Audio DSP module and audio device
By building a standardized functional interface audio DSP module on a PCB substrate, the problems of hardware design complexity and cost when replacing DSP chips are solved, and the universality and rapid iteration of audio devices are realized.
Patent Information
- Application Number
- CN202511784852.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-02-27
AI Technical Summary
Replacing the DSP chip in existing audio electronic devices requires redesigning the hardware, increasing R&D costs and complexity. Furthermore, general-purpose control DSP modules cannot be specifically adapted to the transmission characteristics of audio signals.
Design an audio DSP module that builds a standardized functional interface on a PCB substrate, enabling the functional interface to be electrically connected to the functional pins of the DSP chip, thus ensuring compatibility with different DSP chip models and simplifying hardware design and layout.
This eliminates the need to redesign the PCB layout and module connections when replacing DSP chips, significantly shortening the development cycle, reducing costs, and improving versatility.
Smart Images
Figure CN121585174A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of electronic circuit technology, and in particular to an audio DSP module and an audio device. Background Technology
[0002] Currently, the audio transmission and processing stages of audio electronic devices generally employ a technical solution where audio data is output to a DSP (Digital Signal Processor) chip. When a product needs to replace the DSP chip based on cost or performance requirements, designers must redesign the DSP hardware, perform wiring verification, and conduct compatibility testing, increasing R&D manpower and material costs. Some general-purpose control DSP modules improve compatibility through layered structures and FPGA (Field-Programmable Gate Array) adaptation, but these solutions require additional FPGA chips and complex hardware programming, increasing hardware complexity and cost. Furthermore, they cannot specifically adapt to the transmission characteristics of audio signals, making them difficult to apply directly to audio devices. Summary of the Invention
[0003] This invention provides an audio DSP module and an audio device to improve the versatility of the audio DSP module.
[0004] In a first aspect, embodiments of the present invention provide an audio DSP module, comprising: a PCB substrate and a DSP chip;
[0005] The PCB substrate is configured with a functional interface, and the functional interface is configured to be electrically connected to some functional pins of the DSP chip.
[0006] The functional interfaces include an SPDIF interface, an ADC analog input interface, a TDM / I2S input interface, a TDM / I2S output interface, and a control line interface;
[0007] Configure the SPDIF interface, ADC analog input interface, TDM / I2S input interface, and control line interface for electrical connection with the control unit; configure the TDM / I2S output interface for electrical connection with the power amplifier unit;
[0008] Configure the control line interface to receive the initialization signal of the DSP chip, configure the SPDIF interface, ADC analog input interface, and TDM / I2S input interface to receive audio input signals, and configure the TDM / I2S output interface to output audio output signals.
[0009] Optionally, the ADC analog input interface includes multiple ADC pins.
[0010] Optionally, the TDM / I2S input interface includes multiple digital audio input pins; the TDM / I2S output interface includes multiple digital audio output pins.
[0011] Optionally, the control line interface includes an I2C bus pin, an SPI bus pin, a reset control pin, and a startup control pin.
[0012] Optionally, the SPDIF interface, the ADC analog input interface, and the first power interface constitute a first interface unit; the TDM / I2S input interface and the second power interface constitute a second interface unit; the TDM / I2S output interface and the third power interface constitute a third interface unit; and the control line interface and the fourth power interface constitute a fourth interface unit.
[0013] Configure the first interface unit, second interface unit, third interface unit, and fourth interface unit to be set in different areas.
[0014] Optionally, the first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are each configured to include 13 pins.
[0015] Optionally, the PCB substrate is a 20mm×20mm square substrate;
[0016] The first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are disposed along the edge of the square substrate;
[0017] The DSP chip is mounted in the central area of the square substrate.
[0018] Optionally, when the DSP chips have different models, the functional interfaces are the same, and the functional interfaces are configured to be electrically connected to the DSP chips of different models.
[0019] Secondly, embodiments of the present invention also provide an audio device, including any of the audio DSP modules described in the embodiments of the present invention.
[0020] Optional components also include a control unit, a power amplifier unit, and a speaker unit;
[0021] The control unit is electrically connected to the audio DSP module and the power amplifier unit respectively. The audio DSP module is electrically connected to the power amplifier unit, and the power amplifier unit is electrically connected to the speaker unit.
[0022] The control unit is configured to output initialization signals for the DSP chip, audio input signals, and power amplifier control signals for the power amplifier unit.
[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention proposes an audio DSP module, which simplifies the pins of the audio DSP chip and builds a standardized functional interface on the PCB substrate, so that the functional interface is electrically connected to the functional pins of the DSP chip in a targeted manner. When the DSP chip needs to be replaced, it is only necessary to ensure that the functional pins of the new chip match the preset standardized functional interface, without redesigning the PCB substrate layout and the external connections between the module and the control unit and the power amplifier unit, which significantly shortens the product development and iteration cycle. Attached Figure Description
[0024] Figure 1 This is a block diagram of the audio DSP module structure in the embodiment;
[0025] Figure 2 This is a schematic diagram of the audio DSP module pinout in the embodiment;
[0026] Figure 3 This is a schematic diagram of the PCB of the audio DSP module in the embodiment;
[0027] Figure 4 This is a block diagram of the audio device structure in the embodiment. Detailed Implementation
[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.
[0029] Example 1
[0030] Figure 1 This is a block diagram of the audio DSP module structure in the embodiment, for reference. Figure 1 The audio DSP module includes: a PCB substrate and a DSP chip 100.
[0031] The PCB substrate is equipped with a functional interface, which is electrically connected to some functional pins of the DSP chip 100.
[0032] The functional interfaces include SPDIF interface 201, ADC analog input interface 202, TDM / I2S input interface 203, TDM / I2S output interface 204, and control line interface 205.
[0033] Configure SPDIF interface 201, ADC analog input interface 202, TDM / I2S input interface 203, and control line interface 205 for electrical connection with control unit 1; configure TDM / I2S output interface 204 for electrical connection with power amplifier unit 2.
[0034] Configure the control line interface 205 to receive the initialization signal of the DSP chip 100, configure the SPDIF interface 201, ADC analog input interface 202, and TDM / I2S input interface 203 to receive audio input signals, and configure the TDM / I2S output interface 204 to output audio output signals.
[0035] In this design, the PCB substrate has reserved soldering positions for the DSP chip 100, and also has pin pads for functional interfaces. The PCB substrate also has pins for digital ground (DGND) and analog ground (AGND). The control line interface 205, TDM / I2S input / output interfaces 203 / 204, and SPDIF interface 201 are electrically connected to digital ground (DGND); the ADC analog input interface 202 is electrically connected to analog ground (AGND).
[0036] In this solution, the DSP chip 100 can be a dedicated audio DSP, used for audio processing. The audio DSP supports SPDIF transmission and reception, ADC analog acquisition, and TDM / I2S bus transmission. The model of the DSP chip 100 can be selected according to actual requirements.
[0037] In this scheme, the control unit 1 is used to control the audio DSP module and the power amplifier unit 2. The control unit 1 can be configured to output initialization signal, audio input signal and power amplifier control signal.
[0038] In this solution, power amplifier unit 2 supports TDM / I2S digital audio input (interfacing with TDM / I2S output interface 204), and power amplifier unit 2 is used to drive speaker devices such as loudspeakers.
[0039] In this scheme, the SPDIF interface 201 may include an SPDIFIN pin and an SPDIFOUT pin. SPDIFIN is the signal input pin, and SPDIFOUT is the output pin. The SPDIF format digital audio signal output by the control unit 1 can be transmitted to the DSP chip 100 via the SPDIF interface 201. The DSP chip 100 decodes the signal to process the audio data.
[0040] In this solution, the ADC analog input interface 202 may include one or more analog audio input pins, which are used to electrically connect to the analog audio output terminal of the control unit 1.
[0041] In this scheme, the analog audio signal output by the control unit 1 (such as the voice signal input by the microphone) can be transmitted to the DSP chip 100 via the ADC analog input interface 202. The DSP chip 100 converts the analog signal into digital audio data through its built-in ADC to perform noise reduction, gain adjustment and other processing on the audio data.
[0042] In this scheme, the TDM / I2S input interface 203 may include multiple TDM / I2S input channel pins, which are used to electrically connect to the TDM / I2S output terminal of the control unit 1.
[0043] The TDM / I2S audio signal output by the control unit 1 can be transmitted to the DSP chip 100 via the TDM / I2S input interface 203. The DSP chip 100 parses the received multi-channel audio data according to the timing of BCLK (bit clock) and LRCLK (frame clock), thereby realizing parallel processing of multi-channel audio.
[0044] In this scheme, the TDM / I2S output interface 204 may include multiple TDM / I2S output channel pins, which are used to electrically connect to the TDM / I2S input terminal of the power amplification unit 2.
[0045] After the DSP chip 100 processes the input audio signal, it outputs a standard TDM / I2S format digital audio signal through the TDM / I2S output interface 204. After receiving the signal, the power amplifier unit 2 decodes and amplifies it into an analog audio power signal to drive the speaker unit to produce sound.
[0046] In this solution, the control line interface 205 may include a reset pin, a control bus pin, and a startup mode pin. The control unit 1 can output a low-level signal to the reset pin, thereby triggering the DSP chip 100 to reset. The startup mode pin can be configured to be connected to DGND via a pull-down resistor. The startup mode pin is used to put the audio DSP module into a mode that boots from external Flash.
[0047] In this scheme, after the control unit 1 is powered on, it controls the DSP chip 100 to reset and initialize via the reset pin. After the reset is completed, the control unit 1 sends an initialization command (such as configuring the audio sampling rate, ADC / DAC gain, and EQ parameters) via the control bus pin. After receiving the command, the DSP chip 100 completes the internal register configuration, enters the ready state, and waits to receive the audio input signal.
[0048] This embodiment proposes an audio DSP module. This audio DSP module simplifies the pins of the audio DSP chip and builds a standardized functional interface on the PCB substrate, so that the functional interface can be electrically connected to the functional pins of the DSP chip. When the DSP chip needs to be replaced, it is only necessary to ensure that the functional pins of the new chip match the preset standardized functional interface. There is no need to redesign the PCB substrate layout and the external connections between the module and the control unit and the power amplifier unit, which significantly shortens the product development and iteration cycle.
[0049] Based on any of the aforementioned schemes, in one possible implementation, the ADC analog input interface includes multiple ADC pins.
[0050] For example, in this solution, the ADC analog input interface can be designed with multiple ADC pins, such as 6 independent ADC analog input pins AUX_ADC0~AUX_ADC5.
[0051] In this solution, the functional definitions of AUX_ADC0~AUX_ADC5 are set according to requirements. For example, AUX_ADC0~AUX_ADC5 can be configured to receive analog signal input from the main microphone, analog signal input from the secondary microphone, line input 1 (e.g., CD), line input 2 (e.g., headphones), backup analog signal input 1, and backup analog signal input 2, respectively.
[0052] In this solution, setting up multiple ADC pins enables the audio DSP module to support the acquisition of analog audio signals in multiple scenarios (such as microphone input, line input, and external sensor audio signals), while ensuring that the ADC interface does not need to be redesigned when different DSP chips are replaced.
[0053] Based on any of the aforementioned solutions, in one possible implementation, the TDM / I2S input interface includes multiple digital audio input pins; the TDM / I2S output interface includes multiple digital audio output pins.
[0054] In this design, the TDM / I2S input interface includes multiple digital audio input pins; the TDM / I2S output interface includes multiple digital audio output pins; the pins are defined by function, so that the hardware does not need to be redesigned when the DSP chip is replaced.
[0055] For example, in this solution, three sets of independent TDM / I2S input pins and three sets of independent TDM / I2S output pins can be designed to enable the audio DSP module to support the transmission of multi-channel digital audio while ensuring interface compatibility and signal integrity.
[0056] For example, in this solution, each group of TDM / I2S input pins may include three pins: serial data, bit clock, and frame clock. Taking the TDM / I2S input pins of channel 0 as an example, it may specifically include pin TDM / I2S_IN_SDATA0 (receiving TDM / I2S serial audio data signal), pin TDM / I2S_IN_BCLK0 (receiving TDM / I2S bit clock signal), and pin TDM / I2S_IN_LRCLK0 (receiving TDM / I2S frame clock signal).
[0057] For example, in this solution, each group of TDM / I2S output pins may include three pins: serial data, bit clock, and frame clock. Taking the TDM / I2S output pins of channel 0 as an example, it may specifically include pin TDM / I2S_OUT_SDATA0 (used to output TDM / I2S serial audio data signal), pin TDM / I2S_OUT_BCLK0 (used to output bit clock signal), and pin TDM / I2S_OUT_LRCLK0 (output TDM / I2S frame clock signal).
[0058] In this scheme, the control unit 1 can send instructions to the DSP chip through the control line interface 205 to configure the TDM / I2S input / output parameters (e.g., configure the sampling rate, data bit width, activate the input channel, output channel 0, etc.).
[0059] Control unit 1 outputs dual-channel digital audio signals through the TDM / I2S input interface. The DSP chip receives the data, parses the left / right channel data according to the timing of the bit clock and frame clock, and then performs noise reduction, EQ tuning and other processing.
[0060] The DSP chip outputs the processed audio data to the power amplifier unit 2 through the TDM / I2S output interface; after receiving the signal, the power amplifier unit 2 decodes and amplifies it into an analog power signal, which ultimately drives the speaker unit to play.
[0061] Based on any of the aforementioned schemes, in one possible implementation, the control line interface includes an I2C bus pin, an SPI bus pin, a reset control pin, and a startup control pin.
[0062] In this design, the audio DSP module includes two types of bus pins, which ensures that the circuit of the audio DSP module is compatible with different models of audio DSP chips, thereby realizing the universal design of the audio DSP module.
[0063] For example, in this solution, the pins of the control line interface can be designed to include a reset control pin RESET, a start control pin SELF_BOOT, I2C bus pins I2C_SCL (I2C bus clock), I2C_SDA (I2C bus data), SPI bus pins SPI_SCK (SPI bus clock), SPI_MOSI (SPI bus master transmit, slave receive), SPI_MISO (SPI bus master receive, slave transmit), and SPI_CS (SPI bus chip select).
[0064] Based on any of the aforementioned schemes, in one possible implementation scheme, the SPDIF interface, the ADC analog input interface, and the first power interface constitute a first interface unit; the TDM / I2S input interface and the second power interface constitute a second interface unit; the TDM / I2S output interface and the third power interface constitute a third interface unit; and the control line interface and the fourth power interface constitute a fourth interface unit.
[0065] In this scheme, the first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are configured in separate areas.
[0066] In this design, the first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are set up in separate areas, and the module pins are defined according to their functions; this allows the audio DSP module to meet the requirements of reducing signal crosstalk, simplifying PCB wiring, and facilitating the replacement of DSP chips.
[0067] In this design, the first power interface may include AVDD, AGND, IOVDD, and DGND pins. The second power interface may include DVDD, DGND, and IOVDD pins. The third power interface may include DVDD, DGND, and IOVDD pins. The fourth power interface may include the DGND pin.
[0068] AVDD is used to connect to the analog power supply, DVDD is used to connect to the digital power supply, IOVDD is used to connect to the IO power supply, and DGND is used to connect to the reference ground.
[0069] Based on any of the aforementioned schemes, in one possible implementation scheme, the first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are configured to each include 13 pins.
[0070] In this design, the first interface unit, the second interface unit, the third interface unit, and the fourth interface unit each include 13 evenly distributed pins, which can make the PCB substrate space compact and facilitate PCB design layout.
[0071] Figure 2 This is a pin diagram of the audio DSP module in the embodiment, for reference. Figure 2 In one possible implementation, the first interface unit includes pins 1 to 13, the second interface unit includes pins 40 to 52, the third interface unit includes pins 27 to 39, and the fourth interface unit includes pins 14 to 26.
[0072] In the first interface unit, pins 1, 2, 5, and 6 are power supply pins, pins 3 and 4 are SPDIF digital audio input and output pins, and pins 7 to 13 are analog audio input pins.
[0073] In the second interface unit, pins 52, 51, 41, and 40 are power supply pins, pins 50-48 are one TDM / I2S input pin, pins 47-45 are one TDM / I2S input pin, and pins 44-42 are one TDM / I2S input pin.
[0074] In the third interface unit, pins 39, 38, 28, and 27 are power supply pins, pins 37-35 are one TDM / I2S output pin, pins 34-32 are one TDM / I2S output pin, and pins 31-29 are one TDM / I2S output pin.
[0075] In the fourth interface unit, pins 14, 15, and 26 are power supply pins, pin 16 is a reset control pin, pin 25 is a start control pin, pins 17 and 18 are I2C bus pins, pins 19 to 22 are SPI bus pins, and pins 23 and 24 are status feedback pins.
[0076] Based on any of the aforementioned solutions, in one possible implementation, the PCB substrate is a 20mm × 20mm square substrate.
[0077] The first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are arranged along the edge of the square substrate; the mounting position of the DSP chip is arranged in the central area of the square substrate.
[0078] Figure 3 This is a schematic diagram of the PCB of the audio DSP module in the embodiment, for reference. Figure 3 In one possible implementation, the PCB substrate is evenly divided into four regions along its edge, with 13 pins arranged longitudinally / laterally along each region. A DSP chip mounting position (compatible with SMT surface mount technology) is reserved in the central region of the PCB substrate, and all interface unit pins are connected to the central DSP chip via short-path routing, eliminating cross-region routing.
[0079] In this design, a small 20mm x 20mm square PCB substrate facilitates PCB design and layout. The first to fourth interface units are evenly distributed along the left, top, right, and bottom edges to ensure no signal cross-interference. Pins are defined with fixed functions, eliminating the need for hardware redesign when replacing the DSP chip after the hardware design is complete, thus enabling a universal design.
[0080] Based on any of the aforementioned schemes, in one possible implementation scheme, when the DSP chip models are different, the functional interfaces are the same, and the functional interface configuration is used for electrical connection with different models of DSP chips.
[0081] In this solution, the functional interfaces include an SPDIF interface, an ADC analog input interface, a TDM / I2S input interface, a TDM / I2S output interface, and a control line interface. The pin definitions for each interface are fixed. When replacing the DSP chip, only the chip itself needs to be replaced; the pins of different DSP chip models are mapped and connected according to the fixed pin definitions of the functional interfaces. The standardized pin definitions and software parameter configurations of the functional interfaces allow multiple DSP chips to share the same set of functional interfaces, ensuring consistent audio processing capabilities and adapting to different application scenarios.
[0082] For example, in this solution, the differences in the level or driving capability of the functional pins of different DSP chips can be addressed through a generalized circuit design, without modifying the structure of the functional interface.
[0083] For example, the first DSP chip has a maximum ADC input voltage of 3.3V, while the second DSP chip has a maximum ADC input voltage of 3.0V. In the ADC analog input interface circuit, a unified voltage divider resistor circuit and a parallel Zener diode are designed to ensure that the input voltage does not exceed the minimum tolerance value of either chip, thus achieving compatibility.
[0084] The maximum current of the I2C bus of the first DSP chip is 2mA, and the maximum current of the I2C bus of the second DSP chip is 1mA. By adjusting the value of the pull-up resistor of the I2C bus interface, the I2C bus interface can be matched with the pull-up current of different DSP chips, so as to achieve compatibility without modifying the structure of the functional interface, only by the difference in material selection.
[0085] Example 2
[0086] This embodiment proposes an audio device, including any of the audio DSP modules described in Embodiment 1. The implementation method and beneficial effects of the audio DSP module are the same as those described in Embodiment 1, and the specific details will not be repeated here.
[0087] Figure 4 This is a block diagram of the audio device structure in the embodiment, for reference. Figure 4 Based on any of the aforementioned solutions, in one possible implementation, the audio device further includes a control unit 1, a power amplifier unit 2, and a speaker unit 3.
[0088] The control unit 1 is electrically connected to the audio DSP module 1000 and the power amplifier unit 2 respectively. The audio DSP module 1000 is electrically connected to the power amplifier unit 2, and the power amplifier unit 2 is electrically connected to the speaker unit 3.
[0089] Control unit 1 is configured to output initialization signals for the DSP chip, audio input signals, and power amplifier control signals for power amplifier unit 2.
[0090] For example, in this solution, the control unit 1 can have 2 I2C buses, 1 SPDIF interface, and 1 TDM / I2S interface; the control unit 1 is configured to support 3.3V power supply and be compatible with the power interface (DVDD / IOVDD, etc.) of the audio DSP module 1000, without the need for additional power conversion circuits.
[0091] In this solution, the power amplifier unit 2 uses a Class D power amplifier chip, the specific model of which is selected according to the requirements. The power amplifier unit 2 has one TDM / I2S input interface and one set of control pins.
[0092] In this scheme, after the audio device is powered on, the control unit 1 outputs a low level to the RESET pin of the audio DSP module 1000, triggering the DSP chip to reset. After the reset is completed, the control unit 1 sends an initialization command to the audio DSP module 1000 via the I2C bus. The control unit 1 also sends an initialization command to the power amplifier unit 2 via the I2C bus, enabling the power amplifier unit 2 to complete its initialization.
[0093] Control unit 1 selects one type of audio input signal to output based on user needs: If playing digital audio (such as music from a USB flash drive), it outputs an SPDIF format signal through the SPDIF_TX pin, which is then transmitted to the DSP chip via the SPDIF_IN pin of the audio DSP module 1000. The DSP chip decodes the signal and converts it into parallel audio data. If playing analog audio (such as microphone voice), it outputs a TDM / I2S format signal through the TDM / I2S interface, which is then transmitted to the DSP chip via the TDM / I2S_IN pin of the audio DSP module 1000.
[0094] The DSP chip processes the input signal. After processing, the DSP chip outputs a standard TDM / I2S format signal through the TDM / I2S output interface and transmits it to the power amplifier unit 2.
[0095] After receiving the TDM / I2S signal, the power amplifier unit 2 first decodes and extracts the audio data and clock signal, and then converts the low-power digital signal into a high-power analog signal through the Class D amplifier circuit. The amplified analog signal is transmitted to the speaker unit 3 to drive the speaker diaphragm to vibrate and realize audio playback.
[0096] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.
Claims
1. An audio DSP module, characterized in that, include: PCB substrate and DSP chip; The PCB substrate is configured with a functional interface, and the functional interface is configured to be electrically connected to some or all of the functional pins of the DSP chip. The functional interfaces include an SPDIF interface, an ADC analog input interface, a TDM / I2S input interface, a TDM / I2S output interface, and a control line interface; Configure the SPDIF interface, ADC analog input interface, TDM / I2S input interface, and control line interface for electrical connection with the control unit; configure the TDM / I2S output interface for electrical connection with the power amplifier unit; Configure the control line interface to receive the initialization signal of the DSP chip, configure the SPDIF interface, ADC analog input interface, and TDM / I2S input interface to receive audio input signals, and configure the TDM / I2S output interface to output audio output signals.
2. The audio DSP module as described in claim 1, characterized in that, The ADC analog input interface includes multiple ADC pins.
3. The audio DSP module as described in claim 1, characterized in that, The TDM / I2S input interface includes multiple digital audio input pins; the TDM / I2S output interface includes multiple digital audio output pins.
4. The audio DSP module as described in claim 1, characterized in that, The control line interface includes I2C bus pins, SPI bus pins, reset control pins, and start control pins.
5. The audio DSP module as described in claim 1, characterized in that, The SPDIF interface, ADC analog input interface, and first power interface constitute a first interface unit; the TDM / I2S input interface and second power interface constitute a second interface unit; the TDM / I2S output interface and third power interface constitute a third interface unit; and the control line interface and fourth power interface constitute a fourth interface unit. Configure the first interface unit, second interface unit, third interface unit, and fourth interface unit to be set in different areas.
6. The audio DSP module as described in claim 5, characterized in that, The first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are each configured to have 13 pins.
7. The audio DSP module as described in claim 5, characterized in that, The PCB substrate is a 20mm×20mm square substrate; The first interface unit, the second interface unit, the third interface unit, and the fourth interface unit are disposed along the edge of the square substrate; The DSP chip is mounted in the central area of the square substrate.
8. The audio DSP module as described in any one of claims 1 to 7, characterized in that, When the DSP chips have different models, the functional interfaces are the same, and the functional interfaces are configured to be electrically connected to the DSP chips of different models.
9. An audio device, characterized in that, Includes the audio DSP module as described in any one of claims 1 to 8.
10. The audio device as claimed in claim 9, characterized in that, It also includes a control unit, a power amplifier unit, and a speaker unit; The control unit is electrically connected to the audio DSP module and the power amplifier unit respectively. The audio DSP module is electrically connected to the power amplifier unit, and the power amplifier unit is electrically connected to the speaker unit. The control unit is configured to output initialization signals for the DSP chip, audio input signals, and power amplifier control signals for the power amplifier unit.