Modular chemical waste gas treatment equipment for semiconductor clean room

Abstract

The invention discloses modularized chemical waste gas treatment equipment for a semiconductor clean room, belongs to the field of waste gas treatment, and aims to solve the problems that in response efficiency, manual replacement needs a series of processes such as shutdown, equipment disassembly, filter screen replacement and sealing debugging, the operation is tedious, time consumption is long, and the time window far exceeds the waste gas switching time window, so that the process is forced to be interrupted, and the waste gas is wasted. The modularized chemical waste gas treatment equipment for the semiconductor clean room comprises a negative pressure machine, an exhaust pipe communicated with the upper part of the negative pressure machine and a gas inlet pipe communicated with one end of the negative pressure machine, and a highly toxic gas detoxification filter screen is arranged on the inner side, far away from the negative pressure machine, of the gas inlet pipe; waste gas components are analyzed in real time through the multi-component integrated gas sensor, and the controller drives the corresponding cylinders to accurately extend out of the corresponding special filter screens (such as highly toxic, acidic, alkaline and VOCs filter screens), so that full automation and on-demand treatment in the filtering process are realized, manpower is saved, and the response speed and the working efficiency of waste gas treatment are improved.

Description

Technical Field

[0001] This invention relates to the field of waste gas treatment, and in particular to a modular chemical waste gas treatment device for semiconductor cleanrooms. Background Technology

[0002] In precision manufacturing scenarios such as semiconductor wafer fabrication and chip packaging and testing, cleanrooms serve as core production spaces, continuously treating various types of chemical waste gases generated during processes, including highly toxic gases, acidic gases, alkaline gases, and volatile organic compounds. These waste gases are characterized by complex compositions, strong corrosiveness, and high toxicity. Improper treatment can cause equipment corrosion, wafer contamination, reduced product yield, and potential harm to operator health. Therefore, precise filtration and purification must be achieved through specialized filters in modular chemical waste gas treatment equipment. Different types of waste gases require corresponding acid adsorption, alkaline neutralization, highly toxic detoxification, or VOCs adsorption filters.

[0003] Current mainstream processing methods rely on a "single filter adapts to a single type of waste gas" correspondence, requiring manual replacement of filter modules within the equipment based on the type of waste gas generated by the process. However, in scenarios involving high-density semiconductor manufacturing and continuous multi-process flow, the composition of waste gas often needs to be frequently switched within a short period. For example, wafer manufacturing involves multiple process steps such as etching, cleaning, and developing, with different processes corresponding to different types of waste gas; the same equipment needs to be reused for multiple functions, alternating the processing of wafer layers of different materials, leading to rapid switching of waste gas types; in customized production of small batches and multiple varieties, the type of waste gas also changes frequently with production orders.

[0004] The frequent changes in exhaust gas in such an environment expose numerous insurmountable drawbacks to the manual filter replacement method. In terms of response efficiency, manual replacement involves a series of processes including shutdown, equipment disassembly, filter replacement, and sealing adjustments. This is cumbersome and time-consuming, far exceeding the time window for exhaust gas switching, forcing process interruptions and severely impacting production continuity. Regarding cleanliness and safety risks, the disassembly of equipment creates micro-gaps between the pipes and the cleanroom, allowing dusty external air to easily intrude, violating the strict cleanliness requirements of the cleanroom. Furthermore, residual highly toxic and corrosive exhaust gases in the pipes may leak, potentially causing safety accidents. In terms of compatibility accuracy, manual judgment of exhaust gas type is prone to errors. Incorrectly installed or incompatible filters can lead to filtration failure, and residual contaminants on the old filters may react with the new exhaust gas, generating salts and other substances that clog the filter pores and shorten its lifespan. Regarding maintenance costs, frequent manual replacement requires a significant investment of manpower. Semiconductor-specific filters are inherently expensive, and the additional losses due to incorrect installation and contamination further increase production costs.

[0005] To address the aforementioned problems, a modular chemical waste gas treatment device for semiconductor cleanrooms is proposed. Summary of the Invention

[0006] The purpose of this invention is to provide a modular chemical waste gas treatment device for semiconductor cleanrooms, which solves the problem of response efficiency. Manual replacement requires a series of processes such as shutdown, disassembly of equipment, replacement of filters, and sealing and debugging. The operation is cumbersome and time-consuming, far exceeding the time window for waste gas switching, which leads to forced process interruption and seriously affects the continuity of production.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a modular chemical waste gas treatment device for semiconductor cleanrooms, comprising a negative pressure unit, an air inlet pipe connected to one end of the negative pressure unit, a highly toxic gas detoxification filter disposed on the inner side of the air inlet pipe away from the negative pressure unit, an acidic adsorption filter disposed on the side of the highly toxic gas detoxification filter near the negative pressure unit, an alkaline neutralization filter disposed on the side of the acidic adsorption filter near the negative pressure unit, a VOCs adsorption filter disposed on the side of the alkaline neutralization filter near the negative pressure unit, a first scraper disposed on the side of the highly toxic gas detoxification filter, the acidic adsorption filter, the alkaline neutralization filter, and the VOCs adsorption filter away from the negative pressure unit, a first scraper disposed on the side of the first scraper of the highly toxic gas detoxification filter away from the negative pressure unit away from the highly toxic gas detoxification filter away from the negative pressure unit, a pusher plate disposed on the side of the first scraper of the highly toxic gas detoxification filter away from the negative pressure unit away from the highly toxic gas detoxification filter, a pusher assembly disposed on the outer side of the air inlet pipe, a sliding mechanism disposed above the air inlet pipe, a rotating mechanism disposed on the inner side of the pusher plate, and a multi-component integrated gas sensor disposed on the inner side of the pusher plate.

[0008] Preferably, the actuating assembly includes a fixed plate fixedly connected to the outside of the air intake pipe. The inside of the fixed plate is provided with a first groove corresponding to the highly toxic gas detoxification filter, the acid adsorption filter, the alkaline neutralization filter, and the VOCs adsorption filter. The outside of the fixed plate is fixedly connected to a cylinder corresponding to the highly toxic gas detoxification filter, the acid adsorption filter, the alkaline neutralization filter, and the VOCs adsorption filter. The output end of the cylinder is fixedly connected to a rod fixedly connected to the highly toxic gas detoxification filter, the acid adsorption filter, the alkaline neutralization filter, and the VOCs adsorption filter.

[0009] Preferably, when the highly toxic gas detoxification filter, acid adsorption filter, alkaline neutralization filter, and VOCs adsorption filter are located inside the first groove, the outer surfaces of the highly toxic gas detoxification filter, acid adsorption filter, alkaline neutralization filter, and VOCs adsorption filter are in contact with the inner surface of the first groove.

[0010] Preferably, the sliding mechanism includes an electric actuator fixedly connected to the upper surface of the intake pipe, an electric push rod fixedly connected to the output end of the electric actuator, a first hole provided inside the upper end of the intake pipe, a baffle fixedly connected to one end of the electric push rod, a connecting rod fixedly connected to a first scraper and fixedly connected to the baffle inside the first hole, a second groove provided on both sides of the first scraper, a spring fixedly connected to the inner side of the second groove, and a second scraper fixedly connected to one end of the spring.

[0011] Preferably, the outer side of the second scraper is in contact with the inner side of the air intake pipe, and the inner side of the second scraper is in contact with the inner side of the second groove.

[0012] Preferably, the length of the second scraper is greater than the thickness of the corresponding filter screen.

[0013] Preferably, the rotating mechanism includes a support plate fixedly connected to the side of the first scraper away from the highly toxic gas detoxification filter. A second hole is provided on the inner side of the support plate, and a rotating rod is provided on the inner side of the second hole. A first guide groove is provided on the outer side of the rotating rod, and a first guide rod fixedly connected to the support plate is provided on the inner side of the first guide groove. A rotating disk is fixedly connected to the end of the rotating rod away from the highly toxic gas detoxification filter. A second guide groove is provided on the inner side of the rotating disk, and a second guide rod fixedly connected to the push plate and slidably connected to the rotating disk is provided on the inner side of the second guide groove. A fixed disk is fixedly connected to the end of the air inlet pipe away from the negative pressure machine. A third guide groove is provided on the inner side of the fixed disk, and a third guide rod slidably connected to the fixed disk and fixedly connected to the push plate is provided in the third guide groove. The multi-component integrated gas sensor is fixedly connected to the fixed disk.

[0014] Preferably, the first guide groove has a spiral shape at the end near the highly toxic gas detoxification filter, and a straight shape at the end away from the highly toxic gas detoxification filter.

[0015] Preferably, the second guide groove has a straight shape, and the second guide groove and the second guide rod are fitted with a clearance fit.

[0016] Preferably, the third guide groove has a vortex-shaped appearance.

[0017] 1. Compared with the prior art, the beneficial effects of the present invention are: by analyzing the composition of exhaust gas in real time through a multi-component integrated gas sensor, and by driving the corresponding cylinder to precisely extend the corresponding special filter screen (such as highly toxic, acidic, alkaline, VOCs filter screen) by the controller, the filtration process is fully automated and processed on demand, saving manpower and improving the response speed and work efficiency of exhaust gas treatment.

[0018] 2. This invention integrates multiple functional filters into the same air inlet pipe, which can be activated according to the combination of sensor signals, thereby efficiently treating complex mixed waste gases (such as mixtures of highly toxic, acidic, and VOCs) generated in semiconductor processes, thus broadening the application range of the equipment.

[0019] 3. The filters of this invention are arranged and activated in the order of highly toxic → acidic → alkaline → VOCs, thereby prioritizing the elimination of highly toxic and corrosive components, avoiding their damage to subsequent filters, improving the overall filtration effect and the service life of each filter.

[0020] 4. This invention cleans the inner wall of the air intake pipe by continuously reciprocating scraper, and immediately introduces the scraped pollutants into the currently active filter for treatment, thereby effectively preventing pollutant residue, accumulation, and harmful chemical reactions with subsequent different types of filters, protecting the filter and extending its service life.

[0021] 5. This invention utilizes the rotation and centripetal motion of the push plate to ensure that the incoming exhaust gas is fully and evenly mixed, thereby making the sampling of the multi-component integrated gas sensor more representative, significantly reducing the risk of misjudgment caused by uneven gas distribution, and ensuring the accuracy of filter switching decisions.

[0022] 6. This invention separates the gas mixing and sensor detection actions in terms of timing. Sampling and analysis are performed only after the clean airflow cleared by the scraper arrives, thereby avoiding interference from old contaminants that are scraped off, and further improving the accuracy of component identification and the reliability of filter switching.

[0023] 7. This invention uses a multi-component integrated gas sensor to detect the gas discharged from the semiconductor manufacturing chamber during cleaning, avoiding incomplete cleaning or excessively long cleaning times caused by fixed cleaning times and air volumes, thereby improving semiconductor quality and semiconductor production efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the front view of the first scraper structure of the present invention; Figure 3 This is a schematic diagram of the front cross-sectional structure of the intake pipe of the present invention; Figure 4 For the present invention Figure 3 Schematic diagram of the structure at point A in the middle; Figure 5 For the present invention Figure 3 Schematic diagram of the structure at point B; Figure 6 This is a schematic diagram of the left cross-sectional structure of the fixing plate of the present invention; Figure 7 This is a schematic diagram of the left-side structure of the third guide groove of the present invention; Figure 8 This is a schematic diagram of the second guide groove of the present invention from the left.

[0025] In the diagram: 1. Negative pressure unit; 3. Inlet pipe; 4. Toxic gas detoxification filter; 5. Acidic adsorption filter; 6. Alkaline neutralization filter; 7. VOCs adsorption filter; 8. First scraper; 9. Push plate; 10. Pushing assembly; 11. Sliding mechanism; 12. Rotating mechanism; 13. Multi-component integrated gas sensor; 101. Fixed plate; 102. First groove; 103. Cylinder; 104. Pneumatic rod; 111. Electric actuator; 112. Electric actuator rod; 1 13. First hole; 114. Connecting rod; 115. Second groove; 116. Spring; 117. Second scraper; 118. Baffle; 121. Support plate; 122. Second hole; 123. Rotating rod; 124. First guide groove; 125. First guide rod; 126. Rotating disk; 127. Second guide groove; 128. Second guide rod; 129. Fixed disk; 1210. Third guide groove; 1211. Third guide rod. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figures 1-8 This invention provides a technical solution: a modular chemical waste gas treatment device for semiconductor cleanrooms, comprising a negative pressure unit 1, an exhaust pipe 2 connected above the negative pressure unit 1, an intake pipe 3 connected to one end of the negative pressure unit 1, a highly toxic gas detoxification filter 4 disposed on the inner side of the intake pipe 3 away from the negative pressure unit 1, an acidic adsorption filter 5 disposed on the side of the highly toxic gas detoxification filter 4 near the negative pressure unit 1, an alkaline neutralization filter 6 disposed on the side of the acidic adsorption filter 5 near the negative pressure unit 1, and a VOCs adsorption filter disposed on the side of the alkaline neutralization filter 6 near the negative pressure unit 1. 7. A first scraper 8 is provided on the side of the highly toxic gas detoxification filter 4, the acid adsorption filter 5, the alkaline neutralization filter 6, and the VOCs adsorption filter 7 away from the negative pressure unit 1. A pusher plate 9 is provided on the side of the first scraper 8 away from the highly toxic gas detoxification filter 4 away from the negative pressure unit 1. A pusher assembly 10 is provided on the outside of the air inlet pipe 3. A sliding mechanism 11 is provided above the air inlet pipe 3. A rotating mechanism 12 is provided on the inside of the pusher plate 9. A multi-component integrated gas sensor 13 is provided on the inside of the pusher plate 9.

[0028] The actuating assembly 10 includes a fixed plate 101 fixedly connected to the outside of the air intake pipe 3. The inside of the fixed plate 101 is provided with a first groove 102 corresponding to the highly toxic gas detoxification filter 4, the acid adsorption filter 5, the alkaline neutralization filter 6 and the VOCs adsorption filter 7. The outside of the fixed plate 101 is fixedly connected to a cylinder 103 corresponding to the highly toxic gas detoxification filter 4, the acid adsorption filter 5, the alkaline neutralization filter 6 and the VOCs adsorption filter 7. The output end of the cylinder 103 is fixedly connected to a rod 104 fixedly connected to the highly toxic gas detoxification filter 4, the acid adsorption filter 5, the alkaline neutralization filter 6 and the VOCs adsorption filter 7.

[0029] When the highly toxic gas detoxification filter 4, acid adsorption filter 5, alkaline neutralization filter 6, and VOCs adsorption filter 7 are located inside the first groove 102, the outer surfaces of the highly toxic gas detoxification filter 4, acid adsorption filter 5, alkaline neutralization filter 6, and VOCs adsorption filter 7 are in contact with the inner surface of the first groove 102.

[0030] The sliding mechanism 11 includes an electric actuator 111 fixedly connected to the upper surface of the air intake pipe 3. An electric actuator rod 112 is fixedly connected to the output end of the electric actuator 111. A first hole 113 is provided inside the upper end of the air intake pipe 3. A baffle 118 is fixedly connected to one end of the electric actuator rod 112. A connecting rod 114 is fixedly connected to the first scraper 8 and the baffle 118 inside the first hole 113. A second groove 115 is provided on both sides of the first scraper 8. A spring 116 is fixedly connected to the inner side of the second groove 115. A second scraper 117 is fixedly connected to one end of the spring 116.

[0031] The outer side of the second scraper 117 is in contact with the inner side of the air intake pipe 3, and the inner side of the second scraper 117 is in contact with the inner side of the second groove 115.

[0032] The length of the second scraper 117 is greater than the thickness of the corresponding filter screen.

[0033] The rotating mechanism 12 includes a support plate 121 fixedly connected to the side of the first scraper 8 away from the highly toxic gas detoxification filter 4. A second hole 122 is provided on the inner side of the support plate 121. A rotating rod 123 is located inside the second hole 122. A first guide groove 124 is provided on the outer side of the rotating rod 123. A first guide rod 125 fixedly connected to the support plate 121 is provided on the inner side of the first guide groove 124. A rotating disk 126 is fixedly connected to the end of the rotating rod 123 away from the highly toxic gas detoxification filter 4. The inner side of the rotating disk 126 is provided with… A second guide groove 127 is provided, and a second guide rod 128 is provided on the inner side of the second guide groove 127, which is fixedly connected to the push plate 9 and slidably connected to the rotating disk 126. A fixed disk 129 is fixedly connected to the end of the air inlet pipe 3 away from the negative pressure machine 1. A third guide groove 1210 is provided on the inner side of the fixed disk 129, and a third guide rod 1211 is provided on the third guide groove 1210, which is slidably connected to the fixed disk 129 and fixedly connected to the push plate 9. The multi-component integrated gas sensor 13 is fixedly connected to the fixed disk 129.

[0034] The first guide groove 124 has a spiral shape at the end near the highly toxic gas detoxification filter 4, and a straight shape at the end away from the highly toxic gas detoxification filter 4.

[0035] The second guide groove 127 has a straight appearance and the second guide rod 128 is fitted with a clearance fit.

[0036] The third guide groove 1210 has a vortex-shaped appearance.

[0037] When exhaust gas is generated in the semiconductor cleanroom, the negative pressure machine 1 is started to allow the gas to enter the air inlet pipe 3. At this time, the multi-component integrated gas sensor 13 detects and analyzes the gas to determine its specific nature. The multi-component integrated gas sensor 13 transmits the detected signal to the external controller, which then starts the corresponding cylinder 103. The cylinder 103 drives the air rod 104 to move the corresponding highly toxic gas detoxification filter 4, acid adsorption filter 5, alkaline neutralization filter 6, and VOCs adsorption filter 7 out from the inside of the first groove 102 to filter the gas. Since the filter replacement process is completely automated, no manual replacement is required, saving labor and improving work efficiency.

[0038] Because the highly toxic gas detoxification filter 4, acid adsorption filter 5, alkaline neutralization filter 6, and VOCs adsorption filter 7 are all located within the same inlet pipe 3, mixed gases can be treated. For example, in dry etching processes, highly toxic / corrosive gases containing chlorine or fluorine are often used as etching agents, and oxygen is added for conditioning. The waste gas generated in this process is a mixture of highly toxic gases, acidic gases, and VOCs. Based on data obtained from the multi-component integrated gas sensor 13, the corresponding highly toxic gas detoxification filter 4, acid adsorption filter 5, alkaline neutralization filter 6, and VOCs adsorption filter 7 are inserted into the inner side of the inlet pipe 3 to treat the mixed gas, thus broadening its application range.

[0039] The arrangement of the highly toxic gas detoxification filter 4, acidic adsorption filter 5, alkaline neutralization filter 6, and VOCs adsorption filter 7 ensures that the gas first comes into contact with the highly toxic gas detoxification filter 4 for filtration, then with the acidic adsorption filter 5, then with the alkaline neutralization filter 6, and finally with the VOCs adsorption filter 7. This prioritizes eliminating the safety risks of highly toxic gases and preventing them from corroding subsequent filters. It also removes acidic and alkaline components to prevent the formation of salts that clog the VOCs filter. Finally, the VOCs filter efficiently adsorbs organic waste gas in an undisturbed environment, maximizing the overall filtration effect and filter lifespan.

[0040] Because the length of the second scraper 117 is greater than the thickness of the corresponding filter screen, when the corresponding filter screen returns to the inside of the second groove 115, the second scraper 117 can also clean the position of the filter screen, increasing the cleaning range. When the corresponding filter screen is inside the air intake pipe 3, the second scraper 117 will be compressed to the inside of the second groove 115 by the filter screen.

[0041] When gas enters the inner side of the intake pipe 3, since the intake pipe 3 is fixed and does not generate relative motion with the incoming air to enhance impact, gas contaminants easily adhere to the inner side of the intake pipe 3. After the filter screen is replaced, the adhered contaminants fall onto the replaced filter screen and cause a chemical reaction. For example, when residual fluoride-containing acidic contaminants encounter the newly inserted alkaline neutralizing filter screen 6, they will generate solid salts that clog the filter pores, causing premature failure and affecting the service life of the filter screen. To solve the above problems, when the negative pressure machine 1 is started, the electric actuator 111 is started simultaneously, driving the electric actuator rod 112 to drive the connecting rod 114 to reciprocate. In turn, the first scraper 8 and the second scraper 117 connected to the connecting rod 114 reciprocate, hanging down the contaminants adhering to the inner side of the intake pipe 3. The pollutants are then carried by the airflow generated by the negative pressure unit 1 towards the filter screen for filtration and decomposition. Since the first scraper 8 and the second scraper 117 scrape down the pollutants when they are on the corresponding filter screen, they can be filtered and decomposed, reducing the occurrence of chemical reactions caused by adhering pollutants falling onto the replaced filter screen and causing premature clogging of the filter screen, thus improving the service life of the filter screen. Because the first scraper 8 and the second scraper 117 are constantly moving, they can generate relative motion with the intake air to enhance the impact, resulting in less adhering pollutants. Furthermore, the contact area between the first scraper 8 and the second scraper 117 and the exhaust gas is much smaller than the contact area between the intake pipe 3 and the exhaust gas, making the damage to the filter screen caused by the pollutants adhering to the first scraper 8 and the second scraper 117 much less than the damage caused by the pollutants adhering to the intake pipe 3.

[0042] The gas entering the inner side of the intake pipe 3 is sometimes a mixed gas, but the mixture is not uniform. The position of the multi-component integrated gas sensor 13 is fixed, making its gas detection inaccurate. For example, in a mixture containing highly toxic and acidic gases, the acidic gas passes by the multi-component integrated gas sensor 13 without being detected, thus preventing the corresponding filter from entering the inner side of the intake pipe 3 for filtration and decomposition. To solve this problem, when the first scraper 8 reciprocates, it drives the support plate 121 and the first guide rod 125 to reciprocate. Because the first guide groove 124 is close to highly toxic gases… One end of the gas detoxification filter 4 has a spiral structure, which causes the first guide rod 125 to move to the first guide groove 124, driving the rotating rod 123 and the rotating disk 126 to rotate. This, in turn, drives the second guide rod 128, the push plate 9, and the third guide rod 1211 to rotate. Because the third guide groove 1210 has a vortex-shaped structure, the third guide rod 1211 will move towards the center when it rotates, causing the incoming gas to be pushed to rotate and move towards the center, making the gas mixing more uniform. This allows the multi-component integrated gas sensor 13 to detect the incoming gas more accurately, reducing misjudgments by the multi-component integrated gas sensor 13 and improving the quality of waste gas treatment.

[0043] Because the push plate 9 rotates and moves towards the center, the airflow generated by the negative pressure machine 1 will also rotate and move towards the center. This causes the pollutants scraped off by the second scraper 117 to move towards the center, reducing the occurrence of pollutants remaining on the filter screen frame without being filtered and being pushed down to the next filter screen for filtration when the filter screen is retracted, or being discharged directly without filtration. This improves the quality of waste gas treatment and further extends the service life of the filter screen.

[0044] Because the push plate 9 rotates and moves towards the center, the airflow generated by the negative pressure machine 1 rotates and moves towards the center, causing the pollutants scraped off by the second scraper 117 to rotate. This causes the exhaust gas to rotate inside the filter screen, resulting in a larger area of ​​exhaust gas passing through the filter screen and a wider contact surface. This reduces the occurrence of some areas of the filter screen absorbing too much and some areas absorbing too little, thus improving the service life of the filter screen.

[0045] Because the length of the second scraper 117 is greater than the thickness of the corresponding filter screen, when the corresponding filter screen returns to the inside of the second groove 115, the second scraper 117 can also clean the position of the filter screen, increasing the cleaning range. When the corresponding filter screen is inside the air intake pipe 3, the second scraper 117 will be compressed to the inside of the second groove 115 by the filter screen.

[0046] To reduce the corrosion and damage to the intake pipe 3 caused by pollutants adhering to its inner wall, the adsorption time of pollutants needs to be reduced. This requires continuous cleaning by the second scraper 117 and the first scraper 8. Because the first guide groove 124 has a spiral shape at the end near the highly toxic gas detoxification filter 4 and a straight shape at the end away from the filter 4, the first guide rod 125 drives the push plate 9 to rotate and move towards the center within the straight section of the first guide groove 124. However, at this time, the first scraper 8 and the second scraper 117 are still cleaning the inner wall of the intake pipe 3. If a new type of exhaust gas enters at this time, and the push plate 9 moves towards the center, the pollutants that have just been scraped off are easily brought closer to the multi-component integrated gas. The sensor 13 analyzes the data, causing the multi-component integrated gas sensor 13 to make an incorrect judgment and push out the wrong filter screen, resulting in filter screen damage. However, this device pushes the exhaust gas towards the center after the first scraper 8 and the second scraper 117 are moved away from the multi-component integrated gas sensor 13. At this time, the pollutants near the multi-component integrated gas sensor 13 have been carried away by the air of the negative pressure machine 1, and the incoming gas is basically new exhaust gas. The exhaust gas is then uniformly mixed. When the first guide rod 125 moves back to the intersection of the straight groove and the spiral groove of the first guide groove 124, the multi-component integrated gas sensor 13 is activated for detection. This reduces the chance of the newly scraped pollutants being brought close to the multi-component integrated gas sensor 13 for analysis, further reducing the probability of incorrect judgment and improving the service life of the filter screen.

[0047] When the first guide rod 125 moves back to the junction of the straight groove and the spiral groove of the first guide groove 124, the multi-component integrated gas sensor 13 begins to start detection. The first scraper 8 and the second scraper 117 have already cleaned the contaminants in the intake pipe 3 once. The newly introduced exhaust gas comes into contact with the relatively clean inner wall of the intake pipe 3. This reduces the situation where, when the newly introduced exhaust gas is a different gas, the old contaminants have not been cleaned and the filter screen has already been replaced. The old contaminants come into contact with the new filter screen and produce a chemical reaction inside, clogging the filter screen. This improves the service life of the filter screen.

[0048] Because a lot of waste gas remains inside the semiconductor manufacturing chamber during process switching, after the preceding process is completed and nitrogen is used to purge the inside of the semiconductor manufacturing chamber, the controller immediately switches the multi-component integrated gas sensor 13 into a ppb-level high-sensitivity mode and keeps the dedicated filter corresponding to the preceding process, such as the highly toxic filter 4, in the working position. The multi-component integrated gas sensor 13 can monitor the true concentration decay curve of the residue with extremely high accuracy. At the same time, the old filter continues to work to ensure that any toxic residues purged are captured, preventing them from spreading in the pipeline and forming new pollution sources, thus laying the foundation for safe switching. Only semiconductor process waste gas has such characteristics of high toxicity, high value, and huge losses once polluted, and requires ppb-level monitoring accuracy.

[0049] The controller simultaneously activates the sliding mechanism 11 and the rotating mechanism 12, driving the first scraper 8 and the second scraper 117 to perform a compound movement with the pusher plate 9, which strongly stirs and radially mixes the airflow. This action ensures that the gas composition in the pipeline is highly uniform, so that each sample taken by the sensor 13 can truly represent the overall airflow state, greatly improving the reliability of the concentration reading and providing a reliable data basis for accurately determining the cleaning endpoint. Semiconductor exhaust gas may contain highly adsorbent substances such as silane, which can easily form a concentration gradient on the pipeline wall and filter screen, leading to sampling distortion. The controller sets a dynamic, ppb-level cleaning threshold based on the sensitive gas list of the next process. When the sensor 13 detects that the concentration of all target residues is continuously lower than the threshold, it immediately triggers a cleaning completion signal and simultaneously executes: retracting the old filter screen 4 by pushing the component 10 and pushing out the filter screen 7 prepared for the new process.

[0050] The switching action only occurs when data confirms absolute safety, avoiding incomplete cleaning or excessively long cleaning times caused by fixed cleaning times and air volumes. This prevents contamination and wasted time, impacting semiconductor quality and production efficiency, thus improving both. This directly reflects the two core requirements of continuous and high-cleanliness semiconductor production. Every second of production on the production line is highly valuable, and waiting is a major concern, while wafers have zero tolerance for contamination. Only through this "data-driven, real-time decision-making and execution" can these two contradictory limits be simultaneously met. The production rhythm and quality requirements of other industries do not require such precise coordination. Upon issuing a cleaning completion signal, the controller automatically generates a "purge cleaning quality report" including time consumption, concentration curve, and filter ID, and links it to the upcoming wafer batch number, uploading it to the production management system.

[0051] This step enables "full digital traceability" of the waste gas treatment process. It transforms a physical treatment process into a queryable and analyzable data object, providing crucial information for subsequent quality traceability, precise management of filter life, and process optimization.

[0052] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0053] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular chemical waste gas treatment device for semiconductor cleanrooms, comprising a negative pressure unit (1) and an air inlet pipe (3) connected to one end of the negative pressure unit (1), characterized in that: A highly toxic gas detoxification filter (4) is provided on the inner side of the air inlet pipe (3) away from the negative pressure machine (1). An acidic adsorption filter (5) is provided on the side of the highly toxic gas detoxification filter (4) close to the negative pressure machine (1). An alkaline neutralization filter (6) is provided on the side of the acidic adsorption filter (5) close to the negative pressure machine (1). A VOCs adsorption filter (7) is provided on the side of the alkaline neutralization filter (6) close to the negative pressure machine (1). A first scraper (8) is provided on the side of the highly toxic gas detoxification filter (4), acidic adsorption filter (5), alkaline neutralization filter (6) and VOCs adsorption filter (7) away from the negative pressure machine (1). A pusher plate (9) is provided on the side of the first scraper (8) on the side of the highly toxic gas detoxification filter (4) away from the negative pressure machine (1). A pushing component (10) is provided on the outside of the air intake pipe (3). The pushing component (10) is used to automatically drive one or more corresponding filters to extend into or out of the air intake pipe (3) according to the exhaust gas composition detection results, so as to achieve selective and modular treatment of mixed exhaust gas and automatic replacement of filters. A sliding mechanism (11) is provided above the air intake pipe (3). The sliding mechanism (11) is used to drive the first scraper (8) and the second scraper (117) to reciprocate along the axial direction of the air intake pipe (3) to scrape off the pollutants attached to the inner wall of the air intake pipe (3) and the original position of the filter screen, so as to prevent them from interfering with the performance of the newly activated filter screen. The inner side of the push plate (9) is provided with a rotating mechanism (12). The rotating mechanism (12) is used to convert the axial movement of the first scraper (8) into the rotation and radial centripetal movement of the push plate (9) to stir the exhaust gas so that it is mixed evenly, assist pollutants to gather towards the center of the airflow, and coordinate the control of the detection timing of the multi-component integrated gas sensor (13) to improve the accuracy of component identification. The inner side of the push plate (9) is provided with a multi-component integrated gas sensor (13).

2. The modular chemical waste gas treatment equipment for semiconductor cleanrooms according to claim 1, characterized in that: The pushing assembly (10) includes a fixed plate (101) fixedly connected to the outside of the air inlet pipe (3). The inside of the fixed plate (101) is provided with a first groove (102) corresponding to the highly toxic gas detoxification filter (4), acid adsorption filter (5), alkaline neutralization filter (6) and VOCs adsorption filter (7). The outside of the fixed plate (101) is fixedly connected to a cylinder (103) corresponding to the highly toxic gas detoxification filter (4), acid adsorption filter (5), alkaline neutralization filter (6) and VOCs adsorption filter (7). The output end of the cylinder (103) is fixedly connected to a rod (104) fixedly connected to the highly toxic gas detoxification filter (4), acid adsorption filter (5), alkaline neutralization filter (6) and VOCs adsorption filter (7).

3. The modular chemical waste gas treatment equipment for semiconductor cleanrooms according to claim 2, characterized in that: When the highly toxic gas detoxification filter (4), acid adsorption filter (5), alkaline neutralization filter (6) and VOCs adsorption filter (7) are located inside the first groove (102), the outer surfaces of the highly toxic gas detoxification filter (4), acid adsorption filter (5), alkaline neutralization filter (6) and VOCs adsorption filter (7) are in contact with the inner surface of the first groove (102).

4. The modular chemical waste gas treatment equipment for semiconductor cleanrooms according to claim 1, characterized in that: The sliding mechanism (11) includes an electric actuator (111) fixedly connected to the upper surface of the air intake pipe (3). The output end of the electric actuator (111) is fixedly connected to an electric push rod (112). The upper end of the air intake pipe (3) is provided with a first hole (113). One end of the electric push rod (112) is fixedly connected to a baffle (118). The first hole (113) is provided with a connecting rod (114) fixedly connected to the first scraper (8) and fixedly connected to the baffle (118). The two sides of the first scraper (8) are provided with a second groove (115). The inner side of the second groove (115) is fixedly connected to a spring (116). One end of the spring (116) is fixedly connected to a second scraper (117).

5. A modular chemical waste gas treatment device for semiconductor cleanrooms according to claim 4, characterized in that: The outer side of the second scraper (117) is in contact with the inner side of the air intake pipe (3), and the inner side of the second scraper (117) is in contact with the inner side of the second groove (115).

6. The modular chemical waste gas treatment equipment for semiconductor cleanrooms according to claim 4, characterized in that: The length of the second scraper (117) is greater than the thickness of the corresponding filter screen.

7. The modular chemical waste gas treatment equipment for semiconductor cleanrooms according to claim 1, characterized in that: The rotating mechanism (12) includes a support plate (121) fixedly connected to the side of the first scraper (8) away from the highly toxic gas detoxification filter (4). A second hole (122) is provided on the inner side of the support plate (121), and a rotating rod (123) is located inside the second hole (122). A first guide groove (124) is provided on the outer side of the rotating rod (123), and a first guide rod (125) fixedly connected to the support plate (121) is provided inside the first guide groove (124). A rotating disk (126) is fixedly connected to the end of the rotating rod (123) away from the highly toxic gas detoxification filter (4). A second guide groove (127) is provided on the inner side. A second guide rod (128) is provided on the inner side of the second guide groove (127) and is fixedly connected to the push plate (9) and slidably connected to the rotating disk (126). A fixed disk (129) is fixedly connected to the end of the air inlet pipe (3) away from the negative pressure machine (1). A third guide groove (1210) is provided on the inner side of the fixed disk (129). A third guide rod (1211) is provided on the third guide groove (1210) and is slidably connected to the fixed disk (129) and fixedly connected to the push plate (9). The multi-component integrated gas sensor (13) is fixedly connected to the fixed disk (129).

8. A modular chemical waste gas treatment device for semiconductor cleanrooms according to claim 7, characterized in that: The first guide groove (124) has a spiral shape at the end closest to the highly toxic gas detoxification filter (4), and a straight shape at the end furthest from the highly toxic gas detoxification filter (4).

9. A modular chemical waste gas treatment device for semiconductor cleanrooms according to claim 7, characterized in that: The second guide groove (127) has a straight appearance and the second guide rod (128) is fitted with a clearance fit.

10. A modular chemical waste gas treatment device for semiconductor cleanrooms according to claim 7, characterized in that: The third guide groove (1210) has a vortex-shaped appearance.

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