Circuit breaking module, preparation method of circuit breaking module, circuit board assembly and battery

Abstract

The invention provides a circuit breaking module, a preparation method of the circuit breaking module, a circuit board assembly and a battery. The circuit breaking module provided by the invention comprises a deformation body, a first electric connecting piece and a second electric connecting piece, the deformation body comprises a conductor layer and a first shape memory polymer layer which are stacked, and the deformation body has a first form and a second form; the first end of the deformation body is fixedly connected with the first electric connecting piece, the second end of the deformation body is fixedly connected with the second electric connecting piece, and the first electric connecting piece and the second electric connecting piece are electrically connected with the conductor layer; under the condition that the temperature of the deformation body is increased to be larger than or equal to a preset threshold value from being smaller than the preset threshold value, the first shape memory polymer layer enables the deformation body to be deformed into a second shape from a first shape, and at least one of the first electric connecting piece and the second electric connecting piece is displaced; therefore, the distance between the first electric connecting piece and the second electric connecting piece is changed.

Description

Technical Field

[0001] This application relates to the field of circuit breaker technology, and in particular to a circuit breaker module, a method for manufacturing the circuit breaker module, a circuit board assembly, and a battery. Background Technology

[0002] A circuit breaker module is a protective device used in circuit systems. In related technologies, a circuit breaker module typically includes a fuse. When the current in a circuit equipped with a circuit breaker module is too high, the fuse generates a significant amount of heat. This causes the fuse to rapidly reach its melting point, resulting in it melting and automatically cutting off the circuit, thus providing protection. However, a problem with circuit breaker modules in related technologies is that after a circuit is broken, it cannot automatically restore the circuit to a continuous state. Summary of the Invention

[0003] This invention provides a circuit breaker module, a method for preparing the circuit breaker module, a circuit board assembly, and a battery to solve the problem in related technologies that a circuit breaker module cannot automatically restore itself to a connected state after a circuit break.

[0004] To solve the above-mentioned technical problems, the present invention is implemented as follows: In a first aspect, embodiments of the present invention provide a circuit breaker module.

[0005] The circuit-breaking module provided in this embodiment of the invention includes: a deformable body, a first electrical connector, and a second electrical connector; the deformable body includes a stacked conductor layer and a first shape memory polymer layer, and the deformable body has a first shape and a second shape; a first end of the deformable body is fixedly connected to the first electrical connector, and a second end of the deformable body is fixedly connected to the second electrical connector; the first electrical connector and the second electrical connector are respectively electrically connected to the conductor layer; when the deformable body is in the first shape, there is a gap between the first electrical connector and the second electrical connector; when the temperature of the deformable body increases from less than a preset threshold to greater than or equal to a preset threshold, the first shape memory polymer layer causes the deformable body to deform from the first shape to the second shape, and at least one of the first electrical connector and the second electrical connector is displaced to change the distance between the first electrical connector and the second electrical connector.

[0006] In some embodiments, the deformable body has a plurality of bends, which are arranged and connected sequentially in the direction from the first electrical connector to the second electrical connector, so that the deformable body is wavy.

[0007] In some embodiments, the deformation variant further includes a second shape memory polymer layer, wherein the second shape memory polymer layer and the first shape memory polymer layer are stacked on opposite sides of the conductor layer.

[0008] In some embodiments, one of the second electrical connector and the second end of the deformed part has a protrusion and the other has a groove, the protrusion being fitted into the groove.

[0009] In some embodiments, a welded portion is provided between the protrusion and the groove; or, a connecting adhesive is provided between the protrusion and the groove.

[0010] In some embodiments, the second electrical connector has a protrusion, and the second end of the deformed part has a groove, the groove opening being located on the end face of the second end of the deformed part.

[0011] Secondly, embodiments of the present invention provide a method for preparing a circuit breaker module.

[0012] The method for preparing a circuit breaker module provided in this embodiment of the invention is used to prepare any type of circuit breaker module provided in this embodiment of the invention. The method for preparing a circuit breaker module provided in this embodiment of the invention includes: stacking a conductor layer and a first shape memory polymer layer sequentially; placing the stacked conductor layer and the first shape memory polymer layer in a lamination mold; laminating and shaping the stacked conductor layer and the first shape memory polymer layer to form a deformable shape; fixing a first electrical connector to a first end of the deformable shape, so that the first electrical connector is electrically connected to the conductor layer of the deformable shape; and fixing a second electrical connector to a second end of the deformable shape, so that the second electrical connector is electrically connected to the conductor layer of the deformable shape.

[0013] In some embodiments, the method for preparing the circuit breaker module further includes: performing plasma treatment on the surface of the conductor layer to be bonded before sequentially stacking the conductor layer and the first shape memory polymer layer, and coating the surface to be bonded after plasma treatment with a coupling agent; sequentially stacking the conductor layer and the first shape memory polymer layer includes stacking the conductor layer and the first shape memory polymer layer sequentially such that the side of the conductor layer with the coupling agent faces the first shape memory polymer layer.

[0014] In some embodiments, the cavity of the laminating mold is wavy.

[0015] Thirdly, embodiments of the present invention provide a circuit board assembly.

[0016] The circuit board assembly provided in this embodiment of the invention includes: a substrate and any one of the circuit breaking modules provided in this embodiment of the invention; the circuit breaking module is disposed on the substrate.

[0017] In some embodiments, the substrate is provided with a first conductive portion and a second conductive portion; a first electrical connector is fixedly connected to and electrically connected to the first conductive portion; when the temperature of the deformed part is less than a preset threshold, the second electrical connector is in conductive contact with the second conductive portion; when the temperature of the deformed part is greater than or equal to the preset threshold, the second electrical connector is separated from the second conductive portion.

[0018] In some embodiments, the top surface of the second conductive portion includes a conductive contact surface and a sliding guide surface connected together; the conductive contact surface protrudes from the top surface of the substrate and is used to make conductive contact with the second electrical connector; the sliding guide surface includes a first side and a second side opposite to each other, the first side is disposed on the side of the second side facing the first conductive portion, the first side is connected to the top surface of the substrate, the second side is connected to the conductive contact surface, and the sliding guide surface is used to guide the second electrical connector to move between a first position and a second position, wherein the first position is located on the top surface of the substrate and on the side of the sliding guide surface facing the first conductive portion, and the second position is located on the conductive contact surface.

[0019] In some embodiments, a first magnetic element is provided in the area where the second conductive portion of the substrate is located, and a second magnetic element is provided in the second electrical connector; when the second electrical connector is located on the top surface of the second conductive portion, the first magnetic element and the second magnetic element are magnetically attracted and connected.

[0020] Fourthly, embodiments of the present invention provide a battery.

[0021] The battery provided in this embodiment of the invention includes: a battery cell and any one of the circuit board assemblies provided in this embodiment of the invention.

[0022] The above-described at least one technical solution adopted in the embodiments of the present invention can achieve the following beneficial effects: In embodiments of the present invention, since the conductor layer of the deformable part and the first shape memory polymer layer are stacked, when the temperature of the deformable part is greater than or equal to a preset threshold, the first shape memory polymer layer deforms, which in turn causes the conductor layer to deform synchronously, thereby causing the first electrical connector and / or the second electrical connector to move. This separates the first electrical connector and / or the second electrical connector from the original connection points in the circuit, thereby cutting off the circuit.

[0023] When the temperature of the deformed part decreases and returns to normal, the first shape memory polymer layer returns to its normal shape, causing the first electrical connector and / or the second electrical connector to reset, thereby restoring the connection between the first electrical connector and / or the second electrical connector and the part in the circuit that was originally connected to it, and thus restoring the circuit to a conductive state.

[0024] Thus, the circuit-breaking module provided in this embodiment of the invention can disconnect the circuit when the temperature of the deformation form of the circuit-breaking module is abnormal. When the deformation form of the circuit-breaking module returns to normal temperature, the circuit can be restored.

[0025] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of a circuit breaker module provided in an embodiment of the present invention; Figure 2 A cross-sectional schematic diagram of a deformed circuit breaker module provided in an embodiment of the present invention; Figure 3 A partial schematic diagram of a deformed version of a circuit breaker module provided in an embodiment of the present invention; Figure 4 A schematic diagram of a second electrical connection member of a circuit breaker module provided in an embodiment of the present invention; Figure 5 A schematic diagram of a circuit board assembly in a conducting state for an embodiment of the present invention; Figure 6 A schematic diagram of a circuit board assembly with a circuit breaker module in an open circuit state, provided for an embodiment of the present invention; Figure 7 A schematic diagram of another circuit board assembly with the circuit breaker module in a conducting state, provided in an embodiment of the present invention; Figure 8 This is a flowchart illustrating a method for preparing a circuit breaker module according to an embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures: 1-Circuit board assembly; 100-Circuit Breaker Module; 110 - Shape variant; 110a - Bending portion; 111 - Conductor layer; 112 - First shape memory polymer layer; 113 - Second shape memory polymer layer; 114 - Groove; 120 - First electrical connection; 130 - Second electrical connector; 131 - Protrusion; 140 - Housing; 200-substrate; 210 - First conductive part; 220 - Second conductive part; 221 - Conductive contact surface; 222 - Sliding guide surface; 223 - First position; 224 - Second position. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0030] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0031] Furthermore, although the terminology used in this invention is selected from commonly known and used terms, some terms mentioned in this specification may have been selected by the applicant in his or her judgment, and their detailed meanings are explained in the relevant sections of the description herein.

[0032] Furthermore, the invention should be understood not only through the actual terminology used, but also through the meaning implied by each term.

[0033] The technical solutions provided by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] This invention provides a circuit breaker module. (See reference...) Figures 1 to 7 The circuit breaker module 100 provided in this embodiment of the invention includes: a deformable part 110, a first electrical connector 120, and a second electrical connector 130.

[0035] The deformable form 110 includes a stacked conductor layer 111 and a first shape memory polymer layer 112. The deformable form 110 has a first shape and a second shape. Exemplarily, when the deformable form 110 is in a normal state, it is in the first shape. When a deformation trigger condition is met, the deformable form 110 deforms from the first shape to the second shape. In other words, the first shape of the deformable form 110 is the normal shape, and the second shape of the deformable form 110 is the deformed shape after the deformation is triggered.

[0036] Furthermore, the first end of the deformable part 110 is fixedly connected to the first electrical connector 120, and the second end of the deformable part 110 is fixedly connected to the second electrical connector 130. The first electrical connector 120 and the second electrical connector 130 are respectively electrically connected to the conductor layer 111. When the deformable part 110 is in the first configuration, there is a gap between the first electrical connector 120 and the second electrical connector 130.

[0037] For example, the first electrical connector 120 may be integrally formed on the conductor layer 111, thereby achieving a fixed connection and electrical connection with the conductor layer 111. The second electrical connector 130 may be integrally formed on the conductor layer 111, thereby achieving a fixed connection and electrical connection with the conductor layer 111. Alternatively, the first electrical connector 120 may be a first electrical contact point, which is fixedly connected and electrically connected to the conductor layer 111. The second electrical connector 130 may be a second electrical contact point, which is fixedly connected and electrically connected to the conductor layer 111.

[0038] When the temperature of the deformable part 110 increases from less than a preset threshold to greater than or equal to the preset threshold, the first shape memory polymer layer 112 causes the deformable part 110 to deform from a first shape to a second shape, and at least one of the first electrical connector 120 and the second electrical connector 130 is displaced to change the distance between the first electrical connector 120 and the second electrical connector 130. Specifically, this can be to reduce the distance between the first electrical connector 120 and the second connector 130 so that they are closer together.

[0039] For example, when the temperature of the deformable part 110 increases from below a preset threshold to above or equal to the preset threshold, the deformable part 110 deforms from a first form to a second form. The first form refers to the form of the deformable part 110 when its temperature is below the preset threshold; the second form refers to the form of the deformable part 110 when its temperature is above or equal to the preset threshold. Thus, by deforming the deformable part 110, the first electrical connector 120 and / or the second electrical connector 130 can be moved, allowing them to separate from the previously connected parts in the circuit, thereby disconnecting the circuit.

[0040] When the temperature of the deformable part 110 recovers from being greater than or equal to a preset threshold to being less than a preset threshold, the first shape memory polymer layer 112 causes the deformable part 110 to recover from the second shape to the first shape. For example, when the temperature of the deformable part 110 decreases from being greater than or equal to a preset threshold to being less than a preset threshold, the deformable part 110 recovers from the second shape to the first shape. In this way, by recovering the shape of the deformable part 110, the first electrical connector 120 and / or the second electrical connector 130 can re-contact with the previously connected portion in the circuit, thus restoring the electrical connection.

[0041] In this manner, in embodiments of the present invention, since the conductor layer 111 and the first shape memory polymer layer 112 of the deformable body 110 are stacked, when the temperature of the deformable body 110 is greater than or equal to a preset threshold, the first shape memory polymer layer 112 deforms, which in turn causes the conductor layer 111 to deform synchronously, thereby causing the first electrical connector 120 and / or the second electrical connector 130 to move. This causes the first electrical connector 120 and / or the second electrical connector 130 to separate from the parts originally connected in the circuit, thereby cutting off the circuit.

[0042] When the temperature of the deformable part 110 drops and returns to normal temperature, the first shape memory polymer layer 112 returns to its normal shape, causing the first electrical connector 120 and / or the second electrical connector 130 to reset, thereby restoring the connection between the first electrical connector 120 and / or the second electrical connector 130 and the part that was originally connected in the circuit to the connection state, thereby restoring the circuit to the conducting state.

[0043] Thus, the circuit breaker module 100 provided in this embodiment of the invention can disconnect the circuit when the temperature of the deformation form 110 of the circuit breaker module 100 is abnormal. When the deformation form 110 of the circuit breaker module 100 returns to the normal temperature, the circuit can be restored.

[0044] For example, the conductor layer 111 is made of a metallic material such as copper, silver, or gold. For instance, the conductor layer 111 is copper foil, silver foil, or gold foil. Alternatively, the substrate of the conductor layer 111 is copper, and a silver layer or gold layer is provided on the outer surface of the substrate. Alternatively, the conductor layer 111 can be made of a non-metallic material such as graphene. These are not all listed here.

[0045] For example, the second electrical connector 130 can be made of a silver-nickel alloy. The silver-nickel alloy has a Vickers hardness rating of 200 and a melting point of 961 degrees Celsius. Of course, the second electrical connector 130 can also be made of other materials, which will not be listed here. The first electrical connector 120 can be made of the same material as the second electrical connector 130, or a different material; this will not be elaborated upon here.

[0046] In some embodiments, the deformable part 110 is provided with a plurality of bends 110a, which are arranged and connected sequentially in the direction from the first electrical connector 120 toward the second electrical connector 130, so that the deformable part 110 is wavy. In this way, by making the deformable part 110 wavy, the deformable part 110 can be better deformed when the temperature of the deformable part 110 is greater than or equal to a preset threshold.

[0047] For example, in other embodiments, the deformable form 110 may also be helical. The embodiments of the present invention do not limit the shape of the deformable form 110, as long as it can deform when the temperature is greater than or equal to a preset threshold.

[0048] refer to Figure 2 In some embodiments, the deformable element 110 further includes a second shape memory polymer layer 113. The second shape memory polymer layer 113 and the first shape memory polymer layer 112 are stacked on opposite sides of the conductor layer 111. When the temperature of the deformable element 110 is greater than or equal to a preset threshold, the first shape memory polymer layer 112 and the second shape memory polymer layer 113 together deform the deformable element 110 to offset the second electrical connector 130. When the temperature of the deformable element 110 is less than the preset threshold, the first shape memory polymer layer 112 and the second shape memory polymer layer 113 together deform the deformable element 110 to reset the second electrical connector 130.

[0049] In this way, by stacking the second shape memory polymer layer 113 and the first shape memory polymer layer 112 on opposite sides of the conductor layer 111, the first shape memory polymer layer 112 and the second shape memory polymer layer 113 together cause the deformable body 110 to deform, which enables the first shape memory polymer layer 112 and the second shape memory polymer layer 113 to better drive the conductor layer 111 to deform.

[0050] Exemplarily, the first shape memory polymer layer 112 is made of a shape memory polymer (SMP). For example, the first shape memory polymer layer 112 is made of a polyurethane-based shape memory polymer. For example, the phase transition temperature of the polyurethane-based shape memory polymer is 70 degrees Celsius ± 2 degrees Celsius. The material of the second shape memory polymer layer 113 can be the same as that of the first shape memory polymer layer 112, which will not be described in detail here. Exemplarily, for high-current scenarios, the deformable part 110 can also be formed of a shape memory polymer and carbon fiber.

[0051] It should be noted that if the material of the first shape memory polymer layer 112 is replaced with shape memory alloy (SMA), since SMA requires a specific high temperature to trigger deformation, it needs to be heated by an electric current to deform. Therefore, SMA cannot be directly triggered to deform by the temperature of the environment in which the shape shape 110 is located, resulting in a slow deformation response. Furthermore, if the shape shape 110 is replaced with a conventional fuse, since conventional fuses do not automatically restore continuity after the fault is cleared, they require repair or replacement.

[0052] The solution provided in this embodiment of the invention allows the first shape memory polymer layer 112 to deform when the temperature of the environment where the shape deformable layer 110 is located reaches its phase transition temperature, thereby causing the conductor layer 111 stacked with it to also deform. Thus, in the event of a circuit fault, when the temperature of the shape deformable layer 110 rises to its phase transition temperature, the shape deformable layer 110 can deform rapidly, thereby quickly cutting off the circuit and providing better protection for the circuit.

[0053] To enable those skilled in the art to better understand the solutions provided in the embodiments of the present invention, the working method of the circuit breaker module 100 is briefly described below.

[0054] When the temperature of the deformable element 110 is below a preset threshold, for example, when the temperature of the deformable element 110 is room temperature, the first shape memory polymer layer 112 and the second shape memory polymer layer 113 of the deformable element 110 maintain glassy rigidity, and the second electrical connector 130 is in a conductive position, thereby making the circuit conductive. When the temperature of the deformable element 110 is greater than or equal to the preset threshold (e.g., 70 degrees Celsius or other temperatures), the first shape memory polymer layer 112 and the second shape memory polymer layer 113 of the deformable element 110 deform, thereby driving the second electrical connector 130 to shift. This causes the second electrical connector 130 to separate from the part of the circuit that was originally connected, thereby cutting off the circuit.

[0055] Furthermore, after the deformable part 110 descends to a safe range, the first shape memory polymer layer 112 and the second shape memory polymer layer 113 of the deformable part 110 reversibly recover their deformation, causing the second electrical connector 130 to automatically reset. During the contraction process of the deformable part 110, the first shape memory polymer layer 112 and the second shape memory polymer layer 113 of the deformable part 110 convert thermal energy into the kinetic energy and elastic potential energy of the molecular chains to produce deformation contraction. When the deformable part 110 returns to its original state, it releases a small amount of thermal energy. Since the energy consumed during the deformation of the deformable part 110 is greater than the heat released, the deformable part 110 can play a role in assisting heat dissipation.

[0056] refer to Figure 3 and Figure 4 In some embodiments, the second electrical connector 130 is provided with a protrusion 131, and the second end of the deformable form 110 is provided with a groove 114. The protrusion 131 is used to be fitted into the groove 114. In this way, the second electrical connector 130 and the deformable form 110 can be fixedly connected by the protrusion 131 of the second electrical connector 130 being fitted into the groove 114 at the second end of the deformable form 110.

[0057] In some embodiments, a welded portion is provided between the protrusion 131 and the groove 114. For example, a welded portion is formed by performing a welding process on the joint between the protrusion 131 of the second electrical connector 130 and the groove 114 at the second end of the deformed shape 110, thereby improving the connection effect between the second electrical connector 130 and the deformed shape 110. For example, the welding process can be a laser micro-welding process.

[0058] In other embodiments, a bonding adhesive is provided between the protrusion 131 and the groove 114. For example, by providing adhesive at the joint between the protrusion 131 of the second electrical connector 130 and the groove 114 at the second end of the deformable part 110, a bonding adhesive is formed, thereby improving the connection effect between the second electrical connector 130 and the deformable part 110. For example, the adhesive can be a shape memory polymer adhesive.

[0059] Exemplarily, the conductor layer 111 of the deformable form 110 is exposed on the outer surface of the deformable form 110 via the groove 114. For example, the conductor layer 111 forms part of the bottom wall of the groove 114. Furthermore, when the protrusion 131 is embedded in the groove 114, the end face of the protrusion 131 abuts against the bottom wall of the groove 114, so that the second electrical connector 130 is electrically connected to the conductor layer 111 of the deformable form 110 via the protrusion 131.

[0060] In some embodiments, the second electrical connector 130 is provided with a protrusion 131, and the second end of the deformable part 110 is provided with a groove 114, the groove opening of which is located on the end face of the second end of the deformable part 110.

[0061] In other embodiments, the second electrical connector 130 is provided with a groove 114, and the second end of the deformable part 110 is provided with a protrusion 131, which is used to be fitted into the groove 114. In this way, the second electrical connector 130 and the deformable part 110 can be fixedly connected by fitting the protrusion 131 of the deformable part 110 into the groove 114 of the second electrical connector 130.

[0062] In other words, in an embodiment of the present invention, one of the second electrical connector 130 and the second end of the deformable part 110 is provided with a protrusion 131 and the other is provided with a groove 114. The protrusion 131 is used to be fitted into the groove 114.

[0063] In other embodiments, the second electrical connector 130 can be directly welded to the second end of the deformable part 110. Furthermore, the connection method between the first electrical connector 120 and the first end of the deformable part 110 can be based on the connection method between the second electrical connector 130 and the second end of the deformable part 110; therefore, the connection scheme between the first electrical connector 120 and the first end of the deformable part 110 will not be described in detail here.

[0064] To enable those skilled in the art to better implement the solutions provided in the embodiments of the present invention, the present invention provides a method for preparing the circuit breaker module 100: refer to Figure 8 The method for preparing the circuit breaker module 100 provided in this embodiment of the invention includes: Step 310: Stack the conductor layer and the first shape memory polymer layer in sequence, place the stacked conductor layer and the first shape memory polymer layer in a lamination mold, and laminate and shape the stacked conductor layer and the first shape memory polymer layer to form a deformable shape.

[0065] In an embodiment of the present invention, the conductor layer 111 and the first shape memory polymer layer 112 can be stacked sequentially, the stacked conductor layer 111 and the first shape memory polymer layer 112 can be placed in a lamination mold, and the stacked conductor layer 111 and the first shape memory polymer layer 112 can be laminated and shaped to form a deformable shape 110.

[0066] For example, the cavity of the laminating mold can be corrugated. For example, a corrugated laminating mold can be prepared first. For instance, a high-temperature resistant metal material can be used to process the laminating mold with corrugated grooves. For instance, the laminating mold includes an upper mold and a lower mold. The parameters of the corrugated grooves are set according to design requirements and will not be elaborated here. For instance, the groove walls of the corrugated grooves in the laminating mold are treated with an anti-stick coating.

[0067] Furthermore, the conductor layer 111 and the first shape memory polymer layer 112 can be stacked sequentially and disposed in a corrugated laminating mold. Exemplarily, when the deformation variant 110 also includes a second shape memory polymer layer 113, the second shape memory polymer layer 113, the conductor layer 111, and the first shape memory polymer layer 112 can be stacked sequentially and disposed in a corrugated laminating mold.

[0068] In some embodiments, before the conductor layer 111 and the first shape memory polymer layer 112 are stacked sequentially, the surface of the conductor layer 111 to be bonded is subjected to plasma treatment, and a coupling agent is coated on the surface to be bonded after plasma treatment.

[0069] In some embodiments, stacking the conductor layer 111 and the first shape memory polymer layer 112 in sequence includes stacking the conductor layer 111 and the first shape memory polymer layer 112 in sequence such that the side of the conductor layer 111 with the coupling agent faces the first shape memory polymer layer 112.

[0070] It should be noted that, exemplarily, when the conductor layer 111 is copper foil, the surface of the copper foil can first be subjected to plasma treatment with oxygen to adjust the surface roughness. For example, the surface roughness Ra of the copper foil can be made to be 2.3 micrometers. Further, a coupling agent (e.g., KH-560) can be coated onto the surface of the copper foil. Then, the copper foil coated with the coupling agent is subjected to high-temperature drying. For example, the copper foil coated with the coupling agent can be subjected to high-temperature drying for 30 minutes. After the high-temperature drying of the copper foil coated with the coupling agent, Si-O-Cu interfacial bonds are formed on the surface of the copper foil, which can prevent the first shape memory polymer layer 112 from delaminating with the copper foil after being affected by temperature and humidity.

[0071] Furthermore, the conductor layer 111 and the first shape memory polymer layer 112 can be laminated and shaped to form a shape variant 110. Specifically, the conductor layer 111 and the first shape memory polymer layer 112 can be first placed in the lower mold of a corrugated laminating mold, and then the upper mold can be covered. The corrugated laminating mold can then be placed in the working area of ​​a laminator. Pressure is then applied to the lower mold using the laminator. In this way, the conductor layer 111 and the first shape memory polymer layer 112 can form a shape variant 110 with the same corrugated groove shape as the corrugated laminating mold.

[0072] Furthermore, a demolding process can be implemented to remove the deformed shape 110 from the corrugated laminating mold. For example, before demolding, the pressure applied to the lower mold can be kept constant. After the deformed shape 110 has fully set, the downward pressure is removed. The corrugated shape 110 is then removed.

[0073] Step 320: Fix the first electrical connector to the first end of the deformed body, so that the first electrical connector is electrically connected to the conductor layer of the deformed body.

[0074] In an embodiment of the present invention, the first electrical connector 120 can be fixedly connected to the first end of the deformable body 110, so that the first electrical connector 120 is electrically connected to the conductor layer 111 of the deformable body 110.

[0075] For example, the first electrical connector 120 can be soldered to the first end of the deformed shape 110 by laser soldering process, and the first electrical connector 120 is electrically connected to the conductor layer 111 of the deformed shape 110.

[0076] Step 330: The second electrical connector is fixedly connected to the second end of the deformed body, so that the second electrical connector is electrically connected to the conductor layer of the deformed body.

[0077] In an embodiment of the present invention, the second electrical connector 130 can be fixedly connected to the second end of the deformable body 110, so that the second electrical connector 130 is electrically connected to the conductor layer 111 of the deformable body 110.

[0078] For example, a groove 114 can be formed at the second end of the deformable part 110 in such a way that the protrusion 131 of the second electrical connector 130 can engage with the groove 114 at the second end of the deformable part 110. For example, the groove wall of the wavy groove of the wavy lamination mold is provided with a protrusion. During the lamination molding process, the groove 114 is formed at the part of the deformable part 110 corresponding to the protrusion.

[0079] For example, the length of the groove 114 is 0.1 to 0.2 mm larger than the length of the end face of the protrusion 131 of the second electrical connector 130, and the width of the groove 114 is 0.1 to 0.2 mm larger than the width of the end face of the protrusion 131 of the second electrical connector 130.

[0080] Furthermore, the protrusion 131 of the second electrical connector 130 can be embedded in the groove 114 of the deformable form 110. For example, local pressure (such as hot press head pressing) can be applied when the first shape memory polymer layer 112 of the deformable form 110 is in a semi-molten state, and the protrusion 131 of the second electrical connector 130 can be locked by the shrinkage force of the first shape memory polymer layer 112 after cooling.

[0081] Furthermore, the connection gap between the second electrical connector 130 and the deformed part 110 can be sealed by laser micro-welding or hot-pressing adhesive strips.

[0082] In addition, the circuit breaker module 100 can be encapsulated with epoxy resin. The epoxy resin encapsulation has an IP67 protection rating, a temperature range of -40 degrees Celsius to 125 degrees Celsius, and an epoxy resin encapsulation thickness of less than 0.6 mm, meeting the needs of most application scenarios.

[0083] This invention provides a circuit board assembly. (See reference...) Figures 1 to 7 The circuit board assembly 1 provided in this embodiment of the invention includes: a substrate 200 and any type of circuit breaker module 100 provided in this embodiment of the invention; the circuit breaker module 100 is disposed on the substrate 200.

[0084] In some embodiments, the substrate 200 is provided with a first conductive portion 210 and a second conductive portion 220. Exemplarily, the first conductive portion 210 is a first pad, and the second conductive portion 220 is a second pad. A first electrical connector 120 is fixedly connected to and electrically connected to the first conductive portion 210. Exemplarily, the first electrical connector 120 and the first conductive portion 210 are fixedly connected and electrically connected by welding.

[0085] When the temperature of the deformable part 110 is below a preset threshold, the second electrical connector 130 makes conductive contact with the second conductive part 220. Furthermore, when the temperature of the deformable part 110 is greater than or equal to the preset threshold, the second electrical connector 130 separates from the second conductive part 220. For example, the trigger displacement of the deformable part 110 is 1.5 mm to ensure that the second electrical connector 130 separates from the second conductive part 220.

[0086] For example, the substrate 200 is provided with a controlled circuit. The controlled circuit is connected to the first conductive part 210 and the second conductive part 220, respectively. When the temperature of the deformed part 110 is less than a preset threshold and the second electrical connector 130 is in conductive contact with the second conductive part 220, the first conductive part 210 and the second conductive part 220 are connected via the circuit breaker module 100, thereby making the controlled circuit in a connected state. When the temperature of the deformed part 110 is greater than or equal to the preset threshold and the second electrical connector 130 is separated from the second conductive part 220, the first conductive part 210 and the second conductive part 220 are disconnected, thereby making the controlled circuit in a short-circuit state.

[0087] In some embodiments, the top surface of the second conductive portion 220 includes a conductive contact surface 221 and a sliding guide surface 222 connected together. The conductive contact surface 221 protrudes from the top surface of the substrate 200 and is used for conductive contact with the second electrical connector 130. Exemplarily, the second electrical connector 130 has a graphene coating on the side facing the conductive contact surface 221, for example, the thickness of the graphene coating is 30 to 60 nanometers. Thus, by providing a graphene coating on the side of the second electrical connector 130 facing the conductive contact surface 221, the contact resistance between the second electrical connector 130 and the conductive contact surface 221 can be reduced.

[0088] The sliding guide surface 222 includes a first side and a second side opposite to each other. The first side is located on the side of the second side facing the first conductive portion 210, the first side is connected to the top surface of the substrate 200, and the second side is connected to the conductive contact surface 221. Figure 5 Taking the orientation shown as an example, the left side of the sliding guide surface 222 is the first side, the right side of the sliding guide surface 222 is the second side, and the left side of the sliding guide surface 222 is located on the side of the second side facing the first conductive part 210.

[0089] In some embodiments, the sliding guide surface 222 is used to guide the second electrical connector 130 to move between a first position 223 and a second position 224. The first position 223 is located on the top surface of the substrate 200 and on the side of the sliding guide surface 222 facing the first conductive portion 210; the second position 224 is located on the conductive contact surface 221.

[0090] For example, with Figure 5 and Figure 6 Taking the shown orientation as an example, the first position 223 is located to the left of the second position 224. When the temperature of the deformable part 110 is greater than or equal to a preset threshold, the deformable part 110 contracts, causing the second electrical connector 130 to move from right to left. When the temperature of the deformable part 110 is less than the preset threshold, the deformable part 110 extends, causing the second electrical connector 130 to move from left to right. Since the left edge of the sliding guide surface 222 is flush with the top surface of the substrate 200, the distance between the sliding guide surface 222 and the top surface of the substrate 200 gradually increases from left to right. Thus, the sliding guide surface 222 can guide the second electrical connector 130, moving from left to right, to the top surface of the conductive contact surface 221.

[0091] In other embodiments, when the temperature of the deformable body 110 is greater than or equal to a preset threshold, the deformable body 110 undergoes stretching deformation; when the temperature of the deformable body 110 is less than the preset threshold, the deformable body 110 undergoes contracting deformation. The sliding guide surface 222 can also be referenced in this case. Figure 5 and Figure 6The setup shown is configured as described above; further explanation is not provided here.

[0092] refer to Figure 1 and Figure 7 In some embodiments, the circuit breaker module 100 includes a housing 140. The housing 140 covers the deformable part 110. The housing 140 is fixedly connected to the substrate 200.

[0093] In some embodiments, a first magnetic element is provided in the region where the second conductive portion 220 of the substrate 200 is located. A second magnetic element is provided in the second electrical connector 130. When the second electrical connector 130 is located on the top surface of the second conductive portion 220, the first magnetic element and the second magnetic element are magnetically attracted to each other.

[0094] Furthermore, when the temperature of the deformable part 110 is greater than or equal to a preset threshold, the deformable part 110 overcomes the magnetic attraction between the first magnetic element and the second magnetic element, thereby driving the second electrical connector 130 to move to a position misaligned with the conductive contact surface 221.

[0095] This invention provides a battery. The battery provided in this invention includes: a battery cell and any one of the circuit board assemblies 1 provided in this invention. For example, the battery is a laptop battery or a mobile phone battery, etc.

[0096] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0097] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the embodiments of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit breaker module, characterized in that, include: Deformation element (110), first electrical connector (120), and second electrical connector (130); The shape variant (110) includes a stacked conductor layer (111) and a first shape memory polymer layer (112), and the shape variant (110) has a first shape and a second shape; The first end of the deformable part (110) is fixedly connected to the first electrical connector (120), and the second end of the deformable part (110) is fixedly connected to the second electrical connector (130). The first electrical connector (120) and the second electrical connector (130) are respectively electrically connected to the conductor layer (111). When the deformable part (110) is in the first form, there is a gap between the first electrical connector (120) and the second electrical connector (130). When the temperature of the deformable part (110) increases from less than a preset threshold to greater than or equal to the preset threshold, the first shape memory polymer layer (112) causes the deformable part (110) to deform from the first form to the second form, and at least one of the first electrical connector (120) and the second electrical connector (130) is displaced to change the distance between the first electrical connector (120) and the second electrical connector (130); When the temperature of the deformable form (110) recovers from being greater than or equal to the preset threshold to being less than the preset threshold, the first shape memory polymer layer (112) causes the deformable form (110) to recover from the second form to the first form.

2. The circuit breaker module according to claim 1, characterized in that, The deformable part (110) is provided with a plurality of bends (110a), which are arranged and connected in sequence in the direction from the first electrical connector (120) toward the second electrical connector (130) so that the deformable part (110) is wavy.

3. The circuit breaker module according to claim 1, characterized in that, The shape variant (110) further includes a second shape memory polymer layer (113), wherein the second shape memory polymer layer (113) and the first shape memory polymer layer (112) are stacked on opposite sides of the conductor layer (111).

4. The circuit breaker module according to claim 1, characterized in that, The second electrical connector (130) and the second end of the deformed part (110) are provided with a protrusion (131) and a groove (114), the protrusion (131) being fitted into the groove (114).

5. A method for preparing a circuit breaker module, used to prepare the circuit breaker module according to any one of claims 1 to 4, characterized in that, The method for preparing the circuit breaker module includes: The conductor layer (111) and the first shape memory polymer layer (112) are stacked in sequence, and the stacked conductor layer (111) and the first shape memory polymer layer (112) are placed in a lamination mold. The stacked conductor layer (111) and the first shape memory polymer layer (112) are laminated and shaped to form the deformed shape (110). The first electrical connector (120) is fixedly connected to the first end of the deformable body (110), so that the first electrical connector (120) is electrically connected to the conductor layer (111) of the deformable body (110); The second electrical connector (130) is fixedly connected to the second end of the deformable body (110), so that the second electrical connector (130) is electrically connected to the conductor layer (111) of the deformable body (110).

6. The method for preparing the circuit breaker module according to claim 5, characterized in that, The method for preparing the circuit breaker module further includes: before stacking the conductor layer (111) and the first shape memory polymer layer (112) in sequence, performing plasma treatment on the surface to be bonded of the conductor layer (111), and coating the surface to be bonded after plasma treatment with a coupling agent. The step of stacking the conductor layer (111) and the first shape memory polymer layer (112) in sequence includes: stacking the conductor layer (111) and the first shape memory polymer layer (112) in sequence such that the side of the conductor layer (111) with the coupling agent faces the first shape memory polymer layer (112). And / or, the cavity of the laminating mold is wavy.

7. A circuit board assembly, characterized in that, include: The substrate (200) and the circuit breaker module according to any one of claims 1 to 4; The circuit breaker module is located on the substrate (200).

8. The circuit board assembly according to claim 7, characterized in that, The substrate (200) is provided with a first conductive part (210) and a second conductive part (220). The first electrical connector (120) is fixedly connected to and electrically connected to the first conductive part (210); When the temperature of the deformed part (110) is less than the preset threshold, the second electrical connector (130) makes conductive contact with the second conductive part (220); When the temperature of the deformed part (110) is greater than or equal to the preset threshold, the second electrical connector (130) separates from the second conductive part (220).

9. The circuit board assembly according to claim 8, characterized in that, The top surface of the second conductive part (220) includes a conductive contact surface (221) and a sliding guide surface (222) connected to each other; the conductive contact surface (221) protrudes from the top surface of the substrate (200) and is used to make conductive contact with the second electrical connector (130); The sliding guide surface (222) includes a first side and a second side opposite to each other. The first side is disposed on the side of the second side facing the first conductive part (210). The first side is connected to the top surface of the substrate (200). The second side is connected to the conductive contact surface (221). The sliding guide surface (222) is used to guide the second electrical connector (130) to move between a first position (223) and a second position (224). The first position (223) is located on the top surface of the substrate (200) and on the side of the sliding guide surface (222) facing the first conductive part (210). The second position (224) is located on the conductive contact surface (221).

10. The circuit board assembly according to claim 8, characterized in that, The area where the second conductive portion (220) of the substrate (200) is located is provided with a first magnetic element, and the second electrical connector (130) is provided with a second magnetic element; When the second electrical connector (130) is located on the top surface of the second conductive part (220), the first magnetic element and the second magnetic element are magnetically attracted to each other.

11. A battery, characterized in that, include: The battery cell and the circuit board assembly according to any one of claims 7 to 10.

Images