Contact structure of camera module and electronic device including same

Abstract

Various embodiments according to the present disclosure provide a contact structure of a camera module and an electronic device including the same. The electronic device includes: a housing including a rear plate having an opening and a support frame at least partially disposed along an edge of the rear plate; a camera trim disposed in the opening to be exposed to the outside, covering the camera assembly, and connected to the rear plate; a printed circuit board disposed in the housing; a rear structure supporting the camera assembly and the printed circuit board; a fixing member coupled to the rear structure and fixing the camera assembly and / or the printed circuit board to the support frame; and a conductive member at least partially disposed between the camera trim and the fixing member to electrically connect the camera trim and the fixing member to each other.

Description

[0001] This application is a divisional application of the patent application filed on September 16, 2021, with application number 202180064426.1 and entitled "Contact Structure of Camera Module and Electronic Device Including the Same". Technical Field

[0002] Various embodiments of this disclosure relate to contact structures for improving electrostatic discharge (ESD) in camera modules and electronic devices including such camera modules. Background Technology

[0003] Due to recent significant advancements in information and communication technologies and semiconductor technology, the dissemination and use of various electronic devices are rapidly increasing. In particular, recent electronic devices have been developed to enable communication while being carried.

[0004] Electronic devices can refer to devices that perform specific functions based on embedded programs, such as home appliances, electronic notebooks, portable multimedia players (PMPs), mobile communication terminals, tablet PCs (PCs), video / audio devices, desktop / laptop computers, and vehicle navigation systems. For example, these electronic devices can output stored information in the form of sound or images. With the increasing integration of electronic devices and the widespread use of ultra-high-speed, high-capacity wireless communication, various functions have recently begun to be provided in single electronic devices such as mobile communication terminals. For example, communication functions, as well as various other functions (such as entertainment functions like games, multimedia functions like music / video playback, communication and security functions for mobile banking, and functions like calendar management or e-wallets), have been integrated into single electronic devices. Such electronic devices are becoming increasingly compact, making them convenient for users to carry. Summary of the Invention

[0005] Technical issues

[0006] In electronic devices, camera modules need to be designed to limit malfunctions caused by externally generated static electricity. A camera module may include a camera assembly and a camera trim to cover the camera assembly. Since electronic devices are generally designed such that contact members (e.g., gasket foam) act as surface mount devices (SMDs) on a printed circuit board located around the camera trim of the camera module, and the contact members directly contact the camera trim, malfunctions caused by externally generated static electricity can be prevented.

[0007] However, the aforementioned contact member structure imposes limitations on ensuring mounting space in the electronic device, as the contact member must be positioned on an area of ​​the printed circuit board that overlaps with (or faces) the camera trim. Depending on the characteristics of the contact member, such as its type and nature within the gap between the camera trim and the printed circuit board, the aforementioned contact member structure may struggle to maintain proper contact points.

[0008] According to embodiments of this disclosure, a contact structure between the camera trim and the surrounding metal structure can be achieved by using a fixing member (e.g., a fastening structure) for securing the camera assembly and / or printed circuit board to the electronic device. Therefore, improved electrostatic discharge (ESD) can be provided by ensuring mounting space within the electronic device and having a fixed contact structure.

[0009] Technical solution

[0010] An electronic device according to various embodiments of the present disclosure may include: a housing including a rear panel having an opening and a support frame disposed at least partially along an edge of the rear panel; a camera trim disposed in the opening to be exposed to the outside, the camera trim covering a camera assembly and being connected to the rear panel; a printed circuit board disposed in the housing; a rear structure supporting the camera assembly and the printed circuit board; a fixing member coupled to the rear structure and fixing the camera assembly and / or the printed circuit board to the support frame; and a conductive member disposed at least partially between the camera trim and the fixing member to electrically connect the camera trim and the fixing member.

[0011] An electronic device according to various embodiments of the present disclosure may include: a housing including a rear panel with an opening and a camera trim disposed in the opening to be exposed to the outside and connected to the rear panel; a support frame disposed in the housing; a printed circuit board disposed in a region of the support frame; a camera assembly covered by the camera trim and configured to capture an external object through at least one opening formed in the camera trim; a fixing member for fixing the camera assembly and / or the printed circuit board to the support frame; and a conductive member disposed at least partially between the camera trim and the fixing member to electrically connect the camera trim and the fixing member.

[0012] Beneficial effects

[0013] According to various embodiments of this disclosure, a fixing member (e.g., a fastening structure) existing for securing the camera assembly and the printed circuit board can be used as a contact structure for the camera module. Therefore, the fixing member can form a discharge path between the camera trim and the printed circuit board to improve electrostatic discharge (ESD).

[0014] According to various embodiments of this disclosure, the contact structure of the camera module can be achieved through contact points between conductive members located on the camera trim and fixed members located on the support frame. Because the conductive members do not require separate mounting space on the printed circuit board, design freedom for the electronic device can be ensured.

[0015] According to various embodiments of this disclosure, the contact structure of the camera module does not form a separate thickness in the electronic device because the conductive components for improving ESD are installed inside the camera trim, thus saving material costs based on improvements in materials and dimensions (e.g., reduction).

[0016] The effects that can be obtained from this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains will clearly understand from the following description other effects not described above. Attached Figure Description

[0017] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[0018] Figure 2 This is a front perspective view showing an electronic device according to various embodiments of the present disclosure;

[0019] Figure 3 This is a rear perspective view showing an electronic device according to various embodiments of the present disclosure;

[0020] Figure 4 This is an exploded perspective view illustrating an electronic device according to various embodiments of the present disclosure;

[0021] Figure 5 This is an exploded perspective view showing a support frame, a rear plate, and a camera trim attached to the rear plate in an electronic device according to one of the various embodiments of the present disclosure;

[0022] Figure 6 It is magnification Figure 5 A perspective view of the exploded region A;

[0023] Figure 7 This is a view showing a support frame and a rear structure attached to the support frame in a state where the rear panel of the electronic device has been removed, according to one of the various embodiments of the present disclosure;

[0024] Figure 8a This is a view showing one side of the camera decoration as seen in one direction, according to one of the various embodiments of the present disclosure;

[0025] Figure 8b This is a view showing the other side of the camera decoration as seen from another direction, according to one of the various embodiments of this disclosure;

[0026] Figure 9 This is a view showing a support frame and a rear structure attached to the support frame in an electronic device, as viewed through a projection panel, according to one of the various embodiments of the present disclosure;

[0027] Figure 10 yes Figure 9 A magnified projection of region B; and

[0028] Figure 11 It is along Figure 10 A sectional view taken by line L-L'. Detailed Implementation

[0029] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure.

[0030] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display device 160).

[0031] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0032] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0033] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0034] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0035] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0036] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0037] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0038] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0039] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0040] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0041] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0043] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0044] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0045] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0046] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0047] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0048] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0049] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0050] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0051] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0052] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0053] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0054] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0055] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0056] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g., the Play Store™), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0057] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0058] Figure 2 This is a front perspective view showing an electronic device according to various embodiments of the present disclosure. Figure 3 This is a rear perspective view showing an electronic device according to various embodiments of the present disclosure.

[0059] Reference Figure 2 and Figure 3 The electronic device 101 according to an embodiment may include a housing 310, the housing 310 including a front surface 310A, a rear surface 310B, and a side surface 310C surrounding a space defined between the front surface 310A and the rear surface 310B. In another embodiment (not shown), the housing 310 may refer to a structure formed Figure 2 Front surface 310A, Figure 3 The rear surface 310B and Figure 3 The structure of some of the side surfaces 310C. According to an embodiment, at least a portion of the front surface 310A may be formed of a substantially transparent front panel 302 (e.g., a glass or polymer panel including various coatings). The rear surface 310B may be formed of a rear panel 311. The rear panel 311 may be formed of, for example, glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium) or a combination of two or more of these materials. The side surfaces 310C may be formed of a side frame structure (or side member) 318 that connects the front panel 302 and the rear panel 311 and includes metal and / or polymer. In some embodiments, the rear panel 311 and the side frame structure 318 may be integrally formed and include the same material (e.g., glass, a metal such as aluminum, or ceramic).

[0060] In the illustrated embodiment, the front panel 302 may include two first edge regions 310D that extend seamlessly and curvedly from the front surface 310A toward the rear panel 311 along the two long edges of the front panel 302. In the illustrated embodiment (see...) Figure 3 In the device 302, the rear panel 311 may include two second edge regions 310E, which extend seamlessly and curvedly from the rear surface 310B toward the front panel 302 along the two long edges of the rear panel 311. According to some embodiments, the front panel 302 (or the rear panel 311) may include only one of the first edge regions 310 (or the second edge regions 310E). In another embodiment, some of the first edge regions 310D or the second edge regions 310E may not be included. In the above embodiments, when viewed from one side of the electronic device 101, the side frame structure 318 may have a first thickness (or width) for the side excluding the first edge region 310D or the second edge region 310E, and a second thickness thinner than the first thickness for the side including the first edge region 310D or the second edge region 310E.

[0061] According to an embodiment, electronic device 101 may include displays 330 and 301, and audio modules 303, 307, and 314 (e.g., Figure 1 The audio module 170), sensor module (e.g., Figure 1 Sensor module 176), camera modules 305, 312 and 313 (e.g., Figure 1 The camera module 180), key input device 317 (e.g., Figure 1 The input device 150) and connector holes 308 and 309 (e.g., Figure 1 At least one or more of the connector ends 178). In some embodiments, at least one component (e.g., connector hole 309) may be omitted from the electronic device 101, or the electronic device 101 may additionally include other components.

[0062] According to embodiments, displays 330 and 301 may be visually exposed, for example, through a large portion of the front panel 302. In some embodiments, at least a portion of displays 330 and 301 may be exposed through the front panel 302 forming the front surface 310A and the first edge region 310D. In some embodiments, the edges of displays 330 and 301 may be formed to substantially resemble the contour shape of the front panel 302 adjacent to them. In another embodiment (not shown), the spacing between the outer edges of displays 330 and 301 and the outer edge of the front panel 302 may be substantially constant in order to increase the exposed area of ​​displays 330 and 301.

[0063] According to an embodiment, the surface of the housing 310 (or the front panel 302) may include a screen display area formed as the displays 330 and 301 are visually exposed. For example, the screen display area may include a front surface 310A and a first edge region 310D.

[0064] In another embodiment (not shown), the screen display areas of displays 330 and 301 (e.g., front surface 310A and first edge region 310D) may have recesses or openings formed in a portion thereof, and may include at least one or more of an audio module 314, a sensor module (not shown), a light-emitting element (not shown), and a camera module 305, aligned with the recesses or openings. In another embodiment (not shown), at least one or more of the audio module 314, sensor module (not shown), camera module 305, fingerprint sensor (not shown), and light-emitting element (not shown) may be included on the rear surface of the screen display areas of displays 330 and 301. In another embodiment (not shown), displays 330 and 301 may be coupled to or disposed adjacent to touch sensing circuitry, a pressure sensor capable of measuring the intensity of touch (pressure), and / or a digital converter for detecting magnetic field type styluses. In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge region 310D and / or the second edge region 310E.

[0065] According to embodiments, audio modules 303, 307, and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314. Microphone hole 303 may include a microphone disposed therein to receive external sound, and in some embodiments, multiple microphones may be disposed therein to detect the direction of sound. Speaker holes 307 and 314 may include an external speaker hole 307 and a telephone call receiver hole 314. In some embodiments, speaker holes 307 and 314 and microphone hole 303 are implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without speaker holes 307 and 314. Audio modules 303, 307, and 314 are not limited to the above-described structures and may be varied in design depending on the structure of electronic device 101, for example, by installing only some audio modules or adding new audio modules.

[0066] According to embodiments, a sensor module (not shown) can generate electrical signals or data values ​​corresponding to, for example, the internal operating state or external environmental state of the electronic device 101. The sensor module (not shown) may include, for example, a first sensor module (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the front surface 310A of the housing 310 and / or a third sensor module (e.g., an HRM sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the rear surface 310B of the housing 310. In some embodiments (not shown), the fingerprint sensor may be disposed not only on the front surface 310A of the housing 310 (e.g., displays 330 and 301) but also on the rear surface 310B. The electronic device 101 may also include at least one sensor module (not shown), such as a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, and illuminance sensor. The sensor module is not limited to the structure described above, and its design can be varied depending on the structure of the electronic device 101, such as installing some sensor modules or adding new sensor modules.

[0067] According to embodiments, camera modules 305, 312, and 313 may include, for example, a front-facing camera module 305 disposed on the front surface 310A of the electronic device 101, and a rear-facing camera module 312 and / or a flash 313 disposed on the rear surface 310B. Camera modules 305 and 312 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 313 may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera lens, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101. Camera modules 305, 312, and 313 are not limited to the above-described structures and may be varied in design depending on the structure of the electronic device 101, for example, by installing some camera modules or adding new camera modules.

[0068] According to embodiments, electronic device 101 may include multiple camera modules (e.g., dual-camera or triple-camera) that each have different characteristics (e.g., viewing angles) or functions. For example, multiple camera modules 305 and 312 may be configured to include lenses with different viewing angles, and electronic device 101 may control camera modules 305 and 312 to change the viewing angles performed therein based on user selection. For example, at least one of the multiple camera modules 305 and 312 may be a wide-angle camera, and at least another of the camera modules may be a telephoto camera. Similarly, at least one of the multiple camera modules 305 and 312 may be a front-facing camera, and at least another of the camera modules may be a rear-facing camera. Furthermore, the multiple camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, and an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera). According to embodiments, an IR camera may operate as at least part of a sensor module. For example, a TOF camera may operate as at least part of a sensor module (not shown) for detecting the distance to an object.

[0069] According to an embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310. In another embodiment, the electronic device 101 may not include some or all of the key input devices 317 described above, and the key input devices 317 not included in the electronic device 101 may be implemented in another form, such as soft keys on the display 301. In some embodiments, the key input device may include a sensor module 316 disposed on a second surface (e.g., the rear surface 310B) of the housing 310.

[0070] According to an embodiment, a light-emitting element (not shown) may be disposed, for example, on the front surface 310A of the housing 310. The light-emitting element (not shown) may provide, for example, status information of the electronic device 101 in the form of light. In another embodiment, the light-emitting element (not shown) may provide a light source for operational interaction with, for example, a front-facing camera module 305. The light-emitting element (not shown) may include, for example, LEDs, IR LEDs, and xenon lamps.

[0071] According to an embodiment, connector holes 308 and 309 may include, for example: a first connector hole 309 capable of accommodating a connector (e.g., a USB connector) for sending / receiving power and / or data to / from an external electronic device; and / or a second connector hole 308 (e.g., a headphone jack) capable of accommodating a connector for sending / receiving audio signals to / from an external electronic device.

[0072] According to embodiments, some camera modules 305 and / or some sensor modules (not shown) in sensor modules 305 and 312 may be configured to be exposed to the outside through at least a portion of displays 330 and 301. For example, camera module 305 may include a punch-hole camera disposed within a hole or recess formed on the rear surface of displays 330 and 301. According to embodiments, camera module 312 may be disposed within housing 310 such that a lens is exposed to a second surface (e.g., rear surface 310B) of electronic device 101. For example, camera module 312 may be disposed on a printed circuit board (e.g., Figure 4 On the printed circuit board 340.

[0073] According to an embodiment, the camera module 305 and / or sensor module can be disposed from the internal space of the electronic device 101 to the front panel 302 of the displays 330 and 301 to contact the external environment through a transparent area. Furthermore, some sensor modules 304 can be disposed within the internal space of the electronic device to perform their functions without being visually exposed through the front panel 302.

[0074] Figure 4 This is an exploded perspective view showing an electronic device according to various embodiments.

[0075] Reference Figure 4 Electronic device 101 according to various embodiments (e.g., Figures 1 to 3 The electronic device 101 may include a support frame 370 and a front panel 320 (e.g., Figure 2 Front panel 302), display 330 (e.g., Figure 2 The display 301), printed circuit board 340 (e.g., PCB, flexible PCB (FPCB) or rigid-flex PCB (RFPCB)), battery 350 (e.g., Figure 1 The battery 189), the second support member 360 (e.g., the rear structure), and the antenna (not shown) (e.g., Figure 1 Antenna module 197) and rear panel 380 (e.g., Figure 2 The rear panel 311). The electronic device 101 may also include a camera module 312 comprising a camera assembly 312a and a camera trim 315, a fixing member 410, and a conductive member 420. The support frame 370 of the electronic device 101 according to the embodiment may include a side frame structure 371 (e.g., Figure 2 The side frame structure 318) and the first support member 372.

[0076] In some embodiments, at least one component (e.g., the first support member 372 or the second support member 360) may be omitted from the electronic device 101, or other components may be additionally included. At least one component of the electronic device 101 may be... Figure 2or Figure 3 At least one component of the electronic device 101 is the same as or similar to that of the other component, and its repeated description will be omitted below.

[0077] According to various embodiments, the first support member 372 may be disposed in the electronic device 101 to be connected to the side bezel structure 371, or may be integrated with the side bezel structure 371. The first support member 372 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). The display 330 may be coupled to one surface of the first support member 332, and the printed circuit board 340 may be coupled to the other surface of the first support member 332.

[0078] According to various embodiments, a processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include various processing circuitry, including, for example, one or more of a central processing unit, application processor, graphics processor, image signal processor, sensor hub processor, or communication processor. According to various embodiments, the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 372 and may be electrically connected to an antenna module (e.g., Figure 1 Antenna module 197) and communication module (e.g., Figure 1 (Communication module 190).

[0079] According to embodiments, the memory may include, for example, volatile memory or non-volatile memory.

[0080] According to embodiments, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The interface can electrically or physically connect, for example, electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0081] According to various embodiments, the battery 350, which serves as a means for supplying power to at least one component of the electronic device 101, may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. At least a portion of the battery 350 may be disposed on a plane substantially the same as, for example, a printed circuit board 340. The battery 350 may be integrally disposed within the electronic device 101 or may be detachably disposed on the electronic device 101.

[0082] According to various embodiments, a second support member 360 (e.g., a rear structure) may be disposed between the printed circuit board 340 and the antenna. For example, the second support member 360 may include a surface to which at least one of the printed circuit board 340 or battery 350 is coupled and another surface to which the antenna is coupled.

[0083] According to various embodiments, an antenna (not shown) may be disposed between the rear panel 380 and the display 350. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may perform short-range communication with, for example, an external electronic device, or may wirelessly send / receive power required for charging to / from an external device. In another embodiment, the antenna structure may be included in a portion or combination of the side bezel structure 371 and / or the first support member 372.

[0084] According to various embodiments, the rear plate 380 may form the rear surface of the electronic device 101 (e.g., Figure 3 At least a portion of the second surface 310B.

[0085] According to various embodiments, the fixing member 410 may be coupled to the second support member 360, and the conductive member 420 may be located between the fixing member 410 and the camera trim. The contact structure of the camera module including the fixing member 410 and the conductive member 420 will be described in detail below.

[0086] Figure 5 This is an exploded perspective view showing a support frame, a rear panel, and a camera trim attached to the rear panel in an electronic device according to one of the various embodiments of the present disclosure.

[0087] Figure 6 It is magnification Figure 5 A perspective view of the exploded region A.

[0088] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a housing (e.g., Figure 2 and Figure 3 The housing 310) and the rear structure 360 ​​disposed in the housing 310 (e.g., Figure 4 The second support member 360), camera module 312, and printed circuit board 340.

[0089] According to an embodiment, the camera module (e.g., Figure 3 The camera module 312 includes a camera assembly 312a and a camera trim 315 covering the camera assembly 312a. The camera assembly 312a includes one or more lenses, an image sensor, and / or an image signal processor. According to another embodiment, the housing 310 may include a rear plate 380 covering the rear surface of the electronics 101 and a cover for the camera assembly (e.g., ...). Figure 3 The camera module 312) and the camera trim 315 that at least partially forms the rear surface of the electronic device 101. The housing 310 may also include a support frame 370 that provides mounting space for the side and internal components of the electronic device 101.

[0090] Figure 5 and Figure 6 The configuration of the housing 310, camera module 312, rear structure 360, and printed circuit board 340 can be consistent with... Figure 2 and Figure 3 The housing 310 and camera module 312 and Figure 4 The rear structure 360 ​​and the printed circuit board 340 are partially or entirely the same.

[0091] According to various embodiments, the rear surface of housing 310 (e.g., the surface facing the +Z axis) may be formed by a first surface 311b of rear plate 380 and a camera trim 315 of camera module 312. According to embodiments, rear plate 380 may include the first surface 311b and an opening 311a formed in a region of the first surface 311b (e.g., an edge-adjacent region). Camera trim 315 has a shape corresponding to the shape of the opening 311a, such that its edge region can fit into the opening 311a and can be at least partially exposed to the outside of the opening 311a (e.g., in the +Z axis direction). According to embodiments, camera trim 315 may be designed to have a different thickness compared to adjacent openings 311a. As another example, when rear plate 380 is formed of a metallic material, camera trim 315 can be electrically connected to rear plate 380 via direct contact.

[0092] According to various embodiments, the camera trim 315 is a separate configuration isolated from the rear panel 380 and may comprise a metallic material (e.g., aluminum). The camera trim 315 may include at least one opening 315e corresponding to the number of lens assemblies of the camera module 312 and reduce external impacts transmitted to the camera module 312, thereby protecting the camera module 312.

[0093] According to various embodiments, the printed circuit board 340 may be disposed in a region of the support frame 370 of the housing 310, where the battery (e.g., Figure 4 The battery 350 can be located in another area of ​​the printed circuit board 340. For example, the camera module 312 can be located on one side of the printed circuit board 340, and the battery can be located on the other side of the printed circuit board 340. The camera module 312 and / or the battery can be electrically connected to the printed circuit board 340.

[0094] According to various embodiments, the rear structure 360 ​​may be located between the rear panel 380 and the printed circuit board 340. One area of ​​the rear structure 360 ​​may cover the printed circuit board 340, and another area may cover a portion of the camera assembly 312a. For example, the rear structure 360 ​​may substantially cover most of the surface of the printed circuit board 340 facing the second direction (-Z-axis direction). Therefore, the rear structure 360 ​​may support the camera assembly 312a and / or the printed circuit board 340 to prevent movement due to external impacts.

[0095] According to an embodiment, the rear structure 360 ​​can be provided as an injection molded (e.g., non-conductive material) and have a conductive pattern (not shown) formed on one region of it (e.g., a surface facing a second direction (-Z-axis direction)) to serve as an antenna radiator. The conductive pattern can be a laser-direct-forming (LDS) pattern and can be formed from a conductive material including metallic materials such as copper or nickel. For example, a laser-direct-forming (LDS) pattern can be formed by plating and coating processes after selectively patterning an injection product (e.g., a material comprising a thermoplastic resin) using a laser. Laser treatment can facilitate the plating of metallic materials on a rough resin surface at a microscale.

[0096] According to various embodiments, electronic device 101 may include a fixing member 410 and a conductive member 420 disposed adjacent to camera module 312. The fixing member 410 and / or the conductive member 420 may provide a discharge path to improve electrostatic discharge (ESD) of camera module 312.

[0097] According to various embodiments, the fixing member 410 may be coupled to the rear structure 360 ​​to secure the camera assembly 312a and / or the printed circuit board 340 to the support frame 370. For example, the fixing member 410 includes a fastening structure such as a screw, one surface of the fixing member 410 facing a second direction (-Z-axis direction) is configured to face the camera trim 315 and / or the conductive member 420, and another portion of the fixing member 410 (e.g., including a threaded screw portion) may be inserted into and secured to the rear structure 360 ​​and the support frame 370.

[0098] According to various embodiments, a conductive member 420 may be disposed between the fixed member 410 and the camera trim 315 to electrically connect the fixed member 410 and the camera trim 315. For example, the conductive member 420 may be made of a material that includes elasticity and conductivity. Specific compressibility and elongation provided by the fixed member 410 can prevent lift-up phenomena between the camera trim 315 and the rear structure 360. The conductive member 420 may form part of a discharge path to improve electrostatic discharge (ESD) by providing a structure electrically connected to the fixed member 410 and / or the camera trim 315.

[0099] Figure 7 This is a view showing a support frame and a rear structure attached to the support frame in a state where the rear panel of the electronic device has been removed, according to one of the various embodiments of the present disclosure.

[0100] Figure 8a This is a view showing one side of the camera decoration as viewed in one direction, according to one of the various embodiments of the present disclosure.

[0101] Figure 8b This is a view showing the other side of the camera decoration as viewed from another direction, according to one of the various embodiments of this disclosure.

[0102] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a support frame 370, a rear structure 360, and a camera module (e.g., Figure 3 The camera module 312), printed circuit board 340, fixing member 410, and conductive member 420. According to an embodiment, the camera module (e.g., Figure 3 The camera module 312 may include a camera assembly 312a and a camera trim 315 covering the camera assembly 312a, the camera assembly 312a including one or more lenses, an image sensor and / or an image signal processor.

[0103] Figures 7 to 8b The configuration of the support frame 370, rear structure 360, printed circuit board 340, fixing member 410 and conductive member 420 is consistent with... Figure 5 and Figure 6 The configuration of the support frame 370, rear structure 360, printed circuit board 340, fixing member 410 and conductive member 420 is partially or completely the same.

[0104] According to various embodiments, the fixing member 410 may be located in a first region S1 of the rear structure 360. For example, the rear structure 360 ​​may be provided with a hole in its first region S1 including a threaded screw, into which the fixing member 410 may be inserted (e.g., tightened). The fixing member 410 may, together with other surrounding fixing members, secure the rear structure 360 ​​to a portion of the rear structure 360 ​​and / or the camera assembly 312a.

[0105] According to various embodiments, the camera trim 315 may include a first surface 315a facing the interior of the electronic device 101 and a second surface 315b formed to expose the exterior of the electronic device 101. According to embodiments, a conductive member 420 may be located in a second region S2 of the first surface 315a of the camera trim 315. For example, the second region S2 of the camera trim 315 is provided to form a recess having dimensions corresponding to the dimensions of the conductive member 420, into which the conductive member 420, inserted, can stably maintain contact with the fixing member 410. As another example, an adhesive member (e.g., tape or adhesive) may be provided on one surface of the conductive member 420, or the bonding force between the conductive member 420 and the camera trim 315 may be strengthened.

[0106] According to various embodiments, when viewed from above the camera decoration 315 (e.g., when viewed through a projection camera decoration 315), a portion of the first region S1 of the rear structure 360 ​​may overlap with the second region S2 of the camera decoration 315. According to another embodiment, when viewed from above the camera decoration 315 (e.g., when viewed through a projection camera decoration 315), a portion of the second region S2 of the camera decoration 315 may be configured to overlap with the first region S1 of the rear structure 360. The conductive member 420 and the fixing member 410 may each include surfaces that contact each other, and the camera decoration 315 and the support frame 370 may be electrically connected to each other.

[0107] In the contact structure of the camera module according to this disclosure, the conductive member 420 can be provided as a contact structure for improving ESD and as a fastening structure for securing the rear structure 360 ​​to the electronic device 101. Therefore, a contact structure requiring a separate space in one area of ​​the printed circuit board 340 can be eliminated, thus ensuring additional mounting space for the electronic device 101 and providing design freedom.

[0108] Figure 9 This is a view showing a support frame and a rear structure attached to the support frame in an electronic device, as viewed through a projection panel, according to one of the various embodiments of the present disclosure.

[0109] Figure 10 yes Figure 9 A magnified projection of region B.

[0110] Figure 11 It is along Figure 11 A sectional view taken by line L-L'.

[0111] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a display 330, a rear panel 380, a support frame 370, a rear structure 360, and a camera module (e.g., Figure 3 The camera module 312), printed circuit board 340, fixing member 410, and conductive member 420. According to one embodiment, the camera module (e.g., ...) Figure 3 The camera module 312 may include a camera assembly 312a containing one or more lenses, an image sensor and / or an image signal processor, and a camera decoration 315 covering the camera assembly 312a.

[0112] Figures 9 to 11 The configuration of the monitor 330 and the rear panel 380 can be matched with Figure 4 The configurations of the monitor 330 and the rear panel 380 are partially or entirely the same. Figures 9 to 11The configuration of the support frame 370, rear structure 360, printed circuit board 340, fixing member 410, and conductive member 420 can be consistent with... Figures 5 to 8b The support frame 370, rear structure 360, printed circuit board 340, fixing member 410 and conductive member 420 are partially or entirely the same.

[0113] According to various embodiments, when viewed from the rear surface of the electronic device 101 (e.g., when viewed towards the rear panel 380), the conductive member 420 and the fixing member 410 may be arranged relative to the camera trim 315 in a first direction (+Z axis direction). The rear structure 360 ​​and the support frame 370 may be positioned along the edge of the fixing member 410, and the printed circuit board 340 may be located in an area adjacent to the support frame 370.

[0114] According to various embodiments, the fixing member 410 may form a discharge path L between the camera trim 315 and the support frame 370 to prevent the camera module 312 from being damaged due to static electricity. For example, the discharge path L may be formed to release static electricity generated in the electronic device 101 (or camera module 312) along the camera trim 315, conductive member 420, fixing member 410, support frame 370 and printed circuit board 340.

[0115] According to an embodiment, the conductive member 420 attached to the area of ​​the camera decoration 315 can be designed to be in direct contact with the fixing member 410, thereby releasing static electricity.

[0116] According to an embodiment, the fixing member 410 may be configured to contact multiple components. Because the rear structure 360 ​​for supporting the camera module 312 and / or the printed circuit board 340 is formed of injection-molded material, the fixing member 410 cannot directly provide a conductive path. Therefore, the fixing member 410 passes through the rear structure 360 ​​and is configured to directly contact the support frame 370 formed of conductive members, thereby providing a path.

[0117] For example, the fixing member 410 may include a first portion 411 for electrical connection to the camera trim 315 (or conductive member 420), a second portion 412 for connection to the rear structure 360, and a third portion 413 for connection to the support frame 370 and providing electrical connection. The first portion 411 may be a surface of the fixing member 410 facing a second direction (-Z-axis direction) to form a contact point directly with the conductive member 420. Since the second portion 412, as an extension for connecting the first portion 411 and the third portion 413, is formed to penetrate the rear structure 360 ​​(e.g., a non-metallic structure), a metallic structure separated from the non-metallic structure (e.g., the camera trim 315 and the support frame 370) can be electrically connected. The third portion 413 is configured to contact the support frame 370 to extend the discharge path L formed along the first portion 411, the second portion 412, and the third portion 413 to the support frame 370.

[0118] According to various embodiments, the printed circuit board 340 can be electrically connected to the support frame 370. For example, the printed circuit board 340 can be disposed in direct contact with a region of the support frame 370. In another example, since the printed circuit board 340 is disposed adjacent to and spaced apart from a region of the support frame 370, current can be provided by means of coupling. As a result, static electricity can be discharged through the ground of the printed circuit board 340.

[0119] In the contact structure of the camera module according to this disclosure, the conductive member 420 can be provided as a contact structure for improving ESD and as a fastening structure for securing the rear structure 360 ​​to the electronic device 101. Therefore, since a contact structure requiring separate space in one area of ​​the printed circuit board 340 can be eliminated, additional mounting space for the electronic device 101 can be ensured and design freedom can be provided.

[0120] An electronic device according to various embodiments of the present disclosure (e.g., Figures 1 to 4 Electronic devices may include: housings (e.g., Figure 5 310), including those containing openings (e.g. Figure 5 The rear plate of (e.g., 311a) Figure 5 380) and a support frame (e.g., at least partially along the edge of the rear panel) Figure 5 370); camera decorations (e.g., Figure 5 (315), set in the opening to be exposed to the outside, the camera trim covers the camera components (e.g., Figure 5 (312a) and connected to the back panel; printed circuit board (e.g., Figure 5 (340), housed within the housing; rear structure (e.g., Figure 5 (360°), supporting camera components and printed circuit boards; fixing components (e.g.,Figure 5 (410), connected to the rear structure and securing the camera assembly and / or printed circuit board to the support frame; conductive components (e.g., Figure 5 (420), at least partially disposed between the camera decoration and the fixing component to electrically connect the camera decoration and the fixing component.

[0121] According to various embodiments, at least a portion of the fixing member and the conductive member can be configured to be in contact with each other.

[0122] According to various embodiments, the fixing member may be configured to extend through a portion of the rear structure into the interior of the support frame.

[0123] According to various embodiments, the electronic device can be configured to form a discharge path from the camera assembly to the printed circuit board via a camera trim, conductive components, a fixing component electrically connected to the conductive components, and a support frame.

[0124] According to various embodiments, the fixing member may include a first portion configured to form a contact point with the camera trim or conductive member (e.g., Figure 11 411), the second part for connection with the rear structure (e.g., Figure 11 412), and a third part (e.g., connected to the support frame and providing an electrical connection between the support frame and the camera trim) Figure 11 (413).

[0125] According to various embodiments, the fixing member can be a fastening member including threaded screws for connecting the support frame and the rear structure.

[0126] According to various embodiments, the conductive member can be configured to contact the camera trim and be compressed by being pressed by a fixing member, thereby limiting the formation of a gap between the conductive member and the camera trim.

[0127] According to various embodiments, the interior of the camera trim may include a recess, in which at least a portion of the conductive component may be disposed.

[0128] According to various embodiments, the conductive member may be disposed adjacent to the edge of the camera trim and formed to protrude in a direction opposite to that of the rear panel.

[0129] According to various embodiments, the conductive component may include an elastic material.

[0130] According to various embodiments, the printed circuit board can be arranged adjacent to the support frame.

[0131] According to various embodiments, at least a portion of the printed circuit board may be formed as at least a portion surrounding a fixing member.

[0132] According to various embodiments, the printed circuit board may be spaced apart from the conductive components.

[0133] According to various embodiments, the support frame includes a first region and a second region spaced apart from the first region, wherein the camera assembly and printed circuit board may be disposed in the first region, and the battery may be disposed in the second region.

[0134] According to various embodiments, the electronic device may also include: a display (e.g., Figure 4 (330), disposed in the housing and positioned facing the opposite direction to the rear panel; and the battery (e.g., Figure 4 (350), located in an area separated from the printed circuit board.

[0135] An electronic device according to various embodiments of the present disclosure (e.g., Figures 1 to 4 The electronic device 101 may include: a housing (e.g., Figure 5 310), including a rear panel containing an opening (e.g., Figure 5 380); camera decorations (e.g., Figure 5 315), is provided in the opening to be exposed to the outside and is connected to the rear plate; support members (e.g., Figure 4 The first support member 372 is disposed in the housing; the printed circuit board (e.g., Figure 5 (340), set in one area of ​​the support member; camera assembly (e.g., Figure 5 (312a), covered by camera decoration and configured to capture external objects through at least one opening formed in the camera decoration; fixing members (e.g., Figure 5 410), configured to secure a camera assembly and / or a printed circuit board to a support frame; and a conductive member, at least partially disposed between the camera trim and the mounting member, to electrically connect the camera trim and the mounting member.

[0136] According to various embodiments, the electronic device may also include a rear structure that supports the camera assembly and the printed circuit board (e.g., Figure 5 (360°), wherein the fixing member is connected to the rear structure to secure the camera assembly and / or printed circuit board to the support member.

[0137] According to various embodiments, at least a portion of the fixing member and the conductive member can be configured to be in contact with each other.

[0138] According to various embodiments, the fixing member may be configured to extend through a portion of the rear structure to reach the interior of the support frame.

[0139] According to various embodiments, the electronic device can form a discharge path from the camera assembly to the printed circuit board through a camera trim, conductive components, fixing components electrically connected to the conductive components, and a support frame.

[0140] Those skilled in the art will understand that the contact structure of the camera module and the electronic device including it according to the present disclosure are not limited to the embodiments shown in the above embodiments and drawings, and various changes, modifications or alterations can be made thereto without departing from the scope of the present invention.

Claims

1. An electronic device comprising: The housing includes a rear plate containing an opening and a support frame disposed at least partially along the edge of the rear plate; A camera trim, disposed in the opening to be exposed to the outside, covers the camera assembly and is attached to the rear panel; A printed circuit board is disposed within the housing; The rear structure supports the camera assembly and the printed circuit board; A fixing component is attached to the rear structure and secures the camera assembly and / or the printed circuit board to the support frame; as well as A conductive component is disposed at least partially between the camera trim and the fixing component to electrically connect the camera trim and the fixing component.

2. The electronic device of claim 1, wherein at least a portion of the fixing member and the conductive member are configured to contact each other.

3. The electronic device of claim 2, wherein the fixing member is configured to extend through a portion of the rear structure into the interior of the support frame.

4. The electronic device of claim 2, wherein the electronic device is configured to form a discharge path from the camera assembly to the printed circuit board via the camera trim, the conductive member, the fixing member electrically connected to the conductive member, and the support frame.

5. The electronic device according to claim 2, wherein the fixing member comprises: The first portion is configured to form a contact point with the camera trim or the conductive component; The second part is used for connection with the rear structure; as well as A third part is connected to the support frame and provides electrical connection to the support frame and the camera decoration.

6. The electronic device of claim 2, wherein the fixing member is a fastening member comprising threaded screws for connecting the support frame and the rear structure.

7. The electronic device of claim 2, wherein the conductive member is configured to contact the camera trim and be compressed by being pressed by the fixing member, thereby limiting the formation of a gap between the conductive member and the camera trim.

8. The electronic device of claim 2, wherein the interior of the camera trim includes a recess, and at least a portion of the conductive member is disposed in the recess.

9. The electronic device of claim 2, wherein the conductive member is disposed adjacent to the edge of the camera trim and is formed to project in a direction opposite to that of the rear panel.

10. The electronic device of claim 2, wherein the conductive component comprises an elastic material.

11. The electronic device of claim 2, wherein the printed circuit board is disposed adjacent to the support frame.

12. The electronic device of claim 11, wherein at least a portion of the printed circuit board is formed to surround at least a portion of the fixing member.

13. The electronic device of claim 11, wherein the printed circuit board is spaced apart from the conductive member.

14. The electronic device of claim 1, wherein the support frame comprises a first region and a second region spaced apart from the first region, and The camera assembly and the printed circuit board are disposed in the first region, and the battery is disposed in the second region.

15. The electronic device according to claim 1, further comprising: A display is disposed within the housing and faces the opposite direction to the rear panel; as well as The battery is located in an area separated from the printed circuit board.

Images