Automatic tray loading equipment, automatic tray loading method thereof, controller and storage medium

Abstract

The invention discloses automatic tray loading equipment and an automatic tray loading method thereof, a controller and a storage medium, and relates to the technical field of element automatic tray loading. The method comprises the following steps: placing a target number of copper blocks on a carrier, wherein the target number is equal to the number of first copper grooves; carrying out first vibration material arrangement on the carrier according to the first material arrangement control parameter so as to preliminarily vibrate the copper block into a first copper groove, and carrying out empty groove statistical processing to determine a first tray loading condition; when the first tray loading condition indicates that the loading of the carrier is not completed, the material arranging driving device is controlled to carry out second vibration material arranging treatment and empty groove statistics on the carrier according to the first tray loading condition so as to vibrate the remaining copper blocks into the empty first copper groove, and when the obtained updated second tray loading condition indicates that the loading of the carrier is completed, the remaining copper blocks are vibrated into the empty first copper groove. And the carrier and the first blister tray to be loaded are subjected to positioning covering treatment and turnover transferring treatment, and the copper block is transferred to the first blister tray from the first copper groove to complete tray loading. And the copper block loading efficiency and the copper block loading precision can be improved.

Description

Technical Field

[0001] This application relates to the field of automatic component loading technology, and in particular to an automatic loading device, automatic loading method, controller and storage medium thereof. Background Technology

[0002] With the rapid innovation and technological advancements in electronic products, the demand for smaller PCB sizes and higher power densities presents significant challenges to heat dissipation and structural design. Traditional PCB heat dissipation methods typically involve either fabricating the circuit board on a metal substrate or soldering a metal substrate onto the circuit board. However, both processes suffer from drawbacks such as high metal consumption, complex manufacturing processes, high costs, and bulky size. For applications with relatively low heat dissipation requirements, the complex processes of fabricating heat pumps and soldering metal substrates cannot meet market demands. Embedded copper circuit boards (PCBs) emerged to address these needs. An embedded copper circuit board involves embedding copper blocks within the PCB surface. Heat-generating components are directly attached to the surface of the copper block, and heat is transferred away through the copper.

[0003] In the production process of embedded copper blocks for PCBs, the products need to be packaged after processing and inspection. Currently, after the copper blocks are processed, they need to be sorted and trayed for packaging and transportation. Traditional operations rely on manual placement of each copper block into the holes of the blister pack, which is time-consuming and inefficient. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an automatic tray loading device, an automatic tray loading method, a controller, and a storage medium, which can automatically load copper blocks onto a blister tray in one go, improving the efficiency and accuracy of copper block tray loading.

[0005] In a first aspect, embodiments of this application provide an automatic traying method for an automatic traying device, applied to a controller of the automatic traying device; the automatic traying device includes: a processing platform and a material transfer device; a material aligning station is provided on the processing platform; a carrier and a material aligning drive device are provided on the material aligning station and located directly below the carrier and detachably connected to the carrier; a plurality of first copper grooves are provided on the carrier; a pressure sensor is provided at the bottom of each first copper groove; The method includes: A target number of copper blocks are placed on the vehicle, the target number being equal to the number of the first copper slots; According to the preset first material control parameters, the material driving device is controlled to perform the first vibration material handling on the carrier to initially vibrate the copper block into the first copper tank, and the first loading status is determined by the empty tank statistical processing based on the first sensing information of each pressure sensor. If the first loading status indicates that the loading of the carrier is not completed, the material-setting drive device is controlled to perform a second vibration material-setting process and an empty slot statistical process on the carrier according to the first loading status, so as to vibrate the remaining copper blocks into the empty first copper slot and obtain an updated second loading status. When the second loading status indicates that the carrier has completed loading, the transfer device is controlled to perform positioning and covering processing on the carrier and the first blister tray to be loaded, and to perform flipping and transferring processing, so that the copper block is transferred from the first copper groove to the first blister tray, thus completing the loading.

[0006] In a second aspect, embodiments of this application provide a controller, including at least one processor and a memory for communicatively connecting to the at least one processor; the memory stores instructions executable by the at least one processor, which, when executed by the at least one processor, enable the at least one processor to perform an automatic tray loading method of an automatic tray loading device as described in any of the embodiments of the first aspect.

[0007] Thirdly, embodiments of this application provide an automatic tray loading device, including a controller as described in the second aspect embodiment.

[0008] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions for causing a computer to perform an automatic disk loading method of an automatic disk loading device as described in any of the embodiments of the first aspect.

[0009] This application embodiment includes: an automatic tray loading device comprising: a controller, a processing platform, and a material transfer device; a material loading and aligning station is provided on the processing platform; a carrier is provided on the material loading and aligning station, and a material alignment drive device is provided directly below the carrier and detachably connected to the carrier; multiple first copper slots are provided on the carrier; a pressure sensor is provided at the bottom of each first copper slot; during the process of loading the first blister pack to be loaded using the automatic tray loading device, firstly, a target number of copper blocks are placed on the carrier, the target number being equal to the number of the first copper slots; secondly, the material alignment drive device is controlled according to preset first material alignment control parameters to perform a first vibration material alignment process on the carrier, so as to initially align the copper blocks... The copper blocks are vibrated into the first copper groove, and empty groove statistics are performed based on the first sensing information from each pressure sensor to determine the first loading status. Then, if the first loading status indicates that the carrier loading is incomplete, the material-aligning drive device is controlled to perform a second vibration alignment process and empty groove statistics process on the carrier, vibrating the remaining copper blocks into the empty first copper groove, and obtaining an updated second loading status. Finally, if the second loading status indicates that the carrier loading is complete, the material transfer device is controlled to perform positioning and covering processing on the carrier and the first blister tray to be loaded, and to perform flipping and transferring processing, transferring the copper blocks from the first copper groove to the first blister tray, completing the loading. After loading and aligning on the carrier, the carrier and the first blister tray to be loaded are directly aligned and flipped for material transfer, thus achieving automatic loading quickly and with high precision in one go. In other words, the embodiments of this application can automatically load copper blocks into the blister tray in one go, improving the efficiency and accuracy of copper block loading. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of an automatic tray loading device provided in one embodiment of this application; Figure 2 This is a top view schematic diagram of a vehicle provided in one embodiment of this application; Figure 3 This is a flowchart illustrating the steps of an automatic tray loading method for an automatic tray loading device provided in one embodiment of this application; Figure 4 This is an overall logic diagram of performing a first vibration shaping process and a second vibration shaping process on a vehicle according to an embodiment of this application; Figure 5 This is a schematic diagram of the hardware structure of an electronic device provided in one embodiment of this application. Detailed Implementation

[0011] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0012] It should be understood that in the description of this application, the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0013] It should be noted that although a logical order is shown in the flowcharts in this application, in some cases, the steps shown or described may be performed in a different order than that shown in the flowcharts. In the description of this application, "several" means one or more, and "more" means two or more. The terms "first" and "second" are used only to distinguish technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order in which the technical features are indicated.

[0014] The embodiments of this application will be further described below with reference to the accompanying drawings.

[0015] like Figure 1 and Figure 2 As shown, the automatic tray loading equipment 1000 includes: a controller 300, a processing platform 100, and a material transfer device 200; the processing platform 100 is arranged along its long side as follows: a blister tray placement area 110, a material loading and aligning station 120, and a material unloading area 130; the material loading and aligning station 120 is provided with a carrier 800 and a material aligning drive device 400 located directly below the carrier 800 and detachably connected to the carrier 800; the carrier 800 is provided with a plurality of first copper grooves 810; each first copper groove 810 is provided with a pressure sensor 820 at its bottom; the automatic tray loading equipment 1000 also includes a front image acquisition device 500 and a side image acquisition device 600. The material transfer device 200 includes a vacuum suction cup 212 assembly 210 and retractable and rotatable clamping and flipping assemblies 220 located on both sides of the vacuum suction cup 212 assembly 210. The controller 300 is electrically connected to the material transfer device 200, the material handling drive device 400, the pressure sensor 820, the front image acquisition device 500, and the side image acquisition device 600.

[0016] The blister tray placement area 110 is used to place the first blister tray 901 to be loaded; the unloading area 130 is used to place the second blister tray 902 loaded with copper blocks.

[0017] In one embodiment, the processing platform 100 further includes a moving track 140, which is arranged along the long side of the processing platform 100. The material transfer device 200 is slidably connected to the moving track 140, so that the material transfer device 200 can reciprocate along the processing platform 100.

[0018] In one embodiment, such as Figure 1 As shown, the material transfer device 200 includes a vacuum suction cup 212 assembly 210 and a retractable and flip-over clamping and flipping assembly 220 disposed on both sides of the vacuum suction cup 212 assembly 210.

[0019] Specifically, the vacuum suction cup 212 assembly 210 includes: a suction cup 212 and a first lifting assembly 211; the suction cup 212 is connected to the telescopic end of the first lifting assembly 211; the fixed end of the first lifting assembly 211 is fixedly connected to the top of the housing of the transfer device 200. Furthermore, the first lifting assembly 211 is electrically connected to a controller 300, which can drive the telescopic end of the first lifting assembly 211 to extend or retract, thereby causing the vacuum suction cup 212 assembly 210 to descend or rise. In one embodiment, the first lifting assembly 211 is a telescopic cylinder. Uniformly distributed suction nozzles are provided on the plane of the suction cup 212 facing the processing platform 100, and the transfer device 200 also includes a vacuum generator, which acts on multiple suction cups 212 to give the suction cups 212 suction force to pick up the first blister tray 901.

[0020] Specifically, the clamping and flipping assembly 220 includes: a clamp 222 and a second lifting assembly 221; the clamp 222 is connected to the telescopic end of the second lifting assembly 221, and the fixed end of the second lifting assembly 221 is connected to the top of the housing of the transfer device 200. Furthermore, the second lifting assembly 221 is electrically connected to a controller 300, which can drive the telescopic end to extend or retract, thereby causing the clamp 222 to descend or rise. In one embodiment, the second lifting assembly 221 is a telescopic cylinder. Specifically, the clamp 222 is not a gripper, but a clamping plate to increase the contact area between the clamp 222 and the overlapping carrier 800 and the first blister tray 901. It is understood that the clamp 222 can rotate around its own x-axis to cause the overlapping carrier 800 and the first blister tray 901 to flip and transfer materials. Furthermore, specifically, the housing of the transfer device 200 also includes a drive assembly for controlling the second lifting assembly 221 to move left and right along its long side.

[0021] In some embodiments, the carrier 800 and the material-loading drive device 400 are detachably connected by a locking structure. During the loading process of the carrier 800, the locking structure is locked to fix the carrier 800 and the material-loading drive device 400 in a fixed connection. After the carrier 800 is loaded, before the material is transferred, the locking structure is released to unlock the carrier 800 and the material-loading drive device 400, so as to transfer the copper block in the carrier 800 to the blister tray.

[0022] Understandably, the loading and aligning station 120 of the processing platform 100 is provided with a groove 121. The carrier 800 is placed in the groove 121, and the upper surface of the carrier 800 is lower than the plane of the processing platform 100. The side of the groove 121 acts as a baffle, ensuring that the copper blocks do not fall during vibratory loading. A first distance is maintained between the side of the carrier 800 and the side wall of the groove 121, and a second distance is maintained between the lower surface of the carrier 800 and the bottom surface of the groove 121. The purpose of these first and second distances is to allow the carrier 800 to tilt at a certain angle. The first distance is less than the shortest side length of the copper block to prevent it from falling. Understandably, without the groove 121, the copper blocks might fall during the tilting and vibratory loading process of the carrier 800. If the groove 121 were perfectly fitted, the carrier 800 would not be able to tilt. This application, by providing the groove 121, structurally ensures that tilting and vibratory loading can be achieved.

[0023] It should be noted that after the first blister tray 901 is placed on the carrier 800, the clamp 222 cannot directly extend into the groove 121 to clamp the first blister tray 901 and the carrier 800. The groove 121 is also provided with two lifting components, which are arranged along the y-axis of the carrier 800 and are symmetrically arranged with respect to the geometric center of the carrier 800.

[0024] In one embodiment, to smoothly lift the first blister tray 901 and the carrier 800 to the target height, before lifting, the left clamping component is controlled to move to the left and the right clamping component is controlled to move to the right to ensure that no collision occurs. The lifting components smoothly lift the overlapping first blister tray 901 and the carrier 800 to the target height. At the target height, after the clamps 222 are opened and aligned with the overlapping first blister tray 901 and the carrier 800, the left and right clamping components are driven to move closer to the overlapping first blister tray 901 and the carrier 800, clamping and securing the overlapping first blister tray 901 and the carrier 800, and performing material transfer. After the material is transferred, the material transfer device 200 moves the overlapping carrier 800 and the second blister tray 902 carrying the copper block to above the unloading area 130. By controlling the extension of the second lifting component 221, the overlapping carrier 800 and the second blister tray 902 are initially placed in the unloading area 130 (at this time, the clamp 222 has not yet been released). Then, the clamp 222 is released, and the clamping components on the left and right sides are driven to move away from each other along the long side, so that the second blister tray 902 carrying the copper block falls completely on the unloading area 130.

[0025] In one embodiment, a through hole is provided on the table surface of the unloading area 130, and a transfer trolley is provided below the through hole. After the carrier 800 and the second blister tray 902 carrying copper blocks are placed on the transfer trolley, and the carrier 800 is moved and reset to the loading and aligning station 120, the second blister tray 902 carrying copper blocks is sent to the next processing workshop by controlling the transfer trolley.

[0026] It should be noted that a blister tray is a customized plastic tray made by heating and vacuum-adhering plastic sheets onto a mold; its main function is to fix, protect, organize, and display products. Blister trays have relatively thin walls, and directly vibrating the tray to load materials can easily cause breakage. Therefore, this application designs a carrier 800, on which materials are loaded and then transferred to the blister tray to be loaded, improving the efficiency and accuracy of copper block loading.

[0027] In some embodiments, such as Figure 1 As shown, the automatic tray loading equipment 1000 also includes a robot arm 700 electrically connected to the controller 300. When the robot arm 700 is in use, it is used to control the robot arm 700 to place the remaining copper blocks one by one into the empty first copper slot 810 according to the current empty slot coordinate position.

[0028] Specifically, such as Figure 2 As shown, the two-dimensional rectangular coordinate system established on the carrier 800 with respect to the geometric center of the carrier 800 includes a mutually perpendicular x-axis and a y-axis, with the material handling drive device 400 correspondingly positioned below the geometric center of the carrier 800. The carrier 800 is divided into a first quadrant region A, a second quadrant region B, a third quadrant region C, and a fourth quadrant region D.

[0029] The automatic tray loading equipment 1000 provided in this application embodiment has a controller 300 that can execute the automatic tray loading method provided in this application embodiment. After loading and aligning the carrier 800, the controller directly aligns the carrier 800 with the first blister tray 901 to be loaded and transfers the material, thus achieving automatic tray loading quickly and with high precision in one go. In other words, this application embodiment can automatically load copper blocks onto the blister tray in one go, improving the efficiency and accuracy of copper block tray loading.

[0030] Those skilled in the art will understand that the system structure shown in the figures does not constitute a limitation on the embodiments of this application, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0031] It will be understood by those skilled in the art that the system architecture and application scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. It is known by those skilled in the art that with the evolution of system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0032] Based on the above system structure, various embodiments of the automatic tray loading method of the automatic tray loading device of this application are proposed below.

[0033] like Figure 3 As shown, the automatic tray loading method of this automatic tray loading equipment can be applied to, for example... Figure 1 The controller shown, the automatic tray loading equipment includes: a processing platform and a material transfer device; a material loading and aligning station is provided on the processing platform; a carrier is provided on the material loading and aligning station, and a material aligning drive device is provided directly below the carrier and detachably connected to the carrier; a plurality of first copper slots are provided on the carrier; a pressure sensor is provided at the bottom of each first copper slot; the automatic tray loading method includes, but is not limited to, steps S100 to S400.

[0034] Step S100: Place the target number of copper blocks on the vehicle, the target number being equal to the number of the first copper slots.

[0035] Step S200: Control the material-forming drive device to perform the first vibration material-forming process on the carrier according to the preset first material-forming control parameters, so as to initially vibrate the copper block into the first copper tank, and perform empty tank statistical processing based on the first sensing information of each pressure sensor to determine the first tray loading status.

[0036] Step S300: If the first loading status indicates that the carrier loading is not completed, the material handling drive device is controlled to perform a second vibration material handling process and empty slot statistics process on the carrier according to the first loading status, so as to vibrate the remaining copper blocks into the empty first copper slot and obtain an updated second loading status.

[0037] Step S400: When the second loading status indicates that the carrier loading is complete, control the material transfer device to perform positioning and covering processing and flipping and material transfer processing on the carrier and the first blister tray to be loaded, so that the copper block is transferred from the first copper tank to the first blister tray, and the loading is completed.

[0038] Specifically, in step S200, the first material control parameters include: a first frequency, a first angle, and a first running time. It should be noted that the first frequency, the first angle, and the first running time are all preset, and this application does not impose specific restrictions on the values ​​of the first frequency, the first angle, and the first running time.

[0039] In some embodiments, step S200 is further described, wherein the material-forming drive device is controlled to perform a first vibration material-forming process on the carrier according to the preset first material-forming control parameters, so as to initially vibrate the copper block into the first copper tank, including but not limited to steps S201 to S205.

[0040] Step S201: Drive the carrier in the horizontal position to rotate clockwise around the x-axis by a first angle using the material handling drive device, and control the carrier to vibrate at a first frequency.

[0041] Step S202: After the first running time, the drive vehicle returns to the horizontal position, rotates the drive vehicle counterclockwise around the x-axis by a first angle, and controls the vehicle to vibrate at a first frequency.

[0042] Step S203: After the first running time, the drive vehicle returns to the horizontal position, rotates the drive vehicle counterclockwise around the y-axis by a first angle, and controls the vehicle to vibrate at a first frequency.

[0043] Step S204: After the first running time, the drive vehicle returns to the horizontal position, rotates the drive vehicle clockwise around the y-axis by a first angle, and controls the vehicle to vibrate at a first frequency.

[0044] Step S205: After the first running time, the drive vehicle returns to the horizontal position, and the first vibration material handling process ends.

[0045] Understandably, through steps S201 to S205, when there are many copper blocks in the carrier, high-speed vibration at a high first frequency is used to initially and quickly vibrate the copper blocks into the empty first copper trough, which is equivalent to coarse screening. Furthermore, inclined vibration feeding is performed in four directions to ensure that the stacked copper blocks are quickly and evenly dispersed on the fixture, facilitating subsequent fine inclined vibration feeding.

[0046] Understandably, after the initial vibration shaping process, the copper blocks are initially vibrated into the first copper slot. There is only a very small probability that all the copper blocks in the first copper slot will be filled after the initial vibration shaping process. There is a greater probability that some copper blocks will remain scattered on the carrier after the initial vibration shaping process, failing to fall into the first copper slot, meaning that some of the first copper slots are empty; subsequent empty slot statistics are needed to determine the initial loading status.

[0047] According to some embodiments of this application, step S200 is further described, wherein the first tray loading status is determined by performing empty slot statistical processing based on the first sensing information collected by each pressure sensor, including but not limited to steps S206 to S208.

[0048] Step S206: Obtain the first sensing information of each pressure sensor. Each first sensing information includes the pressure sensing data collected by the pressure sensor and the row and column coordinates of the pressure sensor in the two-dimensional rectangular coordinate system.

[0049] Step S207: Perform statistical analysis on the pressure sensing data and the row and column coordinate information of the region, determine the first copper tank where the pressure sensor with pressure sensing data of 0 is located as an empty tank, count the first number of empty tanks, and determine the empty tank coordinate position of each empty tank.

[0050] Step S208: Determine the first loading status based on the first number of empty slots and the coordinate position of each empty slot.

[0051] Further explanation of step S206 is as follows. Specifically, as... Figure 2 As shown, the two-dimensional rectangular coordinate system is established based on the geometric center of the mold. The system includes an X-axis and a Y-axis, with the X-axis parallel to the long side of the machining platform and the Y-axis parallel to the wide side. The first copper groove is not distributed along the X-axis or Y-axis. Based on this two-dimensional rectangular coordinate system, the row and column coordinates of each pressure sensor can be predetermined.

[0052] Based on common mathematical knowledge, we know that quadrants are four regions divided by two coordinate axes in a Cartesian coordinate system. They are named sequentially from the upper right corner counter-clockwise: Quadrant I, Quadrant II, Quadrant III, and Quadrant IV. The signs of the coordinates (x, y) of points within each quadrant follow a clear pattern, and points on the coordinate axes do not belong to any quadrant. Based on this mathematical knowledge, this application divides the mold into Quadrant I, Quadrant II, Quadrant III, and Quadrant IV regions. Based on this partitioning and the row and column distribution within each quadrant region, the row and column coordinate information of each pressure sensor is pre-determined. This row and column coordinate information accurately reflects the position of a pressure sensor within the mold. For example, if the row and column coordinates of a pressure sensor are (1,1), it means that the pressure sensor is located in the first column from left to right and the first row from bottom to top in the first quadrant; if the row and column coordinates of a pressure sensor are (-1,2), it means that the pressure sensor is located in the first column from right to left and the second row from bottom to top in the second quadrant; if the row and column coordinates of a pressure sensor are (-1,-2), it means that the pressure sensor is located in the first column from right to left and the second row from top to bottom in the third quadrant; and so on, the row and column coordinates of each pressure sensor and its slot can be obtained.

[0053] Since the row and column coordinate information of each pressure sensor is different, the row and column coordinate information can also uniquely identify the pressure sensor. Specifically, the first sensing information is represented as (1,1), 0; indicating that the pressure data value detected by the pressure sensor at position (1,1) is 0.

[0054] Further explaining steps S207 and S208, specifically, the judgment condition used in this application to determine whether the first copper tank is filled with copper blocks is as follows: when the pressure sensing data is 0, the first copper tank where the corresponding pressure sensor is located is determined to be an empty tank; when the pressure sensing data is not 0, the first copper tank where the corresponding pressure sensor is located is determined to be filled with copper blocks. Based on this judgment condition, empty tanks are determined for each pressure sensing data, and the first number of empty tanks is counted; the empty tank coordinates are obtained from the row and column coordinate information of multiple regions; finally, the first loading status is generated.

[0055] It is understandable that the first loading status includes the first number of empty slots and the coordinates of each empty slot.

[0056] By using steps S207 to S208, the first tray loading condition after the first vibration material straightening process is determined, providing a reliable reference for the subsequent second vibration material straightening process.

[0057] Understandably, when the first empty quantity is zero, the first tray loading status indicates that the carrier has completed loading, and each first copper slot has been filled with copper blocks. In this case, the automatic tray loading process ends directly, and the subsequent step S300 is not performed. Instead, step S400 is executed: the material transfer device is controlled to position and cover the carrier and the first blister pack to be loaded, and to flip and transfer the material, so that the copper blocks are transferred from the first copper slots to the first blister pack, completing the tray loading. Conversely, when the first empty quantity is not zero, the first tray loading status indicates that the carrier has not completed loading, and there are still empty first copper slots without copper blocks. In this case, step S300 continues.

[0058] According to some embodiments of this application, step S300 is further described as including, but not limited to, steps S310 to S320.

[0059] Step S310: When the number of empty slots is less than or equal to the preset threshold, process each empty slot individually according to the current empty slot coordinates and perform empty slot statistics to determine the latest second loading status until the number of empty slots is 0, and then complete the loading of the mold.

[0060] Step S320: Alternatively, if the number of empty slots is greater than the preset threshold, perform partitioned vibration material preparation based on the coordinate position of the empty slots, and perform empty slot statistics to determine the latest second loading status. Based on the second loading status, perform partitioned vibration material preparation or material preparation one by one until the number of empty slots is 0, and complete the loading of the mold.

[0061] Specifically, the preset threshold in steps S310 and S320 can be 5 or 3, which can be determined according to actual needs. This application does not impose specific restrictions on the value of the preset threshold.

[0062] Specifically, the empty slot statistical processing in steps S310 and S320 is the same as the empty slot statistical processing in steps S206 to S208, and the empty slot statistical processing in steps S310 and S320 determines the latest second loading status.

[0063] Further explaining step S310, when the number of empty slots is less than or equal to a preset threshold, it indicates that the number of copper blocks not loaded into the first copper slot on the carrier is relatively small. If the first vibration shaping process (with a high vibration frequency) is still performed, the accuracy will be low. Therefore, shaping is performed one by one according to the current empty slot coordinate position, so that the copper blocks are vibrated into the first copper slot corresponding to the empty slot coordinate position more accurately. In one embodiment, the shaping process includes: obtaining a preset third shaping control parameter, which includes a third frequency less than the first frequency and a third angle less than the first angle; determining the target tilting direction according to the empty slot coordinate position, controlling the mold to tilt towards the target tilting direction by a third angle through the shaping drive device, and controlling the mold to vibrate and load the material at the third frequency until the pressure sensor detected by the pressure sensor at the empty slot coordinate position is not 0 (i.e., the copper block enters the first copper slot at the empty slot coordinate position), completing one shaping process; traversing each empty slot coordinate position, performing the above-mentioned shaping process based on the third shaping control parameter, so that each controlled first copper slot is loaded with copper blocks. In addition, after each individual material processing is completed during this process, empty slot statistics are also performed to determine the latest second loading status, until the second empty quantity is 0, at which point it is determined that the mold has been successfully loaded.

[0064] It should be noted that setting a third frequency, which is lower than the first frequency, is to slow down the movement frequency of the copper block and ensure that the copper block enters the slot accurately.

[0065] In another embodiment, when assembling the robot arm 700, the robot arm 700 is controlled to place the remaining copper blocks one by one into the empty first copper slot according to the current empty slot coordinate position.

[0066] Understandably, if the number of empty slots exceeds a preset threshold, it indicates that a significant number of copper blocks have not yet entered the first copper tray. In this case, processing each block individually would drastically reduce tray loading efficiency. Therefore, when the number of empty slots exceeds the preset threshold, step S320 is executed.

[0067] According to some embodiments of this application, the second loading situation includes: the second number of empty slots and the coordinate position of each empty slot. Step S320 is further explained. Specifically, based on the second loading situation, the partitioned vibration material processing or the individual material processing is performed again until the second number of empty slots is 0, and the mold is loaded, including but not limited to steps S321 to S322.

[0068] Step S321: If the number of second vacant slots is greater than the preset threshold, perform zone vibration material processing and vacant slot statistics processing again according to the coordinate position of the vacant slots until the number of second vacant slots is less than or equal to the preset threshold.

[0069] Step S322: When the second number of empty slots is less than or equal to the preset threshold, process each empty slot individually according to its coordinate position, and perform empty slot statistics to determine the latest second loading status until the second number of empty slots is 0, and then complete the loading of the mold.

[0070] According to some embodiments of this application, the partitioned vibration material straightening process in steps S320 and S321 will be further described. The partitioned vibration material straightening process is performed based on the coordinate position of the empty slot, including but not limited to steps S510 to S540.

[0071] Step S510: Divide the mold into a first quadrant region, a second quadrant region, a third quadrant region, and a fourth quadrant region using a two-dimensional rectangular coordinate system established based on the geometric center of the mold.

[0072] Step S520: Based on the current empty slot coordinates, calculate the number of empty slots in the first region of the first quadrant, the number of empty slots in the second region of the second quadrant, the number of empty slots in the third region of the third quadrant, and the number of empty slots in the fourth region of the fourth quadrant.

[0073] In this step, it can be understood that, similar to the row and column coordinate information of the region, the coordinate position of the empty slot also indicates the quadrant region and row and column position of the empty first copper slot. If the coordinate position (x, y) of the empty slot is positive, it means that it is located in the first quadrant region. Based on the sign of the empty slot coordinate position, the quadrant region where the empty first copper slot is located can be quickly determined; similarly, the number of empty slots in each quadrant region can be quickly counted; that is, the number of empty slots in the first region of the first quadrant, the number of empty slots in the second region of the second quadrant, the number of empty slots in the third region of the third quadrant, and the number of empty slots in the fourth region of the fourth quadrant.

[0074] Step S530: Determine the processing order of the first quadrant region, the second quadrant region, the third quadrant region, and the fourth quadrant region according to the order of the number of empty slots in the first region, the second region, the third region, and the fourth region from largest to smallest.

[0075] In this step, for example, when the number of empty slots in the first region is 8, the number of empty slots in the second region is 7, the number of empty slots in the fourth region is 6, and the number of empty slots in the third region is 5, the region processing order is determined as: first quadrant region, second quadrant region, fourth quadrant region, and third quadrant region.

[0076] Step S540: Based on the regional processing order, tilting vibration feeding is performed on the first quadrant region, the second quadrant region, the third quadrant region and the fourth quadrant region respectively according to the pre-configured second material control parameters to complete one zonal vibration material processing.

[0077] In this step, the second material control parameters include: a second angle, a second frequency, and a second running time; wherein, the second angle is greater than the third angle and less than the first angle; the second frequency is greater than the third frequency and less than the first frequency; and the second running time is greater than the first running time.

[0078] Here's an example to illustrate step S540. The processing order for each region is: first quadrant region, second quadrant region, fourth quadrant region, and third quadrant region. First, the material handling device drives the horizontally positioned carrier to tilt at a second angle towards the upper right of the first quadrant region, and controls the carrier to vibrate and feed material at a second frequency. Then, after a second running time, the carrier returns to the horizontal position, tilts at a second angle towards the upper left of the second quadrant region, and controls the carrier to vibrate and feed material at a second frequency. Then, after a second running time, the carrier returns to the horizontal position, tilts at a second angle towards the lower right of the fourth quadrant region, and controls the carrier to vibrate and feed material at a second frequency. Finally, after a second running time, the carrier returns to the horizontal position, tilts at a second angle towards the lower left of the third quadrant region, and controls the carrier to vibrate and feed material at a second frequency. After a second running time, the carrier returns to the horizontal position, completing one zonal vibration material handling process.

[0079] It is understandable that the individual material processing in step S322 is the same as the individual material processing in step S310, and will not be described again here.

[0080] This application achieves the second vibration material sorting process through steps S310 to S320, vibrating the remaining copper blocks into the empty first copper tank, and completing the loading and sorting on the carrier.

[0081] Combination Figure 4 Briefly describe the overall logical process of performing the first vibration shaping process and the second vibration shaping process on the vehicle.

[0082] Step S1: Perform the first vibration shaping process on the carrier.

[0083] Step S2: Perform empty slot statistics processing to determine the first loading status, which includes the first number of empty slots.

[0084] Step S3: Determine whether the number of the first vacancy is greater than the preset threshold; if not, proceed to step S4; if yes, proceed to step S5.

[0085] Step S4: Perform individual material processing to complete the material loading for the mold.

[0086] Step S5: Perform zoned vibration material processing and empty slot statistics to determine the latest second loading status. The second loading status includes the second number of empty slots.

[0087] Step S6: Determine whether the number of second vacant spaces is greater than the preset threshold; if not, proceed to step S4; if yes, proceed to step S5.

[0088] According to some embodiments of this application, step S400 is further described. The processing platform also includes: a blister tray placement area and a material unloading area; the blister tray placement area, the material loading and unloading station, and the material unloading area are arranged sequentially along the long side of the processing platform; the material transfer device includes a vacuum suction cup assembly and a retractable and rotatable clamping and flipping assembly arranged on both sides of the vacuum suction cup assembly. The control of the material transfer device to perform positioning and covering processing on the carrier and the first blister tray to be loaded, and to perform flipping and material transfer processing, so that the copper block is transferred from the first copper groove to the first blister tray, completing the loading, including but not limited to steps S410 to S440.

[0089] Step S410: Control the material transfer device to pick up the empty first blister tray to be loaded from the blister tray placement area. The first blister tray is provided with multiple second copper grooves. The first copper grooves and the second copper grooves have the same shape, total number and distribution position.

[0090] In this step, the first copper groove of the carrier is matched with the second copper groove of the first blister tray so that after positioning and registration, the material can be flipped and transferred in one go, improving the tray loading efficiency.

[0091] Step S420: Move the first blister tray to the top of the loading and aligning station, perform positioning and calibration of the carrier and the first blister tray, and then cover the carrier with the first blister tray.

[0092] Specifically, the automatic tray loading equipment also includes a front image acquisition device and a side image acquisition device.

[0093] According to some embodiments of this application, step S420 includes, but is not limited to, steps S421 to S424.

[0094] Step S421: When the first blister pack moves to the target hovering position above the material loading and aligning station, a front view is captured by the front image acquisition device, and a side view is captured by the side image acquisition device.

[0095] Specifically, in this step, when the first blister pack moves to the target hovering position above the material loading and unloading station, the front image acquisition device faces... Figure 2 The front view is acquired along the y-axis, and the side image acquisition device is used to capture the image from the side. Figure 2 The side view is captured along the x-axis.

[0096] Step S422: Perform image recognition processing on the front view and side view to determine the relative position information of the carrier and the first blister tray, and determine the displacement control information based on the relative position information.

[0097] Specifically, in this step, the relative position information includes: a first relative position relationship and a second relative position relationship; the shift control information includes: a first movement control information and a second movement control information. Step S422 specifically includes: performing image recognition processing on the front view to determine the first relative position relationship between the carrier and the first blister pack, and determining the first movement control information based on the first relative position relationship; performing image recognition processing on the side view to determine the second relative position relationship between the carrier and the first blister pack, and determining the second movement control information based on the second relative position relationship.

[0098] For example, when the first relative positional relationship indicates that the first blister pack is parallel to the carrier and the first blister pack is offset by a first distance relative to the carrier in the positive x-axis direction, the first movement control information is determined to be: move the first distance in the negative x-axis direction. When the second relative positional relationship indicates that the first blister pack is parallel to and aligned with the carrier, the second movement control information is: do not move in the y-axis direction.

[0099] Step S423: Control the movement of the shifting device according to the shift control information, and move the first blister tray to the target registration position.

[0100] In this step, specifically, the shifting device is controlled to move according to the first movement control information and the second movement control information, which drives the first blister tray to the target registration position. At the target registration position, the first blister tray is parallel and aligned with the carrier.

[0101] Step S424: At the target registration position, release the first blister pack to cover the vehicle.

[0102] In this step, at the target registration position, the first blister pack is released to cover the carrier to facilitate subsequent clamping, lifting, and flipping processes.

[0103] Step S430: Unlock the material driving device from the carrier, control the clamping and flipping assembly to clamp, raise and flip the first blister tray and the carrier, so that the copper block is transferred to the corresponding second copper groove, and a second blister tray loaded with copper block and an empty carrier are obtained.

[0104] In this step, specifically, at the target height position, the clamping and flipping assembly of the material transfer device is controlled to clamp and hold the first blister tray and the carrier, and at the target height position, the first blister tray and the carrier are flipped 180 degrees around the x-axis, so that the copper block is transferred to the corresponding second copper groove, thus obtaining the second blister tray loaded with the copper block and the empty carrier.

[0105] It is understandable that the carrier has a certain length and width, and needs to be at a certain height to be able to flip smoothly. Therefore, it is necessary to clamp the first blister tray and the carrier together and raise it to the target height position to flip and transfer the material.

[0106] Step S440: Control the material transfer device to move the second blister tray and the empty carrier to the unloading area for unloading, and flip the empty carrier back to the loading and aligning station to complete the tray loading.

[0107] In this step, the material transfer device is controlled to move the second blister tray and the empty carrier to the unloading area. The clamping and flipping assembly is released and retracted. The empty carrier is then adsorbed by the vacuum suction cup assembly. At the target height position, the carrier is clamped and flipped back by the clamping and flipping assembly and transported back to the loading line station for the next automatic turntable. The second blister tray loaded with copper blocks is placed in the unloading area to complete the loading.

[0108] As can be seen, the embodiments of this application provide an automatic traying device with a rapid traying function, which improves efficiency, ensures accuracy, and reduces reliance on manual labor.

[0109] like Figure 5 As shown, this application also provides a controller, including: The processor 501 can be implemented using a general-purpose central processing unit, microprocessor, application-specific integrated circuit, or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory 502 can be implemented as a read-only memory, static storage device, dynamic storage device, or random access memory. The memory 502 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 502 and is called and executed by the processor 501 to execute the automatic disk loading method of the automatic disk loading device of the embodiments of this application. The input / output interface 503 is used to implement information input and output; The communication interface 504 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). Bus 505 transmits information between various components of the device (e.g., processor 501, memory 502, input / output interface 503, and communication interface 504); The processor 501, memory 502, input / output interface 503, and communication interface 504 are connected to each other within the device via bus 505.

[0110] This application also provides an automatic tray loading device, including the controller described above.

[0111] This application embodiment also provides a storage medium, which is a computer-readable storage medium, storing a computer program that, when executed by a processor, implements the automatic disk loading method of the above-described automatic disk loading device.

[0112] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0113] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0114] The above provides a detailed description of the preferred embodiments of this application. However, this application is not limited to the above-described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by this application.

Claims

1. An automatic tray loading method of an automatic tray loading apparatus, characterized by, The application relates to a controller applied to an automatic tray loading device; the automatic tray loading device comprises a processing platform and a material moving device; a loading and aligning station is arranged on the processing platform; a carrier is arranged on the loading and aligning station; an aligning driving device is arranged below the carrier and detachably connected with the carrier; a plurality of first copper grooves are arranged on the carrier; a pressure sensor is arranged at the bottom of each first copper groove; The method comprises the following steps: placing a target number of copper blocks on the carrier, wherein the target number is equal to the number of the first copper grooves; controlling the aligning driving device to perform first vibration aligning treatment on the carrier according to preset first aligning control parameters, so as to preliminarily vibrate the copper blocks into the first copper grooves, and performing empty groove counting treatment according to acquired first sensing information of each pressure sensor to determine a first tray loading condition; in the case that the first tray loading condition indicates that the carrier loading is not completed, controlling the aligning driving device to perform second vibration aligning treatment on the carrier and the empty groove counting treatment according to the first tray loading condition, so as to vibrate the remaining copper blocks into the empty first copper grooves, and obtaining an updated second tray loading condition; in the case that the second tray loading condition indicates that the carrier loading is completed, controlling the material moving device to perform positioning and covering treatment and turnover and material moving treatment on the carrier and a first blister tray to be loaded, so as to move the copper blocks from the first copper grooves to the first blister tray to complete the tray loading.

2. The automatic tray loading method of the automatic tray loading apparatus according to claim 1, characterized by, The method comprises the following steps: acquiring the first sensing information of each pressure sensor, wherein each first sensing information comprises pressure sensing data collected by the pressure sensor and area row and column coordinate information of the pressure sensor in a two-dimensional rectangular coordinate system; performing statistical analysis on the pressure sensing data and the area row and column coordinate information, determining that the first copper groove where the pressure sensor with 0 pressure sensing data is located is an empty groove, counting a first empty groove number of the empty grooves, and determining empty groove coordinate positions of each empty groove; determining the first tray loading condition according to the first empty groove number and the empty groove coordinate positions of each empty groove.

3. The automatic tray loading method of the automatic tray loading apparatus according to claim 2, characterized by, The second tray loading condition comprises a second empty groove number of the empty grooves and current empty groove coordinate positions of each empty groove; in the case that the first empty groove number is less than or equal to a preset threshold value, performing individual aligning treatment according to the current empty groove coordinate positions and the empty groove counting treatment to determine the latest second tray loading condition until the second empty groove number is 0, and completing the loading of the mold; ​ Or, in the case where the first empty quantity is greater than a preset threshold, performing partition vibration material arranging processing according to the cavity coordinate position, and performing the cavity statistical processing to determine the latest second tray loading condition, and re-performing the partition vibration material arranging processing or the individual material arranging processing according to the second tray loading condition until the second empty quantity is 0, and completing the material loading of the mold.

4. The automatic tray loading method of the automatic tray loading apparatus according to claim 3, characterized by, The re-performing the partition vibration material arranging processing or the individual material arranging processing according to the second tray loading condition until the second empty quantity is 0, and completing the material loading of the mold, comprises: In the case where the second empty quantity is greater than a preset threshold, re-performing the partition vibration material arranging processing and the cavity statistical processing according to the cavity coordinate position until the second empty quantity is less than or equal to a preset threshold; In the case where the second empty quantity is less than or equal to a preset threshold, performing individual material arranging processing according to the cavity coordinate position, and performing the cavity statistical processing to determine the latest second tray loading condition until the second empty quantity is 0, and completing the material loading of the mold.

5. The automatic tray loading method of the automatic tray loading apparatus according to claim 4, wherein The partition vibration material arranging processing according to the cavity coordinate position comprises: Dividing the mold into a first quadrant region, a second quadrant region, a third quadrant region and a fourth quadrant region through a two-dimensional rectangular coordinate system established based on the geometric center of the mold; According to the current cavity coordinate position statistics, obtaining a first region empty cavity quantity of the first quadrant region, a second region empty cavity quantity of the second quadrant region, a third region empty cavity quantity of the third quadrant region, and a fourth region empty cavity quantity of the fourth quadrant region; According to the order from large to small of the first region empty cavity quantity, the second region empty cavity quantity, the third region empty cavity quantity and the fourth region empty cavity quantity, determining a region processing order between the first quadrant region, the second quadrant region, the third quadrant region and the fourth quadrant region; Based on the region processing order, performing inclined vibration material loading processing on the first quadrant region, the second quadrant region, the third quadrant region and the fourth quadrant region according to a preconfigured second material arranging control parameter, to complete one time of the partition vibration material arranging processing.

6. The automatic tray packing method of the automatic tray packing apparatus according to claim 1, wherein The processing platform further comprises a blister tray placement area and a discharging area; the blister tray placement area, the material loading and arranging station and the discharging area are sequentially arranged along the long side direction of the processing platform; the material moving device comprises a vacuum suction disc assembly and a clamping and overturning assembly capable of telescoping and overturning arranged on both sides of the vacuum suction disc assembly; The control of the material moving device on the positioning and covering processing of the carrier and the first blister tray to be loaded, and the overturning and material moving processing, so that the copper block is transferred from the first copper cavity to the first blister tray to complete the loading, comprises: Controlling the material moving device to suck the empty first blister tray to be loaded from the blister tray placement area, and the first blister tray is provided with a plurality of second copper cavities, and the shape, total quantity and distribution position of the first copper cavity and the second copper cavity are the same; The first blister tray is moved above the loading and aligning station, and the carrier and the first blister tray are subjected to positioning and calibration, and then the first blister tray is covered on the carrier; The loading and driving device is unlocked from the carrier, and the clamping and overturning assembly is controlled to clamp and lift and overturn the first blister tray and the carrier, so that the copper blocks are transferred to the corresponding second copper tank, and a second blister tray loaded with copper blocks and the empty carrier are obtained; The material moving device is controlled to move the second blister tray and the empty carrier to the unloading area for unloading, and the empty carrier is overturned and reset to be transported back to the loading and aligning station, and the tray loading is completed.

7. The automatic tray loading method of the automatic tray loading apparatus according to claim 6, wherein The automatic tray loading equipment further comprises a front image acquisition device and a side image acquisition device; The first blister tray is moved above the loading and aligning station, and the carrier and the first blister tray are subjected to positioning and calibration, and then the first blister tray is covered on the carrier; When the first blister tray moves to the target hovering position above the loading and aligning station, a front view is acquired by the front image acquisition device, and a side view is acquired by the side image acquisition device; The relative position information of the carrier and the first blister tray is determined through image recognition of the front view and the side view, and displacement control information is determined according to the relative position information; The displacement device is controlled to move according to the displacement control information, so as to drive the first blister tray to move to a target registration position; At the target registration position, the first blister tray is released to cover on the carrier.

8. A controller characterized by comprising: The controller comprises at least one processor and a memory connected in communication with the at least one processor; the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the automatic tray loading method of the automatic tray loading equipment according to any one of claims 1 to 7.

9. An automatic tray loading apparatus characterized by comprising: The controller according to claim 8.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer executable instructions for causing a computer to execute the automatic tray loading method of the automatic tray loading equipment according to any one of claims 1 to 7.

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