Insulation heat conduction enhanced PC material and preparation method thereof

Abstract

The invention discloses an insulation and heat conduction enhanced PC material and a preparation method thereof, and belongs to the technical field of high polymer materials. The insulating heat-conducting reinforced PC material is prepared from the following raw materials in parts by mass: 33 to 57 parts of PC resin, 10 to 15 parts of glass fiber, 25 to 40 parts of heat-conducting filler and 0.5 to 1 part of modified interface solubilizer, the modified interface solubilizer is mixed shell type polymer nanoparticles, a shell layer monomer comprises butyl acrylate and MAH-g-PE, and a core layer monomer is styrene. By adding the modified interface solubilizer, the interface adhesion is obviously enhanced, and the mechanical property is obviously improved; the core function of the modified interface solubilizer is to reduce the interfacial tension between the PC matrix and the glass fiber, form stable interface bonding through chemical and physical actions, and improve the impact resistance.

Description

Technical Field

[0001] This invention belongs to the field of polymer materials technology, specifically relating to an insulating and thermally conductive enhanced PC material and its preparation method. Background Technology

[0002] With the widespread commercialization of 5G, electronic products are becoming increasingly powerful, with higher integration and assembly density, leading to a sharp increase in power consumption and heat generation. This places higher demands on the thermal conductivity of polymer materials. The booming development of AI applications is also placing higher demands on the computing power of upstream AI chips, resulting in a continuous increase in chip heat flux and significantly boosting the demand for thermally conductive materials. The inherent dimensional stability and flame retardancy of thermally conductive PC materials have become a key focus of current research.

[0003] Polycarbonate (PC) is an amorphous thermoplastic resin with excellent comprehensive properties. It has excellent electrical insulation, elongation, dimensional stability and chemical corrosion resistance, as well as high strength, heat resistance and cold resistance. It also has the advantages of self-extinguishing, flame retardancy, non-toxicity and colorability. PC material itself has a low thermal conductivity of 0.2 W / (mk). PC material itself is notch sensitive, and the alkalinity of alkali metals and their oxides can cause PC to decompose. At present, there is little research on thermally conductive PC.

[0004] PC material exhibits high residual stress after molding, making it prone to cracking and extremely sensitive to notches. Currently, most manufacturers add ABS or toughening agents to adjust the flowability and toughness of PC, making it easier to process and ensuring the toughness meets the requirements of the manufactured parts. However, due to the presence of benzene rings in the PC molecular chain, the melt viscosity is high, making it prone to cracking during use. Especially after adding thermally conductive fillers, the toughness of the product decreases sharply. The current trend in plastic products is towards thinner walls, larger sizes, and lighter weights. Current technology limits the expanded application of thermally conductive PC products, necessitating the development of an insulating and thermally conductive reinforcing material that can replace metal. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide an insulating and thermally conductive enhanced PC material and its preparation method, thereby solving the problems in the prior art.

[0006] The objective of this invention can be achieved through the following technical solutions: An insulating and thermally conductive reinforced PC material, comprising the following raw materials in parts by weight: 33-57 parts of PC resin; 10-15 parts glass fiber; 25-40 parts of thermally conductive filler; 0.5-1 part of modified interfacial solubilizer; The modified interface solubilizer is a mixed shell polymer nanoparticle, wherein the shell monomers include butyl acrylate and MAH-g-PE, and the core monomer is styrene.

[0007] Furthermore, the preparation process of the modified interface solubilizer includes: Step 1: Mix and dissolve butyl acrylate, MAH-g-PE and n-dodecyl mercaptan, then add emulsifier and deionized water, and stir to form a shell pre-emulsion; Step 2: Mix styrene, emulsifier and deionized water, and stir to form a core layer pre-emulsion; Step 3: Mix deionized water and NaHCO3 to adjust the pH to 7-8. Under nitrogen protection, add a portion of the core layer pre-emulsion and potassium persulfate aqueous solution dropwise and stir to form a seed emulsion. Then add the remaining core layer pre-emulsion and potassium persulfate aqueous solution dropwise. After that, add the shell layer pre-emulsion dropwise. The reaction allows MAH-g-PE to be grafted onto the core layer surface to obtain a core-shell polymer emulsion. Step 4: Adjust the pH of the core-shell polymer emulsion to 2-3, add anhydrous ethanol to break the emulsion, and then obtain the modified interface solubilizer after centrifugation, washing and drying.

[0008] Furthermore, PC materials also include: 8-12 parts toughening agent; Antioxidant 0.3-0.5 parts; 0.3-0.5 parts of lubricant.

[0009] Furthermore, the PC resin is at least one of aliphatic aromatic polycarbonate.

[0010] Furthermore, the thermally conductive filler is at least one of boron nitride, natural graphite, and talc powder with a high aspect ratio.

[0011] Furthermore, the toughening agent is at least one of polyethylene, a terpolymer of methyl methacrylate-butadiene-styrene, an ethylene-methyl acrylate copolymer, and an ethylene-butyl acrylate-glycidyl methacrylate copolymer.

[0012] Furthermore, the antioxidant is at least one of hindered phenolic antioxidants, thioester antioxidants, and phosphite antioxidants.

[0013] Furthermore, the lubricant is selected from at least one of polyethylene wax, silicone masterbatch, lignite wax, and pentaerythritol stearate.

[0014] The above-mentioned method for preparing an insulating and thermally conductive enhanced PC material includes the following steps: All raw materials except thermally conductive filler and glass fiber are added to a mixer under nitrogen protection and mixed evenly to obtain a mixture. The mixture is fed into a parallel twin-screw extruder for melting, and thermally conductive fillers and glass fibers are added through the side feed port. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained.

[0015] The above-mentioned insulating and thermally conductive enhanced PC material is used as a raw material in the manufacture of electronic product casings.

[0016] The beneficial effects of this invention are: 1. By adding modified interface solubilizer, the interfacial adhesion is significantly enhanced, and the mechanical properties are significantly improved. The core function of modified interface solubilizer is to reduce the interfacial tension between PC matrix and glass fiber, and form stable interfacial adhesion through chemical (such as covalent bond) and physical (such as hydrogen bond, van der Waals force) interactions, thereby improving impact resistance.

[0017] 2. The combination of glass fiber and modified interfacial solubilizer in this invention can enhance the synergistic effect of thermal conductivity through "structural optimization": the interfacial solubilizer fills the gap between PC and glass fiber, reduces the interfacial thermal resistance, and allows heat to be transferred more smoothly from the PC matrix to the glass fiber and then diffused to the entire material; if combined with other thermally conductive fillers (such as alumina and boron nitride), a three-dimensional thermally conductive network of "matrix-glass fiber-thermally conductive filler" can be formed, further improving the thermal conductivity.

[0018] 3. The insulating and thermally conductive reinforced PC material prepared by this invention has a cantilever beam notched impact strength ≥10 KJ / m. 2 With a melt flow index ≥5g / 10min, flexural modulus >4000Mpa, linear expansion coefficient <30, and thermal conductivity ≥5.5W / (mk), it can meet the requirements of replacing metal heat sinks for electronic components with high thermal conductivity.

[0019] 4. The insulating and thermally conductive enhanced PC material of this invention can achieve a good high-gloss surface effect through injection molding, or it can be extruded into extruded sheets. In addition, it can also be used to solve the problem of recycling and reusing waste plastic PC. Detailed Implementation

[0020] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] An insulating and thermally conductive reinforced PC material, comprising the following raw materials in parts by weight: 33-57 parts of PC resin; 10-15 parts glass fiber 25-40 parts of thermally conductive filler; 8-12 parts toughening agent; 0.5-1 part of modified interfacial solubilizer; Antioxidant 0.3-0.5 parts; 0.3-0.5 parts of lubricant.

[0022] PC resin is at least one of aliphatic aromatic polycarbonates.

[0023] The thermally conductive filler is at least one of boron nitride, natural graphite, and talc powder with a high aspect ratio.

[0024] The glass fiber has a diameter of 13μm and is selected from at least one of ordinary aspect ratio glass fiber and flat glass fiber.

[0025] The toughening agent is at least one of polyethylene, methyl methacrylate-butadiene-styrene terpolymer, ethylene-methyl acrylate copolymer, and ethylene-butyl acrylate-glycidyl methacrylate.

[0026] The antioxidant is at least one of hindered phenolic antioxidants, thioester antioxidants, and phosphite antioxidants; specifically, the hindered phenolic antioxidant is antioxidant 1076, the thioester antioxidant is antioxidant DLTP, and the phosphite antioxidant is antioxidant 168.

[0027] The lubricant is selected from at least one of polyethylene wax, silicone masterbatch, lignite wax, and pentaerythritol stearate.

[0028] The preparation process of the modified interface solubilizer is as follows: Step 1: Mix and dissolve butyl acrylate, MAH-g-PE, and n-dodecyl mercaptan, then add emulsifier and deionized water, and stir for 20 minutes to form a shell pre-emulsion; wherein, the mass ratio of MAH-g-PE, butyl acrylate, n-dodecyl mercaptan, emulsifier and deionized water is: 100:10-20:0.1-0.5:5-8:150-200.

[0029] Step 2: Mix styrene, emulsifier and deionized water, and stir at high speed (1000 rpm) for 30 minutes to form a core layer pre-emulsion; wherein the mass ratio of styrene, emulsifier and deionized water is 100:4-6:150-200.

[0030] Step 3: Add deionized water and NaHCO3 (0.5%) to a four-necked flask, adjust the pH to 7-8, heat to 70-75℃, and purge with nitrogen for protection; then add 1 / 3 of the core layer pre-emulsion and 1 / 2 of the potassium persulfate aqueous solution (potassium persulfate dissolved in deionized water), stirring at 300-500 rpm, and react for 1 hour to form a seed emulsion (core layer particles, approximately 50-80 nm in diameter); then heat to 80℃, slowly add the remaining core layer pre-emulsion and potassium persulfate aqueous solution, and continue the reaction for 1.5 hours; then add the shell layer pre-emulsion, controlling the dropping rate (2-3 drops / second), and react for 2 hours to allow MAH-g-PE to be grafted onto the core layer surface through covalent or hydrogen bonds, forming a shell layer; finally, heat to 85℃ and hold for 1 hour to ensure complete monomer conversion, then cool to room temperature to obtain a core-shell polymer emulsion; Step 4: Adjust the pH of the core-shell polymer emulsion to 2-3 with hydrochloric acid (10%), add anhydrous ethanol to break the emulsion, centrifuge (8000 rpm, 15 minutes), and wash three times alternately with deionized water and ethanol to remove residual emulsifier and unreacted monomers; then place the precipitate in a vacuum drying oven and dry at 60°C for 12 hours to obtain powdered mixed shell polymer nanoparticles, i.e., modified interface solubilizer; The emulsifiers include sodium dodecyl sulfate and nonylphenol polyoxyethylene ether, in a mass ratio of 1:1 to 2:1.

[0031] Modifying the solubilizer can significantly improve the interfacial compatibility between the filler and the modified plastic, greatly improving the dispersion of the thermally conductive filler and the establishment of thermally conductive pathways.

[0032] The above-mentioned method for preparing an insulating and thermally conductive enhanced PC material includes the following steps: S1, PC resin, toughening agent, modified interface solubilizer, antioxidant, and lubricant are added to a mixer under nitrogen protection and mixed evenly to obtain a mixture. S2 involves feeding the mixture into a parallel twin-screw extruder for melting, while simultaneously adding thermally conductive fillers and glass fibers through a side feed port. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained.

[0033] In S2, the extruder barrel temperature is 240-260℃, the screw speed is 400-600 r / min, and the vacuum degree is -0.04~-0.1 MPa.

[0034] The following examples illustrate the preparation process of the insulating and thermally conductive reinforced PC material. All parts used in the examples and comparative examples are by weight, and the specific types of raw materials involved are as follows: Aromatic polycarbonate: Teijin 1250Y (Japan) Fiberglass from Jushi Chemical: 510, 510H; Chongqing International flat fiberglass: ECS301HP-3-M4 Ethylene-methyl acrylate copolymer: DuPont Chemicals EMA 1330AC Methyl methacrylate-butadiene-styrene terpolymer: Dow Chemical MBS 2690 Thermally conductive filler: Weifang Bond boron nitride; natural graphite: Yirui Stone KS80. 150, the talc is Yirui Stone T84; Interface solubilizer: Mixed shell polymer nanoparticles, CP-1 customized by Mitsui Chemicals; Furthermore, the preparation process of the modified interface solubilizers used in the examples is as follows: Step 1: Mix and dissolve butyl acrylate, MAH-g-PE, and n-dodecyl mercaptan, then add emulsifier and deionized water, and stir for 20 minutes to form a shell pre-emulsion; wherein the mass ratio of MAH-g-PE, butyl acrylate, n-dodecyl mercaptan, emulsifier, and deionized water is 100:10-20:0.1-0.5:5-8:150-200 Step 2: Mix styrene, emulsifier, and deionized water, and stir at high speed (1000 rpm) for 30 minutes to form a core layer pre-emulsion; wherein the mass ratio of styrene, emulsifier, and deionized water is 100:4-6:150-200. Step 3: Add deionized water and NaHCO3 (0.5%) to a four-necked flask, adjust the pH to 7-8, heat to 70-75℃, and purge with nitrogen for protection; then add 1 / 3 of the core layer pre-emulsion and 1 / 2 of the potassium persulfate aqueous solution (potassium persulfate dissolved in deionized water), stirring at 300-500 rpm, and react for 1 hour to form a seed emulsion (core layer particles, approximately 50-80 nm in diameter); then heat to 80℃, slowly add the remaining core layer pre-emulsion and potassium persulfate aqueous solution, and continue the reaction for 1.5 hours; then add the shell layer pre-emulsion, controlling the dropping rate (2-3 drops / second), and react for 2 hours to allow MAH-g-PE to be grafted onto the core layer surface through covalent or hydrogen bonds, forming a shell layer; finally, heat to 85℃ and hold for 1 hour to ensure complete monomer conversion, then cool to room temperature to obtain a core-shell polymer emulsion; Step 4: Adjust the pH of the core-shell polymer emulsion to 2-3 with hydrochloric acid (10%), add anhydrous ethanol to break the emulsion, centrifuge (8000 rpm, 15 minutes), and wash three times alternately with deionized water and ethanol to remove residual emulsifier and unreacted monomers; then place the precipitate in a vacuum drying oven and dry at 60°C for 12 hours to obtain powdered mixed shell polymer nanoparticles, i.e., modified interface solubilizer; The emulsifiers include sodium dodecyl sulfate and nonylphenol polyoxyethylene ether, in a mass ratio of 1:1 to 2:1. Example 1 In this embodiment, the insulating and thermally conductive enhanced PC material comprises the following raw materials in parts by weight: 57 parts of aromatic polycarbonate; 10 parts of glass fiber 8 parts of methyl methacrylate-butadiene-styrene terpolymer; 25 parts of thermally conductive filler; 0.5 parts of modified interfacial solubilizer; 0.3 parts pentaerythritol stearate; Antioxidant 1076, 0.1 parts; Antioxidant DLTP 0.1 parts; Antioxidant 168, 0.1 parts; In this embodiment, the aromatic polycarbonate is specifically Teijin Chemical L1250Y, and the thermally conductive filler is a blend of boron nitride, natural graphite, and talc. The preparation method of this insulating and thermally conductive enhanced PC material includes the following steps: (1) Add 57 parts of aromatic polycarbonate, 5 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.5 parts of modified interface solubilizer, 0.1 parts of antioxidant 1076, 0.1 parts of antioxidant 168, 0.1 parts of antioxidant DLTP, and 0.3 parts of pentaerythritol stearate to a mixer under nitrogen protection and mix at high speed for 6 minutes. (2) The mixture from step (1) is fed into a parallel twin-screw extruder for melting. At the same time, 25 parts of thermally conductive filler and 10 parts of glass fiber are added through the side feed port. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained. The barrel temperature of the extruder is 240℃, the screw speed is 400r / min, the melt pressure is 1.5MPa, and the vacuum degree is -0.04MPa. Thus, the insulating and thermally conductive reinforced PC material is obtained.

[0035] Example 2 In this embodiment, the insulating and thermally conductive enhanced PC material comprises the following raw materials in parts by weight: 57 parts of aromatic polycarbonate; 10 parts of fiberglass 2 parts of ethylene-methyl acrylate copolymer; Six parts of methyl methacrylate-butadiene-styrene terpolymer; 25 parts of thermally conductive filler; 0.3 parts pentaerythritol stearate; 0.5 parts of modified interfacial solubilizer; Antioxidant 1076, 0.1 parts; Antioxidant DLTP 0.2 parts; Antioxidant 168 0.2 parts.

[0036] In this embodiment, the aromatic polycarbonate is specifically Teijin's 1250Y, and the thermally conductive filler is a blend of talc, boron nitride, and natural graphite. The preparation method of this insulating and thermally conductive enhanced PC material includes the following steps: (1) Add 57 parts of aromatic polycarbonate, 1 part of ethylene-methyl acrylate copolymer, 4 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.1 parts of antioxidant 1076, 0.2 parts of antioxidant 168, 0.2 parts of antioxidant DLTP, 0.3 parts of pentaerythritol stearate, and 0.5 parts of modified interface solubilizer to a mixer under nitrogen protection and mix at high speed for 6 minutes. (2) The mixture from step (1) is fed into a parallel twin-screw extruder for melting. At the same time, 25 parts of thermally conductive filler and 10 parts of glass fiber are added to the side feed port of the extruder through a liquid pump. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained. The barrel temperature of the extruder is 280℃, the screw speed is 600r / min, the melt pressure is 1.5MPa, and the vacuum degree is -0.10Pa.

[0037] Example 3 In this embodiment, the insulating and thermally conductive enhanced PC material comprises the following raw materials in parts by weight: 47 parts of aromatic polycarbonate; 15 parts glass fiber Polyethylene (toughening agent) 2 parts; 10 parts of methyl methacrylate-butadiene-styrene terpolymer; 40 parts of thermally conductive filler; 1 part of modified interfacial solubilizer; 0.5 parts of lignite wax; Antioxidant 1076, 0.1 parts; Antioxidant 168, 0.2 parts; Antioxidant DLTP 0.2 parts; In this embodiment, the aliphatic polycarbonate is specifically Teijin 1250Y, and the thermally conductive filler is a blend of talc and natural graphite. The preparation method of this insulating and thermally conductive enhanced PC material includes the following steps: (1) Add 47 parts of aromatic polycarbonate, 2 parts of polyethylene, 10 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.1 parts of antioxidant 1076, 0.2 parts of antioxidant 168, 0.2 parts of antioxidant DLTP, 0.5 parts of lignite wax, and 1 part of modified interface solubilizer to a mixer under nitrogen protection and mix at high speed for 2 min. (2) The mixture from step (1) is fed into a parallel twin-screw extruder for melting. At the same time, 40 parts of thermally conductive filler and 15 parts of glass fiber are added to the side feed port of the extruder through a liquid pump. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained. The barrel temperature of the extruder is 260℃, the screw speed is 400r / min, the melt pressure is 1.5MPa, and the vacuum degree is -0.04MPa. Thus, the insulating and thermally conductive reinforced PC material is obtained.

[0038] Example 4 In this embodiment, the insulating and thermally conductive enhanced PC material comprises the following raw materials in parts by weight: 45 parts of aromatic polycarbonate; 15 parts glass fiber Polyethylene (toughening agent) 2 parts; 10 parts of methyl methacrylate-butadiene-styrene terpolymer; 28 parts of thermally conductive filler; 0.5 parts of modified interfacial solubilizer; 0.5 parts of lignite wax; Antioxidant 1076, 0.1 parts; Antioxidant 168, 0.2 parts; Antioxidant DLTP 0.2 parts.

[0039] In this embodiment, the aliphatic polycarbonate is specifically Teijin L1250Y, and the thermally conductive filler is a blend of boron nitride and natural graphite. The preparation method of this insulating and thermally conductive enhanced PC material includes the following steps: (1) Add 60 parts of aromatic polycarbonate, 2 parts of ethylene-methyl acrylate copolymer, 10 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.1 parts of antioxidant 1076, 0.2 parts of antioxidant 168, 0.2 parts of antioxidant DLTP, 0.5 parts of lignite wax, and 0.5 parts of modified interface solubilizer to a mixer under nitrogen protection and mix at high speed for 2 minutes. (2) The mixture from step (1) is fed into a parallel twin-screw extruder for melting. At the same time, 28 parts of thermally conductive filler and 16 parts of glass fiber are added to the side feed port of the extruder through a liquid pump. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained. The barrel temperature of the extruder is 260℃, the screw speed is 400r / min, the melt pressure is 1.5MPa, and the vacuum degree is -0.04MPa. Thus, the insulating and thermally conductive reinforced PC material is obtained.

[0040] Comparative Example 1 The only difference between Comparative Example 1 and Example 1 is that no modified interfacial solubilizer is used in Comparative Example 1.

[0041] Comparative Example 2 The only difference between Comparative Example 2 and Example 1 is that the modified interfacial solubilizer in Example 1 was replaced with a common interfacial solubilizer (MAH-g-PE) in Comparative Example 2.

[0042] In this comparative example, the insulating and thermally conductive reinforced PC material comprises the following parts by weight of raw materials: 57 parts of aromatic polycarbonate; 10 parts of glass fiber 8 parts of methyl methacrylate-butadiene-styrene terpolymer; 25 parts of thermally conductive filler; 0.5 parts of interfacial solubilizer (MAH-g-PE); 0.3 parts pentaerythritol stearate; Antioxidant 1076, 0.1 parts; Antioxidant DLTP 0.1 parts; Antioxidant 168, 0.1 parts; In this embodiment, the aromatic polycarbonate is specifically Teijin Chemical L1250Y, and the thermally conductive filler is a blend of boron nitride, natural graphite, and talc. The preparation method of this insulating and thermally conductive enhanced PC material includes the following steps: (1) Add 57 parts of aromatic polycarbonate, 5 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.5 parts of interfacial solubilizer (MAH-g-PE), 0.1 parts of antioxidant 1076, 0.1 parts of antioxidant 168, 0.1 parts of antioxidant DLTP, and 0.3 parts of pentaerythritol stearate to a mixer under nitrogen protection and mix at high speed for 6 minutes. (2) The mixture from step (1) is fed into a parallel twin-screw extruder for melting. At the same time, 25 parts of thermally conductive filler and 10 parts of glass fiber are added through the side feed port. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained. The barrel temperature of the extruder is 240℃, the screw speed is 400r / min, the melt pressure is 1.5MPa, and the vacuum degree is -0.04MPa. Thus, the insulating and thermally conductive reinforced PC material is obtained.

[0043] Experimental verification The main physical properties of the PC materials prepared in Examples 1-4 and Comparative Example 1 were tested according to relevant testing standards, including tensile strength, elongation at break, flexural strength, flexural modulus, notched impact strength, density, and thermal conductivity. The testing standards and results are shown in Table 1 below. Table 1. Main physical properties of PC materials in Examples 1-4 and Comparative Examples 1-2 The experimental data in Table 1 show that: The improved thermal conductivity of the product is mainly due to the formation of a thermally conductive network. With the addition of thermally conductive fillers and the appropriate combination of different fillers, the product's thermal conductivity will be significantly improved. Adding an interfacial solubilizer further enhances the product's overall performance and thermal conductivity, providing performance support for the practical application of thermally conductive products. Using glass fiber of different shapes will significantly improve the product's thermal conductivity.

[0044] As can be seen from Example 1 and Comparative Example 1, the addition of modified interface solubilizer significantly altered the overall performance of the product, especially its toughness indicators: notched impact and elongation at break were significantly improved; the thermal conductivity of the product also increased significantly, and the thermal conductivity of the product was significantly improved.

[0045] Based on Example 1 and Comparative Example 2, it can be seen that compared with ordinary interface compatibilizer (MAH-g-PE), the product with modified interface solubilizer significantly improves the bonding between glass fiber and resin, significantly enhances the mechanical properties of the product, makes the conductive network in the resin more three-dimensional, and also significantly improves the thermal conductivity of the product.

[0046] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. An insulating and thermally conductive reinforced PC material, characterized in that, Includes the following quantities of raw materials: 33-57 parts of PC resin; 10-15 parts glass fiber 25-40 parts of thermally conductive filler; 0.5-1 part of modified interfacial solubilizer; The modified interface solubilizer is a mixed shell polymer nanoparticle, wherein the shell monomers include butyl acrylate and MAH-g-PE, and the core monomer is styrene.

2. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, The preparation process of the modified interface solubilizer includes: Step 1: Mix and dissolve butyl acrylate, MAH-g-PE and n-dodecyl mercaptan, then add emulsifier and deionized water, and stir to form a shell pre-emulsion; Step 2: Mix styrene, emulsifier and deionized water, and stir to form a core layer pre-emulsion; Step 3: Mix deionized water and NaHCO3 to adjust the pH to 7-8. Under nitrogen protection, add a portion of the core layer pre-emulsion and potassium persulfate aqueous solution dropwise and stir to form a seed emulsion. Then add the remaining core layer pre-emulsion and potassium persulfate aqueous solution dropwise. After that, add the shell layer pre-emulsion dropwise. The reaction allows MAH-g-PE to be grafted onto the core layer surface to obtain a core-shell polymer emulsion. Step 4: Adjust the pH of the core-shell polymer emulsion to 2-3, add anhydrous ethanol to break the emulsion, and then obtain the modified interface solubilizer after centrifugation, washing and drying.

3. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, Also includes: 8-12 parts toughening agent; Antioxidant 0.3-0.5 parts; 0.3-0.5 parts of lubricant.

4. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, The PC resin is at least one of aliphatic aromatic polycarbonates.

5. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, The thermally conductive filler is at least one of boron nitride, natural graphite, and talc powder with a high aspect ratio.

6. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, The toughening agent is at least one of polyethylene, methyl methacrylate-butadiene-styrene terpolymer, ethylene-methyl acrylate copolymer, and ethylene-butyl acrylate-glycidyl methacrylate.

7. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, The antioxidant is at least one of hindered phenolic antioxidants, thioester antioxidants, and phosphite antioxidants.

8. The insulating and thermally conductive enhanced PC material according to claim 1, characterized in that, The lubricant is selected from at least one of polyethylene wax, silicone masterbatch, lignite wax, and pentaerythritol stearate.

9. A method for preparing an insulating and thermally conductive enhanced PC material according to any one of claims 1-8, characterized in that, Includes the following steps: All raw materials except thermally conductive filler and glass fiber are added to a mixer under nitrogen protection and mixed evenly to obtain a mixture. The mixture is fed into a parallel twin-screw extruder for melting, and thermally conductive fillers and glass fibers are added through the side feed port. After extrusion and granulation, an insulating and thermally conductive reinforced PC material is obtained.

10. The use of the insulating and thermally conductive enhanced PC material according to any one of claims 1-8 as a raw material in the manufacture of electronic product casings.

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