ICT and FCT combined detection method

Abstract

The invention discloses an ICT and FCT combined detection method, belongs to the field of automatic assembly of household appliances, solves the problem of low detection efficiency in the prior art, and adopts the technical scheme that the method comprises the following steps: acquiring a PCBA (Printed Circuit Board Assembly) board identity label through a recognition device, and querying whether a database has a corresponding FCT test record or not; if yes, the ICT test is skipped, and the FCT test is directly carried out; if not, the ICT test is carried out firstly, the FCT test is carried out after the test is qualified, and if the test is unqualified, the test is directly shunted to a repair connection mechanism; the unqualified plates in the FCT test are sent to be repaired as well, and the test process is carried out again after the plates are repaired. By dynamically matching the test path, repeated or invalid tests are avoided as far as possible, efficient coordination of ICT and FCT resources is realized, and the overall detection efficiency is remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of automated assembly of household appliances, and in particular to a combined ICT and FCT testing method. Background Technology

[0002] In the field of existing PCBA automated testing technology, to improve testing efficiency and production cycle time, ICT (In-Circuit Test) and FCT (Functional Circuit Test) are usually integrated into the same testing system. For example, Chinese invention patent application CN108957286A discloses an ICT / FCT cascade testing method. When the test fails, manual intervention is required to remove the board and stop the machine, resulting in frequent production line interruptions and making it difficult to meet the needs of high-cycle continuous production. Furthermore, prior art document CN208833879U proposes a fully automated production line solution that achieves automatic sorting of NG boards and non-stop operation. However, this solution requires all PCBA boards, regardless of whether they have passed FCT testing, to undergo the entire ICT and FCT process sequentially, resulting in duplicate testing. Summary of the Invention

[0003] The objective of this invention is to provide a combined ICT and FCT detection method that solves the problem of low detection efficiency in existing technologies and improves detection efficiency.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an ICT and FCT combined detection method applied to a testing system, the testing system including ICT testing equipment, FCT testing equipment, identification device and database, the ICT and FCT combined detection method including S1: feeding the PCBA board into the testing system from the initial entrance of the main conveyor line, obtaining the PCBA board's identification identifier through the identification device, querying the database to see if there is an FCT test record corresponding to the PCBA board, if it exists, then proceed to S5, if it does not exist, then proceed to S2; S2: The ICT testing equipment performs ICT testing on the PCBA board and generates ICT test records. If the PCBA board passes the ICT test, it is sent to FCT and S6 is executed. If the PCBA board fails the ICT test, S3 is executed. S3: PCBA boards that fail ICT testing are directly sent to the rework connection mechanism without undergoing FCT testing; S4: Return the PCBA board for repair and execute S1; S5: After passing through the ICT testing station and skipping the ICT test, the PCBA board is transported to the FCT testing equipment and then S6 is executed; S6: Perform FCT test on the PCBA board and generate FCT test record. If the FCT test passes, proceed to S8; if the FCT test fails, proceed to S7. S7: Transport the PCBA board that fails the FCT test to the rework connection mechanism, rework the PCBA board, and execute S1; S8: Output the PCBA board that has passed the FCT test from the test system's output.

[0005] By adopting the above technical solution, the present invention has the following advantages: For PCBA boards that fail ICT or FCT tests, they are directly diverted to the rework stage through the rework connection mechanism without machine downtime or entry into subsequent testing processes. This minimizes the occupation of FCT equipment or other downstream resources by defective boards, significantly shortens the rework path, and reduces long-distance return to the FCT side or main conveyor line, thereby significantly reducing logistics cross-traffic, handling time, and potential board mixing risks. Simultaneously, the system obtains the PCBA board's identification identifier through an identification device and binds it to test records in the database, thereby dynamically matching a test path for each PCBA board. For PCBA boards with existing FCT test records, ICT testing is skipped directly at the entry point, reducing the ineffective occupation of ICT equipment and optimizing the allocation of test resources. Only FCT testing is performed, reducing redundant test steps and significantly shortening the test cycle of a single PCBA board. For PCBA boards undergoing initial testing or rework after failing ICT, they must pass ICT testing before entering the FCT process, balancing quality control and process efficiency.

[0006] Furthermore, the testing system includes multiple ICT testing stations, multiple FCT testing stations, and a transfer platform connecting the two. The transfer platform is equipped with a buffer. PCBA boards that have completed ICT testing and passed in S2, as well as FCT rework boards that skipped ICT testing in S5, are all transported to the buffer. The testing system monitors the status of each FCT testing station in real time and prioritizes allocating FCT rework boards in the buffer to idle FCT testing stations. Subsequently, it allocates PCBA boards that have passed ICT testing according to the scheduling strategy.

[0007] By adopting the aforementioned technical solution, multiple ICT testing stations and multiple FCT testing stations operate in parallel. Combined with the buffer of the transfer platform, this not only breaks the capacity bottleneck of single-station serial operation, but also minimizes the backlog of qualified ICT PCBA boards due to busy FCT testing stations through temporary storage and rhythm adjustment in the buffer. This ensures that the output of ICT testing stations is continuous and uninterrupted. If allocated in the conventional order, it would crowd out the FCT capacity that should be used for new qualified ICT boards, forcing ICT testing stations to be unable to unload boards after completing testing and have to stop and wait, ultimately leading to an imbalance in the overall line rhythm. By forcibly prioritizing the scheduling of FCT rework boards, they can be quickly cleared from the buffer, ensuring that FCT testing stations can immediately accept new qualified ICT boards after processing rework boards. This maintains the original supply and demand coordination between ICT testing stations and FCT testing stations, thereby ensuring the continuous operation of the main line and avoiding systemic blockages caused by rework.

[0008] Furthermore, for the PCBA boards that have passed the ICT test and are transported by S2 in the buffer, when the test system receives board retrieval requests from multiple FCT test stations, it allocates them according to the order of the board retrieval requests.

[0009] By adopting the aforementioned technical solution, firstly, the timing allocation rule is simple and clear, with high execution efficiency. It reduces complex algorithm judgments and can respond more quickly to the board retrieval needs of each FCT testing station, minimizing PCBA board allocation delays caused by cumbersome scheduling logic and ensuring the smooth flow of qualified products. Secondly, this rule ensures that each FCT testing station receives a fairer supply of PCBA boards, minimizing overcrowding or long-term idleness of a single station due to allocation bias, further consolidating the load balancing effect of the multi-station layout and maximizing the overall utilization rate of FCT equipment. At the same time, the timing allocation and FCT rework board priority rule do not conflict with each other. Priority ensures rapid closure of defective products, while timing fairness ensures efficient flow of qualified products, minimizing disorderly retention of qualified products due to rework board priority, and achieving fast processing of defective products and fast flow of qualified products.

[0010] Furthermore, for PCBA boards that have passed the ICT test and are transported by S2 in the buffer, when the test system receives board retrieval requests from multiple FCT test stations, it prioritizes the FCT test station with the shorter spatial path length to the buffer as the allocation target.

[0011] Through the above technical solutions, firstly, prioritizing shorter paths can minimize the transfer distance and time of PCBA boards from the buffer zone to the FCT testing station, reducing the ineffective time spent by PCBA boards during transfer and directly improving the turnover efficiency of a single PCBA board. Combined with the parallel layout of multiple workstations, this further increases the overall testing cycle time, perfectly adapting to the needs of high-cycle mass production. Secondly, shortening the transfer path can reduce the risk of secondary damage to PCBA boards during handling, such as vibration and bumps, especially protecting the precision components on the PCBA boards, reducing the generation of additional defective products due to transfer, and lowering production costs and rework losses.

[0012] Furthermore, for the PCBA boards that have passed the ICT test and are transported by S2 in the buffer, when the test system receives board retrieval requests from multiple FCT test stations, it calculates an allocation score P for each board retrieval request. The test system then prioritizes allocating the PCBA boards to the FCT test station with the highest allocation score P. Where T represents the waiting time for the board retrieval request, D represents the spatial path length between the corresponding FCT test station and the buffer, and α and β are preset coefficients.

[0013] Using the aforementioned technical solution, waiting time weighting Ensure that FCT testing stations with longer waiting times receive PCBA boards first, and minimize the waste of resources by keeping individual stations idle. Path distance should be weighted accordingly. This approach tends to allocate resources based on proximity, reducing transfer losses and process congestion. The combination of these two factors not only minimizes load imbalance caused by long waiting times at a single FCT testing station, but also shortens the transfer distance and time of PCBA boards, achieving the dual goals of load balancing and efficient transfer. This maximizes the overall utilization rate of FCT testing equipment and the flow efficiency of PCBA boards. At the same time, the preset coefficients α and β can be dynamically adjusted according to mass production scenarios. For example, increasing the weight of β to improve transfer speed under high-cycle demand, and increasing the weight of α to balance capacity when the workstation load is uneven, allows the scheduling rules to adapt to different production rhythms, site layouts, and testing needs, significantly improving the system's scenario adaptability.

[0014] Furthermore, the coefficients α and β are dynamically adjusted based on historical production line operation data. When the average waiting time of the FCT test station exceeds the threshold, the value of α is increased; otherwise, the value of α remains unchanged. When the average transfer distance between the FCT test station and the buffer exceeds the threshold, the value of β is increased; otherwise, the value of β remains unchanged.

[0015] Through the above technical solutions, the dynamic adjustment mechanism breaks the rigid limitations of fixed coefficients, allowing the allocation rules to be optimized in real time according to the actual operating status of the production line. By dynamically adjusting the coefficients α and β in the allocation score based on historical production line operating data, it minimizes deviations caused by subjective settings and can accurately match the production line status under different time periods and different capacity demands. For example, during peak production, the coefficients can be automatically adjusted through data feedback to balance efficiency and balance; during off-peak periods, the current basic configuration is maintained to reduce resource waste. This achieves adaptive optimization of the scheduling strategy. Increasing α strengthens the weight of waiting time in the allocation decision, enabling the system to prioritize the response of FCT test stations with long backlogs, quickly alleviating uneven load and equipment idleness problems, and minimizing bottlenecks in the entire production line caused by long waiting times at individual stations.

[0016] Furthermore, both the ICT test station and the FCT test station are equipped with a base fixed to the test equipment, a detachable needle bed body, and a quick-change plate fixed to the bottom of the needle bed body. The base is provided with vertically arranged interface needles, and the quick-change plate is provided with conductive interfaces corresponding to the interface needles. When the needle bed body is installed on the base, the quick-change plate docks with the base, so that the interface needles and the conductive interfaces form an electrical connection.

[0017] Through the above technical solution, the main body of the needle bed adopts a detachable design, combined with the standardized electrical connection structure of the quick-change board and the base. When it is necessary to switch the testing requirements of different PCBA board models, there is no need to disassemble the entire testing equipment or make complex adjustments. Only the corresponding needle bed main body needs to be replaced to complete the adaptation. This greatly shortens the downtime of product changeover and improves the production line's flexibility to adapt to multi-variety, small-batch production. Modular disassembly also makes the maintenance and repair of the needle bed main body more convenient. When the needle bed malfunctions or the needles are worn, the needle bed main body can be disassembled separately for repair or replacement without shutting down the entire testing station. This reduces the impact of equipment maintenance on the production line cycle time and lowers the operation and maintenance costs.

[0018] Furthermore, for the same type of PCBA board, the needle bed body used in the ICT test station and the needle bed body used in the FCT test station both have the same quick-change board.

[0019] Through the above technical solution, since the quick-change board is a standard electrical interface component, the standardization of the quick-change board allows the main body of the needle bed of ICT and FCT test stations to share the interface pin connection structure of the base. There is no need to design a base interface or quick-change board specification separately for the two tests. The same set of needle bed main body can be directly interchanged between ICT test equipment and FCT test equipment.

[0020] Furthermore, both the ICT testing equipment and the FCT testing equipment are equipped with positioning fixtures, which have at least two guide cone pins for engaging with corresponding positioning holes on the PCBA board. The cone angle of the guide cone pins is 30° to 60°.

[0021] Through the above technical solution, multiple guide cone pins form a reliable multi-point positioning reference. Combined with the conical surface structure, it can guide the PCBA board to quickly align, reduce the difficulty of loading, and improve the placement efficiency. At the same time, it can automatically correct slight placement deviations through the self-centering function, ensuring that the PCBA board and the test points of the needle bed are accurately aligned as much as possible, thereby avoiding missed tests and misjudgments as much as possible. Meanwhile, the conical surface structure can limit the displacement of the PCBA board during the test, resist the influence of vibration or needle bed pressure, and ensure the stability of electrical connection and the reliability of test data. If the cone angle of the guide pin is less than 30°, the cone surface is too gentle, resulting in an excessively large guide tolerance space and a significant weakening of the self-centering correction capability. This makes it difficult to effectively correct the placement deviation of the PCBA board, and positioning errors are likely to occur. At the same time, the locking force of the gentle cone surface is insufficient, and the PCBA board is prone to displacement due to vibration or pressure during the test, affecting the test stability. If the cone angle of the guide pin is greater than 60°, the cone surface is too steep, resulting in a short guide stroke and a very small tolerance space. It is difficult to quickly align the PCBA board with the positioning hole when loading it, significantly increasing the operation difficulty. It may even cause the PCBA board to jam or the positioning hole to collide and be damaged by the guide pin. The steep cone surface also reduces the contact area between the PCBA board and the guide pin, reducing positioning stability. Similarly, displacement deviations are likely to occur during the test, affecting the test accuracy. By limiting the cone angle of the guide pin to the range of 30° to 60°, it has sufficient guiding tolerance space to guide the PCBA board to align more quickly and smoothly, reducing loading difficulty and operation error rate; it also has strong self-centering correction capability, which can accurately correct slight placement deviations and ensure positioning accuracy; at the same time, the appropriate cone angle can provide stable locking force, preventing PCBA board displacement during testing as much as possible and ensuring testing stability.

[0022] Furthermore, the rework connection mechanism includes an ICT rework connection mechanism and an FCT rework connection mechanism. The ICT rework connection mechanism is located in the vicinity of the ICT test equipment, and the FCT rework connection mechanism is located in the vicinity of the FCT test equipment.

[0023] Through the above technical solutions, PCBA boards that fail the ICT test can be sent directly to the ICT rework area nearby, avoiding long-distance return to the FCT side or the main conveyor line as much as possible, and reducing logistics crossover and handling time. Similarly, PCBA boards that fail in the FCT stage can also be quickly transferred to the nearby FCT rework area without having to detour or wait for a unified rework channel, significantly shortening the rework response cycle. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a flowchart of the combined ICT and FCT detection method in this invention; Figure 2 This is a schematic diagram of the combined ICT and FCT testing system of the present invention; Figure 3 This is a cross-sectional view of the combined ICT and FCT testing system of the present invention; Figure 4 This is an operational diagram of the combined ICT and FCT testing system of this invention; Figure 5 This is a partial structural diagram of the ICT testing equipment in this invention; Figure 6 This is a cross-sectional view of the ICT testing equipment in this invention; Figure 7 This is a cross-sectional view of the ICT testing equipment in this invention from another perspective; In the diagram, 10 is the identification device; 20 is the initial entrance; 21 is the ICT testing station; 211 is the ICT testing equipment; 22 is the FCT testing station; 221 is the FCT testing equipment; 23 is the base; 24 is the needle bed body; 25 is the quick-change plate; 26 is the status light; 27 is the display screen; 28 is the exit; 29 is the guide cone; 31 is the ICT rework connection mechanism; 32 is the FCT rework connection mechanism; 40 is the transfer platform; and 41 is the buffer zone. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0026] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein.

[0027] It should be understood that in the various embodiments of the present invention, the number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0028] It should be understood that in this invention, "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0029] It should be understood that in this invention, "multiple" refers to two or more. "And / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, X and / or Y can represent: X alone, X and Y simultaneously, or Y alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "Contains X, Y, and Z", "Contains X, Y, and Z" means that all three X, Y, and Z are contained; "Contains X, Y, or Z" means that one of X, Y, and Z is contained; "Contains X, Y, and / or Z" means that any one, two, or three of X, Y, and Z are contained.

[0030] The technical solution of the present invention will be described in detail below with reference to specific embodiments. The following specific embodiments may be combined or substituted with each other according to the actual situation, and the same or similar concepts or processes may not be described again in some embodiments.

[0031] like Figures 1 to 7 As shown, the present invention provides an ICT and FCT combined testing method applied to a testing system. The testing system includes an ICT testing device 211, an FCT testing device 221, an identification device 10, and a database. The ICT and FCT combined testing method includes S1: feeding the PCBA board into the testing system from the initial entry 20 of the main conveyor line, obtaining the PCBA board's identification identifier through the identification device 10, and querying the database to see if there is an FCT test record corresponding to the PCBA board. If it exists, proceed to S5; otherwise, proceed to S2. S2: ICT test equipment 211 performs ICT test on PCBA board and generates ICT test record. If PCBA board passes ICT test, it is sent to FCT and S6 is executed. If PCBA board fails ICT test, S3 is executed. S3: PCBA boards that fail ICT testing are directly sent to the rework connection mechanism without undergoing FCT testing; S4: Return the PCBA board for repair and execute S1; S5: After passing through the ICT testing station 21 and skipping the ICT test, the PCBA board is transported to the FCT testing equipment 221 and then S6 is executed; S6: Perform FCT test on PCBA board and generate FCT test record. If FCT test passes, proceed to S8; if FCT test fails, proceed to S7. S7: Transport the PCBA board that fails the FCT test to the rework connection mechanism, rework the PCBA board, and execute S1; S8: Output the PCBA board that has passed the FCT test from the test system's output 28.

[0032] For PCBA boards that fail ICT or FCT tests, they are directly diverted to the rework stage via the rework connection mechanism without downtime or subsequent testing. This minimizes the use of FCT equipment or other downstream resources by defective boards, significantly shortens the rework path, and reduces long-distance return to the FCT side or main conveyor line, thereby reducing logistics cross-traffic, handling time, and potential board mixing risks. Simultaneously, the system uses identification device 10 to obtain the PCBA board's identity and binds it to test records in the database. This dynamically matches a test path for each PCBA board. For PCBA boards with existing FCT test records, ICT testing is skipped at the entry point, reducing unnecessary use of ICT equipment and optimizing the allocation of test resources. Only FCT testing is performed, reducing redundant testing steps and significantly shortening the testing cycle for a single PCBA board. For PCBA boards undergoing initial testing or rework after failing ICT, they must pass ICT testing before entering the FCT process, balancing quality control and process efficiency.

[0033] It should be noted that each PCBA board has a unique QR code containing its identification ID information. After ICT and FCT testing are completed, the testing system writes the corresponding test results into this QR code, including test status, timestamp, and maintenance record. All test records, in addition to being written into the QR code, are also simultaneously stored in the backend database, forming a two-way binding between physical components and digital information. This enables on-board storage of test data, supporting not only intelligent scheduling and closed-loop rework but also complete production traceability: from single-board identification, test results of each process, rework history to final shipment status, everything can be quickly traced back via QR code or database, meeting multi-dimensional needs such as quality control, problem analysis, and customer auditing, significantly improving the transparency and reliability of the manufacturing process. When a PCBA board enters the testing system from the initial entrance 20 of the main conveyor line, the identification device 10 automatically scans the QR code on its surface, obtains the board's unique ID in real time, and uploads this ID to the control center. The control center then queries the backend database to determine if an FCT test record corresponding to this ID exists. If an FCT test record exists, it indicates that the board has been retested after repair or has already completed FCT testing. The system will skip ICT testing and directly send it to FCT testing equipment 221 to execute subsequent processes. If no FCT test record exists, it is determined that the board is either going online for the first time or has only completed ICT repair. ICT testing must be performed first to ensure that the basic hardware quality is up to standard before proceeding to the FCT testing stage.

[0034] It should be noted that the PCBA boards described in this application are mainly used in the control units of garment processing equipment, such as household or commercial smart home appliances like washing machines and dryers. These devices have high requirements for the reliability, functional integrity, and production consistency of the control boards, and often face the challenge of testing multiple varieties in small batches due to diverse product models and frequent updates. The ICT and FCT combined testing method provided in this application is specifically designed for such application scenarios. While ensuring high test coverage, it effectively improves production line flexibility and testing efficiency, meeting the comprehensive needs of garment processing equipment manufacturing for high-quality, high-speed, and traceable PCBA production. In subsequent quality analysis, after-sales maintenance, or customer audits, scanning the QR code on any PCBA board allows for quick tracing of its entire manufacturing and testing history, accurately locating problem areas, and significantly improving the overall quality control capabilities and supply chain transparency of garment processing equipment.

[0035] In actual PCBA automated testing production lines, multiple ICT testing stations 21 and multiple FCT testing stations 22 are typically configured to achieve parallel processing. However, in existing technologies, despite the multi-station structure, the connection between ICT testing stations 21 and FCT testing stations 22 still relies on simple buffering or direct connection transport, lacking a differentiated scheduling mechanism for different types of boards. When FCT testing station 22 is too busy to receive new boards in time, qualified PCBA boards that have completed ICT testing will accumulate downstream, forcing... The upstream ICT testing station 21 suspends output, causing congestion in the front end and imbalance in the cycle time of the back end. More seriously, when PCBA boards that fail FCT testing and are repaired re-enter the system, if they are mixed with new PCBA boards that pass ICT testing in the same buffer 41 and assigned to FCT testing station 22 in a first-in-first-out or random order, the insertion of repaired boards will crowd out the FCT capacity that should be used for new boards on the main line, resulting in continuous backlog or even shutdown on the ICT testing station 21 side. This causes the efficiency gains brought by multi-station parallel operation to be offset by the interference of the repair flow. Therefore, in this application, a transfer platform 40 is set up between the ICT test station 21 and the FCT test station 22, and a buffer 41 is configured on it to temporarily store two types of boards: one type is the PCBA board that has completed the ICT test and passed in S2, and the other type is the FCT rework board that skipped the ICT test in S5. This not only breaks the production capacity bottleneck of single station serial, but also avoids the ICT qualified PCBA board from being stuck due to the busy FCT test station through the temporary storage and rhythm adjustment of the buffer 41, thereby ensuring that the ICT test station continues to output without interruption. The testing system monitors the status of each FCT test station 22 in real time and forces the FCT rework boards in the buffer 41 to be sent to the idle FCT test station first during allocation. It can quickly clear them out of the buffer 41, ensuring that the FCT test station can immediately accept new qualified ICT boards after processing the rework boards. After the rework boards are processed, the PCBA boards that have passed the ICT test are allocated according to the preset scheduling strategy, maintaining the original supply and demand coordination relationship between the ICT test station 21 and the FCT test station 22, thereby ensuring the continuous operation of the main line and avoiding system blockage caused by rework as much as possible.

[0036] In existing PCBA automated testing systems, when multiple FCT test stations 22 are configured, PCBA boards that have passed ICT testing in the buffer 41 are typically distributed using a fixed path allocation or round-robin scheduling strategy. For example, boards are sent to the first FCT test station, the second FCT test station, etc., in a preset order, or they are always preferentially allocated to the FCT test station with the closest physical location. When the processing speed of an FCT test station slows down due to the complexity of test items, equipment failure, or debugging, the fixed allocation logic will continue to send boards to it, resulting in severe backlog in front of that station, while other idle FCT test stations have no boards to test, causing uneven utilization of resources across multiple stations. At the same time, because the allocation logic is out of sync with the actual timing of board retrieval requests, the idle station that sends the board retrieval signal first may wait for a long time because it has not been polled, while the station that sends the request later gets the board first, further exacerbating the scheduling imbalance. Therefore, in this application, for PCBA boards that have passed the ICT test and are transported by S2 in buffer 41, when the test system receives board retrieval requests from multiple FCT test stations 22, it calculates an allocation score P for each board retrieval request, and the test system preferentially allocates the PCBA boards to the FCT test station 22 with the highest allocation score P. Where T represents the waiting time for the board retrieval request, D represents the spatial path length between the corresponding FCT test station 22 and buffer 41, and α and β are preset coefficients. Waiting time weight Ensure that FCT testing stations with longer waiting times receive PCBA boards first, and minimize the waste of resources by keeping individual stations idle. Path distance should be weighted accordingly. This approach tends to allocate tasks based on proximity, shortening transport distances and reducing transfer time and mechanical wear. The synergistic effect of these two approaches ensures a basic balance of load across multiple FCT testing stations while minimizing time spent on non-testing tasks, achieving efficient collaboration where those who are capable do more and those who are closer get priority.

[0037] Furthermore, to minimize scheduling rigidity caused by fixed coefficients in different production scenarios, this application introduces an independent dynamic parameter adjustment mechanism based on historical production line operation data: the testing system continuously collects historical board retrieval request waiting time and actual transfer path execution data for each FCT test station 22, and independently judges and adjusts α and β accordingly. Specifically, when the system detects that the average waiting time of all FCT test stations 22 exceeds a preset threshold (e.g., 15 seconds) for multiple consecutive cycles, it determines that there is a risk of load imbalance. At this time, only the α value is increased (e.g., from 1.0 to 1.3) to strengthen the role of waiting time in the scoring. The weighting of parameters prioritizes the allocation of workstations with backlogs, while the β value remains constant to ensure that path efficiency is not affected. Conversely, if the system detects a significant increase in average transfer distance (e.g., exceeding the baseline value by 20%) and increased handling time due to equipment layout adjustments, robotic arm path congestion, or maintenance, only the β value is increased (e.g., from 0.8 to 1.1) to strengthen the preference for nearby allocation and shorten physical flow time. In this case, the α value remains unchanged to avoid unnecessary disturbances to the load balancing logic. α and β are only adjusted synchronously when both waiting time and transfer distance exceed their respective preset thresholds. This mechanism ensures that each parameter change targets a single bottleneck factor, minimizing scheduling oscillations caused by multi-variable coupling, and enabling the allocation strategy to accurately respond to dynamic changes in the production line while maintaining sufficient stability. Thus, in complex production environments with high rework rates, high line mixing, or fluctuating cycle times, the testing system can automatically achieve a better balance between load balancing and transfer efficiency: during peak production periods, β can be appropriately increased through data feedback to accelerate flow; during periods of speed reduction or debugging at some workstations, α is automatically enhanced to prevent bottlenecks as much as possible; and during stable operation, the basic parameter configuration is maintained to reduce unnecessary control intervention. This not only significantly improves the overall utilization rate of the FCT testing equipment 221 and the flow efficiency of PCBA boards, but also enhances the testing system's adaptability to different product types, site layouts, and production capacity requirements, truly realizing the intelligent, flexible, and highly reliable operation of the multi-workstation parallel testing system.

[0038] In existing PCBA automated testing systems, the rework process typically employs a single rework docking point or a centralized rework area. Regardless of whether the PCBA board is deemed unqualified at the ICT or FCT stage, it must exit through the same channel and be sent to a unified rework area far from the testing station. This design means that boards failing ICT testing must traverse the FCT area and even the main conveyor line to reach the rework point, while boards failing at the FCT stage may queue due to congestion in the rework channel. This not only significantly increases handling distance and time but also easily leads to overlapping logistics paths, mixed boards, and scheduling conflicts, especially... In high-cycle production lines, rework flow and main flow interfere with each other, severely restricting the efficiency of the entire line. Therefore, in this application, the rework connection mechanism is clearly divided into ICT rework connection mechanism 31 and FCT rework connection mechanism 32, and respectively set in the adjacent areas of ICT test equipment 211 and FCT test equipment 221: when the PCBA board is judged to be unqualified by ICT test in S3, the test system immediately diverts it to the adjacent ICT rework connection mechanism 31; when the board is judged to be unqualified by FCT test in S7, it is directly sent to the adjacent FCT rework connection mechanism 32. This layout physically separates the two types of rework boards at their source. The ICT rework area can focus on repairing hardware defects such as soldering and components, while the FCT rework area focuses on handling non-hardware issues such as software burning and functional debugging, improving the professionalism and efficiency of rework. At the same time, nearby rework significantly shortens the exit path of PCBA boards that fail the test, avoiding them from crossing the main process area as much as possible, effectively reducing logistics interference with other boards and empty travel of the handling mechanism.

[0039] In existing PCBA testing systems, ICT and FCT test stations 22 typically adopt an integrated needle bed structure, where the needle bed body 24 is fixedly connected to the test equipment base 23, and the electrical interface is hard-wired through internal cables or terminal blocks. When switching between different PCBA models, the entire needle bed needs to be disassembled, rewired, and hundreds of test points calibrated, a process that can take several hours. Therefore, in this application, both the ICT test station 21 and the FCT test station 22 are equipped with a base 23 fixed to the test equipment, a detachable needle bed body 24, and a quick-change plate 25 fixed to the bottom of the needle bed body 24. The base 23 has vertically arranged interface needles, and the quick-change plate 25 has conductive interfaces corresponding to the interface needles. When the needle bed body 24 is installed on the base 23, the quick-change plate 25 docks with the base 23, so that the interface needles and conductive interfaces form an electrical connection. The needle bed body 24 adopts a detachable design, and with the standardized electrical connection structure of the quick-change plate 25 and the base 23, when it is necessary to switch the testing requirements of different PCBA board models, there is no need to disassemble the entire testing equipment or make complex adjustments. Only the corresponding needle bed body 24 needs to be replaced to complete the adaptation. This greatly shortens the downtime of product changeover and improves the production line's flexibility to adapt to multi-variety, small-batch production. Modular disassembly also makes the maintenance and repair of the needle bed body 24 more convenient. When the needle bed malfunctions or the needle pins are worn, the needle bed body 24 can be disassembled separately for repair or replacement without shutting down the entire testing station. This reduces the impact of equipment maintenance on the production line cycle time and lowers the operation and maintenance costs.

[0040] Furthermore, since the quick-change board 25 is consistent as an electrical interface standard component, for the same model of PCBA board, the needle bed body 24 used in the ICT test station 21 and the needle bed body 24 used in the FCT test station 22 both have the same quick-change board 25. The standardization of the quick-change board 25 allows the needle bed body 24 of the ICT and FCT test stations to share the interface pin connection structure of the base 23, without the need to design the base 23 interface or quick-change board 25 specification separately for the two tests. The same set of needle bed body 24 can be directly interchanged between ICT and FCT equipment.

[0041] In automated PCBA testing, to ensure accurate contact between the bed-of-needle probes and the test points on the board, reliable positioning of the PCBA board is necessary to minimize poor contact, misjudgment, or component damage caused by placement deviations or board deformation. For this purpose, both the ICT test equipment 211 and the FCT test equipment 221 are equipped with positioning fixtures, which have guide pins 29 for engaging with corresponding positioning holes on the PCBA board.

[0042] If the cone angle of the guide pin 29 is less than 30°, the cone surface is too gentle, resulting in an excessively large guide tolerance space and a significant weakening of the self-centering correction capability. This makes it difficult to effectively correct the placement deviation of the PCBA board and easily leads to mispositioning. At the same time, the locking force of the gentle cone surface is insufficient, and the PCBA board is prone to displacement due to vibration or pressure during the test, affecting the test stability. If the cone angle of the guide pin 29 is greater than 60°, the cone surface is too steep, resulting in a short guide stroke and a very small tolerance space. It is difficult to quickly align the PCBA board with the positioning hole when loading it, significantly increasing the difficulty of operation. It may even cause the PCBA board to jam or the positioning hole to collide and be damaged with the guide pin 29. The steep cone surface will also reduce the contact area between the PCBA board and the guide pin 29, reducing the positioning stability and making it easy for displacement deviation to occur during the test, which also affects the test accuracy. Therefore, in this application, the cone angle of the guide cone pin 29 is 30° to 60°, which not only has sufficient guiding tolerance space to guide the PCBA board to align more quickly and smoothly, reducing the difficulty of loading and the rate of operational errors, but also has a strong self-centering correction capability, which can accurately correct slight placement deviations and ensure positioning accuracy; at the same time, the appropriate cone angle can provide stable locking force, preventing the PCBA board from shifting during the test as much as possible, ensuring stable electrical connection and reliable test data.

[0043] Furthermore, at least two guide cone pins 29 are provided, and multiple guide cone pins 29 cooperate with corresponding positioning holes on the PCBA board to form a reliable multi-point positioning reference. This structure, combined with the aforementioned 30° to 60° conical surface design, can not only guide the PCBA board to quickly align during the loading process, reducing the difficulty of operation and improving placement efficiency, but also automatically correct slight positional deviations through the self-centering effect of the conical surface, ensuring precise contact between the PCBA board and the bed of needles test points, effectively reducing the risk of missed tests or misjudgments. At the same time, during the testing process, the multi-point constraint and the conical surface contact work together to effectively limit the displacement of the PCBA board caused by vibration or pressure under the bed of needles, ensuring the stability of electrical connections and the reliability of test data.

[0044] In one embodiment, the positioning fixture is equipped with two guide cone pins 29, each with a cone angle of 45°. These pins are located at the positioning holes at opposite corners of the PCBA board, forming a two-point positioning reference, which is sufficient to meet the stability constraint requirements of conventional board types. In scenarios requiring higher positioning accuracy, three or more guide cone pins 29 can be used to further improve repeatability positioning accuracy.

[0045] It should be noted that ICT testing mainly tests the PCBA for open circuits, short circuits, and the soldering condition of all components. It can be divided into open circuit testing, short circuit testing, resistance testing, capacitor testing, diode testing, transistor testing, MOSFET testing, IC pin testing, and other general and special component testing for missing, incorrect, or parameter value deviations of components, solder joint bridging, and open / short circuits on the circuit board. It accurately tells the user which component or point of the open / short circuit is faulty. ICT testing needs to have SPC (Statistical Process Control), data statistics, pass rate, and test time functions. The ICT testing equipment 211 is equipped with a status light 26 with a buzzer and a display screen 27. When the ICT testing equipment 211 detects a defective PCBA board, the yellow light will be constantly lit. When the PCBA passes the test, the green light will be constantly lit. When the ICT testing equipment 211 experiences an operational fault, the red light will flash, the buzzer will emit a "beep-beep-beep" sound, and the display screen 27 will display abnormal information in red scrolling text, indicating the location of the abnormality and the solution.

[0046] The primary purpose of FCT testing is to identify poorly assembled PCBA boards. By simulating the full-function testing of the circuit board when it is assembled into a complete machine, it detects any potentially defective circuit boards before the final assembly. Using pre-defined test points on the quick-change board 25, interface pins are used to connect the signals for complete functional testing. During testing, the PCBA board is moved to the FCT testing station, and then a mechanical action pushes out the interface pins to contact the test points on the PCBA board under test. This simulates the board being connected to the complete machine, allowing for simulated functional testing. The main tests include main wash valve, pre-wash valve, hot water valve, drain pump, electric heating, inverter power supply testing, button and knob encoder testing, door lock testing, SN code testing, digital tube display, light brightness detection, water temperature and water level frequency testing, buzzer testing, version number verification (communication testing), stamping (engraving) of successful tests, and 24V, 12V, 5V, and 3.3V voltage testing. The FCT test equipment 221 is equipped with the same three-color indicator light with a buzzer and display screen 27 as the ICT test equipment 211, which is used to display the test status, result prompts and abnormal alarms in real time. Its structure and function have been described in the previous section on the ICT test equipment 211, so they will not be repeated here.

[0047] It should be noted that in this application, there is an initial entrance 20 of a main conveyor line, which is equipped with an identification device 10. Downstream of the initial entrance 20, there are two parallel ICT test stations 21, each equipped with a separate ICT test device 211. The initial entrance 20 is connected to one of the ICT test stations 21, and the other ICT test station 21 is connected to an ICT rework connection mechanism 31. Downstream of the two ICT test stations 21, there are two parallel FCT test stations 22, each equipped with a separate FCT test device 221. The two ICT test stations 21 and the two FCT test stations 22 are connected by a transfer platform 40. Downstream of the two FCT test stations 22, there are also two FCT test stations 22 connected by the transfer platform 40. The two downstream FCT test stations 22 are respectively connected to the FCT rework connection mechanism 32 and the outlet 28 of the test system. A single arrow indicates the flow of PCBA boards that have passed ICT and FCT tests, a double arrow indicates the flow of PCBA boards that have failed ICT tests, and a triple arrow indicates the flow of PCBA boards that have failed FCT tests. PCBA boards that have been returned for ICT testing are placed in from the initial entrance 20 and enter the ICT testing station 21. PCBA boards that have been returned for FCT testing are placed in from the initial entrance 20. At this time, ICT is passed directly through the PCBA board, and the PCBA board passes directly through the ICT testing station without undergoing ICT testing, and flows directly to the FCT testing station for testing.

[0048] Understandably, in other embodiments, for PCBA boards that have passed the ICT test and are transported by S2 in the buffer, when the test system receives board retrieval requests from multiple FCT test stations, it allocates the boards only according to the order of the board retrieval requests. That is, the FCT test station that completes the current test and issues a board retrieval request first will get the next qualified board first. The timing allocation rules are simple, clear, and highly efficient, reducing complex algorithm judgments and enabling faster response to the board retrieval needs of each FCT testing station. This minimizes PCBA board allocation delays caused by cumbersome scheduling logic and ensures smooth flow of qualified products. Secondly, these rules ensure a fairer supply of PCBA boards to each FCT testing station, preventing overcrowding or prolonged idleness at a single station due to allocation bias. This further strengthens the load balancing effect of the multi-station layout and maximizes the overall utilization of FCT equipment. Simultaneously, the timing allocation and FCT rework board priority rules do not conflict. Priority ensures rapid closure of defective products while ensuring efficient flow of qualified products through timing fairness. This minimizes disorderly delays of qualified products due to rework board priority, achieving rapid processing of defective products and rapid flow of qualified products.

[0049] Understandably, in other embodiments, when the test system receives board retrieval requests from multiple FCT test stations for PCBA boards that have passed ICT testing and are transported by S2 in the buffer, it prioritizes the FCT test station with the shorter spatial path length to the buffer as the allocation target. Based on the actual layout geometry, it makes dynamic decisions to minimize the transfer distance, thereby significantly shortening the physical movement time of the board from the buffer to the test station, reducing time loss in non-testing stages, and effectively improving the single-board turnover speed and the board receiving response efficiency of the FCT test station. Secondly, shortening the transfer path can reduce the risk of secondary damage such as vibration and bumps to the PCBA board during the handling process, especially protecting the precision components on the PCBA board, reducing the generation of additional defective products due to transfer, and reducing production costs and rework losses.

[0050] In addition to the preferred embodiments described above, the present invention has other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection claimed by the present invention.

Claims

1. An ICT and FCT combined detection method applied to a test system, the test system comprising an ICT test device, an FCT test device, an identification device and a database, characterized in that, The ICT and FCT combined detection method comprises S1: sending a PCBA board from an initial inlet of a main conveying line into a test system, acquiring an identity of the PCBA board through an identification device, inquiring whether there is an FCT test record corresponding to the PCBA board in a database, executing S5 if there is, and executing S2 if there is not; S2: performing ICT test on the PCBA board by an ICT test device and generating an ICT test record, conveying the PCBA board to a FCT test device after the PCBA board passes the ICT test, and executing S6 if the PCBA board does not pass the ICT test; S3: conveying the PCBA board that does not pass the ICT test directly to a repair connection mechanism without FCT test; S4: repairing the PCBA board and executing S1; S5: conveying the PCBA board to the FCT test device after the PCBA board passes the ICT test and skips the ICT test, and executing S6; S6: performing FCT test on the PCBA board and generating an FCT test record, executing S8 if the FCT test passes, and executing S7 if the FCT test does not pass; S7: conveying the PCBA board that does not pass the FCT test to the repair connection mechanism, repairing the PCBA board, and executing S1; S8: outputting the PCBA board that passes the FCT test from an outlet of the test system.

2. The ICT and FCT combined detection method according to claim 1, characterized in that, The test system comprises a plurality of ICT test stations, a plurality of FCT test stations and a transfer platform connected between the ICT test stations and the FCT test stations, wherein the transfer platform is provided with a buffer area, the PCBA board that passes the ICT test in S2 and the FCT repair board that skips the ICT test in S5 are both conveyed to the buffer area, the test system monitors the state of each FCT test station in real time, and the FCT repair board in the buffer area is preferentially distributed to an idle FCT test station, and then the PCBA board that passes the ICT test is distributed according to a scheduling strategy.

3. The ICT and FCT combined detection method according to claim 2, characterized in that, For the PCBA board that passes the ICT test conveyed in the buffer area in S2, the test system distributes the PCBA board according to the time sequence of the plate taking request when receiving the plate taking request from the plurality of FCT test stations.

4. The ICT and FCT combined detection method according to claim 2, wherein, For the PCBA board that passes the ICT test conveyed in the buffer area in S2, the test system preferentially selects the FCT test station with a shorter space path length between the buffer area as a distribution target when receiving the plate taking request from the plurality of FCT test stations.

5. The ICT and FCT combined detection method according to claim 2, wherein, For the PCBA board in the buffer zone which passes the ICT test delivered by S2, when the test system receives the take board request sent by the plurality of FCT test stations, the test system calculates the distribution score P for each take board request, and the test system preferentially distributes the PCBA board to the FCT test station with the highest distribution score P: Wherein T represents the waiting time length of the take board request, D represents the space path length between the corresponding FCT test station and the buffer zone, and α and β are preset coefficients.

6. The ICT and FCT combined detection method according to claim 5, wherein, The coefficients α and β are dynamically adjusted according to the historical operation data of the production line, the value of α is increased when it is monitored that the average waiting time of the FCT test station exceeds a threshold value, otherwise the value of α remains unchanged, the value of β is increased when it is monitored that the average transfer distance between the FCT test station and the buffer area exceeds a threshold value, otherwise the value of β remains unchanged.

7. The ICT and FCT combined detection method according to claim 1, wherein, The ICT test station and the FCT test station are both provided with a base fixed on a test device, a detachable needle bed body and a quick-change plate fixed on the bottom of the needle bed body, the base is provided with interface needles arranged vertically, the quick-change plate is provided with conductive interfaces corresponding to the interface needles, when the needle bed body is installed on the base, the quick-change plate is docked with the base to make the interface needles and the conductive interfaces form electrical connection.

8. The ICT and FCT combined detection method according to claim 7, characterized in that, For the same model of PCBA board, the needle bed body used by the ICT test station and the needle bed body used by the FCT test station both have the same quick-change plate.

9. The ICT and FCT combined detection method according to claim 1, wherein, The ICT test device and the FCT test device are both provided with a positioning tool, the positioning tool is provided with at least two guide taper pins for cooperating with corresponding positioning holes on the PCBA board, the taper angle of the guide taper pins is 30°-60°.

10. The ICT and FCT combined detection method according to claim 1, wherein, The repair docking mechanism includes an ICT repair docking mechanism and an FCT repair docking mechanism, the ICT repair docking mechanism is arranged in the adjacent area of the ICT test device, and the FCT repair docking mechanism is arranged in the adjacent area of the FCT test device.

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