibration and setting of the patch pressure.

[0073] During transport, the module first triggers the upward-facing camera 6 to capture an image of the loop calibration board 501 picked up by the voice coil actuator in the chip unloading module, thereby calibrating the angle and position deviation of the unloading nozzle. If the deviation is less than the angle threshold set by the system (e.g., 0.1°), the linear motor is driven to compensate. Subsequently, the voice coil actuator in the chip unloading module repeatedly presses the pressure calibration sensor 502 to collect data with multiple pressure levels, calibrating the chip mounting pressure accuracy to less than the pressure threshold set by the system (e.g., 5g). After calibration is completed before production, it can also be automatically triggered periodically (e.g., every 24 hours) to ensure the stability of position and pressure parameters during long-term operation, providing a reliable guarantee for high-precision and low-damage transport of the transport mechanism.

[0074] Among them, the function of the upward-viewing camera 6 is dedicated to system calibration and is in a shielded state during production operation.

[0075] In this embodiment of the invention, the position and pressure calibration module 5 also has a dual-module structure, comprising two completely independent calibration units, corresponding one-to-one with the first chip unloading module 7 and the second chip unloading module 8. Each calibration unit integrates a dedicated U-shaped calibration board 501, a force calibration sensor 502, and a corresponding upward-facing camera 6, enabling the two chip unloading modules to perform position, angle, and pressure calibration operations simultaneously and independently. This dual-module architecture eliminates the queuing time caused by traditional single calibration stations, greatly improving the efficiency of equipment maintenance and calibration operations, and ensuring that the dual-channel unloading system can maintain high-precision placement performance synchronously and over a long period of time.

[0076] The above is a detailed description of the transfer mechanism of the present invention. As can be seen from the above description, the transfer mechanism of the present invention achieves high-speed, high-precision, and non-destructive transfer of chips from high-temperature turrets to room-temperature turrets through dual-station parallel handling and vision and force calibration.

[0077] Example 2:

[0078] Based on the transfer mechanism of Embodiment 1, this embodiment provides a method for transferring chips from a high-temperature turret to a room-temperature turret in a KGD sorting machine. This transfer method achieves high-speed, high-precision, and non-destructive transfer of chips from the high-temperature turret to the room-temperature turret through dual-station parallel handling and vision and pressure calibration. Figure 7 As shown, the transfer method specifically includes the following steps:

[0079] Step S1: System initialization and calibration.

[0080] After equipment startup or routine maintenance, the system first performs a comprehensive initialization calibration process. Position and pressure calibration module 5 starts working, and the voice coil actuators of the first chip unloading module 7 and the second chip unloading module 8 move sequentially to the dedicated calibration station.

[0081] During this process, each feeding nozzle first picks up the circular calibration plate 501, and then the upward-looking camera 6 performs high-precision image acquisition of the circular standard plate from multiple angles and positions. The calibration algorithm unit analyzes the acquired image data to accurately calculate the pose deviation of each nozzle in the X and Y directions and the rotation angle deviation in the θ direction, and stores these compensation parameters in the control system.

[0082] After visual calibration is completed, the system enters the pressure calibration stage: the voice coil actuator performs a series of pressing tests on the force calibration sensor 502 with different driving parameters. The calibration system collects pressure data in real time and establishes an accurate current-pressure correspondence model by fitting the least squares method.

[0083] This complete calibration process ensures that all actuators can achieve micron-level positioning accuracy and gram-level pressure control accuracy in subsequent production, laying a solid foundation for high-quality transport.

[0084] Step S2: Parallel loading and chip picking.

[0085] After the calibration process is completed, the system can enter the formal production mode. The first chip loading module 1 and the second chip loading module 2 start synchronously under the unified scheduling of the control system, and their respective linear motors drive the voice coil actuators to move in parallel along a predetermined trajectory to the high-temperature turret test station.

[0086] Upon reaching the designated position, the voice coil actuators of the two modules sequentially execute a descent motion according to a preset program, simultaneously picking up two chips that have completed high-temperature testing through their specially designed vacuum nozzles at the ends. The entire pickup process employs a compliant control strategy, ensuring reliable chip adsorption without mechanical damage by real-time monitoring of vacuum changes.

[0087] After pickup, the voice coil actuator smoothly lifts the chip, safely removing it from the test station and preparing it for transport. This parallel operation mode allows two chips to be processed simultaneously in a single operation cycle, significantly improving the overall system throughput efficiency.

[0088] Step S3: Chip handling and temporary storage.

[0089] After chip pickup is complete, the two loading modules enter the collaborative transport phase. The linear motors of the first chip loading module 1 and the second chip loading module 2 operate synchronously, transporting the chips they carry along optimized paths in parallel to the designated loading area of ​​the chip transfer module 3. Upon reaching the target position, the voice coil actuator precisely descends, smoothly releasing the chip onto the two independent chip placement platforms 301 of the chip transfer module 3. These chip placement platforms 301 employ a special surface treatment process, ensuring chip positioning stability while effectively preventing surface scratches.

[0090] Subsequently, the linear motor of the chip transfer module 3 starts, smoothly and at a constant speed transporting the chip placement platform 301 carrying the chips to the next workstation. This transfer and temporary storage design effectively decouples the preceding and following processes, allowing the loading and unloading processes to be carried out asynchronously, greatly improving the system's operational flexibility and overall efficiency.

[0091] Step S4: Precise visual positioning.

[0092] When the chip transfer module 3 transports the chip to the vision inspection station, the system enters the precise positioning stage. Through high-precision servo control, the chip transfer module 3 ensures that the two chip placement platforms 301 are precisely stopped at the center of the imaging area of ​​the downward-looking camera 4.

[0093] Then, two independently configured downward-facing cameras are simultaneously triggered to acquire high-speed, high-resolution images of the chips in their respective channels. The acquired image data is transmitted to the vision processing system in real time, where advanced image processing algorithms quickly identify and calculate the precise position coordinates of each chip in the X and Y directions and the rotation angle deviation in the θ direction.

[0094] These calibrated positioning data are transmitted in real time to the corresponding first chip unloading module 7 and second chip unloading module 8 via a high-speed industrial network, providing key guidance information for subsequent accurate picking.

[0095] Step S5: Precise material cutting and mounting.

[0096] Upon receiving the visual positioning data, the first chip unloading module 7 and the second chip unloading module 8 immediately initiate a synchronized operation process. Based on the received position information, the linear motors of the two unloading modules drive the voice coil actuators to move directly above the corresponding chip on the chip transfer module 3. The voice coil actuators then descend along a calibrated optimal trajectory, activating a vacuum upon reaching a preset height to reliably pick up the chip using a calibrated suction force.

[0097] After the pick-up is completed, the actuator is raised, and the linear motor quickly and smoothly transports the chip to the designated Socket loading position of the ambient temperature turret test module.

[0098] In the final placement stage, the voice coil actuator uses calibrated precise pressure to smoothly and accurately place the chip into the loading position in the socket. The entire placement process adopts a soft landing control strategy to ensure that the chip and the test socket make perfect contact without causing mechanical stress damage.

[0099] Step S6: Cycle and standby.

[0100] After completing one full chip transfer cycle, the system enters the reset preparation phase. All moving parts, including the linear motors and voice coil actuators of the loading module, transfer module, and unloading module, automatically return to the preset ready position.

[0101] The control system monitors the upstream material supply status in real time. If no new chips arrive temporarily, the system can automatically enter a low-power standby mode, maintaining only necessary monitoring functions to reduce energy consumption. Once the sensor detects a new chip ready signal, the system immediately starts a new round of parallel transfer operations from step S2.

[0102] This intelligent cycle and standby mechanism not only ensures the continuity of production, but also significantly improves the energy efficiency and lifespan of the equipment, ensuring that the system can meet the needs of modern semiconductor factories for 24 / 7 uninterrupted production.

[0103] The advantages of implementing this invention are as follows:

[0104] 1. Adopting a dual-station parallel processing architecture, it can process two chips simultaneously during chip loading and unloading, significantly improving the system throughput and efficiency, easily achieving a transfer efficiency of UPH≥4000.

[0105] 2. By combining visual guidance (downward camera positioning) with actuator calibration (upward camera and pressure calibration module), extremely high transfer accuracy is achieved, ensuring precise chip placement;

[0106] 3. Wide range of placement pressure control (30~1600g) can accommodate various chips from micro to medium size (2×2mm~15×15mm), and the voice coil actuator provides flexible contact, effectively reducing the risk of mechanical damage to the chip during handling;

[0107] 4. The dual-channel independent design of the chip transfer module allows the system to maintain half of the production line in normal operation even when only a single chip is provided in the front-end loading, improving equipment utilization and production flexibility. The independent calibration system ensures the accuracy and stability of the equipment under long-term operation.

[0108] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A transfer mechanism from a high-temperature turret to a normal-temperature turret in a KGD sorting machine, characterized in that, The transfer mechanism includes a chip loading module, a chip transfer module, a downward-facing camera, and a chip unloading module; The chip loading module is used to pick up chips from the high-temperature turret and transfer them to the chip transfer module; The chip transfer module is used to carry the chip and transport it to the imaging area of ​​the downward-looking camera; The downward-facing camera is used to visually locate the chip on the chip relay module and feed back the location data. The chip unloading module picks up the chip from the chip transfer module and transfers it to the ambient temperature turret based on the positioning data.

2. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 1, characterized in that, The transfer mechanism also includes a position and pressure calibration module, which is used to calibrate the position, angle and placement pressure of the chip unloading module.

3. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 2, characterized in that, The position and pressure calibration module includes a U-shaped calibration plate, a force calibration sensor, an upward-viewing camera, and a calibration algorithm unit. The spiral-shaped calibration plate is used in conjunction with the upward-looking camera to calibrate the position and angle of the suction nozzle; The force calibration sensor is used to collect the pressing pressure data of the voice coil actuator in the chip feeding module; The upward-facing camera is used to capture feature images of the spiral-shaped calibration plate; The calibration algorithm unit is used to calculate position, angle, and pressure compensation parameters based on image and pressure data.

4. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 3, characterized in that, The upward-facing camera includes a light source, a lens, and a camera module. The camera module is fixedly mounted below the module by a bracket. The lens is vertically upward and aligned with the imaging area. The light source provides illumination for the lens. During calibration, the voice coil actuator of the chip feeding module picks up the U-shaped calibration plate and moves it to the imaging range of the upward-viewing camera. After the upward-viewing camera captures the image, the calibration algorithm unit calculates the position deviation and angle deviation of the nozzle and generates position compensation parameters.

5. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 2, characterized in that, Both the chip loading module and the chip unloading module are independent dual-module structures, and the chip transfer module is a dual-channel structure to achieve parallel operation of two workstations.

6. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 5, characterized in that, The downward-facing camera is provided in two sets, which are used to locate the chips in the two channels of the chip relay module respectively; The position and pressure calibration module has a dual calibration unit structure, which is used to calibrate the two chip feeding modules respectively.

7. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 1, characterized in that, The downward-looking camera includes a camera module, a lens, and a composite lighting system, which consists of a coaxial light source and a ring light source. The downward-facing camera is fixedly installed above the running path of the chip transfer module. It is used to capture chip images and identify the chip's position coordinates and angle through image processing algorithms, and then feed them back to the corresponding chip unloading module in real time.

8. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to claim 1, characterized in that, The chip feeding module includes a voice coil actuator and a linear motor. The voice coil actuator is mounted on the mover of the linear motor. The end of the voice coil actuator is provided with a feeding nozzle, and the feeding nozzle is provided with a vacuum channel inside. The linear motor is used to drive the voice coil actuator to move horizontally. The voice coil actuator is used to drive the pick-up nozzle to perform chip picking and placement actions in the vertical direction, and to adsorb the chip through the negative pressure generated by the vacuum pipe. At the same time, the chip placement pressure is controlled by the integrated sensor.

9. The KGD sorting machine high-temperature turret to ambient temperature turret transfer mechanism according to any one of claims 1 to 8, characterized in that, The chip feeding module includes a voice coil actuator and a linear motor. The end of the voice coil actuator is provided with a feeding nozzle, and the feeding nozzle is provided with a vacuum pipe inside. The linear motor is used to drive the voice coil actuator to move horizontally, and the voice coil actuator is used to drive the feeding nozzle to perform chip picking and placing actions in the vertical direction, and to adsorb the chip through the negative pressure generated by the vacuum pipe.

10. A method for transferring KGD separators from a high-temperature turret to a normal-temperature turret, characterized in that, The transfer method includes the following steps: S1: The position, angle, and placement pressure of the voice coil actuator in the chip feeding module are calibrated using the position and pressure calibration module; S2: The two chip loading modules move to the high-temperature turret and pick up the chips simultaneously; S3: Transfer the picked-up chip and place it on the chip placement platform corresponding to the chip transfer module; S4: Image acquisition and positioning of the chip on the chip transfer module is performed using a downward-facing camera; S5: Two chip unloading modules pick up chips based on positioning and calibration data, transfer them, and place them at the loading position of the ambient temperature turret.

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